ADM3232E_15 [ADI]
Line Driver/Receiver;
| 型号： | ADM3232E_15 |
| 厂家： | 
ADI |
| 描述： | Line Driver/Receiver |
| 文件： | 总12页 (文件大小：232K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
± ±15 k5ꢀES5ꢁProteotꢂd5ꢃ3ꢃ5kd5RE-2ꢃ2
Lint5SPivtP/RtetivtP
ASMꢃ2ꢃ2ꢀ
55
FEATURES
FUNCTIONAL BLOCK DIAGRAM
+3.3V INPUT
Data rate: 460 kbps
ADM3232E
+3.3V TO +6.6V
VOLTAGE
2 Tx and 2 Rx
C1
0.1µF
10V
+
C5
0.1µF
C1+
C1–
V
CC
+
+
Meets EIA-232E specifications
0.1 μF charge pump capacitors
ESD protection to IEC 1000-4-2 (801.2) on RS-232 I/Os
Contact discharge: 8 kV
C3
0.1µF
6.3V
+
V+
DOUBLER
+6.6V TO –6.6V
VOLTAGE
INVERTER
C2
0.1µF
10V
C2+
C2–
V–
C4
+
0.1µF
10V
Air gap discharge: 1ꢀ kV
T1
T1
T1
IN
OUT
TTL/CMOS
INPUTS
RS-232
OUTPUTS
APPLICATIONS
T2
T2
R1
T2
IN
OUT
General-purpose RS-232 data link
Portable instruments
Handsets
R1
R2
R1
OUT
IN
IN
TTL/CMOS
OUTPUTS
5kΩ
5kΩ
RS-232
INPUTS*
R2
R2
OUT
Industrial/telecom diagnostic ports
GND
*INTERNAL 5kΩ PULL-DOWN RESISTOR
ON EACH RS-232 INPUT.
Figure 1.
GENERAL DESCRIPTION
Emissions are also controlled to within very strict limits. CMOS
technology is used to keep the power dissipation to an absolute
minimum, allowing maximum battery life in portable applications.
The ADM3232E transceiver is a high speed, 2-channel RS-232/V.28
interface device that operates from a single 3.3 V power supply.
Low power consumption makes it ideal for battery-powered
portable instruments. The ADM3232E conforms to the EIA-232E
and ITU-T V.28 specifications and operates at data rates up to
460 kbps.
Four external 0.± μF charge pump capacitors are used for the
voltage doubler/inverter, permitting operation from a single
3.3 V supply.
All RS-232 (TxOUT and RxIN) inputs and outputs are protected
against electrostatic discharges (up to ±±1 kV ESD protection).
This ensures compliance with IEC ±000-4-2 requirements.
The ADM3232E is available in a ±6-lead narrow and wide SOIC
packages, as well as a space-saving ±6-lead TSSOP.
This device is ideally suited for operation in electrically harsh
environments or where RS-232 cables are frequently plugged/
unplugged, with the ±±1 kV ESD protection of the ADM3232E
RS-232 input/output pins.
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113 ©2006–2011 Analog Devices, Inc. All rights reserved.
ASMꢃ2ꢃ2ꢀ5
5
TABLꢀ5OF5CONTꢀNTE5
Features .............................................................................................. ±
Pin Configuration and Function Descriptions..............................1
Typical Performance Characteristics ..............................................6
Theory of Operation .........................................................................8
Circuit Description .......................................................................8
High Baud Rate..............................................................................8
Outline Dimensions..........................................................................9
Ordering Guide .......................................................................... ±0
Applications....................................................................................... ±
Functional Block Diagram .............................................................. ±
General Description......................................................................... ±
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
ESD Caution.................................................................................. 4
REVISION HISTORY
4/11—Rev. A to Rev. B
Changes to Features Section and General Description
Section................................................................................................ ±
Change to ESD Protection (RS-232 I/O Pins) Parameter,
Table ± ................................................................................................ 3
Change to ESD Protection on RS-232 Pins Section Heading..... 8
7/08—Rev. 0 to Rev. A
Added ±6-Lead SOIC.........................................................Universal
Updated Outline Dimensions......................................................... 9
Changes to Ordering Guide .......................................................... ±0
12/06—Revision 0: Initial Version
Rev. B | Page 2 of 12
55
ASMꢃ2ꢃ2ꢀ
EꢁꢀCIFICATIONE5
VCC = 3.3 V ± 0.3 V, C± to C4 = 0.± μF; all specifications TMIN to TMAX, unless otherwise noted.
Table 1.
Parameter
Min
Typ
Max
Unit
Test Conditions/Comments
DC CHARACTERISTICS
Operating Voltage Range
VCC Power Supply Current
LOGIC
3.0
3.3
1.3
5.5
3
V
mA
No load
Input Logic Threshold Low, VINL
Input Logic Threshold High, VINH
TTL/CMOS Output Voltage Low, VOL
TTLCMOS Output Voltage High, VOH VCC − 0.6
Logic Pull-Up Current
0.8
0.4
10
V
V
V
V
TIN
TIN
2.0
IOUT = 1.6 mA
I
OUT = −1 mA
5
0.5
μA
V
TIN = GND to VCC
Transmitter Input Hysteresis
RS-232 RECEIVER
Input Voltage Range
Input Threshold Low
Input Threshold High
Input Hysteresis
Input Resistance
−30
0.6
+30
2.4
7
V
V
V
V
1.2
1.6
0.4
5
3
kΩ
RS-232 TRANSMITTER
Output Voltage Swing (RS-232)
Output Voltage Swing (RS-562)
Transmitter Output Resistance
Output Short-Circuit Current (RS-232)
TIMING CHARACTERISTICS
Maximum Data Rate
5.0
3.7
300
5.2
15
V
V
Ω
mA
VCC = 3.3 V, all transmitter outputs loaded with 3 kΩ to ground
VCC = 3.0 V
VCC = 0 V, VOUT = 2 V
460
kbps VCC = 3.3 V, RL = 3 kΩ to 7 kΩ, CL = 50 pF to 1000 pF, one
Tx switching
Receiver Propagation Delay
tPHL
tPLH
Transmitter Propagation Delay
Receiver Output Enable Time
Receiver Output Disable Time
Transmitter Skew
0.4
0.4
300
200
200
30
1
1
1.2
μs
μs
μs
ns
ns
RL = 3 kΩ, CL = 1000 pF
ns
Receiver Skew
Transition Region Slew Rate
300
10
ns
V/μs
5.5
30
Measured from +3 V to −3 V or −3 V to +3 V, VCC = 3.3 V;
RL = 3 kΩ, CL = 1000 pF, TA = 25°C
ESD PROTECTION (RS-232 I/O PINS)
15
15
8
kV
kV
kV
Human body model
IEC 1000-4-2 air discharge
IEC 1000-4-2 contact discharge
Rev. B | Page 3 of 12
ASMꢃ2ꢃ2ꢀ5
5
ABEOLUTꢀ5MAXIMUM5RATINGE5
TA = 21°C, unless otherwise noted.
Table 2.
Parameter
VCC
V+
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rating
−0.3 V to +6 V
(VCC − 0.3 V) to 14 V
+0.3 V to –14 V
V−
Input Voltages
TxIN
RxIN
−0.3 V to (VCC + 0.3 V)
30 V
ESD CAUTION
Output Voltages
TxOUT
15 V
RxOUT
−0.3 V to (VCC + 0.3 V)
Short-Circuit Duration
TxOUT
Continuous
450 mW
Power Dissipation R-16/RW-16
(Derate 6 mW/°C Above 50°C)
θJA, Thermal Impedance
Power Dissipation RU-16
(Derate 6 mW/°C Above 50°C)
θJA, Thermal Impedance
Operating Temperature Range
Industrial (A Version)
Storage Temperature Range
158°C/W
500 mW
158°C/W
−40°C to +85°C
−65°C to +150°C
Lead Temperature
(Soldering, 10 sec)
JEDEC industry-standard
J-STD-020
Rev. B | Page 4 of 12
55
ASMꢃ2ꢃ2ꢀ
ꢁIN5CONFIGURATION5ANS5FUNCTION5SꢀECRIꢁTIONE5
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
C1+
V
CC
GND
T1
V+
ADM3232E
C1–
C2+
C2–
V–
OUT
TOP VIEW
R1
R1
(Not to Scale)
IN
OUT
IN
T1
T2
T2
OUT
IN
R2
R2
OUT
IN
Figure 2. Pin Configuration
Table 3. Pin Function Descriptions
Pin No.
Mnemonic Description
1, 3
C1+, C1–
External Capacitor 1 is connected between these pins. A 0.1 μF capacitor is recommended, but larger capacitors
of up to 47 μF can be used.
2
V+
Internally Generated Positive Supply (6 V Nominal).
4, 5
C2+, C2–
External Capacitor 2 is connected between these pins. A 0.1 μF capacitor is recommended, but larger capacitors
of up to 47 μF can be used.
6
V–
Internally Generated Negative Supply (−6 V Nominal).
7, 14
8, 13
T2OUT, T1OUT Transmitter (Driver) Outputs. These are RS-232 signal levels (typically 6 V).
R2IN, R1IN
Receiver Inputs. These inputs accept RS-232 signal levels. An internal 5 kΩ pull-down resistor to GND is connected
on each input.
9, 12
10, 11
15
R2OUT, R1OUT Receiver Outputs. These are TTL/CMOS output logic levels.
T2IN, T1IN
GND
Transmitter (Driver) Inputs. These inputs accept TTL/CMOS levels.
Ground Pin. Must be connected to 0 V.
16
VCC
Power Supply Input (3.3 V 0.3 V).
Rev. B | Page 5 of 12
ASMꢃ2ꢃ2ꢀ5
5
TYꢁICAL5ꢁꢀRFORMANCꢀ5CHARACTꢀRIETICE5
8
8
6
Tx
OUT
(HIGH)
6
V+
4
4
2
2
0
0
–2
–4
–6
–8
–2
–4
–6
–8
V–
Tx
OUT
(LOW)
0
200
400
600
800
1000
1200
0
2
4
6
8
10
12
LOAD CAPACITANCE (pF)
LOAD CURRENT (mA)
Figure 3. Transmitter Output Voltage High/Low vs.
Load Capacitance @ 460 kbps
Figure 6. Charge Pump V+, V− vs. Load Current
350
300
250
200
150
100
50
8
Tx
HIGH
OUT
6
4
V+ (IMPEDANCE)
V– (IMPEDANCE)
2
0
–2
–4
–6
–8
Tx
LOW
OUT
0
2.7
2.7
2.9
3.1
V
3.3
3.5
2.9
3.1
V
3.3
3.5
(V)
(V)
CC
CC
Figure 4. Transmitter Output Voltage vs. VCC
Figure 7. Charge Pump Impedance vs. VCC
8
6
20
18
16
14
12
10
8
I
@ 460kbps
Tx
OUT
HIGH
CC
4
2
I
@ 230kbps
CC
0
–2
–4
–6
–8
6
4
Tx
OUT
LOW
2
0
0
2
4
6
8
10
12
0
1000
2000
3000
LOAD CURRENT (mA)
LOAD CAPACITANCE (pF)
Figure 5. Transmitter Output Voltage High/Low vs. Load Current
Figure 8. Power Supply Current vs. Load Capacitance
Rev. B | Page 6 of 12
55
ASMꢃ2ꢃ2ꢀ
T
T
1
2
CH 1 5.00V
CH 2
5.00V
M1.00µs
CH1
0V
Figure 9. 460 kbps Data Transmission
Rev. B | Page 7 of 12
ASMꢃ2ꢃ2ꢀ5
5
THꢀORY5OF5OꢁꢀRATION5
S1
S3
S4
The ADM3232E is a single-channel RS-232 line driver/receiver.
Step-up voltage converters, coupled with level-shifting transmitters
and receivers, allow RS-232 levels to be developed while operating
from a single 3.3 V supply.
V
V+ = 2V
CC
CC
+
+
C1
C3
S2
V
GND
CC
INTERNAL
CMOS technology is used to keep the power dissipation to an
absolute minimum, allowing maximum battery life in portable
applications.
OSCILLATOR
Figure 11. Charge Pump Voltage Doubler
CIRCUIT DESCRIPTION
S1
S3
S4
The internal circuitry consists of the following main sections:
V+
GND
FROM
VOLTAGE
DOUBLER
+
+
•
•
•
A charge pump voltage converter
A 3.3 V logic to RS-232 transmitter
An RS-232 to 3.3 V logic receiver
C2
C4
S2
V– = –(V+)
GND
INTERNAL
OSCILLATOR
Charge Pump Voltage Converter
Figure 12. Charge Pump Voltage Inverter
The charge pump voltage converter consists of a 200 kHz
oscillator and a switching matrix. The converter generates a
±6.6 V supply from the input 3.3 V level. This is accomplished
in two stages by using a switched capacitor technique as shown
in Figure ±0. First, the 3.3 V input supply is doubled to 6.6 V by
using Capacitor C± as the charge storage element. The +6.6 V
level is then inverted to generate −6.6 V, using C2 as the storage
element.
3.3 V Logic to RS-232 Transmitter
The drivers convert 3.3 V logic input levels into RS-232 output
levels. With VCC = 3.3 V and driving an RS-232 load, the output
voltage swing is typically ±6 V.
RS-232 to 3.3 V Logic Receiver
The receivers are inverting level shifters that accept RS-232 input
levels and translate them into 3 V logic output levels. The inputs
have internal 1 kΩ pull-down resistors to ground and are pro-
tected against overvoltages up to ±30 V. Unconnected inputs
are pulled to 0 V by the internal 1 kꢀ pull-down resistor. This
results in a Logic ± output level for unconnected inputs or for
inputs connected to GND.
Capacitor C3 and Capacitor C4 are used to reduce the output
ripple. Their values are not critical and can be increased, if desired.
Capacitor C3 is shown connected between V+ and VCC. It is also
acceptable to connect this capacitor between V+ and GND.
If desired, larger capacitors (up to ±0 μF) can be used for
Capacitor C± to Capacitor C4.
+3.3V INPUT
The receivers have Schmitt trigger inputs with a hysteresis level
of 0.4 V. This ensures error-free reception for both noisy inputs
and for inputs with slow transition times.
ADM3232E
+3.3V TO +6.6V
VOLTAGE
DOUBLER
C1
0.1µF
10V
+
C5
0.1µF
C1+
C1–
V
CC
+
+
C3
0.1µF
6.3V
+
ESD Protection on RS-232 Pins
V+
+6.6V TO –6.6V
VOLTAGE
INVERTER
All RS-232 (TxOUT and RxIN) inputs and outputs are protected
against electrostatic discharges (up to ±±1 kV). This ensures
compliance with IEC ±000-4-2 requirements.
C2
0.1µF
10V
C2+
C2–
V–
C4
+
0.1µF
10V
T1
T1
T1
IN
OUT
TTL/CMOS
INPUTS
RS-232
OUTPUTS
HIGH BAUD RATE
T2
T2
R1
T2
IN
OUT
The ADM3232E features high slew rates, permitting data trans-
mission at rates well in excess of the EIA-232E specifications.
RS-232 voltage levels are maintained at data rates up to 460 kbps,
even under worst-case loading conditions. The slew rate is
internally controlled to less than 30 V/μs to minimize EMI
interference.
R1
R2
R1
OUT
IN
IN
TTL/CMOS
OUTPUTS
5kΩ
5kΩ
RS-232
INPUTS*
R2
R2
OUT
GND
*INTERNAL 5kΩ PULL-DOWN RESISTOR
ON EACH RS-232 INPUT.
Figure 10. Typical Operating Circuit
Rev. B | Page 8 of 12
55
ASMꢃ2ꢃ2ꢀ
OUTLINꢀ5SIMꢀNEIONE5
10.00 (0.3937)
9.80 (0.3858)
9
8
16
1
6.20 (0.2441)
5.80 (0.2283)
4.00 (0.1575)
3.80 (0.1496)
1.27 (0.0500)
BSC
0.50 (0.0197)
0.25 (0.0098)
45°
1.75 (0.0689)
1.35 (0.0531)
0.25 (0.0098)
0.10 (0.0039)
8°
0°
COPLANARITY
0.10
SEATING
PLANE
1.27 (0.0500)
0.40 (0.0157)
0.51 (0.0201)
0.31 (0.0122)
0.25 (0.0098)
0.17 (0.0067)
COMPLIANT TO JEDEC STANDARDS MS-012-AC
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 13. 16-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-16)
Dimensions shown in millimeters (and inches)
5.10
5.00
4.90
16
9
8
4.50
4.40
4.30
6.40
BSC
1
PIN 1
1.20
MAX
0.15
0.05
0.20
0.09
0.75
0.60
0.45
8°
0°
0.30
0.19
0.65
BSC
SEATING
PLANE
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 14. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
Rev. B | Page 9 of 12
ASMꢃ2ꢃ2ꢀ5
5
10.50 (0.4134)
10.10 (0.3976)
16
1
9
8
7.60 (0.2992)
7.40 (0.2913)
10.65 (0.4193)
10.00 (0.3937)
0.75 (0.0295)
0.25 (0.00
98)
1.27 (0.0500)
BSC
45°
2.65 (0.1043)
2.35 (0.0925)
0.30 (0.0118)
0.10 (0.0039)
8°
0°
COPLANARITY
0.10
SEATING
PLANE
0.51 (0.0201)
0.31 (0.0122)
1.27 (0.0500)
0.40 (0.0157)
0.33 (0.0130)
0.20 (0.0079)
COMPLIANT TO JEDEC STANDARDS MS-013-AA
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 15. 16-Lead Standard Small Outline Package [SOIC_W]
Wide Body
(RW-16)
Dimensions shown in millimeters (and inches)
ORDERING GUIDE
Model1
ADM3232EARNZ
ADM3232EARNZ-REEL7
ADM3232EARUZ
ADM3232EARUZ-REEL7
ADM3232EARWZ
ADM3232EARWZ-REEL
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Package Description
16-Lead SOIC_N
16-Lead SOIC_N
16-Lead TSSOP
16-Lead TSSOP
16-Lead SOIC_W
16-Lead SOIC_W
Package Option
R-16
R-16
RU-16
RU-16
RW-16
RW-16
1 Z = RoHS Compliant Part.
Rev. B | Page 10 of 12
55
ASMꢃ2ꢃ2ꢀ
NOTꢀE5
Rev. B | Page 11 of 12
ASMꢃ2ꢃ2ꢀ5
NOTꢀE5
5
©2006–2011 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D06410-0-4/11(B)
Rev. B | Page 12 of 12
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