ADM660ARZ-REEL [ADI]
CMOS Switched-Capacitor Voltage Converters; CMOS开关电容电压转换器型号: | ADM660ARZ-REEL |
厂家: | ADI |
描述: | CMOS Switched-Capacitor Voltage Converters |
文件: | 总11页 (文件大小:179K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
CMOS Switched-Capacitor
Voltage Converters
ADM660/ADM8660
TYPICAL CIRCUIT CONFIGURATIONS
FEATURES
ADM660: Inverts or Doubles Input Supply Voltage
ADM8660: Inverts Input Supply Voltage
100 mA Output Current
+1.5V TO +7V
INPUT
Shutdown Function (ADM8660)
2.2 F or 10 F Capacitors
0.3 V Drop at 30 mA Load
+1.5 V to +7 V Supply
V+
FC
ADM660
OSC
CAP+
+
C1
10F
LV
GND
INVERTED
NEGATIVE
OUTPUT
Low Power CMOS: 600 A Quiescent Current
Selectable Charge Pump Frequency (25 kHz/120 kHz)
Pin Compatible Upgrade for MAX660, MAX665, ICL7660
Available in 16-Lead TSSOP Package
CAP–
OUT
C2
10F
+
Voltage Inverter Configuration (ADM660)
APPLICATIONS
Handheld Instruments
Portable Computers
Remote Data Acquisition
Op Amp Power Supplies
+1.5V TO +7V
INPUT
V+
FC
ADM8660
CAP+
+
10F
LV
C1
GND
INVERTED
NEGATIVE
OUTPUT
GENERAL DESCRIPTION
The ADM660/ADM8660 is a charge-pump voltage converter
that can be used to either invert the input supply voltage giving
OUT
CAP–
SD
C2
SHUTDOWN
CONTROL
10F
+
VOUT = –VIN or double it (ADM660 only) giving VOUT = 2 ϫ VIN
.
Voltage Inverter Configuration with Shutdown (ADM8660)
Input voltages ranging from +1.5 V to +7 V can be inverted into
a negative –1.5 V to –7 V output supply. This inverting scheme
is ideal for generating a negative rail in single power supply
systems. Only two small external capacitors are needed for the
charge pump. Output currents up to 50 mA with greater than
90% efficiency are achievable, while 100 mA achieves greater
than 80% efficiency.
The ADM660 is a pin compatible upgrade for the MAX660,
MAX665, ICL7660, and LTC1046.
The ADM660/ADM8660 is available in 8-lead DIP and
narrow-body SOIC. The ADM660 is also available in a 16-lead
TSSOP package.
A Frequency Control (FC) input pin is used to select either
25 kHz or 120 kHz charge-pump operation. This is used to
optimize capacitor size and quiescent current. With 25 kHz
selected, a 10 µF external capacitor is suitable, while with 120 kHz
the capacitor may be reduced to 2.2 µF. The oscillator frequency
on the ADM660 can also be controlled with an external capacitor
connected to the OSC input or by driving this input with an
external clock. In applications where a higher supply voltage is
desired it is possible to use the ADM660 to double the input
voltage. With input voltages from 2.5 V to 7 V, output voltages
from 5 V to 14 V are achievable with up to 100 mA output current.
ADM660/ADM8660 Options
Option
ADM660
ADM8660
Inverting Mode
Doubling Mode
External Oscillator
Shutdown
Y
Y
Y
N
Y
N
N
Y
Package Options
R-8
N-8
Y
Y
Y
Y
Y
N
The ADM8660 features a low power shutdown (SD) pin instead
of the external oscillator (OSC) pin. This can be used to disable
the device and reduce the quiescent current to 300 nA.
RU-16
C
REV.
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
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may result from its use. No license is granted by implication or otherwise
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Analog Devices, Inc. All rights reserved.
2011
Fax:
©
(V+ = +5 V, C1, C2 = 10F,* TA = TMIN to TMAX, unless
ADM660/ADM8660–SPECIFICATIONS otherwise noted.)
Parameter
Min
Typ Max
Unit
Test Conditions/Comments
Input Voltage, V+
RL = 1 kW
3.5
1.5
2.5
7.0
7.0
7.0
V
V
V
Inverting Mode, LV = Open
Inverting Mode, LV = GND
Doubling Mode, LV = OUT
Supply Current
No Load
0.6
2.5
1
4.5
mA
mA
FC = Open (ADM660), GND (ADM8660)
FC = V+, LV = Open
Output Current
100
mA
W
Output Resistance (ADM660)
Output Resistance (ADM8660)
Output Resistance (ADM8660)
9
9
15
15
16.5
IL = 100 mA
IL = 100 mA, TA = 25∞C
IL = 100 mA, TA = –40∞C to +85∞C
W
W
Charge-Pump Frequency
OSC Input Current
25
120
±5
±25
kHz
kHz
mA
FC = Open (ADM660), GND (ADM8660)
FC = V+
FC = Open (ADM660), GND (ADM8660)
FC = V+
mA
Power Efficiency (FC = Open) (ADM660)
Power Efficiency (FC = Open) (ADM8660)
90
90
94
94
%
%
RL = 1 kW Connected from V+ to OUT
RL = 1 kW Connected from V+ to OUT,
TA = +25∞C
RL = 1 kW Connected from V+ to OUT,
TA = –40∞C to +85∞C
Power Efficiency (FC = Open) (ADM8660)
88.5
%
Power Efficiency (FC = Open) (ADM660)
Power Efficiency (FC = Open) (ADM8660)
90
90
93
93
%
%
RL = 500 W Connected from OUT to GND
RL = 500 W Connected from OUT to GND,
TA = +25∞C
Power Efficiency (FC = Open) (ADM8660)
88.5
%
RL = 500 W Connected from OUT to GND,
TA = –40∞C to +85∞C
Power Efficiency (FC = Open)
Voltage Conversion Efficiency
81.5
99.96
0.3
%
%
IL = 100 mA to GND
99
No Load
Shutdown Supply Current, ISHDN
Shutdown Input Voltage, VSHDN
5
mA
V
V
ADM8660, SHDN = V+
SHDN High = Disabled
SHDN Low = Enabled
IL = 100 mA
2.4
0.8
Shutdown Exit Time
500
ms
*
C1 and C2 are low ESR (<0.2 W) electrolytic capacitors.
High ESR degrade performance.
Specifications subject to change without notice.
C
REV.
–2–
ADM660/ADM8660
ABSOLUTE MAXIMUM RATINGS*
(TA = +25°C, unless otherwise noted.)
Power Dissipation, RU-16 . . . . . . . . . . . . . . . . . . . . . 500 mW
(Derate 6 mW/°C above +50°C)
θJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 158°C/W
Operating Temperature Range
Input Voltage (V+ to GND, GND to OUT) . . . . . . . . +7.5 V
LV Input Voltage . . . . . . . . . . (OUT – 0.3 V) to (V+, +0.3 V)
FC and OSC Input Voltage
. . . . . . . . . . . (OUT – 0.3 V) or (V+, –6 V) to (V+, +0.3 V)
OUT, V+ Output Current (Continuous) . . . . . . . . . . . 120 mA
Output Short Circuit Duration to GND . . . . . . . . . . . 10 secs
Power Dissipation, N-8 . . . . . . . . . . . . . . . . . . . . . . . 625 mW
(Derate 8.3 mW/°C above +50°C)
Industrial (A Version) . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . –65°C to +150°C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . +300°C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >2000 V
*
This is a stress rating only; functional operation of the device at these or any other
conditions above those indicated in the operation section of this specification is not
implied. Exposure to absolute maximum rating conditions for extended periods
may affect device reliability.
θJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 120°C/W
Power Dissipation, R-8 . . . . . . . . . . . . . . . . . . . . . . . 450 mW
(Derate 6 mW/°C above +50°C)
θJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 170°C/W
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADM660/ADM8660 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
C
REV.
–3–
ADM660/ADM8660
PIN CONNECTIONS
8-Lead
1
2
3
4
8
7
6
5
1
2
3
4
8
7
6
5
V+
V+
FC
CAP+
GND
FC
CAP+
GND
ADM660
ADM8660
SD
OSC
TOP VIEW
TOP VIEW
(Not to Scale)
LV
LV
(Not to Scale)
CAP–
OUT
CAP–
OUT
16-Lead
1
2
3
4
5
6
7
8
16
NC
NC
NC
FC
15
14
13
12
NC
V+
ADM660
OSC
LV
CAP+
GND
CAP–
NC
TOP VIEW
(Not to Scale)
11 OUT
10 NC
NC
9
NC
NC = NO CONNECT
PIN FUNCTION DESCRIPTIONS
Inverter Configuration
Function
Doubler Configuration (ADM660 Only)
Mnemonic
Mnemonic
Function
FC
Frequency Control Input for Internal Oscillator
and Charge Pump. With FC = Open (ADM660)
or connected to GND (ADM8660), fCP = 25 kHz;
with FC = V+, fCP = 120 kHz.
FC
Frequency Control Input for Internal Oscillator
and Charge Pump. With FC = Open, fCP
=
25 kHz; with FC = V+, fCP = 120 kHz.
CAP+
GND
CAP–
OUT
LV
Positive Charge-Pump Capacitor Terminal.
Positive Input Supply.
CAP+
GND
CAP–
OUT
LV
Positive Charge-Pump Capacitor Terminal.
Power Supply Ground.
Negative Charge-Pump Capacitor Terminal.
Ground.
Negative Charge-Pump Capacitor Terminal.
Output, Negative Voltage.
Low Voltage Operation Input. Connect to OUT.
Must be left unconnected in this mode.
Doubled Positive Output.
Low Voltage Operation Input. Connect to GND
when input voltage is less than 3.5 V. Above
3.5 V, LV may be connected to GND or left
unconnected.
OSC
V+
OSC
ADM660: Oscillator Control Input. OSC is
connected to an internal 15 pF capacitor. An
external capacitor may be connected to slow the
oscillator. An external oscillator may also be
used to overdrive OSC. The charge-pump
frequency is equal to 1/2 the oscillator frequency.
SD
V+
ADM8660: Shutdown Control Input. This in-
put, when high, is used to disable the charge
pump thereby reducing the power consumption.
Positive Power Supply Input.
C
REV.
–4–
Typical Performance Characteristics–ADM660/ADM8660
100
3.0
2.5
2.0
1.5
1.0
0.5
0
I
= 10mA
L
90
80
70
60
50
40
30
VOLTAGE DOUBLER
LV = OUT
I
= 1mA
L
I
= 50mA
L
LV = GND
I
= 80mA
L
LV = OPEN
1k
10k
100k
1M
1.5
3.5 7
5.5
.5
CHARGE-PUMP FREQUENCY – Hz
SUPPLY VOLTAGE – Volts
TPC 1. Power Supply Current vs. Voltage
TPC 4. Efficiency vs. Charge-Pump Frequency
3.5
3.0
2.5
100
80
60
40
20
0
–3.0
EFFICIENCY
–3.4
–3.8
–4.2
–4.6
–5.0
2.0
LV = GND
VOLTAGE DOUBLER
1.5
V
OUT
1.0
0.5
LV = GND
VOLTAGE INVERTER
100
CHARGE-PUMP FREQUENCY – kHz
0
1
10
1000
0
20
40
60
80
100
LOAD CURRENT – mA
TPC 2. Output Voltage and Efficiency vs. Load Current
TPC 5. Power Supply Current vs. Charge-Pump
Frequency
1.6
120
V+ = +6.5V
100
V+ = +5.5V
V+ = +4.5V
1.2
V+ = +3.5V
80
V+ = +3.5V
V+ = +2.5V
V+ = +4.5V
0.8
0.4
0
60
V+ = +1.5V
V+ = +2.5V
V+ = +1.5V
V+ = +5.5V
40
20
0
0
20
40
60
80
100
0
20
40
60
80
100
LOAD CURRENT – mA
LOAD CURRENT – mA
TPC 3. Output Voltage Drop vs. Load Current
TPC 6. Power Efficiency vs. Load Current
C
REV.
–5–
ADM660/ADM8660
35
30
25
20
15
10
5
5.0
LOAD = 10mA
4.5
LOAD = 1mA
4.0
3.5
3.0
2.5
2.0
LOAD = 50mA
LV = GND
FC = OPEN
C1, C2 = 10F
LOAD = 80mA
1.5
1.0
0.5
0
0
–40
–20
0
20
40
60
80
1
10
100
1000
TEMPERATURE – C
CHARGE-PUMP FREQUENCY – kHz
TPC 7. Output Voltage vs. Charge-Pump Frequency
TPC 10. Charge-Pump Frequency vs. Temperature
30
25
20
15
10
5
1k
FC = V+
LV = GND
100
10
1
FC = OPEN
LV = GND
0
0.1
1.5
2.5
3.5
4.5
5.5
6.5
1
10
100
1k
SUPPLYVOLTAGE –Volts
CAPACITANCE – pF
TPC 8. Output Source Resistance vs. Supply Voltage
TPC 11. Charge-Pump Frequency vs. External
Capacitance
30
140
LV = GND
120
LV = GND
LV = OPEN
100
20
LV = OPEN
80
FC = OPEN
OSC = OPEN
C1, C2 = 10F
60
FC = V+
OSC = OPEN
C1,C2 = 2.2F
10
40
20
0
0
1.5
2.5
3.5
4.5
5.5
6.5
3
3.5
4
4.5
5
5.5
6
6.5
7
SUPPLY VOLTAGE – Volts
SUPPLY VOLTAGE – Volts
TPC 9. Charge-Pump Frequency vs. Supply Voltage
TPC 12. Charge-Pump Frequency vs. Supply Voltage
C
REV.
–6–
ADM660/ADM8660
160
140
120
100
80
60
50
40
30
20
10
0
V+ = +1.5V
LV = GND
FC =V+
C1, C2 = 2.2F
60
40
V+ = +3V
V+ = +5V
20
0
–40
–20
0
20
40
60
80
100
–40
–20
0
20
40
60
80
100
TEMPERATURE –
C
TEMPERATURE – C
TPC 13. Charge-Pump Frequency vs. Temperature
TPC 14. Output Resistance vs. Temperature
GENERAL INFORMATION
Switched Capacitor Theory of Operation
The ADM660/ADM8660 is a switched capacitor voltage con-
verter that can be used to invert the input supply voltage. The
ADM660 can also be used in a voltage doubling mode. The
voltage conversion task is achieved using a switched capacitor
technique using two external charge storage capacitors. An on-
board oscillator and switching network transfers charge between
the charge storage capacitors. The basic principle behind the
voltage conversion scheme is illustrated in Figures 1 and 2.
As already described, the charge pump on the ADM660/ADM8660
uses a switched capacitor technique in order to invert or double
the input supply voltage. Basic switched capacitor theory is
discussed below.
A switched capacitor building block is illustrated in Figure 3.
With the switch in position A, capacitor C1 will charge to voltage
V1. The total charge stored on C1 is q1 = C1V1. The switch is
then flipped to position B discharging C1 to voltage V2. The
charge remaining on C1 is q2 = C1V2. The charge transferred
to the output V2 is, therefore, the difference between q1 and
q2, so ∆q = q1–q2 = C1 (V1–V2).
CAP+
+
S1
S2
S3
S4
V+
C1
OUT = –V+
+
CAP–
+ 2
C2
A
B
Φ1
Φ2
V1
V2
OSCILLATOR
R
C2
L
C1
Figure 1. Voltage Inversion Principle
Figure 3. Switched Capacitor Building Block
CAP+
+
S1
S2
S3
S4
V+
V
= 2V+
OUT
+
As the switch is toggled between A and B at a frequency f, the
charge transfer per unit time or current is:
C1
C2
V+
CAP–
+ 2
I = f(∆q) = f(C1)(V1–V 2)
Φ1
Φ2
OSCILLATOR
Therefore,
I = (V1–V 2)/(1/fC1) = (V1–V 2)/(REQ
where REQ = 1/fC1
)
Figure 2. Voltage Doubling Principle
Figure 1 shows the voltage inverting configuration, while Figure 2
shows the configuration for voltage doubling. An oscillator
generating antiphase signals φ1 and φ2 controls switches S1, S2,
and S3, S4. During φ1, switches S1 and S2 are closed charging
C1 up to the voltage at V+. During φ2, S1 and S2 open and S3
and S4 close. With the voltage inverter configuration during φ2,
the positive terminal of C1 is connected to GND via S3 and the
negative terminal of C1 connects to VOUT via S4. The net result
is voltage inversion at VOUT wrt GND. Charge on C1 is trans-
ferred to C2 during φ2. Capacitor C2 maintains this voltage
during φ1. The charge transfer efficiency depends on the on-
resistance of the switches, the frequency at which they are being
switched, and also on the equivalent series resistance (ESR) of
the external capacitors. The reason for this is explained in the
following section. For maximum efficiency, capacitors with low
ESR are, therefore, recommended.
The switched capacitor may, therefore, be replaced by an equivalent
resistance whose value is dependent on both the capacitor size
and the switching frequency. This explains why lower capacitor
values may be used with higher switching frequencies. It should
be remembered that as the switching frequency is increased the
power consumption will increase due to some charge being lost
at each switching cycle. As a result, at high frequencies, the power
efficiency starts decreasing. Other losses include the resistance
of the internal switches and the equivalent series resistance (ESR)
of the charge storage capacitors.
R
EQ
V1
V2
C2
R
L
R
= 1/fC1
EQ
The voltage doubling configuration reverses some of the con-
nections, but the same principle applies.
Figure 4. Switched Capacitor Equivalent Circuit
C
REV.
–7–
ADM660/ADM8660
Inverting Negative Voltage Generator
Table II. ADM8660 Charge-Pump Frequency Selection
Figures 5 and 6 show the ADM660/ADM8660 configured to
generate a negative output voltage. Input supply voltages from
1.5 V up to 7 V are allowable. For supply voltage less than 3 V,
LV must be connected to GND. This bypasses the internal
regulator circuitry and gives best performance in low voltage
applications. With supply voltages greater than 3 V, LV may
be either connected to GND or left open. Leaving it open facili-
tates direct substitution for the ICL7660.
FC
OSC
Charge Pump
C1, C2
GND
V+
Open
Open
25 kHz
120 kHz
See Typical Characteristics
10 µF
2.2 µF
GND or V+ Ext Cap
GND
Ext CLK Ext CLK Frequency/2
+1.5V TO +7V
INPUT
CLK OSC
+1.5V TO +7V
INPUT
ADM660
ADM8660
CMOS GATE
V+
OSC
LV
FC
FC
V+
OSC
LV
CAP+
GND
ADM660
+
CAP+
GND
C1
+
C1
INVERTED
NEGATIVE
OUTPUT
10F
CAP–
INVERTED
NEGATIVE
OUTPUT
OUT
CAP–
OUT
C2
C2
10F
+
+
Figure 7. ADM660/ADM8660 External Oscillator
Figure 5. ADM660 Voltage Inverter Configuration
Voltage Doubling Configuration
Figure 8 shows the ADM660 configured to generate increased
output voltages. As in the inverting mode, only two external
capacitors are required. The doubling function is achieved by
reversing some connections to the device. The input voltage is
applied to the GND pin and V+ is used as the output. Input
voltages from 2.5 V to 7 V are allowable. In this configuration,
pins LV, OUT must be connected to GND.
+1.5V TO +7V
INPUT
FC
V+
ADM8660
CAP+
GND
+
C1
LV
10F
INVERTED
NEGATIVE
OUTPUT
CAP–
SD
OUT
C2
SHUTDOWN
CONTROL
10F
+
The unloaded output voltage in this configuration is 2 (VIN).
Output resistance and ripple are similar to the voltage inverting
configuration.
Figure 6. ADM8660 Voltage Inverter Configuration
OSCILLATOR FREQUENCY
Note that the ADM8660 cannot be used in the voltage
doubling configuration.
The internal charge-pump frequency may be selected to be
either 25 kHz or 120 kHz using the Frequency Control (FC)
input. With FC unconnected (ADM660) or connected to GND
(ADM8660), the internal charge pump runs at 25 kHz while, if
FC is connected to V+, the frequency is increased by a factor of
five. Increasing the frequency allows smaller capacitors to be
used for equivalent performance or, if the capacitor size is un-
changed, it results in lower output impedance and ripple.
DOUBLED
POSITIVE
OUTPUT
FC
V+
OSC
+
ADM660
CAP+
10F
+
+2.5V
TO +7V
INPUT
10F
LV
GND
CAP–
OUT
Figure 8. Voltage Doubler Configuration
If a charge-pump frequency other than the two fixed values is
desired, this is made possible by the OSC input, which can
either have a capacitor connected to it or be overdriven by an
external clock. Refer to the Typical Performance Characteris-
tics, which shows the variation in charge-pump frequency versus
capacitor size. The charge-pump frequency is one-half the oscil-
lator frequency applied to the OSC pin.
Shutdown Input
The ADM8660 contains a shutdown input that can be used to
disable the device and thus reduce the power consumption. A
logic high level on the SD input shuts the device down reducing
the quiescent current to 0.3 µA. During shutdown, the output
voltage goes to 0 V. Therefore, ground referenced loads are not
powered during this state. When exiting shutdown, it takes
several cycles (approximately 500 µs) for the charge pump to
reach its final value. If the shutdown function is not being used,
then SD should be hardwired to GND.
If an external clock is used to overdrive the oscillator, its levels
should swing to within 100 mV of V+ and GND. A CMOS
driver is, therefore, suitable. When OSC is overdriven, FC has
no effect but LV must be grounded.
Capacitor Selection
Note that overdriving is permitted only in the voltage inverter
configuration.
The optimum capacitor value selection depends the charge-pump
frequency. With 25 kHz selected, 10 µF capacitors are recommended,
while with 120 kHz selected, 2.2 µF capacitors may be used.
Other frequencies allow other capacitor values to be used. For
maximum efficiency in all cases, it is recommended that capaci-
tors with low ESR are used for the charge-pump. Low ESR
capacitors give both the lowest output resistance and lowest
ripple voltage. High output resistance degrades the overall power
efficiency and causes voltage drops, especially at high output
Table I. ADM660 Charge-Pump Frequency Selection
FC
OSC
Charge Pump
C1, C2
Open
V+
Open
Open
25 kHz
120 kHz
See Typical Characteristics
10 µF
2.2 µF
Open or V+ Ext Cap
Open
Ext CLK Ext CLK Frequency/2
C
REV.
–8–
ADM660/ADM8660
current levels. The ADM660/ADM8660 is tested using low
ESR, 10 µF, capacitors for both C1 and C2. Smaller values of
C1 increase the output resistance, while increasing C1 will
reduce the output resistance. The output resistance is also depen-
dent on the internal switches on resistance as well as the
capacitors ESR, so the effect of increasing C1 becomes negligible
past a certain point.
Capacitor C2
The output capacitor size C2 affects the output ripple. Increas-
ing the capacitor size reduces the peak-to-peak ripple. The ESR
affects both the output impedance and the output ripple.
Reducing the ESR reduces the output impedance and ripple.
For convenience it is recommended that both C1 and C2 be the
same value.
Figure 9 shows how the output resistance varies with oscillator
frequency for three different capacitor values. At low oscillator
frequencies, the output impedance is dominated by the 1/fC
term. This explains why the output impedance is higher for
smaller capacitance values. At high oscillator frequencies, the
1/fC term becomes insignificant and the output impedance is
dominated by the internal switches on resistance. From an out-
put impedance viewpoint, therefore, there is no benefit to be
gained from using excessively large capacitors.
Table III. Capacitor Selection
Charge-Pump
Frequency
Capacitor
C1, C2
25 kHz
120 kHz
10 µF
2.2 µF
Power Efficiency and Oscillator Frequency Trade-Off
While higher switching frequencies allow smaller capacitors to
be used for equivalent performance, or improved performance
with the same capacitors, there is a trade-off to consider. As the
oscillator frequency is increased, the quiescent current increases.
This happens as a result of a finite charge being lost at each
switching cycle. The charge loss per unit cycle at very high
frequencies can be significant, thereby reducing the power effi-
ciency. Since the power efficiency is also degraded at low oscillator
frequencies due to an increase in output impedance, this means
that there is an optimum frequency band for maximum power
transfer. Refer to the Typical Performance Characteristics section.
500
C1 = C2 = 2.2F
400
300
C1 = C2 = 1F
200
C1 = C2 = 10F
Bypass Capacitor
100
The ac impedance of the ADM660/ADM8660 may be reduced
by using a bypass capacitor on the input supply. This capacitor
should be connected between the input supply and GND. It
will provide instantaneous current surges as required. Suitable
capacitors of 0.1 µF or greater may be used.
0
0.1
1
10
100
OSCILLATOR FREQUENCY – kHz
Figure 9. Output Impedance vs. Oscillator Frequency
C
REV.
–9–
ADM660/ADM8660
OUTLINE DIMENSIONS
0.400 (10.16)
0.365 (9.27)
0.355 (9.02)
8
1
5
4
0.280 (7.11)
0.250 (6.35)
0.240 (6.10)
0.325 (8.26)
0.310 (7.87)
0.300 (7.62)
0.100 (2.54)
BSC
0.060 (1.52)
MAX
0.195 (4.95)
0.130 (3.30)
0.115 (2.92)
0.210 (5.33)
MAX
0.015
(0.38)
MIN
0.150 (3.81)
0.130 (3.30)
0.115 (2.92)
0.015 (0.38)
GAUGE
0.014 (0.36)
0.010 (0.25)
0.008 (0.20)
PLANE
SEATING
PLANE
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
0.430 (10.92)
MAX
0.005 (0.13)
MIN
0.070 (1.78)
0.060 (1.52)
0.045 (1.14)
COMPLIANT TO JEDEC STANDARDS MS-001
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
CORNER LEADS MAY BE CONFIGURED AS WHOLE OR HALF LEADS.
Figure 10. 8-Lead Plastic Dual In-Line Package [PDIP]
Narrow Body
(N-8)
Dimensions shown in inches and (millimeters)
5.00 (0.1968)
4.80 (0.1890)
8
1
5
4
6.20 (0.2441)
5.80 (0.2284)
4.00 (0.1574)
3.80 (0.1497)
0.50 (0.0196)
0.25 (0.0099)
1.27 (0.0500)
BSC
45°
1.75 (0.0688)
1.35 (0.0532)
0.25 (0.0098)
0.10 (0.0040)
8°
0°
0.51 (0.0201)
0.31 (0.0122)
COPLANARITY
0.10
1.27 (0.0500)
0.40 (0.0157)
0.25 (0.0098)
0.17 (0.0067)
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MS-012-AA
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 11. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-8)
Dimensions shown in millimeters and (inches)
–10–
REV. C
ADM660/ADM8660
5.10
5.00
4.90
16
9
8
4.50
4.40
4.30
6.40
BSC
1
PIN 1
1.20
MAX
0.15
0.05
0.20
0.09
0.75
0.60
0.45
8°
0°
0.30
0.19
0.65
BSC
SEATING
PLANE
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 12. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
ADM660ANZ
ADM660ARZ
ADM660ARZ-REEL
ADM660ARUZ
ADM660ARUZ-REEL
ADM660ARUZ-REEL7
ADM8660ANZ
ADM8660ARZ
ADM8660ARZ-REEL
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
Package Option
8-Lead Plastic Dual In-Line Package [PDIP]
N-8
R-8
R-8
RU-16
RU-16
RU-16
N-8
R-8
R-8
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Standard Small Outline Package [SOIC_N]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
8-Lead Plastic Dual In-Line Package [PDIP]
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Standard Small Outline Package [SOIC_N]
1 Z = RoHS Compliant Part
REVISION HISTORY
4/11—Rev. B to Rev. C
Changes to Ordering Guide .......................................................... 11
12/02—Rev. A to Rev. B
Renumbered TPCs and Figures........................................Universal
Edits to Specifications ...................................................................... 2
Updated Absolute Maximum Ratings ........................................... 3
Updated Outline Dimensions....................................................... 10
©2011 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D00082-0-4/11(C)
REV. C
–11–
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