ADM489ANZ [ADI]

5 V, Slew-Rate Limited, Low Power, 250 kbps, Full Duplex EIA RS-485 Transceiver (with DE/RE);
ADM489ANZ
型号: ADM489ANZ
厂家: ADI    ADI
描述:

5 V, Slew-Rate Limited, Low Power, 250 kbps, Full Duplex EIA RS-485 Transceiver (with DE/RE)

文件: 总12页 (文件大小:215K)
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Full-Duplex, Low Power,  
Slew Rate Limited, EIA RS-485 Transceivers  
a
ADM488/ADM489  
FEATURES  
FUNCTIO NAL BLO CK D IAGRAMS  
Meets EIA RS-485 Standard  
250 kbps Data Rate  
Single +5 V ؎ 10% Supply  
–7 V to +12 V Bus Com m on-Mode Range  
12 kInput Im pedance  
2 kV EFT Protection Meets IEC1000-4-4  
High EM Im m unity Meets IEC1000-4-3  
Reduced Slew Rate for Low EM Interference  
Short Circuit Protection  
ADM488  
A
R
RO  
DI  
B
Z
Y
D
Excellent Noise Im m unity  
30 A Supply Current  
APPLICATIONS  
Low Pow er RS-485 System s  
DTE-DCE Interface  
ADM489  
Packet Sw itching  
Local Area Netw orks  
Data Concentration  
Data Multiplexers  
Integrated Services Digital Netw ork (ISDN)  
A
B
R
RO  
RE  
DE  
Z
Y
DI  
D
GENERAL D ESCRIP TIO N  
T he ADM488 and ADM489 are low power differential line  
transceiver suitable for communication on multipoint bus trans-  
mission lines.  
T he receiver contains a fail-safe feature that results in a logic  
high output state if the inputs are unconnected (floating).  
T he ADM488/ADM489 is fabricated on BiCMOS, an ad-  
vanced mixed technology process combining low power CMOS  
with fast switching bipolar technology.  
T hey are intended for balanced data transmission and comply  
with both EIA Standards RS-485 and RS-422. Both products  
contains a single differential line driver and a single differential  
line receiver making them suitable for full duplex data transfer.  
T he ADM488/ADM489 is fully specified over the industrial  
temperature range and is available in DIP, SOIC and T SSOP  
packages.  
T he ADM489 contains an additional receiver and driver enable  
control.  
T he input impedance is 12 k, allowing 32 transceivers to be  
connected on the bus.  
T he ADM488/ADM489 operates from a single +5 V ± 10%  
power supply. Excessive power dissipation caused by bus con-  
tention or by output shorting is prevented by a thermal shut-  
down circuit. T his feature forces the driver output into a high  
impedance state if during fault conditions a significant tempera-  
ture increase is detected in the internal driver circuitry.  
REV. 0  
Inform ation furnished by Analog Devices is believed to be accurate and  
reliable. However, no responsibility is assum ed by Analog Devices for its  
use, nor for any infringem ents of patents or other rights of third parties  
which m ay result from its use. No license is granted by im plication or  
otherwise under any patent or patent rights of Analog Devices.  
One Technology Way, P.O. Box 9106, Norw ood, MA 02062-9106, U.S.A.  
Tel: 617/ 329-4700  
Fax: 617/ 326-8703  
World Wide Web Site: http:/ / w w w .analog.com  
© Analog Devices, Inc., 1997  
(V = +5 V ؎ 10%. All specifications TMIN to TMAX unless  
CC  
otherwise noted)  
ADM488/ADM489–SPECIFICATIONS  
P aram eter  
Min  
Typ Max  
Units  
Test Conditions/Com m ents  
DRIVER  
Differential Output Voltage, VOD  
5.0  
5.0  
5.0  
5.0  
0.2  
3
0.2  
250  
250  
V
V
V
V
V
V
V
mA  
mA  
V
V
µA  
R = , Figure 1  
2.0  
1.5  
1.5  
VCC = 5 V, R = 50 (RS-422), Figure 1  
R = 27 (RS-485), Figure 1  
VT ST = –7 V to +12 V, Figure 2, VCC = 5 V ± 5%  
R = 27 or 50 , Figure 1  
R = 27 or 50 , Figure 1  
R = 27 or 50 Ω  
| VOD| for Complementary Output States  
Common-Mode Output Voltage VOC  
| VOC| for Complementary Output States  
Output Short Circuit Current (VOUT = High)  
Output Short Circuit Current (VOUT = Low)  
CMOS Input Logic T hreshold Low, VINL  
CMOS Input Logic T hreshold High, VINH  
Logic Input Current (DE, DI)  
–7 V VO +12 V  
–7 V VO +12 V  
1.4  
1.4  
0.8  
2.0  
±1.0  
RECEIVER  
Differential Input T hreshold Voltage, VT H  
Input Voltage Hysteresis, VT H  
Input Resistance  
–0.2  
12  
+0.2  
V
–7 V VCM +12 V  
VCM = 0 V  
–7 V VCM +12 V  
VIN = 12 V  
70  
mV  
kΩ  
mA  
mA  
µA  
V
V
mA  
µA  
Input Current (A, B)  
+1  
–0.8  
±1  
VIN = –7 V  
Logic Enable Input Current (RE)  
CMOS Output Voltage Low, VOL  
CMOS Output Voltage High, VOH  
Short Circuit Output Current  
0.4  
IOUT = +4.0 mA  
IOUT = –4.0 mA  
VOUT = GND or VCC  
0.4 V VOUT +2.4 V  
4.0  
7
85  
±1.0  
T hree-State Output Leakage Current  
POWER SUPPLY CURRENT  
ICC  
Outputs Unloaded, Receivers Enabled  
DE = 0 V (Disabled)  
DE = 5 V (Enabled)  
30  
37  
60  
74  
µA  
µA  
Specifications subject to change without notice.  
TIMING SPECIFICATIONS (V = +5 V ؎ 10%. All specifications TMIN to TMAX unless otherwise noted)  
CC  
P aram eter  
Min  
Typ Max  
Units  
Test Conditions/Com m ents  
DRIVER  
Propagation Delay Input to Output T PLH, T PHL 250  
Driver O/P to O/P TSKEW  
2000  
800  
2000  
2000  
3000  
ns  
ns  
ns  
ns  
ns  
kbps  
RL Diff = 54 , CL1 = CL2 = 100 pF, Figure 5  
RL Diff = 54 , CL1 = CL2 = 100 pF, Figure 5  
RL Diff = 54 , CL1 = CL2 = 100 pF, Figure 5  
RL = 500 , CL = 100 pF, Figure 2  
100  
Driver Rise/Fall T ime T R, T F  
Driver Enable to Output Valid  
Driver Disable T iming  
Data Rate  
250  
250  
300  
250  
RL = 500 , CL = 15 pF, Figure 2  
RECEIVER  
Propagation Delay Input to Output T PLH, T PHL 250  
Skew | T PLH–T PHL  
2000  
ns  
ns  
ns  
ns  
CL = 15 pF, Figure 5  
|
100  
10  
10  
Receiver Enable T EN1  
Receiver Disable T EN2  
Data Rate  
50  
50  
RL = 1 k, CL = 15 pF, Figure 4  
RL = 1 k, CL = 15 pF, Figure 4  
250  
kbps  
Specifications subject to change without notice.  
–2–  
REV. 0  
ADM488/ADM489  
Power Dissipation 16-Lead T SSOP . . . . . . . . . . . . . . 800 mW  
θJA, T hermal Impedance . . . . . . . . . . . . . . . . . . . 150°C/W  
Operating T emperature Range  
Industrial (A Version) . . . . . . . . . . . . . . . –40°C to +85°C  
Storage T emperature Range . . . . . . . . . . . . –65°C to +150°C  
Lead T emperature (Soldering, 10 secs) . . . . . . . . . . . +300°C  
Vapor Phase (60 secs) . . . . . . . . . . . . . . . . . . . . . . +215°C  
Infrared (15 secs) . . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C  
ESD Rating, MIL-ST D-883B . . . . . . . . . . . . . . . . . . . . . 4 kV  
EFT Rating, IEC1000-4-4 . . . . . . . . . . . . . . . . . . . . . . . 2 kV  
ABSO LUTE MAXIMUM RATINGS*  
(T A = +25°C unless otherwise noted)  
VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7 V  
Inputs  
Driver Input (DI) . . . . . . . . . . . . . . . –0.3 V to VCC + 0.3 V  
Control Inputs (DE, RE) . . . . . . . . . –0.3 V to VCC + 0.3 V  
Receiver Inputs (A, B) . . . . . . . . . . . . . . . . –14 V to +14 V  
Outputs  
Driver Outputs . . . . . . . . . . . . . . . . . . . . . –14 V to +12.5 V  
Receiver Output . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V  
Power Dissipation 8-Lead DIP . . . . . . . . . . . . . . . . . 700 mW  
*Stresses above those listed under Absolute Maximum Ratings may cause perma-  
nent damage to the device. T his is a stress rating only; functional operation of the  
device at these or any other conditions above those listed in the operational  
sections of this specification is not implied. Exposure to absolute maximum ratings  
for extended periods of time may affect device reliability.  
θ
JA, T hermal Impedance . . . . . . . . . . . . . . . . . . . 120°C/W  
Power Dissipation 8-Lead SOIC . . . . . . . . . . . . . . . . 520 mW  
JA, T hermal Impedance . . . . . . . . . . . . . . . . . . . 110°C/W  
Power Dissipation 14-Lead DIP . . . . . . . . . . . . . . . . 800 mW  
JA, T hermal Impedance . . . . . . . . . . . . . . . . . . . 140°C/W  
Power Dissipation 14-Lead SOIC . . . . . . . . . . . . . . . 800 mW  
JA, T hermal Impedance . . . . . . . . . . . . . . . . . . . 120°C/W  
θ
θ
θ
O RD ERING GUID E  
Model  
Tem perature Range  
P ackage D escription  
P ackage O ption  
ADM488AR  
ADM488AN  
–40°C to +85°C  
–40°C to +85°C  
8-Lead Narrow Body (SOIC)  
8-Lead Plastic DIP  
SO-8  
N-8  
ADM489AN  
ADM489AR  
ADM489ARU  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
14-Lead Plastic DIP (Narrow)  
14-Lead Narrow Body (SOIC)  
16-Lead T hin Shrink Small Outline Package (T SSOP)  
N-14  
R-14  
RU-16  
REV. 0  
–3–  
ADM488/ADM489  
AD M488 P IN FUNCTIO N D ESCRIP TIO NS  
P IN CO NFIGURATIO NS  
8-Lead D IP /SO  
P in Mnem onic Function  
1
2
VCC  
RO  
Power Supply, 5 V ± 10%.  
Receiver Output. When A > B by 200 mV,  
RO = high. If A < B by 200 mV, RO = low.  
V
1
2
3
4
8
7
6
5
A
B
Z
CC  
ADM488  
TOP VIEW  
(Not to Scale)  
RO  
DI  
3
DI  
Driver Input. A logic Low on DI forces Y low  
and Z high while a logic High on DI forces Y  
high and Z low.  
GND  
Y
4
5
6
7
8
GND  
Ground Connection, 0 V  
Y
Z
Noninverting Driver, Output Y  
Inverting Driver, Output Z  
Inverting Receiver Input B  
Noninverting Receiver Input A  
14-Lead D IP /SO  
B
A
1
2
3
4
5
6
7
14  
13  
12  
11  
10  
9
NC  
RO  
V
CC  
NC  
A
AD M489 P IN FUNCTIO N D ESCRIP TIO NS  
D IP /SO IC TSSO P  
RE  
ADM489  
DE  
B
TOP VIEW  
(Not to Scale)  
Z
DI  
P in  
P in  
Mnem onic Function  
Y
GND  
GND  
1, 8, 13  
2, 9, 10, NC  
13, 16  
No Connect. No connections  
are required to this pin.  
NC  
8
NC = NO CONNECT  
2
3
3
RO  
Receiver Output. When  
enabled if A > B by 200 mV  
then RO = high. If A < B by  
200 mV then RO = low.  
16-Lead TSSO P  
4
RE  
Receiver Output Enable. A  
low level enables the receiver  
output, RO. A high level  
places it in a high impedance  
state.  
1
2
3
4
5
6
7
8
16  
15  
14  
V
NC  
A
CC  
NC  
RO  
B
ADM489  
RE  
13 NC  
4
5
5
6
DE  
DI  
Driver Output Enable. A  
high level enables the driver  
differential outputs, Y and Z.  
A low level places it in a high  
impedance state.  
TOP VIEW  
(Not to Scale)  
DE  
12  
11  
10  
9
Z
Y
DI  
NC  
NC  
GND  
GND  
Driver Input. When the  
NC = NO CONNECT  
driver is enabled, a logic Low  
on DI forces Y low and Z  
high, while a logic High on  
DI forces Y high and Z low.  
6, 7  
9
7, 8  
11  
GND  
Y
Ground Connection, 0 V  
Noninverting Driver  
Output Y  
10  
11  
12  
12  
14  
15  
Z
B
A
Inverting Driver Output Z  
Inverting Receiver Input B  
Noninverting Receiver  
Input A  
14  
1
VCC  
Power Supply, 5 V ± 10%.  
–4–  
REV. 0  
ADM488/ADM489  
Test Circuits  
V
CC  
A
B
R
R
R
L
S1  
S2  
0V OR 3V  
DE IN  
V
OD  
DE  
C
V
L
V
OC  
OUT  
Figure 1. Driver Voltage Measurem ent Test Circuit  
Figure 3. Driver Voltage Measurem ent Test Circuit 2  
V
375  
CC  
+1.5V  
R
S1  
L
S2  
V
60⍀  
375⍀  
V
TST  
OD3  
RE  
–1.5V  
C
V
L
OUT  
RE IN  
Figure 4. Receiver Enable/Disable Test Circuit  
Figure 2. Driver Enable/Disable Test Circuit  
+3V  
DE  
Y
A
C
C
L1  
RO  
R
DI  
D
RL  
DIFF  
B
L2  
RE  
Z
Figure 5. Driver/Receiver Propagation Delay Test Circuit  
REV. 0  
–5–  
ADM488/ADM489  
Switching Characteristics  
3V  
3V  
0V  
1.5V  
1.5V  
1.5V  
LZ  
DE  
A, B  
A, B  
1.5V  
T
PLH  
0V  
B
T
PHL  
T
ZL  
T
T
1/2VO  
VO  
2.3V  
2.3V  
A
V
+ 0.5V  
OL  
T
T
SKEW  
SKEW  
V
V
OL  
+VO  
T
90% POINT  
ZH  
HZ  
90% POINT  
OH  
0V  
V
– 0.5V  
OH  
10% POINT  
10% POINT  
–VO  
T
T
F
0V  
R
Figure 6. Driver Propagation Delay, Rise/Fall Tim ing  
Figure 8. Driver Enable/Disable Tim ing  
3V  
1.5V  
1.5V  
LZ  
RE  
0V  
0V  
0V  
A–B  
T
T
ZL  
T
T
PHL  
R
1.5V  
1.5V  
PLH  
V
+ 0.5V  
O/P LOW  
O/P HIGH  
OL  
V
V
OH  
V
OL  
T
T
HZ  
ZH  
RO  
1.5V  
1.5V  
V
OH  
V
– 0.5V  
OL  
OH  
R
0V  
Figure 7. Receiver Propagation Delay  
Figure 9. Receiver Enable/Disable Tim ing  
–6–  
REV. 0  
Typical Performance Characteristics–  
ADM488/ADM489  
40  
35  
30  
25  
20  
15  
10  
5
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
0
–5  
–10  
–15  
–20  
0
0
0.5  
1.0  
1.5  
2.0  
2.5  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0  
OUTPUT VOLTAGE – Volts  
OUTPUT VOLTAGE – Volts  
OUTPUT VOLTAGE – Volts  
Figure 12. Driver Output Low  
Voltage vs. Output Current  
Figure 10. Receiver Output Low  
Voltage vs. Output Current  
Figure 11. Receiver Output High  
Voltage vs. Output Current  
80  
70  
60  
50  
40  
30  
20  
10  
0
0
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
T
T
100  
90  
RO  
DI  
T
10  
0%  
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5  
OUTPUT VOLTAGE – Volts  
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0  
OUTPUT VOLTAGE – Volts  
Figure 15. Driving 4000 ft. of Cable  
Figure 13. Driver Output High  
Voltage vs. Output Current  
Figure 14. Driver Differential Output  
Voltage vs. Output Current  
80  
70  
80  
70  
60  
50  
LIMIT  
100  
90  
60  
50  
40  
30  
20  
10  
0
40  
30  
20  
10  
0
LIMIT  
10dB/DIV  
10  
0%  
0
500kHz/DIV  
5MHz  
0.3 0.6  
1
3
6
10  
30  
30  
200  
FREQUENCY – MHz  
LOG FREQUENCY (0.15–30) – MHz  
Figure 18. Conducted Em issions  
Figure 16. Driver Output Waveform  
and FFT Plot Transm itting @ 150 kHz  
Figure 17. Radiated Em issions  
REV. 0  
–7–  
ADM488/ADM489  
GENERAL INFO RMATIO N  
T he ADM488/ADM489 is a ruggedized RS-485 transceiver that  
operates from a single +5 V supply.  
T ables I and II show the truth tables for transmitting and  
receiving.  
Table I. Transm itting Truth Table  
It contains protection against radiated and conducted interference.  
Inputs  
D E  
O utputs  
It is ideally suited for operation in electrically harsh environ-  
ments or where cables may be plugged/unplugged. It is also  
immune to high RF field strengths without special shielding  
precautions. It is intended for balanced data transmission and  
complies with both EIA Standards RS-485 and RS-422. It con-  
tains a differential line driver and a differential line receiver, and  
is suitable for full duplex data transmission.  
RE  
D I  
Z
Y
X
X
0
1
1
0
0
1
0
X
X
0
1
1
0
Hi-Z  
Hi-Z  
Hi-Z  
Hi-Z  
1
X = Dont Care.  
T he input impedance on the ADM488/ADM489 is 12 k,  
allowing up to 32 transceivers on the differential bus.  
Table II. Receiving Truth Table  
Inputs  
T he ADM488/ADM489 operates from a single +5 V ± 10%  
power supply. Excessive power dissipation caused by bus con-  
tention or by output shorting is prevented by a thermal shut-  
down circuit. T his feature forces the driver output into a high  
impedance state if, during fault conditions, a significant tem-  
perature increase is detected in the internal driver circuitry.  
O utput  
RO  
RE  
D E  
A-B  
0
0
0
1
0
1
0
0
+0.2 V  
+0.2 V  
Inputs O/C  
X
1
0
1
Hi-Z  
T he receiver contains a fail-safe feature that results in a logic  
high output state if the inputs are unconnected (floating).  
X = Dont Care.  
A high level of robustness is achieved using internal protection  
circuitry, eliminating the need for external protection compo-  
nents such as tranzorbs or surge suppressors.  
EFT TRANSIENT P RO TECTIO N SCH EME  
T he ADM488/ADM489 uses protective clamping structures on  
its inputs and outputs that clamp the voltage to a safe level and  
dissipates the energy present in ESD (Electrostatic) and EFT  
(Electrical Fast T ransients) discharges.  
Low electromagnetic emissions are achieved using slew limited  
drivers, minimizing interference both conducted and radiated.  
T he ADM488/ADM489 can transmit at data rates up to  
250 kbps.  
FAST TRANSIENT BURST IMMUNITY (IEC1000-4-4)  
IEC1000-4-4 (previously 801-4) covers electrical fast-transient/  
burst (EFT ) immunity. Electrical fast transients occur as a  
result of arcing contacts in switches and relays. T he tests simu-  
late the interference generated when, for example, a power relay  
disconnects an inductive load. A spark is generated due to the  
well known back EMF effect. In fact, the spark consists of a  
burst of sparks as the relay contacts separate. T he voltage ap-  
pearing on the line, therefore, consists of a burst of extremely  
fast transient impulses. A similar effect occurs when switching  
on fluorescent lights.  
A typical application for the ADM488/ADM489 is illustrated in  
Figure 19. T his shows a full-duplex link where data may be  
transferred at rates up to 250 kbps. A terminating resistor is  
shown at both ends of the link. T his termination is not critical  
since the slew rate is controlled by the ADM488/ADM489 and  
reflections are minimized.  
T he communications network may be extended to include  
multipoint connections as shown in Figure 25. Up to 32 trans-  
ceivers may be connected to the bus.  
+5V  
+5V  
0.1F  
0.1F  
V
V
CC  
DE  
CC  
RE  
A
Y
DI  
RO  
R
D
B
Z
ADM488  
RS-485/RS-422 LINK  
ADM489  
Z
Y
B
DI  
RO  
R
D
A
RE  
DE  
GND  
GND  
Figure 19. ADM488/ADM489 Full-Duplex Data Link  
–8–  
REV. 0  
ADM488/ADM489  
T he fast transient burst test, defined in IEC1000-4-4, simulates  
this arcing and its waveform is illustrated in Figure 20. It  
consists of a burst of 2.5 kH z to 5 kH z transients repeating at  
300 ms intervals. It is specified for both power and data lines.  
C
L
R
M
D
R
HIGH  
VOLTAGE  
SOURCE  
C
50  
OUTPUT  
Z
C
S
C
Four severity levels are defined in terms of an open-circuit volt-  
age as a function of installation environment. T he installation  
environments are defined as  
Figure 21. EFT Generator  
T est results are classified according to the following:  
1. Normal performance within specification limits.  
2. T emporary degradation or loss of performance that is self-  
recoverable.  
3. T emporary degradation or loss of function or performance  
that requires operator intervention or system reset.  
4. Degradation or loss of function that is not recoverable due to  
damage.  
1. Well-protected  
2. Protected  
3. T ypical Industrial  
4. Severe Industrial  
V
T he ADM488/ADM489 has been tested under worst case con-  
ditions using unshielded cables, and meets Classification 2 at  
severity Level 4. Data transmission during the transient condi-  
tion is corrupted, but it may be resumed immediately following  
the EFT event without user intervention.  
t
300ms  
16ms  
V
5ns  
RAD IATED IMMUNITY (IEC1000-4-3)  
IEC1000-4-3 (previously IEC801-3) describes the measurement  
method and defines the levels of immunity to radiated electro-  
magnetic fields. It was originally intended to simulate the elec-  
tromagnetic fields generated by portable radio transceivers or  
any other device that generates continuous wave radiated electro-  
magnetic energy. Its scope has since been broadened to include  
spurious EM energy, which can be radiated from fluorescent  
lights, thyristor drives, inductive loads, etc.  
50ns  
t
0.2/0.4ms  
Figure 20. IEC1000-4-4 Fast Transient Waveform  
T able III shows the peak voltages for each of the environments.  
T esting for immunity involves irradiating the device with an EM  
field. T here are various methods of achieving this including use  
of anechoic chamber, stripline cell, T EM cell and GT EM cell.  
T hese consist essentially of two parallel plates with an electric  
field developed between them. T he device under test is placed  
between the plates and exposed to the electric field. T here are  
three severity levels having field strengths ranging from 1 V to  
10 V/m. Results are classified as follows:  
Table III.  
VP EAK (kV)  
P SU  
VP EAK (kV)  
I-O  
Level  
1
2
3
4
0.5  
1
2
0.25  
0.5  
1
1. Normal Operation.  
4
2
2. T emporary Degradation or loss of function that is self-  
recoverable when the interfering signal is removed.  
A simplified circuit diagram of the actual EFT generator is  
illustrated in Figure 21.  
3. T emporary degradation or loss of function that requires  
operator intervention or system reset when the interfering  
signal is removed.  
T hese transients are coupled onto the signal lines using an EFT  
coupling clamp. T he clamp is 1 m long and completely sur-  
rounds the cable, providing maximum coupling capacitance  
(50 pF to 200 pF typ) between the clamp and the cable. High  
energy transients are capacitively coupled onto the signal lines.  
Fast rise times (5 ns) as specified by the standard result in very  
effective coupling. T his test is very severe since high voltages are  
coupled onto the signal lines. T he repetitive transients can often  
cause problems, where single pulses do not. Destructive latchup  
may be induced due to the high energy content of the transients.  
Note that this stress is applied while the interface products are  
powered up and are transmitting data. T he EFT test applies  
hundreds of pulses with higher energy than ESD. Worst case  
transient current on an I-O line can be as high as 40 A.  
4. Degradation or loss of function that is not recoverable due to  
damage.  
REV. 0  
–9–  
ADM488/ADM489  
T he ADM488/ADM489 comfortably meets Classification 1 at  
the most stringent (Level 3) requirement. In fact, field strengths  
up to 30 V/m showed no performance degradation and error-  
free data transmission continued even during irradiation.  
CO ND UCTED EMISSIO NS  
T his is a measure of noise that is conducted onto the mains  
power supply. T he noise is measured using a LISN (Linc Im-  
pedance Stabilizing Network) and a spectrum analyzer. T he test  
setup is illustrated in Figure 23. T he spectrum analyzer is set to  
scan the spectrum from 0 MHz to 30 MHz. Figure 24 shows  
that the level of conducted emissions from the ADM488/  
ADM489 are well below the allowable limits.  
Table IV.  
Level  
V/m  
Field Strength  
1
2
3
1
3
10  
SPECTRUM  
ANALYZER  
DUT  
LISN  
PSU  
EMI EMISSIO NS  
T he ADM488/ADM489 contains internal slew rate limiting in  
order to minimize the level of electromagnetic interference  
generated. Figure 22 shows an FFT plot when transmitting a  
150 kHz data stream.  
Figure 23. Conducted Em issions Test Setup  
80  
70  
LIMIT  
60  
50  
40  
30  
20  
10  
0
100  
90  
10dB/DIV  
10  
0%  
0.3 0.6  
1
3
6
10  
30  
0
500kHz/DIV  
5MHz  
LOG FREQUENCY (0.15–30) – MHz  
Figure 22. Driver Output Waveform and FFT Plot Trans-  
m itting @ 150 kHz  
Figure 24. Conducted Em issions  
As may be seen, the slew limiting attenuates the high frequency  
components. EMI is therefore reduced, as are reflections due to  
improperly terminated cables.  
EN55022, CISPR22 defines the permitted limits of radiated  
and conducted interference from Information T echnology  
Equipment (IT E).  
T he objective is to control the level of emissions, both con-  
ducted and radiated.  
For ease of measurement and analysis, conducted emissions are  
assumed to predominate below 30 MHz, while radiated emis-  
sions predominate above this frequency.  
–10–  
REV. 0  
ADM488/ADM489  
AP P LICATIO NS INFO RMATIO N  
D iffer ential D ata Tr ansm ission  
Cable and D ata Rate  
T he transmission line of choice for RS-485 communications is a  
twisted pair. T wisted pair cable tends to cancel common mode  
noise and also causes cancellation of the magnetic fields gener-  
ated by the current flowing through each wire, thereby reducing  
the effective inductance of the pair.  
Differential data transmission is used to reliably transmit data  
at high rates over long distances and through noisy environ-  
ments. Differential transmission nullifies the effects of ground  
shifts and noise signals, which appear as common-mode volt-  
ages on the line. T wo main standards are approved by the  
Electronics Industries Association (EIA), which specify the  
electrical characteristics of transceivers used in differential  
data transmission.  
T he ADM488/ADM489 is designed for bidirectional data com-  
munications on multipoint transmission lines. A typical applica-  
tion showing a multipoint transmission network is illustrated in  
Figure 25. An RS-485 transmission line can have as many as  
32 transceivers on the bus. Only one driver can transmit at  
a particular time but multiple receivers may simultaneously  
be enabled.  
T he RS-422 standard specifies data rates up to 10 MBaud and  
line lengths up to 4000 ft. A single driver can drive a transmis-  
sion line with up to 10 receivers.  
In order to cater to true multipoint communications, the RS-  
485 standard was defined. T his standard meets or exceeds all  
the requirements of RS-422 and also allows for up to 32 drivers  
and 32 receivers to be connected to a single bus. An extended  
common-mode range of –7 V to +12 V is defined. T he most  
significant difference between RS-422 and RS-485 is the fact  
that the drivers may be disabled thereby allowing more than  
one (32, in fact) to be connected to a single line. Only one  
driver should be enabled at a time but the RS-485 standard  
contains additional specifications to guarantee device safety in  
the event of line contention.  
As with any transmission line, it is important that reflections are  
minimized. T his may be achieved by terminating the extreme  
ends of the line using resistors equal to the characteristic imped-  
ance of the line. Stub lengths of the main line should also be  
kept as short as possible. A properly terminated transmission  
line appears purely resistive to the driver.  
Table V. Com parison of RS-422 and RS-485 Interface Standards  
Specification  
RS-422  
RS-485  
T ransmission T ype  
Maximum Data Rate  
Maximum Cable Length  
Minimum Driver Output Voltage  
Driver Load Impedance  
Differential  
10 MB/s  
4000 ft.  
±2 V  
Differential  
10 MB/s  
4000 ft.  
±1.5 V  
54 Ω  
100 Ω  
Receiver Input Resistance  
Receiver Input Sensitivity  
Receiver Input Voltage Range  
Number of Drivers/Receivers Per Line  
4 kmin  
±200 mV  
–7 V to +7 V  
1/10  
12 kmin  
±200 mV  
–7 V to +12 V  
32/32  
RT  
RT  
D
D
R
R
R
R
D
D
Figure 25. Typical RS-485 Network  
REV. 0  
–11–  
ADM488/ADM489  
O UTLINE D IMENSIO NS  
D imensions shown in inches and (mm).  
8-Lead Narrow Body (SO IC)  
14-Lead P lastic D IP  
(N-14)  
(SO -8)  
0.1968 (5.00)  
0.1890 (4.80)  
0.795 (20.19)  
0.725 (18.42)  
14  
1
8
7
0.280 (7.11)  
0.240 (6.10)  
8
1
5
4
0.1574 (4.00)  
0.1497 (3.80)  
0.2440 (6.20)  
0.2284 (5.80)  
0.325 (8.25)  
0.300 (7.62)  
0.195 (4.95)  
0.115 (2.93)  
0.060 (1.52)  
0.015 (0.38)  
PIN 1  
PIN 1  
0.0688 (1.75)  
0.0532 (1.35)  
0.210 (5.33)  
MAX  
0.0196 (0.50)  
0.0099 (0.25)  
x 45°  
0.0098 (0.25)  
0.0040 (0.10)  
0.130  
(3.30)  
MIN  
0.160 (4.06)  
0.115 (2.93)  
0.015 (0.381)  
0.008 (0.204)  
SEATING  
PLANE  
0.022 (0.558)  
0.014 (0.356)  
0.100 0.070 (1.77)  
8°  
0°  
0.0500  
(1.27)  
BSC  
0.0192 (0.49)  
0.0138 (0.35)  
(2.54)  
BSC  
0.045 (1.15)  
SEATING  
PLANE  
0.0098 (0.25)  
0.0075 (0.19)  
0.0500 (1.27)  
0.0160 (0.41)  
8-Lead P lastic D IP  
(N-8)  
14-Lead Narrow Body (SO IC)  
(R-14)  
0.3444 (8.75)  
0.3367 (8.55)  
0.430 (10.92)  
0.348 (8.84)  
8
5
14  
1
8
7
0.280 (7.11)  
0.240 (6.10)  
0.1574 (4.00)  
0.1497 (3.80)  
0.2440 (6.20)  
0.2284 (5.80)  
1
4
0.325 (8.25)  
0.300 (7.62)  
0.060 (1.52)  
0.015 (0.38)  
PIN 1  
0.0688 (1.75)  
0.0532 (1.35)  
PIN 1  
0.0196 (0.50)  
0.195 (4.95)  
0.115 (2.93)  
x 45°  
0.210 (5.33)  
0.0098 (0.25)  
0.0040 (0.10)  
0.0099 (0.25)  
MAX  
0.130  
(3.30)  
MIN  
0.160 (4.06)  
0.115 (2.93)  
0.015 (0.381)  
0.008 (0.204)  
8°  
0°  
SEATING  
PLANE  
0.0500  
(1.27)  
BSC  
0.0192 (0.49)  
0.0138 (0.35)  
0.100  
(2.54)  
BSC  
0.022 (0.558)  
0.014 (0.356)  
0.070 (1.77)  
0.045 (1.15)  
SEATING  
PLANE  
0.0500 (1.27)  
0.0160 (0.41)  
0.0099 (0.25)  
0.0075 (0.19)  
16-Lead Thin Shrink Sm all O utline P ackage (TSSO P )  
(RU-16)  
0.201 (5.10)  
0.193 (4.90)  
16  
9
1
8
PIN 1  
0.006 (0.15)  
0.002 (0.05)  
0.0433  
(1.10)  
MAX  
0.028 (0.70)  
0.020 (0.50)  
8°  
0°  
0.0118 (0.30)  
0.0075 (0.19)  
0.0256  
(0.65)  
BSC  
SEATING  
PLANE  
0.0079 (0.20)  
0.0035 (0.090)  
–12–  
REV. 0  

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