ADM660ARZ-REEL [ADI]

CMOS Switched-Capacitor Voltage Converters; CMOS开关电容电压转换器
ADM660ARZ-REEL
型号: ADM660ARZ-REEL
厂家: ADI    ADI
描述:

CMOS Switched-Capacitor Voltage Converters
CMOS开关电容电压转换器

转换器 稳压器 开关式稳压器或控制器 电源电路 开关式控制器 光电二极管
文件: 总11页 (文件大小:179K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
CMOS Switched-Capacitor  
Voltage Converters  
ADM660/ADM8660  
TYPICAL CIRCUIT CONFIGURATIONS  
FEATURES  
ADM660: Inverts or Doubles Input Supply Voltage  
ADM8660: Inverts Input Supply Voltage  
100 mA Output Current  
+1.5V TO +7V  
INPUT  
Shutdown Function (ADM8660)  
2.2 F or 10 F Capacitors  
0.3 V Drop at 30 mA Load  
+1.5 V to +7 V Supply  
V+  
FC  
ADM660  
OSC  
CAP+  
+
C1  
10F  
LV  
GND  
INVERTED  
NEGATIVE  
OUTPUT  
Low Power CMOS: 600 A Quiescent Current  
Selectable Charge Pump Frequency (25 kHz/120 kHz)  
Pin Compatible Upgrade for MAX660, MAX665, ICL7660  
Available in 16-Lead TSSOP Package  
CAP–  
OUT  
C2  
10F  
+
Voltage Inverter Configuration (ADM660)  
APPLICATIONS  
Handheld Instruments  
Portable Computers  
Remote Data Acquisition  
Op Amp Power Supplies  
+1.5V TO +7V  
INPUT  
V+  
FC  
ADM8660  
CAP+  
+
10F  
LV  
C1  
GND  
INVERTED  
NEGATIVE  
OUTPUT  
GENERAL DESCRIPTION  
The ADM660/ADM8660 is a charge-pump voltage converter  
that can be used to either invert the input supply voltage giving  
OUT  
CAP–  
SD  
C2  
SHUTDOWN  
CONTROL  
10F  
+
VOUT = –VIN or double it (ADM660 only) giving VOUT = 2 ϫ VIN  
.
Voltage Inverter Configuration with Shutdown (ADM8660)  
Input voltages ranging from +1.5 V to +7 V can be inverted into  
a negative –1.5 V to –7 V output supply. This inverting scheme  
is ideal for generating a negative rail in single power supply  
systems. Only two small external capacitors are needed for the  
charge pump. Output currents up to 50 mA with greater than  
90% efficiency are achievable, while 100 mA achieves greater  
than 80% efficiency.  
The ADM660 is a pin compatible upgrade for the MAX660,  
MAX665, ICL7660, and LTC1046.  
The ADM660/ADM8660 is available in 8-lead DIP and  
narrow-body SOIC. The ADM660 is also available in a 16-lead  
TSSOP package.  
A Frequency Control (FC) input pin is used to select either  
25 kHz or 120 kHz charge-pump operation. This is used to  
optimize capacitor size and quiescent current. With 25 kHz  
selected, a 10 µF external capacitor is suitable, while with 120 kHz  
the capacitor may be reduced to 2.2 µF. The oscillator frequency  
on the ADM660 can also be controlled with an external capacitor  
connected to the OSC input or by driving this input with an  
external clock. In applications where a higher supply voltage is  
desired it is possible to use the ADM660 to double the input  
voltage. With input voltages from 2.5 V to 7 V, output voltages  
from 5 V to 14 V are achievable with up to 100 mA output current.  
ADM660/ADM8660 Options  
Option  
ADM660  
ADM8660  
Inverting Mode  
Doubling Mode  
External Oscillator  
Shutdown  
Y
Y
Y
N
Y
N
N
Y
Package Options  
R-8  
N-8  
Y
Y
Y
Y
Y
N
The ADM8660 features a low power shutdown (SD) pin instead  
of the external oscillator (OSC) pin. This can be used to disable  
the device and reduce the quiescent current to 300 nA.  
RU-16  
C
REV.  
Information furnished by Analog Devices is believed to be accurate and  
reliable. However, no responsibility is assumed by Analog Devices for its  
use, norforanyinfringementsofpatentsorotherrightsofthirdpartiesthat  
may result from its use. No license is granted by implication or otherwise  
under any patent or patent rights of Analog Devices. Trademarks and  
registered trademarks are the property of their respective companies.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781/329-4700  
781/461-3113  
www.analog.com  
Analog Devices, Inc. All rights reserved.  
2011  
Fax:  
©
(V+ = +5 V, C1, C2 = 10F,* TA = TMIN to TMAX, unless  
ADM660/ADM8660–SPECIFICATIONS otherwise noted.)  
Parameter  
Min  
Typ Max  
Unit  
Test Conditions/Comments  
Input Voltage, V+  
RL = 1 kW  
3.5  
1.5  
2.5  
7.0  
7.0  
7.0  
V
V
V
Inverting Mode, LV = Open  
Inverting Mode, LV = GND  
Doubling Mode, LV = OUT  
Supply Current  
No Load  
0.6  
2.5  
1
4.5  
mA  
mA  
FC = Open (ADM660), GND (ADM8660)  
FC = V+, LV = Open  
Output Current  
100  
mA  
W
Output Resistance (ADM660)  
Output Resistance (ADM8660)  
Output Resistance (ADM8660)  
9
9
15  
15  
16.5  
IL = 100 mA  
IL = 100 mA, TA = 25C  
IL = 100 mA, TA = –40C to +85C  
W
W
Charge-Pump Frequency  
OSC Input Current  
25  
120  
±5  
±25  
kHz  
kHz  
mA  
FC = Open (ADM660), GND (ADM8660)  
FC = V+  
FC = Open (ADM660), GND (ADM8660)  
FC = V+  
mA  
Power Efficiency (FC = Open) (ADM660)  
Power Efficiency (FC = Open) (ADM8660)  
90  
90  
94  
94  
%
%
RL = 1 kW Connected from V+ to OUT  
RL = 1 kW Connected from V+ to OUT,  
TA = +25C  
RL = 1 kW Connected from V+ to OUT,  
TA = –40C to +85C  
Power Efficiency (FC = Open) (ADM8660)  
88.5  
%
Power Efficiency (FC = Open) (ADM660)  
Power Efficiency (FC = Open) (ADM8660)  
90  
90  
93  
93  
%
%
RL = 500 W Connected from OUT to GND  
RL = 500 W Connected from OUT to GND,  
TA = +25C  
Power Efficiency (FC = Open) (ADM8660)  
88.5  
%
RL = 500 W Connected from OUT to GND,  
TA = –40C to +85C  
Power Efficiency (FC = Open)  
Voltage Conversion Efficiency  
81.5  
99.96  
0.3  
%
%
IL = 100 mA to GND  
99  
No Load  
Shutdown Supply Current, ISHDN  
Shutdown Input Voltage, VSHDN  
5
mA  
V
V
ADM8660, SHDN = V+  
SHDN High = Disabled  
SHDN Low = Enabled  
IL = 100 mA  
2.4  
0.8  
Shutdown Exit Time  
500  
ms  
*
C1 and C2 are low ESR (<0.2 W) electrolytic capacitors.  
High ESR degrade performance.  
Specifications subject to change without notice.  
C
REV.  
–2–  
ADM660/ADM8660  
ABSOLUTE MAXIMUM RATINGS*  
(TA = +25°C, unless otherwise noted.)  
Power Dissipation, RU-16 . . . . . . . . . . . . . . . . . . . . . 500 mW  
(Derate 6 mW/°C above +50°C)  
θJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 158°C/W  
Operating Temperature Range  
Input Voltage (V+ to GND, GND to OUT) . . . . . . . . +7.5 V  
LV Input Voltage . . . . . . . . . . (OUT – 0.3 V) to (V+, +0.3 V)  
FC and OSC Input Voltage  
. . . . . . . . . . . (OUT – 0.3 V) or (V+, –6 V) to (V+, +0.3 V)  
OUT, V+ Output Current (Continuous) . . . . . . . . . . . 120 mA  
Output Short Circuit Duration to GND . . . . . . . . . . . 10 secs  
Power Dissipation, N-8 . . . . . . . . . . . . . . . . . . . . . . . 625 mW  
(Derate 8.3 mW/°C above +50°C)  
Industrial (A Version) . . . . . . . . . . . . . . . . 40°C to +85°C  
Storage Temperature Range . . . . . . . . . . . –65°C to +150°C  
Lead Temperature Range (Soldering 10 sec) . . . . . . . . +300°C  
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . +215°C  
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C  
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >2000 V  
*
This is a stress rating only; functional operation of the device at these or any other  
conditions above those indicated in the operation section of this specification is not  
implied. Exposure to absolute maximum rating conditions for extended periods  
may affect device reliability.  
θJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 120°C/W  
Power Dissipation, R-8 . . . . . . . . . . . . . . . . . . . . . . . 450 mW  
(Derate 6 mW/°C above +50°C)  
θJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 170°C/W  
CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily  
accumulate on the human body and test equipment and can discharge without detection. Although the  
ADM660/ADM8660 features proprietary ESD protection circuitry, permanent damage may occur on  
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are  
recommended to avoid performance degradation or loss of functionality.  
C
REV.  
–3–  
ADM660/ADM8660  
PIN CONNECTIONS  
8-Lead  
1
2
3
4
8
7
6
5
1
2
3
4
8
7
6
5
V+  
V+  
FC  
CAP+  
GND  
FC  
CAP+  
GND  
ADM660  
ADM8660  
SD  
OSC  
TOP VIEW  
TOP VIEW  
(Not to Scale)  
LV  
LV  
(Not to Scale)  
CAP–  
OUT  
CAP–  
OUT  
16-Lead  
1
2
3
4
5
6
7
8
16  
NC  
NC  
NC  
FC  
15  
14  
13  
12  
NC  
V+  
ADM660  
OSC  
LV  
CAP+  
GND  
CAP–  
NC  
TOP VIEW  
(Not to Scale)  
11 OUT  
10 NC  
NC  
9
NC  
NC = NO CONNECT  
PIN FUNCTION DESCRIPTIONS  
Inverter Configuration  
Function  
Doubler Configuration (ADM660 Only)  
Mnemonic  
Mnemonic  
Function  
FC  
Frequency Control Input for Internal Oscillator  
and Charge Pump. With FC = Open (ADM660)  
or connected to GND (ADM8660), fCP = 25 kHz;  
with FC = V+, fCP = 120 kHz.  
FC  
Frequency Control Input for Internal Oscillator  
and Charge Pump. With FC = Open, fCP  
=
25 kHz; with FC = V+, fCP = 120 kHz.  
CAP+  
GND  
CAP–  
OUT  
LV  
Positive Charge-Pump Capacitor Terminal.  
Positive Input Supply.  
CAP+  
GND  
CAP–  
OUT  
LV  
Positive Charge-Pump Capacitor Terminal.  
Power Supply Ground.  
Negative Charge-Pump Capacitor Terminal.  
Ground.  
Negative Charge-Pump Capacitor Terminal.  
Output, Negative Voltage.  
Low Voltage Operation Input. Connect to OUT.  
Must be left unconnected in this mode.  
Doubled Positive Output.  
Low Voltage Operation Input. Connect to GND  
when input voltage is less than 3.5 V. Above  
3.5 V, LV may be connected to GND or left  
unconnected.  
OSC  
V+  
OSC  
ADM660: Oscillator Control Input. OSC is  
connected to an internal 15 pF capacitor. An  
external capacitor may be connected to slow the  
oscillator. An external oscillator may also be  
used to overdrive OSC. The charge-pump  
frequency is equal to 1/2 the oscillator frequency.  
SD  
V+  
ADM8660: Shutdown Control Input. This in-  
put, when high, is used to disable the charge  
pump thereby reducing the power consumption.  
Positive Power Supply Input.  
C
REV.  
–4–  
Typical Performance Characteristics–ADM660/ADM8660  
100  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
I
= 10mA  
L
90  
80  
70  
60  
50  
40  
30  
VOLTAGE DOUBLER  
LV = OUT  
I
= 1mA  
L
I
= 50mA  
L
LV = GND  
I
= 80mA  
L
LV = OPEN  
1k  
10k  
100k  
1M  
1.5  
3.5 7  
5.5  
.5  
CHARGE-PUMP FREQUENCY – Hz  
SUPPLY VOLTAGE – Volts  
TPC 1. Power Supply Current vs. Voltage  
TPC 4. Efficiency vs. Charge-Pump Frequency  
3.5  
3.0  
2.5  
100  
80  
60  
40  
20  
0
–3.0  
EFFICIENCY  
–3.4  
–3.8  
–4.2  
–4.6  
–5.0  
2.0  
LV = GND  
VOLTAGE DOUBLER  
1.5  
V
OUT  
1.0  
0.5  
LV = GND  
VOLTAGE INVERTER  
100  
CHARGE-PUMP FREQUENCY – kHz  
0
1
10  
1000  
0
20  
40  
60  
80  
100  
LOAD CURRENT – mA  
TPC 2. Output Voltage and Efficiency vs. Load Current  
TPC 5. Power Supply Current vs. Charge-Pump  
Frequency  
1.6  
120  
V+ = +6.5V  
100  
V+ = +5.5V  
V+ = +4.5V  
1.2  
V+ = +3.5V  
80  
V+ = +3.5V  
V+ = +2.5V  
V+ = +4.5V  
0.8  
0.4  
0
60  
V+ = +1.5V  
V+ = +2.5V  
V+ = +1.5V  
V+ = +5.5V  
40  
20  
0
0
20  
40  
60  
80  
100  
0
20  
40  
60  
80  
100  
LOAD CURRENT – mA  
LOAD CURRENT – mA  
TPC 3. Output Voltage Drop vs. Load Current  
TPC 6. Power Efficiency vs. Load Current  
C
REV.  
–5–  
ADM660/ADM8660  
35  
30  
25  
20  
15  
10  
5
5.0  
LOAD = 10mA  
4.5  
LOAD = 1mA  
4.0  
3.5  
3.0  
2.5  
2.0  
LOAD = 50mA  
LV = GND  
FC = OPEN  
C1, C2 = 10F  
LOAD = 80mA  
1.5  
1.0  
0.5  
0
0
–40  
–20  
0
20  
40  
60  
80  
1
10  
100  
1000  
TEMPERATURE – C  
CHARGE-PUMP FREQUENCY – kHz  
TPC 7. Output Voltage vs. Charge-Pump Frequency  
TPC 10. Charge-Pump Frequency vs. Temperature  
30  
25  
20  
15  
10  
5
1k  
FC = V+  
LV = GND  
100  
10  
1
FC = OPEN  
LV = GND  
0
0.1  
1.5  
2.5  
3.5  
4.5  
5.5  
6.5  
1
10  
100  
1k  
SUPPLYVOLTAGE Volts  
CAPACITANCE – pF  
TPC 8. Output Source Resistance vs. Supply Voltage  
TPC 11. Charge-Pump Frequency vs. External  
Capacitance  
30  
140  
LV = GND  
120  
LV = GND  
LV = OPEN  
100  
20  
LV = OPEN  
80  
FC = OPEN  
OSC = OPEN  
C1, C2 = 10F  
60  
FC = V+  
OSC = OPEN  
C1,C2 = 2.2F  
10  
40  
20  
0
0
1.5  
2.5  
3.5  
4.5  
5.5  
6.5  
3
3.5  
4
4.5  
5
5.5  
6
6.5  
7
SUPPLY VOLTAGE – Volts  
SUPPLY VOLTAGE – Volts  
TPC 9. Charge-Pump Frequency vs. Supply Voltage  
TPC 12. Charge-Pump Frequency vs. Supply Voltage  
C
REV.  
–6–  
ADM660/ADM8660  
160  
140  
120  
100  
80  
60  
50  
40  
30  
20  
10  
0
V+ = +1.5V  
LV = GND  
FC =V+  
C1, C2 = 2.2F  
60  
40  
V+ = +3V  
V+ = +5V  
20  
0
–40  
–20  
0
20  
40  
60  
80  
100  
–40  
–20  
0
20  
40  
60  
80  
100  
TEMPERATURE –  
C
TEMPERATURE – C  
TPC 13. Charge-Pump Frequency vs. Temperature  
TPC 14. Output Resistance vs. Temperature  
GENERAL INFORMATION  
Switched Capacitor Theory of Operation  
The ADM660/ADM8660 is a switched capacitor voltage con-  
verter that can be used to invert the input supply voltage. The  
ADM660 can also be used in a voltage doubling mode. The  
voltage conversion task is achieved using a switched capacitor  
technique using two external charge storage capacitors. An on-  
board oscillator and switching network transfers charge between  
the charge storage capacitors. The basic principle behind the  
voltage conversion scheme is illustrated in Figures 1 and 2.  
As already described, the charge pump on the ADM660/ADM8660  
uses a switched capacitor technique in order to invert or double  
the input supply voltage. Basic switched capacitor theory is  
discussed below.  
A switched capacitor building block is illustrated in Figure 3.  
With the switch in position A, capacitor C1 will charge to voltage  
V1. The total charge stored on C1 is q1 = C1V1. The switch is  
then flipped to position B discharging C1 to voltage V2. The  
charge remaining on C1 is q2 = C1V2. The charge transferred  
to the output V2 is, therefore, the difference between q1 and  
q2, so q = q1–q2 = C1 (V1–V2).  
CAP+  
+
S1  
S2  
S3  
S4  
V+  
C1  
OUT = –V+  
+
CAP–  
+ 2  
C2  
A
B
Φ1  
Φ2  
V1  
V2  
OSCILLATOR  
R
C2  
L
C1  
Figure 1. Voltage Inversion Principle  
Figure 3. Switched Capacitor Building Block  
CAP+  
+
S1  
S2  
S3  
S4  
V+  
V
= 2V+  
OUT  
+
As the switch is toggled between A and B at a frequency f, the  
charge transfer per unit time or current is:  
C1  
C2  
V+  
CAP–  
+ 2  
I = f(q) = f(C1)(V1V 2)  
Φ1  
Φ2  
OSCILLATOR  
Therefore,  
I = (V1V 2)/(1/fC1) = (V1V 2)/(REQ  
where REQ = 1/fC1  
)
Figure 2. Voltage Doubling Principle  
Figure 1 shows the voltage inverting configuration, while Figure 2  
shows the configuration for voltage doubling. An oscillator  
generating antiphase signals φ1 and φ2 controls switches S1, S2,  
and S3, S4. During φ1, switches S1 and S2 are closed charging  
C1 up to the voltage at V+. During φ2, S1 and S2 open and S3  
and S4 close. With the voltage inverter configuration during φ2,  
the positive terminal of C1 is connected to GND via S3 and the  
negative terminal of C1 connects to VOUT via S4. The net result  
is voltage inversion at VOUT wrt GND. Charge on C1 is trans-  
ferred to C2 during φ2. Capacitor C2 maintains this voltage  
during φ1. The charge transfer efficiency depends on the on-  
resistance of the switches, the frequency at which they are being  
switched, and also on the equivalent series resistance (ESR) of  
the external capacitors. The reason for this is explained in the  
following section. For maximum efficiency, capacitors with low  
ESR are, therefore, recommended.  
The switched capacitor may, therefore, be replaced by an equivalent  
resistance whose value is dependent on both the capacitor size  
and the switching frequency. This explains why lower capacitor  
values may be used with higher switching frequencies. It should  
be remembered that as the switching frequency is increased the  
power consumption will increase due to some charge being lost  
at each switching cycle. As a result, at high frequencies, the power  
efficiency starts decreasing. Other losses include the resistance  
of the internal switches and the equivalent series resistance (ESR)  
of the charge storage capacitors.  
R
EQ  
V1  
V2  
C2  
R
L
R
= 1/fC1  
EQ  
The voltage doubling configuration reverses some of the con-  
nections, but the same principle applies.  
Figure 4. Switched Capacitor Equivalent Circuit  
C
REV.  
–7–  
ADM660/ADM8660  
Inverting Negative Voltage Generator  
Table II. ADM8660 Charge-Pump Frequency Selection  
Figures 5 and 6 show the ADM660/ADM8660 configured to  
generate a negative output voltage. Input supply voltages from  
1.5 V up to 7 V are allowable. For supply voltage less than 3 V,  
LV must be connected to GND. This bypasses the internal  
regulator circuitry and gives best performance in low voltage  
applications. With supply voltages greater than 3 V, LV may  
be either connected to GND or left open. Leaving it open facili-  
tates direct substitution for the ICL7660.  
FC  
OSC  
Charge Pump  
C1, C2  
GND  
V+  
Open  
Open  
25 kHz  
120 kHz  
See Typical Characteristics  
10 µF  
2.2 µF  
GND or V+ Ext Cap  
GND  
Ext CLK Ext CLK Frequency/2  
+1.5V TO +7V  
INPUT  
CLK OSC  
+1.5V TO +7V  
INPUT  
ADM660  
ADM8660  
CMOS GATE  
V+  
OSC  
LV  
FC  
FC  
V+  
OSC  
LV  
CAP+  
GND  
ADM660  
+
CAP+  
GND  
C1  
+
C1  
INVERTED  
NEGATIVE  
OUTPUT  
10F  
CAP–  
INVERTED  
NEGATIVE  
OUTPUT  
OUT  
CAP–  
OUT  
C2  
C2  
10F  
+
+
Figure 7. ADM660/ADM8660 External Oscillator  
Figure 5. ADM660 Voltage Inverter Configuration  
Voltage Doubling Configuration  
Figure 8 shows the ADM660 configured to generate increased  
output voltages. As in the inverting mode, only two external  
capacitors are required. The doubling function is achieved by  
reversing some connections to the device. The input voltage is  
applied to the GND pin and V+ is used as the output. Input  
voltages from 2.5 V to 7 V are allowable. In this configuration,  
pins LV, OUT must be connected to GND.  
+1.5V TO +7V  
INPUT  
FC  
V+  
ADM8660  
CAP+  
GND  
+
C1  
LV  
10F  
INVERTED  
NEGATIVE  
OUTPUT  
CAP–  
SD  
OUT  
C2  
SHUTDOWN  
CONTROL  
10F  
+
The unloaded output voltage in this configuration is 2 (VIN).  
Output resistance and ripple are similar to the voltage inverting  
configuration.  
Figure 6. ADM8660 Voltage Inverter Configuration  
OSCILLATOR FREQUENCY  
Note that the ADM8660 cannot be used in the voltage  
doubling configuration.  
The internal charge-pump frequency may be selected to be  
either 25 kHz or 120 kHz using the Frequency Control (FC)  
input. With FC unconnected (ADM660) or connected to GND  
(ADM8660), the internal charge pump runs at 25 kHz while, if  
FC is connected to V+, the frequency is increased by a factor of  
five. Increasing the frequency allows smaller capacitors to be  
used for equivalent performance or, if the capacitor size is un-  
changed, it results in lower output impedance and ripple.  
DOUBLED  
POSITIVE  
OUTPUT  
FC  
V+  
OSC  
+
ADM660  
CAP+  
10F  
+
+2.5V  
TO +7V  
INPUT  
10F  
LV  
GND  
CAP–  
OUT  
Figure 8. Voltage Doubler Configuration  
If a charge-pump frequency other than the two fixed values is  
desired, this is made possible by the OSC input, which can  
either have a capacitor connected to it or be overdriven by an  
external clock. Refer to the Typical Performance Characteris-  
tics, which shows the variation in charge-pump frequency versus  
capacitor size. The charge-pump frequency is one-half the oscil-  
lator frequency applied to the OSC pin.  
Shutdown Input  
The ADM8660 contains a shutdown input that can be used to  
disable the device and thus reduce the power consumption. A  
logic high level on the SD input shuts the device down reducing  
the quiescent current to 0.3 µA. During shutdown, the output  
voltage goes to 0 V. Therefore, ground referenced loads are not  
powered during this state. When exiting shutdown, it takes  
several cycles (approximately 500 µs) for the charge pump to  
reach its final value. If the shutdown function is not being used,  
then SD should be hardwired to GND.  
If an external clock is used to overdrive the oscillator, its levels  
should swing to within 100 mV of V+ and GND. A CMOS  
driver is, therefore, suitable. When OSC is overdriven, FC has  
no effect but LV must be grounded.  
Capacitor Selection  
Note that overdriving is permitted only in the voltage inverter  
configuration.  
The optimum capacitor value selection depends the charge-pump  
frequency. With 25 kHz selected, 10 µF capacitors are recommended,  
while with 120 kHz selected, 2.2 µF capacitors may be used.  
Other frequencies allow other capacitor values to be used. For  
maximum efficiency in all cases, it is recommended that capaci-  
tors with low ESR are used for the charge-pump. Low ESR  
capacitors give both the lowest output resistance and lowest  
ripple voltage. High output resistance degrades the overall power  
efficiency and causes voltage drops, especially at high output  
Table I. ADM660 Charge-Pump Frequency Selection  
FC  
OSC  
Charge Pump  
C1, C2  
Open  
V+  
Open  
Open  
25 kHz  
120 kHz  
See Typical Characteristics  
10 µF  
2.2 µF  
Open or V+ Ext Cap  
Open  
Ext CLK Ext CLK Frequency/2  
C
REV.  
–8–  
ADM660/ADM8660  
current levels. The ADM660/ADM8660 is tested using low  
ESR, 10 µF, capacitors for both C1 and C2. Smaller values of  
C1 increase the output resistance, while increasing C1 will  
reduce the output resistance. The output resistance is also depen-  
dent on the internal switches on resistance as well as the  
capacitors ESR, so the effect of increasing C1 becomes negligible  
past a certain point.  
Capacitor C2  
The output capacitor size C2 affects the output ripple. Increas-  
ing the capacitor size reduces the peak-to-peak ripple. The ESR  
affects both the output impedance and the output ripple.  
Reducing the ESR reduces the output impedance and ripple.  
For convenience it is recommended that both C1 and C2 be the  
same value.  
Figure 9 shows how the output resistance varies with oscillator  
frequency for three different capacitor values. At low oscillator  
frequencies, the output impedance is dominated by the 1/fC  
term. This explains why the output impedance is higher for  
smaller capacitance values. At high oscillator frequencies, the  
1/fC term becomes insignificant and the output impedance is  
dominated by the internal switches on resistance. From an out-  
put impedance viewpoint, therefore, there is no benefit to be  
gained from using excessively large capacitors.  
Table III. Capacitor Selection  
Charge-Pump  
Frequency  
Capacitor  
C1, C2  
25 kHz  
120 kHz  
10 µF  
2.2 µF  
Power Efficiency and Oscillator Frequency Trade-Off  
While higher switching frequencies allow smaller capacitors to  
be used for equivalent performance, or improved performance  
with the same capacitors, there is a trade-off to consider. As the  
oscillator frequency is increased, the quiescent current increases.  
This happens as a result of a finite charge being lost at each  
switching cycle. The charge loss per unit cycle at very high  
frequencies can be significant, thereby reducing the power effi-  
ciency. Since the power efficiency is also degraded at low oscillator  
frequencies due to an increase in output impedance, this means  
that there is an optimum frequency band for maximum power  
transfer. Refer to the Typical Performance Characteristics section.  
500  
C1 = C2 = 2.2F  
400  
300  
C1 = C2 = 1F  
200  
C1 = C2 = 10F  
Bypass Capacitor  
100  
The ac impedance of the ADM660/ADM8660 may be reduced  
by using a bypass capacitor on the input supply. This capacitor  
should be connected between the input supply and GND. It  
will provide instantaneous current surges as required. Suitable  
capacitors of 0.1 µF or greater may be used.  
0
0.1  
1
10  
100  
OSCILLATOR FREQUENCY – kHz  
Figure 9. Output Impedance vs. Oscillator Frequency  
C
REV.  
–9–  
ADM660/ADM8660  
OUTLINE DIMENSIONS  
0.400 (10.16)  
0.365 (9.27)  
0.355 (9.02)  
8
1
5
4
0.280 (7.11)  
0.250 (6.35)  
0.240 (6.10)  
0.325 (8.26)  
0.310 (7.87)  
0.300 (7.62)  
0.100 (2.54)  
BSC  
0.060 (1.52)  
MAX  
0.195 (4.95)  
0.130 (3.30)  
0.115 (2.92)  
0.210 (5.33)  
MAX  
0.015  
(0.38)  
MIN  
0.150 (3.81)  
0.130 (3.30)  
0.115 (2.92)  
0.015 (0.38)  
GAUGE  
0.014 (0.36)  
0.010 (0.25)  
0.008 (0.20)  
PLANE  
SEATING  
PLANE  
0.022 (0.56)  
0.018 (0.46)  
0.014 (0.36)  
0.430 (10.92)  
MAX  
0.005 (0.13)  
MIN  
0.070 (1.78)  
0.060 (1.52)  
0.045 (1.14)  
COMPLIANT TO JEDEC STANDARDS MS-001  
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS  
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR  
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.  
CORNER LEADS MAY BE CONFIGURED AS WHOLE OR HALF LEADS.  
Figure 10. 8-Lead Plastic Dual In-Line Package [PDIP]  
Narrow Body  
(N-8)  
Dimensions shown in inches and (millimeters)  
5.00 (0.1968)  
4.80 (0.1890)  
8
1
5
4
6.20 (0.2441)  
5.80 (0.2284)  
4.00 (0.1574)  
3.80 (0.1497)  
0.50 (0.0196)  
0.25 (0.0099)  
1.27 (0.0500)  
BSC  
45°  
1.75 (0.0688)  
1.35 (0.0532)  
0.25 (0.0098)  
0.10 (0.0040)  
8°  
0°  
0.51 (0.0201)  
0.31 (0.0122)  
COPLANARITY  
0.10  
1.27 (0.0500)  
0.40 (0.0157)  
0.25 (0.0098)  
0.17 (0.0067)  
SEATING  
PLANE  
COMPLIANT TO JEDEC STANDARDS MS-012-AA  
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS  
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR  
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.  
Figure 11. 8-Lead Standard Small Outline Package [SOIC_N]  
Narrow Body  
(R-8)  
Dimensions shown in millimeters and (inches)  
–10–  
REV. C  
ADM660/ADM8660  
5.10  
5.00  
4.90  
16  
9
8
4.50  
4.40  
4.30  
6.40  
BSC  
1
PIN 1  
1.20  
MAX  
0.15  
0.05  
0.20  
0.09  
0.75  
0.60  
0.45  
8°  
0°  
0.30  
0.19  
0.65  
BSC  
SEATING  
PLANE  
COPLANARITY  
0.10  
COMPLIANT TO JEDEC STANDARDS MO-153-AB  
Figure 12. 16-Lead Thin Shrink Small Outline Package [TSSOP]  
(RU-16)  
Dimensions shown in millimeters  
ORDERING GUIDE  
Model1  
ADM660ANZ  
ADM660ARZ  
ADM660ARZ-REEL  
ADM660ARUZ  
ADM660ARUZ-REEL  
ADM660ARUZ-REEL7  
ADM8660ANZ  
ADM8660ARZ  
ADM8660ARZ-REEL  
Temperature Range  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
Package Description  
Package Option  
8-Lead Plastic Dual In-Line Package [PDIP]  
N-8  
R-8  
R-8  
RU-16  
RU-16  
RU-16  
N-8  
R-8  
R-8  
8-Lead Standard Small Outline Package [SOIC_N]  
8-Lead Standard Small Outline Package [SOIC_N]  
16-Lead Thin Shrink Small Outline Package [TSSOP]  
16-Lead Thin Shrink Small Outline Package [TSSOP]  
16-Lead Thin Shrink Small Outline Package [TSSOP]  
8-Lead Plastic Dual In-Line Package [PDIP]  
8-Lead Standard Small Outline Package [SOIC_N]  
8-Lead Standard Small Outline Package [SOIC_N]  
1 Z = RoHS Compliant Part  
REVISION HISTORY  
4/11—Rev. B to Rev. C  
Changes to Ordering Guide .......................................................... 11  
12/02—Rev. A to Rev. B  
Renumbered TPCs and Figures........................................Universal  
Edits to Specifications ...................................................................... 2  
Updated Absolute Maximum Ratings ........................................... 3  
Updated Outline Dimensions....................................................... 10  
©2011 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
D00082-0-4/11(C)  
REV. C  
–11–  

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