ADSP-2183KST-133 [ADI]

DSP Microcomputer; 微电脑DSP
ADSP-2183KST-133
型号: ADSP-2183KST-133
厂家: ADI    ADI
描述:

DSP Microcomputer
微电脑DSP

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a
DSP Microcomputer  
ADSP-2183  
FUNCTIONAL BLOCK DIAGRAM  
FEATURES  
PERFORMANCE  
19 ns Instruction Cycle Time from 26.32 MHz Crystal  
@ 3.3 Volts  
52 MIPS Sustained Performance  
Single-Cycle Instruction Execution  
Single-Cycle Context Switch  
3-Bus Architecture Allows Dual Operand Fetches in  
Every Instruction Cycle  
POWERDOWN  
PROGRAMMABLE  
CONTROL  
I/O  
FLAGS  
MEMORY  
DATA ADDRESS  
GENERATORS  
PROGRAM  
SEQUENCER  
PROGRAM  
MEMORY  
DATA  
MEMORY  
BYTE DMA  
CONTROLLER  
DAG 1 DAG 2  
EXTERNAL  
ADDRESS  
BUS  
PROGRAM MEMORY ADDRESS  
DATA MEMORY ADDRESS  
Multifunction Instructions  
PROGRAM MEMORY DATA  
DATA MEMORY DATA  
Power-Down Mode Featuring Low CMOS Standby  
Power Dissipation with 300 Cycle Recovery from  
Power-Down Condition  
EXTERNAL  
DATA  
BUS  
ARITHMETIC UNITS  
SERIAL PORTS  
SPORT 0 SPORT 1  
INTERNAL  
DMA  
PORT  
TIMER  
Low Power Dissipation in Idle Mode  
ALU MAC SHIFTER  
DMA  
BUS  
INTEGRATION  
ADSP-2100 Family Code Compatible, with Instruction  
Set Extensions  
ADSP-2100 BASE  
ARCHITECTURE  
80K Bytes of On-Chip RAM, Configured as  
16K Words On-Chip Program Memory RAM  
16K Words On-Chip Data Memory RAM  
Dual Purpose Program Memory for Both Instruction  
and Data Storage  
Independent ALU, Multiplier/Accumulator, and Barrel  
Shifter Computational Units  
Two Independent Data Address Generators  
Powerful Program Sequencer Provides  
Zero Overhead Looping  
Conditional Instruction Execution  
Programmable 16-Bit Interval Timer with Prescaler  
128-Lead LQFP, 144-Ball Mini-BGA  
GENERAL DESCRIPTION  
The ADSP-2183 is a single-chip microcomputer optimized for  
digital signal processing (DSP) and other high speed numeric  
processing applications.  
The ADSP-2183 combines the ADSP-2100 family base architec-  
ture (three computational units, data address generators and  
a program sequencer) with two serial ports, a 16-bit internal  
DMA port, a byte DMA port, a programmable timer, Flag I/O,  
extensive interrupt capabilities, and on-chip program and  
data memory.  
The ADSP-2183 integrates 80K bytes of on-chip memory con-  
figured as 16K words (24-bit) of program RAM, and 16K words  
(16-bit) of data RAM. Power-down circuitry is also provided to  
meet the low power needs of battery operated portable equipment.  
The ADSP-2183 is available in 128-lead LQFP, and 144-Ball  
Mini-BGA packages.  
SYSTEM INTERFACE  
16-Bit Internal DMA Port for High Speed Access to  
On-Chip Memory  
4 MByte Memory Interface for Storage of Data Tables  
and Program Overlays  
In addition, the ADSP-2183 supports new instructions, which  
include bit manipulations—bit set, bit clear, bit toggle, bit test—  
new ALU constants, new multiplication instruction (x squared),  
biased rounding, result free ALU operations, I/O memory trans-  
fers and global interrupt masking, for increased flexibility.  
8-Bit DMA to Byte Memory for Transparent  
Program and Data Memory Transfers  
I/O Memory Interface with 2048 Locations Supports  
Parallel Peripherals  
Programmable Memory Strobe and Separate I/O  
Memory Space Permits “Glueless” System Design  
Programmable Wait State Generation  
Two Double-Buffered Serial Ports with Companding  
Hardware and Automatic Data Buffering  
Automatic Booting of On-Chip Program Memory from  
Byte-Wide External Memory, e.g., EPROM, or  
Through Internal DMA Port  
Six External Interrupts  
13 Programmable Flag Pins Provide Flexible System  
Signaling  
ICE-Port™ Emulator Interface Supports Debugging  
in Final Systems  
Fabricated in a high speed, double metal, low power, CMOS  
process, the ADSP-2183 operates with a 19 ns instruction cycle  
time. Every instruction can execute in a single processor cycle.  
The ADSP-2183’s flexible architecture and comprehensive  
instruction set allow the processor to perform multiple opera-  
tions in parallel. In one processor cycle the ADSP-2183 can:  
• Generate the next program address  
• Fetch the next instruction  
• Perform one or two data moves  
• Update one or two data address pointers  
• Perform a computational operation  
ICE-Port is a trademark of Analog Devices, Inc.  
REV. C  
Information furnished by Analog Devices is believed to be accurate and  
reliable. However, no responsibility is assumed by Analog Devices for its  
use, nor for any infringements of patents or other rights of third parties  
which may result from its use. No license is granted by implication or  
otherwise under any patent or patent rights of Analog Devices.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781/329-4700  
Fax: 781/326-8703  
World Wide Web Site: http://www.analog.com  
© Analog Devices, Inc., 2000  
ADSP-2183  
This takes place while the processor continues to:  
• Receive and transmit data through the two serial ports  
• Receive and/or transmit data through the internal DMA port  
• Receive and/or transmit data through the byte DMA port  
• Decrement timer  
ARCHITECTURE OVERVIEW  
The ADSP-2183 instruction set provides flexible data moves  
and multifunction (one or two data moves with a computation)  
instructions. Every instruction can be executed in a single pro-  
cessor cycle. The ADSP-2183 assembly language uses an alge-  
braic syntax for ease of coding and readability. A comprehensive  
set of development tools supports program development.  
Development System  
The ADSP-2100 Family Development Software, a complete  
set of tools for software and hardware system development,  
supports the ADSP-2183. The assembler has an algebraic syntax  
that is easy to program and debug. The linker combines object  
files into an executable file. The simulator provides an interactive  
instruction-level simulation with a reconfigurable user interface  
to display different portions of the hardware environment.  
Figure 1 is an overall block diagram of the ADSP-2183. The  
processor contains three independent computational units: the  
ALU, the multiplier/accumulator (MAC) and the shifter. The  
computational units process 16-bit data directly and have provi-  
sions to support multiprecision computations. The ALU per-  
forms a standard set of arithmetic and logic operations; division  
primitives are also supported. The MAC performs single-cycle  
multiply, multiply/add and multiply/subtract operations with  
40 bits of accumulation. The shifter performs logical and arith-  
metic shifts, normalization, denormalization and derive  
exponent operations. The shifter can be used to efficiently  
implement numeric format control including multiword and  
block floating-point representations.  
The EZ-KIT Lite is a hardware/software kit offering a com-  
plete development environment for the ADSP-21xx family:  
an ADSP-2189M evaluation board with PC monitor software  
plus Assembler, Linker, Simulator and PROM Splitter software.  
The ADSP-2189M evaluation board is a low-cost, easy to use  
hardware platform on which you can quickly get started with  
your DSP software design. The EZ-KIT Lite include the  
following features:  
The internal result (R) bus connects the computational units so  
that the output of any unit may be the input of any unit on the  
next cycle.  
• 35.7 MHz ADSP-2189M  
• Full 16-bit Stereo Audio I/O with AD73322 CODEC  
• RS-232 Interface  
The ADSP-21xx family DSPs contain a shadow register that is  
useful for single cycle context switching of the processor.  
• EZ-ICE Connector for Emulator Control  
• DSP Demo Programs  
• Evaluation Suite of VisualDSP  
A powerful program sequencer and two dedicated data address  
generators ensure efficient delivery of operands to these compu-  
tational units. The sequencer supports conditional jumps, sub-  
routine calls and returns in a single cycle. With internal loop  
counters and loop stacks, the ADSP-2183 executes looped code  
with zero overhead; no explicit jump instructions are required to  
maintain loops.  
The ADSP-218x EZ-ICE® Emulator aids in the hardware debug-  
ging of ADSP-218x systems. The ADSP-218x integrates on-chip  
emulation support with a 14-pin ICE-Port interface. This inter-  
face provides a simpler target board connection requiring fewer  
mechanical clearance considerations than other ADSP-2100  
Family EZ-ICEs. The ADSP-218x device need not be removed  
from the target system when using the EZ-ICE, nor are any  
adapters needed. Due to the small footprint of the EZ-ICE  
connector, emulation can be supported in final board designs.  
Two data address generators (DAGs) provide addresses for  
simultaneous dual operand fetches (from data memory and  
program memory). Each DAG maintains and updates four  
address pointers. Whenever the pointer is used to access data  
(indirect addressing), it is post-modified by the value of one of  
four possible modify registers. A length value may be associated  
with each pointer to implement automatic modulo addressing  
for circular buffers.  
The EZ-ICE performs a full range of functions, including:  
• In-target operation  
• Up to 20 breakpoints  
• Single-step or full-speed operation  
Efficient data transfer is achieved with the use of five internal  
buses:  
• Program Memory Address (PMA) Bus  
• Program Memory Data (PMD) Bus  
• Data Memory Address (DMA) Bus  
• Data Memory Data (DMD) Bus  
• Result (R) Bus  
The two address buses (PMA and DMA) share a single external  
address bus, allowing memory to be expanded off-chip, and the  
two data buses (PMD and DMD) share a single external data  
bus. Byte memory space and I/O memory space also share the  
external buses.  
• Registers and memory values can be examined and altered  
• PC upload and download functions  
• Instruction-level emulation of program booting and execution  
• Complete assembly and disassembly of instructions  
• C source-level debugging  
(See Designing An EZ-ICE-Compatible Target System section  
of this data sheet for exact specifications of the EZ-ICE target  
board connector.)  
Additional Information  
This data sheet provides a general overview of ADSP-2183  
functionality. For additional information on the architecture and  
instruction set of the processor, refer to the ADSP-2100 Family  
User’s Manual, Third Edition. For more information about the  
development tools, refer to the ADSP-2100 Family Development  
Tools Data Sheet.  
Program memory can store both instructions and data, permit-  
ting the ADSP-2183 to fetch two operands in a single cycle,  
one from program memory and one from data memory. The  
ADSP-2183 can fetch an operand from program memory and  
the next instruction in the same cycle.  
EZ-ICE and SoundPort are registered trademarks of Analog Devices, Inc.  
–2–  
REV. C  
ADSP-2183  
In addition to the address and data bus for external memory  
connection, the ADSP-2183 has a 16-bit Internal DMA port  
(IDMA port) for connection to external systems. The IDMA  
port is made up of 16 data/address pins and five control pins.  
The IDMA port provides transparent, direct access to the DSPs  
on-chip program and data RAM.  
The ADSP-2183 provides up to 13 general-purpose flag pins.  
The data input and output pins on SPORT1 can be alternatively  
configured as an input flag and an output flag. In addition, eight  
flags are programmable as inputs or outputs and three flags are  
always outputs.  
A programmable interval timer generates periodic interrupts. A  
16-bit count register (TCOUNT) is decremented every n pro-  
cessor cycle, where n is a scaling value stored in an 8-bit register  
(TSCALE). When the value of the count register reaches zero,  
an interrupt is generated and the count register is reloaded from  
a 16-bit period register (TPERIOD).  
An interface to low cost byte-wide memory is provided by the  
Byte DMA port (BDMA port). The BDMA port is bidirectional  
and can directly address up to four megabytes of external RAM  
or ROM for off-chip storage of program overlays or data tables.  
The byte memory and I/O memory space interface supports  
slow memories and I/O memory-mapped peripherals with pro-  
grammable wait state generation. External devices can gain  
control of external buses with bus request/grant signals (BR,  
BGH and BG). One execution mode (Go Mode) allows the  
ADSP-2183 to continue running from on-chip memory. Normal  
execution mode requires the processor to halt while buses are  
granted.  
Serial Ports  
The ADSP-2183 incorporates two complete synchronous serial  
ports (SPORT0 and SPORT1) for serial communications and  
multiprocessor communication.  
Here is a brief list of the capabilities of the ADSP-2183  
SPORTs. Refer to the ADSP-2100 Family User’s Manual, Third  
Edition, for further details.  
The ADSP-2183 can respond to thirteen possible interrupts,  
eleven of which are accessible at any given time. There can be  
up to six external interrupts (one edge-sensitive, two level-  
sensitive and three configurable) and seven internal interrupts  
generated by the timer, the serial ports (SPORTs), the Byte  
DMA port and the power-down circuitry. There is also a master  
RESET signal.  
• SPORTs are bidirectional and have a separate, double-  
buffered transmit and receive section.  
• SPORTs can use an external serial clock or generate their  
own serial clock internally.  
• SPORTs have independent framing for the receive and trans-  
mit sections. Sections run in a frameless mode or with frame  
synchronization signals, internally or externally generated.  
Frame sync signals are active high or inverted, with either of  
two pulsewidths and timings.  
The two serial ports provide a complete synchronous serial inter-  
face with optional companding in hardware and a wide variety of  
framed or frameless data transmit and receive modes of operation.  
Each port can generate an internal programmable serial clock or  
accept an external serial clock.  
21xx CORE  
ADSP-2183 INTEGRATION  
2
POWER  
DOWN  
CONTROL  
LOGIC  
PROGRAM  
SRAM  
DATA  
SRAM  
16k
؋
16  
INSTRUCTION  
REGISTER  
8
16k
؋
24  
PROGRAMMABLE  
I/O  
BYTE  
DMA  
CONTROLLER  
DATA  
ADDRESS  
GENERATOR  
#2  
DATA  
ADDRESS  
GENERATOR  
#1  
3
PROGRAM  
FLAGS  
SEQUENCER  
PMA BUS  
DMA BUS  
14  
14  
PMA BUS  
14  
MUX  
DMA BUS  
EXTERNAL  
ADDRESS  
BUS  
PMD BUS  
24  
PMD BUS  
EXTERNAL  
DATA  
BUS  
BUS  
MUX  
EXCHANGE  
DMD  
BUS  
DMD BUS  
24  
16  
IN  
P
U
T
R
E
G
S
INPUT REGS  
SHIFTER  
INPUT REGS  
COMPANDING  
CIRCUITRY  
16  
INTERNAL  
DMA  
PORT  
ALU  
MAC  
TIMER  
TRANSMIT REG  
TRANSMIT REG  
OUTPUT REGS  
OUTPUT REGS  
OUTPUT REGS  
RECEIVE REG  
RECEIVE REG  
4
SERIAL  
PORT 0  
SERIAL  
PORT 0  
16  
INTERRUPTS  
R BUS  
5
5
Figure 1. Block Diagram  
–3–  
REV. C  
ADSP-2183  
• SPORTs support serial data word lengths from 3 to 16 bits  
and provide optional A-law and µ-law companding according  
to CCITT recommendation G.711.  
#
of  
Pins  
Pin  
Name(s)  
Input/  
Output Function  
• SPORT receive and transmit sections can generate unique  
interrupts on completing a data word transfer.  
CLKOUT  
SPORT0  
SPORT1  
1
5
5
O
I/O  
I/O  
Processor Clock Output.  
Serial Port I/O Pins  
Serial Port 1 or Two External  
IRQs, Flag In and Flag Out  
IDMA Port Read/Write Inputs  
IDMA Port Select  
IDMA Port Address Latch  
Enable  
IDMA Port Address/Data Bus  
IDMA Port Access Ready  
Acknowledge  
• SPORTs can receive and transmit an entire circular buffer of  
data with only one overhead cycle per data word. An interrupt  
is generated after a data buffer transfer.  
IRD, IWR  
IS  
2
1
1
I
I
I
• SPORT0 has a multichannel interface to selectively receive  
and transmit a 24 or 32 word, time-division multiplexed,  
serial bitstream.  
IAL  
• SPORT1 can be configured to have two external interrupts  
(IRQ0 and IRQ1) and the Flag In and Flag Out signals. The  
internally generated serial clock may still be used in this  
configuration.  
IAD  
IACK  
16  
1
I/O  
O
PWD  
1
1
I
O
Power-Down Control  
Power-Down Control  
Pin Descriptions  
The ADSP-2183 is available in a 128-lead LQFP package, and  
Mini-BGA.  
PWDACK  
FL0, FL1,  
FL2  
PF7:0  
EE  
EBR  
3
8
1
1
1
1
1
1
1
1
1
11  
6
O
I/O  
*
*
*
*
*
*
*
Output Flags  
Programmable I/O Pins  
(Emulator Only*)  
(Emulator Only*)  
(Emulator Only*)  
(Emulator Only*)  
(Emulator Only*)  
(Emulator Only*)  
(Emulator Only*)  
(Emulator Only*)  
(Emulator Only*)  
Ground Pins (LQFP)  
Power Supply Pins (LQFP)  
Ground Pins (Mini-BGA)  
Power Supply Pins (Mini-BGA)  
PIN FUNCTION DESCRIPTIONS  
#
of  
Pin  
Input/  
Output Function  
Name(s)  
Pins  
EBG  
Address  
14  
O
Address Output Pins for Program,  
Data, Byte, & I/O Spaces  
Data I/O Pins for Program and  
Data Memory Spaces (8 MSBs  
Are Also Used as Byte Space  
Addresses)  
Processor Reset Input  
Edge- or Level-Sensitive  
Interrupt Request  
ERESET  
EMS  
Data  
24  
I/O  
EINT  
ECLK  
ELIN  
ELOUT  
GND  
VDD  
GND  
VDD  
*
*
RESET  
IRQ2  
1
1
I
I
IRQL0,  
IRQL1  
22  
11  
2
1
I
I
Level-Sensitive Interrupt  
Requests  
Edge-Sensitive Interrupt  
Request  
*These ADSP-2183 pins must be connected only to the EZ-ICE connector in  
the target system. These pins have no function except during emulation, and  
do not require pull-up or pull-down resistors.  
IRQE  
BR  
1
1
1
1
1
1
1
1
1
1
1
1
I
Bus Request Input  
Bus Grant Output  
Bus Grant Hung Output  
Interrupts  
BG  
O
O
O
O
O
O
O
O
O
I
The interrupt controller allows the processor to respond to the  
eleven possible interrupts and reset with minimum overhead.  
The ADSP-2183 provides four dedicated external interrupt  
input pins, IRQ2, IRQL0, IRQL1 and IRQE. In addition,  
SPORT1 may be reconfigured for IRQ0, IRQ1, FLAG_IN and  
FLAG_OUT, for a total of six external interrupts. The ADSP-  
2183 also supports internal interrupts from the timer, the byte  
DMA port, the two serial ports, software and the power-down  
control circuit. The interrupt levels are internally prioritized and  
individually maskable (except power-down and reset). The  
IRQ2, IRQ0 and IRQ1 input pins can be programmed to be  
either level- or edge-sensitive. IRQL0 and IRQL1 are level-  
sensitive and IRQE is edge sensitive. The priorities and vector  
addresses of all interrupts are shown in Table I.  
BGH  
PMS  
DMS  
BMS  
IOMS  
CMS  
RD  
Program Memory Select Output  
Data Memory Select Output  
Byte Memory Select Output  
I/O Space Memory Select Output  
Combined Memory Select Output  
Memory Read Enable Output  
Memory Write Enable Output  
Memory Map Select Input  
Boot Option Control Input  
WR  
MMAP  
BMODE  
CLKIN,  
XTAL  
I
2
I
Clock or Quartz Crystal Input  
–4–  
REV. C  
ADSP-2183  
Table I. Interrupt Priority and Interrupt Vector Addresses  
Interrupt Vector  
Power-Down  
The ADSP-2183 processor has a low power feature that lets  
the processor enter a very low power dormant state through  
hardware or software control. Here is a brief list of power-  
down features. Refer to the ADSP-2100 Family User’s Manual,  
Third Edition, “System Interface” chapter for detailed  
information about the power-down feature.  
Source of Interrupt  
Address (Hex)  
Reset (or Power-Up with PUCR = 1) 0000 (Highest Priority)  
Power-Down (Nonmaskable)  
IRQ2  
002C  
0004  
IRQL1  
IRQL0  
0008  
000C  
0010  
0014  
0018  
001C  
0020  
0024  
• Quick recovery from power-down. The processor begins  
executing instructions in as few as 300 CLKIN cycles.  
SPORT0 Transmit  
SPORT0 Receive  
IRQE  
BDMA Interrupt  
SPORT1 Transmit or IRQ1  
SPORT1 Receive or IRQ0  
Timer  
• Support for an externally generated TTL or CMOS  
processor clock. The external clock can continue running  
during power-down without affecting the lowest power  
rating and 300 CLKIN cycle recovery.  
• Support for crystal operation includes disabling the oscil-  
lator to save power (the processor automatically waits 4096  
CLKIN cycles for the crystal oscillator to start and stabi-  
lize), and letting the oscillator run to allow 300 CLKIN  
cycle start-up.  
0028 (Lowest Priority)  
Interrupt routines can either be nested, with higher priority  
interrupts taking precedence, or processed sequentially. Inter-  
rupts can be masked or unmasked with the IMASK register.  
Individual interrupt requests are logically ANDed with the bits  
in IMASK; the highest priority unmasked interrupt is then  
selected. The power-down interrupt is nonmaskable.  
• Power-down is initiated by either the power-down pin  
(PWD) or the software power-down force bit.  
• Interrupt support allows an unlimited number of instruc-  
tions to be executed before optionally powering down.  
The power-down interrupt also can be used as a non-  
maskable, edge-sensitive interrupt.  
The ADSP-2183 masks all interrupts for one instruction cycle  
following the execution of an instruction that modifies the  
IMASK register. This does not affect serial port autobuffering  
or DMA transfers.  
• Context clear/save control allows the processor to con-  
tinue where it left off or start with a clean context when  
leaving the power-down state.  
The interrupt control register, ICNTL, controls interrupt nest-  
ing and defines the IRQ0, IRQ1 and IRQ2 external interrupts to  
be either edge- or level-sensitive. The IRQE pin is an external  
edge-sensitive interrupt and can be forced and cleared. The  
IRQL0 and IRQL1 pins are external level-sensitive interrupts.  
• The RESET pin also can be used to terminate  
power-down.  
• Power-down acknowledge pin indicates when the  
processor has entered power-down.  
The IFC register is a write-only register used to force and clear  
interrupts.  
Idle  
When the ADSP-2183 is in the Idle Mode, the processor  
waits indefinitely in a low power state until an interrupt  
occurs. When an unmasked interrupt occurs, it is serviced;  
execution then continues with the instruction following the  
IDLE instruction.  
On-chip stacks preserve the processor status and are automati-  
cally maintained during interrupt handling. The stacks are  
twelve levels deep to allow interrupt, loop and subroutine nesting.  
The following instructions allow global enable or disable servic-  
ing of the interrupts (including power down), regardless of the  
state of IMASK. Disabling the interrupts does not affect serial  
port autobuffering or DMA.  
Slow Idle  
The IDLE instruction is enhanced on the ADSP-2183 to  
let the processor’s internal clock signal be slowed, further  
reducing power consumption. The reduced clock frequency,  
a programmable fraction of the normal clock rate, is speci-  
fied by a selectable divisor given in the IDLE instruction.  
The format of the instruction is  
ENA INTS;  
DIS INTS;  
When the processor is reset, interrupt servicing is enabled.  
LOW POWER OPERATION  
IDLE (n);  
The ADSP-2183 has three low power modes that significantly  
reduce the power dissipation when the device operates under  
standby conditions. These modes are:  
• Power-Down  
• Idle  
where n = 16, 32, 64 or 128. This instruction keeps the  
processor fully functional, but operating at the slower clock  
rate. While it is in this state, the processor’s other internal  
clock signals, such as SCLK, CLKOUT and timer clock,  
are reduced by the same ratio. The default form of the  
instruction, when no clock divisor is given, is the standard  
IDLE instruction.  
• Slow Idle  
The CLKOUT pin may also be disabled to reduce external  
power dissipation.  
REV. C  
–5–  
ADSP-2183  
When the IDLE (n) instruction is used, it effectively slows down  
the processor’s internal clock, and thus its response time, to  
incoming interrupts. The one-cycle response time of the stan-  
dard idle state is increased by n, the clock divisor. When an  
enabled interrupt is received, the ADSP-2183 will remain in the  
idle state for up to a maximum of n processor cycles (n = 16, 32,  
64 or 128) before resuming normal operation.  
If an external clock is used, it should be a TTL-compatible  
signal running at half the instruction rate. The signal is con-  
nected to the processor’s CLKIN input. When an external clock  
is used, the XTAL input must be left unconnected.  
The ADSP-2183 uses an input clock with a frequency equal to  
half the instruction rate; a 16.67 MHz input clock yields a 30 ns  
processor cycle (which is equivalent to 33 MHz). Normally,  
instructions are executed in a single processor cycle. All device  
timing is relative to the internal instruction clock rate, which is  
indicated by the CLKOUT signal when enabled.  
When the IDLE (n) instruction is used in systems with an exter-  
nally generated serial clock (SCLK), the serial clock rate may be  
faster than the processor’s reduced internal clock rate. Under  
these conditions, interrupts must not be generated at a faster  
rate than can be serviced, due to the additional time the processor  
takes to come out of the idle state (a maximum of n processor  
cycles).  
Because the ADSP-2183 includes an on-chip oscillator circuit,  
an external crystal may be used. The crystal should be connected  
across the CLKIN and XTAL pins, with two capacitors connected  
as shown in Figure 3. Capacitor values are dependent on crystal  
type and should be specified by the crystal manufacturer. A  
parallel-resonant, fundamental frequency, microprocessor-grade  
crystal should be used.  
SYSTEM INTERFACE  
Figure 2 shows a typical basic system configuration with the  
ADSP-2183, two serial devices, a byte-wide EPROM and  
optional external program and data overlay memories. Program-  
mable wait state generation allows the processor to connect  
easily to slow peripheral devices. The ADSP-2183 also provides  
four external interrupts and two serial ports or six external inter-  
rupts and one serial port.  
A clock output (CLKOUT) signal is generated by the processor  
at the processor’s cycle rate. This can be enabled and disabled  
by the CLKODIS bit in the SPORT0 Autobuffer Control  
Register.  
ADSP-2183  
XTAL  
CLKIN  
DSP  
CLKOUT  
1/2x CLOCK  
OR  
CLKIN  
XTAL  
A
14  
13-0  
ADDR13-0  
CRYSTAL  
A0-A21  
D
23-16  
FL0-2  
PF0-7  
BYTE  
D
15-8  
24  
MEMORY  
DATA23-0  
DATA  
IRQ2  
BMS  
CS  
IRQE  
IRQL0  
IRQL1  
Figure 3. External Crystal Connections  
A
D
10-0  
ADDR  
DATA  
Reset  
23-8  
RD  
WR  
I/O  
SPACE  
SPORT1  
The RESET signal initiates a master reset of the ADSP-2183.  
The RESET signal must be asserted during the power-up se-  
quence to assure proper initialization. RESET during initial  
power-up must be held long enough to allow the internal clock  
to stabilize. If RESET is activated any time after power-up, the  
clock continues to run and does not require stabilization time.  
SCLK1  
RFS1 OR IRQ0  
(PERIPHERALS)  
SERIAL  
DEVICE  
TFS1 OR IRQ1  
DT1 OR FO  
DR1 OR FI  
IOMS  
CS  
2048 LOCATIONS  
A
13-0  
SPORT0  
SCLK0  
RFS0  
ADDR  
DATA  
OVERLAY  
MEMORY  
D
23-0  
SERIAL  
DEVICE  
TFS0  
TWO 8K  
PMS  
DMS  
CMS  
DT0  
PM SEGMENTS  
DR0  
The power-up sequence is defined as the total time required for  
the crystal oscillator circuit to stabilize after a valid VDD is ap-  
plied to the processor, and for the internal phase-locked loop  
(PLL) to lock onto the specific crystal frequency. A minimum of  
2000 CLKIN cycles ensures that the PLL has locked, but does  
not include the crystal oscillator start-up time. During this  
power-up sequence the RESET signal should be held low. On  
any subsequent resets, the RESET signal must meet the mini-  
TWO 8K  
IDMA PORT  
DM SEGMENTS  
BR  
BG  
BGH  
IRD  
IWR  
IS  
IAL  
IACK  
SYSTEM  
INTERFACE  
OR  
PWD  
CONTROLLER  
16  
PWDACK  
IAD15-0  
Figure 2. ADSP-2183 Basic System Configuration  
Clock Signals  
mum pulsewidth specification, tRSP  
.
The ADSP-2183 can be clocked by either a crystal or a TTL-  
compatible clock signal.  
The RESET input contains some hysteresis; however, if you use  
an RC circuit to generate your RESET signal, the use of an  
external Schmidt trigger is recommended.  
The CLKIN input cannot be halted, changed during operation  
or operated below the specified frequency during normal opera-  
tion. The only exception is while the processor is in the power-  
down state. For additional information, refer to Chapter 9,  
ADSP-2100 Family User’s Manual, Third Edition, for detailed  
information on this power-down feature.  
The master reset sets all internal stack pointers to the empty  
stack condition, masks all interrupts and clears the MSTAT  
register. When RESET is released, if there is no pending bus  
request and the chip is configured for booting (MMAP = 0), the  
boot-loading sequence is performed. The first instruction is  
fetched from on-chip program memory location 0x0000 once  
boot loading completes.  
–6–  
REV. C  
ADSP-2183  
Table II.  
PMOVLAY Memory A13  
Memory Architecture  
The ADSP-2183 provides a variety of memory and peripheral  
interface options. The key functional groups are Program  
Memory, Data Memory, Byte Memory and I/O.  
A12:0  
0
1
Internal  
Not Applicable Not Applicable  
Program Memory is a 24-bit-wide space for storing both  
instruction opcodes and data. The ADSP-2183 has 16K words  
of Program Memory RAM on chip and the capability of access-  
ing up to two 8K external memory overlay spaces using the  
external data bus. Both an instruction opcode and a data value  
can be read from on-chip program memory in a single cycle.  
External  
Overlay 1  
0
1
13 LSBs of Address  
Between 0x2000  
and 0x3FFF  
2
External  
13 LSBs of Address  
Between 0x2000  
and 0x3FFF  
Overlay 2  
Data Memory is a 16-bit-wide space used for the storage of  
data variables and for memory-mapped control registers. The  
ADSP-2183 has 16K words on Data Memory RAM on chip,  
consisting of 16,352 user-accessible locations and 32 memory-  
mapped registers. Support also exists for up to two 8K external  
memory overlay spaces through the external data bus.  
This organization provides for two external 8K overlay segments  
using only the normal 14 address bits. This allows for simple  
program overlays using one of the two external segments in  
place of the on-chip memory. Care must be taken in using this  
overlay space because the processor core (i.e., the sequencer)  
does not take the PMOVLAY register value into account. For  
example, if a loop operation were occurring on one of the exter-  
nal overlays, and the program changes to another external over-  
lay or internal memory, an incorrect loop operation could occur.  
In addition, care must be taken in interrupt service routines as  
the overlay registers are not automatically saved and restored on  
the processor mode stack.  
Byte Memory provides access to an 8-bit-wide memory space  
through the Byte DMA (BDMA) port. The Byte Memory inter-  
face provides access to 4 MBytes of memory by utilizing eight  
data lines as additional address lines. This gives the BDMA Port  
an effective 22-bit address range. On power-up, the DSP can  
automatically load bootstrap code from byte memory.  
I/O Space allows access to 2048 locations of 16-bit-wide data.  
It is intended to be used to communicate with parallel periph-  
eral devices such as data converters and external registers or  
latches.  
For ADSP-2100 Family compatibility, MMAP = 1 is allowed.  
In this mode, booting is disabled and overlay memory is dis-  
abled (PMOVLAY must be 0). Figure 5 shows the memory map  
in this configuration.  
Program Memory  
The ADSP-2183 contains a 16K × 24 on-chip program RAM.  
The on-chip program memory is designed to allow up to two  
accesses each cycle so that all operations can complete in a  
single cycle. In addition, the ADSP-2183 allows the use of 8K  
external memory overlays.  
PROGRAM MEMORY  
ADDRESS  
0x3FFF  
INTERNAL 8K  
(PMOVLAY = 0,  
MMAP = 1)  
0x2000  
0x1FFF  
The program memory space organization is controlled by the  
MMAP pin and the PMOVLAY register. Normally, the ADSP-  
2183 is configured with MMAP = 0 and program memory orga-  
nized as shown in Figure 4.  
8K EXTERNAL  
0x0000  
PROGRAM MEMORY  
ADDRESS  
0x3FFF  
Figure 5. Program Memory (MMAP = 1)  
Data Memory  
The ADSP-2183 has 16,352 16-bit words of internal data  
memory. In addition, the ADSP-2183 allows the use of 8K  
external memory overlays. Figure 6 shows the organization of  
the data memory.  
8K INTERNAL  
(PMOVLAY = 0,  
MMAP = 0)  
OR  
EXTERNAL 8K  
(PMOVLAY = 1 or 2,  
MMAP = 0)  
0x2000  
0x1FFF  
DATA MEMORY  
ADDRESS  
8K INTERNAL  
0x3FFF  
32 MEMORY–  
MAPPED REGISTERS  
0x0000  
0x3FEO  
0x3FDF  
Figure 4. Program Memory (MMAP = 0)  
INTERNAL  
8160 WORDS  
There are 16K words of memory accessible internally when the  
PMOVLAY register is set to 0. When PMOVLAY is set to  
something other than 0, external accesses occur at addresses  
0x2000 through 0x3FFF. The external address is generated as  
shown in Table II.  
0x2000  
0x1FFF  
8K INTERNAL  
(DMOVLAY = 0)  
OR  
EXTERNAL 8K  
(DMOVLAY = 1, 2)  
0x0000  
Figure 6. Data Memory  
REV. C  
–7–  
ADSP-2183  
There are 16,352 words of memory accessible internally when  
the DMOVLAY register is set to 0. When DMOVLAY is set to  
something other than 0, external accesses occur at addresses  
0x0000 through 0x1FFF. The external address is generated as  
shown in Table III.  
The CMS pin functions like the other memory select signals,  
with the same timing and bus request logic. A 1 in the enable bit  
causes the assertion of the CMS signal at the same time as the  
selected memory select signal. All enable bits, except the BMS  
bit, default to 1 at reset.  
Byte Memory  
Table III.  
The byte memory space is a bidirectional, 8-bit-wide, external  
memory space used to store programs and data. Byte memory is  
accessed using the BDMA feature. The byte memory space  
consists of 256 pages, each of which is 16K × 8.  
DMOVLAY Memory A13  
A12:0  
0
1
Internal  
Not Applicable Not Applicable  
External  
Overlay 1  
0
1
13 LSBs of Address  
Between 0x0000  
and 0x1FFF  
The byte memory space on the ADSP-2183 supports read and  
write operations as well as four different data formats. The byte  
memory uses data bits 15:8 for data. The byte memory uses  
data bits 23:16 and address bits 13:0 to create a 22-bit address.  
This allows up to a 4 meg × 8 (32 megabit) ROM or RAM to be  
used without glue logic. All byte memory accesses are timed by  
the BMWAIT register.  
2
External  
13 LSBs of Address  
Between 0x0000  
and 0x1FFF  
Overlay 2  
Byte Memory DMA (BDMA)  
This organization allows for two external 8K overlays using only  
the normal 14 address bits.  
The Byte memory DMA controller allows loading and storing of  
program instructions and data using the byte memory space.  
The BDMA circuit is able to access the byte memory space,  
while the processor is operating normally and steals only one  
DSP cycle per 8-, 16- or 24-bit word transferred.  
All internal accesses complete in one cycle. Accesses to external  
memory are timed using the wait states specified by the DWAIT  
register.  
I/O Space  
The BDMA circuit supports four different data formats which  
are selected by the BTYPE register field. The appropriate num-  
ber of 8-bit accesses are done from the byte memory space to  
build the word size selected. Table V shows the data formats  
supported by the BDMA circuit.  
The ADSP-2183 supports an additional external memory space  
called I/O space. This space is designed to support simple con-  
nections to peripherals or to bus interface ASIC data registers.  
I/O space supports 2048 locations. The lower eleven bits of the  
external address bus are used; the upper 3 bits are undefined.  
Two instructions were added to the core ADSP-2100 Family  
instruction set to read from and write to I/O memory space.  
The I/O space also has four dedicated 3-bit wait state regis-  
ters, IOWAIT0-3, which specify up to seven wait states to be  
automatically generated for each of four regions. The wait states  
act on address ranges as shown in Table IV.  
Table V.  
Internal  
Memory Space  
BTYPE  
Word Size  
Alignment  
00  
01  
10  
11  
Program Memory  
Data Memory  
Data Memory  
Data Memory  
24  
16  
8
Full Word  
Full Word  
MSBs  
Table IV.  
8
LSBs  
Address Range  
Wait State Register  
Unused bits in the 8-bit data memory formats are filled with 0s.  
The BIAD register field is used to specify the starting address  
for the on-chip memory involved with the transfer. The 14-bit  
BEAD register specifies the starting address for the external byte  
memory space. The 8-bit BMPAGE register specifies the start-  
ing page for the external byte memory space. The BDIR register  
field selects the direction of the transfer. Finally the 14-bit  
BWCOUNT register specifies the number of DSP words to  
transfer and initiates the BDMA circuit transfers.  
0x000–0x1FF  
0x200–0x3FF  
0x400–0x5FF  
0x600–0x7FF  
IOWAIT0  
IOWAIT1  
IOWAIT2  
IOWAIT3  
Composite Memory Select (CMS)  
The ADSP-2183 has a programmable memory select signal that  
is useful for generating memory select signals for memories  
mapped to more than one space. The CMS signal is generated  
to have the same timing as each of the individual memory select  
signals (PMS, DMS, BMS, IOMS) but can combine their  
functionality.  
BDMA accesses can cross page boundaries during sequential  
addressing. A BDMA interrupt is generated on the completion  
of the number of transfers specified by the BWCOUNT register.  
The BWCOUNT register is updated after each transfer so it can  
be used to check the status of the transfers. When it reaches  
zero, the transfers have finished and a BDMA interrupt is gener-  
ated. The BMPAGE and BEAD registers must not be accessed  
by the DSP during BDMA operations.  
When set, each bit in the CMSSEL register causes the CMS  
signal to be asserted when the selected memory select is as-  
serted. For example, to use a 32K word memory to act as both  
program and data memory, set the PMS and DMS bits in the  
CMSSEL register and use the CMS pin to drive the chip  
select of the memory; use either DMS or PMS as the additional  
address bit.  
The source or destination of a BDMA transfer will always be  
on-chip program or data memory, regardless of the values of  
MMAP, PMOVLAY or DMOVLAY.  
–8–  
REV. C  
ADSP-2183  
When the BWCOUNT register is written with a nonzero value  
the BDMA circuit starts executing byte memory accesses with  
wait states set by BMWAIT. These accesses continue until the  
count reaches zero. When enough accesses have occurred to create  
a destination word, it is transferred to or from on-chip memory.  
The transfer takes one DSP cycle. DSP accesses to external  
memory have priority over BDMA byte memory accesses.  
Table VI. Boot Summary Table  
MMAP BMODE  
Booting Method  
0
0
BDMA feature is used in default mode  
to load the first 32 program memory  
words from the byte memory space.  
Program execution is held off until all  
32 words have been loaded.  
The BDMA Context Reset bit (BCR) controls whether the  
processor is held off while the BDMA accesses are occurring.  
Setting the BCR bit to 0 allows the processor to continue opera-  
tions. Setting the BCR bit to 1 causes the processor to stop  
execution while the BDMA accesses are occurring, to clear the  
context of the processor and start execution at address 0 when  
the BDMA accesses have completed.  
0
1
1
IDMA feature is used to load any inter-  
nal memory as desired. Program execu-  
tion is held off until internal program  
memory location 0 is written to.  
X
Bootstrap features disabled. Program  
execution immediately starts from  
location 0.  
Internal Memory DMA Port (IDMA Port)  
The IDMA Port provides an efficient means of communication  
between a host system and the ADSP-2183. The port is used to  
access the on-chip program memory and data memory of the  
DSP with only one DSP cycle per word overhead. The IDMA  
port cannot, however, be used to write to the DSP’s memory-  
mapped control registers.  
BDMA Booting  
When the BMODE and MMAP pins specify BDMA booting  
(MMAP = 0, BMODE = 0), the ADSP-2183 initiates a BDMA  
boot sequence when reset is released. The BDMA interface is  
set up during reset to the following defaults when BDMA boot-  
ing is specified: the BDIR, BMPAGE, BIAD and BEAD regis-  
ters are set to 0, the BTYPE register is set to 0 to specify  
program memory 24 bit words, and the BWCOUNT register is  
set to 32. This causes 32 words of on-chip program memory to  
be loaded from byte memory. These 32 words are used to set up  
the BDMA to load in the remaining program code. The BCR  
bit is also set to 1, which causes program execution to be held  
off until all 32 words are loaded into on-chip program memory.  
Execution then begins at address 0.  
The IDMA port has a 16-bit multiplexed address and data bus  
and supports 24-bit program memory. The IDMA port is  
completely asynchronous and can be written to while the  
ADSP-2183 is operating at full speed.  
The DSP memory address is latched and then automatically  
incremented after each IDMA transaction. An external device  
can therefore access a block of sequentially addressed memory  
by specifying only the starting address of the block. This in-  
creases throughput as the address does not have to be sent for  
each memory access.  
The ADSP-2100 Family Development Software (Revision 5.02  
and later) fully supports the BDMA booting feature and can  
generate byte memory space compatible boot code.  
IDMA Port access occurs in two phases. The first is the IDMA  
Address Latch cycle. When the acknowledge is asserted, a 14-  
bit address and 1-bit destination type can be driven onto the bus  
by an external device. The address specifies an on-chip memory  
location; the destination type specifies whether it is a DM or  
PM access. The falling edge of the address latch signal latches  
this value into the IDMAA register.  
The IDLE instruction can also be used to allow the processor to  
hold off execution while booting continues through the BDMA  
interface.  
IDMA Booting  
The ADSP-2183 can also boot programs through its Internal  
DMA port. If BMODE = 1 and MMAP = 0, the ADSP-2183  
boots from the IDMA port. IDMA feature can load as much on-  
chip memory as desired. Program execution is held off until on-  
chip program memory location 0 is written to.  
Once the address is stored, data can either be read from or  
written to the ADSP-2183’s on-chip memory. Asserting the  
select line (IS) and the appropriate read or write line (IRD and  
IWR respectively) signals the ADSP-2183 that a particular  
transaction is required. In either case, there is a one-processor-  
cycle delay for synchronization. The memory access consumes  
one additional processor cycle.  
The ADSP-2100 Family Development Software (Revision 5.02  
and later) can generate IDMA compatible boot code.  
Bus Request and Bus Grant  
Once an access has occurred, the latched address is automati-  
cally incremented and another access can occur.  
The ADSP-2183 can relinquish control of the data and address  
buses to an external device. When the external device requires  
access to memory, it asserts the bus request (BR) signal. If the  
ADSP-2183 is not performing an external memory access, then  
it responds to the active BR input in the following processor  
cycle by:  
Through the IDMAA register, the DSP can also specify the  
starting address and data format for DMA operation.  
Bootstrap Loading (Booting)  
The ADSP-2183 has two mechanisms to allow automatic load-  
ing of the on-chip program memory after reset. The method for  
booting after reset is controlled by the MMAP and BMODE  
pins as shown in Table VI.  
• three-stating the data and address buses and the PMS, DMS,  
BMS, CMS, IOMS, RD, WR output drivers,  
• asserting the bus grant (BG) signal, and  
• halting program execution.  
REV. C  
–9–  
ADSP-2183  
If Go Mode is enabled, the ADSP-2183 will not halt program  
execution until it encounters an instruction that requires an  
external memory access.  
• The syntax is a superset ADSP-2100 Family assembly lan-  
guage and is completely source and object code compatible  
with other family members. Programs may need to be relo-  
cated to utilize on-chip memory and conform to the ADSP-  
2183’s interrupt vector and reset vector map.  
If the ADSP-2183 is performing an external memory access  
when the external device asserts the BR signal, then it will not  
three-state the memory interfaces or assert the BG signal until  
the processor cycle after the access completes. The instruction  
does not need to be completed when the bus is granted. If a  
single instruction requires two external memory accesses, the  
bus will be granted between the two accesses.  
• Sixteen condition codes are available. For conditional jump,  
call, return or arithmetic instructions, the condition can be  
checked and the operation executed in the same instruction  
cycle.  
• Multifunction instructions allow parallel execution of an  
arithmetic instruction with up to two fetches or one write to  
processor memory space during a single instruction cycle.  
When the BR signal is released, the processor releases the BG  
signal, reenables the output drivers and continues program  
execution from the point where it stopped.  
DESIGNING AN EZ-ICE-COMPATIBLE SYSTEM  
The bus request feature operates at all times, including when  
the processor is booting and when RESET is active.  
The ADSP-2183 has on-chip emulation support and an ICE-  
Port, a special set of pins that interface to the EZ-ICE. These  
features allow in-circuit emulation without replacing the target  
system processor by using only a 14-pin connection from the  
target system to the EZ-ICE. Target systems must have a 14-pin  
connector to accept the EZ-ICE’s in-circuit probe, a 14-pin plug.  
The BGH pin is asserted when the ADSP-2183 is ready to  
execute an instruction, but is stopped because the external bus  
is already granted to another device. The other device can re-  
lease the bus by deasserting bus request. Once the bus is re-  
leased, the ADSP-2183 deasserts BG and BGH and executes  
the external memory access.  
The ICE-Port interface consists of the following ADSP-2183 pins:  
EBR  
EMS  
ELIN  
EBG  
EINT  
ELOUT  
ERESET  
ECLK  
EE  
Flag I/O Pins  
The ADSP-2183 has eight general purpose programmable in-  
put/output flag pins. They are controlled by two memory  
mapped registers. The PFTYPE register determines the direc-  
tion, 1 = output and 0 = input. The PFDATA register is used to  
read and write the values on the pins. Data being read from a  
pin configured as an input is synchronized to the ADSP-2183’s  
clock. Bits that are programmed as outputs will read the value  
being output. The PF pins default to input during reset.  
These ADSP-2183 pins must be connected only to the EZ-ICE  
connector in the target system. These pins have no function  
except during emulation, and do not require pull-up or pull-  
down resistors. The traces for these signals between the ADSP-  
2183 and the connector must be kept as short as possible, no  
longer than three inches.  
The following pins are also used by the EZ-ICE:  
In addition to the programmable flags, the ADSP-2183 has five  
fixed-mode flags, FLAG_IN, FLAG_OUT, FL0, FL1 and FL2.  
FL0-FL2 are dedicated output flags. FLAG_IN and FLAG_OUT  
are available as an alternate configuration of SPORT1.  
BR  
BG  
RESET  
GND  
The EZ-ICE uses the EE (emulator enable) signal to take con-  
trol of the ADSP-2183 in the target system. This causes the  
processor to use its ERESET, EBR and EBG pins instead of the  
RESET, BR and BG pins. The BG output is three-stated.  
These signals do not need to be jumper-isolated in your system.  
INSTRUCTION SET DESCRIPTION  
The ADSP-2183 assembly language instruction set has an  
algebraic syntax that was designed for ease of coding and read-  
ability. The assembly language, which takes full advantage of  
the processor’s unique architecture, offers the following benefits:  
The EZ-ICE connects to your target system via a ribbon cable  
and a 14-pin female plug. The ribbon cable is 10 inches in  
length with one end fixed to the EZ-ICE. The female plug is  
plugged onto the 14-pin connector (a pin strip header) on the  
target board.  
• The algebraic syntax eliminates the need to remember cryptic  
assembler mnemonics. For example, a typical arithmetic add  
instruction, such as AR = AX0 + AY0, resembles a simple  
equation.  
• Every instruction assembles into a single, 24-bit word that can  
execute in a single instruction cycle.  
–10–  
REV. C  
ADSP-2183  
Restriction: All memory strobe signals on the ADSP-2183  
(RD, WR, PMS, DMS, BMS, CMS and IOMS) used in your  
target system must have 10 kpull-up resistors connected  
when the EZ-ICE is being used. The pull-up resistors are nec-  
essary because there are no internal pull-ups to guarantee their  
state during prolonged three-state conditions resulting from  
typical EZ-ICE debugging sessions. These resistors may be  
removed at your option when the EZ-ICE is not being used.  
Target Board Connector for EZ-ICE Probe  
The EZ-ICE connector (a standard pin strip header) is shown  
in Figure 7. You must add this connector to your target board  
design if you intend to use the EZ-ICE. Be sure to allow enough  
room in your system to fit the EZ-ICE probe onto the 14-pin  
connector.  
1
3
2
4
GND  
BG  
Target System Interface Signals  
When the EZ-ICE board is installed, the performance on some  
system signals changes. Design your system to be compatible  
with the following system interface signal changes introduced  
by the EZ-ICE board:  
EBG  
BR  
5
6
EBR  
EINT  
ELIN  
ECLK  
7
8
• EZ-ICE emulation introduces an 8 ns propagation delay  
between your target circuitry and the DSP on the RESET  
signal.  
KEY (NO PIN)  
9
10  
12  
14  
ELOUT  
EE  
• EZ-ICE emulation introduces an 8 ns propagation delay  
between your target circuitry and the DSP on the BR signal.  
11  
13  
EMS  
• EZ-ICE emulation ignores RESET and BR when single-  
stepping.  
ERESET  
RESET  
TOP VIEW  
• EZ-ICE emulation ignores RESET and BR when in Emula-  
tor Space (DSP halted).  
Figure 7. Target Board Connector for EZ-ICE  
• EZ-ICE emulation ignores the state of target BR in certain  
modes. As a result, the target system may take control of the  
DSP’s external memory bus only if bus grant (BG) is asserted  
by the EZ-ICE board’s DSP.  
The 14-pin, 2-row pin strip header is keyed at the Pin 7 loca-  
tion—you must remove Pin 7 from the header. The pins must  
be 0.025 inch square and at least 0.20 inch in length. Pin spac-  
ing should be 0.1 × 0.1 inches. The pin strip header must have  
at least 0.15 inch clearance on all sides to accept the EZ-ICE  
probe plug. Pin strip headers are available from vendors such as  
3M, McKenzie, and Samtec.  
Target Architecture File  
The EZ-ICE software lets you load your program in its linked  
(executable) form. The EZ-ICE PC program can not load  
sections of your executable located in boot pages (by the  
linker). With the exception of boot page 0 (loaded into PM  
RAM), all sections of your executable mapped into boot pages  
are not loaded.  
Target Memory Interface  
For your target system to be compatible with the EZ-ICE emu-  
lator, it must comply with the memory interface guidelines  
listed below.  
Write your target architecture file to indicate that only PM  
RAM is available for program storage, when using the EZ-ICE  
software’s loading feature. Data can be loaded to PM RAM or  
DM RAM.  
PM, DM, BM, IOM and CM  
Design your Program Memory (PM), Data Memory (DM),  
Byte Memory (BM), I/O Memory (IOM), and Composite  
Memory (CM) external interfaces to comply with worst case  
device timing requirements and switching characteristics as  
specified in the DSP’s data sheet. The performance of the  
EZ-ICE may approach published worst case specification for  
some memory access timing requirements and switching  
characteristics.  
Note: If your target does not meet the worst case chip specifica-  
tion for memory access parameters, you may not be able to  
emulate your circuitry at the desired CLKIN frequency. De-  
pending on the severity of the specification violation, you may  
have trouble manufacturing your system as DSP components  
statistically vary in switching characteristic and timing require-  
ments within published limits.  
REV. C  
–11–  
ADSP-2183–SPECIFICATIONS  
RECOMMENDED OPERATING CONDITIONS  
K Grade  
B Grade  
Parameter  
Min  
Max  
Min  
Max  
Unit  
VDD  
TAMB  
Supply Voltage  
Ambient Operating Temperature  
3.0  
0
3.6  
+70  
3.0  
–40  
3.6  
+85  
V
°C  
ELECTRICAL CHARACTERISTICS  
K/B Grades  
Typ  
Parameter  
Test Conditions  
Min  
Max  
Unit  
VIH  
VIL  
VOH  
Hi-Level Input Voltage1, 2  
Lo-Level Input Voltage1, 3  
Hi-Level Output Voltage1, 4, 5  
@ VDD = max  
@ VDD = min  
@ VDD = min  
2.0  
V
V
0.4  
I
OH = –0.5 mA  
2.4  
V
@ VDD = min  
I
OH = –100 µA6  
VDD – 0.3  
V
VOL  
IIH  
Lo-Level Output Voltage1, 4, 5  
Hi-Level Input Current3  
@ VDD = min  
IOL = 2 mA  
@ VDD = max  
0.4  
10  
10  
10  
8
V
V
IN = VDD max  
@ VDD = max  
IN = 0 V  
µA  
µA  
µA  
µA  
IIL  
Lo-Level Input Current3  
V
IOZH  
IOZL  
IDD  
Three-State Leakage Current7  
Three-State Leakage Current7  
Supply Current (Idle)9, 10  
@ VDD = max  
VIN = VDD max8  
@ VDD = max  
V
IN = 0 V8  
@ VDD = 3.3  
AMB = +25°C  
CK = 19 ns11  
T
t
10  
9
8
mA  
mA  
mA  
mA  
tCK = 25 ns11  
t
t
CK = 30 ns11  
CK = 34.7 ns11  
6
IDD  
Supply Current (Dynamic)10, 12  
@ VDD = 3.3  
AMB = +25°C  
CK = 19 ns11  
T
t
44  
35  
30  
26  
mA  
mA  
mA  
mA  
tCK = 25 ns11  
t
t
CK = 30 ns11  
CK = 34.7 ns11  
CI  
Input Pin Capacitance3, 6, 13  
@ VIN = 2.5 V  
IN = 1.0 MHz  
f
TAMB = +25°C  
8
8
pF  
pF  
CO  
Output Pin Capacitance6, 7, 13, 14  
@ VIN = 2.5 V  
f
IN = 1.0 MHz  
TAMB = +25°C  
NOTES  
1Bidirectional pins: D0–D23, RFS0, RFS1, SCLK0, SCLK1, TFS0, TFS1, IAD0–IAD15, PF0–PF7.  
12Input only pins: RESET, IRQ2, BR, MMAP, DR0, DR1, PWD, IRQL0, IRQL1, IRQE, IS, IRD, IWR, IAL.  
13Input only pins: CLKIN, RESET, IRQ2, BR, MMAP, DR0, DR1, IS, IAL, IRD, IWR, IRQL0, IRQL1, IRQE, PWD.  
14Output pins: BG, PMS, DMS, BMS, IOMS, CMS, RD, WR, IACK, PWDACK, A0–A13, DT0, DT1, CLKOUT, FL2-0.  
15Although specified for TTL outputs, all ADSP-2183 outputs are CMOS-compatible and will drive to VDD and GND, assuming no dc loads.  
16Guaranteed but not tested.  
17Three-statable pins: A0–A13, D0–D23, PMS, DMS, BMS, IOMS, CMS, RD, WR, DT0, DT1, SCLK0, SCLK1, TFS0, TFS1, RFS0, RFS1, IAD0–IAD15, PF0–PF7.  
180 V on BR, CLKIN Active (to force three-state condition).  
19Idle refers to ADSP-2183 state of operation during execution of IDLE instruction. Deasserted pins are driven to either V DD or GND.  
10Current reflects device operating with no output loads.  
11  
V
I
= 0.4 V and 2.4 V. For typical figures for supply currents, refer to Power Dissipation section.  
measurement taken with all instructions executing from internal memory. 50% of the instructions are multifunction (types 1, 4, 5, 12, 13, 14), 30% are  
IN  
12  
DD  
1type 2 and type 6, and 20% are idle instructions.  
13Applies to LQFP package type and Mini-BGA.  
14Output pin capacitance is the capacitive load for any three-stated output pin.  
Specifications subject to change without notice.  
REV. C  
–12–  
ADSP-2183  
ABSOLUTE MAXIMUM RATINGS*  
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +4.6 V  
Input Voltage . . . . . . . . . . . . . . . . . . . . . –0.5 V to VDD + 0.5 V  
Output Voltage Swing . . . . . . . . . . . . . . –0.5 V to VDD + 0.5 V  
Operating Temperature Range (Ambient) . . . . –40°C to +85°C  
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C  
Lead Temperature (5 sec) LQFP . . . . . . . . . . . . . . . . . +280°C  
*Stresses above those listed under Absolute Maximum Ratings may cause perma-  
nent damage to the device. These are stress ratings only; functional operation of  
the device at these or any other conditions above those indicated in the operational  
sections of this specification is not implied. Exposure to absolute maximum rating  
conditions for extended periods may affect device reliability.  
ESD SENSITIVITY  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily  
accumulate on the human body and test equipment and can discharge without detection. Although  
the ADSP-2183 features proprietary ESD protection circuitry, permanent damage may occur on  
devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are  
recommended to avoid performance degradation or loss of functionality.  
WARNING!  
ESD SENSITIVE DEVICE  
TIMING PARAMETERS  
GENERAL NOTES  
MEMORY TIMING SPECIFICATIONS  
Use the exact timing information given. Do not attempt to  
derive parameters from the addition or subtraction of others.  
While addition or subtraction would yield meaningful results for  
an individual device, the values given in this data sheet reflect  
statistical variations and worst cases. Consequently, you cannot  
meaningfully add up parameters to derive longer times.  
The table below shows common memory device specifications  
and the corresponding ADSP-2183 timing parameters, for your  
convenience.  
Memory  
Device  
ADSP-2183 Timing  
Timing  
Parameter  
Specification  
Parameter Definition  
TIMING NOTES  
Address Setup to  
Write Start  
Address Setup to  
Write End  
tASW  
A0–A13, xMS Setup before  
WR Low  
A0–A13, xMS Setup before  
WR Deasserted  
A0–A13, xMS Hold after  
WR Deasserted  
Data Setup before WR  
High  
Switching Characteristics specify how the processor changes its  
signals. You have no control over this timing—circuitry external  
to the processor must be designed for compatibility with these  
signal characteristics. Switching characteristics tell you what the  
processor will do in a given circumstance. You can also use switch-  
ing characteristics to ensure that any timing requirement of a  
device connected to the processor (such as memory) is satisfied.  
tAW  
Address Hold Time tWRA  
Data Setup Time  
tDW  
Timing Requirements apply to signals that are controlled by cir-  
cuitry external to the processor, such as the data input for a read  
operation. Timing requirements guarantee that the processor  
operates correctly with other devices.  
Data Hold Time  
OE to Data Valid  
Address Access Time tAA  
tDH  
tRDD  
Data Hold after WR High  
RD Low to Data Valid  
A0–A13, xMS to Data Valid  
xMS = PMS, DMS, BMS, CMS, IOMS.  
FREQUENCY DEPENDENCY FOR TIMING  
SPECIFICATIONS  
tCK is defined as 0.5tCKI. The ADSP-2183 uses an input clock  
with a frequency equal to half the instruction rate: a 16.67 MHz  
input clock (which is equivalent to 60 ns) yields a 30 ns proces-  
sor cycle (equivalent to 33 MHz). tCK values within the range of  
0.5tCKI period should be substituted for all relevant timing pa-  
rameters to obtain the specification value.  
Example: tCKH = 0.5tCK – 7 ns = 0.5 (34.7 ns) – 7 ns = 10.35 ns  
REV. C  
–13–  
ADSP-2183  
Parameter  
Min  
Max  
Unit  
Clock Signals and Reset  
Timing Requirements:  
tCKI  
CLKIN Period  
CLKIN Width Low  
CLKIN Width High  
38  
15  
15  
100  
ns  
ns  
ns  
tCKIL  
tCKIH  
Switching Characteristics:  
tCKL  
CLKOUT Width Low  
0.5tCK – 7  
0.5tCK – 7  
0
ns  
ns  
ns  
tCKH  
tCKOH  
CLKOUT Width High  
CLKIN High to CLKOUT High  
20  
Control Signals  
Timing Requirement:  
1
tRSP  
RESET Width Low  
5tCK  
ns  
NOTE  
1Applies after power-up sequence is complete. Internal phase lock loop requires no more than 2000 CLKIN cycles assuming stable CLKIN (not including crystal  
oscillator start-up time).  
tCKI  
tCKIH  
CLKIN  
tCKIL  
tCKOH  
tCKH  
CLKOUT  
tCKL  
Figure 8. Clock Signals  
Parameter  
Min  
Max  
Unit  
Interrupts and Flag  
Timing Requirements:  
tIFS  
tIFH  
IRQx, FI, or PFx Setup before CLKOUT Low 1, 2, 3, 4  
IRQx, FI, or PFx Hold after CLKOUT High 1, 2, 3, 4  
0.25tCK + 15  
0.25tCK  
ns  
ns  
Switching Characteristics:  
tFOH  
Flag Output Hold after CLKOUT Low5  
tFOD  
Flag Output Delay from CLKOUT Low5  
0.5tCK – 7  
ns  
ns  
0.5tCK + 6  
NOTES  
1If IRQx and FI inputs meet tIFS and tIFH setup/hold requirements, they will be recognized during the current clock cycle; otherwise the signals will be recognized on  
the following cycle. (Refer to Interrupt Controller Operation in the Program Control chapter of the User’s Manual for further information on interrupt servicing.)  
2Edge-sensitive interrupts require pulsewidths greater than 10 ns; level-sensitive interrupts must be held low until serviced.  
3IRQx = IRQ0, IRQ1, IRQ2, IRQL0, IRQL1, IRQE.  
4PFx = PF0, PF1, PF2, PF3, PF4, PF5, PF6, PF7.  
5Flag outputs = PFx, FL0, FL1, FL2, Flag_out4.  
tFOD  
CLKOUT  
tFOH  
FLAG  
OUTPUTS  
tIFH  
IRQx  
FI  
PFx  
tIFS  
Figure 9. Interrupts and Flags  
–14–  
REV. C  
ADSP-2183  
Parameter  
Min  
Max  
Unit  
Bus Request–Bus Grant  
Timing Requirements:  
tBH  
tBS  
BR Hold after CLKOUT High1  
BR Setup before CLKOUT Low1  
0.25tCK + 2  
0.25tCK + 17  
ns  
ns  
Switching Characteristics:  
tSD  
CLKOUT High to xMS,  
0.25tCK + 10  
ns  
RD, WR Disable  
xMS, RD, WR  
Disable to BG Low  
BG High to xMS,  
RD, WR Enable  
tSDB  
tSE  
0
ns  
ns  
ns  
ns  
ns  
0
tSEC  
tSDBH  
tSEH  
xMS, RD, WR  
Enable to CLKOUT High  
xMS, RD, WR  
0.25tCK – 4  
Disable to BGH Low2  
BGH High to xMS,  
RD, WR Enable2  
0
0
NOTES  
xMS = PMS, DMS, CMS, IOMS, BMS.  
1BR is an asynchronous signal. If BR meets the setup/hold requirements, it will be recognized during the current clock cycle; otherwise the signal will be recognized on  
the following cycle. Refer to the ADSP-2100 Family User’s Manual, Third Edition, for BR/BG cycle relationships.  
2BGH is asserted when the bus is granted and the processor requires control of the bus to continue.  
tBH  
CLKOUT  
BR  
tBS  
CLKOUT  
PMS, DMS  
BMS, RD  
tSD  
tSEC  
WR  
BG  
tSDB  
tSE  
BGH  
tSDBH  
tSEH  
Figure 10. Bus Request–Bus Grant  
REV. C  
–15–  
ADSP-2183  
Parameter  
Min  
Max  
Unit  
Memory Read  
Timing Requirements:  
tRDD  
tAA  
RD Low to Data Valid  
A0–A13, xMS to Data Valid  
Data Hold from RD High  
0.5tCK – 8 + w  
0.75tCK – 10.5 + w  
ns  
ns  
ns  
tRDH  
0
Switching Characteristics:  
tRP  
RD Pulsewidth  
0.5tCK – 5 + w  
0.25tCK – 2  
0.25tCK – 4  
0.25tCK – 3  
0.5tCK – 5  
ns  
ns  
ns  
ns  
ns  
tCRD  
tASR  
tRDA  
tRWR  
CLKOUT High to RD Low  
0.25tCK + 7  
A0–A13, xMS Setup before RD Low  
A0–A13, xMS Hold after RD Deasserted  
RD High to RD or WR Low  
w = wait states × tCK  
.
xMS = PMS, DMS, CMS, IOMS, BMS.  
CLKOUT  
A0 A13  
DMS, PMS,  
BMS, IOMS,  
CMS  
tRDA  
RD  
tASR  
tCRD  
tRP  
tRWR  
D
tRDD  
tRDH  
tAA  
WR  
Figure 11. Memory Read  
–16–  
REV. C  
ADSP-2183  
Parameter  
Min  
Max  
Unit  
Memory Write  
Switching Characteristics:  
tDW  
tDH  
Data Setup before WR High  
Data Hold after WR High  
0.5tCK – 7 + w  
0.25tCK – 2  
0.5tCK – 5 + w  
0
0.25tCK – 4  
0.25tCK – 4  
0.25tCK – 2  
0.75tCK – 9 + w  
0.25tCK – 3  
0.5tCK – 5  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tWP  
WR Pulsewidth  
tWDE  
tASW  
tDDR  
tCWR  
tAW  
tWRA  
tWWR  
WR Low to Data Enabled  
A0–A13, xMS Setup before WR Low  
Data Disable before WR or RD Low  
CLKOUT High to WR Low  
A0–A13, xMS, Setup before WR Deasserted  
A0–A13, xMS Hold after WR Deasserted  
WR High to RD or WR Low  
0.25 tCK + 7  
w = wait states × tCK  
.
xMS = PMS, DMS, CMS, IOMS, BMS.  
CLKOUT  
A0A13  
DMS, PMS,  
BMS, CMS,  
IOMS  
tWRA  
WR  
tWWR  
tASW  
tWP  
tAW  
tDH  
tDDR  
tCWR  
D
tDW  
tWDE  
RD  
Figure 12. Memory Write  
REV. C  
–17–  
ADSP-2183  
Parameter  
Min  
Max  
Unit  
Serial Ports  
Timing Requirements:  
tSCK  
tSCS  
tSCH  
tSCP  
SCLK Period  
38  
4
7
ns  
ns  
ns  
ns  
DR/TFS/RFS Setup before SCLK Low  
DR/TFS/RFS Hold after SCLK Low  
SCLKIN Width  
15  
Switching Characteristics:  
tCC  
CLKOUT High to SCLKOUT  
SCLK High to DT Enable  
SCLK High to DT Valid  
TFS/RFSOUT Hold after SCLK High  
TFS/RFSOUT Delay from SCLK High  
DT Hold after SCLK High  
0.25tCK  
0
0.25tCK + 10  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tSCDE  
tSCDV  
tRH  
15  
15  
0
tRD  
tSCDH  
tTDE  
tTDV  
tSCDD  
tRDV  
0
0
TFS (Alt) to DT Enable  
TFS (Alt) to DT Valid  
14  
15  
15  
SCLK High to DT Disable  
RFS (Multichannel, Frame Delay Zero) to DT Valid  
CLKOUT  
tCC  
tCC  
tSCK  
SCLK  
tSCP  
tSCP  
tSCS tSCH  
DR  
TFS  
RFS  
IN  
IN  
tRD  
tRH  
RFS  
TFS  
OUT  
OUT  
tSCDD  
tSCDV  
tSCDH  
tSCDE  
DT  
tTDE  
tTDV  
TFS  
ALTERNATE  
FRAME MODE  
tRDV  
RFS  
MULTICHANNEL MODE,  
FRAME DELAY 0  
(MFD = 0)  
Figure 13. Serial Ports  
–18–  
REV. C  
ADSP-2183  
Parameter  
Min  
Max  
Unit  
IDMA Address Latch  
Timing Requirements:  
tIALP  
tIASU  
tIAH  
Duration of Address Latch1, 2  
10  
5
2
0
3
ns  
ns  
ns  
ns  
ns  
IAD15–0 Address Setup before Address Latch End2  
IAD15–0 Address Hold after Address Latch End2  
IACK Low before Start of Address Latch1  
tIKA  
tIALS  
Start of Write or Read after Address Latch End2, 3  
NOTES  
1Start of Address Latch = IS Low and IAL High.  
2End of Address Latch = IS High or IAL Low.  
3Start of Write or Read = IS Low and IWR Low or IRD Low.  
IACK  
tIKA  
IAL  
tIALP  
IS  
tIASU  
tIAH  
IAD150  
tIALS  
IRD OR  
IWR  
Figure 14. IDMA Address Latch  
REV. C  
–19–  
ADSP-2183  
Parameter  
Min  
Max  
Unit  
IDMA Write, Short Write Cycle  
Timing Requirements:  
tIKW  
tIWP  
tIDSU  
tIDH  
IACK Low before Start of Write1  
0
15  
5
ns  
ns  
ns  
ns  
Duration of Write1, 2  
IAD15–0 Data Setup before End of Write2, 3, 4  
IAD15–0 Data Hold after End of Write2, 3, 4  
2
Switching Characteristic:  
tIKHW  
Start of Write to IACK High  
15  
ns  
NOTES  
1Start of Write = IS Low and IWR Low.  
2End of Write = IS High or IWR High.  
3If Write Pulse ends before IACK Low, use specifications tIDSU, tIDH  
.
4If Write Pulse ends after IACK Low, use specifications tIKSU, tIKH  
.
tIKW  
IACK  
IS  
tIKHW  
tIWP  
IWR  
tIDH  
tIDSU  
DATA  
IAD150  
Figure 15. IDMA Write, Short Write Cycle  
–20–  
REV. C  
ADSP-2183  
Parameter  
Min  
Max  
Unit  
IDMA Write, Long Write Cycle  
Timing Requirements:  
tIKW  
tIKSU  
tIKH  
IACK Low before Start of Write1  
0
ns  
ns  
ns  
IAD15–0 Data Setup before IACK Low2, 3  
IAD15–0 Data Hold after IACK Low2, 3  
0.5tCK + 10  
2
Switching Characteristics:  
tIKLW  
Start of Write to IACK Low4  
tIKHW Start of Write to IACK High  
1.5tCK  
ns  
ns  
15  
NOTES  
1Start of Write = IS Low and IWR Low.  
2If Write Pulse ends before IACK Low, use specifications tIDSU, tIDH  
.
3If Write Pulse ends after IACK Low, use specifications tIKSU, tIKH  
.
4This is the earliest time for IACK Low from Start of Write. For IDMA Write Cycle relationships, please refer to the ADSP-21xx Family User’s Manual, Third Edition.  
tIKW  
IACK  
tIKHW  
tIKLW  
IS  
IWR  
tIKSU  
tIKH  
DATA  
IAD150  
Figure 16. IDMA Write, Long Write Cycle  
REV. C  
–21–  
ADSP-2183  
Parameter  
Min  
Max  
Unit  
IDMA Read, Long Read Cycle  
Timing Requirements:  
tIKR  
tIRP  
IACK Low before Start of Read1  
0
15  
ns  
ns  
Duration of Read  
Switching Characteristics:  
tIKHR  
tIKDS  
tIKDH  
tIKDD  
tIRDE  
tIRDV  
tIRDH1  
tIRDH2  
IACK High after Start of Read1  
15  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
IAD15–0 Data Setup before IACK Low  
0.5tCK – 7  
0
IAD15–0 Data Hold after End of Read2  
IAD15–0 Data Disabled after End of Read2  
10  
15  
IAD15–0 Previous Data Enabled after Start of Read  
IAD15–0 Previous Data Valid after Start of Read  
IAD15–0 Previous Data Hold after Start of Read (DM/PM1)3  
IAD15–0 Previous Data Hold after Start of Read (PM2)4  
0
2tCK – 5  
tCK – 5  
NOTES  
1Start of Read = IS Low and IRD Low.  
2End of Read = IS High or IRD High.  
3DM read or first half of PM read.  
4Second half of PM read.  
IACK  
IS  
tIKHR  
tIKR  
tIRP  
IRD  
tIKDS  
tIKDH  
tIRDE  
PREVIOUS  
DATA  
READ  
DATA  
IAD150  
tIRDV  
tIKDD  
tIRDH  
Figure 17. IDMA Read, Long Read Cycle  
–22–  
REV. C  
ADSP-2183  
Parameter  
Min  
Max  
Unit  
IDMA Read, Short Read Cycle  
Timing Requirements:  
tIKR  
tIRP  
IACK Low before Start of Read1  
0
15  
ns  
ns  
Duration of Read  
Switching Characteristics:  
tIKHR  
tIKDH  
tIKDD  
tIRDE  
tIRDV  
IACK High after Start of Read1  
15  
10  
15  
ns  
ns  
ns  
ns  
ns  
IAD15–0 Data Hold after End of Read2  
0
0
IAD15–0 Data Disabled after End of Read2  
IAD15–0 Previous Data Enabled after Start of Read  
IAD15–0 Previous Data Valid after Start of Read  
NOTES  
1Start of Read = IS Low and IRD Low.  
2End of Read = IS High or IRD High.  
IACK  
IS  
tIKR  
tIKHR  
tIRP  
IRD  
tIKDH  
tIRDE  
PREVIOUS  
DATA  
IAD150  
tIKDD  
tIRDV  
Figure 18. IDMA Read, Short Read Cycle  
REV. C  
–23–  
ADSP-2183  
OUTPUT DRIVE CURRENTS  
PINT = internal power dissipation from Power vs. Frequency  
Figure 19 shows typical I-V characteristics for the output drivers  
of the ADSP-2183. The curves represent the current drive  
capability of the output drivers as a function of output voltage.  
graph (Figure 20).  
(C × VDD2 × f ) is calculated for each output:  
100  
75  
# of  
Pins × C  
2
× VDD  
× f  
50  
Address, DMS  
Data Output, WR  
RD  
8
9
1
1
× 10 pF × 3.32  
V
× 33.3 MHz  
=
29.0 mW  
× 10 pF × 3.32 V × 16.67 MHz = 16.3 mW  
25  
3.6V, 40°C  
× 10 pF × 3.32  
× 10 pF × 3.32 V × 33.3 MHz  
V
× 16.67 MHz =  
1.8 mW  
3.6 mW  
50.7 mW  
0
3.3V, +25°C  
CLKOUT  
=
3.0V, +85°C  
25  
50  
3.0V, +85°C  
75  
Total power dissipation for this example is PINT + 50.7 mW.  
3.3V, +25  
°
C
100  
125  
3.6V, 40°C  
1, 3, 4  
2183 POWER, INTERNAL  
220  
205  
150  
175  
200  
190  
184mW  
175  
0
0.75  
1.50  
2.25  
3.00  
3.75  
4.50  
5.25  
V
= 3.6V  
SOURCE VOLTAGE V  
160  
145  
130  
DD  
150mW  
120mW  
Figure 19. Typical Drive Currents  
V
V
= 3.3V  
= 3.0V  
DD  
1000  
100  
10  
110mW  
90mW  
115  
100  
DD  
V
V
V
= 3.6V  
= 3.3V  
= 3.0V  
DD  
DD  
DD  
85 72mW  
70  
28  
32  
36  
40  
CK  
44  
48  
52  
1/t MHz  
1, 2, 3  
POWER, IDLE  
50  
45  
40  
35  
38mW  
V
V
= 3.6V  
= 3.3V  
DD  
30mW  
24mW  
30 27mW  
DD  
25  
20mW  
0
0
25  
55  
85  
20  
TEMPERATURE – °C  
V
= 3.0V  
DD  
15  
NOTES:  
1. REFLECTS ADSP-2183 OPERATION IN LOWEST POWER MODE.  
15mW  
10  
(SEE "SYSTEM INTERFACE" CHAPTER OF THE ADSP-2100 FAMILY  
USER'S MANUAL FOR DETAILS.)  
2. CURRENT REFLECTS DEVICE OPERATING WITH NO INPUT LOADS.  
5
0
28  
36  
40  
CK  
44  
48  
32  
52  
1/t MHz  
Figure 20. Power-Down Supply Current (Typical)  
3
POWER, IDLE n MODES  
32  
30  
POWER DISSIPATION  
30mW  
IDLE  
To determine total power dissipation in a specific application,  
the following equation should be applied for each output:  
28  
26  
2
C × VDD × f  
24  
22  
C = load capacitance, f = output switching frequency.  
20  
18  
20mW  
Example:  
16  
14  
12  
10  
8
In an application where external data memory is used and no  
other outputs are active, power dissipation is calculated as  
follows:  
13.8mW  
13mW  
IDLE (16)  
IDLE (128)  
11mW  
10.6mW  
Assumptions:  
28  
32  
36  
40  
CK  
44  
48  
52  
1/t MHz  
External data memory is accessed every cycle with 50% of the  
address pins switching.  
VALID FOR ALL TEMPERATURE GRADES.  
1
POWER REFLECTS DEVICE OPERATING WITH NO OUTPUT LOADS.  
2
IDLE REFERS TO ADSP-2183 STATE OF OPERATION DURING EXECUTION OF IDLE  
INSTRUCTION. DEASSERTED PINS ARE DRIVEN TO EITHER V OR GND.  
External data memory writes occur every other cycle with  
50% of the data pins switching.  
DD  
3
4
TYPICAL POWER DISSIPATION AT 3.3V V AND 25؇C EXCEPT WHERE SPECIFIED.  
DD  
I
MEASUREMENT TAKEN WITH ALL INSTRUCTIONS EXECUTING FROM INTERNAL  
MEMORY. 50% OF THE INSTRUCTIONS ARE MULTIFUNCTION (TYPES 1,4,5,12,13,14),  
30% ARE TYPE 2 AND TYPE 6, AND 20% ARE IDLE INSTRUCTIONS.  
DD  
Each address and data pin has a 10 pF total load at the pin.  
The application operates at VDD = 3.3 V and tCK = 30.0 ns.  
2
Total Power Dissipation = PINT + (C × VDD × f )  
Figure 21. Power vs. Frequency  
REV. C  
–24–  
ADSP-2183  
CAPACITIVE LOADING  
Figures 22 and 23 show the capacitive loading characteristics of  
the ADSP-2183.  
is calculated. If multiple pins (such as the data bus) are dis-  
abled, the measurement value is that of the last pin to stop  
driving.  
25  
T = +85؇C  
DD  
INPUT  
1.5V  
1.5V  
OR  
V
= 3.0V  
OUTPUT  
20  
15  
10  
5
Figure 24. Voltage Reference Levels for AC Measure-  
ments (Except Output Enable/Disable)  
Output Enable Time  
Output pins are considered to be enabled when they have made  
a transition from a high-impedance state to when they start  
driving. The output enable time (tENA) is the interval from when  
a reference signal reaches a high or low voltage level to when the  
output has reached a specified high or low trip point, as shown  
in the Output Enable/Disable diagram. If multiple pins (such as  
the data bus) are enabled, the measurement value is that of the  
first pin to start driving.  
0
0
20  
40  
60  
80 100 120 140 160 180 200  
pF  
C
L
Figure 22. Typical Output Rise Time vs. Load Capacitance,  
CL (at Maximum Ambient Operating Temperature)  
REFERENCE  
SIGNAL  
tMEASURED  
tDIS  
18  
16  
tENA  
V
V
OH  
OH  
(MEASURED)  
(MEASURED)  
14  
12  
10  
8
V
V
(MEASURED) 0.5V  
2.0V  
1.0V  
OH  
OL  
OUTPUT  
(MEASURED) +0.5V  
V
V
OL  
OL  
tDECAY  
(MEASURED)  
(MEASURED)  
6
OUTPUT STARTS  
DRIVING  
OUTPUT STOPS  
DRIVING  
4
2
HIGH-IMPEDANCE STATE. TEST CONDITIONS CAUSE  
THIS VOLTAGE LEVEL TO BE APPROXIMATELY 1.5V.  
NOMINAL  
2  
4  
6  
Figure 25. Output Enable/Disable  
I
OL  
0
40  
80  
120  
pF  
160  
200  
C
L
Figure 23. Typical Output Valid Delay or Hold vs. Load  
Capacitance, CL (at Maximum Ambient Operating  
Temperature)  
TO  
OUTPUT  
PIN  
+1.5V  
50pF  
TEST CONDITIONS  
Output Disable Time  
Output pins are considered to be disabled when they have  
stopped driving and started a transition from the measured  
output high or low voltage to a high impedance state. The out-  
put disable time (tDIS) is the difference of tMEASURED and tDECAY  
as shown in the Output Enable/Disable diagram. The time is the  
interval from when a reference signal reaches a high or low  
voltage level to when the output voltages have changed by 0.5 V  
from the measured output high or low voltage. The decay time,  
tDECAY, is dependent on the capacitive load, CL, and the current  
load, iL, on the output pin. It can be approximated by the fol-  
lowing equation:  
I
OH  
Figure 26. Equivalent Device Loading for AC Measure-  
ments (Including All Fixtures)  
,
ENVIRONMENTAL CONDITIONS  
Ambient Temperature Rating:  
T
T
AMB = TCASE – (PD × θCA  
)
CASE = Case Temperature in °C  
PD = Power Dissipation in W  
θ
θ
θ
CA = Thermal Resistance (Case-to-Ambient)  
JA = Thermal Resistance (Junction-to-Ambient)  
JC = Thermal Resistance (Junction-to-Case)  
CL • 0.5V  
tDECAY  
=
iL  
from which  
Package  
JA  
JC  
CA  
tDIS = tMEASURED tDECAY  
LQFP  
Mini-BGA  
50°C/W  
70.7°C/W  
2°C/W  
7.4°C/W  
48°C/W  
63.3°C/W  
REV. C  
–25–  
ADSP-2183  
128-Lead LQFP Package Pinout  
102  
101  
100  
99  
IAL  
PF3  
PF2  
PF1  
PF0  
WR  
1
2
GND  
D23  
D22  
D21  
D20  
PIN 1  
IDENTIFIER  
3
4
5
98  
6
97 D19  
96  
7
D18  
RD  
95  
8
D17  
IOMS  
BMS  
DMS  
CMS  
94  
9
D16  
93  
10  
11  
D15  
92  
91  
90  
89  
88  
87  
86  
85  
84  
83  
82  
81  
80  
79  
78  
77  
76  
75  
74  
73  
72  
71  
70  
69  
68  
GND  
GND 12  
V
DD  
13  
14  
15  
V
GND  
D14  
D13  
D12  
D11  
D10  
D9  
DD  
PMS  
A0  
A1 16  
A2 17  
18  
A3  
A4 19  
20  
ADSP-2183  
TOP VIEW  
(Not to Scale)  
A5  
A6 21  
D8  
D7  
22  
23  
24  
25  
A7  
XTAL  
CLKIN  
GND  
D6  
D5  
GND  
D4  
CLKOUT 26  
D3  
27  
28  
29  
30  
GND  
D2  
V
D1  
DD  
D0  
A8  
A9  
V
DD  
A10 31  
32  
BG  
A11  
EBG  
BR  
A12 33  
A13 34  
EBR  
EINT  
35  
IRQE  
67 ELIN  
MMAP 36  
66  
65  
37  
38  
ELOUT  
ECLK  
PWD  
IRQ2  
–26–  
REV. C  
ADSP-2183  
LQFP Pin Configurations  
LQFP  
Number  
Pin  
Name  
LQFP  
Number  
Pin  
Name  
LQFP  
Number  
Pin  
Name  
LQFP  
Number  
Pin  
Name  
1
2
3
4
5
6
7
8
IAL  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
45  
46  
47  
48  
49  
50  
51  
52  
53  
54  
55  
56  
57  
58  
59  
60  
61  
62  
63  
64  
A12  
A13  
IRQE  
MMAP  
PWD  
65  
66  
67  
68  
69  
70  
71  
72  
73  
74  
75  
76  
77  
78  
79  
80  
81  
82  
83  
84  
85  
86  
87  
88  
89  
90  
91  
92  
93  
94  
95  
96  
ECLK  
ELOUT  
ELIN  
EINT  
EBR  
BR  
EBG  
BG  
VDD  
D0  
D1  
D2  
D3  
D4  
97  
98  
99  
D19  
D20  
D21  
D22  
D23  
GND  
IWR  
PF3  
PF2  
PF1  
PF0  
WR  
100  
101  
102  
103  
104  
105  
106  
107  
108  
109  
110  
111  
112  
113  
114  
115  
116  
117  
118  
119  
120  
121  
122  
123  
124  
125  
126  
127  
128  
IRQ2  
RD  
BMODE  
PWDACK  
IACK  
BGH  
VDD  
GND  
IRQL0  
IRQL1  
FL0  
FL1  
FL2  
DT0  
TFS0  
RFS0  
DR0  
SCLK0  
DT1/F0  
TFS1/IRQ1  
RFS1/IRQ0  
GND  
DR1/FI  
SCLK1  
ERESET  
RESET  
EMS  
IOMS  
BMS  
DMS  
CMS  
GND  
VDD  
PMS  
A0  
A1  
A2  
A3  
A4  
A5  
A6  
A7  
XTAL  
CLKIN  
GND  
CLKOUT  
GND  
VDD  
A8  
IRD  
9
IAD15  
IAD14  
IAD13  
IAD12  
IAD11  
IAD10  
IAD9  
IAD8  
IAD7  
IAD6  
VDD  
GND  
IAD5  
IAD4  
IAD3  
IAD2  
IAD1  
IAD0  
PF7  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
GND  
D5  
D6  
D7  
D8  
D9  
D10  
D11  
D12  
D13  
D14  
GND  
VDD  
GND  
D15  
D16  
D17  
D18  
PF6  
PF5  
PF4  
GND  
IS  
A9  
A10  
A11  
EE  
REV. C  
–27–  
ADSP-2183  
144-Lead Mini-BGA Package Pinout  
(Bottom View)  
12  
11  
10  
9
8
7
6
5
4
2
1
3
GND  
D21  
D17  
GND  
IWR  
IAD14  
IAD10  
IAD6  
GND  
IAD2  
PF6  
GND  
IS  
IAL  
A
D23  
D20  
IRD  
IAD15  
IAD13  
IAD11  
IAD8  
VDD  
VDD  
GND  
IAD0  
IAD1  
PF4  
PF5  
PF2  
GND  
WR  
GND  
A0  
PF3  
PF0  
PF1  
RD  
B
C
D22  
GND  
D14  
D10  
D15  
GND  
D11  
D18  
VDD  
D13  
D19  
GND  
D12  
D16  
GND  
IAD9  
IAD7  
D8  
IAD5  
CMS  
IAD4  
PF7  
IAD3  
PMS  
A8  
IOMS  
BMS  
A3  
DMS  
VDD  
A1  
GND  
VDD  
A2  
D
E
IAD12  
A4  
F
D6  
D5  
D2  
D9  
GND  
D1  
D4  
D0  
D7  
D3  
DT0  
DT1  
A7  
A6  
GND  
GND  
GND  
A10  
A5  
XTAL  
CLKIN  
CLKOUT  
A9  
G
H
GND  
VDD  
EBG  
IRQL0  
IRQL1  
TFS0  
VDD  
VDD  
FL2  
GND  
VDD  
A12  
J
VDD  
BR  
BG  
RFS1  
SCLK1  
SCLK0  
TFS1  
VDD  
EBR  
ERESET  
PWDACK  
A11  
K
L
EINT  
ELOUT  
EE  
ELIN  
RESET  
GND  
GND  
DR0  
FL0  
FL1  
GND  
GND  
IACK  
BGH  
IRQE  
MMAP  
A13  
M
ECLK  
EMS  
DR1  
RFS0  
BMODE  
IRQ2  
PWD  
–28–  
REV. C  
ADSP-2183  
Mini-BGA Pin Configurations  
Ball #  
Name  
Ball #  
Name  
Ball #  
Name  
Ball #  
Name  
A01  
A02  
A03  
A04  
A05  
A06  
A07  
A08  
A09  
A10  
A11  
A12  
B01  
B02  
B03  
B04  
B05  
B06  
B07  
B08  
B09  
B10  
B11  
B12  
C01  
C02  
C03  
C04  
C05  
C06  
C07  
C08  
C09  
C10  
C11  
C12  
IAL  
IS  
GND  
PF6  
IAD2  
GND  
IAD6  
IAD10  
IAD14  
IWR  
GND  
GND  
PF1  
PF3  
GND  
PF5  
IAD1  
GND  
VDD  
IAD11  
IAD15  
IRD  
D23  
D21  
RD  
PF0  
WR  
PF2  
PF4  
IAD0  
VDD  
IAD8  
IAD13  
D22  
D20  
D17  
D01  
D02  
D03  
D04  
D05  
D06  
D07  
D08  
D09  
D10  
D11  
D12  
E01  
E02  
E03  
E04  
E05  
E06  
E07  
E08  
E09  
E10  
E11  
E12  
F01  
F02  
F03  
F04  
F05  
F06  
F07  
F08  
F09  
F10  
F11  
F12  
GND  
DMS  
GND  
IOMS  
PF7  
IAD5  
IAD9  
D16  
D19  
D18  
D15  
GND  
VDD  
VDD  
A0  
BMS  
IAD3  
CMS  
IAD7  
GND  
GND  
VDD  
GND  
D14  
A2  
G01  
G02  
G03  
G04  
G05  
G06  
G07  
G08  
G09  
G10  
G11  
G12  
H01  
H02  
H03  
H04  
H05  
H06  
H07  
H08  
H09  
H10  
H11  
H12  
J01  
XTAL  
A5  
GND  
A6  
A8  
A7  
DT0  
D7  
D4  
D9  
K01  
K02  
K03  
K04  
K05  
K06  
K07  
K08  
K09  
K10  
K11  
K12  
L01  
L02  
L03  
L04  
L05  
L06  
L07  
L08  
L09  
L10  
L11  
L12  
M01  
M02  
M03  
M04  
M05  
M06  
M07  
M08  
M09  
M10  
M11  
M12  
A9  
A12  
A11  
PWDACK  
FL2  
TFS0  
TFS1  
SCLK1  
ERESET  
EBR  
BR  
EBG  
D5  
D6  
CLKIN  
GND  
GND  
GND  
VDD  
IRQL0  
DT1  
D3  
A13  
MMAP  
IRQE  
IACK  
GND  
FL0  
DR0  
GND  
RESET  
ELIN  
ELOUT  
EINT  
PWD  
IRQ2  
BMODE  
BGH  
GND  
FL1  
RFS0  
GND  
DR1  
EMS  
EE  
D0  
GND  
D2  
GND  
CLKOUT  
VDD  
A10  
VDD  
VDD  
IRQL1  
SCLK0  
RFS1  
BG  
A1  
A4  
A3  
J02  
J03  
J04  
J05  
J06  
J07  
J08  
J09  
PMS  
IAD4  
D8  
IAD12  
D12  
D13  
D11  
D10  
J10  
J11  
J12  
D1  
VDD  
VDD  
ECLK  
REV. C  
–29–  
ADSP-2183  
OUTLINE DIMENSIONS  
Dimensions given in mm and (inches).  
128-Lead Metric Plastic Thin Quad Flatpack (LQFP)  
(ST-128)  
16.20 (0.638)  
16.00 (0.630)  
15.80 (0.622)  
1.60 (0.063)  
MAX  
0.75 (0.030)  
0.60 (0.024)  
0.50 (0.020)  
128  
1
103  
102  
SEATING  
PLANE  
TOP VIEW  
(PINS DOWN)  
0.08 (0.003)  
MAX LEAD  
COPLANARITY  
38  
39  
65  
64  
0.15 (0.006)  
0.05 (0.002)  
0.27 (0.011)  
0.22 (0.009)  
0.50 (0.020)  
BSC  
LEAD PITCH  
0.17 (0.007)  
LEAD WIDTH  
1.45 (0.057)  
1.40 (0.055)  
1.35 (0.053)  
14.10 (0.555)  
14.00 (0.551)  
13.90 (0.547)  
NOTES:  
THE ACTUAL POSITION OF EACH LEAD IS WITHIN 0.08  
(0.0032) FROM ITS IDEAL POSITION WHEN MEASURED IN THE  
LATERAL DIRECTION.  
CENTER FIGURES ARE TYPICAL UNLESS OTHERWISE NOTED  
–30–  
REV. C  
ADSP-2183  
OUTLINE DIMENSIONS  
Dimensions given in mm and (inches).  
144-Lead Mini-BGA Package Pinout  
(CA-144)  
0.404 (10.25)  
0.394 (10.00) SQ  
0.384 (9.75)  
12 11 10  
9 8 7 6 5 4 3 2 1  
A
B
C
D
E
F
G
H
J
0.346  
(8.80)  
BSC  
0.404 (10.25)  
0.394 (10.00) SQ  
0.384 (9.75)  
TOP VIEW  
0.031  
(0.80)  
BSC  
K
L
M
0.031 (0.80) BSC  
0.346 (8.80) BSC  
DETAIL A  
0.067 (1.70) MAX  
NOTE  
0.010  
(0.25)  
NOM  
DETAIL A  
0.034 (0.85) MIN  
THE ACTUAL POSITION OF THE BALL POPULATION  
IS WITHIN 0.006 (0.150) OF ITS IDEAL POSITION  
RELATIVE TO THE PACKAGE EDGES. THE ACTUAL  
POSITION OF EACH BALL IS WITHIN 0.003 (0.08) OF  
0.010 (0.25) MIN  
0.022 (0.55)  
0.020 (0.50)  
0.018 (0.45)  
0.005  
(0.12)  
MAX  
SEATING  
PLANE  
ITS IDEAL POSITION RELATIVE TO THE BALL POPULATION.  
BALL DIAMETER  
ORDERING GUIDE  
Ambient  
Temperature  
Range  
Instruction  
Rate  
(MHz)  
Package  
Description  
Package  
Option  
Part Number  
ADSP-2183KST-115  
ADSP-2183BST-115  
ADSP-2183KST-133  
ADSP-2183BST-133  
ADSP-2183KST-160  
ADSP-2183BST-160  
ADSP-2183KST-210  
ADSP-2183KCA-210  
0°C to +70°C  
–40°C to +85°C  
0°C to +70°C  
–40°C to +85°C  
0°C to +70°C  
–40°C to +85°C  
0°C to +70°C  
0°C to +70°C  
28.8  
28.8  
33.3  
33.3  
40  
40  
52  
128-Lead LQFP  
128-Lead LQFP  
128-Lead LQFP  
128-Lead LQFP  
128-Lead LQFP  
128-Lead LQFP  
128-Lead LQFP  
144-Lead Mini-BGA  
ST-128  
ST-128  
ST-128  
ST-128  
ST-128  
ST-128  
ST-128  
CA-144  
52  
REV. C  
–31–  

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SI9130DB

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SI9135LG-T1

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SI9122E

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