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ADM241LAR-REEL [ADI]

IC QUAD LINE TRANSCEIVER, PDSO28, MS-013AE, SOIC-28, Line Driver or Receiver;
ADM241LAR-REEL
型号： ADM241LAR-REEL
厂家： ADI    ADI
描述：

IC QUAD LINE TRANSCEIVER, PDSO28, MS-013AE, SOIC-28, Line Driver or Receiver

驱动 光电二极管 接口集成电路 驱动器
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5 V Powered  
CMOS RS-232 Drivers/Receivers  
a
ADM223/ADM230L–ADM241L  
ADM232L TYPICAL OPERATING CIRCUIT  
FEATURES  
Single 5 V Power Supply  
5V INPUT  
Meets All EIA-232-E and V.28 Specifications  
120 kB/s Data Rate  
On-Board DC-DC Converters  
؎9 V Output Swing with 5 V Supply  
Small 1 ␮F Capacitors  
Low Power Shutdown ≤1 ␮A  
Receivers Active in Shutdown (ADM223)  
؎30 V Receiver Input Levels  
Latch-Up FREE  
Plug-In Upgrade for MAX223/230-241  
Plug-In Upgrade for AD230–AD241  
V
C1+  
C1–  
CC  
+5V TO +10V  
VOLTAGE  
DOUBLER  
1␮F  
6.3V  
1␮F  
6.3V  
1␮F  
6.3V  
V+  
V–  
C2+  
C2–  
+10V TO –10V  
VOLTAGE  
INVERTER  
1␮F  
16V  
1␮F  
16V  
T1  
T1  
T1  
T2  
R1  
R2  
IN  
OUT  
TTL/CMOS  
INPUTS*  
RS-232  
OUTPUTS  
T2  
T2  
IN  
OUT  
R1  
R1  
OUT  
IN  
IN  
TTL/CMOS  
OUTPUTS  
RS-232  
INPUTS**  
APPLICATIONS  
Computers  
Peripherals  
Modems  
R2  
R2  
OUT  
GND  
ADM232L  
Printers  
Instruments  
* INTERNAL 400k⍀ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT.  
** INTERNAL 5k⍀ PULL-DOWN RESISTOR ON EACH RS-232 INPUT.  
GENERAL DESCRIPTION  
All members of the ADM230L family, except the ADM231L  
and the ADM239L, include two internal charge pump voltage  
converters that allow operation from a single 5 V supply. These  
converters convert the 5 V input power to the 10 V required  
for RS-232 output levels. The ADM231L and ADM239L are  
designed to operate from 5 V and 12 V supplies. An internal  
+12 V to –12 V charge pump voltage converter generates the  
–12 V supply.  
The ADM2xx family of line drivers/receivers is intended for all  
EIA-232-E and V.28 communications interfaces, especially in  
applications where 12 V is not available. The ADM223,  
ADM230L, ADM235L, ADM236L and ADM241L feature a  
low power shutdown mode that reduces power dissipation to  
less than 5 µW, making them ideally suited for battery powered  
equipment. Two receivers remain enabled during shutdown on  
the ADM223. The ADM233L and ADM235L do not require  
any external components and are particularly useful in applica-  
tions where printed circuit board space is critical.  
The ADM2xxL is an enhanced upgrade for the AD2xx family  
featuring lower power consumption, faster slew rate and opera-  
tion with smaller (1 µF) capacitors.  
Table I. Selection Table  
No. of  
RS-232  
Drivers  
No. of  
Low Power  
Shutdown  
(SD)  
TTL  
Part  
Number  
Power  
Supply Voltage  
RS-232  
External  
Three-State No. of  
Receivers Capacitors  
EN  
Pins  
ADM223  
5 V  
4
5
2
2
2
4
5
4
5
4
3
4
5
0
2
2
2
0
5
3
3
4
5
5
4
Yes (SD)  
Yes  
No  
Yes (EN)  
No  
No  
No  
No  
No  
Yes  
Yes  
No  
28  
20  
14  
16  
20  
16  
24  
24  
24  
24  
24  
28  
ADM230L 5 V  
4
ADM231L 5 V and 7.5 V to 13.2 V  
ADM232L 5 V  
ADM233L 5 V  
ADM234L 5 V  
ADM235L 5 V  
ADM236L 5 V  
ADM237L 5 V  
ADM238L 5 V  
2
4
No  
None  
4
None  
4
4
4
2
4
No  
No  
Yes  
Yes  
No  
No  
No  
Yes  
No  
Yes  
Yes  
ADM239L 5 V and 7.5 V to 13.2 V  
ADM241L 5 V  
REV. A  
Information furnished by Analog Devices is believed to be accurate and  
reliable. However, no responsibility is assumed by Analog Devices for its  
use, nor for any infringements of patents or other rights of third parties  
which may result from its use. No license is granted by implication or  
otherwise under any patent or patent rights of Analog Devices.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781/329-4700  
Fax: 781/326-8703  
World Wide Web Site: http://www.analog.com  
© Analog Devices, Inc., 2001  
ADM223/ADM230L–ADM241L–SPECIFICATIONS VCC = 5 V ؎ 10% (ADM223, ADM31L,  
ADM32L, ADM34L, ADM36L, ADM38L, ADM39L, ADM41L); VCC = 5 V ؎ 5% (ADM230L, ADM233L, ADM235L, ADM237L); V+ = 7.5 V to 13.2 V  
(ADM231L and ADM239L); C1–C4 = 1.0 ␮F Ceramic. All Specifications TMIN to TMAX unless otherwise noted.)  
Parameter  
Min Typ Max Unit Test Conditions/Comments  
Output Voltage Swing  
5
9
2.5  
3.5  
1.5  
1
Volts All Transmitter Outputs Loaded with 3 kΩ to Ground  
VCC Power Supply Current  
6.0  
13  
4
10  
0.8  
mA  
mA  
mA  
µA  
V
No Load, All TINS = VCC (Except ADM223)  
No Load, All TINS = GND  
V+ Power Supply Current  
Shutdown Supply Current  
No Load, V+ = 12 V ADM231L and ADM239L Only  
Input Logic Threshold Low, VINL  
Input Logic Threshold High, VINH  
Logic Pull-Up Current  
TIN, EN, SD, EN, SD  
TIN, EN, SD, EN, SD  
TIN = 0 V  
2.4  
V
12  
25  
+30  
µA  
RS-232 Input Voltage Range1  
RS-232 Input Threshold Low  
RS-232 Input Threshold High  
RS-232 Input Hysteresis  
–30  
0.8  
V
1.2  
1.6  
0.25  
5
V
2.4  
V
V
kΩ  
V
RS-232 Input Resistance  
3
7
0.4  
TA = 0°C to 85°C  
TTL/CMOS Output Voltage Low, VOL  
TTL/CMOS Output Voltage High, VOH  
TTL/CMOS Output Leakage Current  
3.5  
V
IOUT = –1.0 mA  
EN = VCC, 0 V ≤ ROUT ≤ VCC  
ADM223, ADM235L, ADM236L, ADM239L, ADM241L  
(Figure 25. CL = 150 pF)  
0.05  
250  
10 µA  
Output Enable Time (TEN  
)
ns  
Output Disable Time (TDIS  
Propagation Delay  
)
50  
ns  
ADM223, ADM235L, ADM236L, ADM239L, ADM241L  
(Figure 25. RL = 1 kΩ)  
0.3  
8
µs  
RS-232 to TTL  
Transition Region Slew Rate  
V/µs RL = 3 kΩ, CL = 2500 pF  
Measured from +3 V to –3 V or –3 V to +3 V  
VCC = V+ = V– = 0 V, VOUT = 2 V  
Output Resistance  
RS-232 Output Short Circuit Current  
300  
Ω
mA  
10  
NOTES  
1Guaranteed by design.  
Specifications subject to change without notice.  
ABSOLUTE MAXIMUM RATINGS*  
(TA = 25°C unless otherwise noted)  
Thermal Impedance, θJA  
N-14 DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140°C/W  
N-16 DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135°C/W  
N-20 DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125°C/W  
N-24 DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120°C/W  
N-24A DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110°C/W  
R-16 SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105°C/W  
R-20 SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105°C/W  
R-24 SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85°C/W  
R-28 SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W  
RS-28 SSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100°C/W  
Q-14 Cerdip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105°C/W  
Q-16 Cerdip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100°C/W  
Q-20 Cerdip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100°C/W  
Q-24 Cerdip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55°C/W  
D-24 Ceramic . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50°C/W  
Operating Temperature Range  
VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6 V  
V+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . (VCC – 0.3 V) to +14 V  
V– . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –14 V  
Input Voltages  
TIN . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to (VCC + 0.3 V)  
RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 V  
Output Voltages  
TOUT . . . . . . . . . . . . . . . . . . (V+, + 0.3 V) to (V–, – 0.3 V)  
ROUT . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to (VCC + 0.3 V)  
Short Circuit Duration  
TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous  
Power Dissipation  
N-14 DIP (Derate 10 mW/°C above 70°C) . . . . . . 800 mW  
N-16 DIP (Derate 10.5 mW/°C above 70°C) . . . . . 840 mW  
N-20 DIP (Derate 11 mW/°C above 70°C) . . . . . . 890 mW  
N-24 DIP (Derate 13.5 mW/°C above 70°C) . . . . 1000 mW  
N-24A DIP (Derate 13.5 mW/°C above 70°C) . . . 500 mW  
R-16 SOIC (Derate 9 mW/°C above 70°C) . . . . . . 760 mW  
R-20 SOIC (Derate 9.5 mW/°C above 70°C) . . . . 800 mW  
R-24 SOIC (Derate 12 mW/°C above 70°C) . . . . . 850 mW  
R-28 SOIC (Derate 12.5 mW/°C above 70°C) . . . 900 mW  
RS-28 SSOP (Derate 10 mW/°C above 70°C) . . . . 900 mW  
Q-14 Cerdip (Derate 10 mW/°C above 70°C) . . . . 720 mW  
Q-16 Cerdip (Derate 10 mW/°C above 70°C) . . . . 800 mW  
Q-20 Cerdip (Derate 11.2 mW/°C above 70°C) . . . . 890 mW  
Q-24 Cerdip (Derate 12.5 mW/°C above 70°C) . . . 1000 mW  
D-24 Ceramic (Derate 20 mW/°C above 70°C) . . 1000 mW  
Commercial (J Version) . . . . . . . . . . . . . . . . . . . . 0 to 70°C  
Industrial (A Version) . . . . . . . . . . . . . . . –40°C to +85°C  
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C  
Lead Temperature, Soldering . . . . . . . . . . . . . . . . . . . 300°C  
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215°C  
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C  
*This is a stress rating only; functional operation of the device at these or any other  
conditions above those indicated in the operational sections of this specification is  
not implied. Exposure to absolute maximum rating conditions for extended  
periods of time may affect reliability.  
–2–  
REV. A  
ADM223/ADM230L–ADM241L  
ORDERING GUIDE  
Temperature  
Range  
Package  
Option*  
Temperature  
Range  
Package  
Option*  
Temperature  
Range  
Package  
Option*  
Model  
Model  
Model  
ADM223  
ADM223AR  
ADM223ARS –40°C to +85°C  
ADM230L  
ADM230LJN  
ADM230LJR  
ADM230LAN –40°C to +85°C  
ADM230LAR  
ADM230LAQ –40°C to +85°C  
ADM231L  
ADM231LJN  
ADM231LJR  
ADM231LAN –40°C to +85°C N-14  
ADM231LAR –40°C to +85°C R-16  
ADM231LAQ –40°C to +85°C Q-14  
–40°C to +85°C  
R-28  
RS-28  
0°C to 70°C  
0°C to 70°C  
N-20  
R-20  
N-20  
R-20  
Q-20  
0°C to 70°C  
0°C to 70°C  
N-14  
R-16  
–40°C to +85°C  
ADM232L  
ADM233L  
ADM234L  
ADM232LJN 0°C to 70°C  
N-16  
R-16  
N-16  
R-16  
Q-16  
ADM233LJN  
ADM233LAN –40°C to +85°C  
0°C to 70°C  
N-20  
N-20  
ADM234LJN  
ADM234LJR  
ADM234LAN –40°C to +85°C N-16  
ADM234LAR –40°C to +85°C R-16  
ADM234LAQ –40°C to +85°C Q-16  
0°C to 70°C  
0°C to 70°C  
N-16  
R-16  
ADM232LJR  
0°C to 70°C  
ADM232LAN –40°C to +85°C  
ADM232LAR –40°C to +85°C  
ADM232LAQ –40°C to +85°C  
ADM235L  
ADM236L  
ADM236LJN  
ADM236LJR  
ADM236LAN –40°C to +85°C  
ADM236LAR  
ADM237L  
ADM237LJN  
ADM237LJR  
ADM237LAN –40°C to +85°C N-24  
ADM237LAR –40°C to +85°C R-24  
ADM237LAQ –40°C to +85°C Q-24  
ADM235LJN 0°C to 70°C  
ADM235LAN –40°C to +85°C  
ADM235LAQ –40°C to +85°C  
N-24A  
N-24A  
D-24  
0°C to 70°C  
0°C to 70°C  
N-24  
R-24  
N-24  
R-24  
Q-24  
0°C to 70°C  
0°C to 70°C  
N-24  
R-24  
–40°C to +85°C  
ADM236LAQ –40°C to +85°C  
ADM238L  
ADM238LJN 0°C to 70°C  
ADM238LJR  
ADM238LAN –40°C to +85°C  
ADM238LAR –40°C to +85°C  
ADM238LAQ –40°C to +85°C  
ADM239L  
ADM239LJN  
ADM239LJR  
ADM239LAN –40°C to +85°C  
ADM239LAR  
ADM239LAQ –40°C to +85°C  
ADM241L  
N-24  
R-24  
N-24  
R-24  
Q-24  
0°C to 70°C  
0°C to 70°C  
N-24  
R-24  
N-24  
R-24  
Q-24  
ADM241LJR  
ADM241LAR –40°C to +85°C R-28  
ADM241LJRS 0°C to 70°C RS-28  
ADM241LARS –40°C to +85°C RS-28  
0°C to 70°C  
R-28  
0°C to 70°C  
–40°C to +85°C  
*D = Ceramic DIP; N = Plastic DIP; Q = Cerdip; R = Small Outline IC (SOIC); RS = Small Shrink Outline Package (SSOP).  
CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily  
accumulate on the human body and test equipment and can discharge without detection. Although  
the ADM223/ADM230L–ADM241L features proprietary ESD protection circuitry, permanent  
damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper  
ESD precautions are recommended to avoid performance degradation or loss of functionality.  
WARNING!  
ESD SENSITIVE DEVICE  
REV. A  
–3–  
ADM223/ADM230L–ADM241L  
5V INPUT  
V
C1+  
CC  
+5V TO +10V  
VOLTAGE  
DOUBLER  
1␮F  
6.3V  
1␮F  
6.3V  
1␮F  
6.3V  
C1–  
V+  
C2+  
+10V TO –10V  
VOLTAGE  
INVERTER  
1␮F  
16V  
T4  
T5  
T3  
T1  
1
2
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
OUT  
OUT  
V–  
1␮F  
16V  
C2–  
OUT  
IN  
NC  
SD  
T5  
T2  
3
OUT  
T1  
IN  
T1  
T1  
T2  
OUT  
T2  
T1  
4
IN  
IN  
T2  
IN  
T2  
T3  
T4  
T5  
OUT  
OUT  
OUT  
OUT  
ADM230L  
5
OUT  
TOP VIEW  
TTL/CMOS  
INPUTS*  
GND  
T4  
RS-232  
OUTPUTS  
(Not to Scale)  
6
IN  
IN  
T3  
IN  
T3  
T4  
T5  
V
T3  
7
CC  
T4  
IN  
C1+  
V+  
V–  
8
C2–  
C2+  
9
T5  
IN  
SD  
C1–  
NC  
10  
GND  
ADM230L  
NC = NO CONNECT  
* INTERNAL 400k⍀ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT.  
Figure 1. ADM230L DIP/SOIC Pin Configuration  
Figure 2. ADM230L Typical Operating Circuit  
DIP  
C1+  
C1–  
V–  
V+  
V
14  
13  
12  
11  
10  
9
1
2
3
CC  
GND  
T1  
ADM231L  
TOP VIEW  
(Not to Scale)  
5V INPUT  
T2  
OUT  
4
5
6
7
OUT  
1␮F  
R2  
R1  
R1  
T1  
IN  
IN  
R2  
OUT  
IN  
OUT  
V
CC  
7.5V TO 13.2V  
V+  
T2  
IN  
8
C1+  
1␮F  
16V  
+12V TO –12V  
VOLTAGE  
INVERTER  
V–  
1␮F  
C1–  
16V  
SOIC  
T1  
IN  
T1  
T1  
T2  
R1  
R2  
OUT  
TTL/CMOS  
INPUTS*  
RS-232  
OUTPUTS  
C1+  
C1–  
V–  
V+  
V
16  
15  
14  
13  
12  
11  
10  
9
1
2
3
4
5
6
7
8
T2  
IN  
T2  
R1  
R2  
CC  
OUT  
GND  
T1  
R1  
OUT  
IN  
ADM231L  
TOP VIEW  
(Not to Scale)  
TTL/CMOS  
OUTPUTS  
RS-232  
INPUTS**  
T2  
OUT  
OUT  
R2  
R2  
R1  
R1  
T1  
OUT  
IN  
IN  
IN  
R2  
OUT  
OUT  
GND  
ADM231L  
T2  
IN  
IN  
NC  
NC  
* INTERNAL 400k⍀ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT.  
** INTERNAL 5k⍀ PULL-DOWN RESISTOR ON EACH RS-232 INPUT.  
NC = NO CONNECT  
Figure 3. ADM231L DIP and SOIC Pin Configurations  
Figure 4. ADM231L Typical Operating Circuit (DIP Pinout)  
REV. A  
–4–  
ADM223/ADM230L–ADM241L  
5V INPUT  
V
C1+  
CC  
+5V TO +10V  
VOLTAGE  
DOUBLER  
1␮F  
6.3V  
1␮F  
6.3V  
1␮F  
6.3V  
C1–  
V+  
C2+  
+10V TO –10V  
VOLTAGE  
INVERTER  
1␮F  
16V  
V–  
1␮F  
C2–  
16V  
C1+  
V+  
V
CC  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
GND  
T1  
T1  
T1  
T1  
T2  
R1  
R2  
IN  
OUT  
TTL/CMOS  
INPUTS*  
RS-232  
OUTPUTS  
C1–  
C2+  
C2–  
V–  
OUT  
T2  
T2  
OUT  
IN  
ADM232L  
TOP VIEW  
(Not to Scale)  
R1  
R1  
T1  
IN  
R1  
R1  
R2  
OUT  
OUT  
IN  
IN  
TTL/CMOS  
OUTPUTS  
RS-232  
INPUTS**  
IN  
R2  
OUT  
T2  
OUT  
T2  
IN  
GND  
ADM232L  
R2  
IN  
R2  
OUT  
* INTERNAL 400k⍀ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT.  
** INTERNAL 5k⍀ PULL-DOWN RESISTOR ON EACH RS-232 INPUT.  
Figure 5. ADM232L DIP/SOIC Pin Configuration  
Figure 6. ADM232L Typical Operating Circuit  
5V INPUT  
V
CC  
T1  
T2  
T1  
T2  
T1  
T2  
IN  
OUT  
TTL/CMOS  
INPUTS*  
RS-232  
OUTPUTS  
IN  
OUT  
T2  
T1  
R2  
R2  
T2  
V–  
20  
19  
18  
17  
IN  
1
2
3
4
OUT  
IN  
IN  
R1  
R1  
R2  
R1  
R2  
OUT  
OUT  
IN  
TTL/CMOS  
OUTPUTS  
RS-232  
INPUTS**  
R1  
OUT  
OUT  
R2  
IN  
R1  
IN  
ADM233L  
T1  
C2–  
C2+  
V+  
C1+  
C1–  
V–  
16  
15  
14  
13  
C2+  
C2+  
OUT  
5
6
DO NOT MAKE  
CONNECTIONS TO  
THESE PINS  
TOP VIEW  
GND  
(Not to Scale)  
ADM233L  
V
CC  
7
8
C2–  
C2–  
INTERNAL  
–10V POWER  
SUPPLY  
C1+  
GND  
C2–  
C1–  
V–  
V–  
12  
11  
9
INTERNAL  
+10V POWER  
SUPPLY  
V+  
GND  
GND  
C2+  
10  
* INTERNAL 400k⍀ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT.  
** INTERNAL 5k⍀ PULL-DOWN RESISTOR ON EACH RS-232 INPUT.  
Figure 8. ADM233L Typical Operating Circuit  
Figure 7. ADM233L DIP Pin Configuration  
REV. A  
–5–  
ADM223/ADM230L–ADM241L  
5V INPUT  
1␮F  
6.3V  
V
C1+  
CC  
+5V TO +10V  
VOLTAGE  
DOUBLER  
1␮F  
6.3V  
1␮F  
6.3V  
C1–  
V+  
C2+  
+10V TO –10V  
VOLTAGE  
INVERTER  
1␮F  
16V  
V–  
T1  
T2  
T3  
T4  
T4  
T3  
V–  
1␮F  
16V  
1
2
3
4
5
16  
15  
14  
13  
12  
11  
10  
9
OUT  
OUT  
OUT  
IN  
C2–  
OUT  
T1  
IN  
T1  
T1  
T2  
OUT  
T2  
T1  
IN  
ADM234L  
TOP VIEW  
(Not to Scale)  
IN  
IN  
T2  
IN  
T2  
OUT  
GND  
TTL/CMOS  
INPUTS*  
RS-232  
OUTPUTS  
T3  
IN  
T3  
T4  
T3  
T4  
V
C2–  
C2+  
C1–  
OUT  
CC  
6
7
8
C1+  
V+  
T4  
IN  
OUT  
GND  
ADM234L  
* INTERNAL 400k⍀ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT.  
Figure 9. ADM234L DIP/SOIC Pin Configuration  
Figure 10. ADM234L Typical Operating Circuit  
5V INPUT  
1␮F  
V
CC  
T1  
T2  
T3  
T4  
T5  
T1  
T2  
T1  
T2  
IN  
IN  
IN  
IN  
IN  
OUT  
OUT  
T4  
T3  
T1  
T2  
R3  
R3  
1
2
3
4
5
6
7
24  
23  
22  
OUT  
OUT  
OUT  
OUT  
IN  
TTL/CMOS  
INPUTS*  
RS-232  
OUTPUTS  
T3  
T3  
T4  
T5  
OUT  
OUT  
T5  
T4  
T5  
IN  
OUT  
SD  
21  
20  
19  
OUT  
R2  
IN  
EN  
R1  
R1  
R1  
R2  
T2  
ADM235L  
TOP VIEW  
(Not to Scale)  
T5  
OUT  
OUT  
OUT  
OUT  
IN  
IN  
OUT  
OUT  
R4  
R4  
T4  
IN  
IN  
18  
17  
16  
15  
14  
13  
IN  
R2  
R3  
R4  
R5  
R2  
R2  
T1  
8
9
OUT  
TTL/CMOS  
OUTPUTS  
RS-232  
INPUTS**  
R3  
R4  
R5  
R3  
IN  
IN  
IN  
R1  
OUT  
IN  
IN  
R1  
T3  
IN  
10  
R4  
R5  
R5  
GND 11  
OUT  
R5  
OUT  
V
12  
CC  
IN  
SD  
EN  
GND  
ADM235L  
* INTERNAL 400k⍀ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT.  
** INTERNAL 5k⍀ PULL-DOWN RESISTOR ON EACH RS-232 INPUT.  
Figure 11. ADM235L DIP Pin Configuration  
Figure 12. ADM235L Typical Operating Circuit  
REV. A  
–6–  
ADM223/ADM230L–ADM241L  
5V INPUT  
V
C1+  
CC  
+5V TO +10V  
VOLTAGE  
DOUBLER  
1␮F  
6.3V  
1␮F  
6.3V  
1␮F  
6.3V  
C1–  
V+  
C2+  
+10V TO –10V  
VOLTAGE  
INVERTER  
1␮F  
16V  
V–  
1␮F  
C2–  
T3  
T1  
T2  
16V  
T4  
R2  
R2  
24  
23  
22  
OUT  
OUT  
OUT  
1
2
3
OUT  
T1  
IN  
T1  
IN  
T1  
T2  
OUT  
OUT  
T2  
IN  
T2  
T3  
T4  
OUT  
OUT  
OUT  
R1  
21 SD  
IN  
OUT  
4
5
TTL/CMOS  
INPUTS*  
RS-232  
OUTPUTS  
R1  
T3  
IN  
20  
19  
18  
17  
16  
15  
14  
13  
EN  
T3  
T4  
R1  
R2  
T2  
T1  
ADM236L  
TOP VIEW  
(Not to Scale)  
T4  
T3  
IN  
IN  
6
IN  
IN  
T4  
IN  
7
R1  
R1  
R2  
R3  
SD  
R3  
R3  
V–  
GND  
8
OUT  
OUT  
IN  
IN  
IN  
V
9
CC  
IN  
TTL/CMOS  
OUTPUTS  
RS-232  
INPUTS**  
R2  
OUT  
C1+  
10  
R3  
R3  
C2–  
OUT  
V+ 11  
C1–  
C2+  
12  
EN  
GND  
ADM236L  
* INTERNAL 400k⍀ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT.  
** INTERNAL 5k⍀ PULL-DOWN RESISTOR ON EACH RS-232 INPUT.  
Figure 13. ADM236L DIP/SOIC Pin Configuration  
Figure 14. ADM236L Typical Operating Circuit  
5V INPUT  
V
C1+  
CC  
+5V TO +10V  
VOLTAGE  
DOUBLER  
1␮F  
6.3V  
1␮F  
6.3V  
1␮F  
6.3V  
C1–  
V+  
C2+  
+10V TO –10V  
VOLTAGE  
INVERTER  
1␮F  
16V  
V–  
1␮F  
C2–  
16V  
T3  
T1  
T2  
T4  
R2  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
OUT  
OUT  
OUT  
1
2
3
4
5
6
OUT  
T1  
IN  
T1  
T1  
T2  
OUT  
IN  
T2  
IN  
T2  
OUT  
OUT  
R2  
T5  
OUT  
R1  
IN  
TTL/CMOS  
INPUTS*  
IN  
RS-232  
OUTPUTS  
T3  
IN  
T3  
T3  
T4  
R1  
T5  
T4  
OUT  
OUT  
T4  
IN  
T4  
T5  
T2  
IN  
ADM237L  
IN  
OUT  
TOP VIEW  
T3  
T1  
IN  
7
8
IN  
(Not to Scale)  
T5  
IN  
20  
T5  
R1  
OUT  
GND  
R3  
R3  
V–  
OUT  
R1  
R1  
R2  
R3  
OUT  
OUT  
OUT  
IN  
IN  
IN  
V
CC  
9
IN  
C1+  
V+  
RS-232  
INPUTS**  
TTL/CMOS  
OUTPUTS  
10  
11  
12  
R2  
R3  
R2  
C2–  
R3  
C2+  
C1–  
GND  
ADM237L  
* INTERNAL 400k⍀ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT.  
** INTERNAL 5k⍀ PULL-DOWN RESISTOR ON EACH RS-232 INPUT.  
Figure 15. ADM237L DIP/SOIC Pin Configuration  
Figure 16. ADM237L Typical Operating Circuit  
REV. A  
–7–  
ADM223/ADM230L–ADM241L  
5V INPUT  
V
C1+  
CC  
+5V TO +10V  
VOLTAGE  
DOUBLER  
1␮F  
6.3V  
1␮F  
6.3V  
1␮F  
6.3V  
C1–  
V+  
C2+  
+10V TO –10V  
VOLTAGE  
INVERTER  
1␮F  
16V  
V–  
1␮F  
C2–  
16V  
T1  
IN  
T1  
T1  
T2  
T2  
T1  
T3  
R3  
R3  
T4  
OUT  
1
2
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
OUT  
OUT  
OUT  
IN  
T2  
IN  
T2  
T3  
T4  
OUT  
OUT  
OUT  
R2  
IN  
3
OUT  
RS-232  
OUTPUTS  
TTL/CMOS  
INPUTS*  
T3  
IN  
R2  
T3  
T4  
4
OUT  
IN  
T1  
IN  
T4  
T3  
5
OUT  
T4  
IN  
R1  
ADM238L  
6
OUT  
IN  
TOP VIEW  
R1  
IN  
T2  
R1  
R1  
R1  
R2  
7
IN  
OUT  
OUT  
OUT  
OUT  
IN  
IN  
(Not to Scale)  
GND  
R4  
R4  
V–  
8
OUT  
R2  
R3  
R4  
R2  
V
CC  
9
IN  
RS-232  
INPUTS**  
TTL/CMOS  
OUTPUTS  
C1+  
V+  
10  
11  
12  
R3  
R4  
R3  
IN  
C2–  
R4  
IN  
C1–  
C2+  
GND  
ADM238L  
* INTERNAL 400k⍀ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT.  
** INTERNAL 5k⍀ PULL-DOWN RESISTOR ON EACH RS-232 INPUT.  
Figure 18. ADM238L Typical Operating Circuit  
Figure 17. ADM238L DIP/SOIC Pin Configuration  
5V INPUT  
1␮F  
V
CC  
+12V TO –12V  
VOLTAGE  
INVERTER  
C1+  
1␮F  
16V  
7.5V TO 13.2V  
INPUT  
V+  
C1–  
V–  
1␮F  
16V  
R1  
T1  
T2  
24  
1
2
3
4
5
6
OUT  
IN  
T1  
IN  
T1  
T1  
T2  
OUT  
R1  
23  
IN  
IN  
RS-232  
OUTPUTS  
TTL/CMOS  
INPUTS*  
T2  
IN  
T2  
T3  
OUT  
OUT  
R2  
GND  
22  
OUT  
IN  
V
21 R2  
CC  
T3  
IN  
T3  
R1  
R2  
V+  
C+  
20  
T2  
OUT  
OUT  
R1  
R1  
R2  
R3  
R4  
R5  
OUT  
OUT  
OUT  
OUT  
IN  
IN  
IN  
IN  
IN  
ADM239L  
TOP VIEW  
(Not to Scale)  
19 T1  
R3  
R2  
R3  
R4  
R5  
C–  
V–  
7
8
9
18  
IN  
17 R3  
16 T3  
TTL/CMOS  
OUTPUTS  
OUT  
RS-232  
INPUTS**  
R3  
R4  
R5  
IN  
IN  
R5  
OUT 10  
R4  
OUT 11  
NC  
15  
14  
13  
EN  
R5  
OUT  
R4  
T3  
12  
IN  
OUT  
NC  
EN  
GND  
ADM239L  
* INTERNAL 400k⍀ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT.  
** INTERNAL 5k⍀ PULL-DOWN RESISTOR ON EACH RS-232 INPUT.  
Figure 19. ADM239L DIP/SOIC Pin Configuration  
Figure 20. ADM239L Typical Operating Circuit  
REV. A  
–8–  
ADM223/ADM230L–ADM241L  
5V INPUT  
+5V TO +10V  
VOLTAGE  
DOUBLER  
V
C1+  
C1–  
C2+  
C2–  
CC  
1␮F  
16V  
1␮F  
6.3V  
1␮F  
6.3V  
V+  
+10V TO –10V  
VOLTAGE  
INVERTER  
1␮F  
16V  
V–  
1␮F  
16V  
T3  
T1  
T2  
T4  
R3  
R3  
1
2
3
4
5
6
7
8
9
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
OUT  
OUT  
OUT  
T1  
IN  
T1  
T1  
T2  
T3  
IN  
OUT  
OUT  
OUT  
T2  
IN  
T2  
OUT  
OUT  
TTL/CMOS  
INPUTS*  
R2  
RS-232  
OUTPUTS  
SD  
IN  
T3  
IN  
T3  
R2  
EN  
OUT  
T2  
IN  
R4  
IN  
T4  
IN  
T4  
R1  
T4  
OUT  
T1  
IN  
R4  
T4  
T3  
R5  
ADM241L  
TOP VIEW  
(Not to Scale)  
OUT  
IN  
R1  
R1  
R2  
R3  
R4  
R5  
OUT  
OUT  
OUT  
OUT  
IN  
IN  
IN  
IN  
IN  
R1  
OUT  
R1  
IN  
R2  
R3  
R4  
R5  
R2  
IN  
GND 10  
OUT  
IN  
TTL/CMOS  
OUTPUTS  
RS-232  
INPUTS**  
R3  
R4  
R5  
V
11  
12  
13  
14  
18 R5  
CC  
C1+  
V+  
17 V–  
16  
15  
C2–  
C2+  
OUT  
C1–  
ADM241L  
GND  
SD  
EN  
* INTERNAL 400k⍀ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT.  
** INTERNAL 5k⍀ PULL-DOWN RESISTOR ON EACH RS-232 INPUT.  
Figure 22. ADM241L Typical Operating Circuit  
Figure 21. ADM241L SOIC/SSOP Pin Configuration  
5V INPUT  
+5V TO +10V  
VOLTAGE  
DOUBLER  
V
C1+  
C1–  
C2+  
C2–  
CC  
1␮F  
16V  
1␮F  
6.3V  
1␮F  
6.3V  
V+  
+10V TO –10V  
VOLTAGE  
INVERTER  
1␮F  
16V  
V–  
1␮F  
16V  
T3  
T1  
1
2
28 T4  
OUT  
OUT  
OUT  
IN  
T1  
IN  
T1  
T1  
T2  
T3  
OUT  
R3  
R3  
27  
26  
T2  
IN  
T2  
T2  
3
OUT  
OUT  
OUT  
OUT  
TTL/CMOS  
INPUTS*  
RS-232  
OUTPUTS  
4
25 SD  
R2  
IN  
T3  
IN  
T3  
R2  
5
24 EN  
OUT  
T4  
IN  
T4  
R1  
T4  
T2  
IN  
6
23  
22  
21  
20  
R4  
R4  
T4  
T3  
OUT  
IN  
T1  
IN  
7
ADM223  
TOP VIEW  
(Not to Scale)  
OUT  
IN  
R1  
R1  
R2  
R3  
R4  
R5  
OUT  
OUT  
OUT  
OUT  
IN  
IN  
IN  
IN  
IN  
8
R1  
OUT  
R2  
R3  
R4  
R5  
R2  
R1  
IN  
9
IN  
TTL/CMOS  
OUTPUTS  
RS-232  
INPUTS**  
10  
11  
12  
13  
14  
GND  
19 R5  
OUT  
IN  
R3  
R4  
R5  
18  
17  
V
R5  
CC  
C1+  
V+  
V–  
16 C2–  
15  
OUT  
C1–  
C2+  
ADM223  
GND  
SD  
EN  
* INTERNAL 400k⍀ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT.  
** INTERNAL 5k⍀ PULL-DOWN RESISTOR ON EACH RS-232 INPUT.  
NOTE: RECEIVERS R4 AND R5 REMAIN ACTIVE IN SHUTDOWN.  
Figure 24. ADM223 Typical Operating Circuit  
Figure 23. ADM223 SOIC/SSOP Pin Configuration  
REV. A  
–9–  
ADM223/ADM230L–ADM241L  
PIN FUNCTION DESCRIPTION  
Mnemonic  
Function  
VCC  
V+  
Power Supply Input 5 V 10% (5 V 5% ADM233L, ADM235L).  
Internally generated positive supply (+10 V nominal) on all parts except ADM231L and ADM239L.  
ADM231L, ADM239L requires external 7.5 V to 13.2 V supply.  
V–  
Internally generated negative supply (–10 V nominal).  
GND  
C+  
Ground pin. Must be connected to 0 V.  
(ADM231L and ADM239L only). External capacitor (+ terminal) is connected to this pin.  
(ADM231L and ADM239L only). External capacitor (– terminal) is connected to this pin.  
C–  
C1+  
(ADM230L, ADM232L, ADM234L, ADM236L, ADM237L, ADM238L, ADM241L) External capacitor (+ terminal)  
is connected to this pin.  
(ADM233L) The capacitor is connected internally and no external connection to this pin is required.  
C1–  
C2+  
C2–  
TIN  
(ADM230L, ADM232L, ADM234L, ADM236L, ADM237L, ADM238L, ADM241L) External capacitor (– terminal)  
is connected to this pin.  
(ADM233L) The capacitor is connected internally and no external connection to this pin is required.  
(ADM230L, ADM232L, ADM234L, ADM236L, ADM237L, ADM238L, ADM241L) External capacitor (+ terminal)  
is connected to this pin.  
(ADM233L) Internal capacitor connections, Pins 11 and 15 must be connected together.  
(ADM230L, ADM232L, ADM234L, ADM236L, ADM237L, ADM238L, ADM241L) External capacitor (– terminal)  
is connected to this pin.  
(ADM233L) Internal capacitor connections, Pins 10 and 16 must be connected together.  
Transmitter (Driver) Inputs. These inputs accept TTL/CMOS levels. An internal 400 kΩ pull-up resistor to VCC is  
connected on each input.  
TOUT  
RIN  
Transmitter (Driver) Outputs. These are RS-232 levels (typically 10 V).  
Receiver Inputs. These inputs accept RS-232 signal levels. An internal 5 kΩ pull-down resistor to GND is connected on  
each input.  
ROUT  
Receiver Outputs. These are TTL/CMOS levels.  
EN/EN  
Enable Input. Active low on ADM235L, ADM236L, ADM239L, ADM241L. Active high ADM223. This input is used  
to enable/disable the receiver outputs. With EN = low (EN = high ADM223), the receiver outputs are enabled. With  
EN = high (EN = low ADM223), the outputs are placed in a high impedance state. This facility is useful for  
connecting to microprocessor systems.  
SD/SD  
Shutdown Input. Active high on ADM235L, ADM236L, ADM241L. Active low on ADM223. With SD = high on the  
ADM235L, ADM236L, ADM241L, the charge pump is disabled, the receiver outputs are placed in a high impedance  
state and the driver outputs are turned off. With SD low on the ADM223, the charge pump is disabled, the driver  
outputs are turned off and all receivers except R4 and R5 are placed in a high impedance state. In shutdown, the power  
consumption reduces to 5 µW.  
NC  
No Connect. No connections are required to this pin.  
Table I. ADM235L, ADM236L, ADM241L Truth Table  
Table II. ADM223 Truth Table  
Transmitters Receivers  
Transmitters  
T1–T5  
Receivers  
R1–R5  
SD EN  
Status  
SD EN Status  
T1–T4  
R1–R3 R4, R5  
0
0
1
0
1
0
Normal Operation  
Normal Operation  
Shutdown  
Enabled  
Enabled  
Disabled  
Enabled  
Disabled  
Disabled  
0
0
1
1
0
1
0
1
Shutdown  
Shutdown  
Normal Operation Enabled  
Normal Operation Enabled  
Disabled  
Disabled  
Disabled Disabled  
Disabled Enabled  
Disabled Disabled  
Enabled Enabled  
REV. A  
–10–  
ADM223/ADM230L–ADM241L  
9
7
15  
10  
V+  
Tx O/P HI LOADED  
5
3
5
0
1
–1  
–3  
–5  
–7  
–9  
–5  
V–  
–10  
–15  
Tx O/P LO LOADED  
0
5
10  
LOAD CURRENT – mA  
15  
20  
4.0  
4.5  
5.0  
– V  
5.5  
6.0  
V
CC  
Figure 25. Charge Pump V+, V– vs. Current  
Figure 27. Transmitter Output Voltage vs. VCC  
50  
45  
40  
35  
30  
15  
10  
Tx O/P HI  
5
25  
0
NEGATIVE  
SLEW  
20  
15  
10  
5
–5  
POSITIVE  
SLEW  
Tx O/P LO  
–10  
0
–15  
0
500  
1000  
1500  
2000  
2500  
3000  
0
2
4
6
8
10  
LOAD CAPACITANCE – pF  
LOAD CURRENT – mA  
Figure 26. Transmitter Slew Rate vs. Load Capacitance  
Figure 28. Transmitter Output Voltage vs. Current  
350  
300  
V+ IMP  
250  
200  
150  
100  
V– IMP  
50  
0
4.5  
4.7  
4.9  
5.1  
5.3  
5.5  
V
– V  
CC  
Figure 29. Charge Pump Impedance vs. VCC  
REV. A  
–11–  
ADM223/ADM230L–ADM241L  
Tx INPUT  
1
T
SD  
V+  
T
1
2
T
T
T
Tx OUTPUT  
V–  
3.1V  
CH1 5.00V  
CH3 5.00V  
CH2 5.00V M50.0␮s  
CH1  
5.00V CH2 5.00V M1.00␮s CH1  
CH1  
800mV  
B
W
V+, V– EXITING SD  
Figure 30. Charge Pump, V+, V– Exiting Shutdown  
Figure 31. Transmitter Output Loaded Slew Rate  
T
Tx INPUT  
1
2
T
Tx OUTPUT  
800mV  
5.00V CH2 5.00V M1.00␮s CH1  
CH1  
Figure 32. Transmitter Output Unloaded Slew Rate  
GENERAL INFORMATION  
CIRCUIT DESCRIPTION  
The ADM223/ADM230L–ADM241L family of RS-232 drivers/  
receivers are designed to solve interface problems by meeting  
the EIA-232-E specifications while using a single digital 5 V  
supply. The EIA-232-E standard requires transmitters which  
will deliver 5 V minimum on the transmission channel and  
receivers which can accept signal levels down to 3 V. The  
ADM223/ADM230L–ADM241L meet these requirements by  
integrating step up voltage converters and level shifting trans-  
mitters and receivers onto the same chip. CMOS technology is  
used to keep the power dissipation to an absolute minimum. A  
comprehensive range of transmitter/receiver combinations is  
available to cover most communications needs.  
The internal circuitry in the ADM230L–ADM241L consists of  
three main sections. These are:  
(a) A charge pump voltage converter  
(b) RS-232 to TTL/CMOS receivers  
(c) TTL/CMOS to RS-232 transmitters  
Charge Pump DC-DC Voltage Converter  
The charge pump voltage converter consists of an oscillator and  
a switching matrix. The converter generates a 10 V supply  
from the input 5 V level. This is done in two stages using a  
switched capacitor technique as illustrated in Figures 33 and 34.  
First, the 5 V input supply is doubled to 10 V using capacitor  
C1 as the charge storage element. The 10 V level is then inverted  
to generate –10 V using C2 as the storage element.  
The ADM223, ADM230L, ADM235L, ADM236L and  
ADM241L are particularly useful in battery powered systems as  
they feature a low power shutdown mode which reduces power  
dissipation to less than 5 µW.  
S1  
S3  
V
V+ = 2V  
CC  
CC  
C1  
C3  
The ADM233L and ADM235L are designed for applications  
where space saving is important as the charge pump capaci-  
tors are molded into the package.  
S2  
S4  
GND  
V
CC  
The ADM231L and ADM239L include only a negative charge  
pump converter and are intended for applications where a posi-  
tive 12 V is available.  
INTERNAL  
OSCILLATOR  
Figure 33. Charge-Pump Voltage Doubler  
To facilitate sharing a common line or for connection to a micro-  
processor data bus the ADM235L, ADM236L, ADM239L and  
ADM241L feature an enable (EN, EN) function. When disabled,  
the receiver outputs are placed in a high impedance state.  
REV. A  
–12–  
ADM223/ADM230L–ADM241L  
S1  
S2  
S3  
S4  
and all receivers except R4 and R5 on the ADM223 are put into  
a high-impedance disabled state. Receivers R4 and R5 on the  
ADM223 remain enabled during shutdown. This feature allows  
monitoring external activity such as ring indicator monitoring  
while the device is in a low power shutdown mode.  
V+  
GND  
FROM  
VOLTAGE  
DOUBLER  
+
+
C2  
C4  
GND  
V– = –(V+)  
INTERNAL  
OSCILLATOR  
The shutdown control input is active high on all parts except the  
ADM223 where it is active low. Refer to Tables I and II.  
Enable Input  
Figure 34. Charge-Pump Voltage Inverter  
The ADM235, ADM239, ADM241L and ADM223 feature  
an enable input used to enable or disable the receiver outputs.  
The enable input is active low on the ADM235L, ADM239L,  
ADM241L and active high on the ADM223. Refer to Tables I  
and II. When disabled, all receiver outputs are placed in a high  
impedance state. This function allows the outputs to be con-  
nected directly to a microprocessor data bus. It can also be used  
to allow receivers from different devices to share a common data  
line. The timing diagram for the enable function is shown in  
Figure 35.  
Capacitors C3 and C4 are used to reduce the output ripple.  
Their values are not critical and can be reduced if higher  
levels of ripple are acceptable. The charge pump capacitors  
C1 and C2 may also be reduced at the expense of higher  
output impedance on the V+ and V– supplies.  
The V+ and V– supplies may also be used to power external  
circuitry if the current requirements are small.  
Transmitter (Driver) Section  
The drivers convert TTL/CMOS input levels into EIA-232-E  
output levels. With VCC = +5 V and driving a typical EIA-232-E  
load, the output voltage swing is 9 V. Even under worst-case  
conditions the drivers are guaranteed to meet the 5 V EIA-232-E  
minimum requirement.  
3V  
EN*  
0V  
T
T
DIS  
EN  
The input threshold levels are both TTL and CMOS compat-  
ible with the switching threshold set at VCC/4. With a nominal  
3.5V  
0.8V  
V
– 0.1V  
OH  
R
OUT  
V
CC = 5 V the switching threshold is 1.25 V typical. Unused  
V
+ 0.1V  
OL  
inputs may be left unconnected, as an internal 400 kΩ pull-up  
resistor pulls them high forcing the outputs into a low state.  
*POLARITY OF EN IS REVERSED FOR ADM223.  
As required by the EIA-232-E standard, the slew rate is limited  
to less than 30 V/µs without the need for an external slew limit-  
ing capacitor and the output impedance in the power-off state is  
greater than 300 Ω.  
Figure 35. Enable Timing  
APPLICATION HINTS  
Driving Long Cables  
Receiver Section  
In accordance with the EIA-232-E standard, long cables are per-  
missible provided that the total load capacitance does not exceed  
2500 pF. For longer cables which do exceed this, then it is possible  
to trade off baud rate vs. cable length. Large load capacitances  
cause a reduction in slew rate, and hence the maximum transmis-  
sion baud rate is decreased. The ADM230L-ADM241L are  
designed so that the slew rate reduction with increasing load  
capacitance is minimized.  
The receivers are inverting level shifters which accept EIA-232-E  
input levels ( 5 V to 15 V) and translate them into 5 V TTL/  
CMOS levels. The inputs have internal 5 kΩ pull-down resistors  
to ground and are also protected against overvoltages of up to  
30 V. The guaranteed switching thresholds are 0.8 V minimum  
and 2.4 V maximum which are well within the 3 V EIA-232-E  
requirement. The low level threshold is deliberately positive  
as it ensures that an unconnected input will be interpreted as a  
low level.  
For the receivers, it is important that a high level of noise immu-  
nity be inbuilt so that slow rise and fall times do not cause  
multiple output transitions as the signal passes slowly through  
the transition region. The ADM230L-ADM241L have 0.5 V of  
hysteresis to guard against this. This ensures that, even in noisy  
environments, error-free reception can be achieved.  
The receivers have Schmitt trigger inputs with a hysteresis level  
of 0.5 V. This ensures error-free reception for both noisy inputs  
and for inputs with slow transition times.  
Shutdown (SD)  
The ADM223, ADM230L, ADM235L, ADM236L and  
ADM241L feature a control input that may be used to disable  
the part and reduce the power consumption to less than 5 µW.  
This is very useful in battery operated systems. During shutdown  
the charge pump is turned off, the transmitters are disabled  
High Baud Rate Operation  
The ADM230L-ADM241L feature high slew rates permitting  
data transmission at rates well in excess of the EIA-232-E speci-  
fication. The drivers maintain 5 V signal levels at data rates up  
to 100-kB/s under worst-case loading conditions.  
REV. A  
–13–  
ADM223/ADM230L–ADM241L  
OUTLINE DIMENSIONS  
Dimensions shown in inches and (mm).  
14-Lead Plastic DIP (N-14)  
14-Lead Cerdip (Q-14)  
14  
8
14  
8
0.280 (7.11)  
0.240 (6.10)  
0.271 (6.89)  
0.240 (6.09)  
7
PIN 1  
1
PIN 1  
7
1
0.300 (7.62)  
REF  
0.795 (20.19)  
0.725 (18.42)  
0.780 (19.81)  
0.325 (8.25)  
0.300 (7.62)  
0.163 (4.14)  
0.133 (3.378)  
0.060 (1.52)  
0.015 (0.38)  
0.195 (4.95)  
0.115 (2.93)  
0.210  
(5.33)  
0.125  
(3.17)  
MIN  
0.21 (5.33)  
0.15 (3.81)  
0.150  
(3.81)  
0.015 (0.381)  
0.008 (0.204)  
0.200 (5.05)  
0.125 (3.18)  
0.012 (0.305)  
0.008 (0.203)  
SEATING  
PLANE  
15؇  
0؇  
0.02 (0.5)  
0.016 (0.406) 0.099 (2.28) 0.05 (1.27)  
0.11 (2.79) 0.06 (1.52)  
SEATING  
PLANE  
0.022 (0.558) 0.100 0.070 (1.77)  
(2.54)  
0.014 (0.356)  
0.045 (1.15)  
BSC  
16-Lead Cerdip (Q-16)  
16-Lead Plastic DIP (N-16)  
9
16  
16  
9
0.271 (6.89)  
0.240 (6.09)  
8
0.280 (7.11)  
0.240 (6.10)  
8
PIN 1  
PIN 1  
1
1
0.300 (7.62)  
REF  
0.780 (19.81)  
0.325 (8.25)  
0.300 (7.62)  
0.840 (21.33)  
0.745 (18.93)  
0.163 (4.14)  
0.133 (3.378)  
0.060 (1.52)  
0.015 (0.38)  
0.195 (4.95)  
0.115 (2.93)  
0.210  
(5.33)  
0.125  
0.21 (5.33)  
0.15 (3.81)  
(3.17)  
MIN  
0.150  
(3.81)  
0.200 (5.05)  
0.125 (3.18)  
0.015 (0.381)  
0.008 (0.204)  
15؇  
0؇  
0.012 (0.305)  
0.008 (0.203)  
SEATING  
PLANE  
0.02 (0.5)  
0.11 (2.79)  
0.06 (1.52)  
0.05 (1.27)  
SEATING  
PLANE  
0.070 (1.77)  
0.045 (1.15)  
0.022 (0.558)  
0.014 (0.356)  
0.100  
(2.54)  
BSC  
0.016 (0.406) 0.099 (2.28)  
16-Lead SOIC (R-16)  
9
16  
0.299 (7.60)  
0.291 (7.40)  
0.419 (10.65)  
0.404 (10.26)  
PIN 1  
8
1
0.107 (2.72)  
0.413 (10.50)  
0.348 (10.10)  
0.089 (2.26)  
0.364 (9.246)  
0.344 (8.738)  
0.045 (1.15)  
0.020 (0.50)  
0.010 (0.25)  
0.004 (0.10)  
0.015 (0.38)  
0.007 (1.18)  
0.050  
(1.27)  
BSC  
0.018 (0.46)  
0.014 (0.36)  
REV. A  
–14–  
ADM223/ADM230L–ADM241L  
OUTLINE DIMENSIONS  
Dimensions shown in inches and (mm).  
20-Lead Plastic DIP (N-20)  
20-Lead Cerdip (Q-20)  
1.060 (26.90)  
0.925 (23.50)  
0.97 (24.64)  
0.935 (23.75)  
20  
11  
20  
11  
0.28 (7.11)  
0.24 (6.1)  
10  
0.280 (7.11)  
0.240 (6.10)  
10  
PIN 1  
PIN 1  
1
1
0.18 (4.57)  
0.125 (3.18)  
0.32 (8.128)  
0.29 (7.366)  
0.325 (8.25)  
0.300 (7.62)  
0.060 (1.52)  
0.015 (0.38)  
0.195 (4.95)  
0.115 (2.93)  
0.20 (5.0)  
0.14 (3.56)  
0.210  
(5.33)  
0.150  
(3.81)  
0.200 (5.05)  
0.125 (3.18)  
0.15 (3.8)  
0.125 (3.18)  
0.015 (0.381)  
0.008 (0.204)  
0.011 (0.28)  
0.009 (0.23)  
0.070 (1.78)  
0.045 (1.15)  
0.022 (0.558)  
0.014 (0.356)  
0.100 (2.54)  
BSC  
15؇  
0؇  
SEATING  
PLANE  
0.02 (0.5)  
0.016 (0.41)  
0.07 (1.78) SEATING  
0.05 (1.27)  
0.11 (2.79)  
0.09 (2.28)  
PLANE  
LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH  
24-Lead Ceramic DIP (D-24)  
20-Lead SOIC (R-20)  
1.290 (32.77)  
0.005 (0.13)  
0.5118 (13.00)  
0.4961 (12.60)  
0.098 (2.49)  
24  
13  
20  
11  
0.610 (15.49)  
0.500 (12.70)  
0.2992 (7.60)  
0.2914 (7.40)  
PIN 1  
1
12  
0.620 (15.75)  
0.590 (14.99)  
0.4193 (10.65)  
0.3937 (10.00)  
0.075 (1.91)  
0.015 (0.38)  
PIN 1  
1
10  
0.225  
(5.72)  
0.150  
0.015 (0.38)  
0.008 (0.20)  
0.200 (5.08)  
0.120 (3.05)  
(3.81)  
0.1043 (2.65)  
0.0926 (2.35)  
0.0291 (0.74)  
0.0098 (0.25)  
؋
 45؇  
SEATING  
PLANE  
0.023 (0.58)  
0.014 (0.36)  
0.110 (2.79)  
0.090 (2.29)  
0.070 (1.78)  
0.030 (0.76)  
0.0500 (1.27)  
0.0157 (0.40)  
8؇  
0؇  
0.0118 (0.30)  
0.0040 (0.10)  
0.0500  
(1.27)  
BSC  
0.0192 (0.49)  
0.0138 (0.35)  
0.0125 (0.32)  
0.0091 (0.23)  
24-Lead Plastic DIP (N-24A)  
24-Lead Plastic DIP (N-24)  
24  
13  
13  
24  
0.55 (13.97)  
0.53 (13.47)  
PIN 1  
0.260 ؎ 0.001  
(6.61 ؎ 0.03)  
PIN 1  
12  
1
12  
1
0.32 (8.128)  
0.30 (7.62)  
1.228 (31.19)  
1.226 (31.14)  
1.25 (31.75)  
1.24 (31.5)  
0.16 (4.07)  
0.14 (3.56)  
0.606 (15.4)  
0.594 (15.09)  
0.130 (3.30)  
0.128 (3.25)  
0.2  
(5.08)  
MAX  
0.175 (4.45)  
0.12 (3.05)  
SEATING  
PLANE  
15؇  
0؇  
0.011 (0.28)  
0.009 (0.23)  
0.012 (0.305)  
0.008 (0.203)  
0.02 (0.5)  
0.016 (0.41)  
NOTES  
0.11 (2.79)  
0.09 (2.28)  
0.07 (1.78)  
0.05 (1.27)  
0.02 (0.508) 0.105 (2.67)  
0.015 (0.381) 0.095 (2.42)  
0.065 (1.66)  
0.045 (1.15)  
15؇  
0
SEATING  
PLANE  
1. LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH  
2. PLASTIC LEADS WILL BE EITHER SOLDER DIPPED OR TIN PLATED  
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.  
REV. A  
–15–  
ADM223/ADM230L–ADM241L  
OUTLINE DIMENSIONS  
Dimensions shown in inches and (mm).  
24-Lead Cerdip (Q-24)  
28-Lead SOIC (R-28)  
0.708 (18.02)  
0.696 (17.67)  
13  
12  
24  
0.295  
(7.493)  
MAX  
PIN 1  
0.320 (8.128)  
0.290 (7.366)  
1
28  
15  
14  
0.299 (7.6)  
0.291 (7.39)  
1.290 (32.77) MAX  
0.180  
0.225  
(4.572)  
MAX  
(5.715)  
MAX  
PIN 1  
1
0.414 (10.52)  
0.398 (10.10)  
0.125  
(3.175)  
MIN  
SEATING  
PLANE  
0.012 (0.305)  
0.008 (0.203)  
TYP  
0.070 (1.778)  
0.020 (0.508)  
15؇  
0؇  
0.021 (0.533)  
0.015 (0.381)  
TYP  
0.110 (2.794)  
0.090 (2.286)  
TYP  
0.096 (2.44)  
0.089 (2.26)  
0.065 (1.651)  
0.055 (1.397)  
TYP  
0.03 (0.76)  
0.02 (0.51)  
1. LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH.  
2. CERDIP LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED  
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.  
6؇  
0؇  
0.01 (0.254)  
0.006 (0.15)  
0.05 (1.27)  
BSC  
0.019 (0.49)  
0.014 (0.35)  
0.042 (1.067)  
0.018 (0.457)  
0.013 (0.32)  
0.009 (0.23)  
1. LEAD NO. IDENTIFIED BY A DOT.  
2. SOIC LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED  
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.  
24-Lead SOIC (R-24)  
28-Lead SSOP (RS-28)  
0.608 (15.45)  
0.596 (15.13)  
0.407 (10.34)  
0.397 (10.08)  
24  
13  
28  
15  
0.299 (7.6)  
0.291 (7.39)  
0.212 (5.38)  
0.205 (5.207)  
0.414 (10.52)  
0.398 (10.10)  
0.311 (7.9)  
0.301 (7.64)  
PIN 1  
12  
PIN 1  
1
1
14  
0.096 (2.44)  
0.03 (0.76)  
0.07 (1.78)  
0.066 (1.67)  
0.089 (2.26)  
0.02 (0.51)  
0.042 (1.067)  
0.018 (0.447)  
6؇  
0؇  
0.037 (0.94)  
0.022 (0.559)  
8؇  
0؇  
0.01 (0.254)  
0.006 (0.15)  
0.05 (1.27)  
BSC  
0.019 (0.49)  
0.014 (0.35)  
0.013 (0.32)  
0.009 (0.23)  
0.008 (0.203)  
0.002 (0.050)  
0.0256 (0.65)  
BSC  
0.009 (0.229)  
0.005 (0.127)  
1. LEAD NO. 1 IDENTIFIED BY A DOT.  
2. SOIC LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED  
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS  
1. LEAD NO. 1 IDENTIFIED BY A DOT.  
2. LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED  
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS  
ADM223/ADM230L–ADM241L–Revision History  
Location  
Page  
Changed data sheet from REV. 0 to REV. A.  
Removed ESD information from FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
SPECIFICATIONS changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Removed ESD information from ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
REV. A  
–16–  

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 Pin-Programmable Dual Controller - Portable PCs

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SI9130_11

 Pin-Programmable Dual Controller - Portable PCs

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SI9137

 Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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SI9137DB

 Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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SI9137LG

 Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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SI9122E

 500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification Drivers

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