ADG783BCP-REEL7 [ADI]

IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, QCC20, 4 X 4 MM, CSP-20, Multiplexer or Switch;
ADG783BCP-REEL7
型号: ADG783BCP-REEL7
厂家: ADI    ADI
描述:

IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, QCC20, 4 X 4 MM, CSP-20, Multiplexer or Switch

文件: 总10页 (文件大小:95K)
中文:  中文翻译
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PRELIMINARY TECHNICAL DATA  
CMOS,  
Low Voltage 2.5 Quad SPST Switches  
a
Preliminary Technical Data  
ADG781/ADG782/ADG783  
FEATURES  
F U NC T IO NAL B LO C K D IAG RAM S  
1.8 V to 5.5 V Single Supply  
Low On-Resistance 2.5  
On-Resistance Flatness  
-3dB Bandw idth >200MHz  
100 pA Leakage Currents  
14 ns Sw itching Tim es  
20-Lead Chip Scale Package  
Low Pow er Consum ption  
TTL/ CMOS-Com patible Inputs  
S1  
S1  
S1  
IN1  
IN2  
IN3  
IN1  
IN2  
IN1  
IN2  
D1  
S2  
D1  
S2  
D1  
S2  
D2  
S3  
D2  
S3  
D2  
S3  
ADG781  
ADG782  
ADG783  
IN3  
IN4  
IN3  
IN4  
D3  
S4  
D3  
S4  
D3  
S4  
APPLICATIONS  
Battery Pow ered System s  
Com m unication System s  
Sam ple and Hold System s  
Audio SignalRouting  
Relay Replacem ent  
IN4  
D4  
D4  
D4  
SWITCHES SHOWN FOR A LOGIC "1" INPUT  
Video Sw itching  
G E NE R AL D E S C R IP T IO N  
action. T he AD G781/AD G782/AD G783 are available in  
20-lead Chip Scale Packages  
T he ADG781, ADG782 and ADG783 are monolithic  
CMOS devices containing four independently selectable  
switches. T hese switches are designed on an advanced  
submicron process that provides low power dissipation yet  
gives high switching speed, low on resistance, low leakage  
currents and high bandwidth.  
P R O D U C T H IG H LIG H T S  
1. +1.8 V to +5.5 V Single Supply Operation. T he  
ADG781, ADG782 and ADG783 offer high perfor  
mance and are fully specified and guaranteed with +3V  
and +5 V supply rails.  
T hey are designed to operate from a single +1.8 V to  
+5.5 V supply, making them ideal for use in battery pow-  
ered instruments and with the new generation of DACs  
and ADCs from Analog Devices. Fast switching times and  
high bandwidth make the part suitable for video signal  
switching. T he ADG781, ADG782 and ADG783 contain  
four independent single-pole/single throw (SPST )  
switches. T he ADG781 and ADG782 differ only in that  
the digital control logic is inverted. T he ADG781  
switches are turned on with a logic low on the appropriate  
control input, while a logic high is required to turn on the  
switches of the ADG782. T he ADG783 contains two  
switches whose digital control logic is similar to the  
ADG781, while the logic is inverted on the other two  
switches.  
2. Very Low RON (4.5 max at +5 V, 8 max at +3 V).  
At supply voltage of +1.8 V, RON is typically 35 over  
the temperature range.  
3. Low On-Resistance Flatness.  
4. –3 dB Bandwidth >200 MHz.  
5. Fast tON /tOFF  
.
6 . Break-Before-M ake Switching.  
T his prevents channel shorting when the switches are  
configured as a multiplexer (ADG783 only).  
Each switch conducts equally well in both directions when  
ON . T he AD G783 exhibits break-before-make switching  
REV. PrB  
Inform ation furnished by Analog Devices is believed to be accurate and  
reliable. However, no responsibility is assum ed by Analog Devices for its  
use, nor for any infringem ents of patents or other rights of third parties  
which m ay result from its use. No license is granted by im plication or  
otherwise under any patent or patent rights of Analog Devices.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781/329-4700  
Fax: 781/326-8703  
World Wide Web Site: http://www.analog.com  
© Analog Devices, Inc., 2001  
PRELIMINARY TECHNICAL DATA  
1(V = 5 V ±10%, GND = 0 V, unless otherwise noted)  
DD  
ADG781/ADG782/ADG783–SPECIFICATIONS  
B Version  
–40  
to +85  
C
P ar am eter  
+25  
C
C  
Unit  
Test Conditions/Com m ents  
AN ALO G SWIT C H  
Analog Signal Range  
0 V to VDD  
V
On-Resistance (RON  
)
2.5  
4
typ  
max  
typ  
max  
typ  
max  
VS = 0 V to VDD, IDS = 10 mA;  
T est Circuit 1  
4.5  
0.05  
0.3  
On-Resistance M atch Between  
Channels (RON  
)
VS = 0 V to VDD, IDS = 10 mA  
VS = 0 V to VDD, IDS = 10 mA  
On-Resistance Flatness (RFLAT (ON)  
)
0.5  
1.0  
LEAKAG E C U RREN T S  
VDD = 5.5 V  
Source OFF Leakage IS (OFF)  
± 0.01  
± 10  
± 0.01  
± 10  
± 0.01  
± 10  
nA typ  
nA max  
nA typ  
nA max  
nA typ  
nA max  
VD = 4.5 V/1 V, VS = 1 V/4.5 V;  
T est Circuit 2  
VD = 4.5 V/1 V, VS = 1 V/4.5 V;  
T est Circuit 2  
± 20  
± 20  
± 20  
D rain OFF Leakage ID (OFF)  
Channel ON Leakage ID, IS (ON)  
VD = VS = 1 V, or 4.5 V, T est Circuit 3  
D IG IT AL IN PU T S  
Input H igh Voltage, VIN H  
Input Low Voltage, VIN L  
Input Current  
2.4  
0.8  
V min  
V max  
IIN L or IIN H  
0.005  
2
µA typ  
µA max  
pF typ  
VIN = VINL or VINH  
± 0.1  
CIN, Digital Input Capacitance  
D YN AM IC C H ARAC T ERIST IC S2  
t O N  
11  
6
ns typ  
ns max  
ns typ  
ns max  
ns typ  
ns min  
pC typ  
RL = 300 , CL = 35 pF  
VS = 3 V, T est Circuit 4  
RL = 300 , CL = 35 pF  
VS = 3 V, T est Circuit 4  
RL = 300 , CL = 35 pF  
VS1 =VS2 = 3 V, T est Circuit 5  
VS = 2 V, RS = 0 , CL = 1 nF;  
T est Circuit 6  
16  
10  
1
tO F F  
Break-Before-M ake T ime D elay, tD  
Charge Injection  
6
± 3  
Off Isolation  
–58  
–78  
dB typ  
dB typ  
RL = 50 , CL = 5 pF, f = 10 MHz  
RL = 50 , CL = 5 pF, f = 1 MHz;  
T est Circuit 7  
C hannel-to-C hannel C rosstalk  
–90  
dB typ  
RL = 50 , CL = 5 pF, f = 10 MHz  
T est Circuit 8  
–3 dB Bandwidth  
C S (O F F )  
C D (O F F )  
200  
10  
10  
MH z typ  
pF typ  
pF typ  
pF typ  
RL = 50 , CL = 5 pF, T est Circuit 9  
CD , CS (ON )  
22  
P O WER REQ U IREM EN T S  
I D D  
VDD = 5.5 V  
Digital Inputs = 0 V or 5.5 V  
0.001  
µA typ  
1.0  
µA max  
N O T E S  
1T emperature range is as follows:  
B Version: –40°C to +85°C.  
2Guaranteed by design, not subject to production test.  
Speci•cations subject to change without notice.  
REV. PrB  
–2 –  
PRELIMINARY TECHNICAL DATA  
ADG781/ADG782/ADG783  
1
SPECIFICATIONS (V = 3 V ± 10%, GND = 0 V, unless otherwise noted)  
DD  
B Ver sion  
–40  
C  
P ar am eter  
+258C  
to +85  
C Unit  
Test Conditions/Com m ents  
AN ALO G SWIT C H  
Analog Signal Range  
0 V to VDD  
V
On-Resistance (RON  
)
5
5.5  
8
typ  
max  
typ  
max  
typ  
VS = 0 V to VDD, IDS = 10 mA;  
T est Circuit 1  
VS = 0 V to VDD , IDS = 10 mA  
On-Resistance M atch Between  
Channels (RON  
0.1  
)
0.3  
2.5  
On-Resistance Flatness (RFLAT (ON )  
)
VS = 0 V to VDD , IDS = 10 mA  
LEAKAG E C U RREN T S  
VDD = 3.3 V  
Source OFF Leakage IS (OFF)  
± 0.01  
± 10  
± 0.01  
± 10  
± 0.01  
± 10  
nA typ  
nA max  
nA typ  
nA max  
nA typ  
nA max  
VS = 3 V/1 V, VD = 1 V/3 V;  
T est Circuit 2  
VS = 3 V/1 V, VD = 1 V/3 V;  
T est Circuit 2  
± 20  
± 20  
± 20  
D rain OFF Leakage ID (OFF)  
Channel ON Leakage ID , IS (ON)  
VS = VD = 1 V or 3 V, T est Circuit 3  
D IG IT AL IN PU T S  
Input H igh Voltage, VIN H  
Input Low Voltage, VIN L  
Input Current  
2.0  
0.4  
V min  
V max  
IIN L or IIN H  
0.005  
2
µA typ  
µA max  
pF typ  
VIN = VINL or VINH  
± 0.1  
CIN , Digital Input Capacitance  
D YN AM IC C H ARAC T ERIST IC S2  
t O N  
13  
7
ns typ  
ns max  
ns typ  
ns max  
ns typ  
ns min  
pC typ  
RL = 300 , CL = 35 pF  
VS = 2 V, T est Circuit 4  
RL = 300 , CL = 35 pF  
VS = 2 V, T est Circuit 4  
RL = 300 , CL = 35 pF  
VS1 =VS2 = 2 V, T est Circuit 5  
VS = 1.5 V, RS = 0 , CL = 1 nF;  
T est Circuit 6  
20  
12  
1
tO F F  
Break-Before-M ake T ime D elay, tD  
Charge Injection  
7
± 3  
Off Isolation  
–58  
–78  
dB typ  
dB typ  
RL = 50 , CL = 5 pF, f = 10 MHz  
RL = 50 , CL = 5 pF, f = 1 MHz;  
T est Circuit 7  
C hannel-to-C hannel C rosstalk  
–90  
dB typ  
RL = 50 , CL = 5 pF, f = 10 MHz  
T est Circuit 8  
–3 dB Bandwidth  
C S (O F F )  
C D (O F F )  
200  
10  
10  
MH z typ RL = 50 , CL = 5 pF, T est Circuit 9  
pF typ  
pF typ  
pF typ  
CD , C S (ON )  
22  
P O WER REQ U IREM EN T S  
I D D  
VDD = 3.3 V  
Digital Inputs = 0 V or 3.3 V  
0.001  
µA typ  
1.0  
µA max  
N O T E S  
1T emperature ranges are as follows:  
B Version: –40°C to +85°C.  
2Guaranteed by design, not subject to production test.  
Speci•cations subject to change without notice.  
REV. PrB  
–3 –  
PRELIMINARY TECHNICAL DATA  
ADG781/ADG782/ADG783  
AB SO LUT E M AXIM UM RAT ING S1  
(T A = 25°C unless otherwise noted)  
θJC T hermal Impedance . . . . . . . . . . . . . . . . . T BD °C /W  
Lead T emperature, Soldering  
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215°C  
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C  
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to +6 V  
Analog Inputs2 . . . . . . . . . . VSS – 0.3 V to VDD +0.3 V or  
30 mA, Whichever Occurs First  
NOT ES  
D igital Inputs2 . . . . . . . . . . . . . . –0.3 V to VDD +0.3 V or  
30 mA, Whichever Occurs First  
1Stresses above those listed under Absolute Maximum Ratings may cause perma-  
nent damage to the device. T his is a stress rating only; functional operation of the  
device at these or any other conditions above those listed in the operational  
sections of this speci•cation is not implied. Exposure to absolute maximum rating  
conditions for extended periods may affect device reliability. Only one absolute  
maximum rating may be applied at any one time.  
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . 100 mA  
. . . . . . . . . . . . . . (Pulsed at 1 ms, 10% Duty Cycle max)  
Continuous Current, S or D . . . . . . . . . . . . . . . . . . 30 mA  
Operating T emperature Range  
Industrial (B Version) . . . . . . . . . . . . . . –40°C to +85°C  
Storage T emperature Range . . . . . . . . . –65°C to +150°C  
Junction T emperature . . . . . . . . . . . . . . . . . . . . . . . . 150°C  
CSP Package, Power D issipation . . . . . . . . . . . T BD mW  
θJA T hermal Impedance . . . . . . . . . . . . . . . . T BD °C /W  
2Overvoltages at IN, S or D will be clamped by internal diodes. Current should be  
limited to the maximum ratings given.  
C A U T I O N  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily  
accumulate on the human body and test equipment and can discharge without detection. Although  
the AD G 781/AD G 782/AD G 783 features proprietary ESD protection circuitry, perma-  
nent damage may occur on devices subjected to high energy electrostatic discharges.  
T herefore, proper ESD precautions are recommended to avoid performance degradation  
or loss of functionality.  
WARNING!  
ESD SENSITIVE DEVICE  
O R D E R ING G U ID E  
Model  
Tem perature Range  
P ackage D escription  
P ackage O ption  
AD G 781BC P  
AD G 782BC P  
AD G 783BC P  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
Chip Scale Package (CSP)  
Chip Scale Package (CSP)  
Chip Scale Package (CSP)  
C P -20  
C P -20  
C P -20  
P IN C O NF IG U R AT IO NS  
Table I. AD G781/AD G782 Tr uth Table  
AD G781 In  
AD G782 In  
Switch Condition  
NC IN1 NC IN2 NC  
0
1
1
0
O N  
O F F  
D1  
S1  
D2  
S2  
ADG781  
ADG782  
ADG783  
Table II. AD G783 Tr uth Table  
VDD  
GND  
S4  
Logic  
Switch 1, 4  
Switch 2, 3  
S3  
D3  
0
1
O F F  
O N  
O N  
O F F  
D4  
NC IN4 NC IN3 NC  
NC = NO CONNECT  
Exposed Pad tied to Substrate, GND  
REV. PrB  
–4 –  
PRELIMINARY TECHNICAL DATA  
ADG781/ADG782/ADG783  
T E R M I N O L O G Y  
V D D  
Most positive power supply potential.  
Ground (0 V) Reference.  
G N D  
S
Source T erminal. May be an input or output.  
Drain T erminal. May be an input or output.  
Logic Control Input.  
D
I N  
R O N  
Ohmic resistance between D and S.  
RF L AT (O N )  
Flatness is defined as the difference between the maximum and minimum value of on-resistance as mea  
sured over the specifed analog signal range.  
RO N  
IS (OFF)  
On resistance match between any two channels, i.e RONmax-RONmin.  
Source leakage current with the switch “OFF.”  
ID (O F F )  
Drain leakage current with the switch “OFF.”  
ID, IS (ON) Channel leakage current with the switch “ON.”  
VD (VS)  
Analog voltage on terminals D, S.  
C S (O F F )  
C D (O F F )  
“OFF” switch source capacitance. Measured with reference to ground.  
“OFF” switch drain capacitance. M easured with reference to ground.  
CD, CS (ON) “ON ” switch capacitance. M easured with reference to ground.  
C I N  
t O N  
tO F F  
t D  
D igital Input Capacitance.  
Delay time between applying the digital control input and the switch turning on.  
Delay time between applying the digital control input and the switch turning off.  
“OFF” time measured between the 90% points of both switches when switching from one address state to  
another (AD G783 only).  
Off Isolation A measure of unwanted signal coupling through an “OFF” switch.  
C rosstalk  
A measure of unwanted signal which is coupled through from one channel to another as a result of parasitic  
capacitance.  
C harge  
A measure of the glitch impulse transferred from the digital input to the analog output during switching.  
Injection  
Bandwidth  
T he frequency at which the output is attenuated by 3 dBs.  
On Response T he frequency response of the “ON” switch.  
On Loss  
VI N L  
T he loss due to the ON resistance of the switch.  
Maximum input voltage for Logic “0.”  
Minimum input voltage for Logic “1.”  
Input current of the digital input.  
VI N H  
IIN L (IIN H  
I D D  
)
Positive Supply Current.  
REV. PrB  
5 –  
PRELIMINARY TECHNICAL DATA  
Typical Performance Characteristics–  
ADG781/ADG782/ADG783  
10m  
6
V
= +5V  
DD  
5.5  
T
= +25C  
A
1m  
5
4.5  
4
V
= +2.7V  
DD  
100ꢂ  
4 SW  
3.5  
3
10ꢂ  
1ꢂ  
V
= +4.5V  
DD  
V
= +3V  
DD  
1 SW  
2.5  
2
V
= +5V  
DD  
100n  
1.5  
1
10n  
1n  
0.5  
0
0
0.5  
V
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
100  
1k  
10k  
100k  
1M  
10M  
OR V – DRAIN OR SOURCE VOLTAGE – Volts  
D
S
FREQUENCY Hz  
Figure 4. Supply Current vs. Input Switching Frequency  
Figure 1. On Resistance as a Function of VD (VS) for Single  
Supply  
30  
40  
6
V
= +3V  
5.5  
5
DD  
V
= +5V, +3V  
DD  
+85C  
50  
60  
4.5  
4
+25C  
70  
3.5  
3
80  
2.5  
2
90  
40C  
100  
110  
120  
130  
1.5  
1
0.5  
0
0
0.5  
1
1.5  
23  
2.5  
10k  
100k  
1M  
FREQUENCY Hz  
10M  
100M  
V
OR V DRAIN OR SOURCE VOLTAGE Volts  
S
D
Figure 2. On Resistance as a Function of VD (VS) for Differ-  
ent Tem peratures, VDD = 3 V.  
Figure 5. Off Isoltaion vs. Frequency  
6
30  
5.5  
5
V
= +5V  
DD  
40  
50  
V
= +5V, +3V  
DD  
4.5  
4
60  
+85C  
70  
3.5  
3
+25C  
80  
2.5  
2
90  
100  
110  
120  
130  
1.5  
1
40C  
0.5  
0
0
0.5  
V
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
10k  
100k  
1M  
FREQUENCY Hz  
10M  
100M  
OR V DRAIN OR SOURCE VOLTAGE Volts  
D
S
Figure 3. On Resistance as a Function of VD (VS) for Differ-  
ent Tem peratures, VDD = 5 V.  
Figure 6. Crosstalk vs. Frequency  
REV. PrB  
6 –  
PRELIMINARY TECHNICAL DATA  
ADG781/ADG782/ADG783  
0
2  
4  
6  
AP P L I C AT I O N S  
Figure 9 illustrates a photodetector circuit with program-  
mable gain. With the resistor values shown in the circuit  
and using different combinations of switches, gains in the  
range of 2 to 16 can be achieved.  
V
= +5V  
DD  
C1  
R1  
33kꢁ  
+5V  
AD820  
D1  
10k  
100k  
1M  
10M  
100M  
V
+2.5V  
OUT  
FREQUENCY Hz  
R2  
510kꢁ  
Figure 7. On Response vs. Frequency  
+5V  
R4  
R5  
240k240kꢁ  
S1  
D1  
D2  
D3  
D4  
25  
20  
15  
10  
5
R3  
510kꢁ  
T
= +25C  
(LSB) IN1  
A
R6  
R7  
120k120kꢁ  
S2  
S3  
S4  
IN2  
IN3  
R8  
120kꢁ  
V
= +5V  
R9  
120kꢁ  
DD  
V
= +3V  
DD  
+2.5V  
R10  
(MSB) IN4  
120kꢁ  
GND  
0
GAIN RANGE 2 TO 16  
5  
10  
Figure 9. Photodetector Circuit with Program m able Gain  
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
SOURCE VOLTAGE Volts  
Figure 8. Charge Injection vs. Source Voltage  
REV. PrB  
7 –  
PRELIMINARY TECHNICAL DATA  
ADG781/ADG782/ADG783  
Test Circuits  
I
DS  
V1  
I
D
(ON)  
A
I
S
(OFF)  
A
S
D
S
D
S
D
NC  
V
D
V
D
VS  
VS  
RON = V1/IDS  
Test Circuit 1. On Resistance  
Test Circuit 2. IS (OFF)  
Test Circuit 3. ID (OFF)  
VDD  
0.1  
F
µ
VIN  
50%  
50%  
50%  
ADG781  
ADG782  
VDD  
VIN  
50%  
90%  
S
D
VOUT  
RL  
300  
VS  
IN  
CL  
VS  
90%  
35pF  
VOUT  
GND  
tON  
t OFF  
Test Circuit 4. Switching Tim e  
V
V
DD  
DD  
V
IN  
0.1  
F
50%  
50%  
µ
0V  
0V  
90%  
90%  
V
S1  
S2  
D1  
D2  
OUT1  
OUT2  
V
V
S1  
OUT1  
R
C
L1  
L1  
35pF  
V
V
300  
S2  
OUT2  
C
IN1, IN2  
R
L2  
L2  
90%  
90%  
300  
35pF  
V
V
ADG783  
GND  
0V  
IN  
t D  
tD  
Test Circuit 5. Break-Before-Make Delay, tD  
V
V
SW ON  
SW OFF  
DD  
V
IN  
DD  
R
S
D
S
V
OUT  
C
1nF  
V
S
L
IN  
V
OUT  
V
OUT  
GND  
Q
= C V  
L OUT  
INJ  
Test Circuit 6. Charge Injection  
REV. PrB  
8 –  
PRELIMINARY TECHNICAL DATA  
ADG781/ADG782/ADG783  
V
DD  
0.1F  
V
DD  
0.1F  
V
DD  
S
D
V
DD  
V
OUT  
S
D
R
50ꢁ  
L
V
OUT  
IN  
R
L
V
IN  
V
S
50ꢁ  
IN  
GND  
V
IN  
V
S
GND  
Test Circuit 7. OFF Isolation  
Figure 9. Bandwidth  
V
DD  
0.1F  
V
DD  
50ꢁ  
S
S
D
D
V
IN1  
V
S
V
IN2  
V
NC  
OUT  
R
50ꢁ  
L
GND  
CHANNEL-TO-CHANNEL CROSSTALK = 20 LOG  
|
V
/V  
|
S
OUT  
Test Circuit 8. Channel-to-Channel Crosstalk  
REV. PrB  
9 –  
PRELIMINARY TECHNICAL DATA  
ADG781/ADG782/ADG783  
O U T LINE D IM E NS IO NS  
D imensions shown in inches and (mm).  
20-Lead Chip Scale  
(C P - 20)  
0.158(4.0)BSC  
0.024 (0.6)  
0.009(0.24)  
0.148(3.75)BSC  
20  
0.096 (2.45)  
0.085 (2.15)  
0.024 (0.6)  
0.009(0.24)  
0.148(3.75)BSC  
0.096 (2.45)  
0.085 (2.15)  
0.158(4.0)BSC  
0.03(0.75)  
0.014(0.35)  
0.02(0.5)BSC  
o
0.012(0.3)  
0.007(0.18)  
12  
0.032(0.8)Max  
0.026(0.65)Nom  
Bottom View  
0.039(1.0)Max  
0.033(0.85)Nom  
0.039(0.05)  
0.033(0.01)  
0.0(0.0)  
0.039(0.2)Ref  
1 0 –  
REV. PrB  

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