ADP3808JCPZ-RL [ADI]

High Efficiency Switch Mode Li-Ion Battery Charger; 高效率开关模式锂离子电池充电器
ADP3808JCPZ-RL
型号: ADP3808JCPZ-RL
厂家: ADI    ADI
描述:

High Efficiency Switch Mode Li-Ion Battery Charger
高效率开关模式锂离子电池充电器

稳压器 开关式稳压器或控制器 电源电路 电池 开关式控制器
文件: 总16页 (文件大小:339K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
High Efficiency Switch Mode  
Li-Ion Battery Charger  
ADP3808  
FEATURES  
GENERAL DESCRIPTION  
Selectable 3-cell or 4-cell operation  
Adjustable 4.0 V to 4.5 V per cell  
High end-of-charge voltage accuracy  
0.4ꢀ ꢁ 25°C  
0.6ꢀ ꢁ 5°C to 55°C  
0.8ꢀ ꢁ 0°C to 100°C  
Programmable charge current, including trickle charge  
Bootstrapped synchronous drive for external N-channel  
MOSFETs  
The ADP3808 is a complete Li-Ion battery charging controller  
for 3- or 4-cell battery packs. The device combines accurate  
final battery charge voltage control with constant current  
control to simplify the implementation of constant-current,  
constant-voltage (CCCV) chargers.  
The final battery charge voltage is programmable between 4.0 V  
to 4.5 V per cell, allowing the charging of various cell types. The  
charge current is programmable over a wide range from trickle  
charging to full charging. The system current sense amplifier  
includes an ac adapter detection output to signal that the  
adapter is connected. The bootstrapped synchronous driver  
controls two N-channel MOSFET transistors for high efficiency  
charging at a low system cost.  
Programmable oscillator frequency  
APPLICATIONS  
Portable computers  
Portable equipment  
The ADP3808 is specified over the extended commercial  
temperature range of 0°C to 100°C and is available in a 24-lead  
LFCSP package.  
FUNCTIONAL BLOCK DIAGRAM  
VCC  
22  
LOW-SIDE  
DRIVE  
REGULATOR  
UVLO  
AND BIAS  
8
EN  
DRVREG  
BST  
19  
20  
21  
EN  
IN  
DRVH  
SW  
REFERENCE  
OSCILLATOR  
DRVREG  
10  
AGND  
CONTROL  
LOGIC  
18 DRVREG  
17  
DRVLSD  
DRVL  
5
RT  
CELLSEL  
BAT  
16  
PGND  
12  
11  
3-/4-  
CELL  
VTH  
CSP  
CSM  
15  
14  
6
REFIN  
BATTERY  
VOLTAGE  
ADJUST  
g
m
7
9
BATADJ  
COMP  
g
m
CHARGE  
CURRENT  
SETPOINT  
23  
24  
SYSM  
SYSP  
13  
4
CSADJ  
CMP  
1V  
EXTPWR  
CMP  
SYS+  
CMP  
18.25V  
1
2
3
ISYS LIMSET  
LIMIT  
Figure 1.  
Rev. 0  
Information furnished by Analog Devices is believed to be accurate and reliable. However, no  
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other  
rights of third parties that may result from its use. Specifications subject to change without notice. No  
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.  
Trademarks and registeredtrademarks arethe property of their respective owners.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781.329.4700  
Fax: 781.461.3113  
www.analog.com  
©2007 Analog Devices, Inc. All rights reserved.  
 
ADP3808  
TABLE OF CONTENTS  
Features .............................................................................................. 1  
LIMIT........................................................................................... 13  
AC Adaptor Detection............................................................... 13  
EN................................................................................................. 13  
UVLO........................................................................................... 13  
Loop Feed Forward.................................................................... 13  
Application Information................................................................ 14  
Design Procedure....................................................................... 14  
Battery Voltage Settings............................................................. 14  
Inductor Selection.................................................................. 14  
Output Capacitor Selection .................................................. 14  
Input Capacitor Ripple .......................................................... 14  
Decoupling the VCC Pin ...................................................... 14  
Current Sense Filtering.......................................................... 14  
MOSFET Selection................................................................. 14  
Outline Dimensions....................................................................... 15  
Ordering Guide .......................................................................... 15  
Applications....................................................................................... 1  
General Description......................................................................... 1  
Functional Block Diagram .............................................................. 1  
Revision History ............................................................................... 2  
Specifications..................................................................................... 3  
Absolute Maximum Ratings............................................................ 5  
ESD Caution.................................................................................. 5  
Pin Configuration and Function Descriptions............................. 6  
Typical Performance Characteristics ............................................. 7  
Theory of Operation ...................................................................... 10  
Setting the Charge Current ....................................................... 10  
Final Battery Voltage Control ................................................... 11  
Oscillator and PWM .................................................................. 11  
5.25 V Bootstrap Regulator....................................................... 12  
Bootstrapped Synchronous Driver........................................... 12  
System Current Sense ................................................................ 12  
REVISION HISTORY  
6/07—Revision 0: Initial Version  
Rev. 0 | Page 2 of 16  
 
ADP3808  
SPECIFICATIONS  
VCC = 20 V, EN = 5 V, REFIN = 3 V, TA = 0°C to 100°C, unless otherwise noted.1  
Table 1.  
Parameter  
Symbol  
Conditions  
Min  
Typ  
Max  
Unit  
BATTERY VOLTAGE SENSING  
Accuracy  
TA = 25°C, 13 V ≤ VCC ≤ 21 V,  
BATADJ = 0 V or BATADJ = REFIN  
5°C ≤ TA ≤ 55°C, 13 V ≤ VCC ≤ 21 V,  
BATADJ = 0 V or BATADJ = REFIN  
13 V ≤ VCC ≤ 21 V,  
−0.4  
−0.6  
−0.8  
+0.4  
+0.6  
+0.8  
%
%
%
ΔVBAT  
BATADJ = 0 V or BATADJ = REFIN  
Input Resistance  
RBAT  
170  
0.2  
135  
1
kΩ  
μA  
%
Shutdown Leakage Current  
Overvoltage Threshold  
Overvoltage Response Time  
BATTERY VOLTAGE ADJUST  
BATADJ Input Range  
REFIN Input Range  
3-Cell Voltage Low  
3-Cell Voltage High  
4-Cell Voltage Low  
4-Cell Voltage High  
IBAT(SD)  
VBAT(OV)  
tBAT(OV)  
EN = 0 V  
1.0  
120  
VBAT(OV) to COMP < 1 V  
μs  
VBATADJ  
VREFIN  
VBAT  
VBAT  
VBAT  
0
2.0  
REFIN  
3.5  
V
V
V
V
V
BATADJ = 0 V, CELLSEL = 3.3 V  
BATADJ = REFIN, CELLSEL = 3.3 V  
BATADJ = 0 V, CELLSEL = 0 V  
BATADJ = REFIN, CELLSEL = 0 V  
12.0  
13.5  
16.0  
18.0  
VBAT  
BATTERY CURRENT SENSE AMPLIFIER  
Accuracy2  
CSADJ = REFIN, 3.9 V ≤ VCS(CM) ≤ 21 V  
CSADJ = 0.2 × REFIN, 3.9 V ≤ VCS(CM) ≤ 21 V  
−8  
−20  
0
+8  
+30  
VCC  
%
%
V
μA  
μA  
μA  
V/V  
μA  
mV  
μs  
Input Common Mode Range  
Input Bias Current—Operating  
Input Bias Current—Shutdown  
Input Bias Current—CSM  
Gain  
VCM(CS)  
IB(CSP)  
IB(CSP,SD)  
IB(CSM)  
40  
EN = 0 V  
0.1  
0.1  
31.25  
1
100  
1
1
2
AV(CS)  
CSADJ Bias Current  
IB(CSADJ)  
VCS(OC)  
tDC  
2
110  
Overcurrent Threshold2  
Overcurrent Response Time  
DRVL Shutdown Threshold  
SYSTEM CURRENT SENSE AMPLIFIER  
Input Common Mode Range  
Input Bias Current, SYSP  
Input Bias Current, SYSM  
Voltage Gain  
90  
10  
VOC > 130 mV to COMP < 1 V  
VCS(DRVLSD)  
32  
mV  
VCM(SYS)  
IB(SYSP)  
IB( SYSM)  
SYSP and SYSM to AGND  
VSYS(CM) = 19 V  
VSYS(CM) = 19 V  
22  
400  
1
V
300  
0.1  
μA  
μA  
V/V  
ꢀA  
mV  
V
mV  
μs  
mV  
VISYS/(VSYSP − VSYSM  
VISYS = 2.5 V  
)
49.5 50  
5
48  
0
51.5  
ISYS Output Current  
LIMIT Threshold  
LIMSET Input Range  
LIMIT Output Voltage Low  
LIMIT Propagation Delay Time  
VTH(LIMIT)  
VLIMSET  
VOL(LIMIT)  
tpdl(LIMIT)  
SYSP to SYSM, LIMSET = 2.5 V  
53  
58  
3.5  
75  
ILIMIT = −100 μA  
(SYSP) – (SYSM) rising > 55 mV to LIMIT going low  
SYSP to SYSM  
30  
1
EXTPWR  
EXTPWR  
EXTPWR  
EXTPWR  
17.5 22.5  
27.5  
Current Threshold  
VTH(EXTPWR)  
VTH(EXTPWR)  
VTH(EXTPWR)  
tdpl(EXTPWR)  
SYSP to AGND  
18.0 18.25 18.5  
V
Voltage Threshold  
5
1
50  
mV  
μs  
IEXTPWR = −100 μA  
Output Voltage Low  
Propagation Delay Time  
SYSP Rising > 18.5 V to EXTPWR going low  
Rev. 0 | Page 3 of 16  
 
ADP3808  
Parameter  
Symbol  
Conditions  
Min  
Typ  
Max  
Unit  
OSCILLATOR  
Maximum Frequency  
Frequency Variation  
fOSC  
1
290  
2
MHz  
kHz  
V
RT = 150 kΩ  
250  
1.9  
340  
2.1  
ΔfOSC  
VRT  
RT Output Voltage  
Zero Duty Cycle Threshold  
Maximum Duty Cycle Threshold  
LOGIC INPUTS (EN, CELLSEL)  
Input Voltage High  
Input Voltage Low  
Input Current  
Measured at COMP  
Measured at COMP  
1
2
V
V
VIH  
VIL  
IIN  
2.0  
–1  
V
V
μA  
0.8  
+1  
Inputs = 0 V or 5 V  
HIGH-SIDE DRIVER  
Output Resistance, Sourcing Current  
Output Resistance, Sinking Current  
Output Resistance, Unbiased  
Transition Time  
Propagation Delay Time  
LOW-SIDE DRIVER  
BST to SW = 5 V  
BST to SW = 5 V  
BST to SW = 0 V  
3
3
10  
20  
60  
8
8
Ω
Ω
kΩ  
ns  
ns  
trDRVH, tfDRVH BST to SW = 5 V, CLOAD = 1 nF  
40  
85  
tpdhDRVH  
BST to SW = 5 V, CLOAD = 1 nF  
25  
Output Resistance, Sourcing Current  
Output Resistance, Sinking Current  
Output Resistance, Unbiased  
Transition Time  
Propagation Delay Time3  
Timeout Delay4  
3.8  
1.5  
10  
20  
15  
8
8
Ω
Ω
VCC = PGND  
CLOAD = 1 nF  
CLOAD = 1 nF  
SW = 5 V  
kΩ  
ns  
ns  
ns  
ns  
trDRVL, tfDRVL  
tpdhDRVL  
40  
35  
150  
150  
300  
300  
SW = PGND  
SUPPLY VCC  
Supply Voltage Range  
Supply Current  
VCC  
10  
22  
V
Normal Mode  
Shutdown Mode  
Undervoltage Lockout Threshold  
Undervoltage Lockout Hysteresis  
DRV Regulator Output Voltage  
DRV Regulator Output Current  
IVCC  
IVCC(SD)  
VUVLO  
EN = 5 V  
EN = 0 V  
VCC rising  
9.8  
5
9.5  
600  
5.25  
12  
10  
10  
mA  
μA  
V
mV  
V
9
VDRVREG  
IDRVREG  
CL = 100 nF  
5.0  
10  
5.5  
mA  
1 All limits at temperature extremes are guaranteed via correlation using standard statistical quality control (SQC) methods.  
2 Measured between CSP and CSM. (VCSP − VCSM) = 96 mV × CSADJ/REFIN.  
3 For propagation delays, tpdh refers to the specified signal going high, and tpdl refers to it going low.  
4 The turn-on of DRVL is initiated after DRVH turns off by either SW crossing a ~1 V threshold or by expiration of the timeout delay.  
Rev. 0 | Page 4 of 16  
ADP3808  
ABSOLUTE MAXIMUM RATINGS  
Table 2.  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Parameter  
Rating  
VCC  
PGND  
BST  
BST to SW  
SW  
DRVH  
DRVL  
−0.3 V to +25 V  
−0.3 V to +0.3 V  
−0.3 V to +30 V  
−0.3 V to +6 V  
−4 V to +25 V  
SW − 0.3 V to BST + 0.3 V  
PGND − 0.3 V to  
DRVREG + 0.3 V  
ESD CAUTION  
SYSP, SYSM to AGND  
BAT, CSP, CSM to AGND  
SYSP to SYSM  
−25 V to +25 V  
−0.3 V to VCC + 0.3 V  
−5 V to +5 V  
CSP to CSM  
−5 V to +5 V  
All Other Inputs and Outputs  
θJA  
−0.3 V to +6 V  
2-Layer Board  
4-Layer Board  
125°C/W  
83°C/W  
Operating Ambient Temperature  
Range  
0°C to 100°C  
Junction Temperature Range  
Storage Temperature Range  
Lead Temperature  
0°C to 150°C  
−65°C to +150°C  
Soldering (10 sec)  
Vapor Phase (60 sec)  
Infrared (15 sec)  
300°C  
215°C  
220°C  
Rev. 0 | Page 5 of 16  
 
ADP3808  
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS  
ISYS  
LIMSET  
LIMIT  
1
2
3
4
5
6
18 DRVREG  
17 DRVL  
16 PGND  
15 CSP  
ADP3808  
TOP VIEW  
EXTPWR  
RT  
(Not to Scale)  
14 CSM  
REFIN  
13 CSADJ  
Figure 2. LFCSP Pin Configuration  
Table 3. Pin Function Descriptions  
Pin No.  
Mnemonic Description  
1
2
3
4
ISYS  
LIMSET  
LIMIT  
Output for System Current Sense Amplifier.  
System Current Limit Set Point Input.  
System Current Limit Output. This is an open-drain pin and requires a pull-up resistor to a maximum of 6 V.  
External Adapter Sense Open-Drain Output. This pin pulls low when the ac adapter voltage is present. A pull-up  
resistor is required to a maximum of 6 V.  
EXTPWR  
5
RT  
Frequency Setting Resistor Input. An external resistor connected between this pin and AGND sets the oscillator  
frequency of the device.  
6
7
REFIN  
BATADJ  
Reference Input for BATADJ and CSADJ.  
Battery Voltage Adjust Input. This pin uses an analog voltage referenced to REFIN to program voltage from 4.0 V to  
4.5 V per cell.  
8
EN  
Charger Enable Input. Pulling this pin to AGND disables the DRVH and DRVL outputs and puts the circuitry  
powered by VCC into a low power state. The system amplifier and EXTPWR are still active.  
9
COMP  
AGND  
BAT  
CELLSEL  
CSADJ  
Output of Error Amplifiers and Compensation Point.  
Analog Ground. Reference point for the battery sense and all analog functions.  
Battery Sense Input.  
Battery Cell Selection Input. Pulling this pin high selects 3-cell operation; pulling it low selects 4-cell operation.  
Charge Current Programming Input. This pin uses an analog voltage referenced to REFIN to program the battery  
charge current. (VCSP − VCSM) = 96 mV x CSADJ/REFIN.  
10  
11  
12  
13  
14  
15  
16  
17  
18  
CSM  
CSP  
PGND  
DRVL  
DRVREG  
Negative Current Sense Input. This pin connects to the battery side of the battery current sense resistor.  
Positive Current Sense Input. This pin connects to the inductor side of the battery current sense resistor.  
Power Ground. This pin should closely connect to the source of the lower MOSFET.  
Synchronous Rectifier Drive. Output drive for the lower MOSFET.  
Driver Supply Output. A bypass capacitor should be connected from this pin to PGND to provide filtering for the  
low-side supply.  
19  
BST  
Upper MOSFET Floating Bootstrap Supply. A capacitor connected between the BST and SW pins holds this  
bootstrapped voltage for the high-side MOSFET as it is switched.  
20  
21  
DRVH  
SW  
Main Switch Drive. Output drive for the upper MOSFET.  
Switch Node Input. This pin is connected to the buck-switching node, close to the source of the upper MOSFET,  
and is the floating return for the upper MOSFET drive signal.  
22  
23  
24  
VCC  
SYSM  
SYSP  
Input Supply. This pin does not power the SYS amplifier section.  
Negative System Current Sense Input. This pin connects to the battery side of the system current sense resistor.  
Positive System Current Sense Input. This pin connects to the adapter side of the system current sense resistor.  
This pin also provides power to the system amplifier section.  
25  
Paddle  
This pin should be connected to AGND.  
Rev. 0 | Page 6 of 16  
 
ADP3808  
TYPICAL PERFORMANCE CHARACTERISTICS  
30  
12  
11  
10  
9
V
= 16V  
CC  
A
NO LOADS  
T
= 25°C  
T
= 0°C  
A
25  
20  
15  
10  
5
T
= 25°C  
A
T
= 100°C  
A
8
7
6
0
–0.5 –0.4 –0.3 –0.2 –0.1  
0
0.1  
0.2  
0.3  
0.4  
0.5  
12  
13  
14  
15  
16  
V (V)  
CC  
17  
18  
19  
20  
V
ACCURACY (%)  
BAT  
Figure 3. VBAT Accuracy Distribution  
Figure 6. On Supply Current vs. VCC  
0.15  
0.1  
126  
V
= 16V  
CC  
T
= 100°C  
A
106  
86  
0.05  
0
–0.05  
–0.1  
–0.15  
–0.2  
T
= 25°C  
A
66  
46  
T
= 0°C  
A
26  
6
–0.25  
–0.3  
0
100  
13  
14  
15  
16  
(V)  
17  
18  
19  
12  
20  
10  
20  
30  
40  
50  
60  
70  
80  
90  
V
TEMPERATURE (°C)  
CC  
Figure 4. VBAT Accuracy vs. Temperature  
Figure 7. Off Supply Current vs. VCC  
0.07  
20  
T
= 25°C  
V
T
= 16V  
fOASC = 300kHz  
A
CC  
0.06  
0.05  
0.04  
0.03  
0.02  
0.01  
0
= 25°C  
18  
16  
14  
12  
–0.01  
–0.02  
–0.03  
–0.04  
10  
0
13  
14  
15  
16  
V
17  
(V)  
18  
19  
20  
0
500  
1000  
1500  
2000  
2500  
3000  
3500  
DRIVER LOAD CAPACITANCE (pF)  
CC  
Figure 8. Supply Current vs. Driver Load Capacitance  
Figure 5. VBAT Accuracy vs. VCC  
Rev. 0 | Page 7 of 16  
 
ADP3808  
4.5  
4
V
= 16V  
CC  
400  
350  
SOURCE  
3.5  
3
300  
250  
2.5  
2
SINK  
1.5  
1
200  
90  
110  
130  
150  
170  
190  
210  
0
20  
40  
60  
80  
100  
RT (k)  
TEMPERATURE (°C)  
Figure 9. Oscillator Frequency vs. RT  
Figure 12. DRVL On Resistance vs. Temperature  
6
5
V
= 16V  
CC  
= 25°C  
ISYS RISING  
ISYS FALLING  
DRVH  
5V/DIV  
T
A
4
3
2
1
DRVL 5V/DIV  
200ns/DIV  
0
0
0.5  
1
1.5  
2
2.5  
3.0  
V
(V)  
ISYS  
Figure 13. Driver Waveforms  
Figure 10. VLIMIT vs. VISYS  
100  
95  
3.3  
V
V
CC  
V
= 16V  
CC  
T
A
3.2  
3.1  
90  
85  
80  
75  
70  
65  
60  
SINK  
3.0  
2.9  
2.8  
2.7  
SOURCE  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
0
20  
40  
60  
80  
100  
CHARGE CURRENT (A)  
TEMPERATURE (°C)  
Figure 14. Conversion Efficiency vs. Charge Current  
Figure 11. DRVH On Resistance vs. Temperature  
Rev. 0 | Page 8 of 16  
 
ADP3808  
97  
96  
95  
94  
93  
92  
91  
90  
89  
88  
I
= 2A  
CHARGE  
I
= 3A  
CHARGE  
V
T
= 19V  
CC  
= 25°C  
A
3
4
5
6
7
8
9
10  
11  
12  
13  
V
(V)  
BAT  
Figure 15. Conversion Efficiency vs. Battery Voltage  
Rev. 0 | Page 9 of 16  
ADP3808  
THEORY OF OPERATION  
The ADP3808 combines a bootstrapped synchronous switching  
driver with programmable current control and accurate final  
battery voltage control in a constant-current, constant-voltage  
(CCCV) Li-Ion battery charger. High accuracy voltage control  
is needed to safely charge Li-Ion batteries, which are typically  
specified at 4.2 V 1ꢀ per cell. For a typical notebook computer  
battery pack, three or four cells are in series, giving a total  
voltage of 12.6 V or 16.8 V. The ADP3808 allows the final  
battery voltage to be programmed. The programmable range is  
4.0 V to 4.5 V per cell. The total number of cells to be charged  
can be set to either 3 or 4 via a control pin.  
strapped high-side driver, the ADP3808 drives two external  
power NMOS transistors for a simple, lower cost power stage.  
The ADP3808 also provides an uncommitted current sense  
amplifier. This amplifier provides an analog output pin for  
monitoring the current through an external sense resistor. The  
amplifier can be used anywhere in the system that high-side  
current sensing is needed. The sense amplifier output is compared  
to a programmable voltage limit. If the limit is exceeded, the  
LIMIT pin is asserted. The system sense amplifier is also used  
to detect the presence of an ac adaptor. If the adaptor is detected,  
the ADP3808 asserts a logic pin to signal the detection.  
Another requirement for safely charging Li-Ion batteries is  
accurate control of the charge current. The actual charge current  
depends on the number of cells in parallel within the battery  
pack. Typically, this is in the range of 2 A to 3 A. The ADP3808  
provides flexibility in programming the charge current over a  
wide range. An external resistor is used to sense the charge  
current. The charge current can be set by programming the  
sense resistor voltage drop. The voltage drop can be set to a  
maximum of 96 mV. This programmability allows the current  
to be changed during charging. For example, the charge current  
can be reduced for trickle charging.  
SETTING THE CHARGE CURRENT  
The charge current is measured across an external sense  
resistor, RCS, between the CSP and CSM pins. The input  
common-mode range is from ground to VCC, allowing current  
control in short-circuit and low dropout conditions. The voltage  
between CSP and CSM is programmed by a ratio of the voltages  
at CSADJ and REFIN according to Equation 1.  
CSADJ  
VCSP VCSM = 96 mV  
(1)  
REFIN  
For example, using a 20 mΩ sense resistor gives a range from  
150 mA with CSADJ = REFIN/32 to 4.8 A maximum when  
CSADJ = REFIN.  
The synchronous driver provides high efficiency when charging  
at high currents. Efficiency is important mainly to reduce the  
amount of heat generated in the charger, but also to stay within  
the power limits of the ac adapter. With the addition of a boot-  
The power dissipation in RCS should be kept below 500 mW.  
Components R4 and C13 provide high frequency filtering for  
the current sense signal.  
Rev. 0 | Page 10 of 16  
 
ADP3808  
R
SS  
10m  
SYSTEM  
DC/DC  
R
20mꢀ  
1/2 Q1  
FD56990A  
CS  
L1  
V
IN  
+
22µH  
+
C15  
22µF  
R13  
10ꢀ  
1/2 Q1  
FD56990A  
R4  
510ꢀ  
R2  
510ꢀ  
C16  
BATTERY  
12.6V/16.8V  
22µF  
C13  
22µF  
C1  
2.2µF  
3.3V  
C14  
2.2µF  
C9  
100nF  
BST DRV  
ISYS  
LIMIT  
SW DRVL PGND  
V
CSP  
CSM  
SYSP  
SYSM  
CC  
BOOTSTRAPPED  
SYNCHRONOUS  
DRIVER  
3.3V  
R9  
+
+
AMP2  
AMP1  
+
EN  
IN DRVLSD DRVLSD  
LIMSET  
+
V
+ V  
REG  
REF  
R10  
V
TH  
UVLO  
DRVREG  
7.0V  
C10  
BIAS  
1V  
+
EXTPWR  
g
m
1
+
0.1µF  
+
+
SYSP  
BAT  
EN  
CSADJ  
BAT  
LOGIC  
CONTROL  
CHARGE  
CURRENT  
SETPOINT  
3.3V  
R11  
3-/4-CELL  
OSCILLATOR  
2
+
SELECTION  
g
m
REFIN  
BATTERY  
VOLTAGE  
ADJUST  
ADP3808  
BATADJ  
R12  
COMP  
RT  
CELLSEL  
AGND  
C8  
0.22µF  
150kꢀ  
R8  
56ꢀ  
C11  
Figure 16. Typical Application Circuit  
and is ratioed to the REFIN pin. The battery voltage VBAT is set  
according to Equation 2 and Equation 3.  
FINAL BATTERY VOLTAGE CONTROL  
As the battery approaches its final voltage, the ADP3808  
switches from CC mode to CV mode. The change is achieved  
by the common output node of gm1 and gm2. Only one of the  
two outputs controls the voltage at the COMP pin. Both  
amplifiers can only pull down on COMP, such that when either  
amplifier has a positive differential input voltage, its output is  
not active. For example, when the battery voltage, VBAT, is low,  
gm2 does not control VCOMP. When the battery voltage reaches  
the desired final voltage, gm2 takes control of the loop, and the  
charge current is reduced.  
For CELLSEL > 2 V:  
BATADJ  
VBAT = 12 V+ 1.5 V  
(2)  
(3)  
REFIN  
For CELLSEL < 0.8 V:  
BATADJ  
REFIN  
VBAT = 16 V+ 2 V  
OSCILLATOR AND PWM  
The oscillator generates a triangle waveform between 1 V and  
2 V, which is compared to the voltage at the COMP pin, setting  
the duty cycle of the driver stage. When VCOMP is below 1.0 V,  
the duty cycle is zero. Above 2.0 V, the duty cycle reaches its  
maximum. The oscillator frequency is set by the external  
resistor at the RT pin, ROSC, and is given by Equation 4.  
Amplifier gm2 compares the battery voltage to a programmable  
level set by pins BATADJ and REFIN. The target battery voltage  
is dependent on the state of the CELLSEL pin as CELLSEL sets  
the number of cells to be charged. Pulling CELLSEL high sets  
the ADP3808 to charge three cells. When CELLSEL is tied to  
ground, four cells are selected. CELLSEL has a 2 μA pull-up  
current as a fail-safe to select three cells when it is left open.  
41 × 109  
fOSC  
=
(4)  
The final battery voltage is programmable from 4.0 V to 4.5 V  
per cell. The programming voltage is applied to the BATADJ pin  
ROSC  
Rev. 0 | Page 11 of 16  
 
 
 
ADP3808  
DRVREG  
ADP3808  
BOOTSTRAPPED  
SYNCHRONOUS DRIVER  
BST  
CMP3  
CBST  
DRVH  
MIN  
OFF  
TIME  
IN  
Q1  
EN  
SW  
DELAY  
CMP2  
+
1V  
DRVL  
PGND  
Q2  
CMP1  
+
1V  
DELAY  
DRVLSD  
Figure 17. Bootstrapped Synchronous Driver  
Overlap protection is included in the driver to ensure that both  
external MOSFETs are not on at the same time. When DRVH  
turns off the upper MOSFET, the SW node goes low due to the  
inductor current. The ADP3808 monitors the SW voltage, and  
DRVL goes high to turn on the lower MOSFET when SW goes  
below 1 V. When DRVL turns off, an internal timer adds a delay  
of 50 ns before turning DRVH on.  
5.25 V BOOTSTRAP REGULATOR  
The driver stage is powered by the internal 5.25 V bootstrap  
regulator, which is available at the DRVREG pin. Because the  
switching currents are supplied by this regulator, decoupling  
must be added. A 0.1 μF capacitor should be placed close to the  
ADP3808, with the ground side connected close to the power  
ground pin, PGND. This supply is not recommended for use  
externally due to high switching noise.  
When the charge current is low, the DRVLSD comparator  
signals the driver to turn off the low-side MOSFET and DRVL  
is held low. The DRVLSD threshold is set to 0.8 V correspond-  
ing to a 32 mV differential between the CS pins.  
BOOTSTRAPPED SYNCHRONOUS DRIVER  
The PWM comparator controls the state of the synchronous  
driver shown in Figure 17. A high output from the PWM  
comparator forces DRVH on and DRVL off. The drivers have  
an on resistance of less than 4 Ω for fast rise and fall times when  
driving external MOSFETs. Furthermore, the bootstrapped drive  
allows an external NMOS transistor for the main switch instead  
of a PMOS. A boost capacitor of 0.1 μF must be added  
externally between BST and SW.  
The driver stage monitors the voltage across the BST capacitor  
with CMP3. When this voltage is less than 4 V, CMP3 forces a  
minimum off time of 200 ns. This ensures that the BST capacitor  
is charged even during DRVLSD. However, because a minimum  
off time is only forced when needed, the maximum duty cycle is  
greater than 99ꢀ.  
SYSTEM CURRENT SENSE  
The DRVL pin switches between DRVREG and PGND. The  
5.25 V output of DRVREG drives the external NMOS with high  
An uncommitted differential amplifier is provided for  
additional high-side current sensing. This amplifier, AMP2,  
has a fixed gain of 50 V/V from the SYSP and SYSM pins to the  
analog output at ISYS. ISYS has a 100 μA source capability to  
drive an external load. The common-mode range of the input  
pins is from 10 V to 22 V. This amplifier is the only part of the  
ADP3808 that remains active during shutdown. The power to  
this block is derived from the bias current on the SYSP and  
SYSM pins.  
VGS to lower the on resistance. PGND should be connected  
close to the source pin of the external synchronous NMOS.  
When DRVL is high, this turns on the lower NMOS and pulls  
the SW node to ground. At this point, the boost capacitor is  
charged up through the internal boost diode. When the PWM  
switches high, DRVL is turned off and DRVH turns on. DRVH  
switches between BST and SW. When DRVH is on, the SW pin  
is pulled up to the input supply (typically 16 V), and BST rises  
above this voltage by approximately 4.75 V.  
Rev. 0 | Page 12 of 16  
 
 
ADP3808  
LIMIT  
UVLO  
The LIMIT pin is an open-drain output that signals when the  
voltage at ISYS exceeds the voltage at LIMSET. The internal  
comparator produces the function shown in Figure 10. This is  
a graph of VLIMIT vs. VISYS where LIMSET is set to 1.5 V. The  
LIMIT pin should be pulled up to a maximum of 6 V through a  
resistor. When ISYS is below LIMSET, the LIMIT pin has high  
output impedance. The open-drain output is capable of sinking  
700 μA when the threshold is exceeded. This comparator is  
turned off during shutdown to conserve power.  
Undervoltage lock-out, UVLO, is included in the ADP3808 to  
ensure proper startup. As VCC rises above 1 V, the regulator  
tracks VCC until it reaches its final voltage. However, the rest of  
the circuitry is held off by the UVLO comparator. The UVLO  
comparator monitors the regulator to ensure that it is above 5 V  
before turning on the main charger circuitry. This occurs when  
V
CC reaches 9.5 V. Monitoring the regulator outputs makes sure  
that the charger circuitry and driver stage have sufficient  
voltage to operate normally. The UVLO comparator includes  
600 mV of hysteresis to prevent oscillations near the threshold.  
AC ADAPTOR DETECTION  
LOOP FEED FORWARD  
EXTPWR  
The  
pin on the ADP3808 is an open-drain active low  
As the startup sequence discussion shows, the response time at  
COMP is slowed by the large compensation capacitor. To speed  
up the response, two comparators can quickly feed forward  
around the normal control loop and pull the COMP node down  
to limit any overshoot in either short-circuit or overvoltage  
conditions. The overvoltage comparator has a trip point set to  
35ꢀ higher than the final battery voltage. The overcurrent  
comparator threshold is set to 100 mV across the CS pins.  
When these comparators are tripped, a normal soft start  
sequence is initiated. The overvoltage comparator is valuable  
when the battery is removed during charging. In this case, the  
current in the inductor causes the output voltage to spike up,  
and the comparator limits the maximum voltage. Neither of  
these comparators affects the loop under normal charging  
conditions.  
output used to signal that an ac adaptor is connected. If the  
ISYS voltage level is greater than 1 V or the SYSP sense pin  
EXTPWR  
voltage is greater then 18.25 V, the  
pin is driven low.  
A pull-up resistor must be connected when this function is  
required. The maximum pull-up voltage is 6 V.  
EN  
A high impedance CMOS logic input is provided to turn off the  
ADP3808. When the voltage on EN is less than 0.8 V, the  
ADP3808 is placed in low power shutdown. With the exception  
of the system current sense amplifier, AMP2, all other circuitry  
is turned off. The reference and regulators are pulled to ground  
during shutdown and all switching is stopped. During this state,  
the supply current is less than 5 A. In addition, the BAT, CSP,  
CSM, and SW pins go to high impedance to minimize current  
drain from the battery.  
Rev. 0 | Page 13 of 16  
 
ADP3808  
APPLICATION INFORMATION  
input capacitor has to absorb this current ripple, it must have an  
appropriate rms current rating. The maximum input rms  
current is given by  
DESIGN PROCEDURE  
Refer to Figure 16, the typical application circuit, for the  
following description. The design follows that of a buck  
converter. With Li-Ion cells it is important to have a regulator  
with accurate output voltage control.  
PBAT  
D(1 D)  
Irms  
=
×
(10)  
η × D VIN  
D
BATTERY VOLTAGE SETTINGS  
Inductor Selection  
where η is the estimated converter efficiency (approximately  
90ꢀ, 0.9) and PBAT is the maximum battery power consumed.  
Usually the inductor is chosen based on the assumption that the  
inductor ripple current is 15ꢀ of the maximum output dc  
current at maximum input voltage. As long as the inductor used  
has a value close to this, the system should work fine. The final  
choice affects the trade-offs between cost, size, and efficiency.  
For example, the lower the inductance, the size is smaller but  
ripple current is higher. This situation, if taken too far, leads to  
higher ac losses in the core and the windings. Conversely, a  
higher inductance results in lower ripple current and smaller  
output filter capacitors, but the transient response will be  
slower. With these considerations, the required inductance can  
be calculated using Equation 6.  
This is a worst-case calculation and, depending on total charge  
time, the calculated number could be relaxed. Consult the  
capacitor manufacturer for further technical information.  
Decoupling the VCC Pin  
It is a good idea to use an RC filter (R13 and C14) from the  
input voltage to the IC both to filter out switching noise and to  
supply bypass to the chip. During layout, this capacitor should  
be placed as close to the IC as possible. Values between 0.1 μF  
and 2.2 μF are recommended.  
Current Sense Filtering  
During normal circuit operation, the current sense signals can  
have high frequency transients that need filtering to ensure  
proper operation. In the case of the CSP and CSM inputs,  
Resistor R4 is set to 510 Ω and the filter capacitor C13 is 22 nF.  
For the system current sense filter on SYSP, SYSM, R2 is set to  
510 Ω, C1 is 2.2 ꢁF, and C2 is 470 nF.  
VIN, MAX VBAT  
L1 =  
× DMIN × TS  
(6)  
ΔI  
where the maximum input voltage VIN, MAX is used with the  
minimum duty ratio DMIN. The duty ratio is defined as the ratio  
of the output voltage to the input voltage, VBAT/VIN. The ripple  
current is calculated using Equation 7.  
MOSFET Selection  
One of the features of the ADP3808 is that it allows use of a  
high-side NMOS switch instead of a more costly PMOS device.  
The converter also uses synchronous rectification for optimal  
efficiency. To use a high-side NMOS, an internal bootstrap  
regulator automatically generates a 5.25 V supply  
across C9.  
ΔI = 0.3 × IBAT, MAX  
(7)  
The maximum peak-to-peak ripple is 30ꢀ, that is 0.3, and  
maximum battery current, IBAT, MAX, is used.  
For example, with VIN, MAX = 19 V, VBAT = 12.6 V, IBAT, MAX = 3A,  
and TS = 4 μs, the value of L1 is calculated as 18.9 μH. Choosing  
the closest standard value gives L1 = 22 μH.  
Maximum output current determines the RDS(ON) requirement  
for the two power MOSFETs. When the ADP3808 is operating  
in continuous mode, the simplifying assumption can be made  
that one of the two MOSFETs is always conducting the load  
current. The power dissipation for each MOSFET is given by  
Output Capacitor Selection  
An output capacitor is needed in the charger circuit to absorb  
the switching frequency ripple current and smooth the output  
voltage. The rms value of the output ripple current is given by  
VIN ,MAX  
Upper MOSFET:  
Irms  
=
D
(
1 D  
)
(8)  
PDISS = RDS(ON) × (IBAT × √D)2 + VIN × IBAT × √D × TSW × f (11)  
fL1 12  
Lower MOSFET:  
The maximum value occurs when the duty cycle is 0.5. Thus,  
VIN, MAX  
Irms _ MAX = 0.072  
fL1  
PDISS = RDS(ON) × (IBAT × √D)2 + VIN × (IBAT × √1 − D)2 ×  
tSW × f  
(9)  
(12)  
where f is the switching frequency and tSW is the switch  
transition time, usually 10 ns.  
For an input voltage of 19 V and a 22 μH inductance, the  
maximum rms current is 0.26 A. A typical 10 μF or 22 μF  
ceramic capacitor is a good choice to absorb this current.  
The first term accounts for conduction losses while the second  
term estimates switching losses. Using these equations and the  
manufacturers data sheets, the proper device can be selected.  
Input Capacitor Ripple  
As is the case with a normal buck converter, the pulse current at  
the input has a high rms component. Therefore, because the  
Rev. 0 | Page 14 of 16  
 
ADP3808  
OUTLINE DIMENSIONS  
0.60 MAX  
4.00  
BSC SQ  
0.60 MAX  
PIN 1  
INDICATOR  
1
24  
19  
18  
PIN 1  
INDICATOR  
0.50  
BSC  
2.25  
2.10 SQ  
1.95  
TOP  
VIEW  
3.75  
BSC SQ  
EXPOSED  
PAD  
(BOTTOM VIEW)  
0.50  
0.40  
0.30  
6
13  
12  
7
0.25 MIN  
0.80 MAX  
0.65TYP  
2.50 REF  
1.00  
0.85  
0.80  
12° MAX  
0.05 MAX  
0.02 NOM  
0.30  
0.23  
0.18  
COPLANARITY  
0.08  
0.20 REF  
SEATING  
PLANE  
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-2  
Figure 20. 24-Lead Lead Frame Chip Scale Package [LFCSP_VQ]  
4 mm × 4 mm Body, Very Thin Quad  
(CP-24-1)  
Dimensions shown in millimeters  
ORDERING GUIDE  
Ordering  
Model  
Temperature Range  
Package Description  
Package Option Quantity  
ADP3808JCPZ1  
ADP3808JCPZ-RL1  
0°C to 100°C  
0°C to 100°C  
24-Lead Lead Frame Chip Scale Package [LFCSP_VQ]  
24-Lead Lead Frame Chip Scale Package [LFCSP_VQ]  
CP-24-1  
CP-24-1  
5000  
1 Z = RoHS Compliant Part.  
Rev. 0 | Page 15 of 16  
 
 
ADP3808  
NOTES  
©2007 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
D06632-0-6/07(0)  
Rev. 0 | Page 16 of 16  

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