ADG791GBCPZ-500RL7 [ADI]
IC-Compatible, Wide Bandwidth, Quad, 2:1 Multiplexer; IC兼容，宽带宽，四路， 2 ： 1多路复用器
| 型号： | ADG791GBCPZ-500RL7 |
| 厂家： | 
ADI |
| 描述： | IC-Compatible, Wide Bandwidth, Quad, 2:1 Multiplexer |
| 文件： | 总24页 (文件大小：427K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
I2C-Compatible, Wide Bandwidth,
Quad, 2:1 Multiplexer
ADG791A/ADG791G
FUNCTIONAL BLOCK DIAGRAM
FEATURES
V
V
Bandwidth: 325 MHz
DD
GND
DD
GND
Low insertion loss and on resistance: 2.6 Ω typical
On resistance flatness: 0.3 Ω typical
Single 3 V/5 V supply operation
3.3 V analog signal range (5 V supply, 75 Ω load)
Low quiescent supply current: 1 nA typical
Fast switching times: tON = 186 ns, tOFF = 177 ns
I2C®-compatible interface
Compact 24-lead LFCSP
ESD protection
4 kV human body model (HBM)
200 V machine model (MM)
ADG791A
ADG791G
S1A
S1A
D1
D2
D3
D4
D1
D2
D3
S1B
S2A
S1B
S2A
S2B
S3A
S2B
S3A
S3B
S4A
S3B
S4A
D4
S4B
S4B
1 kV field-induced charged device model (FICDM)
2
2
I C SERIAL
I C SERIAL
GPO1
INTERFACE
INTERFACE
APPLICATIONS
A0 A1 A2 SDA SCL
A0 A1 A2 SDA SCL
S-video RGB/YPbPr video switches
HDTVs
Figure 1.
Projection TVs
DVD-R/RW
AV receivers
GENERAL DESCRIPTION
The ADG791A/ADG791G are monolithic CMOS devices
comprising four 2:1 multiplexers/demultiplexers controllable
via a standard I2C serial interface. The CMOS process provides
ultralow power dissipation yet gives high switching speed and
low on resistance.
that allow up to eight devices on the same bus. This allows the
user to expand the capability of the device by increasing the size
of the switching array.
The ADG791A/ADG791G operate from a single 3 V or 5 V
supply voltage and is available in a compact 4 mm × 4 mm
body, 24-lead LFCSP.
The on-resistance profile is very flat over the full analog input
range and wide bandwidth ensures excellent linearity and low
distortion. These features, combined with a wide input signal
range make the ADG791A/ADG791G the ideal switching
solution for a wide range of TV applications including S-video,
RGB, and YPbPr video switches.
PRODUCT HIGHLIGHTS
1. Wide bandwidth: 325 MHz.
2. Ultralow power dissipation.
3. Extended input signal range.
The switches conduct equally well in both directions when on.
In the off condition, signal levels up to the supplies are blocked.
The ADG791A/ADG791G switches exhibit break-before-make
switching action. The ADG791G has one general-purpose logic
output pin controlled by the I2C interface that can also be used
to control other non-I2C-compatible devices such as video filters.
The integrated I2C interface provides a large degree of flexibility
in the system design. It has three configurable I2C address pins
4. Integrated I2C serial interface.
5. Compact 4 mm × 4 mm, 24-lead, Pb-free LFCSP.
6. ESD protection tested as per ESD association standards:
4 kV HBM (ANSI/ESD STM5.1-2001)
200 V MM (ANSI/ESD STM5.2-1999)
1 kV FICDM (ANSI/ESDSTM5.3.1-1999)
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Fax: 781.461.3113
www.analog.com
©2006 Analog Devices, Inc. All rights reserved.
ADG791A/ADG791G
TABLE OF CONTENTS
Features .............................................................................................. 1
Terminology .................................................................................... 16
Theory of Operation ...................................................................... 17
I2C Serial Interface ..................................................................... 17
I2C Address.................................................................................. 17
Write Operation.......................................................................... 17
LDSW Bit..................................................................................... 19
Power On/Software Reset.......................................................... 19
Read Operation........................................................................... 19
Evaluation Board ............................................................................ 20
Using the ADG791G Evaluation Board .................................. 20
Outline Dimensions....................................................................... 23
Ordering Guide .......................................................................... 23
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
I2C Timing Specifications............................................................ 7
Timing Diagram ........................................................................... 8
Absolute Maximum Ratings............................................................ 9
ESD Caution.................................................................................. 9
Pin Configurations and Function Descriptions ......................... 10
Typical Performance Characteristics ........................................... 11
Test Circuits ..................................................................................... 14
REVISION HISTORY
7/06—Revision 0: Initial Version
Rev. 0 | Page 2 of 24
ADG791A/ADG791G
SPECIFICATIONS
VDD = 5 V 10ꢀ, GND = 0 V, TA = −40°C to +85°C, unless otherwise noted.
Table 1.
Parameter
Conditions
Min
Typ1
Max
Unit
ANALOG SWITCH
Analog Signal Range2
VS = VDD, RL = 1 MΩ
VS = VDD, RL = 75 Ω
VD = 0 V, IDS = −10 mA, see Figure 22
VD = 0 V to 1 V, IDS = −10 mA, see Figure 22
0
0
4
V
V
Ω
Ω
3.3
3.5
4
On Resistance, RON
2.6
On-Resistance Matching Between
Channels, ∆RON
VD = 0 V, IDS = −10 mA
VD = 1 V, IDS = −10 mA
VD = 0 V to 1 V, IDS = −10 mA
0.15
0.3
0.5
0.6
0.55
Ω
Ω
Ω
On-Resistance Flatness, RFLAT (ON)
LEAKAGE CURRENTS
Source OFF Leakage (IS (OFF)
)
VD = 4 V/1 V, VS = 1 V/4 V, see Figure 23
VD = 4 V/1 V, VS = 1 V/4 V, see Figure 23
VD = VS = 4 V/1 V, see Figure 24
0.25
0.25
0.25
nA
nA
nA
Drain OFF Leakage (ID (OFF)
)
Channel ON Leakage (ID (ON), IS (ON)
DYNAMIC CHARACTERISTICS3
tON, tENABLE
)
CL = 35 pF, RL = 50 Ω, VS = 2 V, see Figure 28
CL = 35 pF, RL = 50 Ω, VS = 2 V, see Figure 28
CL = 35 pF, RL = 50 Ω, VS1 = VS2 = 2 V, see Figure 29
(ADG791G only)
f = 10 MHz, RL = 50 Ω, see Figure 26
f = 10 MHz, RL = 50 Ω, see Figure 27
186
177
3
250
240
ns
ns
ns
ns
dB
tOFF, tDISABLE
Break-Before-Make Time Delay, tD
I2C to GPO Propagation Delay, tH, tL
Off Isolation
Channel-to-Channel Crosstalk
Same Multiplexer
Different Multiplexer
−3 dB Bandwidth
THD + N
1
130
−60
−55
−70
325
0.14
5
dB
dB
MHz
%
pC
RL = 50 Ω, see Figure 25
RL = 100 Ω
CL = 1 nF, VS = 0 V, see Figure 30
Charge Injection
CS (OFF)
10
pF
CD (OFF)
13
pF
CD (ON), CS (ON)
27
pF
Power Supply Rejection Ratio, PSRR
Differential Gain Error
Differential Phase Error
LOGIC INPUTS3
f = 20 kHz
CCIR330 test signal
CCIR330 test signal
70
0.32
0.44
dB
%
Degrees
A0, A1, A2
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current, IINL or IINH
Input Capacitance, CIN
SCL, SDA
2.0
V
V
μA
pF
0.8
1
VIN = 0 V to VDD
0.005
3
Input High Voltage, VINH
Input Low Voltage, VINL
Input Leakage Current, IIN
Input Hysteresis
0.7 × VDD
−0.3
VDD + 0.3
+0.3 × VDD
1
V
V
μA
V
pF
VIN = 0 V to VDD
0.005
0.05 × VDD
3
Input Capacitance, CIN
Rev. 0 | Page 3 of 24
ADG791A/ADG791G
Parameter
LOGIC OUTPUTS3
Conditions
Min
Typ1
Max
Unit
SDA Pin
Output Low Voltage, VOL
ISINK = 3 mA
ISINK = 6 mA
0.4
0.6
1
V
V
μA
pF
Floating-State Leakage Current
Floating-State Output Capacitance
GPO1 Pin and GPO2 Pin
Output Low Voltage, VOL
Output High Voltage, VOH
POWER REQUIREMENTS
IDD
10
ILOAD = +2 mA
ILOAD = −2 mA
0.4
V
V
2.0
Digital inputs = 0 V or VDD, I2C interface inactive
I2C interface active, fSCL = 400 kHz
I2C interface active, fSCL = 3.4 MHz
0.001
1
0.2
0.7
μA
mA
mA
1All typical values are at TA = 25°C, unless otherwise stated.
2 Guaranteed by initial characterization, not subject to production test.
3 Guaranteed by design, not subject to production test.
Rev. 0 | Page 4 of 24
ADG791A/ADG791G
VDD = 3 V 10ꢀ, GND = 0 V, TA = −40°C to +85°C, unless otherwise noted.
Table 2.
Parameter
Conditions
Min
Typ1
Max
Unit
ANALOG SWITCH
Analog Signal Range2
VS = VDD, RL = 1 MΩ
VS = VDD, RL = 75 Ω
VD = 0 V, IDS = −10 mA, see Figure 22
VD = 0 V to 1 V, IDS = −10 mA, see Figure 22
0
0
2.2
1.7
4
V
V
Ω
Ω
On Resistance, RON
3
6
On-Resistance Matching Between
Channels, ∆RON
VD = 0 V, IDS = −10 mA
VD = 1 V, IDS = −10 mA
VD = 0 V to 1 V, IDS = −10 mA
0.15
0.8
0.6
1.1
2.8
Ω
Ω
Ω
On-Resistance Flatness, RFLAT (ON)
LEAKAGE CURRENTS
Source Off Leakage (IS (OFF)
)
VD = 2 V/1 V, VS = 1 V/2 V, see Figure 23
VD = 2 V/1 V, VS = 1 V/2 V, see Figure 23
VD = VS = 2 V/1 V, see Figure 24
0.25
0.25
0.25
nA
nA
nA
Drain Off Leakage (ID (OFF)
)
Channel On Leakage (ID (ON), IS (ON)
DYNAMIC CHARACTERISTICS3
tON, tENABLE
tOFF, tDISABLE
Break-Before-Make Time Delay, tD
)
CL = 35 pF, RL = 50 Ω, VS = 2 V, see Figure 28
CL = 35 pF, RL = 50 Ω, VS = 2 V, see Figure 28
CL = 35 pF, RL = 50 Ω, VS1 = VS2 = 2 V, see Figure 29
198
195
3
270
260
ns
ns
ns
ns
1
I2C to GPO Propagation Delay, tH, tL
(ADG791G only)
121
Off Isolation
f = 10 MHz, RL = 50 Ω, see Figure 26
f = 10 MHz, RL = 50 Ω, see Figure 27
−60
dB
Channel-to-Channel Crosstalk
Same Multiplexer
Different Multiplexer
−3 dB Bandwidth
THD + N
−55
−70
310
0.14
2.5
dB
dB
MHz
%
RL = 50 Ω, see Figure 25
RL = 100 Ω
CL = 1 nF, VS = 0 V, see Figure 30
Charge Injection
pC
CS (OFF)
10
pF
CD (OFF)
13
pF
CD (ON), CS (ON)
27
pF
Power Supply Rejection Ratio, PSRR
Differential Gain Error
Differential Phase Error
LOGIC INPUTS3
f = 20 kHz
CCIR330 test signal
CCIR330 test signal
70
0.28
0.28
dB
%
Degrees
A0, A1, A2
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current, IINL or IINH
Input Capacitance, CIN
SCL, SDA
2.0
V
V
μA
pF
0.8
1
VIN = 0 V to VDD
0.005
3
Input High Voltage, VINH
Input Low Voltage, VINL
Input Leakage Current, IIN
Input Hysteresis
0.7 × VDD
−0.3
VDD + 0.3
+0.3 × VDD
1
V
V
μA
V
pF
VIN = 0 V to VDD
0.005
0.05 × VDD
3
Input Capacitance, CIN
Rev. 0 | Page 5 of 24
ADG791A/ADG791G
Parameter
LOGIC OUTPUTS3
Conditions
Min
Typ1
Max
Unit
SDA Pin
Output Low Voltage, VOL
ISINK = 3 mA
ISINK = 6 mA
0.4
0.6
1
V
V
μA
pF
Floating-State Leakage Current
Floating-State Output Capacitance
GPO1 Pin and GPO2 Pin
Output Low Voltage, VOL
Output High Voltage, VOH
POWER REQUIREMENTS
IDD
3
ILOAD = +2 mA
ILOAD = −2 mA
0.4
V
V
2.0
Digital inputs = 0 V or VDD, I2C interface inactive
I2C interface active, fSCL = 400 kHz
I2C interface active, fSCL = 3.4 MHz
0.001
1
0.1
0.2
μA
mA
mA
1All typical values are at TA = 25°C, unless otherwise stated.
2 Guaranteed by initial characterization, not subject to production test.
3 Guaranteed by design, not subject to production test.
Rev. 0 | Page 6 of 24
ADG791A/ADG791G
I2C TIMING SPECIFICATIONS
VDD = 2.7 V to 5.5 V; GND = 0 V; TA = −40°C to +85°C, unless otherwise noted. See Figure 2 for timing diagram.
Table 3.
Parameter1 Conditions
Min
Max
100
400
Unit
kHz
kHz
Description
fSCL
Standard mode
Fast mode
Serial clock frequency
High speed mode
CB = 100 pF max
CB = 400 pF max
Standard mode
Fast mode
High speed mode
CB = 100 pF max
CB = 400 pF max
Standard mode
Fast mode
3.4
1.7
MHz
MHz
μs
t1
4
0.6
tHIGH, SCL high time
tLOW, SCL low time
μs
60
ns
ns
μs
μs
120
4.7
1.3
t2
High speed mode
CB = 100 pF max
CB = 400 pF max
Standard mode
Fast mode
High speed mode
Standard mode
Fast mode
160
320
250
100
10
ns
ns
ns
ns
ns
μs
μs
t3
tSU;DAT, data setup time
tHD;DAT, data hold time
2
t4
0
0
3.45
0.9
High speed mode
CB = 100 pF max
CB = 400 pF max
Standard mode
Fast mode
High speed mode
Standard mode
Fast mode
0
0
703
150
ns
ns
μs
μs
ns
μs
μs
ns
μs
μs
μs
μs
ns
ns
ns
t5
t6
4.7
0.6
160
4
0.6
160
4.7
1.3
4
tSU;STA, setup time for a repeated start condition
tHD;STA, hold time (repeated) start condition
High speed mode
Standard mode
Fast mode
t7
t8
tBUF, bus free time between a stop and a start condition
tSU;STO, setup time for stop condition
Standard mode
Fast mode
High speed mode
Standard mode
Fast mode
High speed mode
CB = 100 pF max
CB = 400 pF max
Standard mode
Fast mode
High speed mode
CB = 100 pF max
CB = 400 pF max
Standard mode
Fast mode
0.6
160
t9
1000
tRDA, rise time of SDA signal
tFDA, fall time of SDA signal
tRCL, rise time of SCL signal
20 + 0.1 CB 300
10
20
80
160
300
ns
ns
ns
ns
t10
20 + 0.1 CB 300
10
20
80
160
1000
ns
ns
ns
ns
t11
20 + 0.1 CB 300
High speed mode
CB = 100 pF max
CB = 400 pF max
10
20
40
80
ns
ns
Rev. 0 | Page 7 of 24
ADG791A/ADG791G
Parameter1 Conditions
Min
Max
Unit
Description
t11A
Standard mode
1000
ns
tRCL1, rise time of SCL signal after a repeated start condition
and after an acknowledge bit.
Fast mode
20 + 0.1 CB 300
ns
High speed mode
CB = 100 pF max
CB = 400 pF max
Standard mode
Fast mode
10
20
80
160
300
ns
ns
ns
ns
t12
tFCL, fall time of SCL signal
20 + 0.1 CB 300
High speed mode
CB = 100 pF max
CB = 400 pF max
Fast mode
10
20
0
40
80
50
10
ns
ns
ns
ns
tSP
Pulse width of suppressed spike
High speed mode
0
1 Guaranteed by initial characterization. CB refers to capacitive load on the bus line, tr and tf measured between 0.3 VDD and 0.7 VDD
2 A device must provide a data hold time for SDA to bridge the undefined region of the SCL falling edge.
.
TIMING DIAGRAM
t11
t12
t6
t2
t6
SCL
SDA
t1
t3
t5
t10
t8
t4
t9
t7
P
S
S
P
Figure 2. Timing Diagram for 2-Wire Serial Interface
Rev. 0 | Page 8 of 24
ADG791A/ADG791G
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 4.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Parameter
Ratings
VDD to GND
−0.3 V to +6 V
Analog, Digital Inputs
−0.3 V to VDD + 0.3 V or
30 mA, whichever occurs first
Continuous Current, S or D
Peak Current, S or D
100 mA
300 mA (pulsed at 1 ms,
10% duty cycle max)
Operating Temperature Range
Industrial (B Version)
Storage Temperature Range
Junction Temperature
θJA Thermal Impedance
24-Lead LFCSP
Lead Temperature, Soldering
(10 sec)
IR Reflow, Peak Temperature
(<20 sec)
Only one absolute maximum rating may be applied at any one
time.
−40°C to +85°C
−65°C to +150°C
150°C
30°C/W
300°C
260°C
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. 0 | Page 9 of 24
ADG791A/ADG791G
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
PIN 1
PIN 1
INDICATOR
INDICATOR
S1A
S1B
D1
D2
S2B
S2A
1
2
3
4
5
6
18 A2
17 NC
16 NC
15 NC
14 NC
13 NC
S1A
S1B
D1
D2
S2B
S2A
1
2
3
4
5
6
18 A2
17 NC
16 GPO1
15 NC
14 NC
13 NC
ADG791A
ADG791G
TOP VIEW
TOP VIEW
(Not to Scale)
(Not to Scale)
NOTES
NOTES
1. NC = NO CONNECT.
1. NC = NO CONNECT.
2. THE EXPOSED PAD MUST BE TIED TO GND.
2. THE EXPOSED PAD MUST BE TIED TO GND.
Figure 3. ADG791G Pin Configuration
Figure 4. ADG791A Pin Configuration
Table 5. ADG791A/ADG791G Pin Function Descriptions
Pin No.
Mnemonic
S1A
S1B
D1
Description
1
2
3
A-Side Source Terminal for Mux 1. Can be an input or output.
B-Side Source Terminal for Mux 1. Can be an input or output.
Drain Terminal for Mux 1. Can be an input or output.
Drain Terminal for Mux 2. Can be an input or output.
B-Side Source Terminal for Mux 2. Can be an input or output.
A-Side Source Terminal for Mux 2. Can be an input or output.
A-Side Source Terminal for Mux 3. Can be an input or output.
B-Side Source Terminal for Mux 3. Can be an input or output.
Drain Terminal for Mux 3. Can be an input or output.
Drain Terminal for Mux 4. Can be an input or output.
B-Side Source Terminal for Mux 4. Can be an input or output.
A-Side Source Terminal for Mux 4. Can be an input or output.
Not Internally Connected.
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
D2
S2B
S2A
S3A
S3B
D3
D4
S4B
S4A
NC
NC
NC
NC/GPO1
NC
A2
A1
A0
Not Internally Connected.
Not Internally Connected.
Not Internally Connected for ADG791A/General-Purpose Logic Output 1 for ADG791G.
Not Internally Connected.
Logic Input. Sets Bit A2 from the least significant bit of the 7-bit slave address.
Logic Input. Sets Bit A1 from the least significant bit of the 7-bit slave address.
Logic Input. Sets Bit A0 from the least significant bit of the 7-bit slave address.
SCL
Digital Input, Serial Clock Line. Open-drain input that is used in conjunction with SDA to clock data into
the device. External pull-up resistor required.
22
23
24
SDA
VDD
GND
Digital I/O. Bidirectional, open-drain data line. External pull-up resistor required.
Positive Power Supply Input.
Ground (0 V) Reference.
Rev. 0 | Page 10 of 24
ADG791A/ADG791G
TYPICAL PERFORMANCE CHARACTERISTICS
3.0
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
T
= 25°C
V
= 3.3V, R = 1MΩ
L
T
= 25°C
A
DD
A
V
= 5.0V
= 5.5V
DD
1 CHANNEL
1 CHANNEL
V
= 3V, R = 1MΩ
L
V
= 4.5V
DD
DD
2.5
2.0
1.5
1.0
0.5
0
V
V
= 2.7V, R = 1MΩ
DD
DD
L
V
= 3.3V, R = 75Ω
DD
L
V
= 3V, R = 75Ω
L
DD
V
= 2.7V, R = 75Ω
DD
L
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0
0.5
1.0
1.5
(V ) (V)
2.0
2.5
3.0
INPUT SIGNAL (V)
V
D
S
Figure 5. Analog Signal Range, 3 V Supply
Figure 8. On Resistance vs. VD (VS), 5 V Supply
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
7
6
5
4
3
2
1
0
T
= 25°C
V
= 5.5V, R = 1MΩ
L
A
V
= 5V, R = 1MΩ
DD
DD
L
1 CHANNEL
= 3V
V
= 5.5V, R = 75Ω
DD
L
V
DD
V
= 4.5V, R = 1MΩ
L
DD
T
= +85°C
A
V
= 5V, R = 75Ω
L
DD
V
= 4.5V, R = 75Ω
DD
L
T
= –40°C
A
T
= +25°C
A
T
= 25°C
A
1 CHANNEL
0
1
2
3
4
5
6
0
0.2
0.4
0.6
0.8
V (V ) (V)
D
1.0
1.2
1.4
1.6
INPUT SIGNAL (V)
S
Figure 6. Analog Signal Range, 5 V Supply
Figure 9. On Resistance vs. VD (VS) for Various Temperatures, 3 V Supply
4.5
6
5
4
3
2
1
0
T
= 25°C
T = +25°C
A
1 CHANNEL
T
= +85°C
A
A
1 CHANNEL
V
= 3.0V
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
DD
V
V
= 5V
DD
T
T
= +25°C
= –40°C
A
V
= 2.7V
DD
A
= 3.3V
DD
0
0.2
0.4
0.6
0.8
1.0
(V ) (V)
1.2
1.4
1.6
1.8
0
0.5
1.0
1.5
2.0
2.5
3.0
V
(V ) (V)
S
V
D
D
S
Figure 7. On Resistance vs. VD (VS), 3 V Supply
Figure 10. On Resistance vs. VD (VS) for Various Temperatures, 5 V Supply
Rev. 0 | Page 11 of 24
ADG791A/ADG791G
0
0
–20
T
= 25°C
T
V
= 25°C
A
A
= 3V/5V
–0.5
–1.0
–1.5
–2.0
–2.5
–3.0
–3.5
–4.0
–4.5
–5.0
DD
V
= 3V
DD
V
= 5V
DD
SAME
–40
MULTIPLEXER
–60
DIFFERENT
MULTIPLEXER
–80
–100
–120
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0.01
0.1
1
10
100
1000
SOURCE VOLTAGE (V)
FREQUENCY (MHz)
Figure 11. Charge Injection vs. Source Voltage
Figure 14. Crosstalk vs. Frequency
220
210
200
190
180
170
160
–1
–3
T
V
= 25°C
A
= 5V
DD
tON (3V)
–5
tOFF (3V)
–7
–9
tON (5V)
–11
–13
–15
tOFF (5V)
0.01
0.1
1
10
100
1000
–40
–20
0
20
40
60
80
FREQUENCY (MHz)
TEMPERATURE (°C)
Figure 12. tON/tOFF vs. Temperature
Figure 15. Bandwidth
0
–20
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
T
= 25°C
T
V
= 25°C
A
A
1 CHANNEL
= 3V/5V
= 3V/5V
DD
V
DD
NO DECOUPLING CAPACITORS USED
–40
–60
–80
–100
–120
0.01
0.1
1
10
100
1000
0.0001
0.001
0.01
0.1
1
10
100
1000
FREQUENCY (MHz)
FREQUENCY (MHz)
Figure 13. Off Isolation vs. Frequency
Figure 16. PSRR vs. Frequency
Rev. 0 | Page 12 of 24
ADG791A/ADG791G
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
6
5
4
3
2
1
0
T
= 25°C
T
= 25°C
A
A
V
= 5V
DD
V
= 5V
DD
V
= 3V
DD
V
= 3V
DD
0.1
0.6
1.1
1.6
2.1
2.6
3.1
–20 –18 –16 –14 –12 –10
–8
–6
–4
–2
0
LOAD CURRENT (mA)
fCLK FREQUENCY (MHz)
Figure 17. IDD vs. fCLK Frequency
Figure 20. GPO VOH vs. Load Current
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
2.5
2.0
1.5
1.0
0.5
0
T
= 25°C
A
T
= 25°C
A
V
= 3V
V
= 5V
DD
DD
V
= 5V
DD
V
= 3V
DD
–0.2
0
1
2
3
4
5
6
0
5
10
15
20
25
30
35
2
I C LOGIC INPUT VOLTAGE (V)
LOAD CURRENT (mA)
Figure 18. IDD vs. I2C Logic Input Voltage (SDA, SCL)
Figure 21. GPO VOL vs. Load Current
120
115
110
105
100
95
tPHL (5V)
tPHL (3V)
tPLH (5V)
tPLH (3V)
–40
–20
0
20
40
60
80
TEMPERATURE (°C)
Figure 19. I2C to GPO Propagation Delay vs. Temperature
(ADG791G Only)
Rev. 0 | Page 13 of 24
ADG791A/ADG791G
TEST CIRCUITS
V
DD
0.1µF
I
DS
NETWORK
ANALYZER
SA
50Ω
50Ω
50Ω
V1
V
S
SB
D
S
D
V
OUT
V
S
R
= V1/I
ON
DS
50Ω
GND
Figure 22. On Resistance
Figure 25. Bandwidth
V
DD
0.1µF
NETWORK
ANALYZER
I
(OFF)
I (OFF)
D
50Ω
S
50Ω
S
S
D
A
A
50Ω
V
S
V
V
S
D
50Ω
D
V
OUT
50Ω
GND
Figure 26. Off Isolation
Figure 23. Off Leakage
V
DD
0.1µF
NETWORK
ANALYZER
50Ω
50Ω
SX
SY
I
(ON)
A
D
S
D
NC
V
S
50Ω
V
D
V
OUT
R
50Ω
L
NC = NO CONNECT
DY
DX
GND
50Ω 50Ω
Figure 24. On Leakage
Figure 27. Channel-to-Channel Crosstalk
Rev. 0 | Page 14 of 24
ADG791A/ADG791G
CLOCK PULSES
CORRESPONDING TO THE
LDSW BITS
SCL
50%
90%
50%
5V
0.1µF
S
10%
tOFF
V
OUT
V
DD
tON
V
OUT
D
R
50Ω
C
L
35pF
CLOCK PULSES
CORRESPONDING TO THE
LDSW BITS
L
V
S
2
I C
INTERFACE
SCL
50%
90%
50%
SDA
SCL
GND
10%
V
GPO
tH
tL
Figure 28. Switching Time
5V
CLOCK PULSE
CORRESPONDING
TO THE LDSW BIT
0.1µF
V
DD
SCL
SA
SB
V
OUT
D
V
V
S
80%
OUT
R
50Ω
C
L
35pF
L
V
S
2
I C
INTERFACE
tD
SDA
SCL
GND
Figure 29. Break-Before-Make Time Delay
5V
V
DD
SWITCH ON
R
ΔV
OUT
S
S
D
SWITCH OFF
V
OUT
C
1nF
Q
= C × ΔV
OUT
L
INJ
L
V
S
GND
Figure 30. Charge Injection
Rev. 0 | Page 15 of 24
ADG791A/ADG791G
TERMINOLOGY
On Resistance (RON)
Total Harmonic Distortion + Noise (THD + N)
The ratio of the harmonic amplitudes plus noise of a signal to
the fundamental.
The series on-channel resistance measured between the S and
D pins.
On Resistance Match (ΔRON)
−3 dB Bandwidth
The channel-to-channel matching of on resistance when
channels are operated under identical conditions.
The frequency at which the output is attenuated by 3 dB.
Off Isolation
On Resistance Flatness (RFLAT(ON)
)
The measure of unwanted signal coupling through an off switch.
The variation of on resistance over the specified range produced
by the specified analog input voltage change with a constant
load current.
Crosstalk
The measure of unwanted signal that is coupled through from
one channel to another as a result of parasitic capacitance.
Channel Off Leakage (IOFF
The sum of leakage currents into or out of an off channel input.
)
Charge Injection
The measure of the glitch impulse transferred from the digital
input to the analog output during on/off switching.
Channel On Leakage (ION)
The current loss/gain through an on-channel resistance,
creating a voltage offset across the device.
Differential Gain Error
The measure of how much color saturation shift occurs when
the luminance level changes. Both attenuation and amplifica-
tion can occur; therefore, the largest amplitude change between
any two levels is specified and expressed in ꢀ.
Input Leakage Current (IIN, IINL, IINH
)
The current flowing into a digital input when a specified low
level or high level voltage is applied to that input.
Input/Output Off Capacitance (COFF
The capacitance between an analog input and ground when the
switch channel is off.
)
Differential Phase Error
The measure of how much hue shift occurs when the luminance
level changes. It can be a negative or positive value and is expressed
in degrees of subcarrier phase.
Input/Output On Capacitance (CON)
The capacitance between the inputs or outputs and ground
when the switch channel is on.
Input High Voltage (VINH
The minimum input voltage for Logic 1.
)
Digital Input Capacitance (CIN)
The capacitance between a digital input and ground.
Input Low Voltage (VINL
The maximum input voltage for Logic 0.
)
Output On Switching Time (tON)
Output High Voltage (VOH
The minimum output voltage for Logic 1.
)
The time required for the switch channel to close. The time is
measured from 50ꢀ of the falling edge of the LDSW bit to the
time the output reaches 90ꢀ of the final value.
Output Low Voltage (VOL)
The maximum output voltage for Logic 0.
Output Off Switching Time (tOFF
)
The time required for the switch to open. The time is measured
from 50ꢀ of the falling edge of the LDSW bit to the time the
output reaches 10ꢀ of the final value.
IDD
Positive supply current.
I2C to GPO Propagation Delay (tH, tL)
The time required for the logic value at the GPO pin to settle
after loading a GPO command. The time is measured from 50ꢀ
of the falling edge of the LDSW bit to the time the output
reaches 90ꢀ of the final value for high and 10ꢀ for low.
Rev. 0 | Page 16 of 24
ADG791A/ADG791G
THEORY OF OPERATION
The ADG791A/ADG791G are monolithic CMOS devices
comprising four 2:1 multiplexers controllable via a standard I2C
serial interface. The CMOS process provides ultralow power
dissipation, yet offers high switching speed and low on resistance.
3. Data transmits over the serial bus in sequences of nine
clock pulses (eight data bits followed by an acknowledge
bit). The transitions on the SDA line must occur during the
low period of the clock signal, SCL, and remain stable
during the high period of SCL. Otherwise, a low-to-high
transition when the clock signal is high can be interpreted
as a stop event that ends the communication between the
master and the addressed slave device.
The on resistance profile is very flat over the full analog input
range, and wide bandwidth ensures excellent linearity and low
distortion. These features, combined with a wide input signal
range, make the ADG791A/ADG791G an ideal switching
solution for a wide range of TV applications.
4. After transferring all data bytes, the master establishes a
stop condition, defined as a low-to-high transition on the
SDA line while SCL is high. In write mode, the master pulls
the SDA line high during the 10th clock pulse to establish a
stop condition. In read mode, the master issues a no
acknowledge for the ninth clock pulse (the SDA line
remains high). The master then brings the SDA line low
before the 10th clock pulse, and then high during the 10th
clock pulse to establish a stop condition.
The switches conduct equally well in both directions when on.
In the off condition, signal levels up to the supplies are blocked.
The integrated serial I2C interface controls the operation of the
switches (ADG791A/ADG791G) and general-purpose logic
pins (ADG791G only).
The ADG791A/ADG791G have many attractive features, such
as the ability to individually control each multiplexer, the option
of reading back the status of any switch. The ADG791G has one
general-purpose logic output pin controllable through the I2C
interface. The following sections describe these features in detail.
I2C ADDRESS
The ADG791A/ADG791G has a 7-bit I2C address. The four
most significant bits are internally hardwired while the last
three bits (A0, A1, and A2) are user-adjustable. This allows the
user to connect up to eight ADG791As/ADG791Gs to the same
bus. The I2C bit map shows the configuration of the address.
I2C SERIAL INTERFACE
The ADG791A/ADG791G are controlled via an I2C-compatible
serial bus interface (refer to the I2C-Bus Specification available
from Philips Semiconductor) that allows the part to operate as a
slave device (no clock is generated by the ADG791A/ADG791G).
The communication protocol between the I2C master and the
device operates as follows:
7-Bit I2C Address Configuration
MSB
LSB
1
0
1
0
A2
A1
A0
WRITE OPERATION
1. The master initiates data transfer by establishing a start
condition (defined as a high-to-low transition on the SDA
line while SCL is high). This indicates that an address/data
stream follows. All slave devices connected to the bus
respond to the start condition and shift in the next eight
When writing to the ADG791A/ADG791G, the user must
begin with an address byte and R/ bit, after which time the
W
switch acknowledges that it is prepared to receive data by
pulling SDA low. Data is loaded into the device as a 16-bit word
under the control of a serial clock input, SCL. Figure 31
illustrates the entire write sequence for the ADG791A/
ADG791G. The first data byte (AX7 to AX0) controls the status
of the switches while the LDSW and RESETB bits from the
second byte control the operation mode of the device.
W
bits, consisting of a 7-bit address (MSB first) plus an R/
bit. This bit determines the direction of the data flow
during the communication between the master and the
addressed slave device.
2. The slave device whose address corresponds to the
transmitted address responds by pulling the SDA line
low during the ninth clock pulse (this is known as the
acknowledge bit).
Table 6 shows a list of all commands supported by the
ADG791A/ADG791G with the corresponding byte that needs
to be loaded during a write operation.
To achieve the desired configuration, one or more commands
can be loaded into the device. Any combination of the
commands listed in Table 6 can be used with these restrictions:
At this stage, all other devices on the bus remain idle while
the selected device waits for data to be written to, or read
W
from, its serial register. If the R/ bit is set high, the
•
•
Only one switch from a given multiplexer can be ON at any
given time
W
master reads from the slave device. However, if the R/ bit
is set low, the master writes to the slave device.
When a sequence of successive commands affect the same
element (that is, the switch or GPO pin), only the last
command is executed.
Rev. 0 | Page 17 of 24
ADG791A/ADG791G
SCL
A2
A1
A0 R/W
AX7 AX6 AX5 AX4 AX3 AX2 AX1 AX0
X
X
X
X
X
X
SDA
STOP
CONDITION
BY MASTER
START
CONDITION
BY MASTER
ADDRESS BYTE
RESETB
LDSW
ACKNOWLEDGE
BY SWITCH
ACKNOWLEDGE
BY SWITCH
ACKNOWLEDGE
BY SWITCH
Figure 31. Write Operation
Table 6. ADG791A/ADG791G Command List
AX7
AX6
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
AX5
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
AX4
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
AX3
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
1
1
AX2
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
AX1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
AX0
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
0
1
1
Addressed Switch
0
S1A/D1, S2A/D2, S3A/D3, S4A/D4 off
1
S1A/D1, S2A/D2, S3A/D3, S4A/D4 on
S1B/D1, S2B/D2, S3B/D3, S4B/D4 off
S1B/D1, S2B/D2, S3B/D3, S4B/D4 on
S1A/D1 off
0
1
0
1
S1A/D1 on
0
S1B/D1 off
1
S1B/D1 on
0
S2A/D2 off
1
S2A/D2 on
0
S2B/D2 off
1
S2B/D2 on
0
S3A/D3 off
1
S3A/D3 on
0
S3B/D3 off
1
S3B/D3 on
0
S4A/D4 off
1
S4A/D4 on
0
S4B/D4 off
1
S4B/D4 on
X1
X1
X1
X1
X1
X1
X1
X1
X1
X1
1
Reserved
Reserved
Reserved
Reserved
Mux 1 disabled (all switches connected to D1 are off)
Mux 2 disabled (all switches connected to D2 are off)
Mux 3 disabled (all switches connected to D3 are off)
Mux 4 disabled (all switches connected to D4 are off)
Reserved
Reserved
GPO1 high for ADG791G/reserved for ADG791A
GPO1 low for ADG791G/reserved for ADG791A
All muxes disabled
0
0
1
Reserved
1 X = Logic state does not matter.
Rev. 0 | Page 18 of 24
ADG791A/ADG791G
LDSW BIT
READ OPERATION
The LDSW bit allows the user to control the way the device
executes the commands loaded during the write operations.
The ADG791A/ADG791G executes all the commands loaded
between two successive write operations that have set the
LDSW bit high.
When reading data back from the ADG791A/ADG791G, the
W
user must begin with an address byte and R/ bit. The switch
then acknowledges that it is prepared to transmit data by
pulling SDA low. Following this acknowledgement, the
ADG791A/ADG791G transmits two bytes on the next clock
edges. These bytes contain the status of the switches, and each
byte is followed by an acknowledge bit. A logic high bit
represents a switch in the on (close) state while a low represents
a switch in the off (open) state. For the GPO pin (ADG791G
only), the bit represents the logic value of the pin. Figure 32
illustrates the entire read sequence.
Setting the LDSW high for every write cycle ensures that the
device executes the command right after the LDSW bit was
loaded into the device. This setting can be used when the
desired configuration can be achieved by sending a single
command or when the switches and/or GPO pin are not
required to be updated at the same time. When the desired
configuration requires multiple commands with simultaneous
update, the LDSW bit should be set low while loading the
commands except the last one when the LDSW bit should be set
high. Once the last command with LDSW = high is loaded, the
device executes all commands received since the last update
simultaneously.
The bit maps accompanying Figure 32 show the relationship
between the elements of the ADG791A and ADG791G (that it,
the switches and GPO pins) and the bits that represent their
status after a completed read operation.
POWER ON/SOFTWARE RESET
The ADG791A/ADG791G has a software reset function
implemented by the RESETB bit from the second data byte
written to the device. For normal operation of the multiplexers
and GPO pin, this bit should be set high. When RESETB = low or
after power-up, the switches from all multiplexers are turned off
(open) and the GPO pin is set low.
ADG791A Bit Map
RB15
RB14
RB13
RB12
RB11
RB10
RB9
RB8
RB7
RB6
RB5
RB4
RB3
RB2
RB1
RB0
S1A/D1
S1B/D1
S2A/D2
S2B/D2
S3A/D3
S3B/D3
S4A/D4
S4B/D4
-
-
-
-
-
-
-
-
ADG791G Bit Map
RB15
RB14
RB13
RB12
RB11
RB10
RB9
RB8
RB7
RB6
RB5
RB4
RB3
RB2
RB1
RB0
S1A/D1
S1B/D1
S2A/D2
S2B/D2
S3A/D3
S3B/D3
S4A/D4
S4B/D4
-
-
-
-
GPO1
-
-
-
SCL
SDA
A2
A1
A0 R/W
RB15 RB14 RB13 RB12 RB11 RB10 RB9 RB8
RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0
STOP
CONDITION
BY MASTER
START
CONDITION
BY MASTER
ADDRESS BYTE
ACKNOWLEDGE
BY SWITCH
ACKNOWLEDGE
BY SWITCH
ACKNOWLEDGE
BY SWITCH
Figure 32. ADG791A/ADG791G Read Operation
Rev. 0 | Page 19 of 24
ADG791A/ADG791G
EVALUATION BOARD
The ADG791G evaluation kit allows designers to evaluate the
high performance of the device with a minimum of effort.
USING THE ADG791G EVALUATION BOARD
The ADG791G evaluation kit is a test system designed to
simplify the evaluation of the device. Each input/output of the
part comes with a socket specifically chosen for easy
audio/video evaluation. A data sheet is also available and gives
full information on operating the evaluation board.
The evaluation kit includes a printed circuit board populated
with the ADG791G. The evaluation board can be used to
evaluate the performance of both the ADG791A and
ADG791G. It interfaces to the USB port of a PC, or it can be
used as a standalone evaluation board. Software is available with
the evaluation board that allows the user to easily program the
ADG791G through the USB port. Schematics of the evaluation
board are shown in Figure 33 and Figure 34. The software runs
on any PC that has Microsoft® Windows® 2000 or Windows XP
installed.
Rev. 0 | Page 20 of 24
ADG791A/ADG791G
3 3 0 3 - 0 3 0 6
D
D
D
D
D
D
D
G N
G N
G N
G N
G N
G N
G N
5 6
5 3
4 1
2 8
2 6
1 2
1 0
C
C
C
C
C
C
C
V C
V C
V C
V C
V C
V C
V C
5 5
4 3
3 2
2 7
1 7
1 1
7
C C A V
3
Figure 33. EVAL-ADG791GEB Schematic, USB Controller Section
Rev. 0 | Page 21 of 24
ADG791A/ADG791G
3 4 0 3 - 0 3 0 6
Ω k 1 0
J 8
J 7
J 3
R 8
Ω k 1 0
R 4
Ω k 1 0
R 3
R 1 8
K 1
D
G N
M O T T B O
1
2
E S C A
4
5
P T O
3
E S C A
D _ U A N L O H P O
R 1 7
R 1 6
0
9
8
R 3
R 2
R 2
Ω 0
R 3 5
D _ U A N L O H P O
E
C A S
5
K 2
Ω 0
R 3
P
T O
E
C A S
3
2
4
4
D
G N
M O T T B O
1 8
1 7
1 6
1 5
1 4
1 3
1
1
2
3
4
5
6
M O T T B O
D
G N
2
1
E S C A
4
5
P T O
3
K 9
E S C A
R 1 5
R 1 4
D _ U A N L O H P O
D _ U A N L O H P O
E
C A S
5
P
T O
E
C A S
3
2
4
M O T T B O
K 3
7
6
R 2
R 2
D
G N
1
D
G N
K 8
1
M O T T B O
2
E S C A
4
5
P T O
3
E S C A
D _ U A N L O H P O
D _ U A N L O H P O
R 1 3
E
C A S
5
P
T O
E
C A S
3
2
4
M O T T B O
5
R 2
D
G N
1
K 7
Figure 34. EVAL-ADG791GEB Schematic, Chip Section
Rev. 0 | Page 22 of 24
ADG791A/ADG791G
OUTLINE DIMENSIONS
0.60 MAX
4.00
BSC SQ
0.60 MAX
PIN 1
INDICATOR
1
24
19
18
0.50
BSC
PIN 1
INDICATOR
*
2.45
2.30 SQ
2.15
TOP
3.75
EXPOSED
VIEW
BSC SQ
PA D
(BOTTOMVIEW)
0.50
0.40
0.30
6
13
12
7
0.23 MIN
2.50 REF
0.80 MAX
0.65 TYP
1.00
0.85
0.80
12° MAX
0.05 MAX
0.02 NOM
0.30
0.23
0.18
COPLANARITY
0.08
0.20 REF
SEATING
PLANE
*
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-2
EXCEPT FOR EXPOSED PAD DIMENSION
Figure 35. 24-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm x 4 mm Body, Very Thin Quad
(CP-24-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
I2C Speed
Package Description
24-Lead LFCSP_VQ
24-Lead LFCSP_VQ
Package Option
CP-24-2
CP-24-2
CP-24-2
CP-24-2
ADG791ABCPZ-REEL1
ADG791ABCPZ-500RL71
ADG791ACCPZ-REEL1
ADG791ACCPZ-500RL71
ADG791GBCPZ-REEL1
ADG791GBCPZ-500RL71
ADG791GCCPZ-REEL1
ADG791GCCPZ-500RL71
EVAL-ADG791GEB2
100 kHz, 400 kHz
100 kHz, 400 kHz
100 kHz, 400 kHz, 3.4 MHz 24-Lead LFCSP_VQ
100 kHz, 400 kHz, 3.4 MHz 24-Lead LFCSP_VQ
100 kHz, 400 kHz
100 kHz, 400 kHz
100 kHz, 400 kHz, 3.4 MHz 24-Lead LFCSP_VQ
100 kHz, 400 kHz, 3.4 MHz 24-Lead LFCSP_VQ
Evaluation Board
24-Lead LFCSP_VQ
24-Lead LFCSP_VQ
CP-24-2
CP-24-2
CP-24-2
CP-24-2
1 Z = Pb-free part.
2 Evaluation board is RoHS compliant.
Rev. 0 | Page 23 of 24
ADG791A/ADG791G
NOTES
Purchase of licensed I2C components of Analog Devices or one of its sublicensed Associated Companies conveys a license for the purchaser under the Philips I2C Patent
Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips.
©2006 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D06033-0-7/06(0)
Rev. 0 | Page 24 of 24
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