ADN4664BRZ-REEL7 [ADI]

Dual, 3 V, CMOS, LVDS Differential Line Receiver;
ADN4664BRZ-REEL7
型号: ADN4664BRZ-REEL7
厂家: ADI    ADI
描述:

Dual, 3 V, CMOS, LVDS Differential Line Receiver

光电二极管 接口集成电路
文件: 总13页 (文件大小:260K)
中文:  中文翻译
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Dual, 3 V, CMOS, LVDS  
Differential Line Receiver  
ADN4664  
FUNCTIONAL BLOCK DIAGRAM  
FEATURES  
V
CC  
15 kV ESD protection on output pins  
400 Mbps (200 MHz) switching rates  
Flow-through pinout simplifies PCB layout  
100 ps channel-to-channel skew (typical)  
2.5 ns maximum propagation delay  
ADN4664  
R
R
IN1+  
R
R
OUT1  
OUT2  
IN1–  
3.3 V power supply  
R
R
IN2+  
High impedance outputs on power-down  
Low power design: typically 3 mW (quiescent)  
Interoperable with existing 5 V LVDS drivers  
Accepts small swing (310 mV typical) differential signal  
levels  
IN2–  
GND  
Figure 1.  
Supports open, short, and terminated input fail-safe  
0 V to −100 mV threshold region  
Conforms to TIA/EIA-644 LVDS standard  
Industrial operating temperature range: −40°C to +85°C  
Available in surface-mount (SOIC) package  
APPLICATIONS  
Point-to-point data transmission  
Multidrop buses  
Clock distribution networks  
Backplane receivers  
GENERAL DESCRIPTION  
The ADN4664 is a dual, CMOS, low voltage differential  
signaling (LVDS) line receiver offering data rates of over  
400 Mbps (200 MHz) and ultralow power consumption.  
It features a flow-through pinout for easy PCB layout and  
separation of input and output signals.  
The ADN4664 and its companion driver, the ADN4663, offer a  
new solution to high speed, point-to-point data transmission,  
and a low power alternative to emitter-coupled logic (ECL) or  
positive emitter-coupled logic (PECL).  
The device accepts low voltage (310 mV typical) differential  
input signals and converts them to a single-ended 3 V TTL/  
CMOS logic level.  
Rev. 0  
Information furnished by Analog Devices is believed to be accurate and reliable. However, no  
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other  
rights of third parties that may result from its use. Specifications subject to change without notice. No  
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.  
Trademarks and registeredtrademarks arethe property of their respective owners.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781.329.4700  
Fax: 781.461.3113  
www.analog.com  
©2009 Analog Devices, Inc. All rights reserved.  
 
ADN4664* PRODUCT PAGE QUICK LINKS  
Last Content Update: 02/23/2017  
COMPARABLE PARTS  
View a parametric search of comparable parts.  
TOOLS AND SIMULATIONS  
ADN4664 IBIS Model  
EVALUATION KITS  
• ezLINX™ iCoupler® Isolated Interface Development  
Environment  
REFERENCE DESIGNS  
CN0256  
DESIGN RESOURCES  
ADN4664 Material Declaration  
PCN-PDN Information  
DOCUMENTATION  
Application Notes  
AN-1176: Component Footprints and Symbols in the  
Binary .Bxl File Format  
Quality And Reliability  
Symbols and Footprints  
AN-1177: LVDS and M-LVDS Circuit Implementation Guide  
AN-1179: Junction Temperature Calculation for Analog  
Devices RS-485/RS-422, CAN, and LVDS/M-LVDS  
Transceivers  
DISCUSSIONS  
View all ADN4664 EngineerZone Discussions.  
Data Sheet  
SAMPLE AND BUY  
ADN4664: Dual, 3 V, CMOS, LVDS Differential Line  
Visit the product page to see pricing options.  
Receiver Data Sheet  
User Guides  
TECHNICAL SUPPORT  
UG-400: ezLINX iCoupler Isolated Interface Development  
Environment Hardware User Guide  
Submit a technical question or find your regional support  
number.  
UG-461: ezLINX iCoupler Isolated Interface Development  
Environment Software User Guide  
DOCUMENT FEEDBACK  
Submit feedback for this data sheet.  
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ADN4664  
TABLE OF CONTENTS  
Features .............................................................................................. 1  
ESD Caution...................................................................................6  
Pin Configuration and Function Descriptions..............................7  
Typical Performance Characteristics ..............................................8  
Theory of Operation ...................................................................... 11  
Applications Information.......................................................... 11  
Outline Dimensions....................................................................... 12  
Ordering Guide .......................................................................... 12  
Applications....................................................................................... 1  
General Description......................................................................... 1  
Revision History ............................................................................... 2  
Specifications..................................................................................... 3  
AC Characteristics........................................................................ 4  
Absolute Maximum Ratings............................................................ 6  
REVISION HISTORY  
1/09—Revision 0: Initial Version  
Rev. 0 | Page 2 of 12  
 
ADN4664  
SPECIFICATIONS  
VDD = 3.0 V to 3.6 V; CL = 15 pF to GND; all specifications TMIN to TMAX, unless otherwise noted.  
Table 1.  
Parameter1  
Symbol  
Min  
Typ2  
Max  
Unit  
Conditions/Comments  
LVDS INPUT  
High Threshold at RINx+, RINx−  
Low Threshold at RINx+, RINx−  
3
VTH  
VTL  
IIN  
+100 mV  
mV  
VCM = 1.2 V, 0.05 V, 2.95 V  
VCM = 1.2 V, 0.05 V, 2.95 V  
VIN = 2.8 V, VCC = 3.6 V or 0 V  
VIN = 0 V, VCC = 3.6 V or 0 V  
VIN = 3.6 V, VCC = 0 V  
3
−100  
−10  
−10  
−20  
Input Current at RINx+, RINx−  
1
1
1
+10  
+10  
+20  
μA  
μA  
μA  
OUTPUT  
Output High Voltage  
VOH  
2.7  
2.7  
2.7  
3.1  
3.1  
3.1  
0.3  
−47  
−0.8  
V
V
V
V
IOH = −0.4 mA, VID = +200 mV  
IOH = −0.4 mA, input terminated  
IOH = −0.4 mA, input shorted  
IOL = 2 mA, VID = −200 mV  
Enabled, VOUT = 0 V  
Output Low Voltage  
VOL  
IOS  
VCL  
0.5  
Output Short-Circuit Current4  
Input Clamp Voltage  
POWER SUPPLY  
−15  
−1.5  
−100 mA  
V
ICL = −18 mA  
No Load Supply Current  
ESD PROTECTION  
ICC  
5.4  
9
mA  
Inputs open  
RINx+, RINx− Pins  
All Pins Except RINx+, RINx−  
15 ꢀV  
4 ꢀV  
Human body model  
Human body model  
1
Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground unless otherwise specified.  
2 All typicals are given for: VCC = 3.3 V, TA = 25°C.  
3 VCC is always higher than RINx+ and RINx− voltage. RINx− and RINx+ are allowed to have a voltage range of −0.2 V to VCC − VID/2. However, to be compliant with ac  
specifications, the common voltage range is 0.1 V to 2.3 V.  
4 Output short-circuit current (IOS) is specified as magnitude only; the minus sign indicates direction only. Only one output should be shorted at a time. Do not exceed  
maximum junction temperature specification.  
Rev. 0 | Page 3 of 12  
 
 
 
 
 
 
ADN4664  
AC CHARACTERISTICS  
1
VDD = 3.0 V to 3.6 V; CL = 15 pF to GND; all specifications TMIN to TMAX, unless otherwise noted.  
Table 2.  
Parameter  
Symbol Min Typ2 Max Unit Conditions/Comments3  
Differential Propagation Delay High to Low  
tPHLD  
tPLHD  
tSKD1  
tSKD2  
1.0  
1.0  
0
2.15  
2.03  
80  
2.5  
2.5  
400  
500  
ns  
ns  
ps  
ps  
CL = 15 pF, VID = 200 mV (see Figure 2 and Figure 3)  
CL = 15 pF, VID = 200 mV (see Figure 2 and Figure 3)  
CL = 15 pF, VID = 200 mV (see Figure 2 and Figure 3)  
CL = 15 pF, VID = 200 mV (see Figure 2 and Figure 3)  
Differential Propagation Delay Low to High  
4
Differential Pulse Sꢀew |tPHLD − tPLHD  
|
Differential Channel-to-Channel Sꢀew  
0
100  
(Same Device)5  
Differential Part-to-Part Sꢀew6  
Differential Part-to-Part Sꢀew7  
Rise Time  
Fall Time  
Maximum Operating Frequency8  
tSKD3  
tSKD4  
tTLH  
tTHL  
fMAX  
1.0  
1.5  
800  
800  
ns  
ns  
ps  
ps  
CL = 15 pF, VID = 200 mV (see Figure 2 and Figure 3)  
CL = 15 pF, VID = 200 mV (see Figure 2 and Figure 3)  
CL = 15 pF, VID = 200 mV (see Figure 2 and Figure 3)  
CL = 15 pF, VID = 200 mV (see Figure 2 and Figure 3)  
510  
445  
200 250  
MHz All channels switching  
1 CL includes probe and jig capacitance.  
2 All typicals are given for VCC = 3.3 V, TA = 25°C.  
3 Generator waveform for all tests unless otherwise specified: f = 1 MHz, ZO = 50 Ω, tTLH and tTHL (0% to 100%) ≤ 3 ns for RINx+, RINx−  
.
4 tSKD1 is the magnitude difference in differential propagation delay time between the positive going edge and the negative going edge of the same channel.  
5 Channel-to-channel sꢀew, tSKD2, is the defined as the difference between the propagation delay of one channel and the propagation delay of the other channel on the  
same chip with any event on the inputs.  
6 tSKD3, part-to-part sꢀew, is the differential channel-to-channel sꢀew of any event between devices. This specification applies to devices at the same VCC and within 5°C of  
each other within the operating temperature range.  
7 tSKD4, part-to-part sꢀew, is the differential channel-to-channel sꢀew of any event between devices. This specification applies to devices over recommended operating  
temperature and voltage ranges, and across process distribution. tSKD4 is defined as |maximum − minimum| differential propagation delay.  
8 fMAX generator input conditions: f = 200 MHz, tTLH = tTHL < 1 ns (0% to 100%), 50% duty cycle, differential (1.05 V to 1.35 V peaꢀ-to-peaꢀ). Output criteria: 60%/40% duty  
cycle, VOL (maximum 0.4 V), VOH (minimum 2.7 V), load = 15 pF (stray plus probes).  
Rev. 0 | Page 4 of 12  
 
 
 
 
 
 
 
 
 
ADN4664  
Test Circuits and Timing Diagrams  
V
CC  
R
R
INx+  
SIGNAL  
GENERATOR  
R
OUTx  
INx–  
C
L
5050Ω  
RECEIVER IS  
ENABLED  
C
= LOAD AND TEST JIG CAPACITANCE  
L
Figure 2. Test Circuit for Receiver Propagation Delay and Transition Time  
R
1.3V  
1.1V  
INx–  
0V (DIFFERENTIAL)  
V
= 200mV  
1.2V  
ID  
R
INx+  
tPLHD  
tPHLD  
V
OH  
80%  
80%  
R
1.5V  
1.5V  
OUTx  
20%  
20%  
V
OL  
tTLH  
tTHL  
Figure 3. Receiver Propagation Delay and Transition Time Waveforms  
Rev. 0 | Page 5 of 12  
 
 
ADN4664  
ABSOLUTE MAXIMUM RATINGS  
TA = 25°C, unless otherwise noted.  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Table 3.  
Parameter  
Rating  
VCC to GND  
−0.3 V to +4 V  
−0.3 V to VCC + 3.9 V  
−0.3 V to VCC + 0.3 V  
Input Voltage (RINx+, RINx−) to GND  
Output Voltage (ROUTx) to GND  
Operating Temperature Range  
Industrial Temperature Range  
Storage Temperature Range  
Junction Temperature (TJ max)  
Power Dissipation  
−40°C to +85°C  
−65°C to +150°C  
150°C  
ESD CAUTION  
(TJ max − TA)/θJA  
SOIC Pacꢀage  
θJA Thermal Impedance  
Reflow Soldering Peaꢀ Temperature  
Pb-Free  
149.5°C/W  
260°C 5°C  
Rev. 0 | Page 6 of 12  
 
ADN4664  
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS  
R
R
R
R
1
2
3
4
8
7
6
5
V
CC  
IN1–  
IN1+  
IN2+  
IN2–  
ADN4664  
R
OUT1  
OUT2  
R
TOP VIEW  
(Not to Scale)  
GND  
Figure 4. Pin Configuration  
Table 4. Pin Function Descriptions  
Pin No. Mnemonic Description  
1
2
3
4
RIN1−  
RIN1+  
RIN2+  
RIN2−  
Receiver Channel 1 Inverting Input. When this input is more negative than RIN1+, ROUT1 is high. When this input is  
more positive than RIN1+, ROUT1 is low.  
Receiver Channel 1 Noninverting Input. When this input is more positive than RIN1−, ROUT1 is high. When this input is  
more negative than RIN1−, ROUT1 is low.  
Receiver Channel 2 Noninverting Input. When this input is more positive than RIN2−, ROUT2 is high. When this input is  
more negative than RIN2−, ROUT2 is low.  
Receiver Channel 2 Inverting Input. When this input is more negative than RIN2+, ROUT2 is high. When this input is  
more positive than RIN2+, ROUT2 is low.  
5
6
GND  
ROUT2  
Ground reference point for all circuitry on the part.  
Receiver Channel 2 Output (3 V TTL/CMOS). If the differential input voltage between RIN2+ and RIN2− is positive, this  
output is high. If the differential input voltage is negative, this output is low.  
7
8
ROUT1  
VCC  
Receiver Channel 1 Output (3 V TTL/CMOS). If the differential input voltage between RIN1+ and RIN− is positive, this  
output is high. If the differential input voltage is negative, this output is low.  
Power Supply Input. This part can be operated from 3.0 V to 3.6 V.  
Rev. 0 | Page 7 of 12  
 
ADN4664  
TYPICAL PERFORMANCE CHARACTERISTICS  
0
–5  
3.6  
V
= 0V  
OUT  
= 25°C  
I
= –400µA  
LOAD  
T = 25°C  
A
T
A
3.5  
3.4  
3.3  
3.2  
3.1  
3.0  
2.9  
V
= 200mV  
–10  
–15  
–20  
–25  
–30  
–35  
–40  
–45  
–50  
ID  
3.0  
3.1  
3.2  
3.3  
3.4  
3.5  
3.6  
3.0  
3.1  
3.2  
3.3  
3.4  
CC  
3.5  
3.6  
POWER SUPPLY VOLTAGE, V (V)  
POWER SUPPLY VOLTAGE, V (V)  
CC  
Figure 5. Output High Voltage vs. Power Supply Voltage  
Figure 8. Threshold Voltage vs. Power Supply Voltage  
33.60  
33.55  
33.50  
33.45  
33.40  
33.35  
33.30  
33.25  
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
T
V
V
= 25°C  
A
I
T
V
= 2mA  
LOAD  
= 25°C  
= 3.3V  
CC  
A
= 200mV  
= 15pF  
ID  
= –200mV  
ID  
C
L
BOTH CHANNELS SWITCHING  
ONE CHANNEL SWITCHING  
10 100 1000  
FREQUENCY (MHz)  
0
0.01  
0.1  
1
3.0  
3.1  
3.2  
3.3  
3.4  
CC  
3.5  
3.6  
POWER SUPPLY VOLTAGE, V (V)  
Figure 9. Power Supply Current vs. Frequency  
Figure 6. Output Low Voltage vs. Power Supply Voltage  
–35  
–37  
–39  
–41  
–43  
–45  
–47  
–49  
–51  
–53  
–55  
10  
9
8
7
6
5
4
3
2
1
0
V
= 0V  
OUT  
= 25°C  
V
V
C
= 3.3V  
= 200mV  
= 15pF  
CC  
T
A
ID  
L
FREQUENCY = 1MHz  
BOTH CHANNELS SWITCHING  
–40  
–15  
10  
35  
60  
85  
3.0  
3.1  
3.2  
3.3  
3.4  
3.5  
3.6  
AMBIENT TEMPERATURE (°C)  
POWER SUPPLY VOLTAGE, V (V)  
CC  
Figure 7. Output Short-Circuit Current vs. Power Supply Voltage  
Figure 10. Power Supply Current vs. Ambient Temperature  
Rev. 0 | Page 8 of 12  
 
ADN4664  
2.5  
2.4  
6.0  
5.5  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
V
V
= 3.3V  
V
C
= 3.3V  
= 15pF  
CC  
= 200mV  
CC  
ID  
L
FREQUENCY = 200MHz  
= 15pF  
FREQUENCY = 200MHz  
= 1.2V  
V
C
CM  
L
2.3  
2.2  
tPHLD  
2.1  
tPLHD  
tPLHD  
tPHLD  
2.0  
1.9  
1.8  
–40  
–15  
10  
35  
60  
85  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
AMBIENT TEMPERATURE, T (°C)  
A
DIFFERENTIAL INPUT VOLTAGE, V (V)  
ID  
Figure 11. Differential Propagation Delay vs. Ambient Temperature  
Figure 14. Differential Propagation Delay vs. Differential Input Voltage  
4.0  
250  
T
V
= 25°C  
= 200mV  
A
T
= 25°C  
A
ID  
FREQUENCY = 200MHz  
= 15pF  
FREQUENCY = 200MHz  
V
C
200  
150  
100  
50  
= 200mV  
ID  
3.5  
3.0  
2.5  
2.0  
1.5  
C
L
= 15pF  
L
tPLHD  
0
tPHLD  
–50  
–100  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.0  
3.1  
3.2  
3.3  
3.4  
3.5  
3.6  
COMMON-MODE VOLTAGE, V (V)  
POWER SUPPLY VOLTAGE, V (V)  
CM  
CC  
Figure 15. Differential Skew vs. Power Supply Voltage  
Figure 12. Differential Propagation Delay vs. Common-Mode Voltage  
160  
140  
120  
100  
80  
2.30  
V
V
= 3.3V  
CC  
= 200mV  
T
V
= 25°C  
= 200mV  
A
ID  
2.25  
2.20  
2.15  
2.10  
2.05  
2.00  
1.95  
1.90  
1.85  
ID  
FREQUENCY = 200MHz  
= 15pF  
FREQUENCY = 200MHz  
= 15pF  
C
L
C
L
tPHLD  
60  
40  
tPLHD  
20  
0
–40  
–15  
10  
35  
60  
85  
3.0  
3.1  
3.2  
3.3  
3.4  
3.5  
3.6  
AMBIENT TEMPERATURE, T (°C)  
POWER SUPPLY VOLTAGE, V (V)  
A
CC  
Figure 16. Differential Skew vs. Ambient Temperature  
Figure 13. Differential Propagation Delay vs. Power Supply Voltage  
Rev. 0 | Page 9 of 12  
ADN4664  
600  
580  
560  
540  
520  
500  
480  
460  
440  
420  
1800  
1600  
1400  
1200  
1000  
800  
V
V
= 3.3V  
T
V
V
= 25°C  
CC  
= 200mV  
A
= 3.3V  
ID  
CC  
= 200mV  
FREQUENCY = 25MHz  
= 15pF  
ID  
FREQUENCY = 1MHz  
C
L
tTLH  
tTLH  
tTHL  
tTHL  
600  
400  
400  
3.0  
200  
3.1  
3.2  
3.3  
3.4  
3.5  
3.6  
10  
15  
20  
25  
30  
35  
40  
45  
POWER SUPPLY VOLTAGE, V (V)  
CC  
LOAD (pF)  
Figure 17. Transition Time vs. Power Supply Voltage  
Figure 20. Transition Time vs. Load  
600  
550  
500  
450  
400  
350  
2.9  
2.7  
2.5  
2.3  
2.1  
1.9  
1.7  
1.5  
V
V
= 3.3V  
CC  
= 200mV  
ID  
FREQUENCY = 200MHz  
= 15pF  
C
L
tPHLD  
tTLH  
tPLHD  
tTHL  
T
V
V
= 25°C  
A
= 3.3V  
CC  
= 200mV  
ID  
FREQUENCY = 200MHz  
–40  
–15  
10  
35  
60  
85  
10  
15  
20  
25  
30  
35  
40  
45  
AMBIENT TEMPERATURE, T (°C)  
A
LOAD (pF)  
Figure 21. Differential Propagation Delay vs. Load at 200 MHz  
Figure 18. Transition Time vs. Ambient Temperature  
1800  
3.1  
2.9  
2.7  
2.5  
2.3  
2.1  
1.9  
1.7  
1.5  
T
= 25°C  
A
1600  
1400  
1200  
1000  
800  
600  
400  
200  
0
V
V
= 3.3V  
CC  
= 200mV  
ID  
FREQUENCY = 200MHz  
tPHLD  
tPLHD  
tTLH  
tTHL  
T
V
V
= 25°C  
A
= 3.3V  
CC  
= 200mV  
ID  
FREQUENCY = 1MHz  
10  
15  
20  
25  
30  
35  
40  
45  
10  
15  
20  
25  
30  
35  
40  
45  
LOAD (pF)  
LOAD (pF)  
Figure 19. Differential Propagation Delay vs. Load at 1 MHz  
Figure 22. Transition Time vs. Load at 200 MHz  
Rev. 0 | Page 10 of 12  
ADN4664  
THEORY OF OPERATION  
(1.2 V − [310 mV/2]) = 1.045 V for Logic 1. For Logic 0 the inverting  
and noninverting input voltages are reversed. Note that because  
the differential voltage reverses polarity, the peak-to-peak voltage  
swing across RT is twice the differential voltage.  
The ADN4664 is a dual line receiver for low voltage differential  
signaling. It takes a differential input signal of 310 mV typically  
and converts it into a single-ended 3 V TTL/CMOS logic signal.  
A differential current input signal, received via a transmission  
medium, such as a twisted pair cable, develops a voltage across  
a terminating resistor, RT. This resistor is chosen to match the  
characteristic impedance of the medium, typically around  
100 Ω. The differential voltage is detected by the receiver and  
converted back into a single-ended logic signal.  
Current mode signaling offers considerable advantages over  
voltage mode signalling, such as RS-422. The operating current  
remains fairly constant with increased switching frequency,  
whereas with voltage mode drivers the current increases  
exponentially in most cases. This is caused by the overlap as  
internal gates switch between high and low, which causes cur-  
rents to flow from VCC to ground. A current mode device simply  
reverses a constant current between its two outputs, with no  
significant overlap currents.  
When the noninverting receiver input, RINx+, is positive with  
respect to the inverting input RINx− (current flows through RT  
from RINx+ to RINx−), then ROUTx is high. When the noninverting  
receiver input RINx+ is negative with respect to the inverting  
input RINx− (current flows through RT from RINx− to RINx+), then  
This is similar to emitter-coupled logic (ECL) and positive emitter-  
coupled logic (PECL), but without the high quiescent current of  
ECL and PECL.  
ROUTx is low.  
The ADN4664 differential line receiver is capable of receiving  
signals of 100 mV over a 1 V common-mode range centered  
around 1.2 V. This relates to the typical driver offset voltage  
value of 1.2 V. The signal originating from the driver is centered  
around 1.2 V and may shift 1 V around this center point. This  
1 V shifting may be caused by a difference in the ground  
potential of the driver and receiver, the common-mode effect  
of coupled noise, or both.  
APPLICATIONS INFORMATION  
Figure 23 shows a typical application for point-to-point data  
transmission using the ADN4663 as the driver.  
3.3V  
3.3V  
10µF  
TANTALUM  
+
+
10µF  
0.1µF  
0.1µF  
TANTALUM  
V
V
CC  
CC  
ADN4663  
ADN4664  
D
R
INx+  
OUTy+  
R
OUTy–  
100  
T
Using the ADN4663 as a driver, the received differential current  
is between 2.5 mA and 4.5 mA (typically 3.1 mA), developing  
between 250 mV and 450 mV across a 100 Ω termination resis-  
tor. The received voltage is centered around the receiver offset of  
1.2 V. In other words, the noninverting receiver input is typically  
(1.2 V + [310 mV/2]) = 1.355 V, and the inverting receiver input is  
D
R
OUTx  
INy  
D
R
INx–  
GND  
GND  
Figure 23. Typical Application Circuit  
Rev. 0 | Page 11 of 12  
 
 
ADN4664  
OUTLINE DIMENSIONS  
5.00 (0.1968)  
4.80 (0.1890)  
8
1
5
4
6.20 (0.2441)  
5.80 (0.2284)  
4.00 (0.1574)  
3.80 (0.1497)  
0.50 (0.0196)  
0.25 (0.0099)  
1.27 (0.0500)  
BSC  
45°  
1.75 (0.0688)  
1.35 (0.0532)  
0.25 (0.0098)  
0.10 (0.0040)  
8°  
0°  
0.51 (0.0201)  
0.31 (0.0122)  
COPLANARITY  
0.10  
1.27 (0.0500)  
0.40 (0.0157)  
0.25 (0.0098)  
0.17 (0.0067)  
SEATING  
PLANE  
COMPLIANT TO JEDEC STANDARDS MS-012-AA  
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS  
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR  
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.  
Figure 24. 8-Lead Standard Small Outline Package [SOIC_N]  
Narrow Body  
(R-8)  
Dimensions shown in millimeters and (inches)  
ORDERING GUIDE  
Model  
Temperature Range Package Description  
Package Option  
ADN4664BRZ1  
−40°C to +85°C  
−40°C to +85°C  
8-Lead Standard Small Outline Package [SOIC_N]  
8-Lead Standard Small Outline Package [SOIC_N]  
R-8  
R-8  
ADN4664BRZ-REEL71  
1 Z = RoHS Compliant Part.  
©2009 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
D07961-0-1/09(0)  
Rev. 0 | Page 12 of 12  
 
 

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