ADG749BKS-REEL7 [ADI]
IC 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO6, PLASTIC, MO-203AB, SC-70, 6 PIN, Multiplexer or Switch;
| 型号： | ADG749BKS-REEL7 |
| 厂家： | 
ADI |
| 描述： | IC 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO6, PLASTIC, MO-203AB, SC-70, 6 PIN, Multiplexer or Switch 光电二极管 输出元件 |
| 文件： | 总12页 (文件大小：833K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CMOS 1.8 V to 5.5 V, 2.5 ꢀ
2:1 MUX/SPDT Switch in SC70 Package
a
ADG749
FUNCTIONAL BLOCK DIAGRAM
FEATURES
1.8 V to 5.5 V Single Supply
5 ꢀ (Max) On Resistance
0.75 ꢀ (Typ) On Resistance Flatness
Automotive Temperature Range: –40ꢁC to +125ꢁC
–3 dB Bandwidth > 200 MHz
Rail-to-Rail Operation
ADG749
S2
D
S1
IN
6-Lead SC70 Package
Fast Switching Times:
tON = 12 ns
*SWITCHES SHOWN FOR A LOGIC “1” INPUT
tOFF = 6 ns
Typical Power Consumption (< 0.01 ꢂW)
TTL/CMOS Compatible
APPLICATIONS
Battery-Powered Systems
Communication Systems
Sample-and-Hold Systems
Audio Signal Routing
Video Switching
Mechanical Reed Relay Replacement
GENERAL DESCRIPTION
PRODUCT HIGHLIGHTS
The ADG749 is a monolithic CMOS SPDT switch. This switch
is designed on a submicron process that provides low power
dissipation yet gives high switching speed, low on resistance,
and low leakage currents.
1. 1.8 V to 5.5 V Single-Supply Operation. The ADG749 offers
high performance, including low on resistance and fast
switching times, and is fully specified and guaranteed with
3 V and 5 V supply rails.
The ADG749 can operate from a single-supply range of 1.8 V to
5.5 V, making it ideal for use in battery-powered instruments and
with the new generation of DACs and ADCs from Analog Devices.
2. Very Low RON (5 Ω Max at 5 V and 10 Ω Max at 3 V).
At 1.8 V operation, RON is typically 40 Ω over the tempera-
ture range.
Each switch of the ADG749 conducts equally well in both
directions when on. The ADG749 exhibits break-before-make
switching action.
3. Automotive Temperature Range: –40ꢁC to 125ꢁC.
4. On Resistance Flatness (RFLAT(ON)) (0.75 Ω typ).
5. –3 dB Bandwidth > 200 MHz.
Because of the advanced submicron process, –3 dB bandwidths
of greater than 200 MHz can be achieved.
6. Low Power Dissipation. CMOS construction ensures low
power dissipation.
The ADG749 is available in a 6-lead SC70 package.
7. Fast tON/tOFF.
8. Tiny 6-lead SC70 package.
REV. A
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, norforanyinfringementsofpatentsorotherrightsofthirdpartiesthat
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700
Fax: 781/326-8703
www.analog.com
© Analog Devices, Inc., 2002
ADG749–SPECIFICATIONS1 (VDD = 5 V ꢃ 10%, GND = 0 V.)
B Version
–40ꢁC to –40ꢁC to
Parameter
25ꢁC
+85ꢁC
+125ꢁC
Unit
Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range
0 V to VDD
7
V
On Resistance (RON
)
2.5
5
Ω typ
Ω max
VS = 0 V to VDD, IS = –10 mA;
Test Circuit 1
6
On Resistance Match Between
Channels (∆RON
)
0.1
0.8
Ω typ
Ω max
Ω typ
Ω max
VS = 0 V to VDD, IS = –10 mA
VS = 0 V to VDD, IS = –10 mA
0.8
1.5
On Resistance Flatness (RFLAT(ON)
)
0.75
1.2
LEAKAGE CURRENTS2
Source Off Leakage IS (Off)
VDD = 5.5 V
VS = 4.5 V/1 V, VD = 1 V/4.5 V;
Test Circuit 2
VS = VD = 1 V or VS = VD = 4.5 V;
Test Circuit 3
0.01
0.25
0.01
0.25
nA typ
nA max
nA typ
nA max
0.35
0.35
1
5
Channel On Leakage ID, IS (On)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
2.4
0.8
V min
V max
IINL or IINH
0.005
µA typ
µA max
VIN = VINL or VINH
0.1
DYNAMIC CHARACTERISTICS2
tON
7
3
8
ns typ
ns max
ns typ
ns max
ns typ
ns min
dB typ
dB typ
RL = 300 Ω, CL = 35 pF
VS = 3 V; Test Circuit 4
RL = 300 Ω, CL = 35 pF
VS = 3 V; Test Circuit 4
RL = 300 Ω, CL = 35 pF,
12
6
tOFF
Break-Before-Make Time Delay, tD
Off Isolation
1
VS1 = VS2 = 3 V; Test Circuit 5
–67
–87
RL = 50 Ω, CL = 5 pF, f = 10 MHz
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
Test Circuit 6
Channel-to-Channel Crosstalk
–62
–82
dB typ
dB typ
RL = 50 Ω, CL = 5 pF, f = 10 MHz
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
Test Circuit 7
Bandwidth –3 dB
CS (OFF)
200
7
MHz typ
pF typ
RL = 50 Ω, CL = 5 pF; Test Circuit 8
CD, CS (ON)
27
pF typ
POWER REQUIREMENTS
VDD = 5.5 V
Digital Inputs = 0 V or 5.5 V
IDD
0.001
µA typ
µA max
1.0
NOTES
1Temperature range is as follows: B Version: –40°C to +125°C.
2Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
REV. A
–2–
ADG749
SPECIFICATIONS1
(VDD = 3 V ؎ 10%, GND = 0 V.)
B Version
–40؇C to –40؇C to
Parameter
25؇C
+85؇C
+125؇C
Unit
Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range
0 V to VDD
12
V
On Resistance (RON
)
6
7
10
Ω typ
Ω max
VS = 0 V to VDD, IS = –10 mA;
Test Circuit 1
On Resistance Match Between
Channels (∆RON
)
0.1
0.8
2.5
Ω typ
Ω max
Ω typ
VS = 0 V to VDD, IS = –10 mA
0.8
On Resistance Flatness (RFLAT(ON)
)
VS = 0 V to VDD, IS = –10 mA
LEAKAGE CURRENTS2
Source Off Leakage IS (Off)
VDD = 3.3 V
VS = 3 V/1 V, VD = 1 V/3 V;
Test Circuit 2
VS = VD = 1 V or VS = VD = 3 V;
Test Circuit 3
0.01
0.25
0.01
0.25
nA typ
nA max
nA typ
nA max
0.35
0.35
1
5
Channel On Leakage ID, IS (On)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
2.0
0.8
V min
V max
IINL or IINH
0.005
µA typ
µA max
VIN = VINL or VINH
0.1
DYNAMIC CHARACTERISTICS2
tON
10
4
ns typ
ns max
ns typ
ns max
ns typ
ns min
dB typ
dB typ
RL = 300 Ω, CL = 35 pF
15
8
VS = 2 V; Test Circuit 4
tOFF
RL = 300 Ω, CL = 35 pF
VS = 2 V; Test Circuit 4
RL = 300 Ω, CL = 35 pF
VS1 = VS2 = 2 V; Test Circuit 5
RL = 50 Ω, CL = 5 pF, f = 10 MHz
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
Test Circuit 6
Break-Before-Make Time Delay, tD
Off Isolation
8
1
–67
–87
Channel-to-Channel Crosstalk
–62
–82
dB typ
dB typ
RL = 50 Ω, CL = 5 pF, f = 10 MHz
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
Test Circuit 7
Bandwidth –3 dB
CS (Off)
CD, CS (On)
200
7
27
MHz typ
pF typ
pF typ
RL = 50 Ω, CL = 5 pF; Test Circuit 8
POWER REQUIREMENTS
V
DD = 3.3 V
Digital Inputs = 0 V or 3.3 V
IDD
0.001
µA typ
µA max
1.0
NOTES
1Temperature range is as follows: B Version: –40°C to +125°C.
2Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
REV. A
–3–
ADG749
ABSOLUTE MAXIMUM RATINGS1
TERMINOLOGY
(TA = 25°C, unless otherwise noted)
VDD
GND
S
D
IN
RON
∆RON
Most Positive Power Supply Potential
Ground (0 V) Reference
Source Terminal. May be an input or output.
Drain Terminal. May be an input or output.
Logic Control Input
Ohmic Resistance between D and S
On Resistance Match between any Two Channels
i.e., RON max – RON min
Flatness is defined as the difference between the
maximum and minimum value of on resistance as
measured over the specified analog signal range.
Source Leakage Current with the Switch Off
Channel Leakage Current with the Switch On
Analog Voltage on Terminals D and S
Off Switch Source Capacitance
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Analog, Digital Inputs2 . . . . . . . . . . –0.3 V to VDD + 0.3 V or
30 mA, Whichever Occurs First
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
(Pulsed at 1 ms, 10% Duty Cycle Max)
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . –40°C to +125°C
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
SC70 Package, Power Dissipation . . . . . . . . . . . . . . . . 315 mW
RFLAT(ON)
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 332°C/W
IS (Off)
ID, IS (On)
VD (VS)
θ
JC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 120°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 kV
CS (Off)
CD, CS (On) On Switch Capacitance
1 Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
tON
tOFF
tD
Delay between applying the digital control input
and the output switching on.
Delay between applying the digital control input
and the output switching off.
Off time or on time measured between the 90%
points of both switches, when switching from one
address state to another.
2 Overvoltages at IN, S, or D will be clamped by internal diodes. Current should be
limited to the maximum ratings given.
Crosstalk
A measure of unwanted signal that is coupled
through from one channel to another as a result
of parasitic capacitance.
Table I. Truth Table
ADG749 IN
Switch S1
Switch S2
Off Isolation A measure of unwanted signal coupling through
an off switch.
0
1
ON
OFF
OFF
ON
Bandwidth
The frequency at which the output is attenuated
by –3 dBs.
On Response The Frequency Response of the On Switch
Insertion Loss Loss due to On Resistance of the Switch
PIN CONFIGURATION
S2
D
IN
1
2
3
6
5
4
ADG749
TOP VIEW
(Not to Scale)
V
DD
GND
S1
ORDERING GUIDE
Model
Temperature Range Package Description
Package Option
Branding Information*
ADG749BKS
–40°C to +125°C SC70 (6-Lead Plastic Surface Mount) KS-6
SHB
*Branding on this package is limited to three characters due to space constraints.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG749 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
REV. A
–4–
Typical Performance Characteristics–
ADG749
0.15
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
V
= 5V
= 4.5V/1V
= 1V/4.5V
DD
V
= 2.7V
V
V
DD
D
S
T
= 25ꢁC
A
0.10
0.05
0
V
= 4.5V
DD
V
= 3.0V
DD
I
, I (ON)
S
D
V
= 5.0V
DD
I
(OFF)
S
–0.05
0
10
20
30
40
50
60
70
80
90
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
TEMPERATURE – ꢁC
V
OR V – DRAIN OR SOURCE VOLTAGE – V
S
D
TPC 4. Leakage Currents vs. Temperature
TPC 1. On Resistance vs. VD (VS) Single Supplies
0.15
0.10
0.05
0
6.0
V
V
V
= 3V
= 3V/1V
= 1V/3V
DD
V
= 3V
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
DD
D
S
+85ꢁC
+25ꢁC
–40ꢁC
I
, I (ON)
S
D
I
(OFF)
S
–0.05
0
10
20
30
40
50
60
70
80
90
0
0.5
1.0
1.5
2.0
2.5
3.0
TEMPERATURE – ꢁC
V
OR V – DRAIN OR SOURCE VOLTAGE – V
S
D
TPC 2. On Resistance vs. VD (VS) for Different
Temperatures VDD = 3 V
TPC 5. Leakage Currents vs. Temperature
6.0
10m
1m
V
= 5V
DD
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
V
= 5V
DD
100ꢂ
10ꢂ
1ꢂ
+85ꢁC
+25ꢁC
–40ꢁC
100n
10n
1n
1
10
100
1k
10k
100k
1M
10M
100M
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0 4.5
5.0
FREQUENCY – Hz
V
OR V – DRAIN OR SOURCE VOLTAGE – V
S
D
TPC 3. On Resistance vs. VD (VS) for Different
Temperatures, VDD = 5 V
TPC 6. Supply Current vs. Input Switching Frequency
REV. A
–5–
ADG749
–30
–40
–50
–60
–70
0
V
= 5V, 3V
DD
V
= 5V
DD
–2
–4
–6
–80
–90
–100
–110
–120
–130
0
100M
10k
100k
1M
10M
10k
100k
1M
10M
100M
FREQUENCY – Hz
FREQUENCY – Hz
TPC 7. Off Isolation vs. Frequency
TPC 9. On Response vs. Frequency
12
10
8
–30
–40
V
= 5V, 3V
DD
V
= 5V
–50
DD
–60
6
–70
V
= 3V
DD
4
–80
–90
2
–100
–110
–120
–130
0
–2
–4
0
1
2
3
4
5
10k
100k
1M
10M
100M 0
V
–V
FREQUENCY – Hz
S
TPC 8. Crosstalk vs. Frequency
TPC 10. Charge Injection vs. Source Voltage
REV. A
–6–
ADG749
Test Circuits
Test Circuits 1 to 8 define the test conditions used in the product specification table.
I
DS
V1
I
(OFF)
A
I
(OFF)
A
I
(ON)
A
S
D
D
S
R
D
S
D
S
D
V
V
V
V
S
S
V
D
S
D
= V1/I
DS
ON
Test Circuit 1. On Resistance
Test Circuit 2. Off Leakage
Test Circuit 3. On Leakage
V
DD
0.1ꢂF
V
IN
50%
50%
90%
V
DD
90%
S
D
V
OUT
V
OUT
IN
R
L
C
L
V
S
300ꢀ
35pF
GND
tOFF
tON
Test Circuit 4. Switching Times
V
V
DD
0.1ꢂF
V
IN
50%
50%
50%
DD
D
0V
S1
V
S1
D2
V
OUT
50%
S2
IN
C
35pF
R
300ꢀ
V
OUT
L2
L2
V
S2
0V
GND
tD
tD
V
IN
Test Circuit 5. Break-Before-Make Time Delay, tD
V
DD
0.1ꢂF
V
V
DD
DD
0.1ꢂF
0.1ꢂF
NETWORK
ANALYZER
V
NETWORK
ANALYZER
DD
NETWORK
ANALYZER
V
DD
V
DD
V
R
L
S1
S2
OUT
50ꢀ
S
50ꢀ
S
D
50ꢀ
R
50ꢀ
IN
V
S
V
IN
50ꢀ
S
50ꢀ
D
D
V
IN
V
S
OUT
V
V
OUT
IN
R
L
50ꢀ
V
IN
R
GND
L
GND
50ꢀ
GND
CHANNEL-TO-CHANNEL
V
V
WITH SWITCH
OUT
OUT
V
OUT
CROSSTALK = 20 LOG
INSERTION LOSS = 20 LOG
OFF ISOLATION = 20 LOG
V
V
WITHOUT SWITCH
S
OUT
V
S
Test Circuit 6. Off Isolation
Test Circuit 7. Channel-to-Channel
Crosstalk
Test Circuit 8. Bandwidth
REV. A
–7–
ADG749
APPLICATIONS INFORMATION
The signal transfer characteristic is dependent on the switch
channel capacitance, CDS. This capacitance creates a frequency
zero in the numerator of the transfer function A(s). Because the
switch on resistance is small, this zero usually occurs at high
frequencies. The bandwidth is a function of the switch output
capacitance combined with CDS and the load capacitance. The
frequency pole corresponding to these capacitances appears in
the denominator of A(s).
The ADG749 belongs to Analog Devices’ new family of CMOS
switches. This series of general-purpose switches has improved
switching times, lower on resistance, higher bandwidths, low
power consumption, and low leakage currents.
ADG749 Supply Voltages
Functionality of the ADG749 extends from 1.8 V to 5.5 V single
supply, which makes it ideal for battery-powered instruments,
where power efficiency and performance are important design
parameters.
The dominant effect of the output capacitance, CD, causes the pole
breakpoint frequency to occur first. Therefore, in order to maximize
bandwidth, a switch must have a low input and output capacitance
and low on resistance. The On Response vs. Frequency plot for
the ADG749 can be seen in TPC 9.
It is important to note that the supply voltage effects the input
signal range, the on resistance, and the switching times of the part.
By taking a look at the typical performance characteristics and the
specifications, the effects of the power supplies can be clearly seen.
Off Isolation
For VDD = 1.8 V operation, RON is typically 40 Ω over the
temperature range.
Off isolation is a measure of the input signal coupled through an
off switch to the switch output. The capacitance, CDS, couples
the input signal to the output load when the switch is off, as
shown in Figure 2.
On Response vs. Frequency
Figure 1 illustrates the parasitic components that affect the ac
performance of CMOS switches (the switch is shown surrounded
by a box). Additional external capacitances will further degrade
some performance. These capacitances affect feedthrough,
crosstalk, and system bandwidth.
C
DS
D
S
V
OUT
C
D
C
V
LOAD
IN
R
LOAD
C
DS
D
S
V
Figure 2. Off Isolation Is Affected by External Load
Resistance and Capacitance
OUT
R
ON
C
D
C
V
LOAD
IN
R
LOAD
The larger the value of CDS, the larger the values of feedthrough
that will be produced. The typical performance characteristic
graph of TPC 7 illustrates the drop in off isolation as a function
of frequency. From dc to roughly 200 kHz, the switch shows
better than –95 dB isolation. Up to frequencies of 10 MHz, the off
isolation remains better than –67 dB. As the frequency increases,
more and more of the input signal is coupled through to the output.
Off isolation can be maximized by choosing a switch with the
smallest CDS possible. The values of load resistance and capacitance
also affect off isolation, since they contribute to the coefficients of
the poles and zeros in the transfer function of the switch when open.
Figure 1. Switch Represented by Equivalent Parasitic
Components
The transfer function that describes the equivalent diagram of
the switch (Figure 1) is of the form A(s) shown below.
s(RON
CDS )+1
A(s) = RT
s(RT RON CT )+1
where:
RT = RLOAD
R
+ RON
(
)
LOAD
s(RLOAD CDS
)
A(s) =
CT = CLOAD + CD + CDS
s(RLOAD )(CLOAD + CD + CDS )+1
REV. A
–8–
ADG749
OUTLINE DIMENSIONS
6-Lead Plastic Surface Mount Package [SC70]
(KS-6)
Dimensions shown in millimeters
2.00 BSC
6
5
2
4
3
2.10 BSC
1.25 BSC
1
PIN 1
1.30 BSC
0.65 BSC
1.00
0.90
0.70
1.10 MAX
0.22
0.08
0.46
0.36
0.26
8ꢁ
4ꢁ
0ꢁ
0.30
0.15
0.10 MAX
COPLANARITY
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MO-203AB
REV. A
–9–
ADG749
Revision History
Location
Page
7/02—Data Sheet changed from REV. 0 to REV. A.
Changes to FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Additions to PRODUCT HIGHLIGHTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Changes to SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Edits to ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Changes to TERMINOLOGY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Edits to ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Added new TPCs 4 and 5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Added TPC 10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
TEST CIRCUITS 6, 7, and 8 replaced . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Updated KS-6 Package Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
REV. A
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