ADSP-21364WYSWZ-2A [ADI]
IC 16-BIT, 55.55 MHz, OTHER DSP, PQFP144, MS-026BFB-HD, LQFP-144, Digital Signal Processor;型号: | ADSP-21364WYSWZ-2A |
厂家: | ADI |
描述: | IC 16-BIT, 55.55 MHz, OTHER DSP, PQFP144, MS-026BFB-HD, LQFP-144, Digital Signal Processor 时钟 外围集成电路 |
文件: | 总56页 (文件大小:702K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SHARC Processors
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
SUMMARY
High performance, 32-bit/40-bit, floating-point processor
The ADSP-2136x processors are available with a 333 MHz
core instruction rate and unique peripherals such as the
digital audio interface, S/PDIF transceiver, DTCP (digital
transmission content protection protocol), serial ports,
8-channel asynchronous sample rate converter, precision
clock generators, and more. For complete ordering infor-
mation, see Ordering Guide on Page 53.
optimized for high performance processing
Single-instruction, multiple-data (SIMD) computational
architecture
On-chip memory—3M bit of on-chip SRAM
Code compatible with all other members of the SHARC family
4 BLOCKS OF ON-CHIP MEMORY
CORE PROCESSOR
INSTRUCTION
BLOCK3
BLOCK1
BLOCK2
BLOCK0
SRAM
1M BIT
SRAM
1M BIT
SRAM
0.5M BIT
SRAM
0.5M BIT
CACHE
TIMER
ROM
ROM
32 u 48-BIT
2M BIT
2M BIT
ADDR
DATA
ADDR
ADDR
ADDR
DATA
DATA
DATA
DAG1
8 uꢀ4 u 32
DAG2
8 uꢀ4 u 32
PROGRAM
SEQUENCER
32
PM ADDRESS BUS
DM ADDRESS BUS
32
PM DATA BUS
DM DATA BUS
64
64
IOA
IOA
IOA
SPI
IOA
IOD
IOD
IOD
IOD
PX REGISTER
SPORTS
IDP
PCG
TIMERS
SRC
PROCESSING
ELEMENT
(PEX)
PROCESSING
ELEMENT
(PEY)
SIGNAL
ROUTING
UNIT
IOP REGISTERS
(MEMORY-MAPPED)
S/PDIF
DTCP
6
JTAGTEST & EMULATION
I/O PROCESSOR
AND PERIPHERALS
S
Figure 1. Functional Block Diagram—Processor Core
SHARC and the SHARC logo are registered trademarks of Analog Devices, Inc.
Rev. C
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 U.S.A.
Tel: 781.329.4700
Fax: 781.461.3113
www.analog.com
©2007 Analog Devices, Inc. All rights reserved.
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Up to 12 TDM stream support, each with 128 channels per
frame
KEY FEATURES—PROCESSOR CORE
At 333 MHz (3.0 ns) core instruction rate, the ADSP-2136x
performs 2 GFLOPS/666 MMACS
3M bit on-chip SRAM (1M bit in blocks 0 and 1, and 0.50M bit
in blocks 2 and 3) for simultaneous access by the core pro-
cessor and DMA
4M bit on-chip ROM (2M bit in block 0 and 2M bit in block 1)
Dual data address generators (DAGs) with modulo and bit-
reverse addressing
Zero-overhead looping with single-cycle loop setup, provid-
ing efficient program sequencing
Single-instruction multiple-data (SIMD) architecture
provides:
Two computational processing elements
Concurrent execution
Code compatibility with other SHARC family members at
the assembly level
Parallelism in buses and computational units allows single
cycle execution (with or without SIMD) of a multiply
operation, an ALU operation, a dual memory read or
write, and an instruction fetch
Companding selection on a per channel basis in TDM mode
Input data port provides an additional input path to the pro-
cessor core, configurable as eight channels of serial data or
seven channels of serial data, and up to a 20-bit wide paral-
lel data channel
Signal routing unit provides configurable and flexible con-
nections between all DAI components—six serial ports,
one SPI port, eight channels of asynchronous sample rate
converters, an S/PDIF receiver/transmitter, three timers,
an SPI port,10 interrupts, six flag inputs, six flag outputs,
and 20 SRU I/O pins (DAI_Px)
Two serial peripheral interfaces (SPI): primary on dedicated
pins, secondary on DAI pins provide:
Master or slave serial boot through primary SPI
Full-duplex operation
Master slave mode multimaster support
Open drain outputs
Programmable baud rates, clock polarities, and phases
3 muxed flag/IRQ lines
1 muxed flag/timer expired line
Transfers between memory and core at a sustained
5.4 GBps bandwidth at 333 MHz core instruction rate
DEDICATED AUDIO COMPONENTS
S/PDIF-compatible digital audio receiver/transmitter
supports:
INPUT/OUTPUT FEATURES
DMA controller supports:
25 DMA channels for transfers between
EIAJ CP-340 (CP-1201), IEC-958, AES/EBU standards
Left-justified, I2S, or right-justified serial data input with
16-, 18-, 20-, or 24-bit word widths (transmitter)
Two channel mode and single channel double frequency
(SCDF) mode
Sample rate converter (SRC) contains a serial input port,
de-emphasis filter, sample rate converter (SRC), and serial
output port providing up to –140 dB SNR performance (see
Table 2 on Page 4)
Supports left-justified, I2S, TDM, and right-justified
24-, 20-, 18-, and 16-bit serial formats (input)
Pulse-width modulation provides:
16 PWM outputs configured as four groups of four outputs
Supports center-aligned or edge-aligned PWM waveforms
Can generate complementary signals on two outputs in
paired mode or independent signals in nonpaired mode
ROM-based security features include:
JTAG access to memory permitted with a 64-bit key
Protected memory regions that can be assigned to limit
access under program control to sensitive code
PLL has a wide variety of software and hardware multi-
plier/divider ratios
ADSP-2136x internal memory and a variety of peripherals
32-bit DMA transfers at peripheral clock speed, in parallel
with full-speed processor execution
Asynchronous parallel port provides access to asynchronous
external memory
16 multiplexed address/data lines support 24-bit address
external address range with 8-bit data or 16-bit address
external address range with 16-bit data
55 Mbps transfer rate
External memory access in a dedicated DMA channel
8-bit to 32-bit and 16-bit to 32-bit packing options
Programmable data cycle duration: 2 CCLK to 31 CCLK
Digital audio interface (DAI) includes six serial ports, two pre-
cision clock generators, an input data port, three timers, an
S/PDIF transceiver, a DTCP cipher, an 8-channel asynchro-
nous sample rate converter, an SPI port, and a signal
routing unit
Six dual data line serial ports that operate at up to
41.67 Mbps on each data line—each has a clock, frame
sync, and two data lines that can be configured as either a
receiver or transmitter pair
Left-justified sample pair and I2S support, programmable
direction for up to 24 simultaneous receive or transmit
channels using two I2S-compatible stereo devices per
serial port
Dual voltage: 3.3 V I/O, 1.2 V, or 1.0 V core
Available in 136-ball BGA and 144-lead LQFP_EP packages
(see Ordering Guide on Page 53)
TDM support for telecommunications interfaces including
128 TDM channel support for newer telephony interfaces
such as H.100/H.110
Rev. C
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ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
CONTENTS
Summary ............................................................... 1
Key Features—Processor Core ................................. 2
Input/Output Features ........................................... 2
Dedicated Audio Components ................................. 2
Contents ................................................................ 3
Revision History ...................................................... 3
General Description ................................................. 4
SHARC Family Core Architecture ............................ 5
Memory and I/O Interface Features ........................... 6
Development Tools .............................................. 10
Additional Information ......................................... 11
Pin Function Descriptions ........................................ 12
Address Data Pins as FLAGs .................................. 15
Address/Data Modes ............................................ 15
Boot Modes ........................................................ 15
Core Instruction Rate to CLKIN Ratio Modes ............. 15
ADSP-2136x Specifications ....................................... 16
Operating Conditions ........................................... 16
Electrical Characteristics ........................................ 16
Package Information ............................................ 17
ESD Caution ...................................................... 17
Maximum Power Dissipation ................................. 17
Absolute Maximum Ratings ................................... 17
Timing Specifications ........................................... 17
Output Drive Currents .......................................... 45
Test Conditions ................................................... 45
Capacitive Loading ............................................... 45
Thermal Characteristics ........................................ 46
144-Lead LQFP Pin Configurations ............................. 47
136-Ball BGA Pin Configurations ............................... 48
Outline Dimensions ................................................ 51
Surface Mount Design .......................................... 52
Ordering Guide ...................................................... 53
REVISION HISTORY
9/07—Rev B. to Rev C.
Added additional information to Timing Specifications ....17
Revised Figure 6 ......................................................18
Revised Table 12 ......................................................18
Revised Table 21 ......................................................24
Revised Ordering Guide ............................................53
Rev. C
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ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
GENERAL DESCRIPTION
The ADSP-2136x SHARC® processor is a member of the SIMD
SHARC family of DSPs that feature Analog Devices’ Super Har-
vard Architecture. The processor is source code-compatible
with the ADSP-2126x and ADSP-2116x DSPs, as well as with
first generation ADSP-2106x SHARC processors in SISD (sin-
gle-instruction, single-data) mode. The ADSP-2136x is a
32-bit/40-bit floating-point processor optimized for high
performance automotive audio applications with a large on-
chip SRAM and ROM, multiple internal buses to eliminate I/O
bottlenecks, and an innovative digital audio interface (DAI).
• On-chip ROM (4M bit)
• JTAG test access port
Table 2. ADSP-2136x SHARC Processor Family Features
Feature
As shown in the functional block diagram on Page 1, the
ADSP-2136x uses two computational units to deliver a signifi-
cant performance increase over the previous SHARC processors
on a range of signal processing algorithms. Fabricated in a state-
of-the-art, high speed, CMOS process, the ADSP-2136x proces-
sor achieves an instruction cycle time of 3.0 ns at 333 MHz.
With its SIMD computational hardware, the ADSP-2136x can
perform two GFLOPS running at 333 MHz.
RAM
ROM
3M bit 3M bit
4M bit 4M bit
3M bit 3M bit 3M bit
4M bit 4M bit 4M bit
Audio
No
No
No
Yes
Yes
Decoders in
ROM1
Pulse-Width Yes
Modulation
Yes
Yes
Yes
Yes
Table 2 shows the features of the individual product offerings
and Table 1 shows performance benchmarks for the processors
running at 333 MHz.
S/PDIF
DTCP2
Yes
Yes
No
No
Yes
No
Yes
Yes
Yes
No
Table 1. Benchmarks (at 333 MHz)
SRC
Performance
128 dB No SRC
140 dB 128 dB 128 dB
Speed
(at 333 MHz)
1 Audio decoding algorithms include PCM, Dolby Digital EX, Dolby Prologic IIx,
DTS 96/24, Neo:6, DTS ES, MPEG-2 AAC, MP3, and functions like bass
management, delay, speaker equalization, graphic equalization, and more.
Decoder/post-processor algorithm combination support varies depending upon
the chip version and the system configurations. Please visit www.analog.com for
complete information.
Benchmark Algorithm
1024 Point Complex FFT (Radix 4, with reversal) 27.9 μs
FIR Filter (per tap)1
IIR Filter (per biquad)1
1.5 ns
6.0 ns
2 The ADSP-21362 and ADSP-21365 processors provide the Digital Transmission
Content Protection protocol, a proprietary security protocol. Contact your
Analog Devices sales office for more information.
Matrix Multiply (pipelined)
[3×3] × [3×1]
[4×4] × [4×1]
13.5 ns
23.9 ns
Divide (y/x)
10.5 ns
16.3 ns
The block diagram on Page 8 illustrates the following architec-
tural features:
Inverse Square Root
1 Assumes two files in multichannel SIMD mode
• DMA controller
• Six full duplex serial ports
The ADSP-2136x continues SHARC’s industry-leading stan-
dards of integration for DSPs, combining a high performance
32-bit DSP core with integrated, on-chip system features.
• Two SPI-compatible interface ports—primary on dedi-
cated pins, secondary on DAI pins
• 8-bit or 16-bit parallel port that supports interfaces to off-
chip memory peripherals
The block diagram on Page 1, illustrates the following architec-
tural features:
• Digital audio interface that includes two precision clock
generators (PCG), an input data port (IDP), an S/PDIF
receiver/transmitter, eight channels asynchronous sample
rate converter, DTCP cipher, six serial ports, eight serial
interfaces, a 20-bit parallel input port, 10 interrupts, six flag
outputs, six flag inputs, three timers, and a flexible signal
routing unit (SRU)
• Two processing elements, each of which comprises an
ALU, multiplier, shifter, and data register file
• Data address generators (DAG1, DAG2)
• Program sequencer with instruction cache
• PM and DM buses capable of supporting four 32-bit data
transfers between memory and the core at every core pro-
cessor cycle
Figure 2 shows a sample SPORT configuration using the preci-
sion clock generators to interface with an I2S ADC and an I2S
DAC with a much lower jitter clock than the serial port would
generate itself. Many other SRU configurations are possible.
• Three programmable interval timers with PWM genera-
tion, PWM capture/pulse width measurement, and
external event counter capabilities
• On-chip SRAM (3M bit)
Rev. C
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ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
ADSP-2136x
CLKOUT
CLKIN
CLOCK
ALE
XTAL
2
LATCH
AD15-0
ADDR
CLK_CFG1-0
PARALLEL
PORT
RAM
I/O DEVICE
2
BOOTCFG1-0
DATA
OE
3
RD
FLAG3-1
WR
WE
FLAG0
CS
ADC
(OPTIONAL)
CLK
FS
S DAT
DAI_P1
DAI_ P2
DAI_ P3
S CLK0
S FS0
S D0A
S D0B
SRU
DAC
(OPTIONAL)
CLK
DAI_P18
DAI_P19
DAI_P20
SPORT0-5
TIMERS
FS
S DAT
SPDIF
SRC
IDP
S PI
CLK
FS
PCGA
PCG B
DAI
RES ET
JTAG
6
Figure 2. ADSP-2136x System Sample Configuration
bandwidth between memory and the processing elements.
When using the DAGs to transfer data in SIMD mode, two data
values are transferred with each access of memory or
the register file.
SHARC FAMILY CORE ARCHITECTURE
The ADSP-2136x is code-compatible at the assembly level with
the ADSP-2126x, ADSP-21160, and ADSP-21161, and with the
first generation ADSP-2106x SHARC processors. The
ADSP-2136x shares architectural features with the ADSP-2126x
and ADSP-2116x SIMD SHARC processors, as detailed in the
following sections.
Independent, Parallel Computation Units
Within each processing element is a set of computational units.
The computational units consist of an arithmetic/logic unit
(ALU), multiplier, and shifter. These units perform all opera-
tions in a single cycle. The three units within each processing
element are arranged in parallel, maximizing computational
throughput. Single multifunction instructions execute parallel
ALU and multiplier operations. In SIMD mode, the parallel
ALU and multiplier operations occur in both processing
elements. These computation units support IEEE 32-bit,
single-precision floating-point, 40-bit extended-precision
floating-point, and 32-bit fixed-point data formats.
SIMD Computational Engine
The ADSP-2136x contains two computational processing ele-
ments that operate as a single-instruction multiple-data (SIMD)
engine. The processing elements are referred to as PEX and PEY
and each contains an ALU, multiplier, shifter, and register file.
PEX is always active, and PEY may be enabled by setting the
PEYEN mode bit in the MODE1 register. When this mode is
enabled, the same instruction is executed in both processing ele-
ments, but each processing element operates on different data.
This architecture is efficient at executing math intensive signal
processing algorithms.
Data Register File
A general-purpose data register file is contained in each pro-
cessing element. The register files transfer data between the
computation units and the data buses, and store intermediate
results. These 10-port, 32-register (16 primary, 16 secondary)
register files, combined with the ADSP-2136x enhanced
Entering SIMD mode also has an effect on the way data is trans-
ferred between memory and the processing elements. When in
SIMD mode, twice the data bandwidth is required to sustain
computational operation in the processing elements. Because of
this requirement, entering SIMD mode also doubles the
Rev. C
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ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Harvard architecture, allow unconstrained data flow between
computation units and internal memory. The registers in PEX
are referred to as R0–R15 and in PEY as S0–S15.
The SRAM can be configured as a maximum of 96K words of
32-bit data, 192K words of 16-bit data, 64K words of 48-bit
instructions (or 40-bit data), or combinations of different word
sizes up to three megabits. All of the memory can be accessed as
16-bit, 32-bit, 48-bit, or 64-bit words. A 16-bit floating-point
storage format is supported that effectively doubles the amount
of data that may be stored on-chip. Conversion between the 32-
bit floating-point and 16-bit floating-point formats is per-
formed in a single instruction. While each memory block can
store combinations of code and data, accesses are most efficient
when one block stores data using the DM bus for transfers, and
the other block stores instructions and data using the PM bus
for transfers.
Single-Cycle Fetch of Instruction and Four Operands
The ADSP-2136x features an enhanced Harvard architecture in
which the data memory (DM) bus transfers data and the pro-
gram memory (PM) bus transfers both instructions and data
(see Figure 1 on Page 1). With the processor’s separate program
and data memory buses and on-chip instruction cache, the pro-
cessor can simultaneously fetch four operands (two over each
data bus) and one instruction (from the cache), all in a
single cycle.
Using the DM bus and PM buses, with one bus dedicated to
each memory block, assures single-cycle execution with two
data transfers. In this case, the instruction must be available in
the cache.
Instruction Cache
The ADSP-2136x includes an on-chip instruction cache that
enables three-bus operation for fetching an instruction and four
data values. The cache is selective—only the instructions whose
fetches conflict with PM bus data accesses are cached. This
cache allows full-speed execution of core, looped operations
such as digital filter multiply-accumulates, and FFT butterfly
processing.
DMA Controller
The ADSP-2136x’s on-chip DMA controllers allow data trans-
fers without processor intervention. The DMA controller
operates independently and invisibly to the processor core,
allowing DMA operations to occur while the core is simulta-
neously executing its program instructions. DMA transfers can
occur between the processor’s internal memory and its serial
ports, the SPI-compatible (serial peripheral interface) ports, the
IDP (input data port), the parallel data acquisition port (PDAP),
or the parallel port. Twenty-five channels of DMA are available
on the processors—two for the SPI interface, 12 via the serial
ports, eight via the input data port, two for DTCP (or memory-
to-memory data transfer when DTCP is not used), and one via
the processor’s parallel port. Programs can be downloaded to
the processors using DMA transfers. Other DMA features
include interrupt generation upon completion of DMA trans-
fers, and DMA chaining for automatic linked DMA transfers.
Data Address Generators with Zero-Overhead Hardware
Circular Buffer Support
The ADSP-2136x’s two data address generators (DAGs) are
used for indirect addressing and implementing circular data
buffers in hardware. Circular buffers allow efficient program-
ming of delay lines and other data structures required in digital
signal processing, and are commonly used in digital filters and
Fourier transforms. The two DAGs contain sufficient registers
to allow the creation of up to 32 circular buffers (16 primary
register sets, 16 secondary). The DAGs automatically handle
address pointer wraparound, reduce overhead, increase perfor-
mance, and simplify implementation. Circular buffers can start
and end at any memory location.
Digital Audio Interface (DAI)
Flexible Instruction Set
The digital audio interface (DAI) provides the ability to connect
various peripherals to any of the DSP’s DAI pins (DAI_P20–1).
The 48-bit instruction word accommodates a variety of parallel
operations, for concise programming. For example, the
ADSP-2136x can conditionally execute a multiply, an add, and a
subtract in both processing elements while branching and fetch-
ing up to four 32-bit values from memory—all in a single
instruction.
Programs make these connections using the signal routing unit
(SRU, shown in Figure 3).
The SRU is a matrix routing unit (or group of multiplexers) that
enables the peripherals provided by the DAI to be intercon-
nected under software control. This allows easy use of the
DAI- associated peripherals for a much wider variety of applica-
tions by using a larger set of algorithms than is possible with
nonconfigurable signal paths.
MEMORY AND I/O INTERFACE FEATURES
The ADSP-2136x adds the following architectural features to
the SIMD SHARC family core.
The DAI also includes six serial ports, an S/PDIF receiver/trans-
mitter, a DTCP cipher, a precision clock generator (PCG), eight
channels of asynchronous sample rate converters, an input data
port (IDP), an SPI port, six flag outputs and six flag inputs, and
three timers. The IDP provides an additional input path to the
ADSP-2136x core, configurable as either eight channels of I2S
serial data or as seven channels plus a single 20-bit wide syn-
chronous parallel data acquisition port. Each data channel has
its own DMA channel that is independent from the processor’s
serial ports.
On-Chip Memory
The ADSP-2136x contains three megabits of internal SRAM
and four megabits of internal ROM. Each block can be config-
ured for different combinations of code and data storage (see
Table 3). Each memory block supports single-cycle, indepen-
dent accesses by the core processor and I/O processor. The
processor’s memory architecture, in combination with its sepa-
rate on-chip buses, allows two data transfers from the core and
one from the I/O processor, in a single cycle.
Rev. C
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ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Table 3. ADSP-2136x Internal Memory Space
IOP Registers 0x0000 0000–0003 FFFF
Extended Precision Normal or
Long Word (64 Bits)
Instruction Word (48 Bits)
Normal Word (32 Bits)
Short Word (16 Bits)
BLOCK 0 ROM
BLOCK 0 ROM
BLOCK 0 ROM
BLOCK 0 ROM
0x0004 0000–0x0004 7FFF
0x0008 0000–0x0008 AAA9
0x0008 0000–0x0008 FFFF
0x0010 0000–0x0011 FFFF
Reserved
Reserved
Reserved
0x0004 8000–0x0004 BFFF
0x0009 0000–0x0009 7FFF
0x0012 0000–0x0012 FFFF
BLOCK 0 SRAM
BLOCK 0 SRAM
BLOCK 0 SRAM
BLOCK 0 SRAM
0x0004 C000–0x0004 FFFF
0x0009 0000–0x0009 5554
0x0009 8000–0x0009 FFFF
0x0013 0000–0x0013 FFFF
BLOCK 1 ROM
BLOCK 1 ROM
BLOCK 1 ROM
BLOCK 1 ROM
0x0005 0000–0x0005 7FFF
0x000A 0000–0x000A AAA9
0x000A 0000–0x000A FFFF
0x0014 0000–0x0015 FFFF
Reserved
Reserved
Reserved
0x0005 8000–0x0005 BFFF
0x000B 0000–0x000B 7FFF
0x0016 0000–0x0016 FFFF
BLOCK 1 SRAM
BLOCK 1 SRAM
BLOCK 1 SRAM
BLOCK 1 SRAM
0x0005 C000–0x0005 FFFF
0x000B 0000–0x000B 5554
0x000B 8000–0x000B FFFF
0x0017 0000–0x0017 FFFF
BLOCK 2 SRAM
BLOCK 2 SRAM
BLOCK 2 SRAM
BLOCK 2 SRAM
0x0006 0000–0x0006 1FFF
0x000C 0000–0x000C 2AA9
0x000C 0000–0x000C 3FFF
0x0018 0000–0x0018 7FFF
Reserved
Reserved
Reserved
0x0006 2000–0x0006 FFFF
0x000C 4000–0x000D FFFF
0x0018 8000–0x001B FFFF
BLOCK 3 SRAM
BLOCK 3 SRAM
BLOCK 3 SRAM
BLOCK 3 SRAM
0x0007 0000–0x0007 1FFF
0x000E 0000–0x000E 2AA9
0x000E 0000–0x000E 3FFF
0x001C 0000–0x001C 7FFF
Reserved
Reserved
Reserved
0x0007 2000–0x0007 FFFF
0x000E 4000–0x000F FFFF
0x001C 8000–0x001F FFFF
Reserved
0x0020 0000–0xFFFF FFFF
For complete information on using the DAI, see the
Serial ports operate in four modes:
• Standard DSP serial mode
• Multichannel (TDM) mode
• I2S mode
ADSP-2136x SHARC Processor Hardware Reference.
Serial Ports
The ADSP-2136x features six synchronous serial ports that pro-
vide an inexpensive interface to a wide variety of digital and
mixed-signal peripheral devices such as Analog Devices’
AD183x family of audio codecs, ADCs, and DACs. The serial
ports are made up of two data lines, a clock, and a frame sync.
The data lines can be programmed to either transmit or receive
and each data line has a dedicated DMA channel.
• Left-justified sample pair mode
Left-justified sample pair mode is a mode where in each frame
sync cycle two samples of data are transmitted/received—one
sample on the high segment of the frame sync, the other on the
low segment of the frame sync. Programs have control over var-
ious attributes of this mode.
Serial ports are enabled via 12 programmable and simultaneous
receive or transmit pins that support up to 24 transmit or 24
receive channels of audio data when all six SPORTS are enabled,
or six full duplex TDM streams of 128 channels per frame.
Each of the serial ports supports the left-justified sample pair
and I2S protocols (I2S is an industry-standard interface com-
monly used by audio codecs, ADCs, and DACs, such as the
Analog Devices AD183x family), with two data pins, allowing
four left-justified sample pairs or I2S channels (using two stereo
devices) per serial port, with a maximum of up to 24 I2S chan-
nels. The serial ports permit little-endian or big-endian
transmission formats and word lengths selectable from 3 bits to
32 bits. For the left-justified sample pair and I2S modes, data-
word lengths are selectable between 8 bits and 32 bits. Serial
ports offer selectable synchronization and transmit modes as
well as optional μ-law or A-law companding selection on a per
channel basis. Serial port clocks and frame syncs can be inter-
nally or externally generated.
The serial ports operate at a maximum data rate of 41.67 Mbps.
Serial port data can be automatically transferred to and from
on-chip memory via dedicated DMA channels. Each of the
serial ports can work in conjunction with another serial port to
provide TDM support. One SPORT provides two transmit sig-
nals while the other SPORT provides the two receive signals.
The frame sync and clock are shared.
Rev. C
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September 2007
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
pins, one device select pin, and one clock pin. It is a full-duplex
synchronous serial interface, supporting both master and slave
modes and can operate at a maximum baud rate of 41.67 MHz.
TO PROCESSOR BUSES AND
SYSTEM MEMORY
IO DATA
BUS (32)
IO ADDRESS
BUS (18)
The SPI port can operate in a multimaster environment by
interfacing with up to four other SPI-compatible devices, either
acting as a master or slave device. The ADSP-2136x SPI-com-
patible peripheral implementation also features programmable
baud rate, clock phase, and polarities. The SPI-compatible port
uses open drain drivers to support a multimaster configuration
and to avoid data contention.
GPIO FLAGS/IRQ/TIMEXP
4
DMA CONTROLLER
25 CHANNELS
3
CONTROL/GPIO
16
ADDRESS/DATA BUS/ GPIO
PARALLEL PORT
S/PDIF-Compatible Digital Audio Receiver/Transmitter
and Synchronous/Asynchronous Sample Rate Converter
PWM (16)
SPI PORT (1)
The S/PDIF transmitter has no separate DMA channels. It
receives audio data in serial format and converts it into a
biphase encoded signal. The serial data input to the transmitter
can be formatted as left-justified, I2S, or right-justified with
word widths of 16, 18, 20, or 24 bits.
4
4
SPI PORT (1)
SERIAL PORTS (6)
The serial data, clock, and frame sync inputs to the S/PDIF
transmitter are routed through the signal routing unit (SRU).
They can come from a variety of sources such as the SPORTs,
external pins, the precision clock generators (PCGs), or the
sample rate converters (SRC) and are controlled by the SRU
control registers.
INPUT
DATA PORTS (8)
20
DTCP CIPHER
S/PDIF (Rx/Tx)
The sample rate converter (SRC) contains four SRC blocks and
is the same core as that used in the AD1896 192 kHz stereo
asynchronous sample rate converter and provides up to 140 dB
SNR (see Table 2 on Page 4 for details). The SRC block is used
to perform synchronous or asynchronous sample rate conver-
sion across independent stereo channels, without using internal
processor resources. The four SRC blocks can also be config-
ured to operate together to convert multichannel audio data
without phase mismatches. Finally, the SRC is used to clean up
audio data from jittery clock sources such as the S/PDIF
receiver. The S/PDIF and SRC are not available on the
ADSP-21363 models.
SRC (8 CHANNELS)
PRECISION CLOCK
GENERATORS (2)
3
TIMERS (3)
DIGITAL AUDIO INTERFACE
I/O PROCESSOR
Figure 3. ADSP-2136x I/O Processor and
Peripherals Block Diagram
Digital Transmission Content Protection
The DTCP specification defines a cryptographic protocol for
protecting audio entertainment content from illegal copying,
intercepting, and tampering as it traverses high performance
digital buses, such as the IEEE 1394 standard. Only legitimate
entertainment content delivered to a source device via another
approved copy protection system (such as the DVD content
scrambling system) will be protected by this copy protection
system. This feature is available on the ADSP-21362 and
ADSP-21365 processors only. Licensing through DTLA is
required for these products. Visit www.dtcp.com for more
information.
Parallel Port
The parallel port provides interfaces to SRAM and peripheral
devices. The multiplexed address and data pins (AD15–0) can
access 8-bit devices with up to 24 bits of address, or 16-bit
devices with up to 16 bits of address. In either mode, 8-bit or
16-bit, the maximum data transfer rate is 55 Mbps.
DMA transfers are used to move data to and from internal
memory. Access to the core is also facilitated through the paral-
lel port register read/write functions. The RD, WR, and ALE
(address latch enable) pins are the control pins for the
parallel port.
Pulse-Width Modulation
Serial Peripheral (Compatible) Interface
The PWM module is a flexible, programmable, PWM waveform
generator that can be programmed to generate the required
switching patterns for various applications related to motor and
engine control or audio power control. The PWM generator can
generate either center-aligned or edge-aligned PWM wave-
forms. In addition, it can generate complementary signals on
The processors contain two serial peripheral interface ports
(SPIs). The SPI is an industry-standard synchronous serial link,
enabling the ADSP-2136x SPI-compatible port to communicate
with other SPI-compatible devices. The SPI consists of two data
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two outputs in paired mode or independent signals in non-
Phase-Locked Loop
paired mode (applicable to a single group of four PWM
waveforms).
The processors use an on-chip phase-locked loop (PLL) to gen-
erate the internal clock for the core. On power up, the
CLK_CFG1–0 pins are used to select ratios of 32:1, 16:1, and 6:1
(see Table 8 on Page 15). After booting, numerous other ratios
can be selected via software control.
The entire PWM module has four groups of four PWM outputs
each. Therefore, this module generates 16 PWM outputs in
total. Each PWM group produces two pairs of PWM signals on
the four PWM outputs.
The ratios are made up of software configurable numerator val-
ues from 1 to 64 and software configurable divisor values of 1, 2,
4, and 8.
The PWM generator is capable of operating in two distinct
modes while generating center-aligned PWM waveforms: single
update mode or double update mode. In single update mode the
duty cycle values are programmable only once per PWM period.
This results in PWM patterns that are symmetrical about the
midpoint of the PWM period. In double update mode, a second
updating of the PWM registers is implemented at the midpoint
of the PWM period. In this mode, it is possible to produce
asymmetrical PWM patterns that produce lower harmonic dis-
tortion in three-phase PWM inverters.
Power Supplies
The ADSP-2136x has a separate power supply connection for
the internal (VDDINT), external (VDDEXT), and analog (AVDD/AVSS
)
power supplies. The internal and analog supplies must meet the
1.2 V requirement for K, B, and Y grade models, and the 1.0 V
requirement for Y models. (For information on the temperature
ranges offered for this product, see Operating Conditions on
Page 16, Package Information on Page 17, and Ordering Guide
on Page 53. The external supply must meet the 3.3 V require-
ment. All external supply pins must be connected to the same
power supply.
Timers
The ADSP-2136x has a total of four timers: a core timer that can
generate periodic software interrupts and three general-purpose
timers that can generate periodic interrupts and be indepen-
dently set to operate in one of three modes:
Note that the analog supply pin (AVDD) powers the processor’s
internal clock generator PLL. To produce a stable clock, it is rec-
ommended that PCB designs use an external filter circuit for the
• Pulse waveform generation mode
• Pulse width count/capture mode
• External event watchdog mode
A
VDD pin. Place the filter components as close as possible to the
VDD/AVSS pins. For an example circuit, see Figure 4. (A recom-
A
mended ferrite chip is the muRata BLM18AG102SN1D). To
reduce noise coupling, the PCB should use a parallel pair of
power and ground planes for VDDINT and GND. Use wide traces
to connect the bypass capacitors to the analog power (AVDD) and
ground (AVSS) pins. Note that the AVDD and AVSS pins specified in
Figure 4 are inputs to the processor and not the analog ground
plane on the board—the AVSS pin should connect directly to dig-
ital ground (GND) at the chip.
The core timer can be configured to use FLAG3 as a timer
expired signal, and each general-purpose timer has one bidirec-
tional pin and four registers that implement its mode of
operation: a 6-bit configuration register, a 32-bit count register,
a 32-bit period register, and a 32-bit pulse width register. A sin-
gle control and status register enables or disables all three
general-purpose timers independently.
ROM-Based Security
The ADSP-2136x has a ROM security feature that provides
hardware support for securing user software code by preventing
unauthorized reading from the internal code when enabled.
When using this feature, the processor does not boot-load any
external code, executing exclusively from internal SRAM/ROM.
Additionally, the processor is not freely accessible via the JTAG
port. Instead, a unique 64-bit key, which must be scanned in
through the JTAG or test access port will be assigned to each
customer. The device will ignore a wrong key. Emulation fea-
tures and external boot modes are only available after the
correct key is scanned.
ADSP-213xx
100nF
10nF
1nF
A
V
VDD
DDINT
HIGH-Z FERRITE
BEAD CHIP
A
VSS
LOCATE ALL COMPONENTS
CLOSE TO A AND A PINS
VDD
VSS
Figure 4. Analog Power (AVDD) Filter Circuit
Program Booting
Target Board JTAG Emulator Connector
The internal memory of the ADSP-2136x boots at system
power-up from an 8-bit EPROM via the parallel port, an SPI
master, an SPI slave, or an internal boot. Booting is determined
by the boot configuration (BOOT_CFG1–0) pins (see Table 7
on Page 15). Selection of the boot source is controlled via the
SPI as either a master or slave device, or it can immediately
begin executing from ROM.
Analog Devices DSP Tools product line of JTAG emulators uses
the IEEE 1149.1 JTAG test access port of the processor to moni-
tor and control the target board processor during emulation.
Analog Devices’ DSP Tools product line of JTAG emulators
provides emulation at full processor speed, allowing inspection
and modification of memory, registers, and processor stacks.
The processor’s JTAG interface ensures that the emulator will
not affect target system loading or timing.
Rev. C
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For complete information on Analog Devices’ SHARC DSP
Tools product line of JTAG emulator operation, see the appro-
priate Emulator Hardware User’s Guide.
The VisualDSP++ IDDE lets programmers define and manage
DSP software development. Its dialog boxes and property pages
let programmers configure and manage all of the SHARC devel-
opment tools, including the color syntax highlighting in the
VisualDSP++ editor. This capability permits programmers to:
DEVELOPMENT TOOLS
The ADSP-2136x is supported with a complete set of
CROSSCORE®† software and hardware development tools,
including Analog Devices emulators and VisualDSP++®‡ devel-
opment environment. The same emulator hardware that
supports other SHARC processors also fully emulates the
ADSP-2136x.
• Control how the development tools process inputs and
generate outputs
• Maintain a one-to-one correspondence with the tool’s
command line switches
The VisualDSP++ Kernel (VDK) incorporates scheduling and
resource management tailored specifically to address the mem-
ory and timing constraints of DSP programming. These
capabilities enable engineers to develop code more effectively,
eliminating the need to start from the very beginning, when
developing new application code. The VDK features include
threads, critical and unscheduled regions, semaphores, events,
and device flags. The VDK also supports priority-based, pre-
emptive, cooperative, and time-sliced scheduling approaches. In
addition, the VDK was designed to be scalable. If the application
does not use a specific feature, the support code for that feature
is excluded from the target system.
The VisualDSP++ project management environment lets pro-
grammers develop and debug an application. This environment
includes an easy to use assembler (which is based on an alge-
braic syntax), an archiver (librarian/library builder), a linker, a
loader, a cycle-accurate instruction-level simulator, a C/C++
compiler, and a C/C++ runtime library that includes DSP and
mathematical functions. A key point for these tools is C/C++
code efficiency. The compiler has been developed for efficient
translation of C/C++ code to DSP assembly. The SHARC has
architectural features that improve the efficiency of compiled
C/C++ code.
Because the VDK is a library, a developer can decide whether to
use it or not. The VDK is integrated into the VisualDSP++
development environment, but can also be used via standard
command line tools. When the VDK is used, the development
environment assists the developer with many error-prone tasks
and assists in managing system resources, automating the gen-
eration of various VDK-based objects, and visualizing the
system state, when debugging an application that uses the VDK.
The VisualDSP++ debugger has a number of important fea-
tures. Data visualization is enhanced by a plotting package that
offers a significant level of flexibility. This graphical representa-
tion of user data enables the programmer to quickly determine
the performance of an algorithm. As algorithms grow in com-
plexity, this capability can have increasing significance on the
designer’s development schedule, increasing productivity. Sta-
tistical profiling enables the programmer to nonintrusively poll
the processor as it is running the program. This feature, unique
to VisualDSP++, enables the software developer to passively
gather important code execution metrics without interrupting
the real-time characteristics of the program. Essentially, the
developer can identify bottlenecks in software quickly and
efficiently. By using the profiler, the programmer can focus on
those areas in the program that impact performance and take
corrective action.
VisualDSP++ component software engineering (VCSE) is
Analog Devices’ technology for creating, using, and reusing
software components (independent modules of substantial
functionality) to quickly and reliably assemble software applica-
tions. It allows downloading components from the Web,
dropping them into the application, and publishing component
archives from within VisualDSP++. VCSE supports component
implementation in C/C++ or assembly language.
Use the expert linker to visually manipulate the placement of
code and data on the embedded system. View memory utiliza-
tion in a color-coded graphical form, easily move code and data
to different areas of the processor or external memory with a
drag of the mouse and examine runtime stack and heap usage.
The expert linker is fully compatible with the existing linker def-
inition file (LDF), allowing the developer to move between the
graphical and textual environments.
Debugging both C/C++ and assembly programs with the
VisualDSP++ debugger, programmers can:
• View mixed C/C++ and assembly code (interleaved source
and object information)
• Insert breakpoints
• Set conditional breakpoints on registers, memory,
and stacks
In addition to the software and hardware development tools
available from Analog Devices, third parties provide a wide
range of tools supporting the SHARC processor family. Hard-
ware tools include SHARC processor PC plug-in cards. Third
party software tools include DSP libraries, real-time operating
systems, and block diagram design tools.
• Perform linear or statistical profiling of program execution
• Fill, dump, and graphically plot the contents of memory
• Perform source level debugging
• Create custom debugger windows
Designing an Emulator-Compatible DSP Board (Target)
The Analog Devices family of emulators are tools that every
DSP developer needs to test and debug hardware and software
systems. Analog Devices has supplied an IEEE 1149.1 JTAG test
† CROSSCORE is a registered trademark of Analog Devices, Inc.
‡ VisualDSP++ is a registered trademark of Analog Devices, Inc.
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ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
access port (TAP) on each JTAG processor. Nonintrusive in-
platform includes an evaluation board along with an evaluation
suite of the VisualDSP++ development and debugging environ-
ment with the C/C++ compiler, assembler, and linker. Also
included are sample application programs, power supply, and a
USB cable. All evaluation versions of the software tools are lim-
ited for use only with the EZ-KIT Lite product.
circuit emulation is assured by the use of the processor’s JTAG
interface—the emulator does not affect target system loading or
timing. The emulator uses the TAP to access the internal fea-
tures of the processor, allowing the developer to load code, set
breakpoints, observe variables, observe memory, and examine
registers. The processor must be halted to send data and com-
mands, but once an operation has been completed by the
emulator, the DSP system is set running at full speed with no
impact on system timing.
The USB controller on the EZ-KIT Lite board connects the
board to the USB port of the user’s PC, enabling the
VisualDSP++ evaluation suite to emulate the on-board proces-
sor in-circuit. This permits the customer to download, execute,
and debug programs for the EZ-KIT Lite system. It also allows
in-circuit programming of the on-board flash device to store
user-specific boot code, enabling the board to run as a stand-
alone unit without being connected to the PC.
To use these emulators, the target board must include a header
that connects the DSP’s JTAG port to the emulator.
For details on target board design issues including mechanical
layout, single processor connections, multiprocessor scan
chains, signal buffering, signal termination, and emulator pod
logic, see the Analog Devices JTAG Emulation Technical Refer-
ence (EE-68) on the Analog Devices website
(www.analog.com)—use site search on “EE-68.” This document
is updated regularly to keep pace with improvements to emula-
tor support.
With a full version of VisualDSP++ installed (sold separately),
engineers can develop software for the EZ-KIT Lite or any cus-
tom defined system. Connecting one of Analog Devices’ JTAG
emulators to the EZ-KIT Lite board enables high speed, non-
intrusive emulation.
ADDITIONAL INFORMATION
Evaluation Kit
This data sheet provides a general overview of the
ADSP-2136x architecture and functionality. For detailed infor-
mation on the ADSP-2136x family core architecture and
instruction set, refer to the ADSP-2136x SHARC Processor
Hardware Reference and the ADSP-2136x SHARC Processor
Programming Reference.
Analog Devices offers a range of EZ-KIT Lite®† evaluation plat-
forms to use as a cost-effective method to learn more about
developing or prototyping applications with Analog Devices
processors, platforms, and software tools. Each EZ-KIT Lite
† EZ-KIT Lite is a registered trademark of Analog Devices, Inc.
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PIN FUNCTION DESCRIPTIONS
The ADSP-2136x pin definitions are listed below. Inputs identi-
fied as synchronous (S) must meet timing requirements with
respect to CLKIN (or with respect to TCK for TMS and TDI).
Inputs identified as asynchronous (A) can be asserted asynchro-
nously to CLKIN (or to TCK for TRST). Tie or pull unused
inputs to VDDEXT or GND, except for the following:
DAI_Px, SPICLK, MISO, MOSI, EMU, TMS, TRST, TDI, and
AD15–0 (NOTE: These pins have pull-up resistors.)
The following symbols appear in the Type column of Table 4:
A = asynchronous, G = ground, I = input, O = output,
P = power supply, S = synchronous, (A/D) = active drive,
(O/D) = open drain, and T = three-state, (pd) = pull-down resis-
tor, (pu) = pull-up resistor.
Table 4. Pin Descriptions
State During and
Pin
Type
After Reset
Function
AD15–0
I/O/T
(pu)
Three-state with
pull-up enabled
Parallel Port Address/Data. The ADSP-2136x parallel port and its corresponding
DMA unit output addresses and data for peripherals on these multiplexed pins. The
multiplex state is determined by the ALE pin. The parallel port can operate in either
8-bit or 16-bit mode. Each AD pin has a 22.5 kΩ internal pull-up resistor. See
Address/Data Modes on Page 15 for details of the AD pin operation.
For 8-bit mode: ALE is automatically asserted whenever a change occurs in the upper
16 external address bits, A23–8; ALE is used in conjunction with an external latch to
retain the values of the A23–8.
For detailed information on I/O operations and pin multiplexing, see the ADSP-2136x
SHARC Processor Hardware Reference.
RD
O
(pu)
Three-state, driven Parallel Port Read Enable. RD is asserted low whenever the processor reads 8-bit or
high1
16-bit data from an external memory device. When AD15–0 are flags, this pin remains
deasserted. RD has a 22.5 kΩ internal pull-up resistor.
WR
ALE
O
(pu)
Three-state, driven Parallel Port Write Enable. WR is asserted low whenever the processor writes 8-bit or
high1
16-bit data to an external memory device. When AD15–0 are flags, this pin remains
deasserted. WR has a 22.5 kΩ internal pull-up resistor.
O
(pd)
Three-state, driven Parallel Port Address Latch Enable. ALE is asserted whenever the processor drives
low1
a new address on the parallel port address pins. On reset, ALE is active high. However,
it can be reconfigured using software to be active low. When AD15–0 are flags, this
pin remains deasserted. ALE has a 20 kΩ internal pull-down resistor.
FLAG3–0
I/O/A
Three-state
Flag Pins. Each flag pin is configured via control bits as either an input or output. As
an input, it can be tested as a condition. As an output, it can be used to signal external
peripherals. These pins can be used as an SPI interface slave select output during SPI
mastering. These pins are also multiplexed with the IRQx and the TIMEXP signals. For
detailed information on I/O operations and pin multiplexing, see the ADSP-2136x
SHARC Processor Hardware Reference.
DAI_P20–1
I/O/T
(pu)
Three-state with
programmable
pull-up
Digital Audio Interface Pins. These pins provide the physical interface to the SRU.
The SRU configuration registers define the combination of on-chip peripheral inputs
or outputs connected to the pin and to the pin’s output enable. The configuration
registers of these peripherals then determines the exact behavior of the pin. Any input
or output signal present in the SRU may be routed to any of these pins. The SRU
provides the connection from the serial ports, input data port, precision clock gener-
ators and timers, sample rate converters and SPI to the DAI_P20–1 pins. These pins
have internal 22.5 kΩ pull-up resistors which are enabled on reset. These pull-ups can
be disabled in the DAI_PIN_PULLUP register.
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Table 4. Pin Descriptions (Continued)
State During and
After Reset
Pin
Type
Function
SPICLK
I/O
(pu)
Three-state with
pull-up enabled
Serial Peripheral Interface Clock Signal. Driven by the master, this signal controls
the rate at which data is transferred. The master may transmit data at a variety of baud
rates. SPICLK cycles once for each bit transmitted. SPICLK is a gated clock that is active
during data transfers, only for the length of the transferred word. Slave devices ignore
the serial clock if the slave select input is driven inactive (high). SPICLK is used to shift
out and shift in the data driven on the MISO and MOSI lines. The data is always shifted
out on one clock edge and sampled on the opposite edge of the clock. Clock polarity
and clock phase relative to data are programmable into the SPICTL control register
and define the transfer format. SPICLK has a 22.5 kΩ internal pull-up resistor.
SPIDS
I
Input only
Serial Peripheral Interface Slave Device Select. An active low signal used to select
the processor as an SPI slave device. This input signal behaves like a chip select, and
is provided by the master device for the slave devices. In multimaster mode the
processor’s SPIDS signal can be driven by a slave device to signal to the processor (as
SPI master) that an error has occurred, as some other device is also trying to be the
master device. If asserted low when the device is in master mode, it is considered a
multimaster error. For a single-master, multiple-slave configuration where flag pins
are used, this pin must be tied or pulled high to VDDEXT on the master device. For
processor to processor SPI interaction, any of the master processor’s flag pins can be
used to drive the SPIDS signal on the SPI slave device.
MOSI
MISO
I/O (O/D)
(pu)
Three-state with
pull-up enabled
SPI Master Out Slave In. If the ADSP-2136x is configured as a master, the MOSI pin
becomes a data transmit (output) pin, transmitting output data. If the processor is
configured as a slave, the MOSI pin becomes a data receive (input) pin, receiving input
data. In a SPI interconnection, the data is shifted out from the MOSI output pin of the
master and shifted into the MOSI input(s) of the slave(s). MOSI has a 22.5 kΩ internal
pull-up resistor.
I/O (O/D)
(pu)
Three-state with
pull-up enabled
SPI Master In Slave Out. If the ADSP-2136x is configured as a master, the MISO pin
becomes a data receive (input) pin, receiving input data. If the processor is configured
as a slave, the MISO pin becomes a data transmit (output) pin, transmitting output
data. In an SPI interconnection, the data is shifted out from the MISO output pin of the
slave and shifted into the MISO input pin of the master. MISO has a 22.5 kΩ internal
pull-up resistor. MISO can be configured as O/D by setting the OPD bit in the SPICTL
register.
Note: Only one slave is allowed to transmit data at any given time. To enable broadcast
transmission to multiple SPI slaves, the processor’s MISO pin may be disabled by
setting (=1) Bit 5 (DMISO) of the SPICTL register.
BOOT_CFG1–0
CLKIN
I
I
Input only
Input only
Boot Configuration Select. This pin is used to select the boot mode for the processor.
TheBOOT_CFG pinsmustbe valid before reset is asserted. See Table 7 for a description
of the boot modes.
Local Clock In. Used in conjunction with XTAL. CLKIN is the ADSP-2136x clock input.
It configures the ADSP-2136x to use either its internal clock generator or an external
clock source. Connecting the necessary components to CLKIN and XTAL enables the
internal clock generator. Connecting the external clock to CLKIN while leaving XTAL
unconnected configures the processors to use the external clock source such as an
external clock oscillator. The core is clocked either by the PLL output or this clock input
depending on the CLK_CFG1–0 pin settings. CLKIN may not be halted, changed, or
operated below the specified frequency.
XTAL
O
I
Output only2
Input only
Crystal Oscillator Terminal. Used in conjunction with CLKIN to drive an external
crystal.
CLK_CFG1–0
Core/CLKIN Ratio Control. These pins set the start up clock frequency. See Table 8
for a description of the clock configuration modes. Note that the operating frequency
can be changed by programming the PLL multiplier and divider in the PMCTL register
at any time after the core comes out of reset.
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Table 4. Pin Descriptions (Continued)
State During and
Pin
Type
After Reset
Function
RESETOUT/CLKOUT O
Output only
Reset Out/Local Clock Out. Drives out the core reset signal to an external device.
CLKOUT can also be configured as a reset out pin. The functionality can be switched
between the PLL output clock and reset out by setting Bit 12 of the PMCTL register.
The default is reset out.
RESET
I/A
Input only
Input only3
Processor Reset. Resets the ADSP-2136x to a known state. Upon deassertion, there is
a 4096 CLKIN cycle latency for the PLL to lock. After this time, the core begins program
execution from the hardware reset vector address. The RESET input must be asserted
(low) at power-up.
TCK
TMS
TDI
I
Test Clock (JTAG). Provides a clock for JTAG boundary scan. TCK must be asserted
(pulsed low) after power-up or held low for proper operation of the processors.
I/S
(pu)
Three-state with
pull-up enabled
Test Mode Select (JTAG). Used to control the test state machine. TMS has a 22.5 kΩ
internal pull-up resistor.
I/S
(pu)
Three-state with
pull-up enabled
Three-state4
Test Data Input (JTAG). Provides serial data for the boundary scan logic. TDI has a
22.5 kΩ internal pull-up resistor.
Test Data Output (JTAG). Serial scan output of the boundary scan path.
TDO
TRST
O
I/A
(pu)
Three-state with
pull-up enabled
Test Reset (JTAG). Resets the test state machine. TRST must be asserted (pulsed low)
after power-up or held low for proper operation of the ADSP-2136x. TRST has a
22.5 kΩ internal pull-up resistor.
EMU
VDDINT
O (O/D)
(pu)
Three-state with
pull-up enabled
Emulation Status. Must be connected to the processor’s JTAG emulators target board
connector only. EMU has a 22.5 kΩ internal pull-up resistor.
Core Power Supply. Nominally +1.2 V dc for the K, B grade models, and 1.0 V dc for
P
the Y grade models, and supplies the processor’s core (13 pins).
VDDEXT
AVDD
P
P
I/O Power Supply. Nominally +3.3 V dc (6 pins).
Analog Power Supply. Nominally +1.2 V dc for the K, B grade models, and 1.0 V dc for
the Y grade models, and supplies the processor’s internal PLL (clock generator). This
pin has the same specifications as VDDINT, except that added filtering circuitry is
required. For more information, see Power Supplies on Page 9.
AVSS
G
G
Analog Power Supply Return.
Power Supply Return. (54 pins)
GND
1 RD, WR, and ALE are three-stated (and not driven) only when RESET is active.
2 Output only is a three-state driver with its output path always enabled.
3
Input only is a three-state driver with both output path and pull-up disabled.
4 Three-state is a three-state driver with pull-up disabled.
Rev. C
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ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
ADDRESS DATA PINS AS FLAGS
BOOT MODES
To use these pins as flags (FLAGS15–0), set (=1) Bit 20 of the
SYSCTL register to disable the parallel port. Then set (=1)
Bits 22 to 25 in the SYSCTL register accordingly.
Table 7. Boot Mode Selection
BOOT_CFG1–0
Booting Mode
00
01
10
11
SPI Slave Boot
Table 5. AD15–0 to Flag Pin Mapping
SPI Master Boot
Parallel Port Boot via EPROM
Reserved
AD Pin
AD0
AD1
AD2
AD3
AD4
AD5
AD6
AD7
Flag Pin
FLAG8
AD Pin
AD8
Flag Pin
FLAG0
FLAG1
FLAG2
FLAG3
FLAG4
FLAG5
FLAG6
FLAG7
FLAG9
AD9
FLAG10
FLAG11
FLAG12
FLAG13
FLAG14
FLAG15
AD10
AD11
AD12
AD13
AD14
AD15
CORE INSTRUCTION RATE TO CLKIN RATIO MODES
For details on processor timing, see Timing Specifications on
Page 17.
Table 8. Core Instruction Rate/CLKIN Ratio Selection
CLK_CFG1–0
Core to CLKIN Ratio
00
01
10
11
6:1
ADDRESS/DATA MODES
32:1
The following table shows the functionality of the AD pins for
8-bit and 16-bit transfers to the parallel port. For 8-bit data
transfers, ALE latches Address Bits A23–A8 when asserted, fol-
lowed by Address Bits A7–A0 and Data Bits D7–D0 when
deasserted. For 16-bit data transfers, ALE latches Address Bits
A15–A0 when asserted, followed by Data Bits D15–D0 when
deasserted.
16:1
Reserved
Table 6. Address/Data Mode Selection
PP Data
Mode
AD7–0
Function
AD15–8
Function
ALE
8-bit
Asserted
Deasserted
Asserted
Deasserted
A15–8
D7–0
A7–0
D7–0
A23–16
A7–0
8-bit
16-bit
16-bit
A15–8
D15–8
Rev. C
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ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
ADSP-2136x SPECIFICATIONS
OPERATING CONDITIONS
K Grade
Min Max
B Grade
Min Max
Y Grade
Min Max
Parameter1 Description
Unit
VDDINT
AVDD
Internal (Core) Supply Voltage
1.14 1.26
1.14 1.26
3.13 3.47
1.14 1.26
1.14 1.26
3.13 3.47
0.95 1.05
0.95 1.05
3.13 3.47
V
Analog (PLL) Supply Voltage
V
VDDEXT
External (I/O) Supply Voltage
V
2
VIH
High Level Input Voltage @ VDDEXT = Max
Low Level Input Voltage @ VDDEXT = Min
High Level Input Voltage @ VDDEXT = Max
Low Level Input Voltage @ VDDEXT = Min
Junction Temperature 136-Ball CSP_BGA
Junction Temperature 144-Lead LQFP_EP
2.0
VDDEXT + 0.5
2.0
VDDEXT + 0.5
2.0
VDDEXT + 0.5
V
2
VIL
–0.5 +0.8
1.74 VDDEXT + 0.5
–0.5 +1.19
–0.5 +0.8
1.74 VDDEXT + 0.5
–0.5 +1.19
–40 +125
–40 +125
–0.5 +0.8
1.74 VDDEXT + 0.5
–0.5 +1.19
–40 +125
–40 +125
V
3
VIH
V
_
CLKIN
VIL
V
_
CLKIN
4, 5
TJ
TJ
0
0
+110
+110
°C
°C
4, 5
1
Specifications subject to change without notice.
2 Applies to input and bidirectional pins: AD15–0, FLAG3–0, DAI_Px, SPICLK, MOSI, MISO, SPIDS, BOOT_CFGx, CLK_CFGx, RESET, TCK, TMS, TDI, TRST.
3 Applies to input pin CLKIN.
4 See Thermal Characteristics on Page 46 for information on thermal specifications.
5 See Estimating Power for the ADSP-21362 SHARC Processors (EE-277) for further information.
ELECTRICAL CHARACTERISTICS
Parameter1
Description
Test Conditions
Min
Max
Unit
2
VOH
High Level Output Voltage
Low Level Output Voltage
High Level Input Current
Low Level Input Current
@ VDDEXT = Min, IOH = –1.0 mA3
@ VDDEXT = Min, IOL = 1.0 mA3
@ VDDEXT = Max, VIN = VDDEXT Max
@ VDDEXT = Max, VIN = 0 V
@ VDDEXT = Max, VIN = 0 V
@ VDDEXT = Max, VIN = VDDEXT Max
@ VDDEXT = Max, VIN = 0 V
@ VDDEXT = Max, VIN = 0 V
tCCLK = Min, VDDINT = Nom
AVDD = Max
2.4
V
2
VOL
0.4
10
V
4, 5
IIH
μA
μA
μA
μA
μA
μA
mA
mA
pF
4
IIL
10
5
IILPU
Low Level Input Current Pull-Up
Three-State Leakage Current
Three-State Leakage Current
Three-State Leakage Current Pull-Up
Supply Current (Internal)
Supply Current (Analog)
200
10
6, 7
IOZH
6
IOZL
10
7
IOZLPU
200
800
10
8, 9
IDD
-
INTYP
10
AIDD
11, 12
CIN
Input Capacitance
fIN = 1 MHz, TCASE = 25°C, VIN = 1.2 V
4.7
1
Specifications subject to change without notice.
2 Applies to output and bidirectional pins: AD15–0, RD, WR, ALE, FLAG3–0, DAI_Px, SPICLK, MOSI, MISO, EMU, TDO, CLKOUT, XTAL.
3 See Output Drive Currents on Page 45 for typical drive current capabilities.
4 Applies to input pins: SPIDS, BOOT_CFGx, CLK_CFGx, TCK, RESET, CLKIN.
5 Applies to input pins with 22.5 kΩ internal pull-ups: TRST, TMS, TDI.
6 Applies to three-stateable pins: FLAG3–0.
7 Applies to three-stateable pins with 22.5 kΩ pull-ups: AD15–0, DAI_Px, SPICLK, EMU, MISO, MOSI.
8 Typical internal current data reflects nominal operating conditions.
9 See Estimating Power for the ADSP-21362 SHARC Processors (EE-277) for further information.
10Characterized, but not tested.
11Applies to all signal pins.
12Guaranteed, but not tested.
Rev. C
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ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Table 10. Absolute Maximum Ratings
PACKAGE INFORMATION
The information presented in Figure 5 provides details about
the package branding for the ADSP-2136x processor. For a
complete listing of product availability, see Ordering Guide on
Page 53.
Parameter
Rating
Internal (Core) Supply Voltage (VDDINT
)
–0.3 V to +1.5 V
–0.3 V to +1.5 V
–0.3 V to +4.6 V
–0.5 V to +3.8 V
–0.5 V to VDDEXT + 0.5 V
200 pF
Analog (PLL) Supply Voltage (AVDD
)
External (I/O) Supply Voltage (VDDEXT
Input Voltage
)
Output Voltage Swing
a
ADSP-2136x
Load Capacitance
Storage Temperature Range
Junction Temperature Under Bias
–65°C to +150°C
125°C
tppZ-cc
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TIMING SPECIFICATIONS
S
The ADSP-2136x’s internal clock (a multiple of CLKIN) pro-
vides the clock signal for timing internal memory, processor
core, serial ports, and parallel port (as required for read/write
strobes in asynchronous access mode). During reset, program
the ratio between the processor’s internal clock frequency and
external (CLKIN) clock frequency with the CLK_CFG1–0 pins
(see Table 8 on Page 15). To determine switching frequencies
for the serial ports, divide down the internal clock, using the
programmable divider control of each port (DIVx for the
serial ports).
Figure 5. Typical Package Brand
Table 9. Package Brand Information
Brand Key
Field Description
Temperature Range
Package Type
t
pp
Z
RoHS Compliant Option
See Ordering Guide
Assembly Lot Code
Silicon Revision
The ADSP-2136x’s internal clock switches at higher frequencies
than the system input clock (CLKIN). To generate the internal
clock, the processor uses an internal phase-locked loop (PLL).
This PLL-based clocking minimizes the skew between the sys-
tem clock (CLKIN) signal and the processor’s internal clock (the
clock source for the parallel port logic and I/O pads).
cc
vvvvvv.x
n.n
yyww
Date Code
ESD CAUTION
Note the definitions of various clock periods that are a function
of CLKIN and the appropriate ratio control shown in Table 11
and Table 12.
ESD (electrostatic discharge) sensitive device.
Charged devices and circuit boards can discharge
without detection. Although this product features
patented or proprietary protection circuitry, damage
may occur on devices subjected to high energy ESD.
Therefore, proper ESD precautions should be taken to
avoid performance degradation or loss of functionality.
In Table 11, CCLK is defined as:
fCCLK = (2 × PLLM × fINPUT) ÷ (2 × PLLN)
where:
fCCLK = CCLK frequency
PLLM = Multiplier value programmed
PLLN = Divider value programmed.
MAXIMUM POWER DISSIPATION
See Estimating Power for the ADSP-21362 SHARC Processors
(EE-277) for detailed thermal and power information regarding
maximum power dissipation. For information on package ther-
mal specifications, see Thermal Characteristics on Page 46.
Table 11. ADSP-2136x Clock Generation Operation
Timing
Requirements
Description
Input Clock
Core Clock
Calculation
1/tCK
CLKIN
ABSOLUTE MAXIMUM RATINGS
CCLK
1/tCCLK
Stresses greater than those listed in Table 10 may cause perma-
nent damage to the device. These are stress ratings only;
functional operation of the device at these or any other condi-
tions greater than those indicated in the operational sections of
this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device
reliability.
Note the definitions of various clock periods shown in Table 12
which are a function of CLKIN and the appropriate ratio con-
trol shown in Table 11.
Rev. C
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ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Table 12. Clock Periods
reflect statistical variations and worst cases. Consequently, it is
not meaningful to add parameters to derive longer times. See
Figure 39 on Page 45 under Test Conditions for voltage
reference levels.
Timing
Requirements
Description1
tCK
CLKIN Clock Period
Note that in the user application, the PLL multiplier value
should be selected in such a way that the VCO frequency never
exceeds 666 MHz. The VCO frequency is calculated as follows:
tCCLK
(Processor) Core Clock Period
(Peripheral) Clock Period = 2 × tCCLK
Serial Port Clock Period = (tCCLK) × SR
SPI Clock Period = (tCCLK) × SPIR
tPCLK
tSCLK
f
VCO = 2 × PLLM × fINPUT
tSPICLK
1 where:
where:
f
VCO is the VCO frequency.
SR = serial port-to-peripheral clock ratio (wide range, determined by SPORT
CLKDIV)
PLLM is the multiplier value programmed.
SPIR = SPI-to-peripheral clock ratio (wide range, determined by SPIBAUD
f
f
f
INPUT is the input frequency to the PLL.
register)
SCLK = serial port clock
SPICLK = SPI clock
INPUT = CLKIN when the input divider is disabled and
INPUT = CLKIN ÷ 2 when the input divider is enabled.
Figure 6 shows core to CLKIN relationships with external oscil-
lator or crystal. The shaded divider/multiplier blocks denote
where clock ratios can be set through hardware or software
using the power management control register (PMCTL). For
more information, see the ADSP-2136x SHARC Processor Hard-
ware Reference and Managing the Core PLL on Third-
Generation SHARC Processors (EE-290).
Timing Requirements apply to signals that are controlled by cir-
cuitry external to the processor, such as the data input for a read
operation. Timing requirements guarantee that the processor
operates correctly with other devices.
Switching Characteristics specify how the processor changes its
signals. Circuitry external to the processor must be designed for
compatibility with these signal characteristics. Switching char-
acteristics describe what the processor will do in a given
circumstance. Use switching characteristics to ensure that any
timing requirement of a device connected to the processor (such
Use the exact timing information given. Do not attempt to
derive parameters from the addition or subtraction of others.
While addition or subtraction would yield meaningful results
for an individual device, the values given in this data sheet
PLL
PLLI
CLK
CLKIN
BUF
CLKIN
DIVIDER
CCLK
LOOP
PLL
DIVIDER
VCO
FILTER
XTAL
DIVIDE
BY 2
PMCTL
CLK_CFGx/
PMCTL
PCLK
PLL
MULTIPLIER
PMCTL
CLK_CFGx/PMCTL
CLKOUT
RESETOUT
CLKOUT
BUF
DELAY OF
4096 CLKIN
RESETOUT
RESET
CYCLES
CORERST
Figure 6. Core Clock and System Clock Relationship to CLKIN
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September 2007
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Power-Up Sequencing
The timing requirements for processor startup are given in
Table 13.
Table 13. Power-Up Sequencing Timing Requirements (Processor Startup)
Parameter
Min
Max
Unit
Timing Requirements
tRSTVDD
RESET Low Before VDDINT/VDDEXT On
VDDINT On Before VDDEXT
0
ns
tIVDDEVDD
–50
0
102
+200
200
ms
ms
μs
1
tCLKVDD
CLKIN Valid After VDDINT/VDDEXT Valid
CLKIN Valid Before RESET Deasserted
PLL Control Setup Before RESET Deasserted
tCLKRST
tPLLRST
20
μs
Switching Characteristic
3, 4
tCORERST
Core Reset Deasserted After RESET Deasserted
4096tCK + 2 tCCLK
1 Valid VDDINT/VDDEXT assumes that the supplies are fully ramped to their 1.2 V rails and 3.3 V rails. Voltage ramp rates can vary from microseconds to hundreds of milliseconds
depending on the design of the power supply subsystem.
2 Assumes a stable CLKIN signal, after meeting worst-case start-up timing of crystal oscillators. Refer to your crystal oscillator manufacturer’s data sheet for start-up time.
Assume a 25 ms maximum oscillator start-up time if using the XTAL pin and internal oscillator circuit in conjunction with an external crystal.
3 Applies after the power-up sequence is complete. Subsequent resets require a minimum of 4 CLKIN cycles for RESET to be held low in order to properly initialize and
propagate default states at all I/O pins.
4 The 4096 cycle count depends on tSRST specification in Table 15. If setup time is not met, 1 additional CLKIN cycle may be added to the core reset time, resulting in 4097
cycles maximum.
RESET
tRSTVDD
VDDINT
tIVDDEVDD
tCLKVDD
VDDEXT
CLKIN
tCLKRST
CLK_CFG1-0
tCORERST
tPLLRST
RESETOUT
Figure 7. Power-Up Sequencing
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ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Clock Input
Table 14. Clock Input
333 MHz
Parameter
Unit
Min
Max
Timing Requirements
tCK
CLKIN Period
181
100
ns
ns
ns
ns
ns
ps
tCKL
tCKH
tCKRF
CLKIN Width Low
CLKIN Width High
CLKIN Rise/Fall (0.4 V to 2.0 V)
CCLK Period
7.51
7.51
3
2
tCCLK
3.01
10
3,4
tCKJ
CLKIN Jitter Tolerance
–250
+250
1 Applies only for CLK_CFG1–0 = 00 and default values for PLL control bits in PMCTL.
2 Any changes to PLL control bits in the PMCTL register must meet core clock timing specification tCCLK
3 Actual input jitter should be combined with ac specifications for accurate timing analysis.
4 Jitter specification is maximum peak-to-peak time interval error (TIE) jitter.
.
tCKJ
tCK
CLKIN
tCKH
tCKL
Figure 8. Clock Input
Clock Signals
The ADSP-2136x can use an external clock or a crystal. See the
CLKIN pin description in Table 4 on Page 12. The user applica-
tion program can configure the ADSP-2136x to use its internal
clock generator by connecting the necessary components to the
CLKIN and XTAL pins. Figure 9 shows the component connec-
tions used for a fundamental frequency crystal operating in
parallel mode.
ADSP-2136x
R1
XTAL
CLKIN
1M⍀*
R2
47⍀*
C1
22pF
C2
22pF
Note that the clock rate is achieved using a 16.67 MHz crystal
and a PLL multiplier ratio 16:1 (CCLK:CLKIN achieves a clock
speed of 266.72 MHz). To achieve the full core clock rate, pro-
grams need to configure the multiplier bits in the
PMCTL register.
Y1
24.576MHz
R2 SHOULD BE CHOSEN TO LIMIT CRYSTAL
DRIVE POWER. REFER TO CRYSTAL
MANUFACTURER’S SPECIFICATIONS
*TYPICAL VALUES
Figure 9. 333 MHz Operation (Fundamental Mode Crystal)
Rev. C
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ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Reset
Table 15. Reset
Parameter
Min
Max
Unit
Timing Requirements
1
tWRST
tSRST
RESET Pulse Width Low
RESET Setup Before CLKIN Low
4tCK
8
ns
ns
1 Applies after the power-up sequence is complete. At power-up, the processor’s internal phase-locked loop requires no more than 100 μs while RESET is low, assuming stable
VDD and CLKIN (not including start-up time of external clock oscillator).
CLKIN
tSRST
tWRST
RESET
Figure 10. Reset
Interrupts
The following timing specification applies to the FLAG0,
FLAG1, and FLAG2 pins when they are configured as IRQ0,
IRQ1, and IRQ2 interrupts.
Table 16. Interrupts
Parameter
Min
2 × tPCLK +2
Max
Unit
Timing Requirement
tIPW
IRQx Pulse Width
ns
DAI20
FLAG2
(IRQ2 0)
-1
-
0
-
tIPW
Figure 11. Interrupts
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ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Core Timer
The following timing specification applies to FLAG3 when it is
configured as the core timer (CTIMER).
Table 17. Core Timer
Parameter
Min
Max
Unit
Switching Characteristic
tWCTIM
CTIMER Pulse Width
2 × tPCLK – 1
ns
tWCTIM
FLAG3
(CTIMER)
Figure 12. Core Timer
Timer PWM_OUT Cycle Timing
The following timing specification applies to Timer0, Timer1,
and Timer2 in PWM_OUT (pulse-width modulation) mode.
Timer signals are routed to the DAI_P20–1 pins through the
SRU. Therefore, the timing specifications provided below are
valid at the DAI_P20–1 pins.
Table 18. Timer PWM_OUT Timing
Parameter
Min
Max
2(231 – 1) tPCLK
Unit
Switching Characteristic
tPWMO
Timer Pulse Width Output
2 tPCLK – 1
ns
tPWMO
DAI_P20
(TIMER2
-1
-
0)
Figure 13. Timer PWM_OUT Timing
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ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Timer WDTH_CAP Timing
The following timing specification applies to Timer0, Timer1,
and Timer2 in WDTH_CAP (pulse width count and capture)
mode. Timer signals are routed to the DAI_P20–1 pins through
the SRU. Therefore, the timing specification provided below are
valid at the DAI_P20–1 pins.
Table 19. Timer Width Capture Timing
Parameter
Min
Max
Unit
Timing Requirement
tPWI
Timer Pulse Width
2 tPCLK
2(231– 1) tPCLK
ns
tPWI
DAI_P20-1
(TIMER2-0)
Figure 14. Timer Width Capture Timing
DAI Pin to Pin Direct Routing
For direct pin connections only (for example, DAI_PB01_I to
DAI_PB02_O).
Table 20. DAI Pin to Pin Routing
Parameter
Min
Max
Unit
Timing Requirement
tDPIO
Delay DAI Pin Input Valid to DAI Output Valid
1.5
10
ns
DAI_Pn
DAI_Pm
tDPIO
Figure 15. DAI Pin to Pin Direct Routing
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ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
inputs and outputs are not directly routed to/from DAI pins (via
Precision Clock Generator (Direct Pin Routing)
pin buffers) there is no timing data available. All timing param-
eters and switching characteristics apply to external DAI pins
(DAI_P01 – DAI_P20).
This timing is only valid when the SRU is configured such that
the precision clock generator (PCG) takes its inputs directly
from the DAI pins (via pin buffers) and sends its outputs
directly to the DAI pins. For the other cases, where the PCG’s
Table 21. Precision Clock Generator (Direct Pin Routing)
K and B Grade
Max
Y Grade
Parameter
Min
Max
Unit
Timing Requirements
tPCGIP
tSTRIG
Input Clock Period
20
ns
ns
PCG Trigger Setup Before Falling
Edge of PCG Input Clock
4.5
tHTRIG
PCG Trigger Hold After Falling
Edge of PCG Input Clock
3
ns
Switching Characteristics
tDPCGIO PCG Output Clock and Frame Sync
Active Edge Delay After PCG Input
Clock
2.5
10
10
ns
ns
ns
ns
tDTRIGCLK PCG Output Clock Delay After PCG
Trigger
2.5 + (2.5 × tPCGIP
)
10 + (2.5 × tPCGIP
)
12 + (2.5 × tPCGIP
)
tDTRIGFS
PCG Frame Sync Delay After PCG
Trigger
2.5 + ((2.5 – PH) × tPCGIP
2 × tPCGIP – 1
)
10 + ((2.5 – PH) × tPCGIP
)
12 + ((2.5 – PH) × tPCGIP)
1
tPCGOP
Output Clock Period
PH = FSxPHASE. For more information, see the ADSP-2136x SHARC Processor Hardware Reference, “Precision Clock Generators” chapter.
1 In normal mode, tPCGOP (min) = 2 × tPCGIP
.
tSTRIG
tHTRIG
DAI_Pn
PCG_TRIGx_I
tPCGIP
DAI_Pm
PCG_EXTx_I
(CLKIN)
tDPCGIO
DAI_Py
PCG_CLKx_O
tDTRIGCLK
tDPCGIO
tPCGOP
DAI_Pz
PCG_FSx_O
tDTRIGFS
Figure 16. Precision Clock Generator (Direct Pin Routing)
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ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Flags
The timing specifications provided below apply to the FLAG3–0
and DAI_P20–1 pins, the parallel port, and the serial peripheral
interface (SPI). See Table 4, “Pin Descriptions,” on Page 12 for
more information on flag use.
Table 22. Flags
Parameter
Min
Max
Unit
ns
Timing Requirement
tFIPW
Switching Characteristic
tFOPW FLAG3–0 OUT Pulse Width
FLAG3–0 IN Pulse Width
2 × tPCLK + 3
2 × tPCLK – 1
ns
DAI_P20
(FLAG3
(DATA31
-1
-0 )
IN
-
0)
tFIPW
DAI_P20
(FLAG3
(DATA31
-
OUT
1
-
0
)
-
0)
tFOPW
Figure 17. Flags
Rev. C
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ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Memory Read—Parallel Port
Use these specifications for asynchronous interfacing to memo-
ries (and memory-mapped peripherals) when the ADSP-2136x
is accessing external memory space.
Table 23. 8-Bit Memory Read Cycle
K and B Grade
Y Grade
Max
Parameter
Min
Max
Min
Unit
Timing Requirements
tDRS
tDRH
tDAD
AD7–0 Data Setup Before RD High
3.3
0
4.5
0
ns
ns
AD7–0 Data Hold After RD High
AD15–8 Address to AD7–0 Data Valid
D + tPCLK – 5.0
D + tPCLK – 5.0 ns
Switching Characteristics
tALEW ALE Pulse Width
2 × tPCLK – 2.0
2 × tPCLK – 2.0
tPCLK – 2.5
ns
ns
ns
1
tADAS
tRRH
AD15–0 Address Setup Before ALE Deasserted tPCLK – 2.5
Delay Between RD Rising Edge to Next
Falling Edge
H + tPCLK – 1.4
H + tPCLK – 1.4
tALERW
tRWALE
ALE Deasserted to Read Asserted
Read Deasserted to ALE Asserted
AD15–0 Address Hold After ALE Deasserted
ALE Deasserted to AD7–0 Address in High-Z
RD Pulse Width
2 × tPCLK – 3.8
F + H + 0.5
tPCLK – 2.3
tPCLK
2 × tPCLK – 3.8
F + H + 0.5
tPCLK – 2.3
tPCLK
ns
ns
ns
1
tADAH
tALEHZ
tRW
1
tPCLK + 3.0
tPCLK + 3.8
ns
ns
ns
ns
ns
D – 2.0
D – 2.0
tRDDRV
tADRH
tDAWH
AD7–0 ALE Address Drive After Read High
AD15–8 Address Hold After RD High
AD15–8 Address to RD High
F + H + tPCLK – 2.3
H
F + H + tPCLK – 2.3
H
D + tPCLK – 4.0
D + tPCLK – 4.0
D = (data cycle duration = the value set by the PPDUR Bits (5–1) in the PPCTL register) × tPCLK
H = tPCLK (if a hold cycle is specified, else H = 0)
F = 7 × tPCLK (if FLASH_MODE is set, else F = 0)
t
PCLK = (peripheral) clock period = 2 × tCCLK
1 On reset, ALE is an active high cycle. However, it can be configured by software to be active low.
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ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
tRWALE
tALERW
tALEW
ALE
tRRH
RD
tRW
tRDDRV
WR
tDAWH
tADRH
tADAS
tADAH
VALID
ADDRESS
AD15-8
VALID ADDRESS
VALID ADDRESS
VALID ADDRESS
tDRS tDRH
tDAD
VALID
ADDRESS
VALID
DATA
VALID
DATA
VALID ADDRESS
AD7-0
tALEHZ
NOTE: MEMORY READS ALWAYS OCCUR IN GROUPS OF FOUR
BETWEEN ALE CYCLES. THIS FIGURE ONLY SHOWS TWO MEMORY
READS IN ORDER TO PROVIDE THE NECESSARY TIMING INFORMATION.
Figure 18. Read Cycle for 8-Bit Memory Timing
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ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Table 24. 16-Bit Memory Read Cycle
K and B Grade
Y Grade
Parameter
Min
Max
Min
Max
Unit
Timing Requirements
tDRS
tDRH
AD15–0 Data Setup Before RD High
AD15–0 Data Hold After RD High
3.3
0
4.5
0
ns
ns
Switching Characteristics
tALEW ALE Pulse Width
2 × tPCLK – 2.0
2 × tPCLK – 2.0
tPCLK – 2.5
ns
ns
ns
ns
1
tADAS
AD15–0 Address Setup Before ALE Deasserted tPCLK – 2.5
tALERW
ALE Deasserted to Read Asserted
2 × tPCLK – 3.8
H + tPCLK – 1.4
2 × tPCLK – 3.8
H + tPCLK – 1.4
2
tRRH
Delay Between RD Rising Edge to Next Falling
Edge
tRWALE
tRDDRV
Read Deasserted to ALE Asserted
F + H + 0.5
F + H + 0.5
ns
ns
ns
ns
ns
ALE Address Drive After Read High
AD15–0 Address Hold After ALE Deasserted
F + H + tPCLK – 2.3
tPCLK – 2.3
F + H + tPCLK – 2.3
tPCLK – 2.3
1
tADAH
tALEHZ
tRW
ALE Deasserted to Address/Data15–0 in High-Z tPCLK
RD Pulse Width D – 2.0
tPCLK + 3.0 tPCLK
D – 2.0
tPCLK + 3.8
1
D = (data cycle duration = the value set by the PPDUR Bits (5–1) in the PPCTL register) × tPCLK
H = tPCLK (if a hold cycle is specified, else H = 0)
F = 7 × tPCLK (if FLASH_MODE is set, else F = 0)
t
PCLK = (peripheral) clock period = 2 × tCCLK
1 On reset, ALE is an active high cycle. However, it can be configured by software to be active low.
2 This parameter is only available when in EMPP = 0 mode.
tRWALE
tALERW
tALEW
ALE
tRRH
RD
tRW
WR
tRDDRV
tALEHZ
tADAH
tDRS
tDRH
tADAS
VALID
ADDRESS
AD15-0
VALID DATA
VALID DATA
VALID ADDRESS
NOTE: FOR 16-BIT MEMORY READS, WHEN EMPP ꢀ 0, ONLY ONE RD PULSE OCCURS BETWEEN ALE CYCLES.
WHEN EMPP = 0, MULTIPLE RD PULSES OCCUR BETWEEN ALE CYCLES. FOR COMPLETE INFORMATION,
SEE THE ADSP-2136X SHARC PROCESSOR HARDWARE REFERENCE.
Figure 19. Read Cycle for 16-Bit Memory Timing
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ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Memory Write—Parallel Port
Use these specifications for asynchronous interfacing to memo-
ries (and memory-mapped peripherals) when the
ADSP-2136x is accessing external memory space.
Table 25. 8-Bit Memory Write Cycle
K and B Grade
Min
Y Grade
Parameter
Min
Unit
Switching Characteristics:
tALEW
ALE Pulse Width
2 × tPCLK – 2.0
tPCLK – 2.8
2 × tPCLK – 2.0
tPCLK – 2.8
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
1
tADAS
tALERW
tRWALE
tWRH
AD15–0 Address Setup Before ALE Deasserted
ALE Deasserted to Write Asserted
Write Deasserted to ALE Asserted
Delay Between WR Rising Edge to Next WR Falling Edge
AD15–0 Address Hold After ALE Deasserted
WR Pulse Width
2 × tPCLK – 3.8
H + 0.5
2 × tPCLK – 3.8
H + 0.5
F + H + tPCLK – 2.3
tPCLK – 0.5
F + H + tPCLK – 2.3
tPCLK – 0.5
1
tADAH
tWW
D – F – 2.0
tPCLK – 2.8
D – F – 2.0
tPCLK – 3.5
tADWL
tADWH
tDWS
AD15–8 Address to WR Low
AD15–8 Address Hold After WR High
AD7–0 Data Setup Before WR High
AD7–0 Data Hold After WR High
AD15–8 Address to WR High
H
H
D – F + tPCLK – 4.0
H
D – F + tPCLK – 4.0
H
tDWH
tDAWH
D – F + tPCLK – 4.0
D – F + tPCLK – 4.0
D = (data cycle duration = the value set by the PPDUR Bits (5–1) in the PPCTL register) × tPCLK
.
H = tPCLK (if a hold cycle is specified, else H = 0)
F = 7 × tPCLK (if FLASH_MODE is set, else F = 0). If FLASH_MODE is set, D must be ≥ 9 × tPCLK
PCLK = (peripheral) clock period = 2 × tCCLK
.
t
1 On reset, ALE is an active high cycle. However, it can be configured by software to be active low.
tALERW
tALEW
ALE
tRWALE
tWW
WR
tWRH
tADWL
tDAWH
RD
tADAS
tADAH
tADWH
VALID
ADDRESS
AD15
AD7
-
-
8
VALID ADDRESS
VALID ADDRESS
tDWH
tDWS
VALID
ADDRESS
VALID DATA
VALID DATA
0
NOTE: MEMORY WRITES ALWAYS OCCUR IN GROUPS OF FOUR
BETWEEN ALE CYCLES. THIS FIGURE ONLY SHOWS TWO MEMORY
WRITES IN ORDER TO PROVIDE THE NECESSARY TIMING INFORMATION.
Figure 20. Write Cycle for 8-Bit Memory Timing
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ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Table 26. 16-Bit Memory Write Cycle
K and B Grade
Y Grade
Parameter
Min
Min
Unit
Switching Characteristics
tALEW
ALE Pulse Width
2 × tPCLK – 2.0
tPCLK – 2.5
2 × tPCLK – 2.0
tPCLK – 2.5
ns
ns
ns
ns
ns
ns
ns
ns
ns
1
tADAS
AD15–0 Address Setup Before ALE Deasserted
ALE Deasserted to Write Asserted
tALERW
2 × tPCLK – 3.8
H + 0.5
2 × tPCLK – 3.8
H + 0.5
tRWALE
Write Deasserted to ALE Asserted
2
tWRH
Delay Between WR Rising Edge to Next WR Falling Edge
AD15–0 Address Hold After ALE Deasserted
WR Pulse Width
F + H + tPCLK – 2.3
tPCLK – 2.3
F + H + tPCLK – 2.3
tPCLK – 2.3
1
tADAH
tWW
tDWS
tDWH
D – F – 2.0
D – F + tPCLK – 4.0
H
D – F – 2.0
D – F + tPCLK – 4.0
H
AD15–0 Data Setup Before WR High
AD15–0 Data Hold After WR High
D = (data cycle duration = the value set by the PPDUR Bits (5–1) in the PPCTL register) × tPCLK
.
H = tPCLK (if a hold cycle is specified, else H = 0)
F = 7 × tPCLK (if FLASH_MODE is set, else F = 0). If FLASH_MODE is set, D must be ≥ 9 × tPCLK
.
t
PCLK = (peripheral) clock period = 2 × tCCLK
1 On reset, ALE is an active high cycle. However, it can be configured by software to be active low.
2 This parameter is only available when in EMPP = 0 mode.
tALEW
tALERW
ALE
tRWALE
tWW
WR
RD
tWRH
tDWH
tADAS
tADAH
VALID
ADDRESS
VALID
ADDRESS
AD15-0
VALID DATA
tDWS
VALID DATA
NOTE: FOR 16-BIT MEMORY WRITES, WHEN EMPP ꢀ 0, ONLY ONE WR PULSE OCCURS BETWEEN ALE CYCLES.
WHEN EMPP = 0, MULTIPLE WR PULSES OCCUR BETWEEN ALE CYCLES. FOR COMPLETE INFORMATION,
SEE THE ADSP-2136X SHARC PROCESSOR HARDWARE REFERENCE.
Figure 21. Write Cycle for 16-Bit Memory Timing
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ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Serial Ports
To determine whether communication is possible between two
devices at clock speed n, the following specifications must be
confirmed: 1) frame sync delay and frame sync setup and hold,
2) data delay and data setup and hold, and 3) SCLK width.
Serial port signals (SCLK, FS, data channel A, data channel B)
are routed to the DAI_P20–1 pins using the SRU. Therefore, the
timing specifications provided below are valid at the
DAI_P20–1 pins.
Table 27. Serial Ports—External Clock
K and B Grade
Y Grade
Parameter
Min
Max
Max
Unit
Timing Requirements
1
tSFSE
FS Setup Before SCLK
(Externally Generated FS in Either Transmit or Receive Mode)
2.5
ns
1
tHFSE
FS Hold After SCLK
(Externally Generated FS in Either Transmit or Receive Mode)
2.5
2.5
2.5
12
ns
ns
ns
ns
ns
1
tSDRE
Receive Data Setup Before Receive SCLK
Receive Data Hold After SCLK
SCLK Width
1
tHDRE
tSCLKW
tSCLK
SCLK Period
24
Switching Characteristics
2
tDFSE
FS Delay After SCLK
(Internally Generated FS in Either Transmit or Receive Mode)
9.5
9.5
11
11
ns
2
tHOFSE
FS Hold After SCLK
(Internally Generated FS in Either Transmit or Receive Mode)
2
2
ns
ns
ns
2
2
tDDTE
tHDTE
Transmit Data Delay After Transmit SCLK
Transmit Data Hold After Transmit SCLK
1 Referenced to sample edge.
2 Referenced to drive edge.
Table 28. Serial Ports—Internal Clock
K and B Grade
Max
Y Grade
Parameter
Min
Max
Unit
Timing Requirements
1
tSFSI
FS Setup Before SCLK
(Externally Generated FS in Either Transmit or Receive Mode)
7
ns
1
tHFSI
FS Hold After SCLK
(Externally Generated FS in Either Transmit or Receive Mode)
2.5
7
ns
ns
ns
1
tSDRI
Receive Data Setup Before SCLK
Receive Data Hold After SCLK
1
tHDRI
2.5
Switching Characteristics
2
tDFSI
FS Delay After SCLK (Internally Generated FS in Transmit Mode)
3
8
3
3.5
9.5
4.0
ns
ns
ns
ns
ns
ns
ns
2
tHOFSI
FS Hold After SCLK (Internally Generated FS in Transmit Mode)
FS Delay After SCLK (Internally Generated FS in Receive Mode)
FS Hold After SCLK (Internally Generated FS in Receive Mode)
Transmit Data Delay After SCLK
–1.0
–1.0
–1.0
2
tDFSIR
2
tHOFSIR
2
tDDTI
2
tHDTI
Transmit Data Hold After SCLK
tSCLKIW
Transmit or Receive SCLK Width
0.5tSCLK – 2 0.5tSCLK + 2 0.5tSCLK + 2
1 Referenced to the sample edge.
2 Referenced to drive edge.
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ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Table 29. Serial Ports—Enable and Three-State
K and B Grade
Y Grade
Parameter
Min
2
Max
Max
Unit
Switching Characteristics
1
tDDTEN
Data Enable from External Transmit SCLK
ns
ns
ns
1
tDDTTE
Data Disable from External Transmit SCLK
7
8.5
1
tDDTIN
Data Enable from Internal Transmit SCLK
–1
1 Referenced to drive edge.
Table 30. Serial Ports—External Late Frame Sync
K and B Grade
Max
Y Grade
Parameter
Min
Max
Unit
Switching Characteristics
1
tDDTLFSE
Data Delay from Late External Transmit FS or
External Receive FS with MCE = 1, MFD = 0
9
10.5
ns
ns
1
tDDTENFS
Data Enable for MCE = 1, MFD = 0
0.5
1 The tDDTLFSE and tDDTENFS parameters apply to left-justified sample pair as well as DSP serial mode, and MCE = 1, MFD = 0.
EXTERNAL RECEIVE FS WITH MCE = 1, MFD = 0
DRIVE
SAMPLE
DRIVE
DAI_P20-1
(SCLK)
tSFSE/I
tHFSE/I
DAI_P20-1
(FS)
tDDTE/I
tDDTENFS
tHDTE/I
1ST BIT
DAI_P20-1
(DATA CHANNEL A/B)
2ND BIT
tDDTLFSE
LATE EXTERNAL TRANSMIT FS
DRIVE
SAMPLE
DRIVE
tHFSE/I
DAI_P20
(SCLK)
-1
tSFSE/I
DAI_P20-1
(FS)
tDDTE/I
tDDTENFS
tHDTE/I
1ST BIT
DAI_P20
(DATA CHANNEL A/B)
-1
2ND BIT
tDDTLFSE
NOTE: SERIAL PORT SIGNALS (SCLK, FS, DATA CHANNEL A/B) ARE ROUTED TO THE DAI_P20-1 PINS
USING THE SRU. THE TIMING SPECIFICATIONS PROVIDED HERE ARE VALID AT THE DAI_P20-1 PINS.
Figure 22. External Late Frame Sync1
1 This figure reflects changes made to support left-justified sample pair mode.
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ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
DATA RECEIVE—INTERNAL CLOCK
DRIVE EDGE SAMPLE EDGE
DATA RECEIVE—EXTERNAL CLOCK
DRIVE EDGE SAMPLE EDGE
tSCLKIW
tSCLKW
DAI_P20
-
1
DAI_P20-1
(SCLK)
(SCLK)
tDFSIR
tDFSE
tHFSE
tHFSI
tSFSI
tSFSE
tHOFSR
tHOFSE
DAI_P20-1
DAI_P20-1
(FS)
(FS)
tHDRE
tSDRI
tHDRI
tSDRE
DAI_P20
(DATA CHANNEL A/B)
-
1
DAI_P20
(DATA CHANNEL A/B)
-1
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF SCLK (EXTERNAL), SCLK (INTERNAL) CAN BE USED AS THE ACTIVE SAMPLING EDGE.
DATA TRANSMIT—INTERNAL CLOCK
DRIVE EDGE SAMPLE EDGE
DATA TRANSMIT—EXTERNAL CLOCK
DRIVE EDGE SAMPLE EDGE
tSCLKIW
tSCLKW
DAI_P20-1
DAI_P20-1
(SCLK)
(SCLK)
tDFSI
tDFSE
tHFSI
tHOFSI
tSFSI
tHOFSE
tSFSE
tHFSE
DAI_P20
-
1
DAI_P20-1
(FS)
(FS)
tDDTE
tDDTI
tHDTE
tHDTI
DAI_P20
-
1
DAI_P20-1
(DATA CHANNEL A/B)
(DATA CHANNEL A/B)
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF SCLK (EXTERNAL), SCLK (INTERNAL) CAN BE USED AS THE ACTIVE SAMPLING EDGE.
DRIVE EDGE
DRIVE EDGE
DAI_P20-1
SCLK
SCLK (EXT)
tDDTEN
tDDTTE
DAI_P20-1
(DATA CHANNEL A/B)
DRIVE EDGE
DAI_P20-1
SCLK (INT)
tDDTIN
DAI_P20-1
(DATA CHANNEL A/B)
Figure 23. Serial Ports
Rev. C
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September 2007
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Input Data Port (IDP)
The timing requirements for the IDP are given in Table 31. IDP
signals (SCLK, FS, SDATA) are routed to the DAI_P20–1 pins
using the SRU. Therefore, the timing specifications provided
below are valid at the DAI_P20–1 pins.
Table 31. IDP
Parameter
Min
Max
Unit
Timing Requirements
1
tSISFS
FS Setup Before SCLK Rising Edge
3
ns
ns
ns
ns
ns
ns
1
tSIHFS
FS Hold After SCLK Rising Edge
SDATA Setup Before SCLK Rising Edge
SDATA Hold After SCLK Rising Edge
Clock Width
3
1
tSISD
3
1
tSIHD
tIDPCLKW
tIDPCLK
3
9
Clock Period
24
1
DATA, SCLK, FS can come from any of the DAI pins. SCLK and FS can also come via PCG or SPORTs. PCG’s input can be either CLKIN or any of the DAI pins.
SAMPLE EDGE
tIDPCLK
tIDPCLKW
DAI_P20-1
(SCLK)
tSISFS
tSIHFS
DAI_P20
-1
(FS)
tSISD
tSIHD
DAI_P20
-
1
(SDATA)
Figure 24. IDP Master Timing
Rev. C
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ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Reference. Note that the most significant 16 bits of external
PDAP data can be provided through either the parallel port
AD15–0 or the DAI_P20–5 pins. The remaining 4 bits can only
be sourced through DAI_P4–1. The timing below is valid at the
DAI_P20–1 pins or at the AD15–0 pins.
Parallel Data Acquisition Port (PDAP)
The timing requirements for the PDAP are provided in
Table 32. PDAP is the parallel mode operation of Channel 0 of
the IDP. For details on the operation of the IDP, see the IDP
chapter of the ADSP-2136x SHARC Processor Hardware
Table 32. Parallel Data Acquisition Port (PDAP)
Parameter
Min
Max
Unit
Timing Requirements
1
tSPCLKEN
PDAP_CLKEN Setup Before PDAP_CLK Sample Edge
PDAP_CLKEN Hold After PDAP_CLK Sample Edge
PDAP_DAT Setup Before SCLK PDAP_CLK Sample Edge
PDAP_DAT Hold After SCLK PDAP_CLK Sample Edge
Clock Width
2.5
2.5
3.0
2.5
7.0
24
ns
ns
ns
ns
ns
ns
1
tHPCLKEN
1
tPDSD
1
tPDHD
tPDCLKW
tPDCLK
Clock Period
Switching Characteristics
tPDHLDD Delay of PDAP Strobe After Last PDAP_CLK Capture Edge for a Word
tPDSTRB PDAP Strobe Pulse Width
2 × tPCLK – 1
ns
ns
2 × tPCLK – 1.5
1
Source pins of DATA are AD7–0, DATA7–0, or DAI pins. Source pins for SCLK and FS are: 1) DAI pins, 2) CLKIN through PCG, or 3) DAI pins through PCG.
SAMPLE EDGE
tPDCLK
tPDCLKW
DAI_P20
-1
(PDAP_CLK)
tSPCLKEN
tHPCLKEN
DAI_P20-1
(PDAP_CLKEN)
tPDSD
tPDHD
DATA
DAI_P20
(PDAP_STROBE)
-1
tPDSTRB
tPDHLDD
Figure 25. PDAP Timing
Rev. C
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ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Pulse-Width Modulation Generators
Table 33. PWM Timing
Parameter
Min
Max
Unit
Switching Characteristics
tPWMW
tPWMP
PWM Output Pulse Width
tPCLK – 2
(216 – 2) × tPCLK – 2
(216 – 1) × tPCLK
ns
ns
PWM Output Period
2 × tPCLK – 1.5
tPWMW
PWM
OUTPUTS
tPWMP
Figure 26. PWM Timing
Sample Rate Converter—Serial Input Port
The SRC input signals (SCLK, FS, and SDATA) are routed from
the DAI_P20–1 pins using the SRU. Therefore, the timing spec-
ifications provided in Table 34 are valid at the DAI_P20–1 pins.
This feature is not available on the ADSP-21363 models.
Table 34. SRC, Serial Input Port
Parameter
Min
Max
Unit
Timing Requirements
1
tSRCSFS
FS Setup Before SCLK Rising Edge
FS Hold After SCLK Rising Edge
SDATA Setup Before SCLK Rising Edge
SDATA Hold After SCLK Rising Edge
Clock Width
3
ns
ns
ns
ns
ns
ns
1
tSRCHFS
3
1
tSRCSD
3
1
tSRCHD
tSRCCLKW
tSRCCLK
3
36
80
Clock Period
1
DATA, SCLK, FS can come from any of the DAI pins. SCLK and FS can also come via PCG or SPORTs. PCG’s input can be either CLKIN or any of the DAI pins.
SAMPLE EDGE
tSRCCLK
tSRCCLKW
DAI_P20
(SCLK)
-
1
tSRCSFS
tSRCHFS
DAI_P20-1
(FS)
tSRCSD
tSRCHD
DAI_P20
-
1
(SDATA)
Figure 27. SRC Serial Input Port Timing
Rev. C
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September 2007
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Sample Rate Converter—Serial Output Port
For the serial output port, the frame-sync is an input and should
meet setup and hold times with regard to SCLK on the output
port. The serial data output, SDATA, has a hold time and delay
specification with regard to SCLK. Note that SCLK rising edge is
the sampling edge and the falling edge is the drive edge.
Table 35. SRC, Serial Output Port
K and B Grade
Max
Y Grade
Parameter
Min
Max
Unit
Timing Requirements
1
tSRCSFS
FS Setup Before SCLK Rising Edge
FS Hold After SCLK Rising Edge
3
3
ns
ns
1
tSRCHFS
Switching Characteristics
1
tSRCTDD
Transmit Data Delay After SCLK Falling Edge
Transmit Data Hold After SCLK Falling Edge
10.5
12.5
ns
ns
1
tSRCTDH
2
1
DATA, SCLK, FS can come from any of the DAI pins. SCLK and FS can also come via PCG or SPORTs. PCG’s input can be either CLKIN or any of the DAI pins.
SAMPLE EDGE
tSRCCLK
tSRCCLKW
DAI_P20-1
(SCLK)
tSRCSFS
tSRCHFS
DAI_P20
-1
(FS)
tSRCTDD
DAI_P20
-
1
(SDATA)
tSRCTDH
Figure 28. SRC Serial Output Port Timing
Rev. C
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September 2007
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
S/PDIF Transmitter—Serial Input Waveforms
S/PDIF Transmitter
Figure 29 shows the right-justified mode. LRCLK is HI for the
left channel and LO for the right channel. Data is valid on the
rising edge of SCLK. The MSB is delayed 12-bit clock periods
(in 20-bit output mode) or 16-bit clock periods (in 16-bit output
mode) from an LRCLK transition, so that when there are
64 SCLK periods per LRCLK period, the LSB of the data will be
right-justified to the next LRCLK transition.
Serial data input to the S/PDIF transmitter can be formatted as
left-justified, I2S, or right-justified with word widths of 16, 18,
20, or 24 bits. The following sections provide timing for the
transmitter. This feature is not available on the
ADSP-21363 models.
LRCLK
RIGHT CHANNEL
LEFT CHANNEL
SCLK
SDATA
LSB
MSB MSB-1 MSB-2
LSB+2 LSB+1
LSB
MSB MSB-1 MSB-2
LSB+2 LSB+1
LSB
Figure 29. Right -Justified Mode
Figure 30 shows the default I2S-justified mode. LRCLK is LO for
the left channel and HI for the right channel. Data is valid on the
rising edge of SCLK. The MSB is left-justified to an LRCLK
transition but with a single SCLK period delay.
RIGHT CHANNEL
LRCLK
LEFT CHANNEL
SCLK
MSB MSB-1 MSB-2
LSB+2 LSB+1 LSB
MSB
MSB-1 MSB-2
LSB+2 LSB+1 LSB
MSB
SDATA
Figure 30. I2S-Justified Mode
Figure 31 shows the left-justified mode. LRCLK is HI for the left
channel and LO for the right channel. Data is valid on the rising
edge of SCLK. The MSB is left-justified to an LRCLK transition
with no MSB delay.
LRCLK
RIGHT CHANNEL
LEFT CHANNEL
SCLK
SDATA
LSB+2 LSB+1 LSB
MSB
MSB-1 MSB-2
LSB+2 LSB+1
LSB
MSB
MSB-1 MSB-2
MSB MSB+1
Figure 31. Left-Justified Mode
Rev. C
|
Page 38 of 56
|
September 2007
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
S/PDIF Transmitter Input Data Timing
The timing requirements for the input port are given in
Table 36. Input signals (SCLK, FS, and SDATA) are routed to
the DAI_P20–1 pins using the SRU. Therefore, the timing spec-
ifications provided below are valid at the DAI_P20–1 pins.
Table 36. S/PDIF Transmitter Input Data Timing
K and B Grade
Min
Y Grade
Max
Parameter
Min
Unit
Timing Requirements
1
tSISFS
FS Setup Before SCLK Rising Edge
FS Hold After SCLK Rising Edge
SDATA Setup Before SCLK Rising Edge
SDATA Hold After SCLK Rising Edge
Clock Width
3
3
ns
ns
ns
ns
ns
ns
ns
ns
1
tSIHFS
3
3
1
tSISD
3
3
1
tSIHD
tSISCLKW
tSISCLK
tSITXCLKW
tSITXCLK
3
3
36
80
9
36
80
9.5
20
Clock Period
Transmit Clock Width
Transmit Clock Period
20
1
DATA, SCLK, FS can come from any of the DAI pins. SCLK and FS can also come via PCG or SPORTs. PCG’s input can be either CLKIN or any of the DAI pins.
tSITXCLKW
tSITXCLK
SAMPLE EDGE
DAI_P20
-1
(TXCLK)
tSISCLKW
DAI_P20
-1
(SCLK)
tSIHFS
tSISFS
DAI_P20
-1
(FS)
tSISD
tSIHD
DAI_P20
-
1
(SDATA)
Figure 32. S/PDIF Transmitter Input Timing
Oversampling Clock (TXCLK) Switching Characteristics
S/PDIF Transmitter has an oversampling clock. This TXCLK
input is divided down to generate the biphase clock.
Table 37. Oversampling Clock (TXCLK) Switching Characteristics
Parameter
Min
Max
Unit
MHz
MHz
kHz
TXCLK Frequency for TXCLK = 384 × FS
TXCLK Frequency for TXCLK = 256 × FS
Frame Rate
73.8
49.2
192.0
Rev. C
|
Page 39 of 56
|
September 2007
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
S/PDIF Receiver
The following section describes timing as it relates to the
S/PDIF receiver. This feature is not available on the
ADSP-21363 models.
Internal Digital PLL Mode
In the internal digital phase-locked loop mode the internal PLL
(digital PLL) generates the 512 × FS clock.
Table 38. S/PDIF Receiver Output Timing (Internal Digital PLL Mode)
Parameter
Min
Max
Unit
Switching Characteristics
tDFSI
LRCLK Delay After SCLK
LRCLK Hold After SCLK
5
5
ns
ns
ns
ns
ns
tHOFSI
tDDTI
tHDTI
–2
Transmit Data Delay After SCLK
Transmit Data Hold After SCLK
Transmit SCLK Width
–2
38
1
tSCLKIW
1 SCLK frequency is 64 × FS where FS = the frequency of LRCLK.
DRIVE EDGE
SAMPLE EDGE
tSCLKIW
DAI_P20
(SCLK)
-
1
1
tDFSI
tHOFSI
DAI_P20
-
(FS)
tDDTI
tHDTI
DAI_P20-1
(DATA CHANNEL A/B)
Figure 33. SPDIF Receiver Internal Digital PLL Mode Timing
Rev. C
|
Page 40 of 56
|
September 2007
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
SPI Interface—Master
The ADSP-2136x contains two SPI ports. The primary has dedi-
cated pins and the secondary is available through the DAI. The
timing provided in Table 39 and Table 40 applies to both.
Table 39. SPI Interface Protocol—Master Switching and Timing Specifications
K and B Grade
Y Grade
Parameter
Min
Max Min
Max
Unit
Timing Requirements
tSSPIDM
tSSPIDM
tHSPIDM
Data Input Valid to SPICLK Edge (Data Input Setup Time)
Data Input Valid to SPICLK Edge (Data Input Setup Time) (SPI2)
SPICLK Last Sampling Edge to Data Input Not Valid
5.2
8.2
2
6.2
9.5
2
ns
ns
ns
Switching Characteristics
tSPICLKM
tSPICHM
tSPICLM
tDDSPIDM
tDDSPIDM
tHDSPIDM
tSDSCIM
tSDSCIM
tHDSM
Serial Clock Cycle
8 × tPCLK – 2
4 × tPCLK – 2
4 × tPCLK – 2
8 × tPCLK – 2
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Serial Clock High Period
4 × tPCLK – 2
4 × tPCLK – 2
Serial Clock Low Period
SPICLK Edge to Data Out Valid (Data Out Delay Time)
SPICLK Edge to Data Out Valid (Data Out Delay Time) (SPI2)
SPICLK Edge to Data Out Not Valid (Data Out Hold Time)
FLAG3–0IN (SPI Device Select) Low to First SPICLK Edge
FLAG3–0IN (SPI Device Select) Low to First SPICLK Edge (SPI2)
Last SPICLK Edge to FLAG3–0IN High
3.0
8.0
3.0
9.5
4 × tPCLK – 2
4 × tPCLK – 2.5
4 × tPCLK – 2.5
4 × tPCLK – 2
4 × tPCLK – 1
4 × tPCLK – 2
4 × tPCLK – 3.0
4 × tPCLK – 3.0
4 × tPCLK – 2
4 × tPCLK – 1
tSPITDM
Sequential Transfer Delay
FLAG3-0
(OUTPUT)
tSDSCIM
tSPICHM
tSPICLM
tSPICHM
tDDSPIDM
tSPICLKM
tHDSM
tSPITDM
SPICLK
(CP = 0)
(OUTPUT)
tSPICLM
SPICLK
(CP = 1)
(OUTPUT)
tHDSPIDM
MOSI
(OUTPUT)
MSB
LSB
tSSPIDM
tSSPIDM
CPHASE = 1
tHSPIDM
tHSPIDM
MISO
MSB
LSB
(INPUT)
VALID
VALID
tHDSPIDM
tDDSPIDM
MOSI
(OUTPUT)
MSB
LSB
tSSPIDM
tHSPIDM
CPHASE = 0
MSB
VALID
LSB
VALID
MISO
(INPUT)
Figure 34. SPI Master Timing
Rev. C
|
Page 41 of 56
|
September 2007
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
SPI Interface—Slave
Table 40. SPI Interface Protocol—Slave Switching and Timing Specifications
K and B Grade
Y Grade
Parameter
Min
Max
Max
Unit
Timing Requirements
tSPICLKS
tSPICHS
tSPICLS
tSDSCO
Serial Clock Cycle
4 × tPCLK – 2
2 × tPCLK – 2
2 × tPCLK – 2
ns
ns
ns
Serial Clock High Period
Serial Clock Low Period
SPIDS Assertion to First SPICLK Edge
CPHASE = 0
CPHASE = 1
2 × tPCLK
2 × tPCLK
ns
ns
tHDS
Last SPICLK Edge to SPIDS Not Asserted, CPHASE = 0
Data Input Valid to SPICLK Edge (Data Input Setup Time)
SPICLK Last Sampling Edge to Data Input Not Valid
SPIDS Deassertion Pulse Width (CPHASE = 0)
2 × tPCLK
ns
ns
ns
ns
tSSPIDS
tHSPIDS
tSDPPW
2
2
2 × tPCLK
Switching Characteristics
tDSOE SPIDS Assertion to Data Out Active
0
0
0
0
5
5
ns
ns
ns
ns
ns
ns
ns
1
tDSOE
tDSDHI
SPIDS Assertion to Data Out Active (SPI2)
8
9
SPIDS Deassertion to Data High Impedance
SPIDS Deassertion to Data High Impedance (SPI2)
SPICLK Edge to Data Out Valid (Data Out Delay Time)
5
5.5
10
11.0
1
tDSDHI
8.6
9.5
tDDSPIDS
tHDSPIDS
tDSOV
SPICLK Edge to Data Out Not Valid (Data Out Hold Time) 2 × tPCLK
SPIDS Assertion to Data Out Valid (CPHASE = 0)
5 × tPCLK
5 × tPCLK
1 The timing fortheseparameters applies when the SPI is routedthroughthesignal routingunit. For moreinformation, seetheADSP-2136xSHARCProcessor HardwareReference,
“Serial Peripheral Interface Port” chapter.
Rev. C
|
Page 42 of 56
|
September 2007
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
SPIDS
(INPUT)
tSPIC HS
tSPICLS
tSPICLKS
tHDS
tSDPPW
SPICLK
(CP = 0)
(INPUT)
tSPICLS
tSDSCO
tSPICHS
SPICLK
(CP = 1)
(INPUT)
tDSDHI
tHDSPIDS
tDDSPIDS
tDSOE
tDDSPIDS
MISO
(OUTPUT)
MSB
LSB
tHSPIDS
CPHASE = 1
tSSPIDS
tSSPIDS
MOSI
(INPUT)
MSB VALID
LSB VALID
tDSOV
tDSO E
tHDSPIDS
tDDSPIDS
tDSDHI
MISO
(OUTPUT)
LSB
MSB
tHSPIDS
CPHASE = 0
tSSPIDS
MOSI
(INPUT)
MSB VALID
LSB VALID
Figure 35. SPI Slave Timing
Rev. C
|
Page 43 of 56
|
September 2007
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
JTAG Test Access Port and Emulation
Table 41. JTAG Test Access Port and Emulation
Parameter
Min
Max
Unit
Timing Requirements
tTCK
TCK Period
tCK
5
ns
ns
ns
ns
ns
ns
tSTAP
tHTAP
TDI, TMS Setup Before TCK High
TDI, TMS Hold After TCK High
System Inputs Setup Before TCK High
System Inputs Hold After TCK High
TRST Pulse Width
6
1
tSSYS
7
1
tHSYS
tTRSTW
Switching Characteristics
tDTDO TDO Delay from TCK Low
System Outputs Delay After TCK Low
18
4tCK
7
ns
ns
2
tDSYS
tCK ÷ 2 + 7
1 System Inputs = AD15–0, SPIDS, CLK_CFG1–0, RESET, BOOT_CFG1–0, MISO, MOSI, SPICLK, DAI_Px, FLAG3–0.
2 System Outputs = MISO, MOSI, SPICLK, DAI_Px, AD15–0, RD, WR, FLAG3–0, CLKOUT, EMU, ALE.
tTCK
TCK
tSTAP
tHTAP
TMS
TDI
tDTDO
TDO
tSSYS
tHSYS
SYSTEM
INPUTS
tDSYS
SYSTEM
OUTPUTS
Figure 36. IEEE 1149.1 JTAG Test Access Port
Rev. C
|
Page 44 of 56
|
September 2007
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
OUTPUT DRIVE CURRENTS
CAPACITIVE LOADING
Figure 37 shows typical I-V characteristics for the output driv-
ers of the ADSP-2136x. The curves represent the current drive
capability of the output drivers as a function of output voltage.
Output delays and holds are based on standard capacitive loads:
30 pF on all pins (see Figure 38). Figure 42 shows graphically
how output delays and holds vary with load capacitance. The
graphs of Figure 40, Figure 41, and Figure 42 may not be linear
outside the ranges shown for Typical Output Delay vs. Load
Capacitance and Typical Output Rise Time (20% to 80%,
V = Min) vs. Load Capacitance.
40
V
OH
30
3.3V, +25°C
3.47V, -45°C
20
12
10
10
0
3.11V, +125°C
RISE
y = 0.0467x + 1.6323
FALL
-
10
8
3.11V, +125°C
-
20
3.3V, +25°C
3.5
6
V
-
-
30
OL
3.47V,
-
45°C
40
4
y = 0.045x + 1.524
0
0.5
1.0
1.5
2.0
2.5
3.0
SWEEP (VDDEXT) VOLTAGE (V)
2
0
Figure 37. ADSP-2136x Typical Drive
50
100
150
200
250
0
TEST CONDITIONS
LOAD CAPACITANCE (pF)
The ac signal specifications (timing parameters) appear in
Table 15 on Page 21 through Table 41 on Page 44. These include
output disable time, output enable time, and capacitive loading.
The timing specifications for the SHARC apply for the voltage
reference levels in Figure 38.
Figure 40. Typical Output Rise/Fall Time
(20% to 80%, VDDEXT = Max)
Timing is measured on signals when they cross the 1.5 V level as
described in Figure 39. All delays (in nanoseconds) are mea-
sured between the point that the first signal reaches 1.5 V and
the point that the second signal reaches 1.5 V.
12
10
RISE
y = 0.049x + 1.5105
FALL
8
6
4
2
0
50⍀
TO
OUTPUT
PIN
1.5V
y = 0.0482x + 1.4604
30pF
Figure 38. Equivalent Device Loading for AC Measurements
(Includes All Fixtures)
0
50
100
150
200
250
LOAD CAPACITANCE (pF)
Figure 41. Typical Output Rise/Fall Time
(20% to 80%, VDDEXT = Min)
INPUT
OR
1.5V
1.5V
OUTPUT
Figure 39. Voltage Reference Levels for AC Measurements
Rev. C
|
Page 45 of 56
|
September 2007
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Values of θJC are provided for package comparison and PCB
design considerations when an exposed pad is required. Note
that the thermal characteristics values provided in Table 42
throughTable 44 are modeled values.
10
8
Y = 0.0488x
-1.5923
6
Table 42. Thermal Characteristics for BGA (No Thermal vias
in PCB)
4
Parameter
θJA
θJMA
θJMA
θJC
ΨJT
ΨJMT
ΨJMT
Condition
Typical
25.40
21.90
20.90
5.07
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
2
0
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
-
-
2
4
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
0.140
0.330
0.410
0
50
100
150
200
LOAD CAPACITANCE (pF)
Figure 42. Typical Output Delay or Hold vs. Load Capacitance
(at Ambient Temperature)
Table 43. Thermal Characteristics for BGA (Thermal vias in
PCB)
Parameter
θJA
θJMA
θJMA
θJC
ΨJT
ΨJMT
ΨJMT
Condition
Typical
23.40
20.00
19.20
5.00
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
THERMAL CHARACTERISTICS
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
The ADSP-2136x processor is rated for performance over the
temperature range specified in Operating Conditions
on Page 16.
Table 42 through Table 44 airflow measurements comply with
JEDEC standards JESD51-2 and JESD51-6 and the junction-to-
board measurement complies with JESD51-8. Test board and
thermal via design comply with JEDEC standards JESD51-9
(BGA) and JESD51-5 (LQFP_EP). The junction-to-case mea-
surement complies with MIL-STD-883. All measurements use a
2S2P JEDEC test board.
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
0.130
0.300
0.360
Table 44. Thermal Characteristics for LQFP_EP (with
Exposed Pad Soldered to PCB)
Industrial applications using the BGA package require thermal
vias, to an embedded ground plane, in the PCB. Refer to JEDEC
standard JESD51-9 for printed circuit board thermal ball land
and thermal via design information.
Parameter
θJA
θJMA
θJMA
θJC
ΨJT
ΨJMT
ΨJMT
Condition
Typical
16.80
14.20
13.50
7.25
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Industrial applications using the LQFP_EP package require
thermal trace squares and thermal vias, to an embedded ground
plane, in the PCB. Refer to JEDEC standard JESD51-5 for more
information.
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
0.51
0.72
To determine the junction temperature of the device while on
the application PCB, use:
0.80
TJ = TT + (ΨJT × PD)
where:
TJ = junction temperature (°C)
TT = case temperature (°C) measured at the top center of the
package
ΨJT = junction-to-top (of package) characterization parameter
is the typical value from Table 42 through Table 44.
PD = power dissipation Estimating Power for the ADSP-21362
SHARC Processors (EE-277) for more information.
Values of θJA are provided for package comparison and PCB
design considerations.
Rev. C
|
Page 46 of 56
|
September 2007
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
144-LEAD LQFP PIN CONFIGURATIONS
The following table shows the ADSP-2136x’s pin names and
their default function after reset (in parentheses).
Table 45. LQFP Pin Assignments
Pin Name
VDDINT
Pin No.
1
Pin Name
VDDINT
GND
RD
Pin No.
37
Pin Name
VDDEXT
Pin No.
73
Pin Name
GND
VDDINT
GND
VDDINT
GND
VDDINT
GND
VDDEXT
GND
VDDINT
GND
VDDINT
RESET
SPIDS
GND
VDDINT
SPICLK
MISO
MOSI
GND
VDDINT
VDDEXT
AVDD
Pin No.
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
CLK_CFG0
CLK_CFG1
BOOT_CFG0
BOOT_CFG1
GND
2
38
GND
74
3
39
VDDINT
75
4
ALE
40
GND
76
5
AD15
AD14
AD13
GND
VDDEXT
AD12
VDDINT
GND
AD11
AD10
AD9
41
DAI_P10 (SD2B)
DAI_P11 (SD3A)
DAI_P12 (SD3B)
DAI_P13 (SCLK3)
DAI_P14 (SFS3)
DAI_P15 (SD4A)
VDDINT
77
6
42
78
VDDEXT
GND
7
43
79
8
44
80
VDDINT
9
45
81
GND
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
46
82
VDDINT
47
83
GND
48
GND
84
VDDINT
49
GND
85
GND
50
DAI_P16 (SD4B)
DAI_P17 (SD5A)
DAI_P18 (SD5B)
DAI_P19 (SCLK5)
VDDINT
86
FLAG0
FLAG1
AD7
51
87
AD8
52
88
DAI_P1 (SD0A) 53
89
GND
VDDINT
GND
54
55
90
VDDINT
GND
91
GND
DAI_P2 (SD0B) 56
DAI_P3 (SCLK0) 57
GND
92
VDDEXT
GND
VDDEXT
93
GND
58
59
60
61
62
DAI_P20 (SFS5)
GND
94
VDDINT
VDDEXT
95
AD6
VDDINT
VDDINT
96
AVSS
AD5
GND
FLAG2
97
GND
AD4
DAI_P4 (SFS0)
FLAG3
98
RESETOUT/CLKOUT 134
VDDINT
DAI_P5 (SD1A) 63
DAI_P6 (SD1B) 64
DAI_P7 (SCLK1) 65
VDDINT
99
EMU
TDO
TDI
135
136
137
138
139
140
141
142
143
144
GND
GND
100
101
102
103
104
105
106
107
108
AD3
VDDINT
AD2
VDDINT
66
67
68
69
70
GND
TRST
TCK
VDDEXT
GND
GND
VDDINT
VDDINT
GND
TMS
GND
CLKIN
XTAL
VDDEXT
AD1
GND
VDDINT
AD0
DAI_P8 (SFS1)
GND
WR
DAI_P9 (SD2A) 71
VDDINT 72
VDDINT
VDDINT
VDDINT
Rev. C
|
Page 47 of 56
|
September 2007
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
136-BALL BGA PIN CONFIGURATIONS
The following table shows the ADSP-2136x’s pin names and
their default function after reset (in parentheses).
Table 46. BGA Pin Assignments
Ball Name
CLK_CFG0
XTAL
Ball No. Ball Name
Ball No. Ball Name
Ball No. Ball Name
Ball No.
D01
D02
D04
D05
D06
D09
D10
D11
D13
D14
A01
A02
A03
A04
A05
A06
A07
A08
A09
A10
A11
A12
A13
A14
E01
E02
E04
E05
E06
E09
E10
E11
E13
E14
CLK_CFG1
GND
B01
B02
B03
B04
B05
B06
B07
B08
B09
B10
B11
B12
B13
B14
F01
F02
F04
F05
F06
F09
F10
F11
F13
F14
BOOT_CFG1
BOOT_CFG0
GND
C01
C02
C03
C12
C13
C14
VDDINT
GND
GND
GND
GND
GND
GND
GND
GND
VDDINT
TMS
VDDEXT
TCK
CLKIN
TRST
GND
TDI
GND
RESETOUT/CLKOUT
TDO
AVSS
VDDINT
AVDD
EMU
VDDEXT
MOSI
MISO
SPIDS
VDDINT
SPICLK
RESET
VDDINT
GND
GND
GND
GND
GND
VDDINT
FLAG1
FLAG0
GND
AD7
G01
G02
G13
G14
AD6
H01
H02
H13
H14
GND
VDDINT
VDDEXT
GND
VDDEXT
DAI_P18 (SD5B)
DAI_P17 (SD5A)
GND
GND
DAI_P19 (SCLK5)
GND
GND
GND
GND
GND
GND
GND
GND
GND
FLAG2
DAI_P20 (SFS5)
FLAG3
Rev. C
|
Page 48 of 56
|
September 2007
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Table 46. BGA Pin Assignments (Continued)
Ball Name
AD5
Ball No. Ball Name
Ball No. Ball Name
Ball No. Ball Name
Ball No.
M01
J01
AD3
K01
K02
K04
K05
K06
K09
K10
K11
K13
K14
P01
P02
P03
P04
P05
P06
P07
P08
P09
P10
P11
P12
P13
P14
AD2
L01
L02
L04
L05
L06
L09
L10
L11
L13
L14
AD0
AD4
J02
VDDINT
AD1
WR
M02
GND
J04
GND
GND
GND
M03
GND
J05
GND
GND
GND
M12
GND
J06
GND
GND
DAI_P12 (SD3B)
DAI_P13 (SCLK3)
M13
GND
J09
GND
GND
M14
GND
J10
GND
GND
GND
J11
GND
GND
VDDINT
J13
GND
GND
DAI_P16 (SD4B)
AD15
J14
DAI_P15 (SD4A)
AD14
DAI_P14 (SFS3)
N01
N02
N03
N04
N05
N06
N07
N08
N09
N10
N11
N12
N13
N14
ALE
AD13
RD
AD12
VDDINT
AD11
VDDEXT
AD10
AD8
AD9
VDDINT
DAI_P1 (SD0A)
DAI_P3 (SCLK0)
DAI_P5 (SD1A)
DAI_P6 (SD1B)
DAI_P7 (SCLK1)
DAI_P8 (SFS1)
DAI_P9 (SD2A)
DAI_P11 (SD3A)
DAI_P2 (SD0B)
VDDEXT
DAI_P4 (SFS0)
VDDINT
VDDINT
GND
DAI_P10 (SD2B)
Rev. C
|
Page 49 of 56
|
September 2007
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
14 13 12 11 10
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
KEY
V
V
A
VDD
DDINT
GND*
A
I/O SIGNALS
DDEXT
VSS
*USE THE CENTER BLOCK OF GROUND PINS TO PROVIDE
THERMAL PATHWAYS TO YOUR PRINTED
CIRCUIT BOARD’S GROUND PLANE.
Figure 43. BGA Pin Assignments (Bottom View, Summary)
1
2
3
4
5
6
7
8
9
10 11 12 13 14
A
B
C
D
E
F
G
H
J
K
L
M
N
P
KEY
V
V
A
VDD
DDINT
GND*
A
I/O SIGNALS
DDEXT
VSS
*USE THE CENTER BLOCK OF GROUND PINS TO PROVIDE
THERMAL PATHWAYS TO YOUR PRINTED
CIRCUIT BOARD’S GROUND PLANE.
Figure 44. BGA Pin Assignments (Top View, Summary)
Rev. C
|
Page 50 of 56
|
September 2007
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
OUTLINE DIMENSIONS
The ADSP-2136x is available in 136-ball BGA and 144-lead
exposed pad (LQFP_EP) packages.
22.20
22.00 SQ
21.80
20.20
20.00 SQ
19.80
1.60 MAX
0.75
0.60
0.45
109
108
109
108
144
144
1
1
SEATING
PLANE
PIN 1
EXPOSED*
PAD
8.80 SQ
TOP VIEW
(PINS DOWN)
1.45
1.40
1.35
0.20
0.09
7°
3.5°
0°
BOTTOM VIEW
(PINS UP)
0.15
0.05
COPLANARITY
36
73
73
36
0.08
72
72
37
37
0.27
0.22
0.17
VIEW A
0.50
VIEW A
BSC
ROTATED 90° CCW
LEAD PITCH
COMPLIANT TO JEDEC STANDARDS MS-026-BFB-HD
*EXPOSED PAD IS COINCIDENT WITH BOTTOM SURFACE AND
DOES NOT PROTRUDE BEYOND IT. EXPOSED PAD IS CENTERED.
Figure 45. 144-Lead Low Profile Quad Flat Package, Exposed Pad [LQFP_EP] (SW-144-1)
Dimensions shown in millimeters
Rev. C
|
Page 51 of 56
|
September 2007
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
A1 CORNER
INDEX AREA
12.10
12.00 SQ
11.90
13
11
9
7
5
3
1
14
12
10
8
6
4
2
A
B
C
D
E
F
BALL A1
INDICATOR
10.40
BSC SQ
TOP VIEW
G
J
BOTTOM VIEW
0.80 BSC
H
K
L
M
N
P
DETAIL A
1.70 MAX
1.31
1.21
1.10
DETAIL A
0.25 MIN
0.12 MAX
COPLANARITY
*
0.50
0.45
0.40
SEATING
PLANE
BALL DIAMETER
*
COMPLIANT WITH JEDEC STANDARDS MO-205-AE
WITH EXCEPTION TO BALL DIAMETER.
Figure 46. 136-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-136)
Dimensions shown in millimeters
SURFACE MOUNT DESIGN
Table 47 is provided as an aide to PCB design. For industry-
standard design recommendations, refer to IPC-7351, Generic
Requirements for Surface Mount Design and Land Pattern
Standard.
Table 47. BGA Data for Use with Surface Mount Design
Package
Ball Attach Type
Solder Mask Opening
Ball Pad Size
136-Ball CSP_BGA (BC-136)
Solder Mask Defined
0.40 mm diameter
0.53 mm diameter
Rev. C
|
Page 52 of 56
|
September 2007
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
ORDERING GUIDE
Operating
Voltage
Temperature
Range1
Instruction On-Chip
Internal/
External
Package
Description
Model
ADSP-21362KBC-1AA2
ADSP-21362KBCZ-1AA2, 3
ADSP-21362BBC-1AA2
Rate
SRAM
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
ROM
Package Option
0°C to +70°C
0°C to +70°C
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
4M Bit 1.2 V/3.3 V 136-Ball CSP_BGA BC-136
4M Bit 1.2 V/3.3 V 136-Ball CSP_BGA BC-136
4M Bit 1.2 V/3.3 V 136-Ball CSP_BGA BC-136
4M Bit 1.2 V/3.3 V 136-Ball CSP_BGA BC-136
4M Bit 1.2 V/3.3 V 136-Ball CSP_BGA BC-136
4M Bit 1.2 V/3.3 V 144-Lead LQFP_EP SW-144-1
4M Bit 1.2 V/3.3 V 144-Lead LQFP_EP SW-144-1
4M Bit 1.2 V/3.3 V 144-Lead LQFP_EP SW-144-1
4M Bit 1.0 V/3.3 V 144-Lead LQFP_EP SW-144-1
4M Bit 1.0 V/3.3 V 144-Lead LQFP_EP SW-144-1
4M Bit 1.2 V/3.3 V 136-Ball CSP_BGA BC-136
4M Bit 1.2 V/3.3 V 136-Ball CSP_BGA BC-136
4M Bit 1.2 V/3.3 V 144-Lead LQFP_EP SW-144-1
4M Bit 1.2 V/3.3 V 136-Ball CSP_BGA BC-136
4M Bit 1.2 V/3.3 V 136-Ball CSP_BGA BC-136
4M Bit 1.2 V/3.3 V 136-Ball CSP_BGA BC-136
4M Bit 1.2 V/3.3 V 144-Lead LQFP_EP SW-144-1
4M Bit 1.2 V/3.3 V 144-Lead LQFP_EP SW-144-1
4M Bit 1.0 V/3.3 V 144-Lead LQFP_EP SW-144-1
4M Bit 1.0 V/3.3 V 144-Lead LQFP_EP SW-144-1
4M Bit 1.2 V/3.3 V 136-Ball CSP_BGA BC-136
4M Bit 1.2 V/3.3 V 136-Ball CSP_BGA BC-136
4M Bit 1.2 V/3.3 V 144-Lead LQFP_EP SW-144-1
4M Bit 1.2 V/3.3 V 136-Ball CSP_BGA BC-136
4M Bit 1.2 V/3.3 V 136-Ball CSP_BGA BC-136
4M Bit 1.2 V/3.3 V 136-Ball CSP_BGA BC-136
4M Bit 1.2 V/3.3 V 144-Lead LQFP_EP SW-144-1
4M Bit 1.2 V/3.3 V 144-Lead LQFP_EP SW-144-1
4M Bit 1.0 V/3.3 V 144-Lead LQFP_EP SW-144-1
4M Bit 1.0 V/3.3 V 144-Lead LQFP_EP SW-144-1
4M Bit 1.2 V/3.3 V 136-Ball CSP_BGA BC-136
4M Bit 1.2 V/3.3 V 136-Ball CSP_BGA BC-136
4M Bit 1.2 V/3.3 V 136-Ball CSP_BGA BC-136
4M Bit 1.2 V/3.3 V 136-Ball CSP_BGA BC-136
4M Bit 1.2 V/3.3 V 136-Ball CSP_BGA BC-136
4M Bit 1.2 V/3.3 V 144-Lead LQFP_EP SW-144-1
4M Bit 1.2 V/3.3 V 144-Lead LQFP_EP SW-144-1
4M Bit 1.0 V/3.3 V 144-Lead LQFP_EP SW-144-1
4M Bit 1.0 V/3.3 V 144-Lead LQFP_EP SW-144-1
4M Bit 1.0 V/3.3 V 144-Lead LQFP_EP SW-144-1
4M Bit 1.0 V/3.3 V 144-Lead LQFP_EP SW-144-1
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
0°C to +70°C
–40°C to +85°C
–40°C to +85°C
–40°C to +105°C 200 MHz
–40°C to +105°C 200 MHz
0°C to +70°C
ADSP-21362BBCZ-1AA2, 3
ADSP-21362WBBCZ-1A2, 3
ADSP-21362KSWZ-1AA2
ADSP-21362BSWZ-1AA2, 3
ADSP-21362WBSWZ-1A2, 3, 4
ADSP-21362YSWZ-2AA2, 3
ADSP-21362WYSWZ-2A2, 3, 4
ADSP-21363KBC-1AA
ADSP-21363KBCZ-1AA3
ADSP-21363KSWZ-1AA3
ADSP-21363BBC-1AA
ADSP-21363BBCZ-1AA3
ADSP-21363WBBCZ-1A3
ADSP-21363BSWZ-1AA3
ADSP-21363WBSWZ-1A3, 4
ADSP-21363YSWZ-2AA3, 4
ADSP-21363WYSWZ-2A3, 4
ADSP-21364KBC-1AA
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
0°C to +70°C
0°C to +70°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +105°C 200 MHz
–40°C to +105°C 200 MHz
0°C to +70°C
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
ADSP-21364KBCZ-1AA3
ADSP-21364KSWZ-1AA3
ADSP-21364BBC–1AA
0°C to +70°C
0°C to +70°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +105°C 200 MHz
–40°C to +105°C 200 MHz
0°C to +70°C
ADSP-21364BBCZ-1AA3
ADSP-21364WBBCZ-1A3
ADSP-21364BSWZ-1AA3
ADSP-21364WBSWZ-1A3, 4
ADSP-21364YSWZ-2AA3
ADSP-21364WYSWZ-2A3, 4
ASDP-21365KBC-1AA2, 5, 6
ASDP-21365KBCZ-1AA2, 3, 5, 6
ASDP-21365BBC-1AA2, 5, 6
ASDP-21365BBCZ-1AA2, 3, 5, 6
ASDP-21365WBBCZ-1A2, 3, 5, 6
ADSP-21365BSWZ-1AA2, 3, 5, 6
ADSP-21365WBSWZ-1A2, 4, 5, 6
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
0°C to +70°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +105°C 200 MHz
–40°C to +105°C 200 MHz
–40°C to +105°C 200 MHz
ADSP-21365YSWZ-2AA2, 3, 5, 6
ADSP-21365YSWZ-2CA2, 3, 5, 6
ADSP-21365WYSWZ-2A2, 3, 5, 6
-
ADSP-21365WYSWZ-2C2, 3, 4, 5, 6 –40°C to +105°C 200 MHz
Rev. C
|
Page 53 of 56
|
September 2007
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Operating
Voltage
Temperature
Range1
Instruction On-Chip
Internal/
External
Package
Description
Model
Rate
SRAM
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
ROM
Package Option
ADSP-21366KBC-1AA5, 6
ADSP-21366KBCZ-1AA3, 5, 6
ADSP-21366KSWZ-1AA3, 5, 6
ADSP-21366BBC–1AA5, 6
ADSP-21366BBCZ-1AA3, 5, 6
ADSP-21366WBBCZ-1A3, 5, 6
ADSP-21366BSWZ-1AA3, 5, 6
ADSP-21366WBSWZ-1A3, 4, 5, 6
ADSP-21366YSWZ-2AA3, 5, 6
ADSP-21366WYSWZ-2A3, 4, 5, 6
0°C to +70°C
0°C to +70°C
0°C to +70°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
4M Bit 1.2 V/3.3 V 136-Ball CSP_BGA BC-136
4M Bit 1.2 V/3.3 V 136-Ball CSP_BGA BC-136
4M Bit 1.2 V/3.3 V 144-Lead LQFP_EP SW-144-1
4M Bit 1.2 V/3.3 V 136-Ball CSP_BGA BC-136
4M Bit 1.2 V/3.3 V 136-Ball CSP_BGA BC-136
4M Bit 1.2 V/3.3 V 136-Ball CSP_BGA BC-136
4M Bit 1.2 V/3.3 V 144-Lead LQFP_EP SW-144-1
4M Bit 1.2 V/3.3 V 144-Lead LQFP_EP SW-144-1
4M Bit 1.0 V/3.3 V 144-Lead LQFP_EP SW-144-1
4M Bit 1.0 V/3.3 V 144-Lead LQFP_EP SW-144-1
–40°C to +105°C 200 MHz
–40°C to +105°C 200 MHz
1 Referenced temperature is ambient temperature.
2 License from DTLA required for these products.
3 Z = RoHS compliant part.
4 W = For quoting purposes only. Contact local sales office for specific ordering information.
5 Available with a wide variety of audio algorithm combinations sold as part of a chipset and bundled with necessary software. For a complete list, visit our website at
www.analog.com/SHARC.
6 License from Dolby Laboratories, Inc. and Digital Theater Systems (DTS) required for these products.
Rev. C
|
Page 54 of 56
|
September 2007
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Rev. C
|
Page 55 of 56
|
September 2007
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
©2007 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D06359-0-9/07(C)
Rev. C
|
Page 56 of 56
|
September 2007
相关型号:
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