ADP2441-EVALZ [ADI]

36 V,1 A, Synchronous, Step-Down DC-to-DC Regulator; 36 V , 1 A,同步,降压的DC- DC稳压器
ADP2441-EVALZ
型号: ADP2441-EVALZ
厂家: ADI    ADI
描述:

36 V,1 A, Synchronous, Step-Down DC-to-DC Regulator
36 V , 1 A,同步,降压的DC- DC稳压器

稳压器
文件: 总32页 (文件大小:1912K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
36 V,1 A, Synchronous,  
Step-Down DC-to-DC Regulator  
ADP2441  
Data Sheet  
FEATURES  
TYPICAL CIRCUIT CONFIGURATION  
C3  
Wide input voltage range of 4.5 V to 36 V  
Low minimum on time of 50 ns  
Maximum load current of 1 A  
C
C4  
BST  
V
OUT  
High efficiency of up to 94%  
R
TOP  
Adjustable output down to 0.6 V  
1% output voltage accuracy  
Adjustable switching frequency of 300 kHz to 1 MHz  
Pulse skip mode at light load for power saving  
Precision enable input pin  
V
IN  
FB  
VIN  
R
V
BOTTOM  
OUT  
COMP ADP2441  
SW  
C
C
OUT  
IN  
V
IN  
EN  
R
PGND  
COMP  
Open-drain power good  
C
COMP  
External soft start with tracking  
Overcurrent-limit protection  
R
FREQ  
Shutdown current of less than 15 μA  
UVLO and thermal shutdown  
Figure 1.  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
12-lead, 3 mm × 3 mm LFCSP package  
V
= 5V  
OUT  
V
= 12V  
OUT  
APPLICATIONS  
Point of load applications  
Distributed power systems  
Industrial control supplies  
Standard rail conversion to 24 V/12 V/5 V/3.3 V  
V
= 3.3V  
OUT  
V
= 24V  
IN  
GENERAL DESCRIPTION  
fSW = 300kHz  
The ADP2441 is a constant frequency, current mode control,  
synchronous, step-down dc-to-dc regulator that is capable of  
driving loads up to 1 A with excellent line and load regulation  
characteristics. The ADP2441 operates with a wide input voltage  
range of 4.5 V to 36 V, which makes it ideal for regulating power  
from a wide variety of sources. In addition, the ADP2441 has  
very low minimum on time (50 ns) and is, therefore, suitable for  
applications requiring a very high step-down ratio.  
0.02  
0.2  
LOAD (A)  
1
Figure 2. Efficiency vs. Load Current, VIN = 24 V  
The output voltage can be adjusted from 0.6 V to 0.9 V × VIN.  
High efficiency is obtained with integrated low resistance  
N-channel MOSFETs for both high-side and low-side devices.  
The ADP2441 uses hiccup mode to protect the IC from short  
circuits or from overcurrent conditions on the output. The external  
programmable soft start limits inrush current during startup for  
a wide variety of load capacitances. Other key features include  
tracking, input undervoltage lockout (UVLO), thermal shutdown  
(TSD), and precision enable (EN), which can also be used as a  
logic level shutdown input.  
The switching frequency is adjustable from 300 kHz to 1 MHz with  
an external resistor. The ADP2441 also has an accurate power-good  
(PGOOD) open-drain output signal.  
At light load conditions, the regulator operates in pulse skip  
mode by skipping pulses and reducing switching losses to improve  
energy efficiency. In addition, at medium to heavy load conditions,  
the regulator operates in fixed frequency pulse-width modulation  
(PWM) mode to reduce electromagnetic interference (EMI).  
The ADP2441 is available in a 3 mm × 3 mm, 12-lead LFCSP  
package and is rated for a junction temperature range of −40°C  
to +125°C.  
Rev. A  
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Tel: 781.329.4700  
Technical Support  
©2012 Analog Devices, Inc. All rights reserved.  
www.analog.com  
 
 
 
 
ADP2441  
Data Sheet  
TABLE OF CONTENTS  
Features .............................................................................................. 1  
Applications Information.............................................................. 18  
Selecting the Output Voltage .................................................... 18  
Setting the Switching Frequency.............................................. 18  
Soft Start ...................................................................................... 19  
External Components Selection............................................... 19  
Boost Capacitor .......................................................................... 21  
VCC Capacitor............................................................................ 21  
Loop Compensation .................................................................. 21  
Large Signal Analysis of the Loop Compensation................. 21  
Design Example.............................................................................. 23  
Configuration and Components Selection............................. 23  
System Configuration................................................................ 24  
Typical Application Circuits ......................................................... 25  
Design Example.......................................................................... 25  
Other Typical Circuit Configurations ..................................... 26  
Power Dissipation and Thermal Considerations ....................... 29  
Power Dissipation....................................................................... 29  
Thermal Considerations............................................................ 29  
Evaluation Board Thermal Performance .................................... 30  
Circuit Board Layout Recommendations ................................... 31  
Outline Dimensions....................................................................... 32  
Ordering Guide .......................................................................... 32  
Applications....................................................................................... 1  
General Description......................................................................... 1  
Typical Circuit Configuration......................................................... 1  
Revision History ............................................................................... 2  
Specifications..................................................................................... 3  
Absolute Maximum Ratings............................................................ 5  
Thermal Resistance ...................................................................... 5  
ESD Caution.................................................................................. 5  
Pin Configuration and Function Descriptions............................. 6  
Typical Performance Characteristics ............................................. 7  
Internal Block Diagram ................................................................. 14  
Theory of Operation ...................................................................... 15  
Control Architecure ................................................................... 15  
Adjustable Frequency................................................................. 16  
Power Good................................................................................. 16  
Soft Start ...................................................................................... 16  
Tracking ....................................................................................... 16  
Undervoltage Lockout (UVLO) ............................................... 17  
Precision Enable/Shutdown...................................................... 17  
Current-Limit and Short-Circuit Protection.......................... 17  
Thermal Shutdown..................................................................... 17  
REVISION HISTORY  
11/12—Rev. 0 to Rev. A  
Changes to Figure 1.......................................................................... 1  
Changed IVIN Maximum Parameter from 2.2 mA to2 mA.......... 3  
Changes to Pin 3 and Pin 5 Descriptions...................................... 6  
Changes to Boost Capacitor Section............................................ 21  
Changes to Figure 66...................................................................... 31  
Changes to Ordering Guide .......................................................... 32  
6/12—Revision 0: Initial Version  
Rev. A | Page 2 of 32  
 
Data Sheet  
ADP2441  
SPECIFICATIONS  
VIN = 4.5 V to 36 V, TJ = −40°C to +125°C, unless otherwise noted.  
Table 1.  
Parameter  
Symbol  
Test Conditions/Comments  
Min  
Typ  
Max  
Unit  
POWER SUPPLY  
Input Voltage Range  
Supply Current  
Shutdown Current  
UVLO  
VIN  
IVIN  
ISHDN  
4.5  
36  
2
15  
V
mA  
μA  
VEN = 1.5 V not switching  
VEN = AGND  
1.7  
10  
Threshold  
Hysteresis  
VUVLO  
VIN falling  
3.8  
4
200  
4.2  
5.5  
V
mV  
INTERNAL REGULATOR  
Regulator Output Voltage  
OUTPUT  
VCC  
VIN = 5 V to 36 V  
5
V
Output Voltage Range  
Maximum Output Current  
Feedback Regulation Voltage  
VOUT  
IOUT  
VFB  
0.6  
1
0.594  
0.591  
0.9 × VIN  
V
A
V
V
TJ = −40°C to +85°C  
TJ = −40°C to +125°C  
0.6  
0.6  
0.606  
0.609  
Line Regulation  
Load Regulation  
0.005  
0.05  
%/V  
%/A  
ERROR AMPLIFIER  
Feedback Bias Current  
Transconductance  
Open-Loop Voltage Gain1  
MOSFETS  
IFB_BIAS  
gm  
AVOL  
VFB = 0.6 V  
50  
250  
65  
200  
300  
nA  
μA/V  
dB  
ICOMP  
=
20 μA  
200  
High-Side Switch On Resistance2  
Low-Side Switch On Resistance2  
Leakage Current  
Minimum On Time3  
Minimum Off Time4  
CURRENT SENSE  
RDS_H(ON)  
RDS_L(ON)  
ILKG  
tON_MIN  
tOFF_MIN  
BST − SW = 5 V  
VCC = 5 V  
VEN = AGND  
170  
120  
1
50  
165  
270  
180  
25  
65  
175  
mΩ  
mΩ  
ꢀA  
ns  
All switching frequencies  
ns  
Current Sense Amplifier Gain  
Hiccup Time  
Number Of Cumulative Current-Limit Cycles  
to Go into Hiccup Mode  
Peak Current Limit  
FREQUENCY  
GCS  
1.6  
1.4  
2
6
8
2.4  
A/V  
ms  
Events  
fSW = 300 kHz to1 MHz  
ICL  
1.6  
1.8  
A
Switching Frequency Range  
Frequency Set Accuracy  
fSW  
300  
270  
900  
1000  
330  
1100  
kHz  
kHz  
kHz  
FREQ pin = 308 kΩ  
FREQ pin = 92.5 kΩ  
300  
1000  
SOFT START  
Soft Start Current  
PRECISION ENABLE  
Input Threshold  
Hysteresis  
Leakage Current  
Thermal Shutdown  
Rising  
ISS  
VSS = 0 V  
0.9  
1
1.2  
1.25  
1
μA  
VEN(RISING)  
VEN(HYST)  
IIEN_LEAK  
1.15  
1.20  
100  
0.1  
V
mV  
μA  
VIN = VEN  
TSD  
TSD(HYST)  
150  
25  
°C  
°C  
Hysteresis  
Rev. A | Page 3 of 32  
 
ADP2441  
Data Sheet  
Parameter  
Symbol  
Test Conditions/Comments  
Min  
Typ  
Max  
Unit  
POWER GOOD  
PGOOD High, FB Rising Threshold5  
PGOOD Low, FB Rising Threshold5  
PGOOD High, FB Falling Threshold5  
PGOOD Low, FB Falling Threshold5  
PGOOD  
89  
92  
95  
%
%
%
%
111  
106  
83  
115  
109  
86  
118  
112  
89  
Delay  
tPGOOD  
50  
1
0.5  
μs  
μA  
kΩ  
High Leakage Current  
Pull-Down Resistor  
TRK  
IPGOOD(SRC) VPGOOD = VCC  
IPGOOD(SNK) FB = 0 V  
10  
0.7  
TRK Input Voltage Range  
TRK to FB Offset Voltage  
0
600  
mV  
mV  
TRK = 0 mV to 500 mV  
10  
1 Guaranteed by design.  
2 Measured between VIN and SW pins—includes bond wires and pin resistance.  
3 Based on bench characterization. Measured with VIN = 12 V, VOUT = 1.2 V, load = 1 A, fSW = 1 MHz, and the output in regulation. Measurement does not include dead time.  
4 Based on bench characterization. Measured with VIN = 15 V, VOUT = 12 V, load = 1 A, fSW = 600 kHz, and the output in regulation. Measurement does not include dead time.  
5 This threshold is expressed as a percentage of the nominal output voltage.  
Rev. A | Page 4 of 32  
 
 
 
 
 
Data Sheet  
ADP2441  
ABSOLUTE MAXIMUM RATINGS  
Table 2.  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Parameter  
VIN to PGND  
EN to AGND  
SW to PGND  
BST to PGND  
VCC to AGND  
BST to SW  
Rating  
−0.3 V to +40 V  
−0.3 V to +40 V  
−0.3 V to +40 V  
−0.3 V to +45 V  
−0.3 V to +6 V  
−0.3 V to +6 V  
FREQ, PGOOD, SS/TRK, COMP, FB to AGND −0.3 V to +6 V  
THERMAL RESISTANCE  
PGND to AGND  
0.3 V  
θJA is specified for the worst-case conditions, that is, a device  
soldered in a circuit board for surface-mount packages, and is  
based on a 4-layer standard JEDEC board.  
Operating Junction Temperature Range  
Storage Temperature Range  
Lead Temperature (Soldering, 10 sec)  
−40°C to +125°C  
−65°C to +150°C  
260°C  
Table 3. Thermal Resistance  
Package Type  
θJA  
θJC  
Unit  
12-Lead LFCSP  
40  
2.4  
°C/W  
ESD CAUTION  
Rev. A | Page 5 of 32  
 
 
 
 
ADP2441  
Data Sheet  
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS  
FB  
COMP  
EN  
1
2
3
9 VIN  
SW  
ADP2441  
TOP  
VIEW  
8
7 PGND  
NOTES  
1. THE EXPOSED PAD SHOULD BE CONNECTED  
TO THE SYSTEM AGND PLANE AND PGND PLANE.  
Figure 3. Pin Configuration, Top View  
Table 4. Pin Function Descriptions  
Pin No.  
Mnemonic Description  
1
2
3
FB  
COMP  
EN  
Feedback Regulation Voltage is 0.6 V. Connect this pin to a resistor divider from the output of the dc-to-dc regulator.  
Error Amplifier Compensation. Connect a resistor and capacitor in series to ground.  
Precision Enable. This features offers ±±5 accuracy when using a 1.2± V reference voltage. Pull this pin high to  
enable the regulator and low to disable the regulator. Do not leave the EN pin floating.  
4
±
PGOOD  
FREQ  
Active High Power-Good Output. This pin is pulled low when the output is out of regulation.  
Switching Frequency. A resistor to AGND sets the switching frequency (see the Setting the Switching Frequency  
section). Do not leave the FREQ pin floating.  
6
SS/TRK  
PGND  
SW  
Soft Start/Tracking Input. A capacitor to ground is required to program the soft start time, which gradually ramps  
up the output. A resistive divider to an external reference is required on this pin to track an external voltage.  
Power Ground. Connect a decoupling ceramic capacitor as close as possible between the VIN pin and this pin.  
Connect this pin directly to the exposed pad.  
Switch. The midpoint for the drain of the low-side N-channel power MOSFET switch and the source for the high-side  
N-channel power MOSFET switch.  
7
8
9
VIN  
Power Supply Input. Connect this pin to the input power source, and connect a bypass ceramic capacitor directly  
from this pin to PGND, as close as possible to the IC. The operation voltage is 4.± V to 36 V.  
10  
BST  
Boost. Connect a 10 nF ceramic capacitor between the BST and SW pins as close to the IC as possible to form a  
floating supply for the high-side N-Channel power MOSFET driver. This capacitor is needed to drive the gate of the  
N-channel power MOSFET above the supply voltage.  
11  
12  
VCC  
Output of the Internal Low Dropout Regulator. This pin supplies power for the internal controller and driver circuitry.  
Connect a 1 μF ceramic capacitor between VCC and AGND and a 1 μF ceramic capacitor between VCC and PGND.  
The VCC output is active when the EN pin voltage is more than 0.7 V.  
Analog Ground. This pin is the internal ground for the control functions. Connect this pin directly to the exposed pad.  
Exposed Thermal Pad. The exposed pad should be connected to AGND and PGND.  
AGND  
EP  
Rev. A | Page 6 of 32  
 
Data Sheet  
ADP2441  
TYPICAL PERFORMANCE CHARACTERISTICS  
100  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
V
= 5V  
IN  
V
= 5V  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
IN  
V
= 12V  
IN  
V
= 12V  
IN  
V
= 24V  
IN  
V
= 24V  
IN  
V
= 3.3V  
V
= 3.3V  
OUT  
OUT  
fSW = 300kHz  
COILCRAFT MSS1038  
fSW = 700kHz  
COILCRAFT MSS1038  
0.01  
0.1  
LOAD (A)  
1
1
1
0.01  
0.1  
LOAD (A)  
1
Figure 4. Efficiency vs. Load Current,  
VOUT = 3.3 V, fSW = 300 kHz  
Figure 7. Efficiency vs. Load Current,  
VOUT = 3.3 V, fSW = 700 kHz  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
V
= 12V  
IN  
V
= 12V  
IN  
V
= 24V  
IN  
V
= 24V  
V
= 36V  
IN  
IN  
V
= 36V  
IN  
V
= 5V  
V
= 5V  
OUT  
OUT  
fSW = 300kHz  
COILCRAFT MSS1038  
fSW = 700kHz  
COILCRAFT MSS1038  
0.01  
0.1  
LOAD (A)  
0.01  
0.1  
LOAD (A)  
1
Figure 5. Efficiency vs. Load Current,  
VOUT = 5 V, fSW = 300 kHz  
Figure 8. Efficiency vs. Load Current,  
VOUT = 5 V, fSW = 700 kHz  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
V
= 24V  
IN  
V
= 24V  
IN  
V
= 36V  
IN  
V
= 36V  
IN  
V
= 12V  
V
= 12V  
OUT  
OUT  
fSW = 300kHz  
COILCRAFT MSS1038  
fSW = 600kHz  
COILCRAFT MSS1038  
0.01  
0.1  
0.01  
0.1  
1
LOAD (A)  
LOAD (A)  
Figure 6. Efficiency vs. Load Current,  
VOUT = 12 V, fSW = 300 kHz  
Figure 9. Efficiency vs. Load Current,  
VOUT = 12 V, fSW = 600 kHz  
Rev. A | Page 7 of 32  
 
ADP2441  
Data Sheet  
0.5  
0.4  
0.3  
0.2  
0.1  
0
400  
350  
300  
250  
200  
150  
100  
50  
V
V
V
= 12V  
= 24V  
= 36V  
IN  
IN  
IN  
fSW = 300kHz  
fSW = 700kHz  
–0.1  
V
= 5V  
OUT  
fSW = 700kHz  
–0.2  
–0.3  
–0.4  
–0.5  
V
= 3.3V  
15  
OUT  
0
0
0.2  
0.4  
0.6  
0.8  
1.0  
5
10  
20  
25  
30  
35  
40  
LOAD (A)  
V
(V)  
IN  
Figure 10. Load Regulation for Different Supplies  
Figure 13. Pulse Skip Threshold, VOUT = 3.3 V  
1.0  
0.8  
300  
250  
200  
150  
100  
50  
fSW = 300kHz  
0.6  
0.4  
T
= +25°C  
A
T
= –40°C  
0.2  
A
fSW = 700kHz  
0
–0.2  
–0.4  
–0.6  
–0.8  
–1.0  
T
= +125°C  
A
V
V
= 24V  
= 5V  
IN  
OUT  
fSW = 700kHz  
V
= 5V  
OUT  
0
0
0.2  
0.4  
0.6  
0.8  
1.0  
10  
15  
20  
25  
(V)  
30  
35  
40  
LOAD (A)  
V
IN  
Figure 11. Load Regulation for Different Temperatures  
Figure 14. Pulse Skip Threshold, VOUT = 5 V  
0.5  
0.4  
300  
250  
200  
150  
100  
50  
0.3  
fSW = 300kHz  
0.2  
LOAD = 500mA  
0.1  
0
fSW = 600kHz  
–0.1  
–0.2  
–0.3  
–0.4  
–0.5  
LOAD = 1A  
V
V
= 24V  
IN  
= 5V  
OUT  
fSW = 700kHz  
V
= 12V  
20  
OUT  
0
15  
7
12  
17  
22  
(V)  
27  
32  
37  
25  
30  
35  
40  
V
V
(V)  
IN  
IN  
Figure 12. Line Regulation, VOUT = 5 V for Different Loads  
Figure 15. Pulse Skip Threshold, VOUT = 12 V  
Rev. A | Page 8 of 32  
 
 
 
Data Sheet  
ADP2441  
12  
2.25  
2.05  
1.85  
1.65  
1.45  
1.25  
1.05  
0.85  
0.65  
0.45  
0.25  
0.05  
V
= 36V  
IN  
10  
8
V
= 4.5V  
= 12V  
= 24V  
= 36V  
IN  
6
V
V
V
IN  
IN  
IN  
4
V
= 4.5V  
IN  
2
0
–50  
–50 –30 –10  
10  
30  
50  
70  
90  
110 130 150  
0
50  
100  
150  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
Figure 16. Shutdown Current vs. Temperature  
Figure 19. Supply Current vs. Temperature  
4.5  
4.4  
4.3  
4.2  
4.1  
4.0  
1.24  
1.22  
1.20  
1.18  
1.16  
1.14  
1.12  
1.10  
1.08  
1.06  
1.04  
ENABLE RISING THRESHOLD  
UVLO, RISING V  
IN  
ENABLE FALLING THRESHOLD  
UVLO, FALLING V  
IN  
3.9  
–50  
–50 –30 –10  
10  
30  
50  
70  
90  
110 130 150  
–25  
0
25  
50  
75  
100  
125  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
Figure 17. UVLO Threshold vs. Temperature  
Figure 20. Enable Threshold vs. Temperature  
130  
120  
110  
100  
90  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
80  
P
P
P
P
FALL, FB INCREASING  
RISE, FB DECREASING  
RISE, FB INCREASING  
FALL, FB DECREASING  
GOOD  
GOOD  
GOOD  
GOOD  
70  
60  
0
–50 –30 –10  
10  
30  
50  
70  
90  
110 130 150  
0
0.1  
0.2  
0.3  
0.4  
0.5  
0.6  
0.7  
0.8  
TRACK (V)  
TEMPERATURE (°C)  
Figure 21. PGOOD Threshold vs. Temperature  
Figure 18. Tracking Range  
Rev. A | Page 9 of 32  
ADP2441  
Data Sheet  
1200  
1100  
1000  
900  
800  
700  
600  
500  
400  
300  
200  
1200  
1000  
800  
fSW = 1MHz  
fSW = 1MHz  
fSW = 700kHz  
fSW = 700kHz  
600  
400  
fSW = 300kHz  
200  
fSW = 300kHz  
0
0
–50 –30 –10  
10  
30  
50  
70  
90  
110 130 150  
5
10  
15  
20  
(V)  
25  
30  
35  
40  
TEMPERATURE (°C)  
V
IN  
Figure 22. Switching Frequency vs. Supply  
Figure 25. Switching Frequency vs. Temperature  
1.80  
1.78  
1.76  
1.74  
1.72  
1.70  
1.68  
1.66  
1.64  
1.62  
1.60  
1.58  
1.56  
1.54  
1.52  
1.50  
200  
175  
150  
125  
100  
75  
MINIMUM OFF  
V
V
= 36V  
IN  
= 4.5V  
IN  
MINIMUM ON  
50  
25  
0
–50  
0
50  
TEMPERATURE (°C)  
100  
150  
–50 –30 –10  
10  
30  
50  
70  
90  
110 130 150  
TEMPERATURE (°C)  
Figure 26. Current Limit vs. Temperature  
Figure 23. Minimum On Time and Minimum Off Time vs. Temperature  
260  
240  
220  
200  
180  
160  
140  
120  
100  
180  
160  
140  
120  
100  
80  
60  
40  
20  
0
–50  
–25  
0
25  
50  
75  
100  
125  
150  
–50 –30 –10  
10  
30  
50  
70  
90  
110 130 150  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
Figure 27. Low-Side RDS(ON) vs. Temperature  
Figure 24. High-Side RDS(ON) vs. Temperature  
Rev. A | Page 10 of 32  
Data Sheet  
ADP2441  
V
V
OUT  
OUT  
1
1
V
V
f
= 24V  
IN  
OUT  
SW  
= 3.3V  
= 500kHz  
LOAD = 100mA  
INDUCTOR CURRENT  
INDUCTOR CURRENT  
4
4
V
V
= 24V  
= 3.3V  
= 500kHz  
IN  
OUT  
SW  
F
SW  
SW  
2
2
B
B
W
CH1 20.0mV  
CH2 10.0V  
CH4 200mA   
M4.00µs A CH4 120mA  
T 41.40%  
CH1 20.0mV  
CH2 10.0V  
CH4 500mA Ω  
M4.00µs A CH4 120mA  
T 41.40%  
W
Figure 28. Pulse Skip Mode,  
IN = 24 V, VOUT = 3.3 V, fSW = 500 kHz, No Load  
Figure 31. Pulse Skip Mode,  
VIN = 24 V, VOUT = 3.3 V, fSW = 500 kHz, Load = 100 mA  
V
V
V
OUT  
OUT  
1
1
INDUCTOR CURRENT  
INDUCTOR CURRENT  
V
V
f
= 24V  
IN  
OUT  
SW  
= 3.3V  
4
= 500kHz  
LOAD = 1A  
4
2
SW  
SW  
2
B
B
W
CH1 20.0mV  
CH2 10.0V  
CH4 500mA Ω  
M1.00µs  
T 41.40%  
A CH2 9.80V  
CH1 200mV  
CH2 10.0V  
CH4 1.00A Ω  
M2.00ms A CH1 60.0mV  
T 49.40%  
W
Figure 29. PWM Mode,  
VIN = 24 V, VOUT = 3.3 V, fSW = 500 kHz, Load = 1 A  
Figure 32. Hiccup Mode,  
VIN = 24 V, VOUT = 3.3 V, fSW = 500 kHz, Output Short to PGND  
V
V
= 24V fSW = 700kHz  
OUT  
V
IN  
OUT  
1
= 5V LOAD STEP = 300mA  
V
OUT  
V
V
f
= 24V  
IN  
1
= 5V  
OUT  
= 700kHz  
LOAD STEP = 500mA  
SW  
LOAD  
SW  
LOAD  
SW  
4
2
4
2
B
B
CH1 100mV  
CH2 10V  
CH4 500mA Ω  
M200µs A CH4 690mA  
T 79.80%  
CH1 50.0mV  
CH2 10.0V  
W
CH4 200mA Ω  
M200µs A CH4 604mA  
W
Figure 30. Load Transient Response,  
Figure 33. Load Transient Response,  
VIN = 24 V, VOUT = 5 V, fSW = 700 kHz, Load Step = 500 mA  
VIN = 24 V, VOUT = 5 V, fSW = 700 kHz, Load Step = 300 mA  
Rev. A | Page 11 of 32  
 
ADP2441  
Data Sheet  
V
OUT  
1
V
OUT  
V
V
f
= 12V  
IN  
1
= 5V  
OUT  
= 300kHz  
LOAD STEP = 500mA  
SW  
LOAD  
SW  
LOAD  
SW  
V
V
f
= 24V  
= 12V  
= 600kHz  
IN  
OUT  
SW  
LOAD STEP = 500mA  
4
2
4
2
B
B
CH1 100mV  
CH2 5.00V  
M200µs A CH4 690mA  
CH1 200mV  
CH2 10.0V  
M200µs A CH4 600mA  
W
W
CH4 500mA Ω  
CH4 500mA Ω  
Figure 34. Load Transient Response,  
Figure 37. Load Transient Response,  
VIN = 12 V, VOUT = 5 V, fSW = 300 kHz, Load Step = 500 mA  
VIN = 24 V, VOUT = 12 V, fSW = 600 kHz, Load Step = 500 mA  
ENABLE  
V
OUT  
1
V
3
OUT  
PGOOD  
LOAD  
SW  
V
V
f
= 24V  
= 12V  
= 300kHz  
IN  
OUT  
SW  
LOAD STEP = 500mA  
1
4
4
2
V
V
f
= 24V  
IN  
= 5V  
OUT  
= 700kHz  
SW  
B
B
CH1 200mV  
CH2 10.0V  
CH4 500mA Ω  
M200µs A CH4 550mA  
CH1 2.00V  
CH3 5.00V  
M 200µs  
A CH3 1.60V  
W
W
CH4 2.00V  
Figure 35. Load Transient Response,  
IN = 24 V, VOUT = 12 V, fSW = 300 kHz, Load Step = 500 mA  
Figure 38. Power-Good Shutdown,  
V
V
IN = 24 V, VOUT = 5 V, fSW = 700 kHz  
V
ENABLE  
IN  
V
V
f
= 24V  
IN  
= 5V  
OUT  
= 700kHz  
SW  
V
OUT  
V
V
= 36V  
IN  
3
1
3
1
= 5V  
OUT  
f
SW  
= 700kHz  
V
OUT  
SW  
PGOOD  
4
2
B
CH2 10.0V  
B
B
CH1 2.00V  
CH3 2.00V  
M1.00ms  
A CH3 1.64V  
CH1 2.00V  
CH3 10.0V  
W
M4.00ms  
A CH3 5.00V  
W
W
CH4 2.00V  
Figure 36. Power Good Startup,  
VIN = 24 V, VOUT = 5 V, fSW = 700 kHz  
Figure 39. Startup with VIN  
VIN = 36 V, VOUT = 5 V, fSW = 700 kHz, No Load  
,
Rev. A | Page 12 of 32  
Data Sheet  
ADP2441  
ENABLE  
V
IN  
V
V
f
= 36V  
IN  
= 5V  
OUT  
= 700kHz  
LOAD = 5Ω  
SW  
3
1
V
V
f
= 24V  
IN  
V
OUT  
= 5V  
OUT  
V
OUT  
= 700kHz  
SW  
3
1
SS  
SW  
4
2
SW  
2
B
B
CH2 10.0V  
B
CH2 10.0V  
CH4 2.00V  
CH1 2.00V  
CH3 10.0V  
W
M4.00ms  
A CH3 9.00V  
CH1 2.00V  
CH3 5.00V  
M1.00ms  
A CH3 1.40V  
W
W
Figure 40. Startup with VIN  
IN = 36 V, VOUT = 5 V, fSW = 700 kHz, Load = 5 Ω  
,
Figure 43. Soft Start Startup with Precision Enable,  
VIN = 24 V, VOUT = 5 V, fSW = 700 kHz, No Load, Internal SS  
V
110  
90  
200  
160  
120  
80  
ENABLE  
70  
3
V
OUT  
V
V
f
= 24V  
IN  
50  
= 5V  
OUT  
= 700kHz  
LOAD = 5Ω  
SW  
30  
40  
SS  
10  
0
SW  
1
4
–10  
–30  
–50  
–70  
–90  
–40  
–80  
–120  
–160  
–200  
CROSSOVER = 58kHz: 1/12fSW  
PHASE MARGIN = 55°  
V
V
f
= 24V  
IN  
= 5V  
OUT  
= 700kHz  
LOAD = 1A  
SW  
2
B
CH2 10.0V  
CH4 2.00V  
CH1 2.00V  
CH3 5.00V  
M200µs  
A CH3 2.20V  
W
1
10  
FREQUENCY (kHz)  
100  
Figure 44. Magnitude and Phase vs. Frequency  
Figure 41. Shutdown with Precision Enable,  
VIN = 24 V, VOUT = 5 V, fSW = 700 kHz, Load = 5 Ω  
ENABLE  
3
V
OUT  
V
V
f
= 24V  
IN  
= 5V  
OUT  
1
4
SS  
= 700kHz  
LOAD = 5Ω  
SW  
SS = 10nF  
SW  
2
B
CH2 10.0V  
CH1 2.00V  
CH3 5.00V  
M2.00ms  
A CH3 2.20V  
W
CH4 500mV  
Figure 42. Startup with Precision Enable,  
VIN = 24 V, VOUT = 5 V, fSW = 700 kHz, Load = 5 Ω, SS = 10 nF  
Rev. A | Page 13 of 32  
ADP2441  
Data Sheet  
INTERNAL BLOCK DIAGRAM  
AGND  
VIN  
VCC  
INTERNAL LDO  
BST  
EN  
UVLO  
+
1.25V  
BAND GAP  
REFERENCE  
OSC  
FREQ  
COMP  
ENABLE  
CLOCK  
POWER STAGE  
I
SS  
+
PULSE SKIP  
ENABLE  
NMOS  
FB  
+
STATE MACHINE GATE  
CONTROL LOGIC  
COMP  
THRESHOLD  
SS/TRK  
1V  
SW  
+
V
CC  
+
PWM  
V
= 0.6V  
REF  
NMOS  
PWM  
COMPARATOR  
PGND  
HICCUP  
HICCUP  
TIMER  
+
SLOPE  
COMPENSATION/  
RAMP  
GENERATOR  
CURRENT SENSE  
AMPLIFIER  
PGOOD  
115% OF  
FEEDBACK  
CURRENT-LIMIT  
COMPARATOR  
REFERENCE  
CURRENT  
V
FB  
86%OF  
FEEDBACK  
Figure 45. Block Diagram  
Rev. A | Page 14 of 32  
 
Data Sheet  
ADP2441  
THEORY OF OPERATION  
V
IN  
The ADP2441 is a fixed frequency, current mode control, step-  
down, synchronous switching regulator that is capable of  
driving 1 A loads. The device operates with a wide input voltage  
range from 4.5 V to 36 V, and its output is adjustable from 0.6 V  
to 0.9 V × VIN. The integrated high-side N-channel power  
MOSFET and the low-side N-channel power MOSFET yield  
high efficiency with medium to heavy loads. Pulse skip mode is  
available to improve efficiency at light loads.  
CLOCK  
VC  
S
R
Q
V
OUT  
COMP  
PWM DRIVER  
QB  
I
L
COMPARATOR  
R
× I  
L
SWL  
REF  
RAMP  
EMULATION  
BLOCK  
V
RAMP  
gm  
V
FB  
SENSE_  
OUT  
G
The ADP2441 includes programmable features, such as soft  
start, output voltage, switching frequency, and power good.  
These features are programmed externally via tiny resistors and  
capacitors. The ADP2441 also includes protection features, such  
as UVLO with hysteresis, output short-circuit protection, and  
thermal shutdown.  
CS  
Figure 46. Control Architecture Block Diagram  
Pulse Skip Mode  
The ADP2441 has built-in pulse skip circuitry that turns on  
during light loads, switching only as necessary so that the  
output voltage remains within regulation. This allows the  
regulator to maintain high efficiency during operation with  
light loads by reducing switching losses. The pulse skip circuitry  
includes a comparator, which compares the COMP voltage to a  
fixed pulse skip threshold.  
CONTROL ARCHITECURE  
The ADP2441 is based on the emulated peak current mode  
control architecture.  
Fixed Frequency Mode  
A basic block diagram of the control architecture is shown in  
Figure 46. With medium to heavy loads, the ADP2441 operates  
in the fixed switching frequency PWM mode. The output  
voltage, VOUT, is sensed on the feedback pin, FB. An error  
amplifier integrates the error between the feedback voltage and  
the reference voltage (VREF = 0.6 V) to generate an error voltage  
at the COMP pin. A current sense amplifier senses the valley  
inductor current (IL) during the off period when the low-side  
power MOSFET is on and the high-side power MOSFET is off.  
An internal oscillator initiates a PWM pulse to turn off the low-  
side power MOSFET and turn on the high-side power MOSFET  
at a fixed switching frequency. When the high-side N-channel  
power MOSFET is enabled, the valley inductor current  
information is added to an emulated ramp signal, and then the  
PWM comparator compares this value to the error voltage on  
the COMP pin. The output of the PWM comparator modulates  
the duty cycle by adjusting the trailing edge of the PWM pulse  
that turns off the high-side power MOSFET and turns on the  
low-side power MOSFET.  
COMP  
CONTROL  
LOGIC  
PULSE SKIP  
THRESHOLD  
ADP2441  
DC  
1V  
Figure 47. Pulse Skip Comparator  
With light loads, the output voltage discharges at a very slow  
rate (load dependent). When the output voltage is within  
regulation, the device enters sleep mode and draws a very small  
quiescent current. As the output voltage drops below the  
regulation voltage, the COMP voltage rises above the pulse skip  
threshold. The device wakes up and starts switching until the  
output voltage is within regulation.  
As the load increases, the settling value of the COMP voltage  
increases. At a particular load, COMP settles above the pulse skip  
threshold, and the part enters the fixed frequency PWM mode.  
Therefore, the load current at which COMP exceeds the pulse  
skip threshold is defined as the pulse skip current threshold; the  
value varies with the duty cycle and the inductor ripple current.  
Slope compensation is programmed internally into the  
emulated ramp signal and is automatically selected, depending  
on the input voltage, output voltage, and switching frequency.  
This prevents subharmonic oscillations for near or greater than  
50% duty cycle operation. The one restriction of this feature is  
that the inductor ripple current must be set between 0.2 A and  
0.5 A to provide sufficient current information to the loop.  
The measured value of pulse skip threshold over VIN is given in  
Figure 13, Figure 14, and Figure 15.  
Rev. A | Page 15 of 32  
 
 
 
ADP2441  
Data Sheet  
establishing a voltage ramp slope at the SS pin, as shown in  
ADJUSTABLE FREQUENCY  
Figure 49. The soft start period ends when the soft start ramp  
voltage exceeds the internal reference of 0.6 V. The ADP2441  
also features an internal default soft start time of 2 ms. For more  
information, see the Applications Information section.  
The ADP2441 features a programmable oscillator frequency with  
a resistor connected between the FREQ and AGND pins.  
At power-up, the FREQ pin is forced to 1.2 V and current flows  
from the FREQ pin to AGND; the current value is based on the  
resistor value on the FREQ pin. Then, the same current is  
replicated in the oscillator to set the switching frequency. Note  
that the resistor connected to the FREQ pin should be placed as  
close as possible to the FREQ pin (see the Applications  
Information section for more information).  
ENABLE  
3
V
OUT  
POWER GOOD  
SS  
V
V
f
= 24V  
1
2
IN  
The PGOOD pin is an open-drain output that indicates the  
status of the output voltage. When the voltage of the FB pin is  
between 92% and 109% of the internal reference voltage, the  
PGOOD output is pulled high, provided there is a pull-up  
resistor connected to the pin. When the voltage of the FB pin is  
not within this range, the PGOOD output is pulled low to  
AGND. The PGOOD threshold is shown in Figure 48.  
= 5V  
OUT  
= 700kHz  
LOAD = 1A  
SW  
EXTERNAL SS = 10nF  
B
CH2 1.00V  
CH1 2.00V  
CH3 5.00V  
M10.0ms  
A CH1 2.52V  
W
Figure 49. External Soft Start  
Likewise, the PGOOD pin is pulled low to AGND when the  
input voltage is below the internal UVLO threshold, when the  
EN pin is low, or when a thermal shutdown event has occurred.  
TRACKING  
The ADP2441 has a tracking feature that allows the output  
voltage to track an external voltage. This feature is especially  
useful in a system where power supply sequencing and tracking  
is required.  
V
FALLING  
V
RISING  
OUT  
OUT  
116  
110  
100  
The ADP2441 SS/TRK pin is connected to the internal error  
amplifier. The internal error amplifier includes three inputs: the  
internal reference voltage, the SS/TRK voltage, and the feedback  
voltage. The error amplifier regulates the feedback voltage to  
the lower of the other two voltages. To track a master voltage,  
tie the SS/TRK pin to a resistor divider from the master voltage  
as shown in Figure 50.  
100  
90  
84  
UNDERVOLTAGE  
POWER  
GOOD  
OVERVOLAGE POWER  
GOOD  
UNDERVOLTAGE  
PGOOD  
V
OUT  
COMP  
SW  
MASTER  
VOLTAGE  
Figure 48. PGOOD Threshold  
In a typical application, a pull-up resistor connected between the  
PGOOD pin and an external supply is used to generate a logic  
signal. This pull-up resistor should range in value from 30 kΩ  
to 100 kΩ, and the external supply should be less than 5.5 V.  
R
R
R
TOP  
TRK_TOP  
SS/TRK  
FB  
R
TRK_BOT  
BOTTOM  
ADP2441  
Figure 50. Tracking Feature Block Diagram  
SOFT START  
The ratio of the slave output voltage to the master voltage is a  
function of the two dividers as follows:  
The ADP2441 soft start feature allows the output voltage to ramp  
up in a controlled manner, limiting the inrush current during  
startup. An external capacitor connected between the SS/TRK  
and AGND pins is required to program the soft start time.  
RTOP  
RBOTTOM  
1  
1  
VOUT  
VMASTER  
(1)  
The programmable soft start feature is useful when a load  
requires a controlled voltage slew rate at startup. When the  
regulator powers up and soft start is enabled, the internal  
1 μA current source charges the external soft start capacitor,  
RTRK _TOP  
RTRK _ BOT  
Rev. A | Page 16 of 32  
 
 
 
 
 
 
 
Data Sheet  
ADP2441  
Coincident Tracking  
itself to using a resistor divider from the VIN pin (or another  
external supply) to program a desired UVLO threshold that is  
higher than the fixed internal UVLO of 4.2 V. The hysteresis is  
100 mV.  
The most common mode of tracking is coincident tracking. In this  
method, the slope of the slave voltage matches that of the master  
voltage, as shown in Figure 51. As the master voltage rises, the  
slave voltage rises identically. Eventually, the slave voltage reaches  
its regulation voltage, at which point the internal reference takes  
over the regulation while the SS/TRK input continues to increase,  
thus preventing itself from influencing the output voltage.  
If a resistor divider is not used, a logic signal can be applied. A  
logic high enables the part, and a logic low forces the part into  
shutdown mode.  
V
VIN  
BST  
IN  
MASTER VOLTAGE  
SLAVE VOLTAGE  
V
OUT  
SW  
FB  
ADP2441  
R1  
R2  
EN  
FREQ AGND COMP  
TIME  
Figure 51. Coincident Tracking  
Figure 53. Precision Enable Used as a Programmable UVLO  
For coincident tracking, select resistor values such that RTRK_TOP  
= RTOP and RTRK_BOT = RBOTTOM in Equation 1.  
CURRENT-LIMIT AND SHORT-CIRCUIT  
PROTECTION  
Ratiometric Tracking  
The ADP2441 has a current-limit comparator that compares  
the current sensed across the low-side power MOSFET to the  
internally set reference current. If the sensed current exceeds  
the reference current, the high-side power MOSFET is not  
turned on in the next cycle and the low-side power MOSFET  
stays on until the inductor current ramps down below the  
current-limit level.  
In the ratiometric tracking scheme, the master and the slave  
voltages rise with different slopes.  
MASTER VOLTAGE  
SLAVE VOLTAGE  
If the output is overloaded and the peak inductor current exceeds  
the preset current limit for more than eight consecutive clock  
cycles, the hiccup mode current-limit condition occurs. The  
output goes to sleep for 6 ms, during which time the output is  
discharged, the average power dissipation is reduced, and the  
part wakes up with a soft start period. If the current-limit condition  
is triggered again, the output goes to sleep and wakes up after 6 ms.  
Figure 32 shows the current-limit hiccup mode when the output  
is shorted to PGND.  
TIME  
Figure 52. Ratiometric Tracking  
For ratiometric tracking in which the master voltage rises faster  
than the slave voltage (as shown in Figure 52), select RTRK_TOP  
RTOP and RTRK_BOT = RBOTTOM in Equation 1.  
UNDERVOLTAGE LOCKOUT (UVLO)  
THERMAL SHUTDOWN  
The UVLO function prevents the IC from turning on while the  
input voltage is below the specified operating range to avoid an  
undesired operating mode. If the input voltage drops below the  
specified range, the UVLO function shuts off the device. The  
rising input voltage threshold for the UVLO function is 4.2 V  
with 200 mV hysteresis. The 200 mV of hysteresis prevents the  
regulator from turning on and off repeatedly with slow voltage  
ramp on the VIN pin.  
If the ADP2441 junction temperature rises above 150°C, the  
thermal shutdown circuit turns off the switching regulator. Extreme  
junction temperatures can be the result of high current operation,  
poor circuit board design, or high ambient temperature. A 25°C  
hysteresis is included so that when a thermal shutdown occurs,  
the ADP2441 does not return to normal operation until the  
junction temperature drops below 125°C. Soft start is active  
upon each restart cycle.  
PRECISION ENABLE/SHUTDOWN  
The ADP2441 features a precision enable pin (EN) that can be used  
to enable or shut down the device. The 5% accuracy lends  
Rev. A | Page 17 of 32  
 
 
 
 
 
 
ADP2441  
Data Sheet  
APPLICATIONS INFORMATION  
due to the requirement of minimum on time and minimum off  
time for current sensing and robust operation. However, the  
choice is also influenced by whether there is a need for small  
external components. For example, for small, area limited  
power solutions, higher switching frequencies are required.  
100  
SELECTING THE OUTPUT VOLTAGE  
The output voltage is set using a resistor divider connected between  
the output voltage and the FB pin (see Figure 54). The resistor  
divider divides down the output voltage to the 0.6 V FB regulation  
voltage. The output voltage can be set to as low as 0.6 V and as  
high as 90% of the power input voltage.  
90  
D
MAX  
The ratio of the resistive voltage divider sets the output voltage,  
and the absolute value of the resistors sets the divider string  
current. For lower divider string currents, the small 50 nA  
(0.1 μA maximum) FB bias current should be taken into  
account when calculating the resistor values. The FB bias  
current can be ignored for a higher divider string current;  
however, using small feedback resistors degrades efficiency at  
very light loads.  
80  
70  
60  
50  
40  
30  
20  
10  
0
To limit degradation of the output voltage accuracy due to FB  
bias current to less than 0.005% (0.5% maximum), ensure that  
the divider string current is greater than 20 μA. To calculate the  
desired resistor values, first determine the value of the bottom  
resistor, RBOTTOM, as follows:  
D
MIN  
0
200  
400  
600  
800  
1000  
1200  
FREQUENCY (kHz)  
Figure 55. Duty Cycle vs. Switching Frequency  
VREF  
ISTRING  
Calculate the value of the frequency resistor using the following  
equation:  
RBOTTOM  
(2)  
(3)  
where:  
92,500  
fSW  
RFREQ  
(4)  
VREF is the internal reference and equals 0.6 V.  
ISTRING is the resistor divider string current.  
where RFREQ is in kΩ, and fSW is in kHz.  
Then calculate the value of the top resistor, RTOP, as follows:  
Table 6 and Figure 56 provide examples of frequency resistor  
values, which are based on the switching frequency.  
VOUT VREF  
RTOP RBOTTOM   
VREF  
Table 6. Frequency Resistor Selection  
V
OUT  
RFREQ (kΩ)  
Frequency  
300 kHz  
700 kHz  
1 MHz  
ADP2441  
308  
132  
92.5  
R
TOP  
FB  
R
BOTTOM  
PGOOD  
R
FREQ SS/TRK  
1200  
1100  
1000  
900  
800  
700  
600  
500  
400  
300  
200  
C
FREQ  
SS  
EXTERNAL  
SUPPLY  
Figure 54. Voltage Divider  
Table 5. Output Voltage Selection  
Voltage (V)  
RTOP (kΩ)  
190  
73  
RBOTTOM (kΩ)  
12  
5
3.3  
1.2  
10  
10  
10  
10  
45  
10  
50  
100  
150  
200  
250  
300  
350  
SETTING THE SWITCHING FREQUENCY  
RESISTANCE (k)  
The choice of the switching frequency depends on the required  
dc-to-dc conversion ratio and is limited by the minimum and  
maximum controllable duty cycle, as shown in Figure 55. This is  
Figure 56. Frequency vs. Resistance  
Rev. A | Page 18 of 32  
 
 
 
 
 
 
 
Data Sheet  
ADP2441  
due to their poor temperature and dc bias characteristics. Table 10  
shows a list of recommended MLCC capacitors from Murata  
and Taiyo Yuden.  
SOFT START  
The soft start function limits the input inrush current and  
prevents output overshoot at startup. The soft start time is  
programmed by connecting a small ceramic capacitor between  
the SS/TRK and AGND pins, with the value of this capacitor  
defining the soft start time, tSS, as follows:  
For large step load transients, add more bulk capacitance by, for  
example, using electrolytic or polymer capacitors. Make sure  
that the ripple current rating of the bulk capacitor exceeds the  
minimum input ripple current of a particular design.  
VREF  
tSS  
ISS  
CSS  
(5)  
Inductor Selection  
The high switching frequency of the ADP2441 allows for  
minimal output voltage ripple even when small inductors are used.  
Selecting the size of the inductor involves considering the trade-off  
between efficiency and transient response. A smaller inductor  
results in larger inductor current ripple, which provides excellent  
transient response but degrades efficiency. Due to the high  
switching frequency of the ADP2441, using shielded ferrite core  
inductors is recommended because of their low core losses and  
low EMI.  
where:  
REF is the internal reference voltage and equals 0.6 V.  
ISS is the soft start current and equals 1 μA.  
CSS is the soft start capacitor value.  
V
Table 7. Soft Start Time Selection  
Soft Start Capacitor (nF)  
Soft Start Time (ms)  
5
3
10  
20  
6
12  
The inductor ripple current also affects the stability of the loop  
because the ADP2441 uses the emulated peak current mode  
architecture. In the traditional approach of slope compensation,  
the user sets the inductor ripple current and then sets the slope  
compensation using an external ramp resistor. In most cases, the  
inductor ripple current is typically set to be 1/3 of the maximum  
load current for optimal transient response and efficiency. The  
ADP2441 has internal slope compensation, which assumes that  
the inductor ripple current is set to 0.3 A (30% of the maximum  
load of 1 A), eliminating the need for an external ramp resistor.  
Alternatively, the user can float the SS/TRK pin and use the  
internal soft start time of 2 ms.  
EXTERNAL COMPONENTS SELECTION  
Input Capacitor Selection  
The input current to a buck regulator is pulsating in nature. The  
current is zero when the high-side switch is off and is approxi-  
mately equal to the load current when the switch is on. Because  
switching occurs at reasonably high frequencies (300 kHz to  
1 MHz), the input bypass capacitor usually supplies most of  
the high frequency current (ripple current), allowing the input  
power source to supply only the average (dc) current. The input  
capacitor needs a sufficient ripple current rating to handle the  
input ripple and needs an ESR that is low enough to mitigate the  
input voltage ripple. In many cases, different types of capacitors  
are placed in parallel to minimize the effective ESR and ESL.  
For the ADP2441, choose an inductor such that the peak-to-  
peak ripple current of the inductor is between 0.2 A and 0.5 A  
for stable operation.  
Therefore, calculate the inductor value as follows:  
VOUT (VIN VOUT  
VIN fSW L  
)
IL   
(8)  
(9)  
0.2 A ≤ ΔIL ≤ 0.5 A  
The minimum input capacitance required for a particular load is  
2VOUT (VIN VOUT  
VIN fSW  
)
5VOUT (VIN VOUT  
VIN fSW  
)
L   
I
OUT D (1D)  
CIN _ MIN  
(6)  
(VPP IOUT D RESR ) fSW  
3.3VOUT (VIN VOUT  
)
L
IDEAL   
where:  
VPP is the desired input ripple voltage.  
ESR is the equivalent series resistance of the capacitor.  
OUT is the maximum load current.  
VIN fSW  
where:  
R
I
VIN is the input voltage.  
OUT is the desired output voltage.  
SW is the regulator switching frequency.  
V
f
It is recommended to use a ceramic bypass capacitor because  
the ESR associated with this type of capacitor is near zero,  
simplifying the equation to  
For applications with a wide input (VIN) range, choose the  
inductor based on the geometric mean of the input voltage  
extremes.  
I
OUT D (1D)  
CIN _ MIN  
(7)  
V
PP fSW  
VIN(GEOMETRIC) VIN _ MAX VIN _ MIN  
In addition, it is recommended to use a ceramic capacitor with a  
voltage rating that is 1.5 times the input voltage with X5R and X7R  
dielectrics. Using Y5V and Z5U dielectrics is not recommended  
where:  
V
IN_MAX is the maximum input voltage.  
V
IN_MIN is the minimum input voltage.  
Rev. A | Page 19 of 32  
 
 
ADP2441  
Data Sheet  
The inductor value is based on VIN(GEOMETRIC) as follows:  
Output Capacitor Selection  
3.3VOUT (VIN(GEOMETRIC) VOUT  
VIN(GEOMETRIC) fSW  
)
The output capacitor selection affects both the output voltage  
ripple and the loop dynamics of the regulator. The ADP2441 is  
designed to operate with small ceramic output capacitors that  
have low ESR and ESL; therefore, the device can easily meet  
tight output voltage ripple specifications. For best performance,  
use X5R or X7R dielectric capacitors with a voltage rating that is  
1.5 times the output voltage and avoid using Y5V and Z5U  
dielectric capacitors, which have poor temperature and dc bias  
characteristics. Table 10 lists some recommended capacitor  
from Murata and Taiyo Yuden.  
LIDEAL  
Table 8. Inductor Values for Various VIN, VOUT, and fSW  
Combinations  
Inductor Value  
fSW (kHz)  
300  
VIN (V)  
12  
12  
24  
24  
24  
36  
36  
36  
12  
12  
24  
24  
24  
36  
36  
12  
24  
24  
36  
VOUT (V)  
3.3  
5
3.3  
5
12  
3.3  
5
12  
3.3  
5
3.3  
5
12  
3.3  
5
Min (μH)  
22  
27  
27  
39  
56  
27  
39  
68  
12  
15  
15  
18  
27  
15  
22  
6.8  
10  
Max (μH)  
27  
33  
33  
47  
68  
33  
47  
82  
15  
18  
18  
22  
33  
18  
27  
10  
300  
300  
300  
300  
300  
300  
300  
600  
600  
600  
600  
600  
600  
600  
1000  
1000  
1000  
1000  
For acceptable maximum output voltage ripple, determine the  
minimum output capacitance, COUT(MIN), as follows:  
1
VRIPPLE  IL ESR   
(11)  
8fSW COUT(MIN)  
Therefore,  
COUT(MIN)  
where:  
IL  
(12)  
8fSW (VRIPPLE  IL ESR)  
ΔVRIPPLE is the allowable peak-to-peak output voltage ripple.  
ΔIL is the inductor ripple current.  
ESR is the equivalent series resistance of the capacitor.  
fSW is the switching frequency of the regulator.  
5
5
12  
5
12  
22  
15  
18  
12  
If there is a step load requirement, choose the output capacitor  
value based on the value of the step load. For the maximum accep-  
table output voltage droop/overshoot caused by the step load,  
To avoid inductor saturation and ensure proper operation, choose  
the inductor value so that neither the saturation current nor  
the maximum temperature rated current ratings are exceeded.  
Inductor manufacturers specify both of these ratings in data  
sheets, or the rating can be calculated as follows:  
3
COUT(MIN)  IOUT(STEP)   
(13)  
fSW  VDROOP  
where:  
ΔIOUT(STEP) is the load step.  
SW is the switching frequency of the regulator.  
IL  
2
f
IL _ PEAK ILOAD(MAX)  
(10)  
ΔVDROOP is the maximum allowable output voltage droop/overshoot.  
where:  
LOAD(MAX) is the maximum dc load current.  
ΔIL is the peak-to-peak inductor ripple current.  
Select the largest output capacitance given by Equation 12 and  
Equation 13. When choosing the type of ceramic capacitor for the  
output filter of the regulator, select one with a nominal capacitance  
that is 20% to 30% larger than the calculated value because the  
effective capacitance degrades with dc voltage and temperature.  
Figure 57 shows the capacitance loss due to the output voltage  
dc bias for three X7R MLCC capacitors from Murata.  
I
Table 9. Recommended Inductors  
Small Size Inductors  
Value (μH) (<10 mm × 10 mm)  
Large Size Inductors  
(>10 mm × 10 mm)  
10  
18  
33  
15  
XAL4040-103ME  
LPS6235-183ML  
LPS6235-33ML  
XAL4040-153ME  
MSS1260  
MSS1260  
MSS1260  
MSS1260  
Rev. A | Page 20 of 32  
Data Sheet  
ADP2441  
30.0  
LOOP COMPENSATION  
The ADP2441 uses peak current mode control architecture for  
excellent load and line transient response. This control architecture  
has two loops: an external voltage loop and an inner current loop.  
24.6  
19.2  
13.8  
8.40  
The inner current loop senses the current in the low-side switch  
and controls the duty cycle to maintain the average inductor  
current. Slope compensation is added to the inner current loop  
to ensure stable operation when the duty cycle is above 50%.  
22µF/25V  
10µF/25V  
The external voltage loop senses the output voltage and adjusts  
the duty cycle to regulate the output voltage to the desired  
value. A transconductance amplifier with an external series RC  
network connected to the COMP pin compensates the external  
voltage loop.  
3.00  
0
5
10  
15  
20  
25  
DC BIAS VOLTAGE (V)  
Figure 57. Capacitance vs. DC Bias Voltage  
ADP2441  
For example, to attain 20 μF of output capacitance with an output  
voltage of 5 V while providing some margin for temperature  
variation, use a 22 μF capacitor with a voltage rating of 25 V  
and a 10 μF capacitor with a voltage rating of 25 V in parallel.  
This configuration ensures that the output capacitance is  
sufficient under all conditions and, therefore, that the device  
exhibits stable behavior.  
COMP  
VFB  
R
C
COMP  
gm  
0.6V  
COMP  
AGND  
Table 10. Recommended Output Capacitors for ADP2441  
Vendor  
Figure 58. RC Compensation Network  
Capacitor  
10 μF/25 V  
22 μF/25 V  
47 μF/6.3 V  
4.7 μF/50 V  
Murata  
Taiyo Yuden  
LARGE SIGNAL ANALYSIS OF THE LOOP  
COMPENSATION  
GRM32DR71E106KA12L  
GRM32ER71E226KE15L  
GCM32ER70J476KE19L  
GRM31CR71H475KA12L  
TMK325B7106KN-TR  
TMK325B7226MM-TR  
JMK325B7476MM-TR  
UMK325B7475MMT  
The control loop can be broken down into the following three  
sections:  
VOUT to VCOMP  
VCOMP to IL  
IL to VOUT  
BOOST CAPACITOR  
The boost pin (BST) is used to power up the internal driver for the  
high-side power MOSFET. In the ADP2441, the high-side power  
MOSFET is an N-channel device to achieve high efficiency in  
mid and high duty cycle applications. To power up the high-side  
driver, a capacitor is required between the BST and SW pins.  
The size of this boost capacitor is critical because it affects the  
light load functionality and efficiency of the device. Therefore,  
choose a boost ceramic capacitor with a value between 10 nF to  
22 nF with a voltage rating of 50 V and place the capacitor as  
close as possible to the IC. It is recommended to use a boost  
capacitor within this range because a capacitor beyond 22 nF  
can cause the LDO to reach the current-limit threshold.  
V
IN  
INDUCTOR  
CURRENT  
SENSE  
PULSE-WIDTH  
MODULATOR  
I
L
V
OUT  
C
OUT  
R
LOAD  
V
COMP  
g
G
m
VCC CAPACITOR  
V
= 0.6V  
REF  
ADP2441  
The ADP2441 has an internal regulator to power up the internal  
controller and the low-side driver. The VCC pin is the output of  
the internal regulator. The internal regulator provides the pulse  
current when the low-side driver turns on. Therefore, it is recom-  
mended that a 1 ꢀF ceramic capacitor be placed between the VCC  
and PGND pins as close as possible to the IC and that a 1 ꢀF  
ceramic capacitor be placed between the VCC and AGND pins.  
R
C
COMP  
COMP  
Figure 59. Large Signal Model  
Rev. A | Page 21 of 32  
 
 
 
 
 
 
ADP2441  
Data Sheet  
Correspondingly, there are three transfer functions:  
At the crossover frequency, the gain of the open-loop transfer  
function is unity.  
V
V
COMP (s) VREF  
OUT (s) VOUT  
gm ZCOMP (s)  
(14)  
(15)  
(16)  
H(fCROSSOVER) = 1  
(20)  
This yields Equation 21 for the RC compensation network  
impedance at the crossover frequency.  
IL (s)  
COMP (s)  
GCS  
V
2fCROSSOVER COUT VOUT  
Z
COMP ( fCROSSOVER)   
(21)  
(22)  
V
IL (s)  
OUT (s)  
g
m GCS  
VREF  
ZFILT (s)  
Placing s = fCROSSOVER in Equation 17,  
where:  
12 fCROSSOVER RCOMP CCOMP  
Z
COMP ( fCROSSOVER)   
gm is the transconductance of the error amplifier and equals  
250 ꢀA/V.  
2 fCROSSOVER CCOMP  
GCS is the current sense gain and equals 2 A/V.  
To ensure that there is sufficient phase margin at the crossover  
frequency, place the compensator zero at 1/8 of the crossover  
frequency, as shown in the following equation:  
V
V
OUT is the output voltage of the regulator.  
REF is the internal reference voltage and equals 0.6 V.  
ZCOMP(s) is the impedance of the RC compensation network that  
1
fCROSSOVER  
fZERO  
(23)  
forms a pole at the origin and a zero as expressed in Equation 17.  
2RCOMP CCOMP  
8
1sRCOMP CCOMP  
Z
COMP (s)   
(17)  
Solving Equation 21, Equation 22, and Equation 23 yields the  
value for the resistor and capacitor in the RC compensation  
network, as shown in Equation 24 and Equation 25.  
sCCOMP  
ZFILT(s) is the impedance of the output filter and is expressed as  
RLOAD  
1sRLOAD COUT  
2 fCROSSOVER  
C
OUT VOUT  
VREF  
Z
FILT (s)   
(18)  
RCOMP 0.9  
(24)  
(25)  
g
m GCS  
where s is the angular frequency, which can be written as s = 2πf.  
1
CCOMP  
The overall loop gain, H(s), is obtained by multiplying the three  
transfer functions previously mentioned as follows:  
2 fZERO RCOMP  
Using these equations allows calculating the compensations for  
the voltage loop.  
VREF  
VOUT  
H(s) gm GCS   
ZCOMP (s)ZFILT (s)  
(19)  
When the switching frequency (fSW), output voltage (VOUT),  
output inductor (L), and output capacitor (COUT) values are  
selected, the unity crossover frequency can be set to 1/12 of the  
switching frequency.  
Rev. A | Page 22 of 32  
Data Sheet  
ADP2441  
DESIGN EXAMPLE  
Consider an application with the following specifications:  
Soft Start Capacitor  
For a given soft start time, the soft start capacitor can be calculated  
using Equation 5,  
VIN =24 V 10%  
VOUT = 5 V 1%  
Switching frequency = 700 kHz  
Load = 800 mA typical  
Maximum load current = 1 A  
Soft start time = 6 ms  
VREF  
tSS  
ISS  
CSS  
I
SS tSS  
VREF  
CSS  
CSS  
Overshoot ≤ 2% under all load transient conditions  
1μA 6 ms  
CONFIGURATION AND COMPONENTS SELECTION  
Resistor Divider  
10 nF  
0.6 V  
Inductor Selection  
Select the inductor by using Equation 9.  
The first step in selecting the external components is to  
calculate the resistance of the resistor divider that sets the  
output voltage.  
3.3VOUT (VIN VOUT  
VIN fSW  
)
LIDEAL  
Using Equation 2 and Equation 3,  
VREF  
ISTRING 60 μA  
0.6  
3.35 V(24 5) V  
24 V700 kHz  
RBOTTOM  
10 kꢁ  
L
IDEAL   
18.66μH 18.3μH  
VOUT VREF  
In Equation 9, VIN = 24 V, VOUT = 5 V, ILOAD(MAX) = 1 A, and fSW  
=
RTOP RBOTTOM   
VREF  
700 kHz, which results in L = 18.66 ꢀH. When L = 18 μH (the  
closest standard value) in Equation 8, ΔIL = 0.314 A. Although  
the maximum output current required is 1 A, the maximum  
peak current is 1.6 A. Therefore, the inductor should be rated  
for higher than 1.6 A current.  
5 V 0.6 V  
RTOP 10 k  
73.3 kꢁ  
0.6 V  
Switching Frequency  
Input Capacitor Selection  
Choosing the switching frequency involves considering the  
trade-off between efficiency and component size. Low  
frequency improves the efficiency by reducing the gate losses  
but requires a large inductor. The choice of high frequency is  
limited by the minimum and maximum duty cycle.  
The input filter consists of a small 0.1 ꢀF ceramic capacitor  
placed as close as possible to the IC.  
The minimum input capacitance required for a particular load is  
I
OUT D (1D)  
CIN _ MIN  
Table 11. Duty Cycle  
VPP fSW  
VIN  
Duty Cycle  
where:  
VPP = 50 mV.  
OUT = 1 A.  
D = 0.23.  
SW = 700 kHz.  
Therefore,  
24 V (Nominal)  
26 V (10% Above Nominal)  
22 V (10% Less than Nominal)  
DNOMINAL = 20.8%  
DMIN = 19%  
DMAX = 23%  
I
f
Based on the estimated duty cycle range, choose the switching  
frequency according to the minimum and maximum duty cycle  
limitations, as shown in Figure 55. For example, a 700 kHz,  
frequency is well within the maximum and minimum duty  
cycle limitations.  
1 A 0.22(10.22)  
0.05 V 700 kHz  
CIN _ MIN  
4.9 μF  
Choosing an input capacitor of 10 ꢀF with a voltage rating of  
50 V ensures sufficient capacitance over voltage and temperature.  
Using Equation 4,  
92,500  
RFREQ  
fSW  
FREQ = 132 kΩ  
R
Rev. A | Page 23 of 32  
 
 
ADP2441  
Data Sheet  
Output Capacitor Selection  
Selecting the crossover frequency to be 1/12 of the switching  
frequency and placing the zero frequency at 1/8 of the crossover  
frequency ensures that there is enough phase margin in the system.  
Select the output capacitor by using Equation 12 and Equation 13:  
IL  
COUT(MIN)  
Table 13. Calculated Parameter Value  
8fSW (VRIPPLE  IL ESR)  
Parameter  
fCROSSOVER  
fZERO  
VREF  
gm  
Test Conditions/Comments  
Value  
Equation 12 is based on the output voltage ripple (ΔVRIPPLE),  
which is 1% of the output voltage.  
1/12 of fSW  
1/8 of fCROSSOVER  
Fixed reference  
Transconductance of error  
amplifier  
58.3 kHz  
7.3 kHz  
0.6 V  
3
COUT(MIN)  IOUT(STEP)  
250 μA/V  
fSW  VDROOP  
Equation 13 calculates the capacitor selection based on the  
transient load performance requirement of 2%. Perform these  
calculations, and then use the equation that yields the larger  
capacitor size to select a capacitor.  
GCS  
COUT  
VOUT  
Current sense gain  
Output capacitor  
Output voltage  
2 A/V  
22 μF  
5 V  
In this example, the values listed in Table 12 are substituted for  
the variables in Equation 12 and Equation 13.  
Based on the values listed in Table 13, calculate the compen-  
sation value:  
258.3 225  
Table 12. Requirements  
RCOMP 0.9  
121 k  
2502  
0.6  
Parameter  
Test Conditions/Comments  
Value  
Ripple Current  
Voltage Ripple  
Voltage Droop Due  
to Load Transient  
Fixed at 0.3 A for the ADP2441 0.3 A  
The closest standard resistor value is 118 kΩ. Therefore,  
1% of VOUT  
2% of VOUT  
50 mV  
100 mV  
1
CCOMP  
185 pF 180 pF  
27.3118  
ESR  
fSW  
5 mΩ  
700 kHz  
SYSTEM CONFIGURATION  
Configure the system as follows:  
1. Connect a capacitor of 1 ꢀF between the VCC and PGND  
pins and another capacitor of 1 ꢀF between the VCC and  
AGND pins. For best performance, use ceramic X5R or  
X7R capacitors with a 25 V voltage rating.  
2. Connect a ceramic capacitor of 10 nF with a 50 V voltage  
rating between the BST and SW pins.  
3. Connect a resistor between the FREQ and AGND pins as  
close as possible to the IC.  
4. If using the power-good feature, connect a pull-up resistor  
of 50 kΩ to an external supply of 5 V.  
The calculation based on the output voltage ripple (see  
Equation 12) dictates that the minimum output capacitance is  
0.3 A  
COUT(MIN)  
1.1μF  
8700 kHz(50 mV 0.3 A5 mꢁ)  
whereas the calculation based on the transient load (see  
Equation 13) dictates that the minimum output capacitance is  
3
COUT(MIN) 0.5  
22 F  
700 kHz0.1 V  
5. Connect a capacitor of 10 nF between the SS and AGND pins.  
If the tracking feature is needed, connect a resistor divider  
between the TRK pin and another supply, as shown in  
Figure 50.  
To meet both requirements, use the value determined by the  
latter equation. As shown in Figure 57, capacitance degrades  
with dc bias; therefore, choose a capacitor that is 1.5 times the  
calculated value.  
See Figure 60 for a schematic of this design example and Table 14  
for the calculated component values.  
C
OUT = 1.5 × 22 ꢀF = 32 ꢀF  
Compensation Selection  
Calculate the compensation component values for the feedback  
loop by using the following equations:  
2 fCROSSOVER  
C
OUT VOUT  
VREF  
RCOMP 0.9  
g
m GCS  
1
CCOMP  
2 fZERO RCOMP  
Rev. A | Page 24 of 32  
 
 
 
Data Sheet  
ADP2441  
TYPICAL APPLICATION CIRCUITS  
DESIGN EXAMPLE  
VIN = 24 V 10%, VOUT = 5 V, fSW = 700 kHz.  
C3  
1µF/25V  
V
24V  
IN  
C5  
10nF/50V  
C4  
1µF/25V  
C2  
4.7µF/  
50V  
C1  
4.7µF/  
50V  
FB  
VIN  
L1  
V
OUT  
R5  
118k  
18µH  
R3  
10kꢀ  
5V, 1A  
ADP2441  
COMP  
EN  
SW  
C10  
180pF  
C6  
0.1µF  
C7  
22µF  
C8  
10µF  
PGND  
EXT  
R2  
73.3kꢀ  
R7  
50kꢀ  
C11  
10nF  
PGOOD  
TRK  
R9  
132kꢀ  
Figure 60. ADP2441 Typical Application Circuit, VIN = 24 V 10%, VOUT = 5 V, fSW = 700 kHz  
Table 14. Calculated Component Values for Figure 60  
Qty.  
Ref  
C1, C2  
C3, C4  
C5, C11  
C7  
C8  
L1  
C6  
C10  
R9  
Value  
4.7 μF  
1 μF  
10 nF  
22 μF  
Description  
Part Number  
2
2
2
1
1
1
1
1
1
1
1
1
Capacitor ceramic, X7R, 50 V  
Capacitor ceramic, 1 μF, 25 V, X7R, 10%, 0603  
Capacitor ceramic, 10,000 pF, 50 V, 10%, X7R, 603 ECJ-1VB1H103K  
Capacitor ceramic, 22 μF, 25 V, X7R, 1210  
Capacitor ceramic, 10 μF, 25 V, X7R, 1210  
Inductor, 18.3 μH  
Capacitor ceramic, 0.1 μF, 50 V, X7R, 0805  
Capacitor ceramic, 50 V  
Resistor, 1/10 W, 1%, 0603, SMD  
Resistor, 1/10 W, 1%, 0603, SMD  
Resistor, 1/10 W, 1%, 0603, SMD  
Resistor, 1/10 W, 1%, 0603, SMD  
Resistor, 1/10 W, 1%, 0603, SMD  
GRM31CR71H475KA12L  
GRM188R71E105KA12D  
GRM32ER71E226K  
10 μF  
GRM32DR71E106KA12L  
CoilCraft MSS1260T-183NLB  
ECJ-2FB1H104K  
18.3 μH  
0.1 μF  
185 pF  
132 kΩ  
118 kΩ  
74 kΩ  
10 kΩ  
50 kΩ  
Vishay, Panasonic  
R5  
R2  
R3  
R7  
1
Rev. A | Page 25 of 32  
 
 
 
 
ADP2441  
Data Sheet  
OTHER TYPICAL CIRCUIT CONFIGURATIONS  
VIN = 24 V 10%, VOUT = 12 V, fSW = 600 kHz.  
C3  
1µF/25V  
V
IN  
C4  
1µF/25V  
C5  
10nF/50V  
24V  
C2  
4.7µF/  
50V  
C1  
4.7µF/  
50V  
FB  
COMP  
VIN  
L1  
33.3µH  
V
OUT  
R5  
121k  
R3  
10kꢀ  
12V, 1A  
ADP2441  
SW  
C10  
220pF  
C6  
0.1µF  
C7  
22µF/  
25V  
EN  
PGND  
EXT  
R2  
191kꢀ  
F
SW  
600kHz  
R7  
50kꢀ  
C11  
10nF  
PGOOD  
TRK  
R9  
154kꢀ  
Figure 61. ADP2441 Typical Application Circuit, VIN = 24 V 10%, VOUT = 12 V, fSW = 600 kHz  
Table 15. Calculated Component Values for Figure 61  
Qty.  
Ref  
C1, C2  
C3, C4  
C5, C11  
C7  
L1  
C6  
C10  
R9  
R5  
Value  
4.7 μF  
1 μF  
10 nF  
22 μF  
33.3 μH  
0.1 μF  
220 pF  
154 kΩ  
121 kΩ  
191 kΩ  
10 kΩ  
50 kΩ  
Description  
Part Number  
2
2
2
1
1
1
1
1
1
1
1
1
Capacitor ceramic, X7R, 50 V  
Capacitor ceramic, 1 μF, 25 V, X7R, 10%, 0603  
Capacitor ceramic, 10000 pF, 50 V, 10%, X7R, 0603 ECJ-1VB1H103K  
Capacitor ceramic, 22 μF, 25 V, X7R, 1210  
Inductor, 33.3 μH  
Capacitor ceramic, 0.1 μF, 50 V, X7R, 0805  
Capacitor ceramic, 50 V  
Resistor, 1/10 W, 1%, 0603, SMD  
Resistor, 1/10 W, 1%, 0603, SMD  
Resistor, 1/10 W, 1%, 0603, SMD  
Resistor, 1/10 W, 1%, 0603, SMD  
Resistor, 1/10 W, 1%, 0603, SMD  
GRM31CR71H475KA12L  
GRM188R71E105KA12D  
GRM32ER71E226K  
CoilCraft MSS1038-333ML  
ECJ-2FB1H104K  
Vishay, Panasonic  
R2  
R3  
R7  
Rev. A | Page 26 of 32  
 
 
Data Sheet  
ADP2441  
VIN = 12 V 10%, VOUT = 5 V, fSW = 500 kHz.  
C3  
1µF/25V  
V
IN  
C4  
1µF/25V  
C5  
10nF/50V  
12V  
C2  
4.7µF/  
50V  
C1  
4.7µF/  
50V  
FB  
VIN  
L1  
V
OUT  
R5  
118kꢀ  
18µH  
R3  
10kꢀ  
5V, 1A  
ADP2441  
COMP  
EN  
SW  
C10  
270pF  
C6  
0.1µF  
C7  
22µF  
C8  
22µF  
PGND  
EXT  
R2  
73.3kꢀ  
F
SW  
500kHz  
R7  
50kꢀ  
C11  
10nF  
PGOOD  
TRK  
R9  
185kꢀ  
Figure 62. ADP2441 Typical Application Circuit, VIN = 12 V 10%, VOUT = 5 V, fSW = 500 kHz  
Table 16. Calculated Component Values for Figure 62  
Qty.  
Ref  
C1, C2  
C3, C4  
C5, C11  
C7  
C8  
L1  
C6  
C10  
R9  
Value  
4.7 μF  
1 μF  
10 nF  
22 μF  
Description  
Part Number  
2
2
2
1
1
1
1
1
1
1
1
1
Capacitor ceramic, X7R, 50 V  
GRM31CR71H475KA12L  
GRM188R71E105KA12D  
ECJ-1VB1H103K  
Capacitor ceramic, 1 μF, 25 V, X7R, 10%, 0603  
Capacitor ceramic, 10,000 pF, 50 V, 10%, X7R, 0603  
Capacitor ceramic, 22 μF, 25 V, X7R, 1210  
Capacitor ceramic, 22 μF, 25 V, X7R, 1210  
Inductor, 18.3 μH  
GRM32ER71E226K  
22 μF  
18.3 μH  
0.1 μF  
270 pF  
185 kΩ  
118 kΩ  
74 kΩ  
10 kΩ  
50 kΩ  
CoilCraft MSS1038-183ML  
ECJ-2FB1H104K  
Vishay, Panasonic  
Capacitor ceramic, 0.1 μF, 50 V, X7R, 0805  
Capacitor ceramic, 50 V  
Resistor, 1/10 W, 1%, 0603, SMD  
Resistor, 1/10 W, 1%, 0603, SMD  
Resistor, 1/10 W, 1%, 0603, SMD  
Resistor, 1/10 W, 1%, 0603, SMD  
Resistor, 1/10 W, 1%, 0603, SMD  
R5  
R2  
R3  
R7  
1
Rev. A | Page 27 of 32  
 
ADP2441  
Data Sheet  
VIN = 36 V 10%, VOUT = 3.3 V, fSW = 300 kHz.  
C3  
1µF/25V  
V
IN  
C4  
1µF/25V  
C5  
10nF/50V  
36V  
C2  
4.7µF/  
50V  
C1  
4.7µF/  
50V  
FB  
VIN  
L1  
V
OUT  
R5  
91k  
33.3µH  
R3  
10kꢀ  
3.3V, 1A  
ADP2441  
COMP  
EN  
SW  
C10  
560pF  
C6  
0.1µF  
C7  
47µF  
C8  
47µF  
PGND  
EXT  
R2  
45kꢀ  
F
SW  
300kHz  
R7  
50kꢀ  
C11  
10nF  
PGOOD  
TRK  
R9  
300kꢀ  
Figure 63. ADP2441 Typical Application Circuit, VIN = 36 V 10%, VOUT = 3.3 V, fSW = 300 kHz  
Table 17. Calculated Component Values for Figure 63  
Qty.  
Ref  
C1, C2  
C3, C4  
C5, C11  
C7  
C8  
L1  
C6  
C10  
R9  
Value  
4.7 μF  
1 μF  
Description  
Part Number  
2
2
2
1
1
1
1
1
1
1
1
1
Capacitor ceramic, X7R, 50 V  
GRM31CR71H475KA12L  
GRM188R71E105KA12D  
ECJ-1VB1H103K  
GRM32ER70J476KE20L  
GRM32ER70J476KE20L  
CoilCraft MSS1038T-333ML  
ECJ-2FB1H104K  
Capacitor ceramic, 1 μF, 25 V, X7R, 10%, 0603  
Capacitor ceramic, 10,000 pF, 50 V, 10%, X7R, 0603  
Capacitor ceramic, 47 μF, 6.3 V, X7R, 1210  
Capacitor ceramic, 47 μF, 6.3 V, X7R, 1210  
Inductor, 33.3 μH  
10 nF  
47 μF  
47 μF  
33.3 μH  
0.1 μF  
560 pF  
300 kΩ  
91 kΩ  
45 kΩ  
10 kΩ  
50 kΩ  
Capacitor ceramic, 0.1 μF, 50 V, X7R, 0805  
Capacitor ceramic, 50 V  
Vishay, Panasonic  
Resistor, 1/10 W, 1%, 0603, SMD  
Resistor, 1/10 W, 1%, 0603, SMD  
Resistor, 1/10 W, 1%, 0603, SMD  
Resistor, 1/10 W, 1%, 0603, SMD  
Resistor, 1/10 W, 1%, 0603, SMD  
R5  
R2  
R3  
R7  
1
Rev. A | Page 28 of 32  
 
Data Sheet  
ADP2441  
POWER DISSIPATION AND THERMAL CONSIDERATIONS  
Transition Losses  
POWER DISSIPATION  
The efficiency of a dc-to-dc regulator is  
POUT  
Transition losses occur because the N-channel MOSFET power  
switch cannot turn on or off instantaneously. During a switch  
node transition, the power switch provides all of the inductor  
current, and the source-to-drain voltage of the power switch is  
half the input, resulting in power loss. Transition losses increase  
as the load current and input voltage increase, and these losses  
occur twice for each switching cycle.  
Efficiency   
100%  
(26)  
PIN  
where:  
PIN is the input power.  
OUT is the output power.  
The power loss of a dc-to-dc regulator is  
LOSS = PIN POUT  
There are four main sources of power loss in a dc-to-dc regulator:  
P
The transition losses can be calculated as follows:  
P
VIN  
2
PTRANS  
IOUT (tON tOFF ) fSW  
(30)  
where tON and tOFF are the rise time and fall time of the switch  
node and are each approximately 10 ns for a 24 V input.  
Inductor losses  
Power switch conduction losses  
Switching losses  
THERMAL CONSIDERATIONS  
Transition losses  
The power dissipated by the regulator increases the die junction  
temperature, TJ, above the ambient temperature, TA, as follows:  
Inductor Losses  
TJ = TA + TR  
(31)  
Inductor conduction losses are caused by the flow of current  
through the inductor DCR (internal resistance).  
where the temperature rise, TR, is proportional to the power  
dissipation, PD, in the package.  
The inductor power loss (excluding core loss) is  
PL = IOUT2 × DCRL  
The proportionality coefficient is defined as the thermal  
resistance from the junction temperature of the die to the  
ambient temperature as follows:  
(27)  
Power Switch Conduction Losses  
Power switch conductive losses are due to the output current, IOUT  
flowing through the N-channel MOSFET power switches that  
have internal resistance, RDS(ON). The amount of power loss can  
be approximated as follows:  
,
TR = θJA + PD  
(32)  
where θJA is the junction-to-ambient thermal resistance and  
equals 40°C/W for the JEDEC board (see Table 3).  
2
When designing an application for a particular ambient tempera-  
ture range, calculate the expected ADP2441 power dissipation (PD)  
due to the conduction, switching, and transition losses using  
Equation 28, Equation 29, and Equation 30, and then estimate  
the temperature rise using Equation 31 and Equation 32. Improved  
thermal performance can be achieved by implementing good  
board layout. For example, on the ADP2441 evaluation board  
(ADP2441-EVALZ), the measured θJA is <30°/W. Thermal perfor-  
mance of the ADP2441 evaluation board is shown in the Figure 64  
and Figure 65.  
P
COND = [RDS(ON) –High Side × D + RDS(ON) – Low Side×(1 – D)] × IOUT (28)  
Switching Losses  
Switching losses are associated with the current drawn by the  
driver to turn the power devices on and off at the switching  
frequency. Each time a power device gate is turned on and off,  
the driver transfers a charge (ꢂQ) from the input supply to the  
gate and then from the gate to ground.  
The amount of switching loss can by calculated as follows:  
PSW = QG_TOTAL × VIN × fSW  
where:  
G_TOTAL is the total gate charge of both the high-side and low-  
side devices and is approximately 28 nC.  
SW is the switching frequency.  
(29)  
Q
f
Rev. A | Page 29 of 32  
 
 
 
ADP2441  
Data Sheet  
EVALUATION BOARD THERMAL PERFORMANCE  
55  
145  
125  
105  
85  
T
= 25°C  
A
50  
45  
40  
35  
30  
25  
65  
45  
25  
0
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
0
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
IC POWER DISSIPIATION (W)  
IC POWER DISSIPIATION (W)  
Figure 64. Junction Temperature vs. Power Dissipation Based on  
ADP2441-EVALZ  
Figure 65. Maximum Ambient Temperature vs. Power Dissipation Based on  
ADP2441-EVALZ  
Rev. A | Page 30 of 32  
 
 
 
Data Sheet  
ADP2441  
CIRCUIT BOARD LAYOUT RECOMMENDATIONS  
Good circuit board layout is essential for obtaining optimum  
performance. Poor circuit board layout degrades the output  
voltage ripple; the load, line, and feedback regulation; and the  
EMI and electromagnetic compatibility performance. For  
optimum layout, refer to the following guidelines:  
The placement and routing of the compensation components  
are critical for optimum performance of ADP2441. Place  
the compensation components as close as possible to the  
COMP pin. Use 0402 sized compensation components to  
allow closer placement, which in turn reduces parasitic noise.  
Surround the compensation components with AGND to  
prevent noise pickup.  
The FREQ pin is sensitive to noise; therefore, the frequency  
resistor should be located as close as possible to the FREQ pin  
and should be routed with minimal trace length. The small  
signal components should be grounded to the analog  
ground path.  
Use separate analog and power ground planes. Connect the  
ground reference of sensitive analog circuitry, such as the  
output voltage divider component and the compensation  
and frequency resistor, to analog ground. In addition,  
connect the ground references of power components, such  
as input and output capacitors, to power ground. Connect  
both ground planes to the exposed pad of the ADP2441.  
Place one end of the input capacitor as close as possible to  
the VIN pin, and connect the other end to the closest  
power ground plane.  
C3  
C5  
C4  
V
OUT  
Place a high frequency filter capacitor between the VIN  
and PGND pins, as close as possible to the PGND pin.  
VCC is the internal regulator output. Place a 1 ꢀF capacitor  
between the VCC and AGND pins and another 1 ꢀF  
capacitor between the VCC and PGND pins. Place the  
capacitors as close as possible to the pins.  
R2  
V
IN  
FB  
VIN  
SW  
V
R3  
OUT  
COMP ADP2441  
C6  
C7  
V
IN  
EN  
PGND  
R5  
Ensure that the high current loop traces are as short and wide  
as possible. Make the high current path from CIN through  
L, COUT, and the power ground plane back to CIN as short as  
possible. To accomplish this, ensure that the input and output  
capacitors share a common power ground plane. In addition,  
make the high current path from the PGND pin through  
L and COUT back to the power ground plane as short as  
possible. To do this, ensure that the PGND pin is tied to  
the PGND plane as close as possible to the input and output  
capacitors (see Figure 66).  
C10  
R9  
NOTES  
1. THICK LINE INDICATES HIGH CURRENT TRACE.  
Figure 66. High Current Trace  
C
BST  
Connect the ADP2441 exposed pad to a large copper plane  
to maximize its power dissipation capability.  
VCC  
AGND  
FB  
C
V
IN  
Place the feedback resistor divider network as close as possible  
to the FB pin to prevent noise pickup. The length of the trace  
connecting the top of the feedback resistor divider to the  
output must be as short as possible while being kept away  
from the high current traces and switch node to avoid noise  
pickup. Place an analog ground plane on either side of the  
FB trace to further reduce noise pickup.  
IN  
COMP  
V
OUT  
FREQ  
PGND  
C
OUT  
Figure 67. PCB Top Layer Placement  
Rev. A | Page 31 of 32  
 
 
ADP2441  
Data Sheet  
OUTLINE DIMENSIONS  
3.10  
3.00 SQ  
2.90  
0.30  
0.23  
0.18  
PIN 1  
INDICATOR  
PIN 1  
INDICATOR  
10  
12  
0.50  
BSC  
1
3
9
7
EXPOSED  
PAD  
1.70  
1.60 SQ  
1.50  
0.20 MIN  
6
4
0.50  
0.40  
0.30  
TOP VIEW  
BOTTOM VIEW  
FOR PROPER CONNECTION OF  
THE EXPOSED PAD, REFER TO  
THE PIN CONFIGURATION AND  
FUNCTION DESCRIPTIONS  
0.80  
0.75  
0.70  
0.05 MAX  
0.02 NOM  
COPLANARITY  
0.08  
SECTION OF THIS DATA SHEET.  
SEATING  
PLANE  
0.20 REF  
COMPLIANT TO JEDEC STANDARDS MO-229-WEED-4.  
Figure 68. 12-Lead Lead Frame Chip Scale Package [LFCSP_WQ]  
3 mm × 3 mm Body, Very Very Thin Quad  
(CP-12-6)  
Dimensions shown in millimeters  
ORDERING GUIDE  
Package  
Model1  
Output Voltage Temperature Range Package Description  
Option  
12-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-12-6  
12-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-12-6  
Evaluation Board Preset to 5 V  
Branding  
LK4  
LK4  
ADP2441ACPZ-R7 Adjustable  
ADP2441ACPZ-R2 Adjustable  
ADP2441-EVALZ  
−40°C to +125°C  
−40°C to +125°C  
1 Z = RoHS Compliant Part.  
©2012 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
D10581-0-11/12(A)  
Rev. A | Page 32 of 32  
 
 
 

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