ADSP-BF527BBCZ-5AX [ADI]

IC 0-BIT, 133 MHz, OTHER DSP, PBGA208, 17 X 17 MM, MO-205AM, CSPBGA-289, Digital Signal Processor;
ADSP-BF527BBCZ-5AX
型号: ADSP-BF527BBCZ-5AX
厂家: ADI    ADI
描述:

IC 0-BIT, 133 MHz, OTHER DSP, PBGA208, 17 X 17 MM, MO-205AM, CSPBGA-289, Digital Signal Processor

文件: 总72页 (文件大小:1642K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Blackfin® Embedded Processor  
Preliminary Technical Data  
ADSP-BF522/523/524/525/526/527  
FEATURES  
PERIPHERALS  
Up to 600 MHz high-performance Blackfin processor  
Two 16-bit MACs, two 40-bit ALUs, four 8-bit video ALUs,  
40-bit shifter  
USB 2.0 high speed on-the-go (OTG) with Integrated PHY  
IEEE 802.3-compliant 10/100 Ethernet MAC  
Parallel peripheral interface (PPI), supporting ITU-R 656  
video data formats  
RISC-like register and instruction model for ease of  
programming and compiler-friendly support  
Advanced debug, trace, and performance monitoring  
Accepts a wide range of supply voltages for internal and I/O  
operations. See Operating Conditions for  
ADSP-BF523/525/527 on Page 29 and Operating Condi-  
tions for ADSP-BF522/524/526 on Page 27  
Programmable on-chip voltage regulator  
(ADSP-BF523/525/527 processors only)  
Host DMA port (HOSTDP)  
Two dual-channel, full-duplex synchronous serial ports  
(SPORTs), supporting eight stereo I2S channels  
12 peripheral DMAs, 2 mastered by the Ethernet MAC  
Two memory-to-memory DMAs with external request lines  
Event handler with 54 interrupt inputs  
Serial peripheral interface (SPI) compatible port  
Two UARTs with IrDA® support  
289-ball (12 mm x 12 mm) and 208-ball (17 mm x 17 mm)  
CSP_BGA packages  
Two-wire interface (TWI) controller  
Eight 32-bit timers/counters with PWM support  
32-bit up/down counter with rotary support  
Real-time clock (RTC) and watchdog timer  
32-bit core timer  
48 general-purpose I/Os (GPIOs), with programmable  
hysteresis  
NAND flash controller (NFC)  
Debug/JTAG interface  
On-chip PLL capable of 0.5
؋
to 64
؋
 frequency multiplication  
MEMORY  
132K bytes of on-chip memory:  
(See Table 1 on Page 3 for L1 and L3 memory size details)  
External memory controller with glueless support for SDRAM  
and asynchronous 8-bit and 16-bit memories  
Flexible booting options from external flash, SPI, and TWI  
memory or from host devices including SPI, TWI, and UART  
Code Security with LockboxTM Secure Technology  
One-Time-Programmable (OTP) Memory  
Memory management unit providing memory protection  
WATCHDOG TIMER  
OTP MEMORY  
RTC  
VOLTAGE REGULATOR*  
JTAG TEST AND EMULATION  
PERIPHERAL  
COUNTER  
SPORT0  
SPORT1  
UART1  
UART0  
NFC  
ACCESS BUS  
INTERRUPT  
CONTROLLER  
GPIO  
PORT F  
B
L1 INSTRUCTION  
MEMORY  
L1 DATA  
GPIO  
PORT G  
DMA  
MEMORY  
PPI  
CONTROLLER  
DMA  
ACCESS  
BUS  
EAB  
16  
SPI  
DCB  
USB  
TIMER7-1  
TIMER0  
GPIO  
PORT H  
DEB  
BOOT  
ROM  
EXTERNAL PORT  
FLASH, SDRAM CONTROL  
EMAC  
HOST DMA  
TWI  
PORT J  
*REGULATOR AVAILABLE ON ADSP-BF523/525/527 PROCESSORS ONLY  
Figure 1. Processor Block Diagram  
Blackfin and the Blackfin logo are registered trademarks of Analog Devices, Inc.  
Rev. PrE  
Information furnished by Analog Devices is believed to be accurate and reliable.  
However, no responsibility is assumed by Analog Devices for its use, nor for any  
infringements of patents or other rights of third parties that may result from its use.  
Specifications subject to change without notice. No license is granted by implication  
or otherwise under any patent or patent rights of Analog Devices. Trademarks and  
registered trademarks are the property of their respective owners.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 U.S.A.  
Tel: 781.329.4700  
Fax: 781.461.3113  
www.analog.com  
© 2008 Analog Devices, Inc. All rights reserved.  
ADSP-BF522/523/524/525/526/527  
Preliminary Technical Data  
TABLE OF CONTENTS  
General Description ................................................. 3  
Portable Low-Power Architecture ............................. 3  
System Integration ................................................ 3  
Processor Peripherals ............................................. 3  
Blackfin Processor Core .......................................... 4  
Memory Architecture ............................................ 5  
DMA Controllers .................................................. 9  
Host DMA Port .................................................... 9  
Real-Time Clock ................................................. 10  
Watchdog Timer ................................................ 10  
Timers ............................................................. 10  
Up/Down Counter and Thumbwheel Interface .......... 10  
Serial Ports ........................................................ 11  
Serial Peripheral Interface (SPI) Port ....................... 11  
UART Ports ...................................................... 11  
USB On-The-Go Dual-Role Device Controller ........... 12  
TWI Controller Interface ...................................... 12  
10/100 Ethernet MAC .......................................... 12  
Ports ................................................................ 12  
Parallel Peripheral Interface (PPI) ........................... 13  
Code Security with Lockbox Secure Technology ......... 14  
Dynamic Power Management ................................ 14  
ADSP-BF523/525/527 Voltage Regulation ................ 15  
ADSP-BF522/524/526 Voltage Regulation ................ 16  
Clock Signals ..................................................... 16  
Booting Modes ................................................... 18  
Instruction Set Description .................................... 20  
Development Tools .............................................. 21  
Designing an Emulator-Compatible  
Processor Board (Target) ................................... 21  
Related Documents .............................................. 21  
Lockbox Secure Technology Disclaimer .................... 21  
Signal Descriptions ................................................. 22  
Specifications ........................................................ 26  
Operating Conditions for ADSP-BF522/524/526 ......... 26  
Operating Conditions for ADSP-BF523/525/527 ......... 28  
Electrical Characteristics ....................................... 30  
Absolute Maximum Ratings ................................... 31  
ESD Sensitivity ................................................... 31  
Package Information ............................................ 31  
Timing Specifications ........................................... 32  
Output Drive Currents ......................................... 57  
Power Dissipation ............................................... 59  
Test Conditions .................................................. 59  
Environmental Conditions .................................... 62  
289-Ball CSP_BGA Ball assignment ............................ 63  
208-Ball CSP_BGA Ball assignment ............................ 66  
Outline Dimensions ................................................ 69  
Surface Mount Design .......................................... 70  
Ordering Guide ..................................................... 71  
REVISION HISTORY  
06/08—Revision PrE:  
Changes to processor specifications (starting on Page 27). Major  
changes include:  
Numerous small clarifications and corrections throughout  
document.  
• Added NFC timing ...................................................Page 36  
• Changes to SPI timing .............................................Page 47  
• Added UART timing ...............................................Page 49  
• Added Up/Down Counter timing ..........................Page 51  
• Changes to HOSTDP timing ............Page 52 and Page 53  
Changes to ball assignment tables .........Page 64 and Page 67  
Changes to voltage regulator in Block Diagram..........Page 1  
Changes to processor comparison data ......Table 1 on Page 3  
Changes to hibernate state description................... Page 15  
Changes to voltage regulator description ................ Page 16  
Changes to booting modes description................... Page 18  
Changes to signal descriptions ............ Table 10 on Page 23  
Added Lockbox Secure Technology Disclaimer ....... Page 21  
Rev. PrE  
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Page 2 of 72  
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August 2008  
Preliminary Technical Data  
GENERAL DESCRIPTION  
The ADSP-BF522/524/526 and ADSP-BF523/525/527 proces-  
sors are members of the Blackfin family of products,  
incorporating the Analog Devices/Intel Micro Signal Architec-  
ture (MSA). Blackfin processors combine a dual-MAC state-of-  
the-art signal processing engine, the advantages of a clean,  
orthogonal RISC-like microprocessor instruction set, and sin-  
gle-instruction, multiple-data (SIMD) multimedia capabilities  
into a single instruction-set architecture.  
The ADSP-BF522/524/526 and ADSP-BF523/525/527 proces-  
sors are completely code compatible with other Blackfin  
processors. The ADSP-BF523/525/527 processors offer perfor-  
mance up to 600 MHz. The ADSP-BF522/524/526 processors  
offer performance up to 400 MHz and reduced static power  
consumption. Differences with respect to peripheral combina-  
tions are shown in Table 1.  
ADSP-BF522/523/524/525/526/527  
By integrating a rich set of industry-leading system peripherals  
and memory, Blackfin processors are the platform of choice for  
next-generation applications that require RISC-like program-  
mability, multimedia support, and leading-edge signal  
processing in one integrated package.  
PORTABLE LOW-POWER ARCHITECTURE  
Blackfin processors provide world-class power management  
and performance. They are produced with a low power and low  
voltage design methodology and feature on-chip dynamic  
power management, which is the ability to vary both the voltage  
and frequency of operation to significantly lower overall power  
consumption. This capability can result in a substantial reduc-  
tion in power consumption, compared with just varying the  
frequency of operation. This allows longer battery life for  
portable appliances.  
Table 1. Processor Comparison  
SYSTEM INTEGRATION  
The ADSP-BF522/524/526 and ADSP-BF523/525/527 proces-  
sors are highly integrated system-on-a-chip solutions for the  
next generation of embedded network connected applications.  
By combining industry-standard interfaces with a high perfor-  
mance signal processing core, cost-effective applications can be  
developed quickly, without the need for costly external compo-  
nents. The system peripherals include an IEEE-compliant 802.3  
10/100 Ethernet MAC, a USB 2.0 high speed OTG controller, a  
TWI controller, a NAND flash controller, two UART ports, an  
SPI port, two serial ports (SPORTs), eight general purpose 32-  
bit timers with PWM capability, a core timer, a real-time clock,  
a watchdog timer, a Host DMA (HOSTDP) interface, and a par-  
allel peripheral interface (PPI).  
Feature  
Host DMA  
1
1
2
2
1
8
1
1
1
1
1
1
2
2
1
8
1
1
1
1
1
1
1
2
2
1
8
1
1
1
1
1
1
2
2
1
8
1
1
1
1
1
1
1
2
2
1
8
1
1
1
1
1
1
1
1
2
2
1
8
1
1
1
USB  
Ethernet MAC  
Internal Voltage Regulator  
TWI  
SPORTs  
UARTs  
SPI  
PROCESSOR PERIPHERALS  
GP Timers  
The ADSP-BF522/524/526 and ADSP-BF523/525/527 proces-  
sors contain a rich set of peripherals connected to the core via  
several high bandwidth buses, providing flexibility in system  
configuration as well as excellent overall system performance  
(see the block diagram on Page 1). These Blackfin processors  
contain dedicated network communication modules and high  
speed serial and parallel ports, an interrupt controller for flexi-  
ble management of interrupts from the on-chip peripherals or  
external sources, and power management control functions to  
tailor the performance and power characteristics of the proces-  
sor and system to many application scenarios.  
All of the peripherals, except for the general-purpose I/O, TWI,  
real-time clock, and timers, are supported by a flexible DMA  
structure. There are also separate memory DMA channels dedi-  
cated to data transfers between the processor's various memory  
spaces, including external SDRAM and asynchronous memory.  
Multiple on-chip buses running at up to 133 MHz provide  
enough bandwidth to keep the processor core running along  
with activity on all of the on-chip and external peripherals.  
Watchdog Timers  
RTC  
Parallel Peripheral Interface  
GPIOs  
48 48 48 48 48 48  
48K 48K 48K 48K 48K 48K  
L1 Instruction SRAM  
L1 Instruction SRAM/Cache 16K 16K 16K 16K 16K 16K  
L1 Data SRAM  
32K 32K 32K 32K 32K 32K  
32K 32K 32K 32K 32K 32K  
4K 4K 4K 4K 4K 4K  
32K 32K 32K 32K 32K 32K  
L1 Data SRAM/Cache  
L1 Scratchpad  
L3 Boot ROM  
Maximum Speed Grade1  
Maximum System Clock Speed  
Package Options  
400 MHz  
80 MHz  
600 MHz  
133 MHz  
289-Ball CSP_BGA  
208-Ball CSP_BGA  
1 Maximum speed grade is not available with every possible SCLK selection.  
Rev. PrE  
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Page 3 of 72  
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August 2008  
ADSP-BF522/523/524/525/526/527  
Preliminary Technical Data  
The ADSP-BF523/525/527 processors include an on-chip volt-  
age regulator in support of the processor’s dynamic power  
management capability. The voltage regulator provides a range  
of core voltage levels when supplied from VDDEXT. The voltage  
regulator can be bypassed at the user's discretion.  
BLACKFIN PROCESSOR CORE  
As shown in Figure 2, the Blackfin processor core contains two  
16-bit multipliers, two 40-bit accumulators, two 40-bit ALUs,  
four video ALUs, and a 40-bit shifter. The computation units  
process 8-, 16-, or 32-bit data from the register file.  
The compute register file contains eight 32-bit registers. When  
performing compute operations on 16-bit operand data, the  
register file operates as 16 independent 16-bit registers. All  
operands for compute operations come from the multiported  
register file and instruction constant fields.  
ADDRESS ARITHMETIC UNIT  
SP  
FP  
P5  
P4  
I3  
I2  
I1  
I0  
L3  
L2  
L1  
L0  
B3  
B2  
B1  
B0  
M3  
M2  
M1  
M0  
DAG1  
P3  
DAG0  
P2  
P1  
P0  
DA1  
DA0  
32  
32  
32  
PREG  
32  
RAB  
SD  
LD1  
LD0  
32  
32  
32  
ASTAT  
32  
32  
SEQUENCER  
R7.H  
R7.L  
R6.H  
R5.H  
R4.H  
R3.H  
R2.H  
R1.H  
R0.H  
R6.L  
R5.L  
R4.L  
R3.L  
R2.L  
R1.L  
R0.L  
ALIGN  
16  
16  
8
8
8
8
DECODE  
BARREL  
SHIFTER  
LOOP BUFFER  
40  
40  
40 40  
A0  
A1  
CONTROL  
UNIT  
32  
32  
DATA ARITHMETIC UNIT  
Figure 2. Blackfin Processor Core  
Each MAC can perform a 16-bit by 16-bit multiply in each  
cycle, accumulating the results into the 40-bit accumulators.  
Signed and unsigned formats, rounding, and saturation  
are supported.  
The ALUs perform a traditional set of arithmetic and logical  
operations on 16-bit or 32-bit data. In addition, many special  
instructions are included to accelerate various signal processing  
tasks. These include bit operations such as field extract and pop-  
ulation count, modulo 232 multiply, divide primitives, saturation  
and rounding, and sign/exponent detection. The set of video  
instructions include byte alignment and packing operations,  
16-bit and 8-bit adds with clipping, 8-bit average operations,  
and 8-bit subtract/absolute value/accumulate (SAA) operations.  
Also provided are the compare/select and vector search  
instructions.  
For certain instructions, two 16-bit ALU operations can be per-  
formed simultaneously on register pairs (a 16-bit high half and  
16-bit low half of a compute register). If the second ALU is used,  
quad 16-bit operations are possible.  
The 40-bit shifter can perform shifts and rotates and is used to  
support normalization, field extract, and field deposit  
instructions.  
The program sequencer controls the flow of instruction execu-  
tion, including instruction alignment and decoding. For  
program flow control, the sequencer supports PC relative and  
Rev. PrE  
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Page 4 of 72  
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August 2008  
Preliminary Technical Data  
ADSP-BF522/523/524/525/526/527  
indirect conditional jumps (with static branch prediction), and  
subroutine calls. Hardware is provided to support zero-over-  
head looping. The architecture is fully interlocked, meaning that  
the programmer need not manage the pipeline when executing  
instructions with data dependencies.  
The address arithmetic unit provides two addresses for simulta-  
neous dual fetches from memory. It contains a multiported  
register file consisting of four sets of 32-bit index, modify,  
length, and base registers (for circular buffering), and eight  
additional 32-bit pointer registers (for C-style indexed stack  
manipulation).  
Blackfin processors support a modified Harvard architecture in  
combination with a hierarchical memory structure. Level 1 (L1)  
memories are those that typically operate at the full processor  
speed with little or no latency. At the L1 level, the instruction  
memory holds instructions only. The two data memories hold  
data, and a dedicated scratchpad data memory stores stack and  
local variable information.  
In addition, multiple L1 memory blocks are provided, offering a  
configurable mix of SRAM and cache. The memory manage-  
ment unit (MMU) provides memory protection for individual  
tasks that may be operating on the core and can protect system  
registers from unintended access.  
(EBIU), provides expansion with SDRAM, flash memory, and  
SRAM, optionally accessing up to 516M bytes of  
physical memory.  
The memory DMA controller provides high-bandwidth data-  
movement capability. It can perform block transfers of code or  
data between the internal memory and the external  
memory spaces.  
0xFFFF FFFF  
CORE MMR REGISTERS (2M BYTES)  
0xFFE0 0000  
SYSTEM MMR REGISTERS (2M BYTES)  
0xFFC0 0000  
RESERVED  
0xFFB0 1000  
SCRATCHPAD SRAM (4K BYTES)  
0xFFB0 0000  
RESERVED  
0xFFA1 4000  
INSTRUCTION SRAM / CACHE (16K BYTES)  
0xFFA1 0000  
RESERVED  
0xFFA0 C000  
INSTRUCTION BANK B SRAM (16K BYTES)  
0xFFA0 8000  
INSTRUCTION BANK A SRAM (32K BYTES)  
0xFFA0 0000  
RESERVED  
0xFF90 8000  
DATA BANK B SRAM / CACHE (16K BYTES)  
0xFF90 4000  
DATA BANK B SRAM (16K BYTES)  
0xFF90 0000  
RESERVED  
The architecture provides three modes of operation: user mode,  
supervisor mode, and emulation mode. User mode has  
restricted access to certain system resources, thus providing a  
protected software environment, while supervisor mode has  
unrestricted access to the system and core resources.  
0xFF80 8000  
DATA BANK A SRAM / CACHE (16K BYTES)  
0xFF80 4000  
DATA BANK A SRAM (16K BYTES)  
0xFF80 0000  
RESERVED  
0xEF00 8000  
BOOT ROM (32K BYTES)  
0xEF00 0000  
The Blackfin processor instruction set has been optimized so  
that 16-bit opcodes represent the most frequently used instruc-  
tions, resulting in excellent compiled code density. Complex  
DSP instructions are encoded into 32-bit opcodes, representing  
fully featured multifunction instructions. Blackfin processors  
support a limited multi-issue capability, where a 32-bit instruc-  
tion can be issued in parallel with two 16-bit instructions,  
allowing the programmer to use many of the core resources in a  
single instruction cycle.  
RESERVED  
0x2040 0000  
ASYNC MEMORY BANK 3 (1M BYTES)  
0x2030 0000  
ASYNC MEMORY BANK 2 (1M BYTES)  
0x2020 0000  
ASYNC MEMORY BANK 1 (1M BYTES)  
0x2010 0000  
ASYNC MEMORY BANK 0 (1M BYTES)  
0x2000 0000  
RESERVED  
0x08 00 0000  
SDRAM MEMORY (16M BYTES  
-128M BYTES)  
0x0000 0000  
The Blackfin processor assembly language uses an algebraic syn-  
tax for ease of coding and readability. The architecture has been  
optimized for use in conjunction with the C/C++ compiler,  
resulting in fast and efficient software implementations.  
Figure 3. Internal/External Memory Map  
Internal (On-Chip) Memory  
The processor has three blocks of on-chip memory providing  
high-bandwidth access to the core.  
The first block is the L1 instruction memory, consisting of  
64K bytes SRAM, of which 16K bytes can be configured as a  
four-way set-associative cache. This memory is accessed at full  
processor speed.  
The second on-chip memory block is the L1 data memory, con-  
sisting of up to two banks of up to 32K bytes each. Each memory  
bank is configurable, offering both cache and SRAM functional-  
ity. This memory block is accessed at full processor speed.  
MEMORY ARCHITECTURE  
The Blackfin processor views memory as a single unified  
4G byte address space, using 32-bit addresses. All resources,  
including internal memory, external memory, and I/O control  
registers, occupy separate sections of this common address  
space. The memory portions of this address space are arranged  
in a hierarchical structure to provide a good cost/performance  
balance of some very fast, low-latency on-chip memory as cache  
or SRAM, and larger, lower-cost and performance off-chip  
memory systems. See Figure 3.  
The third memory block is a 4K byte scratchpad SRAM which  
runs at the same speed as the L1 memories, but is only accessible  
as data SRAM and cannot be configured as cache memory.  
The on-chip L1 memory system is the highest-performance  
memory available to the Blackfin processor. The off-chip mem-  
ory system, accessed through the external bus interface unit  
Rev. PrE  
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Page 5 of 72  
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August 2008  
ADSP-BF522/523/524/525/526/527  
Preliminary Technical Data  
OTP enables developers to store both public and private data  
on-chip. In addition to storing public and private key data for  
applications requiring security, it also allows developers to store  
completely user-definable data such as customer ID, product  
ID, MAC address, etc. Hence generic parts can be shipped  
which are then programmed and protected by the developer  
within this non-volatile memory.  
External (Off-Chip) Memory  
External memory is accessed via the EBIU. This 16-bit interface  
provides a glueless connection to a bank of synchronous DRAM  
(SDRAM) as well as up to four banks of asynchronous memory  
devices including flash, EPROM, ROM, SRAM, and memory  
mapped I/O devices.  
The SDRAM controller can be programmed to interface to up  
to 128M bytes of SDRAM. A separate row can be open for each  
SDRAM internal bank and the SDRAM controller supports up  
to 4 internal SDRAM banks, improving overall performance.  
The asynchronous memory controller can be programmed to  
control up to four banks of devices with very flexible timing  
parameters for a wide variety of devices. Each bank occupies a  
1M byte segment regardless of the size of the devices used, so  
that these banks are only contiguous if each is fully populated  
with 1M byte of memory.  
I/O Memory Space  
The processor does not define a separate I/O space. All  
resources are mapped through the flat 32-bit address space. On-  
chip I/O devices have their control registers mapped into mem-  
ory-mapped registers (MMRs) at addresses near the top of the  
4G byte address space. These are separated into two smaller  
blocks, one which contains the control MMRs for all core func-  
tions, and the other which contains the registers needed for  
setup and control of the on-chip peripherals outside of the core.  
The MMRs are accessible only in supervisor mode and appear  
as reserved space to on-chip peripherals.  
NAND Flash Controller (NFC)  
The ADSP-BF522/524/526 and ADSP-BF523/525/527 proces-  
sors provide a NAND flash controller (NFC). NAND flash  
devices provide high-density, low-cost memory. However,  
NAND flash devices also have long random access times, invalid  
blocks, and lower reliability over device lifetimes. Because of  
this, NAND flash is often used for read-only code storage. In  
this case, all DSP code can be stored in NAND flash and then  
transferred to a faster memory (such as SDRAM or SRAM)  
before execution. Another common use of NAND flash is for  
storage of multimedia files or other large data segments. In this  
case, a software file system may be used to manage reading and  
writing of the NAND flash device. The file system selects mem-  
ory segments for storage with the goal of avoiding bad blocks  
and equally distributing memory accesses across all address  
locations. Hardware features of the NFC include:  
• Support for page program, page read, and block erase of  
NAND flash devices, with accesses aligned to page  
boundaries.  
• Error checking and correction (ECC) hardware that facili-  
tates error detection and correction.  
• A single 8-bit external bus interface for commands,  
addresses and data.  
• Support for SLC (single level cell) NAND flash devices  
unlimited in size, with page sizes of 256 and 512 bytes.  
Larger page sizes can be supported in software.  
Booting  
The processor contains a small on-chip boot kernel, which con-  
figures the appropriate peripheral for booting. If the processor is  
configured to boot from boot ROM memory space, the proces-  
sor starts executing from the on-chip boot ROM. For more  
information, see Booting Modes on Page 18.  
Event Handling  
The event controller on the processor handles all asynchronous  
and synchronous events to the processor. The processor pro-  
vides event handling that supports both nesting and  
prioritization. Nesting allows multiple event service routines to  
be active simultaneously. Prioritization ensures that servicing of  
a higher-priority event takes precedence over servicing of a  
lower-priority event. The controller provides support for five  
different types of events:  
• Emulation – An emulation event causes the processor to  
enter emulation mode, allowing command and control of  
the processor via the JTAG interface.  
• RESET – This event resets the processor.  
• Nonmaskable Interrupt (NMI) – The NMI event can be  
generated by the software watchdog timer or by the NMI  
input signal to the processor. The NMI event is frequently  
used as a power-down indicator to initiate an orderly shut-  
down of the system.  
• Exceptions – Events that occur synchronously to program  
flow (in other words, the exception is taken before the  
instruction is allowed to complete). Conditions such as  
data alignment violations and undefined instructions cause  
exceptions.  
• Capability of releasing external bus interface pins during  
long accesses.  
• Support for internal bus requests of 16-bits  
• DMA engine to transfer data between internal memory and  
NAND flash device.  
• Interrupts – Events that occur asynchronously to program  
flow. They are caused by input signals, timers, and other  
peripherals, as well as by an explicit software instruction.  
One-Time Programmable Memory  
The processor has 64K bits of one-time programmable non-vol-  
atile memory that can be programmed by the developer only  
one time. It includes the array and logic to support read access  
and programming. Additionally, its pages can be write  
protected.  
Rev. PrE  
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Page 6 of 72  
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August 2008  
Preliminary Technical Data  
ADSP-BF522/523/524/525/526/527  
Each event type has an associated register to hold the return  
address and an associated return-from-event instruction. When  
an event is triggered, the state of the processor is saved on the  
supervisor stack.  
The processor event controller consists of two stages, the core  
event controller (CEC) and the system interrupt controller  
(SIC). The core event controller works with the system interrupt  
controller to prioritize and control all system events. Conceptu-  
ally, interrupts from the peripherals enter into the SIC and are  
then routed directly into the general-purpose interrupts of the  
CEC.  
Table 2. Core Event Controller (CEC)  
Priority  
(0 is Highest) Event Class  
EVT Entry  
EMU  
0
Emulation/Test Control  
1
RESET  
RST  
2
Nonmaskable Interrupt  
Exception  
NMI  
3
EVX  
4
Reserved  
5
Hardware Error  
IVHW  
IVTMR  
IVG7  
6
Core Timer  
Core Event Controller (CEC)  
7
General-Purpose Interrupt 7  
General-Purpose Interrupt 8  
General-Purpose Interrupt 9  
General-Purpose Interrupt 10  
General-Purpose Interrupt 11  
General-Purpose Interrupt 12  
General-Purpose Interrupt 13  
General-Purpose Interrupt 14  
General-Purpose Interrupt 15  
The CEC supports nine general-purpose interrupts (IVG15–7),  
in addition to the dedicated interrupt and exception events. Of  
these general-purpose interrupts, the two lowest-priority  
interrupts (IVG15–14) are recommended to be reserved for  
software interrupt handlers, leaving seven prioritized interrupt  
inputs to support the peripherals of the processor. Table 2  
describes the inputs to the CEC, identifies their names in the  
event vector table (EVT), and lists their priorities.  
8
IVG8  
9
IVG9  
10  
11  
12  
13  
14  
15  
IVG10  
IVG11  
IVG12  
IVG13  
IVG14  
IVG15  
System Interrupt Controller (SIC)  
The system interrupt controller provides the mapping and rout-  
ing of events from the many peripheral interrupt sources to the  
prioritized general-purpose interrupt inputs of the CEC.  
Although the processor provides a default mapping, the user  
can alter the mappings and priorities of interrupt events by writ-  
ing the appropriate values into the interrupt assignment  
registers (SIC_IARx). Table 3 describes the inputs into the SIC  
and the default mappings into the CEC.  
Table 3. System Interrupt Controller (SIC)  
General Purpose  
Interrupt (at RESET) Peripheral Interrupt ID  
Default  
Core Interrupt ID  
Peripheral Interrupt Event  
PLL Wakeup Interrupt  
DMA Error 0 (generic)  
DMAR0 Block Interrupt  
DMAR1 Block Interrupt  
DMAR0 Overflow Error  
DMAR1 Overflow Error  
PPI Error  
SIC Registers  
IVG7  
IVG7  
IVG7  
IVG7  
IVG7  
IVG7  
IVG7  
IVG7  
IVG7  
IVG7  
IVG7  
IVG7  
IVG7  
IVG7  
IVG8  
IVG8  
IVG9  
IVG9  
IVG9  
IVG9  
IVG10  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
2
2
2
2
3
IAR0 IMASK0, ISR0, IWR0  
IAR0 IMASK0, ISR0, IWR0  
IAR0 IMASK0, ISR0, IWR0  
IAR0 IMASK0, ISR0, IWR0  
IAR0 IMASK0, ISR0, IWR0  
IAR0 IMASK0, ISR0, IWR0  
IAR0 IMASK0, ISR0, IWR0  
IAR0 IMASK0, ISR0, IWR0  
IAR1 IMASK0, ISR0, IWR0  
IAR1 IMASK0, ISR0, IWR0  
IAR1 IMASK0, ISR0, IWR0  
IAR1 IMASK0, ISR0, IWR0  
IAR1 IMASK0, ISR0, IWR0  
IAR1 IMASK0, ISR0, IWR0  
IAR1 IMASK0, ISR0, IWR0  
IAR1 IMASK0, ISR0, IWR0  
IAR2 IMASK0, ISR0, IWR0  
IAR2 IMASK0, ISR0, IWR0  
IAR2 IMASK0, ISR0, IWR0  
IAR2 IMASK0, ISR0, IWR0  
IAR2 IMASK0, ISR0, IWR0  
1
2
3
4
5
6
MAC Status  
7
SPORT0 Status  
8
SPORT1 Status  
9
Reserved  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
Reserved  
UART0 Status  
UART1 Status  
RTC  
DMA Channel 0 (PPI/NFC)  
DMA 3 Channel (SPORT0 RX)  
DMA 4 Channel (SPORT0 TX)  
DMA 5 Channel (SPORT1 RX)  
DMA 6 Channel (SPORT1 TX)  
TWI  
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Table 3. System Interrupt Controller (SIC) (Continued)  
General Purpose  
Interrupt (at RESET) Peripheral Interrupt ID  
Default  
Core Interrupt ID  
Peripheral Interrupt Event  
DMA 7 Channel (SPI)  
DMA8 Channel (UART0 RX)  
DMA9 Channel (UART0 TX)  
DMA10 Channel (UART1 RX)  
DMA11 Channel (UART1 TX)  
OTP Memory Interrupt  
GP Counter  
SIC Registers  
IVG10  
IVG10  
IVG10  
IVG10  
IVG10  
IVG11  
IVG11  
IVG11  
IVG11  
IVG11  
IVG11  
IVG12  
IVG12  
IVG12  
IVG12  
IVG12  
IVG12  
IVG12  
IVG12  
IVG12  
IVG12  
IVG13  
IVG13  
IVG13  
IVG13  
IVG13  
IVG7  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
45  
46  
47  
48  
49  
50  
51  
52  
53  
54  
55  
3
3
3
3
3
4
4
4
4
4
4
5
5
5
5
5
5
5
5
5
5
6
6
6
6
6
0
0
0
0
3
3
3
3
3
IAR2 IMASK0, ISR0, IWR0  
IAR2 IMASK0, ISR0, IWR0  
IAR2 IMASK0, ISR0, IWR0  
IAR3 IMASK0, ISR0, IWR0  
IAR3 IMASK0, ISR0, IWR0  
IAR3 IMASK0, ISR0, IWR0  
IAR3 IMASK0, ISR0, IWR0  
IAR3 IMASK0, ISR0, IWR0  
IAR3 IMASK0, ISR0, IWR0  
IAR3 IMASK0, ISR0, IWR0  
IAR3 IMASK0, ISR0, IWR0  
IAR4 IMASK1, ISR1, IWR1  
IAR4 IMASK1, ISR1, IWR1  
IAR4 IMASK1, ISR1, IWR1  
IAR4 IMASK1, ISR1, IWR1  
IAR4 IMASK1, ISR1, IWR1  
IAR4 IMASK1, ISR1, IWR1  
IAR4 IMASK1, ISR1, IWR1  
IAR4 IMASK1, ISR1, IWR1  
IAR5 IMASK1, ISR1, IWR1  
IAR5 IMASK1, ISR1, IWR1  
IAR5 IMASK1, ISR1, IWR1  
IAR5 IMASK1, ISR1, IWR1  
IAR5 IMASK1, ISR1, IWR1  
IAR5 IMASK1, ISR1, IWR1  
IAR5 IMASK1, ISR1, IWR1  
IAR5 IMASK1, ISR1, IWR1  
IAR6 IMASK1, ISR1, IWR1  
IAR6 IMASK1, ISR1, IWR1  
IAR6 IMASK1, ISR1, IWR1  
IAR6 IMASK1, ISR1, IWR1  
IAR6 IMASK1, ISR1, IWR1  
IAR6 IMASK1, ISR1, IWR1  
IAR6 IMASK1, ISR1, IWR1  
IAR6 IMASK1, ISR1, IWR1  
DMA1 Channel (MAC RX/HOSTDP)  
Port H Interrupt A  
DMA2 Channel (MAC TX/NFC)  
Port H Interrupt B  
Timer 0  
Timer 1  
Timer 2  
Timer 3  
Timer 4  
Timer 5  
Timer 6  
Timer 7  
Port G Interrupt A  
Port G Interrupt B  
MDMA Stream 0  
MDMA Stream 1  
Software Watchdog Timer  
Port F Interrupt A  
Port F Interrupt B  
SPI Status  
NFC Status  
IVG7  
HOSTDP Status  
IVG7  
Host Read Done  
USB_EINT Interrupt  
USB_INT0 Interrupt  
USB_INT1 Interrupt  
USB_INT2 Interrupt  
USB_DMAINT Interrupt  
IVG7  
IVG10  
IVG10  
IVG10  
IVG10  
IVG10  
event has been accepted into the system. This register is  
updated automatically by the controller, but it may be writ-  
ten only when its corresponding IMASK bit is cleared.  
• CEC interrupt mask register (IMASK) – Controls the  
masking and unmasking of individual events. When a bit is  
set in the IMASK register, that event is unmasked and is  
processed by the CEC when asserted. A cleared bit in the  
IMASK register masks the event, preventing the processor  
from servicing the event even though the event may be  
latched in the ILAT register. This register may be read or  
Event Control  
The processor provides a very flexible mechanism to control the  
processing of events. In the CEC, three registers are used to  
coordinate and control events. Each register is 16 bits wide.  
• CEC interrupt latch register (ILAT) – Indicates when  
events have been latched. The appropriate bit is set when  
the processor has latched the event and cleared when the  
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written while in supervisor mode. (Note that general-pur-  
pose interrupts can be globally enabled and disabled with  
the STI and CLI instructions, respectively.)  
• CEC interrupt pending register (IPEND) – The IPEND  
register keeps track of all nested events. A set bit in the  
IPEND register indicates the event is currently active or  
nested at some level. This register is updated automatically  
by the controller but may be read while in supervisor mode.  
ler. DMA-capable peripherals include the Ethernet MAC, NFC,  
HOSTDP, USB, SPORTs, SPI port, UARTs, and PPI. Each indi-  
vidual DMA-capable peripheral has at least one dedicated DMA  
channel.  
The processor DMA controller supports both one-dimensional  
(1-D) and two-dimensional (2-D) DMA transfers. DMA trans-  
fer initialization can be implemented from registers or from sets  
of parameters called descriptor blocks.  
The SIC allows further control of event processing by providing  
three pairs of 32-bit interrupt control and status registers. Each  
register contains a bit corresponding to each of the peripheral  
interrupt events shown in Table 3 on Page 7.  
• SIC interrupt mask registers (SIC_IMASKx) – Control the  
masking and unmasking of each peripheral interrupt event.  
When a bit is set in these registers, that peripheral event is  
unmasked and is processed by the system when asserted. A  
cleared bit in the register masks the peripheral event, pre-  
venting the processor from servicing the event.  
The 2-D DMA capability supports arbitrary row and column  
sizes up to 64K elements by 64K elements, and arbitrary row  
and column step sizes up to 32K elements. Furthermore, the  
column step size can be less than the row step size, allowing  
implementation of interleaved data streams. This feature is  
especially useful in video applications where data can be de-  
interleaved on the fly.  
Examples of DMA types supported by the processor DMA con-  
troller include:  
• A single, linear buffer that stops upon completion  
• SIC interrupt status registers (SIC_ISRx) – As multiple  
peripherals can be mapped to a single event, these registers  
allow the software to determine which peripheral event  
source triggered the interrupt. A set bit indicates the  
peripheral is asserting the interrupt, and a cleared bit indi-  
cates the peripheral is not asserting the event.  
• A circular, auto-refreshing buffer that interrupts on each  
full or fractionally full buffer  
• 1-D or 2-D DMA using a linked list of descriptors  
• 2-D DMA using an array of descriptors, specifying only the  
base DMA address within a common page  
• SIC interrupt wakeup enable registers (SIC_IWRx) – By  
enabling the corresponding bit in these registers, a periph-  
eral can be configured to wake up the processor, should the  
core be idled or in sleep mode when the event is generated.  
For more information see Dynamic Power Management on  
Page 14.  
Because multiple interrupt sources can map to a single general-  
purpose interrupt, multiple pulse assertions can occur simulta-  
neously, before or during interrupt processing for an interrupt  
event already detected on this interrupt input. The IPEND reg-  
ister contents are monitored by the SIC as the interrupt  
acknowledgement.  
The appropriate ILAT register bit is set when an interrupt rising  
edge is detected (detection requires two core clock cycles). The  
bit is cleared when the respective IPEND register bit is set. The  
IPEND bit indicates that the event has entered into the proces-  
sor pipeline. At this point the CEC recognizes and queues the  
next rising edge event on the corresponding event input. The  
minimum latency from the rising edge transition of the general-  
purpose interrupt to the IPEND output asserted is three core  
clock cycles; however, the latency can be much higher, depend-  
ing on the activity within and the state of the processor.  
In addition to the dedicated peripheral DMA channels, there are  
two memory DMA channels provided for transfers between the  
various memories of the processor system. This enables trans-  
fers of blocks of data between any of the memories—including  
external SDRAM, ROM, SRAM, and flash memory—with mini-  
mal processor intervention. Memory DMA transfers can be  
controlled by a very flexible descriptor-based methodology or  
by a standard register-based autobuffer mechanism.  
The processor also has an external DMA controller capability  
via dual external DMA request pins when used in conjunction  
with the external bus interface unit (EBIU). This functionality  
can be used when a high speed interface is required for external  
FIFOs and high bandwidth communications peripherals such as  
USB 2.0. It allows control of the number of data transfers for  
memory DMA. The number of transfers per edge is program-  
mable. This feature can be programmed to allow memory DMA  
to have an increased priority on the external bus relative to the  
core.  
HOST DMA PORT  
The host port interface allows an external host to be a DMA  
master to transfer data in and out of the device. The host device  
masters the transactions and the Blackfin is the DMA slave.  
The host port is enabled through the PAB interface. Once  
enabled, the DMA is controlled by the external host, which can  
then program the DMA to send/receive data to any valid inter-  
nal or external memory location.  
The host port interface controller has the following features.  
• Allows external master to configure DMA read/write data  
transfers and read port status.  
DMA CONTROLLERS  
The processor has multiple, independent DMA channels that  
support automated data transfers with minimal overhead for  
the processor core. DMA transfers can occur between the pro-  
cessor's internal memories and any of its DMA-capable  
peripherals. Additionally, DMA transfers can be accomplished  
between any of the DMA-capable peripherals and external  
devices connected to the external memory interfaces, including  
the SDRAM controller and the asynchronous memory control-  
• Uses asynchronous memory protocol for external interface.  
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• 8-/16-bit external data interface to host device.  
• Half duplex operation  
Connect RTC pins RTXI and RTXO with external components  
as shown in Figure 4.  
• Little-/big-endian data transfer.  
• Acknowledge mode allows flow control on host  
transactions.  
• Interrupt mode guarantees a burst of FIFO depth host  
transactions.  
RTXI  
RTXO  
R1  
X1  
C1  
C2  
REAL-TIME CLOCK  
The real-time clock (RTC) provides a robust set of digital watch  
features, including current time, stopwatch, and alarm. The  
RTC is clocked by a 32.768 kHz crystal external to the  
Blackfin processor. The RTC peripheral has dedicated power  
supply pins so that it can remain powered up and clocked even  
when the rest of the processor is in a low-power state. The RTC  
provides several programmable interrupt options, including  
interrupt per second, minute, hour, or day clock ticks, interrupt  
on programmable stopwatch countdown, or interrupt at a pro-  
grammed alarm time.  
SUGGESTED COMPONENTS:  
X1 = ECLIPTEK EC38J (THROUGH-HOLE PACKAGE) OR  
EPSON MC405 12 pF LOAD (SURFACE-MOUNT PACKAGE)  
C1 = 22 pF  
C2 = 22 pF  
R1 = 10 MΩ  
NOTE: C1 AND C2 ARE SPECIFIC TO CRYSTAL SPECIFIED FOR X1.  
CONTACT CRYSTAL MANUFACTURER FOR DETAILS. C1 AND C2  
SPECIFICATIONS ASSUME BOARD TRACE CAPACITANCE OF 3 pF.  
Figure 4. External Components for RTC  
The 32.768 kHz input clock frequency is divided down to a 1 Hz  
signal by a prescaler. The counter function of the timer consists  
of four counters: a 60-second counter, a 60-minute counter, a  
24-hour counter, and an 32,768-day counter.  
When enabled, the alarm function generates an interrupt when  
the output of the timer matches the programmed value in the  
alarm control register. There are two alarms: The first alarm is  
for a time of day. The second alarm is for a day and time of  
that day.  
The stopwatch function counts down from a programmed  
value, with one-second resolution. When the stopwatch is  
enabled and the counter underflows, an interrupt is generated.  
Like the other peripherals, the RTC can wake up the processor  
from sleep mode upon generation of any RTC wakeup event.  
Additionally, an RTC wakeup event can wake up the processor  
from deep sleep mode or cause a transition from the hibernate  
state.  
WATCHDOG TIMER  
The processor includes a 32-bit timer that can be used to imple-  
ment a software watchdog function. A software watchdog can  
improve system availability by forcing the processor to a known  
state through generation of a hardware reset, nonmaskable  
interrupt (NMI), or general-purpose interrupt, if the timer  
expires before being reset by software. The programmer initial-  
izes the count value of the timer, enables the appropriate  
interrupt, then enables the timer. Thereafter, the software must  
reload the counter before it counts to zero from the pro-  
grammed value. This protects the system from remaining in an  
unknown state where software, which would normally reset the  
timer, has stopped running due to an external noise condition  
or software error.  
If configured to generate a hardware reset, the watchdog timer  
resets both the core and the processor peripherals. After a reset,  
software can determine if the watchdog was the source of the  
hardware reset by interrogating a status bit in the watchdog  
timer control register.  
The timer is clocked by the system clock (SCLK), at a maximum  
frequency of fSCLK  
.
TIMERS  
There are nine general-purpose programmable timer units in  
the processors. Eight timers have an external pin that can be  
configured either as a pulse width modulator (PWM) or timer  
output, as an input to clock the timer, or as a mechanism for  
measuring pulse widths and periods of external events. These  
timers can be synchronized to an external clock input to the sev-  
eral other associated PF pins, an external clock input to the  
PPI_CLK input pin, or to the internal SCLK.  
The timer units can be used in conjunction with the two UARTs  
to measure the width of the pulses in the data stream to provide  
a software auto-baud detect function for the respective serial  
channels.  
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The timers can generate interrupts to the processor core provid-  
ing periodic events for synchronization, either to the system  
clock or to a count of external signals.  
In addition to the eight general-purpose programmable timers,  
a ninth timer is also provided. This extra timer is clocked by the  
internal processor clock and is typically used as a system tick  
clock for generation of operating system periodic interrupts.  
• DMA operations with single-cycle overhead – Each SPORT  
can automatically receive and transmit multiple buffers of  
memory data. The processor can link or chain sequences of  
DMA transfers between a SPORT and memory.  
• Interrupts – Each transmit and receive port generates an  
interrupt upon completing the transfer of a data word or  
after transferring an entire data buffer, or buffers,  
through DMA.  
UP/DOWN COUNTER AND THUMBWHEEL  
INTERFACE  
• Multichannel capability – Each SPORT supports 128 chan-  
nels out of a 1024-channel window and is compatible with  
the H.100, H.110, MVIP-90, and HMVIP standards.  
A 32-bit up/down counter is provided that can sense 2-bit  
quadrature or binary codes as typically emitted by industrial  
drives or manual thumb wheels. The counter can also operate in  
general-purpose up/down count modes. Then, count direction  
is either controlled by a level-sensitive input pin or by two edge  
detectors.  
SERIAL PERIPHERAL INTERFACE (SPI) PORT  
The processors have an SPI-compatible port that enables the  
processor to communicate with multiple SPI-compatible  
devices.  
A third input can provide flexible zero marker support and can  
alternatively be used to input the push-button signal of thumb  
wheels. All three pins have a programmable debouncing circuit.  
An internal signal forwarded to the timer unit enables one timer  
to measure the intervals between count events. Boundary regis-  
ters enable auto-zero operation or simple system warning by  
interrupts when programmable count values are exceeded.  
The SPI interface uses three pins for transferring data: two data  
pins (Master Output-Slave Input, MOSI, and Master Input-  
Slave Output, MISO) and a clock pin (serial clock, SCK). An SPI  
chip select input pin (SPISS) lets other SPI devices select the  
processor, and seven SPI chip select output pins (SPISEL7–1) let  
the processor select other SPI devices. The SPI select pins are  
reconfigured general-purpose I/O pins. Using these pins, the  
SPI port provides a full-duplex, synchronous serial interface,  
which supports both master/slave modes and multimaster  
environments.  
The SPI port’s baud rate and clock phase/polarities are pro-  
grammable, and it has an integrated DMA channel,  
configurable to support transmit or receive data streams. The  
SPI’s DMA channel can only service unidirectional accesses at  
any given time.  
SERIAL PORTS  
The processors incorporate two dual-channel synchronous  
serial ports (SPORT0 and SPORT1) for serial and multiproces-  
sor communications. The SPORTs support the following  
features:  
• I2S capable operation.  
• Bidirectional operation – Each SPORT has two sets of inde-  
pendent transmit and receive pins, enabling eight channels  
of I2S stereo audio.  
• Buffered (8-deep) transmit and receive ports – Each port  
has a data register for transferring data words to and from  
other processor components and shift registers for shifting  
data in and out of the data registers.  
The SPI port’s clock rate is calculated as:  
fSCLK  
2 × SPI_BAUD  
-----------------------------------  
SPI Clock Rate =  
Where the 16-bit SPI_BAUD register contains a value of 2  
to 65,535.  
• Clocking – Each transmit and receive port can either use an  
external serial clock or generate its own, in frequencies  
ranging from (fSCLK/131,070) Hz to (fSCLK/2) Hz.  
• Word length – Each SPORT supports serial data words  
from 3 to 32 bits in length, transferred most-significant-bit  
first or least-significant-bit first.  
• Framing – Each transmit and receive port can run with or  
without frame sync signals for each data word. Frame sync  
signals can be generated internally or externally, active high  
or low, and with either of two pulse widths and early or late  
frame sync.  
During transfers, the SPI port simultaneously transmits and  
receives by serially shifting data in and out on its two serial data  
lines. The serial clock line synchronizes the shifting and sam-  
pling of data on the two serial data lines.  
UART PORTS  
The processors provide two full-duplex universal asynchronous  
receiver/transmitter (UART) ports, which are fully compatible  
with PC-standard UARTs. Each UART port provides a simpli-  
fied UART interface to other peripherals or hosts, supporting  
full-duplex, DMA-supported, asynchronous transfers of serial  
• Companding in hardware – Each SPORT can perform  
A-law or μ-law companding according to ITU recommen-  
dation G.711. Companding can be selected on the transmit  
and/or receive channel of the SPORT without  
additional latencies.  
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data. A UART port includes support for five to eight data bits,  
one or two stop bits, and none, even, or odd parity. Each UART  
port supports two modes of operation:  
utilizes two pins for transferring clock (SCL) and data (SDA)  
and supports the protocol at speeds up to 400k bits/sec. The  
TWI interface pins are compatible with 5 V logic levels.  
• PIO (programmed I/O) – The processor sends or receives  
data by writing or reading I/O mapped UART registers.  
The data is double-buffered on both transmit and receive.  
Additionally, the TWI module is fully compatible with serial  
camera control bus (SCCB) functionality for easier control of  
various CMOS camera sensor devices.  
• DMA (direct memory access) – The DMA controller trans-  
fers both transmit and receive data. This reduces the  
number and frequency of interrupts required to transfer  
data to and from memory. The UART has two dedicated  
DMA channels, one for transmit and one for receive. These  
DMA channels have lower default priority than most DMA  
channels because of their relatively low service rates.  
Each UART port's baud rate, serial data format, error code gen-  
eration and status, and interrupts are programmable:  
• Supporting bit rates ranging from (fSCLK/1,048,576) to  
(fSCLK/16) bits per second.  
10/100 ETHERNET MAC  
The ADSP-BF526 and ADSP-BF527 processors offer the capa-  
bility to directly connect to a network by way of an embedded  
Fast Ethernet Media Access Controller (MAC) that supports  
both 10-BaseT (10M bits/sec) and 100-BaseT (100M bits/sec)  
operation. The 10/100 Ethernet MAC peripheral on the proces-  
sor is fully compliant to the IEEE 802.3-2002 standard and it  
provides programmable features designed to minimize supervi-  
sion, bus use, or message processing by the rest of the processor  
system.  
Some standard features are:  
• Support of MII and RMII protocols for external PHYs.  
• Full duplex and half duplex modes.  
• Supporting data formats from seven to 12 bits per frame.  
• Both transmit and receive operations can be configured to  
generate maskable interrupts to the processor.  
• Data framing and encapsulation: generation and detection  
of preamble, length padding, and FCS.  
The UART port’s clock rate is calculated as:  
fSCLK  
16 × UART_Divisor  
• Media access management (in half-duplex operation): col-  
lision and contention handling, including control of  
retransmission of collision frames and of back-off timing.  
• Flow control (in full-duplex operation): generation and  
detection of PAUSE frames.  
• Station management: generation of MDC/MDIO frames  
for read-write access to PHY registers.  
• SCLK operating range down to 25 MHz (active and sleep  
operating modes).  
• Internal loopback from Tx to Rx.  
Some advanced features are:  
• Buffered crystal output to external PHY for support of a  
single crystal system.  
• Automatic checksum computation of IP header and IP  
payload fields of Rx frames.  
• Independent 32-bit descriptor-driven Rx and Tx DMA  
channels.  
• Frame status delivery to memory via DMA, including  
frame completion semaphores, for efficient buffer queue  
management in software.  
• Tx DMA support for separate descriptors for MAC header  
and payload to eliminate buffer copy operations.  
• Convenient frame alignment modes support even 32-bit  
alignment of encapsulated Rx or Tx IP packet data in mem-  
ory after the 14-byte MAC header.  
-----------------------------------------------  
UART Clock Rate =  
Where the 16-bit UART_Divisor comes from the UART_DLH  
(most significant 8 bits) and UART_DLL (least significant  
8 bits) registers.  
In conjunction with the general-purpose timer functions, auto-  
baud detection is supported.  
The capabilities of the UARTs are further extended with sup-  
port for the infrared data association (IrDA®) serial infrared  
physical layer link specification (SIR) protocol.  
USB ON-THE-GO DUAL-ROLE DEVICE CONTROLLER  
The USB OTG controller provides a low-cost connectivity solu-  
tion for consumer mobile devices such as cell phones, digital  
still cameras and MP3 players, allowing these devices to transfer  
data using a point-to-point USB connection without the need  
for a PC host. The USBDRC module can operate in a traditional  
USB peripheral-only mode as well as the host mode presented  
in the On-The-Go (OTG) supplement to the USB 2.0 Specifica-  
tion. In host mode, the USB module supports transfers at high-  
speed (480Mbps), full-speed (12Mbps), and low-speed  
(1.5Mbps) rates. Peripheral-only mode supports the high- and  
full-speed transfer rates.  
TWI CONTROLLER INTERFACE  
The processors include a two wire interface (TWI) module for  
providing a simple exchange method of control data between  
multiple devices. The TWI is compatible with the widely used  
I2C® bus standard. The TWI module offers the capabilities of  
simultaneous master and slave operation, support for both 7-bit  
addressing and multimedia data arbitration. The TWI interface  
Rev. PrE  
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Preliminary Technical Data  
ADSP-BF522/523/524/525/526/527  
• Programmable Ethernet event interrupt supports any com-  
bination of:  
toggle pin values, and one register is written in order to  
specify a pin value. Reading the GPIO status register allows  
software to interrogate the sense of the pins.  
• Any selected Rx or Tx frame status conditions.  
• PHY interrupt condition.  
• Wakeup frame detected.  
• Any selected MAC management counter(s) at half-  
full.  
• DMA descriptor error.  
• GPIO interrupt mask registers – The two GPIO interrupt  
mask registers allow each individual GPIO pin to function  
as an interrupt to the processor. Similar to the two GPIO  
control registers that are used to set and clear individual  
pin values, one GPIO interrupt mask register sets bits to  
enable interrupt function, and the other GPIO interrupt  
mask register clears bits to disable interrupt function.  
GPIO pins defined as inputs can be configured to generate  
hardware interrupts, while output pins can be triggered by  
software interrupts.  
• 47 MAC management statistics counters with selectable  
clear-on-read behavior and programmable interrupts on  
half maximum value.  
• Programmable Rx address filters, including a 64-bin  
address hash table for multicast and/or unicast frames, and  
programmable filter modes for broadcast, multicast, uni-  
cast, control, and damaged frames.  
• Advanced power management supporting unattended  
transfer of Rx and Tx frames and status to/from external  
memory via DMA during low-power sleep mode.  
• GPIO interrupt sensitivity registers – The two GPIO inter-  
rupt sensitivity registers specify whether individual pins are  
level- or edge-sensitive and specify—if edge-sensitive—  
whether just the rising edge or both the rising and falling  
edges of the signal are significant. One register selects the  
type of sensitivity, and one register selects which edges are  
significant for edge-sensitivity.  
• System wakeup from sleep operating mode upon magic  
packet or any of four user-definable wakeup frame filters.  
• Support for 802.3Q tagged VLAN frames.  
• Programmable MDC clock rate and preamble suppression.  
• In RMII operation, seven unused pins may be configured  
as GPIO pins for other purposes.  
PARALLEL PERIPHERAL INTERFACE (PPI)  
The processor provides a parallel peripheral interface (PPI) that  
can connect directly to parallel A/D and D/A converters, video  
encoders and decoders, and other general-purpose peripherals.  
The PPI consists of a dedicated input clock pin, up to three  
frame synchronization pins, and up to 16 data pins. The input  
clock supports parallel data rates up to half the system clock rate  
and the synchronization signals can be configured as either  
inputs or outputs.  
The PPI supports a variety of general-purpose and ITU-R 656  
modes of operation. In general-purpose mode, the PPI provides  
half-duplex, bidirectional data transfer with up to 16 bits of  
data. Up to three frame synchronization signals are also pro-  
vided. In ITU-R 656 mode, the PPI provides half-duplex  
bidirectional transfer of 8- or 10-bit video data. Additionally,  
on-chip decode of embedded start-of-line (SOL) and start-of-  
field (SOF) preamble packets is supported.  
PORTS  
Because of the rich set of peripherals, the processor groups the  
many peripheral signals to four ports—Port F, Port G, Port H,  
and Port J. Most of the associated pins are shared by multiple  
signals. The ports function as multiplexer controls.  
General-Purpose I/O (GPIO)  
The processor has 48 bidirectional, general-purpose I/O (GPIO)  
pins allocated across three separate GPIO modules—PORTFIO,  
PORTGIO, and PORTHIO, associated with Port F, Port G, and  
Port H, respectively. Port J does not provide GPIO functional-  
ity. Each GPIO-capable pin shares functionality with other  
processor peripherals via a multiplexing scheme; however, the  
GPIO functionality is the default state of the device upon  
power-up. Neither GPIO output nor input drivers are active by  
default. Each general-purpose port pin can be individually con-  
trolled by manipulation of the port control, status, and interrupt  
registers:  
General-Purpose Mode Descriptions  
The general-purpose modes of the PPI are intended to suit a  
wide variety of data capture and transmission applications.  
Three distinct submodes are supported:  
1. Input mode – Frame syncs and data are inputs into the PPI.  
2. Frame capture mode – Frame syncs are outputs from the  
PPI, but data are inputs.  
• GPIO direction control register – Specifies the direction of  
each individual GPIO pin as input or output.  
3. Output mode – Frame syncs and data are outputs from the  
PPI.  
• GPIO control and status registers – The processor employs  
a “write one to modify” mechanism that allows any combi-  
nation of individual GPIO pins to be modified in a single  
instruction, without affecting the level of any other GPIO  
pins. Four control registers are provided. One register is  
written in order to set pin values, one register is written in  
order to clear pin values, one register is written in order to  
Input Mode  
Input mode is intended for ADC applications, as well as video  
communication with hardware signaling. In its simplest form,  
PPI_FS1 is an external frame sync input that controls when to  
read data. The PPI_DELAY MMR allows for a delay (in  
PPI_CLK cycles) between reception of this frame sync and the  
initiation of data reads. The number of input data samples is  
Rev. PrE  
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ADSP-BF522/523/524/525/526/527  
Preliminary Technical Data  
user programmable and defined by the contents of the  
PPI_COUNT register. The PPI supports 8-bit and 10-bit  
through 16-bit data, programmable in the PPI_CONTROL  
register.  
CODE SECURITY WITH LOCKBOX SECURE  
TECHNOLOGY  
A security system consisting of a blend of hardware and soft-  
ware provides customers with a flexible and rich set of code  
security features with Lockbox secure technology. Key features  
include:  
• OTP memory  
• Unique chip ID  
• Code authentication  
• Secure mode of operation  
Frame Capture Mode  
Frame capture mode allows the video source(s) to act as a slave  
(for frame capture for example). The ADSP-BF522/524/526 and  
ADSP-BF523/525/527 processors control when to read from the  
video source(s). PPI_FS1 is an HSYNC output and PPI_FS2 is a  
VSYNC output.  
Output Mode  
The security scheme is based upon the concept of authentica-  
tion of digital signatures using standards-based algorithms and  
provides a secure processing environment in which to execute  
code and protect assets. See Lockbox Secure Technology Dis-  
claimer on Page 21.  
Output mode is used for transmitting video or other data with  
up to three output frame syncs. Typically, a single frame sync is  
appropriate for data converter applications, whereas two or  
three frame syncs could be used for sending video with hard-  
ware signaling.  
DYNAMIC POWER MANAGEMENT  
ITU-R 656 Mode Descriptions  
The processor provides four operating modes, each with a dif-  
ferent performance/power profile. In addition, dynamic power  
management provides the control functions to dynamically alter  
the processor core supply voltage, further reducing power dissi-  
pation. When configured for a 0 volt core supply voltage, the  
processor enters the hibernate state. Control of clocking to each  
of the processor peripherals also reduces power consumption.  
See Table 4 for a summary of the power settings for each mode.  
The ITU-R 656 modes of the PPI are intended to suit a wide  
variety of video capture, processing, and transmission applica-  
tions. Three distinct submodes are supported:  
1. Active video only mode  
2. Vertical blanking only mode  
3. Entire field mode  
Active Video Mode  
Full-On Operating Mode—Maximum Performance  
Active video only mode is used when only the active video por-  
tion of a field is of interest and not any of the blanking intervals.  
The PPI does not read in any data between the end of active  
video (EAV) and start of active video (SAV) preamble symbols,  
or any data present during the vertical blanking intervals. In this  
mode, the control byte sequences are not stored to memory;  
they are filtered by the PPI. After synchronizing to the start of  
Field 1, the PPI ignores incoming samples until it sees an SAV  
code. The user specifies the number of active video lines per  
frame (in PPI_COUNT register).  
In the full-on mode, the PLL is enabled and is not bypassed,  
providing capability for maximum operational frequency. This  
is the power-up default execution state in which maximum per-  
formance can be achieved. The processor core and all enabled  
peripherals run at full speed.  
Active Operating Mode—Moderate Dynamic Power  
Savings  
In the active mode, the PLL is enabled but bypassed. Because the  
PLL is bypassed, the processor’s core clock (CCLK) and system  
clock (SCLK) run at the input clock (CLKIN) frequency. DMA  
access is available to appropriately configured  
L1 memories.  
Vertical Blanking Interval Mode  
In this mode, the PPI only transfers vertical blanking interval  
(VBI) data.  
In the active mode, it is possible to disable the PLL through the  
PLL control register (PLL_CTL). If disabled, the PLL must be  
re-enabled before transitioning to the full-on or sleep modes.  
Entire Field Mode  
In this mode, the entire incoming bit stream is read in through  
the PPI. This includes active video, control preamble sequences,  
and ancillary data that may be embedded in horizontal and ver-  
tical blanking intervals. Data transfer starts immediately after  
synchronization to Field 1. Data is transferred to or from the  
synchronous channels through eight DMA engines that work  
autonomously from the processor core.  
Table 4. Power Settings  
Core  
Clock  
System  
Clock  
PLL  
Core  
Mode/State PLL  
Bypassed (CCLK) (SCLK) Power  
Full On  
Active  
Enabled No  
Enabled/ Yes  
Disabled  
Enabled Enabled On  
Enabled Enabled On  
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Preliminary Technical Data  
ADSP-BF522/523/524/525/526/527  
Table 4. Power Settings (Continued)  
The Ethernet or USB modules can wake up the internal supply  
regulator (ADSP-BF525 and ADSP-BF527 only) or signal an  
external regulator to wake up using EXT_WAKE0 or  
EXT_WAKE1. If PG15 does not connect as a PHYINT signal to  
an external PHY device, PG15 can be pulled low by any other  
device to wake the processor up. The processor can also be  
woken up by a real-time clock wakeup event or by asserting the  
RESET pin. All hibernate wakeup events initiate the hardware  
reset sequence. Individual sources are enabled by the VR_CTL  
register. The EXT_WAKEx signals are provided to indicate the  
occurrence of wakeup events.  
Core  
Clock  
System  
Clock  
PLL  
Core  
Mode/State PLL  
Bypassed (CCLK) (SCLK) Power  
Sleep  
Enabled  
Disabled Enabled On  
Disabled Disabled On  
Disabled Disabled Off  
Deep Sleep Disabled  
Hibernate  
Disabled  
Sleep Operating Mode—High Dynamic Power Savings  
The sleep mode reduces dynamic power dissipation by disabling  
the clock to the processor core (CCLK). The PLL and system  
clock (SCLK), however, continue to operate in this mode. Typi-  
cally an external event or RTC activity wakes up the processor.  
When in the sleep mode, asserting a wakeup enabled in the  
SIC_IWRx registers causes the processor to sense the value of  
the BYPASS bit in the PLL control register (PLL_CTL). If  
BYPASS is disabled, the processor transitions to the full on  
mode. If BYPASS is enabled, the processor transitions to the  
active mode.  
As long as VDDEXT is applied, the VR_CTL register maintains its  
state during hibernation. All other internal registers and memo-  
ries, however, lose their content in the hibernate state. State  
variables may be held in external SRAM or SDRAM. The SCK-  
ELOW bit in the VR_CTL register controls whether or not  
SDRAM operates in self-refresh mode, which allows it to retain  
its content while the processor is in hibernate and through the  
subsequent reset sequence.  
Power Savings  
System DMA access to L1 memory is not supported in  
sleep mode.  
As shown in Table 5, the processor supports six different power  
domains, which maximizes flexibility while maintaining com-  
pliance with industry standards and conventions. By isolating  
the internal logic of the processor into its own power domain,  
separate from the RTC and other I/O, the processor can take  
advantage of dynamic power management without affecting the  
RTC or other I/O devices. There are no sequencing require-  
ments for the various power domains, but all domains must be  
powered according to the appropriate Specifications table for  
processor Operating Conditions; even if the feature/peripheral  
is not used.  
Deep Sleep Operating Mode—Maximum Dynamic Power  
Savings  
The deep sleep mode maximizes dynamic power savings by dis-  
abling the clocks to the processor core (CCLK) and to all  
synchronous peripherals (SCLK). Asynchronous peripherals,  
such as the RTC, may still be running but cannot access internal  
resources or external memory. This powered-down mode can  
only be exited by assertion of the reset interrupt (RESET) or by  
an asynchronous interrupt generated by the RTC. When in deep  
sleep mode, an RTC asynchronous interrupt causes the proces-  
sor to transition to the Active mode. Assertion of RESET while  
in deep sleep mode causes the processor to transition to the full  
on mode.  
Table 5. Power Domains  
Power Domain  
VDD Range  
All internal logic, except RTC, Memory, USB, OTP VDDINT  
RTC internal logic and crystal I/O  
Memory logic  
VDDRTC  
VDDMEM  
VDDUSB  
VDDOTP  
VDDEXT  
Hibernate State—Maximum Static Power Savings  
The hibernate state maximizes static power savings by disabling  
the voltage and clocks to the processor core (CCLK) and to all of  
the synchronous peripherals (SCLK). The internal voltage regu-  
lator (ADSP-BF523/525/527 only) for the processor can be shut  
off by writing b#00 to the FREQ bits of the VR_CTL register.  
This setting sets the internal power supply voltage (VDDINT) to  
0 V to provide the lowest static power dissipation. Any critical  
information stored internally (for example, memory contents,  
register contents, and other information) must be written to a  
non-volatile storage device prior to removing power if the pro-  
cessor state is to be preserved. Writing b#00 to the FREQ bits  
also causes EXT_WAKE0 and EXT_WAKE1 to transition low,  
which can be used to signal an external voltage regulator to shut  
down.  
USB PHY logic  
OTP logic  
All other I/O  
The dynamic power management feature of the processor  
allows both the processor’s input voltage (VDDINT) and clock fre-  
quency (fCCLK) to be dynamically controlled.  
The power dissipated by a processor is largely a function of its  
clock frequency and the square of the operating voltage. For  
example, reducing the clock frequency by 25% results in a 25%  
reduction in dynamic power dissipation, while reducing the  
voltage by 25% reduces dynamic power dissipation by more  
than 40%. Further, these power savings are additive, in that if  
the clock frequency and supply voltage are both reduced, the  
power savings can be dramatic, as shown in the following  
equations.  
Since VDDEXT and VDDMEM can still be supplied in this mode, all  
of the external pins three-state, unless otherwise specified. This  
allows other devices that may be connected to the processor to  
still have power applied without drawing unwanted current.  
Rev. PrE  
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ADSP-BF522/523/524/525/526/527  
Preliminary Technical Data  
The voltage regulator has two modes set by the VRSEL pin—the  
normal pulse width control of an external FET and the external  
supply mode which can signal a power down during hibernate  
to an external regulator. Set VRSEL to VDDEXT to use an external  
regulator or set VRSEL to GND to use the internal regulator. In  
the external mode VROUT becomes EXT_WAKE1. If the internal  
regulator is used, EXT_WAKE0 can control other power  
sources in the system during the hibernate state. Both signals  
are high-true for power-up and may be connected directly to the  
low-true shut down input of many common regulators. The  
mode of the SS/PG (Soft Start/Power Good) signal also changes  
according to the state of VRSEL. When using an internal regula-  
tor, the SS/PG pin is Soft Start, and when using an external  
regulator, it is Power Good. The Soft Start feature is recom-  
mended to reduce the inrush currents and to reduce VDDINT  
voltage overshoot when coming out of hibernate or changing  
voltage levels. The Power Good (PG) input signal allows the  
processor to start only after the internal voltage has reached a  
chosen level. In this way, the startup time of the external regula-  
tor is detected after hibernation. For a complete description of  
Soft Start and Power Good functionality, refer to the ADSP-  
BF52x Blackfin Processor Hardware Reference.  
Power Savings Factor  
2
fCCLKRED  
-------------------------  
fCCLKNOM  
VDDINTRED  
-------------------------------  
VDDINTNOM  
TRED  
--------------  
TNOM  
=
×
×
% Power Savings = (1 Power Savings Factor) × 100%  
where the variables in the equations are:  
f
f
CCLKNOM is the nominal core clock frequency  
CCLKRED is the reduced core clock frequency  
V
V
DDINTNOM is the nominal internal supply voltage  
DDINTRED is the reduced internal supply voltage  
T
T
NOM is the duration running at fCCLKNOM  
RED is the duration running at fCCLKRED  
ADSP-BF523/525/527 VOLTAGE REGULATION  
The ADSP-BF523/525/527 provides an on-chip voltage regula-  
tor that can generate processor core voltage levels from an  
external supply. Figure 5 shows the typical external components  
required to complete the power management system. The regu-  
lator controls the internal logic voltage levels and is  
ADSP-BF522/524/526 VOLTAGE REGULATION  
The ADSP-BF522/524/526 processor requires an external volt-  
age regulator to power the VDDINT domain. To reduce standby  
power consumption, the external voltage regulator can be sig-  
naled through EXT_WAKE0 or EXT_WAKE1 to remove power  
from the processor core. These identical signals are high-true  
for power-up and may be connected directly to the low-true  
shut down input of many common regulators. While in the  
programmable with the voltage regulator control register  
(VR_CTL) in increments of 50 mV. To reduce standby power  
consumption, the internal voltage regulator can be programmed  
to remove power to the processor core while keeping I/O power  
supplied. While in the hibernate state, all external supplies  
(VDDEXT, VDDMEM, VDDUSB, VDDOTP) can still be applied, eliminat-  
ing the need for external buffers. VDDRTC must be applied at all  
times for correct hibernate operation. The voltage regulator can  
be activated from this power down state either through an RTC  
wakeup, a USB wakeup, an ethernet wakeup, or by asserting the  
RESET pin, each of which then initiates a boot sequence. The  
regulator can also be disabled and bypassed at the user’s  
discretion.  
hibernate state, all external supplies (VDDEXT, VDDMEM, VDDUSB  
,
VDDOTP) can still be applied, eliminating the need for external  
buffers. VDDRTC must be applied at all times for correct hibernate  
operation. The external voltage regulator can be activated from  
this power down state either through an RTC wakeup, a USB  
wakeup, an ethernet wakeup, or by asserting the RESET pin,  
each of which then initiates a boot sequence. EXT_WAKE0 or  
EXT_WAKE1 indicate a wakeup to the external voltage regula-  
tor. The Power Good (PG) input signal allows the processor to  
start only after the internal voltage has reached a chosen level. In  
this way, the startup time of the external regulator is detected  
after hibernation. For a complete description of the Power Good  
functionality, refer to the ADSP-BF52x Blackfin Processor Hard-  
ware Reference.  
SET OF DECOUPLING  
CAPACITORS  
2.25V TO 3.6V  
INPUT VOLTAGE  
RANGE  
V
DDEXT  
(LOW-INDUCTANCE)  
V
V
DDEXT  
+
100μF  
10μH  
100μF  
+
100nF  
DDINT  
CLOCK SIGNALS  
+
FDS9431A  
The processor can be clocked by an external crystal, a sine wave  
input, or a buffered, shaped clock derived from an external  
clock oscillator.  
SS/PG  
10μF  
LOW ESR  
ZHCS1000 100μF  
If an external clock is used, it should be a TTL compatible signal  
and must not be halted, changed, or operated below the speci-  
fied frequency during normal operation. This signal is  
connected to the processor’s CLKIN pin. When an external  
clock is used, the XTAL pin must be left unconnected.  
VR  
OUT  
SHORT AND LOW-  
INDUCTANCE WIRE  
EXT_WAKE1  
SEE H/W REFERENCE,  
SYSTEM DESIGN CHAPTER,  
TO DETERMINE VALUE  
VR  
SEL  
GND  
NOTE: DESIGNER SHOULD MINIMIZE  
TRACE LENGTH TO FDS9431A.  
Figure 5. ADSP-BF523/525/527 Voltage Regulator Circuit  
Rev. PrE  
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Preliminary Technical Data  
ADSP-BF522/523/524/525/526/527  
Alternatively, because the processor includes an on-chip oscilla-  
tor circuit, an external crystal may be used. For fundamental  
frequency operation, use the circuit shown in Figure 6. A paral-  
lel-resonant, fundamental frequency, microprocessor-grade  
crystal is connected across the CLKIN and XTAL pins. The on-  
chip resistance between CLKIN and the XTAL pin is in the 500  
kΩ range. Further parallel resistors are typically not recom-  
mended. The two capacitors and the series resistor shown in  
Figure 6 fine tune phase and amplitude of the sine frequency.  
The capacitor and resistor values shown in Figure 6 are typical  
values only. The capacitor values are dependent upon the crystal  
manufacturers’ load capacitance recommendations and the PCB  
physical layout. The resistor value depends on the drive level  
specified by the crystal manufacturer. The user should verify the  
customized values based on careful investigations on multiple  
devices over temperature range.  
The Blackfin core runs at a different clock rate than the on-chip  
peripherals. As shown in Figure 7, the core clock (CCLK) and  
system peripheral clock (SCLK) are derived from the input  
clock (CLKIN) signal. An on-chip PLL is capable of multiplying  
the CLKIN signal by a programmable 0.5× to 64× multiplication  
factor (bounded by specified minimum and maximum VCO  
frequencies). The default multiplier is 10×, but it can be modi-  
fied by a software instruction sequence.  
On-the-fly frequency changes can be effected by simply writing  
to the PLL_DIV register. The maximum allowed CCLK and  
SCLK rates depend on the applied voltages VDDINT, VDDEXT, and  
VDDMEM; the VCO is always permitted to run up to the frequency  
specified by the part’s speed grade. The CLKOUT pin reflects  
the SCLK frequency to the off-chip world. It is part of the  
SDRAM interface, but it functions as a reference signal in other  
timing specifications as well. While active by default, it can be  
disabled using the EBIU_SDGCTL and EBIU_AMGCTL  
registers.  
BLACKFIN  
CLKOUT  
“FINE” ADJUSTMENT  
REQUIRES PLL SEQUENCING  
CO ARSE” ADJUSTMENT  
TO PLL CIRCUITRY  
ON-THE-FLY  
EN  
CLKBUF  
÷ 1, 2, 4, 8  
CCLK  
PLL  
0.5× to 64×  
CLKIN  
EN  
VCO  
SCLK  
÷ 1 to 15  
CLKIN  
XTAL  
330*  
FOR OVERTONE  
OPERATION ONLY:  
SCLK CCLK  
SCLK 133 MHz  
18 pF*  
18 pF*  
Figure 7. Frequency Modification Methods  
NOTE: VALUES MARKED WITH * MUST BE CUSTOMIZED  
DEPENDING ON THE CRYSTAL AND LAYOUT. PLEASE  
ANALYZE CAREFULLY.  
All on-chip peripherals are clocked by the system clock (SCLK).  
The system clock frequency is programmable by means of the  
SSEL3–0 bits of the PLL_DIV register. The values programmed  
into the SSEL fields define a divide ratio between the PLL output  
(VCO) and the system clock. SCLK divider values are 1 through  
15. Table 6 illustrates typical system clock ratios.  
Note that the divisor ratio must be chosen to limit the system  
clock frequency to its maximum of fSCLK. The SSEL value can be  
changed dynamically without any PLL lock latencies by writing  
the appropriate values to the PLL divisor register (PLL_DIV).  
Figure 6. External Crystal Connections  
A third-overtone crystal can be used for frequencies above 25  
MHz. The circuit is then modified to ensure crystal operation  
only at the third overtone, by adding a tuned inductor circuit as  
shown in Figure 6. A design procedure for third-overtone oper-  
ation is discussed in detail in application note (EE-168) Using  
Third Overtone Crystals with the ADSP-218x DSP on the Analog  
Devices website (www.analog.com)—use site search on  
“EE-168.”  
Table 6. Example System Clock Ratios  
The CLKBUF pin is an output pin, which is a buffered version  
of the input clock. This pin is particularly useful in Ethernet  
applications to limit the number of required clock sources in the  
system. In this type of application, a single 25 MHz or 50 MHz  
crystal may be applied directly to the processor. The 25 MHz or  
50 MHz output of CLKBUF can then be connected to an exter-  
nal Ethernet MII or RMII PHY device. If instead of a crystal, an  
external oscillator is used at CLKIN, CLKBUF will not have the  
40/60 duty cycle required by some devices. The CLKBUF output  
is active by default and can be disabled for power savings rea-  
sons using the VR_CTL register.  
Example Frequency Ratios  
(MHz)  
VCO  
100  
Signal Name Divider Ratio  
SSEL3–0  
VCO/SCLK  
SCLK  
100  
50  
0001  
1:1  
0110  
6:1  
300  
1010  
10:1  
500  
50  
Rev. PrE  
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ADSP-BF522/523/524/525/526/527  
Preliminary Technical Data  
The core clock (CCLK) frequency can also be dynamically  
changed by means of the CSEL1–0 bits of the PLL_DIV register.  
Supported CCLK divider ratios are 1, 2, 4, and 8, as shown in  
Table 7. This programmable core clock capability is useful for  
fast core frequency modifications.  
pins of the reset configuration register, sampled during power-  
on resets and software-initiated resets, implement the modes  
shown in Table 8.  
Table 8. Booting Modes  
BMODE3–0 Description  
Table 7. Core Clock Ratios  
0000  
0001  
0010  
0011  
0100  
0101  
0110  
0111  
1000  
1001  
1010  
1011  
1100  
Idle - No boot  
Example Frequency Ratios  
Boot from 8- or 16-bit external flash memory  
Boot from 16-bit asynchronous FIFO  
Boot from serial SPI memory (EEPROM or flash)  
Boot from SPI host device  
Boot from serial TWI memory (EEPROM/flash)  
Boot from TWI host  
(MHz)  
VCO  
300  
Signal Name Divider Ratio  
CSEL1–0  
VCO/CCLK  
CCLK  
300  
150  
125  
25  
00  
01  
10  
11  
1:1  
2:1  
4:1  
8:1  
300  
500  
200  
Boot from UART0 Host  
Boot from UART1 Host  
The maximum CCLK frequency not only depends on the part's  
speed grade (see Page 72), it also depends on the applied VDDINT  
voltage. See Table 12 and Table 15 for details. The maximal sys-  
tem clock rate (SCLK) depends on the chip package and the  
applied VDDINT, VDDEXT, and VDDMEM voltages (see Table 14 and  
Table 17).  
Reserved  
Boot from SDRAM  
Boot from OTP memory  
Boot from 8-bit NAND flash  
via NFC using PORTF data pins  
BOOTING MODES  
1101  
Boot from 8-bit NAND flash  
via NFC using PORTH data pins  
The processor has several mechanisms (listed in Table 8) for  
automatically loading internal and external memory after a  
reset. The boot mode is defined by four BMODE input pins  
dedicated to this purpose. There are two categories of boot  
modes. In master boot modes the processor actively loads data  
from parallel or serial memories. In slave boot modes the pro-  
cessor receives data from external host devices.  
The boot modes listed in Table 8 provide a number of mecha-  
nisms for automatically loading the processor’s internal and  
external memories after a reset. By default, all boot modes use  
the slowest meaningful configuration settings. Default settings  
can be altered via the initialization code feature at boot time or  
by proper OTP programming at pre-boot time. The BMODE  
1110  
1111  
Boot from 16-Bit Host DMA  
Boot from 8-Bit Host DMA  
• Idle/no boot mode (BMODE = 0x0) — In this mode, the  
processor goes into idle. The idle boot mode helps recover  
from illegal operating modes, such as when the OTP mem-  
ory has been misconfigured.  
• Boot from 8-bit or 16-bit external flash memory  
(BMODE = 0x1) — In this mode, the boot kernel loads the  
first block header from address 0x2000 0000, and (depend-  
ing on instructions contained in the header) the boot  
kernel performs an 8- or 16-bit boot or starts program exe-  
cution at the address provided by the header. By default, all  
configuration settings are set for the slowest device possible  
(3-cycle hold time, 15-cycle R/W access times, 4-cycle  
setup).  
The ARDY is not enabled by default, but it can be enabled  
through OTP programming. Similarly, all interface behav-  
ior and timings can be customized through OTP  
programming. This includes activation of burst-mode or  
page-mode operation. In this mode, all asynchronous  
interface signals are enabled at the port muxing level.  
• Boot from 16-bit asynchronous FIFO (BMODE = 0x2) —  
In this mode, the boot kernel starts booting from address  
0x2030 0000. Every 16-bit word that the boot kernel has to  
read from the FIFO must be requested by placing a low  
pulse on the DMAR1 pin.  
• Boot from serial SPI memory, EEPROM or flash  
(BMODE = 0x3) — 8-, 16-, 24-, or 32-bit addressable  
devices are supported. The processor uses the PG1 GPIO  
pin to select a single SPI EEPROM/flash device and sub-  
Rev. PrE  
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Preliminary Technical Data  
ADSP-BF522/523/524/525/526/527  
mits a read command and successive address bytes (0x00)  
until a valid 8-, 16-, 24-, or 32-bit addressable device is  
detected. Pull-up resistors are required on the SPISEL1 and  
MISO pins. By default, a value of 0x85 is written to the  
SPI_BAUD register.  
• Boot from SDRAM (BMODE = 0xA) This is a warm boot  
scenario, where the boot kernel starts booting from address  
0x0000 0010. The SDRAM is expected to contain a valid  
boot stream and the SDRAM controller must be configured  
by the OTP settings.  
• Boot from SPI host device (BMODE = 0x4) — The proces-  
sor operates in SPI slave mode and is configured to receive  
the bytes of the LDR file from an SPI host (master) agent.  
The HWAIT signal must be interrogated by the host before  
every transmitted byte. A pull-up resistor is required on the  
SPISS input. A pull-down on the serial clock (SCK) may  
improve signal quality and booting robustness.  
• Boot from OTP memory (BMODE = 0xB) — This provides  
a stand-alone booting method. The boot stream is loaded  
from on-chip OTP memory. By default, the boot stream is  
expected to start from OTP page 0x40 and can occupy all  
public OTP memory up to page 0xDF. This is 2560 bytes.  
Since the start page is programmable, the maximum size of  
the boot stream can be extended to 3072 bytes.  
• Boot from serial TWI memory, EEPROM/flash  
(BMODE = 0x5) — The processor operates in master mode  
and selects the TWI slave connected to the TWI with the  
unique ID 0xA0.  
Table 9. Fourth Byte for Large Page Devices  
Bit  
D1:D0 Page Size  
(excluding spare area)  
Parameter  
Value Meaning  
00  
01  
10  
11  
1K byte  
2K byte  
4K byte  
8K byte  
The processor submits successive read commands to the  
memory device starting at internal address 0x0000 and  
begins clocking data into the processor. The TWI memory  
device should comply with the Philips I2C® Bus Specifica-  
tion version 2.1 and should be able to auto-increment its  
internal address counter such that the contents of the  
memory device can be read sequentially. By default, a  
PRESCALE value of 0xA and a TWI_CLKDIV value of  
0x0811 are used. Unless altered by OTP settings, an I2C  
memory that takes two address bytes is assumed. The  
development tools ensure that data booted to memories  
that cannot be accessed by the Blackfin core is written to an  
intermediate storage location and then copied to the final  
destination via memory DMA.  
D2  
Spare Area Size  
00  
01  
8 byte/512 byte  
16 byte/512 byte  
D5:D4 Block Size  
(excluding spare area)  
00  
01  
10  
11  
64K byte  
128K byte  
256K byte  
512K byte  
D6  
Bus width  
00  
01  
x8  
not supported  
D3, D7 Not Used for configuration  
• Boot from TWI host (BMODE = 0x6) — The TWI host  
selects the slave with the unique ID 0x5F.  
The processor replies with an acknowledgement and the  
host then downloads the boot stream. The TWI host agent  
should comply with the Philips I2C Bus Specification  
version 2.1. An I2C multiplexer can be used to select one  
processor at a time when booting multiple processors from  
a single TWI.  
• Boot from UART0 host on Port G (BMODE = 0x7) —  
Using an autobaud handshake sequence, a boot-stream for-  
matted program is downloaded by the host. The host  
selects a bit rate within the UART clocking capabilities.  
• Boot from 8-bit external NAND flash memory (BMODE =  
0xC and BMODE = 0xD) — In this mode, auto detection of  
the NAND flash device is performed.  
BMODE = 0xC, the processor configures PORTF GPIO  
pins PF7:0 for the NAND data pins and PORTH pins  
PH15:10 for the NAND control signals.  
BMODE = 0xD, the processor configures PORTH GPIO  
pins PH7:0 for the NAND data pins and PORTH pins  
PH15:10 for the NAND control signals.  
For correct device operation pull-up resistors are required  
on both ND_CE (PH10) and ND_BUSY (PH13) signals. By  
default, a value of 0x0033 is written to the NFC_CTL regis-  
ter. The booting procedure always starts by booting from  
byte 0 of block 0 of the NAND flash device.  
When performing the autobaud, the UART expects a “@”  
(0x40) character (eight bits data, one start bit, one stop bit,  
no parity bit) on the UART0RX pin to determine the bit  
rate. The UART then replies with an acknowledgement  
composed of 4 bytes (0xBF, the value of UART0_DLL, the  
value of UART0_DLH, then 0x00). The host can then  
download the boot stream. To hold off the host the Blackfin  
processor signals the host with the boot host wait  
(HWAIT) signal. Therefore, the host must monitor  
HWAIT before every transmitted byte.  
• Boot from UART1 host on Port F (BMODE = 0x8). Same  
as BMODE = 0x7 except that the UART1 port is used.  
Rev. PrE  
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ADSP-BF522/523/524/525/526/527  
Preliminary Technical Data  
NAND flash boot supports the following features:  
—Device Auto Detection  
—Error Detection & Correction for maximum reliability  
—No boot stream size limitation  
—Peripheral DMA providing efficient transfer of all data  
(excluding the ECC parity data)  
—Software-configurable boot mode for booting from  
boot streams spanning multiple blocks, including bad  
blocks  
• Boot from 16-Bit Host DMA (BMODE = 0xE) — In this  
mode, the host DMA port is configured in 16-bit Acknowl-  
edge mode, with little endian data formatting. Unlike other  
modes, the host is responsible for interpreting the boot  
stream. It writes data blocks individually into the Host  
DMA port. Before configuring the DMA settings for each  
block, the host may either poll the ALLOW_CONFIG bit in  
HOST_STATUS or wait to be interrupted by the HWAIT  
signal. When using HWAIT, the host must still check  
ALLOW_CONFIG at least once before beginning to con-  
figure the Host DMA Port. After completing the  
configuration, the host is required to poll the READY bit in  
HOST_STATUS before beginning to transfer data. When  
the host sends an HIRQ control command, the boot kernel  
issues a CALL instruction to address 0xFFA0 0000. It is the  
host's responsibility to ensure that valid code has been  
placed at this address. The routine at 0xFFA0 0000 can be a  
simple initialization routine to configure internal  
resources, such as the SDRAM controller, which then  
returns using an RTS instruction. The routine may also by  
the final application, which will never return to the boot  
kernel.  
—Software-configurable boot mode for booting from  
multiple copies of the boot stream, allowing for han-  
dling of bad blocks and uncorrectable errors  
—Configurable timing via OTP memory  
Small page NAND flash devices must have a 512-byte page  
size, 32 pages per block, a 16-byte spare area size, and a bus  
configuration of 8 bits. By default, all read requests from  
the NAND flash are followed by four address cycles. If the  
NAND flash device requires only three address cycles, the  
device must be capable of ignoring the additional address  
cycles.  
• Boot from 8-Bit Host DMA (BMODE = 0xF) — In this  
mode, the Host DMA port is configured in 8-bit interrupt  
mode, with little endian data formatting. Unlike other  
modes, the host is responsible for interpreting the boot  
stream. It writes data blocks individually into the Host  
DMA port. Before configuring the DMA settings for each  
block, the host may either poll the ALLOW_CONFIG bit in  
HOST_STATUS or wait to be interrupted by the HWAIT  
signal. When using HWAIT, the host must still check  
ALLOW_CONFIG at least once before beginning to con-  
figure the Host DMA Port. The host will receive an  
interrupt from the HOST_ACK signal every time it is  
allowed to send the next FIFO depths worth (sixteen 32-bit  
words) of information. When the host sends an HIRQ con-  
trol command, the boot kernel issues a CALL instruction to  
address 0xFFA0 0000. It is the host's responsibility to  
ensure valid code has been placed at this address. The rou-  
tine at 0xFFA0 0000 can be a simple initialization routine  
to configure internal resources, such as the SDRAM con-  
troller, which then returns using an RTS instruction. The  
routine may also by the final application, which will never  
return to the boot kernel.  
For each of the boot modes, a 16-byte header is first read from  
an external memory device. The header specifies the number of  
bytes to be transferred and the memory destination address.  
Multiple memory blocks may be loaded by any boot sequence.  
Once all blocks are loaded, program execution commences from  
the address stored in the EVT1 register.  
Prior to booting, the pre-boot routine interrogates the OTP  
memory. Individual boot modes can be customized or even dis-  
abled based on OTP programming. External hardware,  
especially booting hosts, may watch the HWAIT signal to deter-  
mine when the pre-boot has finished and the boot kernel starts  
the boot process. By programming OTP memory, the user can  
The small page NAND flash device must comply with the  
following command set:  
—Reset: 0xFF  
—Read lower half of page: 0x00  
—Read upper half of page: 0x01  
—Read spare area: 0x50  
For large-page NAND-flash devices, the four-byte elec-  
tronic signature is read in order to configure the kernel for  
booting, which allows support for multiple large-page  
devices. The fourth byte of the electronic signature must  
comply with the specification in Table 9.  
Any NAND flash array configuration from Table 9, exclud-  
ing 16-bit devices, that also complies with the command set  
listed below are directly supported by the boot kernel.  
There are no restrictions on the page size or block size as  
imposed by the small-page boot kernel.  
For devices consisting of a five-byte signature, only four are  
read. The fourth must comply as outlined above.  
Large page devices must support the following command  
set:  
—Reset: 0xFF  
—Read Electronic Signature: 0x90  
—Read: 0x00, 0x30 (confirm command)  
Large-page devices must not support or react to NAND  
flash command 0x50. This is a small-page NAND flash  
command used for device auto detection.  
By default, the boot kernel will always issue five address  
cycles; therefore, if a large page device requires only four  
cycles, the device must be capable of ignoring the addi-  
tional address cycles.  
Rev. PrE  
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Preliminary Technical Data  
ADSP-BF522/523/524/525/526/527  
also instruct the pre-boot routine to customize the PLL, Internal  
Voltage Regulator (ADSP-BF523/525/527 only), SDRAM Con-  
troller, and Asynchronous Memory Controller.  
The boot kernel differentiates between a regular hardware reset  
and a wakeup-from-hibernate event to speed up booting in the  
later case. Bits 6-4 in the system reset configuration (SYSCR)  
register can be used to bypass the pre-boot routine and/or boot  
kernel in case of a software reset. They can also be used to simu-  
late a wakeup-from-hibernate boot in the software reset case.  
DEVELOPMENT TOOLS  
The processor is supported with a complete set of  
CROSSCORE® software and hardware development tools,  
including Analog Devices emulators and VisualDSP++® devel-  
opment environment. The same emulator hardware that  
supports other Blackfin processors also fully emulates the  
ADSP-BF522/524/526 and ADSP-BF523/525/527 processors.  
EZ-KIT Lite® Evaluation Board  
For evaluation of ADSP-BF523/525/527 processors, use the  
ADSP-BF527 EZ-KIT Lite board available from Analog Devices.  
Order part number ADZS-BF527-EZLITE. The board comes  
with on-chip emulation capabilities and is equipped to enable  
software development. Multiple daughter cards are available.  
An ADSP-BF526 EZ-KIT Lite board is under development.  
The boot process can be further customized by “initialization  
code.” This is a piece of code that is loaded and executed prior to  
the regular application boot. Typically, this is used to configure  
the SDRAM controller or to speed up booting by managing the  
PLL, clock frequencies, wait states, or serial bit rates.  
The boot ROM also features C-callable function that can be  
called by the user application at run time. This enables second-  
stage boot or boot management schemes to be implemented  
with ease.  
DESIGNING AN EMULATOR-COMPATIBLE  
PROCESSOR BOARD (TARGET)  
The Analog Devices family of emulators are tools that every sys-  
tem developer needs in order to test and debug hardware and  
software systems. Analog Devices has supplied an IEEE 1149.1  
JTAG Test Access Port (TAP) on each JTAG processor. The  
emulator uses the TAP to access the internal features of the pro-  
cessor, allowing the developer to load code, set breakpoints,  
observe variables, observe memory, and examine registers. The  
processor must be halted to send data and commands, but once  
an operation has been completed by the emulator, the processor  
system is set running at full speed with no impact on  
system timing.  
INSTRUCTION SET DESCRIPTION  
The Blackfin processor family assembly language instruction set  
employs an algebraic syntax designed for ease of coding and  
readability. The instructions have been specifically tuned to pro-  
vide a flexible, densely encoded instruction set that compiles to  
a very small final memory size. The instruction set also provides  
fully featured multifunction instructions that allow the pro-  
grammer to use many of the processor core resources in a single  
instruction. Coupled with many features more often seen on  
microcontrollers, this instruction set is very efficient when com-  
piling C and C++ source code. In addition, the architecture  
supports both user (algorithm/application code) and supervisor  
(O/S kernel, device drivers, debuggers, ISRs) modes of opera-  
tion, allowing multiple levels of access to core  
processor resources.  
The assembly language, which takes advantage of the proces-  
sor’s unique architecture, offers the following advantages:  
• Seamlessly integrated DSP/MCU features are optimized for  
both 8-bit and 16-bit operations.  
To use these emulators, the target board must include a header  
that connects the processor’s JTAG port to the emulator.  
For details on target board design issues including mechanical  
layout, single processor connections, multiprocessor scan  
chains, signal buffering, signal termination, and emulator pod  
logic, see (EE-68) Analog Devices JTAG Emulation Technical  
Reference on the Analog Devices website (www.analog.com)—  
use site search on “EE-68.” This document is updated regularly  
to keep pace with improvements to emulator support.  
• A multi-issue load/store modified-Harvard architecture,  
which supports two 16-bit MAC or four 8-bit ALU + two  
load/store + two pointer updates per cycle.  
• All registers, I/O, and memory are mapped into a unified  
4G byte memory space, providing a simplified program-  
ming model.  
• Microcontroller features, such as arbitrary bit and bit-field  
manipulation, insertion, and extraction; integer operations  
on 8-, 16-, and 32-bit data-types; and separate user and  
supervisor stack pointers.  
• Code density enhancements, which include intermixing of  
16-bit and 32-bit instructions (no mode switching, no code  
segregation). Frequently used instructions are encoded  
in 16 bits.  
RELATED DOCUMENTS  
The following publications that describe the ADSP-  
BF522/524/526 and ADSP-BF523/525/527 processors (and  
related processors) can be ordered from any Analog Devices  
sales office or accessed electronically on our website:  
Getting Started With Blackfin Processors  
ADSP-BF52x Blackfin Processor Hardware Reference  
Blackfin Processor Programming Reference  
ADSP-BF522/524/526 Blackfin Processor Anomaly List  
ADSP-BF523/525/527 Blackfin Processor Anomaly List  
LOCKBOX SECURE TECHNOLOGY DISCLAIMER  
Analog Devices products containing Lockbox Secure Technol-  
ogy are warranted by Analog Devices as detailed in the Analog  
Devices Standard Terms and Conditions of Sale. To our knowl-  
edge, the Lockbox Secure Technology, when used in accordance  
Rev. PrE  
|
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August 2008  
ADSP-BF522/523/524/525/526/527  
Preliminary Technical Data  
with the data sheet and hardware reference manual specifica-  
tions, provides a secure method of implementing code and data  
safeguards. However, Analog Devices does not guarantee that  
this technology provides absolute security.  
ACCORDINGLY, ANALOG DEVICES HEREBY DISCLAIMS  
ANY AND ALL EXPRESS AND IMPLIED WARRANTIES  
THAT THE LOCKBOX SECURE TECHNOLOGY CANNOT  
BE BREACHED, COMPROMISED OR OTHERWISE CIR-  
CUMVENTED AND IN NO EVENT SHALL ANALOG  
DEVICES BE LIABLE FOR ANY LOSS, DAMAGE DESTRUC-  
TION OR RELEASE OF DATA, INFORMATION, PHYSICAL  
PROPERTY OR INTELLECTUAL PROPERTY.  
Rev. PrE  
|
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August 2008  
Preliminary Technical Data  
SIGNAL DESCRIPTIONS  
ADSP-BF522/523/524/525/526/527  
Signal definitions for the ADSP-BF522/524/526 and  
output pin (CLKBUF). On the external memory interface, the  
control and address lines are driven high, with the exception of  
CLKOUT, which toggles at the system clock rate. If, however,  
the BR pin is asserted, then the memory pins are also three-  
stated.  
All I/O pins have their input buffers disabled with the exception  
of the pins that need pull-ups or pull-downs, as noted in  
Table 10.  
ADSP-BF523/525/527 processors are listed in Table 10. In order  
to maintain maximum function and reduce package size and  
ball count, some balls have dual, multiplexed functions. In cases  
where ball function is reconfigurable, the default state is shown  
in plain text, while the alternate function is shown in italics.  
All pins are three-stated during and immediately after reset,  
with the exception of the external memory interface, asynchro-  
nous and synchronous memory control, and the buffered XTAL  
Table 10. Signal Descriptions  
Driver  
Type1  
Signal Name  
EBIU  
Type Function  
ADDR19–1  
DATA15–0  
ABE1–0/SDQM1–0  
AMS3–0  
ARDY  
O
I/O  
O
O
I
Address Bus  
Data Bus  
A
A
Byte Enables/Data Mask  
Bank Select  
A
A
Hardware Ready Control  
Output Enable  
AOE  
O
O
O
O
O
O
O
O
O
O
A
A
A
A
A
A
A
B
ARE  
Read Enable  
AWE  
Write Enable  
SRAS  
SDRAM Row Address Strobe  
SDRAM Column Address Strobe  
SDRAM Write Enable  
SDRAM Clock Enable  
SDRAM Clock Output  
SDRAM A10 Signal  
SDRAM Bank Select  
SCAS  
SWE  
SCKE  
CLKOUT  
SA10  
A
A
SMS  
USB 2.0 HS OTG  
USB_DP  
USB_DM  
USB_XI  
I/O  
I/O  
I
Data + (This ball should be pulled low when USB is unused or not present.)  
Data - (This ball should be pulled low when USB is unused or not present.)  
F
F
USB Crystal Input (This ball should be pulled low when USB is unused or not  
present.)  
USB_XO  
O
I
USB Crystal Output (This ball should be left unconnected when USB is unused F  
or not present.)  
USB_ID  
USB OTG mode (This ball should be pulled low when USB is unused or not  
present.)  
USB_VREF  
USB_RSET  
USB_VBUS  
I
USB voltage reference (Connect to GND through a 0.1 μF capacitor, or leave  
unconnected if USB is unused or not present.)  
I
USB resistance set. (This ball should be left unconnected when USB is unused  
or not present.)  
I/O 5V USB VBUS (USB_VBUS is an output only during initialization of USB OTG  
session request pulses. Host mode or OTG type A mode require that an  
external voltage source of 5V, at 8mA or more–per the OTG specification–be  
applied to VBUS. Other OTG modes require that this external voltage be  
disabled. This ball should be pulled low when USB is unused or not present.)  
F
Rev. PrE  
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ADSP-BF522/523/524/525/526/527  
Preliminary Technical Data  
Table 10. Signal Descriptions (Continued)  
Driver  
Type1  
Signal Name  
Type Function  
Port F: GPIO and Multiplexed Peripherals  
PF0/PPI D0/DR0PRI /ND_D0A  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
GPIO/PPI Data 0/SPORT0 Primary Receive Data  
/NAND Alternate Data 0  
C
C
D
C
C
D
C
C
PF1/PPI D1/RFS0/ND_D1A  
GPIO/PPI Data 1/SPORT0 Receive Frame Sync  
/NAND Alternate Data 1  
PF2/PPI D2/RSCLK0/ND_D2A  
GPIO/PPI Data 2/SPORT0 Receive Serial Clock  
/NAND Alternate Data 2/Alternate Capture Input 0  
PF3/PPI D3/DT0PRI/ND_D3A  
GPIO/PPI Data 3/SPORT0 Transmit Primary Data  
/NAND Alternate Data 3  
PF4/PPI D4/TFS0/ND_D4A/TACLK0  
PF5/PPI D5/TSCLK0/ND_D5A/TACLK1  
PF6/PPI D6/DT0SEC/ND_D6A/TACI0  
PF7/PPI D7/DR0SEC/ND_D7A/TACI1  
GPIO/PPI Data 4/SPORT0 Transmit Frame Sync  
/NAND Alternate Data 4/Alternate Timer Clock 0  
GPIO/PPI Data 5/SPORT0 Transmit Serial Clock  
/NAND Alternate Data 5/Alternate Timer Clock 1  
GPIO/PPI Data 6/SPORT0 Transmit Secondary Data  
/NAND Alternate Data 6/Alternate Capture Input 0  
GPIO/PPI Data 7/SPORT0 Receive Secondary Data  
/NAND Alternate Data 7/Alternate Capture Input 1  
PF8/PPI D8/DR1PRI  
I/O  
I/O  
I/O  
I/O  
I/O  
GPIO/PPI Data 8/SPORT1 Primary Receive Data  
C
D
C
C
C
PF9/PPI D9/RSCLK1/SPISEL6  
PF10/PPI D10/RFS1/SPISEL7  
PF11/PPI D11/TFS1/CZM  
PF12/PPI D12/DT1PRI/SPISEL2/CDG  
GPIO/PPI Data 9/SPORT1 Receive Serial Clock/SPI Slave Select 6  
GPIO/PPI Data 10/SPORT1 Receive Frame Sync/SPI Slave Select 7  
GPIO/PPI Data 11/SPORT1 Transmit Frame Sync/Counter Zero Marker  
GPIO/PPI Data 12/SPORT1 Transmit Primary Data/SPI Slave Select 2/Counter  
Down Gate  
PF13/PPI D13/TSCLK1/SPISEL3/CUD  
I/O  
GPIO/PPI Data 13/SPORT1 Transmit Serial Clock/SPI Slave Select 3/Counter Up  
D
Direction  
PF14/PPI D14/DT1SEC/UART1TX  
I/O  
I/O  
GPIO/PPI Data 14/SPORT1 Transmit Secondary Data/UART1 Transmit  
C
C
PF15/PPI D15/DR1SEC/UART1RX/TACI3  
GPIO/PPI Data 15/SPORT1 Receive Secondary Data  
/UART1 Receive /Alternate Capture Input 3  
Port G: GPIO and Multiplexed Peripherals  
PG0/HWAIT  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
GPIO/Boot Host Wait2  
C
C
D
C
C
C
C
C
C
PG1/SPISS/SPISEL1  
GPIO/SPI Slave Select Input/SPI Slave Select 1  
PG2/SCK  
GPIO/SPI Clock  
PG3/MISO/DR0SECA  
GPIO/SPI Master In Slave Out/Sport 0 Alternate Receive Data Secondary  
GPIO/SPI Master Out Slave In/Sport 0 Alternate Transmit Data Secondary  
GPIO/Timer1/PPI Frame Sync2  
PG4/MOSI/DT0SECA  
PG5/TMR1/PPI_FS2  
PG6/DT0PRIA/TMR2/PPI_FS3  
PG7/TMR3/DR0PRIA/UART0TX  
PG8/TMR4/RFS0A/UART0RX/TACI4  
GPIO/SPORT0 Alternate Primary Transmit Data / Timer2 / PPI Frame Sync3  
GPIO/Timer3/Sport 0 Alternate Receive Data Primary/UART0 Transmit  
GPIO/Timer 4/Sport 0 Alternate Receive Clock/Frame Sync  
/UART0 Receive/Alternate Capture Input 4  
PG9/TMR5/RSCLK0A/TACI5  
PG10/TMR6/TSCLK0A/TACI6  
I/O  
I/O  
GPIO/Timer5/Sport 0 Alternate Receive Clock  
/Alternate Capture Input 5  
D
D
GPIO/Timer 6 /Sport 0 Alternate Transmit  
/Alternate Capture Input 6  
PG11/TMR7/HOST_WR  
I/O  
I/O  
GPIO/Timer7/Host DMA Write Enable  
C
C
PG12/DMAR1/UART1TXA/HOST_ACK  
GPIO/DMA Request 1/Alternate UART1 Transmit/Host DMA Acknowledge  
Rev. PrE  
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Page 24 of 72  
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August 2008  
Preliminary Technical Data  
ADSP-BF522/523/524/525/526/527  
Table 10. Signal Descriptions (Continued)  
Driver  
Type1  
Signal Name  
Type Function  
PG13/DMAR0/UART1RXA/HOST_ADDR/TACI2 I/O  
GPIO/DMA Request 0/Alternate UART1 Receive/Host DMA Address/Alternate  
Capture Input 2  
C
D
C
PG14/TSCLK0A1/MDC/HOST_RD I/O  
GPIO/SPORT0 Alternate 1 Transmit/Ethernet Management Channel Clock  
/Host DMA Read Enable  
PG153/TFS0A/MII PHYINT/RMII MDINT/HOST_CE I/O  
Port H: GPIO and Multiplexed Peripherals  
GPIO/SPORT0 Alternate Transmit Frame Sync/Ethernet/MII PHY Interrupt/RMII  
Management Channel Data Interrupt/Host DMA Chip Enable  
PH0/ND_D0/MIICRS/RMIICRSDV/HOST_D0  
PH1/ND_D1/ERxER/HOST_D1  
I/O  
I/O  
I/O  
I/O  
GPIO/NAND D0/Ethernet MII or RMII Carrier Sense/Host DMA D0  
GPIO/NAND D1/Ethernet MII or RMII Receive Error/Host DMA D1  
GPIO/NAND D2/Ethernet Management Channel Serial Data/Host DMA D2  
GPIO/NAND D3/Ethernet MII Transmit Enable/Host DMA D3  
GPIO/NAND D4/Ethernet MII or RMII Reference Clock/Host D4  
GPIO/NAND D5/Ethernet MII or RMII Transmit D0/Host DMA D5  
GPIO/NAND D6/Ethernet MII or RMII Receive D0/Host DMA D6  
GPIO/NAND D7/Ethernet MII or RMII Transmit D1/Host DMA D7  
C
C
C
C
C
C
C
C
C
PH2/ND_D2/MDIO/HOST_D2  
PH3/ND_D3/ETxEN/HOST_D3  
PH4/ND_D4/MIITxCLK/RMIIREF_CLK/HOST_D4 I/O  
PH5/ND_D5/ETxD0/HOST_D5  
PH6/ND_D6/ERxD0/HOST_D6  
PH7/ND_D7/ETxD1/HOST_D7  
PH8/SPISEL4/ERxD1/HOST_D8/TACLK2  
I/O  
I/O  
I/O  
I/O  
GPIO/Alternate Capture Input 2/Ethernet MII or RMII Receive D1/Host DMA D8  
/SPI Slave Select 4  
PH9/SPISEL5/ETxD2/HOST_D9/TACLK3  
I/O  
GPIO/SPI Slave Select 5/Ethernet MII Transmit D2/Host DMA D9  
/Alternate Timer Clock 3  
C
PH10/ND_CE/ERxD2/HOST_D10  
PH11/ND_WE/ETxD3/HOST_D11  
PH12/ND_RE/ERxD3/HOST_D12  
PH13/ND_BUSY/ERxCLK/HOST_D13  
PH14/ND_CLE/ERxDV/HOST_D14  
I/O  
I/O  
I/O  
I/O  
I/O  
GPIO/NAND Chip Enable/Ethernet MII Receive D2/Host DMA D10  
GPIO/NAND Write Enable/Ethernet MII Transmit D3/Host DMA D11  
GPIO/NAND Read Enable/Ethernet MII Receive D3/Host DMA D12  
GPIO/NAND Busy/Ethernet MII Receive Clock/Host DMA D13  
C
C
C
C
C
GPIO/NAND Command Latch Enable/Ethernet MII or RMII Receive Data  
Valid/Host DMA D14  
PH15/ND_ALE/COL/HOST_D15  
Port J: Multiplexed Peripherals  
PJ0: PPI_FS1/TMR0  
I/O  
GPIO/NAND Address Latch Enable/Ethernet MII Collision/Host DMA Data 15  
C
C
I/O  
I
PPI Frame Sync1/Timer0  
PPI Clock/Timer Clock  
PJ1: PPI_CLK/TMRCLK  
PJ2: SCL  
I/O 5V TWI Serial Clock (This pin is an open-drain output and requires a pull-up  
resistor.4)  
E
E
PJ3: SDA  
I/O 5V TWI Serial Data (This pin is an open-drain output and requires a pull-up  
resistor.4)  
Real Time Clock  
RTXI  
I
RTC Crystal Input (This ball should be pulled low when not used.)  
RTC Crystal Output  
RTXO  
JTAG Port  
TCK  
O
I
JTAG Clock  
TDO  
O
I
JTAG Serial Data Out  
C
C
TDI  
JTAG Serial Data In  
TMS  
I
JTAG Mode Select  
TRST  
I
JTAG Reset (This ball should be pulled low if the JTAG port is not used.)  
Emulation Output  
EMU  
O
Rev. PrE  
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Page 25 of 72  
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August 2008  
ADSP-BF522/523/524/525/526/527  
Preliminary Technical Data  
Table 10. Signal Descriptions (Continued)  
Driver  
Type1  
Signal Name  
Type Function  
Clock  
CLKIN  
I
Clock/Crystal Input  
Crystal Output  
XTAL  
O
O
CLKBUF  
Buffered XTAL Output  
C
Mode Controls  
RESET  
I
I
I
Reset  
NMI  
Nonmaskable Interrupt (This ball should be pulled high when not used.)  
Boot Mode Strap 3-0  
BMODE3–0  
ADSP-BF523/525/527 Voltage Regulator  
VRSEL  
I
External/Internal Voltage Regulator Select  
External FET Drive/Wake up Indication 1  
Wake up Indication 0  
VROUT/EXT_WAKE1  
O
O
I
G
C
EXT_WAKE0  
SS/PG  
Soft Start/Power Good  
ADSP-BF522/524/526 Voltage Regulation I/F  
EXT_WAKE1  
EXT_WAKE0  
PG  
O
O
I
Wake up Indication 1  
Wake up Indication 0  
Power Good  
C
C
Power Supplies  
ALL SUPPLIES MUST BE POWERED  
See Operating Conditions for ADSP-BF523/525/527 on Page 29,  
and see Operating Conditions for ADSP-BF522/524/526 on Page 27.  
VDDEXT  
VDDINT  
VDDRTC  
VDDUSB  
VDDMEM  
VDDOTP  
VPPOTP  
VSS  
P
P
P
P
P
P
P
G
I/O Power Supply  
Internal Power Supply  
Real Time Clock Power Supply  
3.3 V USB Phy Power Supply  
MEM Power Supply  
OTP Power Supply  
OTP Programming Voltage  
Ground for All Supplies  
1 See Output Drive Currents on Page 58 for more information about each driver type.  
2 HWAIT must be pulled high or low to configure polarity. See Booting Modes on Page 18.  
3 When driven low, this ball can be used to wake up the processor from the hibernate state, either in normal GPIO mode or in Ethernet mode as MII PHYINT. If the ball is used  
for wake up, enable the feature with the PHYWE bit in the VR_CTL register, and pull-up the ball with a resistor.  
4 Consult version 2.1 of the I2C specification for the proper resistor value.  
Rev. PrE  
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Page 26 of 72  
|
August 2008  
Preliminary Technical Data  
ADSP-BF522/523/524/525/526/527  
SPECIFICATIONS  
Specifications are subject to change without notice.  
OPERATING CONDITIONS FOR ADSP-BF522/524/526  
Parameter  
Conditions  
Min  
tbd  
Nominal  
tbd  
Max  
tbd  
Unit  
V
VDDINT Internal Supply Voltage  
1
VDDEXT External Supply Voltage  
1.70  
2.25  
1.70  
2.25  
1.8, 2.5 or 3.3 3.6  
3.6  
V
2
VDDRTC RTC Power Supply Voltage  
V
3
VDDMEM MEM Supply Voltage  
1.8, 2.5 or 3.3 3.6  
V
VDDOTP OTP Supply Voltage  
VPPOTP OTP Programming Voltage  
For Reads  
For Writes4  
VDDUSB USB Supply Voltage5  
2.5  
2.75  
V
2.25  
6.9  
2.5  
7.0  
3.3  
2.75  
7.1  
V
V
3.0  
3.6  
V
VIH  
VIH  
VIH  
VIHTWI  
VIL  
High Level Input Voltage6, 7  
High Level Input Voltage6, 7  
High Level Input Voltage6, 7  
High Level Input Voltage  
Low Level Input Voltage6, 7  
Low Level Input Voltage6, 7  
Low Level Input Voltage6, 7  
Low Level Input Voltage  
Junction Temperature  
VDDEXT/VDDMEM = 1.90 V  
1.1  
3.6  
V
VDDEXT/VDDMEM = 2.75 V  
1.7  
3.6  
V
VDDEXT/VDDMEM = 3.6 V  
2.0  
3.6  
V
8
VDDEXT = 1.90 V/2.75 V/3.6 V  
VDDEXT/VDDMEM = 1.7 V  
0.7 x VBUSTWI  
–0.3  
–0.3  
–0.3  
–0.3  
0
VBUSTWI  
0.6  
V
V
VIL  
VDDEXT/VDDMEM = 2.25 V  
0.7  
V
VIL  
VDDEXT/VDDMEM = 3.0 V  
0.8  
V
9
VILTWI  
TJ  
VDDEXT = minimum  
0.3 x VBUSTWI  
+105  
V
289-Ball CSP_BGA @ TAMBIENT = 0°C to +70°C  
208-Ball CSP_BGA @ TAMBIENT = 0°C to +70°C  
°C  
°C  
°C  
TJ  
Junction Temperature  
0
+105  
TJ  
Junction Temperature  
208-Ball CSP_BGA @ TAMBIENT = –40°C to +85°C –40  
+105  
1 Must remain powered (even if the associated function is not used).  
2 If not used, power with VDDEXT  
3 Balls that use VDDMEM are DATA15–0, ADDR19–1, ABE1–0, ARE, AWE, AOE, AMS3–0, ARDY, SA10, SWE, SCAS, CLKOUT, SRAS, SMS, SCKE. These balls are not tolerant  
.
to voltages higher than VDDMEM  
.
4 The VDDOTP voltage for writes must only be applied when programming OTP memory. There is a finite amount of cumulative time that this voltage may be applied (dependent  
on voltage and junction temperature) over the lifetime of the part. Please see Table 19 on Page 32 for details.  
5 When not using the USB peripheral on the ADSP-BF524/BF526 or terminating VDDUSB on the ADSP-BF522, VDDUSB must be powered by VDDEXT  
.
6 Bidirectional balls (PF15–0, PG15–0, PH15–0) and input balls (RTXI, TCK, TDI, TMS, TRST, CLKIN, RESET, NMI, and BMODE3–0) of the ADSP-  
BF522/523/524/525/526/527 processors are 3.3 V tolerant (always accept up to 3.6 V maximum VIH). Voltage compliance (on outputs, VOH) is limited by the VDDEXT supply  
voltage.  
7 Parameter value applies to all input and bidirectional balls, except USB_DP, USB_DM, USB_VBUS, SDA, and SCL.  
8 The VIHTWI min and max value vary with the selection in the TWI_DT field of the NONGPIO_DRIVE register. See VBUSTWI min and max values in Table 11.  
9 SDA and SCL are pulled up to VBUSTWI. See Table 11.  
Table 11 shows settings for TWI_DT in the NONGPIO_DRIVE  
register. Set this register prior to using the TWI port.  
Table 11. TWI_DT Field Selections and VDDEXT/VBUSTWI  
TWI_DT  
000 (default)  
001  
010  
011  
100  
101  
110  
111 (reserved)  
VDDEXT Nominal  
VBUSTWI Minimum  
VBUSTWI Nominal  
VBUSTWI Maximum  
Unit  
V
V
V
V
V
V
V
3.3  
1.8  
2.5  
1.8  
3.3  
1.8  
2.5  
2.97  
1.27  
2.97  
2.97  
4.5  
2.25  
2.25  
3.3  
1.8  
3.3  
3.3  
5
2.5  
2.5  
3.63  
2.35  
3.63  
3.63  
5.5  
2.75  
2.75  
Rev. PrE  
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Page 27 of 72  
|
August 2008  
ADSP-BF522/523/524/525/526/527  
Preliminary Technical Data  
ADSP-BF522/524/526 Clock Related Operating Conditions  
Table 12 describes the core clock timing requirements for the  
ADSP-BF522/524/526 processors. Take care in selecting MSEL,  
SSEL, and CSEL ratios so as not to exceed the maximum core  
clock and system clock (see Table 14). Table 13 describes phase-  
locked loop operating conditions.  
Table 12. Core Clock (CCLK) Requirements—ADSP-BF522/524/526 Processors—All Speed Grades1  
Parameter  
Max  
4003  
350  
Unit  
MHz  
MHz  
MHz  
MHz  
MHz  
fCCLK  
fCCLK  
fCCLK  
fCCLK  
fCCLK  
Core Clock Frequency (VDDINT =tbd2 V minimum)  
Core Clock Frequency (VDDINT =tbd4 V minimum)  
Core Clock Frequency (VDDINT = tbd5 V minimum)  
Core Clock Frequency (VDDINT = tbd V minimum)  
Core Clock Frequency (VDDINT = tbd V minimum)  
300  
TBD  
TBD  
1 See the Ordering Guide on Page 72.  
2 Preliminary data indicates a value of 1.33 V.  
3 Applies only to 400 MHz speed grade only. See the Ordering Guide on Page 72.  
4 Preliminary data indicates a value of 1.235 V.  
5 Preliminary data indicates a value of 1.14 V.  
Table 13. Phase-Locked Loop Operating Conditions  
Parameter  
fVCO  
Minimum  
50  
Maximum Unit  
Speed Grade1 MHz  
Voltage Controlled Oscillator (VCO) Frequency  
1 See the Ordering Guide on Page 72.  
Table 14. ADSP-BF522/524/526 Processors Maximum SCLK Conditions  
Parameter  
fSCLK  
VDDEXT/VDDMEM = 1.8 V/2.5 V/3.3 V Nominal  
Unit  
MHz  
MHz  
CLKOUT/SCLK Frequency (VDDINT tbd V)1  
80  
fSCLK  
CLKOUT/SCLK Frequency (VDDINT < tbd V)  
tbd  
1 fSCLK must be less than or equal to fCCLK and is subject to additional restrictions for SDRAM interface operation. See Table 25 on Page 39.  
Rev. PrE  
|
Page 28 of 72  
|
August 2008  
Preliminary Technical Data  
ADSP-BF522/523/524/525/526/527  
OPERATING CONDITIONS FOR ADSP-BF523/525/527  
Parameter  
Conditions  
Min  
0.95  
1.70  
2.25  
2.25  
1.70  
2.25  
2.25  
3.0  
Nominal  
Max  
1.26  
Unit  
V
VDDINT Internal Supply Voltage1  
VDDEXT External Supply Voltage2, 3  
VDDEXT External Supply Voltage2, 3  
VDDRTC RTC Power Supply Voltage4  
VDDMEM MEM Supply Voltage2, 5  
VDDOTP OTP Supply Voltage2  
VPPOTP OTP Programming Voltage2  
VDDUSB USB Supply Voltage6  
Internal Voltage Regulator Disabled  
Internal Voltage Regulator Enabled  
1.8, 2.5 or 3.3 3.6  
V
2.5 or 3.3  
3.6  
3.6  
V
V
1.8, 2.5 or 3.3 3.6  
V
2.5  
2.5  
3.3  
2.75  
V
2.75  
3.6  
V
V
VIH  
VIH  
VIH  
High Level Input Voltage7, 8  
High Level Input Voltage7, 8  
High Level Input Voltage7, 8  
VDDEXT/VDDMEM = 1.90 V  
1.1  
3.6  
V
VDDEXT/VDDMEM = 2.75 V  
1.7  
3.6  
V
VDDEXT/VDDMEM = 3.6 V  
2.0  
3.6  
V
9
VIHTWI High Level Input Voltage  
VDDEXT = 1.90 V/2.75 V/3.6 V  
VDDEXT/VDDMEM = 1.7 V  
0.7 x VBUSTWI  
–0.3  
–0.3  
–0.3  
–0.3  
0
VBUSTWI  
0.6  
V
VIL  
VIL  
VIL  
Low Level Input Voltage7, 8  
Low Level Input Voltage7, 8  
Low Level Input Voltage7, 8  
V
VDDEXT/VDDMEM = 2.25 V  
0.7  
V
VDDEXT/VDDMEM = 3.0 V  
0.8  
V
10  
VILTWI Low Level Input Voltage  
VDDEXT = minimum  
0.3 x VBUSTWI  
+105  
V
TJ  
TJ  
TJ  
Junction Temperature  
Junction Temperature  
Junction Temperature  
289-Ball CSP_BGA @ TAMBIENT = 0°C to +70°C  
208-Ball CSP_BGA @ TAMBIENT = 0°C to +70°C  
°C  
°C  
°C  
0
+105  
208-Ball CSP_BGA @ TAMBIENT = –40°C to +85°C –40  
+105  
1 The voltage regulator can generate VDDINT at levels of tbd V to tbd V with tbd% to +tbd% tolerance.  
2 Must remain powered (even if the associated function is not used).  
3 VDDEXT is the supply to the voltage regulator and GPIO.  
4 If not used, power with VDDEXT  
.
5 Balls that use VDDMEM are DATA15–0, ADDR19–1, ABE1–0, ARE, AWE, AOE, AMS3–0, ARDY, SA10, SWE, SCAS, CLKOUT, SRAS, SMS, SCKE. These balls are not tolerant  
to voltages higher than VDDMEM  
.
6 When not using the USB peripheral on the ADSP-BF525/BF527 or terminating VDDUSB on the ADSP-BF523, VDDUSB must be powered by VDDEXT  
.
7 Bidirectional balls (PF15–0, PG15–0, PH15–0) and input balls (RTXI, TCK, TDI, TMS, TRST, CLKIN, RESET, NMI, and BMODE3–0) of the ADSP-  
BF522/523/524/525/526/527 processors are 3.3 V tolerant (always accept up to 3.6 V maximum VIH). Voltage compliance (on outputs, VOH) is limited by the VDDEXT supply  
voltage.  
8 Parameter value applies to all input and bidirectional balls, except USB_DP, USB_DM, USB_VBUS, SDA, and SCL.  
9 The VIHTWI min and max value vary with the selection in the TWI_DT field of the NONGPIO_DRIVE register. See VBUSTWI min and max values in Table 11 on Page 27.  
10SDA and SCL are pulled up to VBUSTWI. See Table 11 on Page 27.  
Rev. PrE  
|
Page 29 of 72  
|
August 2008  
ADSP-BF522/523/524/525/526/527  
Preliminary Technical Data  
ADSP-BF523/525/527 Clock Related Operating Conditions  
Table 15 describes the core clock timing requirements for the  
ADSP-BF523/525/527 processors. Take care in selecting MSEL,  
SSEL, and CSEL ratios so as not to exceed the maximum core  
clock and system clock (see Table 17). Table 16 describes phase-  
locked loop operating conditions.  
Table 15. Core Clock (CCLK) Requirements—ADSP-BF523/525/527 Processors—All Speed Grades1  
Parameter  
fCCLK  
Internal Regulator Setting  
Max  
600  
533  
400  
Unit  
MHz  
MHz  
MHz  
Core Clock Frequency (VDDINT =1.14 V minimum)2  
Core Clock Frequency (VDDINT =1.093 V minimum)3  
Core Clock Frequency (VDDINT = 0.95 V minimum)  
1.20 V  
1.15 V  
1.0 V  
fCCLK  
fCCLK  
1 See the Ordering Guide on Page 72.  
2 Applies only to 600 MHz speed grades. See the Ordering Guide on Page 72.  
3 Applies only to 533 MHz and 600 MHz speed grades. See the Ordering Guide on Page 72.  
Table 16. Phase-Locked Loop Operating Conditions  
Parameter  
fVCO  
Minimum  
50  
Maximum Unit  
Speed Grade1 MHz  
Voltage Controlled Oscillator (VCO) Frequency  
1 See the Ordering Guide on Page 72.  
Table 17. ADSP-BF523/525/527 Processors Maximum SCLK Conditions  
Parameter  
VDDEXT/VDDMEM = 1.8 V Nominal1 VDDEXT/VDDMEM = 2.5 V/3.3 V Nominal Unit  
fSCLK CLKOUT/SCLK Frequency (VDDINT 1.14 V)2  
fSCLK CLKOUT/SCLK Frequency (VDDINT < 1.14 V)2  
1 If either VDDEXT or VDDMEM are operating at 1.8V nominal, fSCLK is constrained to 100MHz.  
100  
100  
1333  
100  
MHz  
MHz  
2 fSCLK must be less than or equal to fCCLK and is subject to additional restrictions for SDRAM interface operation. See Table 25 on Page 39.  
3 Rounded number. Actual test specification is SCLK period of 7.5 ns. See Table 25 on Page 39.  
Rev. PrE  
|
Page 30 of 72  
|
August 2008  
Preliminary Technical Data  
ADSP-BF522/523/524/525/526/527  
ELECTRICAL CHARACTERISTICS  
Parameter  
Test Conditions  
Min  
Typical  
Max  
Unit  
VOH  
VOH  
VOH  
VOL  
High Level Output Voltage  
High Level Output Voltage  
High Level Output Voltage  
Low Level Output Voltage  
VDDEXT /VDDMEM = 1.7 V, IOH = –0.5 mA 1.35  
VDDEXT /VDDMEM = 2.25 V, IOH = –0.5 mA 2.0  
VDDEXT /VDDMEM = 3.0 V, IOH = –0.5 mA 2.4  
V
V
V
V
VDDEXT /VDDMEM = 1.7 V/2.25 V/3.0 V,  
IOL = 2.0 mA  
0.4  
VOLTWI  
Low Level Output Voltage  
VDDEXT /VDDMEM = 1.7 V/2.25 V/3.0 V,  
IOL = 2.0 mA  
TBD  
V
V
IIH  
High Level Input Current1  
Low Level Input Current1  
High Level Input Current JTAG2  
Three-State Leakage Current3  
Three-State Leakage Current4  
Three-State Leakage Current3  
Input Capacitance5  
VDDEXT /VDDMEM =3.6 V, VIN = 3.6 V  
VDDEXT /VDDMEM =3.6 V, VIN = 0 V  
VDDEXT = 3.6 V, VIN = 3.6 V  
10.0  
10.0  
50.0  
10.0  
10.0  
10.0  
TBD6  
TBD  
μA  
μA  
μA  
μA  
μA  
μA  
pF  
μA  
IIL  
IIHP  
IOZH  
IOZHTWI  
IOZL  
VDDEXT /VDDMEM= 3.6 V, VIN = 3.6 V  
VDDEXT =3.0 V, VIN = 5.5 V  
VDDEXT /VDDMEM= 3.6 V, VIN = 0 V  
fIN = 1 MHz, TAMBIENT = 25°C, VIN = 2.5 V  
CIN  
TBD  
IDDHIBERNATE  
Total Current for All Domains in  
Hibernate State  
VDDEXT=VDDMEM=VDDRTC=VDDUSB = 3.3 V,  
VDDOTP=VPPOTP= 2.5 V, VDDINT = 0 V,  
CLKIN=0 MHz, @TJ = 25°C  
IDDRTC  
Total Current for VDDRTC in Hibernate VDDRTC = 3.3 V, @TJ = 25°C  
State  
TBD  
μA  
1 Applies to input balls.  
2 Applies to JTAG input balls (TCK, TDI, TMS, TRST).  
3 Applies to three-statable balls.  
4 Applies to bidirectional balls SCL and SDA.  
5 Applies to all signal balls.  
6 Guaranteed, but not tested.  
Rev. PrE  
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Page 31 of 72  
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August 2008  
ADSP-BF522/523/524/525/526/527  
Preliminary Technical Data  
Table 19. Maximum OTP Memory Programming Time for  
ADSP-BF522/524/526 Processors  
ABSOLUTE MAXIMUM RATINGS  
Stresses greater than those listed in the table may cause perma-  
nent damage to the device. These are stress ratings only.  
Functional operation of the device at these or any other condi-  
tions greater than those indicated in the operational sections of  
this specification is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device  
reliability.  
Temperature (TJ)  
VPPOTP Voltage (V) 25°C  
85°C  
110°C  
125°C  
6.9  
7.0  
7.1  
tbd sec  
tbd sec tbd sec tbd sec  
2400 sec tbd sec tbd sec tbd sec  
1000 sec tbd sec tbd sec tbd sec  
Parameter  
Rating  
ESD SENSITIVITY  
Internal Supply Voltage (VDDINT  
)
tbd V to +tbd V  
–0.3 V to +3.8 V  
External (I/O) Supply Voltage  
ESD (electrostatic discharge) sensitive device.  
Charged devices and circuit boards can discharge  
without detection. Although this product features  
patented or proprietary circuitry, damage may occur  
on devices subjected to high energy ESD. Therefore,  
proper ESD precautions should be taken to avoid  
performance degradation or loss of functionality.  
(VDDEXT/VDDMEM  
Input Voltage1, 2  
Input Voltage1, 2, 3  
Input Voltage1, 2, 4  
Output Voltage Swing  
)
–0.5 V to +3.6 V  
–0.5 V to +5.5 V  
–0.5 V to +5.25 V  
–0.5 V to  
VDDEXT /VDDMEM+0.5 V  
Load Capacitance5  
200 pF  
PACKAGE INFORMATION  
Storage Temperature Range  
–65°C to +150°C  
The information presented in Figure 8 and Table 20 provides  
details about the package branding for the ADSP-  
BF522/524/526 and ADSP-BF523/525/527 processors. For a  
complete listing of product availability, see Ordering Guide on  
Page 72.  
Junction Temperature Underbias  
+110°C  
1 Applies to 100% transient duty cycle. For other duty cycles see Table 18.  
2 Applies only when VDDEXT is within specifications. When VDDEXT is outside speci-  
fications, the range is VDDEXT 0.2 Volts.  
3 Applies to balls SCL and SDA.  
4 Applies to balls USB_DP, USB_DM, and USB_VBUS.  
5 For proper SDRAM controlleroperation, the maximum load capacitance is 50 pF  
(at 3.3 V) or 30 pF (at 2.5 V) for ADDR19–1, DATA15–0, ABE1–0/SDQM1–0,  
CLKOUT, SCKE, SA10, SRAS, SCAS, SWE, and SMS.  
a
ADSP-BF52x  
Table 18. Maximum Duty Cycle for Input Transient Voltage1  
tppZccc  
vvvvvv.x n.n  
VIN Min (V)  
TBD  
VIN Max (V)  
TBD  
Maximum Duty Cycle  
yyww country_of_origin  
B
100 %  
40%  
25%  
15%  
10%  
TBD  
TBD  
Figure 8. Product Information on Package  
TBD  
TBD  
TBD  
TBD  
Table 20. Package Brand Information  
TBD  
TBD  
Brand Key  
Field Description  
Product Name1  
1 Applies to all signal balls with the exception of CLKIN, XTAL,  
VROUT/EXT_WAKE1.  
ADSP-BF52x  
t
Temperature Range  
Package Type  
pp  
When programming OTP memory on the ADSP-  
BF522/524/526 processors, the VPPOTP ball must be set to the  
write value specified in the Operating Conditions for ADSP-  
BF522/524/526 on Page 27. There is a finite amount of cumula-  
tive time that the write voltage may be applied (dependent on  
voltage and junction temperature) to VPPOTP over the lifetime  
of the part. Therefore, maximum OTP memory programming  
time for the ADSP-BF522/524/526 processors is shown in  
Table 19. The ADSP-BF523/525/527 processors do not have a  
similar restriction.  
Z
RoHS Compliant Designation  
See Ordering Guide  
Assembly Lot Code  
Silicon Revision  
ccc  
vvvvvv.x  
n.n  
yyww  
Date Code  
1 See product names in the Ordering Guide on Page 72.  
Rev. PrE  
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Page 32 of 72  
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August 2008  
Preliminary Technical Data  
ADSP-BF522/523/524/525/526/527  
TIMING SPECIFICATIONS  
Clock and Reset Timing  
Table 21 and Figure 9 describe clock and reset operations. Per  
the CCLK and SCLK timing specifications in Table 12 to  
Table 17, combinations of CLKIN and clock multipliers must  
not select core/peripheral clocks in excess of the processor's  
speed grade.  
Table 21. Clock and Reset Timing  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
tCKIN  
CLKIN Period  
20.0  
10.0  
10.0  
100.0  
ns  
ns  
ns  
ns  
ns  
tCKINL  
tCKINH  
tBUFDLAY  
tWRST  
CLKIN Low Pulse1  
CLKIN High Pulse1  
CLKIN to CLKBUF Delay  
RESET Asserted Pulse Width Low2  
10  
11 tCKIN  
1 Applies to bypass mode and non-bypass mode.  
2 Applies after power-up sequence is complete. At power-up, the processor’s internal phase-locked loop requires no more than 2000 CLKIN cycles, while RESET is asserted,  
assuming stable power supplies and CLKIN (not including start-up time of external clock oscillator).  
tCKIN  
CLKIN  
tCKINL  
tCKINH  
tBUFDLAY  
tBUFDLAY  
CLKBUF  
tWRST  
RESET  
Figure 9. Clock and Reset Timing  
Rev. PrE  
|
Page 33 of 72  
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August 2008  
ADSP-BF522/523/524/525/526/527  
Preliminary Technical Data  
Asynchronous Memory Read Cycle Timing  
Table 22. Asynchronous Memory Read Cycle Timing  
V
DDMEM = 1.8 V  
VDDMEM = 2.5/3.3 V  
Max  
Parameter  
Min  
Max  
Min  
Unit  
Timing Requirements  
tSDAT DATA15–0 Setup Before CLKOUT  
tHDAT DATA15–0 Hold After CLKOUT  
tSARDY ARDY Setup Before CLKOUT  
tHARDY ARDY Hold After CLKOUT  
Switching Characteristics  
2.1  
0.8  
4.0  
0.0  
2.1  
0.8  
4.0  
0.0  
ns  
ns  
ns  
ns  
tDO Output Delay After CLKOUT1  
tHO Output Hold After CLKOUT 1  
1 Output balls include AMS30, ABE1–0, ADDR19–1, AOE, ARE.  
6.0  
6.0  
ns  
ns  
0.8  
0.8  
HOLD  
1 CYCLE  
SETUP  
2 CYCLES  
PROGRAMMED READ ACCESS  
4 CYCLES  
ACCESS EXTENDED  
3 CYCLES  
CLKOUT  
tDO  
tHO  
AMSx  
ABE1–0  
ABE, ADDRESS  
ADDR19–1  
AOE  
tDO  
tHO  
ARE  
tHARDY  
tSARDY  
tHARDY  
ARDY  
tSARDY  
tSDAT  
tHDAT  
DATA15–0  
READ  
Figure 10. Asynchronous Memory Read Cycle Timing  
Rev. PrE  
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Page 34 of 72  
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August 2008  
Preliminary Technical Data  
ADSP-BF522/523/524/525/526/527  
Asynchronous Memory Write Cycle Timing  
Table 23. Asynchronous Memory Write Cycle Timing  
V
DDMEM = 1.8 V  
Max  
VDDMEM = 2.5/3.3 V  
Max  
Parameter  
Min  
Min  
Unit  
Timing Requirements  
tSARDY  
tHARDY  
ARDY Setup Before CLKOUT  
ARDY Hold After CLKOUT  
4.0  
0.0  
4.0  
0.0  
ns  
ns  
Switching Characteristics  
tDDAT  
tENDAT  
tDO  
DATA15–0 Disable After CLKOUT  
6.0  
6.0  
6.0  
6.0  
ns  
ns  
ns  
ns  
DATA15–0 Enable After CLKOUT  
Output Delay After CLKOUT1  
Output Hold After CLKOUT 1  
0.0  
0.8  
0.0  
0.8  
tHO  
1 Output balls include AMS30, ABE1–0, ADDR19–1, DATA15–0, AOE, AWE.  
ACCESS  
EXTENDED  
1 CYCLE  
SETUP  
2 CYCLES  
HOLD  
1 CYCLE  
PROGRAMMED WRITE  
ACCESS 2 CYCLES  
CLKOUT  
tDO  
tHO  
AMSx  
ABE1–0  
ABE, ADDRESS  
ADDR19–1  
tDO  
tHO  
AWE  
tHARDY  
tSARDY  
ARDY  
tSARDY  
tENDAT  
tDDAT  
DATA15–0  
WRITE DATA  
Figure 11. Asynchronous Memory Write Cycle Timing  
Rev. PrE  
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Page 35 of 72  
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August 2008  
ADSP-BF522/523/524/525/526/527  
Preliminary Technical Data  
NAND Flash Controller Interface Timing  
Table 24 and Figure 12 on Page 36 through Figure 16 on  
Page 38 describe NAND Flash Controller Interface operations.  
Table 24. NAND Flash Controller Interface Timing  
Parameter  
Min  
Max  
Unit  
Write Cycle  
Switching Characteristics  
tCWL  
tCH  
tCLHWL  
tCLH  
tALLWL  
ND_CE Setup Time to AWE Low  
ND_CE Hold Time From AWE High  
ND_CLE Setup Time High to AWE Low  
ND_CLE Hold Time From AWE high  
ND_ALE Setup Time Low to AWE Low  
ND_ALE Hold Time From AWE High  
AWE Low to AWE high  
AWE High to AWE Low  
AWE Low to AWE Low  
Data Setup Time for a Write Access  
Data Hold Time for a Write Access  
1.0 × tSCLK – 4  
3.0 × tSCLK – 4  
0.0  
2.5 × tSCLK – 4  
0.0  
2.5 × tSCLK – 4  
(WR_DLY +1.0) × tSCLK – 4  
4.0 × tSCLK – 4  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tALH  
1
tWP  
tWHWL  
1
tWC  
(WR_DLY +5.0) × tSCLK – 4  
(WR_DLY +1.5) × tSCLK – 4  
2.5 × tSCLK – 4  
1
tDWS  
tDWH  
Read Cycle  
Switching Characteristics  
tCRL  
tCRH  
tRP  
ND_CE Setup Time to ARE Low  
ND_CE Hold Time From ARE High  
ARE Low to ARE High  
ARE High to ARE Low  
ARE Low to ARE Low  
1.0 × tSCLK – 4  
3.0 × tSCLK – 4  
(RD_DLY +1.0) × tSCLK – 4  
4.0 × tSCLK – 4  
(RD_DLY +5.0) × tSCLK – 4  
ns  
ns  
ns  
ns  
ns  
1
tRHRL  
1
tRC  
Timing Requirements  
tDRS  
tDRH  
Data Setup Time for a Read Transaction  
Data Hold Time for a Read Transaction  
8.02  
0.0  
ns  
ns  
Write Followed by Read  
Switching Characteristics  
tWHRL  
AWE High to ARE Low  
5.0 × tSCLK – 4  
ns  
1 WR_DLY and RD_DLY are defined in the NFC_CTL register.  
2 The only parameter that differs from 1.8V to 2.5/3.3V operation is tDRS, which is 8.0ns at 2.5/3.3V and is 11ns at 1.8V.  
t
t
CH  
CWL  
ND_CE  
ND_CLE  
t
CLH  
t
CLHWL  
t
t
ALH  
ALLWL  
ND_ALE  
AWE  
t
WP  
t
DWH  
t
DWS  
ND_D -D  
0
15  
Figure 12. NAND Flash Controller Interface Timing - Command Write Cycle  
Rev. PrE  
|
Page 36 of 72  
|
August 2008  
Preliminary Technical Data  
ADSP-BF522/523/524/525/526/527  
t
CWL  
ND_CE  
t
CLLWL  
ND_CLE  
ND_ALE  
t
t
ALH  
t
t
ALHWL  
ALH  
ALHWL  
t
t
WP  
WP  
t
WHWL  
AWE  
t
WC  
t
t
t
t
DWH  
DWS  
DWH  
DWS  
ND_D -D  
0
15  
Figure 13. NAND Flash Controller Interface Timing - Address Write Cycle  
t
CWL  
ND_CE  
t
CLLWL  
ND_CLE  
t
ALHWL  
ND_ALE  
t
t
WP  
WP  
t
WHWL  
AWE  
t
WC  
ARE  
t
t
t
t
DWS  
DWH  
DWS  
DWH  
ND_D -D  
0
15  
Figure 14. NAND Flash Controller Interface Timing - Data Write Operation  
Rev. PrE  
|
Page 37 of 72  
|
August 2008  
ADSP-BF522/523/524/525/526/527  
Preliminary Technical Data  
t
t
CRH  
CRL  
ND_CE  
ND_CLE  
ND_ALE  
AWE  
t
RC  
t
t
RP  
RP  
t
RHRL  
ARE  
t
t
t
t
DRS  
DRH  
DRS  
DRH  
ND_D -D  
0
15  
Figure 15. NAND Flash Controller Interface Timing - Data Read Operation  
t
CWL  
ND_CE  
ND_CLE  
ND_ALE  
t
t
CLH  
CLHWL  
t
WP  
AWE  
t
RP  
t
WHWL  
ARE  
t
t
t
t
DWH  
DWS  
DWH  
DRS  
ND_D -D  
0
15  
Figure 16. NAND Flash Controller Interface Timing - Write Followed by Read Operation  
Rev. PrE  
|
Page 38 of 72  
|
August 2008  
Preliminary Technical Data  
ADSP-BF522/523/524/525/526/527  
SDRAM Interface Timing  
Table 25. SDRAM Interface Timing  
ADSP-BF522/524/526  
ADSP-BF523/525/527  
VDDMEM = 1.8 V VDDMEM = 2.5/3.3 V VDDMEM = 1.8 V VDDMEM = 2.5/3.3 V  
Parameter  
Min Max Min  
Max  
Min Max Min  
Max  
Unit  
Timing Requirements  
tSSDAT Data Setup Before CLKOUT  
tHSDAT Data Hold After CLKOUT  
Switching Characteristics  
1.5  
0.8  
1.5  
0.8  
1.5  
0.8  
1.5  
0.8  
ns  
ns  
tSCLK CLKOUT Period1  
12.5  
2.5  
12.5  
2.5  
7.5  
2.5  
2.5  
7.5  
2.5  
2.5  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tSCLKH CLKOUT Width High  
tSCLKL CLKOUT Width Low  
2.5  
2.5  
tDCAD Command, Address, Data Delay After CLKOUT2  
tHCAD Command, Address, Data Hold After CLKOUT2  
tDSDAT Data Disable After CLKOUT  
tENSDAT Data Enable After CLKOUT  
4.4  
5.0  
4.4  
5.0  
4.0  
5.0  
4.0  
5.0  
1.0  
1.0  
1.0  
1.0  
0.0  
0.0  
0.0  
0.0  
1 The tSCLK value is the inverse of the fSCLK specification discussed in Table 14 and Table 17. Package type and reduced supply voltages affect the best-case values listed here.  
2 Command balls include: SRAS, SCAS, SWE, SDQM, SMS, SA10, SCKE.  
tSCLK  
tSCLKH  
CLKOUT  
tSSDAT  
tSCLKL  
tHSDAT  
DATA (IN)  
tDCAD  
tDSDAT  
tENSDAT  
tHCAD  
DATA (OUT)  
tDCAD  
COMMAND, ADDRESS  
(OUT)  
tHCAD  
NOTE: COMMAND = SRAS, SCAS, SWE, SDQM, SMS, SA10, SCKE.  
Figure 17. SDRAM Interface Timing  
Rev. PrE  
|
Page 39 of 72  
|
August 2008  
ADSP-BF522/523/524/525/526/527  
Preliminary Technical Data  
External DMA Request Timing  
Table 26 and Figure 18 describe the External DMA Request  
operations.  
Table 26. External DMA Request Timing  
VDDEXT/VDDMEM = 1.8 V1 VDDEXT/VDDMEM = 2.5/3.3 V  
Parameter  
Min  
Max  
Min  
Max  
Unit  
Timing Parameters  
tDR  
tDH  
DMARx Asserted to CLKOUT High Setup  
6.0  
6.0  
ns  
ns  
ns  
ns  
CLKOUT High to DMARx Deasserted Hold Time  
0.0  
0.0  
tDMARACT DMARx Active Pulse Width  
tDMARINACT DMARx Inactive Pulse Width  
1.0 × tSCLK  
1.75 × tSCLK  
1.0 × tSCLK  
1.75 × tSCLK  
1 Because the external DMA control pins are part of the VDDEXT power domain and the CLKOUT signal is part of the VDDMEM power domain, systems in which VDDEXT and  
V
DDMEM are NOT equal may require level shifting logic for correct operation.  
CLKOUT  
tDR  
tDH  
DMAR0/1  
(Active Low)  
tDMARACT  
tDMARINACT  
DMAR0/1  
(Active High)  
tDMARACT  
tDMARINACT  
Figure 18. External DMA Request Timing  
Rev. PrE  
|
Page 40 of 72  
|
August 2008  
Preliminary Technical Data  
ADSP-BF522/523/524/525/526/527  
Parallel Peripheral Interface Timing  
Table 27 and Figure 19 on Page 41, Figure 23 on Page 46, and  
Figure 24 on Page 46 describe parallel peripheral interface  
operations.  
Table 27. Parallel Peripheral Interface Timing  
ADSP-BF522/524/526  
ADSP-BF523/525/527  
V
DDEXT = 1.8 V VDDEXT = 2.5/3.3 V VDDEXT = 1.8 V VDDEXT = 2.5/3.3 V  
Parameter  
Min Max Min  
Max  
Min Max Min  
Max  
Unit  
Timing Requirements  
tPCLKW PPI_CLK Width1  
tPCLK PPI_CLK Period1  
6.4  
6.4  
6.0  
6.0  
ns  
ns  
16.0  
16.0  
15.0  
15.0  
Timing Requirements - GP Input and Frame Capture Modes  
tSFSPE External Frame Sync Setup Before PPI_CLK  
(Nonsampling Edge for Rx, Sampling Edge for Tx)  
6.7  
6.7  
6.7  
6.7  
ns  
tHFSPE External Frame Sync Hold After PPI_CLK  
tSDRPE Receive Data Setup Before PPI_CLK  
tHDRPE Receive Data Hold After PPI_CLK  
1.0  
3.5  
1.5  
1.0  
3.5  
1.5  
1.0  
3.5  
1.5  
1.0  
3.5  
1.5  
ns  
ns  
ns  
Switching Characteristics - GP Output and Frame Capture Modes  
tDFSPE Internal Frame Sync Delay After PPI_CLK  
tHOFSPE Internal Frame Sync Hold After PPI_CLK  
tDDTPE Transmit Data Delay After PPI_CLK  
tHDTPE Transmit Data Hold After PPI_CLK  
1 PPI_CLK frequency cannot exceed fSCLK/2  
8.8  
8.8  
8.8  
8.8  
8.0  
8.0  
8.0  
8.0  
ns  
ns  
ns  
ns  
1.7  
1.8  
1.7  
1.8  
1.7  
1.8  
1.7  
1.8  
DATA1 IS  
SAMPLED  
DATA0 IS  
SAMPLED  
PPI_CLK  
POLC = 0  
PPI_CLK  
POLC = 1  
t
t
HFSPE  
SFSPE  
POLS = 1  
POLS = 0  
PPI_FS1  
POLS = 1  
POLS = 0  
PPI_FS2  
t
t
HDRPE  
SDRPE  
PPI_DATA  
Figure 19. PPI GP Rx Mode with External Frame Sync Timing  
Rev. PrE  
|
Page 41 of 72  
|
August 2008  
ADSP-BF522/523/524/525/526/527  
Preliminary Technical Data  
DATA  
DATA  
DRIVING/  
FRAME  
SYNC  
DRIVING/  
FRAME  
SYNC  
SAMPLING  
EDGE  
SAMPLING  
EDGE  
PPI_CLK  
POLC = 0  
PPI_CLK  
POLC = 1  
t
HFSPE  
t
SFSPE  
POLS = 1  
POLS = 0  
PPI_FS1  
POLS = 1  
POLS = 0  
PPI_FS2  
t
DDTPE  
t
HDTPE  
PPI_DATA  
Figure 20. PPI GP Tx Mode with External Frame Sync Timing  
FRAME  
DATA0  
IS  
SAMPLED  
SYNC IS  
DRIVEN  
OUT  
POLC = 0  
PPI_CLK  
PPI_CLK  
POLC = 1  
t
DFSPE  
t
HOFSPE  
POLS = 1  
POLS = 0  
PPI_FS1  
PPI_FS2  
POLS = 1  
POLS = 0  
t
t
SDRPE  
HDRPE  
PPI_DATA  
Figure 21. PPI GP Rx Mode with Internal Frame Sync Timing  
Rev. PrE  
|
Page 42 of 72  
|
August 2008  
Preliminary Technical Data  
ADSP-BF522/523/524/525/526/527  
FRAME  
SYNC IS  
DRIVEN  
OUT  
DATA0 IS  
DRIVEN  
OUT  
PPI_CLK  
POLC = 0  
PPI_CLK  
POLC = 1  
t
DFSPE  
t
HOFSPE  
POLS = 1  
PPI_FS1  
POLS = 0  
POLS = 1  
PPI_FS2  
POLS = 0  
t
DDTPE  
t
HDTPE  
PPI_DATA  
DATA0  
Figure 22. PPI GP Tx Mode with Internal Frame Sync Timing  
Rev. PrE  
|
Page 43 of 72  
|
August 2008  
ADSP-BF522/523/524/525/526/527  
Preliminary Technical Data  
Serial Ports  
Table 28 through Table 31 on Page 45 and Figure 23 on Page 46  
through Figure 24 on Page 46 describe serial port operations.  
Table 28. Serial Ports—External Clock  
ADSP-BF522/524/526  
ADSP-BF523/525/527  
V
DDEXT = 1.8 V VDDEXT = 2.5/3.3 V VDDEXT = 1.8 V VDDEXT = 2.5/3.3 V  
Parameter  
Min Max Min  
Max  
Min Max Min  
Max  
Unit  
Timing Requirements  
tSFSE TFSx/RFSx Setup Before TSCLKx/RSCLKx1  
tHFSE TFSx/RFSx Hold After TSCLKx/RSCLKx1  
tSDRE Receive Data Setup Before RSCLKx1  
tHDRE Receive Data Hold After RSCLKx1  
tSCLKEW TSCLKx/RSCLKx Width  
tSCLKE TSCLKx/RSCLKx Period  
Switching Characteristics  
3.0  
3.0  
3.0  
3.6  
5.4  
18.0  
3.0  
3.0  
3.0  
3.6  
5.4  
18.0  
3.0  
3.0  
3.0  
3.0  
4.5  
15.0  
3.0  
3.0  
3.0  
3.0  
4.5  
15.0  
ns  
ns  
ns  
ns  
ns  
ns  
tDFSE TFSx/RFSx Delay After TSCLKx/RSCLKx  
(Internally Generated TFSx/RFSx)2  
12.0  
12.0  
12.0  
12.0  
10.0  
10.0  
10.0  
10.0  
ns  
ns  
tHOFSE TFSx/RFSx Hold After TSCLKx/RSCLKx  
(Internally Generated TFSx/RFSx)1  
tDDTE Transmit Data Delay After TSCLKx1  
tHDTE Transmit Data Hold After TSCLKx1  
0.0  
0.0  
0.0  
0.0  
0.0  
0.0  
0.0  
0.0  
ns  
ns  
1 Referenced to sample edge.  
2 Referenced to drive edge.  
Table 29. Serial Ports—Internal Clock  
ADSP-BF522/524/526  
ADSP-BF523/525/527  
V
DDEXT = 1.8 V VDDEXT = 2.5/3.3 V VDDEXT = 1.8 V VDDEXT = 2.5/3.3 V  
Parameter  
Min Max Min  
Max  
Min Max Min  
Max  
Unit  
Timing Requirements  
tSFSI TFSx/RFSx Setup Before TSCLKx/RSCLKx1  
tHFSI TFSx/RFSx Hold After TSCLKx/RSCLKx1  
tSDRI Receive Data Setup Before RSCLKx1  
tHDRI Receive Data Hold After RSCLKx1  
Switching Characteristics  
11.3  
–1.5  
11.3  
–1.5  
11.3  
–1.5  
11.3  
–1.5  
9.6  
9.6  
ns  
ns  
ns  
ns  
–1.5  
9.6  
–1.5  
9.6  
–1.5  
–1.5  
tSCLKIW TSCLKx/RSCLKx Width  
5.4  
5.4  
4.5  
4.5  
ns  
ns  
ns  
tSCLKI TSCLKx/RSCLKx Period  
18.0  
18.0  
15.0  
15.0  
tDFSI TFSx/RFSx Delay After TSCLKx/RSCLKx  
(Internally Generated TFSx/RFSx)2  
3.0  
3.0  
3.0  
3.0  
3.0  
3.0  
3.0  
3.0  
tHOFSI TFSx/RFSx Hold After TSCLKx/RSCLKx  
(Internally Generated TFSx/RFSx)1  
tDDTI Transmit Data Delay After TSCLKx1  
tHDTI Transmit Data Hold After TSCLKx1  
4.0  
1.8  
4.0  
1.8  
1.0  
1.0  
1.0  
1.0  
ns  
ns  
ns  
1 Referenced to sample edge.  
2 Referenced to drive edge.  
Rev. PrE  
|
Page 44 of 72  
|
August 2008  
Preliminary Technical Data  
ADSP-BF522/523/524/525/526/527  
Table 30. Serial Ports—Enable and Three-State  
ADSP-BF522/524/526  
ADSP-BF523/525/527  
V
DDEXT = 1.8 V VDDEXT = 2.5/3.3 V VDDEXT = 1.8 V VDDEXT = 2.5/3.3 V  
Parameter  
Min Max Min  
Max  
Min Max Min  
Max  
Unit  
Switching Characteristics  
tDTENE Data Enable Delay from External TSCLKx1  
tDDTTE Data Disable Delay from External TSCLKx1  
tDTENI Data Enable Delay from Internal TSCLKx1  
tDDTTI Data Disable Delay from Internal TSCLKx1  
1 Referenced to drive edge.  
0.0  
0.0  
0.0  
0.0  
ns  
ns  
ns  
ns  
10.0  
3.0  
10.0  
3.0  
10.0  
3.0  
10.0  
3.0  
–2.0  
–2.0  
–2.0  
–2.0  
Table 31. External Late Frame Sync  
ADSP-BF522/524/526  
ADSP-BF523/525/527  
V
DDEXT = 1.8 V VDDEXT = 2.5/3.3 V VDDEXT = 1.8 V VDDEXT = 2.5/3.3 V  
Parameter  
Min Max Min  
Max  
Min Max Min  
Max  
Unit  
Switching Characteristics  
tDDTLFSE Data Delay from Late External TFSx  
10.0  
10.0  
10.0  
10.0  
ns  
ns  
or External RFSx in multi-channel mode with MFD = 01, 2  
tDTENLFSE Data Enable from Late FS or in multi-channel mode with  
MFD = 01, 2  
0.0  
0.0  
0.0  
0.0  
1 When in multi-channel mode, TFSx enable and TFSx valid follow tDDTENFS and tDDTLFSE  
2 If external RFSx/TFSx setup to RSCLKx/TSCLKx > tSCLKE/2 then tDDTTE/I and tDTENE/I apply, otherwise tDDTLFSE and tDTENLFS apply.  
.
Rev. PrE  
|
Page 45 of 72  
|
August 2008  
ADSP-BF522/523/524/525/526/527  
Preliminary Technical Data  
DATA RECEIVE—INTERNAL CLOCK  
DATA RECEIVE—EXTERNAL CLOCK  
DRIVE  
EDGE  
SAMPLE  
EDGE  
DRIVE  
EDGE  
SAMPLE  
EDGE  
tSCLKIW  
tSCLKEW  
RSCLKx  
RSCLKx  
tDFSI  
tDFSE  
tHOFSI  
tSFSI  
tHFSI  
tHOFSE  
tSFSE  
tHFSE  
RFSx  
RFSx  
tSDRI  
tHDRI  
tSDRE  
tHDRE  
DRx  
DRx  
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF RSCLKx OR TSCLKx CAN BE USED AS THE ACTIVE SAMPLING EDGE.  
DATA TRANSMIT—INTERNAL CLOCK  
DATA TRANSMIT—EXTERNAL CLOCK  
DRIVE  
EDGE  
SAMPLE  
EDGE  
DRIVE  
EDGE  
SAMPLE  
EDGE  
tSCLKIW  
tSCLKEW  
TSCLKx  
TFSx  
TSCLKx  
tDFSI  
tDFSE  
tHOFSI  
tSFSI  
tHFSI  
tHOFSE  
tSFSE  
tHFSE  
TFSx  
tDDTI  
tDDTE  
tHDTI  
tHDTE  
DTx  
DTx  
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF RSCLKx OR TSCLKx CAN BE USED AS THE ACTIVE SAMPLING EDGE.  
Figure 23. Serial Ports  
EXTERNAL RFSx IN MULTI-CHANNEL MODE WITH MCE = 1  
DRIVE  
SAMPLE  
DRIVE  
RSCLKx  
RFSx  
tSFSE/I  
tHOFSE/I  
tDDTTE/I  
tDTENE/I  
tDTENLFS  
1ST BIT  
2ND BIT  
DTx  
tDDTLFSE  
LATE EXTERNAL TFSx  
DRIVE  
SAMPLE  
DRIVE  
TSCLKx  
TFSx  
tHOFSE/I  
tSFSE/I  
tDDTTE/I  
tDTENE/I  
tDTENLFS  
DTx  
1ST BIT  
2ND BIT  
tDDTLFSE  
Figure 24. External Late Frame Sync  
Rev. PrE  
|
Page 46 of 72  
|
August 2008  
Preliminary Technical Data  
ADSP-BF522/523/524/525/526/527  
Serial Peripheral Interface (SPI) Port—Master Timing  
Table 32 and Figure 25 describe SPI port master operations.  
Table 32. Serial Peripheral Interface (SPI) Port—Master Timing  
ADSP-BF522/524/526  
DDEXT = 1.8 V VDDEXT = 2.5/3.3 V  
Max Min Max Min  
ADSP-BF523/525/527  
V
VDDEXT = 1.8 V VDDEXT = 2.5/3.3 V  
Parameter  
Min  
Max Min  
Max Unit  
Timing Requirements  
tSSPIDM Data Input Valid to SCK Edge (Data Input Setup) 11.6  
11.6  
–1.5  
9.6  
9.6  
ns  
ns  
tHSPIDM SCK Sampling Edge to Data Input Invalid  
Switching Characteristics  
–1.5  
–1.5  
–1.5  
tSDSCIM SPISELx low to First SCK Edge  
tSPICHM Serial Clock High Period  
2 × tSCLK  
2 × tSCLK  
2 × tSCLK  
2 × tSCLK  
ns  
ns  
ns  
ns  
ns  
ns  
2 × tSCLK 1.5  
2 × tSCLK 1.5  
4 × tSCLK  
2 × tSCLK 1.5  
2 × tSCLK 1.5  
4 × tSCLK  
2 × tSCLK 1.5  
2 × tSCLK 1.5  
4 × tSCLK  
2 × tSCLK –1.5  
2 × tSCLK –1.5  
4 × tSCLK  
tSPICLM Serial Clock Low Period  
tSPICLK Serial Clock Period  
tHDSM Last SCK Edge to SPISELx High  
tSPITDM Sequential Transfer Delay  
2 × tSCLK  
2 × tSCLK  
2 × tSCLK  
2 × tSCLK  
2 × tSCLK  
2 × tSCLK  
2 × tSCLK  
2 × tSCLK  
tDDSPIDM SCK Edge to Data Out Valid (Data Out Delay)  
tHDSPIDM SCK Edge to Data Out Invalid (Data Out Hold)  
6
6
6
6
ns  
ns  
–1.0  
–1.0  
–1.0  
–1.0  
SPISELx  
(OUTPUT)  
tSPICLK  
tHDSM  
tSPITDM  
tSDSCIM  
tSPICHM  
tSPICLM  
SCK  
(CPOL = 0)  
(OUTPUT)  
tSPICLM  
tSPICHM  
SCK  
(CPOL = 1)  
(OUTPUT)  
tHDSPIDM  
tDDSPIDM  
MOSI  
(OUTPUT)  
MSB  
LSB  
CPHA = 1  
tSSPIDM  
tHSPIDM  
MISO  
(INPUT)  
MSB VALID  
LSB VALID  
tHDSPIDM  
tDDSPIDM  
MOSI  
(OUTPUT)  
MSB  
LSB  
CPHA = 0  
tSSPIDM  
tHSPIDM  
MISO  
(INPUT)  
MSB VALID  
LSB VALID  
Figure 25. Serial Peripheral Interface (SPI) Port—Master Timing  
Rev. PrE  
|
Page 47 of 72  
|
August 2008  
ADSP-BF522/523/524/525/526/527  
Preliminary Technical Data  
Serial Peripheral Interface (SPI) Port—Slave Timing  
Table 33 and Figure 26 describe SPI port slave operations.  
Table 33. Serial Peripheral Interface (SPI) Port—Slave Timing  
ADSP-BF522/524/526  
VDDEXT = 1.8 V VDDEXT = 2.5/3.3 V  
Max Min Max Min  
ADSP-BF523/525/527  
VDDEXT = 1.8 V  
VDDEXT = 2.5/3.3 V  
Max Unit  
Parameter  
Min  
Max Min  
Timing Requirements  
tSPICHS Serial Clock High Period  
tSPICLS Serial Clock Low Period  
tSPICLK Serial Clock Period  
2 × tSCLK 1.5  
2 × tSCLK 1.5  
4 × tSCLK  
2 × tSCLK 1.5  
2 × tSCLK 1.5  
2 × tSCLK 1.5  
4 × tSCLK  
2 × tSCLK  
2 × tSCLK  
2 × tSCLK  
1.6  
2 × tSCLK –1.5  
2 × tSCLK –1.5  
4 × tSCLK  
2 × tSCLK  
2 × tSCLK  
2 × tSCLK  
1.6  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
2 × tSCLK 1.5  
4 × tSCLK  
2 × tSCLK  
2 × tSCLK  
2 × tSCLK  
1.6  
tHDS Last SCK Edge to SPISS Not Asserted  
tSPITDS Sequential Transfer Delay  
tSDSCI SPISS Assertion to First SCK Edge  
2 × tSCLK  
2 × tSCLK  
2 × tSCLK  
tSSPID Data Input Valid to SCK Edge (Data Input Setup) 1.6  
tHSPID SCK Sampling Edge to Data Input Invalid  
Switching Characteristics  
1.6  
1.6  
1.6  
1.6  
tDSOE SPISS Assertion to Data Out Active  
tDSDHI SPISS Deassertion to Data High Impedance  
tDDSPID SCK Edge to Data Out Valid (Data Out Delay)  
tHDSPID SCK Edge to Data Out Invalid (Data Out Hold)  
0
0
12.0 0  
12.0 0  
10.3 0  
10.3 ns  
8.5  
10  
0
8.5  
10  
0
8
0
8
ns  
10  
10 ns  
ns  
0
0
0
0
SPISS  
(INPUT)  
tSPICHS  
tSPICLS  
tSPICLK  
tHDS  
tSPITDS  
SCKx  
(CPOL = 0)  
(INPUT)  
tSDSCI  
tSPICLS  
tSPICHS  
SCKx  
(CPOL = 1)  
(INPUT)  
tDSOE  
tDDSPID  
tHDSPID  
MSB  
tDDSPID  
tDSDHI  
MISOx  
(OUTPUT)  
LSB  
CPHA = 1  
tSSPID  
tHSPID  
MOSIx  
(INPUT)  
MSB VALID  
LSB VALID  
tDSOE  
tHDSPID  
tDSDHI  
tDDSPID  
MISOx  
(OUTPUT)  
MSB  
LSB  
tHSPID  
CPHA = 0  
tSSPID  
MOSIx  
(INPUT)  
MSB VALID  
LSB VALID  
Figure 26. Serial Peripheral Interface (SPI) Port—Slave Timing  
Rev. PrE  
|
Page 48 of 72  
|
August 2008  
Preliminary Technical Data  
ADSP-BF522/523/524/525/526/527  
Universal Asynchronous Receiver-Transmitter  
(UART) Ports—Receive and Transmit Timing  
Figure 27 describes the UART ports receive and transmit opera-  
tions. The maximum baud rate is SCLK/16. There is some  
latency between the generation of internal UART interrupts  
and the external data operations. These latencies are negligible  
at the data transmission rates for the UART.  
CLKOUT  
(SAMPLE  
CLOCK)  
UARTx Rx  
RECEIVE  
DATA(5-8)  
DATA(5-8)  
STOP  
INTERNAL  
UARTRECEIVE  
INTERRUPT  
UARTRECEIVE BIT SET BY  
DATA STOP ;  
CLEARED BY FIFO READ  
START  
UARTx Tx  
STOP(1-2)  
TRANSMIT  
INTERNAL  
UART TRANSMIT  
INTERRUPT  
UART TRANSMIT BIT SETBY PROGRAM;  
CLEARED BY WRITE TO TRANSMIT  
Figure 27. UART Ports—Receive and Transmit Timing  
General-Purpose Port Timing  
Table 34 and Figure 28 describe general-purpose  
port operations.  
Table 34. General-Purpose Port Timing  
ADSP-BF522/524/526  
ADSP-BF523/525/527  
V
DDEXT = 1.8 V VDDEXT = 2.5/3.3 V VDDEXT = 1.8 V VDDEXT = 2.5/3.3 V  
Parameter  
Timing Requirement  
tWFI General-Purpose Port Ball Input Pulse Width  
Switching Characteristics  
tGPOD General-Purpose Port Ball Output Delay from CLKOUT Low  
Min  
tSCLK + 1  
0
Max Min  
tSCLK + 1  
Max Min  
tSCLK + 1  
Max Min  
tSCLK + 1  
Max Unit  
ns  
9.66  
0
9.66  
0
6
0
6
ns  
CLKOUT  
tGPOD  
GPIO OUTPUT  
GPIO INPUT  
tWFI  
Figure 28. General-Purpose Port Timing  
Rev. PrE  
|
Page 49 of 72  
|
August 2008  
ADSP-BF522/523/524/525/526/527  
Preliminary Technical Data  
Timer Cycle Timing  
Table 35 and Figure 29 describe timer expired operations. The  
input signal is asynchronous in “width capture mode” and  
“external clock mode” and has an absolute maximum input fre-  
quency of (fSCLK/2) MHz.  
Table 35. Timer Cycle Timing  
ADSP-BF522/524/526  
ADSP-BF523/525/527  
V
DDEXT = 1.8 V  
Max  
VDDEXT = 2.5/3.3 V  
Min Max  
VDDEXT = 1.8 V  
Min Max  
VDDEXT = 2.5/3.3 V  
Min Max  
Parameter  
Min  
Unit  
Timing Characteristics  
tWL Timer Pulse Width Input Low  
(Measured In SCLK Cycles)1  
1 × tSCLK  
1 × tSCLK  
1 × tSCLK  
1 × tSCLK  
1 × tSCLK  
1 × tSCLK  
1 × tSCLK  
1 × tSCLK  
ns  
ns  
tWH Timer Pulse Width Input High  
(Measured In SCLK Cycles)1  
tTIS Timer Input Setup Time Before CLKOUT Low2  
tTIH Timer Input Hold Time After CLKOUT Low2  
Switching Characteristics  
5
5
5
5
ns  
ns  
–2  
–2  
–2  
–2  
tHTO Timer Pulse Width Output  
(Measured In SCLK Cycles)  
1 × tSCLK (232–1)tSCLK 1 × tSCLK (232–1)tSCLK 1 × tSCLK (232–1)tSCLK 1 × tSCLK (232–1)tSCLK ns  
8.1 8.1 ns  
tTOD Timer Output Update Delay After CLKOUT High  
6
6
1 The minimum pulse widths apply for TMRx signals in width capture and external clock modes. They also apply to the PF15 or PPI_CLK signals in PWM output mode.  
2 Either a valid setup and hold time or a valid pulse width is sufficient. There is no need to resynchronize programmable flag inputs.  
CLKOUT  
tTOD  
MRx OUTPUT  
tHTO  
tTIS  
tTIH  
MRx INPUT  
tWH, tWL  
Figure 29. Timer Cycle Timing  
Rev. PrE  
|
Page 50 of 72  
|
August 2008  
Preliminary Technical Data  
ADSP-BF522/523/524/525/526/527  
Timer Clock Timing  
Table 36 and Figure 30 describe timer clock timing.  
Table 36. Timer Clock Timing  
V
DDEXT = 1.8 V  
Max  
VDDEXT = 2.5/3.3 V  
Parameter  
Min  
Min  
Max  
Unit  
Switching Characteristic  
tTODP  
Timer Output Update Delay After PPI_CLK High  
12.64  
12.64  
ns  
PPI_CLK  
tTODP  
MRx OUTPUT  
Figure 30. Timer Clock Timing  
Up/Down Counter/Rotary Encoder Timing  
Table 37. Up/Down Counter/Rotary Encoder Timing  
VDDEXT = 1.8 V  
Min Max  
VDDEXT = 2.5/3.3 V  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
tWCOUNT  
tCIS  
Up/Down Counter/Rotary Encoder Input Pulse Width  
tSCLK + 1  
tSCLK + 1  
4.0  
ns  
ns  
ns  
Counter Input Setup Time Before CLKOUT Low1  
4.0  
4.0  
tCIH  
Counter Input Hold Time After CLKOUT Low1  
4.0  
1 Either a valid setup and hold time or a valid pulse width is sufficient. There is no need to resynchronize counter inputs.  
CLKOUT  
tCIS  
tCIH  
CUD/CDG/CZM  
tWCOUNT  
Figure 31. Up/Down Counter/Rotary Encoder Timing  
Rev. PrE  
|
Page 51 of 72  
|
August 2008  
ADSP-BF522/523/524/525/526/527  
Preliminary Technical Data  
HOSTDP A/C Timing- Host Read Cycle  
Table 38 describe the HOSTDP A/C Host Read Cycle timing  
requirements.  
Table 38. Host Read Cycle Timing Requirements  
ADSP-BF522/524/526,  
VDDEXT = 1.8 V VDDEXT = 2.5/3.3 V  
ADSP-BF523/525/527  
VDDEXT = 1.8 V  
VDDEXT = 2.5/3.3 V  
Parameter  
Timing Requirements  
Min  
Max  
Min  
Max  
Min  
Max  
Min  
4
Max Unit  
tSADRDL HOST_ADDR and HOST_CE Setup  
before HOST_RD falling edge  
tHADRDH HOST_ADDR and HOST_CE Hold  
after HOST_RD rising edge  
tRDWL HOST_RD pulse width low  
(ACK mode)  
4
4
4
ns  
ns  
ns  
ns  
ns  
2.5  
2.5  
2.5  
2.5  
tDRDYRDL + tRDYPRD  
+ tDRDHRDY  
1.5 × tSCLK + 8.7  
tDRDYRDL + tRDYPRD  
+ tDRDHRDY  
1.5 × tSCLK + 8.7  
tDRDYRDL + tRDYPRD  
+ tDRDHRDY  
1.5 × tSCLK + 8.7  
tDRDYRDL + tRDYPRD  
+ tDRDHRDY  
1.5 × tSCLK + 8.7  
tRDWL HOST_RD pulse width low  
(INT mode)  
tRDWH HOST_RD pulse width high  
or time between HOST_RD rising  
edge and HOST_WR falling edge  
tDRDHRDY HOST_RD rising edge delay after  
HOST_ACK rising edge (ACK mode)  
Switching Characteristics  
2 × tSCLK  
2 × tSCLK  
2 × tSCLK  
2 × tSCLK  
0
0
0
0
ns  
tSDATRDY Data valid prior HOST_ACK rising  
edge (ACK mode)  
4.5  
3.5  
4.5  
3.5  
ns  
1.5 × tSCLK ns  
NM1 ns  
tDRDYRDL Host_ACK assertion delay after  
HOST_RD/HOST_CE (ACK mode)  
tRDYPRD HOST_ACK low pulse-width  
for Read access (ACK mode)  
tDDARWH Data disable after HOST_RD  
1.5 × tSCLK  
1.5 × tSCLK  
1.5 × tSCLK  
NM1  
NM1  
NM1  
9.0  
9.0  
9.0  
9.0  
ns  
tACC  
Data valid after HOST_RD falling  
edge (INT mode)  
1.5 × tSCLK  
1.5 × tSCLK  
1.5 × tSCLK  
1.5 × tSCLK ns  
tHDARWH Data hold after HOST_RD rising  
edge  
1.0  
1.0  
1.0  
1.0  
ns  
1 NM (Not Measured) — This parameter is not measured, because the time for which HOST_ACK is low is system design dependent.  
HOST_ADDR  
HOST_CE  
tSADRDL  
tHADRDH  
tRDWH  
tRDWL  
HOST_RD  
tRDYPRD  
HOST_ACK  
tDRDYRDL  
tDRDHRDY  
tSDATRDY  
tDDARWH  
tHDARWH  
HOST_D15-0  
tACC  
Figure 32. HOSTDP A/C- Host Read Cycle  
Rev. PrE  
|
Page 52 of 72  
|
August 2008  
Preliminary Technical Data  
ADSP-BF522/523/524/525/526/527  
HOSTDP A/C Timing- Host Write Cycle  
Table 39 describes the HOSTDP A/C Host Write Cycle timing  
requirements.  
Table 39. Host Write Cycle Timing Requirements  
ADSP-BF522/524/526  
VDDEXT = 1.8 V VDDEXT = 2.5/3.3 V  
ADSP-BF523/525/527  
VDDEXT = 1.8 V  
VDDEXT = 2.5/3.3 V  
Parameter  
Timing Requirements  
Min  
Max  
Min  
Max  
Min  
Max  
Min  
4
Max Unit  
tSADWRL HOST_ADDR/HOST_CE Setup  
before HOST_WR falling edge  
tHADWRH HOST_ADDR/HOST_CE Hold  
after HOST_WR rising edge  
tWRWL HOST_WR pulse width low  
(ACK mode)  
HOST_WR pulse width low  
(INT mode)  
tWRWH HOST_WR pulse width high  
or time between HOST_WR  
rising edge and HOST_RD  
falling edge  
4
4
4
ns  
ns  
ns  
ns  
ns  
2.5  
2.5  
2.5  
2.5  
tDRDYWRL + tRDYPRD  
+ tDWRHRDY  
1.5 × tSCLK + 8.7  
t
DRDYWRL + tRDYPRD  
+ tDWRHRDY  
1.5 × tSCLK + 8.7  
t
DRDYWRL + tRDYPRD  
+ tDWRHRDY  
1.5 × tSCLK + 8.7  
t
DRDYWRL + tRDYPRD  
+ tDWRHRDY  
1.5 × tSCLK + 8.7  
2 × tSCLK  
2 × tSCLK  
2 × tSCLK  
2 × tSCLK  
tDWRHRDY HOST_WR rising edge delay  
after HOST_ACK rising edge  
(ACK mode)  
0
0
0
0
ns  
tHDATWH Data Hold after HOST_WR  
rising edge  
tSDATWH Data Setup before HOST_WR  
rising edge  
2.5  
2.5  
2.5  
2.5  
2.5  
2.5  
2.5  
2.5  
ns  
ns  
Switching Characteristics  
tDRDYWRL HOST_ACK low delay after  
HOST_WR/HOST_CE asserted  
(ACK mode)  
tRDYPWR HOST_ACK low pulse-width for  
Write access (ACK mode)  
1.5 × tSCLK  
1.5 × tSCLK  
1.5 × tSCLK  
1.5 × tSCLK ns  
NM1  
NM1  
NM1  
NM1 ns  
1 NM (Not Measured) — This parameter is not measured, because the time for which HOST_ACK is low is system design dependent.  
HOST_ADDR  
HOST_CE  
tSADWRL  
tHADWRH  
tWRWH  
tWRWL  
HOST_WR  
tRDYPWR  
HOST_ACK  
tDRDYWRL  
tDWRHRDY  
tSDATWH  
tHDATWH  
HOST_D15-0  
Figure 33. HOSTDP A/C- Host Write Cycle  
Rev. PrE  
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ADSP-BF522/523/524/525/526/527  
Preliminary Technical Data  
10/100 Ethernet MAC Controller Timing  
Table 40 through Table 45 and Figure 34 through Figure 39  
describe the 10/100 Ethernet MAC Controller operations.  
Table 40. 10/100 Ethernet MAC Controller Timing: MII Receive Signal  
VDDEXT = 1.8 V  
VDDEXT = 2.5/3.3 V  
Max  
Parameter1  
Min  
Max  
Min  
None  
Unit  
tERXCLKF ERxCLK Frequency (fSCLK = SCLK Frequency)  
None  
25 + 1%  
25 + 1%  
MHz  
fSCLK + 1%  
fSCLK + 1%  
tERXCLKW ERxCLK Width (tERxCLK = ERxCLK Period)  
tERxCLK x 35% tERxCLK x 65% tERxCLK x 35% tERxCLK x 65% ns  
tERXCLKIS Rx Input Valid to ERxCLK Rising Edge (Data In Setup)  
tERXCLKIH ERxCLK Rising Edge to Rx Input Invalid (Data In Hold)  
1 MII inputs synchronous to ERxCLK are ERxD3–0, ERxDV, and ERxER.  
7.5  
7.5  
7.5  
7.5  
ns  
ns  
Table 41. 10/100 Ethernet MAC Controller Timing: MII Transmit Signal  
VDDEXT = 1.8 V  
Max  
VDDEXT = 2.5/3.3 V  
Max  
Parameter1  
Min  
Min  
Unit  
tETXCLKF ETxCLK Frequency (fSCLK = SCLK Frequency)  
None  
25 + 1%  
None  
25 + 1%  
MHz  
fSCLK + 1%  
fSCLK + 1%  
tETXCLKW ETxCLK Width (tETxCLK = ETxCLK Period)  
tETxCLK x 35% tETxCLK x 65% tETxCLK x 35% tETxCLK x 65% ns  
tETXCLKOV ETxCLK Rising Edge to Tx Output Valid (Data Out Valid)  
tETXCLKOH ETxCLK Rising Edge to Tx Output Invalid (Data Out Hold)  
1 MII outputs synchronous to ETxCLK are ETxD3–0.  
20  
20  
ns  
ns  
0
0
Table 42. 10/100 Ethernet MAC Controller Timing: RMII Receive Signal  
VDDEXT = 1.8 V  
Max  
VDDEXT = 2.5/3.3 V  
Max  
Parameter1  
Min  
Min  
Unit  
tEREFCLKF REF_CLK Frequency (fSCLK = SCLK Frequency)  
None  
50 + 1%  
None  
50 + 1%  
MHz  
2 x fSCLK + 1%  
2 x fSCLK + 1%  
tEREFCLKW EREF_CLK Width (tEREFCLK = EREFCLK Period)  
tEREFCLK x 35% tEREFCLK x 65% tEREFCLK x 35% tEREFCLK x 65% ns  
tEREFCLKIS Rx Input Valid to RMII REF_CLK Rising Edge (Data In Setup)  
tEREFCLKIH RMII REF_CLK Rising Edge to Rx Input Invalid (Data In Hold)  
1 RMII inputs synchronous to RMII REF_CLK are ERxD1–0, RMII CRS_DV, and ERxER.  
4
2
4
2
ns  
ns  
Table 43. 10/100 Ethernet MAC Controller Timing: RMII Transmit Signal  
ADSP-BF522/524/526  
ADSP-BF523/525/527  
VDDEXT = 1.8 V VDDEXT = 2.5/3.3 V VDDEXT = 1.8 V VDDEXT = 2.5/3.3 V  
Parameter1  
Min Max Min  
Max  
Min Max Min  
Max  
Unit  
tEREFCLKOV RMII REF_CLK Rising Edge  
to Tx Output Valid (Data Out Valid)  
8.1  
8.1  
7.5  
7.5  
ns  
tEREFCLKOH RMII REF_CLK Rising Edge  
to Tx Output Invalid (Data Out Hold)  
2
2
2
2
ns  
1 RMII outputs synchronous to RMII REF_CLK are ETxD1–0.  
Rev. PrE  
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Preliminary Technical Data  
ADSP-BF522/523/524/525/526/527  
Table 44. 10/100 Ethernet MAC Controller Timing: MII/RMII Asynchronous Signal  
VDDEXT = 1.8 V VDDEXT = 2.5/3.3 V  
Min Max Min Max Unit  
tETxCLK x 1.5  
tERxCLK x 1.5  
ETxCLK x 1.5  
Parameter1, 2  
tECOLH COL Pulse Width High  
tETxCLK x 1.5  
tERxCLK x 1.5  
ns  
ns  
tECOLL COL Pulse Width Low  
tETxCLK x 1.5  
tERxCLK x 1.5  
t
tERxCLK x 1.5  
tETxCLK x 1.5  
tETxCLK x 1.5  
tECRSH CRS Pulse Width High  
tECRSL CRS Pulse Width Low  
tETxCLK x 1.5  
tETxCLK x 1.5  
ns  
ns  
1 MII/RMII asynchronous signals are COL and CRS. These signals are applicable in both MII and RMII modes. The asynchronous COL input is synchronized separately to  
both the ETxCLK and the ERxCLK, and the COL input must have a minimum pulse width high or low at least 1.5 times the period of the slower of the two clocks.  
2 The asynchronous CRS input is synchronized to the ETxCLK, and the CRS input must have a minimum pulse width high or low at least 1.5 times the period of ETxCLK.  
Table 45. 10/100 Ethernet MAC Controller Timing: MII Station Management  
ADSP-BF522/524/526  
VDDEXT = 1.8 V VDDEXT = 2.5/3.3 V VDDEXT = 1.8 V VDDEXT = 2.5/3.3 V  
Min Max Min Max Min Max Min Max  
ADSP-BF523/525/527  
Parameter1  
Unit  
ns  
tMDIOS MDIO Input Valid to MDC Rising Edge (Setup)  
tMDCIH MDC Rising Edge to MDIO Input Invalid (Hold)  
tMDCOV MDC Falling Edge to MDIO Output Valid  
tMDCOH MDC Falling Edge to MDIO Output Invalid (Hold)  
11.5  
11.5  
25  
11.5  
11.5  
25  
10  
10  
25  
–1  
10  
10  
25  
–1  
ns  
ns  
–1  
–1  
ns  
1 MDC/MDIO is a 2-wire serial bidirectional port for controlling one or more external PHYs. MDC is an output clock whose minimum period is programmable as a multiple  
of the system clock SCLK. MDIO is a bidirectional data line.  
tERXCLK  
ERx_CLK  
tERXCLKW  
ERxD3-0  
ERxDV  
ERxER  
tERXCLKIS  
tERXCLKIH  
Figure 34. 10/100 Ethernet MAC Controller Timing: MII Receive Signal  
tETXCLK  
MII TxCLK  
tETXCLKW  
tETXCLKOH  
ETxD3-0  
ETxEN  
tETXCLKOV  
Figure 35. 10/100 Ethernet MAC Controller Timing: MII Transmit Signal  
Rev. PrE  
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ADSP-BF522/523/524/525/526/527  
Preliminary Technical Data  
tREFCLK  
RMII _REF_CLK  
tREFCLKW  
ERxD1-0  
ERxDV  
ERxER  
tREFCLKIS  
tREFCLKIH  
Figure 36. 10/100 Ethernet MAC Controller Timing: RMII Receive Signal  
tREFCLK  
RMII _REF_CLK  
tREFCLKOH  
ETxD1-0  
ETxEN  
tREFCLKOV  
Figure 37. 10/100 Ethernet MAC Controller Timing: RMII Transmit Signal  
MII CRS, COL  
tECRSH  
tECOLH  
tECRSL  
tECOLL  
Figure 38. 10/100 Ethernet MAC Controller Timing: Asynchronous Signal  
MDC (OUTPUT)  
MDIO (OUTPUT)  
tMDCOH  
tMDCOV  
MDIO (INPUT)  
tMDIOS tMDCIH  
Figure 39. 10/100 Ethernet MAC Controller Timing: MII Station Management  
Rev. PrE  
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Preliminary Technical Data  
ADSP-BF522/523/524/525/526/527  
JTAG Test And Emulation Port Timing  
Table 46 and Figure 40 describe JTAG port operations.  
Table 46. JTAG Port Timing  
V
DDEXT = 1.8 V VDDEXT = 2.5/3.3 V  
Parameter  
Min Max Min  
Max  
Unit  
Timing Parameters  
tTCK TCK Period  
20  
4
20  
4
ns  
tSTAP TDI, TMS Setup Before TCK High  
tHTAP TDI, TMS Hold After TCK High  
tSSYS System Inputs Setup Before TCK High1  
tHSYS System Inputs Hold After TCK High1  
tTRSTW TRST Pulse Width2 (measured in TCK cycles)  
Switching Characteristics  
ns  
4
4
ns  
4
4
ns  
5
5
ns  
4
4
TCK  
tDTDO TDO Delay from TCK Low  
tDSYS System Outputs Delay After TCK Low3  
10  
12  
10  
12  
ns  
ns  
1 System Inputs = DATA15–0, ARDY, SCL, SDA, PF15–0, PG15–0, PH15–0, TCK, TRST, RESET, NMI, BMODE3–0.  
2 50 MHz Maximum  
3 System Outputs = DATA15–0, ADDR19–1, ABE1–0, AOE, ARE, AWE, AMS3–0, SRAS, SCAS, SWE, SCKE, CLKOUT, SA10, SMS, SCL, SDA, PF15–0, PG15–0, PH15–0,  
TDO, EMU.  
tTCK  
TCK  
tSTAP  
tHTAP  
TMS  
TDI  
tDTDO  
TDO  
tSSYS  
tHSYS  
SYSTEM  
INPUTS  
tDSYS  
SYSTEM  
OUTPUTS  
Figure 40. JTAG Port Timing  
Rev. PrE  
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ADSP-BF522/523/524/525/526/527  
Preliminary Technical Data  
OUTPUT DRIVE CURRENTS  
150  
100  
50  
Figure 41 through Figure 52 show typical current-voltage char-  
acteristics for the output drivers of the ADSP-BF523/525/527  
and ADSP-BF522/524/526 processors. The curves represent the  
current drive capability of the output drivers as a function of  
output voltage. See Table 10 on Page 23 for information about  
which driver type corresponds to a particular ball.  
TBD  
0
–50  
150  
100  
50  
–100  
–150  
0
0
0
0.5  
1.0  
1.5  
2.0  
2.5  
2.5  
2.5  
3.0  
3.0  
3.0  
TBD  
SOURCE VOLTAGE (V)  
0
Figure 43. Drive Current B (Low VDDEXT/VDDMEM  
)
–50  
–100  
–150  
150  
100  
50  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
SOURCE VOLTAGE (V)  
Figure 41. Drive Current A (Low VDDEXT/VDDMEM  
)
TBD  
0
–50  
150  
100  
50  
–100  
–150  
0.5  
1.0  
1.5  
2.0  
TBD  
SOURCE VOLTAGE (V)  
0
–50  
Figure 44. Drive Current B (High VDDEXT/VDDMEM  
)
150  
100  
50  
–100  
–150  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
SOURCE VOLTAGE (V)  
Figure 42. Drive Current A (High VDDEXT/VDDMEM  
)
TBD  
0
–50  
–100  
–150  
0.5  
1.0  
1.5  
2.0  
SOURCE VOLTAGE (V)  
Figure 45. Drive Current C (Low VDDEXT/VDDMEM  
)
Rev. PrE  
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Preliminary Technical Data  
ADSP-BF522/523/524/525/526/527  
150  
100  
50  
150  
100  
50  
TBD  
TBD  
0
0
–50  
–50  
–100  
–150  
–100  
–150  
0
0
0
0
0
0
0.5  
1.0  
1.5  
2.0  
2.5  
2.5  
2.5  
3.0  
3.0  
3.0  
0.5  
1.0  
1.5  
2.0  
2.5  
2.5  
2.5  
3.0  
3.0  
3.0  
SOURCE VOLTAGE (V)  
SOURCE VOLTAGE (V)  
Figure 46. Drive Current C (High VDDEXT/VDDMEM  
)
Figure 49. Drive Current E (Low VDDEXT/VDDMEM)  
150  
100  
50  
150  
100  
50  
TBD  
TBD  
0
–50  
0
–50  
–100  
–150  
–100  
–150  
0.5  
1.0  
1.5  
2.0  
0.5  
1.0  
1.5  
2.0  
SOURCE VOLTAGE (V)  
SOURCE VOLTAGE (V)  
Figure 47. Drive Current D (Low VDDEXT/VDDMEM  
)
Figure 50. Drive Current E (High VDDEXT/VDDMEM)  
150  
100  
50  
150  
100  
50  
TBD  
TBD  
0
–50  
0
–50  
–100  
–150  
–100  
–150  
0.5  
1.0  
1.5  
2.0  
0.5  
1.0  
1.5  
2.0  
SOURCE VOLTAGE (V)  
SOURCE VOLTAGE (V)  
Figure 48. Drive Current D (High VDDEXT/VDDMEM  
)
Figure 51. Drive Current F (Low VDDEXT/VDDMEM)  
Rev. PrE  
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Preliminary Technical Data  
Output Enable Time Measurement  
150  
100  
50  
Output balls are considered to be enabled when they have made  
a transition from a high impedance state to the point when they  
start driving.  
The output enable time tENA is the interval from the point when a  
reference signal reaches a high or low voltage level to the point  
when the output starts driving as shown on the right side of  
Figure 55.  
TBD  
0
–50  
–100  
–150  
REFERENCE  
SIGNAL  
tDIS_MEASURED  
tENA_MEASURED  
tDIS  
VOH  
tENA  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
SOURCE VOLTAGE (V)  
VOH(MEASURED)  
VTRIP(HIGH)  
(MEASURED)  
VOH (MEASURED) ؊ ⌬V  
VOL (MEASURED) + V  
Figure 52. Drive Current F (High VDDEXT/VDDMEM  
)
VTRIP(LOW)  
VOL  
VOL(MEASURED)  
(MEASURED)  
POWER DISSIPATION  
tDECAY  
tTRIP  
Total power dissipation has two components: one due to inter-  
nal circuitry (PINT) and one due to the switching of external  
output drivers (PEXT).  
OUTPUT STOPS DRIVING  
OUTPUT STARTS DRIVING  
HIGH IMPEDANCE STATE  
See the ADSP-BF52x Blackfin Processor Hardware Reference  
Manual for definitions of the various operating modes and for  
instructions on how to minimize system power.  
Power dissipation specifications for the ADSP-  
BF522/523/524/525/526/527 processors are TBD.  
Figure 55. Output Enable/Disable  
The time tENA MEASURED is the interval, from when the reference sig-  
nal switches,_to when the output voltage reaches VTRIP(high) or  
V
TRIP(low). VTRIP(high) is 2.0 V and VTRIP(low) is 1.0 V for  
VDDEXT/VDDMEM (nominal) = 2.5 V/3.3 V. Time tTRIP is the interval  
from when the output starts driving to when the output reaches  
the VTRIP(high) or VTRIP(low) trip voltage.  
TEST CONDITIONS  
All timing parameters appearing in this data sheet were mea-  
sured under the conditions described in this section. Figure 53  
shows the measurement point for AC measurements (except  
output enable/disable). The measurement point VMEAS is VDDEXT/2  
or VDDMEM/2 for VDDEXT/VDDMEM (nominal) = 1.8 V/2.5 V/3.3 V.  
Time tENA is calculated as shown in the equation:  
tENA = tENA_MEASURED tTRIP  
If multiple balls (such as the data bus) are enabled, the measure-  
ment value is that of the first ball to start driving.  
Output Disable Time Measurement  
INPUT  
OR  
OUTPUT  
V
V
MEAS  
MEAS  
Output balls are considered to be disabled when they stop driv-  
ing, go into a high impedance state, and start to decay from their  
output high or low voltage. The output disable time tDIS is the  
Figure 53. Voltage Reference Levels for AC  
Measurements (Except Output Enable/Disable)  
difference between tDIS MEASURED and tDECAY as shown on the left side  
_
of Figure 55.  
tDIS = tDIS_MEASURED tDECAY  
50  
TO  
OUTPUT  
PIN  
The time for the voltage on the bus to decay by ΔV is dependent  
on the capacitive load CL and the load current IL. This decay time  
can be approximated by the equation:  
V
LOAD  
30pF  
tDECAY = (CLΔV) ⁄ IL  
Figure 54. Equivalent Device Loading for AC Measurements  
(Includes All Fixtures)  
The time tDECAY is calculated with test loads CL and IL, and with  
ΔV equal to 0.5 V for VDDEXT/VDDMEM (nominal) = 2.5 V/3.3 V.  
The time tDIS MEASURED is the interval from when the reference sig-  
_
nal switches, to when the output voltage decays ΔV from the  
measured output high or output low voltage.  
Rev. PrE  
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Preliminary Technical Data  
ADSP-BF522/523/524/525/526/527  
Example System Hold Time Calculation  
To determine the data output hold time in a particular system,  
first calculate tDECAY using the equation given above. Choose ΔV  
to be the difference between the processor’s output voltage and  
the input threshold for the device requiring the hold time. CL is  
the total bus capacitance (per data line), and IL is the total leak-  
age or three-state current (per data line). The hold time will be  
tDECAY plus the various output disable times as specified in the  
Timing Specifications on Page 33 (for example tDSDAT for an  
SDRAM write cycle as shown in SDRAM Interface Timing on  
Page 39).  
Capacitive Loading  
Output delays and holds are based on standard capacitive loads  
of an average of 6 pF on all balls (see Figure 56). VLOAD is equal  
to (VDDEXT/VDDMEM) /2. The graphs of Figure 57 through  
Figure 64 show how output rise time varies with capacitance.  
The delay and hold specifications given should be derated by a  
factor derived from these figures. The graphs in these figures  
may not be linear outside the ranges shown.  
Figure 57. Typical Rise and Fall Times (10%–90%) versus Load Capacitance  
for Driver A at VDDEXT/VDDMEM = Min  
TESTER PIN ELECTRONICS  
50:  
V
LOAD  
T1  
DUT  
OUTPUT  
45:  
70:  
ZO = 50:ꢀ(impedance)  
TD = 4.04 r 1.18 ns  
50:  
0.5pF  
4pF  
2pF  
400:  
NOTES:  
THE WORST CASE TRANSMISSION LINE DELAY IS SHOWN AND CAN BE USED  
FOR THE OUTPUT TIMING ANALYSIS TO REFELECT THE TRANSMISSION LINE  
EFFECT AND MUST BE CONSIDERED.THE TRANSMISSION LINE (TD), IS FOR  
LOAD ONLY AND DOES NOT AFFECT THE DATA SHEET TIMING SPECIFICATIONS.  
Figure 58. Typical Rise and Fall Times (10%–90%) versus Load Capacitance  
for Driver A at VDDEXT/VDDMEM = Max  
ANALOG DEVICES RECOMMENDS USING THE IBIS MODEL TIMING FOR A GIVEN  
SYSTEM REQUIREMENT. IF NECESSARY, A SYSTEM MAY INCORPORATE  
EXTERNAL DRIVERS TO COMPENSATE FOR ANY TIMING DIFFERENCES.  
Figure 56. Equivalent Device Loading for AC Measurements  
(Includes All Fixtures)  
Rev. PrE  
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Preliminary Technical Data  
Figure 59. Typical Rise and Fall Times (10%–90%) versus Load Capacitance  
for Driver B at VDDEXT/VDDMEM = Min  
Figure 62. Typical Rise and Fall Times (10%–90%) versus Load Capacitance  
for Driver C at VDDEXT/VDDMEM = Max  
Figure 60. Typical Rise and Fall Times (10%–90%) versus Load Capacitance  
for Driver B at VDDEXT/VDDMEM = Max  
Figure 63. Typical Rise and Fall Times (10%–90%) versus Load Capacitance  
for Driver D at VDDEXT/VDDMEM = Min  
Figure 61. Typical Rise and Fall Times (10%–90%) versus Load Capacitance  
for Driver C at VDDEXT/VDDMEM = Min  
Figure 64. Typical Rise and Fall Times (10%–90%) versus Load Capacitance  
for Driver D at VDDEXT/VDDMEM = Max  
Rev. PrE  
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Preliminary Technical Data  
ADSP-BF522/523/524/525/526/527  
ENVIRONMENTAL CONDITIONS  
To determine the junction temperature on the application  
printed circuit board use:  
TJ = TCASE + JT × PD)  
where:  
TJ = Junction temperature (؇C)  
T
CASE = Case temperature (؇C) measured by customer at top  
center of package.  
ΨJT = From Table 48  
PD = Power dissipation (see Power Dissipation on Page 60 for  
the method to calculate PD)  
Values of θJA are provided for package comparison and printed  
circuit board design considerations. θJA can be used for a first  
order approximation of TJ by the equation:  
TJ = TA + JA × PD)  
where:  
TA = Ambient temperature (؇C)  
Values of θJC are provided for package comparison and printed  
circuit board design considerations when an external heat sink  
is required.  
Values of θJB are provided for package comparison and printed  
circuit board design considerations.  
In Table 48, airflow measurements comply with JEDEC stan-  
dards JESD51-2 and JESD51-6, and the junction-to-board  
measurement complies with JESD51-8. The junction-to-case  
measurement complies with MIL-STD-883 (Method 1012.1).  
All measurements use a 2S2P JEDEC test board.  
Table 47. Thermal Characteristics (BC-208-1)  
Parameter Condition  
Typical Unit  
θJA  
0 linear m/s air flow  
23.20  
20.20  
19.20  
13.05  
6.92  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
θJMA  
θJMA  
θJB  
1 linear m/s air flow  
2 linear m/s air flow  
θJC  
Table 48. Thermal Characteristics (BC-289-2)  
Parameter Condition Typical Unit  
θJA  
0 linear m/s air flow  
34.5  
31.1  
29.8  
20.3  
8.8  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
θJMA  
θJMA  
θJB  
1 linear m/s air flow  
2 linear m/s air flow  
θJC  
Rev. PrE  
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ADSP-BF522/523/524/525/526/527  
Preliminary Technical Data  
289-BALL CSP_BGA BALL ASSIGNMENT  
Table 49 lists the CSP_BGA balls by signal mnemonic.  
Table 50 on Page 65 lists the CSP_BGA by ball number.  
Table 49. 289-Ball CSP_BGA Ball Assignment (Alphabetically by Signal)  
Signal  
Ball Signal  
No.  
Ball Signal Ball Signal Ball Signal  
No. No. No.  
P1 GND N9 VPPOTP AB11 PH12  
Ball Signal Ball Signal  
Ball  
No.  
T7  
U7  
U8  
No.  
No.  
ABE0/SDQM0 AB9 DATA9  
ABE1/SDQM1 AC9 DATA10  
M23 VDDEXT  
N22 VDDEXT  
N23 VDDEXT  
P22 VDDEXT  
N17 VDDMEM  
P17 VDDMEM  
R17 VDDMEM  
T17 VDDMEM  
U17 VDDMEM  
B5 VDDMEM  
H8 VDDMEM  
H9 VDDMEM  
H10 VDDMEM  
H11 VDDMEM  
H12 VDDMEM  
H13 VDDOTP  
H14 VDDRTC  
H15 VDDUSB  
H16 VDDUSB  
J8 NC  
P2 GND N10 PF0  
R2 GND N11 PF1  
N1 GND N12 PF2  
N2 GND N13 PF3  
M2 GND N14 PF4  
M1 GND N15 PF5  
A7 PH13  
B8 PH14  
A8 PH15  
B9 PPI_CLK/TMRCLK A6 VDDEXT  
B11 PPI_FS1/TMR0 B7 VDDINT  
B10 RESET  
B12 RTXI  
B13 RTXO  
B16 SA10  
A20 SCAS  
ADDR1  
ADDR2  
ADDR3  
ADDR4  
ADDR5  
ADDR6  
ADDR7  
ADDR8  
ADDR9  
ADDR10  
ADDR11  
ADDR12  
ADDR13  
ADDR14  
ADDR15  
ADDR16  
ADDR17  
ADDR18  
ADDR19  
AMS0  
AMS1  
AMS2  
AMS3  
AOE  
ARDY  
ARE  
AWE  
BMODE0  
BMODE1  
BMODE2  
BMODE3  
CLKBUF  
CLKIN  
CLKOUT  
DATA0  
DATA1  
DATA2  
DATA3  
DATA4  
DATA5  
DATA6  
DATA7  
DATA8  
AB8 DATA11  
AC8 DATA12  
AB7 DATA13  
AC7 DATA14  
AC6 DATA15  
AB6 EMU  
AB4 EXT_WAKE0  
AB5 GND  
AC5 GND  
AC4 GND  
AB3 GND1  
AC3 GND  
AB2 GND1  
AC2 GND  
AA2 GND1  
W2 GND  
Y2 GND  
AA1 GND  
AB1 GND  
AC17 GND  
AB16 GND  
AC16 GND  
AB15 GND  
AC15 GND  
AC14 GND  
AB17 GND  
AB14 GND  
G2 GND  
F2 GND  
E1 GND  
E2 GND  
AB19 GND  
R23 GND  
AB18 GND  
Y1 GND  
V2 GND  
W1 GND  
U2 GND  
V1 GND  
U1 GND  
T2 GND  
T1 GND  
R1 GND  
U9  
U10  
U11  
U12  
U13  
U14  
U15  
U16  
AC12  
W23  
W22  
Y23  
G23  
V22 VDDINT  
U23 VDDINT  
V23 VDDINT  
AC10 VDDINT  
AC11 VDDINT  
AB13 VDDINT  
B22 VDDINT  
C22 VDDINT  
AC13 VDDINT  
AB12 VDDINT  
AC20 VDDINT  
AB10 VDDINT  
L1 VDDINT  
J2  
GND P9 PF6  
AC19 GND P10 PF7  
A1 GND P11 PF8  
A23 GND P12 PF9  
B6 GND P13 PF10 B15 SCKE  
G16 GND P14 PF11 B17 SCL  
G17 GND P15 PF12 B18 SDA  
H17 GND R9 PF13 B19 SMS  
H22 GND R10 PF14 A9 SRAS  
J22 GND R11 PF15 A10 SS/PG  
J16 VROUT/EXT_WAKE1 AC18  
K8 VRSEL/VDDEXT  
K16 XTAL  
L8  
J9  
GND R12 PG0  
H2 SWE  
AB22  
P23  
J10 GND R13 PG1  
J11 GND R14 PG2  
J12 GND R15 PG3  
J13 GND T22 PG4  
J14 GND AC1 PG5  
J15 GND AC23 PG6  
G1 TCK  
H1 TDI  
F1 TDO  
D1 TMS  
J1  
VDDINT  
K1 VDDINT  
L2 VDDINT  
K2 VDDINT  
AB21 VDDINT  
AA22 VDDINT  
Y22 VDDINT  
AC21 VDDINT  
AB20 VDDINT  
AC22 VDDINT  
AB23 VDDINT  
AA23 VDDINT  
G7 VDDINT  
G8 VDDINT  
G9 VDDINT  
G10 VDDINT  
G11 VDDINT  
G12 VDDINT  
G13 VDDINT  
L16  
M8  
M16  
N8  
N16  
P8  
P16  
R8  
R16  
T8  
T9  
T10  
T11  
T12  
T13  
T14  
T15  
T16  
D2 TRST  
C2 USB_DM  
B1 USB_DP  
C1 USB_ID  
B2 USB_RSET  
K9 NC  
K10 NC  
K11 NC  
K12 NC  
K13 NC  
K14 NC  
K15 NC  
L9 NC  
L10 NC  
L11 NC  
L12 NC  
L13 NC  
L14 NC  
L15 NC  
M9 NC  
M10 NC  
M11 NC  
M12 NC  
M13 NC  
M14 NC  
A15 PG7  
A16 PG8  
A17 PG9  
A18 PG10 B4 USB_VBUS  
A19 PG11 B3 USB_VREF  
A21 PG12 A2 USB_XI  
A22 PG13 A3 USB_XO  
B20 PG14 A4 VDDEXT  
B21 PG15 A5 VDDEXT  
B23 PH0  
C23 PH1  
D22 PH2  
D23 PH3  
E22 PH4  
E23 PH5  
F22 PH6  
F23 PH7  
G22 PH8  
H23 PH9  
A11 VDDEXT  
A12 VDDEXT  
A13 VDDEXT  
B14 VDDEXT  
A14 VDDEXT  
K23 VDDEXT  
K22 VDDEXT  
L23 VDDEXT  
L22 VDDEXT  
T23 VDDEXT  
G14 VDDMEM J7  
G15 VDDMEM K7  
H7 VDDMEM L7  
J17 VDDMEM M7  
K17 VDDMEM N7  
L17 VDDMEM P7  
M17 VDDMEM R7  
J23 PH10 M22 VDDEXT  
M15 NMI U22 PH11 R22 VDDEXT  
NOTE: In this table, BOLD TYPE indicates the sole signal/function for that ball on ADSP-BF522/524/526 processors.  
1 For ADSP-BF52xC compatibility, connect this ball to VDDEXT  
.
Rev. PrE  
|
Page 64 of 72  
|
August 2008  
Preliminary Technical Data  
ADSP-BF522/523/524/525/526/527  
Table 50. 289-Ball CSP_BGA Ball Assignment (Numerically by Ball Number)  
Ball Signal  
No.  
Ball Signal  
No.  
Ball Signal  
No.  
Ball Signal Ball Signal Ball Signal  
Ball Signal  
No.  
No.  
No.  
No.  
A1 GND  
A2 PG12  
A3 PG13  
A4 PG14  
A5 PG15  
B23 NC  
C1 PG8  
C2 PG6  
C22 SDA  
C23 NC  
H22 GND  
H23 NC  
J1 TDI  
L22 PH8  
L23 PH7  
P22 PH15  
P23 XTAL  
U22 NMI  
U23 RTXI  
AC5 ADDR9  
AC6 ADDR5  
AC7 ADDR4  
AC8 ADDR2  
AC9 ABE1/SDQM1  
AC10 SA10  
AC11 SCAS  
AC12 VDDOTP  
AC13 SMS  
AC14 ARDY  
AC15 AOE  
AC16 AMS2  
AC17 AMS0  
AC18 VROUT/EXT_WAKE1  
AC19 EXT_WAKE0  
AC20 SS/PG  
AC21 USB_RSET  
AC22 USB_VREF  
AC23 GND  
M1 DATA15 R1 DATA8 V1 DATA4  
M2 DATA14 R2 DATA11 V2 DATA1  
M7 VDDMEM R7 VDDMEM V22 RESET  
J2 EMU  
J7 VDDMEM  
J8 VDDINT  
J9 GND  
J10 GND  
J11 GND  
J12 GND  
J13 GND  
J14 GND  
J15 GND  
J16 VDDINT  
J17 VDDEXT  
J22 GND1  
J23 NC  
K1 TDO  
K2 TRST  
K7 VDDMEM  
K8 VDDINT  
K9 GND  
K10 GND  
K11 GND  
K12 GND  
K13 GND  
K14 GND  
K15 GND  
K16 VDDINT  
K17 VDDEXT  
K22 PH6  
K23 PH5  
L1 TCK  
A6 PPI_CLK/TMRCLK D1 PG4  
M8 VDDINT  
M9 GND  
M10 GND  
M11 GND  
M12 GND  
M13 GND  
M14 GND  
M15 GND  
M16 VDDINT  
M17 VDDEXT  
M22 PH10  
M23 PH12  
R8 VDDINT  
R9 GND  
R10 GND  
R11 GND  
R12 GND  
R13 GND  
R14 GND  
R15 GND  
R16 VDDINT  
R17 VDDEXT  
R22 PH11  
R23 CLKIN  
V23 RTXO  
A7 PF0  
A8 PF2  
A9 PF14  
A10 PF15  
A11 PH0  
A12 PH1  
A13 PH2  
A14 PH4  
A15 NC  
A16 NC  
A17 NC  
A18 NC  
A19 NC  
A20 PF9  
A21 NC  
A22 NC  
A23 GND  
B1 PG7  
B2 PG9  
B3 PG11  
B4 PG10  
B5 VDDINT  
B6 GND  
D2 PG5  
D22 NC  
D23 NC  
E1 BMODE2  
E2 BMODE3  
E22 NC  
E23 NC  
F1 PG3  
W1 DATA2  
W2 ADDR16  
W22 VDDUSB  
W23 VDDRTC  
Y1 DATA0  
Y2 ADDR17  
Y22 USB_ID  
Y23 VDDUSB  
AA1 ADDR18  
AA2 ADDR15  
AA22 USB_DP  
F2 BMODE1  
F22 NC  
F23 NC  
G1 PG1  
N1 DATA12 T1 DATA7 AA23 USB_XO  
N2 DATA13 T2 DATA6 AB1 ADDR19  
N7 VDDMEM T7 VDDMEM AB2 ADDR13  
G2 BMODE0  
G7 VDDEXT  
G8 VDDEXT  
G9 VDDEXT  
G10 VDDEXT  
G11 VDDEXT  
G12 VDDEXT  
G13 VDDEXT  
G14 VDDEXT  
G15 VDDEXT  
G16 GND1  
N8 VDDINT  
N9 GND  
N10 GND  
N11 GND  
N12 GND  
N13 GND  
N14 GND  
N15 GND  
N16 VDDINT  
N17 VDDEXT  
N22 PH13  
N23 PH14  
T8 VDDINT  
T9 VDDINT  
T10 VDDINT  
T11 VDDINT  
T12 VDDINT  
T13 VDDINT  
T14 VDDINT  
T15 VDDINT  
T16 VDDINT  
T17 VDDEXT  
T22 GND  
T23 PH9  
AB3 ADDR11  
AB4 ADDR7  
AB5 ADDR8  
AB6 ADDR6  
AB7 ADDR3  
AB8 ADDR1  
AB9 ABE0/SDQM0  
AB10 SWE  
AB11 VPPOTP  
AB12 SRAS  
AB13 SCKE  
B7 PPI_FS1/TMR0 G17 GND  
B8 PF1  
B9 PF3  
B10 PF5  
B11 PF4  
B12 PF6  
B13 PF7  
B14 PH3  
B15 PF10  
B16 PF8  
B17 PF11  
B18 PF12  
B19 PF13  
B20 NC  
G22 NC  
G23 NC  
AB14 AWE  
H1 PG2  
H2 PG0  
H7 VDDEXT  
H8 VDDINT  
H9 VDDINT  
H10 VDDINT  
H11 VDDINT  
H12 VDDINT  
H13 VDDINT  
H14 VDDINT  
H15 VDDINT  
H16 VDDINT  
H17 GND1  
P1 DATA9 U1 DATA5 AB15 AMS3  
P2 DATA10 U2 DATA3 AB16 AMS1  
P7 VDDMEM U7 VDDMEM AB17 ARE  
L2 TMS  
L7 VDDMEM  
L8 VDDINT  
L9 GND  
L10 GND  
L11 GND  
L12 GND  
L13 GND  
L14 GND  
L15 GND  
L16 VDDINT  
L17 VDDEXT  
P8 VDDINT  
P9 GND  
P10 GND  
P11 GND  
P12 GND  
P13 GND  
P14 GND  
P15 GND  
P16 VDDINT  
P17 VDDEXT  
U8 VDDMEM AB18 CLKOUT  
U9 VDDMEM AB19 CLKBUF  
U10 VDDMEM AB20 USB_VBUS  
U11 VDDMEM AB21 USB_DM  
U12 VDDMEM AB22 VRSEL/VDDEXT  
U13 VDDMEM AB23 USB_XI  
U14 VDDMEM AC1 GND  
U15 VDDMEM AC2 ADDR14  
U16 VDDMEM AC3 ADDR12  
U17 VDDEXT  
B21 NC  
B22 SCL  
AC4 ADDR10  
NOTE: In this table, BOLD TYPE indicates the sole signal/function for that ball on ADSP-BF522/524/526 processors.  
1 For ADSP-BF52xC compatibility, connect this ball to VDDEXT  
.
Rev. PrE  
|
Page 65 of 72  
|
August 2008  
ADSP-BF522/523/524/525/526/527  
Preliminary Technical Data  
Figure 66 shows the top view of the BC-289-2 CSP_BGA ball  
configuration. Figure 65 shows the bottom view of the BC-289-  
2 CSP_BGA ball configuration.  
A1 BALL  
PAD CORNER  
A
B
C
D
E
F
G
H
J
K
L
TOP VIEW  
M
N
P
KEY:  
R
T
V
V
GND  
I/O  
NC  
V
DDINT  
U
V
W
Y
DDEXT  
DDMEM  
AA  
AB  
AC  
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23  
Figure 65. 289-Ball CSP_BGA Ball Configuration (Top View)  
A1 BALL  
PAD CORNER  
A
B
C
D
E
BOTTOM VIEW  
F
G
H
KEY:  
J
K
V
V
GND  
I/O  
NC  
V
L
DDINT  
M
N
DDEXT  
DDMEM  
P
R
T
U
V
W
Y
AA  
AB  
AC  
23 22 21 20 19 18 17 16 15 14 13 12 11 10  
9
8
7
6
5
4
3
2
1
Figure 66. 289-Ball CSP_BGA Ball Configuration (Bottom View)  
Rev. PrE  
|
Page 66 of 72  
|
August 2008  
Preliminary Technical Data  
ADSP-BF522/523/524/525/526/527  
208-BALL CSP_BGA BALL ASSIGNMENT  
Table 51 lists the CSP_BGA balls by signal mnemonic.  
Table 52 on Page 68 lists the CSP_BGA by ball number.  
Table 51. 208-Ball CSP_BGA Ball Assignment (Alphabetically by Signal)  
Signal  
Ball Signal  
No.  
Ball Signal  
No.  
Ball Signal  
No.  
Ball Signal  
No.  
Ball Signal  
No.  
Ball  
No.  
ABE0/SDQM0 V19 DATA2  
ABE1/SDQM1 V20 DATA3  
Y7  
W7 GND  
Y6 GND  
W6 GND  
Y5 GND  
W5 GND  
Y4 GND  
W4 GND  
Y3 GND  
W3 GND  
Y2 GND  
GND  
L12 PG6  
L13 PG7  
M9 PG8  
M10 PG9  
M11 PG10  
M12 PG11  
M13 PG12  
N9 PG13  
N10 PG14  
N11 PG15  
N12 PH0  
N13 PH1  
M2 SS/PG  
G19 VDDINT  
T20 VDDMEM  
P14  
L8  
L1  
L2  
K1  
K2  
J1  
SWE  
TCK  
ADDR01  
ADDR02  
ADDR03  
ADDR04  
ADDR05  
ADDR06  
ADDR07  
ADDR08  
ADDR09  
ADDR10  
ADDR11  
ADDR12  
ADDR13  
ADDR14  
ADDR15  
ADDR16  
ADDR17  
ADDR18  
ADDR19  
AMS0  
W20 DATA4  
W19 DATA5  
Y19 DATA6  
W18 DATA7  
Y18 DATA8  
W17 DATA9  
Y17 DATA10  
W16 DATA11  
Y16 DATA12  
W15 DATA13  
Y15 DATA14  
W14 DATA15  
Y14 EMU  
V2  
R1  
T1  
VDDMEM  
VDDMEM  
VDDMEM  
M7  
M8  
N7  
TDI  
TDO  
TMS  
TRST  
U2 VDDMEM  
U1 VDDMEM  
F20 VDDMEM  
E20 VDDMEM  
C20 VDDMEM  
N8  
J2  
P7  
H1 USB_DM  
H2 USB_DP  
G1 USB_ID  
P8  
P9  
P10  
P11  
R20  
A16  
D19  
G20  
H20  
F19  
A10  
A7  
B7  
A8  
B8  
A9  
B9  
USB_RSET D20 VDDMEM  
USB_VBUS E19 VDDOTP  
USB_VREF H19 VDDRTC  
W2 GND  
W1 GND  
Y1  
PH2  
V1  
T2  
GND  
NMI  
Y20 PH3  
B19 PH4  
USB_XI  
USB_XO  
VDDEXT  
A19 VDDUSB  
A18 VDDUSB  
W13 EXT_WAKE1 J20 VPPOTP L19 PH5  
G7 VROUT/EXT_WAKE0  
Y13 GND  
W12 GND  
Y12 GND  
W11 GND  
Y11 GND  
J19 GND  
K19 GND  
M19 GND  
L20 GND  
N20 GND  
P19 GND  
M20 GND  
N19 GND  
Y10 GND  
W10 GND  
A1  
PF0  
F1  
E1  
E2  
PH6  
PH7  
PH8  
B10 VDDEXT  
B11 VDDEXT  
A12 VDDEXT  
B12 VDDEXT  
A13 VDDEXT  
B13 VDDEXT  
B14 VDDEXT  
B15 VDDEXT  
B16 VDDEXT  
B17 VDDEXT  
G8 VRSEL/VDDEXT  
A17 PF1  
A20 PF2  
B20 PF3  
H9 PF4  
H10 PF5  
H11 PF6  
H12 PF7  
H13 PF8  
G9 XTAL  
G10  
G11  
H7  
D1 PH9  
D2 PH10  
C1  
C2  
B1  
B2  
PH11  
PH12  
PH13  
PH14  
H8  
AMS1  
J7  
AMS2  
J8  
AMS3  
K7  
AOE  
J9  
PF9  
A2 PH15  
B3  
A3 PPI_FS1/TMR0  
B5 RESET  
A5 RTXI  
B6 RTXO  
A6 SA10  
K8  
ARDY  
J10 PF10  
J11 PF11  
J12 PF12  
J13 PF13  
PPI_CLK/TMRCLK G2 VDDEXT  
F2 VDDINT  
L7  
ARE  
G12  
G13  
G14  
H14  
J14  
AWE  
B18 VDDINT  
A14 VDDINT  
A15 VDDINT  
U19 VDDINT  
U20 VDDINT  
P20 VDDINT  
BMODE0  
BMODE1  
BMODE2  
BMODE3  
CLKBUF  
CLKIN  
K9  
PF14  
Y9  
GND  
K10 PF15  
K11 PG0  
K12 PG1  
K13 PG2  
W9 GND  
C19 GND  
A11 GND  
K20 GND  
R2  
P1  
P2  
SCAS  
SCKE  
SCL  
K14  
L14  
M14  
N14  
P12  
P13  
A4  
B4  
VDDINT  
VDDINT  
CLKOUT  
DATA0  
L9  
PG3  
N1 SDA  
N2 SMS  
M1 SRAS  
Y8  
GND  
L10 PG4  
L11 PG5  
R19 VDDINT  
T19 VDDINT  
DATA1  
W8 GND  
NOTE: In this table, BOLD TYPE indicates the sole signal/function for that ball on ADSP-BF522/524/526 processors.  
Rev. PrE  
|
Page 67 of 72  
|
August 2008  
ADSP-BF522/523/524/525/526/527  
Preliminary Technical Data  
Table 52. 208-Ball CSP_BGA Ball Assignment (Numerically by Ball Number)  
Ball Signal  
No.  
Ball Signal  
No.  
Ball Signal  
No.  
Ball Signal  
No.  
Ball Signal  
No.  
Ball Signal  
No.  
A1  
A2  
A3  
A4  
A5  
A6  
A7  
A8  
A9  
GND  
PF9  
B19 NMI  
B20 GND  
H13 GND  
L19 VPPOTP  
L20 AMS3  
M1 PG5  
R1  
R2  
TDI  
Y3  
Y4  
Y5  
Y6  
Y7  
Y8  
Y9  
DATA10  
DATA8  
DATA6  
DATA4  
DATA2  
DATA0  
BMODE2  
H14 VDDINT  
PG0  
PF11  
SCL  
C1  
C2  
PF5  
PF6  
H19 USB_VREF  
H20 VROUT/EXT_WAKE0  
R19 SMS  
M2 PG6  
R20 VDDOTP  
PF13  
PF15  
PH0  
PH2  
PH4  
C19 CLKBUF  
C20 USB_ID  
J1  
J2  
J7  
J8  
J9  
PG11  
PG12  
VDDEXT  
VDDEXT  
GND  
M7 VDDMEM  
M8 VDDMEM  
M9 GND  
M10 GND  
M11 GND  
M12 GND  
M13 GND  
M14 VDDINT  
M19 AMS2  
M20 ARE  
T1  
T2  
TDO  
EMU  
D1  
D2  
PF3  
PF4  
T19 SRAS  
T20 SWE  
Y10 BMODE0  
Y11 ADDR19  
Y12 ADDR17  
Y13 ADDR15  
Y14 ADDR13  
Y15 ADDR11  
Y16 ADDR9  
Y17 ADDR7  
Y18 ADDR5  
Y19 ADDR3  
Y20 GND  
D19 VDDUSB  
U1  
U2  
TRST  
TMS  
A10 XTAL  
A11 CLKIN  
A12 PH8  
A13 PH10  
A14 RTXI  
A15 RTXO  
A16 VDDRTC  
A17 GND  
D20 USB_RSET  
J10 GND  
E1  
E2  
PF1  
PF2  
J11 GND  
U19 SA10  
U20 SCAS  
J12 GND  
E19 USB_VBUS  
E20 USB_DP  
J13 GND  
V1  
V2  
DATA15  
TCK  
J14 VDDINT  
J19 AMS0  
J20 EXT_WAKE1  
F1  
F2  
PF0  
N1  
N2  
N7  
N8  
N9  
PG3  
V19 ABE0/SDQM0  
V20 ABE1/SDQM1  
W1 DATA14  
W2 DATA13  
W3 DATA11  
W4 DATA9  
PPI_FS1/TMR0  
PG4  
F19 VRSEL/VDDEXT  
K1  
K2  
K7  
PG9  
VDDMEM  
VDDMEM  
GND  
A18 USB_XO F20 USB_DM  
PG10  
VDDEXT  
VDDEXT  
GND  
A19 USB_XI  
A20 GND  
G1  
G2  
G7  
G8  
G9  
PG15  
PPI_CLK/TMRCLK K8  
N10 GND  
N11 GND  
N12 GND  
N13 GND  
N14 VDDINT  
N19 AWE  
N20 AOE  
B1  
B2  
B3  
B4  
B5  
B6  
B7  
B8  
B9  
PF7  
VDDEXT  
VDDEXT  
VDDEXT  
K9  
W5 DATA7  
PF8  
K10 GND  
K11 GND  
K12 GND  
K13 GND  
K14 VDDINT  
K19 AMS1  
K20 CLKOUT  
W6 DATA5  
PF10  
SDA  
PF12  
PF14  
PH1  
PH3  
PH5  
W7 DATA3  
G10 VDDEXT  
G11 VDDEXT  
G12 VDDINT  
G13 VDDINT  
G14 VDDINT  
G19 SS/PG  
G20 VDDUSB  
W8 DATA1  
W9 BMODE3  
W10 BMODE1  
W11 ADDR18  
W12 ADDR16  
W13 ADDR14  
W14 ADDR12  
W15 ADDR10  
W16 ADDR8  
W17 ADDR6  
W18 ADDR4  
W19 ADDR2  
W20 ADDR1  
P1  
P2  
P7  
P8  
P9  
PG1  
PG2  
L1  
L2  
L7  
L8  
L9  
PG7  
VDDMEM  
VDDMEM  
VDDMEM  
B10 PH6  
B11 PH7  
B12 PH9  
B13 PH11  
B14 PH12  
B15 PH13  
B16 PH14  
B17 PH15  
B18 RESET  
PG8  
H1  
H2  
H7  
H8  
H9  
PG13  
PG14  
VDDEXT  
VDDEXT  
GND  
VDDEXT  
VDDMEM  
GND  
P10 VDDMEM  
P11 VDDMEM  
P12 VDDINT  
P13 VDDINT  
P14 VDDINT  
P19 ARDY  
P20 SCKE  
L10 GND  
L11 GND  
L12 GND  
L13 GND  
L14 VDDINT  
H10 GND  
H11 GND  
H12 GND  
Y1  
Y2  
GND  
DATA12  
NOTE: In this table, BOLD TYPE indicates the sole signal/function for that ball on ADSP-BF522/524/526 processors.  
Rev. PrE  
|
Page 68 of 72  
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August 2008  
Preliminary Technical Data  
ADSP-BF522/523/524/525/526/527  
Figure 67 shows the top view of the CSP_BGA ball configura-  
tion. Figure 68 shows the bottom view of the CSP_BGA  
ball configuration.  
A1 BALL  
PAD CORNER  
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
KEY:  
VDDINT  
VDDEXT  
GND  
I/O  
U
V
W
Y
VDDMEM  
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17 18 19 20  
TOP VIEW  
Figure 67. 208-Ball CSP_BGA Ball Configuration (Top View)  
A1 BALL  
PAD CORNER  
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
KEY:  
VDDINT  
VDDEXT  
GND  
I/O  
U
V
W
Y
VDDMEM  
20 19 18 17 16 15 14 13 12 11 10  
9
8
7
6
5
4
3
2
1
BOTTOM VIEW  
Figure 68. 208-Ball CSP_BGA Ball Configuration (Bottom View)  
Rev. PrE  
|
Page 69 of 72  
|
August 2008  
ADSP-BF522/523/524/525/526/527  
Preliminary Technical Data  
OUTLINE DIMENSIONS  
Dimensions in Figure 69, 289-Ball CSP_BGA (BC-289-2) are  
shown in millimeters.  
0.5 BSC  
BALL  
PITCH  
12.00 BSC SQ  
11.00 BSC SQ  
A1 BALL  
PAD CORNER  
CL  
A1 BALL  
PAD CORNER  
A
B
C
D
E
F
G
H
J
K
L
M
N
CL  
P
R
T
U
V
W
Y
AA  
AB  
AC  
23 22 21 20 19 18 17 16 15 14 13 12 11 10  
9 8 7 6 5 4 3 2 1  
TOP VIEW  
BOTTOM VIEW  
1.40  
1.26  
1.11  
0.20 MIN  
DETAIL A  
SIDE VIEW  
NOTES  
0.08 MAX  
COPLANARITY  
1. DIMENSIONS ARE IN MILLIMETERS.  
2. COMPLIES WITH JEDEC REGISTERED OUTLINE  
MO-195, VARIATION AJ AND EXCEPTION TO PACKAGE HEIGHT  
AND BALL HEIGHT.  
SEATING PLANE  
0.35  
DETAIL A  
3. MINIMUM BALL HEIGHT 0.20  
BALL DIAMETER  
0.30  
0.25  
Figure 69. 289-Ball CSP_BGA (BC-289-2)  
Rev. PrE  
|
Page 70 of 72  
|
August 2008  
Preliminary Technical Data  
ADSP-BF522/523/524/525/526/527  
17.10  
17.00 SQ  
16.90  
A1 CORNER  
INDEX AREA  
20 18 16 14 12 10  
19 17 15 13 11  
8
6
4
2
9
7
5
3
1
A
B
C
D
E
F
A1 BALL  
CORNER  
G
H
J
15.20  
BSC SQ  
K
L
M
N
P
R
T
0.80  
BSC  
U
V
W
Y
TOP VIEW  
DETAIL A  
BOTTOM VIEW  
*
1.36  
1.26  
1.16  
1.75  
1.61  
1.46  
DETAIL A  
0.35 NOM  
0.30 MIN  
*
0.50  
0.45  
0.40  
COPLANARITY  
0.12  
SEATING  
PLANE  
BALL  
DIAMETER  
*
COMPLIANT TO JEDEC STANDARDS MO-205-AM WITH  
EXCEPTION TO PACKAGE HEIGHT AND BALL DIAMETER.  
Figure 70. 208-Ball CSP_BGA (BC-208-2)  
SURFACE MOUNT DESIGN  
Table 53 is provided as an aide to PCB design. For industry-  
standard design recommendations, refer to IPC-7351, Generic  
Requirements for Surface Mount Design and Land Pattern  
Standard.  
Table 53. Surface Mount Design Supplement  
Package  
Ball Attach Type  
Solder Mask Opening  
Ball Pad Size  
289-Ball CSP_BGA  
208-Ball CSP_BGA  
Solder Mask Defined  
Solder Mask Defined  
0.26 mm diameter  
0.40 mm diameter  
0.35 mm diameter  
0.50 mm diameter  
Rev. PrE  
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Page 71 of 72  
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August 2008  
Preliminary Technical Data  
ADSP-BF522/523/524/525/526/527  
ORDERING GUIDE  
Table 54. ADSP-BF522/524/526 Processors  
Temperature  
Package Instruction Operating Voltage  
Option Rate (Max) (Nom)  
Model  
Range1  
Package Description  
ADSP-BF526KBCZ-4X 0ºC to +70ºC  
289-Ball Chip Scale Package Ball  
Grid Array (CSP_BGA)  
BC-289-2 400 MHz  
BC-208-2 400 MHz  
BC-208-2 400 MHz  
tbd V internal, 1.8 V, 2.5 V, or 3.3 V I/O  
ADSP-BF526BBCZ-4AX –40ºC to +85ºC 208-Ball Chip Scale Package Ball  
Grid Array (CSP_BGA)  
ADSP-BF526BBCZ-3AX –40ºC to +85ºC 208-Ball Chip Scale Package Ball  
Grid Array (CSP_BGA)  
tbd V internal, 1.8 V, 2.5 V, or 3.3 V I/O  
tbd V internal, 1.8 V, 2.5 V, or 3.3 V I/O  
1 Referenced temperature is ambient temperature.  
Table 55. ADSP-BF523/525/527 Processors  
Temperature  
Package Instruction Operating Voltage  
Option Rate (Max) (Nom)  
Model  
Range1  
Package Description  
289-Ball Chip Scale Package Ball  
Grid Array (CSP_BGA)  
208-Ball Chip Scale Package Ball  
Grid Array (CSP_BGA)  
ADSP-BF527KBCZ-6X 0ºC to +70ºC  
BC-289-2 600 MHz  
BC-208-2 600 MHz  
BC-208-2 533 MHz  
1.2 V internal2, 1.8 V, 2.5 V, or 3.3 V I/O  
ADSP-BF527KBCZ-6AX 0ºC to +70ºC  
1.2 V internal2, 1.8 V, 2.5 V, or 3.3 V I/O  
1.15 V internal2, 1.8 V, 2.5 V, or 3.3 V I/O  
ADSP-BF527BBCZ-5AX –40ºC to +85ºC 208-Ball Chip Scale Package Ball  
Grid Array (CSP_BGA)  
1 Referenced temperature is ambient temperature.  
2
This is the voltage required to run at the maximum instruction rate. Lesser frequencies may require lower operating voltages. Please see Table 12 and Table 15 for details.  
©2008 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
PR06675-0-9/08(PrE)  
Rev. PrE  
|
Page 72 of 72  
|
August 2008  

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