ADM3307EACP [ADI]
15 kV ESD Protected, 2.7 V to 3.6 V Serial Port Transceivers with Green Idle⑩; 15千伏ESD保护， 2.7 V至3.6 V串行端口收发器与绿色Idle⑩
| 型号： | ADM3307EACP |
| 厂家： | 
ADI |
| 描述： | 15 kV ESD Protected, 2.7 V to 3.6 V Serial Port Transceivers with Green Idle⑩ |
| 文件： | 总16页 (文件大小：307K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
15 kV ESD Protected, 2.7 V to 3.6 V
a
Serial Port Transceivers with Green Idle™
ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E*
FEATURES
The active receiver can alert the processor, which can then take
the ADM33xxE device out of the shutdown mode.
Green Idle Power-Saving Mode
Single 2.7 V to 3.6 V Power Supply
Operates with 3 V Logic
0.1 ꢀF to 1 ꢀF Charge Pump Capacitors
Low EMI
The ADM3307E contains five drivers and three receivers and is
intended for mobile phone data lump cables and portable com-
puting applications.
The ADM3311E contains three drivers and five receivers and is
intended for serial port applications on notebook/laptop computers.
Low Power Shutdown: 20 nA
Full RS-232 Compliance
460 kbits/s Data Rate
The ADM3310E is a low current version of the ADM3311E. This
device also allows two receivers to be active in shutdown mode.
1 Receiver Active in Shutdown (2 for ADM3310E)
ESD >15 kV IEC 1000-4-2 on RS-232 I/Os (ADM33xxE)
ESD >15 kV IEC 1000-4-2 on CMOS and RS-232 I/Os
(ADM3307E)
The ADM3312E contains three drivers and three receivers and is
intended for serial port applications, PDAs, mobile phone data
lump cables, and other hand-held devices.
The ADM3315E is a low current version of the ADM3312E,
with a 22 kW receiver input resistance that reduces the drive
requirements of the DTE. Its main applications are PDAs,
palmtop computers, and mobile phone data lump cables.
APPLICATIONS
Mobile Phone Handsets/Data Cables
Laptop and Notebook Computers
Printers
Peripherals
Modems
The ADM33xxE devices are fabricated using CMOS technology
for minimal power consumption. All parts feature a high level
of overvoltage protection and latch-up immunity.
PDAs/Hand-Held Devices/Palmtop Computers
All ADM33xxE devices are available in a 32-lead 5 mm ¥ 5 mm
LFCSP package and in a TSSOP package (ADM3307E,
ADM3310E, and ADM3311E in a 28-lead TSSOP; ADM3312E
and ADM3315E in a 24-lead TSSOP). The ADM3311E also
comes in a 28-lead SSOP package.
GENERAL DESCRIPTION
The ADM33xxE line of driver/receiver products is designed to
fully meet the EIA-232 standard while operating with a single
2.7 V to 3.6 V power supply. The devices feature an on-board
charge pump dc-to-dc converter, eliminating the need for dual
power supplies. This dc-to-dc converter contains a voltage
tripler and a voltage inverter that internally generates positive
and negative supplies from the input 3 V power supply. The dc-
to-dc converter operates in Green Idle mode, whereby the charge
pump oscillator is gated ON and OFF to maintain the output
voltage at ±7.25 V under varying load conditions. This minimizes
the power consumption and makes these products ideal for
battery-powered portable devices.
The ADM33xxE devices are ruggedized RS-232 line drivers/
receivers that operate from a single supply of 2.7 V to 3.6 V.
Step-up voltage converters coupled with level shifting transmitters
and receivers allow RS-232 levels to be developed while operating
from a single supply. Features include low power consumption,
Green Idle operation, high transmission rates, and compatibility
with the EU directive on electromagnetic compatibility. This EM
compatibility directive includes protection against radiated and
conducted interference, including high levels of electrostatic
discharge.
The ADM33xxE devices are suitable for operation in harsh elec-
trical environments and contain ESD protection up to ±15 kV
on their RS-232 lines (ADM3310E, ADM3311E, ADM3312E,
and ADM3315E). The ADM3307E contains ESD protection
up to ±15 kV on all I/O lines (CMOS, RS-232, EN, and SD).
All RS-232 (and CMOS, SD, and EN for ADM3307E) inputs and
outputs are protected against electrostatic discharges (up to ±15 kV).
This ensures compliance with IEC 1000-4-2 requirements.
These devices are ideally suited for operation in electrically harsh
environments or where RS-232 cables are frequently being
plugged/unplugged. They are also immune to high RF field
strengths without special shielding precautions.
A shutdown facility that reduces the power consumption to
66 nW is also provided. While in shutdown, one receiver remains
active (two receivers active with ADM3310E), thereby allowing
monitoring of peripheral devices. This feature allows the device
to be shut down until a peripheral device begins communication.
Emissions are also controlled to within very strict limits. CMOS
technology is used to keep the power dissipation to an absolute
minimum, allowing maximum battery life in portable applications.
*Protected by U.S.Patent No. 5,606,491.
REV. G
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, norforanyinfringementsofpatentsorotherrightsofthirdpartiesthat
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700
Fax: 781/326-8703
www.analog.com
© 2004 Analog Devices, Inc. All rights reserved.
ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E
FUNCTIONAL BLOCK DIAGRAMS
C1
C1
C2
0.1ꢀF
0.1ꢀF
C4
0.1ꢀF
0.1ꢀF
Vꢁ
C3+
GND
C3–
C3
0.1ꢀF
C4
0.1ꢀF
Vꢁ
C2+
C3+
C1+
0.1ꢀF
VOLTAGE
TRIPLER/
INVERTER
ꢁ3V TO
ꢃ9V
V
CERAMIC
C2+
CC
C2
0.1ꢀF
V
CC
V
VOLTAGE
TRIPLER/
INVERTER
ꢁ3V TO
CC
ꢁ
V
C3
CC
C5
0.1ꢀF
10ꢀF
TANTALUM
ꢁ
C2ꢂ
C1ꢂ
EN
10ꢀF
TANTALUM
0.1ꢀF
0.1ꢀF
V–
C2ꢂ
EN
CERAMIC
C3–
V–
ꢃ9V
C1–
ENABLE
INPUT
ENABLE
INPUT
C5
0.1ꢀF
SHUTDOWN
INPUT
SD
C1+
GND
SD
SHUTDOWN
INPUT
T1
T2
T1
T1
T2
IN
OUT
T1
T2
T1
T2
T3
T1
T2
IN
OUT
CMOS
INPUTS
EIA/TIA-232
OUTPUTS
T2
T3
IN
IN
OUT
1
IN
OUT
OUT
T3
T3
CMOS
INPUTS
OUT
EIA/TIA-232
OUTPUTS
T3
T4
T3
T4
T5
IN
IN
IN
1
R1
R1
R2
R3
R4
R5
OUT
R1
R2
R3
R4
R5
IN
T4
T5
OUT
OUT
R2
R3
OUT
IN
IN
IN
T5
R1
EIA/TIA-232
CMOS
OUTPUTS
OUT
2
INPUTS
R1
R2
R3
R1
R2
R3
OUT
OUT
R4
R5
OUT
EIA/TIA-232
CMOS
OUTPUTS
R2
R3
OUT
2
OUT
OUT
INPUTS
OUT
IN
OUT
ADM3310E/
ADM3311E
ADM3307E
NOTES
1
NOTES
1
INTERNAL 400kꢄ PULL-UP RESISTOR ON EACH CMOS INPUT.
INTERNAL 5kꢄ PULL-DOWN RESISTOR ON EACH RS-232 INPUT.
INTERNAL 400kꢄ PULL-UP RESISTOR ON EACH CMOS INPUT.
INTERNAL 5kꢄ PULL-DOWN RESISTOR ON EACH RS-232 INPUT.
2
2
C1
0.1ꢀF
C4
0.1ꢀF
Vꢁ
C3+
GND
C3–
C3
0.1ꢀF
C2+
C2
0.1ꢀF
V
CC
VOLTAGE
TRIPLER/
INVERTER
ꢁ3V TO
V
CC
C5
0.1ꢀF
ꢁ
10ꢀF
TANTALUM
0.1ꢀF
CERAMIC
V–
C2ꢂ
EN
ꢃ9V
C1–
ENABLE
INPUT
SHUTDOWN
INPUT
SD
C1+
T1
T2
T1
T2
T3
T1
IN
OUT
CMOS
INPUTS
EIA/TIA-232
OUTPUTS
T2
IN
OUT
1
T3
T3
IN
OUT
R1
R1
R2
R3
OUT
R1
IN
EIA/TIA-232
R2
CMOS
OUTPUTS
R2
R3
OUT
IN
IN
2
INPUTS
OUT
R3
ADM3312E/
ADM3315E
NOTES
1
INTERNAL 400kꢄ PULL-UP RESISTOR ON EACH CMOS INPUT.
INTERNAL 5kꢄ (22kꢄ FOR ADM3315E) PULL-DOWN RESISTOR
ON EACH RS-232 INPUT.
2
REV. G
–2–
ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E
(V = 2.7 V to 3.6 V, C1–C5 = 0.1 ꢀF. All specifications TMIN to TMAX, unless otherwise noted.)
SPECIFICATIONS
CC
Parameter
Min
Typ
Max
Unit
Test Conditions/Comments
Operating Voltage Range
VCC Power Supply Current
ADM3307E
2.7
3.3
3.6
V
0.75
0.75
0.45
1.5
4.5
1
mA
mA
mA
VCC = 3.0 V to 3.6 V; No Load
VCC = 2.7 V to 3.6 V; No Load
No Load; VCC = 3.0 V to 3.6 V; TA = 0∞C
to 85∞C
ADM3311E, ADM3312E
0.45
0.35
4.5
mA
No Load; VCC = 2.7 V to 3.6 V; TA = – 40∞C
to +85∞C
VCC = 2.7 V to 3.6 V; No Load
RL = 3 kW to GND on all TOUTS
ADM3310E, ADM3315E
ADM3310E, ADM3311E,
ADM3312E, ADM3315E
0.85
35
mA
mA
Shutdown Supply Current
0.02
1
mA
Input Pull-Up Current
Input Leakage Current, SD, EN
Input Logic Threshold Low, VINL
10
0.02
25
mA
mA
V
V
V
TIN = GND
±1
0.8
0.4
TIN, EN, SHDN
TIN, EN, SHDN; VCC = 2.7 V
TIN, EN, SHDN
IOUT = 1.6 mA
IOUT = –200 mA
Input Logic Threshold High, VINH
CMOS Output Voltage Low, VOL
CMOS Output Voltage High, VOH
CMOS Output Leakage Current
ADM3307E
ADM3310E, ADM3311E
ADM3312E, ADM3315E
2.0
0.4
V
V
VCC – 0.6
0.04
0.05
±1
±5
mA
mA
EN = VCC, 0 V < ROUT < VCC
EN = VCC, 0 V < ROUT < VCC
Charge Pump Output Voltage, V+
ADM3307E, ADM3311E, ADM3312E
Charge Pump Output Voltage, V–
ADM3307E, ADM3311E, ADM3312E
Charge Pump Output Voltage, V+
ADM3310E, ADM3315E
+7.25
–7.25
+6.5
–6.5
V
V
V
V
No Load
No Load
No Load
No Load
Charge Pump Output Voltage, V–
ADM3310E, ADM3315E
EIA-232 Input Voltage Range
EIA-232 Input Threshold Low
EIA-232 Input Threshold High
EIA-232 Input Hysteresis
EIA-232 Input Resistance
ADM3307E, ADM3310E, ADM3311E,
ADM3312E
–25
0.4
+25
2.4
V
V
V
V
1.3
2.0
0.14
3
5
7
kW
kW
ADM3315E
14
22
31
REV. G
–3–
ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E
SPECIFICATIONS (continued)
Parameter
Min
Typ
Max
Unit
Test Conditions/Comments
Output Voltage Swing
ADM3310E, ADM3315E
±5.0
±5.5
V
All Transmitter Outputs Loaded with
3 kW to Ground
ADM3307E, ADM3311E, ADM3312
±5.0
±6.4
±5.5
V
V
(VCC = 3.0 V)
(VCC = 2.7 V)
All Transmitter Outputs Loaded with
3 kW to Ground
VCC = 0 V, VOUT = ±2 V
Transmitter Output Resistance
RS-232 Output Short Circuit Current
300
W
mA
±15
±60
Maximum Data Rate
ADM3307E
250
460
250
720
920
460
kbps
kbps
kbps
RL = 3 kW to 7 kW, CL = 50 pF to 1000 pF,
V
CC = 2.7 V
RL = 3 kW to 7 kW, CL = 50 pF to 1000 pF,
VCC = 3.0 V
RL = 3 kW to 7 kW, CL = 50 pF to 1000 pF,
VCC = 3.0 V
ADM3310E, ADM3311E, ADM3312E
ADM3315E
Receiver Propagation Delay, TPHL, TPLH
0.3
ms
CL = 150 pF
CL = 150 pF; ADM3307E Only
0.17
100
300
500
18
1
ms
Receiver Output Enable Time, tER
Receiver Output Disable Time, tDR
Transmitter Propagation Delay, TPHL, TPLH
Transition Region Slew Rate
ns
ns
ns
V/ms
RL = 3 kW, CL = 1000 pF
3
RL = 3 kW, CL = 50 pF to 1000 pF1
ESD PROTECTION (I/O PINS)
±15
±15
±8
kV
kV
kV
Human Body Model
IEC 1000-4-2 Air Discharge
IEC 1000-4-2 Contact Discharge2
NOTES
1Measured at +3 V to –3 V or –3 V to +3 V.
2Includes CMOS I/O, SD, and EN for ADM3307E.
Specification subject to change without notice.
ABSOLUTE MAXIMUM RATINGS*
(TA = 25∞C, unless otherwise noted)
Thermal Impedance, qJA
CP-32 LFCSP . . . . . . . . . . . . . . . . . . . . . . . . . . . 32.5∞C/W
RU-28 TSSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . 68.0∞C/W
RU-24 TSSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . 68.0∞C/W
RS-28 SSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . .76.0∞C/W
Operating Temperature Range
VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +4 V
V+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . (VCC – 0.3 V) to +9 V
V– . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –9 V
Input Voltages
TIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6 V
RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30 V
Output Voltages
TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±15 V
ROUT . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to (VCC + 0.3 V)
Short Circuit Duration
Industrial (A Version) . . . . . . . . . . . . . . . . . . –40∞C to +85∞C
Storage Temperature Range . . . . . . . . . . –65∞C to +150∞C
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . . . 300∞C
ESD Rating (IEC 1000-4-2 Air) (RS-232 I/Os) . . . . . . .±15 kV
ESD Rating (IEC 1000-4-2 Contact) (RS-232 I/Os) . . . .±8 kV
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operation
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
REV. G
–4–
ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E
PRODUCT SELECTION GUIDE
No. Rx
Active
in SD
ICC
Shutdown
Max*
Supply
Voltage
15 kV
ESD
ICC
Max
Generic
Tx
Rx
Speed
Additional Features
ADM3307E 2.7 V to 3.6 V
5
3
1
1 Mbps
RS-232
CMOS
EN and SD
1.5 mA 1 mA
±15 kV ESD Protection
CMOS on RS-232 and
CMOS I/Os including
SD and EN Pins.
ADM3310E 2.7 V to 3.6 V
3
5
2
460 kbps RS-232
0.85 mA 1 mA
2 Rxs Active in Shutdown.
Green Idle Mode
Level 6 V. Low power
ADM3311E.
ADM3311E 2.7 V to 3.6 V
ADM3312E 2.7 V to 3.6 V
ADM3315E 2.7 V to 3.6 V
3
3
3
5
3
3
1
1
1
460 kbps RS-232
460 kbps RS-232
460 kbps RS-232
1 mA
1 mA
0.85 mA 1 mA
1 mA
1 mA
22 kW Rx I/P
Resistance. Green Idle
Mode Level 6 V. Low power
ADM3312E.
*ICC Shutdown is 20 nA typically.
ORDERING GUIDE
Package Description
Model
Temperature Range
Package Option
ADM3307EARU
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
28-Lead Thin Shrink Small Outline (TSSOP)
Tape and Reel
RU-28
RU-28
RU-28
ADM3307EARU-REEL
ADM3307EARU-REEL7
ADM3307EACP
Tape and Reel
32-Lead 5 mm ¥ 5 mm Lead Frame Chip Scale Package (LFCSP)
CP-32-2
RU-28
RU-28
RU-28
RU-28
RU-28
CP-32-2
CP-32-2
CP-32-2
RS-28
ADM3307EACP-REEL
ADM3307EACP-REEL7
ADM3310EARU
ADM3310EARU-REEL
ADM3310EARU-REEL7
ADM3310EACP
ADM3310EACP-REEL
ADM3310EACP-REEL7
ADM3311EARS
ADM3311EARS-REEL
ADM3311EARS-REEL7
ADM3311EARZ*
Tape and Reel
Tape and Reel
28-Lead Thin Shrink Small Outline (TSSOP)
Tape and Reel
Tape and Reel
32-Lead 5 mm ¥ 5 mm Lead Frame Chip Scale Package (LFCSP)
Tape and Reel
Tape and Reel
28-Lead Shrink Small Outline (SSOP)
Tape and Reel
Tape and Reel
RS-28
RS-28
28-Lead Shrink Small Outline (SSOP)
RS-28
ADM3311EARZ-REEL*
ADM3311EARZ-REEL7*
ADM3311EARU
Tape and Reel
Tape and Reel
RS-28
RS-28
28-Lead Thin Shrink Small Outline (TSSOP)
RU-28
RU-28
RU-28
CP-32-2
RU-24
RU-24
RU-24
CP-32-2
CP-32-2
CP-32-2
RU-24
RU-24
RU-24
RU-24
RU-24
RU-24
CP-32-2
CP-32-2
CP-32-2
ADM3311EARU-REEL
ADM3311EARU-REEL7
ADM3311EACP
Tape and Reel
Tape and Reel
32-Lead 5 mm ¥ 5 mm Lead Frame Chip Scale Package (LFCSP)
ADM3312EARU
24-Lead Thin Shrink Small Outline (TSSOP)
ADM3312EARU-REEL
ADM3312EARU-REEL7
ADM3312EACP
Tape and Reel
Tape and Reel
32-Lead 5 mm ¥ 5 mm Lead Frame Chip Scale Package (LFCSP)
ADM3312EACP-REEL
ADM3312EACP-REEL7
ADM3315EARU
ADM3315EARU-REEL
ADM3315EARU-REEL7
ADM3315EARUZ*
ADM3315EARUZ-REEL* –40∞C to +85∞C
ADM3315EARUZ-REEL7* –40∞C to +85∞C
ADM3315EACP
Tape and Reel
Tape and Reel
24-Lead Thin Shrink Small Outline (TSSOP)
Tape and Reel
Tape and Reel
24-Lead Thin Shrink Small Outline (TSSOP)
Tape and Reel
Tape and Reel
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
32-Lead 5 mm ¥ 5 mm Lead Frame Chip Scale Package (LFCSP)
ADM3315EACP-REEL
ADM3315EACP-REEL7
Tape and Reel
Tape and Reel
*
Z = Pb-free part.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADM33xxE feature proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
REV. G
–5–
ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E
PIN CONFIGURATIONS
Vꢁ
1
2
3
4
5
6
7
8
9
28
C2ꢁ
V
27 C3ꢁ
CC
C2ꢂ
C1ꢂ
26
25
C1ꢁ
C3ꢂ
PIN 1
1
2
3
4
5
6
7
8
24 V–
23 GND
22 GND
EN
SD
NC
IDENTIFIER
EN
24 Vꢂ
ADM3307E
23
SD
GND
T1
21
20
19
18
17
T1
T2
T3
T4
IN
IN
IN
OUT
OUT
OUT
OUT
ADM3307E
T1
IN
T1
T2
T3
T4
T5
22
21
20
19
18
T2
T3
T4
OUT
OUT
OUT
OUT
OUT
TOP VIEW
(Not to Scale)
T2
IN
IN
IN
T5
TOP VIEW
(Not to Scale)
T5
OUT
T3
IN
T4 10
IN
T5
11
IN
R1
12
13
17 R1
OUT
IN
R2
R3
R2
R3
16
15
IN
OUT
14
IN
OUT
ADM3307E
Vꢁ
1
2
28
C3ꢁ
27 GND
C2ꢁ
V
3
26
25
24
23
22
21
20
C3ꢂ
Vꢂ
CC
C2ꢂ
4
PIN 1
IDENTIFIER
C1ꢂ
EN
C1ꢁ
T1
5
ADM3310E/
ADM3311E
1
2
3
4
5
6
7
8
24 C1–
EN
C1+
NC
23
SD
6
SD
T1
22
21
NC
ADM3310E/
ADM3311E
T1
T2
T3
T1
IN
IN
IN
OUT
OUT
OUT
7
IN
IN
IN
OUT
20 T2
19 T3
TOP VIEW
(Not to Scale
T2
T2
T3
8
OUT
OUT
R1
)
OUT
OUT
18
R1
IN
IN
TOP VIEW
(Not to Scale)
R2
T3
17 R2
9
10
11
19 R1
R1
IN
IN
IN
IN
OUT
R2
R2
R3
18
17
OUT
R3
R4
12
13
OUT
16 R4
15 R5
OUT
R5
14
OUT
IN
ADM3310E/ADM3311E
Vꢁ
1
2
3
4
5
6
7
8
9
24
C3ꢁ
GND
C3ꢂ
C2ꢁ
23
22
V
CC
C2ꢂ
EN
21 Vꢂ
PIN 1
1
2
3
4
5
6
7
8
24 C1–
EN
C1+
NC
T1
IN
IDENTIFIER
23
20 C1ꢂ
SD
ADM3312E/
ADM3315E
22
21
NC
ADM3312E/
ADM3315E
C1ꢁ
19
18
17
16
SD
T1
T1
OUT
OUT
OUT
T2
20 T2
19 T3
IN
T1
IN
OUT
T3
IN
TOP VIEW
(Not to Scale
)
NC
NC
18 NC
17 NC
T2
T2
IN
OUT
OUT
TOP VIEW
(Not to Scale)
T3
IN
T3
R1
10
15 R1
OUT
OUT
OUT
IN
IN
IN
R2
R3
R2
R3
11
12
14
13
ADM3312E/ADM3315E
–6–
REV. G
ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E
PIN FUNCTION DESCRIPTIONS
Mnemonic
Function
VCC
V+
Power Supply Input 2.7 V to 3.6 V.
Internally Generated Positive Supply, 7.25 V (6.5 V nominal for ADM3310E, ADM3315E). Capacitor C4 is
connected between VCC and V+.
V–
Internally Generated Positive Supply, –7.25 V (–6.5 V nominal for ADM3310E, ADM3315E). Capacitor C5 is
connected between GND and V–.
GND
Ground Pin. Must be connected to 0 V.
C1+, C1–
External Capacitor 1 is connected between these pins. A 0.1 mF capacitor is recommended, but larger capacitors
up to 1 mF may be used.
C2+, C2–
C3+, C3–
TIN
External Capacitor 2 is connected between these pins. A 0.1 mF capacitor is recommended, but larger capacitors
up to 1 mF may be used.
External Capacitor 3 is connected between these pins. A 0.1 mF capacitor is recommended, but larger capacitors
up to 1 mF may be used.
Transmitter (Driver) Inputs. These inputs accept TTL/CMOS levels. An internal 400 kW pull-up resistor to
VCC is connected on each input.
TOUT
RIN
Transmitter (Driver) Outputs. Typically ±5.5 V (±6.4 V for ADM3311E and ADM3312E)
Receiver Inputs. These inputs accept RS-232 signal levels. An internal 5 kW pull-down resistor (22 kW for ADM3315E)
to GND is connected on each of these inputs.
ROUT
EN
Receiver Outputs. These are TTL/CMOS levels.
Receiver Enable. A high level three-states all the receiver outputs.
SD
Shutdown Control. A high level disables the charge pump and reduces the quiescent current to less than 1 mA.
All transmitters and most receivers are disabled. One receiver remains active in shutdown (two receivers active
in shutdown for the ADM3310E).
• ADM3307E ROUT3 active in shutdown
• ADM3310E ROUT4 and ROUT5 active in shutdown
• ADM3311E ROUT5 active in shutdown
• ADM3312E ROUT3 active in shutdown
• ADM3315E ROUT3 active in shutdown
Table I. ADM3307E Truth Table
Table II. ADM3310E Truth Table
SD EN Status TOUT1–3 ROUT1–3
SD EN Status
TOUT1–5
ROUT1–2
ROUT
3
ROUT4–5
0
0
Normal
Enabled
Enabled
Enabled
0
0
Normal
Enabled
Enabled
Enabled
Operation
Normal
Operation
Operation
Receivers
Disabled
0
1
Enabled
Disabled
Disabled
0
1
Enabled
Disabled
Disabled
1
1
0
1
Shutdown Disabled
Shutdown Disabled
Disabled
Disabled
Enabled
Disabled
1
1
0
1
Shutdown Disabled
Shutdown Disabled
Disabled
Disabled
Enabled
Disabled
Table IV. ADM3312E/ADM3315E Truth Table
Table III. ADM3311 Truth Table
SD EN Status
TOUT1–3
ROUT1–2
ROUT3
SD EN Status
TOUT1–3
ROUT1–4
ROUT5
0
0
Normal
Enabled
Enabled
Enabled
0
0
Normal
Enabled
Enabled
Enabled
Operation
Normal
Operation
Operation
Receivers
Disabled
0
1
Enabled
Disabled
Disabled
0
1
Enabled
Disabled
Disabled
1
1
0
1
Shutdown Disabled
Shutdown Disabled
Disabled
Disabled
Enabled
Disabled
1
1
0
1
Shutdown Disabled
Shutdown Disabled
Disabled
Disabled
Enabled
Disabled
REV. G
–7–
ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E
Typical Performance Characteristics
9
T
HIGH
OUT
7
5
3
SD
Vꢁ
1
–1
–3
–5
–7
T
LOW
OUT
0
200
400
600
800
1000
LOAD CAPACITANCE – pF
TPC 1. Charge Pump V+ Exiting Shutdown
TPC 4. Transmitter Output vs. Load Capacitance
(VCC = 3.3 V, Data Rate = 460 kbps)
40
35
30
25
20
SD
15
10
5
Vꢂ
0
0
500
1000
1500
2000
2500
LOAD CAPACITANCE – pF
TPC 2. Charge Pump V– Exiting Shutdown
TPC 5. Slew Rate vs. Load Capacitance (VCC = 3.3 V)
9
7
25
20
15
10
5
V+
5
3
1
–1
–3
–5
–7
–9
V–
0
0
5
10
15
20
0
200
400
600
800
1000
1200
LOAD CURRENT – mA
LOAD CAPACITANCE – pF
TPC 3. Charge Pump V+, V– vs. Load Current
(VCC = 3.3 V)
TPC 6. Supply Current vs. Load Capacitance (RL = 3 kW)
(VCC = 3.3 V, Data Rate = 460 kbps)
REV. G
–8–
ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E
25
20
15
10
5
SD
TX O/P LOW
0
0
200
400
600
800
1000
1200
LOAD CAPACITANCE – pF
TCP 7. Supply Current vs. Load Capacitance (RL = Infinite)
(VCC = 3.3 V, Data Rate = 460 kbps)
TPC 10. Transmitter Output (Low) Exiting Shutdown
30
10
8
28
460kbps
26
6
24
4
250kbps
22
2
20
0
125kbps
18
16
14
12
10
–2
–4
–6
–8
–10
1000
800
0
200
400
600
0
200
400
600
800
1000
LOAD CAPACITANCE – pF
LOAD CAPACITANCE – pF
TPC 8. Supply Current vs. Load Capacitance
TPC 11. Transmitter Output Voltage High/Low vs. Load
(VCC = 3.3 V, RL = 5 kW)
Capacitance (VCC = 3.3 V, CLK = 1 Mb/s, RL = 5 kW, ADM3307E)
300
250
200
150
100
50
SD
TX O/P
HIGH
0
0
5
10
15
20
LOAD CURRENT – mA
TPC 9. Transmitter Output (High) Exiting Shutdown
TPC 12. Oscillator Frequency vs. Load Current
REV. G
–9–
ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E
25
20
15
10
5
600
500
400
300
200
100
0
0
2.6
2.6
2.8
3.0
3.2
– V
3.4
3.6
2.8
3.0
3.2
– V
3.4
3.6
V
CC
V
CC
TCP 13. ICC vs. VCC (Unloaded)
TPC 14. ICC vs. VCC (RL = 3 kW)
REV. G
–10–
ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E
CIRCUIT DESCRIPTION
phase, S8 and S9 are open, while S10 and S11 are closed. C3 is
connected across C5, whose positive terminal is grounded and
whose negative terminal is the V– output. Over several cycles,
The internal circuitry consists mainly of four sections. These
include the following:
C5 charges to –3 VCC
.
1. A charge pump voltage converter
2. 3.3 V logic to EIA-232 transmitters
3. EIA-232 to 3.3 V logic receivers
The V+ and V– supplies may also be used to power external
circuitry if the current requirements are small. Please refer to
TPC 3 in the Typical Performance Characteristics section.
4. Transient protection circuit on all I/O lines
What Is Green Idle?
Green Idle is a method of minimizing power consumption under
idle (no transmit) conditions while still maintaining the ability to
transmit data instantly.
Charge Pump DC-to-DC Voltage Converter
The charge pump voltage converter consists of a 250 kHz (300 kHz
for ADM3307E) oscillator and a switching matrix. The converter
generates a ±9 V supply from the input 3.0 V level. This is done
in two stages using a switched capacitor technique, as illustrated.
First, the 3.0 V input supply is tripled to 9.0 V using capacitor
C4 as the charge storage element. The +9.0 V level is then
inverted to generate –9.0 V using C5 as the storage element.
How Does it Work?
Charge pump type dc-to-dc converters used in RS-232 line drivers
normally operate open-loop, i.e., the output voltage is not regu-
lated in any way. Under light load conditions, the output voltage
is close to twice the supply voltage for a doubler and three times
the supply voltage for a tripler, with very little ripple. As the load
current increases, the output voltage falls and the ripple voltage
increases.
However, it should be noted that, unlike other charge pump dc-to-
dc converters, the charge pump on the ADM3307E does not run
open-loop. The output voltage is regulated to ±7.25 V (or ±6.5 V
for the ADM3310E and ADM3315E) by the Green Idle circuit
and never reaches ±9 V in practice. This saves power as well as
maintains a more constant output voltage.
Even under no-load conditions, the oscillator and charge pump
operate at a very high frequency with consequent switching losses
and current drain.
Green Idle works by monitoring the output voltage and maintain-
ing it at a constant value of around 7 V*. When the voltage rises
above 7.25 V** the oscillator is turned off. When the voltage falls
below 7 V*, the oscillator is turned on and a burst of charging
pulses is sent to the reservoir capacitor. When the oscillator is
turned off, the power consumption of the charge pump is virtu-
ally zero, so the average current drain under light load conditions
is greatly reduced.
V+ = 3V
+
CC
S1
S2
S3
S4
S6
V
CC
+
+
S5
C1
C2
C4
S7
GND
V
CC
V
CC
INTERNAL
OSCILLATOR
Figure 1. Charge Pump Voltage Tripler
The tripler operates in two phases. During the oscillator low
phase, S1 and S2 are closed and C1 charges rapidly to VCC
S3, S4, and S5 are open, and S6 and S7 are closed.
A block diagram of the Green Idle circuit is shown in Figure 3.
Both V+ and V– are monitored and compared to a reference
voltage derived from an on-chip band gap device. If either V+
or V– fall below 7 V*, the oscillator starts up until the
voltage rises above 7.25 V**.
.
During the oscillator high phase, S1 and S2 are open, and S3
and S4 are closed, so the voltage at the output of S3 is 2VCC
.
This voltage is used to charge C2. In the absence of any dis-
charge current, C2 charges up to 2VCC after several cycles.
During the oscillator high phase, as previously mentioned, S6
BAND GAP
V+ VOLTAGE
VOLTAGE
COMPARATOR
WITH 250mV
REFERENCE
HYSTERESIS
and S7 are closed, so the voltage at the output of S6 is 3VCC
.
This voltage is then used to charge C3. The voltage inverter
is illustrated in Figure 2.
START/STOP
V+
S8
S10
CHARGE
PUMP
TRANSCEIVERS
V+
GND
SHUTDOWN
FROM
VOLTAGE
TRIPLER
+
+
V–
C3
C5
S9
S11
V– = –(V+)
GND
START/STOP
INTERNAL
OSCILLATOR
V– VOLTAGE
COMPARATOR
WITH 250mV
HYSTERESIS
Figure 2. Charge Pump Voltage Inverter
During the oscillator high phase, S10 and S11 are open, while
S8 and S9 are closed. C3 is charged to 3VCC from the output of
the voltage tripler over several cycles. During the oscillator low
Figure 3. Block Diagram of Green Idle Circuit
NOTES
*For ADM3310E and ADM3315E, replace with 6.25 V.
**For ADM3310E and ADM3315E, replace with 6.5 V.
REV. G
–11–
ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E
The operation of Green Idle for V+ under various load conditions
is illustrated in Figure 4. Under light load conditions, C1 is
maintained in a charged condition, and only a single oscillator
pulse is required to charge up C2. Under these conditions, V+
may actually overshoot 7.25 V** slightly.
age; decreasing the load current decreases it. The ripple voltage
at light loads is naturally lower than that for high load currents.
Using Green Idle, the ripple voltage is determined by the high and
low thresholds of the Green Idle circuit. These are nominally 7 V*
and 7.25 V**, so the ripple is 250 mV under most load conditions.
With very light load conditions, there may be some overshoot
above 7.25 V**, so the ripple is slightly greater. Under heavy load
conditions where the output never reaches 7.25 V**, the Green Idle
circuitis inoperative and the ripple voltageis determined by the load
current, the same as in a normal charge pump.
OVERSHOOT
1
7.25V
V+
2
7V
OSC
What about Electromagnetic Compatibility?
LIGHT
LOAD
Green Idle does not operate with a constant oscillator frequency.
As a result, the frequency and spectrum of the oscillator signal vary
with load. Any radiated and conducted emissions also vary accord-
ingly. Like other Analog Devices RS-232 transceiver products, the
ADM33xxE devices feature slew rate limiting and other techniques
to minimize radiated and conducted emissions.
1
7.25V
V+
2
7V
OSC
MEDIUM
LOAD
Transmitter (Driver) Section
The drivers convert 3.3 V logic input levels into EIA-232 output
levels. With VCC = 3.0 V and driving an EIA-232 load, the output
voltage swing is typically ±6.4 V (or ±5.5 V for ADM3310E
and ADM3315E).
1
7.25V
V+
2
7V
OSC
Unused inputs may be left unconnected, as an internal 400 kV
pull-up resistor pulls them high forcing the outputs into a low
state. The input pull-up resistors typically source 8 mA when
grounded, so unused inputs should either be connected to VCC
or left unconnected in order to minimize power consumption.
HEAVY
LOAD
NOTES
1
FOR ADM3310E AND ADM3315E REPLACE WITH 6.5V.
FOR ADM3310E AND ADM3315E REPLACE WITH 6.25V.
2
Receiver Section
Figure 4. Operation of Green Idle under Various Load
Conditions
The receivers are inverting level shifters that accept RS-232 input
levels and translate them into 3.3 V logic output levels. The inputs
have internal 5 kW pull-down resistors (22 kW for the ADM3310E)
to ground and are also protected against overvoltages of up to ±30 V.
Unconnected inputs are pulled to 0 V by the internal 5 kW (or
22 kW for the ADM3315E) pull-down resistor. This, therefore,
results in a Logic 1 output level for unconnected inputs or for
inputs connected to GND.
Under medium load conditions, it may take several cycles for C2
to charge up to 7.25 V**. The average frequency of the oscillator
is higher because there are more pulses in each burst and the
bursts of pulses are closer together and more frequent.
Under high load conditions, the oscillator is on continuously if
the charge pump output cannot reach 7.25 V**.
Green Idle Versus Shutdown
Shutdown mode minimizes power consumption by shutting down
the charge pump altogether. In this mode, the switches in the
The receivers have Schmitt trigger inputs with a hysteresis level
of 0.14 V. This ensures error-free reception for both noisy inputs
and for inputs with slow transition times.
voltage tripler are configured so V+ is connected directly to VCC
.
V– is zero because there is no charge pump operation to charge C5.
This means there is a delay when coming out of Shutdown mode
before V+ and V– achieve their normal operating voltages. Green
Idle maintains the transmitter supply voltages under transmitter
idle conditions so this delay does not occur.
ENABLE AND SHUTDOWN
The enable function is intended to facilitate data bus connections
where it is desirable to three-state the receiver outputs. In the
disabled mode, all receiver outputs are placed in a high imped-
ance state. The shutdown function is intended to shut the device
down, thereby minimizing the quiescent current. In shutdown,
all transmitters are disabled. All receivers are shut down, except
for receiver R3 (ADM3307E, ADM3312E, and ADM3315E),
receiver R5 (ADM3311E), and receivers R4 and R5 (ADM3310E).
Note that disabled transmitters are not three-stated in shutdown,
so it is not permitted to connect multiple (RS-232) driver outputs
together.
Doesn’t it Increase Supply Voltage Ripple?
The ripple on the output voltage of a charge pump operating in
open-loop depends on three factors: the oscillator frequency, the
value of the reservoir capacitor, and the load current. The value of
the reservoir capacitor is fixed. Increasing the oscillator frequency
decreases the ripple voltage; decreasing the oscillator frequency
increases it. Increasing the load current increases the ripple volt-
The shutdown feature is very useful in battery-operated systems
since it reduces the power consumption to 66 nW. During shut-
down, the charge pump is also disabled. When exiting shutdown,
the charge pump is restarted and it takes approximately 100 ms
for it to reach its steady state operating conditions.
NOTES
*For ADM3310E and ADM3315E, replace with 6.25 V.
**For ADM3310E and ADM3315E, replace with 6.5 V.
REV. G
–12–
ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E
3V
The transmitter outputs and receiver inputs have a similar protec-
tion structure. The receiver inputs can also dissipate some of the
energy through the internal 5 kW (or 22 kW for the ADM3310E)
resistor to GND as well as through the protection diodes.
EN INPUT
0V
tDR
V
OH
V
– 0.1V
OH
RECEIVER
OUTPUT
V
+ 0.1V
RECEIVER
INPUT
OL
V
Rx
OL
D1
D2
Figure 5. Receiver Disable Timing
R
IN
3V
EN INPUT
Figure 7a. Receiver Input Protection Scheme
0V
tER
V
OH
3V
RECEIVER
OUTPUT
TRANSMITTER
Tx
0.4V
OUTPUT
D1
V
OL
Figure 6. Receiver Enable Timing
High Baud Rate
D2
The ADM33xxE features high slew rates, permitting data trans-
mission at rates well in excess of the EIA/RS-232E specifications.
RS-232 voltage levels are maintained at data rates up to 230 kbps
(460 kbps for ADM3307E) under worst-case loading conditions.
This allows for high speed data links between two terminals.
Figure 7b. Transmitter Output Protection Scheme
The ADM3307E protection scheme is slightly different (see
Figures 8a and 8b). The receiver inputs, transmitter inputs, and
transmitter outputs contain two back-to-back high speed clamping
diodes. The receiver outputs (CMOS outputs), SD and EN pins
contain a single reverse biased high speed clamping diode. Under
normal operation with maximum CMOS signal levels, the receiver
output, SD, and EN protection diodes have no effect because
they are reversed biased. If, however, the voltage exceeds about
15 V, reverse breakdown occurs and the voltage is clamped at
this level. If the voltage reaches –0.7 V, the diode is forward
biased and the voltage is clamped at this level. The receiver inputs
can also dissipate some of the energy through the internal 5 kW
resistor to GND as well as through the protection diodes.
LAYOUT AND SUPPLY DECOUPLING
Because of the high frequencies at which the ADM33xxE oscillator
operates, particular care should be taken with printed circuit
board layout, with all traces being as short as possible and C1 to
C3 being connected as close to the device as possible. The use
of a ground plane under and around the device is also highly
recommended.
When the oscillator starts up during Green Idle operation, large
current pulses are taken from VCC. For this reason, VCC should be
decoupled with a parallel combination of 10 mF tantalum and
0.1 mF ceramic capacitors, mounted as close to the VCC pin as
possible.
RECEIVER
INPUT
RECEIVER
OUTPUT
Rx
Capacitors C1 to C3 can have values between 0.1 mF and 1 mF.
Larger values give lower ripple. These capacitors can be either
electrolytic capacitors chosen for low equivalent series resistance
(ESR) or nonpolarized types, but the use of ceramic types is
highly recommended. If polarized electrolytic capacitors are
used, polarity must be observed (as shown by C1+).
D1
D2
D3
R
IN
Figure 8a. ADM3307E Receiver Input Protection Scheme
ESD/EFT TRANSIENT PROTECTION SCHEME
TRANSMITTER
OUTPUT
TRANSMITTER
INPUT
The ADM33xxE uses protective clamping structures on all inputs
and outputs that clamp the voltage to a safe level and dissipate
the energy present in ESD (electrostatic) and EFT (electrical fast
transients) discharges. A simplified schematic of the protection
structure is shown below in Figures 7a and 7b (see Figures 8a and
8b for ADM3307E protection structure). Each input and output
contains two back-to-back high speed clamping diodes. During nor-
mal operation with maximum RS-232 signal levels, the diodes have
no effect as one or the other is reverse biased depending on the
polarity of the signal. If however the voltage exceeds about ±50 V,
reverse breakdown occurs and the voltage is clamped at this level.
The diodes are large p-n junctions designed to handle the
instantaneous current surge that can exceed several amperes.
Tx
D3
D4
D1
D2
Figure 8b. ADM3307E Transmitter Output Protection Scheme
The protection structures achieve ESD protection up to ±15 kV on
all RS-232 I/O lines (and all CMOS lines, including SD and EN
for the ADM3307E). The methods used to test the protection
scheme are discussed later.
REV. G
–13–
ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E
ESD TESTING (IEC 1000-4-2)
IEC 1000-4-2 (previously 801-2) specifies compliance testing using
two coupling methods, contact discharge and air-gap discharge.
100
90
Contact discharge calls for a direct connection to the unit being
tested. Air-gap discharge uses a higher test voltage but does not
make direct contact with the unit under testing. With air discharge,
the discharge gun is moved toward the unit under testing, which
develops an arc across the air gap, thus the term air discharge.
36.8
This method is influenced by humidity, temperature, barometric
pressure, distance, and rate of closure of the discharge gun. The
contact discharge method, while less realistic, is more repeatable
10
and is gaining acceptance in preference to the air-gap method.
tDL
tRL
TIME t
Although very little energy is contained within an ESD pulse,
the extremely fast rise time coupled with high voltages can cause
failures in unprotected semiconductors. Catastrophic destruction
can occur immediately as a result of arcing or heating. Even if
catastrophic failure does not occur immediately, the device may
suffer from parametric degradation that may result in degraded
performance. The cumulative effects of continuous exposure can
eventually lead to complete failure.
Figure 10. Human Body Model ESD Current Waveform
100
90
I/O lines are particularly vulnerable to ESD damage. Simply
touching or plugging in an I/O cable can result in a static discharge
that can damage or completely destroy the interface product
connected to the I/O port. Traditional ESD test methods, such as
the MIL-STD-883B method 3015.7, do not fully test a product’s
susceptibility to this type of discharge. This test was intended to
test a product’s susceptibility to ESD damage during handling. Each
pin is tested with respect to all other pins. There are some impor-
tant differences between the traditional test and the IEC test:
10
0.1 TO 1ns
TIME t
30ns
60ns
Figure 11. IEC1000-4-2 ESD Current Waveform
(a) The IEC test is much more stringent in terms of discharge
energy. The peak current injected is over four times greater.
The ADM33xxE devices are tested using both of the previously
mentioned test methods. All pins are tested with respect to all
other pins as per the Human Body Model, ESD Assoc. Std. 55.1
specification. In addition, all I/O pins are tested as per the
IEC 1000-4-2 test specification. The products were tested under
the following conditions:
(b) The current rise time is significantly faster in the IEC test.
(c) The IEC test is carried out while power is applied to the device.
It is possible that the ESD discharge could induce latch-up in the
device under test. This test, therefore, is more representative of
a real world I/O discharge where the equipment is operating
normally with power applied. For maximum peace of mind,
however, both tests should be performed, ensuring maximum
protection both during handling and later during field service.
(a) Power-On—Normal Operation
(b) Power-Off
There are four levels of compliance defined by IEC 1000-4-2. The
ADM33xxE parts meet the most stringent compliance level for
both contact and air-gap discharge. This means the products are
able to withstand contact discharges in excess of 8 kV and air-
gap discharges in excess of 15 kV.
R2
R1
HIGH
VOLTAGE
GENERATOR
DEVICE
UNDER TEST
C1
Table V. IEC 1000-4-2 Compliance Levels
ESD TEST METHOD
R2
C1
Level
Contact Discharge (kV)
Air Discharge (kV)
HUMAN BODY MODEL
ESD ASSOC. STD 55.1
1.5kV
330V
100pF
150pF
1
2
3
4
2
4
6
8
2
4
8
15
IEC1000-4-2
Figure 9. ESD Test Standards
REV. G
–14–
ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E
OUTLINE DIMENSIONS
32-Lead Lead Frame Chip Scale Package [LFCSP]
(CP-32-2)
Dimensions shown in millimeters
5.00
BSC SQ
0.60 MAX
PIN 1
0.60 MAX
INDICATOR
25
24
32
1
PIN 1
INDICATOR
0.50
BSC
3.25
3.10 SQ
2.95
4.75
BSC SQ
TOP
VIEW
BOTTOM
VIEW
0.50
0.40
0.30
17
8
16
9
0.25 MIN
3.50 REF
0.80 MAX
0.65 TYP
12ꢅ MAX
0.05 MAX
0.02 NOM
1.00
0.85
0.80
0.30
0.23
0.18
COPLANARITY
0.08
0.20 REF
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
28-Lead Shrink Small Outline Package [SSOP]
(RS-28)
Dimensions shown in millimeters
10.50
10.20
9.90
28
15
14
5.60 8.20
5.30 7.80
5.00 7.40
1
1.85
1.75
1.65
0.10
COPLANARITY
2.00 MAX
0.25
0.09
8ꢅ
4ꢅ
0ꢅ
0.95
0.75
0.55
0.38
0.22
0.65
BSC
0.05
MIN
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MO-150AH
24-Lead Thin Shrink Small Outline Package [TSSOP]
28-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-24)
Dimensions shown in millimeters
(RU-28)
Dimensions shown in millimeters
7.90
7.80
7.70
9.80
9.70
9.60
24
13
12
28
15
14
4.50
4.40
4.30
4.50
4.40
4.30
6.40 BSC
6.40 BSC
1
1
PIN 1
PIN 1
0.65
BSC
1.20
MAX
0.65
BSC
1.20
0.15
0.05
MAX
0.15
0.05
0.75
0.60
0.45
8ꢅ
0ꢅ
0.75
0.60
0.45
8ꢅ
0ꢅ
0.30
0.19
0.30
0.19
0.20
0.09
0.20
0.09
SEATING
PLANE
COPLANARITY
0.10
SEATING
PLANE
0.10 COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-153AD
COMPLIANT TO JEDEC STANDARDS MO-153AE
REV. G
–15–
ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E
Revision History
Location
Page
4/04—Data Sheet changed from REV. F to REV. G
Changes to ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Updated OUTLINE DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
8/02—Data Sheet changed to REV. F
ADM3307E (REV. 0), ADM3311E (REV. E), and ADM3312E (REV. A)
data sheets merged into REV. G of ADM33xxE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . UNIVERSAL
ADM3310E (REV. PrA now prelims) and ADM3315E (REV. PrA) added . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . UNIVERSAL
Edits to FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Edits to APPLICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Edits to GENERAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Edits to FUNCTIONAL BLOCK DIAGRAMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Edits to SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
Edits to ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
ADM33xx PRODUCT SELECTION GUIDE added . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Added ADM3307E, ADM3310E, ADM3312E, and ADM3315E PIN CONFIGURATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Edits to PIN FUNCTION DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Added ADM3307E, ADM3310E, ADM3312E, and ADM3315E Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Edits to TPCs 1–14 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
TPCs 15–18 deleted . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Edits to CIRCUIT DESCRIPTION section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Edits to Charge Pump DC-to-DC Voltage Converter section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Edits to How Does It Work section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Edits to Green Idle vs. Shutdown section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Edits to Doesn’t It Increase Supply Voltage Ripple? section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Edits to What About Electromagnetic Compatibility? section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Edits to Transmitter (Driver) section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Edits to Receiver section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Edits to ENABLE AND SHUTDOWN section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Edits to High Baud Rate section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Edits to ESD/EFT TRANSIENT PROTECTION SCHEME . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Added Figures 8a and 8b and renumbered the figures that followed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Edits to ESD TESTING (IEC 1000-4-2) section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Edits to Figure 9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Deleted Table II and Table III and replaced them with Table V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Added RU-24 PACKAGE OUTLINE; updated CP-32, RS-28 and RU-28 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
REV. G
–16–
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