ADMP411ACEZ-RL7 [ADI]
High SPL Microphone with Bottom Port and Analog Output; 高声压级麦克风与底部端口和模拟输出
| 型号： | ADMP411ACEZ-RL7 |
| 厂家： | 
ADI |
| 描述： | High SPL Microphone with Bottom Port and Analog Output |
| 文件： | 总12页 (文件大小：296K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
High SPL Microphone with
Bottom Port and Analog Output
Data Sheet
ADMP411
FEATURES
FUNCTIONAL BLOCK DIAGRAM
4.72 mm × 3.76 mm × 1.0 mm surface mount package
131 dB SPL acoustic overload point
Sensitivity of −46 dBV
OUTPUT
AMPLIFIER
OUTPUT
2 dB sensitivity tolerance
Omnidirectional response
High SNR of 62 dBA
POWER
Extended frequency response from 28 Hz to 20 kHz
Low current consumption: <250 μA
Single-ended analog output
ADMP411
V
GND
DD
Figure 1.
High PSR of −80 dBV
Compatible with Sn/Pb and Pb-free solder processes
RoHS/WEEE compliant
APPLICATIONS
Fire and safety radios
Safety masks
Smartphones and feature phones
Tablet computers
Teleconferencing systems
Digital still and video cameras
Studio microphones
Figure 2. Isometric Views of Microphone Package
Bluetooth headsets
Security and surveillance
GENERAL DESCRIPTION
The ADMP4111 is a high performance, high SPL, low noise, low
power, analog output bottom ported, omnidirectional MEMS
microphone. The ADMP411 consists of a MEMS microphone
element and an impedance converter amplifier. The ADMP411
sensitivity specification makes it an excellent choice for both
near field and far field applications. The ADMP411 is pin
compatible with the ADMP401 microphone, providing an
easy upgrade path.
The ADMP411 has a linear response up to 131 dB SPL. It offers
high SNR and extended wideband frequency response resulting
in natural sound with high intelligibility. Low current consump-
tion enables long battery life for portable applications.
The ADMP411 is available in a miniature 4.72 mm × 3.76 mm
× 1.0 mm surface-mount package. It is reflow solder compatible
with no sensitivity degradation.
1 Protected by U.S. Patents 7,449,356; 7,825,484; 7,885,423; 7,961,897. Other patents are pending.
Rev. 0
Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Technical Support
©2013 Analog Devices, Inc. All rights reserved.
www.analog.com
ADMP411
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Codec Connections.......................................................................7
Dynamic Range Considerations..................................................7
Supporting Documents ................................................................7
Handling Instructions.......................................................................8
Pick and Place Equipment............................................................8
Reflow Solder.................................................................................8
Board Wash ....................................................................................8
PCB Land Pattern Layout.................................................................9
Outline Dimensions....................................................................... 10
Ordering Guide .......................................................................... 10
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
ESD Caution.................................................................................. 4
Pin Configuration and Function Descriptions............................. 5
Typical Performance Characteristics ............................................. 6
Applications Information ................................................................ 7
REVISION HISTORY
4/13—Revision 0: Initial Version
Rev. 0 | Page 2 of 12
Data Sheet
ADMP411
SPECIFICATIONS
TA = 25°C, VDD = 1.8 V, unless otherwise noted. All minimum and maximum specifications are guaranteed. Typical specifications are not
guaranteed.
Table 1.
Parameter
Test Conditions/Comments
Min Typ
Omni
Max Unit
PERFORMANCE
Directionality
Sensitivity
1 kHz, 94 dB SPL
−48 −46
62
−44
dBV
dBA
dBA SPL
dB
Signal-to-Noise Ratio (SNR)
Equivalent Input Noise (EIN)
Dynamic Range
20 Hz to 20 kHz, A-weighted
20 Hz to 20 kHz, A-weighted
Derived from EIN and maximum acoustic input
Low frequency −3 dB point
32
99
28
Frequency Response1
Hz
High frequency −3 dB point
105 dB SPL
>20
0.2
kHz
%
Total Harmonic Distortion (THD)
Power Supply Rejection (PSR)
Power Supply Rejection Ratio (PSRR)
Acoustic Overload Point
POWER SUPPLY
1
217 Hz, 100 mV p-p square wave superimposed on VDD = 1.8 V
1 kHz, 100 mV p-p sine wave superimposed on VDD = 1.8 V
10% THD
−80
−46
131
dBV
dB
dB SPL
Supply Voltage (VDD)
Supply Current (IS)
1.5
3.63
220
250
V
µA
µA
VDD = 1.8 V
VDD = 3.3 V
180
210
OUTPUT CHARACTERISTICS
Output Impedance (ZOUT
Output DC Offset
)
200
0.8
Ω
V
Maximum Output Voltage
Noise Floor
131 dB SPL input
20 Hz to 20 kHz, A-weighted, rms
0.355
−108
V rms
dBV
1 See Figure 5 and Figure 6.
Rev. 0 | Page 3 of 12
ADMP411
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 2.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Parameter
Rating
Supply Voltage
Sound Pressure Level (SPL)
Mechanical Shock
Vibration
−0.3 V to +3.63 V
160 dB
10,000 g
Per MIL-STD-883 Method 2007,
Test Condition B
Storage Temperature Range
−40°C to +150°C
Operating Temperature Range −40°C to +85°C
ESD CAUTION
CRITICAL ZONE
tP
T
TO T
L
P
T
P
RAMP-UP
T
L
tL
T
SMAX
T
SMIN
tS
RAMP-DOWN
PREHEAT
t
25°C TO PEAK
TIME
Figure 3. Recommended Soldering Profile Limits
Table 3. Recommended Soldering Profile Limits
Profile Feature
Sn63/Pb37
Pb-Free
Average Ramp Rate (TL to TP)
Preheat
1.25°C/sec maximum
1.25°C/sec maximum
Minimum Temperature (TSMIN
)
100°C
150°C
Maximum Temperature (TSMAX
)
150°C
200°C
Time (TSMIN to TSMAX), tS
Ramp-Up Rate (TSMAX to TL)
60 sec to 75 sec
1.25°C/sec
60 sec to 75 sec
1.25°C/sec
Time Maintained Above Liquidous (tL)
Liquidous Temperature (TL)
45 sec to 75 sec
183°C
~50 sec
217°C
Peak Temperature (TP)
Time Within 5°C of Actual Peak Temperature (tP)
Ramp-Down Rate
215°C + 3°C/−3°C
20 sec to 30 sec
3°C/sec maximum
5 minute maximum
260°C + 0°C/−5°C
20 sec to 30 sec
3°C/sec maximum
5 minute maximum
Time 25°C to Peak Temperature
Rev. 0 | Page 4 of 12
Data Sheet
ADMP411
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
OUTPUT
GND
2
1
GND
3
GND
6
V
DD
4
5
GND
BOTTOM VIEW
(Not to Scale)
Figure 4. Pin Configuration
Table 4. Pin Function Descriptions
Pin No.
Mnemonic
OUTPUT
GND
GND
GND
Description
1
2
3
4
5
6
Analog Output Signal
Ground
Ground
Ground
Power Supply
Ground
VDD
GND
Rev. 0 | Page 5 of 12
ADMP411
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
20
15
10
5
10
1
0
–5
–10
0.1
90
100
110
120
130
140
10
100
1k
10k 20k
AMPLITUDE (dB SPL)
FREQUENCY (Hz)
Figure 5. Frequency Response Mask
Figure 8. THD + N vs. Input Level
15
10
5
0
–10
–20
–30
–40
–50
–60
0
–5
–10
–15
10
100
1k
10k
90
100
110
120
130
140
FREQUENCY (Hz)
INPUT AMPLITUDE (dB SPL)
Figure 6. Typical Frequency Response (Measured)
Figure 9. Linearity
–40
–41
–42
–43
–44
–45
–46
–47
–48
–49
–50
1.2
1.0
0.8
0.6
0.4
0.2
0
128dB SPL
130dB SPL
132dB SPL
134dB SPL
136dB SPL
138dB SPL
140dB SPL
100
1k
10k
0
0.2
0.4
0.6
TIME (ms)
0.8
1.0
FREQUENCY (Hz)
Figure 7. Typical Power Supply Rejection Ratio vs. Frequency
Figure 10. Clipping Characteristics
Rev. 0 | Page 6 of 12
Data Sheet
ADMP411
APPLICATIONS INFORMATION
GAIN = (R1 + R2)/R1
1.8V TO 3.3V
CODEC CONNECTIONS
R1
R2
V
REF
The ADMP411 output can be connected to a dedicated codec
microphone input (see Figure 11) or to a high input impedance
gain stage (see Figure 12). A 0.1 µF ceramic capacitor placed
close to the ADMP411 supply pin is used for testing and is
recommended to adequately decouple the microphone from
noise on the power supply. A dc blocking capacitor is required at
the output of the microphone. This capacitor creates a high-pass
filter with a corner frequency at
0.1µF
V
DD
V
ADA4075-2
OUT
1µF
MINIMUM
ADMP411
OUTPUT
GND
10kΩ
V
REF
Figure 12. ADMP411 Connected to the ADA4075-2 Op Amp
fC = 1/(2π × C × R)
DYNAMIC RANGE CONSIDERATIONS
where R is the input impedance of the codec.
To fully utilize the 99 dB dynamic range of the ADMP411 in
a design, the preamp, ADC, or codec circuit following it must
be chosen carefully. For example, the ADAU1761 has a 98 dB
dynamic range with VDD = 3.3 V. To match the dynamic ranges
between the microphone and the ADC input of the codec, some
gain must be added to the ADMP411 output. For example, at
the 131 dB SPL maximum acoustic input, the ADMP411 outputs a
−13 dBV rms signal. The full-scale input voltage of the ADAU1761
ADC is 0 dBV; therefore, 13 dB of gain must be added to the
signal to match the dynamic range of the microphone with the
dynamic range of the codec.
A minimum value of 4.7 μF is recommended in Figure 11
because the ADAU1761/ADAU1361 input impedance can be
as low as 2 kΩ at its highest PGA gain setting, which results
in a high-pass filter corner frequency at 17 Hz.
Figure 12 shows the ADMP411 connected to an ADA4075-2
op amp configured as a noninverting preamplifier. The
AN-1165 Application Note describes using op amps for
microphone preamp circuits and includes a list of
recommended Analog Devices, Inc., op amps.
MICBIAS
0.1µF
SUPPORTING DOCUMENTS
Evaluation Board User Guide
ADAU1761
OR
V
DD
UG-445, EVAL-ADMP411Z-FLEX: Bottom-Ported Analog
Output MEMS Microphone Evaluation Board
ADAU1361
4.7µF
ADMP411
MINIMUM
LINN
LINP
CM
OUTPUT
Application Notes
GND
AN-1003, Recommendations for Mounting and Connecting
Analog Devices, Inc., Bottom-Ported MEMS Microphones
Figure 11. ADMP411 Connected to the Analog Devices ADAU1761 or
ADAU1361 Codec
AN-1068, Reflow Soldering of the MEMS Microphone
AN-1112, Microphone Specifications Explained
AN-1124, Recommendations for Sealing Analog Devices, Inc.,
Bottom-Port MEMS Microphones from Dust and Liquid
Ingress
AN-1140, Microphone Array Beamforming
AN-1165, Op Amps for MEMS Microphone Preamp Circuits
AN-1181, Using a MEMS Microphone in a 2-Wire Microphone
Circuit
Rev. 0 | Page 7 of 12
ADMP411
Data Sheet
HANDLING INSTRUCTIONS
PICK AND PLACE EQUIPMENT
REFLOW SOLDER
The MEMS microphone can be handled using standard pick
and place and chip shooting equipment. Take care to avoid
damage to the MEMS microphone structure as follows:
For best results, the soldering profile should be in accordance
with the recommendations of the manufacturer of the solder
paste used to attach the MEMS microphone to the PCB. It is
recommended that the solder reflow profile not exceed the limit
conditions specified in Figure 3 and Table 3. For more detailed
recommendations, see the AN-1068 Application Note, Reflow
Soldering of the MEMS Microphone.
•
Use a standard pickup tool to handle the microphone.
Because the microphone hole is on the bottom of the
package, the pickup tool can make contact with any part
of the lid surface.
•
Do not pick up the microphone with a vacuum tool that
makes contact with the bottom side of the microphone.
Do not pull air out or blow air into the microphone port.
Do not use excessive force to place the microphone
on the PCB.
BOARD WASH
When washing the PCB, ensure that water does not make
contact with the microphone port. Blowoff procedures and
ultrasonic cleaning must not be used.
•
•
Rev. 0 | Page 8 of 12
Data Sheet
ADMP411
PCB LAND PATTERN LAYOUT
The recommended PCB land pattern for the ADMP411 is laid
out to a 1:1 ratio to the solder pads on the microphone package,
as shown in Figure 13. Take care to avoid applying solder paste
to the sound hole in the PCB. A suggested solder paste stencil
pattern layout is shown in Figure 14. The diameter of the sound
hole in the PCB should be larger than the diameter of the sound
port of the microphone. A minimum diameter of 0.5 mm is
recommended.
2.62
ø0.90 (3×)
ø1.10
ø1.68
2.54
2.40
1.20
1.27
ø0.70 (2×)
0.79
Figure 13. PCB Land Pattern Layout (Dimensions Shown in Millimeters)
1.8mm/1.3mm DIA. 0.2032 CUT WIDTH (4×)
0.649mm DIA. (2×)
0.85mm DIA. (3×)
2.4mm
1.2mm
2.54mm
1.27mm
2.62mm
3.41mm
Figure 14. Suggested Solder Paste Stencil Pattern Layout
Rev. 0 | Page 9 of 12
ADMP411
Data Sheet
OUTLINE DIMENSIONS
4.82
4.72
4.62
3.30 REF
2.62 BSC
REFERENCE
CORNER
0.79 BSC
4.10 REF
PIN 1
0.90 DIA.
(PINS 1, 5, 6)
1
6
2
1.68 DIA.
3.86
3.76
3.66
3
2.54
BSC
2.40 BSC
1.10 DIA.
3.14
REF
1.27 BSC
(THRU HOLE)
1.20 BSC
0.25 DIA.
5
4
0.61 REF
0.70 DIA.
(PINS 2, 4)
0.68 REF
TOP VIEW
SIDE VIEW
BOTTOM VIEW
1.10
1.00
0.90
0.73 REF
0.24 REF
Figure 15. 6-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV]
4.72 mm × 3.76 mm Body
(CE-6-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
−40°C to +85°C
−40°C to +85°C
Package Description
Package Option
CE-6-1
CE-6-1
Ordering Quantity
ADMP411ACEZ-RL
ADMP411ACEZ-RL7
EVAL-ADMP411Z-FLEX
6-Terminal LGA_CAV, 13”Tape and Reel
6-Terminal LGA_CAV, 7”Tape and Reel
Flex Evaluation Board
4,500
1,000
1 Z = RoHS Compliant Part.
Rev. 0 | Page 10 of 12
Data Sheet
NOTES
ADMP411
Rev. 0 | Page 11 of 12
ADMP411
NOTES
Data Sheet
©2013 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D10913-0-44/13(0)
Rev. 0 | Page 12 of 12
相关型号：
©2020 ICPDF网 联系我们和版权申明