ADG783BCP-REEL [ADI]

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ADG783BCP-REEL
型号: ADG783BCP-REEL
厂家: ADI    ADI
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2.5 Quad SPST Switches  
a
in Chip Scale Package  
ADG781/ADG782/ADG783  
FEATURES  
FUNCTIONAL BLOCK DIAGRAMS  
1.8 V to 5.5 V Single Supply  
Low On Resistance (2.5 Typ)  
Low On-Resistance Flatness (0.5 )  
–3 dB Bandwidth > 200 MHz  
Rail-to-Rail Operation  
20-Lead 4 mm 4 mm Chip Scale Package  
Fast Switching Times  
tON = 16 ns  
tOFF = 10 ns  
Typical Power Consumption (< 0.01 W)  
TTL/CMOS Compatible  
For Functionally Equivalent Devices in 16-Lead TSSOP  
and SOIC Packages, See ADG711/ADG712/ADG713  
S1  
S1  
S1  
IN1  
IN2  
IN3  
IN4  
IN1  
IN2  
IN3  
IN4  
IN1  
IN2  
IN3  
IN4  
D1  
S2  
D1  
S2  
D1  
S2  
D2  
S3  
D2  
S3  
D2  
S3  
ADG782  
ADG783  
ADG781  
D3  
S4  
D3  
S4  
D3  
S4  
D4  
D4  
D4  
SWITCHES SHOWN FOR A LOGIC “1” INPUT  
APPLICATIONS  
Battery Powered Systems  
Communication Systems  
Sample Hold Systems  
Audio Signal Routing  
Video Switching  
Mechanical Reed Relay Replacement  
GENERAL DESCRIPTION  
PRODUCT HIGHLIGHTS  
1. 20-Lead 4 mm ϫ 4 mm Chip Scale Package (CSP).  
The ADG781, ADG782, and ADG783 are monolithic CMOS  
devices containing four independently selectable switches. These  
switches are designed on an advanced submicron process that  
provides low power dissipation and high switching speed, low on  
resistance, low leakage currents and high bandwidth.  
2. 1.8 V to 5.5 V Single Supply Operation. The ADG781,  
ADG782, and ADG783 offer high performance and are  
fully specified and guaranteed with 3 V and 5 V supply  
rails.  
They are designed to operate from a single 1.8 V to 5.5 V sup-  
ply, making them ideal for use in battery powered instruments  
and with the new generation of DACs and ADCs from Analog  
Devices. Fast switching times and high bandwidth make the  
part suitable for video signal switching.  
3. Very Low RON (4.5 max at 5 V, 8 max at 3 V). At supply  
voltage of 1.8 V, RON is typically 35 over the temperature  
range.  
4. Low On-Resistance Flatness.  
5. –3 dB Bandwidth >200 MHz.  
The ADG781, ADG782, and ADG783 contain four independent  
single-pole/single throw (SPST) switches. The ADG781 and  
ADG782 differ only in that the digital control logic is inverted.  
The ADG781 switches are turned on with a logic low on the  
appropriate control input, while a logic high is required to turn  
on the switches of the ADG782. The ADG783 contains two  
switches whose digital control logic is similar to the ADG781,  
while the logic is inverted on the other two switches.  
6. Low Power Dissipation. CMOS construction ensures low  
power dissipation.  
7. Fast tON/tOFF.  
8. Break-Before-Make Switching. This prevents channel shorting  
when the switches are configured as a multiplexer (ADG783  
only).  
Each switch conducts equally well in both directions when ON.  
The ADG783 exhibits break-before-make switching action.  
The ADG781/ADG782/ADG783 are available in 20-lead chip  
scale packages.  
REV. A  
Information furnished by Analog Devices is believed to be accurate and  
reliable. However, no responsibility is assumed by Analog Devices for its  
use, norforanyinfringementsofpatentsorotherrightsofthirdpartiesthat  
may result from its use. No license is granted by implication or otherwise  
under any patent or patent rights of Analog Devices.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781/329-4700  
Fax: 781/326-8703  
www.analog.com  
© Analog Devices, Inc., 2002  
(VDD = 5 V 10%, GND = 0 V. All specifications  
ADG781/ADG782/ADG783–SPECIFICATIONS –40C to +85C unless otherwise noted.)  
B Version  
–40C to  
+85C  
Parameter  
+25C  
Unit  
Test Conditions/Comments  
ANALOG SWITCH  
Analog Signal Range  
0 V to VDD  
V
On Resistance (RON  
)
2.5  
4
typ  
max  
typ  
max  
typ  
max  
VS = 0 V to VDD, IS = –10 mA;  
Test Circuit 1  
VS = 0 V to VDD, IS = –10 mA  
4.5  
0.05  
0.4  
On-Resistance Match Between  
Channels (RON  
)
On-Resistance Flatness (RFLAT(ON)  
)
0.5  
VS = 0 V to VDD, IS = –10 mA  
1.0  
LEAKAGE CURRENTS  
Source OFF Leakage IS (OFF)  
VDD = 5.5 V;  
VS = 4.5 V/1 V, VD = 1 V/4.5 V;  
Test Circuit 2  
VS = 4.5 V/1 V, VD = 1 V/4.5 V;  
Test Circuit 2  
VS = VD = 1 V, or 4.5 V;  
Test Circuit 3  
0.01  
0.1  
0.01  
0.1  
0.01  
0.1  
nA typ  
nA max  
nA typ  
nA max  
nA typ  
nA max  
0.2  
0.2  
0.2  
Drain OFF Leakage ID (OFF)  
Channel ON Leakage ID, IS (ON)  
DIGITAL INPUTS  
Input High Voltage, VINH  
Input Low Voltage, VINL  
Input Current  
2.4  
0.8  
V min  
V max  
I
INL or IINH  
0.005  
µA typ  
µA max  
VIN = VINL or VINH  
0.1  
DYNAMIC CHARACTERISTICS2  
tON  
11  
6
ns typ  
ns max  
ns typ  
ns max  
ns typ  
ns min  
pC typ  
RL = 300 , CL = 35 pF,  
VS = 3 V; Test Circuit 4  
RL = 300 , CL = 35 pF,  
VS = 3 V; Test Circuit 4  
RL = 300 , CL = 35 pF,  
VS1 = VS2 = 3 V; Test Circuit 5  
VS = 2 V; RS = 0 , CL = 1 nF;  
Test Circuit 6  
16  
10  
1
tOFF  
Break-Before-Make Time Delay, tD  
(ADG783 Only)  
Charge Injection  
6
3
Off Isolation  
–58  
–78  
dB typ  
dB typ  
RL = 50 , CL = 5 pF, f = 10 MHz  
RL = 50 , CL = 5 pF, f = 1 MHz;  
Test Circuit 7  
Channel-to-Channel Crosstalk  
–90  
dB typ  
RL = 50 , CL = 5 pF, f = 10 MHz;  
Test Circuit 8  
Bandwidth –3 dB  
CS (OFF)  
200  
10  
10  
MHz typ  
pF typ  
pF typ  
pF typ  
RL = 50 , CL = 5 pF; Test Circuit 9  
f = 1 MHz  
f = 1 MHz  
C
D (OFF)  
CD, CS (ON)  
22  
f = 1 MHz  
POWER REQUIREMENTS  
IDD  
VDD = 5.5 V  
Digital Inputs = 0 V or 5.5 V  
0.001  
µA typ  
µA max  
1.0  
NOTES  
1Temperature ranges are as follows: B Version: –40°C to +85°C.  
2Guaranteed by design, not subject to production test.  
Specifications subject to change without notice.  
–2–  
REV. A  
ADG781/ADG782/ADG783  
SPECIFICATIONS1 (VDD = 3 V 10%, GND = 0 V. All specifications –40C to +85C unless otherwise noted.)  
B Version  
–40C to  
Parameter  
+25C  
+85C  
Unit  
Test Conditions/Comments  
ANALOG SWITCH  
Analog Signal Range  
0 V to VDD  
5.5  
10  
V
On Resistance (RON  
)
5
typ  
max  
typ  
max  
typ  
VS = 0 V to VDD, IS = –10 mA;  
Test Circuit 1  
VS = 0 V to VDD, IS = –10 mA  
On-Resistance Match Between  
0.1  
Channels (RON  
)
0.5  
2.5  
On-Resistance Flatness (RFLAT(ON)  
)
VS = 0 V to VDD, IS = –10 mA  
LEAKAGE CURRENTS  
VDD = 3.3 V;  
Source OFF Leakage IS (OFF)  
0.01  
0.1  
0.01  
0.1  
0.01  
nA typ  
nA max  
nA typ  
nA max  
nA typ  
nA max  
VS = 3 V/1 V, VD = 1 V/3 V;  
Test Circuit 2  
VS = 3 V/1 V, VD = 1 V/3 V;  
Test Circuit 2  
VS = VD = 1 V, or 3 V;  
Test Circuit 3  
0.2  
0.2  
0.2  
Drain OFF Leakage ID (OFF)  
Channel ON Leakage ID, IS (ON)  
0.1  
DIGITAL INPUTS  
Input High Voltage, VINH  
Input Low Voltage, VINL  
Input Current  
2.0  
0.8  
V min  
V max  
IINL or IINH  
0.005  
µA typ  
µA max  
VIN = VINL or VINH  
0.1  
DYNAMIC CHARACTERISTICS2  
tON  
13  
7
ns typ  
ns max  
ns typ  
ns max  
ns typ  
ns min  
pC typ  
RL = 300 , CL = 35 pF,  
VS = 2 V; Test Circuit 4  
RL = 300 , CL = 35 pF,  
VS = 2 V; Test Circuit 4  
RL = 300 , CL = 35 pF,  
20  
12  
1
tOFF  
Break-Before-Make Time Delay, tD  
(ADG783 Only)  
Charge Injection  
7
V
S1 = VS2 = 2 V; Test Circuit 5  
3
VS = 1.5 V; RS = 0 , CL = 1 nF;  
Test Circuit 6  
Off Isolation  
–58  
–78  
dB typ  
dB typ  
RL = 50 , CL = 5 pF, f = 10 MHz  
RL = 50 , CL = 5 pF, f = 1 MHz;  
Test Circuit 7  
Channel-to-Channel Crosstalk  
–90  
dB typ  
RL = 50 , CL = 5 pF, f = 10 MHz;  
Test Circuit 8  
Bandwidth –3 dB  
CS (OFF)  
200  
10  
10  
MHz typ  
pF typ  
pF typ  
pF typ  
RL = 50 , CL = 5 pF; Test Circuit 9  
f = 1 MHz  
f = 1 MHz  
C
D (OFF)  
CD, CS (ON)  
22  
f = 1 MHz  
POWER REQUIREMENTS  
IDD  
V
DD = 3.3 V  
0.001  
µA typ  
µA max  
Digital Inputs = 0 V or 3.3 V  
1.0  
NOTES  
1Temperature ranges are as follows: B Version: –40°C to +85°C.  
2Guaranteed by design, not subject to production test.  
Specifications subject to change without notice.  
–3–  
REV. A  
ADG781/ADG782/ADG783  
ABSOLUTE MAXIMUM RATINGS1  
(TA = 25°C unless otherwise noted.)  
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . 300°C  
IR Reflow (<20 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 235°C  
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6 V  
Analog, Digital Inputs2 . . . . . . . . . . –0.3 V to VDD + 0.3 V or  
30 mA, Whichever Occurs First  
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA  
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA  
(Pulsed at 1 ms, 10% Duty Cycle max)  
NOTES  
1Stresses above those listed under Absolute Maximum Ratings may cause perma-  
nent damage to the device. This is a stress rating only; functional operation of the  
device at these or any other conditions above those listed in the operational  
sections of this specification is not implied. Exposure to absolute maximum rating  
conditions for extended periods may affect device reliability. Only one absolute  
maximum rating may be applied at any one time.  
2Overvoltages at IN, S, or D will be clamped by internal diodes. Current should be  
limited to the maximum ratings given.  
Operating Temperature Range  
Industrial (B Version) . . . . . . . . . . . . . . . . –40°C to +85°C  
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C  
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 150°C  
Chip Scale Package  
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 32°C/W  
ORDERING GUIDE  
Model  
Temperature Range  
Package Description  
Package Option  
ADG781BCP  
ADG782BCP  
ADG783BCP  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
20-Lead Chip Scale (CSP)  
20-Lead Chip Scale (CSP)  
20-Lead Chip Scale (CSP)  
CP-20  
CP-20  
CP-20  
Table I. Truth Table (ADG781/ADG782)  
PIN CONFIGURATION  
(CSP)  
ADG781 In  
ADG782 In  
Switch Condition  
0
1
1
0
ON  
OFF  
20 19 18 17 16  
PIN 1  
IDENTIFIER  
D1  
S1  
1
2
3
4
5
15  
D2  
14 S2  
Table II. Truth Table (ADG783)  
ADG781/ADG782/  
GND  
S4  
13  
V
DD  
ADG783  
TOP VIEW  
12 S3  
11 D3  
Logic  
Switch 1, 4  
Switch 2, 3  
(Not to Scale)  
D4  
0
1
OFF  
ON  
ON  
OFF  
6
9
10  
7
8
NC = NO CONNECT  
EXPOSED PAD TIED TO SUBSTRATE, GND  
CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily  
accumulate on the human body and test equipment and can discharge without detection.  
Although the ADG781/ADG782/ADG783 feature proprietary ESD protection circuitry, permanent  
damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper  
ESD precautions are recommended to avoid performance degradation or loss of functionality.  
WARNING!  
ESD SENSITIVE DEVICE  
–4–  
REV. A  
ADG781/ADG782/ADG783  
TERMINOLOGY  
VDD  
Most positive power supply potential.  
CD, CS (ON)  
“ON” switch capacitance.  
tON  
Delay between applying the digital control  
input and the output switching on.  
Delay between applying the digital control  
GND  
S
D
IN  
RON  
RON  
Ground (0 V) reference.  
Source terminal. May be an input or output.  
Drain terminal. May be an input or output.  
Logic control input.  
Ohmic resistance between D and S.  
On-resistance match between any two chan-  
nels (i.e., RON max and RON min).  
tOFF  
input and the output switching off.  
tD  
“OFF” time or “ON” time measured  
between the 90% points of both switches,  
when switching from one address state to  
another (ADG783 only).  
RFLAT(ON)  
Flatness is defined as the difference between  
the maximum and minimum value of on  
resistance as measured over the specified  
analog signal range.  
Source leakage current with the switch “OFF.”  
Drain leakage current with the switch “OFF.”  
Channel leakage current with the switch “ON.”  
Analog voltage on terminals D, S.  
Crosstalk  
A measure of unwanted signal that is coupled  
through from one channel to another as a  
result of parasitic capacitance.  
A measure of unwanted signal coupling  
through an “OFF” switch.  
A measure of the glitch impulse transferred  
from the digital input to the analog output  
during switching.  
Off Isolation  
IS (OFF)  
D (OFF)  
I
Charge  
Injection  
ID, IS (ON)  
VD (VS)  
On Response  
On Loss  
The frequency response of the “ON” switch.  
The loss due to the on resistance of the switch.  
CS (OFF)  
CD (OFF)  
“OFF” switch source capacitance.  
“OFF” switch drain capacitance.  
Typical Performance Characteristics  
6
6
5.5  
5
T
= 25C  
5.5  
5
V
= 5V  
A
DD  
V
= 2.7V  
DD  
4.5  
4
4.5  
4
+85C  
3.5  
3
3.5  
3
V
= 4.5V  
DD  
V
= 3V  
+25C  
DD  
2.5  
2
2.5  
2
V
= 5V  
DD  
1.5  
1
1.5  
1
40C  
0.5  
0
0.5  
0
0
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
V
OR V DRAIN OR SOURCE VOLTAGE V  
V OR V DRAIN OR SOURCE VOLTAGE V  
D S  
D
S
TPC 1. On Resistance as a Function of VD (VS)  
TPC 3. On Resistance as a Function of VD (VS) for  
Different Temperatures VDD = 5 V  
6
10m  
V
= 5V  
DD  
V
= 3V  
5.5  
5
DD  
1m  
+85C  
4.5  
4
+25C  
100ꢂ  
4 SW  
3.5  
3
10ꢂ  
1ꢂ  
1 SW  
2.5  
2
40C  
100n  
1.5  
1
10n  
1n  
0.5  
0
100  
1k  
10k  
100k  
1M  
10M  
0
0.5  
1
1.5  
2
2.5  
3
FREQUENCY Hz  
V
OR V DRAIN OR SOURCE VOLTAGE V  
D
S
TPC 2. On Resistance as a Function of VD (VS) for  
Different Temperatures VDD = 3 V  
TPC 4. Supply Current vs. Input Switching Frequency  
REV. A  
–5–  
ADG781/ADG782/ADG783  
30  
0
2  
4  
6  
40  
V
= 5V, 3V  
DD  
50  
60  
V
= 5V  
DD  
70  
80  
90  
100  
110  
120  
130  
10k  
100k  
1M  
FREQUENCY Hz  
10M  
100M  
10k  
100k  
1M  
10M  
100M  
FREQUENCY Hz  
TPC 5. Off Isolation vs. Frequency  
TPC 7. On Response vs. Frequency  
25  
20  
15  
10  
5
30  
40  
50  
60  
70  
80  
90  
T
= 25C  
A
V
= 5V, 3V  
DD  
V
= 5V  
DD  
V
= 3V  
DD  
100  
0
110  
120  
130  
5  
10  
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
10k  
100k  
1M  
FREQUENCY Hz  
10M  
100M  
SOURCE VOLTAGE V  
TPC 8. Charge Injection vs. Source Voltage  
TPC 6. Crosstalk vs. Frequency  
C1  
APPLICATIONS  
Figure 1 illustrates a photodetector circuit with programmable  
gain. An AD820 is used as the output operational amplifier.  
With the resistor values shown in the circuit, and using different  
combinations of the switches, gain in the range of 2 to 16 can  
be achieved.  
R1  
33kꢀ  
5V  
AD820  
D1  
2.5V  
V
OUT  
R2  
510kꢀ  
5V  
R4  
R5  
240k240kꢀ  
S1  
D1  
D2  
D3  
D4  
R3  
510kꢀ  
(LSB) IN1  
R6  
R7  
120k120kꢀ  
S2  
S3  
S4  
IN2  
IN3  
R8  
120kꢀ  
R9  
120kꢀ  
2.5V  
R10  
120kꢀ  
(MSB) IN4  
GND  
GAIN RANGE 2 TO 16  
Figure 1. Photodetector Circuit with Programmable Gain  
REV. A  
–6–  
ADG781/ADG782/ADG783  
Test Circuits  
I
DS  
I
(OFF)  
A
I
(OFF)  
A
I
(ON)  
A
S
D
D
V1  
S
D
S
D
NC  
V
V
V
D
S
D
D
S
NC = NO CONNECT  
V
S
R
= V1/I  
ON  
DS  
Test Circuit 1. On Resistance  
Test Circuit 2. Off Leakage  
Test Circuit 3. On Leakage  
V
DD  
0.1F  
V
50%  
50%  
50%  
ADG781  
ADG782  
IN  
V
DD  
V
IN  
50%  
90%  
D
S
V
OUT  
R
300ꢀ  
V
C
35pF  
IN  
L
S
L
V
S
90%  
V
OUT  
GND  
tON  
tOFF  
Test Circuit 4. Switching Times  
V
DD  
V
0.1F  
IN  
50%  
50%  
0V  
V
DD  
90%  
90%  
V
S1  
S2  
D1  
D2  
OUT1  
V
V
0V  
0V  
S1  
OUT1  
C
35pF  
R
300ꢀ  
L1  
L1  
V
V
S2  
OUT2  
C
35pF  
R
300ꢀ  
IN1, IN2  
L2  
L2  
90%  
90%  
V
OUT2  
V
ADG783  
GND  
IN  
tD  
tD  
Test Circuit 5. Break-Before-Make Time Delay, tD  
SW ON  
SW OFF  
V
DD  
V
IN  
V
DD  
R
S
D
S
V
OUT  
C
V
L
IN  
S
1nF  
V
OUT  
GND  
V
OUT  
Q
= C  
V
OUT  
INJ  
L
Test Circuit 6. Charge Injection  
V
DD  
V
DD  
0.1F  
0.1F  
NETWORK  
NETWORK  
ANALYZER  
ANALYZER  
V
DD  
V
DD  
D1  
S1  
D2  
NC  
V
OUT  
R
L
S
50ꢀ  
50ꢀ  
50ꢀ  
IN  
S2  
V
S
R
50ꢀ  
L
50ꢀ  
D
V
V
OUT  
IN  
IN  
V
R
S
L
50ꢀ  
GND  
GND  
CHANNEL-TO-CHANNEL  
V
V
V
S
OUT  
OUT  
OFF ISOLATION = 20 LOG  
CROSSTALK = 20 LOG  
V
S
Test Circuit 7. Off Isolation  
Test Circuit 8. Channel-to-Channel Crosstalk  
REV. A  
–7–  
ADG781/ADG782/ADG783  
V
V
DD  
0.1F  
NETWORK  
ANALYZER  
DD  
S
50ꢀ  
IN  
V
S
D
V
V
OUT  
IN  
R
L
50ꢀ  
GND  
V
WITH SWITCH  
OUT  
WITHOUT SWITCH  
INSERTION LOSS = 20 LOG  
V
OUT  
Test Circuit 9. Bandwidth  
OUTLINE DIMENSIONS  
Dimensions shown in inches and (mm).  
20-Lead CSP  
(CP-20)  
0.024 (0.60)  
0.017 (0.42)  
0.009 (0.24)  
0.024 (0.60)  
0.010 (0.25)  
MIN  
0.157 (4.0)  
BSC SQ  
0.017 (0.42)  
0.009 (0.24)  
16  
15  
20  
1
PIN 1  
0.012 (0.30)  
0.009 (0.23)  
0.007 (0.18)  
0.030 (0.75)  
0.024 (0.60)  
0.020 (0.50)  
0.089 (2.25)  
0.083 (2.10) SQ  
0.077 (1.95)  
INDICATOR  
0.148 (3.75)  
BSC SQ  
TOP  
VIEW  
BOTTOM  
VIEW  
11  
10  
5
6
0.028 (0.70) MAX  
0.026 (0.65) NOM  
0.080 (2.00)  
REF  
12MAX  
0.035 (0.90) MAX  
0.033 (0.85) NOM  
0.002 (0.05)  
0.0004 (0.01)  
0.0 (0.0)  
SEATING  
PLANE  
0.020 (0.50)  
BSC  
0.008 (0.20)  
REF  
CONTROLLING DIMENSIONS ARE IN MILLIMETERS  
Revision History  
Location  
Page  
Data Sheet changed from REV. 0 to REV. A.  
Edits to Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–6  
Changes to OUTLINE DIMENSIONS drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
–8–  
REV. A  

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