ADSP-BF533SBBCZ500 [ADI]

Blackfin Embedded Processor; Blackfin嵌入式处理器
ADSP-BF533SBBCZ500
型号: ADSP-BF533SBBCZ500
厂家: ADI    ADI
描述:

Blackfin Embedded Processor
Blackfin嵌入式处理器

外围集成电路 时钟
文件: 总60页 (文件大小:2727K)
中文:  中文翻译
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Blackfin®  
Embedded Processor  
a
ADSP-BF533  
External memory controller with glueless support for  
SDRAM, SRAM, FLASH, and ROM  
Flexible memory booting options from SPI® and  
external memory  
FEATURES  
Up to 600 MHz high performance Blackfin processor  
Two 16-bit MACs, two 40-bit ALUs, four 8-bit video ALUs,  
40-bit shifter  
PERIPHERALS  
RISC-like register and instruction model for ease of pro-  
gramming and compiler-friendly support  
Parallel peripheral interface PPI/GPIO, supporting  
ITU-R 656 video data formats  
Two dual-channel, full duplex synchronous serial ports, sup-  
porting eight stereo I2S channels  
12-channel DMA controller  
Advanced debug, trace, and performance monitoring  
0.8 V to 1.26 V core VDD with on-chip voltage regulation  
1.8 V, 2.5 V, and 3.3 V compliant I/O  
160-ball mini-BGA, 169-ball lead free PBGA packages  
SPI-compatible port  
MEMORY  
Three timer/counters with PWM support  
UART with support for IrDA®  
Event handler  
Real-time clock  
Watchdog timer  
Debug/JTAG interface  
On-chip PLL capable of 0.5
؋
 to 64
؋
 frequency multiplication  
Core timer  
Up to 148K bytes of on-chip memory:  
16K bytes of instruction SRAM/Cache  
64K bytes of instruction SRAM  
32K bytes of data SRAM/Cache  
32K bytes of data SRAM  
4K bytes of scratchpad SRAM  
Two dual-channel memory DMA controllers  
Memory management unit providing memory protection  
EVENT  
CONTROLLER/  
CORE TIMER  
JTAG TEST AND  
EMULATION  
WATCHDOG TIMER  
REAL-TIME CLOCK  
VOLTAGE  
REGULATOR  
B
UART PORT  
IrDA  
L1  
L1  
DATA  
MMU  
INSTRUCTION  
MEMORY  
MEMORY  
TIMER0, TIMER1,  
TIMER2  
CORE/SYSTEM BUS INTERFACE  
PPI / GPIO  
DMA  
CONTROLLER  
SERIAL PORTS (2)  
SPI PORT  
BOOT ROM  
EXTERNAL PORT  
FLASH, SDRAM  
CONTROL  
Figure 1. Functional Block Diagram  
Blackfin and the Blackfin logo are registered trademarks of Analog Devices, Inc.  
Rev. D  
Information furnished by Analog Devices is believed to be accurate and reliable.  
However, no responsibility is assumed by Analog Devices for its use, nor for any  
infringements of patents or other rights of third parties that may result from its use.  
Specifications subject to change without notice. No license is granted by implication  
or otherwise under any patent or patent rights of Analog Devices. Trademarks and  
registered trademarks are the property of their respective owners.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 U.S.A.  
Tel: 781.329.4700  
Fax: 781.461.3113  
www.analog.com  
© 2006 Analog Devices, Inc. All rights reserved.  
ADSP-BF533  
TABLE OF CONTENTS  
General Description ................................................. 4  
Portable Low Power Architecture ............................. 4  
System Integration ................................................ 4  
ADSP-BF533 Processor Peripherals ........................... 4  
Blackfin Processor Core .......................................... 4  
Memory Architecture ............................................ 5  
DMA Controllers .................................................. 8  
Real-Time Clock ................................................... 9  
Watchdog Timer .................................................. 9  
Timers ............................................................... 9  
Serial Ports (SPORTs) .......................................... 10  
Serial Peripheral Interface (SPI) Port ....................... 10  
UART Port ........................................................ 10  
Programmable Flags (PFx) .................................... 11  
Parallel Peripheral Interface ................................... 11  
Dynamic Power Management ................................ 11  
Voltage Regulation .............................................. 13  
Clock Signals ..................................................... 13  
Booting Modes ................................................... 14  
Instruction Set Description ................................... 14  
Development Tools ............................................. 15  
Designing an Emulator-Compatible Processor Board .. 16  
Related Documents ............................................. 16  
Pin Descriptions .................................................... 17  
Specifications ........................................................ 20  
Operating Conditions .......................................... 20  
Electrical Characteristics ....................................... 21  
Absolute Maximum Ratings .................................. 22  
Package Information ........................................... 22  
ESD Sensitivity ................................................... 22  
Timing Specifications .......................................... 23  
Clock and Reset Timing .................................... 24  
Asynchronous Memory Read Cycle Timing ........... 25  
Asynchronous Memory Write Cycle Timing .......... 26  
SDRAM Interface Timing .................................. 27  
External Port Bus Request and Grant Cycle Timing .. 28  
Parallel Peripheral Interface Timing ..................... 29  
Serial Ports ..................................................... 32  
Universal Asynchronous Receiver-Transmitter  
(UART) Port—Receive and Transmit Timing ...... 39  
Programmable Flags Cycle Timing ....................... 40  
Timer Cycle Timing .......................................... 41  
JTAG Test and Emulation Port Timing .................. 42  
Output Drive Currents ......................................... 43  
Power Dissipation ............................................... 45  
Test Conditions .................................................. 45  
Environmental Conditions .................................... 48  
160-Ball BGA Pinout ............................................... 50  
169-Ball PBGA Pinout ............................................. 53  
Outline Dimensions ................................................ 56  
Ordering Guide ..................................................... 58  
Serial Peripheral Interface (SPI) Port  
—Master Timing .......................................... 37  
Serial Peripheral Interface (SPI) Port  
—Slave Timing ............................................. 38  
Rev. D  
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September 2006  
ADSP-BF533  
REVISION HISTORY  
8/06—Revision D: Changed from Rev. C to Rev. D  
Added 1.8 V I/O to Features ....................................... 1  
Changed Text in Figure External Components for RTC .... 9  
Added Text to Serial Ports (SPORTs) ........................... 10  
Changed Font in Formula in Power Savings .................. 12  
Complete Rewrite of Operating Conditions ................... 20  
Added 1.8 V to Operating Conditions .......................... 20  
Complete Rewrite of Electrical Characteristics ............... 21  
Added 1.8 V Specifications to Multiple Tables of  
Timing Specifications .............................................. 23  
Edit to Asynchronous Memory Read Cycle Timing ......... 25  
Edit to Asynchronous Memory Write Cycle Timing ........ 26  
Changed Data in SDRAM Interface Timing .................. 27  
Changed Data in Parallel Peripheral Interface Timing ...... 29  
Changed Data in Serial Ports ..................................... 32  
Deleted References to Temperature in Figures  
in Output Drive Currents ......................................... 43  
Added 1.8 V Data to Output Drive Currents .................. 43  
Moved Data to Operating Conditions  
and Rewrote Power Dissipation ................................. 45  
Deleted References to Temperature in Figures  
in Test Conditions .................................................. 45  
Added 1.8 V References in Test Conditions ................... 45  
Added 1.8 V Characterization Data Capacitive Loading ... 45  
Changed Thermal Characteristics for BC-160 Package ..... 49  
Added Models to Ordering Guide ............................... 58  
Rev. D  
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Page 3 of 60 | September 2006  
ADSP-BF533  
GENERAL DESCRIPTION  
The ADSP-BF533 processor is a member of the Blackfin family  
of products, incorporating the Analog Devices, Inc./Intel Micro  
Signal Architecture (MSA). Blackfin processors combine a dual-  
MAC state-of-the-art signal processing engine, the advantages  
of a clean, orthogonal RISC-like microprocessor instruction set,  
and single instruction, multiple data (SIMD) multimedia capa-  
bilities into a single instruction set architecture.  
ADSP-BF533 PROCESSOR PERIPHERALS  
The ADSP-BF533 processor contains a rich set of peripherals  
connected to the core via several high bandwidth buses, provid-  
ing flexibility in system configuration as well as excellent overall  
system performance (see the functional block diagram in  
Figure 1 on Page 1). The general-purpose peripherals include  
functions such as UART, timers with PWM (pulse-width mod-  
ulation) and pulse measurement capability, general-purpose  
flag I/O pins, a real-time clock, and a watchdog timer. This set  
of functions satisfies a wide variety of typical system support  
needs and is augmented by the system expansion capabilities of  
the part. In addition to these general-purpose peripherals, the  
ADSP-BF533 processor contains high speed serial and parallel  
ports for interfacing to a variety of audio, video, and modem  
codec functions; an interrupt controller for flexible manage-  
ment of interrupts from the on-chip peripherals or external  
sources; and power management control functions to tailor the  
performance and power characteristics of the processor and sys-  
tem to many application scenarios.  
The Blackfin processors are completely code and pin-compati-  
ble, differing only with respect to their performance and on-  
chip memory. Specific performance and memory configura-  
tions are shown in Table 1.  
Table 1. Processor Comparison  
ADSP-BF533  
Maximum Performance  
600 MHz 1200 MMACs  
16K bytes  
Instruction  
SRAM/Cache  
Instruction SRAM  
64K bytes  
32K bytes  
All of the peripherals, except for general-purpose I/O, real-time  
clock, and timers, are supported by a flexible DMA structure.  
There is also a separate memory DMA channel dedicated to  
data transfers between the processor’s various memory spaces,  
including external SDRAM and asynchronous memory. Multi-  
ple on-chip buses running at up to 133 MHz provide enough  
bandwidth to keep the processor core running along with activ-  
ity on all of the on-chip and external peripherals.  
Data  
SRAM/Cache  
Data SRAM  
Scratchpad  
32K bytes  
4K bytes  
By integrating a rich set of industry-leading system peripherals  
and memory, Blackfin processors are the platform of choice for  
next generation applications that require RISC-like program-  
mability, multimedia support, and leading-edge signal  
processing in one integrated package.  
The ADSP-BF533 processor includes an on-chip voltage regula-  
tor in support of the processor’s dynamic power management  
capability. The voltage regulator provides a range of core volt-  
age levels from a single 2.25 V to 3.6 V input. The voltage  
regulator can be bypassed at the user’s discretion.  
PORTABLE LOW POWER ARCHITECTURE  
Blackfin processors provide world-class power management  
and performance. Blackfin processors are designed in a low  
power and low voltage design methodology and feature  
dynamic power management—the ability to vary both the volt-  
age and frequency of operation to significantly lower overall  
power consumption. Varying the voltage and frequency can  
result in a substantial reduction in power consumption, com-  
pared with just varying the frequency of operation. This  
translates into longer battery life for portable appliances.  
BLACKFIN PROCESSOR CORE  
As shown in Figure 2 on Page 6, the Blackfin processor core  
contains two 16-bit multipliers, two 40-bit accumulators, two  
40-bit ALUs, four video ALUs, and a 40-bit shifter. The compu-  
tation units process 8-bit, 16-bit, or 32-bit data from the  
register file.  
The compute register file contains eight 32-bit registers. When  
performing compute operations on 16-bit operand data, the  
register file operates as 16 independent 16-bit registers. All  
operands for compute operations come from the multiported  
register file and instruction constant fields.  
SYSTEM INTEGRATION  
The ADSP-BF533 processor is a highly integrated system-on-a-  
chip solution for the next generation of digital communication  
and consumer multimedia applications. By combining indus-  
try-standard interfaces with a high performance signal  
processing core, users can develop cost-effective solutions  
quickly without the need for costly external components. The  
system peripherals include a UART port, an SPI port, two serial  
ports (SPORTs), four general-purpose timers (three with PWM  
capability), a real-time clock, a watchdog timer, and a parallel  
peripheral interface.  
Each MAC can perform a 16-bit by 16-bit multiply in each  
cycle, accumulating the results into the 40-bit accumulators.  
Signed and unsigned formats, rounding, and saturation are  
supported.  
The ALUs perform a traditional set of arithmetic and logical  
operations on 16-bit or 32-bit data. In addition, many special  
instructions are included to accelerate various signal processing  
tasks. These include bit operations such as field extract and pop-  
ulation count, modulo 232 multiply, divide primitives, saturation  
and rounding, and sign/exponent detection. The set of video  
Rev. D  
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September 2006  
ADSP-BF533  
instructions includes byte alignment and packing operations,  
16-bit and 8-bit adds with clipping, 8-bit average operations,  
and 8-bit subtract/absolute value/accumulate (SAA) operations.  
Also provided are the compare/select and vector search  
instructions.  
The Blackfin processor assembly language uses an algebraic syn-  
tax for ease of coding and readability. The architecture has been  
optimized for use in conjunction with the C/C++ compiler,  
resulting in fast and efficient software implementations.  
MEMORY ARCHITECTURE  
For certain instructions, two 16-bit ALU operations can be per-  
formed simultaneously on register pairs (a 16-bit high half and  
16-bit low half of a compute register). By also using the second  
ALU, quad 16-bit operations are possible.  
The Blackfin processors view memory as a single unified  
4G byte address space, using 32-bit addresses. All resources,  
including internal memory, external memory, and I/O control  
registers, occupy separate sections of this common address  
space. The memory portions of this address space are arranged  
in a hierarchical structure to provide a good cost/performance  
balance of some very fast, low latency on-chip memory as cache  
or SRAM, and larger, lower cost and performance off-chip  
memory systems. See Figure 3 on Page 7.  
The 40-bit shifter can perform shifts and rotates and is used to  
support normalization, field extract, and field deposit  
instructions.  
The program sequencer controls the flow of instruction execu-  
tion, including instruction alignment and decoding. For  
program flow control, the sequencer supports PC relative and  
indirect conditional jumps (with static branch prediction), and  
subroutine calls. Hardware is provided to support zero-over-  
head looping. The architecture is fully interlocked, meaning that  
the programmer need not manage the pipeline when executing  
instructions with data dependencies.  
The L1 memory system is the primary highest performance  
memory available to the Blackfin processor. The off-chip mem-  
ory system, accessed through the external bus interface unit  
(EBIU), provides expansion with SDRAM, flash memory, and  
SRAM, optionally accessing up to 132M bytes of  
physical memory.  
The address arithmetic unit provides two addresses for simulta-  
neous dual fetches from memory. It contains a multiported  
register file consisting of four sets of 32-bit index, modify,  
length, and base registers (for circular buffering), and eight  
additional 32-bit pointer registers (for C-style indexed stack  
manipulation).  
The memory DMA controller provides high bandwidth data-  
movement capability. It can perform block transfers of code or  
data between the internal memory and the external  
memory spaces.  
Internal (On-Chip) Memory  
Blackfin processors support a modified Harvard architecture in  
combination with a hierarchical memory structure. Level 1 (L1)  
memories are those that typically operate at the full processor  
speed with little or no latency. At the L1 level, the instruction  
memory holds instructions only. The two data memories hold  
data, and a dedicated scratchpad data memory stores stack and  
local variable information.  
The ADSP-BF533 processor has three blocks of on-chip mem-  
ory providing high bandwidth access to the core.  
The first is the L1 instruction memory, consisting of up to  
80K bytes SRAM, of which 16K bytes can be configured as a  
four way set-associative cache. This memory is accessed at full  
processor speed.  
The second on-chip memory block is the L1 data memory, con-  
sisting of up to two banks of up to 32K bytes each. Each memory  
bank is configurable, offering both cache and SRAM functional-  
ity. This memory block is accessed at full processor speed.  
In addition, multiple L1 memory blocks are provided, offering a  
configurable mix of SRAM and cache. The memory manage-  
ment unit (MMU) provides memory protection for individual  
tasks that may be operating on the core and can protect system  
registers from unintended access.  
The third memory block is a 4K byte scratchpad SRAM which  
runs at the same speed as the L1 memories, but is only accessible  
as data SRAM and cannot be configured as cache memory.  
The architecture provides three modes of operation: user mode,  
supervisor mode, and emulation mode. User mode has  
restricted access to certain system resources, thus providing a  
protected software environment, while supervisor mode has  
unrestricted access to the system and core resources.  
External (Off-Chip) Memory  
The external bus interface can be used with both asynchronous  
devices such as SRAM, FLASH, EEPROM, ROM, and I/O  
devices, and synchronous devices such as SDRAMs. The bus  
width is always 16 bits. A1 is the least significant address of a  
16-bit word. 8-bit peripherals should be addressed as if they  
were 16-bit devices, where only the lower eight bits of data  
should be used.  
The Blackfin processor instruction set has been optimized so  
that 16-bit opcodes represent the most frequently used instruc-  
tions, resulting in excellent compiled code density. Complex  
DSP instructions are encoded into 32-bit opcodes, representing  
fully featured multifunction instructions. Blackfin processors  
support a limited multi-issue capability, where a 32-bit instruc-  
tion can be issued in parallel with two 16-bit instructions,  
allowing the programmer to use many of the core resources in a  
single instruction cycle.  
The PC133-compliant SDRAM controller can be programmed  
to interface to up to 128M bytes of SDRAM. The SDRAM con-  
troller allows one row to be open for each internal SDRAM  
bank, for up to four internal SDRAM banks, improving overall  
system performance.  
Rev. D  
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September 2006  
ADSP-BF533  
ADDRESS ARITHMETIC UNIT  
SP  
FP  
P5  
P4  
P3  
P2  
P1  
P0  
I3  
I2  
I1  
I0  
L3  
L2  
L1  
L0  
B3  
B2  
B1  
B0  
M3  
M2  
M1  
M0  
DAG1  
DAG0  
DA1  
DA0  
32  
32  
32  
PREG  
32  
RAB  
SD  
LD1  
LD0  
32  
32  
32  
ASTAT  
32  
32  
SEQUENCER  
R7.H  
R7.L  
R6.H  
R5.H  
R4.H  
R3.H  
R2.H  
R1.H  
R0.H  
R6.L  
R5.L  
R4.L  
R3.L  
R2.L  
R1.H  
R0.L  
ALIGN  
16  
16  
8
8
8
8
DECODE  
BARREL  
SHIFTER  
LOOP BUFFER  
40  
40  
40 40  
A0  
A1  
CONTROL  
UNIT  
32  
32  
DATA ARITHMETIC UNIT  
Figure 2. Blackfin Processor Core  
The asynchronous memory controller can be programmed to  
control up to four banks of devices with very flexible timing  
parameters for a wide variety of devices. Each bank occupies a  
1M byte segment regardless of the size of the devices used, so  
that these banks will only be contiguous if each is fully popu-  
lated with 1M byte of memory.  
memory space, the processor starts executing from the on-chip  
boot ROM. For more information, see Booting Modes on  
Page 14.  
Event Handling  
The event controller on the ADSP-BF533 processor handles all  
asynchronous and synchronous events to the processor. The  
ADSP-BF533 processor provides event handling that supports  
both nesting and prioritization. Nesting allows multiple event  
service routines to be active simultaneously. Prioritization  
ensures that servicing of a higher priority event takes prece-  
dence over servicing of a lower priority event. The controller  
provides support for five different types of events:  
I/O Memory Space  
Blackfin processors do not define a separate I/O space. All  
resources are mapped through the flat 32-bit address space.  
On-chip I/O devices have their control registers mapped into  
memory mapped registers (MMRs) at addresses near the top of  
the 4G byte address space. These are separated into two smaller  
blocks, one of which contains the control MMRs for all core  
functions, and the other of which contains the registers needed  
for setup and control of the on-chip peripherals outside of the  
core. The MMRs are accessible only in supervisor mode and  
appear as reserved space to on-chip peripherals.  
• Emulation – An emulation event causes the processor to  
enter emulation mode, allowing command and control of  
the processor via the JTAG interface.  
• Reset – This event resets the processor.  
• Nonmaskable interrupt (NMI) – The NMI event can be  
generated by the software watchdog timer or by the NMI  
input signal to the processor. The NMI event is frequently  
used as a power-down indicator to initiate an orderly shut-  
down of the system.  
Booting  
The ADSP-BF533 processor contains a small boot kernel, which  
configures the appropriate peripheral for booting. If the  
ADSP-BF533 processor is configured to boot from boot ROM  
Rev. D  
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September 2006  
ADSP-BF533  
Table 2. Core Event Controller (CEC)  
0xFFFF FFFF  
0xFFE0 0000  
0xFFC0 0000  
0xFFB0 1000  
0xFFB0 0000  
0xFFA1 4000  
0xFFA1 0000  
0xFFA0 0000  
0xFF90 8000  
0xFF90 4000  
0xFF90 0000  
0xFF80 8000  
0xFF80 4000  
0xFF80 0000  
0xEF00 0000  
0x2040 0000  
0x2030 0000  
0x2020 0000  
0x2010 0000  
0x2000 0000  
0x0800 0000  
0x0000 0000  
CORE MMR REGISTERS (2M BYTE)  
SYSTEM MMR REGISTERS (2M BYTE)  
RESERVED  
Priority  
(0 is Highest)  
Event Class  
EVT Entry  
0
Emulation/Test Control EMU  
Reset RST  
Nonmaskable Interrupt NMI  
SCRATCHPAD SRAM (4K BYTE)  
RESERVED  
1
2
INSTRUCTION SRAM/CACHE (16K BYTE)  
INSTRUCTION SRAM (64K BYTE)  
RESERVED  
3
Exception  
EVX  
4
Reserved  
5
Hardware Error  
IVHW  
IVTMR  
IVG7  
DATA BANK B SRAM/CACHE (16K BYTE)  
DATA BANK B SRAM (16K BYTE)  
RESERVED  
6
Core Timer  
7
General Interrupt 7  
General Interrupt 8  
General Interrupt 9  
General Interrupt 10  
General Interrupt 11  
General Interrupt 12  
General Interrupt 13  
General Interrupt 14  
General Interrupt 15  
8
IVG8  
DATA BANK A SRAM/CACHE (16K BYTE)  
DATA BANK A SRAM (16K BYTE)  
9
IVG9  
10  
11  
12  
13  
14  
15  
IVG10  
IVG11  
IVG12  
IVG13  
IVG14  
IVG15  
RESERVED  
RESERVED  
ASYNC MEMORY BANK 3 (1M BYTE)  
ASYNC MEMORY BANK 2 (1M BYTE)  
ASYNC MEMORY BANK 1 (1M BYTE)  
ASYNC MEMORY BANK 0 (1M BYTE)  
RESERVED  
System Interrupt Controller (SIC)  
The system interrupt controller provides the mapping and rout-  
ing of events from the many peripheral interrupt sources to the  
prioritized general-purpose interrupt inputs of the CEC.  
Although the ADSP-BF533 processor provides a default map-  
ping, the user can alter the mappings and priorities of interrupt  
events by writing the appropriate values into the interrupt  
assignment registers (IAR). Table 3 describes the inputs into the  
SIC and the default mappings into the CEC.  
SDRAM MEMORY (16M BYTE TO 128M BYTE)  
Figure 3. ADSP-BF533 Internal/External Memory Map  
• Exceptions – Events that occur synchronously to program  
flow (i.e., the exception will be taken before the instruction  
is allowed to complete). Conditions such as data alignment  
violations and undefined instructions cause exceptions.  
Event Control  
• Interrupts – Events that occur asynchronously to program  
flow. They are caused by input pins, timers, and other  
peripherals, as well as by an explicit software instruction.  
The ADSP-BF533 processor provides the user with a very flexi-  
ble mechanism to control the processing of events. In the CEC,  
three registers are used to coordinate and control events. Each  
register is 16 bits wide:  
Each event type has an associated register to hold the return  
address and an associated return-from-event instruction. When  
an event is triggered, the state of the processor is saved on the  
supervisor stack.  
• CEC interrupt latch register (ILAT) – The ILAT register  
indicates when events have been latched. The appropriate  
bit is set when the processor has latched the event and  
cleared when the event has been accepted into the system.  
This register is updated automatically by the controller, but  
it may be written only when its corresponding IMASK bit  
is cleared.  
The ADSP-BF533 processor event controller consists of two  
stages, the core event controller (CEC) and the system interrupt  
controller (SIC). The core event controller works with the sys-  
tem interrupt controller to prioritize and control all system  
events. Conceptually, interrupts from the peripherals enter into  
the SIC, and are then routed directly into the general-purpose  
interrupts of the CEC.  
• CEC interrupt mask register (IMASK) – The IMASK regis-  
ter controls the masking and unmasking of individual  
events. When a bit is set in the IMASK register, that event is  
unmasked and will be processed by the CEC when asserted.  
A cleared bit in the IMASK register masks the event, pre-  
venting the processor from servicing the event even though  
the event may be latched in the ILAT register. This register  
may be read or written while in supervisor mode. (Note  
that general-purpose interrupts can be globally enabled and  
disabled with the STI and CLI instructions, respectively.)  
Core Event Controller (CEC)  
The CEC supports nine general-purpose interrupts (IVG15–7),  
in addition to the dedicated interrupt and exception events. Of  
these general-purpose interrupts, the two lowest priority inter-  
rupts (IVG15–14) are recommended to be reserved for software  
interrupt handlers, leaving seven prioritized interrupt inputs to  
support the peripherals of the ADSP-BF533 processor. Table 2  
describes the inputs to the CEC, identifies their names in the  
event vector table (EVT), and lists their priorities.  
Rev. D  
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ADSP-BF533  
Table 3. System Interrupt Controller (SIC)  
source triggered the interrupt. A set bit indicates the  
peripheral is asserting the interrupt, and a cleared bit indi-  
cates the peripheral is not asserting the event.  
Peripheral Interrupt Event  
PLL Wakeup  
Default Mapping  
IVG7  
• SIC interrupt wakeup enable register (SIC_IWR) – By  
enabling the corresponding bit in this register, a peripheral  
can be configured to wake up the processor, should the  
core be idled when the event is generated. (For more infor-  
mation, see Dynamic Power Management on Page 11.)  
DMA Error  
IVG7  
PPI Error  
IVG7  
SPORT 0 Error  
IVG7  
SPORT 1 Error  
IVG7  
Because multiple interrupt sources can map to a single general-  
purpose interrupt, multiple pulse assertions can occur simulta-  
neously, before or during interrupt processing for an interrupt  
event already detected on this interrupt input. The IPEND reg-  
ister contents are monitored by the SIC as the interrupt  
acknowledgement.  
SPI Error  
IVG7  
UART Error  
IVG7  
Real-Time Clock  
IVG8  
DMA Channel 0 (PPI)  
DMA Channel 1 (SPORT 0 Receive)  
DMA Channel 2 (SPORT 0 Transmit)  
DMA Channel 3 (SPORT 1 Receive)  
DMA Channel 4 (SPORT 1 Transmit)  
DMA Channel 5 (SPI)  
DMA Channel 6 (UART Receive)  
DMA Channel 7 (UART Transmit)  
Timer 0  
IVG8  
IVG9  
IVG9  
The appropriate ILAT register bit is set when an interrupt rising  
edge is detected (detection requires two core clock cycles). The  
bit is cleared when the respective IPEND register bit is set. The  
IPEND bit indicates that the event has entered into the proces-  
sor pipeline. At this point the CEC will recognize and queue the  
next rising edge event on the corresponding event input. The  
minimum latency from the rising edge transition of the general-  
purpose interrupt to the IPEND output asserted is three core  
clock cycles; however, the latency can be much higher, depend-  
ing on the activity within and the state of the processor.  
IVG9  
IVG9  
IVG10  
IVG10  
IVG10  
IVG11  
IVG11  
IVG11  
IVG12  
IVG12  
IVG13  
Timer 1  
Timer 2  
DMA CONTROLLERS  
PF Interrupt A  
PF Interrupt B  
The ADSP-BF533 processor has multiple, independent DMA  
controllers that support automated data transfers with minimal  
overhead for the processor core. DMA transfers can occur  
between the processor’s internal memories and any of its DMA-  
capable peripherals. Additionally, DMA transfers can be accom-  
plished between any of the DMA-capable peripherals and  
external devices connected to the external memory interfaces,  
including the SDRAM controller and the asynchronous mem-  
ory controller. DMA-capable peripherals include the SPORTs,  
SPI port, UART, and PPI. Each individual DMA-capable  
peripheral has at least one dedicated DMA channel.  
DMA Channels 8 and 9  
(Memory DMA Stream 1)  
DMA Channels 10 and 11  
(Memory DMA Stream 0)  
IVG13  
IVG13  
Software Watchdog Timer  
• CEC interrupt pending register (IPEND) – The IPEND  
register keeps track of all nested events. A set bit in the  
IPEND register indicates the event is currently active or  
nested at some level. This register is updated automatically  
by the controller but may be read while in supervisor mode.  
The ADSP-BF533 processor DMA controller supports both  
1-dimensional (1-D) and 2-dimensional (2-D) DMA transfers.  
DMA transfer initialization can be implemented from registers  
or from sets of parameters called descriptor blocks.  
The SIC allows further control of event processing by providing  
three 32-bit interrupt control and status registers. Each register  
contains a bit corresponding to each of the peripheral interrupt  
events shown in Table 3 on Page 8.  
The 2-D DMA capability supports arbitrary row and column  
sizes up to 64K elements by 64K elements, and arbitrary row  
and column step sizes up to 32K elements. Furthermore, the  
column step size can be less than the row step size, allowing  
implementation of interleaved data streams. This feature is  
especially useful in video applications where data can be  
de-interleaved on-the-fly.  
• SIC interrupt mask register (SIC_IMASK) – This register  
controls the masking and unmasking of each peripheral  
interrupt event. When a bit is set in the register, that  
peripheral event is unmasked and will be processed by the  
system when asserted. A cleared bit in the register masks  
the peripheral event, preventing the processor from servic-  
ing the event.  
Examples of DMA types supported by the ADSP-BF533 proces-  
sor DMA controller include:  
• SIC interrupt status register (SIC_ISR) – As multiple  
peripherals can be mapped to a single event, this register  
allows the software to determine which peripheral event  
• A single, linear buffer that stops upon completion  
• A circular, autorefreshing buffer that interrupts on each  
full or fractionally full buffer  
Rev. D  
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ADSP-BF533  
• 1-D or 2-D DMA using a linked list of descriptors  
RTXI  
RTXO  
R1  
X1  
• 2-D DMA using an array of descriptors, specifying only the  
base DMA address within a common page  
In addition to the dedicated peripheral DMA channels, there are  
two memory DMA channels provided for transfers between the  
various memories of the ADSP-BF533 processor system. This  
enables transfers of blocks of data between any of the memo-  
ries—including external SDRAM, ROM, SRAM, and flash  
memory—with minimal processor intervention. Memory DMA  
transfers can be controlled by a very flexible descriptor-based  
methodology or by a standard register-based autobuffer  
mechanism.  
C1  
C2  
SUGGESTED COMPONENTS:  
X1 = ECLIPTEK EC38J (THROUGH-HOLE PACKAGE) OR  
EPSON MC405 12 pF LOAD (SURFACE-MOUNT PACKAGE)  
C1 = 22 pF  
C2 = 22 pF  
R1 = 10 MΩ  
REAL-TIME CLOCK  
NOTE: C1 AND C2 ARE SPECIFIC TO CRYSTAL SPECIFIED FOR X1.  
CONTACT CRYSTAL MANUFACTURER FOR DETAILS. C1 AND C2  
SPECIFICATIONS ASSUME BOARD TRACE CAPACITANCE OF 3 pF.  
The ADSP-BF533 processor real-time clock (RTC) provides a  
robust set of digital watch features, including current time, stop-  
watch, and alarm. The RTC is clocked by a 32.768 kHz crystal  
external to the ADSP-BF533 processor. The RTC peripheral has  
dedicated power supply pins so that it can remain powered up  
and clocked even when the rest of the processor is in a low  
power state. The RTC provides several programmable interrupt  
options, including interrupt per second, minute, hour, or day  
clock ticks, interrupt on programmable stopwatch countdown,  
or interrupt at a programmed alarm time.  
Figure 4. External Components for RTC  
remaining in an unknown state where software, which would  
normally reset the timer, has stopped running due to an external  
noise condition or software error.  
If configured to generate a hardware reset, the watchdog timer  
resets both the core and the ADSP-BF533 processor peripherals.  
After a reset, software can determine if the watchdog was the  
source of the hardware reset by interrogating a status bit in the  
watchdog timer control register.  
The 32.768 kHz input clock frequency is divided down to a 1 Hz  
signal by a prescaler. The counter function of the timer consists  
of four counters: a 60 second counter, a 60 minute counter, a  
24 hour counter, and a 32,768 day counter.  
The timer is clocked by the system clock (SCLK), at a maximum  
frequency of fSCLK  
.
When enabled, the alarm function generates an interrupt when  
the output of the timer matches the programmed value in the  
alarm control register. There are two alarms. The first alarm is  
for a time of day. The second alarm is for a day and time of  
that day.  
TIMERS  
There are four general-purpose programmable timer units in  
the ADSP-BF533 processor. Three timers have an external pin  
that can be configured either as a pulse-width modulator  
(PWM) or timer output, as an input to clock the timer, or as a  
mechanism for measuring pulse-widths and periods of external  
events. These timers can be synchronized to an external clock  
input to the PF1 pin, an external clock input to the PPI_CLK  
pin, or to the internal SCLK.  
The stopwatch function counts down from a programmed  
value, with one second resolution. When the stopwatch is  
enabled and the counter underflows, an interrupt is generated.  
Like other peripherals, the RTC can wake up the processor from  
sleep mode upon generation of any RTC wakeup event.  
Additionally, an RTC wakeup event can wake up the processor  
from deep sleep mode, and wake up the on-chip internal voltage  
regulator from a powered-down state.  
The timer units can be used in conjunction with the UART to  
measure the width of the pulses in the data stream to provide an  
autobaud detect function for a serial channel.  
The timers can generate interrupts to the processor core provid-  
ing periodic events for synchronization, either to the system  
clock or to a count of external signals.  
Connect RTC pins RTXI and RTXO with external components  
as shown in Figure 4.  
In addition to the three general-purpose programmable timers,  
a fourth timer is also provided. This extra timer is clocked by the  
internal processor clock and is typically used as a system tick  
clock for generation of operating system periodic interrupts.  
WATCHDOG TIMER  
The ADSP-BF533 processor includes a 32-bit timer that can be  
used to implement a software watchdog function. A software  
watchdog can improve system availability by forcing the proces-  
sor to a known state through generation of a hardware reset,  
nonmaskable interrupt (NMI), or general-purpose interrupt, if  
the timer expires before being reset by software. The program-  
mer initializes the count value of the timer, enables the  
appropriate interrupt, then enables the timer. Thereafter, the  
software must reload the counter before it counts to zero from  
the programmed value. This protects the system from  
Rev. D  
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ADSP-BF533  
processor select other SPI devices. The SPI select pins are recon-  
figured programmable flag pins. Using these pins, the SPI port  
provides a full-duplex, synchronous serial interface which sup-  
ports both master/slave modes and multimaster environments.  
SERIAL PORTS (SPORTs)  
The ADSP-BF533 processor incorporates two dual-channel  
synchronous serial ports (SPORT0 and SPORT1) for serial and  
multiprocessor communications. The SPORTs support the fol-  
lowing features:  
The baud rate and clock phase/polarities for the SPI port are  
programmable, and it has an integrated DMA controller, con-  
figurable to support transmit or receive data streams. The SPI  
DMA controller can only service unidirectional accesses at any  
given time.  
• I2S capable operation.  
• Bidirectional operation – Each SPORT has two sets of inde-  
pendent transmit and receive pins, enabling eight channels  
of I2S stereo audio.  
The SPI port clock rate is calculated as:  
• Buffered (8-deep) transmit and receive ports – Each port  
has a data register for transferring data words to and from  
other processor components and shift registers for shifting  
data in and out of the data registers.  
fSCLK  
2 × SPI_Baud  
--------------------------------  
SPI Clock Rate =  
Where the 16-bit SPI_Baud register contains a value of 2 to  
65,535.  
• Clocking – Each transmit and receive port can either use an  
external serial clock or generate its own, in frequencies  
ranging from (fSCLK/131,070) Hz to (fSCLK/2) Hz.  
During transfers, the SPI port simultaneously transmits and  
receives by serially shifting data in and out on its two serial data  
lines. The serial clock line synchronizes the shifting and sam-  
pling of data on the two serial data lines.  
• Word length – Each SPORT supports serial data words  
from 3 bits to 32 bits in length, transferred most-signifi-  
cant-bit first or least-significant-bit first.  
UART PORT  
• Framing – Each transmit and receive port can run with or  
without frame sync signals for each data word. Frame sync  
signals can be generated internally or externally, active high  
or low, and with either of two pulsewidths and early or late  
frame sync.  
The ADSP-BF533 processor provides a full-duplex universal  
asynchronous receiver/transmitter (UART) port, which is fully  
compatible with PC-standard UARTs. The UART port provides  
a simplified UART interface to other peripherals or hosts, sup-  
porting full-duplex, DMA-supported, asynchronous transfers of  
serial data. The UART port includes support for 5 data bits to  
8 data bits, 1 stop bit or 2 stop bits, and none, even, or odd par-  
ity. The UART port supports two modes of operation:  
• Companding in hardware – Each SPORT can perform  
A-law or μ-law companding according to ITU recommen-  
dation G.711. Companding can be selected on the transmit  
and/or receive channel of the SPORT without additional  
latencies.  
• PIO (programmed I/O) – The processor sends or receives  
data by writing or reading I/O-mapped UART registers.  
The data is double-buffered on both transmit and receive.  
• DMA operations with single-cycle overhead – Each SPORT  
can automatically receive and transmit multiple buffers of  
memory data. The processor can link or chain sequences of  
DMA transfers between a SPORT and memory.  
• DMA (direct memory access) – The DMA controller trans-  
fers both transmit and receive data. This reduces the  
number and frequency of interrupts required to transfer  
data to and from memory. The UART has two dedicated  
DMA channels, one for transmit and one for receive. These  
DMA channels have lower default priority than most DMA  
channels because of their relatively low service rates.  
• Interrupts – Each transmit and receive port generates an  
interrupt upon completing the transfer of a data-word or  
after transferring an entire data buffer or buffers through  
DMA.  
The baud rate, serial data format, error code generation and  
status, and interrupts for the UART port are programmable.  
• Multichannel capability – Each SPORT supports 128 chan-  
nels out of a 1,024-channel window and is compatible with  
the H.100, H.110, MVIP-90, and HMVIP standards.  
The UART programmable features include:  
An additional 250 mV of SPORT input hysteresis can be  
enabled by setting Bit 15 of the PLL_CTL register. When this bit  
is set, all SPORT input pins have the increased hysteresis.  
• Supporting bit rates ranging from (fSCLK/1,048,576) bits per  
second to (fSCLK/16) bits per second.  
• Supporting data formats from seven bits to 12 bits per  
frame.  
SERIAL PERIPHERAL INTERFACE (SPI) PORT  
• Both transmit and receive operations can be configured to  
generate maskable interrupts to the processor.  
The ADSP-BF533 processor has an SPI-compatible port that  
enables the processor to communicate with multiple SPI-com-  
patible devices.  
The UART port’s clock rate is calculated as:  
The SPI interface uses three pins for transferring data: two data  
pins (master output-slave input, MOSI, and master input-slave  
output, MISO) and a clock pin (serial clock, SCK). An SPI chip  
select input pin (SPISS) lets other SPI devices select the proces-  
sor, and seven SPI chip select output pins (SPISEL7–1) let the  
fSCLK  
-----------------------------------------------  
UART Clock Rate =  
16 × UART_Divisor  
Where the 16-bit UART_Divisor comes from the DLH register  
(most significant 8 bits) and DLL register (least significant  
8 bits).  
Rev. D  
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ADSP-BF533  
In conjunction with the general-purpose timer functions,  
autobaud detection is supported.  
Three distinct ITU-R 656 modes are supported:  
• Active video only – The PPI does not read in any data  
between the end of active video (EAV) and start of active  
video (SAV) preamble symbols, or any data present during  
the vertical blanking intervals. In this mode, the control  
byte sequences are not stored to memory; they are filtered  
by the PPI.  
The capabilities of the UART are further extended with support  
for the Infrared Data Association (IrDA) serial infrared physical  
layer link specification (SIR) protocol.  
PROGRAMMABLE FLAGS (PFx)  
The ADSP-BF533 processor has 16 bidirectional, general-pur-  
pose programmable flag (PF15–0) pins. Each programmable  
flag can be individually controlled by manipulation of the flag  
control, status and interrupt registers:  
• Vertical blanking only – The PPI only transfers vertical  
blanking interval (VBI) data, as well as horizontal blanking  
information and control byte sequences on VBI lines.  
• Entire field – The entire incoming bitstream is read in  
through the PPI. This includes active video, control pream-  
ble sequences, and ancillary data that may be embedded in  
horizontal and vertical blanking intervals.  
• Flag direction control register – Specifies the direction of  
each individual PFx pin as input or output.  
• Flag control and status registers – The ADSP-BF533 pro-  
cessor employs a “write one to modify” mechanism that  
allows any combination of individual flags to be modified  
in a single instruction, without affecting the level of any  
other flags. Four control registers are provided. One regis-  
ter is written in order to set flag values, one register is  
written in order to clear flag values, one register is written  
in order to toggle flag values, and one register is written in  
order to specify a flag value. Reading the flag status register  
allows software to interrogate the sense of the flags.  
Though not explicitly supported, ITU-R 656 output functional-  
ity can be achieved by setting up the entire frame structure  
(including active video, blanking, and control information) in  
memory and streaming the data out the PPI in a frame sync-less  
mode. The processor’s 2-D DMA features facilitate this transfer  
by allowing the static frame buffer (blanking and control codes)  
to be placed in memory once, and simply updating the active  
video information on a per-frame basis.  
The general-purpose modes of the PPI are intended to suit a  
wide variety of data capture and transmission applications. The  
modes are divided into four main categories, each allowing up  
to 16 bits of data transfer per PPI_CLK cycle:  
• Flag interrupt mask registers – The two flag interrupt mask  
registers allow each individual PFx pin to function as an  
interrupt to the processor. Similar to the two flag control  
registers that are used to set and clear individual flag values,  
one flag interrupt mask register sets bits to enable interrupt  
function, and the other flag interrupt mask register clears  
bits to disable interrupt function. PFx pins defined as  
inputs can be configured to generate hardware interrupts,  
while output PFx pins can be triggered by software  
interrupts.  
• Data receive with internally generated frame syncs  
• Data receive with externally generated frame syncs  
• Data transmit with internally generated frame syncs  
• Data transmit with externally generated frame syncs  
These modes support ADC/DAC connections, as well as video  
communication with hardware signaling. Many of the modes  
support more than one level of frame synchronization. If  
desired, a programmable delay can be inserted between asser-  
tion of a frame sync and reception/transmission of data.  
• Flag interrupt sensitivity registers – The two flag interrupt  
sensitivity registers specify whether individual PFx pins are  
level- or edge-sensitive and specify—if edge-sensitive—  
whether just the rising edge or both the rising and falling  
edges of the signal are significant. One register selects the  
type of sensitivity, and one register selects which edges are  
significant for edge-sensitivity.  
DYNAMIC POWER MANAGEMENT  
The ADSP-BF533 processor provides five operating modes,  
each with a different performance/power profile. In addition,  
dynamic power management provides the control functions to  
dynamically alter the processor core supply voltage, further  
reducing power dissipation. Control of clocking to each of the  
ADSP-BF533 processor peripherals also reduces power con-  
sumption. See Table 4 for a summary of the power settings for  
each mode.  
PARALLEL PERIPHERAL INTERFACE  
The processor provides a parallel peripheral interface (PPI) that  
can connect directly to parallel A/D and D/A converters, ITU-R  
601/656 video encoders and decoders, and other general-  
purpose peripherals. The PPI consists of a dedicated input clock  
pin, up to three frame synchronization pins, and up to 16 data  
pins. The input clock supports parallel data rates up to half the  
system clock rate.  
In ITU-R 656 modes, the PPI receives and parses a data stream  
of 8-bit or 10-bit data elements. On-chip decode of embedded  
preamble control and synchronization information is  
supported.  
Rev. D  
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ADSP-BF533  
Table 4. Power Settings  
PLL control register (PLL_CTL). If BYPASS is disabled, the pro-  
cessor will transition to the full-on mode. If BYPASS is enabled,  
the processor will transition to the active mode.  
Core  
Clock  
System  
Clock  
PLL  
Core  
Power  
When in the sleep mode, system DMA access to L1 memory is  
not supported.  
Mode  
Full-On  
Active  
PLL  
Bypassed (CCLK) (SCLK)  
Enabled No  
Enabled Enabled On  
Deep Sleep Operating Mode—Maximum Dynamic Power  
Savings  
Enabled/ Yes  
Disabled  
Enabled Enabled On  
Sleep  
Enabled  
Disabled Enabled On  
Disabled Disabled On  
Disabled Disabled Off  
The deep sleep mode maximizes dynamic power savings by dis-  
abling the clocks to the processor core (CCLK) and to all  
synchronous peripherals (SCLK). Asynchronous peripherals,  
such as the RTC, may still be running but will not be able to  
access internal resources or external memory. This powered-  
down mode can only be exited by assertion of the reset interrupt  
(RESET) or by an asynchronous interrupt generated by the  
RTC. When in deep sleep mode, an RTC asynchronous inter-  
rupt causes the processor to transition to the active mode.  
Assertion of RESET while in deep sleep mode causes the proces-  
sor to transition to the full-on mode.  
Deep Sleep Disabled  
Hibernate Disabled  
Full-On Operating Mode—Maximum Performance  
In the full-on mode, the PLL is enabled and is not bypassed,  
providing capability for maximum operational frequency. This  
is the power-up default execution state in which maximum per-  
formance can be achieved. The processor core and all enabled  
peripherals run at full speed.  
Active Operating Mode—Moderate Power Savings  
Power Savings  
In the active mode, the PLL is enabled but bypassed. Because the  
PLL is bypassed, the processor’s core clock (CCLK) and system  
clock (SCLK) run at the input clock (CLKIN) frequency. In this  
mode, the CLKIN to CCLK multiplier ratio can be changed,  
although the changes are not realized until the full-on mode is  
entered. DMA access is available to appropriately configured L1  
memories.  
As shown in Table 5, the ADSP-BF533 processor supports three  
different power domains. The use of multiple power domains  
maximizes flexibility, while maintaining compliance with  
industry standards and conventions. By isolating the internal  
logic of the ADSP-BF533 processor into its own power domain,  
separate from the RTC and other I/O, the processor can take  
advantage of dynamic power management, without affecting  
the RTC or other I/O devices. There are no sequencing require-  
ments for the various power domains.  
In the active mode, it is possible to disable the PLL through the  
PLL control register (PLL_CTL). If disabled, the PLL must be  
re-enabled before transitioning to the full-on or sleep modes.  
Table 5. Power Domains  
Hibernate Operating Mode—Maximum Static Power  
Savings  
Power Domain  
VDD Range  
VDDINT  
All internal logic, except RTC  
RTC internal logic and crystal I/O  
All other I/O  
The hibernate mode maximizes static power savings by dis-  
abling the voltage and clocks to the processor core (CCLK) and  
to all the synchronous peripherals (SCLK). The internal voltage  
regulator for the processor can be shut off by writing b#00 to  
the FREQ bits of the VR_CTL register. This disables both CCLK  
and SCLK. Furthermore, it sets the internal power supply volt-  
age (VDDINT) to 0 V to provide the lowest static power  
dissipation. Any critical information stored internally (memory  
contents, register contents, etc.) must be written to a nonvolatile  
storage device prior to removing power if the processor state is  
to be preserved. Since VDDEXT is still supplied in this mode, all of  
the external pins three-state, unless otherwise specified. This  
allows other devices that may be connected to the processor to  
have power still applied without drawing unwanted current.  
The internal supply regulator can be woken up either by a real-  
time clock wakeup or by asserting the RESET pin.  
VDDRTC  
VDDEXT  
The power dissipated by a processor is largely a function of the  
clock frequency of the processor and the square of the operating  
voltage. For example, reducing the clock frequency by 25%  
results in a 25% reduction in dynamic power dissipation, while  
reducing the voltage by 25% reduces dynamic power dissipation  
by more than 40%. Further, these power savings are additive, in  
that if the clock frequency and supply voltage are both reduced,  
the power savings can be dramatic.  
The dynamic power management feature of the ADSP-BF533  
processor allows both the processor input voltage (VDDINT) and  
clock frequency (fCCLK) to be dynamically controlled.  
The savings in power dissipation can be modeled using the  
power savings factor and % power savings calculations.  
Sleep Operating Mode—High Dynamic Power Savings  
The sleep mode reduces dynamic power dissipation by disabling  
the clock to the processor core (CCLK). The PLL and system  
clock (SCLK), however, continue to operate in this mode. Typi-  
cally an external event or RTC activity will wake up the  
processor. When in the sleep mode, assertion of wakeup will  
cause the processor to sense the value of the BYPASS bit in the  
The power savings factor is calculated as:  
power savings factor  
2
fCCLKRED  
---------------------  
fCCLKNOM  
VDDINTRED  
--------------------------  
VDDINTNOM  
tRED  
----------  
tNOM  
=
×
×
Rev. D  
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ADSP-BF533  
where the variables in the equations are:  
If an external clock is used, it must not be halted, changed, or  
operated below the specified frequency during normal opera-  
tion. This signal is connected to the processor’s CLKIN pin.  
When an external clock is used, the XTAL pin must be left  
unconnected.  
f
f
CCLKNOM is the nominal core clock frequency  
CCLKRED is the reduced core clock frequency  
V
V
DDINTNOM is the nominal internal supply voltage  
DDINTRED is the reduced internal supply voltage  
Alternatively, because the ADSP-BF533 processor includes an  
on-chip oscillator circuit, an external crystal may be used. The  
crystal should be connected across the CLKIN and XTAL pins,  
with two capacitors connected as shown in Figure 6. Capacitor  
values are dependent on crystal type and should be specified by  
the crystal manufacturer. A parallel-resonant, fundamental fre-  
quency, microprocessor-grade crystal should be used.  
t
NOM is the duration running at fCCLKNOM  
RED is the duration running at fCCLKRED  
t
The percent power savings is calculated as:  
% power savings = (1 power savings factor) × 100%  
VOLTAGE REGULATION  
The Blackfin processors provide an on-chip voltage regulator  
that can generate processor core voltage levels 0.85 V to 1.2 V  
from an external 2.25 V to 3.6 V supply. Figure 5 shows the typ-  
ical external components required to complete the power  
management system.The regulator controls the internal logic  
voltage levels and is programmable with the voltage regulator  
control register (VR_CTL) in increments of 50 mV. To reduce  
standby power consumption, the internal voltage regulator can  
be programmed to remove power to the processor core while  
keeping I/O power (VDDEXT) supplied. While in hibernation,  
XTAL  
CLKOUT  
CLKIN  
Figure 6. External Crystal Connections  
As shown in Figure 7, the core clock (CCLK) and system  
peripheral clock (SCLK) are derived from the input clock  
(CLKIN) signal. An on-chip PLL is capable of multiplying the  
CLKIN signal by a user programmable 0.5× to 64×  
multiplication factor (bounded by specified minimum and max-  
imum VCO frequencies). The default multiplier is 10×, but it  
can be modified by a software instruction sequence. On-the-fly  
frequency changes can be effected by simply writing to the  
PLL_DIV register.  
V
DDEXT can still be applied, eliminating the need for external  
buffers. The voltage regulator can be activated from this power-  
down state either through an RTC wakeup or by asserting  
RESET, which will then initiate a boot sequence. The regulator  
can also be disabled and bypassed at the user’s discretion.  
VDDEXT  
100µF  
2. 25V TO 3.6V  
INPUT VOLTAGE  
RANGE  
“FINE” ADJUSTMENT  
REQUIRES PLL SEQUENCING  
COARSE” ADJUSTMENT  
ON-THE-FLY  
10µH  
VDDINT  
0.1µF  
ZHCS1000  
FDS9431A  
100µF  
1µF  
÷ 1, 2, 4, 8  
÷ 1 to 15  
CCLK  
SCLK  
PLL  
0.5× to 64×  
CLKIN  
VCO  
VROUT10  
EXTERNAL COMPONENTS  
NOTE: VROUT10 SHOULD BETIED TOGETHER EXTERNALLY  
AND DESIGNER SHOULD MINIMIZETRACE LENGTH TO FDS9431A.  
SCLK CCLK  
SCLK 133 MHz  
Figure 5. Voltage Regulator Circuit  
Figure 7. Frequency Modification Methods  
CLOCK SIGNALS  
All on-chip peripherals are clocked by the system clock (SCLK).  
The system clock frequency is programmable by means of the  
SSEL3–0 bits of the PLL_DIV register. The values programmed  
into the SSEL fields define a divide ratio between the PLL output  
(VCO) and the system clock. SCLK divider values are 1 through  
15. Table 6 illustrates typical system clock ratios.  
The ADSP-BF533 processor can be clocked by an external crys-  
tal, a sine wave input, or a buffered, shaped clock derived from  
an external clock oscillator.  
See EE-228: Switching Regulator Design Considerations for ADSP-BF533  
Blackfin Processors.  
Rev. D  
|
Page 13 of 60  
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September 2006  
ADSP-BF533  
Table 6. Example System Clock Ratios  
The BMODE pins of the reset configuration register, sampled  
during power-on resets and software-initiated resets, imple-  
ment the following modes:  
Example Frequency Ratios  
(MHz)  
VCO  
100  
Signal Name Divider Ratio  
• Execute from 16-bit external memory – Execution starts  
from address 0x2000 0000 with 16-bit packing. The boot  
ROM is bypassed in this mode. All configuration settings  
are set for the slowest device possible (3-cycle hold time;  
15-cycle R/W access times; 4-cycle setup).  
SSEL3–0  
VCO/SCLK  
SCLK  
100  
133  
50  
0001  
1:1  
0011  
3:1  
400  
1010  
10:1  
500  
• Boot from 8-bit or 16-bit external flash memory – The flash  
boot routine located in boot ROM memory space is set up  
using asynchronous memory bank 0. All configuration set-  
tings are set for the slowest device possible (3-cycle hold  
time; 15-cycle R/W access times; 4-cycle setup).  
The maximum frequency of the system clock is fSCLK. Note that  
the divisor ratio must be chosen to limit the system clock fre-  
quency to its maximum of fSCLK. The SSEL value can be changed  
dynamically without any PLL lock latencies by writing the  
appropriate values to the PLL divisor register (PLL_DIV).  
• Boot from SPI serial EEPROM (8-, 16-, or 24-bit  
addressable) – The SPI uses the PF2 output pin to select a  
single SPI EEPROM device, submits successive read com-  
mands at addresses 0x00, 0x0000, and 0x000000 until a  
valid 8-, 16-, or 24-bit addressable EEPROM is detected,  
and begins clocking data into the beginning of L1 instruc-  
tion memory.  
The core clock (CCLK) frequency can also be dynamically  
changed by means of the CSEL1–0 bits of the PLL_DIV register.  
Supported CCLK divider ratios are 1, 2, 4, and 8, as shown in  
Table 7. This programmable core clock capability is useful for  
fast core frequency modifications.  
Table 7. Core Clock Ratios  
For each of the boot modes, a 10-byte header is first read from  
an external memory device. The header specifies the number of  
bytes to be transferred and the memory destination address.  
Multiple memory blocks may be loaded by any boot sequence.  
Once all blocks are loaded, program execution commences from  
the start of L1 instruction SRAM.  
Example Frequency Ratios  
(MHz)  
VCO  
300  
Signal Name Divider Ratio  
CSEL1–0  
VCO/CCLK  
CCLK  
300  
150  
125  
25  
00  
01  
10  
11  
1:1  
2:1  
4:1  
8:1  
300  
In addition, Bit 4 of the reset configuration register can be set by  
application code to bypass the normal boot sequence during a  
software reset. For this case, the processor jumps directly to the  
beginning of L1 instruction memory.  
500  
200  
BOOTING MODES  
INSTRUCTION SET DESCRIPTION  
The ADSP-BF533 processor has two mechanisms (listed in  
Table 8) for automatically loading internal L1 instruction mem-  
ory after a reset. A third mode is provided to execute from  
external memory, bypassing the boot sequence.  
The Blackfin processor family assembly language instruction set  
employs an algebraic syntax designed for ease of coding and  
readability. The instructions have been specifically tuned to pro-  
vide a flexible, densely encoded instruction set that compiles to  
a very small final memory size. The instruction set also provides  
fully featured multifunction instructions that allow the pro-  
grammer to use many of the processor core resources in a single  
instruction. Coupled with many features more often seen on  
microcontrollers, this instruction set is very efficient when com-  
piling C and C++ source code. In addition, the architecture  
supports both user (algorithm/application code) and supervisor  
(O/S kernel, device drivers, debuggers, ISRs) modes of opera-  
tion, allowing multiple levels of access to core processor  
resources.  
Table 8. Booting Modes  
BMODE1–0  
Description  
00  
Executefrom16-bitexternalmemory(bypass  
boot ROM)  
01  
10  
11  
Boot from 8-bit or 16-bit flash  
Boot from SPI host slave mode  
Boot from SPI serial EEPROM (8-, 16-, or 24-bit  
address range)  
The assembly language, which takes advantage of the proces-  
sor’s unique architecture, offers the following advantages:  
• Seamlessly integrated DSP/CPU features are optimized for  
both 8-bit and 16-bit operations.  
• A multi-issue load/store modified Harvard architecture,  
which supports two 16-bit MAC or four 8-bit ALU + two  
load/store + two pointer updates per cycle.  
Rev. D  
|
Page 14 of 60  
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September 2006  
ADSP-BF533  
• All registers, I/O, and memory are mapped into a unified  
4G byte memory space, providing a simplified program-  
ming model.  
• Set conditional breakpoints on registers, memory,  
and stacks.  
• Trace instruction execution.  
• Microcontroller features, such as arbitrary bit and bit-field  
manipulation, insertion, and extraction; integer operations  
on 8-, 16-, and 32-bit data types; and separate user and  
supervisor stack pointers.  
• Perform linear or statistical profiling of program execution.  
• Fill, dump, and graphically plot the contents of memory.  
• Perform source level debugging.  
• Code density enhancements, which include intermixing of  
16-bit and 32-bit instructions (no mode switching, no code  
segregation). Frequently used instructions are encoded in  
16 bits.  
• Create custom debugger windows.  
The VisualDSP++ IDDE lets programmers define and manage  
software development. Its dialog boxes and property pages let  
programmers configure and manage all of the Blackfin develop-  
ment tools, including the color syntax highlighting in the  
VisualDSP++ editor. This capability permits programmers to:  
DEVELOPMENT TOOLS  
The ADSP-BF533 processor is supported with a complete set of  
CROSSCORE®software and hardware development tools,  
including Analog Devices emulators and VisualDSP++®devel-  
opment environment. The same emulator hardware that  
supports other Blackfin processors also fully emulates the  
ADSP-BF533 processor.  
• Control how the development tools process inputs and  
generate outputs.  
• Maintain a one-to-one correspondence with the tool’s  
command line switches.  
The VisualDSP++ kernel (VDK) incorporates scheduling and  
resource management tailored specifically to address the mem-  
ory and timing constraints of DSP programming. These  
capabilities enable engineers to develop code more effectively,  
eliminating the need to start from the very beginning, when  
developing new application code. The VDK features include  
threads, critical and unscheduled regions, semaphores, events,  
and device flags. The VDK also supports priority-based, pre-  
emptive, cooperative, and time-sliced scheduling approaches. In  
addition, the VDK was designed to be scalable. If the application  
does not use a specific feature, the support code for that feature  
is excluded from the target system.  
The VisualDSP++ project management environment lets pro-  
grammers develop and debug an application. This environment  
includes an easy to use assembler (which is based on an alge-  
braic syntax), an archiver (librarian/library builder), a linker, a  
loader, a cycle-accurate instruction level simulator, a C/C++  
compiler, and a C/C++ runtime library that includes DSP and  
mathematical functions. A key point for these tools is C/C++  
code efficiency. The compiler has been developed for efficient  
translation of C/C++ code to processor assembly. The processor  
has architectural features that improve the efficiency of com-  
piled C/C++ code.  
The VisualDSP++ debugger has a number of important fea-  
tures. Data visualization is enhanced by a plotting package that  
offers a significant level of flexibility. This graphical representa-  
tion of user data enables the programmer to quickly determine  
the performance of an algorithm. As algorithms grow in com-  
plexity, this capability can have increasing significance on the  
designer’s development schedule, increasing productivity. Sta-  
tistical profiling enables the programmer to nonintrusively poll  
the processor as it is running the program. This feature, unique  
to VisualDSP++, enables the software developer to passively  
gather important code execution metrics without interrupting  
the real-time characteristics of the program. Essentially, the  
developer can identify bottlenecks in software quickly and effi-  
ciently. By using the profiler, the programmer can focus on  
those areas in the program that impact performance and take  
corrective action.  
Because the VDK is a library, a developer can decide whether to  
use it or not. The VDK is integrated into the VisualDSP++  
development environment, but can also be used via standard  
command line tools. When the VDK is used, the development  
environment assists the developer with many error-prone tasks  
and assists in managing system resources, automating the gen-  
eration of various VDK-based objects, and visualizing the  
system state, when debugging an application that uses the VDK.  
Use the expert linker to visually manipulate the placement of  
code and data on the embedded system. View memory utiliza-  
tion in a color coded graphical form, easily move code and data  
to different areas of the processor or external memory with the  
drag of the mouse, and examine runtime stack and heap usage.  
The expert linker is fully compatible with existing linker defini-  
tion file (LDF), allowing the developer to move between the  
graphical and textual environments.  
Debugging both C/C++ and assembly programs with the  
VisualDSP++ debugger, programmers can:  
Analog Devices emulators use the IEEE 1149.1 JTAG test access  
port of the ADSP-BF533 processor to monitor and control the  
target board processor during emulation. The emulator pro-  
vides full speed emulation, allowing inspection and  
modification of memory, registers, and processor stacks. Non-  
intrusive in-circuit emulation is assured by the use of the  
processor’s JTAG interface—the emulator does not affect target  
system loading or timing.  
• View mixed C/C++ and assembly code (interleaved source  
and object information).  
• Insert breakpoints.  
CROSSCORE is a registered trademark of Analog Devices, Inc.  
VisualDSP++ is a registered trademark of Analog Devices, Inc.  
Rev. D  
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Page 15 of 60  
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September 2006  
ADSP-BF533  
In addition to the software and hardware development tools  
available from Analog Devices, third parties provide a wide  
range of tools supporting the Blackfin processor family. Hard-  
ware tools include Blackfin processor PC plug-in cards. Third  
party software tools include DSP libraries, real-time operating  
systems, and block diagram design tools.  
EZ-KIT Lite Evaluation Board  
For evaluation of ADSP-BF533 processors, use the  
ADSP-BF533 EZ-KIT Lite® board available from Analog  
Devices. Order part number ADDS-BF533-EZLITE. The board  
comes with on-chip emulation capabilities and is equipped to  
enable software development. Multiple daughter cards are  
available.  
DESIGNING AN EMULATOR-COMPATIBLE  
PROCESSOR BOARD  
The Analog Devices family of emulators are tools that every sys-  
tem developer needs to test and debug hardware and software  
systems. Analog Devices has supplied an IEEE 1149.1 JTAG test  
access port (TAP) on each JTAG processor. The emulator uses  
the TAP to access the internal features of the processor, allow-  
ing the developer to load code, set breakpoints, observe  
variables, observe memory, and examine registers. The proces-  
sor must be halted to send data and commands, but once an  
operation has been completed by the emulator, the processor  
system is set running at full speed with no impact on  
system timing.  
To use these emulators, the target board must include a header  
that connects the processor’s JTAG port to the emulator.  
For details on target board design issues including mechanical  
layout, single processor connections, multiprocessor scan  
chains, signal buffering, signal termination, and emulator pod  
logic, see the EE-68: Analog Devices JTAG Emulation Technical  
Reference on the Analog Devices website (www.analog.com)—  
use site search on “EE-68.” This document is updated regularly  
to keep pace with improvements to emulator support.  
RELATED DOCUMENTS  
The following publications that describe the ADSP-BF533 pro-  
cessors (and related processors) can be ordered from any  
Analog Devices sales office or accessed electronically on our  
website:  
Getting Started With Blackfin Processors  
ADSP-BF533 Blackfin Processor Hardware Reference  
ADSP-BF53x/BF56x Blackfin Processor Programming  
Reference  
ADSP-BF533 Blackfin Processor Anomaly List  
Rev. D  
|
Page 16 of 60 | September 2006  
ADSP-BF533  
PIN DESCRIPTIONS  
ADSP-BF533 processor pin definitions are listed in Table 9.  
In order to maintain maximum functionality and reduce pack-  
age size and pin count, some pins have dual, multiplexed  
functionality. In cases where pin functionality is reconfigurable,  
the default state is shown in plain text, while alternate function-  
ality is shown in italics.  
All pins are three-stated during and immediately after reset,  
except the memory interface, asynchronous memory control,  
and synchronous memory control pins, which are driven high.  
If BR is active, then the memory pins are also three-stated. All  
unused I/O pins have their input buffers disabled with the  
exception of the pins that need pull-ups or pull-downs as noted  
in the table footnotes.  
Table 9. Pin Descriptions  
Driver  
Pin Name  
Type Function  
Type1 Pull-Up/Down Requirement  
Memory Interface  
ADDR19–1  
O
Address Bus for Async/Sync Access  
A
A
None  
DATA15–0  
I/O Data Bus for Async/Sync Access  
None  
ABE1–0/SDQM1–0  
O
I
Byte Enables/Data Masks for Async/Sync Access A  
None  
BR  
Bus Request  
Bus Grant  
Pull-up Required If Function Not Used  
BG  
O
O
A
A
None  
None  
BGH  
Bus Grant Hang  
Asynchronous Memory Control  
AMS3–0  
O
I
Bank Select  
A
None  
ARDY  
Hardware Ready Control  
Output Enable  
Read Enable  
Pull-up Required If Function Not Used  
AOE  
O
O
O
A
A
A
None  
None  
None  
ARE  
AWE  
Write Enable  
Synchronous Memory Control  
SRAS  
SCAS  
O
O
O
O
O
O
O
Row Address Strobe  
Column Address Strobe  
Write Enable  
A
A
A
A
B
None  
None  
None  
None  
None  
None  
None  
SWE  
SCKE  
Clock Enable  
CLKOUT  
SA10  
Clock Output  
A10 Pin  
A
A
SMS  
Bank Select  
Timers  
TMR0  
I/O Timer 0  
C
C
C
None  
None  
None  
TMR1/PPI_FS1  
TMR2/PPI_FS2  
I/O Timer 1/PPI Frame Sync1  
I/O Timer 2/PPI Frame Sync2  
Rev. D  
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Page 17 of 60 | September 2006  
ADSP-BF533  
Table 9. Pin Descriptions (Continued)  
Driver  
Pin Name  
Type Function  
Type1 Pull-Up/Down Requirement  
Parallel Peripheral Interface Port/GPIO  
PF0/SPISS  
I/O Programmable Flag 0/SPI Slave Select Input  
C
C
None  
None  
PF1/SPISEL1/TMRCLK  
I/O Programmable Flag 1/SPI Slave Select  
Enable 1/External Timer Reference  
PF2/SPISEL2  
I/O Programmable Flag 2/SPI Slave Select Enable 2  
C
C
None  
None  
PF3/SPISEL3/PPI_FS3  
I/O Programmable Flag 3/SPI Slave Select  
Enable 3/PPI Frame Sync 3  
PF4/SPISEL4/PPI15  
PF5/SPISEL5/PPI14  
PF6/SPISEL6/PPI13  
PF7/SPISEL7/PPI12  
I/O Programmable Flag 4/SPI Slave Select  
C
C
C
C
None  
None  
None  
None  
Enable 4/PPI 15  
I/O Programmable Flag 5/SPI Slave Select  
Enable 5/PPI 14  
I/O Programmable Flag 6/SPI Slave Select  
Enable 6/PPI 13  
I/O Programmable Flag 7/SPI Slave Select  
Enable 7/PPI 12  
PF8/PPI11  
PF9/PPI10  
PF10/PPI9  
PF11/PPI8  
PF12/PPI7  
PF13/PPI6  
PF14/PPI5  
PF15/PPI4  
PPI3–0  
I/O Programmable Flag 8/PPI 11  
I/O Programmable Flag 9/PPI 10  
I/O Programmable Flag 10/PPI 9  
I/O Programmable Flag 11/PPI 8  
I/O Programmable Flag 12/PPI 7  
I/O Programmable Flag 13/PPI 6  
I/O Programmable Flag 14/PPI 5  
I/O Programmable Flag 15/PPI 4  
I/O PPI3–0  
C
C
C
C
C
C
C
C
C
C
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
PPI_CLK  
JTAG Port  
TCK  
I
PPI Clock  
I
JTAG Clock  
Internal Pull-down  
None  
TDO  
O
I
JTAG Serial Data Out  
JTAG Serial Data In  
JTAG Mode Select  
JTAG Reset  
C
TDI  
Internal Pull-down  
Internal Pull-down  
External Pull-down If JTAG Not Used  
None  
TMS  
I
TRST  
I
EMU  
O
Emulation Output  
C
SPI Port  
MOSI  
I/O Master Out Slave In  
I/O Master In Slave Out  
C
C
None  
MISO  
Pull HIGH Through a 4.7 kΩ Resistor  
if Booting via the SPI Port.  
SCK  
I/O SPI Clock  
D
None  
Rev. D  
|
Page 18 of 60 | September 2006  
ADSP-BF533  
Table 9. Pin Descriptions (Continued)  
Driver  
Type1 Pull-Up/Down Requirement  
Pin Name  
Serial Ports  
RSCLK0  
RFS0  
Type Function  
I/O SPORT0 Receive Serial Clock  
I/O SPORT0 Receive Frame Sync  
D
C
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
DR0PRI  
DR0SEC  
TSCLK0  
TFS0  
I
I
SPORT0 Receive Data Primary  
SPORT0 Receive Data Secondary  
I/O SPORT0 Transmit Serial Clock  
I/O SPORT0 Transmit Frame Sync  
D
C
C
C
D
C
DT0PRI  
DT0SEC  
RSCLK1  
RFS1  
O
O
SPORT0 Transmit Data Primary  
SPORT0 Transmit Data Secondary  
I/O SPORT1 Receive Serial Clock  
I/O SPORT1 Receive Frame Sync  
DR1PRI  
DR1SEC  
TSCLK1  
TFS1  
I
I
SPORT1 Receive Data Primary  
SPORT1 Receive Data Secondary  
I/O SPORT1 Transmit Serial Clock  
I/O SPORT1 Transmit Frame Sync  
D
C
C
C
DT1PRI  
DT1SEC  
UART Port  
RX  
O
O
SPORT1 Transmit Data Primary  
SPORT1 Transmit Data Secondary  
I
UART Receive  
UART Transmit  
None  
None  
TX  
O
C
Real-Time Clock  
RTXI  
I
RTC Crystal Input  
Pull LOW when not used  
N/A  
RTXO  
O
RTC Crystal Output  
Clock  
CLKIN  
I
Clock/Crystal Input  
Crystal Output  
Needs to be at a Level or Clocking  
None  
XTAL  
O
Mode Controls  
RESET  
I
I
I
Reset  
Always Active if Core Power On  
Pull LOW when not used  
NMI  
Nonmaskable Interrupt  
Boot Mode Strap  
BMODE1–0  
Voltage Regulator  
VROUT1–0  
Supplies  
VDDEXT  
Pull-up or Pull-down Required  
O
External FET Drive  
N/A  
P
P
P
G
I/O Power Supply  
N/A  
N/A  
N/A  
N/A  
VDDINT  
Core Power Supply  
Real-Time Clock Power Supply  
External Ground  
VDDRTC  
GND  
1 Refer to Figure 27 on Page 43 to Figure 38 on Page 44.  
Rev. D  
|
Page 19 of 60 | September 2006  
ADSP-BF533  
SPECIFICATIONS  
Component specifications are subject to change  
without notice.  
OPERATING CONDITIONS  
Parameter  
Conditions  
Min Nom  
0.8 1.2  
0.95 1.2  
Max Unit  
VDDINT Internal Supply Voltage1, 2  
VDDINT Internal Supply Voltage1, 3  
VDDEXT External Supply Voltage2  
VDDEXT External Supply Voltage3, 4  
1.32  
1.32  
V
V
V
V
V
1.75 1.8/2.5/3.3 3.6  
2.7 3.3 3.6  
1.75 1.8/2.5/3.3 3.6  
VDDRTC Real-Time Clock  
Power Supply Voltage2  
VDDRTC Real-Time Clock  
Power Supply Voltage3, 4  
2.7 3.3  
3.6  
V
VIH  
VIH  
High Level Input Voltage5, 6 VDDEXT =1.85 V  
High Level Input Voltage5, 6 VDDEXT =Maximum  
VDDEXT =Maximum  
Low Level Input Voltage5, 8 VDDEXT =1.75 V  
Low Level Input Voltage5, 8 VDDEXT =2.25 V  
1.3  
1.85  
3.6  
V
V
V
V
V
2.0  
VIHCLKIN High Level Input Voltage7  
2.2  
3.6  
VIL  
VIL  
TJ  
TJ  
TJ  
–0.3  
–0.3  
+0.3  
+0.6  
Junction Temperature  
Junction Temperature  
Junction Temperature  
160-Ball Chip Scale Ball Grid Array (Mini-BGA) @ TAMBIENT = –40°C to +85°C –40  
+105 °C  
+105 °C  
+105 °C  
160-Ball Chip Scale Ball Grid Array (Mini-BGA) @ TAMBIENT = 0°C to +70°C  
169-Ball Plastic Ball Grid Array (PBGA) @ TAMBIENT = –40°C to +85°C  
0
–40  
1 The regulator can generate VDDINT at levels of 0.85 V to 1.15 V with –5 % to +10 % tolerance except at 1.2 V with 0% to 10% tolerance. To run the ADSP-BF533 at 500 MHz  
or 600 MHz, VDDINT must be in an operating range of 1.2 V to 1.32 V.  
2 Nonautomotive grade parts, see Ordering Guide on Page 58.  
3 Automotive grade parts, see Ordering Guide on Page 58.  
4 Automotive grade parts in 169-Ball Plastic Ball Grid Array (PBGA) package, see Ordering Guide on Page 58.  
5 The ADSP-BF533 processors are 3.3 V tolerant (always accepts up to 3.6 V maximum VIH), but voltage compliance (on outputs, VOH) depends on the input VDDEXT, because  
VOH (maximum) approximately equals VDDEXT (maximum). This 3.3 V tolerance applies to bidirectional pins (DATA15–0, TMR2–0, PF15–0, PPI3–0, RSCLK1–0, TSCLK1–0,  
RFS1–0, TFS1–0, MOSI, MISO, SCK) and input only pins (BR, ARDY, PPI_CLK, DR0PRI, DR0SEC, DR1PRI, DR1SEC, RX, RTXI, TCK, TDI, TMS, TRST, CLKIN, RESET,  
NMI, and BMODE1–0).  
6 Parameter value applies to all input and bidirectional pins except CLKIN.  
7 Parameter value applies to CLKIN pin only.  
8 Parameter value applies to all input and bidirectional pins.  
Rev. D  
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Page 20 of 60 | September 2006  
ADSP-BF533  
ELECTRICAL CHARACTERISTICS  
Parameter  
Test Conditions  
Min Typical  
Max  
Unit  
V
VOH  
VOH  
VOH  
VOL  
VOL  
IIH  
High Level Output Voltage1  
High Level Output Voltage1  
High Level Output Voltage1  
Low Level Output Voltage1  
Low Level Output Voltage1  
High Level Input Current2  
High Level Input Current JTAG3  
Low Level Input Current2  
@ VDDEXT = +1.75 V, IOH = –0.5 mA  
@ VDDEXT = +2.25 V, IOH = –0.5 mA  
@ VDDEXT = +3.0 V, IOH = –0.5 mA  
1.5  
1.9  
2.4  
V
V
@ VDDEXT = 1.75 V, IOL = 2.0 mA  
0.2  
V
@ VDDEXT = 2.25 V/3.0 V, IOL = 2.0 mA  
@ VDDEXT = Maximum, VIN = VDD Maximum  
@ VDDEXT = Maximum, VIN = VDD Maximum  
@ VDDEXT = Maximum, VIN = 0 V  
0.4  
V
10.0  
50.0  
10.0  
10.0  
10.0  
87  
μA  
μA  
μA  
μA  
μA  
pF  
μA  
mA  
mA  
mA  
mA  
mA  
μA  
IIHP  
4
IIL  
IOZH  
Three-State Leakage Current5  
Three-State Leakage Current5  
Input Capacitance6  
@ VDDEXT = Maximum, VIN = VDD Maximum  
@ VDDEXT = Maximum, VIN = 0 V  
4
IOZL  
CIN  
fIN = 1 MHz, TAMBIENT = 25°C, VIN = 2.5 V  
VDDEXT = 3.65 V with voltage regulator off (VDDINT = 0 V)  
VDDINT = 0.8 V, TJUNCTION = 25°C  
4
IDDHIBERNATE  
VDDINT Current in Hibernate Mode  
VDDINT Current in Deep Sleep Mode  
VDDINT Current in Sleep Mode  
VDDINT Current Dissipation (Typical)  
VDDINT Current Dissipation (Typical)  
VDDINT Current Dissipation (Typical)  
VDDRTC Current  
50  
8
IDDDEEPSLEEP  
35  
IDDSLEEP  
VDDINT = 0.8 V, TJUNCTION = 25°C  
37.5  
47  
8, 9  
IDD  
VDDINT = 0.8 V, fIN = 50 MHz, TJUNCTION = 25°C  
VDDINT = 1.2 V, fIN = 500 MHz, TJUNCTION = 25°C  
VDDINT = 1.2 V, fIN = 600 MHz, TJUNCTION = 25°C  
VDDRTC = 3.3 V, TJUNCTION = 25°C  
_
_
_
TYP  
TYP  
TYP  
8, 9  
8, 9  
IDD  
IDD  
240  
270  
20  
IDDRTC  
1 Applies to output and bidirectional pins.  
2 Applies to input pins except JTAG inputs.  
3 Applies to JTAG input pins (TCK, TDI, TMS, TRST).  
4 Absolute value.  
5 Applies to three-statable pins.  
6 Applies to all signal pins.  
7 Guaranteed, but not tested.  
8 See Power Dissipation on Page 45.  
9 Processor executing 75% dual MAC, 25% ADD with moderate data bus activity.  
Rev. D  
|
Page 21 of 60 | September 2006  
ADSP-BF533  
ABSOLUTE MAXIMUM RATINGS  
PACKAGE INFORMATION  
Stresses greater than those listed in the table may cause perma-  
nent damage to the device. These are stress ratings only.  
Functional operation of the device at these or any other condi-  
tions greater than those indicated in the operational sections of  
this specification is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device  
reliability.  
The information presented in Figure 8 and Table 11 provides  
information about how to read the package brand and relate it  
to specific product features. For a complete listing of product  
offerings, see the Ordering Guide on Page 58.  
a
ADSP-BF533  
Parameter  
Rating  
tppZ-cc  
Internal (Core) Supply Voltage (VDDINT  
)
–0.3 V to +1.4 V  
–0.5 V to +3.8 V  
–0.5 V to +3.8 V  
–0.5 V to VDDEXT +0.5 V  
200 pF  
vvvvvv.x n.n  
yyww country_of_origin  
External (I/O) Supply Voltage (VDDEXT  
Input Voltage1  
)
B
Output Voltage Swing  
Figure 8. Product Information on Package  
Load Capacitance  
Storage Temperature Range  
Junction Temperature Under Bias  
–65°C to +150°C  
125°C  
Table 11. Package Brand Information  
Brand Key  
Field Description  
Temperature Range  
Package Type  
1 Applies to 100% transient duty cycle. For other duty cycles see Table 10.  
t
Table 10. Maximum Duty Cycle for Input Transient Voltage1  
pp  
Z
Lead Free Option (Optional)  
See Ordering Guide  
Assembly Lot Code  
Silicon Revision  
VIN Min (V)  
–0.50  
VIN Max (V)  
+3.80  
Maximum Duty Cycle  
ccc  
100%  
40%  
25%  
15%  
10%  
vvvvvv.x  
n.n  
–0.70  
+4.00  
–0.80  
+4.10  
yyww  
Date Code  
–0.90  
+4.20  
–1.00  
+4.30  
1 Applies to all signal pins with the exception of CLKIN, XTAL, VROUT1–0.  
ESD SENSITIVITY  
CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily  
accumulate on the human body and test equipment and can discharge without detection. Although  
the ADSP-BF533 processor features proprietary ESD protection circuitry, permanent damage may  
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions  
are recommended to avoid performance degradation or loss of functionality.  
Rev. D  
|
Page 22 of 60 | September 2006  
ADSP-BF533  
TIMING SPECIFICATIONS  
Table 12 through Table 15 describe the timing requirements for  
the ADSP-BF533 processor clocks. Take care in selecting MSEL,  
SSEL, and CSEL ratios so as not to exceed the maximum core  
clock and system clock as described in Absolute Maximum  
Ratings on Page 22, and the voltage controlled oscillator (VCO)  
operating frequencies described in Table 14. Table 14 describes  
phase-locked loop operating conditions.  
Table 12. Core Clock Requirements—ADSP-BF533SKBC600 and ADSP-BF533SKBCZ600  
Parameter  
Min  
1.67  
2.10  
2.35  
2.66  
4.00  
Max  
Unit  
ns  
tCCLK  
tCCLK  
tCCLK  
tCCLK  
tCCLK  
Core Cycle Period (VDDINT =1.2 V Minimum)  
Core Cycle Period (VDDINT =1.045 V Minimum)  
Core Cycle Period (VDDINT =0.95 V Minimum)  
Core Cycle Period (VDDINT =0.85 V Minimum)  
Core Cycle Period (VDDINT =0.8 V )  
ns  
ns  
ns  
ns  
Table 13. Core Clock Requirements—  
ADSP-BF533SBBC500/ADSP-BF533SBBCZ500/ADSP-BF533WBBCZ-5A  
and ADSP-BF533SBB500/ADSP-BF533SBBZ500/ADSP-BF533WBBZ-5A  
Parameter  
Min  
2.00  
2.25  
2.50  
3.00  
4.00  
Max  
Unit  
ns  
tCCLK  
tCCLK  
tCCLK  
tCCLK  
tCCLK  
Core Cycle Period (VDDINT =1.2 V Minimum)  
Core Cycle Period (VDDINT =1.045 V Minimum)  
Core Cycle Period (VDDINT =0.95 V Minimum)  
Core Cycle Period (VDDINT =0.85 V Minimum)  
Core Cycle Period (VDDINT =0.8 V )  
ns  
ns  
ns  
ns  
Table 14. Phase-Locked Loop Operating Conditions  
Parameter  
Min  
Max  
Unit  
fVCO  
Voltage Controlled Oscillator (VCO) Frequency  
50  
Maximum fCCLK  
MHz  
Table 15. Maximum SCLK Conditions  
Parameter1  
VDDEXT = 1.8 V VDDEXT = 2.5 V VDDEXT = 3.3 V Unit  
fSCLK  
CLKOUT/SCLK Frequency (VDDINT 1.14 V)  
100  
100  
133  
100  
133  
100  
MHz  
MHz  
fSCLK  
CLKOUT/SCLK Frequency (VDDINT < 1.14 V)  
1 tSCLK (= 1/fSCLK) must be greater than or equal to tCCLK  
.
Rev. D  
|
Page 23 of 60  
|
September 2006  
ADSP-BF533  
Clock and Reset Timing  
Table 16 and Figure 9 describe clock and reset operations. Per  
Absolute Maximum Ratings on Page 22, combinations of  
CLKIN and clock multipliers must not select core/peripheral  
clocks in excess of 600 MHz/133 MHz.  
Table 16. Clock and Reset Timing  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
tCKIN  
CLKIN Period  
25.0  
100.01  
ns  
ns  
ns  
ns  
tCKINL  
tCKINH  
tWRST  
CLKIN Low Pulse2  
CLKIN High Pulse1  
RESET Asserted Pulse Width Low3  
10.0  
10.0  
11 × tCKIN  
1 If DF bit in PLL_CTL register is set, then the maximum tCKIN period is 50 ns.  
2 Applies to bypass mode and nonbypass mode.  
3 Applies after power-up sequence is complete. At power-up, the processor’s internal phase-locked loop requires no more than 2,000 CLKIN cycles, while RESET is asserted,  
assuming stable power supplies and CLKIN (not including start-up time of external clock oscillator).  
tCKIN  
CLKIN  
tCKINL  
tCKINH  
tWRST  
RESET  
Figure 9. Clock and Reset Timing  
Rev. D  
|
Page 24 of 60 | September 2006  
ADSP-BF533  
Asynchronous Memory Read Cycle Timing  
Table 17. Asynchronous Memory Read Cycle Timing  
VDDEXT = 1.8 V  
VDDEXT = 2.5 V/3.3 V  
Max  
Parameter  
Min  
Max  
Min  
Unit  
Timing Requirements  
tSDAT  
DATA15–0 Setup Before CLKOUT  
DATA15–0 Hold After CLKOUT  
ARDY Setup Before CLKOUT  
ARDY Hold After CLKOUT  
2.1  
1.0  
4.0  
1.0  
2.1  
0.8  
4.0  
0.0  
ns  
ns  
ns  
ns  
tHDAT  
tSARDY  
tHARDY  
Switching Characteristics  
tDO  
tHO  
Output Delay After CLKOUT1  
Output Hold After CLKOUT 1  
6.0  
6.0  
ns  
ns  
1.0  
0.8  
1 Output pins include AMS3–0, ABE1–0, ADDR19–1, DATA15–0, AOE, ARE.  
HOLD  
1 CYCLE  
SETUP  
2 CYCLES  
PROGRAMMED READ ACCESS  
4 CYCLES  
ACCESS EXTENDED  
3 CYCLES  
CLKOUT  
tDO  
tHO  
AMSx  
ABE1–0  
ABE, ADDRESS  
ADDR19–1  
AOE  
tDO  
tHO  
ARE  
tHARDY  
tSARDY  
tHARDY  
ARDY  
tSARDY  
tSDAT  
tHDAT  
DATA15–0  
READ  
Figure 10. Asynchronous Memory Read Cycle Timing  
Rev. D  
|
Page 25 of 60 | September 2006  
ADSP-BF533  
Asynchronous Memory Write Cycle Timing  
Table 18. Asynchronous Memory Write Cycle Timing  
VDDEXT = 1.8 V  
Max  
VDDEXT = 2.5 V/3.3 V  
Max  
Parameter  
Min  
Min  
Unit  
Timing Requirements  
tSARDY  
tHARDY  
ARDY Setup Before CLKOUT  
ARDY Hold After CLKOUT  
4.0  
1.0  
4.0  
0.0  
ns  
ns  
Switching Characteristics  
tDDAT  
tENDAT  
tDO  
DATA15–0 Disable After CLKOUT  
6.0  
6.0  
6.0  
6.0  
ns  
ns  
ns  
ns  
DATA15–0 Enable After CLKOUT  
Output Delay After CLKOUT1  
Output Hold After CLKOUT 1  
1.0  
1.0  
1.0  
0.8  
tHO  
1 Output pins include AMS3–0, ABE1–0, ADDR19–1, DATA15–0, AOE, AWE.  
ACCESS  
EXTENDED  
1 CYCLE  
SETUP  
2 CYCLES  
HOLD  
1 CYCLE  
PROGRAMMED WRITE  
ACCESS 2 CYCLES  
CLKOUT  
AMSx  
tDO  
tHO  
ABE1–0  
ABE, ADDRESS  
ADDR19–1  
tDO  
tHO  
AWE  
tHARDY  
tSARDY  
ARDY  
tSARDY  
tENDAT  
tDDAT  
DATA15–0  
WRITE DATA  
Figure 11. Asynchronous Memory Write Cycle Timing  
Rev. D  
|
Page 26 of 60 | September 2006  
ADSP-BF533  
SDRAM Interface Timing  
Table 19. SDRAM Interface Timing  
VDDEXT = 1.8 V  
Max  
VDDEXT = 2.5 V/3.3 V  
Max  
Parameter  
Min  
Min  
Unit  
Timing Requirements  
tSSDAT  
tHSDAT  
DATA Setup Before CLKOUT  
DATA Hold After CLKOUT  
2.1  
0.0  
1.5  
0.8  
ns  
ns  
Switching Characteristics  
tSCLK  
CLKOUT Period1  
10.0  
2.5  
7.5  
2.5  
2.5  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tSCLKH  
tSCLKL  
tDCAD  
tHCAD  
tDSDAT  
CLKOUT Width High  
CLKOUT Width Low  
2.5  
Command, ADDR, Data Delay After CLKOUT2  
Command, ADDR, Data Hold After CLKOUT1  
Data Disable After CLKOUT  
6.0  
6.0  
4.0  
4.0  
1.0  
1.0  
1.0  
1.0  
tENSDAT Data Enable After CLKOUT  
1 Refer to Table 15 on Page 23 for maximum fSCLK at various VDDINT  
.
2 Command pins include: SRAS, SCAS, SWE, SDQM, SMS, SA10, SCKE.  
tSCLK  
tSCLKH  
CLKOUT  
tSSDAT  
tSCLKL  
tHSDAT  
DATA(IN)  
tDCAD  
tDSDAT  
tENSDAT  
tHCAD  
DATA(OUT)  
tDCAD  
CMND ADDR  
(OUT)  
tHCAD  
NOTE: COMMAND = SRAS, SCAS, SWE, SDQM, SMS, SA10, SCKE.  
Figure 12. SDRAM Interface Timing  
Rev. D  
|
Page 27 of 60 | September 2006  
ADSP-BF533  
External Port Bus Request and Grant Cycle Timing  
Table 20 and Figure 13 describe external port bus request and  
bus grant operations.  
Table 20. External Port Bus Request and Grant Cycle Timing  
VDDEXT = 1.8 V  
Max  
VDDEXT = 2.5 V/3.3 V  
Max  
Parameter  
Min  
Min  
Unit  
Timing Requirements  
tBS BR Asserted to CLKOUT High Setup  
tBH CLKOUT High to BR Deasserted Hold Time  
Switching Characteristics  
4.6  
1.0  
4.6  
0.0  
ns  
ns  
tSD CLKOUT Low to xMS, Address, and RD/WR Disable  
tSE CLKOUT Low to xSMS, Address, and RD/WR Enable  
tDBG CLKOUT High to BG High Setup  
tEBG CLKOUT High to BG Deasserted Hold Time  
tDBH CLKOUT High to BGH High Setup  
tEBH CLKOUT High to BGH Deasserted Hold Time  
4.5  
4.5  
4.6  
4.6  
4.6  
4.6  
4.5  
4.5  
3.6  
3.6  
3.6  
3.6  
ns  
ns  
ns  
ns  
ns  
ns  
CLKOUT  
tBH  
tBS  
BR  
tSD  
tSE  
AMSx  
tSD  
tSE  
ADDR19-1  
ABE1-0  
tSD  
tSE  
AWE  
ARE  
tDBG  
tEBG  
BG  
tDBH  
tEBH  
BGH  
Figure 13. External Port Bus Request and Grant Cycle Timing  
Rev. D  
|
Page 28 of 60 | September 2006  
ADSP-BF533  
Parallel Peripheral Interface Timing  
Table 21 and Figure 14 on Page 29 through Figure 17 on  
Page 31 describe parallel peripheral interface operations.  
Table 21. Parallel Peripheral Interface Timing  
VDDEXT = 1.8 V  
Max  
VDDEXT = 2.5 V/3.3 V  
Max  
Parameter  
Min  
Min  
Unit  
Timing Requirements  
tPCLKW PPI_CLK Width  
6.0  
6.0  
ns  
ns  
ns  
tPCLK  
PPI_CLK Period1  
15.0  
6.0  
15.0  
4.0  
tSFSPE External Frame Sync Setup Before PPI_CLK Edge  
(Nonsampling Edge for Rx, Sampling Edge for Tx)  
tHFSPE External Frame Sync Hold After PPI_CLK  
tSDRPE Receive Data Setup Before PPI_CLK  
tHDRPE Receive Data Hold After PPI_CLK  
1.0  
3.5  
1.5  
1.0  
3.5  
1.5  
ns  
ns  
ns  
Switching Characteristics—GP Output and Frame Capture Modes  
tDFSPE Internal Frame Sync Delay After PPI_CLK  
tHOFSPE Internal Frame Sync Hold After PPI_CLK  
tDDTPE Transmit Data Delay After PPI_CLK  
tHDTPE Transmit Data Hold After PPI_CLK  
1 PPI_CLK frequency cannot exceed fSCLK/2  
8.0  
9.0  
8.0  
9.0  
ns  
ns  
ns  
ns  
1.7  
1.8  
1.7  
1.8  
FRAME  
DATA0  
IS  
SAMPLED  
SYNC IS  
DRIVEN  
OUT  
POLC = 0  
PPI_CLK  
PPI_CLK  
POLC = 1  
t
DFSPE  
t
HOFSPE  
POLS = 1  
POLS = 0  
PPI_FS1  
POLS = 1  
POLS = 0  
PPI_FS2  
t
t
SDRPE  
HDRPE  
PPI_DATA  
Figure 14. PPI GP Rx Mode with Internal Frame Sync Timing  
Rev. D  
|
Page 29 of 60 | September 2006  
ADSP-BF533  
FRAME  
SYNC IS  
SAMPLED  
FOR  
DATA0 IS  
DATA1 IS  
SAMPLED  
DATA0  
SAMPLED  
PPI_CLK  
POLC = 0  
PPI_CLK  
POLC = 1  
t
HFSPE  
t
SFSPE  
POLS = 1  
PPI_FS1  
POLS = 0  
POLS = 1  
PPI_FS2  
POLS = 0  
t
t
SDRPE  
HDRPE  
PPI_DATA  
Figure 15. PPI GP Rx Mode with External Frame Sync Timing  
FRAME  
SYNC IS  
SAMPLED  
DATA0 IS  
DRIVEN  
OUT  
PPI_CLK  
POLC = 0  
PPI_CLK  
POLC = 1  
t
HFSPE  
t
SFSPE  
POLS = 1  
PPI_FS1  
POLS = 0  
POLS = 1  
PPI_FS2  
POLS = 0  
t
HDTPE  
PPI_DATA  
DATA0  
t
DDTPE  
Figure 16. PPI GP Tx Mode with External Frame Sync Timing  
Rev. D  
|
Page 30 of 60 | September 2006  
ADSP-BF533  
FRAME  
SYNC IS  
DRIVEN  
OUT  
DATA0 IS  
DRIVEN  
OUT  
PPI_CLK  
POLC = 0  
PPI_CLK  
POLC = 1  
t
DFSPE  
t
HOFSPE  
POLS = 1  
POLS = 0  
PPI_FS1  
PPI_FS2  
POLS = 1  
POLS = 0  
t
DDTPE  
t
HDTPE  
PPI_DATA  
DATA0  
Figure 17. PPI GP Tx Mode with Internal Frame Sync Timing  
Rev. D  
|
Page 31 of 60 | September 2006  
ADSP-BF533  
Serial Ports  
Table 22 on Page 32 through Table 25 on Page 33 and Figure 18  
on Page 34 through Figure 20 on Page 36 describe Serial Port  
operations.  
Table 22. Serial Ports—External Clock  
VDDEXT = 1.8 V  
Max  
VDDEXT = 2.5 V/3.3 V  
Max  
Parameter  
Min  
Min  
Unit  
Timing Requirements  
tSFSE TFS/RFS Setup Before TSCLK/RSCLK1  
tHFSE TFS/RFS Hold After TSCLK/RSCLK1  
tSDRE Receive Data Setup Before RSCLK1  
tHDRE Receive Data Hold After RSCLK1  
tSCLKEW TSCLK/RSCLK Width  
3.0  
3.0  
3.0  
3.0  
4.5  
15.0  
3.0  
3.0  
3.0  
3.0  
4.5  
15.0  
ns  
ns  
ns  
ns  
ns  
ns  
tSCLKE TSCLK/RSCLK Period  
Switching Characteristics  
tDFSE TFS/RFS Delay After TSCLK/RSCLK (Internally Generated TFS/RFS)2  
tHOFSE TFS/RFS Hold After TSCLK/RSCLK (Internally Generated TFS/RFS)1 0.0  
tDDTE Transmit Data Delay After TSCLK1  
10.0  
10.0  
10.0  
10.0  
ns  
ns  
ns  
ns  
0.0  
0.0  
tHDTE Transmit Data Hold After TSCLK1  
0.0  
1 Referenced to sample edge.  
2 Referenced to drive edge.  
Table 23. Serial Ports—Internal Clock  
VDDEXT = 1.8 V  
Max  
VDDEXT = 2.5 V/3.3 V  
Max  
Parameter  
Min  
Min  
Unit  
Timing Requirements  
tSFSI TFS/RFS Setup Before TSCLK/RSCLK1  
tHFSI TFS/RFS Hold After TSCLK/RSCLK1  
tSDRI Receive Data Setup Before RSCLK1  
tHDRI Receive Data Hold After RSCLK1  
tSCLKEW TSCLK/RSCLK Width  
11.0  
2.0  
9.0  
9.0  
ns  
ns  
ns  
ns  
ns  
ns  
2.0  
9.0  
0.0  
0.0  
4.5  
4.5  
tSCLKE TSCLK/RSCLK Period  
15.0  
15.0  
Switching Characteristics  
tDFSI TFS/RFS Delay After TSCLK/RSCLK (Internally Generated TFS/RFS)2  
tHOFSI TFS/RFS Hold After TSCLK/RSCLK (Internally Generated TFS/RFS)1 1.0  
tDDTI Transmit Data Delay After TSCLK1  
tHDTI Transmit Data Hold After TSCLK1  
3.0  
3.0  
3.0  
3.0  
ns  
ns  
ns  
ns  
ns  
1.0  
2.0  
2.0  
tSCLKIW TSCLK/RSCLK Width  
4.5  
4.5  
1 Referenced to sample edge.  
2 Referenced to drive edge.  
Rev. D  
|
Page 32 of 60 | September 2006  
ADSP-BF533  
Table 24. Serial Ports—Enable and Three-State  
VDDEXT = 1.8 V  
Max  
VDDEXT = 2.5 V/3.3 V  
Max  
Parameter  
Min  
0
Min  
0
Unit  
Switching Characteristics  
tDTENE Data Enable Delay from External TSCLK1  
tDDTTE Data Disable Delay from External TSCLK1  
ns  
ns  
ns  
ns  
10.0  
3.0  
10.0  
3.0  
tDTENI  
Data Enable Delay from Internal TSCLK1  
Data Disable Delay from Internal TSCLK1  
2.0  
2.0  
tDDTTI  
1 Referenced to drive edge.  
Table 25. External Late Frame Sync  
VDDEXT = 1.8 V  
VDDEXT = 2.5 V/3.3 V  
Max  
Parameter  
Min  
Max  
Min  
Unit  
Switching Characteristics  
t
t
DDTLFSE Data Delay from Late External TFS or External RFS with MCE = 1, MFD = 01, 2  
DTENLFS Data Enable from Late FS or MCE = 1, MFD = 01, 2  
10.0  
10.0  
ns  
ns  
0
0
1 MCE = 1, TFS enable and TFS valid follow tDTENLFS and tDDTLFSE  
.
2 If external RFS/TFS setup to RSCLK/TSCLK > tSCLKE/2, then tDDTE I and tDTENE I apply; otherwise tDDTLFSE and tDTENLFS apply.  
/
/
Rev. D  
|
Page 33 of 60 | September 2006  
ADSP-BF533  
DATA RECEIVE—INTERNAL CLOCK  
DATA RECEIVE—EXTERNAL CLOCK  
DRIVE  
EDGE  
SAMPLE  
EDGE  
DRIVE  
EDGE  
SAMPLE  
EDGE  
tSCLKIW  
tSCLKEW  
RSCLK  
RSCLK  
tDFSE  
tDFSE  
tHOFSE  
RFS  
tSFSI  
tHFSI  
tHOFSE  
tSFSE  
tHFSE  
RFS  
tSDRI  
tHDRI  
tSDRE  
tHDRE  
DR  
DR  
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF RCLK OR TCLK CAN BE USED AS THE ACTIVE SAMPLING EDGE.  
DATA TRANSMIT—INTERNAL CLOCK  
DATA TRANSMIT—EXTERNAL CLOCK  
DRIVE  
EDGE  
SAMPLE  
EDGE  
DRIVE  
EDGE  
SAMPLE  
EDGE  
tSCLKIW  
tSCLKEW  
TSCLK  
TSCLK  
tDFSI  
tDFSE  
tHOFSI  
tSFSI  
tHFSI  
tHOFSE  
tSFSE  
tHFSE  
TFS  
DT  
TFS  
tDDTI  
tDDTE  
tHDTI  
tHDTE  
DT  
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF RCLK OR TCLK CAN BE USED AS THE ACTIVE SAMPLING EDGE.  
DRIVE  
EDGE  
DRIVE  
EDGE  
TSCLK (EXT)  
TFS ("LATE", EXT.)  
TSCLK / RSCLK  
tDDTTE  
tDTENE  
DT  
DRIVE  
EDGE  
DRIVE  
EDGE  
TSCLK (INT)  
TFS ("LATE", INT.)  
TSCLK / RSCLK  
tDTENI  
tDDTTI  
DT  
Figure 18. Serial Ports  
Rev. D  
|
Page 34 of 60 | September 2006  
ADSP-BF533  
EXTERNAL RFS WITH MCE = 1, MFD = 0  
DRIVE SAMPLE  
DRIVE  
RSCLK  
tHOFSE/I  
tSFSE/I  
RFS  
tDDTE/I  
tDTENLFS  
1ST BIT  
tDDTLFSE  
tHDTE/I  
2ND BIT  
DT  
LATE EXTERNAL TFS  
DRIVE  
SAMPLE  
DRIVE  
TSCLK  
tSFSE/I  
tHOFSE/I  
TFS  
tDDTE/I  
tDTENLFS  
1ST BIT  
tDDTLFSE  
tHDTE/I  
DT  
2ND BIT  
Figure 19. External Late Frame Sync (Frame Sync Setup < tSCLKE/2)  
Rev. D  
|
Page 35 of 60 | September 2006  
ADSP-BF533  
EXTERNAL RFS WITH MCE = 1, MFD = 0  
DRIVE  
SAMPLE  
DRIVE  
RSCLK  
RFS  
tSFSE/I  
tHOFSE/I  
tDDTE/I  
tHDTE/I  
tDTENLSCK  
1ST BIT  
DT  
2ND BIT  
tDDTLSCK  
LATE EXTERNAL TFS  
DRIVE  
SAMPLE  
DRIVE  
TSCLK  
TFS  
tSFSE/I  
tHOFSE/I  
tDDTE/I  
tHDTE/I  
tDTENLSCK  
DT  
1ST BIT  
2ND BIT  
tDDTLSCK  
Figure 20. External Late Frame Sync (Frame Sync Setup > tSCLKE/2)  
Rev. D  
|
Page 36 of 60 | September 2006  
ADSP-BF533  
Serial Peripheral Interface (SPI) Port  
—Master Timing  
Table 26 and Figure 21 describe SPI port master operations.  
Table 26. Serial Peripheral Interface (SPI) Port—Master Timing  
VDDEXT = 1.8 V  
Max  
VDDEXT = 2.5 V/3.3 V  
Parameter  
Min  
Min  
Max  
Unit  
Timing Requirements  
tSSPIDM  
Data Input Valid to SCK Edge (Data Input Setup)  
8.5  
7.5  
ns  
ns  
tHSPIDM SCK Sampling Edge to Data Input Invalid  
–1.5  
–1.5  
Switching Characteristics  
tSDSCIM  
tSPICHM  
tSPICLM  
tSPICLK  
tHDSM  
SPISELx Low to First SCK Edge (x=0 or x=1)  
Serial Clock High Period  
2tSCLK –1.5  
2tSCLK –1.5  
2tSCLK –1.5  
4tSCLK –1.5  
2tSCLK –1.5  
2tSCLK –1.5  
0
2tSCLK –1.5  
2tSCLK 1.5  
2tSCLK 1.5  
4tSCLK 1.5  
2tSCLK 1.5  
2tSCLK 1.5  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Serial Clock Low Period  
Serial Clock Period  
Last SCK Edge to SPISELx High (x=0 or x=1)  
Sequential Transfer Delay  
tSPITDM  
tDDSPIDM SCK Edge to Data Out Valid (Data Out Delay)  
tHDSPIDM SCK Edge to Data Out Invalid (Data Out Hold)  
6
6
–1.0  
+4.0  
–1.0  
+4.0  
SPISELx  
(OUTPUT)  
tSPICLK  
tHDSM  
tSPITDM  
tSDSCIM  
tSPICHM  
tSPICLM  
SCK  
(CPOL = 0)  
(OUTPUT)  
tSPICLM  
tSPICHM  
SCK  
(CPOL = 1)  
(OUTPUT)  
tDDSPIDM  
tHDSPIDM  
MOSI  
(OUTPUT)  
MSB  
LSB  
CPHA = 1  
tSSPIDM  
tHSPIDM  
tSSPIDM  
tHSPIDM  
MISO  
(INPUT)  
MSB VALID  
LSB VALID  
tHDSPIDM  
LSB  
tDDSPIDM  
MOSI  
(OUTPUT)  
MSB  
CPHA = 0  
tSSPIDM  
tHSPIDM  
MISO  
(INPUT)  
MSB VALID  
LSB VALID  
Figure 21. Serial Peripheral Interface (SPI) Port—Master Timing  
Rev. D  
|
Page 37 of 60 | September 2006  
ADSP-BF533  
Serial Peripheral Interface (SPI) Port  
—Slave Timing  
Table 27 and Figure 22 describe SPI port slave operations.  
Table 27. Serial Peripheral Interface (SPI) Port—Slave Timing  
VDDEXT = 1.8 V  
Max  
VDDEXT = 2.5 V/3.3 V  
Max  
Parameter  
Min  
Min  
Unit  
Timing Requirements  
tSPICHS Serial Clock High Period  
tSPICLS Serial Clock Low Period  
tSPICLK Serial Clock Period  
2tSCLK –1.5  
2tSCLK –1.5  
4tSCLK –1.5  
2tSCLK –1.5  
2tSCLK –1.5  
2tSCLK –1.5  
1.6  
2tSCLK –1.5  
2tSCLK –1.5  
4tSCLK –1.5  
2tSCLK –1.5  
2tSCLK –1.5  
2tSCLK –1.5  
1.6  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tHDS  
Last SCK Edge to SPISS Not Asserted  
tSPITDS Sequential Transfer Delay  
tSDSCI SPISS Assertion to First SCK Edge  
tSSPID Data Input Valid to SCK Edge (Data Input Setup)  
tHSPID SCK Sampling Edge to Data Input Invalid  
Switching Characteristics  
1.6  
1.6  
tDSOE SPISS Assertion to Data Out Active  
tDSDHI SPISS Deassertion to Data High Impedance  
tDDSPID SCK Edge to Data Out Valid (Data Out Delay)  
tHDSPID SCK Edge to Data Out Invalid (Data Out Hold)  
0
0
0
0
9
0
0
0
0
8
ns  
ns  
ns  
ns  
9
8
10  
10  
10  
10  
SPISS  
(INPUT)  
tSPICHS  
tSPICLS  
tSPICLK  
tHDS  
tSPITDS  
SCK  
(CPOL = 0)  
(INPUT)  
tSDSCI  
tSPICLS  
tSPICHS  
SCK  
(CPOL = 1)  
(INPUT)  
tDSOE  
tDDSPID  
tHDSPID  
MSB  
tDDSPID  
tDSDHI  
LSB  
MISO  
(OUTPUT)  
tHSPID  
tSSPID  
CPHA = 1  
tSSPID  
tHSPID  
MOSI  
(INPUT)  
MSB VALID  
LSB VALID  
tDSOE  
tDDSPID  
tDSDHI  
MISO  
(OUTPUT)  
MSB  
LSB  
tHSPID  
CPHA = 0  
tSSPID  
MOSI  
(INPUT)  
MSB VALID  
LSB VALID  
Figure 22. Serial Peripheral Interface (SPI) Port—Slave Timing  
Rev. D  
|
Page 38 of 60 | September 2006  
ADSP-BF533  
Universal Asynchronous Receiver-Transmitter  
(UART) Port—Receive and Transmit Timing  
Figure 23 describes UART port receive and transmit operations.  
The maximum baud rate is SCLK/16. As shown in Figure 23  
there is some latency between the generation internal UART  
interrupts and the external data operations. These latencies are  
negligible at the data transmission rates for the UART.  
CLKOUT  
(SAMPLE CLOCK)  
RXD  
DATA[8:5]  
STOP  
RECEIVE  
INTERNAL  
UART RECEIVE  
INTERRUPT  
UART RECEIVE BIT SET BY DATA STOP;  
CLEARED BY FIFO READ  
START  
TXD  
DATA[8:5]  
STOP[2:1]  
TRANSMIT  
INTERNAL  
UART TRANSMIT  
INTERRUPT  
UART TRANSMIT BIT SET BY PROGRAM;  
CLEARED BY WRITE TO TRANSMIT  
Figure 23. UART Port—Receive and Transmit Timing  
Rev. D  
|
Page 39 of 60 | September 2006  
ADSP-BF533  
Programmable Flags Cycle Timing  
Table 28 and Figure 24 describe programmable flag operations.  
Table 28. Programmable Flags Cycle Timing  
VDDEXT = 1.8 V  
Max  
VDDEXT = 2.5 V/3.3 V  
Max  
Parameter  
Min  
Min  
tSCLK + 1  
Unit  
ns  
Timing Requirement  
tWFI  
Flag Input Pulse Width  
tSCLK + 1  
Switching Characteristic  
tDFO Flag Output Delay from CLKOUT Low  
6
6
ns  
CLKOUT  
tDFO  
PF (OUTPUT)  
FLAG OUTPUT  
FLAG INPUT  
tWFI  
PF (INPUT)  
Figure 24. Programmable Flags Cycle Timing  
Rev. D  
|
Page 40 of 60 | September 2006  
ADSP-BF533  
Timer Cycle Timing  
Table 29 and Figure 25 describe timer expired operations. The  
input signal is asynchronous in width capture mode and exter-  
nal clock mode and has an absolute maximum input frequency  
of fSCLK/2 MHz.  
Table 29. Timer Cycle Timing  
VDDEXT = 1.8 V  
Max  
VDDEXT = 2.5 V/3.3 V  
Max  
Parameter  
Min  
Min  
Unit  
Timing Characteristics  
tWL Timer Pulse Width Input Low1 (Measured in SCLK Cycles)  
tWH Timer Pulse Width Input High1 (Measured in SCLK Cycles)  
Switching Characteristic  
1
1
1
1
SCLK  
SCLK  
tHTO Timer Pulse Width Output2 (Measured in SCLK Cycles)  
1
(232–1)  
1
(232–1)  
SCLK  
1 The minimum pulse widths apply for TMRx input pins in width capture and external clock modes. They also apply to the PF1 or PPI_CLK input pins in PWM output mode.  
2 The minimum time for tHTO is one cycle, and the maximum time for tHTO equals (232–1) cycles.  
CLKOUT  
tHTO  
TMRx  
(PWM OUTPUT MODE)  
TMRx  
tWL  
tWH  
(WIDTH CAPTURE AND  
EXTERNAL CLOCK MODES)  
Figure 25. Timer PWM_OUT Cycle Timing  
Rev. D  
|
Page 41 of 60 | September 2006  
ADSP-BF533  
JTAG Test and Emulation Port Timing  
Table 30 and Figure 26 describe JTAG port operations.  
Table 30. JTAG Port Timing  
VDDEXT = 1.8 V  
Max  
VDDEXT = 2.5 V/3.3 V  
Max  
Parameter  
Min  
Min  
Unit  
Timing Requirements  
tTCK  
TCK Period  
20  
4
20  
4
ns  
tSTAP  
tHTAP  
tSSYS  
tHSYS  
TDI, TMS Setup Before TCK High  
TDI, TMS Hold After TCK High  
System Inputs Setup Before TCK High1  
System Inputs Hold After TCK High1  
ns  
4
4
ns  
4
4
ns  
5
5
ns  
tTRSTW TRST Pulse Width2 (Measured in TCK Cycles)  
4
4
TCK  
Switching Characteristics  
tDTDO  
tDSYS  
TDO Delay from TCK Low  
System Outputs Delay After TCK Low3  
10  
12  
10  
12  
ns  
ns  
0
0
1 System Inputs = DATA15–0, ARDY, TMR2–0, PF15–0, PPI_CLK, RSCLK0–1, RFS0–1, DR0PRI, DR0SEC, TSCLK0–1, TFS0–1, DR1PRI, DR1SEC, MOSI, MISO, SCK, RX,  
RESET, NMI, BMODE1–0, BR, PP3–0.  
2 50 MHz maximum  
3 System Outputs = DATA15–0, ADDR19–1, ABE1–0, AOE, ARE, AWE, AMS3–0, SRAS, SCAS, SWE, SCKE, CLKOUT, SA10, SMS, TMR2–0, PF15–0, RSCLK0–1, RFS0–1,  
TSCLK0–1, TFS0–1, DT0PRI, DT0SEC, DT1PRI, DT1SEC, MOSI, MISO, SCK, TX, BG, BGH, PPI3–0.  
tTCK  
TCK  
tSTAP  
tHTAP  
TMS  
TDI  
tDTDO  
TDO  
tSSYS  
tHSYS  
SYSTEM  
INPUTS  
tDSYS  
SYSTEM  
OUTPUTS  
Figure 26. JTAG Port Timing  
Rev. D  
|
Page 42 of 60 | September 2006  
ADSP-BF533  
OUTPUT DRIVE CURRENTS  
150  
100  
50  
Figure 27 through Figure 38 show typical current-voltage char-  
acteristics for the output drivers of the ADSP-BF533 processor.  
The curves represent the current drive capability of the output  
drivers as a function of output voltage.  
VDDEXT = 2.75V  
VDDEXT = 2.50V  
VDDEXT = 2.25V  
150  
0
–50  
VOH  
VDDEXT = 2.75V  
VDDEXT = 2.50V  
100  
50  
VDDEXT = 2.25V  
–100  
–150  
VOL  
0
–50  
VOH  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
SOURCE VOLTAGE (V)  
Figure 30. Drive Current B (VDDEXT = 2.5 V)  
VOL  
–100  
–150  
80  
60  
V
DDEXT = 1.9V  
VDDEXT = 1.8V  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
V
DDEXT = 1.7V  
40  
SOURCE VOLTAGE (V)  
Figure 27. Drive Current A (VDDEXT = 2.5 V)  
20  
0
80  
60  
VDDEXT = 1.9V  
20  
40  
60  
80  
VDDEXT = 1.8V  
V
DDEXT = 1.7V  
40  
20  
0
0
0.5  
1.0  
1.5  
2.0  
SOURCE VOLTAGE (V)  
20  
40  
60  
80  
Figure 31. Drive Current B (VDDEXT = 1.8 V)  
150  
100  
50  
VDDEXT = 3.65V  
VDDEXT = 3.30V  
0
0.5  
1.0  
1.5  
2.0  
SOURCE VOLTAGE (V)  
V
DDEXT = 2.95V  
Figure 28. Drive Current A (VDDEXT = 1.8 V)  
150  
100  
50  
0
VDDEXT = 3.65V  
DDEXT = 3.30V  
VOH  
V
VDDEXT = 2.95V  
–50  
–100  
–150  
VOL  
0
VOH  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
–50  
–100  
–150  
SOURCE VOLTAGE (V)  
Figure 32. Drive Current B (VDDEXT = 3.3 V)  
VOL  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
SOURCE VOLTAGE (V)  
Figure 29. Drive Current A (VDDEXT = 3.3 V)  
Rev. D  
|
Page 43 of 60 | September 2006  
ADSP-BF533  
60  
40  
20  
100  
VDDEXT = 2.75V  
VDDEXT = 2.50V  
VDDEXT = 2.25V  
VDDEXT = 2.75V  
VDDEXT = 2.50V  
VDDEXT = 2.25V  
80  
60  
40  
20  
0
0
–20  
–40  
–60  
VOH  
VOH  
–20  
–40  
–60  
VOL  
VOL  
80  
–100  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
SOURCE VOLTAGE (V)  
SOURCE VOLTAGE (V)  
Figure 33. Drive Current C (VDDEXT = 2.5 V)  
Figure 36. Drive Current D (VDDEXT = 2.5 V)  
30  
60  
40  
VDDEXT = 1.9V  
DDEXT = 1.8V  
DDEXT = 1.7V  
V
20  
V
DDEXT = 1.9V  
V
VDDEXT = 1.8V  
V
DDEXT = 1.7V  
10  
0
20  
0
10  
20  
20  
40  
30  
40  
60  
0
0
0.5  
1.0  
1.5  
2.0  
0.5  
1.0  
1.5  
2.0  
SOURCE VOLTAGE (V)  
SOURCE VOLTAGE (V)  
Figure 37. Drive Current D (VDDEXT = 1.8 V)  
Figure 34. Drive Current C (VDDEXT = 1.8 V)  
150  
100  
50  
100  
80  
60  
40  
20  
V
V
DDEXT = 3.65V  
DDEXT = 3.30V  
V
DDEXT = 3.65V  
VDDEXT = 3.30V  
VDDEXT = 2.95V  
VDDEXT = 2.95V  
0
VOH  
0
–20  
–40  
–60  
VOH  
–50  
VOL  
–100  
VOL  
–150  
80  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
–100  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
SOURCE VOLTAGE (V)  
SOURCE VOLTAGE (V)  
Figure 38. Drive Current D (VDDEXT = 3.3 V)  
Figure 35. Drive Current C (VDDEXT = 3.3 V)  
Rev. D  
|
Page 44 of 60 | September 2006  
ADSP-BF533  
The time for the voltage on the bus to decay by ΔV is dependent  
on the capacitive load CL and the load current IL. This decay  
time can be approximated by the equation:  
POWER DISSIPATION  
Many operating conditions can affect power dissipation. System  
designers should refer to EE-229: Estimating Power for  
ADSP-BF531/ADSP-BF532/ADSP-BF533 Blackfin Processors on  
the Analog Devices website (www.analog.com)—use site search  
on “EE-229.” This document provides detailed information for  
optimizing your design for lowest power.  
tDECAY = (CLΔV) ⁄ IL  
The time tDECAY is calculated with test loads CL and IL, and with  
ΔV equal to 0.1 V for VDDEXT (nominal) = 1.8 V or 0.5 V for  
VDDEXT (nominal) = 2.5 V/3.3 V.  
See the ADSP-BF53x Blackfin Processor Hardware Reference  
Manual for definitions of the various operating modes and for  
instructions on how to minimize system power.  
The time tDIS_MEASURED is the interval from when the reference  
signal switches, to when the output voltage decays ΔV from the  
measured output high or output low voltage.  
TEST CONDITIONS  
Example System Hold Time Calculation  
All timing parameters appearing in this data sheet were mea-  
sured under the conditions described in this section. Figure 39  
shows the measurement point for ac measurements (except out-  
put enable/disable). The measurement point VMEAS is 0.95 V for  
VDDEXT (nominal) = 1.8 V, and 1.5 V for VDDEXT (nominal) =  
2.5 V/3.3 V.  
To determine the data output hold time in a particular system,  
first calculate tDECAY using the equation given above. Choose ΔV  
to be the difference between the ADSP-BF533 processor output  
voltage and the input threshold for the device requiring the hold  
time. CLis the total bus capacitance (per data line), and IL is the  
total leakage or three-state current (per data line). The hold time  
will be tDECAY plus the various output disable times as specified  
in the Timing Specifications on Page 23 (for example tDSDAT for  
an SDRAM write cycle as shown in SDRAM Interface Timing  
on Page 27).  
INPUT  
OR  
OUTPUT  
V
V
MEAS  
MEAS  
Figure 39. Voltage Reference Levels for AC  
Measurements (Except Output Enable/Disable)  
REFERENCE  
SIGNAL  
Output Enable Time Measurement  
tDIS_MEASURED  
tENA_MEASURED  
Output pins are considered to be enabled when they have made  
a transition from a high impedance state to the point when they  
start driving.  
tDIS  
tENA  
V
OH  
V
(MEASURED)  
OH  
(MEASURED)  
V
(MEASURED) ؊V  
(MEASURED) + V  
OH  
V
(HIGH)  
(LOW)  
The output enable time tENA is the interval from the point when a  
reference signal reaches a high or low voltage level to the point  
when the output starts driving as shown on the right side of  
Figure 40.  
TRIP  
V
TRIP  
V
OL  
V
OL  
V
(MEASURED)  
OL  
(MEASURED)  
tDECAY  
tTRIP  
The time tENA_MEASURED is the interval, from when the reference  
signal switches, to when the output voltage reaches VTRIP(high)  
or VTRIP (low). For VDDEXT (nominal) = 1.8 V—VTRIP (high) is  
1.3 V and VTRIP (low) is 0.7 V. For VDDEXT (nominal) =  
OUTPUT STOPS DRIVING  
OUTPUT STARTS DRIVING  
HIGH IMPEDANCE STATE  
2.5 V/3.3 V—VTRIP (high) is 2.0 V and VTRIP (low) is 1.0 V. Time  
tTRIP is the interval from when the output starts driving to when  
the output reaches the VTRIP (high) or VTRIP (low) trip voltage.  
Figure 40. Output Enable/Disable  
50  
TO  
OUTPUT  
PIN  
V
LOAD  
Time tENA is calculated as shown in the equation:  
tENA = tENA_MEASURED tTRIP  
30pF  
If multiple pins (such as the data bus) are enabled, the measure-  
ment value is that of the first pin to start driving.  
Figure 41. Equivalent Device Loading for AC Measurements  
(Includes All Fixtures)  
Output Disable Time Measurement  
Output pins are considered to be disabled when they stop driv-  
ing, go into a high impedance state, and start to decay from their  
output high or low voltage. The output disable time tDIS is the  
difference between tDIS_MEASURED and tDECAY as shown on the left  
Capacitive Loading  
Output delays and holds are based on standard capacitive loads:  
30 pF on all pins (see Figure 41). VLOAD is 0.95 V for VDDEXT  
(nominal) = 1.8 V, and 1.5 V for VDDEXT (nominal) =  
2.5 V/3.3 V. Figure 42 on Page 46 through Figure 53 on Page 48  
show how output rise time varies with capacitance. The delay  
side of Figure 39.  
tDIS = tDIS_MEASURED tDECAY  
Rev. D  
|
Page 45 of 60  
|
September 2006  
ADSP-BF533  
and hold specifications given should be derated by a factor  
derived from these figures. The graphs in these figures may not  
be linear outside the ranges shown.  
ABE0 (133MHz DRIVER), VDDEXT (MAX) = 3.65V  
12  
ABEB0 (133MHz DRIVER), V  
RISE TIME  
= 1.7V  
DDEXT  
16  
14  
12  
10  
8
10  
8
RISE TIME  
FALL TIME  
6
FALL TIME  
4
6
4
2
0
2
0
0
50  
100  
150  
200  
250  
LOAD CAPACITANCE (pF)  
0
50  
100  
150  
200  
250  
LOAD CAPACITANCE (pF)  
Figure 42. Typical Rise and Fall Times (10% to 90%) vs. Load Capacitance for  
Driver A at VDDEXT = 1.8 V  
Figure 44. Typical Rise and Fall Times (10% to 90%) vs. Load Capacitance for  
Driver A at VDDEXT = 3.65 V  
CLKOUT (CLKOUT DRIVER), V  
DDEXT  
= 1.7V  
ABE_B0 (133MHz DRIVER), VDDEXT (MIN) = 2.25V  
14  
12  
10  
8
14  
12  
RISE TIME  
RISE TIME  
10  
FALL TIME  
8
FALL TIME  
6
4
6
4
2
0
2
0
50  
100  
150  
200  
250  
0
LOAD CAPACITANCE (pF)  
0
50  
100  
150  
200  
250  
LOAD CAPACITANCE (pF)  
Figure 45. Typical Rise and Fall Times (10% to 90%) vs. Load Capacitance for  
Driver B at VDDEXT = 1.8 V  
Figure 43. Typical Rise and Fall Times (10% to 90%) vs. Load Capacitance for  
Driver A at VDDEXT = 2.25 V  
Rev. D  
|
Page 46 of 60  
|
September 2006  
ADSP-BF533  
TMR0 (33MHz DRIVER), V  
DDEXT  
= 1.7V  
CLKOUT (CLKOUT DRIVER), VDDEXT (MIN) = 2.25V  
30  
25  
20  
15  
10  
5
12  
10  
RISE TIME  
RISE TIME  
8
6
4
2
0
FALL TIME  
FALL TIME  
0
50  
100  
150  
200  
250  
0
LOAD CAPACITANCE (pF)  
0
50  
100  
150  
200  
250  
LOAD CAPACITANCE (pF)  
Figure 46. Typical Rise and Fall Times (10% to 90%) vs. Load Capacitance for  
Driver B at VDDEXT = 2.25 V  
Figure 48. Typical Rise and Fall Times (10% to 90%) vs. Load Capacitance for  
Driver C at VDDEXT = 1.8 V  
CLKOUT (CLKOUT DRIVER), VDDEXT (MAX) = 3.65V  
10  
TMR0 (33MHz DRIVER), VDDEXT (MIN) = 2.25V  
30  
9
8
25  
RISE TIME  
7
RISE TIME  
20  
6
FALL TIME  
5
15  
FALL TIME  
4
3
2
1
0
10  
5
0
50  
100  
150  
200  
250  
0
LOAD CAPACITANCE (pF)  
0
50  
100  
150  
200  
250  
LOAD CAPACITANCE (pF)  
Figure 47. Typical Rise and Fall Times (10% to 90%) vs. Load Capacitance for  
Driver B at VDDEXT = 3.65 V  
Figure 49. Typical Rise and Fall Times (10% to 90%) vs. Load Capacitance for  
Driver C at VDDEXT = 2.25 V  
Rev. D  
|
Page 47 of 60  
|
September 2006  
ADSP-BF533  
SCK (66MHz DRIVER), VDDEXT (MAX) = 3.65V  
TMR0 (33MHz DRIVER), VDDEXT (MAX) = 3.65V  
14  
20  
18  
16  
14  
12  
10  
8
RISE TIME  
RISE TIME  
12  
10  
FALL TIME  
FALL TIME  
6
4
2
0
8
6
4
2
0
0
50  
100  
150  
200  
250  
0
50  
100  
150  
200  
250  
LOAD CAPACITANCE (pF)  
LOAD CAPACITANCE (pF)  
Figure 53. Typical Rise and Fall Times (10% to 90%) vs. Load Capacitance for  
Driver D at VDDEXT = 3.65 V  
Figure 50. Typical Rise and Fall Times (10% to 90%) vs. Load Capacitance for  
Driver C at VDDEXT = 3.65 V  
ENVIRONMENTAL CONDITIONS  
SCK (66MHz DRIVER), V  
DDEXT  
= 1.7V  
18  
16  
14  
12  
10  
8
To determine the junction temperature on the application  
printed circuit board use:  
RISE TIME  
TJ = TCASE + JT × PD)  
where:  
FALL TIME  
TJ = junction temperature (؇C).  
T
CASE = case temperature (؇C) measured by customer at top  
center of package.  
6
ΨJT = from Table 31 through Table 32.  
4
PD = power dissipation (see Power Dissipation on Page 45 for  
the method to calculate PD).  
2
Values of θJA are provided for package comparison and printed  
circuit board design considerations. θJA can be used for a first  
order approximation of TJ by the equation:  
0
0
50  
100  
150  
200  
250  
LOAD CAPACITANCE (pF)  
Figure 51. Typical Rise and Fall Times (10% to 90%) vs. Load Capacitance for  
Driver D at VDDEXT = 1.8 V  
TJ = TA + JA × PD)  
where:  
TA = ambient temperature (؇C).  
SCK (66MHz DRIVER), VDDEXT (MIN) = 2.25V  
18  
In Table 31 through Table 32, airflow measurements comply  
with JEDEC standards JESD51–2 and JESD51–6, and the junc-  
tion-to-board measurement complies with JESD51–8. The  
junction-to-case measurement complies with MIL-STD-883  
(Method 1012.1). All measurements use a 2S2P JEDEC test  
board.  
16  
14  
RISE TIME  
12  
10  
FALL TIME  
8
6
4
2
0
0
50  
100  
150  
200  
250  
LOAD CAPACITANCE (pF)  
Figure 52. Typical Rise and Fall Times (10% to 90%) vs. Load Capacitance for  
Driver D at VDDEXT = 2.25 V  
Rev. D  
|
Page 48 of 60  
|
September 2006  
ADSP-BF533  
Thermal resistance θJA in Table 31 through Table 32 is the figure  
of merit relating to performance of the package and board in a  
convective environment. θJMA represents the thermal resistance  
under two conditions of airflow. ΨJT represents the correlation  
between TJ and TCASE  
.
Table 31. Thermal Characteristics for BC-160 Package  
Parameter Condition  
Typ  
Unit  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
θJA  
0 Linear m/s Airflow  
27.1  
23.85  
22.7  
7.26  
0.14  
0.26  
0.35  
θJMA  
θJMA  
θJC  
1 Linear m/s Airflow  
2 Linear m/s Airflow  
Not Applicable  
ΨJT  
ΨJT  
ΨJT  
0 Linear m/s Airflow  
1 Linear m/s Airflow  
2 Linear m/s Airflow  
Table 32. Thermal Characteristics for B-169 Package  
Parameter Condition  
Typ  
Unit  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
θJA  
0 Linear m/s Airflow  
22.8  
20.3  
19.3  
10.39  
0.59  
0.88  
1.37  
θJMA  
θJMA  
θJC  
1 Linear m/s Airflow  
2 Linear m/s Airflow  
Not Applicable  
ΨJT  
ΨJT  
ΨJT  
0 Linear m/s Airflow  
1 Linear m/s Airflow  
2 Linear m/s Airflow  
Rev. D  
|
Page 49 of 60 | September 2006  
ADSP-BF533  
160-BALL BGA PINOUT  
Table 33 lists the BGA pinout by signal. Table 34 on Page 51  
lists the BGA pinout by ball number.  
Table 33. 160-Ball BGA Ball Assignment (Alphabetically by Signal)  
Signal  
ABE0  
Ball No.  
H13  
H12  
J14  
Signal  
DATA4  
DATA5  
DATA6  
DATA7  
DATA8  
DATA9  
DATA10  
DATA11  
DATA12  
DATA13  
DATA14  
DATA15  
DR0PRI  
DR0SEC  
DR1PRI  
DR1SEC  
DT0PRI  
DT0SEC  
DT1PRI  
DT1SEC  
EMU  
Ball No.  
N8  
Signal  
GND  
GND  
GND  
GND  
GND  
GND  
MISO  
MOSI  
NMI  
Ball No.  
L6  
Signal  
SCK  
Ball No.  
D1  
ABE1  
P8  
L8  
SCKE  
B13  
C13  
D13  
D12  
P2  
ADDR1  
ADDR2  
ADDR3  
ADDR4  
ADDR5  
ADDR6  
ADDR7  
ADDR8  
ADDR9  
ADDR10  
ADDR11  
ADDR12  
ADDR13  
ADDR14  
ADDR15  
ADDR16  
ADDR17  
ADDR18  
ADDR19  
AMS0  
M7  
N7  
L10  
M4  
M10  
P14  
E2  
SMS  
K14  
L14  
J13  
SRAS  
P7  
SWE  
M6  
N6  
TCK  
K13  
L13  
K12  
L12  
M12  
M13  
M14  
N14  
N13  
N12  
M11  
N11  
P13  
P12  
P11  
E14  
F14  
F13  
G12  
G13  
E13  
G14  
H14  
P10  
N10  
N4  
TDI  
M3  
N3  
P6  
D3  
B10  
D2  
C1  
TDO  
M5  
N5  
TFS0  
H3  
PF0  
TFS1  
E1  
P5  
PF1  
TMR0  
L2  
P4  
PF2  
C2  
TMR1  
M1  
K2  
K1  
PF3  
C3  
TMR2  
J2  
PF4  
B1  
TMS  
N2  
G3  
PF5  
B2  
TRST  
N1  
F3  
PF6  
B3  
TSCLK0  
TSCLK1  
TX  
J1  
H1  
PF7  
B4  
F1  
H2  
PF8  
A2  
A3  
A4  
A5  
B5  
K3  
F2  
PF9  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDRTC  
VROUT0  
VROUT1  
XTAL  
A1  
E3  
PF10  
PF11  
PF12  
PF13  
PF14  
PF15  
PPI_CLK  
PPI0  
PPI1  
PPI2  
PPI3  
RESET  
RFS0  
RFS1  
RSCLK0  
RSCLK1  
RTXI  
RTXO  
RX  
C7  
M2  
A10  
A14  
B11  
C4  
C12  
D5  
GND  
AMS1  
GND  
B6  
D9  
AMS2  
GND  
A6  
C6  
F12  
G4  
AMS3  
GND  
AOE  
GND  
C5  
C9  
J4  
ARDY  
GND  
C11  
D4  
C8  
J12  
L7  
ARE  
GND  
B8  
AWE  
GND  
D7  
A7  
B7  
L11  
P1  
BG  
GND  
D8  
BGH  
GND  
D10  
D11  
F4  
C10  
J3  
D6  
BMODE0  
BMODE1  
BR  
GND  
E4  
P3  
GND  
G2  
L1  
E11  
J11  
L4  
D14  
A12  
B14  
M9  
GND  
F11  
G11  
H4  
CLKIN  
GND  
G1  
A9  
A8  
L3  
CLKOUT  
DATA0  
DATA1  
DATA2  
DATA3  
GND  
L9  
GND  
H11  
K4  
B9  
N9  
GND  
A13  
B12  
A11  
P9  
GND  
K11  
L5  
SA10  
SCAS  
E12  
C14  
M8  
GND  
Rev. D  
|
Page 50 of 60 | September 2006  
ADSP-BF533  
Table 34. 160-Ball BGA Ball Assignment (Numerically by Ball Number)  
Ball No.  
A1  
Signal  
VDDEXT  
PF8  
Ball No.  
C13  
C14  
D1  
Signal  
SMS  
Ball No.  
H1  
Signal  
DT0PRI  
DT0SEC  
TFS0  
Ball No.  
M3  
M4  
M5  
M6  
M7  
M8  
M9  
M10  
M11  
M12  
M13  
M14  
N1  
Signal  
TDI  
A2  
SCAS  
H2  
GND  
A3  
PF9  
SCK  
H3  
DATA12  
DATA9  
DATA6  
DATA3  
DATA0  
GND  
A4  
PF10  
PF11  
PF14  
PPI2  
D2  
PF0  
H4  
GND  
A5  
D3  
MOSI  
GND  
H11  
H12  
H13  
H14  
J1  
GND  
A6  
D4  
ABE1  
A7  
D5  
VDDEXT  
VDDINT  
GND  
ABE0  
A8  
RTXO  
RTXI  
D6  
AWE  
A9  
D7  
TSCLK0  
DR0SEC  
RFS0  
ADDR15  
ADDR9  
ADDR10  
ADDR11  
TRST  
A10  
A11  
A12  
A13  
A14  
B1  
GND  
D8  
GND  
J2  
XTAL  
CLKIN  
VROUT0  
GND  
D9  
VDDEXT  
GND  
J3  
D10  
D11  
D12  
D13  
D14  
E1  
J4  
VDDEXT  
VDDINT  
VDDEXT  
ADDR4  
ADDR1  
DR0PRI  
TMR2  
GND  
J11  
J12  
J13  
J14  
K1  
SWE  
N2  
TMS  
PF4  
SRAS  
N3  
TDO  
B2  
PF5  
BR  
N4  
BMODE0  
DATA13  
DATA10  
DATA7  
DATA4  
DATA1  
BGH  
B3  
PF6  
TFS1  
N5  
B4  
PF7  
E2  
MISO  
DT1SEC  
VDDINT  
VDDINT  
SA10  
K2  
N6  
B5  
PF12  
PF13  
PPI3  
E3  
K3  
TX  
N7  
B6  
E4  
K4  
GND  
N8  
B7  
E11  
E12  
E13  
E14  
F1  
K11  
K12  
K13  
K14  
L1  
GND  
N9  
B8  
PPI1  
ADDR7  
ADDR5  
ADDR2  
RSCLK0  
TMR0  
N10  
N11  
N12  
N13  
N14  
P1  
B9  
VDDRTC  
NMI  
ARDY  
AMS0  
TSCLK1  
DT1PRI  
DR1SEC  
GND  
ADDR16  
ADDR14  
ADDR13  
ADDR12  
VDDEXT  
TCK  
B10  
B11  
B12  
B13  
B14  
C1  
GND  
VROUT1  
SCKE  
CLKOUT  
PF1  
F2  
L2  
F3  
L3  
RX  
F4  
L4  
VDDINT  
GND  
P2  
F11  
F12  
F13  
F14  
G1  
GND  
L5  
P3  
BMODE1  
DATA15  
DATA14  
DATA11  
DATA8  
DATA5  
DATA2  
BG  
C2  
PF2  
VDDEXT  
AMS2  
AMS1  
RSCLK1  
RFS1  
L6  
GND  
P4  
C3  
PF3  
L7  
VDDEXT  
GND  
P5  
C4  
GND  
L8  
P6  
C5  
GND  
L9  
VDDINT  
GND  
P7  
C6  
PF15  
VDDEXT  
PPI0  
G2  
L10  
L11  
L12  
L13  
L14  
M1  
M2  
P8  
C7  
G3  
DR1PRI  
VDDEXT  
GND  
VDDEXT  
ADDR8  
ADDR6  
ADDR3  
TMR1  
P9  
C8  
G4  
P10  
P11  
P12  
P13  
P14  
C9  
PPI_CLK  
RESET  
GND  
G11  
G12  
G13  
G14  
ADDR19  
ADDR18  
ADDR17  
GND  
C10  
C11  
C12  
AMS3  
AOE  
VDDEXT  
ARE  
EMU  
Rev. D  
|
Page 51 of 60 | September 2006  
ADSP-BF533  
Figure 54 lists the top view of the BGA ball configuration.  
Figure 55 lists the bottom view of the BGA ball configuration.  
1
2
3
4
5
6
7
8
9
10 11 12 13 14  
A
B
C
D
E
F
G
H
J
K
L
M
N
P
KEY:  
V
V
V
DDINT  
GND  
I/O  
DDRTC  
ROUT  
V
DDEXT  
Figure 54. 160-Ball Mini-BGA Ground Configuration (Top View)  
14 13 12 11 10  
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
KEY:  
V
V
V
DDINT  
GND  
I/O  
DDRTC  
ROUT  
V
DDEXT  
Figure 55. 160-Ball Mini-BGA Ground Configuration (Bottom View)  
Rev. D  
|
Page 52 of 60 | September 2006  
ADSP-BF533  
169-BALL PBGA PINOUT  
Table 35 lists the PBGA pinout by signal. Table 36 on Page 54  
lists the PBGA pinout by ball number.  
Table 35. 169-Ball PBGA Ball Assignment (Alphabetically by Signal)  
Signal  
ABE0  
Ball No.  
H16  
H17  
J16  
Signal  
DATA4  
DATA5  
DATA6  
DATA7  
DATA8  
DATA9  
DATA10  
DATA11  
DATA12  
DATA13  
DATA14  
DATA15  
DR0PRI  
DR0SEC  
DR1PRI  
DR1SEC  
DT0PRI  
DT0SEC  
DT1PRI  
DT1SEC  
EMU  
Ball No.  
U12  
U11  
T10  
U10  
T9  
Signal  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
MISO  
MOSI  
NMI  
Ball No.  
K9  
Signal  
RTXI  
Ball No.  
A10  
A11  
T1  
Signal  
Ball No.  
K6  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VROUT0  
VROUT1  
XTAL  
ABE1  
K10  
K11  
L7  
RTXO  
RX  
L6  
ADDR1  
ADDR2  
ADDR3  
ADDR4  
ADDR5  
ADDR6  
ADDR7  
ADDR8  
ADDR9  
ADDR10  
ADDR11  
ADDR12  
ADDR13  
ADDR14  
ADDR15  
ADDR16  
ADDR17  
ADDR18  
ADDR19  
AMS0  
M6  
J17  
SA10  
SCAS  
SCK  
B15  
A16  
D1  
M7  
K16  
K17  
L16  
L17  
M16  
M17  
N17  
N16  
P17  
P16  
R17  
R16  
T17  
U15  
T15  
U16  
T14  
D17  
E16  
E17  
F16  
F17  
C16  
G16  
G17  
T13  
U17  
U5  
L8  
M8  
U9  
L9  
T2  
T8  
L10  
L11  
M9  
T16  
E2  
SCKE  
SMS  
B14  
A17  
A15  
B17  
U4  
B12  
B13  
A13  
U8  
U7  
SRAS  
SWE  
T7  
U6  
TCK  
T6  
E1  
TDI  
U3  
M2  
M1  
H1  
B11  
D2  
C1  
TDO  
T4  
PF0  
TFS0  
L1  
PF1  
TFS1  
G2  
H2  
PF2  
B1  
TMR0  
TMR1  
TMR2  
TMS  
R1  
K2  
PF3  
C2  
P2  
K1  
PF4  
A1  
P1  
F1  
PF5  
A2  
T3  
F2  
PF6  
B3  
TRST  
U2  
U1  
PF7  
A3  
B4  
TSCLK0  
TSCLK1  
TX  
L2  
GND  
B16  
F11  
G7  
PF8  
G1  
AMS1  
GND  
PF9  
A4  
B5  
R2  
AMS2  
GND  
PF10  
PF11  
PF12  
PF13  
PF14  
PF15  
PPI_CLK  
PPI0  
VDD  
F12  
G12  
H12  
J12  
K12  
L12  
M10  
M11  
M12  
B2  
AMS3  
GND  
G8  
A5  
A6  
B6  
VDD  
AOE  
GND  
G9  
VDD  
ARDY  
GND  
G10  
G11  
H7  
VDD  
ARE  
GND  
A7  
B7  
VDD  
AWE  
GND  
VDD  
BG  
GND  
H8  
B10  
B9  
VDD  
BGH  
GND  
H9  
VDD  
BMODE0  
BMODE1  
BR  
GND  
H10  
H11  
J7  
PPI1  
A9  
B8  
VDD  
T5  
GND  
PPI2  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
C17  
A14  
D16  
U14  
T12  
U13  
T11  
GND  
PPI3  
A8  
A12  
N1  
J1  
F6  
CLKIN  
GND  
J8  
RESET  
RFS0  
RFS1  
RSCLK0  
RSCLK1  
RTCVDD  
F7  
CLKOUT  
DATA0  
DATA1  
DATA2  
DATA3  
GND  
J9  
F8  
GND  
J10  
J11  
K7  
F9  
GND  
N2  
J2  
G6  
GND  
H6  
GND  
K8  
F10  
J6  
Rev. D  
|
Page 53 of 60 | September 2006  
ADSP-BF533  
Table 36. 169-Ball PBGA Ball Assignment (Numerically by Ball Number)  
Ball No.  
A1  
Signal  
PF4  
Ball No.  
D16  
D17  
E1  
Signal  
CLKOUT  
AMS0  
MOSI  
Ball No.  
J2  
Signal  
RSCLK1  
VDDEXT  
GND  
Ball No.  
M12  
M16  
M17  
N1  
Signal  
VDD  
Ball No.  
U9  
Signal  
DATA9  
DATA7  
DATA5  
DATA4  
DATA2  
DATA0  
ADDR16  
ADDR18  
BGH  
A2  
PF5  
J6  
ADDR7  
ADDR8  
RFS0  
U10  
U11  
U12  
U13  
U14  
U15  
U16  
U17  
A3  
PF7  
J7  
A4  
PF9  
E2  
MISO  
J8  
GND  
A5  
PF11  
PF12  
PF14  
PPI3  
E16  
E17  
F1  
AMS1  
AMS2  
DT1PRI  
DT1SEC  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
RTCVDD  
GND  
J9  
GND  
N2  
RSCLK0  
ADDR10  
ADDR9  
TMR2  
A6  
J10  
J11  
J12  
J16  
J17  
K1  
GND  
N16  
N17  
P1  
A7  
GND  
A8  
F2  
VDD  
A9  
PPI1  
F6  
ADDR1  
ADDR2  
DT0SEC  
DT0PRI  
VDDEXT  
GND  
P2  
TMR1  
A10  
A11  
A12  
A13  
A14  
A15  
A16  
A17  
B1  
RTXI  
RTXO  
RESET  
XTAL  
CLKIN  
SRAS  
SCAS  
SMS  
F7  
P16  
P17  
R1  
ADDR12  
ADDR11  
TMR0  
F8  
F9  
K2  
F10  
F11  
F12  
F16  
F17  
G1  
K6  
R2  
TX  
K7  
R16  
R17  
T1  
ADDR14  
ADDR13  
RX  
VDD  
K8  
GND  
AMS3  
AOE  
K9  
GND  
K10  
K11  
K12  
K16  
K17  
L1  
GND  
T2  
VDDEXT  
TMS  
PF2  
TSCLK1  
TFS1  
GND  
T3  
B2  
VDDEXT  
PF6  
G2  
VDD  
T4  
TDO  
B3  
G6  
VDDEXT  
GND  
ADDR3  
ADDR4  
TFS0  
T5  
BMODE1  
DATA15  
DATA13  
DATA10  
DATA8  
DATA6  
DATA3  
DATA1  
BG  
B4  
PF8  
G7  
T6  
B5  
PF10  
PF13  
PF15  
PPI2  
G8  
GND  
T7  
B6  
G9  
GND  
L2  
TSCLK0  
VDDEXT  
GND  
T8  
B7  
G10  
G11  
G12  
G16  
G17  
H1  
GND  
L6  
T9  
B8  
GND  
L7  
T10  
T11  
T12  
T13  
T14  
T15  
T16  
T17  
U1  
B9  
PPI0  
VDD  
L8  
GND  
B10  
B11  
B12  
B13  
B14  
B15  
B16  
B17  
C1  
PPI_CLK  
NMI  
ARE  
L9  
GND  
AWE  
L10  
L11  
L12  
L16  
L17  
M1  
M2  
M6  
M7  
M8  
M9  
M10  
M11  
GND  
VROUT0  
VROUT1  
SCKE  
SA10  
GND  
SWE  
DR1PRI  
DR1SEC  
VDDEXT  
GND  
GND  
ADDR19  
ADDR17  
GND  
H2  
VDD  
H6  
ADDR5  
ADDR6  
DR0SEC  
DR0PRI  
VDDEXT  
VDDEXT  
VDDEXT  
GND  
H7  
ADDR15  
EMU  
H8  
GND  
H9  
GND  
U2  
TRST  
PF1  
H10  
H11  
H12  
H16  
H17  
J1  
GND  
U3  
TDI  
C2  
PF3  
GND  
U4  
TCK  
C16  
C17  
D1  
ARDY  
BR  
VDD  
U5  
BMODE0  
DATA14  
DATA12  
DATA11  
ABE0  
U6  
SCK  
ABE1  
VDD  
U7  
D2  
PF0  
RFS1  
VDD  
U8  
Rev. D  
|
Page 54 of 60 | September 2006  
ADSP-BF533  
A1 BALL PAD CORNER  
A
B
C
D
E
F
KEY  
G
H
J
V
V
GND  
NC  
V
DDINT  
K
L
I/O  
DDEXT  
ROUT  
M
N
P
R
T
U
2
4
6
8
10  
12  
14  
16  
1
3
5
7
9
11  
13  
15  
17  
TOP VIEW  
Figure 56. 169-Ball PBGA Ground Configuration (Top View)  
A1 BALL PAD CORNER  
A
B
C
D
KEY:  
V
GND  
I/O  
NC  
E
DDINT  
F
V
V
G
DDEXT  
ROUT  
H
J
K
L
M
N
P
R
T
U
17  
15  
13  
11  
9
7
5
3
1
16  
14  
12  
10  
8
6
4
2
BOTTOM VIEW  
Figure 57. 169-Ball PBGA Ground Configuration (Bottom View)  
Rev. D  
|
Page 55 of 60 | September 2006  
ADSP-BF533  
OUTLINE DIMENSIONS  
Dimensions in the outline dimension figures are shown in  
millimeters.  
12.00 BSC SQ  
A1 CORNER  
INDEX AREA  
1
14 12 10  
13 11  
8
6
4
2
9
7
5
3
A
B
C
D
E
F
G
H
J
BALL A1  
INDICATOR  
10.40  
BSC  
SQ  
K
L
M
N
P
TOP VIEW  
0.80 BSC  
BALL PITCH  
BOTTOM VIEW  
1.31  
1.21  
1.11  
1.70  
DETAIL A  
MAX  
SEATING  
PLANE  
0.12  
MAX  
COPLANARITY  
0.50  
0.45  
0.40  
0.40 NOM  
(NOTE 3)  
NOTES  
BALL DIAMETER  
1. DIMENSIONS ARE IN MILLIMETERS.  
2. COMPLIES WITH JEDEC REGISTERED OUTLINE  
MO-205, VARIATION AE WITH EXCEPTION OF  
THE BALL DIAMETER.  
DETAIL A  
3. MINIMUM BALL HEIGHT 0.25.  
Figure 58. Chip Scale Package Ball Grid Array (Mini-BGA) BC-160  
Rev. D  
|
Page 56 of 60 | September 2006  
ADSP-BF533  
A1 BALL PAD CORNER  
19.00 BSC SQ  
16.00 BSC SQ  
1.00 BSC  
BALL PITCH  
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
16 14 12 10  
8
6
4
2
17 15 13 11  
9
7
5
3
1
TOP VIEW  
BOTTOM VIEW  
0.40 MIN  
2.50  
2.23  
1.97  
SIDE VIEW  
DETAIL A  
0.20 MAX  
COPLANARITY  
NOTES  
SEATING PLANE  
0.70  
0.60  
0.50  
1. DIMENSIONS ARE IN MILLIMETERS.  
2. COMPLIES WITH JEDEC REGISTERED OUTLINE  
MS-034, VARIATION AAG-2  
DETAIL A  
BALL DIAMETER  
.
3. MINIMUM BALL HEIGHT 0.40  
Figure 59. Plastic Ball Grid Array (PBGA) B-169  
SURFACE MOUNT DESIGN  
Table 37 is provided as an aid to PCB design. For industry-  
standard design recommendations, refer to IPC-7351, Generic  
Requirements for Surface Mount Design and Land Pattern  
Standard.  
Table 37. BGA Data for Use with Surface Mount Design  
Package  
Ball Attach Type  
Solder Mask Opening  
0.40 mm diameter  
0.43 mm diameter  
Ball Pad Size  
Chip Scale Package Ball Grid Array (Mini-BGA) BC-160  
Plastic Ball Grid Array (PBGA) B-169  
Solder Mask Defined  
Solder Mask Defined  
0.55 mm diameter  
0.56 mm diameter  
Rev. D  
|
Page 57 of 60 | September 2006  
ADSP-BF533  
ORDERING GUIDE  
Temperature  
Range1  
Package Instruction Operating Voltage  
Option Rate (Max) (Nom)  
Model  
Package Description  
ADSP-BF533SKBC600  
0°C to +70°C  
160-Ball Chip Scale Package  
Ball Grid Array (Mini-BGA)  
BC-160 600 MHz  
BC-160 600 MHz  
BC-160 500 MHz  
BC-160 500 MHz  
BC-160 500 MHz  
1.26 V Internal  
1.8 V, 2.5 V or 3.3 V I/O  
ADSP-BF533SKBCZ6002 0°C to +70°C  
160-Ball Chip Scale Package  
Ball Grid Array (Mini-BGA)  
1.26 V Internal  
1.8 V, 2.5 V or 3.3 V I/O  
ADSP-BF533SBBC500  
–40°C to +85°C 160-Ball Chip Scale Package  
Ball Grid Array (Mini-BGA)  
1.26 V Internal  
1.8 V, 2.5 V or 3.3 V I/O  
ADSP-BF533SBBCZ5002 –40°C to +85°C 160-Ball Chip Scale Package  
Ball Grid Array (Mini-BGA)  
ADSP-BF533WBBCZ-5A2, 3 –40°C to +85°C 160-Ball Chip Scale Package  
Ball Grid Array (Mini-BGA)  
1.26 V Internal  
1.8 V, 2.5 V or 3.3 V I/O  
1.26 V Internal, 3.0 V or 3.3 V I/O  
ADSP-BF533SBB500  
ADSP-BF533SBBZ5002  
ADSP-BF533WBBZ-5A2, 3 –40°C to +85°C 169-Ball Plastic Ball Grid Array (PBGA) B-169  
–40°C to +85°C 169-Ball Plastic Ball Grid Array (PBGA) B-169  
500 MHz  
500 MHz  
500 MHz  
1.26 V Internal, 2.5 V or 3.3 V I/O  
1.26 V Internal, 2.5 V or 3.3 V I/O  
1.26 V Internal, 3.0 V or 3.3 V I/O  
–40°C to +85°C 169-Ball Plastic Ball Grid Array (PBGA) B-169  
1 Referenced temperature is ambient temperature.  
2 Z = Pb-free part.  
3 Automotive grade part.  
Rev. D  
|
Page 58 of 60 | September 2006  
ADSP-BF533  
Rev. D  
|
Page 59 of 60 | September 2006  
ADSP-BF533  
©2006 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
D05992-0-9/06(D)  
Rev. D  
|
Page 60 of 60 | September 2006  

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