ADSP-BF561SKBCZ5002 [ADI]

Blackfin㈢ Embedded Symmetric Multiprocessor; Blackfin㈢嵌入式对称多处理器
ADSP-BF561SKBCZ5002
型号: ADSP-BF561SKBCZ5002
厂家: ADI    ADI
描述:

Blackfin㈢ Embedded Symmetric Multiprocessor
Blackfin㈢嵌入式对称多处理器

文件: 总64页 (文件大小:3260K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Blackfin® Embedded  
Symmetric Multiprocessor  
ADSP-BF561  
Two internal memory-to-memory DMAs and one internal  
memory DMA controller  
12 general-purpose 32-bit timers/counters with PWM  
capability  
SPI-compatible port  
UART with support for IrDA®  
Dual watchdog timers  
Dual 32-bit core timers  
48 programmable flags (GPIO)  
On-chip phase-locked loop capable of 0.5× to 64× frequency  
multiplication  
Two parallel input/output peripheral interface units support-  
ing ITU-R 656 video and glueless interface to analog front  
end ADCs  
Two dual channel, full duplex synchronous serial ports sup-  
porting eight stereo I2S channels  
FEATURES  
Dual symmetric 600 MHz high performance Blackfin cores  
328K bytes of on-chip memory  
(see Memory Architecture on Page 4)  
Each Blackfin core includes:  
Two 16-bit MACs, two 40-bit ALUs, four 8-bit video ALUs,  
40-bit shifter  
RISC-like register and instruction model for ease of pro-  
gramming and compiler-friendly support  
Advanced debug, trace, and performance monitoring  
0.8 V to 1.35 V core VDD with on-chip voltage regulator  
2.5 V and 3.3 V compliant I/O  
256-ball CSP_BGA (two sizes) and 297-ball PBGA  
package options  
PERIPHERALS  
Dual 12-channel DMA controllers  
(supporting 24 peripheral DMAs)  
Four memory-to-memory DMAs  
IRQ CONTROL/  
WATCHDOG  
TIMER  
JTAG TEST  
EMULATION  
IRQ CONTROL/  
WATCHDOG  
TIMER  
VOLTAGE  
REGULATOR  
UART  
IrDA  
B
B
SPI  
L1  
DATA  
MEMORY  
L1  
DATA  
MEMORY  
L1  
L1  
L2 SRAM  
128K BYTES  
INSTRUCTION  
MEMORY  
INSTRUCTION  
MEMORY  
SPORT0  
SPORT1  
GPIO  
IMDMA  
CONTROLLER  
CORE SYSTEM/BUS INTERFACE  
EAB  
DMA  
CONTROLLER1  
32  
TIMERS  
DMA  
CONTROLLER2  
DEB  
DAB  
16  
BOOT ROM  
16  
32  
DAB  
PAB  
EXTERNAL PORT  
FLASH/SDRAM CONTROL  
PPI0  
PPI1  
Figure 1. Functional Block Diagram  
Blackfin and the Blackfin logo are registered trademarks of Analog Devices, Inc.  
Rev. B  
Information furnished by Analog Devices is believed to be accurate and reliable.  
However, no responsibility is assumed by Analog Devices for its use, nor for any  
infringements of patents or other rights of third parties that may result from its use.  
Specifications subject to change without notice. No license is granted by implication  
or otherwise under any patent or patent rights of Analog Devices. Trademarks and  
registered trademarks are the property of their respective owners.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 U.S.A.  
Tel: 781.329.4700  
Fax: 781.461.3113  
www.analog.com  
©2007 Analog Devices, Inc. All rights reserved.  
ADSP-BF561  
TABLE OF CONTENTS  
General Description ................................................. 3  
Portable Low Power Architecture ............................. 3  
Blackfin Processor Core .......................................... 3  
Memory Architecture ............................................ 4  
DMA Controllers .................................................. 8  
Watchdog Timer .................................................. 8  
Timers ............................................................... 9  
Serial Ports (SPORTs) ............................................ 9  
Serial Peripheral Interface (SPI) Port ......................... 9  
UART Port .......................................................... 9  
Programmable Flags (PFx) .................................... 10  
Parallel Peripheral Interface ................................... 10  
Dynamic Power Management ................................ 11  
Voltage Regulation .............................................. 12  
Voltage Regulator Layout Guidelines .................... 12  
Clock Signals ..................................................... 13  
Booting Modes ................................................... 14  
Instruction Set Description ................................... 14  
Development Tools ............................................. 15  
Designing an Emulator-Compatible Processor Board .. 16  
Related Documents ............................................. 16  
Pin Descriptions .................................................... 17  
Specifications ........................................................ 20  
Operating Conditions .......................................... 20  
Electrical Characteristics ....................................... 20  
Absolute Maximum Ratings .................................. 21  
Package Information ........................................... 21  
ESD Sensitivity ................................................... 21  
Timing Specifications .......................................... 22  
Clock and Reset Timing .................................... 23  
Asynchronous Memory Read Cycle Timing ........... 24  
Asynchronous Memory Write Cycle Timing .......... 25  
SDRAM Interface Timing .................................. 26  
External Port Bus Request and Grant Cycle Timing .. 27  
Parallel Peripheral Interface Timing ..................... 28  
Serial Ports ..................................................... 32  
Programmable Flags Cycle Timing ....................... 38  
Timer Cycle Timing .......................................... 39  
JTAG Test and Emulation Port Timing .................. 40  
Output Drive Currents ......................................... 41  
Power Dissipation ............................................... 42  
Test Conditions .................................................. 42  
Environmental Conditions .................................... 44  
256-Ball CSP_BGA Ball Assignment ........................... 46  
256-Ball CSP_BGA Ball Assignment ........................... 51  
297-Ball PBGA ball assignment .................................. 56  
Outline Dimensions ................................................ 61  
Ordering Guide ..................................................... 64  
REVISION HISTORY  
4/07—Changes from Rev. A to Rev. B  
Added Text to Serial Ports (SPORTs)............................. 9  
Changed Font in Formula in Power Savings ...................12  
Complete Rewrite of Operating Conditions ....................20  
Complete Rewrite of Electrical Characteristics ................20  
Edit to Figure Asynchronous Memory Read Cycle Timing .24  
Edit to Figure Asynchronous Memory Write Cycle Timing 25  
Deleted References to Temperature in Figures  
in Output Drive Currents ..........................................41  
Moved Data to Operating Conditions  
and Rewrote Power Dissipation ..................................42  
Deleted References to Temperature in Figures  
in Test Conditions ...................................................42  
Added figures for 256-Ball CSP_BGA Ball Configuration (Top  
View) ....................................................................50  
Added figure 256-Ball Chip Scale Package Ball Grid Array  
(CSP_BGA) (BC-256-4).............................................61  
Added Models to Ordering Guide ................................64  
5/06—Changes from Rev. 0 to Rev. A  
1/05—Initial version  
Serial Peripheral Interface (SPI) Port—  
Master Timing ............................................. 35  
Serial Peripheral Interface (SPI) Port—  
Slave Timing ............................................... 36  
Universal Asynchronous Receiver Transmitter (UART)  
Port—Receive and Transmit Timing ................. 37  
Rev. B  
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Page 2 of 64  
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June 2007  
ADSP-BF561  
GENERAL DESCRIPTION  
The ADSP-BF561 processor is a high performance member of  
the Blackfin family of products targeting a variety of multime-  
dia, industrial, and telecommunications applications. At the  
heart of this device are two independent Analog Devices Black-  
fin processors. These Blackfin processors combine a dual-MAC  
state-of-the-art signal processing engine, the advantage of a  
clean, orthogonal RISC-like microprocessor instruction set, and  
single instruction, multiple data (SIMD) multimedia capabilities  
in a single instruction set architecture.  
The powerful 40-bit shifter has extensive capabilities for per-  
forming shifting, rotating, normalization, extraction, and  
depositing of data. The data for the computational units is  
found in a multiported register file of sixteen 16-bit entries or  
eight 32-bit entries.  
A powerful program sequencer controls the flow of instruction  
execution, including instruction alignment and decoding. The  
sequencer supports conditional jumps and subroutine calls, as  
well as zero overhead looping. A loop buffer stores instructions  
locally, eliminating instruction memory accesses for tight  
looped code.  
The ADSP-BF561 processor has 328K bytes of on-chip memory.  
Each Blackfin core includes:  
• 16K bytes of instruction SRAM/cache  
• 16K bytes of instruction SRAM  
Two data address generators (DAGs) provide addresses for  
simultaneous dual operand fetches from memory. The DAGs  
share a register file containing four sets of 32-bit Index, Modify,  
Length, and Base registers. Eight additional 32-bit registers  
provide pointers for general indexing of variables and stack  
locations.  
• 32K bytes of data SRAM/cache  
• 32K bytes of data SRAM  
• 4K bytes of scratchpad SRAM  
Blackfin processors support a modified Harvard architecture in  
combination with a hierarchical memory structure. Level 1 (L1)  
memories are those that typically operate at the full processor  
speed with little or no latency. Level 2 (L2) memories are other  
memories, on-chip or off-chip, that may take multiple processor  
cycles to access. At the L1 level, the instruction memory holds  
instructions only. The two data memories hold data, and a dedi-  
cated scratchpad data memory stores stack and local variable  
information. At the L2 level, there is a single unified memory  
space, holding both instructions and data.  
Additional on-chip memory peripherals include:  
• 128K bytes of low latency on-chip L2 SRAM  
• Four-channel internal memory DMA controller  
• External memory controller with glueless support for  
SDRAM, mobile SDRAM, SRAM, and flash.  
PORTABLE LOW POWER ARCHITECTURE  
Blackfin processors provide world-class power management  
and performance. Blackfin processors are designed in a low  
power and low voltage design methodology and feature  
dynamic power management, the ability to vary both the voltage  
and frequency of operation to significantly lower overall power  
consumption. Varying the voltage and frequency can result in a  
substantial reduction in power consumption, compared with  
just varying the frequency of operation. This translates into  
longer battery life for portable appliances.  
In addition, half of L1 instruction memory and half of L1 data  
memory may be configured as either Static RAMs (SRAMs) or  
caches. The Memory Management Unit (MMU) provides mem-  
ory protection for individual tasks that may be operating on the  
core and may protect system registers from unintended access.  
The architecture provides three modes of operation: user mode,  
supervisor mode, and emulation mode. User mode has  
restricted access to certain system resources, thus providing a  
protected software environment, while supervisor mode has  
unrestricted access to the system and core resources.  
BLACKFIN PROCESSOR CORE  
As shown in Figure 2, each Blackfin core contains two multi-  
plier/accumulators (MACs), two 40-bit ALUs, four video ALUs,  
and a single shifter. The computational units process 8-bit,  
16-bit, or 32-bit data from the register file.  
The Blackfin instruction set has been optimized so that 16-bit  
op-codes represent the most frequently used instructions,  
resulting in excellent compiled code density. Complex DSP  
instructions are encoded into 32-bit op-codes, representing fully  
featured multifunction instructions. Blackfin processors sup-  
port a limited multi-issue capability, where a 32-bit instruction  
can be issued in parallel with two 16-bit instructions, allowing  
the programmer to use many of the core resources in a single  
instruction cycle.  
Each MAC performs a 16-bit by 16-bit multiply in every cycle,  
with accumulation to a 40-bit result, providing eight bits of  
extended precision. The ALUs perform a standard set of arith-  
metic and logical operations. With two ALUs capable of  
operating on 16-bit or 32-bit data, the flexibility of the computa-  
tion units covers the signal processing requirements of a varied  
set of application needs.  
The Blackfin assembly language uses an algebraic syntax for  
ease of coding and readability. The architecture has been opti-  
mized for use in conjunction with the VisualDSP C/C++  
compiler, resulting in fast and efficient software  
implementations.  
Each of the two 32-bit input registers can be regarded as two  
16-bit halves, so each ALU can accomplish very flexible single  
16-bit arithmetic operations. By viewing the registers as pairs of  
16-bit operands, dual 16-bit or single 32-bit operations can be  
accomplished in a single cycle. By further taking advantage of  
the second ALU, quad 16-bit operations can be accomplished  
simply, accelerating the per cycle throughput.  
Rev. B  
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Page 3 of 64  
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June 2007  
ADSP-BF561  
ADDRESS ARITHMETIC UNIT  
SP  
FP  
P5  
P4  
P3  
P2  
P1  
P0  
I3  
I2  
I1  
I0  
L3  
L2  
L1  
L0  
B3  
B2  
B1  
B0  
M3  
M2  
M1  
M0  
DAG1  
DAG0  
DA1  
DA0  
32  
32  
32  
PREG  
32  
RAB  
SD  
LD1  
LD0  
32  
32  
32  
ASTAT  
32  
32  
SEQUENCER  
R7.H  
R7.L  
R6.H  
R5.H  
R4.H  
R3.H  
R2.H  
R1.H  
R0.H  
R6.L  
R5.L  
R4.L  
R3.L  
R2.L  
R1.L  
R0.L  
ALIGN  
16  
16  
8
8
8
8
DECODE  
BARREL  
SHIFTER  
LOOP BUFFER  
40  
40  
40 40  
A0  
A1  
CONTROL  
UNIT  
32  
32  
DATA ARITHMETIC UNIT  
Figure 2. Blackfin Processor Core  
Internal (On-Chip) Memory  
MEMORY ARCHITECTURE  
The ADSP-BF561 has four blocks of on-chip memory providing  
high bandwidth access to the core.  
The ADSP-BF561 views memory as a single unified 4G byte  
address space, using 32-bit addresses. All resources including  
internal memory, external memory, and I/O control registers  
occupy separate sections of this common address space. The  
memory portions of this address space are arranged in a hierar-  
chical structure to provide a good cost/performance balance of  
some very fast, low latency memory as cache or SRAM very  
close to the processor, and larger, lower cost and performance  
memory systems farther away from the processor. The  
ADSP-BF561 memory map is shown in Figure 3.  
The first is the L1 instruction memory of each Blackfin core  
consisting of 16K bytes of four-way set-associative cache mem-  
ory and 16K bytes of SRAM. The cache memory may also be  
configured as an SRAM. This memory is accessed at full proces-  
sor speed. When configured as SRAM, each of the two 16K  
banks of memory is broken into 4K sub-banks which can be  
independently accessed by the processor and DMA.  
The second on-chip memory block is the L1 data memory of  
each Blackfin core which consists of four banks of 16K bytes  
each. Two of the L1 data memory banks can be configured as  
one way of a two-way set-associative cache or as an SRAM. The  
other two banks are configured as SRAM. All banks are accessed  
at full processor speed. When configured as SRAM, each of the  
four 16K banks of memory is broken into 4K sub-banks which  
can be independently accessed by the processor and DMA.  
The L1 memory system in each core is the highest performance  
memory available to each Blackfin core. The L2 memory pro-  
vides additional capacity with lower performance. Lastly, the  
off-chip memory system, accessed through the External Bus  
Interface Unit (EBIU), provides expansion with SDRAM, flash  
memory, and SRAM, optionally accessing more than  
768M bytes of physical memory. The memory DMA controllers  
provide high bandwidth data movement capability. They can  
perform block transfers of code or data between the internal  
L1/L2 memories and the external memory spaces.  
The third memory block associated with each core is a 4K byte  
scratchpad SRAM which runs at the same speed as the L1 mem-  
ories, but is only accessible as data SRAM (it cannot be  
configured as cache memory and is not accessible via DMA).  
Rev. B  
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Page 4 of 64  
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June 2007  
ADSP-BF561  
CORE A MEMORY MAP  
CORE MMR REGISTERS  
CORE B MEMORY MAP  
0xFFFF FFFF  
CORE MMR REGISTERS  
0xFFE0 0000  
0xFFC0 0000  
0xFFB0 1000  
0xFFB0 0000  
0xFFA1 4000  
0xFFA1 0000  
0xFFA0 4000  
0xFFA0 0000  
0xFF90 8000  
0xFF90 4000  
0xFF90 0000  
0xFF80 8000  
0xFF80 4000  
0xFF80 0000  
SYSTEM MMR REGISTERS  
RESERVED  
L1 SCRATCHPAD SRAM (4K)  
RESERVED  
L1 INSTRUCTION SRAM/CACHE (16K)  
RESERVED  
L1 INSTRUCTION SRAM (16K)  
RESERVED  
RESERVED  
L1 DATA BANK B SRAM/CACHE (16K)  
L1 DATA BANK B SRAM (16K)  
RESERVED  
L1 DATA BANK A SRAM/CACHE (16K)  
L1 DATA BANK A SRAM (16K)  
0xFF80 0000  
0xFF70 1000  
RESERVED  
INTERNAL MEMORY  
L1 SCRATCHPAD SRAM (4K)  
RESERVED  
0xFF70 0000  
0xFF61 4000  
L1 INSTRUCTION SRAM/CACHE (16K)  
RESERVED  
0xFF61 0000  
0xFF60 4000  
L1 INSTRUCTION SRAM (16K)  
RESERVED  
RESERVED  
0xFF60 0000  
0xFF50 8000  
L1 DATA BANK B SRAM/CACHE (16K)  
L1 DATA BANK B SRAM (16K)  
RESERVED  
0xFF50 4000  
0xFF50 0000  
0xFF40 8000  
0xFF40 4000  
0xFF40 0000  
L1 DATA BANK A SRAM/CACHE (16K)  
L1 DATA BANK A SRAM (16K)  
RESERVED  
0xFEB2 0000  
L2 SRAM (128K)  
RESERVED  
0xFEB0 0000  
0xEF00 4000  
0xEF00 0000  
BOOT ROM  
RESERVED  
0x3000 0000  
0x2C00 0000  
ASYNC MEMORY BANK 3  
ASYNC MEMORY BANK 2  
ASYNC MEMORY BANK 1  
ASYNC MEMORY BANK 0  
0x2800 0000  
0x2400 0000  
0x2000 0000  
RESERVED  
SDRAM BANK 3  
SDRAM BANK 2  
EXTERNAL MEMORY  
Top of last SDRAM page  
SDRAM BANK 1  
SDRAM BANK 0  
0x0000 0000  
Figure 3. Memory Map  
The fourth on-chip memory system is the L2 SRAM memory  
array which provides 128K bytes of high speed SRAM operating  
at one half the frequency of the core, and slightly longer latency  
than the L1 memory banks. The L2 memory is a unified instruc-  
tion and data memory and can hold any mixture of code and  
data required by the system design. The Blackfin cores share a  
dedicated low latency 64-bit wide data path port into the L2  
SRAM memory.  
(SDRAM) as well as up to four banks of asynchronous memory  
devices, including flash, EPROM, ROM, SRAM, and memory  
mapped I/O devices.  
The PC133-compliant SDRAM controller can be programmed  
to interface to up to four banks of SDRAM, with each bank con-  
taining between 16M bytes and 128M bytes providing access to  
up to 512M bytes of SDRAM. Each bank is independently pro-  
grammable and is contiguous with adjacent banks regardless of  
the sizes of the different banks or their placement. This allows  
flexible configuration and upgradability of system memory  
while allowing the core to view all SDRAM as a single, contigu-  
ous, physical address space.  
Each Blackfin core processor has its own set of core Memory  
Mapped Registers (MMRs) but share the same system MMR  
registers and 128K bytes L2 SRAM memory.  
External (Off-Chip) Memory  
The asynchronous memory controller can also be programmed  
to control up to four banks of devices with very flexible timing  
parameters for a wide variety of devices. Each bank occupies a  
The ADSP-BF561 external memory is accessed via the External  
Bus Interface Unit (EBIU). This interface provides a glueless  
connection to up to four banks of synchronous DRAM  
Rev. B  
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Page 5 of 64  
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June 2007  
ADSP-BF561  
64M byte segment regardless of the size of the devices used so  
that these banks will only be contiguous if fully populated with  
64M bytes of memory.  
The ADSP-BF561 event controller consists of two stages: the  
Core Event Controller (CEC) and the System Interrupt Control-  
ler (SIC). The Core Event Controller works with the System  
Interrupt Controller to prioritize and control all system events.  
Conceptually, interrupts from the peripherals enter into the  
SIC, and are then routed directly into the general-purpose  
interrupts of the CEC.  
I/O Memory Space  
Blackfin processors do not define a separate I/O space. All  
resources are mapped through the flat 32-bit address space. On-  
chip I/O devices have their control registers mapped into mem-  
ory mapped registers (MMRs) at addresses near the top of the  
4G byte address space. These are separated into two smaller  
blocks, one which contains the control MMRs for all core func-  
tions, and the other which contains the registers needed for  
setup and control of the on-chip peripherals outside of the core.  
The core MMRs are accessible only by the core and only in  
supervisor mode and appear as reserved space by on-chip  
peripherals. The system MMRs are accessible by the core in  
supervisor mode and can be mapped as either visible or reserved  
to other devices, depending on the system protection  
model desired.  
Core Event Controller (CEC)  
The CEC supports nine general-purpose interrupts (IVG15–7),  
in addition to the dedicated interrupt and exception events. Of  
these general-purpose interrupts, the two lowest priority inter-  
rupts (IVG15–14) are recommended to be reserved for software  
interrupt handlers, leaving seven prioritized interrupt inputs to  
support the peripherals of the ADSP-BF561. Table 1 describes  
the inputs to the CEC, identifies their names in the Event Vector  
Table (EVT), and lists their priorities.  
Table 1. Core Event Controller (CEC)  
Priority  
(0 is Highest)  
Booting  
Event Class  
EVT Entry  
EMU  
The ADSP-BF561 contains a small boot kernel, which config-  
ures the appropriate peripheral for booting. If the ADSP-BF561  
is configured to boot from boot ROM memory space, the pro-  
cessor starts executing from the on-chip boot ROM.  
0
Emulation/Test Control  
Reset  
1
RST  
2
Nonmaskable Interrupt  
Exceptions  
NMI  
3
EVX  
Event Handling  
4
Global Enable  
The event controller on the ADSP-BF561 handles all asynchro-  
nous and synchronous events to the processor. The  
5
Hardware Error  
IVHW  
IVTMR  
IVG7  
6
Core Timer  
ADSP-BF561 provides event handling that supports both nest-  
ing and prioritization. Nesting allows multiple event service  
routines to be active simultaneously. Prioritization ensures that  
servicing of a higher priority event takes precedence over servic-  
ing of a lower priority event. The controller provides support for  
five different types of events:  
7
General Interrupt 7  
General Interrupt 8  
General Interrupt 9  
General Interrupt 10  
General Interrupt 11  
General Interrupt 12  
General Interrupt 13  
General Interrupt 14  
General Interrupt 15  
8
IVG8  
9
IVG9  
10  
11  
12  
13  
14  
15  
IVG10  
IVG11  
IVG12  
IVG13  
IVG14  
IVG15  
• Emulation – An emulation event causes the processor to  
enter emulation mode, allowing command and control of  
the processor via the JTAG interface.  
• Reset – This event resets the processor.  
• Nonmaskable Interrupt (NMI) – The NMI event can be  
generated by the software watchdog timer or by the NMI  
input signal to the processor. The NMI event is frequently  
used as a power-down indicator to initiate an orderly shut-  
down of the system.  
System Interrupt Controller (SIC)  
The System Interrupt Controller provides the mapping and  
routing of events from the many peripheral interrupt sources to  
the prioritized general-purpose interrupt inputs of the CEC.  
Although the ADSP-BF561 provides a default mapping, the user  
can alter the mappings and priorities of interrupt events by writ-  
ing the appropriate values into the Interrupt Assignment  
Registers (SIC_IAR7–0). Table 2 describes the inputs into the  
SIC and the default mappings into the CEC.  
• Exceptions – Events that occur synchronously to program  
flow, i.e., the exception will be taken before the instruction  
is allowed to complete. Conditions such as data alignment  
violations or undefined instructions cause exceptions.  
• Interrupts – Events that occur asynchronously to program  
flow. They are caused by timers, peripherals, input pins,  
and an explicit software instruction.  
Each event has an associated register to hold the return address  
and an associated “return from event” instruction. When an  
event is triggered, the state of the processor is saved on the  
supervisor stack.  
Rev. B  
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Page 6 of 64  
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June 2007  
ADSP-BF561  
Table 2. System Interrupt Controller (SIC)  
Table 2. System Interrupt Controller (SIC) (Continued)  
Default  
Default  
Peripheral Interrupt Event  
PLL Wakeup  
Mapping  
Peripheral Interrupt Event  
Mapping  
IVG7  
IVG7  
IVG7  
IVG7  
IVG7  
IVG7  
IVG7  
IVG7  
IVG7  
IVG7  
IVG7  
IVG8  
IVG8  
IVG8  
IVG8  
IVG8  
IVG8  
IVG8  
IVG8  
IVG8  
IVG8  
IVG8  
IVG8  
IVG9  
IVG9  
IVG9  
IVG9  
IVG9  
IVG9  
IVG9  
IVG9  
IVG9  
IVG9  
IVG9  
IVG9  
IVG10  
IVG10  
IVG10  
IVG10  
IVG10  
IVG10  
IVG10  
IVG10  
IVG10  
IVG10  
Timer10 Interrupt  
IVG10  
IVG10  
IVG11  
IVG11  
IVG11  
IVG11  
IVG11  
IVG11  
IVG8  
DMA1 Error (Generic)  
DMA2 Error (Generic)  
IMDMA Error  
Timer11 Interrupt  
Programmable Flags 15–0 Interrupt A  
Programmable Flags 15–0 Interrupt B  
Programmable Flags 31–16 Interrupt A  
Programmable Flags 31–16 Interrupt B  
Programmable Flags 47–32 Interrupt A  
Programmable Flags 47–32 Interrupt B  
PPI0 Error  
PPI1 Error  
SPORT0 Error  
SPORT1 Error  
SPI Error  
DMA1 Channel 12/13 Interrupt  
(Memory DMA/Stream 0)  
UART Error  
DMA1 Channel 14/15 Interrupt  
(Memory DMA/Stream 1)  
IVG8  
IVG9  
IVG9  
Reserved  
DMA1 Channel 0 Interrupt (PPI0)  
DMA1 Channel 1 Interrupt (PPI1)  
DMA1 Channel 2 Interrupt  
DMA1 Channel 3 Interrupt  
DMA1 Channel 4 Interrupt  
DMA1 Channel 5 Interrupt  
DMA1 Channel 6 Interrupt  
DMA1 Channel 7 Interrupt  
DMA1 Channel 8 Interrupt  
DMA1 Channel 9 Interrupt  
DMA1 Channel 10 Interrupt  
DMA1 Channel 11 Interrupt  
DMA2 Channel 0 Interrupt (SPORT0 Rx)  
DMA2 Channel 1 Interrupt (SPORT0 Tx)  
DMA2 Channel 2 Interrupt (SPORT1 Rx)  
DMA2 Channel 3 Interrupt (SPORT1 Tx)  
DMA2 Channel 4 Interrupt (SPI)  
DMA2 Channel 5 Interrupt (UART Rx)  
DMA2 Channel 6 Interrupt (UART Tx)  
DMA2 Channel 7 Interrupt  
DMA2 Channel 8 Interrupt  
DMA2 Channel 9 Interrupt  
DMA2 Channel 10 Interrupt  
DMA2 Channel 11 Interrupt  
Timer0 Interrupt  
DMA2 Channel 12/13 Interrupt  
(Memory DMA/Stream 0)  
DMA2 Channel 14/15 Interrupt  
(Memory DMA/Stream 1)  
IMDMA Stream 0 Interrupt  
IMDMA Stream 1 Interrupt  
Watchdog Timer Interrupt  
Reserved  
IVG12  
IVG12  
IVG13  
IVG7  
Reserved  
IVG7  
Supplemental Interrupt 0  
Supplemental Interrupt 1  
IVG7  
IVG7  
Event Control  
The ADSP-BF561 provides the user with a very flexible mecha-  
nism to control the processing of events. In the CEC, three  
registers are used to coordinate and control events. Each of the  
registers is 16 bits wide, while each bit represents a particular  
event class.  
• CEC Interrupt Latch Register (ILAT) – The ILAT register  
indicates when events have been latched. The appropriate  
bit is set when the processor has latched the event and  
cleared when the event has been accepted into the system.  
This register is updated automatically by the controller, but  
may also be written to clear (cancel) latched events. This  
register may be read while in supervisor mode and may  
only be written while in supervisor mode when the corre-  
sponding IMASK bit is cleared.  
Timer1 Interrupt  
• CEC Interrupt Mask Register (IMASK) – The IMASK reg-  
ister controls the masking and unmasking of individual  
events. When a bit is set in the IMASK register, that event is  
unmasked and will be processed by the CEC when asserted.  
A cleared bit in the IMASK register masks the event,  
thereby preventing the processor from servicing the event  
even though the event may be latched in the ILAT register.  
This register may be read from or written to while in  
supervisor mode.  
Timer2 Interrupt  
Timer3 Interrupt  
Timer4 Interrupt  
Timer5 Interrupt  
Timer6 Interrupt  
Timer7 Interrupt  
Timer8 Interrupt  
Timer9 Interrupt  
Rev. B  
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ADSP-BF561  
Note that general-purpose interrupts can be globally  
enabled and disabled with the STI and CLI instructions,  
respectively.  
controller. DMA-capable peripherals include the SPORTs, SPI  
port, UART, and PPIs. Each individual DMA-capable periph-  
eral has at least one dedicated DMA channel.  
• CEC Interrupt Pending Register (IPEND) – The IPEND  
register keeps track of all nested events. A set bit in the  
IPEND register indicates the event is currently active or  
nested at some level. This register is updated automatically  
by the controller but may be read while in supervisor mode.  
The ADSP-BF561 DMA controllers support both 1-dimen-  
sional (1-D) and 2-dimensional (2-D) DMA transfers. DMA  
transfer initialization can be implemented from registers or  
from sets of parameters called descriptor blocks.  
The 2-D DMA capability supports arbitrary row and column  
sizes up to 64K elements by 64K elements, and arbitrary row  
and column step sizes up to ± 32K elements. Furthermore, the  
column step size can be less than the row step size, allowing  
implementation of interleaved data streams. This feature is  
especially useful in video applications where data can be de-  
interleaved on the fly.  
The SIC allows further control of event processing by providing  
six 32-bit interrupt control and status registers. Each register  
contains a bit corresponding to each of the peripheral interrupt  
events shown in Table 2.  
• SIC Interrupt Mask Registers (SIC_IMASKx) – These reg-  
isters control the masking and unmasking of each  
peripheral interrupt event. When a bit is set in these regis-  
ters, that peripheral event is unmasked and will be  
processed by the system when asserted. A cleared bit in  
these registers masks the peripheral event, thereby prevent-  
ing the processor from servicing the event.  
Examples of DMA types supported by the ADSP-BF561 DMA  
controllers include:  
• A single linear buffer that stops upon completion.  
• A circular autorefreshing buffer that interrupts on each full  
or fractionally full buffer.  
• SIC Interrupt Status Registers (SIC_ISRx) – As multiple  
peripherals can be mapped to a single event, these registers  
allow the software to determine which peripheral event  
source triggered the interrupt. A set bit indicates the  
peripheral is asserting the interrupt; a cleared bit indicates  
the peripheral is not asserting the event.  
• 1-D or 2-D DMA using a linked list of descriptors.  
• 2-D DMA using an array of descriptors, specifying only the  
base DMA address within a common page.  
In addition to the dedicated peripheral DMA channels, each  
DMA Controller has four memory DMA channels provided for  
transfers between the various memories of the ADSP-BF561  
system. These enable transfers of blocks of data between any of  
the memories—including external SDRAM, ROM, SRAM, and  
flash memory—with minimal processor intervention. Memory  
DMA transfers can be controlled by a very flexible descriptor-  
based methodology or by a standard register-based autobuffer  
mechanism.  
• SIC Interrupt Wakeup Enable Registers (SIC_IWRx) – By  
enabling the corresponding bit in these registers, each  
peripheral can be configured to wake up the processor,  
should the processor be in a powered-down mode when  
the event is generated.  
Because multiple interrupt sources can map to a single general-  
purpose interrupt, multiple pulse assertions can occur simulta-  
neously, before or during interrupt processing for an interrupt  
event already detected on this interrupt input. The IPEND reg-  
ister contents are monitored by the SIC as the interrupt  
acknowledgement.  
Further, the ADSP-BF561 has a four channel Internal Memory  
DMA (IMDMA) Controller. The IMDMA Controller allows  
data transfers between any of the internal L1 and L2 memories.  
WATCHDOG TIMER  
The appropriate ILAT register bit is set when an interrupt rising  
edge is detected (detection requires two core clock cycles). The  
bit is cleared when the respective IPEND register bit is set. The  
IPEND bit indicates that the event has entered into the proces-  
sor pipeline. At this point the CEC will recognize and queue the  
next rising edge event on the corresponding event input. The  
minimum latency from the rising edge transition of the general-  
purpose interrupt to the IPEND output asserted is three core  
clock cycles; however, the latency can be much higher, depend-  
ing on the activity within and the mode of the processor.  
Each ADSP-BF561 core includes a 32-bit timer, which can be  
used to implement a software watchdog function. A software  
watchdog can improve system availability by forcing the proces-  
sor to a known state, via generation of a hardware reset,  
nonmaskable interrupt (NMI), or general-purpose interrupt, if  
the timer expires before being reset by software. The program-  
mer initializes the count value of the timer, enables the  
appropriate interrupt, then enables the timer. Thereafter, the  
software must reload the counter before it counts to zero from  
the programmed value. This protects the system from remain-  
ing in an unknown state where software, which would normally  
reset the timer, has stopped running due to an external noise  
condition or software error.  
DMA CONTROLLERS  
The ADSP-BF561 has two independent DMA controllers that  
support automated data transfers with minimal overhead for  
the DSP cores. DMA transfers can occur between the  
ADSP-BF561 internal memories and any of its DMA-capable  
peripherals. Additionally, DMA transfers can be accomplished  
between any of the DMA-capable peripherals and external  
devices connected to the external memory interfaces, including  
the SDRAM controller and the asynchronous memory  
After a reset, software can determine if the watchdog was the  
source of the hardware reset by interrogating a status bit in the  
timer control register, which is set only upon a watchdog gener-  
ated reset.  
Rev. B  
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ADSP-BF561  
The timer is clocked by the system clock (SCLK) at a maximum  
• Interrupts – Each transmit and receive port generates an  
interrupt upon completing the transfer of a data word or  
after transferring an entire data buffer or buffers through  
DMA.  
frequency of fSCLK  
.
TIMERS  
There are 14 programmable timer units in the ADSP-BF561.  
• Multichannel capability – Each SPORT supports 128 chan-  
nels out of a 1,024-channel window and is compatible with  
the H.100, H.110, MVIP-90, and HMVIP standards.  
Each of the 12 general-purpose timer units can be indepen-  
dently programmed as a Pulse Width Modulator (PWM),  
internally or externally clocked timer, or pulse width counter.  
The general-purpose timer units can be used in conjunction  
with the UART to measure the width of the pulses in the data  
stream to provide an autobaud detect function for a serial chan-  
nel. The general-purpose timers can generate interrupts to the  
processor core providing periodic events for synchronization,  
either to the processor clock or to a count of external signals.  
An additional 250 mV of SPORT input hysteresis can be  
enabled by setting Bit 15 of the PLL_CTL register. When this bit  
is set, all SPORT input pins have the increased hysteresis.  
SERIAL PERIPHERAL INTERFACE (SPI) PORT  
The ADSP-BF561 processor has an SPI-compatible port that  
enables the processor to communicate with multiple SPI-com-  
patible devices.  
In addition to the 12 general-purpose programmable timers,  
another timer is also provided for each core. These extra timers  
are clocked by the internal processor clock (CCLK) and are typ-  
ically used as a system tick clock for generation of operating  
system periodic interrupts.  
The SPI interface uses three pins for transferring data: two data  
pins (master output-slave input, MOSI, and master input-slave  
output, MISO) and a clock pin (serial clock, SCK). An SPI chip  
select input pin (SPISS) lets other SPI devices select the proces-  
sor, and seven SPI chip select output pins (SPISEL7–1) let the  
processor select other SPI devices. The SPI select pins are recon-  
figured programmable flag pins. Using these pins, the SPI port  
provides a full-duplex, synchronous serial interface which sup-  
ports both master/slave modes and multimaster environments.  
SERIAL PORTS (SPORTs)  
The ADSP-BF561 incorporates two dual-channel synchronous  
serial ports (SPORT0 and SPORT1) for serial and multiproces-  
sor communications. The SPORTs support the following  
features:  
The baud rate and clock phase/polarities for the SPI port are  
programmable, and it has an integrated DMA controller, con-  
figurable to support transmit or receive data streams. The SPI  
DMA controller can only service unidirectional accesses at any  
given time.  
• I2S capable operation.  
• Bidirectional operation – Each SPORT has two sets of inde-  
pendent transmit and receive pins, enabling eight channels  
of I2S stereo audio.  
The SPI port clock rate is calculated as:  
• Buffered (8-deep) transmit and receive ports – Each port  
has a data register for transferring data words to and from  
other DSP components and shift registers for shifting data  
in and out of the data registers.  
fSCLK  
2 × SPI_BAUD  
-----------------------------------  
SPI Clock Rate =  
Where the 16-bit SPI_BAUD register contains a value of 2 to  
65,535.  
• Clocking – Each transmit and receive port can either use an  
external serial clock or generate its own, in frequencies  
ranging from (fSCLK/131,070) Hz to (fSCLK/2) Hz.  
During transfers, the SPI port simultaneously transmits and  
receives by serially shifting data in and out on its two serial data  
lines. The serial clock line synchronizes the shifting and sam-  
pling of data on the two serial data lines.  
• Word length – Each SPORT supports serial data words  
from 3 bits to 32 bits in length, transferred most significant  
bit first or least significant bit first.  
UART PORT  
• Framing – Each transmit and receive port can run with or  
without frame sync signals for each data word. Frame sync  
signals can be generated internally or externally, active high  
or low, and with either of two pulse widths and early or late  
frame sync.  
The ADSP-BF561 processor provides a full-duplex universal  
asynchronous receiver/transmitter (UART) port, which is fully  
compatible with PC-standard UARTs. The UART port provides  
a simplified UART interface to other peripherals or hosts, sup-  
porting full-duplex, DMA-supported, asynchronous transfers of  
serial data. The UART port includes support for 5 data bits to  
8 data bits, 1 stop bit or 2 stop bits, and none, even, or odd par-  
ity. The UART port supports two modes of operation:  
• Companding in hardware – Each SPORT can perform  
A-law or μ-law companding according to ITU recommen-  
dation G.711. Companding can be selected on the transmit  
and/or receive channel of the SPORT without additional  
latencies.  
• PIO (programmed I/O) – The processor sends or receives  
data by writing or reading I/O-mapped UART registers.  
The data is double-buffered on both transmit and receive.  
• DMA operations with single-cycle overhead – Each SPORT  
can automatically receive and transmit multiple buffers of  
memory data. The DSP can link or chain sequences of  
DMA transfers between a SPORT and memory.  
• DMA (direct memory access) – The DMA controller trans-  
fers both transmit and receive data. This reduces the  
number and frequency of interrupts required to transfer  
data to and from memory. The UART has two dedicated  
Rev. B  
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ADSP-BF561  
DMA channels, one for transmit and one for receive. These  
DMA channels have lower default priority than most DMA  
channels because of their relatively low service rates.  
interrupt function. PFx pins defined as inputs can be con-  
figured to generate hardware interrupts, while output PFx  
pins can be configured to generate software interrupts.  
The baud rate, serial data format, error code generation and  
status, and interrupts for the UART port are programmable.  
• Flag interrupt sensitivity registers – These registers specify  
whether individual PFx pins are level- or edge-sensitive  
and specify, if edge-sensitive, whether just the rising edge  
or both the rising and falling edges of the signal are signifi-  
cant. One register selects the type of sensitivity, and one  
register selects which edges are significant for edge  
sensitivity.  
The UART programmable features include:  
• Supporting bit rates ranging from (fSCLK/1,048,576) bits per  
second to (fSCLK/16) bits per second.  
• Supporting data formats from seven bits to 12 bits per  
frame.  
PARALLEL PERIPHERAL INTERFACE  
• Both transmit and receive operations can be configured to  
generate maskable interrupts to the processor.  
The ADSP-BF561 processor provides two parallel peripheral  
interfaces (PPI0, PPI1) that can connect directly to parallel A/D  
and D/A converters, video encoders and decoders, and other  
general-purpose peripherals. The PPI consists of a dedicated  
input clock pin, up to 3 frame synchronization pins, and up to  
16 data pins. The input clock supports parallel data rates at up to  
The UART port’s clock rate is calculated as:  
fSCLK  
-----------------------------------------------  
UART Clock Rate =  
16 × UART_Divisor  
Where the 16-bit UART_Divisor comes from the UART_DLH  
register (most significant 8 bits) and UART_DLL register (least  
significant 8 bits).  
f
SCLK/2 MHz, and the synchronization signals can be configured  
as either inputs or outputs.  
The PPI supports a variety of general-purpose and ITU-R 656  
modes of operation. In general-purpose mode, the PPI provides  
half-duplex, bi-directional data transfer with up to 16 bits of  
data. Up to 3 frame synchronization signals are also provided.  
In ITU-R 656 mode, the PPI provides half-duplex, bi-direc-  
tional transfer of 8- or 10-bit video data. Additionally, on-chip  
decode of embedded start-of-line (SOL) and start-of-field (SOF)  
preamble packets is supported.  
In conjunction with the general-purpose timer functions,  
autobaud detection is supported.  
The capabilities of the UART are further extended with support  
for the Infrared Data Association (IrDA) serial infrared physical  
layer link specification (SIR) protocol.  
PROGRAMMABLE FLAGS (PFx)  
The ADSP-BF561 has 48 bidirectional, general-purpose I/O,  
programmable flag (PF47–0) pins. Some programmable flag  
pins are used by peripherals (see Pin Descriptions on Page 17).  
When not used as a peripheral pin, each programmable flag can  
be individually controlled by manipulation of the flag control,  
status, and interrupt registers as follows:  
General-Purpose Mode Descriptions  
The general-purpose modes of the PPI are intended to suit a  
wide variety of data capture and transmission applications.  
Three distinct submodes are supported:  
• Input mode – frame syncs and data are inputs into the PPI.  
• Flag direction control register – Specifies the direction of  
each individual PFx pin as input or output.  
• Frame capture mode – frame syncs are outputs from the  
PPI, but data are inputs.  
• Flag control and status registers – Rather than forcing the  
software to use a read-modify-write process to control the  
setting of individual flags, the ADSP-BF561 employs a  
“write one to set” and “write one to clear” mechanism that  
allows any combination of individual flags to be set or  
cleared in a single instruction, without affecting the level of  
any other flags. Two control registers are provided, one  
register is written-to in order to set flag values, while  
another register is written-to in order to clear flag values.  
Reading the flag status register allows software to interro-  
gate the sense of the flags.  
• Output mode – frame syncs and data are outputs from the  
PPI.  
Input Mode  
Input mode is intended for ADC applications, as well as video  
communication with hardware signaling. In its simplest form,  
PPI_FS1 is an external frame sync input that controls when to  
read data. The PPI_DELAY MMR allows for a delay (in  
PPI_CLK cycles) between reception of this frame sync and the  
initiation of data reads. The number of input data samples is  
user programmable and defined by the contents of the  
PPI_COUNT register. The PPI supports 8-bit, and 10-bit  
through 16-bit data, and are programmable in the  
• Flag interrupt mask registers – These registers allow each  
individual PFx pin to function as an interrupt to the pro-  
cessor. Similar to the flag control registers that are used to  
set and clear individual flag values, one flag interrupt mask  
register sets bits to enable an interrupt function, and the  
other flag interrupt mask register clears bits to disable an  
PPI_CONTROL register.  
Frame Capture Mode  
Frame capture mode allows the video source(s) to act as a slave  
(e.g., for frame capture). The ADSP-BF561 processors control  
when to read from the video source(s). PPI_FS1 is an HSYNC  
output and PPI_FS2 is a VSYNC output.  
Rev. B  
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ADSP-BF561  
Table 3. Power Settings  
Output Mode  
Output mode is used for transmitting video or other data with  
up to three output frame syncs. Typically, a single frame sync is  
appropriate for data converter applications, whereas two or  
three frame syncs could be used for sending video with hard-  
ware signaling.  
Core  
Clock  
System  
Clock  
PLL  
Core  
Mode/State PLL  
Bypassed (CCLK) (SCLK) Power  
Full-On  
Active  
Enabled No  
Enabled Enabled On  
Enabled Enabled On  
Enabled/ Yes  
Disabled  
ITU-R 656 Mode Descriptions  
Sleep  
Enabled  
Disabled Enabled On  
Disabled Disabled On  
Disabled Disabled Off  
The ITU-R 656 modes of the PPI are intended to suit a wide  
variety of video capture, processing, and transmission applica-  
tions. Three distinct submodes are supported:  
Deep Sleep Disabled –  
Hibernate Disabled –  
• Active video only mode  
• Vertical blanking only mode  
• Entire field mode  
Active Operating Mode—Moderate Power Savings  
In the active mode, the PLL is enabled but bypassed. Because the  
PLL is bypassed, the processor’s core clock (CCLK) and system  
clock (SCLK) run at the input clock (CLKIN) frequency. In this  
mode, the CLKIN to CCLK multiplier ratio can be changed,  
although the changes are not realized until the full-on mode is  
entered. DMA access is available to appropriately configured L1  
and L2 memories.  
Active Video Only Mode  
Active video only mode is used when only the active video por-  
tion of a field is of interest and not any of the blanking intervals.  
The PPI does not read in any data between the end of active  
video (EAV) and start of active video (SAV) preamble symbols,  
or any data present during the vertical blanking intervals. In this  
mode, the control byte sequences are not stored to memory;  
they are filtered by the PPI. After synchronizing to the start of  
Field 1, the PPI ignores incoming samples until it sees an SAV  
code. The user specifies the number of active video lines per  
frame (in the PPI_COUNT register).  
In the active mode, it is possible to disable the PLL through the  
PLL control register (PLL_CTL). If disabled, the PLL must be  
re-enabled before transitioning to the full-on or sleep modes.  
Sleep Operating Mode—High Dynamic Power Savings  
The sleep mode reduces power dissipation by disabling the  
clock to the processor core (CCLK). The PLL and system clock  
(SCLK), however, continue to operate in this mode. Typically an  
external event will wake up the processor. When in the sleep  
mode, assertion of wakeup will cause the processor to sense the  
value of the BYPASS bit in the PLL control register (PLL_CTL).  
Vertical Blanking Interval Mode  
In this mode, the PPI only transfers vertical blanking interval  
(VBI) data.  
Entire Field Mode  
When in the sleep mode, system DMA access is only available to  
external memory, not to L1 or on-chip L2 memory.  
In this mode, the entire incoming bit stream is read in through  
the PPI. This includes active video, control preamble sequences,  
and ancillary data that may be embedded in horizontal and ver-  
tical blanking intervals. Data transfer starts immediately after  
synchronization to Field 1.  
Deep Sleep Operating Mode—Maximum Dynamic Power  
Savings  
The deep sleep mode maximizes power savings by disabling the  
clocks to the processor cores (CCLK) and to all synchronous  
peripherals (SCLK). Asynchronous peripherals will not be able  
to access internal resources or external memory. This powered-  
down mode can only be exited by assertion of the reset interrupt  
(RESET). If BYPASS is disabled, the processor will transition to  
the full-on mode. If BYPASS is enabled, the processor will tran-  
sition to the active mode.  
DYNAMIC POWER MANAGEMENT  
The ADSP-BF561 provides four power management modes and  
one power management state, each with a different perfor-  
mance/power profile. In addition, dynamic power management  
provides the control functions to dynamically alter the proces-  
sor core supply voltage, further reducing power dissipation.  
Control of clocking to each of the ADSP-BF561 peripherals also  
reduces power consumption. See Table 3 for a summary of the  
power settings for each mode.  
Hibernate State—Maximum Static Power Savings  
The hibernate state maximizes static power savings by disabling  
the voltage and clocks to the processor core (CCLK) and to all  
the synchronous peripherals (SCLK). The internal voltage regu-  
lator for the processor can be shut off by writing b#00 to the  
FREQ bits of the VR_CTL register. This disables both CCLK  
and SCLK. Furthermore, it sets the internal power supply volt-  
age (VDDINT) to 0 V to provide the lowest static power dissipation.  
Any critical information stored internally (memory contents,  
register contents, etc.) must be written to a nonvolatile storage  
device prior to removing power if the processor state is to be  
Full-On Operating Mode—Maximum Performance  
In the full-on mode, the PLL is enabled and is not bypassed,  
providing capability for maximum operational frequency. This  
is the default execution state in which maximum performance  
can be achieved. The processor cores and all enabled peripherals  
run at full speed.  
Rev. B  
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ADSP-BF561  
preserved. Since VDDEXT is still supplied in this mode, all of the  
external pins three-state, unless otherwise specified. This allows  
other devices that may be connected to the processor to have  
power still applied without drawing unwanted current. The  
internal supply regulator can be woken up by asserting the  
RESET pin.  
VOLTAGE REGULATION  
The ADSP-BF561 processor provides an on-chip voltage regula-  
tor that can generate processor core voltage levels 0.85 V to  
1.30 V (within a specified tolerance, see Operating Conditions)  
from an external 2.25 V to 3.6 V supply. Figure 4 shows the typ-  
ical external components required to complete the power  
management system. The regulator controls the internal logic  
voltage levels and is programmable with the voltage regulator  
control register (VR_CTL) in increments of 50 mV. To reduce  
standby power consumption, the internal voltage regulator can  
be programmed to remove power to the processor core while  
keeping I/O power (VDDEXT) supplied. While in the hibernate  
state, VDDEXT can still be applied, thus eliminating the need for  
external buffers. The voltage regulator can be activated from  
this power-down state by asserting RESET, which will then ini-  
tiate a boot sequence. The regulator can also be disabled and  
bypassed at the user’s discretion.  
Power Savings  
As shown in Table 4, the ADSP-BF561 supports two different  
power domains. The use of multiple power domains maximizes  
flexibility, while maintaining compliance with industry stan-  
dards and conventions. By isolating the internal logic of the  
ADSP-BF561 into its own power domain, separate from the I/O,  
the processor can take advantage of Dynamic Power Manage-  
ment, without affecting the I/O devices. There are no  
sequencing requirements for the various power domains.  
Table 4. ADSP-BF561 Power Domains  
The internal voltage regulation feature is not available on auto-  
motive grade models. External voltage regulation is required to  
ensure correct operation of these parts.  
Power Domain  
All internal logic  
I/O  
VDD Range  
VDDINT  
VDDEXT  
The power dissipated by a processor is largely a function of the  
clock frequency of the processor and the square of the operating  
voltage. For example, reducing the clock frequency by 25%  
results in a 25% reduction in dynamic power dissipation, while  
reducing the voltage by 25% reduces dynamic power dissipation  
by more than 40%. Further, these power savings are additive, in  
that if the clock frequency and supply voltage are both reduced,  
the power savings can be dramatic.  
SETOFDECOUPLING  
CAPACITORS  
2.25V TO 3.6V  
INPUT VOLTAGE  
RANGE  
VDDEXT  
(LOW-INDUCTANCE)  
VDDEXT  
+
100µF  
10µH  
100nF  
VDDINT  
+
+
100µF  
The dynamic power management feature of the ADSP-BF561  
allows both the processor’s input voltage (VDDINT) and clock fre-  
quency (fCCLK) to be dynamically controlled.  
FDS9431A  
100µF  
10µF  
LOW ESR  
ZHCS1000  
VROUT  
VROUT  
The savings in power dissipation can be modeled using the  
power savings factor and % power savings calculations.  
SHORT AND LOW-  
INDUCTANCE WIRE  
The power savings factor is calculated as:  
NOTE: DESIGNER SHOULD MINIMIZE  
TRACE LENGTH TO FDS9431A.  
power savings factor  
GND  
2
fCCLKRED  
---------------------  
fCCLKNOM  
VDDINTRED  
--------------------------  
VDDINTNOM  
tRED  
----------  
tNOM  
=
×
×
Figure 4. Voltage Regulator Circuit  
where the variables in the equations are:  
Voltage Regulator Layout Guidelines  
f
CCLKNOM is the nominal core clock frequency  
CCLKRED is the reduced core clock frequency  
f
Regulator external component placement, board routing, and  
bypass capacitors all have a significant effect on noise injected  
into the other analog circuits on-chip. The VROUT1-0 traces  
and voltage regulator external components should be consid-  
ered as noise sources when doing board layout and should not  
be routed or placed near sensitive circuits or components on the  
board. All internal and I/O power supplies should be well  
bypassed with bypass capacitors placed as close to the  
ADSP-BF561 processors as possible.  
V
V
DDINTNOM is the nominal internal supply voltage  
DDINTRED is the reduced internal supply voltage  
t
NOM is the duration running at fCCLKNOM  
RED is the duration running at fCCLKRED  
t
The percent power savings is calculated as:  
% power savings = (1 power savings factor) × 100%  
Rev. B  
|
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June 2007  
ADSP-BF561  
For further details on the on-chip voltage regulator and related  
board design guidelines, see the Switching Regulator Design  
Considerations for ADSP-BF533 Blackfin Processors (EE-228)  
applications note on the Analog Devices web site (www.ana-  
log.com)—use site search on “EE-228”.  
As shown in Figure 6, the core clock (CCLK) and system  
peripheral clock (SCLK) are derived from the input clock  
(CLKIN) signal. An on-chip PLL is capable of multiplying the  
CLKIN signal by a user-programmable 0.5× to 64× multiplica-  
tion factor. The default multiplier is 10×, but it can be modified  
by a software instruction sequence. On the fly frequency  
changes can be effected by simply writing to the PLL_DIV  
register.  
CLOCK SIGNALS  
The ADSP-BF561 processor can be clocked by an external crys-  
tal, a sine wave input, or a buffered, shaped clock derived from  
an external clock oscillator.  
“FINE” ADJUSTMENT  
REQUIRES PLL SEQUENCING  
COARSE” ADJUSTMENT  
ON-THE-FLY  
If an external clock is used, it should be a TTL compatible signal  
and must not be halted, changed, or operated below the speci-  
fied frequency during normal operation. This signal is  
connected to the processor’s CLKIN pin. When an external  
clock is used, the XTAL pin must be left unconnected.  
÷ 1, 2, 4, 8  
÷ 1 TO 15  
CCLK  
SCLK  
PLL  
0.5× TO 64×  
CLKIN  
VCO  
Alternatively, because the ADSP-BF561 processor includes an  
on-chip oscillator circuit, an external crystal may be used. For  
fundamental frequency operation, use the circuit shown in  
Figure 5. A parallel-resonant, fundamental frequency, micro-  
processor-grade crystal is connected across the CLKIN and  
XTAL pins. The on-chip resistance between CLKIN and the  
XTAL pin is in the 500 kΩ range. Further parallel resistors are  
typically not recommended. The two capacitors and the series  
resistor shown in Figure 5 fine tune the phase and amplitude of  
the sine frequency. The capacitor and resistor values shown in  
Figure 5 are typical values only. The capacitor values are depen-  
dent upon the crystal manufacturer’s load capacitance  
recommendations and the physical PCB layout. The resistor  
value depends on the drive level specified by the crystal manu-  
facturer. System designs should verify the customized values  
based on careful investigation on multiple devices over the  
allowed temperature range.  
SCLK CCLK  
SCLK 133MHz  
Figure 6. Frequency Modification Methods  
All on-chip peripherals are clocked by the system clock (SCLK).  
The system clock frequency is programmable by means of the  
SSEL3–0 bits of the PLL_DIV register. The values programmed  
into the SSEL fields define a divide ratio between the PLL output  
(VCO) and the system clock. SCLK divider values are 1 through  
15. Table 5 illustrates typical system clock ratios.  
Table 5. Example System Clock Ratios  
Example Frequency  
Ratios (MHz)  
Signal Name  
SSEL3–0  
Divider Ratio  
VCO/SCLK  
A third-overtone crystal can be used at frequencies above  
25 MHz. The circuit is then modified to ensure crystal operation  
only at the third overtone, by adding a tuned inductor circuit as  
shown in Figure 5.  
VCO  
100  
300  
500  
SCLK  
0001  
0110  
1010  
1:1  
100  
50  
6:1  
10:1  
50  
Blackfin  
The maximum frequency of the system clock is fSCLK. Note that  
the divisor ratio must be chosen to limit the system clock fre-  
quency to its maximum of fSCLK. The SSEL value can be changed  
dynamically without any PLL lock latencies by writing the  
appropriate values to the PLL divisor register (PLL_DIV).  
CLKOUT  
TO PLL CIRCUITRY  
EN  
CLKIN  
18pF*  
XTAL  
FOR OVERTONE  
OPERATION ONLY:  
18pF*  
NOTE: VALUES MARKED WITH * MUST BE CUSTOMIZED  
DEPENDING ON THE CRYSTAL AND LAYOUT. PLEASE  
ANALYZE CAREFULLY.  
Figure 5. External Crystal Connections  
Rev. B  
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June 2007  
ADSP-BF561  
The core clock (CCLK) frequency can also be dynamically  
changed by means of the CSEL1–0 bits of the PLL_DIV register.  
Supported CCLK divider ratios are 1, 2, 4, and 8, as shown in  
Table 6. This programmable core clock capability is useful for  
fast core frequency modifications.  
All configuration settings are set for the slowest device pos-  
sible (3-cycle hold time; 15-cycle R/W access times; 4-cycle  
setup).  
• Boot from SPI host device – The Blackfin processor oper-  
ates in SPI slave mode and is configured to receive the bytes  
of the .LDR file from an SPI host (master) agent. To hold  
off the host device from transmitting while the boot ROM  
is busy, the Blackfin processor asserts a GPIO pin, called  
host wait (HWAIT), to signal the host device not to send  
any more bytes until the flag is deasserted. The flag is cho-  
sen by the user and this information is transferred to the  
Blackfin processor via bits 10:5 of the FLAG header.  
Table 6. Core Clock Ratios  
Example Frequency  
Ratios (MHz)  
Signal Name  
CSEL1–0  
Divider Ratio  
VCO/CCLK  
VCO  
500  
500  
200  
200  
CCLK  
00  
01  
10  
11  
1:1  
2:1  
4:1  
8:1  
500  
250  
50  
• Boot from SPI serial EEPROM (16-, 24-bit addressable) –  
The SPI uses the PF2 output pin to select a single SPI  
EPROM device, submits a read command at address  
0x0000, and begins clocking data into the beginning of L1  
instruction memory. A 16-, 24-bit addressable SPI-compat-  
ible EPROM must be used.  
25  
The maximum PLL clock time when a change is programmed  
via the PLL_CTL register is 40 μs. The maximum time to change  
the internal voltage via the internal voltage regulator is also  
40 μs. The reset value for the PLL_LOCKCNT register is 0x200.  
This value should be programmed to ensure a 40 μs wakeup  
time when either the voltage is changed or a new MSEL value is  
programmed. The value should be programmed to ensure an  
80 μs wakeup time when both voltage and the MSEL value are  
changed. The time base for the PLL_LOCKCNT register is the  
period of CLKIN.  
For each of the boot modes, a boot loading protocol is used to  
transfer program and data blocks from an external memory  
device to their specified memory locations. Multiple memory  
blocks may be loaded by any boot sequence. Once all blocks are  
loaded, Core A program execution commences from the start of  
L1 instruction SRAM (0xFFA0 0000). Core B remains in a held-  
off state until Bit 5 of SICA_SYSCR is cleared by Core A. After  
that, Core B will start execution at address 0xFF60 0000.  
In addition, Bit 4 of the reset configuration register can be set by  
application code to bypass the normal boot sequence during a  
software reset. For this case, the processor jumps directly to the  
beginning of L1 instruction memory.  
BOOTING MODES  
The ADSP-BF561 has three mechanisms (listed in Table 7) for  
automatically loading internal L1 instruction memory, L2, or  
external memory after a reset. A fourth mode is provided to exe-  
cute from external memory, bypassing the boot sequence.  
INSTRUCTION SET DESCRIPTION  
The Blackfin processor family assembly language instruction set  
employs an algebraic syntax that was designed for ease of coding  
and readability. The instructions have been specifically tuned to  
provide a flexible, densely encoded instruction set that compiles  
to a very small final memory size. The instruction set also pro-  
vides fully featured multifunction instructions that allow the  
programmer to use many of the processor core resources in a  
single instruction. Coupled with many features more often seen  
on microcontrollers, this instruction set is very efficient when  
compiling C and C++ source code. In addition, the architecture  
supports both a user (algorithm/application code) and a super-  
visor (O/S kernel, device drivers, debuggers, ISRs) mode of  
operation—allowing multiple levels of access to core processor  
resources.  
Table 7. Booting Modes  
BMODE1–0 Description  
00  
Execute from 16-bit external memory  
(Bypass Boot ROM)  
01  
10  
11  
Boot from 8-bit/16-bit flash  
Boot from SPI host slave mode  
Boot from SPI serial EEPROM  
(16-, 24-bit address range)  
The BMODE pins of the reset configuration register, sampled  
during power-on resets and software initiated resets, implement  
the following modes:  
• Execute from 16-bit external memory – Execution starts  
from address 0x2000 0000 with 16-bit packing. The boot  
ROM is bypassed in this mode. All configuration settings  
are set for the slowest device possible (3-cycle hold time,  
15-cycle R/W access times, 4-cycle setup). Note that, in  
bypass mode, only Core A can execute instructions from  
external memory.  
The assembly language, which takes advantage of the proces-  
sor’s unique architecture, offers the following advantages:  
• Seamlessly integrated DSP/CPU features are optimized for  
both 8-bit and 16-bit operations.  
• A multi-issue load/store modified Harvard architecture,  
which supports two 16-bit MAC or four 8-bit ALU plus  
two load/store plus two pointer updates per cycle.  
• Boot from 8-bit/16-bit external flash memory – The  
8-bit/16-bit flash boot routine located in boot ROM mem-  
ory space is set up using Asynchronous Memory Bank 0.  
Rev. B  
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June 2007  
ADSP-BF561  
• All registers, I/O, and memory are mapped into a unified  
4G byte memory space providing a simplified program-  
ming model.  
• Set conditional breakpoints on registers, memory, and  
stacks.  
• Trace instruction execution.  
• Microcontroller features, such as arbitrary bit and bit-field  
manipulation, insertion, and extraction; integer operations  
on 8-, 16-, and 32-bit data types; and separate user and ker-  
nel stack pointers.  
• Perform linear or statistical profiling of program execution.  
• Fill, dump, and graphically plot the contents of memory.  
• Perform source level debugging.  
• Code density enhancements, which include intermixing of  
16-bit and 32-bit instructions (no mode switching, no code  
segregation). Frequently used instructions are encoded as  
16-bits.  
• Create custom debugger windows.  
The VisualDSP++ IDE lets programmers define and manage  
software development. Its dialog boxes and property pages let  
programmers configure and manage all development tools,  
including color syntax highlighting in the VisualDSP++ editor.  
These capabilities permit programmers to:  
DEVELOPMENT TOOLS  
The ADSP-BF561 is supported with a complete set of  
• Control how the development tools process inputs and  
generate outputs.  
CROSSCORE®software and hardware development tools,  
including Analog Devices emulators and the VisualDSP++®  
development environment. The same emulator hardware that  
supports other Analog Devices processors also fully emulates  
the ADSP-BF561.  
• Maintain a one-to-one correspondence with the tool’s  
command line switches.  
The VisualDSP++ Kernel (VDK) incorporates scheduling and  
resource management tailored specifically to address the mem-  
ory and timing constraints of embedded, real-time  
The VisualDSP++ project management environment lets pro-  
grammers develop and debug an application. This environment  
includes an easy to use assembler that is based on an algebraic  
syntax, an archiver (librarian/library builder), a linker, a loader,  
a cycle-accurate instruction-level simulator, a C/C++ compiler,  
and a C/C++ runtime library that includes DSP and mathemati-  
cal functions. A key point for these tools is C/C++ code  
efficiency. The compiler has been developed for efficient trans-  
lation of C/C++ code to Blackfin assembly. The Blackfin  
processor has architectural features that improve the efficiency  
of compiled C/C++ code.  
programming. These capabilities enable engineers to develop  
code more effectively, eliminating the need to start from the  
very beginning when developing new application code. The  
VDK features include threads, critical and unscheduled regions,  
semaphores, events, and device flags. The VDK also supports  
priority-based, pre-emptive, cooperative, and time-sliced  
scheduling approaches. In addition, the VDK was designed to  
be scalable. If the application does not use a specific feature, the  
support code for that feature is excluded from the target system.  
The VisualDSP++ debugger has a number of important fea-  
tures. Data visualization is enhanced by a plotting package that  
offers a significant level of flexibility. This graphical representa-  
tion of user data enables the programmer to quickly determine  
the performance of an algorithm. As algorithms grow in com-  
plexity, this capability can have increasing significance on the  
designer’s development schedule, increasing productivity. Sta-  
tistical profiling enables the programmer to nonintrusively poll  
the processor as it is running the program. This feature, unique  
to VisualDSP++, enables the software developer to passively  
gather important code execution metrics without interrupting  
the real-time characteristics of the program. Essentially, the  
developer can identify bottlenecks in software quickly and effi-  
ciently. By using the profiler, the programmer can focus on  
those areas in the program that impact performance and take  
corrective action.  
Because the VDK is a library, a developer can decide whether to  
use it or not. The VDK is integrated into the VisualDSP++  
development environment, but can also be used with standard  
command line tools. When the VDK is used, the development  
environment assists the developer with many error prone tasks  
and assists in managing system resources, automating the  
generation of various VDK-based objects, and visualizing the  
system state when debugging an application that uses the VDK.  
The Expert Linker can be used to visually manipulate the place-  
ment of code and data in the embedded system. Memory  
utilization can be viewed in a color-coded graphical form. Code  
and data can be easily moved to different areas of the processor  
or external memory with the drag of the mouse. Runtime stack  
and heap usage can be examined. The Expert Linker is fully  
compatible with existing Linker Definition File (LDF), allowing  
the developer to move between the graphical and textual  
environments.  
Debugging both C/C++ and assembly programs with the  
VisualDSP++ debugger, programmers can:  
Analog Devices emulators use the IEEE 1149.1 JTAG test access  
port of the ADSP-BF561 to monitor and control the target  
board processor during emulation. The emulator provides full-  
speed emulation, allowing inspection and modification of mem-  
ory, registers, and processor stacks. Nonintrusive in-circuit  
emulation is assured by the use of the processor’s JTAG inter-  
face—the emulator does not affect the loading or timing of the  
target system.  
• View mixed C/C++ and assembly code (interleaved source  
and object information).  
• Insert breakpoints.  
CROSSCORE is a registered trademark of Analog Devices, Inc.  
VisualDSP++ is a registered trademark of Analog Devices, Inc.  
Rev. B  
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June 2007  
ADSP-BF561  
In addition to the software and hardware development tools  
available from Analog Devices, third parties provide a wide  
range of tools supporting the Blackfin processor family. Third  
party software tools include DSP libraries, real-time operating  
systems, and block diagram design tools.  
EZ-KIT Lite Evaluation Board  
For evaluation of ADSP-BF561 processors, use the  
ADSP-BF561 EZ-KIT Lite® board available from Analog  
Devices. Order part number ADDS-BF561-EZLITE. The board  
comes with on-chip emulation capabilities and is equipped to  
enable software development. Multiple daughter cards are  
available.  
DESIGNING AN EMULATOR-COMPATIBLE  
PROCESSOR BOARD  
The Analog Devices family of emulators are tools that every sys-  
tem developer needs to test and debug hardware and software  
systems. Analog Devices has supplied an IEEE 1149.1 JTAG  
Test Access Port (TAP) on the ADSP-BF561. The emulator uses  
the TAP to access the internal features of the processor, allow-  
ing the developer to load code, set breakpoints, observe  
variables, observe memory, and examine registers. The proces-  
sor must be halted to send data and commands, but once an  
operation has been completed by the emulator, the processor is  
set running at full speed with no impact on system timing.  
To use these emulators, the target board must include a header  
that connects the processor’s JTAG port to the emulator.  
For details on target board design issues, including mechanical  
layout, single processor connections, multiprocessor scan  
chains, signal buffering, signal termination, and emulator pod  
logic, see Analog Devices JTAG Emulation Technical Reference  
(EE-68) on the Analog Devices website (www.analog.com)—use  
site search on “EE-68.” This document is updated regularly to  
keep pace with improvements to emulator support.  
RELATED DOCUMENTS  
The following publications that describe the ADSP-BF561 pro-  
cessors (and related processors) can be ordered from any  
Analog Devices sales office or accessed electronically on our  
website:  
Getting Started With Blackfin Processors  
ADSP-BF561 Blackfin Processor Hardware Reference  
ADSP-BF53x/BF56x Blackfin Processor Programming  
Reference  
ADSP-BF561 Blackfin Processor Anomaly List  
Rev. B  
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Page 16 of 64  
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June 2007  
ADSP-BF561  
PIN DESCRIPTIONS  
ADSP-BF561 pin definitions are listed in Table 8. In order to  
maintain maximum function and reduce package size and pin  
count, some pins have multiple functions. In cases where pin  
function is reconfigurable, the default state is shown in plain  
text, while alternate functionality is shown in italics.  
All pins are three-stated during and immediately after reset,  
with the exception of the external memory interface. On the  
external memory interface, the control and address lines are  
driven high during reset unless the BR pin is asserted.  
All I/O pins have their input buffers disabled, with the exception  
of the pins noted in the data sheet that need pull-ups or pull-  
downs if unused.  
Table 8. Pin Descriptions  
Driver  
Type1  
Pin Name  
EBIU  
Type Function  
ADDR25–2  
DATA31–0  
ABE3–0/SDQM3–0  
BR  
O
I/O  
O
I
Address Bus for Async/Sync Access  
Data Bus for Async/Sync Access  
A
A
Byte Enables/Data Masks for Async/Sync Access  
Bus Request (This pin should be pulled HIGH if not used.)  
Bus Grant  
A
BG  
O
O
A
A
BGH  
Bus Grant Hang  
EBIU (ASYNC)  
AMS3–0  
ARDY  
O
I
Bank Select  
A
Hardware Ready Control (This pin should be pulled HIGH if not used.)  
AOE  
O
O
O
Output Enable  
Write Enable  
Read Enable  
A
A
A
AWE  
ARE  
EBIU (SDRAM)  
SRAS  
O
O
O
O
O
O
O
O
Row Address Strobe  
Column Address Strobe  
Write Enable  
A
A
A
A
B
B
A
A
SCAS  
SWE  
SCKE  
Clock Enable  
SCLK0/CLKOUT  
SCLK1  
Clock Output Pin 0  
Clock Output Pin 1  
SDRAM A10 Pin  
Bank Select  
SA10  
SMS3–0  
Rev. B  
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Page 17 of 64  
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June 2007  
ADSP-BF561  
Table 8. Pin Descriptions (Continued)  
Driver  
Type1  
Pin Name  
Type Function  
PF/SPI/TIMER  
PF0/SPISS/TMR0  
PF1/SPISEL1/TMR1  
PF2/SPISEL2/TMR2  
PF3/SPISEL3/TMR3  
PF4/SPISEL4/TMR4  
PF5/SPISEL5/TMR5  
PF6/SPISEL6/TMR6  
PF7/SPISEL7/TMR7  
PF8  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
Programmable Flag/Slave SPI Select/Timer  
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
Programmable Flag/SPI Select/Timer  
Programmable Flag/SPI Select/Timer  
Programmable Flag/SPI Select/Timer  
Programmable Flag/SPI Select/Timer  
Programmable Flag/SPI Select/Timer  
Programmable Flag/SPI Select/Timer  
Programmable Flag/SPI Select/Timer  
Programmable Flag  
PF9  
Programmable Flag  
PF10  
Programmable Flag  
PF11  
Programmable Flag  
PF12  
Programmable Flag  
PF13  
Programmable Flag  
PF14  
Programmable Flag  
PF15/EXT CLK  
PPI0  
Programmable Flag/External Timer Clock Input  
PPI0D15–8/PF47–40 I/O  
PPI Data/Programmable Flag Pins  
PPI Data Pins  
C
C
PPI0D7–0  
I/O  
I
PPI0CLK  
PPI Clock  
PPI0SYNC1/TMR8  
PPI0SYNC2/TMR9  
PPI0SYNC3  
I/O  
I/O  
I/O  
PPI Sync/Timer  
PPI Sync/Timer  
PPI Sync  
C
C
C
PPI1  
PPI1D15–8/PF39–32 I/O  
PPI Data/Programmable Flag Pins  
PPI Data Pins  
C
C
PPI1D7–0  
I/O  
I
PPI1CLK  
PPI Clock  
PPI1SYNC1/TMR10  
PPI1SYNC2/TMR11  
PPI1SYNC3  
SPORT0  
I/O  
I/O  
I/O  
PPI Sync/Timer  
PPI Sync/Timer  
PPI Sync  
C
C
C
RSCLK0/PF28  
RFS0/PF19  
I/O  
I/O  
I
Sport0 Receive Serial Clock/Programmable Flag  
Sport0 Receive Frame Sync/Programmable Flag  
Sport0 Receive Data Primary  
D
C
DR0PRI  
DR0SEC/PF20  
TSCLK0/PF29  
TFS0/PF16  
I/O  
I/O  
I/O  
I/O  
I/O  
Sport0 Receive Data Secondary/Programmable Flag  
Sport0 Transmit Serial Clock/Programmable Flag  
Sport0 Transmit Frame Sync/Programmable Flag  
Sport0 Transmit Data Primary/Programmable Flag  
Sport0 Transmit Data Secondary/Programmable Flag  
C
D
C
C
C
DT0PRI/PF18  
DT0SEC/PF17  
Rev. B  
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Page 18 of 64  
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June 2007  
ADSP-BF561  
Table 8. Pin Descriptions (Continued)  
Driver  
Type1  
Pin Name  
SPORT1  
Type Function  
RSCLK1/PF30  
RFS1/PF24  
DR1PRI  
I/O  
I/O  
I
Sport1 Receive Serial Clock/Programmable Flag  
D
C
Sport1 Receive Frame Sync/Programmable Flag  
Sport1 Receive Data Primary  
DR1SEC/PF25  
TSCLK1/PF31  
TFS1/PF21  
DT1PRI/PF23  
DT1SEC/PF22  
SPI  
I/O  
I/O  
I/O  
I/O  
I/O  
Sport1 Receive Data Secondary/Programmable Flag  
Sport1 Transmit Serial Clock/Programmable Flag  
Sport1 Transmit Frame Sync/Programmable Flag  
Sport1 Transmit Data Primary/Programmable Flag  
Sport1 Transmit Data Secondary/Programmable Flag  
C
D
C
C
C
MOSI  
I/O  
I/O  
Master Out Slave In  
C
MISO  
Master In Slave Out (This pin should be pulled HIGH through a 4.7 kΩ resistor if booting via the SPI  
C
port.)  
SCK  
I/O  
SPI Clock  
D
UART  
RX/PF27  
TX/PF26  
JTAG  
I/O  
I/O  
UART Receive/Programmable Flag  
UART Transmit/Programmable Flag  
C
C
EMU  
O
I
Emulation Output  
C
C
TCK  
JTAG Clock  
TDO  
O
I
JTAG Serial Data Out  
TDI  
JTAG Serial Data In  
TMS  
I
JTAG Mode Select  
TRST  
I
JTAG Reset (This pin should be pulled LOW if JTAG is not used.)  
Clock  
CLKIN  
I
Clock/Crystal Input (This pin needs to be at a level or clocking.)  
Crystal Connection  
XTAL  
O
Mode Controls  
RESET  
I
Reset (This pin is always active during core power-on.)  
NMI0  
I
Nonmaskable Interrupt Core A (This pin should be pulled LOW when not used.)  
Nonmaskable Interrupt Core B (This pin should be pulled LOW when not used.)  
Boot Mode Strap (These pins must be pulled to the state required for the desired boot mode.)  
Sleep  
NMI1  
I
BMODE1–0  
SLEEP  
I
O
I
C
BYPASS  
Voltage Regulator  
VROUT1–0  
Supplies  
VDDEXT  
VDDINT  
GND  
PLL BYPASS Control (Pull-up or pull-down Required.)  
O
External FET Drive  
P
Power Supply  
Power Supply  
Power Supply Return  
NC  
P
G
No Connection  
NC  
1 Refer to Figure 28 on Page 41 to Figure 32 on Page 42.  
Rev. B  
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Page 19 of 64  
|
June 2007  
ADSP-BF561  
SPECIFICATIONS  
Component specifications are subject to change without notice.  
OPERATING CONDITIONS  
Parameter  
Conditions  
Min  
0.8  
Nominal Max  
Unit  
V
VDDINT Internal Supply Voltage1  
Nonautomotive 500 MHz and 533 MHz speed grade models  
and ADSP-BF561SKBCZ6002  
1.25  
1.375  
VDDINT Internal Supply Voltage1  
VDDINT Internal Supply Voltage3  
VDDEXT External Supply Voltage  
VDDEXT External Supply Voltage  
VIH High Level Input Voltage4, 5  
600 MHz speed grade models except ADSP-BF561SKBCZ6002  
Automotive grade models2  
0.8  
0.95  
2.25  
2.7  
2.0  
–0.3  
0
0
–40  
0
1.35  
1.25  
1.4185 V  
1.312  
V
V
V
V
V
Nonautomotive grade models2  
Automotive grade models2  
2.5 or 3.3 3.6  
3.3  
3.6  
3.6  
+0.6  
VIL  
TJ  
TJ  
TJ  
TJ  
TJ  
Low Level Input Voltage5  
Junction Temperature  
Junction Temperature  
Junction Temperature  
Junction Temperature  
Junction Temperature  
256-Ball CSP_BGA (12 mm ϫ 12 mm) @ TAMBIENT = 0°C to +70°C  
256-Ball CSP_BGA (17 mm ϫ 17 mm) @ TAMBIENT = 0°C to +70°C  
256-Ball CSP_BGA (17 mm ϫ 17 mm) @ TAMBIENT =–40°C to +85°C  
297-Ball PBGA @ TAMBIENT = 0°C to +70°C  
+105 °C  
+95 °C  
+115 °C  
+95 °C  
+115 °C  
297-Ball PBGA @ TAMBIENT = –40°C to +85°C  
–40  
1 Internal voltage (VDDINT) regulator tolerance is –5% to +10% for all models except 600 MHz models in the PBGA package where tolerance is –7% to +12%  
2 See Ordering Guide on Page 64.  
3 The internal voltage regulation feature is not available. External voltage regulation is required to ensure correct operation.  
4 The ADSP-BF561 is 3.3 V tolerant (always accepts up to 3.6 V maximum VIH), but voltage compliance (on outputs, VOH) depends on the input VDDEXT, because VOH (maximum)  
approximately equals VDDEXT (maximum). This 3.3 V tolerance applies to bidirectional and input only pins.  
5 Applies to all signal pins.  
ELECTRICAL CHARACTERISTICS  
Parameter  
Test Conditions  
VDDEXT = 3.0 V, IOH = –0.5 mA  
VDDEXT = 3.0 V, IOL = 2.0 mA  
Min Typical  
2.4  
Max Unit  
VOH  
VOL  
IIH  
High Level Output Voltage1  
Low Level Output Voltage1  
High Level Input Current2  
High Level Input Current JTAG3  
Low Level Input Current2  
Three-State Leakage Current5  
Three-State Leakage Current5  
Input Capacitance6  
VDDINT Current in Hibernate Mode  
VDDINT Current in Deep Sleep Mode  
VDDINT Current  
VDDINT Current  
VDDINT Current  
V
0.4  
V
VDDEXT = Maximum, VIN = VDD Maximum  
VDDEXT = Maximum, VIN = VDD Maximum  
VDDEXT = Maximum, VIN = 0 V  
VDDEXT = Maximum, VIN = VDD Maximum  
VDDEXT = Maximum, VIN = 0 V  
fIN = 1 MHz, TAMBIENT = 25°C, VIN = 2.5 V  
VDDEXT = 3.65 V with Voltage Regulator Off (VDDINT = 0 V)  
VDDINT = 0.8 V, TJUNCTION = 25°C  
VDDINT = 0.8 V, fIN = 50 MHz, TJUNCTION = 25°C  
VDDINT = 1.25 V, fIN = 500 MHz, TJUNCTION = 25°C  
VDDINT = 1.35 V, fIN = 600 MHz, TJUNCTION = 25°C  
10.0  
50.0  
μA  
μA  
IIHP  
4
IIL  
10.0 μA  
10.0 μA  
10.0 μA  
IOZH  
4
IOZL  
CIN  
IDDHIBERNATE  
4
87  
pF  
50  
32  
66  
469  
588  
μA  
8
IDDDEEPSLEEP  
mA  
mA  
mA  
mA  
8, 9  
IDD  
_
_
_
TYP  
TYP  
TYP  
8, 9  
8, 9  
IDD  
IDD  
1 Applies to output and bidirectional pins.  
2 Applies to input pins except JTAG inputs.  
3 Applies to JTAG input pins (TCK, TDI, TMS, TRST).  
4 Absolute value.  
5 Applies to three-statable pins.  
6 Applies to all signal pins.  
7 Guaranteed, but not tested.  
8 See Estimating Power for ADSP-BF561 Blackfin Processors (EE-293) on the Analog Devices website (www.analog.com)—use site search on “EE-293”.  
9 Processor executing 75% dual MAC, 25% ADD with moderate data bus activity.  
Rev. B  
|
Page 20 of 64  
|
June 2007  
ADSP-BF561  
ABSOLUTE MAXIMUM RATINGS  
Stresses greater than those listed in the table may cause perma-  
nent damage to the device. These are stress ratings only.  
Functional operation of the device at these or any other condi-  
tions greater than those indicated in the operational sections of  
this specification is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device  
reliability.  
PACKAGE INFORMATION  
The information presented in Figure 7 and Table 10 provides  
details about the package branding for the Blackfin processors.  
For a complete listing of product availability, see the Ordering  
Guide on Page 64.  
a
Parameter  
Value  
ADSP-BF561  
Internal (Core) Supply Voltage (VDDINT  
)
–0.3 V to +1.42 V  
–0.5 V to +3.8 V  
–0.5 V to +3.8 V  
–0.5 V to VDDEXT + 0.5 V  
200 pF  
tppZccc  
External (I/O) Supply Voltage (VDDEXT  
Input Voltage1  
)
vvvvvv.x n.n  
yyww country_of_origin  
Output Voltage Swing  
Load Capacitance2  
B
Figure 7. Product Information on Package  
Table 10. Package Brand Information  
Storage Temperature Range  
Junction Temperature Under Bias  
–65؇C to +150؇C  
125؇C  
1 Applies to 100% transient duty cycle. For other duty cycles see Table 9.  
2 For proper SDRAM controller operation, the maximum load capacitance is 50 pF  
(at 3.3 V) or 30 pF (at 2.5 V) for ADDR19–1, DATA15–0, ABE1–0/SDQM1–0,  
CLKOUT, SCKE, SA10, SRAS, SCAS, SWE, and SMS.  
Brand Key  
Field Description  
Temperature Range  
Package Type  
t
Table 9. Maximum Duty Cycle for Input Transient Voltage1  
pp  
Z
RoHS Compliant Part  
See Ordering Guide  
Assembly Lot Code  
Silicon Revision  
VIN Min (V)  
–0.50  
–0.70  
–0.80  
–0.90  
VIN Max (V)2  
3.80  
4.00  
4.10  
4.20  
Maximum Duty Cycle  
100%  
40%  
25%  
15%  
10%  
ccc  
vvvvvv.x  
n.n  
–1.00  
4.30  
yyww  
Date Code  
1 Applies to all signal pins with the exception of CLKIN, XTAL, VROUT1–0.  
2 Only one of the listed options can apply to a particular design.  
ESD SENSITIVITY  
ESD (electrostatic discharge) sensitive device.  
Charged devices and circuit boards can discharge  
without detection. Although this product features  
patented or proprietary circuitry, damage may occur  
on devices subjected to high energy ESD. Therefore,  
proper ESD precautions should be take to avoid  
performance degradation or loss of functionality.  
Rev. B  
|
Page 21 of 64  
|
June 2007  
ADSP-BF561  
TIMING SPECIFICATIONS  
Table 11 through Table 13 describe the timing requirements for  
the ADSP-BF561 clocks (tCCLK = 1/fCCLK). Take care in selecting  
MSEL, SSEL, and CSEL ratios so as not to exceed the maximum  
core clock, system clock, and Voltage Controlled Oscillator  
(VCO) operating frequencies, as described in Absolute Maxi-  
mum Ratings on Page 21. Table 14 describes phase-locked loop  
operating conditions.  
Table 11. Core Clock (CCLK) Requirements—500 MHz and 533 MHz Speed Grade Models1  
Parameter  
Max  
533  
500  
444  
350  
300  
250  
Unit  
MHz  
MHz  
MHz  
MHz  
MHz  
MHz  
fCCLK  
fCCLK  
fCCLK  
fCCLK  
fCCLK  
fCCLK  
CCLK Frequency (VDDINT = 1.25 Vminimum)2, 3  
CCLK Frequency (VDDINT = 1.1875 Vminimum)  
CCLK Frequency (VDDINT = 1.045 Vminimum)  
CCLK Frequency (VDDINT = 0.95 Vminimum)  
CCLK Frequency (VDDINT = 0.855 Vminimum)3, 4  
CCLK Frequency (VDDINT = 0.8 V minimum)4  
1 See Ordering Guide on Page 64.  
2 External Voltage regulation is required on automotive grade models (see Ordering Guide on Page 64) to ensure correct operation.  
3 Not applicable to nonautomotive grade models. See Ordering Guide on Page 64.  
4 Not applicable to automotive grade models in PBGA package. See Ordering Guide on Page 64.  
Table 12. Core Clock (CCLK) Requirements—600 MHz Speed Grade Models in CSP_BGA Package1  
Parameter  
Max  
600  
475  
425  
375  
250  
Unit  
MHz  
MHz  
MHz  
MHz  
MHz  
fCCLK  
fCCLK  
fCCLK  
fCCLK  
fCCLK  
CCLK Frequency (VDDINT = 1.1875 V minimum)  
CCLK Frequency (VDDINT = 1.045 V minimum)  
CCLK Frequency (VDDINT = 0.95 V minimum)  
CCLK Frequency (VDDINT = 0.855 V minimum)  
CCLK Frequency (VDDINT = 0.8 V minimum)  
1 See Ordering Guide on Page 64.  
Table 13. Core Clock (CCLK) Requirements—600 MHz Speed Grade Models in PBGA Package1  
Parameter  
Max  
600  
500  
444  
350  
300  
250  
Unit  
MHz  
MHz  
MHz  
MHz  
MHz  
MHz  
fCCLK  
fCCLK  
fCCLK  
fCCLK  
fCCLK  
fCCLK  
CCLK Frequency (VDDINT = 1.2825 V minimum)2  
CCLK Frequency (VDDINT = 1.1875 V minimum)  
CCLK Frequency (VDDINT = 1.045 V minimum)  
CCLK Frequency (VDDINT = 0.95 V minimum)  
CCLK Frequency (VDDINT = 0.855 V minimum)  
CCLK Frequency (VDDINT = 0.8 V minimum)  
1 See Ordering Guide on Page 64.  
2 External voltage regulator required to ensure proper operation at 600 MHz 1.35 V nominal.  
Table 14. Phase-Locked Loop Operating Conditions  
Parameter  
Min  
Max  
Unit  
Voltage Controlled Oscillator (VCO) Frequency  
50  
Maximum fCCLK MHz  
Table 15. System Clock (SCLK) Requirements  
Parameter1  
Max VDDEXT = 2.5 V/3.3 V  
Unit  
MHz  
MHz  
fSCLK  
fSCLK  
CLKOUT/SCLK Frequency (VDDINT 1.14 V)  
CLKOUT/SCLK Frequency (VDDINT < 1.14 V)  
133  
100  
1 tSCLK (= 1/fSCLK) must be greater than or equal to tCCLK  
.
Rev. B  
|
Page 22 of 64  
|
June 2007  
ADSP-BF561  
Clock and Reset Timing  
Table 16 and Figure 8 describe clock and reset operations. Per  
Absolute Maximum Ratings on Page 21, combinations of  
CLKIN and clock multipliers must not result in core/system  
clocks exceeding the maximum limits allowed for the processor,  
including system clock restrictions related to supply voltage.  
Table 16. Clock and Reset Timing  
Parameter  
Min  
Max  
100.0  
Unit  
Timing Requirements  
tCKIN  
CLKIN (to PLL) Period1, 2, 3  
25.0  
ns  
ns  
ns  
ns  
tCKINL  
tCKINH  
tWRST  
CLKIN Low Pulse  
10.0  
CLKIN High Pulse  
RESET Asserted Pulse Width Low4  
10.0  
11 × tCKIN  
1 If DF bit in PLL_CTL register is set tCLKIN is divided by two before going to PLL, then the tCLKIN maximum period is 50 ns and the tCLKIN minimum period is 12.5 ns.  
2 Applies to PLL bypass mode and PLL nonbypass mode.  
3 Combinations of the CLKIN frequency and the PLL clock multiplier must not exceed the allowed fVCO, fCCLK, and fSCLK settings discussed in Table 11 on Page 22 through  
Table 15 on Page 22.  
4 Applies after power-up sequence is complete. At power-up, the processor’s internal phase-locked loop requires no more than 2,000 CLKIN cycles, while RESET is asserted,  
assuming stable power supplies and CLKIN (not including startup time of external clock oscillator).  
tCKIN  
CLKIN  
tCKINL  
tCKINH  
tWRST  
RESET  
Figure 8. Clock and Reset Timing  
Rev. B  
|
Page 23 of 64  
|
June 2007  
ADSP-BF561  
Asynchronous Memory Read Cycle Timing  
Table 17. Asynchronous Memory Read Cycle Timing  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
tSDAT  
DATA31–0 Setup Before CLKOUT  
DATA31–0 Hold After CLKOUT  
ARDY Setup Before CLKOUT  
ARDY Hold After CLKOUT  
2.1  
0.8  
4.0  
0.0  
ns  
ns  
ns  
ns  
tHDAT  
tSARDY  
tHARDY  
Switching Characteristics  
tDO  
tHO  
Output Delay After CLKOUT1  
Output Hold After CLKOUT 1  
6.0  
ns  
ns  
0.8  
1 Output pins include AMS3–0, ABE3–0, ADDR25–2, AOE, ARE.  
HOLD  
1 CYCLE  
SETUP  
2 CYCLES  
PROGRAMMED READ ACCESS  
4 CYCLES  
ACCESS EXTENDED  
3 CYCLES  
CLKOUT  
tDO  
tHO  
AMSx  
ABE1–0  
ABE, ADDRESS  
ADDR19–1  
AOE  
tDO  
tHO  
ARE  
tHARDY  
tSARDY  
tHARDY  
ARDY  
tSARDY  
tSDAT  
tHDAT  
DATA15–0  
READ  
Figure 9. Asynchronous Memory Read Cycle Timing  
Rev. B  
|
Page 24 of 64  
|
June 2007  
ADSP-BF561  
Asynchronous Memory Write Cycle Timing  
Table 18. Asynchronous Memory Write Cycle Timing  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
tSARDY  
tHARDY  
ARDY Setup Before CLKOUT  
ARDY Hold After CLKOUT  
4.0  
0.0  
ns  
ns  
Switching Characteristics  
tDDAT  
tENDAT  
tDO  
DATA31–0 Disable After CLKOUT  
6.0  
6.0  
ns  
ns  
ns  
ns  
DATA31–0 Enable After CLKOUT  
Output Delay After CLKOUT1  
Output Hold After CLKOUT 1  
1.0  
0.8  
tHO  
1 Output pins include AMS3–0, ABE3–0, ADDR25–2, DATA31–0, AOE, AWE.  
ACCESS  
EXTENDED  
1 CYCLE  
SETUP  
2 CYCLES  
HOLD  
1 CYCLE  
PROGRAMMED WRITE  
ACCESS 2 CYCLES  
CLKOUT  
AMSx  
tDO  
tHO  
ABE1–0  
ABE, ADDRESS  
ADDR19–1  
tDO  
tHO  
AWE  
tHARDY  
tSARDY  
ARDY  
tSARDY  
tENDAT  
tDDAT  
DATA15–0  
WRITE DATA  
Figure 10. Asynchronous Memory Write Cycle Timing  
Rev. B  
|
Page 25 of 64  
|
June 2007  
ADSP-BF561  
SDRAM Interface Timing  
Table 19. SDRAM Interface Timing  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
tSSDAT  
tHSDAT  
DATA Setup Before CLKOUT  
DATA Hold After CLKOUT  
1.5  
0.8  
ns  
ns  
Switching Characteristics  
tSCLK  
CLKOUT Period1  
7.5  
2.5  
2.5  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tSCLKH  
tSCLKL  
tDCAD  
tHCAD  
tDSDAT  
tENSDAT  
CLKOUT Width High  
CLKOUT Width Low  
Command, ADDR, Data Delay After CLKOUT2  
Command, ADDR, Data Hold After CLKOUT2  
Data Disable After CLKOUT  
Data Enable After CLKOUT  
4.0  
4.0  
0.8  
1.0  
1 Refer to Table 15 on Page 22 for maximum fSCLK at various VDDINT  
.
2 Command pins include: SRAS, SCAS, SWE, SDQM, SMS3–0, SA10, SCKE.  
tSCLK  
tSCLKH  
CLKOUT  
tSSDAT  
tSCLKL  
tHSDAT  
DATA (IN)  
tDCAD  
tDSDAT  
tENSDAT  
tHCAD  
DATA(OUT)  
tDCAD  
CMND ADDR  
(OUT)  
tHCAD  
NOTE: COMMAND = SRAS, SCAS, SWE, SDQM, SMS, SA10, SCKE.  
Figure 11. SDRAM Interface Timing  
Rev. B  
|
Page 26 of 64  
|
June 2007  
ADSP-BF561  
External Port Bus Request and Grant Cycle Timing  
Table 20 and Figure 12 describe external port bus request and  
bus grant operations.  
Table 20. External Port Bus Request and Grant Cycle Timing  
Parameter1, 2  
Min  
Max  
Unit  
Timing Requirements  
tBS  
tBH  
BR Asserted to CLKOUT High Setup  
4.6  
0.0  
ns  
ns  
CLKOUT High to BR Deasserted Hold Time  
Switching Characteristics  
tSD  
CLKOUT Low to AMSx, Address and ARE/AWE Disable  
4.5  
4.5  
3.6  
3.6  
3.6  
3.6  
ns  
ns  
ns  
ns  
ns  
ns  
tSE  
CLKOUT Low to AMSx, Address and ARE/AWE Enable  
CLKOUT High to BG Asserted Setup  
tDBG  
tEBG  
tDBH  
tEBH  
CLKOUT High to BG Deasserted Hold Time  
CLKOUT High to BGH Asserted Setup  
CLKOUT High to BGH Deasserted Hold Time  
1 These are preliminary timing parameters that are based on worst-case operating conditions.  
2 The pad loads for these timing parameters are 20 pF.  
CLKOUT  
tBS  
tBH  
BR  
tSD  
tSE  
AMSx  
tSD  
tSE  
ADDR25-2  
ABE3-0  
tSD  
tSE  
AWE  
ARE  
tDBG  
tEBG  
BG  
tDBH  
tEBH  
BGH  
Figure 12. External Port Bus Request and Grant Cycle Timing  
Rev. B  
|
Page 27 of 64  
|
June 2007  
ADSP-BF561  
Parallel Peripheral Interface Timing  
Table 21, and Figure 13 through Figure 16 on Page 30, describe  
default Parallel Peripheral Interface operations.  
If bit 4 of the PLL_CTL register is set, then Figure 17 on Page 30  
and Figure 18 on Page 31 apply.  
Table 21. Parallel Peripheral Interface Timing  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
tPCLKW  
tPCLK  
PPIxCLK Width1  
PPIxCLK Period1  
5.0  
13.3  
4.0  
1.0  
3.5  
2.0  
ns  
ns  
ns  
ns  
ns  
ns  
tSFSPE  
tHFSPE  
tSDRPE  
tHDRPE  
External Frame Sync Setup Before PPIxCLK  
External Frame Sync Hold After PPIxCLK  
Receive Data Setup Before PPIxCLK  
Receive Data Hold After PPIxCLK  
Switching Characteristics  
tDFSPE  
tHOFSPE  
tDDTPE  
tHDTPE  
Internal Frame Sync Delay After PPIxCLK  
8.0  
8.0  
ns  
ns  
ns  
ns  
Internal Frame Sync Hold After PPIxCLK  
Transmit Data Delay After PPIxCLK  
Transmit Data Hold After PPIxCLK  
1.7  
2.0  
1 For PPI modes that use an internally generated frame sync, the PPIxCLK frequency cannot exceed fSCLK/2. For modes with no frame syncs or external frame syncs, PPIxCLK  
cannot exceed 75 MHz and fSCLK should be equal to or greater than PPIxCLK.  
FRAME  
DATA0  
IS  
SAMPLED  
SYNC IS  
DRIVEN  
OUT  
POLC = 0  
PPIxCLK  
PPIxCLK  
POLC = 1  
t
DFSPE  
t
HOFSPE  
POLS = 1  
PPIxSYNC11  
POLS = 0  
POLS = 1  
PPIxSYNC2  
POLS = 0  
t
t
SDRPE  
HDRPE  
PPIxDATA  
Figure 13. PPI GP Rx Mode with Internal Frame Sync Timing (Default)  
Rev. B  
|
Page 28 of 64  
|
June 2007  
ADSP-BF561  
FRAME  
SYNC IS  
SAMPLED  
FOR  
DATA0 IS  
DATA1 IS  
SAMPLED  
DATA0  
SAMPLED  
PPIxCLK  
POLC = 0  
PPIxCLK  
POLC = 1  
t
HFSPE  
t
SFSPE  
POLS = 1  
PPIxSYNC1  
POLS = 0  
POLS = 1  
PPIxSYNC2  
POLS = 0  
t
t
HDRPE  
SDRPE  
PPIx_DATA  
Figure 14. PPI GP Rx Mode with External Frame Sync Timing (Default)  
FRAME  
SYNC IS  
DRIVEN  
OUT  
DATA0 IS  
DRIVEN  
OUT  
PPIxCLK  
POLC = 0  
PPIxCLK  
POLC = 1  
t
DFSPE  
t
HOFSPE  
POLS = 1  
PPIxSYNC1  
POLS = 0  
POLS = 1  
PPIxSYNC2  
POLS = 0  
t
DDTPE  
t
HDTPE  
PPIx_DATA  
DATA0  
Figure 15. PPI GP Tx Mode with Internal Frame Sync Timing (Default)  
Rev. B  
|
Page 29 of 64  
|
June 2007  
ADSP-BF561  
FRAME  
SYNC IS  
SAMPLED  
DATA0 IS  
DRIVEN  
OUT  
PPIxCLK  
POLC = 0  
PPIxCLK  
POLC = 1  
t
HFSPE  
t
SFSPE  
POLS = 1  
PPxSYNC1  
POLS = 0  
POLS = 1  
PPIxSYNC2  
POLS = 0  
t
HDTPE  
PPIx_DATA  
DATA0  
t
DDTPE  
Figure 16. PPI GP Tx Mode with External Frame Sync Timing (Default)  
DATA  
DATA  
SAMPLING/  
FRAME  
SYNC  
SAMPLING/  
FRAME  
SYNC  
SAMPLING  
EDGE  
SAMPLING  
EDGE  
PPIxCLK  
POLC = 0  
PPIxCLK  
POLC = 1  
t
t
HFSPE  
SFSPE  
POLS = 1  
PPIxSYNC1  
POLS = 0  
POLS = 1  
PPIxSYNC2  
POLS = 0  
t
t
SDRPE  
HDRPE  
PPIx_DATA  
Figure 17. PPI GP Rx Mode with External Frame Sync Timing (Bit 4 of PLL_CTL Set)  
Rev. B  
|
Page 30 of 64  
|
June 2007  
ADSP-BF561  
DATA  
DATA  
DRIVING/  
FRAME  
SYNC  
DRIVING/  
FRAME  
SYNC  
SAMPLING  
EDGE  
SAMPLING  
EDGE  
PPIxCLK  
POLC = 0  
PPIxCLK  
POLC = 1  
t
HFSPE  
t
SFSPE  
POLS = 1  
PPIxSYNC1  
POLS = 0  
POLS = 1  
PPIxSYNC2  
POLS = 0  
t
DDTPE  
t
HDTPE  
PPIx_DATA  
Figure 18. PPI GP Tx Mode with External Frame Sync Timing (Bit 4 of PLL_CTL Set)  
Rev. B  
|
Page 31 of 64  
|
June 2007  
ADSP-BF561  
Serial Ports  
Table 22 through Table 25 on Page 34 and Figure 19 on Page 33  
through Figure 20 on Page 34 describe Serial Port operations.  
Table 22. Serial Ports—External Clock  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
tSFSE  
TFSx/RFSx Setup Before TSCLKx/RSCLKx1  
3.0  
3.0  
3.0  
3.0  
4.5  
15.0  
ns  
ns  
ns  
ns  
ns  
ns  
tHFSE TFSx/RFSx Hold After TSCLKx/RSCLKx1  
tSDRE Receive Data Setup Before RSCLKx1  
tHDRE Receive Data Hold After RSCLKx1  
tSCLKW TSCLKx/RSCLKx Width  
tSCLK  
TSCLKx/RSCLKx Period  
Switching Characteristics  
tDFSE TFSx/RFSx Delay After TSCLKx/RSCLKx (Internally Generated TFSx/RFSx)2  
tHOFSE TFSx/RFSx Hold After TSCLKx/RSCLKx (Internally Generated TFSx/RFSx)2  
tDDTE Transmit Data Delay After TSCLKx2  
10.0  
10.0  
ns  
ns  
ns  
ns  
0.0  
0.0  
tHDTE Transmit Data Hold After TSCLKx2  
1 Referenced to sample edge.  
2 Referenced to drive edge.  
Table 23. Serial Ports—Internal Clock  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
tSFSI  
tHFSI  
tSDRI  
tHDRI  
TFSx/RFSx Setup Before TSCLKx/RSCLKx1  
TFSx/RFSx Hold After TSCLKx/RSCLKx1  
Receive Data Setup Before RSCLKx1  
Receive Data Hold After RSCLKx1  
8.0  
ns  
ns  
ns  
ns  
ns  
ns  
–2.0  
6.0  
0.0  
tSCLKW TSCLKx/RSCLKx Width  
tSCLK TSCLKx/RSCLKx Period  
Switching Characteristics  
4.5  
15.0  
tDFSI  
TFSx/RFSx Delay After TSCLKx/RSCLKx (Internally Generated TFSx/RFSx)2  
3.0  
3.0  
ns  
ns  
ns  
ns  
ns  
tHOFSI TFSx/RFSx Hold After TSCLKx/RSCLKx (Internally Generated TFSx/RFSx)2  
–1.0  
tDDTI  
tHDTI  
Transmit Data Delay After TSCLKx2  
Transmit Data Hold After TSCLKx2  
–2.0  
4.5  
tSCLKIW TSCLKx/RSCLKx Width  
1 Referenced to sample edge.  
2 Referenced to drive edge.  
Rev. B  
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June 2007  
ADSP-BF561  
DATA RECEIVE—INTERNAL CLOCK  
DATA RECEIVE—EXTERNAL CLOCK  
DRIVE  
EDGE  
SAMPLE  
EDGE  
DRIVE  
EDGE  
SAMPLE  
EDGE  
tSCLKIW  
tSCLKEW  
RSCLKx  
RSCLKx  
tDFSI  
tDFSE  
tHOFSI  
tSFSI  
tHFSI  
tHOFSE  
tSFSE  
tHFSE  
RFSx  
DRx  
RFSx  
DRx  
tSDRI  
tHDRI  
tSDRE  
tHDRE  
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF RSCLKx OR TSCLKx CAN BE USED AS THE ACTIVE SAMPLING EDGE.  
DATA TRANSMIT—INTERNAL CLOCK  
DATA TRANSMIT—EXTERNAL CLOCK  
DRIVE  
EDGE  
SAMPLE  
EDGE  
DRIVE  
EDGE  
SAMPLE  
EDGE  
tSCLKIW  
tSCLKEW  
TSCLKx  
TSCLKx  
TFSx  
tDFSI  
tDFSE  
tHOFSI  
tSFSI  
tHFSI  
tHOFSE  
tSFSE  
tHFSE  
TFSx  
DTx  
tDDTI  
tDDTE  
tHDTI  
tHDTE  
DTx  
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF RSCLKx OR TSCLKx CAN BE USED AS THE ACTIVE SAMPLING EDGE.  
Figure 19. Serial Ports  
Rev. B  
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June 2007  
ADSP-BF561  
Table 24. Serial Ports—Enable and Three-State  
Parameter  
Min  
0
Max  
Unit  
Switching Characteristics  
tDTENE  
tDDTTE  
tDTENI  
tDDTTI  
Data Enable Delay from External TSCLKx1  
Data Disable Delay from External TSCLKx1  
Data Enable Delay from Internal TSCLKx1  
Data Disable Delay from Internal TSCLKx1  
ns  
ns  
ns  
ns  
10.0  
3.0  
–2.0  
1 Referenced to drive edge.  
Table 25. External Late Frame Sync  
Parameter  
Min  
Max  
10.0  
Unit  
Switching Characteristics  
tDDTLFSE Data Delay from Late External TFSx or External RFSx with MCE = 1, MFD = 01, 2  
tDTENLFS Data Enable from Late FS or MCE = 1, MFD = 01, 2  
ns  
ns  
0
1 MCE = 1, TFSx enable and TFSx valid follow tDTENLFS and tDDTLFSE  
.
2 If external RFSx/TFSx setup to RSCLKx/TSCLKx > tSCLKE/2, then tDDTTE I and tDTENE I apply; otherwise tDDTLFSE and tDTENLFS apply.  
/
/
EXTERNAL RFS WITH MCE = 1, MFD = 0  
DRIVE  
SAMPLE  
DRIVE  
RSCLKx  
RFSx  
tSFSE/I  
tHOFSE/I  
tDDTTE/I  
tDTENE/I  
tDTENLFS  
1ST BIT  
2ND BIT  
DTx  
tDDTLFSE  
LATE EXTERNAL TFS  
DRIVE  
SAMPLE  
DRIVE  
TSCLKx  
TFSx  
tHOFSE/I  
tSFSE/I  
tDDTTE/I  
tDTENE/I  
tDTENLFS  
DTx  
1ST BIT  
2ND BIT  
tDDTLFSE  
Figure 20. External Late Frame Sync  
Rev. B  
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June 2007  
ADSP-BF561  
Serial Peripheral Interface (SPI) Port—  
Master Timing  
Table 26 and Figure 21 describe SPI port master operations.  
Table 26. Serial Peripheral Interface (SPI) Port—Master Timing  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
tSSPIDM  
tHSPIDM  
Data Input Valid to SCK Edge (Data Input Setup)  
SCK Sampling Edge to Data Input Invalid  
7.5  
ns  
ns  
–1.5  
Switching Characteristics  
tSDSCIM  
tSPICHM  
tSPICLM  
tSPICLK  
SPISELx Low to First SCK Edge  
2tSCLK – 1.5  
2tSCLK – 0.5  
2tSCLK – 1.5  
4tSCLK – 1.5  
2tSCLK – 1.5  
2tSCLK – 1.5  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Serial Clock High Period  
Serial Clock Low Period  
Serial Clock Period  
tHDSM  
Last SCK Edge to SPISELx High  
Sequential Transfer Delay  
tSPITDM  
tDDSPIDM  
tHDSPIDM  
SCK Edge to Data Out Valid (Data Out Delay)  
SCK Edge to Data Out Invalid (Data Out Hold)  
6
–1.0  
+4.0  
SPISELx  
(OUTPUT)  
tSPICLK  
tHDSM  
tSPITDM  
tSDSCIM  
tSPICHM  
tSPICLM  
SCK  
(CPOL = 0)  
(OUTPUT)  
tSPICLM  
tSPICHM  
SCK  
(CPOL = 1)  
(OUTPUT)  
tDDSPIDM  
tHDSPIDM  
MOSI  
(OUTPUT)  
MSB  
LSB  
CPHA=1  
tSSPIDM  
tHSPIDM  
tSSPIDM  
tHSPIDM  
MISO  
(INPUT)  
MSB VALID  
LSB VALID  
tHDSPIDM  
LSB  
tDDSPIDM  
MOSI  
(OUTPUT)  
MSB  
CPHA=0  
tSSPIDM  
tHSPIDM  
MISO  
(INPUT)  
MSB VALID  
LSB VALID  
Figure 21. Serial Peripheral Interface (SPI) Port—Master Timing  
Rev. B  
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ADSP-BF561  
Serial Peripheral Interface (SPI) Port—  
Slave Timing  
Table 27 and Figure 22 describe SPI port slave operations.  
Table 27. Serial Peripheral Interface (SPI) Port—Slave Timing  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
tSPICHS  
tSPICLS  
tSPICLK  
tHDS  
Serial Clock High Period  
2tSCLK – 1.5  
2tSCLK – 1.5  
4tSCLK – 1.5  
2tSCLK – 1.5  
2tSCLK – 1.5  
2tSCLK – 1.5  
1.6  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Serial Clock Low Period  
Serial Clock Period  
Last SCK Edge to SPISS Not Asserted  
Sequential Transfer Delay  
tSPITDS  
tSDSCI  
tSSPID  
tHSPID  
SPISS Assertion to First SCK Edge  
Data Input Valid to SCK Edge (Data Input Setup)  
SCK Sampling Edge to Data Input Invalid  
1.6  
Switching Characteristics  
tDSOE  
SPISS Assertion to Data Out Active  
0
0
0
0
8
ns  
ns  
ns  
ns  
tDSDHI  
tDDSPID  
tHDSPID  
SPISS Deassertion to Data High Impedance  
SCK Edge to Data Out Valid (Data Out Delay)  
SCK Edge to Data Out Invalid (Data Out Hold)  
8
10  
10  
SPISS  
(INPUT)  
tSPICHS  
tSPICLS  
tSPICLK  
tHDS  
tSPITDS  
SCK  
(CPOL = 0)  
(INPUT)  
tSDSCI  
tSPICLS  
tSPICHS  
SCK  
(CPOL = 1)  
(INPUT)  
tDSOE  
tDDSPID  
tHDSPID  
MSB  
tDDSPID  
tDSDHI  
LSB  
MISO  
(OUTPUT)  
tHSPID  
tSSPID  
CPHA=1  
tSSPID  
tHSPID  
MOSI  
(INPUT)  
MSB VALID  
LSB VALID  
tDSOE  
tDDSPID  
tDSDHI  
MISO  
(OUTPUT)  
MSB  
LSB  
tHSPID  
CPHA=0  
tSSPID  
MOSI  
(INPUT)  
MSB VALID  
LSB VALID  
Figure 22. Serial Peripheral Interface (SPI) Port—Slave Timing  
Rev. B  
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June 2007  
ADSP-BF561  
Universal Asynchronous Receiver Transmitter (UART)  
Port—Receive and Transmit Timing  
Figure 23 describes UART port receive and transmit operations.  
The maximum baud rate is SCLK/16. As shown in Figure 23,  
there is some latency between the generation internal UART  
interrupts and the external data operations. These latencies are  
negligible at the data transmission rates for the UART.  
CLKOUT  
(SAMPLE CLOCK)  
Rx  
DATA8–5  
STOP  
RECEIVE  
INTERNAL  
UART RECEIVE  
INTERRUPT  
UART RECEIVE BIT SET BY DATA STOP;  
CLEARED BY FIFO READ  
START  
Tx  
DATA8–5  
STOP2–1  
AS DATA  
WRITEN TO  
BUFFER  
TRANSMIT  
INTERNAL  
UART TRANSMIT  
INTERRUPT  
UART TRANSMIT BIT SET BY PROGRAM;  
CLEARED BY WRITE TO TRANSMIT  
Figure 23. UART Port—Receive and Transmit Timing  
Rev. B  
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June 2007  
ADSP-BF561  
Programmable Flags Cycle Timing  
Table 28 and Figure 24 describe programmable flag operations.  
Table 28. Programmable Flags Cycle Timing  
Parameter  
Min  
Max  
Unit  
ns  
Timing Requirement  
tWFI  
Switching Characteristic  
tDFO Flag Output Delay from CLKOUT Low  
Flag Input Pulse Width  
tSCLK + 1  
6
ns  
CLKOUT  
tDFO  
PFx (OUTPUT)  
FLAG OUTPUT  
FLAG INPUT  
tWFI  
PFx (INPUT)  
Figure 24. Programmable Flags Cycle Timing  
Rev. B  
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June 2007  
ADSP-BF561  
Timer Cycle Timing  
Table 29 and Figure 25 describe timer expired operations. The  
input signal is asynchronous in width capture mode and exter-  
nal clock mode and has an absolute maximum input frequency  
of fSCLK/2 MHz.  
Table 29. Timer Cycle Timing  
Parameter  
Min  
Max  
Unit  
Timing Characteristics  
tWL  
tWH  
Timer Pulse Width Input Low1 (Measured in SCLK Cycles)  
Timer Pulse Width Input High1 (Measured in SCLK Cycles)  
1
1
SCLK  
SCLK  
Switching Characteristic  
tHTO Timer Pulse Width Output2 (Measured in SCLK Cycles)  
1
(232–1)  
SCLK  
1 The minimum pulse widths apply for TMRx input pins in width capture and external clock modes. They also apply to the PF1 or PPIxCLK input pins in PWM output mode.  
2 The minimum time for tHTO is one cycle, and the maximum time for tHTO equals (232–1) cycles.  
CLKOUT  
tHTO  
TMRx  
(PWM OUTPUT MODE)  
TMRx  
tWL  
tWH  
(WIDTH CAPTURE AND  
EXTERNAL CLOCK MODES)  
Figure 25. Timer PWM_OUT Cycle Timing  
Rev. B  
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June 2007  
ADSP-BF561  
JTAG Test and Emulation Port Timing  
Table 30 and Figure 26 describe JTAG port operations.  
Table 30. JTAG Port Timing  
Parameter  
Min  
Max  
Unit  
Timing Parameters  
tTCK  
TCK Period  
20  
4
ns  
tSTAP  
tHTAP  
tSSYS  
tHSYS  
tTRSTW  
TDI, TMS Setup Before TCK High  
TDI, TMS Hold After TCK High  
System Inputs Setup Before TCK High1  
System Inputs Hold After TCK High1  
TRST Pulse Width2 (Measured in TCK Cycles)  
ns  
4
ns  
4
ns  
5
ns  
4
TCK  
Switching Characteristics  
tDTDO TDO Delay from TCK Low  
tDSYS  
System Outputs Delay After TCK Low3  
10  
12  
ns  
ns  
0
1 System Inputs= DATA31–0, ARDY, PF47–0, PPI0CLK, PPI1CLK, RSCLK0–1, RFS0–1, DR0PRI, DR0SEC, TSCLK0–1, TFS0–1, DR1PRI, DR1SEC, MOSI, MISO, SCK, RX,  
RESET, NMI0, NMI1, BMODE1–0, BR, and PPIxD7–0.  
2 50 MHz maximum  
3 System Outputs = DATA31–0, ADDR25–2, ABE3–0, AOE, ARE, AWE, AMS3–0, SRAS, SCAS, SWE, SCKE, CLKOUT, SA10, SMS3–0, PF47–0, RSCLK0–1, RFS0–1,  
TSCLK0–1, TFS0–1, DT0PRI, DT0SEC, DT1PRI, DT1SEC, MOSI, MISO, SCK, TX, BG, BGH, and PPIxD7–0.  
tTCK  
TCK  
tSTAP  
tHTAP  
TMS  
TDI  
tDTDO  
TDO  
tSSYS  
tHSYS  
SYSTEM  
INPUTS  
tDSYS  
SYSTEM  
OUTPUTS  
Figure 26. JTAG Port Timing  
Rev. B  
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June 2007  
ADSP-BF561  
OUTPUT DRIVE CURRENTS  
150  
100  
50  
Figure 27 through Figure 34 on Page 42 show typical current  
voltage characteristics for the output drivers of the  
ADSP-BF561 processor. The curves represent the current drive  
capability of the output drivers as a function of output voltage.  
Refer to Table 8 on Page 17 to identify the driver type for a pin.  
VDDEXT = 2.75V  
VDDEXT = 2.50V  
VDDEXT = 2.25V  
0
–50  
VOH  
150  
V
DDEXT = 2.75V  
VDDEXT = 2.50V  
VDDEXT = 2.25V  
100  
50  
–100  
–150  
VOL  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
0
–50  
VOH  
SOURCE VOLTAGE (V)  
Figure 29. Drive Current B (Low VDDEXT  
)
VOL  
–100  
–150  
150  
100  
50  
V
DDEXT = 3.65V  
VDDEXT = 2.95V  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
VDDEXT = 3.30V  
SOURCE VOLTAGE (V)  
Figure 27. Drive Current A (Low VDDEXT  
)
0
VOH  
150  
100  
50  
VDDEXT = 3.65V  
VDDEXT = 3.30V  
VDDEXT = 2.95V  
–50  
–100  
VOL  
–150  
0
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
VOH  
SOURCE VOLTAGE (V)  
–50  
–100  
–150  
Figure 30. Drive Current B (High VDDEXT  
)
VOL  
60  
40  
20  
VDDEXT = 2.75V  
VDDEXT = 2.50V  
VDDEXT = 2.25V  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
SOURCE VOLTAGE (V)  
Figure 28. Drive Current A (High VDDEXT  
)
0
–20  
–40  
–60  
VOH  
VOL  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
SOURCE VOLTAGE (V)  
Figure 31. Drive Current C (Low VDDEXT  
)
Rev. B  
|
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|
June 2007  
ADSP-BF561  
POWER DISSIPATION  
100  
80  
60  
40  
20  
Many operating conditions can affect power dissipation. System  
designers should refer to Estimating Power for ADSP-BF561  
Blackfin Processors (EE-293) on the Analog Devices website  
(www.analog.com)—use site search on “EE-293.” This docu-  
ment provides detailed information for optimizing your design  
for lowest power.  
VDDEXT = 3.65V  
DDEXT = 3.30V  
VDDEXT = 2.95V  
V
0
–20  
–40  
–60  
See the ADSP-BF561 Blackfin Processor Hardware Reference  
Manual for definitions of the various operating modes and for  
instructions on how to minimize system power.  
VOH  
VOL  
TEST CONDITIONS  
80  
All timing parameters appearing in this data sheet were mea-  
sured under the conditions described in this section. Figure 35  
shows the measurement point for ac measurements (except out-  
put enable/disable). The measurement point VMEAS is 1.5 V for  
VDDEXT (nominal) = 2.5 V/3.3 V.  
–100  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
SOURCE VOLTAGE (V)  
Figure 32. Drive Current C (High VDDEXT  
)
100  
INPUT  
OR  
OUTPUT  
VDDEXT = 2.75V  
VDDEXT = 2.50V  
VDDEXT = 2.25V  
80  
60  
40  
V
V
MEAS  
MEAS  
Figure 35. Voltage Reference Levels for AC  
Measurements (Except Output Enable/Disable)  
20  
0
VOH  
Output Enable Time Measurement  
–20  
Output pins are considered to be enabled when they have made  
a transition from a high impedance state to the point when they  
start driving.  
–40  
–60  
VOL  
80  
The output enable time tENA is the interval from the point when a  
reference signal reaches a high or low voltage level to the point  
when the output starts driving as shown on the right side of  
Figure 36 on Page 43.  
–100  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
SOURCE VOLTAGE (V)  
The time tENA MEASURED is the interval, from when the reference sig-  
nal switches,_to when the output voltage reaches VTRIP(high) or  
VTRIP(low). VTRIP(high) is 2.0 V and VTRIP(low) is 1.0 V for VDDEXT  
Figure 33. Drive Current D (Low VDDEXT  
)
150  
100  
50  
(nominal) = 2.5 V/3.3 V. Time tTRIP is the interval from when the  
output starts driving to when the output reaches the VTRIP(high)  
or VTRIP(low) trip voltage.  
V
DDEXT = 3.65V  
VDDEXT = 3.30V  
VDDEXT = 2.95V  
Time tENA is calculated as shown in the equation:  
tENA = tENA_MEASURED tTRIP  
If multiple pins (such as the data bus) are enabled, the measure-  
ment value is that of the first pin to start driving.  
0
VOH  
–50  
Output Disable Time Measurement  
VOL  
Output pins are considered to be disabled when they stop driv-  
ing, go into a high impedance state, and start to decay from their  
output high or low voltage. The output disable time tDIS is the  
–100  
–150  
difference between tDIS MEASURED and tDECAY as shown on the left side  
_
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
of Figure 36 on Page 43.  
SOURCE VOLTAGE (V)  
tDIS = tDIS_MEASURED tDECAY  
Figure 34. Drive Current D (High VDDEXT  
)
Rev. B  
|
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|
June 2007  
ADSP-BF561  
The time for the voltage on the bus to decay by ΔV is dependent  
on the capacitive load CL and the load current IL. This decay time  
can be approximated by the equation:  
14  
12  
RISE TIME  
tDECAY = (CLΔV) ⁄ IL  
10  
FALL TIME  
8
The time tDECAY is calculated with test loads CL and IL, and with  
ΔV equal to 0.5 V for VDDEXT (nominal) = 2.5 V/3.3 V.  
6
4
The time tDIS MEASURED is the interval from when the reference sig-  
_
nal switches, to when the output voltage decays ΔV from the  
measured output high or output low voltage.  
2
0
Example System Hold Time Calculation  
To determine the data output hold time in a particular system,  
first calculate tDECAY using the equation given above. Choose ΔV  
to be the difference between the ADSP-BF561 processor’s out-  
put voltage and the input threshold for the device requiring the  
hold time. CL is the total bus capacitance (per data line), and IL is  
the total leakage or three-state current (per data line). The hold  
time will be tDECAY plus the various output disable times as speci-  
fied in the Timing Specifications on Page 22 (for example tDSDAT  
for an SDRAM write cycle as shown in SDRAM Interface Tim-  
ing on Page 26).  
0
50  
100  
150  
200  
250  
LOAD CAPACITANCE (pF)  
Figure 38. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance  
for Driver A at VDDEXT (min)  
12  
10  
RISE TIME  
8
FALL TIME  
REFERENCE  
SIGNAL  
6
4
2
0
tDIS_MEASURED  
tENA_MEASURED  
tDIS  
tENA  
VOH  
VOH(MEASURED)  
(MEASURED)  
VOH (MEASURED) ؊V  
VOL (MEASURED) + V  
VTRIP(HIGH)  
VTRIP(LOW)  
0
50  
100  
150  
200  
250  
VOL  
LOAD CAPACITANCE (pF)  
VOL(MEASURED)  
(MEASURED)  
Figure 39. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance  
for Driver A at VDDEXT (max)  
tDECAY  
tTRIP  
OUTPUT STOPS DRIVING  
OUTPUT STARTS DRIVING  
12  
10  
HIGH IMPEDANCE STATE  
Figure 36. Output Enable/Disable  
RISE TIME  
8
Capacitive Loading  
Output delays and holds are based on standard capacitive loads:  
30 pF on all pins (see Figure 37). VLOAD is 1.5 V for VDDEXT (nomi-  
nal) = 2.5 V/3.3 V. Figure 38 through Figure 45 on Page 44 show  
how output rise time varies with capacitance. The delay and  
hold specifications given should be derated by a factor derived  
from these figures. The graphs in these figures may not be linear  
outside the ranges shown.  
FALL TIME  
6
4
2
0
0
50  
100  
150  
200  
250  
50  
TO  
LOAD CAPACITANCE (pF)  
V
OUTPUT  
PIN  
LOAD  
Figure 40. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance  
for Driver B at VDDEXT (min)  
30pF  
Figure 37. Equivalent Device Loading for AC Measurements  
(Includes All Fixtures)  
Rev. B  
|
Page 43 of 64  
|
June 2007  
ADSP-BF561  
10  
9
18  
16  
14  
8
RISE TIME  
RISE TIME  
7
12  
10  
8
6
5
FALL TIME  
FALL TIME  
4
3
2
1
0
6
4
2
0
0
50  
100  
150  
200  
250  
0
50  
100  
150  
200  
250  
LOAD CAPACITANCE (pF)  
LOAD CAPACITANCE (pF)  
Figure 41. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance  
for Driver B at VDDEXT (max)  
Figure 44. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance  
for Driver D at VDDEXT (min)  
30  
14  
12  
25  
RISE TIME  
RISE TIME  
10  
20  
8
FALL TIME  
15  
FALL TIME  
6
4
2
0
10  
5
0
0
50  
100  
150  
200  
250  
0
50  
100  
150  
200  
250  
LOAD CAPACITANCE (pF)  
LOAD CAPACITANCE (pF)  
Figure 42. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance  
for Driver C at VDDEXT (min)  
Figure 45. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance  
for Driver D at VDDEXT (max)  
20  
18  
16  
ENVIRONMENTAL CONDITIONS  
To determine the junction temperature on the application  
printed circuit board use:  
RISE TIME  
14  
TJ = TCASE + JT × PD)  
12  
where:  
FALL TIME  
TJ = junction temperature (؇C).  
10  
T
CASE = case temperature (؇C) measured by customer at top  
8
6
4
2
0
center of package.  
ΨJT = from Table 31 on Page 45 through Table 33 on Page 45.  
PD = power dissipation (see Power Dissipation on Page 42 for  
the method to calculate PD).  
0
50  
100  
150  
200  
250  
Values of θJA are provided for package comparison and printed  
circuit board design considerations. θJA can be used for a first  
order approximation of TJ by the equation:  
LOAD CAPACITANCE (pF)  
Figure 43. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance  
for Driver C at VDDEXT (max)  
TJ = TA + JA × PD)  
where:  
TA = ambient temperature (؇C).  
Rev. B  
|
Page 44 of 64  
|
June 2007  
ADSP-BF561  
In Table 31 through Table 33, airflow measurements comply  
with JEDEC standards JESD51–2 and JESD51–6, and the junc-  
tion-to-board measurement complies with JESD51–8. The  
junction-to-case measurement complies with MIL-STD-883  
(Method 1012.1). All measurements use a 2S2P JEDEC test  
board.  
Thermal resistance θJA in Table 31 through Table 33 is the figure  
of merit relating to performance of the package and board in a  
convective environment. θJMA represents the thermal resistance  
under two conditions of airflow. θJB represents the heat  
extracted from the periphery of the board. ΨJT represents the  
correlation between TJ and TCASE. Values of θJB are provided for  
package comparison and printed circuit board design  
considerations.  
Table 31. Thermal Characteristics for BC-256-4  
(17 mm × 17 mm) Package  
Parameter  
θJA  
Condition  
Typical  
18.1  
15.9  
15.1  
3.72  
0.11  
0.18  
0.18  
Unit  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
0 Linear m/s Airflow  
1 Linear m/s Airflow  
2 Linear m/s Airflow  
Not Applicable  
0 Linear m/s Airflow  
1 Linear m/s Airflow  
2 Linear m/s Airflow  
θJMA  
θJMA  
θJC  
ΨJT  
ΨJT  
ΨJT  
Table 32. Thermal Characteristics for BC-256-1  
(12 mm × 12 mm) Package  
Parameter  
θJA  
θJMA  
θJMA  
θJB  
Condition  
Typical  
25.6  
22.4  
21.6  
18.9  
4.85  
0.15  
n/a  
Unit  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
0 Linear m/s Airflow  
1 Linear m/s Airflow  
2 Linear m/s Airflow  
Not Applicable  
θJC  
Not Applicable  
ΨJT  
ΨJT  
ΨJT  
0 Linear m/s Airflow  
1 Linear m/s Airflow  
2 Linear m/s Airflow  
n/a  
Table 33. Thermal Characteristics for B-297 Package  
Parameter  
θJA  
θJMA  
θJMA  
θJB  
Condition  
Typical  
20.6  
17.8  
17.4  
16.3  
7.15  
0.37  
n/a  
Unit  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
0 Linear m/s Airflow  
1 Linear m/s Airflow  
2 Linear m/s Airflow  
Not Applicable  
θJC  
Not Applicable  
ΨJT  
ΨJT  
ΨJT  
0 Linear m/s Airflow  
1 Linear m/s Airflow  
2 Linear m/s Airflow  
n/a  
Rev. B  
|
Page 45 of 64  
|
June 2007  
ADSP-BF561  
256-BALL CSP_BGA (17 mm ϫ 17 mm) BALL ASSIGNMENT  
Table 34 lists the 256-Ball CSP_BGA (17 mm ϫ 17 mm) ball  
assignment by ball number. Table 35 on Page 48 lists the ball  
assignment alphabetically by signal.  
Table 34. 256-Ball CSP_BGA (17 mm ϫ 17 mm) Ball Assignment (Numerically by Ball Number)  
Ball No.  
A1  
Signal  
VDDEXT  
ADDR22  
ADDR18  
ADDR14  
ADDR11  
AMS3  
Ball No.  
C9  
Signal  
SMS3  
Ball No.  
F1  
Signal Ball No.  
CLKIN H9  
PPI0D10 H10  
RESET H11  
Signal  
GND  
Ball No.  
L1  
Signal  
PPI0D3  
PPI0D2  
PPI0D1  
PPI0D0  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
GND  
A2  
C10  
C11  
C12  
C13  
C14  
C15  
C16  
D1  
SWE  
F2  
GND  
L2  
A3  
SA10  
F3  
GND  
L3  
A4  
ABE0  
F4  
BYPASS H12  
VDDEXT H13  
VDDEXT H14  
VDDEXT H15  
GND  
L4  
A5  
ADDR07  
ADDR04  
DATA0  
DATA05  
PPI0D15  
F5  
GND  
L5  
A6  
F6  
DATA21  
DATA19  
DATA23  
VROUT1  
PPI0D8  
PPI0D7  
PPI0D9  
GND  
L6  
A7  
AMS0  
F7  
L7  
A8  
ARDY  
F8  
GND  
GND  
H16  
J1  
L8  
A9  
SMS2  
F9  
L9  
A10  
A11  
A12  
A13  
A14  
A15  
A16  
B1  
SCLK0  
D2  
PPI0SYNC3 F10  
PPI0SYNC2 F11  
VDDEXT J2  
VDDEXT J3  
VDDEXT J4  
DATA11 J5  
DATA08 J6  
DATA10 J7  
DATA16 J8  
L10  
L11  
L12  
L13  
L14  
L15  
L16  
M1  
M2  
M3  
M4  
M5  
M6  
M7  
M8  
M9  
M10  
M11  
VDDEXT  
VDDEXT  
VDDEXT  
NC  
SCLK1  
D3  
ABE2  
D4  
ADDR21  
ADDR15  
ADDR09  
AWE  
F12  
F13  
F14  
F15  
F16  
G1  
ABE3  
D5  
ADDR06  
ADDR03  
VDDEXT  
ADDR24  
ADDR23  
ADDR19  
ADDR17  
ADDR12  
ADDR10  
AMS1  
D6  
GND  
DT0PRI  
DATA31  
DATA28  
PPI1SYNC2  
PPI1D15  
PPI1D14  
PPI1D9  
VDDINT  
VDDINT  
GND  
D7  
GND  
D8  
SMS0  
GND  
D9  
SRAS  
XTAL  
J9  
GND  
B2  
D10  
D11  
D12  
D13  
D14  
D15  
D16  
E1  
SCAS  
G2  
VDDEXT J10  
VDDEXT J11  
GND  
B3  
BGH  
G3  
GND  
B4  
ABE1  
G4  
GND  
GND  
J12  
J13  
VDDINT  
VDDINT  
DATA20  
DATA22  
DATA24  
PPI0D6  
PPI0D5  
PPI0D4  
B5  
DATA02  
DATA01  
DATA03  
DATA07  
PPI0D11  
PPI0D13  
PPI0D12  
PPI0D14  
PPI1CLK  
VDDINT  
GND  
G5  
B6  
G6  
VDDEXT J14  
B7  
G7  
GND  
GND  
GND  
GND  
J15  
J16  
K1  
B8  
AOE  
G8  
VDDINT  
GND  
B9  
SMS1  
G9  
B10  
B11  
B12  
B13  
B14  
B15  
B16  
C1  
SCKE  
E2  
G10  
G11  
G12  
G13  
G14  
G15  
G16  
H1  
K2  
VDDINT  
GND  
BR  
E3  
VDDEXT K3  
VDDEXT K4  
DATA17 K5  
DATA14 K6  
DATA15 K7  
DATA18 K8  
VROUT0 K9  
BG  
E4  
PPI1SYNC3 M12  
VDDINT  
RSCLK0  
DR0PRI  
TSCLK0  
DATA29  
PPI1SYNC1  
PPI1D10  
PPI1D7  
PPI1D5  
PF0  
ADDR08  
ADDR05  
ADDR02  
DATA04  
E5  
VDDEXT  
VDDEXT  
GND  
M13  
M14  
M15  
M16  
N1  
E6  
E7  
E8  
VDDINT  
GND  
GND  
PPI0SYNC1 E9  
GND  
C2  
ADDR25  
PPI0CLK  
ADDR20  
ADDR16  
ADDR13  
AMS2  
E10  
VDDINT  
GND  
H2  
GND  
GND  
K10  
K11  
GND  
N2  
C3  
E11  
E12  
E13  
E14  
E15  
E16  
H3  
VDDEXT  
GND  
N3  
C4  
VDDINT  
DATA06  
DATA13  
DATA09  
DATA12  
H4  
VDDINT K12  
VDDINT K13  
N4  
C5  
H5  
GND  
N5  
C6  
H6  
GND  
GND  
GND  
K14  
K15  
K16  
DATA26  
DATA25  
DATA27  
N6  
PF04  
C7  
H7  
N7  
PF09  
C8  
ARE  
H8  
N8  
PF12  
Rev. B  
|
Page 46 of 64  
|
June 2007  
ADSP-BF561  
Table 34. 256-Ball CSP_BGA (17 mm ϫ 17 mm) Ball Assignment (Numerically by Ball Number) (Continued)  
Ball No.  
N9  
Signal  
GND  
Ball No.  
P5  
Signal  
PF01  
Ball No.  
R1  
Signal Ball No.  
PPI1D12 R13  
PPI1D11 R14  
PPI1D4 R15  
PPI1D1 R16  
Signal  
RSCLK1  
TSCLK1  
NC  
Ball No.  
Signal  
TDO  
T9  
N10  
N11  
N12  
N13  
N14  
N15  
N16  
P1  
BMODE1  
BMODE0  
RX  
P6  
PF06  
R2  
T10  
T11  
T12  
T13  
T14  
T15  
T16  
TDI  
P7  
PF08  
R3  
EMU  
P8  
PF15  
R4  
TFS0  
MISO  
TX  
DR1SEC  
DT1SEC  
RFS0  
P9  
NMI1  
TMS  
R5  
PF02  
PF07  
PF11  
PF14  
TCK  
T1  
T2  
T3  
T4  
T5  
T6  
T7  
T8  
VDDEXT  
NC  
P10  
P11  
P12  
P13  
P14  
P15  
P16  
R6  
DR1PRI  
DT1PRI  
VDDEXT  
NMI0  
SCK  
R7  
PPI1D3  
PPI1D2  
PF03  
DATA30  
PPI1D13  
PPI1D8  
PPI1D6  
PPI1D0  
R8  
RFS1  
R9  
P2  
TFS1  
R10  
R11  
R12  
TRST  
SLEEP  
MOSI  
PF05  
P3  
DR0SEC  
DT0SEC  
PF10  
P4  
PF13  
Rev. B  
|
Page 47 of 64  
|
June 2007  
ADSP-BF561  
Table 35. 256-Ball CSP_BGA (12 mm ϫ 12 mm) Ball Assignment (Alphabetically by Signal)  
Signal  
ABE0  
Ball No.  
C12  
D12  
A12  
A13  
B15  
A15  
C14  
B14  
A14  
C13  
B13  
D6  
Signal  
Ball No.  
B11  
F4  
Signal  
DT0SEC  
DT1PRI  
DT1SEC  
EMU  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
Ball No.  
P16  
T15  
N14  
T11  
E7  
Signal  
GND  
Ball No.  
M9  
M11  
N9  
T12  
R12  
L13  
R15  
T2  
Signal  
Ball No.  
E2  
BR  
PPI0D13  
PPI0D14  
PPI0D15  
PPI0SYNC1  
PPI0SYNC2  
PPI0SYNC3  
PPI1CLK  
PPI1D0  
PPI1D1  
PPI1D2  
PPI1D3  
PPI1D4  
PPI1D5  
PPI1D6  
PPI1D7  
PPI1D8  
PPI1D9  
PPI1D10  
PPI1D11  
PPI1D12  
PPI1D13  
PPI1D14  
PPI1D15  
PPI1SYNC1  
PPI1SYNC2  
PPI1SYNC3  
RESET  
ABE1  
BYPASS  
CLKIN  
GND  
E4  
ABE2  
F1  
GND  
D1  
ABE3  
DATA0  
C15  
D14  
D13  
D15  
B16  
C16  
E13  
D16  
F14  
E15  
F15  
F13  
E16  
E14  
G14  
G15  
F16  
G13  
G16  
H15  
J14  
MISO  
MOSI  
NC  
C1  
ADDR02  
ADDR03  
ADDR04  
ADDR05  
ADDR06  
ADDR07  
ADDR08  
ADDR09  
ADDR10  
ADDR11  
ADDR12  
ADDR13  
ADDR14  
ADDR15  
ADDR16  
ADDR17  
ADDR18  
ADDR19  
ADDR20  
ADDR21  
ADDR22  
ADDR23  
ADDR24  
ADDR25  
AMS0  
DATA01  
DATA02  
DATA03  
DATA04  
DATA05  
DATA06  
DATA07  
DATA08  
DATA09  
DATA10  
DATA11  
DATA12  
DATA13  
DATA14  
DATA15  
DATA16  
DATA17  
DATA18  
DATA19  
DATA20  
DATA21  
DATA22  
DATA23  
DATA24  
DATA25  
DATA26  
DATA27  
DATA28  
DATA29  
DATA30  
DATA31  
DR0PRI  
DR0SEC  
DR1PRI  
DR1SEC  
DT0PRI  
D3  
E9  
D2  
E11  
F8  
NC  
E5  
NC  
P4  
F9  
NMI0  
NMI1  
PF0  
P11  
P9  
R4  
G4  
T4  
G5  
N5  
P5  
T3  
G7  
PF01  
R3  
B6  
G8  
PF02  
R5  
N4  
A5  
G9  
PF03  
T5  
P3  
B5  
G10  
H2  
PF04  
N6  
T6  
N3  
C6  
PF05  
P2  
A4  
H3  
PF06  
P6  
M4  
N2  
D5  
H6  
PF07  
R6  
C5  
H7  
PF08  
P7  
R2  
B4  
H8  
PF09  
N7  
T7  
R1  
A3  
H9  
PF10  
P1  
B3  
H10  
H11  
H12  
H13  
J5  
PF11  
R7  
M3  
M2  
N1  
C4  
PF12  
N8  
T8  
D4  
PF13  
A2  
H14  
J15  
PF14  
R8  
M1  
K4  
B2  
PF15  
P8  
B1  
H16  
J16  
J6  
PPI0CLK  
PPI0D0  
PPI0D1  
PPI0D2  
PPI0D3  
PPI0D4  
PPI0D5  
PPI0D6  
PPI0D7  
PPI0D8  
PPI0D9  
PPI0D10  
PPI0D11  
PPI0D12  
C3  
L4  
F3  
C2  
J7  
RFS0  
N15  
P13  
M13  
R13  
N12  
C11  
D10  
P12  
B10  
A10  
A11  
R11  
D8  
A7  
K15  
K14  
K16  
L16  
M16  
N16  
L15  
M14  
P15  
T14  
N13  
L14  
J8  
L3  
RFS1  
AMS1  
B7  
J9  
L2  
RSCLK0  
RSCLK1  
RX  
AMS2  
C7  
J10  
J11  
K7  
L1  
AMS3  
A6  
K3  
AOE  
B8  
K2  
SA10  
ARDY  
A8  
K8  
K1  
SCAS  
ARE  
C8  
K9  
J3  
SCK  
AWE  
D7  
K10  
K12  
K13  
L9  
J2  
SCKE  
BG  
B12  
D11  
N11  
N10  
J4  
SCLK0  
BGH  
F2  
SCLK1  
BMODE0  
BMODE1  
E1  
SLEEP  
M7  
E3  
SMS0  
Rev. B  
|
Page 48 of 64  
|
June 2007  
ADSP-BF561  
Table 35. 256-Ball CSP_BGA (12 mm ϫ 12 mm) Ball Assignment (Alphabetically by Signal) (Continued)  
Signal  
SMS1  
SMS2  
SMS3  
SRAS  
SWE  
Ball No.  
B9  
Signal  
Ball No.  
M15  
R14  
T13  
A1  
Signal  
Ball No.  
G3  
Signal  
Ball No.  
L11  
L12  
T1  
Signal  
Ball No.  
M5  
TSCLK0  
TSCLK1  
TX  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VROUT0  
VROUT1  
XTAL  
A9  
G6  
M6  
C9  
G11  
G12  
K5  
M8  
D9  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
T16  
E6  
M10  
M12  
H1  
C10  
R9  
A16  
F5  
TCK  
K6  
E8  
TDI  
T10  
T9  
F6  
K11  
L5  
E10  
E12  
H4  
J1  
TDO  
TFS0  
TFS1  
TMS  
F7  
G1  
R16  
P14  
P10  
R10  
F10  
F11  
F12  
G2  
L6  
L7  
H5  
L8  
J12  
J13  
TRST  
L10  
Rev. B  
|
Page 49 of 64  
|
June 2007  
ADSP-BF561  
Figure 46 lists the top view of the 256-Ball CSP_BGA  
(17 mm × 17 mm) ball configuration. Figure 47 lists the bottom  
view.  
A1 BALL  
PAD CORNER  
A
B
C
D
E
F
KEY:  
V
V
GND  
I/O  
NC  
V
DDINT  
DDEXT  
ROUT  
G
H
J
K
L
M
N
P
R
T
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16  
TOP VIEW  
Figure 46. 256-Ball CSP_BGA Ball Configuration (Top View)  
A1 BALL  
PAD CORNER  
A
B
C
D
E
F
KEY:  
V
GND  
I/O  
NC  
V
DDINT  
V
DDEXT  
ROUT  
G
H
J
K
L
M
N
P
R
T
16 15 14 13 12 11 10  
9
8
7
6
5
4
3
2
1
BOTTOM VIEW  
Figure 47. 256-Ball CSP_BGA Ball Configuration (Bottom View)  
Rev. B  
|
Page 50 of 64  
|
June 2007  
ADSP-BF561  
256-BALL CSP_BGA (12 mm ϫ 12 mm) BALL ASSIGNMENT  
Table 36 lists the 256-Ball CSP_BGA (12 mm ϫ 12 mm) ball  
assignment by ball number. Table 37 on Page 53 lists the ball  
assignment alphabetically by signal.  
Table 36. 256-Ball CSP_BGA (12 mm ϫ 12 mm) Ball Assignment (Numerically by Ball Number)  
Ball No. Signal  
Ball No. Signal  
Ball No. Signal  
Ball No. Signal  
Ball No. Signal  
A01  
A02  
A03  
A04  
A05  
A06  
A07  
A08  
A09  
A10  
A11  
A12  
A13  
A14  
A15  
A16  
B01  
B02  
B03  
B04  
B05  
B06  
B07  
B08  
B09  
B10  
B11  
B12  
B13  
B14  
B15  
B16  
C01  
C02  
C03  
C04  
C05  
C06  
C07  
C08  
VDDEXT  
ADDR24  
ADDR20  
VDDEXT  
ADDR14  
ADDR10  
AMS3  
C09  
C10  
C11  
C12  
C13  
C14  
C15  
C16  
D01  
D02  
D03  
D04  
D05  
D06  
D07  
D08  
D09  
D10  
D11  
D12  
D13  
D14  
D15  
D16  
E01  
E02  
E03  
E04  
E05  
E06  
E07  
E08  
E09  
E10  
E11  
E12  
E13  
E14  
E15  
E16  
SMS2  
F01  
F02  
F03  
F04  
F05  
F06  
F07  
F08  
F09  
F10  
F11  
F12  
F13  
F14  
F15  
F16  
G01  
G02  
G03  
G04  
G05  
G06  
G07  
G08  
G09  
G10  
G11  
G12  
G13  
G14  
G15  
G16  
H01  
H02  
H03  
H04  
H05  
H06  
H07  
H08  
CLKIN  
H09  
H10  
H11  
H12  
H13  
H14  
H15  
H16  
J01  
J02  
J03  
J04  
J05  
J06  
J07  
J08  
J09  
J10  
J11  
J12  
J13  
J14  
J15  
J16  
K01  
K02  
K03  
K04  
K05  
K06  
K07  
K08  
K09  
K10  
K11  
K12  
K13  
K14  
K15  
K16  
GND  
L01  
PPI0D0  
PPI1SYNC2  
GND  
SRAS  
VDDEXT  
RESET  
GND  
L02  
GND  
VDDINT  
DATA16  
DATA18  
DATA20  
DATA17  
DATA19  
VROUT0  
VROUT1  
PPI0D2  
PPI0D3  
PPI0D1  
VDDEXT  
GND  
L03  
BGH  
PPI0D10  
ADDR21  
ADDR17  
VDDINT  
GND  
L04  
PPI1SYNC3  
VDDEXT  
PPI1D11  
GND  
GND  
L05  
ADDR07  
DATA1  
DATA3  
PPI0D13  
PPI0D15  
PPI0SYNC3  
ADDR23  
GND  
L06  
L07  
AWE  
L08  
VDDINT  
GND  
VDDEXT  
SMS3  
VDDINT  
GND  
L09  
L10  
VDDEXT  
GND  
SCLK0  
ADDR08  
DATA10  
DATA8  
DATA12  
DATA9  
DATA11  
XTAL  
L11  
SCLK1  
L12  
DR0PRI  
TFS0  
BG  
L13  
ABE2  
GND  
L14  
GND  
ABE3  
ADDR09  
GND  
L15  
DATA27  
DATA29  
PPI1D15  
PPI1D13  
PPI1D9  
GND  
VDDEXT  
PPI1CLK  
ADDR22  
ADDR18  
ADDR16  
ADDR12  
VDDEXT  
AMS1  
VDDINT  
VDDINT  
VDDINT  
GND  
L16  
ARDY  
M01  
M02  
M03  
M04  
M05  
M06  
M07  
M08  
M09  
M10  
M11  
M12  
M13  
M14  
M15  
M16  
N01  
N02  
N03  
N04  
N05  
N06  
N07  
N08  
SCAS  
GND  
SA10  
VDDEXT  
BYPASS  
PPI0D14  
GND  
VDDEXT  
ADDR02  
GND  
DATA30  
DATA22  
GND  
NC  
PF3  
DATA5  
DATA6  
GND  
GND  
DATA21  
DATA23  
PPI0D6  
PPI0D4  
PPI0D8  
PPI1SYNC1  
PPI1D14  
VDDEXT  
GND  
PF7  
ARE  
GND  
VDDINT  
GND  
SMS1  
VDDINT  
ADDR05  
ADDR03  
DATA15  
DATA14  
GND  
SCKE  
PPI0D11  
PPI0D12  
PPI0SYNC1  
ADDR15  
ADDR13  
AMS2  
BMODE0  
SCK  
VDDEXT  
BR  
DR1PRI  
NC  
ABE1  
ADDR06  
ADDR04  
DATA0  
PPI0SYNC2  
PPI0CLK  
ADDR25  
ADDR19  
GND  
VDDEXT  
DATA31  
DT0PRI  
PPI1D12  
PPI1D10  
PPI1D3  
PPI1D1  
PF1  
DATA13  
VDDEXT  
GND  
VDDINT  
SMS0  
VDDINT  
GND  
SWE  
GND  
GND  
ABE0  
PPI0D9  
PPI0D7  
PPI0D5  
VDDINT  
VDDINT  
GND  
VDDINT  
DATA28  
DATA26  
DATA24  
DATA25  
VDDEXT  
DATA2  
GND  
ADDR11  
AOE  
DATA4  
DATA7  
VDDEXT  
PF9  
GND  
AMS0  
PF13  
Rev. B  
|
Page 51 of 64  
|
June 2007  
ADSP-BF561  
Table 36. 256-Ball CSP_BGA (12 mm ϫ 12 mm) Ball Assignment (Numerically by Ball Number) (Continued)  
Ball No. Signal  
Ball No. Signal  
Ball No. Signal  
Ball No. Signal  
Ball No. Signal  
N09  
N10  
N11  
N12  
N13  
N14  
N15  
N16  
P01  
P02  
P03  
P04  
TDO  
P05  
P06  
P07  
P08  
P09  
P10  
P11  
P12  
P13  
P14  
P15  
P16  
GND  
R01  
R02  
R03  
R04  
R05  
R06  
R07  
R08  
R09  
R10  
R11  
R12  
PPI1D7  
PPI1D6  
PPI1D2  
PPI1D0  
PF4  
R13  
R14  
R15  
R16  
T01  
T02  
T03  
T04  
T05  
T06  
T07  
T08  
TX/PF26  
TSCLK1  
DT1PRI  
RFS0  
T09  
T10  
T11  
T12  
T13  
T14  
T15  
T16  
TCK  
BMODE1  
MOSI  
PF5  
TMS  
PF11  
SLEEP  
GND  
PF15  
VDDEXT  
RX/PF27  
DR1SEC  
DT1SEC  
VDDEXT  
RFS1  
GND  
VDDEXT  
PPI1D4  
VDDEXT  
PF2  
GND  
TRST  
PF8  
DT0SEC  
TSCLK0  
PPI1D8  
GND  
NMI0  
GND  
PF10  
PF14  
NMI1  
TDI  
RSCLK1  
TFS1  
PF6  
VDDEXT  
PF12  
PPI1D5  
PF0  
RSCLK0  
DR0SEC  
EMU  
MISO  
VDDEXT  
Rev. B  
|
Page 52 of 64  
|
June 2007  
ADSP-BF561  
Table 37. 256-Ball CSP_BGA (12 mm ϫ 12 mm) Ball Assignment (Alphabetically by Signal)  
Signal  
ABE0  
Ball No. Signal  
Ball No. Signal  
Ball No. Signal  
Ball No.  
N14  
P02  
P05  
P09  
P12  
R12  
N11  
M05  
M13  
P11  
R09  
P04  
N05  
T04  
M06  
R05  
P06  
T05  
M07  
R06  
N06  
R07  
P07  
T07  
N08  
R08  
P08  
C02  
L01  
J05  
E11  
B13  
A14  
A15  
D13  
G11  
B15  
G10  
B14  
C14  
F11  
D07  
A06  
C06  
B05  
E06  
A05  
E05  
B04  
F06  
B03  
C04  
A03  
F05  
B02  
D04  
A02  
C03  
C08  
B07  
E07  
A07  
C07  
D09  
B08  
A08  
A13  
C12  
M10  
N10  
BR  
B12  
G04  
F01  
B16  
C15  
E12  
C16  
E14  
D15  
D16  
E15  
F13  
F15  
F12  
F16  
F14  
G15  
G13  
G12  
H12  
H15  
H13  
H16  
H14  
J15  
DT0SEC  
DT1PRI  
DT1SEC  
EMU  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
N15  
R15  
T15  
R11  
C05  
C11  
C13  
D05  
D06  
D08  
D14  
E01  
E13  
F08  
F10  
G02  
G06  
G07  
G08  
G14  
H01  
H02  
H08  
H09  
H10  
J07  
GND  
ABE1  
BYPASS  
CLKIN  
GND  
ABE2  
GND  
ABE3  
DATA0  
GND  
ADDR02  
ADDR03  
ADDR04  
ADDR05  
ADDR06  
ADDR07  
ADDR08  
ADDR09  
ADDR10  
ADDR11  
ADDR12  
ADDR13  
ADDR14  
ADDR15  
ADDR16  
ADDR17  
ADDR18  
ADDR19  
ADDR20  
ADDR21  
ADDR22  
ADDR23  
ADDR24  
ADDR25  
AMS0  
DATA1  
GND  
DATA2  
MISO  
MOSI  
NC  
DATA3  
DATA4  
DATA5  
NC  
DATA6  
NMI0  
NMI1  
PF0  
DATA7  
DATA8  
DATA9  
PF1  
DATA10  
DATA11  
DATA12  
DATA13  
DATA14  
DATA15  
DATA16  
DATA17  
DATA18  
DATA19  
DATA20  
DATA21  
DATA22  
DATA23  
DATA24  
DATA25  
DATA26  
DATA27  
DATA28  
DATA29  
DATA30  
DATA31  
DR0PRI  
DR0SEC  
DR1PRI  
DR1SEC  
DT0PRI  
PF2  
PF3  
PF4  
PF5  
PF6  
PF7  
PF8  
PF9  
PF10  
PF11  
PF12  
PF13  
PF14  
PF15  
PPI0CLK  
PPI0D0  
PPI0D1  
PPI0D2  
PPI0D3  
PPI0D4  
PPI0D5  
PPI0D6  
PPI0D7  
PPI0D8  
PPI0D9  
PPI0D10  
PPI0D11  
J13  
J16  
J11  
K14  
K15  
K13  
L15  
K12  
L16  
J12  
J14  
K07  
K09  
K10  
L03  
L07  
L09  
L11  
L14  
M04  
M09  
N07  
N12  
AMS1  
AMS2  
J03  
AMS3  
J04  
AOE  
K02  
H05  
K01  
H04  
K03  
H03  
F04  
E02  
ARDY  
ARE  
M15  
L12  
P16  
M12  
T14  
M16  
AWE  
BG  
BGH  
BMODE0  
BMODE1  
Rev. B  
|
Page 53 of 64  
|
June 2007  
ADSP-BF561  
Table 37. 256-Ball CSP_BGA (12 mm ϫ 12 mm) Ball Assignment (Alphabetically by Signal) (Continued)  
Signal  
Ball No. Signal  
PPI1SYNC1  
Ball No. Signal  
Ball No. Signal  
Ball No.  
M14  
T01  
T03  
T06  
T08  
T12  
T16  
E08  
F07  
F09  
G09  
H06  
H07  
H11  
J08  
PPI0D12  
PPI0D13  
PPI0D14  
PPI0D15  
PPI0SYNC1  
PPI0SYNC2  
PPI0SYNC3  
PPI1CLK  
PPI1D0  
E03  
D01  
G05  
D02  
E04  
C01  
D03  
B01  
R04  
N04  
R03  
N03  
T02  
P03  
R02  
R01  
P01  
M03  
N02  
L06  
N01  
M02  
K05  
M01  
K04  
L02  
L04  
F03  
R16  
N13  
P15  
P13  
T13  
D11  
D10  
M11  
B10  
A11  
A12  
T11  
E09  
B09  
C09  
A10  
C10  
E10  
T09  
R10  
TDO  
N09  
L13  
P14  
T10  
P10  
N16  
R14  
R13  
A01  
A04  
A09  
A16  
B06  
B11  
D12  
E16  
F02  
G03  
G16  
J06  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VROUT0  
VROUT1  
XTAL  
PPI1SYNC2  
PPI1SYNC3  
RESET  
RFS0  
TFS0  
TFS1  
TMS  
TRST  
RFS1  
TSCLK0  
TSCLK1  
TX/PF26  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
RSCLK0  
RSCLK1  
RX  
PPI1D1  
SA10  
PPI1D2  
SCAS  
SCK  
PPI1D3  
PPI1D4  
SCKE  
PPI1D5  
SCLK0  
SCLK1  
SLEEP  
SMS0  
SMS1  
SMS2  
SMS3  
SRAS  
PPI1D6  
PPI1D7  
J09  
PPI1D8  
J10  
PPI1D9  
K08  
K11  
L08  
M08  
J01  
PPI1D10  
PPI1D11  
PPI1D12  
PPI1D13  
PPI1D14  
PPI1D15  
K06  
K16  
L05  
L10  
SWE  
TCK  
J02  
TDI  
G01  
Rev. B  
|
Page 54 of 64  
|
June 2007  
ADSP-BF561  
Figure 48 lists the top view of the 256-Ball CSP_BGA (12 mm ϫ  
12 mm) ball configuration. Figure 49 lists the bottom view.  
A1 BALL  
PAD CORNER  
A
B
C
D
E
F
KEY:  
V
V
GND  
I/O  
NC  
V
DDINT  
DDEXT  
ROUT  
G
H
J
K
L
M
N
P
R
T
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16  
TOP VIEW  
Figure 48. 256-Ball CSP_BGA Ball Configuration (Top View)  
A1 BALL  
PAD CORNER  
A
B
C
D
E
F
KEY:  
V
GND  
I/O  
NC  
V
DDINT  
V
DDEXT  
ROUT  
G
H
J
K
L
M
N
P
R
T
16 15 14 13 12 11 10  
9
8
7
6
5
4
3
2
1
BOTTOM VIEW  
Figure 49. 256-Ball CSP_BGA Ball Configuration (Bottom View)  
Rev. B  
|
Page 55 of 64  
|
June 2007  
ADSP-BF561  
297-BALL PBGA BALL ASSIGNMENT  
Table 38 lists the 297-Ball PBGA ball assignment numerically by  
ball number. Table 39 on Page 58 lists the ball assignment  
alphabetically by signal.  
Table 38. 297-Ball PBGA Ball Assignment (Numerically by Ball Number)  
Ball No. Signal  
Ball No. Signal  
Ball No. Signal  
Ball No. Signal  
A01  
A02  
A03  
A04  
A05  
A06  
A07  
A08  
A09  
A10  
A11  
A12  
A13  
A14  
A15  
A16  
A17  
A18  
A19  
A20  
A21  
A22  
A23  
A24  
A25  
A26  
B01  
B02  
B03  
B04  
B05  
B06  
B07  
B08  
B09  
B10  
B11  
B12  
B13  
B14  
GND  
B15  
B16  
B17  
B18  
B19  
B20  
B21  
B22  
B23  
B24  
B25  
B26  
C01  
C02  
C03  
C04  
C05  
C22  
C23  
C24  
C25  
C26  
D01  
D02  
D03  
D04  
D23  
D24  
D25  
D26  
E01  
E02  
E03  
E24  
E25  
E26  
F01  
F02  
F25  
F26  
SMS1  
G01  
G02  
G25  
G26  
H01  
H02  
H25  
H26  
J01  
J02  
J10  
J11  
J12  
J13  
J14  
J15  
J16  
J17  
J18  
J25  
J26  
K01  
K02  
K10  
K11  
K12  
K13  
K14  
K15  
K16  
K17  
K18  
K25  
K26  
L01  
L02  
L10  
L11  
L12  
L13  
PPI0D11  
PPI0D10  
DATA4  
DATA7  
BYPASS  
RESET  
L14  
GND  
ADDR25  
ADDR23  
ADDR21  
ADDR19  
ADDR17  
ADDR15  
ADDR13  
ADDR11  
ADDR09  
AMS3  
SMS3  
L15  
GND  
SCKE  
L16  
GND  
SWE  
L17  
GND  
SA10  
L18  
VDDINT  
DATA12  
DATA15  
VROUT0  
GND  
BR  
L25  
BG  
DATA6  
DATA9  
CLKIN  
L26  
ABE1  
M01  
M02  
M10  
M11  
M12  
M13  
M14  
M15  
M16  
M17  
M18  
M25  
M26  
N01  
N02  
N10  
N11  
N12  
N13  
N14  
N15  
N16  
N17  
N18  
N25  
N26  
P01  
P02  
P10  
P11  
P12  
P13  
P14  
ABE3  
ADDR07  
GND  
GND  
VDDEXT  
GND  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDINT  
VDDINT  
VDDINT  
DATA8  
DATA11  
XTAL  
AMS1  
ADDR05  
PPI0SYNC3  
PPI0CLK  
GND  
GND  
AWE  
GND  
ARE  
GND  
SMS0  
GND  
SMS2  
GND  
GND  
SRAS  
GND  
GND  
SCAS  
GND  
VDDINT  
DATA14  
DATA17  
VROUT1  
PPI0D9  
VDDEXT  
GND  
SCLK0  
SCLK1  
BGH  
GND  
GND  
ADDR04  
ADDR03  
PPI0SYNC1  
PPI0SYNC2  
GND  
ABE0  
ABE2  
NC  
ADDR08  
ADDR06  
GND  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDINT  
VDDINT  
VDDINT  
DATA10  
DATA13  
NC  
GND  
GND  
GND  
PPI1CLK  
GND  
GND  
GND  
GND  
GND  
ADDR24  
ADDR22  
ADDR20  
ADDR18  
ADDR16  
ADDR14  
ADDR12  
ADDR10  
AMS2  
ADDR02  
DATA1  
PPI0D15  
PPI0D14  
GND  
GND  
GND  
VDDINT  
DATA16  
DATA19  
PPI0D7  
PPI0D8  
VDDEXT  
GND  
GND  
DATA0  
DATA3  
PPI0D13  
PPI0D12  
DATA2  
DATA5  
NC  
VDDEXT  
GND  
AMS0  
GND  
AOE  
GND  
GND  
ARDY  
GND  
GND  
Rev. B  
|
Page 56 of 64  
|
June 2007  
ADSP-BF561  
Table 38. 297-Ball PBGA Ball Assignment (Numerically by Ball Number) (Continued)  
Ball No. Signal Ball No. Signal Ball No. Signal  
Ball No. Signal  
RX  
P15  
P16  
P17  
P18  
P25  
P26  
R01  
R02  
R10  
R11  
R12  
R13  
R14  
R15  
R16  
R17  
R18  
R25  
R26  
T01  
T02  
T10  
T11  
T12  
T13  
T14  
T15  
T16  
T17  
T18  
T25  
T26  
U01  
U02  
U10  
GND  
U11  
VDDEXT  
VDDEXT  
VDDEXT  
GND  
AC04  
AC23  
AC24  
AC25  
AC26  
AD01  
AD02  
AD03  
AD04  
AD05  
AD22  
AD23  
AD24  
AD25  
AD26  
AE01  
AE02  
AE03  
AE04  
AE05  
AE06  
AE07  
AE08  
AE09  
AE10  
AE11  
AE12  
AE13  
AE14  
AE15  
AE16  
AE17  
AE18  
AE19  
AE20  
GND  
AE21  
AE22  
AE23  
AE24  
AE25  
AE26  
AF01  
AF02  
AF03  
AF04  
AF05  
AF06  
AF07  
AF08  
AF09  
AF10  
AF11  
AF12  
AF13  
AF14  
AF15  
AF16  
AF17  
AF18  
AF19  
AF20  
AF21  
AF22  
AF23  
AF24  
AF25  
AF26  
GND  
U12  
GND  
RFS1  
DR1SEC  
TFS1  
GND  
GND  
U13  
GND  
VDDINT  
DATA18  
DATA21  
PPI0D5  
PPI0D6  
VDDEXT  
GND  
U14  
DR0SEC  
RFS0  
PPI1D7  
PPI1D6  
GND  
U15  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
DATA24  
DATA27  
PPI1SYNC3  
PPI0D0  
DATA26  
DATA29  
PPI1SYNC1  
PPI1SYNC2  
DATA28  
DATA31  
PPI1D15  
PPI1D14  
DATA30  
DT0PRI  
PPI1D13  
PPI1D12  
DT0SEC  
TSCLK0  
PPI1D11  
PPI1D10  
GND  
U16  
NC  
U17  
GND  
PPI1D4  
PPI1D2  
PPI1D0  
PF1  
U18  
U25  
GND  
U26  
GND  
GND  
V01  
GND  
GND  
V02  
GND  
PF3  
GND  
V25  
GND  
PF5  
GND  
V26  
NC  
PF7  
GND  
W01  
W02  
W25  
W26  
Y01  
RSCLK0  
PPI1D5  
GND  
PF9  
GND  
PF11  
PF13  
PF15  
NMI1  
TCK  
VDDINT  
DATA20  
DATA23  
PPI0D3  
PPI0D4  
VDDEXT  
GND  
PPI1D3  
PPI1D1  
PF0  
Y02  
Y25  
PF2  
TDI  
Y26  
PF4  
TMS  
AA01  
AA02  
AA25  
AA26  
AB01  
AB02  
AB03  
AB24  
AB25  
AB26  
AC01  
AC02  
AC03  
PF6  
SLEEP  
NMI0  
SCK  
GND  
PF8  
GND  
PF10  
PF12  
PF14  
NC  
GND  
TX  
GND  
RSCLK1  
DR1PRI  
TSCLK1  
DT1SEC  
DT1PRI  
GND  
GND  
GND  
TDO  
VDDINT  
DATA22  
DATA25  
PPI0D1  
PPI0D2  
VDDEXT  
GND  
TRST  
EMU  
TFS0  
DR0PRI  
PPI1D9  
PPI1D8  
GND  
BMODE1  
BMODE0  
MISO  
MOSI  
Rev. B  
|
Page 57 of 64  
|
June 2007  
ADSP-BF561  
Table 39. 297-Ball PBGA Ball Assignment (Alphabetically by Signal)  
Signal  
ABE0  
Ball No.  
A22  
B22  
A23  
B23  
D25  
C26  
C25  
B26  
A25  
B24  
A24  
A10  
B10  
A09  
B09  
A08  
B08  
A07  
B07  
A06  
B06  
A05  
B05  
A04  
B04  
A03  
B03  
A02  
B12  
A12  
B11  
A11  
B13  
B14  
A14  
A13  
B21  
A21  
AE18  
AE17  
Signal  
BR  
Ball No.  
B20  
H01  
J01  
Signal  
DT0SEC  
DT1PRI  
DT1SEC  
EMU  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
Ball No.  
AA25  
AF25  
AF24  
AE16  
A01  
A26  
B02  
Signal  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
Ball No.  
N15  
ABE1  
BYPASS  
CLKIN  
N16  
ABE2  
N17  
ABE3  
DATA0  
E25  
P11  
ADDR02  
ADDR03  
ADDR04  
ADDR05  
ADDR06  
ADDR07  
ADDR08  
ADDR09  
ADDR10  
ADDR11  
ADDR12  
ADDR13  
ADDR14  
ADDR15  
ADDR16  
ADDR17  
ADDR18  
ADDR19  
ADDR20  
ADDR21  
ADDR22  
ADDR23  
ADDR24  
ADDR25  
AMS0  
DATA1  
D26  
F25  
P12  
DATA2  
P13  
DATA3  
E26  
P14  
DATA4  
G25  
F26  
B25  
P15  
DATA5  
C03  
C04  
C05  
C22  
C23  
C24  
D03  
D04  
D23  
D24  
E03  
P16  
DATA6  
H25  
G26  
J25  
P17  
DATA7  
R11  
DATA8  
R12  
DATA9  
H26  
K25  
J26  
R13  
DATA10  
DATA11  
DATA12  
DATA13  
DATA14  
DATA15  
DATA16  
DATA17  
DATA18  
DATA19  
DATA20  
DATA21  
DATA22  
DATA23  
DATA24  
DATA25  
DATA26  
DATA27  
DATA28  
DATA29  
DATA30  
DATA31  
DR0PRI  
DR0SEC  
DR1PRI  
DR1SEC  
DT0PRI  
R14  
R15  
L25  
R16  
K26  
M25  
L26  
R17  
T11  
T12  
N25  
M26  
P25  
N26  
R25  
P26  
T25  
E24  
T13  
J02  
T14  
L11  
T15  
L12  
T16  
L13  
T17  
L14  
U14  
L15  
AB03  
AB24  
AC03  
AC04  
AC23  
AC24  
AD03  
AD04  
AD05  
AD22  
AD23  
AD24  
AE02  
AE25  
AF01  
R26  
U25  
T26  
L16  
L17  
M02  
M11  
M12  
M13  
M14  
M15  
M16  
M17  
N11  
N12  
N13  
N14  
AMS1  
V25  
U26  
W25  
V26  
Y25  
W26  
AB26  
AC25  
AF22  
AE23  
Y26  
AMS2  
AMS3  
AOE  
ARDY  
ARE  
AWE  
BG  
BGH  
BMODE0  
BMODE1  
Rev. B  
|
Page 58 of 64  
|
June 2007  
ADSP-BF561  
Table 39. 297-Ball PBGA Ball Assignment (Alphabetically by Signal) (Continued)  
Signal  
GND  
MISO  
MOSI  
NC  
Ball No.  
AF26  
AE19  
AE20  
K02  
Signal  
Ball No.  
P01  
Signal  
RSCLK0  
RSCLK1  
RX  
Ball No.  
AD26  
AF21  
AE21  
B19  
Signal  
Ball No.  
K13  
K14  
K15  
L10  
PPI0D7  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VROUT0  
VROUT1  
XTAL  
PPI0D8  
P02  
PPI0D9  
N02  
PPI0D10  
PPI0D11  
PPI0D12  
PPI0D13  
PPI0D14  
PPI0D15  
PPI0SYNC1  
PPI0SYNC2  
PPI0SYNC3  
PPI1CLK  
PPI1D0  
G02  
SA10  
NC  
L01  
G01  
SCAS  
A18  
M10  
N10  
P10  
R10  
T10  
U10  
U11  
U12  
U13  
J16  
NC  
L02  
F02  
SCK  
AF19  
B17  
NC  
AD25  
AE13  
AE26  
AF18  
AF13  
AE05  
AF05  
AE06  
AF06  
AE07  
AF07  
AE08  
AF08  
AE09  
AF09  
AE10  
AF10  
AE11  
AF11  
AE12  
AF12  
C02  
F01  
SCKE  
NC  
E02  
SCLK0  
SCLK1  
SLEEP  
SMS0  
A19  
NC  
E01  
A20  
NMI0  
NMI1  
PF0  
D01  
AF17  
A15  
D02  
C01  
SMS1  
B15  
PF1  
B01  
SMS2  
A16  
PF2  
AF04  
AE04  
AF03  
AE03  
AF02  
AE01  
AD02  
AD01  
AC02  
AC01  
AB02  
AB01  
AA02  
AA01  
Y02  
SMS3  
B16  
PF3  
PPI1D1  
SRAS  
A17  
J17  
PF4  
PPI1D2  
SWE  
B18  
J18  
PF5  
PPI1D3  
TCK  
AF14  
AF15  
AE14  
AB25  
AE24  
AF16  
AE15  
AA26  
AF23  
AF20  
J10  
K16  
K17  
K18  
L18  
PF6  
PPI1D4  
TDI  
PF7  
PPI1D5  
TDO  
PF8  
PPI1D6  
TFS0  
PF9  
PPI1D7  
TFS1  
M18  
N18  
P18  
R18  
T18  
U15  
U16  
U17  
U18  
M01  
N01  
K01  
PF10  
PF11  
PF12  
PF13  
PF14  
PF15  
PPI0CLK  
PPI0D0  
PPI0D1  
PPI0D2  
PPI0D3  
PPI0D4  
PPI0D5  
PPI0D6  
PPI1D8  
TMS  
PPI1D9  
TRST  
PPI1D10  
PPI1D11  
PPI1D12  
PPI1D13  
PPI1D14  
PPI1D15  
PPI1SYNC1  
PPI1SYNC2  
PPI1SYNC3  
RESET  
TSCLK0  
TSCLK1  
TX/PF26  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
J11  
V02  
Y01  
J12  
U01  
W01  
W02  
V01  
J13  
U02  
J14  
T01  
J15  
T02  
H02  
K10  
R01  
RFS0  
AC26  
AE22  
K11  
R02  
RFS1  
K12  
Rev. B  
|
Page 59 of 64  
|
June 2007  
ADSP-BF561  
Figure 50 lists the top view of the 297-Ball PBGA ball configura-  
tion. Figure 51 lists the bottom view.  
A
B
C
D
E
F
G
KEY:  
H
V
V
GND  
I/O  
NC  
V
J
DDINT  
K
DDEXT  
ROUT  
L
M
N
P
R
T
U
V
W
Y
AA  
AB  
AC  
AD  
AE  
AF  
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26  
TOP VIEW  
Figure 50. 297-Ball PBGA Ball Configuration (Top View)  
A
B
C
D
E
F
KEY:  
G
H
V
GND  
I/O  
NC  
V
DDINT  
J
V
DDEXT  
ROUT  
K
L
M
N
P
R
T
U
V
W
Y
AA  
AB  
AC  
AD  
AE  
AF  
26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10  
9 8 7 6 5 4 3 2 1  
BOTTOM VIEW  
Figure 51. 297-Ball PBGA Ball Configuration (Bottom View)  
Rev. B  
|
Page 60 of 64  
|
June 2007  
ADSP-BF561  
OUTLINE DIMENSIONS  
Dimensions in the outline dimension figures are shown in  
millimeters.  
256-BALL CSP_BGA (BC-256-4)  
17.00 BSC SQ  
15.00 BSC SQ  
A1 BALL  
PAD CORNER  
1.00 BSC  
BALL PITCH  
CL  
A1 BALL  
PAD CORNER  
A
B
C
D
E
F
G
H
J
CL  
K
L
M
N
P
R
T
16 15 14 13 12 11 10  
9
8
7
6
5
4
3
2
1
TOP VIEW  
BOTTOM VIEW  
1.90  
1.76  
1.61  
0.45 MIN  
DETAIL A  
SIDE VIEW  
0.20 MAX  
COPLANARITY  
NOTES  
1. DIMENSIONS ARE IN MILLIMETERS.  
2. COMPLIES WITH JEDEC REGISTERED OUTLINE  
MO-192-AAF-1, WITH EXCEPTION TO PACKAGE HEIGHT.  
3. MINIMUM BALL HEIGHT 0.45  
SEATING PLANE  
0.70  
0.60  
0.50  
DETAIL A  
BALL DIAMETER  
Figure 52. 256-Ball Chip Scale Package Ball Grid Array (CSP_BGA) (BC-256-4)  
Rev. B  
|
Page 61 of 64  
|
June 2007  
ADSP-BF561  
12.00 BSC SQ  
9.75 BSC SQ  
CL  
A1 BALL  
PAD CORNER  
0.65 BSC  
BALL PITCH  
A1 BALL  
PAD CORNER  
A
B
C
D
E
F
G
H
J
CL  
K
L
M
N
P
R
T
16 15 14 13 12 11 10  
9
8
7
6
5
4
3
2
1
TOP VIEW  
BOTTOM VIEW  
1.70  
1.51  
1.36  
0.25 MIN  
DETAIL A  
SIDE VIEW  
0.10 MAX  
COPLANARITY  
NOTES  
1. DIMENSIONS ARE IN MILLIMETERS.  
2. COMPLIES WITH JEDEC REGISTERED OUTLINE  
MO-225, WITH NO EXACT PACKAGE SIZE AND  
EXCEPTION TO PACKAGE HEIGHT.  
SEATING PLANE  
0.45  
DETAIL A  
BALL DIAMETER  
0.40  
0.35  
3. MINIMUM BALL HEIGHT 0.25  
Figure 53. 256-Ball Chip Scale Package Ball Grid Array (CSP_BGA) (BC-256-1)  
Rev. B  
|
Page 62 of 64  
|
June 2007  
ADSP-BF561  
27.00 BSC SQ  
25.00 BSC SQ  
A1 BALL  
PAD CORNER  
8.00  
CL  
1.00 BSC  
BALL PITCH  
A1 BALL  
PAD CORNER  
A
B
C
D
E
F
G
H
J
K
L
M
N
P
8.00  
CL  
R
T
U
V
W
Y
AA  
AB  
AC  
AD  
AE  
AF  
26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10  
9 8 7 6 5 4 3 2 1  
TOP VIEW  
BOTTOM VIEW  
2.43  
2.23  
2.03  
0.40 MIN  
DETAIL A  
SIDE VIEW  
0.20 MAX  
COPLANARITY  
NOTES  
1. DIMENSIONS ARE IN MILLIMETERS.  
2. COMPLIES WITH JEDEC REGISTERED OUTLINE  
MS-034, VARIATION AAL-1.  
3. MINIMUM BALL HEIGHT 0.40  
SEATING PLANE  
0.70  
0.60  
0.50  
DETAIL A  
BALL DIAMETER  
Figure 54. 297-Ball Plastic Ball Grid Array (PBGA) (B-297)  
SURFACE MOUNT DESIGN  
Table 40 is provided as an aid to PCB design. For industry-  
standard design recommendations, refer to IPC-7351, Generic  
Requirements for Surface Mount Design and Land Pattern  
Standard.  
Table 40. BGA Data for Use with Surface Mount Design  
Package  
Ball Attach Type  
Solder Mask Opening  
0.30 mm diameter  
0.43 mm diameter  
0.43 mm diameter  
Ball Pad Size  
256-Ball CSP_BGA (BC-256-1)  
256-Ball CSP_BGA (BC-256-4)  
297-Ball PBGA (B-297)  
Solder Mask Defined  
Solder Mask Defined  
Solder Mask Defined  
0.43 mm diameter  
0.55 mm diameter  
0.58 mm diameter  
Rev. B  
|
Page 63 of 64  
|
June 2007  
ADSP-BF561  
ORDERING GUIDE  
Temperature Speed Grade Operating Voltage  
Package  
Option  
Model  
Range1  
Rate (Max) (Nom)  
Package Description  
ADSP-BF561SKBCZ6002  
0°C to +70°C 600 MHz  
1.25 V Internal, 2.5 V or 3.3 V I/O 256-Ball Chip Scale Package Ball Grid BC-256-1  
Array (CSP_BGA)  
ADSP-BF561SKBCZ5002  
0°C to +70°C 500 MHz  
1.25 V Internal, 2.5 V or 3.3 V I/O 256-Ball Chip Scale Package Ball Grid BC-256-1  
Array (CSP_BGA)  
ADSP-BF561SKB500  
ADSP-BF561SKB600  
ADSP-BF561SKBZ5002  
ADSP-BF561SKBZ6002  
ADSP-BF561SBB600  
ADSP-BF561SBB500  
ADSP-BF561SBBZ6002  
ADSP-BF561SBBZ5002  
ADSP-BF561WBBZ-5A2, 3  
ADSP-BF561SKBCZ-6A2  
0°C to +70°C 500 MHz  
0 C to +70°C 600 MHz  
0°C to +70°C 500 MHz  
0°C to +70°C 600 MHz  
–40°C to +85°C 600 MHz  
–40°C to +85°C 500 MHz  
–40°C to +85°C 600 MHz  
–40°C to +85°C 500 MHz  
–40°C to +85°C 533 MHz  
0°C to +70°C 600 MHz  
1.25 V Internal, 2.5 V or 3.3 V I/O 297-Ball Plastic Ball Grid Array (PBGA) B-297  
1.35 V Internal, 2.5 V or 3.3 V I/O 297-Ball Plastic Ball Grid Array (PBGA) B-297  
1.25 V Internal, 2.5 V or 3.3 V I/O 297-Ball Plastic Ball Grid Array (PBGA) B-297  
1.35 V Internal, 2.5 V or 3.3 V I/O 297-Ball Plastic Ball Grid Array (PBGA) B-297  
1.35 V Internal, 2.5 V or 3.3 V I/O 297-Ball Plastic Ball Grid Array (PBGA) B-297  
1.25 V Internal, 2.5 V or 3.3 V I/O 297-Ball Plastic Ball Grid Array (PBGA) B-297  
1.35 V Internal, 2.5 V or 3.3 V I/O 297-Ball Plastic Ball Grid Array (PBGA) B-297  
1.25 V Internal, 2.5 V or 3.3 V I/O 297-Ball Plastic Ball Grid Array (PBGA) B-297  
1.25 V Internal, 2.5 V or 3.3 V I/O 297-Ball Plastic Ball Grid Array (PBGA) B-297  
1.35 V Internal, 2.5 V or 3.3 V I/O 256-Ball Chip Scale Package Ball Grid BC-256-4  
Array (CSP_BGA)  
ADSP-BF561SKBCZ-5A2  
ADSP-BF561SBBCZ-6A2  
ADSP-BF561SBBCZ-5A2  
0°C to +70°C 500 MHz  
–40°C to +85°C 600 MHz  
–40°C to +85°C 500 MHz  
1.25 V Internal, 2.5 V or 3.3 V I/O 256-Ball Chip Scale Package Ball Grid BC-256-4  
Array (CSP_BGA)  
1.35 V Internal, 2.5 V or 3.3 V I/O 256-Ball Chip Scale Package Ball Grid BC-256-4  
Array (CSP_BGA)  
1.25 V Internal, 2.5 V or 3.3 V I/O 256-Ball Chip Scale Package Ball Grid BC-256-4  
Array (CSP_BGA)  
ADSP-BF561WBBCZ-5A2, 3 –40°C to +85°C 533 MHz  
1.25 V Internal, 2.5 V or 3.3 V I/O 256-Ball Chip Scale Package Ball Grid BC-256-4  
Array (CSP_BGA)  
1 Referenced temperature is ambient temperature.  
2 Z = RoHS compliant part.  
3 W indicates automotive grade part. The internal voltage regulation feature is not available on automotive parts.  
©2007 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
D04696-0-6/07(B)  
Rev. B  
|
Page 64 of 64  
|
June 2007  

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