ADG902BCP-REEL7_技术文档

Wideband, 40 dB Isolation at 1 GHz, CMOS

1.65 V to 2.75 V, SPST Switches

ADG901/ADG902

FUNCTIONAL BLOCK DIAGRAMS

ADG901

FEATURES

Wideband Switch: –3 dB @ 4.5 GHz

Absorptive/Reflective Switches

High Off Isolation (40 dB @ 1 GHz)

Low Insertion Loss (0.8 dB @1 GHz)

Single 1.65 V to 2.75 V Power Supply

CMOS/LVTTL Control Logic

RF1

RF2

50ꢀ

8-Lead MSOP and Tiny 3 mm ꢁ 3 mm LFCSP Packages

Low Power Consumption (<1 ꢂA)

CTRL

RF1

APPLICATIONS

ADG902

Wireless Communications

General-Purpose RF Switching

Dual-Band Applications

High Speed Filter Selection

Digital Transceiver Front End Switch

IF Switching

RF2

CTRL

Tuner Modules

Antenna Diversity Switching

GENERAL DESCRIPTION

LVTTL compatible. The low power consumption of these

CMOS devices makes them ideally suited to wireless applica-

tions and general-purpose high frequency switching.

The ADG901/ADG902 are wideband switches that use a

CMOS process to provide high isolation and low insertion loss to

1 GHz. The ADG901 is an absorptive (matched) switch with

50 Ω terminated shunt legs, while the ADG902 is a reflective

switch. These devices are designed such that the isolation is

high over the dc to 1 GHz frequency range. They have on-board

CMOS control logic, thus eliminating the need for external

controlling circuitry. The control inputs are both CMOS and

PRODUCT HIGHLIGHTS

1. –40 dB Off Isolation @ 1 GHz

2. 0.8 dB Insertion Loss @ 1 GHz

3. Tiny 8-Lead MSOP/LFCSP Packages

0

–0.4

–0.6

–0.8

–1.0

–1.2

–1.4

–1.6

–1.8

–2.0

–2.2

–2.4

–2.6

T

= 25ꢃC

A

–10

–20

–30

–40

–50

–60

–70

–80

V

= 2.5 V

DD

V

T

= 2.5V

= 25ꢃC

DD

A

–90

–2.8

V

= 1.8 V

DD

–100

–3.0

10k

100k

1M

10M

100M

1G

10G

100k

1M

10M

100M

1G

10G

FREQUENCY (Hz)

Figure 2. Insertion Loss vs. Frequency

Figure 1. Off Isolation vs. Frequency

REV. A

Information furnished by Analog Devices is believed to be accurate and

reliable. However, no responsibility is assumed by Analog Devices for its

use, norforanyinfringementsofpatentsorotherrightsofthirdpartiesthat

may result from its use. No license is granted by implication or otherwise

under any patent or patent rights of Analog Devices. Trademarks and

registered trademarks are the property of their respective owners.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.

Tel: 781/329-4700

Fax: 781/326-8703

www.analog.com

(V_DD= 1.65 V to 2.75 V, GND = 0 V, input power = 0 dBm,

ADG901/ADG902–SPECIFICATIONS¹^{all specifications T}_MINto T_MAX, unless otherwise noted.)

B Version

Parameter

Symbol Conditions

Min

Typ²

Max

Unit

AC ELECTRICAL CHARACTERISTICS

Operating Frequency³

–3 dB Frequency⁴

DC

2.5

4.5

7

GHz

dBm

dB

Input Power⁴

0 V dc Bias

+0.5 V dc Bias

DC to 100 MHz; V_DD= 2.5 V 10%

500 MHz; V_DD= 2.5 V 10%

1000 MHz; V_DD= 2.5 V 10%

100 MHz

500 MHz

1000 MHz

100 MHz

500 MHz

1000 MHz

DC to 100 MHz

500 MHz

1000 MHz

DC to 100 MHz

500 MHz

16

Insertion Loss

S₂₁, S₁₂

S₁₁, S₂₂

0.4

0.5

0.8

61

45

40

60

47

37

28

29

28

23

21

19

3.6

5.8

3.1

6.0

17

36

2.5

0.7

0.8

1.25

Isolation—RF1 to RF2

(CP Package)

60

43

34

51

37.5

31

20

23

25

18

17

15

Isolation—RF1 to RF2

(RM Package)

Return Loss (On Channel)⁴

Return Loss (Off Channel)⁴

1000 MHz

On Switching Time⁴

Off Switching Time⁴

Rise Time⁴

t_ON

t_OFF

t_RISE

t_FALL

P_{–1 dB}

50% CTRL to 90% RF

50% CTRL to 10% RF

10% to 90% RF

90% to 10% RF

1000 MHz

6

ns

dBm

mV p-p

9.5

5.5

8.5

Fall Time⁴

1 dB Compression⁴

Third Order Intermodulation Intercept IP₃

900 MHz/901 MHz, 4 dBm

30

Video Feedthrough⁵

DC ELECTRICAL CHARACTERISTICS

Input High Voltage

Input Low Voltage

Input Leakage Current

V_INH

V_DD= 2.25 V to 2.75 V

V_DD= 1.65 V to 1.95 V

V_DD= 2.25 V to 2.75 V

V_DD= 1.65 V to 1.95 V

0 ≤ V_IN≤ 2.75 V

1.7

0.65 V_CC

V

V_INH

V_INL

I_I

0.7

0.35 V_CC

1

0.1

µA

CAPACITANCE⁴

RF1/RF2, RF Port On Capacitance

CTRL Input Capacitance

C_RFON f = 1 MHz

1.2

2.1

pF

C_CTRL

f = 1 MHz

POWER REQUIREMENTS

V_DD

Quiescent Power Supply Current

1.65

2.75

1

V

µA

I_DD

Digital inputs = 0 V or V_DD

0.1

NOTES

¹Temperature range B Version: –40°C to +85°C.

²Typical values are at V_DD= 2.5 V and 25°C, unless otherwise stated.

³Point at which insertion loss degrades by 1 dB.

⁴Guaranteed by design, not subject to production test.

⁵The dc transience at the output of any port of the switch when the control voltage is switched from high to low or low to high in a 50 Ω test setup, measured with

1 ns rise time pulses and 500 MHz bandwidth.

Specifications subject to change without notice.

–2–

REV. A

ADG901/ADG902

ABSOLUTE MAXIMUM RATINGS¹

LFCSP Package

(T_A= 25°C, unless otherwise noted.)

␪

_JAThermal Impedance (2-layer board) . . . . . . . . . . 84°C/W

V_DDto GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4 V

Inputs to GND . . . . . . . . . . . . . . . . . . –0.5 V to V_DD+ 0.3 V²

Continuous Current . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 mA

Input Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 dBm

Operating Temperature Range

Industrial (B Version) . . . . . . . . . . . . . . . . –40°C to +85°C

Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C

MSOP Package

_JAThermal Impedance (4-layer board) . . . . . . . . . . 48°C/W

Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . . 300°C

IR Reflow, Peak Temperature (<20 sec) . . . . . . . . . . . . 235°C

ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 kV

NOTES

¹Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only and functional operation of

the device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability. Only one absolute

maximum rating may be applied at any one time.

␪

_JAThermal Impedance . . . . . . . . . . . . . . . . . . . . . 206°C/W

²RF1/2 Off Port Inputs to Ground ................................... –0.5 V to V_DD– 0.5 V

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

Branding

ADG901BRM

–40°C to +85°C

Mini Small Outline Package (MSOP)

Lead Frame Chip Scale Package (LFCSP)

Mini Small Outline Package (MSOP)

Lead Frame Chip Scale Package (LFCSP)

Evaluation Board

RM-8

CP-8

RM-8

CP-8

W6B

W7B

ADG901BRM-500RL7 –40°C to +85°C

ADG901BRM-REEL7 –40°C to +85°C

ADG901BCP-500RL7 –40°C to +85°C

ADG901BCP-REEL7

ADG902BRM

ADG902BRM-500RL7 –40°C to +85°C

ADG902BRM-REEL7 –40°C to +85°C

ADG902BCP-500RL7 –40°C to +85°C

ADG902BCP-REEL7

EVAL-ADG901EB

EVAL-ADG902EB

–40°C to +85°C

Evaluation Board

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although the

ADG901/ADG902 features proprietary ESD protection circuitry, permanent damage may occur on

devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are

recommended to avoid performance degradation or loss of functionality.

PIN CONFIGURATION

8-Lead MSOP (RM-8)

8-Lead 3 mm ꢁ 3 mm LFCSP (CP-8)

PIN FUNCTION DESCRIPTIONS

Pin No. Mnemonic Function

1

V_DD

Power Supply Input. These parts can

be operated from 1.65 V to 2.75 V;

V_DDshould be decoupled to GND.

1

2

3

4

8

7

6

5

RF2

GND

V

DD

ADG901/

ADG902

TOP VIEW

CTRL

GND

2

CTRL

CMOS or TTL Logic Level.

0

1

➞

RF1 Isolated from RF2

RF1 to RF2

(Not to Scale)

RF1

3, 5, 6, 7 GND

Ground Reference Point for All

Circuitry on the Part.

4

8

RF1

RF2

RF1 Port.

RF2 Port.

Table I. Truth Table

Signal Path

CTRL

0

1

RF1 isolated from RF2

RF1 to RF2

REV. A

–3–

ADG901/ADG902

TERMINOLOGY

Parameter

Description

V_DD

Most positive power supply potential.

Positive supply current.

I_DD

GND

CTRL

V_INL

V_INH

Ground (0 V) reference.

Logic control input.

Maximum input voltage for Logic 0.

Minimum input voltage for Logic 1.

Input current of the digital input.

Digital input capacitance.

I_INL(I_INH

C_IN

)

t_ON

Delay between applying the digital control input and the output switching on.

Delay between applying the digital control input and the output switching off.

Rise time. Time for the RF signal to rise from 10% to 90% of the ON level.

Fall time. Time for the RF signal to fall from 90% to 10% of the ON level.

t_OFF

t_RISE

t_FALL

Off Isolation

Insertion Loss

P_{–1 dB}

The attenuation between input and output ports of the switch when the switch control voltage is in the

OFF condition.

The attenuation between input and output ports of the switch when the switch control voltage is in the

ON condition.

1 dB compression point. The RF input power level at which the switch insertion loss increases by 1 dB over its

low level value. It is a measure of how much power the ON switch can handle before the insertion loss increases

by 1 dB.

IP₃

Third order intermodulation intercept. This is a measure of the power in false tones that occur when closely spaced

tones are passed through a switch, whereby the nonlinearity of the switch causes these false tones to be generated.

Return Loss

The amount of reflected power relative to the incident power at a port. Large return loss indicates good matching.

By measuring Return Loss the VSWR can be calculated from conversion charts. VSWR (voltage standing wave ratio)

indicates degree of matching present at a switch RF port.

Video Feedthrough Spurious signals present at the RF ports of the switch when the control voltage is switched from high to low

or low to high without an RF signal present.

–4–

REV. A

Typical Performance Characteristics–ADG901/ADG902

–0.40

–0.45

–0.50

–0.55

–0.60

–0.65

–0.70

–0.75

–0.80

–0.85

–0.90

–0.95

–1.00

–0.4

–0.6

–0.8

–1.0

–1.2

–1.4

–1.6

–1.8

–2.0

–2.2

–2.4

–2.6

–2.8

–3.0

–0.6

–0.8

–1.0

V

= 2.5V

DD

V

= 1.95V

DD

V

= 1.8V

V

= 2.25V

DD

V

= 2.25V

DD

–1.2

–1.4

–1.6

–1.8

–2.0

V

= 2.5V

DD

V

= 2.75V

DD

V

= 2.75V

V

= 1.65V

DD

–2.2

–2.4

–2.6

–2.8

–3.0

T

= 25ꢃC

T

A

= 25ꢃC

T

A

= 25ꢃC

A

10k

100k

1M

10M 100M

1G

10G

10k

100k

1M

10M 100M

1G

10G

10k

100k

1M

10M 100M

1G

10G

FREQUENCY (Hz)

TPC 1. Insertion Loss vs. Frequency

over Supplies (S12 and S21)

TPC 2. Insertion Loss vs. Frequency

over Supplies (S12 and S21)

(Zoomed TPC 1 Plot)

TPC 3. Insertion Loss vs. Frequency

over Supplies (S12 and S21)

0

–0.4

V

= 2.5V

–5

–10

–15

–20

–25

–30

–35

–40

–45

–50

–55

–60

–65

–70

–75

–80

–85

–90

DD

–5

–10

–15

–20

–25

–30

–35

–40

–45

–50

–55

T = 25ꢃC

A

–40ꢃC

–0.6

+25ꢃC

–0.8

–1.0

–1.2

–1.4

–1.6

–1.8

–2.0

–2.2

–2.4

–2.6

–2.8

–3.0

+85ꢃC

+25ꢃC

V

= 2.5V

DD

–60

–65

–70

–75

–80

–85

V

= 1.8V

V

= 2.5V

DD

–90

DD

–40ꢃC

100M 1G

–95

–100

10k 100k

1M

10M

10G

10k 100k

1M

10M

100M 1G

10G

10k 100k

1M

10M

100M 1G

10G

FREQUENCY (Hz)

TPC 4. Insertion Loss vs. Frequency

over Temperature (S12 and S21)

TPC 6. OFF Isolation vs. Frequency

over Temperature (S12 and S21)

TPC 5. OFF Isolation vs. Frequency

over Supplies (S12 and S21)

0

T

V

= 25ꢃC

A

= 2.5V

–5

DD

CH1

–10

–15

–20

–25

CTRL

RFx

OFF SWITCH

CH2

–30

–35

ON SWITCH

CH1 = CTRL = 1V/DIV

CH2 = RFx = 100mV/DIV

t

= 2.8ns

= 5.1ns

CH2 pk-pk

2.016mV

RISE

FALL

10k 100k

1M

10M

100M 1G

10G

FREQUENCY (Hz)

CH1 500mV CH2 1mV 10.0ns

TPC 8. Switch Timing

TPC 7. Return Loss vs. Frequency

(S11)

TPC 9. Video Feedthrough

REV. A

–5–

ADG901/ADG902

40

20

18

16

14

35

30

25

20

15

10

12

10

8

6

4

5

0

V

T

= 2.5V

V

T

= 2.5V

DD

= 25ꢃC

DD

= 25ꢃC

2

A

0

250

350

450

550

650

750

850

0

250

500

750

1000 1250 1500

FREQUENCY (MHz)

TPC 10. IP₃vs. Frequency

TPC 11. P_–1dBvs. Frequency

–6–

REV. A

ADG901/ADG902

Test Circuits*

V

DD

0.1ꢂF

V

DD

0.1ꢂF

V

OUT

R

L

V

50ꢀ

DD

ADG901

V

DD

V

RF1

50ꢀ

RF2

OUT

RF1

RF2

50%

V

S

V

CTRL

50ꢀ

R

50ꢀ

L

V

S

CTRL

50ꢀ

10%

90%

NETWORK

ANALYZER

V

OUT

CTRL

GND

V

OUT

V

= 20 LOG

INSERTION LOSS

CTRL

t_ON

t_OFF

V

S

Test Circuit 1. Switching Timing: t_ON, t_OFF

Test Circuit 4. Insertion Loss

V

DD

0.1ꢂF

V

DD

0.1ꢂF

V

DD

ADG901

V

DD

NC

OSCILLOSCOPE

V

OUT

RF1

RF2

RF1

50%

V

CTRL

R

L

50ꢀ

V

S

90%

CTRL

50ꢀ

10%

V

OUT

CTRL

GND

V

CTRL

t_RISE

t_FALL

Test Circuit 2. Switch Timing: t_RISE, t_FALL

Test Circuit 5. Video Feedthrough

V

DD

0.1ꢂF

V

OUT

R

L

V

50ꢀ

DD

ADG901

RF1

50ꢀ

RF2

V

S

50ꢀ

NETWORK

ANALYZER

CTRL

GND

V

OUT

V

OFF ISOLATION = 20 LOG

CTRL

V

S

Test Circuit 3. Off Isolation

*Similiar setups for ADG902.

REV. A

–7–

ADG901/ADG902

V

DD

0.1ꢂF

RF

SOURCE

V

DD

ADG901

RF

SOURCE

SPECTRUM

ANALYZER

SPECTRUM

ANALYZER

COMBINER

RF1

RF2

RF1

V

S

50ꢀ

RF

SOURCE

CTRL

GND

V

CTRL

Test Circuit 7. P_–1dB

Test Circuit 6. IP₃

–8–

REV. A

ADG901/ADG902

APPLICATIONS

ADG9xx EVALUATION BOARD

The ADG901/ADG902 are ideal solutions for low power, high

frequency applications. The low insertion loss, high isolation

between ports, low distortion, and low current consumption of

these parts make them excellent solutions for many high frequency

switching applications.

The ADG9xx evaluation board allows designers to evaluate the

high performance wideband switches with a minimum of effort.

To prove that these devices meet user requirements, the user

requires only a power supply and a network analyzer along with

the evaluation board. An application note is available with the

evaluation board and provides complete information on operating

the evaluation board.

Applications include switching between high frequency filters,

ASK generator, and FSK generator.

Absorptive vs. Reflective Switches

The RF1 port (see Figure 3) is connected through a 50 Ω trans-

mission line to the top left SMA connector J1. RF2 is connected

through a 50 Ω transmission line to the top SMA connector J2.

J3 is connected to GND. A through transmission line connects

J4 and J5 and this transmission line is used to estimate the loss

of the PCB over the environmental conditions being evaluated.

The ADG901 is an absorptive (matched) switch with 50 Ω termi-

nated shunt legs, and the ADG902 is a reflective switch with 0 Ω

terminated shunts to ground. The ADG901 absorptive switch

has a good VSWR on each port, regardless of the switch mode.

An absorptive switch should be used when there is a need for a

good VSWR that is looking into the port but not passing the

through signal to the common port. The ADG901 is therefore

ideal for applications that require minimum reflections back to

the RF source. It also ensures that the maximum power is trans-

ferred to the load.

The board is constructed of a 4-layer, FR4 material with a dielec-

tric constant of 4.3 and an overall thickness of 0.062 inches. Two

ground layers with grounded planes provide ground for the RF

transmission lines. The transmission lines were designed using a

coplanar waveguide with ground plane model using a trace width

of 0.052 inches, clearance to ground plane of 0.030 inches,

dielectric thickness of 0.029 inches, and a metal thickness of

0.014 inches.

The ADG902 reflective switch is suitable for applications where

high off port VSWR does not matter and the switch has some

other desired performance feature. It can be used in many appli-

cations, including high speed filter selection. In most cases, an

absorptive switch can be used instead of a reflective switch, but

not vice versa.

Figure 3. ADG9xx Evaluation Board Top View

REV. A

–9–

ADG901/ADG902

OUTLINE DIMENSIONS

8-Lead Mini Small Outline Package [MSOP]

(RM-8)

Dimensions shown in millimeters

3.00

BSC

8

5

4

4.90

BSC

3.00

BSC

1

PIN 1

0.65 BSC

1.10 MAX

0.15

0.00

0.80

0.60

0.40

8ꢃ

0ꢃ

0.38

0.22

0.23

0.08

SEATING

PLANE

COPLANARITY

0.10

COMPLIANT TO JEDEC STANDARDS MO-187AA

8-Lead Lead Frame Chip Scale Package [LFCSP]

3 mm ꢁ 3 mm Body

(CP-8)

Dimensions shown in millimeters

0.50

0.40

0.30

3.00

BSC SQ

0.60 MAX

8

PIN 1 INDICATOR

0.45

1

PIN 1

INDICATOR

1.90

1.75

1.60

2.75

BSC SQ

1.50

REF

TOP

VIEW

BOTTOM

VIEW

0.50

BSC

4

5

0.25

MIN

1.60

1.45

1.30

0.80 MAX

0.65TYP

0.90

0.85

0.80

12ꢃ MAX

0.05 MAX

0.02 NOM

SEATING

PLANE

0.30

0.23

0.18

0.20 REF

–10–

REV. A

ADG901/ADG902

Revision History

Location

Page

10/04—Data Sheet changed from REV. 0 to REV. A.

Changes to FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Changes to PRODUCT HIGHLIGHTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Changes to SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Changes to ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Change to ADG9xx EVALUATION BOARD section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Updated OUTLINE DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

REV. A

–11–

–12–


型号：	ADG902BCP-REEL7
厂家：	ADI
描述：	Wideband, 40 dB Isolation at 1 GHz, CMOS 1.65 V to 2.75 V, SPST Switches 宽带40 dB的隔离在1 GHz ， CMOS 1.65 V至2.75 V，单刀单掷开关开关
文件：	总12页 (文件大小：1083K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

ADG902BCP-REEL7 [ADI]

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