ADSP-21060CW-160 [ADI]
ADSP-21060 Industrial SHARC DSP Microcomputer Family; ADSP- 21060 SHARC工业DSP单片机系列型号: | ADSP-21060CW-160 |
厂家: | ADI |
描述: | ADSP-21060 Industrial SHARC DSP Microcomputer Family |
文件: | 总48页 (文件大小:479K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
®
ADSP-21060 Industrial SHARC
a
DSP Microcomputer Family
ADSP-21060C/ADSP-21060LC
SUMMARY
Efficient Program Sequencing with Zero-Overhead
Looping: Single-Cycle Loop Setup
High Performance Signal Processor for Communica-
tions, Graphics, and Imaging Applications
Super Harvard Architecture
IEEE JTAG Standard 1149.1 Test Access Port and
On-Chip Emulation
Four Independent Buses for Dual Data Fetch,
Instruction Fetch, and Nonintrusive I/O
32-Bit IEEE Floating-Point Computation Units—
Multiplier, ALU, and Shifter
240-Lead Thermally Enhanced CQFP Package
32-Bit Single-Precision and 40-Bit Extended-Precision
IEEE Floating-Point Data Formats or 32-Bit Fixed-
Point Data Format
Dual-Ported On-Chip SRAM and Integrated I/O
Peripherals—A Complete System-On-A-Chip
Integrated Multiprocessing Features
Industrial Temperature Grade Hermetic Ceramic QFP
Package
Parallel Computations
Single-Cycle Multiply and ALU Operations in Parallel
with Dual Memory Read/Writes and Instruction Fetch
Multiply with Add and Subtract for Accelerated FFT
Butterfly Computation
KEY FEATURES
40 MIPS, 25 ns Instruction Rate, Single-Cycle Instruction
Execution
120 MFLOPS Peak, 80 MFLOPS Sustained Performance
Dual Data Address Generators with Modulo and Bit-
Reverse Addressing
4 Mbit On-Chip SRAM
Dual-Ported for Independent Access by Core Processor
and DMA
Off-Chip Memory Interfacing
4 Gigawords Addressable
Programmable Wait State Generation, Page-Mode
DRAM Support
DUAL-PORTED SRAM
CORE PROCESSOR
TIMER
INSTRUCTION
JTAG
TWO INDEPENDENT
7
CACHE
DUAL-PORTED BLOCKS
32 x 48-BIT
TEST &
EMULATION
PROCESSOR PORT
I/O PORT
ADDR
DATA
DATA
ADDR
DATA
ADDR
ADDR
DATA
DAG1
DAG2
PROGRAM
SEQUENCER
8 x 4 x 32
8 x 4 x 24
EXTERNAL
PORT
IOD
48
IOA
17
24
PM ADDRESS BUS
32
48
ADDR BUS
MUX
32
DM ADDRESS BUS
MULTIPROCESSOR
INTERFACE
PM DATA BUS
DM DATA BUS
48
BUS
DATA BUS
MUX
CONNECT
(PX)
40/32
HOST PORT
4
DMA
DATA
IOP
REGISTERS
CONTROLLER
REGISTER
FILE
6
6
(
MEMORY MAPPED)
SERIAL PORTS
(2)
16 x 40-BIT
BARREL
SHIFTER
ALU
MULTIPLIER
CONTROL,
STATUS &
DATA BUFFERS
36
LINK PORTS
(6)
I/O PROCESSOR
Figure 1. Block Diagram
SHARC is a registered trademark of Analog Devices, Inc.
REV. B
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700
Fax: 781/326-8703
World Wide Web Site: http://www.analog.com
© Analog Devices, Inc., 2001
ADSP-21060C/ADSP-21060LC
Multiprocessing
DMA Controller
Glueless Connection for Scalable DSP Multiprocessing
Architecture
Distributed On-Chip Bus Arbitration for Parallel Bus
Connect of Up to Six ADSP-2106xs Plus Host
Six Link Ports for Point-to-Point Connectivity and Array
Multiprocessing
10 DMA Channels for Transfers Between ADSP-2106x
Internal Memory and External Memory, External
Peripherals, Host Processor, Serial Ports, or Link
Ports
Background DMA Transfers at 40 MHz, in Parallel with
Full-Speed Processor Execution
240 Mbytes/s Transfer Rate Over Parallel Bus
240 Mbytes/s Transfer Rate Over Link Ports
Host Processor Interface to 16- and 32-Bit Microprocessors
Host Can Directly Read/Write ADSP-2106x Internal
Memory
Serial Ports
Two 40 Mbit/s Synchronous Serial Ports with
Companding Hardware
Independent Transmit and Receive Functions
TABLE OF CONTENTS
ADSP-2106x Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 7. JTAG Clocktree for Multiple ADSP-2106x
GENERAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . 3
ADSP-21000 FAMILY CORE ARCHITECTURE . . . . . . . 4
ADSP-21060C/ADSP-21060LC FEATURES . . . . . . . . . . . 4
DEVELOPMENT TOOLS . . . . . . . . . . . . . . . . . . . . . . . . . . 7
ADDITIONAL INFORMATION . . . . . . . . . . . . . . . . . . . . . 7
PIN FUNCTION DESCRIPTIONS . . . . . . . . . . . . . . . . . . 8
TARGET BOARD CONNECTOR FOR EZ-ICE®
PROBE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
RECOMMENDED OPERATING CONDITIONS (5V) . 13
ELECTRICAL CHARACTERISTICS (5 V) . . . . . . . . . . . 13
POWER DISSIPATION ADSP-21060C (5 V) . . . . . . . . . . 14
RECOMMENDED OPERATING CONDITIONS (3.3V) 15
ELECTRICAL CHARACTERISTICS (3.3 V) . . . . . . . . . . 15
POWER DISSIPATION ADSP-21060LC (3.3 V) . . . . . . . . 16
ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . 17
TIMING SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . 17
Memory Read—Bus Master . . . . . . . . . . . . . . . . . . . . . . . 20
Memory Write—Bus Master . . . . . . . . . . . . . . . . . . . . . . 21
Synchronous Read/Write—Bus Master . . . . . . . . . . . . . . 22
Synchronous Read/Write—Bus Slave . . . . . . . . . . . . . . . . 24
Multiprocessor Bus Request and Host Bus Request . . . . . 25
Asynchronous Read/Write—Host to ADSP-2106x . . . . . . 27
Three-State Timing—Bus Master, Bus Slave,
HBR, SBTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
DMA Handshake . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Link Ports: 1 × CLK Speed Operation . . . . . . . . . . . . . . 32
Link Ports: 2 × CLK Speed Operation . . . . . . . . . . . . . . 33
Serial Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
JTAG Test Access Port and Emulation . . . . . . . . . . . . . . . 38
OUTPUT DRIVE CURRENTS . . . . . . . . . . . . . . . . . . . . . 39
POWER DISSIPATION . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
TEST CONDITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
ENVIRONMENTAL CONDITIONS . . . . . . . . . . . . . . . . 42
240-LEAD METRIC CQFP PIN CONFIGURATIONS . . 43
OUTLINE DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . 45
ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 8. Clock Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 9. Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 10. Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 11. Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 12. Flags . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 13. Memory Read—Bus Master . . . . . . . . . . . . . . . . 20
Figure 14. Memory Write—Bus Master . . . . . . . . . . . . . . . 21
Figure 15. Synchronous Read/Write—Bus Master . . . . . . . 23
Figure 16. Synchronous Read/Write—Bus Slave . . . . . . . . . 24
Figure 17. Multiprocessor Bus Request and Host Bus
Request . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 18a. Synchronous REDY Timing . . . . . . . . . . . . . . 27
Figure 18b. Asynchronous Read/Write—Host to
ADSP-2106x . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Figure 19a. Three-State Timing (Bus Transition Cycle,
SBTS Assertion) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 19b. Three-State Timing (Host Transition Cycle) . . 29
Figure 20. DMA Handshake Timing . . . . . . . . . . . . . . . . . 31
Figure 21. Link Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 22. Serial Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Figure 23. External Late Frame Sync . . . . . . . . . . . . . . . . . 37
Figure 24. IEEE 11499.1 JTAG Test Access Port . . . . . . . 38
Figure 25. Output Enable/Disable . . . . . . . . . . . . . . . . . . . 40
Figure 26. Equivalent Device Loading for AC Measurements
(Includes All Fixtures) . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Figure 27. Voltage Reference Levels for AC Measurements
(Except Output Enable/Disable) . . . . . . . . . . . . . . . . . . . 40
Figure 28. ADSP-2106x Typical Drive Currents
(VDD = 5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Figure 29. Typical Output Rise Time (10%–90% VDD
)
vs. Load Capacitance (VDD = 5 V) . . . . . . . . . . . . . . . . . . . 41
Figure 30. Typical Output Rise Time (0.8 V–2.0 V)
vs. Load Capacitance (VDD = 5 V) . . . . . . . . . . . . . . . . . . . 41
Figure 31. Typical Output Delay or Hold vs. Load Capacitance
(at Maximum Case Temperature) (VDD = 5 V) . . . . . . . . . 41
Figure 32. ADSP-2106x Typical Drive Currents
FIGURES
Figure 1. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Figure 2. ADSP-2106x System . . . . . . . . . . . . . . . . . . . . . . . 4
Figure 3. Shared Memory Multiprocessing System . . . . . . . . 6
Figure 4. ADSP-21060C/ADSP-21060LC Memory Map . . . 7
Figure 5. Target Board Connector for ADSP-2106x
EZ-ICE Emulator (Jumpers in Place) . . . . . . . . . . . . . . . 11
Figure 6. JTAG Scan Path Connections for Multiple
(VDD = 3.3 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Figure 33. Typical Output Rise Time (10%–90% VDD
)
vs. Load Capacitance (VDD = 3.3 V) . . . . . . . . . . . . . . . . . 41
Figure 34. Typical Output Rise Time (0.8 V–2.0 V) vs. Load
Capacitance (VDD = 3.3 V) . . . . . . . . . . . . . . . . . . . . . . . . 42
Figure 35. Typical Output Delay or Hold vs. Load Capacitance
(at Maximum Case Temperature) (VDD = 3.3 V) . . . . . . . . 42
EZ-ICE is a registered trademark of Analog Devices, Inc.
REV. B
–2–
ADSP-21060C/ADSP-21060LC
DMA controller, serial ports, and link port and parallel bus
connectivity for glueless DSP multiprocessing.
Figure 1 shows a block diagram of the ADSP-21060C/
ADSP-21060LC, illustrating the following architectural features:
Computation Units (ALU, Multiplier and Shifter) with a
Shared Data Register File
Data Address Generators (DAG1, DAG2)
Program Sequencer with Instruction Cache
Interval Timer
On-Chip SRAM
External Port for Interfacing to Off-Chip Memory and
Peripherals
Host Port and Multiprocessor Interface
DMA Controller
Serial Ports and Link Ports
JTAG Test Access Port
S
GENERAL DESCRIPTION
The ADSP-2106x SHARC—Super Harvard Architecture Com-
puter—is a signal processing microcomputer that offers new
capabilities and levels of performance. The ADSP-2106x
SHARCs are 32-bit processors optimized for high performance
DSP applications. The ADSP-2106x builds on the ADSP-
21000 DSP core to form a complete system-on-a-chip, adding a
dual-ported on-chip SRAM and integrated I/O peripherals sup-
ported by a dedicated I/O bus.
Figure 2 shows a typical single-processor system. A multi-
processing system is shown in Figure 3.
Table I. ADSP-21060C/ADSP-21060LC Benchmarks
(@ 40 MHz)
Fabricated in a high speed, low power CMOS process, the
ADSP-2106x has a 25 ns instruction cycle time and operates
at 40 MIPS. With its on-chip instruction cache, the processor
can execute every instruction in a single cycle. Table I shows
performance benchmarks for the ADSP-2106x.
1024-Pt. Complex FFT
(Radix 4, with Digit Reverse)
FIR Filter (per Tap)
IIR Filter (per Biquad)
Divide (y/x)
Inverse Square Root (1/√x)
DMA Transfer Rate
0.46 ms
18,221 cycles
25 ns
100 ns
150 ns
225 ns
1 cycle
4 cycles
6 cycles
9 cycles
The ADSP-2106x SHARC represents a new standard of inte-
gration for signal computers, combining a high performance
floating-point DSP core with integrated, on-chip system features
including a 4 Mbit SRAM memory host processor interface,
240 Mbytes/s
REV. B
–3–
ADSP-21060C/ADSP-21060LC
ADSP-21000 FAMILY CORE ARCHITECTURE
Instruction Cache
The ADSP-2106x includes an on-chip instruction cache that
enables three-bus operation for fetching an instruction and two
data values. The cache is selective—only the instructions whose
fetches conflict with PM bus data accesses are cached. This
allows full-speed execution of core, looped operations such as
digital filter multiply-accumulates and FFT butterfly processing.
The ADSP-2106x includes the following architectural features
of the ADSP-21000 family core. The ADSP-21060C is code-
and function-compatible with the ADSP-21061 and ADSP-21062.
Independent, Parallel Computation Units
The arithmetic/logic unit (ALU), multiplier and shifter all per-
form single-cycle instructions. The three units are arranged in
parallel, maximizing computational throughput. Single multi-
function instructions execute parallel ALU and multiplier opera-
tions. These computation units support IEEE 32-bit single-
precision floating-point, extended precision 40-bit floating-
point, and 32-bit fixed-point data formats.
Data Address Generators with Hardware Circular Buffers
The ADSP-2106x’s two data address generators (DAGs) imple-
ment circular data buffers in hardware. Circular buffers allow
efficient programming of delay lines and other data structures
required in digital signal processing, and are commonly used in
digital filters and Fourier transforms. The two DAGs of the
ADSP-2106x contain sufficient registers to allow the creation of
up to 32 circular buffers (16 primary register sets, 16 second-
ary). The DAGs automatically handle address pointer wrap-
around, reducing overhead, increasing performance, and
simplifying implementation. Circular buffers can start and end
at any memory location.
ADSP-2106x
CS
BMS
1x CLOCK
3
CLKIN
EBOOT
LBOOT
BOOT
EPROM
(OPTIONAL)
ADDR
DATA
IRQ
2-0
4
FLAG
3-0
ADDR
ADDR
DATA
31-0
TIMEXP
MEMORY
AND
PERIPHERALS
(OPTIONAL)
DATA
47-0
Flexible Instruction Set
LINK
DEVICES
(6 MAXIMUM)
(OPTIONAL)
LxCLK
LxACK
LxDAT
RD
WR
OE
WE
ACK
CS
The 48-bit instruction word accommodates a variety of parallel
operations, for concise programming. For example, the ADSP-
2106x can conditionally execute a multiply, an add, a subtract
and a branch, all in a single instruction.
3-0
ACK
MS
3-0
TCLK0
RCLK0
TFS0
RSF0
DT0
PAGE
SBTS
SW
SERIAL
DEVICE
(OPTIONAL)
DMA DEVICE
(OPTIONAL)
DATA
ADSP-21060C/ADSP-21060LC FEATURES
Augmenting the ADSP-21000 family core, the ADSP-21060
adds the following architectural features:
ADRCLK
DR0
DMAR1-2
DMAG1-2
TCLK1
RCLK1
TFS1
RFS1
DT1
CS
HBR
HBG
Dual-Ported On-Chip Memory
SERIAL
DEVICE
(OPTIONAL)
HOST
PROCESSOR
INTERFACE
(OPTIONAL)
The ADSP-21060C contains four megabits of on-chip SRAM,
organized as two blocks of 2 Mbits each, which can be config-
ured for different combinations of code and data storage.
Each memory block is dual-ported for single-cycle, independent
accesses by the core processor and I/O processor or DMA con-
troller. The dual-ported memory and separate on-chip buses
allow two data transfers from the core and one from I/O, all in a
single cycle.
REDY
DR1
BR
1-6
ADDR
DATA
RPBA
CPA
JTAG
ID
2-0
RESET
7
Figure 2. ADSP-2106x System
Data Register File
On the ADSP-21060C, the memory can be configured as a
maximum of 128K words of 32-bit data, 256K words of 16-bit
data, 80K words of 48-bit instructions (or 40-bit data), or com-
binations of different word sizes up to four megabits. All of
the memory can be accessed as 16-bit, 32-bit, or 48-bit words.
A general purpose data register file is used for transferring data
between the computation units and the data buses, and for
storing intermediate results. This 10-port, 32-register (16 pri-
mary, 16 secondary) register file, combined with the ADSP-
21000 Harvard architecture, allows unconstrained data flow
between computation units and internal memory.
A 16-bit floating-point storage format is supported that effec-
tively doubles the amount of data that may be stored on-chip.
Conversion between the 32-bit floating-point and 16-bit floating-
point formats is done in a single instruction.
Single-Cycle Fetch of Instruction and Two Operands
The ADSP-2106x features an enhanced Harvard architecture in
which the data memory (DM) bus transfers data and the pro-
gram memory (PM) bus transfers both instructions and data
(see Figure 1). With its separate program and data memory
buses and on-chip instruction cache, the processor can simulta-
neously fetch two operands and an instruction (from the cache),
all in a single cycle.
While each memory block can store combinations of code and
data, accesses are most efficient when one block stores data,
using the DM bus for transfers, and the other block stores
instructions and data, using the PM bus for transfers. Using the
DM bus and PM bus in this way, with one dedicated to each
memory block, assures single-cycle execution with two data
transfers. In this case, the instruction must be available in the
cache. Single-cycle execution is also maintained when one of the
data operands is transferred to or from off-chip, via the ADSP-
2106x’s external port.
REV. B
–4–
ADSP-21060C/ADSP-21060LC
Off-Chip Memory and Peripherals Interface
Serial Ports
The ADSP-2106x’s external port provides the processor’s inter-
face to off-chip memory and peripherals. The 4-gigaword off-
chip address space is included in the ADSP-2106x’s unified
address space. The separate on-chip buses—for PM addresses,
PM data, DM addresses, DM data, I/O addresses, and I/O
data—are multiplexed at the external port to create an external
system bus with a single 32-bit address bus and a single 48-bit
(or 32-bit) data bus.
The ADSP-2106x features two synchronous serial ports that
provide an inexpensive interface to a wide variety of digital and
mixed-signal peripheral devices. The serial ports can operate at
the full clock rate of the processor, providing each with a maxi-
mum data rate of 40 Mbit/s. Independent transmit and receive
functions provide greater flexibility for serial communications.
Serial port data can be automatically transferred to and from
on-chip memory via DMA. Each of the serial ports offers TDM
multichannel mode.
Addressing of external memory devices is facilitated by on-chip
decoding of high-order address lines to generate memory bank
select signals. Separate control lines are also generated for sim-
plified addressing of page-mode DRAM. The ADSP-2106x
provides programmable memory wait states and external
memory acknowledge controls to allow interfacing to DRAM
and peripherals with variable access, hold, and disable time
requirements.
The serial ports can operate with little-endian or big-endian
transmission formats, with word lengths selectable from 3 bits to
32 bits. They offer selectable synchronization and transmit
modes as well as optional µ-law or A-law companding. Serial
port clocks and frame syncs can be internally or externally
generated.
Multiprocessing
Host Processor Interface
The ADSP-2106x offers powerful features tailored to multi-
processing DSP systems. The unified address space (see
Figure 4) allows direct interprocessor accesses of each ADSP-
2106x’s internal memory. Distributed bus arbitration logic is
included on-chip for simple, glueless connection of systems
containing up to six ADSP-2106xs and a host processor. Master
processor changeover incurs only one cycle of overhead. Bus
arbitration is selectable as either fixed or rotating priority. Bus lock
allows indivisible read-modify-write sequences for semaphores. A
vector interrupt is provided for interprocessor commands. Maxi-
mum throughput for interprocessor data transfer is 240 Mbytes/s
over the link ports or external port. Broadcast writes allow simulta-
neous transmission of data to all ADSP-2106xs and can be used
to implement reflective semaphores.
The ADSP-2106x’s host interface allows easy connection to
standard microprocessor buses, both 16-bit and 32-bit, with
little additional hardware required. Asynchronous transfers at
speeds up to the full clock rate of the processor are supported.
The host interface is accessed through the ADSP-2106x’s exter-
nal port and is memory-mapped into the unified address space.
Four channels of DMA are available for the host interface; code
and data transfers are accomplished with low software overhead.
The host processor requests the ADSP-2106x’s external bus
with the host bus request (HBR), host bus grant (HBG), and
ready (REDY) signals. The host can directly read and write the
internal memory of the ADSP-2106x, and can access the DMA
channel setup and mailbox registers. Vector interrupt support is
provided for efficient execution of host commands.
Link Ports
The ADSP-2106x features six 4-bit link ports that provide addi-
tional I/O capabilities. The link ports can be clocked twice per
cycle, allowing each to transfer eight bits per cycle. Link port
I/O is especially useful for point-to-point interprocessor commu-
nication in multiprocessing systems.
DMA Controller
The ADSP-2106x’s on-chip DMA controller allows zero-
overhead data transfers without processor intervention. The
DMA controller operates independently and invisibly to the
processor core, allowing DMA operations to occur while the
core is simultaneously executing its program instructions.
The link ports can operate independently and simultaneously,
with a maximum data throughput of 240 Mbytes/s. Link port
data is packed into 32- or 48-bit words, and can be directly read
by the core processor or DMA-transferred to on-chip memory.
DMA transfers can occur between the ADSP-2106x’s internal
memory and either external memory, external peripherals or a
host processor. DMA transfers can also occur between the
ADSP-2106x’s internal memory and its serial ports or link
ports. DMA transfers between external memory and external
peripheral devices are another option. External bus packing to
16-, 32-, or 48-bit words is performed during DMA transfers.
Each link port has its own double-buffered input and output
registers. Clock/acknowledge handshaking controls link port
transfers. Transfers are programmable as either transmit or
receive.
Ten channels of DMA are available on the ADSP-2106x—two
via the link ports, four via the serial ports, and four via the
processor’s external port (for either host processor, other
ADSP-2106xs, memory or I/O transfers). Four additional link
port DMA channels are shared with serial port 1 and the exter-
nal port. Programs can be downloaded to the ADSP-2106x
using DMA transfers. Asynchronous off-chip peripherals can
control two DMA channels using DMA Request/Grant lines
(DMAR1-2, DMAG1-2). Other DMA features include inter-
rupt generation upon completion of DMA transfers and DMA
chaining for automatic linked DMA transfers.
Program Booting
The internal memory of the ADSP-2106x can be booted at
system power-up from either an 8-bit EPROM, a host proces-
sor, or through one of the link ports. Selection of the boot
source is controlled by the BMS (Boot Memory Select),
EBOOT (EPROM Boot), and LBOOT (Link/Host Boot) pins.
32-bit and 16-bit host processors can be used for booting.
REV. B
–5–
ADSP-21060C/ADSP-21060LC
ADSP-2106x #6
ADSP-2106x #5
ADSP-2106x #4
ADSP-2106x #3
ADDR
CLKIN
31-0
DATA
47-0
RESET
RPBA
3
011
ID
2-0
CONTROL
CPA
5
BR , BR
1-2 4-6
BR
3
ADSP-2106x #2
CLKIN
RESET
RPBA
ADDR
31-0
DATA
47-0
3
ID
010
2-0
CONTROL
CPA
BR , BR
5
1
3-6
BR
2
ADSP-2106x #1
1x
CLOCK
CLKIN
ADDR
DATA
ADDR
DATA
31-0
RESET
RESET
GLOBAL
MEMORY
47-0
AND
PERIPHERALS
(OPTIONAL)
OE
RD
WR
ACK
RPBA
WE
ACK
CS
3
001
ID
2-0
MS
3-0
CS
BMS
PAGE
SBTS
BOOT
EPROM
(OPTIONAL)
ADDR
CONTROL
DATA
SW
ADRCLK
CS
HBR
HBG
HOST
PROCESSOR
INTERFACE
(OPTIONAL)
REDY
ADDR
DATA
CPA
5
BR
2-6
BR
1
Figure 3. Shared Memory Multiprocessing System
REV. B
–6–
ADSP-21060C/ADSP-21060LC
0x0000 0000
0x0002 0000
0x0040 0000
IOP REGISTERS
BANK 0
INTERNAL
MEMORY
SPACE
MS
MS
MS
0
1
2
NORMAL WORD ADDRESSING
SHORT WORD ADDRESSING
DRAM
(OPTIONAL)
0x0004 0000
0x0008 0000
INTERNAL MEMORY SPACE
OF ADSP-2106x
BANK 1
BANK 2
WITH ID=001
0x0010 0000
0x0018 0000
INTERNAL MEMORY SPACE
OF ADSP-2106x
WITH ID=010
INTERNAL MEMORY SPACE
OF ADSP-2106x
WITH ID=011
EXTERNAL
MEMORY
SPACE
0x0020 0000
0x0028 0000
MULTIPROCESSOR
MEMORY SPACE
INTERNAL MEMORY SPACE
OF ADSP-2106x
WITH ID=100
MS
BANK 3
3
INTERNAL MEMORY SPACE
OF ADSP-2106x
WITH ID=101
BANK SIZE IS
0x0030 0000
0x0038 0000
0x003F FFFF
SELECTED BY
MSIZE BIT FIELD OF
SYSCON
INTERNAL MEMORY SPACE
OF ADSP-2106x
WITH ID=110
REGISTER.
BROADCAST WRITE
TO ALL
NONBANKED
ADSP-2106xs
NORMAL WORD ADDRESSING: 32-BIT DATA WORDS
48-BIT INSTRUCTION WORDS
SHORT WORD ADDRESSING: 16-BIT DATA WORDS
0xFFFF FFFF
Figure 4. ADSP-21060C/ADSP-21060LC Memory Map
DEVELOPMENT TOOLS
Further details and ordering information are available in the
ADSP-21000 Family Hardware and Software Development Tools
data sheet (ADDS-210xx-TOOLS). This data sheet can be
requested from any Analog Devices sales office or distributor.
The ADSP-21060C is supported with a complete set of software
and hardware development tools, including an EZ-ICEIn-
Circuit Emulator, EZ-Kit, and development software. The
SHARC EZ-Kit is a complete low cost package for DSP evalua-
tion and prototyping. The EZ-Kit contains a PC plug-in card
(EZ-LAB®) with an ADSP-21062 (5 V) processor. The EZ-Kit
also includes an optimizing compiler, assembler, instruction
level simulator, run-time libraries, diagnostic utilities and a
complete set of example programs.
In addition to the software and hardware development tools
available from Analog Devices, third parties provide a wide
range of tools supporting the SHARC processor family. Hard-
ware tools include SHARC PC plug-in cards multiprocessor
SHARC VME boards, and daughter and modules with multiple
SHARCs and additional memory. These modules are based on
the SHARCPAC™ module specification. Third Party software
tools include an Ada compiler, DSP libraries, operating systems
and block diagram design tools.
Analog Devices ADSP-21000 Family Development Software
includes an easy to use Assembler based on an algebraic syntax,
Assembly Library/Librarian, Linker, instruction-level Simulator,
an ANSI C optimizing Compiler, the CBug™ C Source—Level
Debugger and a C Runtime Library including DSP and math-
ematical functions. The ADSP-21000 Family Development
Software is available for both the PC and Sun platforms.
ADDITIONAL INFORMATION
This data sheet provides a general overview of the ADSP-21060C
architecture and functionality. For detailed information on the
ADSP-21000 Family core architecture and instruction set, refer to
the ADSP-2106x SHARC User’s Manual, Second Edition.
The ADSP-2106x EZ-ICEEmulator uses the IEEE 1149.1 JTAG
test access port of the ADSP-2106x processor to monitor and
control the target board processor during emulation. The EZ-ICE
provides full-speed emulation, allowing inspection and modifi-
cation of memory, registers, and processor stacks. Nonintrusive
in-circuit emulation is assured by the use of the processor’s
JTAG interface—the emulator does not affect target system
loading or timing.
CBUG and SHARCPAC are trademarks of Analog Devices, Inc.
EZ-LAB is a registered trademark of Analog Devices, Inc.
REV. B
–7–
ADSP-21060C/ADSP-21060LC
PIN FUNCTION DESCRIPTIONS
ADSP-21060C pin definitions are listed below. All pins are
identical on the ADSP-21060C and ADSP-21060LC. Inputs
identified as synchronous (S) must meet timing requirements
with respect to CLKIN (or with respect to TCK for TMS,
TDI). Inputs identified as asynchronous (A) can be asserted
asynchronously to CLKIN (or to TCK for TRST).
DRx, TCLKx, RCLKx, LxDAT3-0, LxCLK, LxACK, TMS and
TDI)—these pins can be left floating. These pins have a logic-
level hold circuit that prevents the input from floating
internally.
A = Asynchronous
O = Output
G = Ground
P = Power Supply
(O/D) = Open Drain
I = Input
S = Synchronous
(A/D) = Active Drive
Unused inputs should be tied or pulled to VDD or GND,
except for ADDR31-0, DATA47-0, FLAG3-0, SW, and inputs that
have internal pull-up or pull-down resistors (CPA, ACK, DTx,
T = Three-State (when SBTS is asserted, or when the
ADSP-2106x is a bus slave)
Pin
Type
Function
ADDR31-0
I/O/T
External Bus Address. The ADSP-2106x outputs addresses for external memory and peripherals on
these pins. In a multiprocessor system the bus master outputs addresses for read/writes of the internal
memory or IOP registers of other ADSP-2106xs. The ADSP-2106x inputs addresses when a host
processor or multiprocessing bus master is reading or writing its internal memory or IOP registers.
DATA47-0
I/O/T
O/T
External Bus Data. The ADSP-2106x inputs and outputs data and instructions on these pins. 32-bit
single-precision floating-point data and 32-bit fixed-point data is transferred over bits 47–16 of the
bus. 40-bit extended-precision floating-point data is transferred over bits 47–8 of the bus. 16-bit short
word data is transferred over bits 31–16 of the bus. In PROM boot mode, 8-bit data is transferred over
bits 23–16. Pull-up resistors on unused DATA pins are not necessary.
MS3-0
Memory Select Lines. These lines are asserted (low) as chip selects for the corresponding banks of
external memory. Memory bank size must be defined in the ADSP-2106x’s system control register
(SYSCON). The MS3-0 lines are decoded memory address lines that change at the same time as the
other address lines. When no external memory access is occurring the MS3-0 lines are inactive; they are
active however when a conditional memory access instruction is executed, whether or not the condition
is true. MS0 can be used with the PAGE signal to implement a bank of DRAM memory (Bank 0). In a
multiprocessing system the MS3-0 lines are output by the bus master.
RD
I/O/T
I/O/T
O/T
Memory Read Strobe. This pin is asserted (low) when the ADSP-2106x reads from external memory
devices or from the internal memory of other ADSP-2106xs. External devices (including other ADSP-
2106xs) must assert RD to read from the ADSP-2106x’s internal memory. In a multiprocessing system
RD is output by the bus master and is input by all other ADSP-2106xs.
WR
Memory Write Strobe. This pin is asserted (low) when the ADSP-2106x writes to external memory
devices or to the internal memory of other ADSP-2106xs. External devices must assert WR to write to
the ADSP-2106x’s internal memory. In a multiprocessing system WR is output by the bus master and
is input by all other ADSP-2106xs.
PAGE
DRAM Page Boundary. The ADSP-2106x asserts this pin to signal that an external DRAM page
boundary has been crossed. DRAM page size must be defined in the ADSP-2106x’s memory control
register (WAIT). DRAM can only be implemented in external memory Bank 0; the PAGE signal can
only be activated for Bank 0 accesses. In a multiprocessing system PAGE is output by the bus master.
ADRCLK
O/T
Clock Output Reference. In a multiprocessing system ADRCLK is output by the bus master.
SW
I/O/T
Synchronous Write Select. This signal is used to interface the ADSP-2106x to synchronous
memory devices (including other ADSP-2106xs). The ADSP-2106x asserts SW (low) to provide an
early indication of an impending write cycle, which can be aborted if WR is not later asserted (e.g., in a
conditional write instruction). In a multiprocessing system, SW is output by the bus master and is
input by all other ADSP-2106xs to determine if the multiprocessor memory access is a read or write.
SW is asserted at the same time as the address output. A host processor using synchronous writes must
assert this pin when writing to the ADSP-2106x(s).
ACK
I/O/S
Memory Acknowledge. External devices can deassert ACK (low) to add wait states to an external
memory access. ACK is used by I/O devices, memory controllers, or other peripherals to hold off
completion of an external memory access. The ADSP-2106x deasserts ACK as an output to add wait
states to a synchronous access of its internal memory. In a multiprocessing system, a slave ADSP-
2106x deasserts the bus master’s ACK input to add wait state(s) to an access of its internal memory.
The bus master has a keeper latch on its ACK pin that maintains the input at the level to which it was
last driven.
REV. B
–8–
ADSP-21060C/ADSP-21060LC
Pin
Type
Function
SBTS
I/S
Suspend Bus Three-State. External devices can assert SBTS (low) to place the external bus address,
data, selects and strobes in a high impedance state for the following cycle. If the ADSP-2106x
attempts to access external memory while SBTS is asserted, the processor will halt and the memory
access will not be completed until SBTS is deasserted. SBTS should only be used to recover from host
processor/ADSP-2106x deadlock, or used with a DRAM controller.
IRQ2-0
I/A
Interrupt Request Lines. May be either edge-triggered or level-sensitive.
FLAG3-0
I/O/A
Flag Pins. Each is configured via control bits as either an input or output. As an input, it can be
tested as a condition. As an output, it can be used to signal external peripherals.
TIMEXP
O
Timer Expired. Asserted for four cycles when the timer is enabled and TCOUNT decrements to
zero.
HBR
I/A
Host Bus Request. Must be asserted by a host processor to request control of the ADSP-2106x’s
external bus. When HBR is asserted in a multiprocessing system, the ADSP-2106x that is bus master
will relinquish the bus and assert HBG. To relinquish the bus, the ADSP-2106x places the address,
data, select and strobe lines in a high impedance state. HBR has priority over all ADSP-2106x bus
requests (BR6-1) in a multiprocessing system.
HBG
CS
I/O
I/A
Host Bus Grant. Acknowledges an HBR bus request, indicating that the host processor may take
control of the external bus. HBG is asserted (held low) by the ADSP-2106x until HBR is released. In a
multiprocessing system, HBG is output by the ADSP-2106x bus master and is monitored by all others.
Chip Select. Asserted by host processor to select the ADSP-2106x.
REDY (O/D) O
Host Bus Acknowledge. The ADSP-2106x deasserts REDY (low) to add wait states to an asynchro-
nous access of its internal memory or IOP registers by a host. Open drain output (O/D) by default; can
be programmed in ADREDY bit of SYSCON register to be active drive (A/D). REDY will only be
output if the CS and HBR inputs are asserted.
DMAR1
DMAR2
DMAG1
DMAG2
BR6-1
I/A
DMA Request 1 (DMA Channel 7).
DMA Request 2 (DMA Channel 8).
DMA Grant 1 (DMA Channel 7).
DMA Grant 2 (DMA Channel 8).
I/A
O/T
O/T
I/O/S
Multiprocessing Bus Requests. Used by multiprocessing ADSP-2106xs to arbitrate for bus master-
ship. An ADSP-2106x only drives its own BRx line (corresponding to the value of its ID2-0 inputs) and
monitors all others. In a multiprocessor system with less than six ADSP-2106xs, the unused BRx pins
should be pulled high; the processor’s own BRx line must not be pulled high or low because it is an
output.
ID2-0
I
Multiprocessing ID. Determines which multiprocessing bus request (BR1 – BR6) is used by ADSP-
2106x. ID = 001 corresponds to BR1, ID = 010 corresponds to BR2, etc. ID = 000 in single-processor
systems. These lines are a system configuration selection which should be hardwired or only changed
at reset.
RPBA
I/S
I/O
Rotating Priority Bus Arbitration Select. When RPBA is high, rotating priority for multiprocessor
bus arbitration is selected. When RPBA is low, fixed priority is selected. This signal is a system con-
figuration selection which must be set to the same value on every ADSP-2106x. If the value of RPBA is
changed during system operation, it must be changed in the same CLKIN cycle on every ADSP-2106x.
CPA (O/D)
Core Priority Access. Asserting its CPA pin allows the core processor of an ADSP-2106x bus slave
to interrupt background DMA transfers and gain access to the external bus. CPA is an open drain
output that is connected to all ADSP-2106xs in the system. The CPA pin has an internal 5 kΩ pull-up
resistor. If core access priority is not required in a system, the CPA pin should be left unconnected.
DTx
O
Data Transmit (Serial Ports 0, 1). Each DT pin has a 50 kΩ internal pull-up resistor.
Data Receive (Serial Ports 0, 1). Each DR pin has a 50 kΩ internal pull-up resistor.
Transmit Clock (Serial Ports 0, 1). Each TCLK pin has a 50 kΩ internal pull-up resistor.
Receive Clock (Serial Ports 0, 1). Each RCLK pin has a 50 kΩ internal pull-up resistor.
DRx
I
TCLKx
RCLKx
I/O
I/O
REV. B
–9–
ADSP-21060C/ADSP-21060LC
Pin
Type
Function
TFSx
I/O
Transmit Frame Sync (Serial Ports 0, 1).
Receive Frame Sync (Serial Ports 0, 1).
RFSx
I/O
LxDAT3-0
I/O
Link Port Data (Link Ports 0–5). Each LxCLK pin has a 50 kΩ internal pull-down resistor that is
enabled or disabled by the LPDRD bit of the LCOM register.
LxCLK
LxACK
EBOOT
I/O
I/O
I
Link Port Clock (Link Ports 0–5). Each LxCLK pin has a 50 kΩ internal pull-down resistor that is
enabled or disabled by the LPDRD bit of the LCOM register.
Link Port Acknowledge (Link Ports 0–5). Each LxACK pin has a 50 kΩ internal pull-down resistor
that is enabled or disabled by the LPDRD bit of the LCOM register.
EPROM Boot Select. When EBOOT is high, the ADSP-2106x is configured for booting from an 8-
bit EPROM. When EBOOT is low, the LBOOT and BMS inputs determine booting mode. See table
below. This signal is a system configuration selection that should be hardwired.
LBOOT
I
Link Boot. When LBOOT is high, the ADSP-2106x is configured for link port booting. When
LBOOT is low, the ADSP-2106x is configured for host processor booting or no booting. See table
below. This signal is a system configuration selection that should be hardwired.
BMS
I/O/T*
Boot Memory Select. Output: Used as chip select for boot EPROM devices (when EBOOT = 1,
LBOOT = 0). In a multiprocessor system, BMS is output by the bus master. Input: When low, indi-
cates that no booting will occur and that ADSP-2106x will begin executing instructions from external
memory. See table below. This input is a system configuration selection that should be hardwired.
*Three-statable only in EPROM boot mode (when BMS is an output).
EBOOT
LBOOT
BMS
Booting Mode
1
0
0
0
0
1
0
0
1
0
1
1
Output
EPROM (Connect BMS to EPROM chip select.)
Host Processor
Link Port
No Booting. Processor executes from external memory.
Reserved
Reserved
1 (Input)
1 (Input)
0 (Input)
0 (Input)
x (Input)
CLKIN
I
Clock In. External clock input to the ADSP-2106x. The instruction cycle rate is equal to CLKIN.
CLKIN may not be halted, changed, or operated below the minimum specified frequency.
RESET
I/A
Processor Reset. Resets the ADSP-2106x to a known state and begins execution at the program
memory location specified by the hardware reset vector address. This input must be asserted (low) at
power-up.
TCK
TMS
I
Test Clock (JTAG). Provides an asynchronous clock for JTAG boundary scan.
I/S
Test Mode Select (JTAG). Used to control the test state machine. TMS has a 20 kΩ internal pull-up
resistor.
TDI
I/S
Test Data Input (JTAG). Provides serial data for the boundary scan logic. TDI has a 20 kΩ internal
pull-up resistor.
TDO
O
Test Data Output (JTAG). Serial scan output of the boundary scan path.
TRST
I/A
Test Reset (JTAG). Resets the test state machine. TRST must be asserted (pulsed low) after power-
up or held low for proper operation of the ADSP-2106x. TRST has a 20 kΩ internal pull-up resistor.
EMU (O/D)
ICSA
O
O
P
Emulation Status. Must be connected to the ADSP-2106x EZ-ICE target board connector only.
Reserved, leave unconnected.
VDD
Power Supply; nominally 5.0 V dc for 5 V devices or 3.3 V dc for 3.3 V devices. (30 pins).
Power Supply Return. (30 pins).
GND
G
NC
Do Not Connect. Reserved pins which must be left open and unconnected.
REV. B
–10–
ADSP-21060C/ADSP-21060LC
TARGET BOARD CONNECTOR FOR EZ-ICE PROBE
The ADSP-2106x EZ-ICE Emulator uses the IEEE 1149.1
JTAG test access port of the ADSP-2106x to monitor and control
the target board processor during emulation. The EZ-ICE probe
requires the ADSP-2106x’s CLKIN, TMS, TCK, TRST, TDI,
TDO, EMU, and GND signals be made accessible on the target
system via a 14-pin connector (a 2 row × 7 pin strip header) such
as that shown in Figure 5. The EZ-ICE probe plugs directly onto
this connector for chip-on-board emulation. You must add this
connector to your target board design if you intend to use the
ADSP-2106x EZ-ICE. The total trace length between the EZ-
ICE connector and the furthest device sharing the EZ-ICE
JTAG pins should be limited to 15 inches maximum for guaran-
teed operation. This length restriction must include EZ-ICE
JTAG signals that are routed to one or more ADSP-2106x
devices, or a combination of ADSP-2106x devices and other
JTAG devices on the chain.
The 14-pin, 2-row pin strip header is keyed at the Pin 3 location —
Pin 3 must be removed from the header. The pins must be
0.025 inch square and at least 0.20 inch in length. Pin spacing
should be 0.1 × 0.1 inches. Pin strip headers are available from
vendors such as 3M, McKenzie and Samtec.
The BTMS, BTCK, BTRST and BTDI signals are provided so
the test access port can also be used for board-level testing.
When the connector is not being used for emulation, place
jumpers between the Bxxx pins and the xxx pins. If the test
access port will not be used for board testing, tie BTRST to GND
and tie or pull BTCK up to VDD. The TRST pin must be
asserted after power-up (through BTRST on the connector) or
held low for proper operation of the ADSP-2106x. None of the
Bxxx pins (Pins 5, 7, 9, 11) are connected on the EZ-ICEprobe.
The JTAG signals are terminated on the EZ-ICE probe as
follows:
Signal Termination
1
2
TMS
TCK
Driven through 22 Ω Resistor (16 mA Driver)
Driven at 10 MHz through 22 Ω Resistor (16 mA
Driver)
EMU
GND
3
5
4
6
KEY (NO PIN)
CLKIN (OPTIONAL)
TMS
TRST* Active Low Driven through 22 Ω Resistor (16 mA
Driver) (Pulled Up by On-Chip 20 kΩ Resistor)
BTMS
TDI
TDO
Driven by 22 Ω Resistor (16 mA Driver)
7
9
8
One TTL Load, Split Termination (160/220)
TCK
BTCK
CLKIN One TTL Load, Split Termination (160/220)
10
12
EMU
Active Low 4.7 kΩ Pull-Up Resistor, One TTL Load
(Open-Drain Output from the DSP)
BTRST
TRST
11
*TRST is driven low until the EZ-ICE probe is turned on by the emulator at
software start-up. After software start-up, TRST is driven high.
BTDI
GND
TDI
13
14
Figure 6 shows JTAG scan path connections for systems that
contain multiple ADSP-2106x processors.
TDO
TOP VIEW
Figure 5. Target Board Connector for ADSP-2106x EZ-ICE
Emulator (Jumpers in Place)
JTAG
DEVICE
(OPTIONAL)
ADSP-2106x
ADSP-2106x
#1
n
TDI
TDO
TDO
TDO
TDI
TDI
TDI
EZ-ICE
JTAG
CONNECTOR
OTHER
JTAG
CONTROLLER
TCK
TMS
EMU
TRST
TDO
CLKIN
OPTIONAL
Figure 6. JTAG Scan Path Connections for Multiple ADSP-2106x Systems
REV. B
–11–
ADSP-21060C/ADSP-21060LC
Connecting CLKIN to Pin 4 of the EZ-ICEheader is optional.
The emulator only uses CLKIN when directed to perform op-
erations such as starting, stopping and single-stepping multiple
ADSP-21060 in a synchronous manner. If you do not need these
operations to occur synchronously on the multiple processors,
simply tie Pin 4 of the EZ-ICE header to ground.
CLKIN and EMU should be treated as critical signals in terms
of skew, and should be laid out as short as possible on your
board. If TCK, TMS and CLKIN are driving a large number of
ADSP-21060 (more than eight) in your system, then treat them
as a clock tree using multiple drivers to minimize skew. (See
Figure 7, JTAG Clock Tree, and Clock Distribution in the
High Frequency Design Considerations section of the ADSP-
2106x User’s Manual, Second Edition.)
If synchronous multiprocessor operations are needed and CLKIN
is connected, clock skew between the multiple ADSP-21060C/
ADSP-21060LC processors and the CLKIN pin on the EZ-ICE
header must be minimal. If the skew is too large, synchronous
operations may be off by one or more cycles between proces-
sors. For synchronous multiprocessor operation TCK, TMS,
If synchronous multiprocessor operations are not needed (i.e.,
CLKIN is not connected), just use appropriate parallel termina-
tion on TCK and TMS. TDI, TDO, EMU, and TRST are not
critical signals in terms of skew.
For complete information on the SHARC EZ-ICE, see the ADSP-
2100 Family JTAG EZ-ICE User’s Guide and Reference.
TDI
TDO
TDI
TDO
TDI
TDO
5kꢀ
*
TDI
TDO
TDI
TDO
TDI
TDO
TDI
5kꢀ
*
EMU
TCK
TMS
TRST
TDO
SYSTEM
CLKIN
CLKIN
EMU
*
OPEN DRAIN DRIVER OR EQUIVALENT, i.e.,
Figure 7. JTAG Clocktree for Multiple ADSP-2106x Systems
REV. B
–12–
ADSP-21060C/ADSP-21060LC
ADSP-21060C–SPECIFICATIONS
RECOMMENDED OPERATING CONDITIONS (5 V)
K Grade
Parameter
Test Conditions
Min
Max
Unit
VDD
TCASE
VIH1
VIH2
VIL
Supply Voltage
4.75
–40
2.0
2.2
–0.5
5.25
+100
VDD + 0.5
VDD + 0.5
+0.8
V
°C
V
V
V
Case Operating Temperature
High Level Input Voltage1
High Level Input Voltage2
Low Level Input Voltage1, 2
@ VDD = max
@ VDD = max
@ VDD = min
NOTES
1Applies to input and bidirectional pins: DATA47-0, ADDR31-0, RD, WR, SW, ACK, SBTS, IRQ2-0, FLAG3-0, HBG, CS, DMAR1, DMAR2, BR6-1, ID2-0, RPBA,
CPA, TFS0, TFS1, RFS0, RFS1, LxDAT3-0, LxCLK, LxACK, EBOOT, LBOOT, BMS, TMS, TDI, TCK, HBR, DR0, DR1, TCLK0, TCLK1, RCLK0, RCLK1.
2Applies to input pins: CLKIN, RESET, TRST.
ELECTRICAL CHARACTERISTICS (5 V)
Parameter
Test Conditions
Min
Max
Unit
VOH
VOL
IIH
IIL
IILP
IOZH
IOZL
IOZHP
IOZLC
IOZLA
IOZLAR
IOZLS
CIN
High Level Output Voltage1
Low Level Output Voltage1
High Level Input Current3, 4
Low Level Input Current3
@ VDD = min, IOH = –2.0 mA2
@ VDD = min, IOL = 4.0 mA2
@ VDD = max, VIN = VDD max
@ VDD = max, VIN = 0 V
@ VDD = max, VIN = 0 V
@ VDD = max, VIN = VDD max
@ VDD = max, VIN = 0 V
@ VDD = max, VIN = VDD max
@ VDD = max, VIN = 0 V
@ VDD = max, VIN = 1.5 V
@ VDD = max, VIN = 0 V
@ VDD = max, VIN = 0 V
4.1
V
V
0.4
10
10
150
10
10
350
1.5
350
4.2
150
4.7
µA
µA
µA
µA
µA
µA
mA
µA
mA
µA
pF
Low Level Input Current4
Three-State Leakage Current5, 6, 7, 8
Three-State Leakage Current5, 9
Three-State Leakage Current9
Three-State Leakage Current7
Three-State Leakage Current10
Three-State Leakage Current8
Three-State Leakage Current6
Input Capacitance11, 12
fIN = 1 MHz, TCASE = 25°C, VIN = 2.5 V
NOTES
11Applies to output and bidirectional pins: DATA47-0, ADDR31-0, MS3-0, RD, WR, PAGE, ADRCLK, SW, ACK, FLAG3-0, TIMEXP, HBG, REDY, DMAG1,
DMAG2, BR6-1, CPA, DT0, DT1, TCLK0, TCLK1, RCLK0, RCLK1, TFS0, TFS1, RFS0, RFS1, LxDAT3-0, LxCLK, LxACK, BMS, TDO, EMU, ICSA.
12See “Output Drive Currents” for typical drive current capabilities.
13Applies to input pins: SBTS, IRQ2-0, HBR, CS, DMAR1, DMAR2, ID2-0, RPBA, EBOOT, LBOOT, CLKIN, RESET, TCK.
14Applies to input pins with internal pull-ups: DR0, DR1, TRST, TMS, TDI.
15Applies to three-statable pins: DATA47-0, ADDR31-0, MS3-0, RD, WR, PAGE, ADRCLK, SW, ACK, FLAG3-0, REDY, HBG, DMAG1, DMAG2, BMS, BR6–1
,
TFSX, RFSX, TDO, EMU. (Note that ACK is pulled up internally with 2 kΩ during reset in a multiprocessor system, when ID2-0 = 001 and another ADSP-21060 is
not requesting bus mastership.)
16Applies to three-statable pins with internal pull-ups: DT0, DT1, TCLK0, TCLK1, RCLK0, RCLK1.
17Applies to CPA pin.
18Applies to ACK pin when pulled up. (Note that ACK is pulled up internally with 2 kΩ during reset in a multiprocessor system, when ID2-0 = 001 and another
ADSP-21060 is not requesting bus mastership).
19Applies to three-statable pins with internal pull-downs: LxDAT3-0, LxCLK, LxACK.
10Applies to ACK pin when keeper latch enabled.
11Applies to all signal pins.
12Guaranteed but not tested.
Specifications subject to change without notice.
–13–
REV. B
ADSP-21060C/ADSP-21060LC
POWER DISSIPATION ADSP-21060C (5 V)
These specifications apply to the internal power portion of VDD only. See the Power Dissipation section of this data sheet for calcula-
tion of external supply current and total supply current. For a complete discussion of the code used to measure power dissipation, see
the technical note “SHARC Power Dissipation Measurements.”
Specifications are based on the following operating scenarios:
Operation
Peak Activity (IDDINPEAK
)
High Activity (IDDINHIGH
)
Low Activity (IDDINLOW)
Instruction Type
Multifunction
Multifunction
Single Function
Instruction Fetch
Cache
Internal Memory
1 per Cycle (DM)
1 per 2 Cycles
Internal Memory
None
Core Memory Access
Internal Memory DMA
2 per Cycle (DM and PM)
1 per Cycle
1 per 2 Cycles
To estimate power consumption for a specific application, use the following equation where % is the amount of time your program
spends in that state:
%PEAK × IDDINPEAK + %HIGH × IDDINHIGH + %LOW × IDDINLOW + %IDLE × IDDIDLE = power consumption
Parameter
Test Conditions
Max
Unit
IDDINPEAK
Supply Current (Internal)1
Supply Current (Internal)2
Supply Current (Internal)2
Supply Current (Idle)3
tCK = 30 ns, VDD = max
tCK = 25 ns, VDD = max
745
850
mA
mA
IDDINHIGH
tCK = 30 ns, VDD = max
tCK = 25 ns, VDD = max
575
670
mA
mA
IDDINLOW
tCK = 30 ns, VDD = max
tCK = 25 ns, VDD = max
340
390
mA
mA
IDDIDLE
VDD = max
200
mA
NOTES
1The test program used to measure IDDINPEAK represents worst case processor operation and is not sustainable under normal application conditions. Actual internal
power measurements made using typical applications are less than specified.
2IDDINHIGH is a composite average based on a range of high activity code. IDDINLOW is a composite average based on a range of low activity code.
3Idle denotes ADSP-21060C state during execution of IDLE instruction.
REV. B
–14–
ADSP-21060C/ADSP-21060LC
ADSP-21060LC–SPECIFICATIONS
RECOMMENDED OPERATING CONDITIONS (3.3 V)
K Grade
Parameter
Test Conditions
Min
Max
Unit
VDD
TCASE
VIH1
VIH2
VIL
Supply Voltage
3.15
–40
2.0
2.2
–0.5
3.45
+100
VDD + 0.5
VDD + 0.5
0.8
V
°C
V
V
V
Case Operating Temperature
High Level Input Voltage1
High Level Input Voltage2
Low Level Input Voltage1, 2
@ VDD = max
@ VDD = max
@ VDD = min
NOTES
1Applies to input and bidirectional pins: DATA47-0, ADDR31-0, RD, WR, SW, ACK, SBTS, IRQ2-0, FLAG3-0, HBG, CS, DMAR1, DMAR2, BR6-1, ID2-0, RPBA,
CPA, TFS0, TFS1, RFS0, RFS1, LxDAT3-0, LxCLK, LxACK, EBOOT, LBOOT, BMS, TMS, TDI, TCK, HBR, DR0, DR1, TCLK0, TCLK1, RCLK0,
RCLK1.
2Applies to input pins: CLKIN, RESET, TRST.
ELECTRICAL CHARACTERISTICS (3.3 V)
Parameter
Test Conditions
Min
Max
Unit
VOH
VOL
IIH
IIL
IILP
IOZH
IOZL
IOZHP
IOZLC
IOZLA
IOZLAR
IOZLS
CIN
High Level Output Voltage1
Low Level Output Voltage1
High Level Input Current3, 4
Low Level Input Current3
@ VDD = min, IOH = –2.0 mA2
@ VDD = min, IOL = 4.0 mA2
@ VDD = max, VIN = VDD max
@ VDD = max, VIN = 0 V
@ VDD = max, VIN = 0 V
@ VDD = max, VIN = VDD max
@ VDD = max, VIN = 0 V
@ VDD = max, VIN = VDD max
@ VDD = max, VIN = 0 V
@ VDD = max, VIN = 2 V
@ VDD = max, VIN = 0 V
@ VDD = max, VIN = 0 V
2.4
V
V
0.4
10
10
150
10
10
350
1.5
350
4.2
150
4.7
µA
µA
µA
µA
µA
µA
mA
µA
mA
µA
pF
Low Level Input Current4
Three-State Leakage Current5, 6, 7, 8
Three-State Leakage Current5, 9
Three-State Leakage Current9
Three-State Leakage Current7
Three-State Leakage Current10
Three-State Leakage Current8
Three-State Leakage Current6
Input Capacitance11, 12
fIN = 1 MHz, TCASE = 25°C, VIN = 2.5 V
NOTES
11Applies to output and bidirectional pins: DATA47-0, ADDR31-0, MS3-0, RD, WR, PAGE, ADRCLK, SW, ACK, FLAG3-0, TIMEXP, HBG, REDY, DMAG1,
DMAG2, BR6-1, CPA, DT0, DT1, TCLK0, TCLK1, RCLK0, RCLK1, TFS0, TFS1, RFS0, RFS1, LxDAT3-0, LxCLK, LxACK, BMS, TDO, EMU, ICSA.
12See “Output Drive Currents” for typical drive current capabilities.
13Applies to input pins: ACK SBTS, IRQ2-0, HBR, CS, DMAR1, DMAR2, ID2-0, RPBA, EBOOT, LBOOT, CLKIN, RESET, TCK.
14Applies to input pins with internal pull-ups: DR0, DR1, TRST, TMS, TDI.
15Applies to three-statable pins: DATA47-0, ADDR31-0, MS3-0, RD, WR, PAGE, ADRCLK, SW, ACK, FLAG3-0, REDY, HBG, DMAG1, DMAG2, BMS, BR6–1
,
TFSX, RFSX, TDO, EMU. (Note that ACK is pulled up internally with 2 kΩ during reset in a multiprocessor system, when ID2-0 = 001 and another ADSP-21060LC
is not requesting bus mastership.)
16Applies to three-statable pins with internal pull-ups: DT0, DT1, TCLK0, TCLK1, RCLK0, RCLK1.
17Applies to CPA pin.
18Applies to ACK pin when pulled up. (Note that ACK is pulled up internally with 2 kΩ during reset in a multiprocessor system, when ID2-0 = 001 and another
ADSP-21060LC is not requesting bus mastership).
19Applies to three-statable pins with internal pull-downs: LxDAT3-0, LxCLK, LxACK.
10Applies to ACK pin when keeper latch enabled.
11Applies to all signal pins.
12Guaranteed but not tested.
Specifications subject to change without notice.
REV. B
–15–
ADSP-21060C/ADSP-21060LC
POWER DISSIPATION ADSP-21060LC (3.3 V)
These specifications apply to the internal power portion of VDD only. See the Power Dissipation section of this data sheet for calcula-
tion of external supply current and total supply current. For a complete discussion of the code used to measure power dissipation,
see the technical note “SHARC Power Dissipation Measurements.”
Specifications are based on the following operating scenarios:
Operation
Peak Activity (IDDINPEAK
Multifunction
)
High Activity (IDDINHIGH
Multifunction
)
Low Activity (IDDINLOW
Single Function
Internal Memory
None
)
Instruction Type
Instruction Fetch
Core Memory Access
Internal Memory DMA
Cache
Internal Memory
1 per Cycle (DM)
1 per 2 Cycles
2 per Cycle (DM and PM)
1 per Cycle
1 per 2 Cycles
To estimate power consumption for a specific application, use the following equation where % is the amount of time your program
spends in that state:
%PEAK × IDDINPEAK + %HIGH × IDDINHIGH + %LOW × IDDINLOW + %IDLE × IDDIDLE = power consumption
Parameter
Test Conditions
Max
Unit
IDDINPEAK
Supply Current (Internal)1
Supply Current (Internal)2
Supply Current (Internal)2
Supply Current (Idle)3
tCK = 30 ns, VDD = max
tCK = 25 ns, VDD = max
540
600
mA
mA
IDDINHIGH
IDDINLOW
tCK = 30 ns, VDD = max
tCK = 25 ns, VDD = max
425
475
mA
mA
tCK = 30 ns, VDD = max
tCK = 25 ns, VDD = max
250
275
mA
mA
IDDIDLE
VDD = max
180
mA
NOTES
1The test program used to measure IDDINPEAK represents worst-case processor operation and is not sustainable under normal application conditions. Actual internal
power measurements made using typical applications are less than specified.
2IDDINHIGH is a composite average based on a range of high activity code. IDDINLOW is a composite average based on a range of low activity code.
3Idle denotes ADSP-21060LC state during execution of IDLE instruction.
REV. B
–16–
ADSP-21060C/ADSP-21060LC
ABSOLUTE MAXIMUM RATINGS (3.3 V)*
ABSOLUTE MAXIMUM RATINGS (5 V)*
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +4.6 V
Input Voltage . . . . . . . . . . . . . . . . . . . . –0.5 V to VDD + 0.5 V
Output Voltage Swing . . . . . . . . . . . . . –0.5 V to VDD + 0.5 V
Load Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 pF
Junction Temperature Under Bias . . . . . . . . . . . . . . . . . 130°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Lead Temperature (5 seconds) . . . . . . . . . . . . . . . . . . . 280°C
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Input Voltage . . . . . . . . . . . . . . . . . . . . –0.5 V to VDD + 0.5 V
Output Voltage Swing . . . . . . . . . . . . . –0.5 V to VDD + 0.5 V
Load Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 pF
Junction Temperature Under Bias . . . . . . . . . . . . . . . . 130°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Lead Temperature (5 seconds) . . . . . . . . . . . . . . . . . . 280°C
*Stresses greater than those listed above may cause permanent damage to the
device. These are stress ratings only, and functional operation of the device at these
or any other conditions greater than those indicated in the operational sections of
this specification is not implied. Exposure to absolute maximum rating conditions
for extended periods may affect device reliability.
*Stresses greater than those listed above may cause permanent damage to the
device. These are stress ratings only, and functional operation of the device at these
or any other conditions greater than those indicated in the operational sections of
this specification is not implied. Exposure to absolute maximum rating conditions
for extended periods may affect device reliability.
ESD SENSITIVITY
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V
readily accumulate on the human body and test equipment and can discharge without
detection. Although the ADSP-21060C/ADSP-21060LC features proprietary ESD pro-
tection circuitry, permanent damage may occur on devices subjected to high-energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid
performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
See Figure 28 under Test Conditions for voltage reference
levels.
TIMING SPECIFICATIONS
Two speed grades of the ADSP-21060C are offered, 40 MHz
and 33.3 MHz. The specifications shown are based on a
CLKIN frequency of 40 MHz (tCK = 25 ns). The DT derating
allows specifications at other CLKIN frequencies (within the
min–max range of the tCK specification; see Clock Input below).
DT is the difference between the actual CLKIN period and a
CLKIN period of 25 ns:
Switching Characteristics specify how the processor changes its
signals. You have no control over this timing—circuitry external
to the processor must be designed for compatibility with these
signal characteristics. Switching characteristics tell you what the
processor will do in a given circumstance. You can also use
switching characteristics to ensure that any timing requirement
of a device connected to the processor (such as memory) is
satisfied.
DT = tCK – 25 ns
Timing Requirements apply to signals that are controlled by cir-
cuitry external to the processor, such as the data input for a
read operation. Timing requirements guarantee that the proces-
sor operates correctly with other devices.
Use the exact timing information given. Do not attempt to
derive parameters from the addition or subtraction of others.
While addition or subtraction would yield meaningful results for
an individual device, the values given in this data sheet reflect
statistical variations and worst cases. Consequently, you cannot
meaningfully add parameters to derive longer times.
(O/D) = Open Drain
(A/D) = Active Drive
REV. B
–17–
ADSP-21060C/ADSP-21060LC
ADSP-21060C
40 MHz 33 MHz
ADSP-21060LC
40 MHz 33 MHz
Min Max Unit
Parameter
Min
Max
Min
Max
Min
Max
Clock Input
Timing Requirements:
tCK
CLKIN Period
25
7
5
100
3
30
7
5
100
3
25
9.5
5
100
3
30
9.5
5
100
3
ns
ns
ns
ns
tCKL
tCKH
tCKRF
CLKIN Width Low
CLKIN Width High
CLKIN Rise/Fall (0.4 V–2.0 V)
tCK
CLKIN
tCKH
tCKL
Figure 8. Clock Input
ADSP-21060C
ADSP-21060LC
Max
Parameter
Reset
Min
Max
Min
Unit
Timing Requirements:
tWRST
RESET Pulsewidth Low1
tSRST
RESET Setup before CLKIN High2
4tCK
14 + DT/2
4tCK
14 + DT/2 tCK
ns
ns
tCK
NOTES
1Applies after the power-up sequence is complete. At power-up, the processor’s internal phase-locked loop requires no more than 2000 CLKIN cycles while RESET
is low, assuming stable VDD and CLKIN (not including start-up time of external clock oscillator).
2Only required if multiple ADSP-2106xs must come out of reset synchronous to CLKIN with program counters (PC) equal (i.e., for a SIMD system). Not required
for multiple ADSP-2106xs communicating over the shared bus (through the external port), because the bus arbitration logic synchronizes itself automatically after reset.
CLKIN
tSRST
tWRST
RESET
Figure 9. Reset
ADSP-21060C
ADSP-21060LC
Parameter
Min
Max
Min
Max
Unit
Interrupts
Timing Requirements:
tSIR
tHIR
tIPW
IRQ2-0 Setup before CLKIN High1
18 + 3DT/4
2 + tCK
18 + 3DT/4
2 + tCK
ns
ns
ns
IRQ2-0 Hold before CLKIN High1
IRQ2-0 Pulsewidth2
12 + 3DT/4
12 + 3DT/4
NOTES
1Only required for IRQx recognition in the following cycle.
2Applies only if tSIR and tHIR requirements are not met.
CLKIN
tSIR
tHIR
IRQ2-0
tIPW
Figure 10. Interrupts
REV. B
–18–
ADSP-21060C/ADSP-21060LC
ADSP-21060C
ADSP-21060LC
Parameter
Min
Max
Min
Max
Unit
Timer
Switching Characteristic:
tDTEX
CLKIN High to TIMEXP
15
15
ns
CLKIN
tDTEX
tDTEX
TIMEXP
Figure 11. Timer
ADSP-21060C
ADSP-21060LC
Parameter
Flags
Min
Max
Min
Max
Unit
Timing Requirements:
tSFI
tHFI
tDWRFI
tHFIWR
FLAG3-0IN Setup before CLKIN High1
FLAG3-0IN Hold after CLKIN High1
FLAG3-0IN Delay after RD/WR Low1
FLAG3-0IN Hold after RD/WR Deasserted1
8 + 5DT/16
0 – 5DT/16
8 + 5DT/16
0 – 5DT/16
ns
ns
ns
ns
5 + 7DT/16
5 + 7DT/16
0
0
Switching Characteristics:
tDFO
FLAG3-0OUT Delay after CLKIN High
16
14
16
14
ns
ns
ns
ns
tHFO
tDFOE
tDFOD
FLAG3-0OUT Hold after CLKIN High
CLKIN High to FLAG3-0OUT Enable
CLKIN High to FLAG3-0OUT Disable
4
3
4
3
NOTE
1Flag inputs meeting these setup and hold times will affect conditional instructions in the following instruction cycle.
CLKIN
tDFOE
tDFO
tDFO
tDFOD
tHFO
FLAG3-0
OUT
FLAG OUTPUT
CLKIN
tHFI
tSFI
FLAG3-0
IN
tHFIWR
tDWRFI
RD, WR
FLAG INPUT
Figure 12. Flags
REV. B
–19–
ADSP-21060C/ADSP-21060LC
Memory Read—Bus Master
characteristics also apply for bus master synchronous read/write
timing (see Synchronous Read/Write – Bus Master below). If
these timing requirements are met, the synchronous read/write
timing can be ignored (and vice versa).
Use these specifications for asynchronous interfacing to memo-
ries (and memory-mapped peripherals) without reference to
CLKIN. These specifications apply when the ADSP-2106x is
the bus master accessing external memory space. These switching
ADSP-21060C
ADSP-21060LC
Max
Parameter
Min
Max
Min
Unit
Timing Requirements:
tDAD
tDRLD
tHDA
tHDRH
tDAAK
tDSAK
Address, Selects Delay to Data Valid1, 2
18 + DT + W
12 + 5DT/8 + W
18 + DT + W
12 + 5DT/8 + W ns
ns
RD Low to Data Valid1
Data Hold from Address, Selects3
Data Hold from RD High3
0.5
2.0
0.5
2.0
ns
ns
ACK Delay from Address, Selects2, 4
ACK Delay from RD Low4
14 + 7DT/8 + W
8 + DT/2 + W
14 + 7DT/8 + W ns
8 + DT/2 + W
ns
Switching Characteristics:
tDRHA
tDARL
tRW
Address, Selects Hold after RD High
0 + H
2 + 3DT/8
12.5 + 5DT/8 + W
8 + 3DT/8 + HI
0 + H
2 + 3DT/8
12.5 + 5DT/8 + W
8 + 3DT/8 + HI
ns
ns
ns
ns
Address, Selects to RD Low2
RD Pulsewidth
tRWR
RD High to WR, RD, DMAGx Low
tSADADC Address, Selects Setup before
ADRCLK High2
0 + DT/4
0 + DT/4
ns
W = (number of wait states specified in WAIT register) × tCK.
HI = tCK (if an address hold cycle or bus idle cycle occurs, as specified in WAIT register; otherwise HI = 0).
H = tCK (if an address hold cycle occurs as specified in WAIT register; otherwise H = 0).
NOTES
1Data Delay/Setup: User must meet tDAD or tDRLD or synchronous spec tSSDATI
.
2The falling edge of MSx, SW, BMS is referenced.
3Data Hold: User must meet tHDA or tHDRH or synchronous spec tHSDATI. See System Hold Time Calculation under Test Conditions for the calculation of hold times
given capacitive and dc loads.
4ACK Delay/Setup: User must meet tDAAK or tDSAK or synchronous specification tSACKC for deassertion of ACK (Low), all three specifications must be met for asser-
tion of ACK (High).
ADDRESS
MSx, SW
BMS
tDRHA
tDARL
tRW
RD
tHDA
tHDRH
tDRLD
tDAD
DATA
tDSAK
tRWR
tDAAK
ACK
WR, DMAG
tSADADC
ADRCLK
(OUT)
Figure 13. Memory Read—Bus Master
REV. B
–20–
ADSP-21060C/ADSP-21060LC
Memory Write—Bus Master
characteristics also apply for bus master synchronous read/write
timing (see Synchronous Read/Write–Bus Master). If these
timing requirements are met, the synchronous read/write timing
can be ignored (and vice versa).
Use these specifications for asynchronous interfacing to memo-
ries (and memory-mapped peripherals) without reference to
CLKIN. These specifications apply when the ADSP-2106x is
the bus master accessing external memory space. These switching
ADSP-21060C
ADSP-21060LC
Max
Parameter
Min
Max
Min
Unit
Timing Requirements:
tDAAK
tDSAK
ACK Delay from Address, Selects1, 2
14 + 7DT/8 + W
8 + DT/2 + W
14 + 7DT/8 + W ns
ACK Delay from WR Low1
8 + DT/2 + W
ns
Switching Characteristics:
tDAWH
tDAWL
tWW
tDDWH
tDWHA
Address, Selects to WR Deasserted2
17 + 15DT/16 + W
3 + 3DT/8
17 + 15DT/16 + W
3 + 3DT/8
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Address, Selects to WR Low2
WR Pulsewidth
12 + 9DT/16 + W
7 + DT/2 + W
0.5 + DT/16 + H
1 + DT/16 + H
8 + 7DT/16 + H
5 + 3DT/8 + I
–1 + DT/16
12 + 9DT/16 + W
7 + DT/2 + W
0.5 + DT/16 + H
1 + DT/16 + H
8 + 7DT/16 + H
5 + 3DT/8 + I
–1 + DT/16
Data Setup before WR High
Address Hold after WR Deasserted
tDATRWH Data Disable after WR Deasserted3
6 + DT/16 + H
6 + DT/16 + H
tWWR
tDDWR
tWDE
WR High to WR, RD, DMAGx Low
Data Disable before WR or RD Low
WR Low to Data Enabled
tSADADC Address, Selects to ADRCLK High2
0 + DT/4
0 + DT/4
W = (number of wait states specified in WAIT register) × tCK
.
H = tCK (if an address hold cycle occurs, as specified in WAIT register; otherwise H = 0).
I = tCK (if a bus idle cycle occurs, as specified in WAIT register; otherwise I = 0).
NOTES
1ACK Delay/Setup: User must meet tDAAK or tDSAK or synchronous specification tSACKC for deassertion of ACK (Low), all three specifications must be met for asser-
tion of ACK (High).
2The falling edge of MSx, SW, BMS is referenced.
3See System Hold Time Calculation under Test Conditions for calculation of hold times given capacitive and dc loads.
ADDRESS
MSx , SW
BMS
tDWHA
tDAWH
tWW
tDAWL
WR
tWWR
tDDWR
tDDWH
tWDE
tDATRWH
DATA
tDSAK
tDAAK
ACK
RD , DMAG
tSADADC
ADRCLK
(OUT)
Figure 14. Memory Write—Bus Master
REV. B
–21–
ADSP-21060C/ADSP-21060LC
Synchronous Read/Write—Bus Master
When accessing a slave ADSP-2106x, these switching character-
istics must meet the slave’s timing requirements for synchronous
read/writes (see Synchronous Read/Write—Bus Slave). The
slave ADSP-2106x must also meet these (bus master) timing
requirements for data and acknowledge setup and hold times.
Use these specifications for interfacing to external memory
systems that require CLKIN—relative timing or for accessing a
slave ADSP-2106x (in multiprocessor memory space). These
synchronous switching characteristics are also valid during asyn-
chronous memory reads and writes (see Memory Read—Bus
Master and Memory Write—Bus Master).
ADSP-21060C
ADSP-21060LC
Max
Parameter
Min
Max
Min
Unit
Timing Requirements:
tSSDATI Data Setup before CLKIN
tHSDATI Data Hold after CLKIN
3 + DT/8
3.5 – DT/8
3 + DT/8
3.5 – DT/8
ns
ns
tDAAK
ACK Delay after Address, MSx,
SW, BMS1, 2
14 + 7 DT/8 + W
14 + 7 DT/8 + W
ns
ns
ns
tSACKC ACK Setup before CLKIN2
6.5 + DT/4
–1 – DT/4
6.5 + DT/4
–1 – DT/4
tHACK
ACK Hold after CLKIN
Switching Characteristics:
tDADRO Address, MSx, BMS, SW Delay
after CLKIN1
7 – DT/8
7 – DT/8
ns
tHADRO Address, MSx, BMS, SW Hold
after CLKIN
–1 – DT/8
9 + DT/8
–2 – DT/8
–3 – 3DT/16
8 + DT/4
–1 – DT/8
9 + DT/8
–2 – DT/8
–3 – 3DT/16
8 + DT/4
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tDPGC
tDRDO
tDWRO
tDRWL
PAGE Delay after CLKIN
16 + DT/8
4 – DT/8
4 – 3DT/16
12.5 + DT/4
19 + 5DT/16
7 – DT/8
16 + DT/8
4 – DT/8
4 – 3DT/16
12.5 + DT/4
19.25 + 5DT/16
7 – DT/8
RD High Delay after CLKIN
WR High Delay after CLKIN
RD/WR Low Delay after CLKIN
tSDDATO Data Delay after CLKIN
tDATTR Data Disable after CLKIN3
tDADCCK ADRCLK Delay after CLKIN
tADRCK ADRCLK Period
tADRCKH ADRCLK Width High
tADRCKL ADRCLK Width Low
0 – DT/8
4 + DT/8
tCK
(tCK/2 – 2)
(tCK/2 – 2)
0 – DT/8
4 + DT/8
tCK
(tCK/2 – 2)
(tCK/2 – 2)
10 + DT/8
10 + DT/8
W = (number of Wait states specified in WAIT register) × tCK
.
NOTES
1The falling edge of MSx, SW, BMS is referenced.
2ACK Delay/Setup: User must meet tDAAK or tDSAK or synchronous specification tSACKC for deassertion of ACK (Low), all three specifications must be met for assertion
of ACK (High).
3See System Hold Time Calculation under Test Conditions for calculation of hold times given capacitive and dc loads.
REV. B
–22–
ADSP-21060C/ADSP-21060LC
CLKIN
tADRCK
tADRCKL
tADRCKH
tDADCCK
ADRCLK
tHADRO
tDAAK
tDADRO
ADDRESS
MSx, SW
tDPGC
PAGE
tHACK
tSACKC
ACK
(IN)
READ CYCLE
tDRWL
tDRDO
RD
tHSDATI
tSSDATI
DATA
(IN)
WRITE CYCLE
tDWRO
tDRWL
WR
tDATTR
tSDDATO
DATA
(OUT)
Figure 15. Synchronous Read/Write—Bus Master
REV. B
–23–
ADSP-21060C/ADSP-21060LC
Synchronous Read/Write—Bus Slave
memory space). The bus master must meet these (bus slave)
timing requirements.
Use these specifications for ADSP-2106x bus master accesses of
a slave’s IOP registers or internal memory (in multiprocessor
ADSP-21060C
ADSP-21060LC
Parameter
Min
Max
Min
Max
Unit
Timing Requirements:
tSADRI
tHADRI
tSRWLI
tHRWLI
tRWHPI
Address, SW Setup before CLKIN
15 + DT/2
15 + DT/2
ns
ns
ns
ns
ns
ns
ns
Address, SW Hold before CLKIN
RD/WR Low Setup before CLKIN1
RD/WR Low Hold after CLKIN
RD/WR Pulse High
5 + DT/2
5 + DT/2
9.5 + 5DT/16
–3.5 – 5DT/16
3
5
1
9.5 + 5DT/16
–3.75 – 5DT/16
3
5
1
8 + 7DT/16
8 + 7DT/16
tSDATWH Data Setup before WR High
tHDATWH Data Hold after WR High
Switching Characteristics:
tSDDATO Data Delay after CLKIN
tDATTR Data Disable after CLKIN2
tDACKAD ACK Delay after Address, SW3
tACKTR ACK Disable after CLKIN3
19 + 5DT/16
7 – DT/8
9
19.25 + 5DT/16 ns
0 – DT/8
0 – DT/8
7 – DT/8
9
ns
ns
ns
–1 – DT/8
6 – DT/8
–1 – DT/8
6 – DT/8
NOTES
1tSRWLI (min) = 9.5 + 5DT/16 when Multiprocessor Memory Space Wait State (MMSWS bit in WAIT register) is disabled; when MMSWS is enabled, t SRWLI (min)
= 4 + DT/8.
2See System Hold Time Calculation under Test Conditions for calculation of hold times given capacitive and dc loads.
3tDACKAD is true only if the address and SW inputs have setup times (before CLKIN) greater than 10 + DT/8 and less than 19 + 3DT/4. If the address and SW inputs have
setup times greater than 19 + 3DT/4, then ACK is valid 14 + DT/4 (max) after CLKIN. A slave that sees an address with an M field match will respond with ACK
regardless of the state of MMSWS or strobes. A slave will three-state ACK every cycle with tACKTR
.
CLKIN
tSADRI
tHADRI
ADDRESS
SW
tDACKAD
tACKTR
ACK
READ ACCESS
tSRWLI
tHRWLI
tRWHPI
RD
tSDDATO
tDATTR
DATA
(OUT)
WRITE ACCESS
tRWHPI
tSRWLI
tHRWLI
WR
tHDATWH
tSDATWH
DATA
(IN)
Figure 16. Synchronous Read/Write—Bus Slave
REV. B
–24–
ADSP-21060C/ADSP-21060LC
Multiprocessor Bus Request and Host Bus Request
Use these specifications for passing of bus mastership between
multiprocessing ADSP-2106xs (BRx) or a host processor
(HBR, HBG).
ADSP-21060C
Max
ADSP-21060LC
Parameter
Min
Min
Max
Unit
Timing Requirements:
t
HBGRCSV HBG Low to RD/WR/CS Valid1
20+ 5DT/4
14 + 3DT/4
6 + DT/2
20+ 5DT/4
14 + 3DT/4
6 + DT/2
ns
ns
ns
ns
ns
ns
ns
ns
ns
tSHBRI
HBR Setup before CLKIN2
20 + 3DT/4
13 + DT/2
13 + DT/2
21 + 3DT/4
20 + 3DT/4
13 + DT/2
13 + DT/2
21 + 3DT/4
tHHBRI HBR Hold before CLKIN2
tSHBGI HBG Setup before CLKIN
tHHBGI HBG Hold before CLKIN High
tSBRI
tHBRI
BRx, CPA Setup before CLKIN3
BRx, CPA Hold before CLKIN High
6 + DT/2
6 + DT/2
tSRPBAI RPBA Setup before CLKIN
tHRPBAI RPBA Hold before CLKIN
12 + 3DT/4
12 + 3DT/4
Switching Characteristics:
tDHBGO HBG Delay after CLKIN
tHHBGO HBG Hold after CLKIN
7 – DT/8
7 – DT/8
7 – DT/8
7 – DT/8
ns
ns
ns
ns
ns
ns
–2 – DT/8
–2 – DT/8
–2 – DT/8
–2 – DT/8
–2 – DT/8
–2 – DT/8
tDBRO
tHBRO
BRx Delay after CLKIN
BRx Hold after CLKIN
tDCPAO CPA Low Delay after CLKIN
tTRCPA CPA Disable after CLKIN
tDRDYCS REDY (O/D) or (A/D) Low from CS
and HBR Low4
8 – DT/8
4.5 – DT/8
8.5 – DT/8
4.5 – DT/8
8.5
11.0
ns
ns
ns
tTRDYHG REDY (O/D) Disable or REDY (A/D)
High from HBG4
40 + 23DT/16
40 + 23DT/16
tARDYTR REDY (A/D) Disable from CS or
HBR High4
10
10
NOTES
1For first asynchronous access after HBR and CS asserted, ADDR31-0 must be a non-MMS value 1/2 tCK before RD or WR goes low or by tHBGRCSV after HBG goes
low. This is easily accomplished by driving an upper address signal high when HBG is asserted. See the “Host Processor Control of the ADSP-2106x” section in the
ADSP-2106x SHARC User’s Manual, Second Edition.
2Only required for recognition in the current cycle.
3CPA assertion must meet the setup to CLKIN; deassertion does not need to meet the setup to CLKIN.
4(O/D) = open drain, (A/D) = active drive.
REV. B
–25–
ADSP-21060C/ADSP-21060LC
CLKIN
tSHBRI
tHHBRI
HBR
tDHBGO
tHHBGO
HBG
(OUT)
tDBRO
tHBRO
BRx
(OUT)
tTRCPA
tDCPAO
CPA (OUT)
(O/D)
tSHBGI
tHHBGI
HBG (IN)
tSBRI
tHBRI
BRx (IN)
CPA (IN) (O/D)
tSRPBAI
tHRPBAI
RPBA
HBR AND CS
tTRDYHG
tDRDYCS
REDY (O/D)
tARDYTR
REDY (A/D)
tHBGRCSV
HBG (OUT)
RD
WR
CS
O/D = OPEN DRAIN, A/D = ACTIVE DRIVE
Figure 17. Multiprocessor Bus Request and Host Bus Request
REV. B
–26–
ADSP-21060C/ADSP-21060LC
drive the RD and WR pins to access the ADSP-2106x’s internal
memory or IOP registers. HBR and HBG are assumed low for
this timing.
Asynchronous Read/Write—Host to ADSP-2106x
Use these specifications for asynchronous host processor accesses
of an ADSP-2106x, after the host has asserted CS and HBR
(low). After HBG is returned by the ADSP-2106x, the host can
ADSP-21060C
Max
ADSP-21060LC
Max
Parameter
Min
Min
Unit
Read Cycle
Timing Requirements:
tSADRDL
tHADRDH
tWRWH
Address Setup/CS Low before RD Low1
Address Hold/CS Hold Low after RD
RD/WR High Width
0
0
6
0
0
0
0
6
0
0
ns
ns
ns
ns
ns
tDRDHRDY
tDRDHRDY
RD High Delay after REDY (O/D) Disable
RD High Delay after REDY (A/D) Disable
Switching Characteristics:
tSDATRDY
tDRDYRDL
tRDYPRD
Data Valid before REDY Disable from Low
2
2
ns
ns
REDY (O/D) or (A/D) Low Delay after RD Low
REDY (O/D) or (A/D) Low Pulsewidth
for Read
10
12.5
45 + 21DT/16
2
45 + 21DT/16
2
ns
ns
tHDARWH
Data Disable after RD High
8
8.5
Write Cycle
Timing Requirements:
tSCSWRL
tHCSWRH
tSADWRH
tHADWRH
tWWRL
CS Low Setup before WR Low
0
0
5
2
7
6
0
0
5
2
7
6
ns
ns
ns
ns
ns
ns
CS Low Hold after WR High
Address Setup before WR High
Address Hold after WR High
WR Low Width
tWRWH
RD/WR High Width
tDWRHRDY
WR High Delay after REDY
(O/D) or (A/D) Disable
Data Setup before WR High
Data Hold after WR High
0
5
1
0
5
1
ns
ns
ns
tSDATWH
tHDATWH
Switching Characteristics:
tDRDYWRL REDY (O/D) or (A/D) Low Delay
after WR/CS Low
REDY (O/D) or (A/D) Low Pulsewidth
for Write
10
12.5
ns
ns
tRDYPWR
15 + 7DT/16
15 + 7DT/16
tSRDYCK
REDY (O/D) or (A/D) Disable to CLKIN
1 + 7DT/16 8 + 7DT/16
1 + 7DT/16 8 + 7DT/16 ns
NOTE
1Not required if RD and address are valid tHBGRCSV after HBG goes low. For first access after HBR asserted, ADDR31-0 must be a non-MMS value 1/2 tCLK before RD
or WR goes low or by tHBGRCSV after HBG goes low. This is easily accomplished by driving an upper address signal high when HBG is asserted. See the “Host Proces-
sor Control of the ADSP-2106x” section in the ADSP-2106x SHARC User’s Manual, Second Edition.
CLKIN
tSRDYCK
REDY (O/D)
REDY (A/D)
O/D = OPEN DRAIN, A/D = ACTIVE DRIVE
Figure 18a. Synchronous REDY Timing
REV. B
–27–
ADSP-21060C/ADSP-21060LC
READ CYCLE
ADDRESS/CS
tHADRDH
tSADRDL
tWRWH
RD
tHDARWH
DATA (OUT)
tDRDHRDY
tSDATRDY
tRDYPRD
tDRDYRDL
REDY (O/D)
REDY (A/D)
WRITE CYCLE
ADDRESS
tHADWRH
tSADWRH
tHCSWRH
tSCSWRL
CS
tWWRL
tWRWH
WR
tHDATWH
tSDATWH
DATA (IN)
tDWRHRDY
tRDYPWR
tDRDYWRL
REDY (O/D)
REDY (A/D)
O/D = OPEN DRAIN, A/D = ACTIVE DRIVE
Figure 18b. Asynchronous Read/Write—Host to ADSP-2106x
REV. B
–28–
ADSP-21060C/ADSP-21060LC
and the SBTS pin. This timing is applicable to bus master tran-
sition cycles (BTC) and host transition cycles (HTC) as well as
the SBTS pin.
Three-State Timing—Bus Master, Bus Slave, HBR, SBTS
These specifications show how the memory interface is disabled
(stops driving) or enabled (resumes driving) relative to CLKIN
ADSP-21060C
ADSP-21060LC
Max
Parameter
Min
Max
Min
Unit
Timing Requirements:
tSTSCK
tHTSCK
SBTS Setup before CLKIN
SBTS Hold before CLKIN
12 + DT/2
12 + DT/2
ns
ns
6 + DT/2
6 + DT/2
Switching Characteristics:
tMIENA
tMIENS
tMIENHG
tMITRA
tMITRS
tMITRHG
tDATEN
tDATTR
tACKEN
tACKTR
tADCEN
tADCTR
Address/Select Enable after CLKIN
–1.5 – DT/8
–1.5 – DT/8
–1.5 – DT/8
–1.25 – DT/8
–1.5 – DT/8
–1.5 – DT/8
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Strobes Enable after CLKIN1
HBG Enable after CLKIN
Address/Select Disable after CLKIN
Strobes Disable after CLKIN1
HBG Disable after CLKIN
Data Enable after CLKIN2
Data Disable after CLKIN2
ACK Enable after CLKIN2
ACK Disable after CLKIN2
ADRCLK Enable after CLKIN
ADRCLK Disable after CLKIN
0 – DT/4
1.5 – DT/4
2.0 – DT/4
0.25 – DT/4
1.5 – DT/4
2.0 – DT/4
9 + 5DT/16
0 – DT/8
7.5 + DT/4
–1 – DT/8
–2 – DT/8
9 + 5DT/16
0 – DT/8
7.5 + DT/4
–1 – DT/8
–2 – DT/8
7 – DT/8
6 – DT/8
8 – DT/4
7 – DT/8
6 – DT/8
8 – DT/4
tMTRHBG Memory Interface Disable before
HBG Low3
tMENHBG Memory Interface Enable after
HBG High3
0 + DT/8
19 + DT
0 + DT/8
19 + DT
ns
ns
NOTES
1Strobes = RD, WR, SW, PAGE, DMAG.
2In addition to bus master transition cycles, these specs also apply to bus master and bus slave synchronous read/write.
3Memory Interface = Address, RD, WR, MSx, SW, HBG, PAGE, DMAGx, BMS (in EPROM boot mode).
CLKIN
tSTSCK
tHTSCK
SBTS
tMITRA, tMITRS, tMITRHG
tMIENA, tMIENS, tMIENHG
MEMORY
INTERFACE
tDATTR
tDATEN
DATA
tACKTR
tACKEN
ACK
tADCEN
tADCTR
ADRCLK
Figure 19a. Three-State Timing (Bus Transition Cycle, SBTS Assertion)
HBG
tMTRHBG
tMENHBG
MEMORY
INTERFACE
MEMORY INTERFACE = ADDRESS, RD, WR, MSx, SW, PAGE, DMAGx. BMS (IN EPROM BOOT MODE)
Figure 19b. Three-State Timing (Host Transition Cycle)
REV. B
–29–
ADSP-21060C/ADSP-21060LC
DMA Handshake
transfer is controlled by ADDR31-0, RD, WR, MS3-0, and ACK
(not DMAG). For Paced Master mode, the Memory Read–Bus
Master, Memory Write–Bus Master, and Synchronous Read/
Write–Bus Master timing specifications for ADDR31-0, RD, WR,
MS3-0, SW, PAGE, DATA47-0, and ACK also apply.
These specifications describe the three DMA handshake modes.
In all three modes DMAR is used to initiate transfers. For hand-
shake mode, DMAG controls the latching or enabling of data
externally. For external handshake mode, the data transfer is
controlled by the ADDR31-0, RD, WR, SW, PAGE, MS3-0
,
ACK, and DMAG signals. For Paced Master mode, the data
ADSP-21060C
ADSP-21060LC
Max
Parameter
Min
Max
Min
Unit
Timing Requirements:
tSDRLC
tSDRHC
tWDR
DMARx Low Setup before CLKIN1
5
5
5
5
ns
ns
DMARx High Setup before CLKIN1
DMARx Width Low
(Nonsynchronous)
6
2
6
2
ns
tSDATDGL Data Setup after DMAGx Low2
tHDATIDG Data Hold after DMAGx High
tDATDRH Data Valid after DMARx High2
tDMARLL DMARx Low Edge to Low Edge
10 + 5DT/8
16 + 7DT/8
10 + 5DT/8 ns
ns
16 + 7DT/8 ns
23 + 7DT/8
6
23 + 7DT/8
6
ns
ns
tDMARH
DMARx Width High
Switching Characteristics:
tDDGL
tWDGH
tWDGL
tHDGC
DMAGx Low Delay after CLKIN
DMAGx High Width
DMAGx Low Width
9 + DT/4
6 + 3DT/8
12 + 5DT/8
–2 – DT/8
8 + 9DT/16
0
0
10 + 5DT/8 + W
1 + DT/16
0
11 + 9DT/16 + W
0
15 + DT/4
6 – DT/8
9 + DT/4
6 + 3DT/8
12 + 5DT/8
–2 – DT/8
8 + 9DT/16
0
0
10 + 5DT/8 + W
1 + DT/16
0
11 + 9DT/16 + W
0
15 + DT/4
6 – DT/8
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
DMAGx High Delay after CLKIN
tVDATDGH Data Valid before DMAGx High3
tDATRDGH Data Disable after DMAGx High4
7
2
7
2
tDGWRL
tDGWRH
tDGWRR
tDGRDL
tDRDGH
tDGRDR
tDGWR
WR Low before DMAGx Low
DMAGx Low before WR High
WR High before DMAGx High
RD Low before DMAGx Low
RD Low before DMAGx High
RD High before DMAGx High
DMAGx High to WR, RD, DMAGx
Low
3 + DT/16
2
3 + DT/16
2
3
3
5 + 3DT/8 + HI
5 + 3DT/8 + HI
17 + DT
ns
ns
tDADGH
tDDGHA
Address/Select Valid to DMAGx High 17 + DT
Address/Select Hold after DMAGx
High
–0.5
–0.5
ns
W = (number of wait states specified in WAIT register) × tCK
.
HI = tCK (if an address hold cycle or bus idle cycle occurs, as specified in WAIT register; otherwise HI = 0).
NOTES
1Only required for recognition in the current cycle.
2tSDATDGL is the data setup requirement if DMARx is not being used to hold off completion of a write. Otherwise, if DMARx low holds off completion of the write, the
data can be driven tDATDRH after DMARx is brought high.
3tVDATDGH is valid if DMARx is not being used to hold off completion of a read. If DMARx is used to prolong the read, then tVDATDGH = 8 + 9DT/16 + (n × tCK) where
n equals the number of extra cycles that the access is prolonged.
4See System Hold Time Calculation under Test Conditions for calculation of hold times given capacitive and dc loads.
REV. B
–30–
ADSP-21060C/ADSP-21060LC
CLKIN
tSDRLC
tDMARLL
tSDRHC
tWDR
tDMARH
DMARx
DMAGx
tHDGC
tDDGL
tWDGL
tWDGH
TRANSFERS BETWEEN ADSP-2106x INTERNAL MEMORY AND EXTERNAL DEVICE
tDATRDGH
tVDATDGH
DATA (FROM
ADSP-2106x TO
EXTERNAL DRIVE)
tDATDRH
tHDATIDG
tSDATDGL
DATA (FROM
EXTERNAL DRIVE
TO ADSP-2106x)
TRANSFERS BETWEEN EXTERNAL DEVICE AND EXTERNAL MEMORY* (EXTERNAL HANDSHAKE MODE)
tDGWRL
WR
tDGWRH
tDGWRR
(EXTERNAL DEVICE
TO EXTERNAL
MEMORY)
tDGRDR
tDGRDL
RD
(EXTERNAL
MEMORY TO
EXTERNAL DEVICE)
tDRDGH
tDADGH
tDDGHA
ADDRESS
MSx, SW
*
MEMORY READ – BUS MASTER, MEMORY WRITE – BUS MASTER, AND SYNCHRONOUS READ/WRITE – BUS MASTER
TIMING SPECIFICATIONS FOR ADDR
, RD, WR, SW, MS AND ACK ALSO APPLY HERE.
31-0
3-0
Figure 20. DMA Handshake Timing
REV. B
–31–
ADSP-21060C/ADSP-21060LC
Link Ports: 1 ꢁ CLK Speed Operation
ADSP-21060C
Max
ADSP-21060LC
Max
Parameter
Min
Min
Unit
Receive
Timing Requirements:
tSLDCL
tHLDCL
tLCLKIW
tLCLKRWL
tLCLKRWH
Data Setup before LCLK Low
Data Hold after LCLK Low
LCLK Period (1 × Operation)
LCLK Width Low
3.5
3
tCK
6
3
3
tCK
6
5
ns
ns
ns
ns
ns
LCLK Width High
5
Switching Characteristics:
tDLAHC
tDLALC
tENDLK
tTDLK
LACK High Delay after CLKIN High
18 + DT/2
–3
5 + DT/2
28.5 + DT/2
13
18 + DT/2
–3
5 + DT/2
29.0 + DT/2
13
ns
ns
ns
ns
LACK Low Delay after LCLK High1
LACK Enable from CLKIN
LACK Disable from CLKIN
20 + DT/2
20 + DT/2
Transmit
Timing Requirements:
tSLACH LACK Setup before LCLK High
tHLACH LACK Hold after LCLK High
18
–7
20
–7
ns
ns
Switching Characteristics:
tDLCLK
LCLK Delay after CLKIN (1 × Operation)
15.5
3
16.75
2.5
ns
ns
ns
ns
ns
tDLDCH
tHLDCH
tLCLKTWL
tLCLKTWH
tDLACLK
tENDLK
tTDLK
Data Delay after LCLK High
Data Hold after LCLK High
LCLK Width Low
–3
–3
(tCK/2) – 2
(tCK/2) – 2
(tCK/2) + 8.5
5 + DT/2
(tCK/2) + 2
(tCK/2) + 2
(3 × tCK/2) + 17 (tCK/2) + 8.0
5 + DT/2
(tCK/2) – 1
(tCK/2) – 2.25
(tCK/2) + 2.25
(tCK/2) + 1.0
(3 × tCK/2) + 18.5 ns
LCLK Width High
LCLK Low Delay after LACK High
LDAT, LCLK Enable after CLKIN
LDAT, LCLK Disable after CLKIN
ns
ns
20 + DT/2
20 + DT/2
Link Port Service Request Interrupts: 1 × and
2 × Speed Operations
Timing Requirements:
tSLCK
tHLCK
LACK/LCLK Setup before CLKIN Low2
LACK/LCLK Hold after CLKIN Low2
10
2
10
2
ns
ns
NOTES
1LACK will go low with tDLALC relative to rising edge of LCLK after first nibble is received. LACK will not go low if the receiver’s link buffer is not about to fill.
2Only required for interrupt recognition in the current cycle.
REV. B
–32–
ADSP-21060C/ADSP-21060LC
Link Ports: 2 ꢁ CLK Speed Operation
Calculation of link receiver data setup and hold relative to link clock is required to determine the maximum allowable skew that can
be introduced in the transmission path between LDATA and LCLK. Setup skew is the maximum delay that can be introduced in
LDATA relative to LCLK, (setup skew = tLCLKTWH min – tDLDCH – tSLDCL). Hold skew is the maximum delay that can be intro-
duced in LCLK relative to LDATA, (hold skew = tLCLKTWL min – tHLDCH – tHLDCL). Calculations made directly from 2 × speed
specifications will result in unrealistically small skew times because they include multiple tester guardbands. The setup and hold skew
times shown below are calculated to include only one tester guardband.
ADSP-21060C Setup Skew
ADSP-21060C Hold Skew
=
=
0.62 ns max (If port 2 is transmitter, setup skew is 0.39)
2.40 ns max
ADSP-21060LC Setup Skew
ADSP-21060LC Hold Skew
=
=
1.23 ns max
2.76 ns max
ADSP-21060C
Max
ADSP-21060LC
Parameter
Min
Min
Max
Unit
Receive
Timing Requirements:
tSLDCL
tHLDCL
tLCLKIW
tLCLKRWL
tLCLKRWH
Data Setup before LCLK Low
Data Hold after LCLK Low
LCLK Period (2 × Operation)
LCLK Width Low
2.5
2.25
2.25
tCK/2
5.25
4.5
ns
ns
ns
ns
ns
2.25
tCK/2
4.5
LCLK Width High
4.25
Switching Characteristics:
tDLAHC LACK High Delay after CLKIN High
tDLALC
LACK Low Delay after LCLK High1
18 + DT/2
6
28.5 + DT/2
16.5
18 + DT/2
6
29.5 + DT/2
18.5
ns
ns
Transmit
Timing Requirements:
tSLACH LACK Setup before LCLK High
tHLACH LACK Hold after LCLK High
19
–6.75
19
–6.5
ns
ns
Switching Characteristics:
tDLCLK
tDLDCH
tHLDCH
tLCLKTWL
tLCLKTWH
tDLACLK
LCLK Delay after CLKIN
8
2.5
8
2.25
ns
ns
ns
ns
ns
ns
Data Delay after LCLK High
Data Hold after LCLK High
LCLK Width Low
LCLK Width High
LCLK Low Delay after LACK High
–2.0
(tCK/4) – 1
–2.0
(tCK/4) + 1.5
(tCK/4) – 1.5 (tCK/4) + 1
(tCK/4) + 9 (3 * tCK/4) + 16.5
(tCK/4) – 0.75 (tCK/4) + 1.5
(tCK/4) – 1.5 (tCK/4) + 1
(tCK/4) + 9
(3 * tCK/4) + 16.5
NOTE
1LACK will go low with tDLALC relative to rising edge of LCLK after first nibble is received. LACK will not go low if the receiver’s link buffer is not about to fill.
REV. B
–33–
ADSP-21060C/ADSP-21060LC
TRANSMIT
CLKIN
tDLCLK
tLCLKTWL
tLCLKTWH
LAST NIBBLE
TRANSMITTED
FIRST NIBBLE
TRANSMITTED
LCLK INACTIVE
(HIGH)
LCLK 1x
OR
LCLK 2x
tDLDCH
tHLDCH
LDAT(3:0)
LACK (IN)
OUT
tDLACLK
tSLACH
tHLACH
THE tSLACH REQUIREMENT APPLIES TO THE RISING EDGE OF LCLK ONLY FOR THE FIRST NIBBLE TRANSMITTED.
RECEIVE
CLKIN
tLCLKIW
tLCLKRWH
tLCLKRWL
LCLK 1x
OR
LCLK 2x
tHLDCL
tSLDCL
LDAT(3:0)
IN
tDLALC
tDLAHC
LACK (OUT)
LINK PORT ENABLE/THREE-STATE DELAY FROM INSTRUCTION
CLKIN
tENDLK
tTDLK
LCLK
LDAT(3:0)
LACK
LINK PORT ENABLE OR THREE-STATE TAKES EFFECT 2 CYCLES AFTER A WRITE TO A LINK PORT CONTROL REGISTER.
LINK PORT INTERRUPT SETUP TIME
CLKIN
tHLCK
tSLCK
LCLK
LACK
Figure 21. Link Ports
REV. B
–34–
ADSP-21060C/ADSP-21060LC
Serial Ports
Parameter
ADSP-21060C
Max
ADSP-21060LC
Min
Min
Max
Unit
External Clock
Timing Requirements:
tSFSE
TFS/RFS Setup before TCLK/RCLK1
3.5
4
1.5
4
9.5
tCK
3.5
4
1.5
4
9.5
tCK
ns
ns
ns
ns
ns
ns
tHFSE
tSDRE
tHDRE
tSCLKW
tSCLK
TFS/RFS Hold after TCLK/RCLK1, 2
Receive Data Setup before RCLK1
Receive Data Hold after RCLK1
TCLK/RCLK Width
TCLK/RCLK Period
Internal Clock
Timing Requirements:
tSFSI
TFS Setup before TCLK1; RFS Setup
before RCLK1
8
1
3
3
8
1
3
3
ns
ns
ns
ns
tHFSI
tSDRI
tHDRI
TFS/RFS Hold after TCLK/RCLK1, 2
Receive Data Setup before RCLK1
Receive Data Hold after RCLK1
External or Internal Clock
Switching Characteristics:
tDFSE
RFS Delay after RCLK (Internally
Generated RFS)3
13
13
ns
ns
tHOFSE
RFS Hold after RCLK (Internally
Generated RFS)3
3
3
External Clock
Switching Characteristics:
tDFSE
TFS Delay after TCLK (Internally
Generated TFS)3
13
16
13
16
ns
tHOFSE
TFS Hold after TCLK (Internally
Generated TFS)3
3
5
3
5
ns
ns
ns
tDDTE
tHODTE
Transmit Data Delay after TCLK3
Transmit Data Hold after TCLK3
Internal Clock
Switching Characteristics:
tDFSI
TFS Delay after TCLK (Internally
Generated TFS)3
4.5
7.5
4.5
7.5
ns
tHOFSI
TFS Hold after TCLK (Internally
Generated TFS)3
–1.5
0
–1.5
0
ns
ns
ns
ns
tDDTI
tHDTI
tSCLKIW
Transmit Data Delay after TCLK3
Transmit Data Hold after TCLK3
TCLK/RCLK Width
(tSCLK/2) – 2
(tSCLK/2) + 2
(tSCLK/2) – 2.5 (tSCLK/2) + 2.5
Enable and Three-State
Switching Characteristics:
tDDTEN
tDDTTE
tDDTIN
tDDTTI
tDCLK
Data Enable from External TCLK3
3.5
0
4.0
ns
ns
ns
ns
ns
ns
Data Disable from External TCLK3
Data Enable from Internal TCLK3
Data Disable from Internal TCLK3
TCLK/RCLK Delay from CLKIN
SPORT Disable after CLKIN
10.5
10.5
0
3
3
22 + 3DT/8
17
22 + 3DT/8
17
tDPTR
Gated SCLK with External TFS
(Mesh Multiprocessing)4
Timing Requirements:
tSTFSCK
tHTFSCK
TFS Setup before CLKIN
TFS Hold after CLKIN
5
5
ns
ns
tCK/2
tCK/2
External Late Frame Sync
Switching Characteristics:
tDDTLFSE Data Delay from Late External TFS or
External RFS with MCE = 1, MFD = 05
tDDTENFS Data Enable from late FS or MCE = 1,
MFD = 05
12
12.8
ns
ns
3
3.5
To determine whether communication is possible between two devices at clock speed n, the following specifications must be confirmed: 1) frame sync delay & frame sync setup
and hold, 2) data delay & data setup and hold, and 3) SCLK width.
REV. B
–35–
ADSP-21060C/ADSP-21060LC
NOTES
1Referenced to sample edge.
2RFS hold after RCK when MCE = 1, MFD = 0 is 0 ns minimum from drive edge. TFS hold after TCK for late external TFS is 0 ns minimum from drive edge.
3Referenced to drive edge.
4Applies only to gated serial clock mode used for serial port system I/O in mesh multiprocessing systems.
5MCE = 1, TFS enable and TFS valid follow tDDTLFSE and tDDTENFS
.
DATA RECEIVE– INTERNAL CLOCK
DATA RECEIVE– EXTERNAL CLOCK
SAMPLE
EDGE
DRIVE
EDGE
DRIVE
EDGE
SAMPLE
EDGE
tSCLKIW
tSCLKW
RCLK
RCLK
tDFSE
tHOFSE
tDFSE
tHOFSE
tHFSE
tSFSI
tHFSI
tSFSE
RFS
DR
RFS
DR
tSDRE
tHDRE
tSDRI
tHDRI
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF RCLK, TCLK CAN BE USED AS THE ACTIVE SAMPLING EDGE.
DATA TRANSMIT– INTERNAL CLOCK
DATA TRANSMIT– EXTERNAL CLOCK
SAMPLE
EDGE
DRIVE
EDGE
DRIVE
EDGE
SAMPLE
EDGE
tSCLKIW
tSCLKW
TCLK
TCLK
tDFSI
tHOFSI
tDFSE
tHOFSE
tSFSI
tHFSI
tHFSE
tSFSE
TFS
TFS
tDDTI
tDDTE
tHDTI
tHDTE
DT
DT
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF RCLK, TCLK CAN BE USED AS THE ACTIVE SAMPLING EDGE.
DRIVE EDGE DRIVE EDGE
TCLK / RCLK
TCLK (EXT)
DT
tDDTEN
tDDTTE
DRIVE
EDGE
DRIVE
EDGE
TCLK / RCLK
TCLK (INT)
tDDTIN
tDDTTI
DT
CLKIN
CLKIN
tHTFSCK
tDPTR
tSTFSCK
SPORT ENABLE AND
THREE-STATE
LATENCY
TCLK, RCLK
SPORT DISABLE DELAY
FROM INSTRUCTION
TFS (EXT)
TFS, RFS, DT
IS TWO CYCLES
tDCLK
NOTE: APPLIES ONLY TO GATED SERIAL CLOCK MODE WITH
EXTERNAL TFS, AS USED IN THE SERIAL PORT SYSTEM I/O FOR
MESH MULTIPROCESSING.
TCLK (INT)
RCLK (INT)
LOW TO HIGH ONLY
Figure 22. Serial Ports
REV. B
–36–
ADSP-21060C/ADSP-21060LC
EXTERNAL RFS with MCE = 1, MFD = 0
DRIVE
tHOFSE/I
DRIVE
SAMPLE
RCLK
RFS
(SEE NOTE 2)
tSFSE/I
tDDTE/I
tDDTENFS
tHDTE/I
1ST BIT
DT
2ND BIT
tDDTLFSE
LATE EXTERNAL TFS
DRIVE
DRIVE
SAMPLE
TCLK
tHOFSE/I (SEE NOTE 2)
tSFSE/I
TFS
DT
tDDTE/I
tDDTENFS
tHDTE/I
1ST BIT
2ND BIT
tDDTLFSE
Figure 23. External Late Frame Sync
REV. B
–37–
ADSP-21060C/ADSP-21060LC
JTAG Test Access Port and Emulation
ADSP-21060C
ADSP-21060LC
Parameter
Min
Max
Min
Max
Unit
Timing Requirements:
tTCK
TCK Period
tCK
5
6
7
18
tCK
5
6
7
18.5
ns
ns
ns
ns
ns
ns
tSTAP
tHTAP
tSSYS
tHSYS
tTRSTW
TDI, TMS Setup before TCK High
TDI, TMS Hold after TCK High
System Inputs Setup before TCK Low1
System Inputs Hold after TCK Low1
TRST Pulsewidth
4tCK
4tCK
Switching Characteristics:
tDTDO TDO Delay from TCK Low
tDSYS
System Outputs Delay after TCK Low2
13
18.5
13
18.5
ns
ns
NOTES
1System Inputs = DATA47-0, ADDR31-0, RD, WR, ACK, SBTS, SW, HBR, HBG, CS, DMAR1, DMAR2, BR6-1, ID2-0, RPBA, IRQ2-0, FLAG3-0, DR0, DR1,
TCLK0, TCLK1, RCLK0, RCLK1, TFS0, TFS1, RFS0, RFS1, LxDAT3-0, LxCLK, LxACK, EBOOT, LBOOT, BMS, CLKIN, RESET.
2System Outputs = DATA47-0, ADDR31-0, MS3-0, RD, WR, ACK, PAGE, ADRCLK, SW, HBG, REDY, DMAG1, DMAG2, BR6-1, CPA, FLAG3-0, TIMEXP, DT0,
DT1, TCLK0, TCLK1, RCLK0, RCLK1, TFS0, TFS1, RFS0, RFS1, LxDAT3-0, LxCLK, LxACK, BMS.
tTCK
TCK
tSTAP
tHTAP
TMS
TDI
tDTDO
TDO
tSSYS
tHSYS
SYSTEM
INPUTS
tDSYS
SYSTEM
OUTPUTS
Figure 24. IEEE 11499.1 JTAG Test Access Port
REV. B
–38–
ADSP-21060C/ADSP-21060LC
Table III. External Power Calculations (3.3 V Device)
OUTPUT DRIVE CURRENTS
Figure 28 shows typical I-V characteristics for the output drivers
of the ADSP-2106x. The curves represent the current drive
capability of the output drivers as a function of output voltage.
Pin
Type
# of
%
2
Pins Switching ꢁ C
ꢁ f
ꢁ VDD = PEXT
Address
MS0
WR
Data
ADDRCLK
15
1
1
32
1
50
0
–
50
–
× 44.7 pF × 10 MHz × 10.9 V = 0.037 W
× 44.7 pF × 10 MHz × 10.9 V = 0.000 W
× 44.7 pF × 20 MHz × 10.9 V = 0.010 W
× 14.7 pF × 10 MHz × 10.9 V = 0.026 W
× 4.7 pF × 20 MHz × 10.9 V = 0.001 W
POWER DISSIPATION
Total power dissipation has two components, one due to inter-
nal circuitry and one due to the switching of external output
drivers. Internal power dissipation is dependent on the instruc-
tion execution sequence and the data operands involved. Inter-
nal power dissipation is calculated in the following way:
PEXT = 0.074 W
A typical power consumption can now be calculated for these
conditions by adding a typical internal power dissipation:
P
INT = IDDIN × VDD
The external component of total power dissipation is caused by
the switching of output pins. Its magnitude depends on:
P
TOTAL = PEXT + (IDDIN2 × 5.0 V )
Note that the conditions causing a worst-case PEXT are different
from those causing a worst-case PINT. Maximum PINT cannot
occur while 100% of the output pins are switching from all ones
to all zeros. Note also that it is not common for an application to
have 100% or even 50% of the outputs switching simultaneously.
– the number of output pins that switch during each cycle (O)
– the maximum frequency at which they can switch (f)
– their load capacitance (C)
– their voltage swing (VDD
)
and is calculated by:
TEST CONDITIONS
Output Disable Time
P
EXT = O × C × VDD2 × f
Output pins are considered to be disabled when they stop driv-
ing, go into a high impedance state, and start to decay from
their output high or low voltage. The time for the voltage on the
bus to decay by ∆V is dependent on the capacitive load, CL and
the load current, IL. This decay time can be approximated by
the following equation:
The load capacitance should include the processor’s package
capacitance (CIN). The switching frequency includes driving the
load high and then back low. Address and data pins can drive
high and low at a maximum rate of 1/(2tCK). The write strobe
can switch every cycle at a frequency of 1/tCK. Select pins switch
at 1/(2tCK), but selects can switch on each cycle.
C
∆V
L
Example:
t
=
DECAY
I
L
Estimate PEXT with the following assumptions:
The output disable time tDIS is the difference between tMEASURED
and tDECAY as shown in Figure 25. The time tMEASURED is the
interval from when the reference signal switches to when the
output voltage decays ∆V from the measured output high or
output low voltage. tDECAY is calculated with test loads CL and
IL, and with ∆V equal to 0.5 V.
–A system with one bank of external data memory RAM (32-bit)
–Four 128K × 8 RAM chips are used, each with a load of 10 pF
–External data memory writes occur every other cycle, a rate
of 1/(4tCK), with 50% of the pins switching
–The instruction cycle rate is 40 MHz (tCK = 25 ns).
The PEXT equation is calculated for each class of pins that can
drive:
Output Enable Time
Output pins are considered to be enabled when they have made
a transition from a high impedance state to when they start
driving. The output enable time tENA is the interval from when a
reference signal reaches a high or low voltage level to when the
output has reached a specified high or low trip point, as shown
in the Output Enable/Disable diagram (Figure 25). If multiple
pins (such as the data bus) are enabled, the measurement value
is that of the first pin to start driving.
Table II. External Power Calculations (5 V Device)
Pin
Type
# of
%
2
Pins Switching ꢁ C
ꢁ f
ꢁ VDD = PEXT
Address
MS0
15
1
1
32
1
50
0
–
50
–
× 44.7 pF × 10 MHz × 25 V = 0.084 W
× 44.7 pF × 10 MHz × 25 V = 0.000 W
× 44.7 pF × 20 MHz × 25 V = 0.022 W
× 14.7 pF × 10 MHz × 25 V = 0.059 W
× 4.7 pF × 20 MHz × 25 V = 0.002 W
WR
Data
ADDRCLK
PEXT = 0.167 W
REV. B
–39–
ADSP-21060C/ADSP-21060LC
Example System Hold Time Calculation
I
OL
To determine the data output hold time in a particular system,
first calculate tDECAY using the equation given above. Choose ∆V
to be the difference between the ADSP-2106x’s output voltage
and the input threshold for the device requiring the hold time. A
typical ∆V will be 0.4 V. CL is the total bus capacitance (per
data line), and IL is the total leakage or three-state current (per
data line). The hold time will be tDECAY plus the minimum
disable time (i.e., tDATRWH for the write cycle).
TO
OUTPUT
PIN
+1.5V
50pF
I
OH
REFERENCE
SIGNAL
Figure 26. Equivalent Device Loading for AC Measure-
ments (Includes All Fixtures)
tMEASURED
tENA
tDIS
V
V
OH (MEASURED)
V
V
OH (MEASURED)
V
V
– ꢂV
+ ꢂV
2.0V
1.0V
1.5V
1.5V
OH (MEASURED)
OL (MEASURED)
OL (MEASURED)
OL (MEASURED)
Figure 27. Voltage Reference Levels for AC Measure-
ments (Except Output Enable/Disable)
tDECAY
OUTPUT STARTS
DRIVING
OUTPUT STOPS
DRIVING
Capacitive Loading
Output delays and holds are based on standard capacitive loads:
50 pF on all pins (see Figure 26). The delay and hold specifica-
tions given should be derated by a factor of 1.5 ns/50 pF for
loads other than the nominal value of 50 pF. Figures 29–30,
33–34 show how output rise time varies with capacitance. Fig-
ures 31, 35 show graphically how output delays and holds vary
with load capacitance. (Note that this graph or derating does
not apply to output disable delays; see the previous section
Output Disable Time under Test Conditions.) The graphs of
Figures 29, 30 and 31 may not be linear outside the ranges
shown.
HIGH-IMPEDANCE STATE.
TEST CONDITIONS CAUSE
THIS VOLTAGE TO BE
APPROXIMATELY 1.5V
Figure 25. Output Enable/Disable
REV. B
–40–
ADSP-21060C/ADSP-21060LC
5
4
3
2
1
75
50
25
5.25V, –40ꢃC
5.0V, +25ꢃC
0
Y = 0.03X –1.45
4.75V, +100ꢃC
–25
4.75V, +100ꢃC
–50
–75
5.0V, +25ꢃC
5.25V, –40ꢃC
–100
NOMINAL
–125
–150
–1
25
50
75
100
125
150
175
200
0
0.75
1.50
2.25
3.00
3.75
4.50
5.25
LOAD CAPACITANCE – pF
SOURCE VOLTAGE – V
Figure 31. Typical Output Delay or Hold vs. Load Capaci-
tance (at Maximum Case Temperature) (VDD = 5 V)
Figure 28. ADSP-2106x Typical Drive Currents (VDD = 5 V)
16.0
14.0
12.0
120
100
V
3.3V, +25°C
OH
80
60
40
3.6V, –40°C
RISE TIME
10.0
20
0
3.0V, +100°C
Y = 0.005X + 3.7
8.0
6.0
4.0
3.0V, +100°C
FALL TIME
3.3V, +25°C
–20
–40
3.6V, –40°C
–60
–80
V
OL
2.0
0
Y = 0.0031X + 1.1
–100
–120
0
20
40
60
80
100 120 140 160 180 200
0
0.5
1
1.5
2
2.5
3
3.5
LOAD CAPACITANCE – pF
SOURCE VOLTAGE – V
Figure 32. ADSP-2106x Typical Drive Currents (VDD = 3.3 V)
Figure 29. Typical Output Rise Time (10%–90% VDD) vs.
Load Capacitance (VDD = 5 V)
18
16
3.5
3.0
2.5
14
Y = 0.0796X + 1.17
12
10
RISE TIME
2.0
Y = 0.009X + 1.1
RISE TIME
8
1.5
6
4
2
Y = 0.0467X + 0.55
FALL TIME
1.0
FALL TIME
Y = 0.005X + 0.6
0.5
0
0
0
20
40
60
80 100 120 140 160 180 200
0
20
40
60
80
100 120 140 160 180 200
LOAD CAPACITANCE – pF
LOAD CAPACITANCE – pF
Figure 33. Typical Output Rise Time (10%–90% VDD) vs.
Load Capacitance (VDD = 3.3 V)
Figure 30. Typical Output Rise Time (0.8 V–2.0 V) vs.
Load Capacitance (VDD = 5 V)
REV. B
–41–
ADSP-21060C/ADSP-21060LC
5
4
3
2
1
9
8
7
Y = 0.0329X –1.65
Y = 0.0391X + 0.36
6
5
4
RISE TIME
Y = 0.0305X + 0.24
3
2
1
0
FALL TIME
NOMINAL
–1
0
20
40
60
80 100 120 140 160 180 200
25
50
75
100
125
150
175
200
LOAD CAPACITANCE – pF
LOAD CAPACITANCE – pF
Figure 35. Typical Output Delay or Hold vs. Load Capaci-
tance (at Maximum Case Temperature) (VDD = 3.3 V)
Figure 34. Typical Output Rise Time (0.8 V–2.0 V) vs.
Load Capacitance (VDD = 3.3 V)
ENVIRONMENTAL CONDITIONS
Thermal Characteristics
source may be used. A heatsink should be attached with a ther-
mal adhesive.
The ADSP-2106x is packaged in a 240-lead thermally enhanced
ceramic QFP (CQFP). There are two package versions, one
with a copper/tungsten heat slug on top of the package (CZ) for
air cooling, and one with the heat slug on the bottom (CW) for
cooling through the board. The ADSP-2106x is specified for a
case temperature (TCASE). To ensure that the TCASE data sheet
specification is not exceeded, a heatsink and/or an air flow
TCASE = TAMB + (PD × θCA
)
T
PD =
CASE = Case temperature (measured on the heat slug surface)
Power dissipation in W (this value depends upon the
specific application; a method for calculating PD is
shown under Power Dissipation).
θCA
=
Value from the following table.
Airflow
(Linear Ft./Min.)
0
100
200
14
400
600
θCA (°C/W)
21060CW/LCW
21060CZ/LCZ
19.5 16
20 16
12
10
14
11.5 9.5
NOTES
This represents thermal resistance at total power of 5 W. With air flow, no variance is seen in θCA of 5 W.
θ
CA at 0 LFM varies with power
21060CW/LCW: at 2 W, θCA = 23°C/W; at 3 W, θCA = 21.5°C/W.
21060CZ/LCZ: at 2 W, θCA = 24°C/W; at 3 W, θCA = 21.5°C/W.
JC= 0.24°C/W.
θ
REV. B
–42–
ADSP-21060C/ADSP-21060LC
240-LEAD METRIC CQFP PIN CONFIGURATION
HEAT SLUG UP VERSION (CZ)
240
181
1
180
TOP VIEW
PINS DOWN
HEAT SLUG
60
121
61
120
THE 240–LEAD PACKAGE CONTAINS A COPPER/TUNGSTEN
HEAT SLUG ON ITS TOP SURFACE. HEAT SLUG AND
PACKAGE LID ARE ELECTRICALLY ISOLATED.
Pin Pin
No. Name
Pin Pin
No. Name
Pin Pin
No. Name
Pin Pin
No. Name
Pin Pin
No. Name
Pin Pin
No. Name
1
2
3
4
5
6
7
8
TDI
TRST
VDD
TDO
TIMEXP
EMU
ICSA
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
ADDR20
ADDR21
GND
ADDR22
ADDR23
ADDR24
VDD
GND
VDD
ADDR25
ADDR26
ADDR27
GND
MS3
MS2
MS1
MS0
SW
BMS
ADDR28
GND
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
TCLK0
TFS0
DR0
201 L2DAT0
202 L2CLK
203 L2ACK
204 NC
161 DATA14
162 DATA13
163 DATA12
164 GND
165 DATA11
166 DATA10
167 DATA9
168 VDD
169 DATA8
170 DATA7
171 DATA6
172 GND
173 DATA5
174 DATA4
175 DATA3
176 VDD
121 DATA41
122 DATA40
123 DATA39
124 VDD
125 DATA38
126 DATA37
127 DATA36
128 GND
RCLK0
RFS0
VDD
VDD
GND
ADRCLK
REDY
HBG
CS
205 VDD
206 L3DAT3
207 L3DAT2
208 L3DAT1
209 L3DAT0
210 L3CLK
211 L3ACK
212 GND
213 L4DAT3
214 L4DAT2
215 L4DAT1
216 L4DAT0
217 L4CLK
218 L4ACK
219 VDD
FLAG3
FLAG2
FLAG1
FLAG0
GND
ADDR0
ADDR1
VDD
ADDR2
ADDR3
ADDR4
GND
ADDR5
ADDR6
ADDR7
VDD
ADDR8
ADDR9
ADDR10
GND
ADDR11
ADDR12
ADDR13
VDD
ADDR14
ADDR15
GND
ADDR16
ADDR17
ADDR18
VDD
9
129 NC
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
130 DATA35
131 DATA34
132 DATA33
133 VDD
134 VDD
135 GND
136 DATA32
137 DATA31
138 DATA30
139 GND
140 DATA29
141 DATA28
142 DATA27
143 VDD
RD
WR
GND
VDD
GND
CLKIN
ACK
177 DATA2
178 DATA1
179 DATA0
180 GND
100 DMAG2
101 DMAG1
102 PAGE
103 VDD
104 BR6
105 BR5
106 BR4
107 BR3
108 BR2
109 BR1
110 GND
111 VDD
112 GND
113 DATA47
114 DATA46
115 DATA45
116 VDD
117 DATA44
118 DATA43
119 DATA42
120 GND
220 GND
221 VDD
181 GND
VDD
VDD
ADDR29
ADDR30
ADDR31
GND
222 L5DAT3
223 L5DAT2
224 L5DAT1
225 L5DAT0
226 L5CLK
227 L5ACK
228 GND
229 ID2
230 ID1
231 ID0
232 LBOOT
233 RPBA
234 RESET
235 EBOOT
236 IRQ2
237 IRQ1
238 IRQ0
182 L0DAT3
183 L0DAT2
184 L0DAT1
185 L0DAT0
186 L0CLK
187 L0ACK
188 VDD
189 L1DAT3
190 L1DAT2
191 L1DAT1
192 L1DAT0
193 L1CLK
194 L1ACK
195 GND
144 VDD
145 DATA26
146 DATA25
147 DATA24
148 GND
149 DATA23
150 DATA22
151 DATA21
152 VDD
153 DATA20
154 DATA19
155 DATA18
156 GND
157 DATA17
158 DATA16
159 DATA15
160 VDD
SBTS
DMAR2
DMAR1
HBR
DT1
TCLK1
TFS1
DR1
RCLK1
RFS1
GND
CPA
196 GND
197 VDD
198 L2DAT3
199 L2DAT2
200 L2DAT1
VDD
ADDR19
239 TCK
240 TMS
DT0
REV. B
–43–
ADSP-21060C/ADSP-21060LC
240-LEAD METRIC CQFP PIN CONFIGURATION
HEAT SLUG DOWN VERSION (CW)
240
181
1
180
TOP VIEW
PINS DOWN
HEAT SLUG
60
121
61
120
THE 240–LEAD PACKAGE CONTAINS A COPPER/TUNGSTEN
HEAT SLUG ON ITS BOTTOM SURFACE. HEAT SLUG AND
PACKAGE LID ARE ELECTRICALLY ISOLATED.
Pin Pin
No. Name
Pin Pin
No. Name
Pin Pin
No. Name
Pin Pin
No. Name
Pin Pin
No. Name
Pin Pin
No. Name
1
2
3
4
5
6
7
8
GND
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
DATA29
GND
DATA30
DATA31
DATA32
GND
VDD
VDD
DATA33
DATA34
DATA35
NC
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
DMAG2
ACK
CLKIN
GND
VDD
GND
WR
201 GND
202 VDD
161 ADDR5
162 GND
163 ADDR4
164 ADDR3
165 ADDR2
166 VDD
167 ADDR1
168 ADDR0
169 GND
170 FLAG0
171 FLAG1
172 FLAG2
173 FLAG3
174 ICSA
175 EMU
176 TIMEXP
177 TDO
178 VDD
179 TRST
180 TDI
121 ADDR28
122 BMS
123 SW
124 MS0
125 MS1
126 MS2
127 MS3
128 GND
129 ADDR27
130 ADDR26
131 ADDR25
132 VDD
133 GND
134 VDD
135 ADDR24
136 ADDR23
137 ADDR22
138 GND
139 ADDR21
140 ADDR20
141 ADDR19
142 VDD
DATA0
DATA1
DATA2
VDD
DATA3
DATA4
DATA5
GND
DATA6
DATA7
DATA8
VDD
DATA9
DATA10
DATA11
GND
DATA12
DATA13
DATA14
VDD
DATA15
DATA16
DATA17
GND
DATA18
DATA19
DATA20
VDD
DATA21
DATA22
DATA23
GND
203 L4ACK
204 L4CLK
205 L4DAT0
206 L4DAT1
207 L4DAT2
208 L4DAT3
209 GND
210 L3ACK
211 L3CLK
212 L3DAT0
213 L3DAT1
214 L3DAT2
215 L3DAT3
216 VDD
RD
CS
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
HBG
REDY
ADRCLK
GND
VDD
VDD
RFS0
RCLK0
DR0
GND
DATA36
DATA37
DATA38
VDD
DATA39
DATA40
DATA41
GND
DATA42
DATA43
DATA44
VDD
DATA45
DATA46
DATA47
GND
VDD
GND
BR1
BR2
BR3
BR4
BR5
BR6
217 NC
218 L2ACK
219 L2CLK
220 L2DAT0
221 L2DAT1
222 L2DAT2
223 L2DAT3
224 VDD
TFS0
100 TCLK0
101 DT0
102 CPA
103 GND
104 RFS1
105 RCLK1
106 DR1
107 TFS1
108 TCLK1
109 DT1
181 TMS
182 TCK
183 IRQ0
184 IRQ1
143 VDD
144 ADDR18
145 ADDR17
146 ADDR16
147 GND
148 ADDR15
149 ADDR14
150 VDD
151 ADDR13
152 ADDR12
153 ADDR11
154 GND
155 ADDR10
156 ADDR9
157 ADDR8
158 VDD
225 GND
226 GND
185 IRQ2
186 EBOOT
187 RESET
188 RPBA
189 LBOOT
190 ID0
191 ID1
192 ID2
193 GND
194 L5ACK
195 L5CLK
196 L5DAT0
197 L5DAT1
198 L5DAT2
199 L5DAT3
200 VDD
227 L1ACK
228 L1CLK
229 L1DAT0
230 L1DAT1
231 L1DAT2
232 L1DAT3
233 VDD
234 L0ACK
235 L0CLK
236 L0DAT0
237 L0DAT1
238 L0DAT2
239 L0DAT3
240 GND
110 HBR
111 DMAR1
112 DMAR2
113 SBTS
114 GND
115 ADDR31
116 ADDR30
117 ADDR29
118 VDD
DATA24
DATA25
DATA26
VDD
VDD
DATA27
DATA28
VDD
PAGE
DMAG1
119 VDD
120 GND
159 ADDR7
160 ADDR6
REV. B
–44–
ADSP-21060C/ADSP-21060LC
OUTLINE DIMENSIONS
Dimensions shown in inches and (millimeters within parentheses).
240-Lead CQFP with Heat Slug Up and Formed Leads (QS-240)
1.441 (36.60)
1.422 (36.13) SQ
1.404 (35.65)
1.270 (32.25)
1.260 (32.00) SQ
1.250 (31.75)
1.104 (28.05)
1.094 (27.80) SQ
1.085 (27.55)
PIN 1
ID
240
181
180
181
180
240
1
1
SEAL RING
LID
0.837 (21.25)
0.827 (21.00) SQ
0.817 (20.75)
TOP VIEW
PINS DOWN
BOTTOM VIEW
HEAT SLUG
60
121
120
121
120
60
61
61
0.758 (19.25)
0.748 (19.00) SQ
0.738 (18.75)
0.146 (3.70)
0.127 (3.22)
0.108 (2.75)
0.169 (4.30) MAX
-C- SEATING PLANE
0.004 (0.10)
7ꢃ
–3ꢃ
0.009 (0.23)
0.008 (0.20)
0.007 (0.17)
0.020 (0.50)
TYP
LEAD PITCH
0.024 (0.60)
0.008 (0.20)
0.035 (0.90)
0.030 (0.75)
0.024 (0.60)
C
0.067 (1.70)
0.006 (0.15)
0.006 (0.15)
0.014 (0.35)
NOTES:
0.012 (0.30)
0.010 (0.25)
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS.
INCH DIMENSIONS ARE ROUNDED OFF MILLIMETER
EQUIVALENTS FOR REFERENCE ONLY AND ARE
NOT APPROPRIATE FOR USE IN DESIGN.
0.009 (0.23)
0.008 (0.20)
0.007 (0.17)
2. LEAD FINISH = GOLD PLATE (60 MICROINCHES)
3. LEAD SWEEP/LEAD OFFSET = 0.005 (0.127) MAX
LEAD THICKNESS
0.007 (0.180)
0.006 (0.155)
0.005 (0.130)
0.018 (0.45)
0.010 (0.25)
0.002 (0.05)
REV. B
–45–
ADSP-21060C/ADSP-21060LC
OUTLINE DIMENSIONS
Dimensions shown in inches and (millimeters within parentheses).
240-Lead Metric CQFP with Heat Slug Up and Unformed Leads (QS-240)
0.665 (16.88)
8 ꢁ 0.650 (16.50)
0.635 (16.12)
2.953 (75.00) SQ
1.161 (29.50) BSC
61
120
121
61
60
120
121
60
SEAL RING
LID
2 ꢁ
2.594
(65.90)
TOP VIEW
BOTTOM VIEW
HEAT SLUG
180
181
1
1
180
181
INDEX 1
GOLD
PLATED
240
240
INDEX 2
0.079 (2.00)
NO GOLD
2.972 (75.50) SQ
NONCONDUCTIVE
CERAMIC TIE BAR
0.067 (1.70)
0.006 (0.15)
0.006 (0.15)
0.014 (0.35)
NOTES:
0.012 (0.30)
0.010 (0.25)
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS.
INCH DIMENSIONS ARE ROUNDED OFF MILLIMETER
EQUIVALENTS FOR REFERENCE ONLY AND ARE
NOT APPROPRIATE FOR USE IN DESIGN.
0.009 (0.23)
0.008 (0.20)
0.007 (0.17)
2. LEAD FINISH = GOLD PLATE (60 MICROINCHES)
3. LEAD SWEEP/LEAD OFFSET = 0.005 (0.127) MAX
LEAD THICKNESS
0.007 (0.180)
0.006 (0.155)
0.005 (0.130)
0.018 (0.45)
0.010 (0.25)
0.002 (0.05)
REV. B
–46–
ADSP-21060C/ADSP-21060LC
OUTLINE DIMENSIONS
Dimensions shown in inches and (millimeters within parentheses).
240-Lead Metric CQFP with Heat Slug Down and Formed Leads (QS-240A)
0.837 (21.25)
0.827 (21.00) SQ
0.817 (20.75)
1.441 (36.60)
1.422 (36.13) SQ
1.404 (35.65)
0.758 (19.25)
0.748 (19.00) SQ
0.738 (18.75)
1.270 (32.25)
1.260 (32.00) SQ
1.250 (31.75)
181
180
240
PIN 1
ID
240
181
180
1
1
SEAL RING
LID
TOP VIEW
PINS DOWN
BOTTOM VIEW
HEAT SLUG
121
120
60
121
120
60
61
61
1.104 (28.05)
1.094 (27.80) SQ
1.085 (27.55)
0.146 (3.70)
0.127 (3.22)
0.108 (2.75)
0.165 (4.20) MAX
-C- SEATING PLANE
0.004 (0.10)
7ꢃ
–3ꢃ
0.009 (0.23)
0.008 (0.20)
0.007 (0.17)
0.020 (0.50)
TYP
LEAD PITCH
0.035 (0.90)
0.030 (0.75)
0.024 (0.60)
0.020 (0.50)
0.004 (0.10)
C
0.067 (1.70)
0.006 (0.15)
0.006 (0.15)
0.014 (0.35)
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS.
INCH DIMENSIONS ARE ROUNDED OFF MILLIMETER
EQUIVALENTS FOR REFERENCE ONLY AND ARE
NOT APPROPRIATE FOR USE IN DESIGN.
0.012 (0.30)
0.010 (0.25)
2. LEAD FINISH = GOLD PLATE (60 MICROINCHES)
3. LEAD SWEEP/LEAD OFFSET = 0.005 (0.127) MAX
0.009 (0.23)
0.008 (0.20)
0.007 (0.17)
LEAD THICKNESS
0.007 (0.180)
0.006 (0.155)
0.005 (0.130)
0.018 (0.45)
0.010 (0.25)
0.002 (0.05)
REV. B
–47–
ADSP-21060C/ADSP-21060LC
OUTLINE DIMENSIONS
Dimensions shown in inches and (millimeters within parentheses).
240-Lead Metric CQFP with Heat Slug Down and Unformed Leads (QS-240A)
0.665 (16.88)
8 ꢁ 0.650 (16.50)
0.635 (16.12)
2.953 (75.00) SQ
1.161 (29.50) BSC
120
120
121
61
60
61
121
60
SEAL RING
LID
2 ꢁ
2.594
(65.90)
BOTTOM VIEW
HEAT SLUG
TOP VIEW
1
180
181
180
181
1
INDEX 1
GOLD
PLATED
INDEX 2
0.079 (2.00)
NO GOLD
240
240
2.972 (75.50) SQ
0.067 (1.70)
NONCONDUCTIVE
CERAMIC TIE BAR
0.006 (0.15)
0.006 (0.15)
0.014 (0.35)
NOTES:
0.012 (0.30)
0.010 (0.25)
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS.
INCH DIMENSIONS ARE ROUNDED OFF MILLIMETER
EQUIVALENTS FOR REFERENCE ONLY AND ARE
NOT APPROPRIATE FOR USE IN DESIGN.
0.009 (0.23)
0.008 (0.20)
0.007 (0.17)
2. LEAD FINISH = GOLD PLATE (60 MICROINCHES)
3. LEAD SWEEP/LEAD OFFSET = 0.005 (0.127) MAX
LEAD THICKNESS
0.007 (0.180)
0.006 (0.155)
0.005 (0.130)
0.018 (0.45)
0.010 (0.25)
0.002 (0.05)
ORDERING GUIDE
Part Number
Case Temperature Range
Heat Slug Orientation
Instruction Rate
Operating Voltage
ADSP-21060CZ-133
ADSP-21060CZ-160
ADSP-21060CW-133
ADSP-21060CW-160
ADSP-21060LCW-133
ADSP-21060LCW-160
–40°C to +100°C
–40°C to +100°C
–40°C to +100°C
–40°C to +100°C
–40°C to +100°C
–40°C to +100°C
Heat Slug Up
Heat Slug Up
Heat Slug Down
Heat Slug Down
Heat Slug Down
Heat Slug Down
33 MHz
40 MHz
33 MHz
40 MHz
33 MHz
40 MHz
5 V
5 V
5 V
5 V
3.3 V
3.3 V
REV. B
–48–
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