ADSP-BF606 [ADI]

Blackfin Dual Core; Blackfin处理器双核
ADSP-BF606
型号: ADSP-BF606
厂家: ADI    ADI
描述:

Blackfin Dual Core
Blackfin处理器双核

文件: 总44页 (文件大小:1365K)
中文:  中文翻译
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Blackfin Dual Core  
Embedded Processor  
ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609  
Preliminary Technical Data  
FEATURES  
MEMORY  
Dual-core symmetric high-performance Blackfin processor,  
up to 500 MHz per core  
Each core contains two 16-bit MACs, two 40-bit ALUs, and a  
40-bit barrel shifter  
RISC-like register and instruction model for ease of  
programming and compiler-friendly support  
Advanced debug, trace, and performance monitoring  
Pipelined Vision Processor provides hardware to process sig-  
nal and image algorithms used for pre- and co-processing  
of video frames in ADAS or other video processing  
applications  
Each core contains 148K bytes of L1 SRAM memory (proces-  
sor core-accessible) with multi-parity bit protection  
Up to 256K bytes of L2 SRAM memory with ECC protection  
Dynamic memory controller provides 16-bit interface to a  
single bank of DDR2 or LPDDR DRAM devices  
Static memory controller with asynchronous memory inter-  
face that supports 8-bit and 16-bit memories  
Flexible booting options from flash, eMMC and SPI memories  
and from SPI, link port and UART hosts  
Memory management unit provides memory protection  
Accepts a range of supply voltages for I/O operation. See  
Operating Conditions on Page 31  
Off-chip voltage regulator interface  
349-ball (19 mm × 19 mm) RoHS compliant BGA package  
SYSTEM CONTROL BLOCKS  
PERIPHERALS  
2× TWI  
EMULATOR  
TEST & CONTROL  
PLL & POWER  
MANAGEMENT  
FAULT  
MANAGEMENT  
EVENT  
DUAL  
CONTROL  
WATCHDOG  
8× TIMER  
1× COUNTER  
2× PWM  
L2 MEMORY  
CORE 0  
CORE 1  
32K BYTE  
ROM  
3× SPORT  
1× ACM  
B
B
256K BYTE  
148K BYTE  
PARITY BIT PROTECTED  
L1 SRAM  
148K BYTE  
PARITY BIT PROTECTED  
L1 SRAM  
ECC-  
PROTECTED  
SRAM  
INSTRUCTION/DATA  
INSTRUCTION/DATA  
2× UART  
112  
GP  
I/O  
EMMC/RSI  
1× CAN  
DMA SYSTEM  
2× EMAC  
WITH  
2× IEEE 1588  
EXTERNAL  
BUS  
INTERFACES  
2× SPI  
4× LINK PORT  
3× PPI  
PIPELINED  
VISION PROCESSOR  
CRC  
STATIC  
MEMORY  
CONTROLLER  
DYNAMIC  
MEMORY  
CONTROLLER  
VIDEO  
SUBSYSTEM  
HARDWARE  
FUNCTIONS  
PIXEL  
COMPOSITOR  
LPDDR  
DDR2  
16  
USB 2.0 HS OTG  
16  
FLASH  
SRAM  
Figure 1. Processor Block Diagram  
Blackfin and the Blackfin logo are registered trademarks of Analog Devices, Inc.  
Rev. PrD  
Information furnished by Analog Devices is believed to be accurate and reliable.  
However, no responsibility is assumed by Analog Devices for its use, nor for any  
infringements of patents or other rights of third parties that may result from its use.  
Specifications subject to change without notice. No license is granted by implication  
or otherwise under any patent or patent rights of Analog Devices. Trademarks and  
registered trademarks are the property of their respective owners.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 U.S.A.  
Tel: 781.329.4700  
Fax: 781.461.3113  
www.analog.com  
© 2012 Analog Devices, Inc. All rights reserved.  
ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609 Preliminary Technical Data  
TABLE OF CONTENTS  
Features ................................................................. 1  
Memory ................................................................ 1  
General Description ................................................. 3  
Blackfin Processor Core .......................................... 3  
Instruction Set Description ..................................... 4  
Processor Infrastructure ......................................... 5  
Memory Architecture ............................................ 6  
Video Subsystem .................................................. 9  
Processor Safety Features ...................................... 10  
Additional Processor Peripherals ............................ 11  
Power and Clock Management ............................... 14  
System Debug .................................................... 17  
EZ-KIT Lite® Evaluation Board .............................. 17  
Related Signal Chains ........................................... 18  
Signal Descriptions ................................................. 19  
Pin Multiplexing ................................................. 20  
Pin Termination and Drive Characteristics-Requirements 24  
Specifications ........................................................ 31  
Operating Conditions ........................................... 31  
Electrical Characteristics ....................................... 33  
Processor — Absolute Maximum Ratings .................. 34  
ESD Sensitivity ................................................... 34  
Processor — Package Information ........................... 34  
Environmental Conditions .................................... 35  
349-Ball CSP_BGA Ball Assignments .......................... 36  
Outline Dimensions ................................................ 42  
Surface-Mount Design .......................................... 42  
Automotive Products .............................................. 43  
Pre Release Products ............................................... 43  
Designing an Emulator-Compatible  
Processor Board (Target) ................................... 17  
Related Documents ............................................. 18  
REVISION HISTORY  
3/12—Revision PrD: Initial public version  
Rev. PrD  
| Page 2 of 44 | March 2012  
Preliminary Technical Data ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609  
GENERAL DESCRIPTION  
The ADSP-BF609 processor is a member of the Blackfin  
family of products, incorporating the Analog Devices/Intel  
Micro Signal Architecture (MSA). Blackfin processors combine  
a dual-MAC state-of-the-art signal processing engine, the  
advantages of a clean, orthogonal RISC-like microprocessor  
instruction set, and single-instruction, multiple-data (SIMD)  
multimedia capabilities into a single instruction-set  
architecture.  
The processor offers performance up to 500 MHz, as well as low  
static power consumption. Produced with a low-power and low-  
voltage design methodology, they provide world-class power  
management and performance.  
Table 1. Processor Comparison (Continued)  
Processor Feature  
L1 Instruction SRAM  
L1 Instruction SRAM/Cache  
L1 Data SRAM  
64K  
16K  
32K  
32K  
4K  
L1 Data SRAM/Cache  
L1 Scratchpad  
By integrating a rich set of industry-leading system peripherals  
and memory (shown in Table 1), Blackfin processors are the  
platform of choice for next-generation applications that require  
RISC-like programmability, multimedia support, and leading-  
edge signal processing in one integrated package. These applica-  
tions span a wide array of markets, from automotive systems to  
embedded industrial, instrumentation and power/motor con-  
trol applications.  
L2 Data SRAM  
128K  
256K  
L2 Boot ROM  
32K  
Maximum Speed Grade (MHz)2 400  
Maximum SYSCLK (MHz)  
500  
250  
Package Options  
349-Ball CSP_BGA  
1 VGA is 640 x 480 pixels per frame, 30 frames per second. HD is 1280 x 960 pixels  
per frame, 30 frames per second.  
Table 1. Processor Comparison  
2 Maximum speed grade is not available with every possible SYSCLK selection.  
Processor Feature  
BLACKFIN PROCESSOR CORE  
As shown in Figure 1, the processor integrates two Blackfin pro-  
cessor cores. Each core, shown in Figure 2, contains two 16-bit  
multipliers, two 40-bit accumulators, two 40-bit ALUs, four  
video ALUs, and a 40-bit shifter. The computation units process  
8-, 16-, or 32-bit data from the register file.  
The compute register file contains eight 32-bit registers. When  
performing compute operations on 16-bit operand data, the  
register file operates as 16 independent 16-bit registers. All  
operands for compute operations come from the multiported  
register file and instruction constant fields.  
Up/Down/Rotary Counters  
Timer/Counters with PWM  
3-Phase PWM Units (4-pair)  
SPORTs  
1
8
2
3
2
1
3
1
1
2
2
1
4
2
SPIs  
USB OTG  
Parallel Peripheral Interface  
Removable Storage Interface  
CAN  
Each MAC can perform a 16-bit by 16-bit multiply in each  
cycle, accumulating the results into the 40-bit accumulators.  
Signed and unsigned formats, rounding, and saturation  
are supported.  
TWI  
UART  
The ALUs perform a traditional set of arithmetic and logical  
operations on 16-bit or 32-bit data. In addition, many special  
instructions are included to accelerate various signal processing  
tasks. These include bit operations such as field extract and pop-  
ulation count, modulo 232 multiply, divide primitives, saturation  
and rounding, and sign/exponent detection. The set of video  
instructions include byte alignment and packing operations,  
16-bit and 8-bit adds with clipping, 8-bit average operations,  
and 8-bit subtract/absolute value/accumulate (SAA) operations.  
Also provided are the compare/select and vector search  
instructions.  
ADC Control Module (ACM)  
Link Ports  
Ethernet MAC (IEEE 1588)  
Pixel Compositor (PIXC)  
No  
No  
1
1
Pipelined Vision Processor  
(PVP)1  
VGA  
HD  
GPIOs  
112  
For certain instructions, two 16-bit ALU operations can be per-  
formed simultaneously on register pairs (a 16-bit high half and  
16-bit low half of a compute register). If the second ALU is used,  
quad 16-bit operations are possible.  
Rev. PrD  
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ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609 Preliminary Technical Data  
ADDRESS ARITHMETIC UNIT  
SP  
I3  
I2  
I1  
I0  
L3  
L2  
L1  
L0  
B3  
B2  
B1  
B0  
M3  
M2  
M1  
M0  
FP  
P5  
P4  
P3  
P2  
P1  
P0  
DAG1  
DAG0  
DA1  
DA0  
32  
32  
32  
PREG  
32  
RAB  
SD  
LD1  
LD0  
32  
32  
32  
ASTAT  
32  
32  
SEQUENCER  
ALIGN  
R7.H  
R7.L  
R6.H  
R5.H  
R4.H  
R3.H  
R2.H  
R1.H  
R0.H  
R6.L  
R5.L  
R4.L  
R3.L  
R2.L  
R1.L  
R0.L  
16  
16  
8
8
8
8
DECODE  
BARREL  
SHIFTER  
LOOP BUFFER  
40  
40  
40 40  
A0  
A1  
CONTROL  
UNIT  
32  
32  
DATA ARITHMETIC UNIT  
Figure 2. Blackfin Processor Core  
The 40-bit shifter can perform shifts and rotates and is used to  
support normalization, field extract, and field deposit  
instructions.  
In addition, multiple L1 memory blocks are provided, offering a  
configurable mix of SRAM and cache. The memory manage-  
ment unit (MMU) provides memory protection for individual  
tasks that may be operating on the core and can protect system  
registers from unintended access.  
The architecture provides three modes of operation: user mode,  
supervisor mode, and emulation mode. User mode has  
restricted access to certain system resources, thus providing a  
protected software environment, while supervisor mode has  
unrestricted access to the system and core resources.  
The program sequencer controls the flow of instruction execu-  
tion, including instruction alignment and decoding. For  
program flow control, the sequencer supports PC relative and  
indirect conditional jumps (with static branch prediction), and  
subroutine calls. Hardware supports zero-overhead looping.  
The architecture is fully interlocked, meaning that the program-  
mer need not manage the pipeline when executing instructions  
with data dependencies.  
The address arithmetic unit provides two addresses for simulta-  
neous dual fetches from memory. It contains a multiported  
register file consisting of four sets of 32-bit index, modify,  
length, and base registers (for circular buffering), and eight  
additional 32-bit pointer registers (for C-style indexed stack  
manipulation).  
Blackfin processors support a modified Harvard architecture in  
combination with a hierarchical memory structure. Level 1 (L1)  
memories are those that typically operate at the full processor  
speed with little or no latency. At the L1 level, the instruction  
memory holds instructions only. The data memory holds data,  
and a dedicated scratchpad data memory stores stack and local  
variable information.  
INSTRUCTION SET DESCRIPTION  
The Blackfin processor instruction set has been optimized so  
that 16-bit opcodes represent the most frequently used instruc-  
tions, resulting in excellent compiled code density. Complex  
DSP instructions are encoded into 32-bit opcodes, representing  
fully featured multifunction instructions. Blackfin processors  
support a limited multi-issue capability, where a 32-bit instruc-  
tion can be issued in parallel with two 16-bit instructions,  
allowing the programmer to use many of the core resources in a  
single instruction cycle.  
The Blackfin processor family assembly language instruction set  
employs an algebraic syntax designed for ease of coding and  
readability. The instructions have been specifically tuned to pro-  
vide a flexible, densely encoded instruction set that compiles to  
Rev. PrD  
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Preliminary Technical Data ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609  
a very small final memory size. The instruction set also provides  
fully featured multifunction instructions that allow the pro-  
grammer to use many of the processor core resources in a single  
instruction. Coupled with many features more often seen on  
microcontrollers, this instruction set is very efficient when com-  
piling C and C++ source code. In addition, the architecture  
supports both user (algorithm/application code) and supervisor  
(O/S kernel, device drivers, debuggers, ISRs) modes of opera-  
tion, allowing multiple levels of access to core  
sequence. Descriptor-based DMA transfers allow multiple  
DMA sequences to be chained together and a DMA channel can  
be programmed to automatically set up and start another DMA  
transfer after the current sequence completes.  
The DMA controller supports the following DMA operations.  
• A single linear buffer that stops on completion.  
• A linear buffer with negative, positive or zero stride length.  
• A circular, auto-refreshing buffer that interrupts when each  
buffer becomes full.  
• A similar buffer that interrupts on fractional buffers (for  
example, 1/2, 1/4).  
• 1D DMA – uses a set of identical ping-pong buffers defined  
by a linked ring of two-word descriptor sets, each contain-  
ing a link pointer and an address.  
• 1D DMA – uses a linked list of 4 word descriptor sets con-  
taining a link pointer, an address, a length, and a  
configuration.  
• 2D DMA – uses an array of one-word descriptor sets, spec-  
ifying only the base DMA address.  
processor resources.  
The assembly language, which takes advantage of the proces-  
sor’s unique architecture, offers the following advantages:  
• Seamlessly integrated DSP/MCU features are optimized for  
both 8-bit and 16-bit operations.  
• A multi-issue load/store modified-Harvard architecture,  
which supports two 16-bit MAC or four 8-bit ALU + two  
load/store + two pointer updates per cycle.  
• All registers, I/O, and memory are mapped into a unified  
4G byte memory space, providing a simplified program-  
ming model.  
• Control of all asynchronous and synchronous events to the  
processor is handled by two subsystems: the Core Event  
Controller (CEC) and the System Event Controller (SEC).  
• 2D DMA – uses a linked list of multi-word descriptor sets,  
specifying everything.  
CRC Protection  
• Microcontroller features, such as arbitrary bit and bit-field  
manipulation, insertion, and extraction; integer operations  
on 8-, 16-, and 32-bit data-types; and separate user and  
supervisor stack pointers.  
• Code density enhancements, which include intermixing of  
16-bit and 32-bit instructions (no mode switching, no code  
segregation). Frequently used instructions are encoded  
in 16 bits.  
The two CRC protection modules allow system software to peri-  
odically calculate the signature of code and/or data in memory,  
the content of memory-mapped registers, or communication  
message objects. Dedicated hardware circuitry compares the  
signature with pre calculated values and triggers appropriate  
fault events.  
For example, every 100 ms the system software might initiate  
the signature calculation of the entire memory contents and  
compare these contents with expected, pre calculated values. If a  
mismatch occurs, a fault condition can be generated (via the  
processor core or the trigger routing unit).  
PROCESSOR INFRASTRUCTURE  
The following sections provide information on the primary  
infrastructure components of the ADSP-BF609 processor.  
The CRC is a hardware module based on a CRC32 engine that  
computes the CRC value of the 32-bit data words presented to  
it. Data is provided by the source channel of the memory-to-  
memory DMA (in memory scan mode) and is optionally for-  
warded to the destination channel (memory transfer mode).  
The main features of the CRC peripheral are:  
• Memory scan mode  
• Memory transfer mode  
DMA Controllers  
The processor uses Direct Memory Access (DMA) to transfer  
data within memory spaces or between a memory space and a  
peripheral. The processor can specify data transfer operations  
and return to normal processing while the fully integrated DMA  
controller carries out the data transfers independent of proces-  
sor activity.  
DMA transfers can occur between memory and a peripheral or  
between one memory and another memory. Two channels are  
used for Memory-to-Memory DMA where one channel is the  
source channel, and the second is the destination channel.  
All DMAs can transport data to and from all on-chip and off-  
chip memories. Programs can use two types of DMA transfers,  
descriptor-based or register-based. Register-based DMA allows  
the processor to directly program DMA control registers to ini-  
tiate a DMA transfer. On completion, the control registers may  
be automatically updated with their original setup values for  
continuous transfer. Descriptor-based DMA transfers require a  
set of parameters stored within memory to initiate a DMA  
• Data verify mode  
• Data fill mode  
• User-programmable CRC32 polynomial  
• Bit/byte mirroring option (endianness)  
• Fault/error interrupt mechanisms  
• 1D and 2D fill block to initialize array with constants.  
• 32-bit CRC signature of a block of a memory or MMR  
block.  
Rev. PrD  
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ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609 Preliminary Technical Data  
operation. Six system-level interrupt channels (PINT0–5) are  
reserved for this purpose. Each of these interrupt channels can  
manage up to 32 interrupt pins. The assignment from pin to  
interrupt is not performed on a pin-by-pin basis. Rather, groups  
of eight pins (half ports) can be flexibly assigned to interrupt  
channels.  
Every pin interrupt channel features a special set of 32-bit mem-  
ory-mapped registers that enable half-port assignment and  
interrupt management. This includes masking, identification,  
and clearing of requests. These registers also enable access to the  
respective pin states and use of the interrupt latches, regardless  
of whether the interrupt is masked or not. Most control registers  
feature multiple MMR address entries to write-one-to-set or  
write-one-to-clear them individually.  
Event Handling  
The processor provides event handling that supports both nest-  
ing and prioritization. Nesting allows multiple event service  
routines to be active simultaneously. Prioritization ensures that  
servicing of a higher-priority event takes precedence over ser-  
vicing of a lower-priority event. The processor provides support  
for five different types of events:  
• Emulation – An emulation event causes the processor to  
enter emulation mode, allowing command and control of  
the processor via the JTAG interface.  
• Reset – This event resets the processor.  
• Nonmaskable Interrupt (NMI) – The NMI event can be  
generated either by the software watchdog timer, by the  
NMI input signal to the processor, or by software. The  
NMI event is frequently used as a power-down indicator to  
initiate an orderly shutdown of the system.  
• Exceptions – Events that occur synchronously to program  
flow (in other words, the exception is taken before the  
instruction is allowed to complete). Conditions such as  
data alignment violations and undefined instructions cause  
exceptions.  
General-Purpose I/O (GPIO)  
Each general-purpose port pin can be individually controlled by  
manipulation of the port control, status, and interrupt registers:  
• GPIO direction control register – Specifies the direction of  
each individual GPIO pin as input or output.  
• GPIO control and status registers – A “write one to mod-  
ify” mechanism allows any combination of individual  
GPIO pins to be modified in a single instruction, without  
affecting the level of any other GPIO pins.  
• GPIO interrupt mask registers – Allow each individual  
GPIO pin to function as an interrupt to the processor.  
GPIO pins defined as inputs can be configured to generate  
hardware interrupts, while output pins can be triggered by  
software interrupts.  
• Interrupts – Events that occur asynchronously to program  
flow. They are caused by input signals, timers, and other  
peripherals, as well as by an explicit software instruction.  
Core Event Controller (CEC)  
The CEC supports nine general-purpose interrupts (IVG15–7),  
in addition to the dedicated interrupt and exception events. Of  
these general-purpose interrupts, the two lowest-priority  
interrupts (IVG15–14) are recommended to be reserved for  
software interrupt handlers. For more information, see the  
ADSP-BF60x Processor Programmer’s Reference.  
• GPIO interrupt sensitivity registers – Specify whether indi-  
vidual pins are level- or edge-sensitive and specify—if  
edge-sensitive—whether just the rising edge or both the ris-  
ing and falling edges of the signal are significant.  
System Event Controller (SEC)  
Pin Multiplexing  
The SEC manages the enabling, prioritization, and routing of  
events from each system interrupt or fault source. Additionally,  
it provides notification and identification of the highest priority  
active system interrupt request to each core and routes system  
fault sources to its integrated fault management unit.  
The processor supports a flexible multiplexing scheme that mul-  
tiplexes the GPIO pins with various peripherals. A maximum of  
4 peripherals plus GPIO functionality is shared by each GPIO  
pin. All GPIO pins have a bypass path feature – that is, when the  
output enable and the input enable of a GPIO pin are both  
active, the data signal before the pad driver is looped back to the  
receive path for the same GPIO pin. For more information, see  
Pin Multiplexing on Page 20.  
Trigger Routing Unit (TRU)  
The TRU provides system-level sequence control without core  
intervention. The TRU maps trigger masters (generators of trig-  
gers) to trigger slaves (receivers of triggers). Slave endpoints can  
be configured to respond to triggers in various ways. Common  
applications enabled by the TRU include:  
• Automatically triggering the start of a DMA sequence after  
a sequence from another DMA channel completes  
MEMORY ARCHITECTURE  
The ADSP-BF609 processor views memory as a single unified  
4G byte address space, using 32-bit addresses. All resources,  
including internal memory, external memory, and I/O control  
registers, occupy separate sections of this common address  
space. The memory portions of this address space are arranged  
in a hierarchical structure to provide a good cost/performance  
balance of some very fast, low-latency core-accessible memory  
as cache or SRAM, and larger, lower-cost and performance  
interface-accessible memory systems. See Figure 3 and Figure 4.  
• Software triggering  
• Synchronization of concurrent activities  
Pin Interrupts  
Every port pin on the processor can request interrupts in either  
an edge-sensitive or a level-sensitive manner with programma-  
ble polarity. Interrupt functionality is decoupled from GPIO  
Rev. PrD  
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Preliminary Technical Data ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609  
Figure 3. ADSP-BF606 Internal/External Memory Map  
Rev. PrD  
| Page 7 of 44 | March 2012  
ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609 Preliminary Technical Data  
Figure 4. ADSP-BF607/ADSP-BF608/ADSP-BF609 Internal/External Memory Map  
Rev. PrD  
| Page 8 of 44 | March 2012  
Preliminary Technical Data ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609  
Internal (Core-Accessible) Memory  
Booting  
The L1 memory system is the highest-performance memory  
available to the Blackfin processor cores.  
The processor has several mechanisms for automatically loading  
internal and external memory after a reset. The boot mode is  
defined by the SYS_BMODE input pins dedicated for this pur-  
pose. There are two categories of boot modes. In master boot  
modes, the processor actively loads data from parallel or serial  
memories. In slave boot modes, the processor receives data  
from external host devices.  
The boot modes are shown in Table 2. These modes are imple-  
mented by the SYS_BMODE bits of the reset configuration  
register and are sampled during power-on resets and software-  
initiated resets.  
Each core has its own private L1 memory. The modified Har-  
vard architecture supports two concurrent 32-bit data accesses  
along with an instruction fetch at full processor speed which  
provides high bandwidth processor performance. Two separate  
64K-byte of data memory blocks partner with an 80K-byte  
memory block for instruction storage. Each block is multi-  
banked for efficient data exchange through DMA and can be  
configured as SRAM. Alternatively, 16K bytes of each block can  
be configured in L1 cache mode. The four-way set-associative  
instruction cache and the 2 two-way set-associative data caches  
greatly accelerate memory access performance, especially when  
accessing external memories.  
The L1 memory domain also features a 4K-byte scratchpad  
SRAM block which is ideal for storing local variables and the  
software stack. All L1 memory is protected by a multi-parity bit  
concept, regardless of whether the memory is operating in  
SRAM or cache mode.  
Outside of the L1 domain, L2 and L3 memories are arranged  
using a Von Neumann topology. The L2 memory domain is a  
unified instruction and data memory and can hold any mixture  
of code and data required by the system design. The L2 memory  
domain is accessible by both Blackfin cores through a dedicated  
64-bit interface. It operates at half the frequency of the cores.  
The processor features up to 256K bytes of L2 SRAM which is  
ECC-protected and organized in eight banks. Individual banks  
can be made private to any of the cores or the DMA subsystem.  
There is also a 32K-byte single-bank ROM in the L2 domain. It  
contains boot code and safety functions.  
Table 2. Boot Modes  
SYS_BMODE Setting Boot Mode  
000  
001  
010  
011  
100  
101  
110  
111  
No boot/Idle  
Memory  
RSI0 Master  
SPI0 Master  
SPI0 Slave  
Reserved  
LP0 Slave  
UART0 Slave  
VIDEO SUBSYSTEM  
The following sections describe the components of the proces-  
sor’s video subsystem. These blocks are shown with blue  
shading in Figure 1 on Page 1.  
Video Interconnect (VID)  
Static Memory Controller (SMC)  
The Video Interconnect provides a connectivity matrix that  
interconnects the Video Subsystem: three PPIs, the PIXC, and  
the PVP. The interconnect uses a protocol to manage data  
transfer among these video peripherals.  
The SMC can be programmed to control up to four banks of  
external memories or memory-mapped devices, with very flexi-  
ble timing parameters. Each bank occupies a 64M byte segment  
regardless of the size of the device used, so that these banks are  
only contiguous if each is fully populated with 64M bytes of  
memory.  
Pipelined Vision Processor (PVP)  
The PVP engine provides hardware implementation of signal  
and image processing algorithms that are required for  
co-processing and pre-processing of monochrome video frames  
in ADAS applications, robotic systems, and other machine  
applications.  
The PVP works in conjunction with the Blackfin cores. It is  
optimized for convolution and wavelet based object detection  
and classification, and tracking and verification algorithms. The  
PVP has the following processing blocks.  
• Four 5x5 16-bit convolution blocks optionally followed by  
down scaling  
• A 16-bit cartesian-to-polar coordinate conversion block  
• A pixel edge classifier that supports 1st and 2nd derivative  
modes  
• An arithmetic unit with 32-bit addition, multiply and  
divide  
Dynamic Memory Controller (DMC)  
The DMC includes a controller that supports JESD79-2E com-  
patible double data rate (DDR2) SDRAM and JESD209A low  
power DDR (LPDDR) SDRAM devices.  
I/O Memory Space  
The processor does not define a separate I/O space. All  
resources are mapped through the flat 32-bit address space. On-  
chip I/O devices have their control registers mapped into mem-  
ory-mapped registers (MMRs) at addresses near the top of the  
4G byte address space. These are separated into two smaller  
blocks, one which contains the control MMRs for all core func-  
tions, and the other which contains the registers needed for  
setup and control of the on-chip peripherals outside of the core.  
The MMRs are accessible only in supervisor mode and appear  
as reserved space to on-chip peripherals.  
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ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609 Preliminary Technical Data  
• A 32-bit threshold block with 16 thresholds, a histogram,  
and run-length encoding  
• Two 32-bit integral blocks that support regular and diago-  
nal integrals  
• An up- and down-scaling unit with independent scaling  
ratios for horizontal and vertical components  
• Input and output formatters for compatibility with many  
data formats, including Bayer input format  
• ITU-656 status word error detection and correction for  
ITU-656 receive modes and ITU-656 preamble and status  
word decode.  
• Optional packing and unpacking of data to/from 32 bits  
from/to 8 bits, 16 bits and 24 bits. If packing/unpacking is  
enabled, endianness can be configured to change the order  
of packing/unpacking of bytes/words.  
• RGB888 can be converted to RGB666 or RGB565 for trans-  
mit modes.  
• Various de-interleaving/interleaving modes for receiv-  
ing/transmitting 4:2:2 YCrCb data.  
The PVP can form a pipe of all the constituent algorithmic  
modules and is dynamically reconfigurable to form different  
pipeline structures.  
• Configurable LCD data enable (DEN) output available on  
Frame Sync 3.  
The PVP supports the simultaneous processing of up to four  
data streams. The memory pipe stream operates on data  
received by DMA from any L1, L2, or L3 memory. The three  
camera pipe streams operate on a common input received  
directly from any of the three PPI inputs. Optionally, the PIXC  
can convert color data received by the PPI and forward luma  
values to the PVP’s monochrome engine. Each stream has a  
dedicated DMA output. This preprocessing concept ensures  
careful use of available power and bandwidth budgets and frees  
up the processor cores for other tasks.  
The PVP provides for direct core MMR access to all control/sta-  
tus registers. Two hardware interrupts interface to the system  
event controller. For optimal performance, the PVP allows reg-  
ister programming through its control DMA interface, as well as  
outputting selected status registers through the status DMA  
interface. This mechanism enables the PVP to automatically  
process job lists completely independent of the Blackfin cores.  
PROCESSOR SAFETY FEATURES  
The ADSP-BF609 processor has been designed for functional  
safety applications. While the level of safety is mainly domi-  
nated by the system concept, the following primitives are  
provided by the devices to build a robust safety concept.  
Dual Core Supervision  
The processor has been implemented as dual-core devices to  
separate critical tasks to large independency. Software models  
support mutual supervision of the cores in symmetrical fashion.  
Multi-Parity-Bit-Protected L1 Memories  
In the processor’s L1 memory space, whether SRAM or cache,  
each word is protected by multiple parity bits to detect the single  
event upsets that occur in all RAMs. This applies both to L1  
instruction and data memory spaces.  
Pixel Compositor (PIXC)  
The pixel compositor (PIXC) provides image overlays with  
transparent-color support, alpha blending, and color space con-  
version capabilities for output to TFT LCDs and NTSC/PAL  
video encoders. It provides all of the control to allow two data  
streams from two separate data buffers to be combined,  
blended, and converted into appropriate forms for both LCD  
panels and digital video outputs. The main image buffer pro-  
vides the basic background image, which is presented in the  
data stream. The overlay image buffer allows the user to add  
multiple foreground text, graphics, or video objects on top of  
the main image or video data stream.  
ECC-Protected L2 Memories  
Error correcting codes (ECC) are used to correct single event  
upsets. The L2 memory is protected with a Single Error Correct-  
Double Error Detect (SEC-DED) code. By default ECC is  
enabled, but it can be disabled on a per-bank basis. Single-bit  
errors are transparently corrected. Dual-bit errors can issue a  
system event or fault if enabled. ECC protection is fully trans-  
parent to the user, even if L2 memory is read or written by 8-bit  
or 16-bit entities.  
CRC-Protected Memories  
Parallel Peripheral Interface (PPI)  
While parity bit and ECC protection mainly protect against ran-  
dom soft errors in L1 and L2 memory cells, the CRC engines can  
be used to protect against systematic errors (pointer errors) and  
static content (instruction code) of L1, L2 and even L3 memo-  
ries (DDR2, LPDDR). The processors feature two CRC engines  
which are embedded in the memory-to-memory DMA control-  
lers. CRC check sums can be calculated or compared on the fly  
during memory transfers, or one or multiple memory regions  
can be continuously scrubbed by single DMA work unit as per  
DMA descriptor chain instructions. The CRC engine also pro-  
tects data loaded during the boot process.  
The processor provides up to three parallel peripheral interfaces  
(PPIs), supporting data widths up to 24 bits. The PPI supports  
direct connection to TFT LCD panels, parallel analog-to-digital  
and digital-to-analog converters, video encoders and decoders,  
image sensor modules and other general-purpose peripherals.  
The following features are supported in the PPI module:  
• Programmable data length: 8 bits, 10 bits, 12 bits, 14 bits,  
16 bits, 18 bits, and 24 bits per clock.  
• Various framed, non-framed, and general-purpose operat-  
ing modes. Frame syncs can be generated internally or can  
be supplied by an external device.  
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Preliminary Technical Data ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609  
a “fault”. Additionally, the system events can be defined as an  
interrupt to the cores. If defined as such, the SEC forwards the  
event to the fault management unit which may automatically  
reset the entire device for reboot, or simply toggle the  
SYS_FAULT output pins to signal off-chip hardware. Option-  
ally, the fault management unit can delay the action taken via a  
keyed sequence, to provide a final chance for the Blackfin cores  
to resolve the crisis and to prevent the fault action from being  
taken.  
Memory Protection  
The Blackfin cores feature a memory protection concept, which  
grants data and/or instruction accesses from enabled memory  
regions only. A supervisor mode vs. user mode programming  
model supports dynamically varying access rights. Increased  
flexibility in memory page size options supports a simple  
method of static memory partitioning.  
System Protection  
All system resources and L2 memory banks can be controlled by  
either the processor cores, memory-to-memory DMA, or the  
system debug unit (SDU). A system protection unit (SPU)  
enables write accesses to specific resources that are locked to  
any of four masters: Core 0, Core 1, Memory DMA, and the Sys-  
tem Debug Unit. System protection is enabled in greater  
granularity for some modules (L2, SEC and GPIO controllers)  
through a global lock concept.  
ADDITIONAL PROCESSOR PERIPHERALS  
The processor contains a rich set of peripherals connected to the  
core via several high-bandwidth buses, providing flexibility in  
system configuration as well as excellent overall system perfor-  
mance (see the block diagram on Page 1). The processors  
contain high-speed serial and parallel ports, an interrupt con-  
troller for flexible management of interrupts from the on-chip  
peripherals or external sources, and power management control  
functions to tailor the performance and power characteristics of  
the processor and system to many application scenarios.  
Watchpoint Protection  
The primary purpose of watchpoints and hardware breakpoints  
is to serve emulator needs. When enabled, they signal an emula-  
tor event whenever user-defined system resources are accessed  
or a core executes from user-defined addresses. Watchdog  
events can be configured such that they signal the events to the  
other Blackfin core or to the fault management unit.  
The following sections describe additional peripherals that were  
not described in the previous sections.  
Timers  
The processor includes several timers which are described in the  
following sections.  
Dual Watchdog  
General-Purpose Timers  
The two on-chip watchdog timers each may supervise one  
Blackfin core.  
There is one GP timer unit and it provides eight general-pur-  
pose programmable timers. Each timer has an external pin that  
can be configured either as a pulse width modulator (PWM) or  
timer output, as an input to clock the timer, or as a mechanism  
for measuring pulse widths and periods of external events.  
These timers can be synchronized to an external clock input on  
the TMRx pins, an external clock TMRCLK input pin, or to the  
internal SCLK0.  
The timer units can be used in conjunction with the UARTs and  
the CAN controller to measure the width of the pulses in the  
data stream to provide a software auto-baud detect function for  
the respective serial channels.  
Bandwidth Monitor  
All DMA channels that operate in memory-to-memory mode  
(Memory DMA, PVP Memory Pipe DMA, PIXC DMA) are  
equipped with a bandwidth monitor mechanism. They can sig-  
nal a system event or fault when transactions tend to starve  
because system buses are fully loaded with higher-priority  
traffic.  
Signal Watchdogs  
The eight general-purpose timers feature two new modes to  
monitor off-chip signals. The Watchdog Period mode monitors  
whether external signals toggle with a period within an expected  
range. The Watchdog Width mode monitors whether the pulse  
widths of external signals are in an expected range. Both modes  
help to detect incorrect undesired toggling (or lack thereof) of  
system-level signals.  
The timers can generate interrupts to the processor core, pro-  
viding periodic events for synchronization to either the system  
clock or to external signals. Timer events can also trigger other  
peripherals via the TRU (for instance, to signal a fault).  
Core Timers  
Each processor core also has its own dedicated timer. This extra  
timer is clocked by the internal processor clock and is typically  
used as a system tick clock for generating periodic operating  
system interrupts.  
Up/Down Count Mismatch Detection  
The up/down counter can monitor external signal pairs, such as  
request/grant strobes. If the edge count mismatch exceeds the  
expected range, the up/down counter can flag this to the proces-  
sor or to the fault management unit.  
Watchdog Timers  
Each core includes a 32-bit timer, which may be used to imple-  
ment a software watchdog function. A software watchdog can  
improve system availability by forcing the processor to a known  
state, via generation of a hardware reset, nonmaskable interrupt  
(NMI), or general-purpose interrupt, if the timer expires before  
Fault Management  
The fault management unit is part of the system event controller  
(SEC). Any system event, whether a dual-bit uncorrectable ECC  
error, or any peripheral status interrupt, can be defined as being  
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ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609 Preliminary Technical Data  
being reset by software. The programmer initializes the count  
value of the timer, enables the appropriate interrupt, then  
enables the timer. Thereafter, the software must reload the  
counter before it counts to zero from the programmed value.  
This protects the system from remaining in an unknown state  
where software, which would normally reset the timer, has  
stopped running due to an external noise condition or software  
error.  
After a reset, software can determine if the watchdog was the  
source of the hardware reset by interrogating a status bit in the  
timer control register, which is set only upon a watchdog gener-  
ated reset.  
Serial Ports (SPORTs)  
Three synchronous serial ports that provide an inexpensive  
interface to a wide variety of digital and mixed-signal peripheral  
devices such as Analog Devices’ AD183x family of audio codecs,  
ADCs, and DACs. The serial ports are made up of two data  
lines, a clock, and frame sync. The data lines can be pro-  
grammed to either transmit or receive and each data line has a  
dedicated DMA channel.  
Serial port data can be automatically transferred to and from  
on-chip memory/external memory via dedicated DMA chan-  
nels. Each of the serial ports can work in conjunction with  
another serial port to provide TDM support. In this configura-  
tion, one SPORT provides two transmit signals while the other  
SPORT provides the two receive signals. The frame sync and  
clock are shared.  
Serial ports operate in five modes:  
• Standard DSP serial mode  
• Multichannel (TDM) mode  
• I2S mode  
• Packed I2S mode  
• Left-justified mode  
3-Phase PWM Units  
The two 3-phase PWM generation units each feature:  
• 16-bit center-based PWM generation unit  
• Programmable PWM pulse width  
• Single/double update modes  
• Programmable dead time and switching frequency  
• Twos-complement implementation which permits smooth  
transition to full ON and full OFF states  
• Dedicated asynchronous PWM shutdown signal  
Each PWM block integrates a flexible and programmable  
3-phase PWM waveform generator that can be programmed to  
generate the required switching patterns to drive a 3-phase volt-  
age source inverter for ac induction motor (ACIM) or  
permanent magnet synchronous motor (PMSM) control. In  
addition, the PWM block contains special functions that con-  
siderably simplify the generation of the required PWM  
switching patterns for control of the electronically commutated  
motor (ECM) or brushless dc motor (BDCM). Software can  
enable a special mode for switched reluctance motors (SRM).  
The eight PWM output signals (per PWM unit) consist of four  
high-side drive signals and four low-side drive signals. The  
polarity of a generated PWM signal can be set with software, so  
that either active HI or active LO PWM patterns can be  
produced.  
ACM Interface  
The ADC control module (ACM) provides an interface that  
synchronizes the controls between the processor and an analog-  
to-digital converter (ADC). The analog-to-digital conversions  
are initiated by the processor, based on external or internal  
events.  
The ACM allows for flexible scheduling of sampling instants  
and provides precise sampling signals to the ADC.  
Figure 5 shows how to connect an external ADC to the ACM  
and one of the SPORTs.  
SPT_AD1  
SPT_AD0  
SPORTx  
SPT_CLK  
SPT_FS  
Pulses synchronous to the switching frequency can be generated  
internally and output on the PWM_SYNC pin. The PWM unit  
can also accept externally generated synchronization pulses  
through PWM_SYNC.  
Each PWM unit features a dedicated asynchronous shutdown  
pin which (when brought low) instantaneously places all six  
PWM outputs in the OFF state.  
ADSP-BF60x  
SPORT  
SELECT  
MUX  
ACM_CLK  
ACM_FS  
ACM  
ACM_A[2:0]  
ACM_A3  
ACM_A4  
Link Ports  
RANGE  
SGL/DIFF  
A[2:0]  
Four DMA-enabled, 8-bit-wide link ports can connect to the  
link ports of other DSPs or processors. Link ports are bidirec-  
tional ports having eight data lines, an acknowledge line and a  
clock line.  
ADC  
CS  
ADSCLK  
D
D
A
B
OUT  
OUT  
Figure 5. ADC, ACM, and SPORT Connections  
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Preliminary Technical Data ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609  
The ACM synchronizes the ADC conversion process, generat-  
ing the ADC controls, the ADC conversion start signal, and  
other signals. The actual data acquisition from the ADC is done  
by a peripheral such as a SPORT or a SPI.  
The processor interfaces directly to many ADCs without any  
glue logic required.  
To help support the Local Interconnect Network (LIN) proto-  
cols, a special command causes the transmitter to queue a break  
command of programmable bit length into the transmit buffer.  
Similarly, the number of stop bits can be extended by a pro-  
grammable inter-frame space.  
The capabilities of the UARTs are further extended with sup-  
port for the Infrared Data Association (IrDA®) serial infrared  
physical layer link specification (SIR) protocol.  
General-Purpose Counters  
A 32-bit counter is provided that can operate in general-pur-  
pose up/down count modes and can sense 2-bit quadrature or  
binary codes as typically emitted by industrial drives or manual  
thumbwheels. Count direction is either controlled by a level-  
sensitive input pin or by two edge detectors.  
A third counter input can provide flexible zero marker support  
and can alternatively be used to input the push-button signal of  
thumb wheels. All three pins have a programmable debouncing  
circuit.  
Internal signals forwarded to each general-purpose timer enable  
these timers to measure the intervals between count events.  
Boundary registers enable auto-zero operation or simple system  
warning by interrupts when programmable count values are  
exceeded.  
TWI Controller Interface  
The processors include a 2-wire interface (TWI) module for  
providing a simple exchange method of control data between  
multiple devices. The TWI module is compatible with the  
widely used I2C bus standard. The TWI module offers the  
capabilities of simultaneous master and slave operation and  
support for both 7-bit addressing and multimedia data arbitra-  
tion. The TWI interface utilizes two pins for transferring clock  
(TWI_SCL) and data (TWI_SDA) and supports the protocol at  
speeds up to 400k bits/sec. The TWI interface pins are compati-  
ble with 5 V logic levels.  
Additionally, the TWI module is fully compatible with serial  
camera control bus (SCCB) functionality for easier control of  
various CMOS camera sensor devices.  
Serial Peripheral Interface (SPI) Ports  
Removable Storage Interface (RSI)  
The processors have two SPI-compatible ports that allow the  
processor to communicate with multiple SPI-compatible  
devices.  
The removable storage interface (RSI) controller acts as the host  
interface for multimedia cards (MMC), secure digital memory  
cards (SD), secure digital input/output cards (SDIO), and CE-  
ATA hard disk drives. The following list describes the main fea-  
tures of the RSI controller.  
• Support for a single MMC, SD memory, SDIO card or CE-  
ATA hard disk drive  
In its simplest mode, the SPI interface uses three pins for trans-  
ferring data: two data pins (Master Output-Slave Input, MOSI,  
and Master Input-Slave Output, MISO) and a clock pin (serial  
clock, SCK). An SPI chip select input pin (SPISS) lets other SPI  
devices select the processor, and seven SPI chip select output  
pins (SPISEL7–1) let the processor select other SPI devices. The  
SPI select pins are reconfigured general-purpose I/O pins. Using  
these pins, the SPI port provides a full-duplex, synchronous  
serial interface, which supports both master/slave modes and  
multimaster environments.  
• Support for 1-bit and 4-bit SD modes  
• Support for 1-bit, 4-bit, and 8-bit MMC modes  
• Support for 4-bit and 8-bit CE-ATA hard disk drives  
• Support for eMMC 4.3 embedded NAND flash devices  
The SPI port’s baud rate and clock phase/polarities are pro-  
grammable, and it has integrated DMA channels for both  
transmit and receive data streams.  
• A ten-signal external interface with clock, command, and  
up to eight data lines  
• Card interface clock generation from SCLK0  
• SDIO interrupt and read wait features  
UART Ports  
The processors provide two full-duplex universal asynchronous  
receiver/transmitter (UART) ports, which are fully compatible  
with PC-standard UARTs. Each UART port provides a simpli-  
fied UART interface to other peripherals or hosts, supporting  
full-duplex, DMA-supported, asynchronous transfers of serial  
data. A UART port includes support for five to eight data bits,  
and none, even, or odd parity. Optionally, an additional address  
bit can be transferred to interrupt only addressed nodes in  
multi-drop bus (MDB) systems. A frame is terminates by one,  
one and a half, two or two and a half stop bits.  
• CE-ATA command completion signal recognition and  
disable  
Controller Area Network (CAN)  
A CAN controller implements the CAN 2.0B (active) protocol.  
This protocol is an asynchronous communications protocol  
used in both industrial and automotive control systems. The  
CAN protocol is well suited for control applications due to its  
capability to communicate reliably over a network. This is  
because the protocol incorporates CRC checking, message error  
tracking, and fault node confinement.  
The UART ports support automatic hardware flow control  
through the Clear To Send (CTS) input and Request To Send  
(RTS) output with programmable assertion FIFO levels.  
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ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609 Preliminary Technical Data  
The CAN controller offers the following features:  
• Support for 802.3Q tagged VLAN frames  
• 32 mailboxes (8 receive only, 8 transmit only, 16 configu-  
rable for receive or transmit).  
• Dedicated acceptance masks for each mailbox.  
• Additional data filtering on first two bytes.  
• Support for both the standard (11-bit) and extended (29-  
bit) identifier (ID) message formats.  
• Support for remote frames.  
• Programmable MDC clock rate and preamble suppression  
IEEE 1588 Support  
The IEEE 1588 standard is a precision clock synchronization  
protocol for networked measurement and control systems. The  
processor includes hardware support for IEEE 1588 with an  
integrated precision time protocol synchronization engine  
(PTP_TSYNC). This engine provides hardware assisted time  
stamping to improve the accuracy of clock synchronization  
between PTP nodes. The main features of the engine are:  
• Active or passive network support.  
• CAN wakeup from hibernation mode (lowest static power  
consumption mode).  
• Support for both IEEE 1588-2002 and IEEE 1588-2008 pro-  
tocol standards  
• Interrupts, including: TX complete, RX complete, error  
and global.  
• Hardware assisted time stamping capable of up to 12.5 ns  
resolution  
An additional crystal is not required to supply the CAN clock, as  
the CAN clock is derived from a system clock through a pro-  
grammable divider.  
• Lock adjustment  
• Automatic detection of IPv4 and IPv6 packets, as well as  
PTP messages  
10/100 Ethernet MAC  
• Multiple input clock sources (SCLK0, RMII clock, external  
clock)  
• Programmable pulse per second (PPS) output  
• Auxiliary snapshot to time stamp external events  
The processor can directly connect to a network by way of an  
embedded fast Ethernet media access controller (MAC) that  
supports both 10-BaseT (10M bits/sec) and 100-BaseT (100M  
bits/sec) operation. The 10/100 Ethernet MAC peripheral on the  
processor is fully compliant to the IEEE 802.3-2002 standard  
and it provides programmable features designed to minimize  
supervision, bus use, or message processing by the rest of the  
processor system.  
USB 2.0 On-the-Go Dual-Role Device Controller  
The USB 2.0 OTG dual-role device controller provides a low-  
cost connectivity solution for the growing adoption of this bus  
standard in industrial applications, as well as consumer mobile  
devices such as cell phones, digital still cameras, and MP3 play-  
ers. The USB 2.0 controller allows these devices to transfer data  
using a point-to-point USB connection without the need for a  
PC host. The module can operate in a traditional USB periph-  
eral-only mode as well as the host mode presented in the On-  
the-Go (OTG) supplement to the USB 2.0 specification.  
Some standard features are:  
• Support and RMII protocols for external PHYs  
• Full duplex and half duplex modes  
• Media access management (in half-duplex operation)  
• Flow control  
The USB clock (USB_CLKIN) is provided through a dedicated  
external crystal or crystal oscillator.  
• Station management: generation of MDC/MDIO frames  
for read-write access to PHY registers  
The USB On-the-Go dual-role device controller includes a  
Phase Locked Loop with programmable multipliers to generate  
the necessary internal clocking frequency for USB.  
Some advanced features are:  
• Automatic checksum computation of IP header and IP  
payload fields of Rx frames  
POWER AND CLOCK MANAGEMENT  
• Independent 32-bit descriptor-driven receive and transmit  
DMA channels  
• Frame status delivery to memory through DMA, including  
frame completion semaphores for efficient buffer queue  
management in software  
The processor provides four operating modes, each with a dif-  
ferent performance/power profile. When configured for a 0 volt  
internal supply voltage (VDD_INT), the processor enters the hiber-  
nate state. Control of clocking to each of the processor  
peripherals also reduces power consumption. See Table 5 for a  
summary of the power settings for each mode.  
• Tx DMA support for separate descriptors for MAC header  
and payload to eliminate buffer copy operations  
Crystal Oscillator (SYS_XTAL)  
• Convenient frame alignment modes  
The processor can be clocked by an external crystal, (Figure 6) a  
sine wave input, or a buffered, shaped clock derived from an  
external clock oscillator. If an external clock is used, it should be  
a TTL compatible signal and must not be halted, changed, or  
operated below the specified frequency during normal opera-  
tion. This signal is connected to the processor’s SYS_CLKIN  
• 47 MAC management statistics counters with selectable  
clear-on-read behavior and programmable interrupts on  
half maximum value  
• Advanced power management  
• Magic packet detection and wakeup frame filtering  
Rev. PrD  
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Preliminary Technical Data ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609  
pin. When an external clock is used, the SYS_XTAL pin must be  
left unconnected. Alternatively, because the processor includes  
an on-chip oscillator circuit, an external crystal may be used.  
For fundamental frequency operation, use the circuit shown in  
Figure 7. A parallel-resonant, fundamental frequency, micro-  
processor grade crystal is connected between the USB_XTAL  
pin and ground. A load capacitor is placed in parallel with the  
crystal. The combined capacitive value of the board trace para-  
sitic, the case capacitance of the crystal (from crystal  
manufacturer) and the parallel capacitor in the diagram should  
be in the range of 8 pF to 15 pF.  
BLACKFIN  
TO PLL  
CIRCUITRY  
BLACKFIN  
ꢄꢅꢁȍ  
TO USB PLL  
SYS_CLKIN  
18 pF*  
SYS_XTAL  
ꢅꢁꢀȍ2  
ꢃꢃꢁȍ  
*
FOR OVERTONE  
OPERATION ONLY:  
5-12 pf1, 2  
18 pF *  
NOTE: VALUES MARKED WITH * MUST BE CUSTOMIZED, DEPENDING  
ON THE CRYSTAL AND LAYOUT. PLEASE ANALYZE CAREFULLY. FOR  
FREQUENCIES ABOVE 33 MHz, THE SUGGESTED CAPACITOR VALUE  
OF 18pF SHOULD BE TREATED AS A MAXIMUM, AND THE SUGGESTED  
5(6,6725ꢀ9$/8(ꢀ6+28/'ꢀ%(ꢀ5('8&('ꢀ72ꢀꢁꢀȍꢂ  
NOTES:  
1. CAPACITANCE VALUE SHOWN INCLUDES BOARD PARASITICS  
2. VALUES ARE A PRELIMINARY ESTIMATE.  
Figure 7. External USB Crystal Connection  
Figure 6. External Crystal Connection  
The crystal should be chosen so that its rated load capacitance  
matches the nominal total capacitance on this node. A series  
resistor may be added between the USB_XTAL pin and the par-  
allel crystal and capacitor combination, in order to further  
reduce the drive level of the crystal.  
The parallel capacitor and the series resistor shown in Figure 7  
fine tune phase and amplitude of the sine frequency. The capac-  
itor and resistor values shown in Figure 7 are typical values  
only. The capacitor values are dependent upon the crystal man-  
ufacturers’ load capacitance recommendations and the PCB  
physical layout. The resistor value depends on the drive level  
specified by the crystal manufacturer. The user should verify the  
customized values based on careful investigations on multiple  
devices over temperature range.  
For fundamental frequency operation, use the circuit shown in  
Figure 6. A parallel-resonant, fundamental frequency, micro-  
processor grade crystal is connected across the CLKIN and  
XTAL pins. The on-chip resistance between CLKIN and the  
XTAL pin is in the 500 kΩ range. Further parallel resistors are  
typically not recommended.  
The two capacitors and the series resistor shown in Figure 6 fine  
tune phase and amplitude of the sine frequency. The capacitor  
and resistor values shown in Figure 6 are typical values only.  
The capacitor values are dependent upon the crystal manufac-  
turers’ load capacitance recommendations and the PCB physical  
layout. The resistor value depends on the drive level specified by  
the crystal manufacturer. The user should verify the customized  
values based on careful investigations on multiple devices over  
temperature range.  
Clock Generation  
A third-overtone crystal can be used for frequencies above  
25 MHz. The circuit is then modified to ensure crystal operation  
only at the third overtone by adding a tuned inductor circuit as  
shown in Figure 6. A design procedure for third-overtone oper-  
ation is discussed in detail in application note (EE-168) Using  
Third Overtone Crystals with the ADSP-218x DSP on the Ana-  
log Devices website (www.analog.com)—use site search on  
“EE-168.”  
The clock generation unit (CGU) generates all on-chip clocks  
and synchronization signals. Multiplication factors are pro-  
grammed to the PLL to define the PLLCLK frequency.  
Programmable values divide the PLLCLK frequency to generate  
the core clock (CCLK), the system clocks (SYSCLK, SCLK0 and  
SCLK1), the LPDDR or DDR2 clock (DCLK) and the output  
clock (OCLK). This is illustrated in Figure 8 on Page 32.  
Writing to the CGU control registers does not affect the behav-  
ior of the PLL immediately. Registers are first programmed with  
a new value, and the PLL logic executes the changes so that it  
transitions smoothly from the current conditions to the new  
ones.  
SYS_CLKIN oscillations start when power is applied to the  
VDD_EXT pins. The rising edge of SYS_HWRST can be applied  
after all voltage supplies are within specifications (see Operating  
Conditions on Page 31), and SYS_CLKIN oscillations are stable.  
USB Crystal Oscillator  
The USB can be clocked by an external crystal, a sine wave  
input, or a buffered, shaped clock derived from an external  
clock oscillator. If an external clock is used, it should be a TTL  
compatible signal and must not be halted, changed, or operated  
below the specified frequency during normal operation. This  
signal is connected to the processor’s USB_XTAL pin. Alterna-  
tively, because the processor includes an on-chip oscillator  
circuit, an external crystal may be used.  
Rev. PrD  
| Page 15 of 44 | March 2012  
ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609 Preliminary Technical Data  
Full-On Operating Mode—Maximum Performance  
Clock Out/External Clock  
In the full-on mode, the PLL is enabled and is not bypassed,  
providing capability for maximum operational frequency. This  
is the power-up default execution state in which maximum per-  
formance can be achieved. The processor cores and all enabled  
peripherals run at full speed.  
The SYS_CLKOUT output pin has programmable options to  
output divided-down versions of the on-chip clocks, including  
USB clocks. Note that the USBCLK is provided for debug pur-  
poses only and is not supported or guaranteed for clocking  
customer applications. By default, the SYS_CLKOUT pin drives  
a buffered version of the SYS_CLKIN input. Clock generation  
faults (for example PLL unlock) may trigger a reset by hardware.  
The clocks shown in Table 3 can be outputs from  
Active Operating Mode—Moderate Dynamic Power Savings  
In the active mode, the PLL is enabled but bypassed. Because the  
PLL is bypassed, the processor’s core clocks and system clocks  
run at the input clock (SYS_CLKIN) frequency. DMA access is  
available to appropriately configured L1 memories.  
SYS_CLKOUT.  
Table 3. Clock Dividers  
For more information about PLL controls, see the “Dynamic  
Power Management” chapter in the ADSP-BF60x Blackfin Pro-  
cessor Hardware Reference.  
Clock Source  
CCLK (core clock)  
SYSCLK (System clock)  
Divider  
By 4  
By 2  
See Table 5 for a summary of the power settings for each mode.  
SCLK0 (system clock for PVP, all None  
peripherals not covered by  
SCLK1)  
Table 5. Power Settings  
fSYSCLK  
fDCLK  
fSCLK0  
fSCLK1  
,
SCLK1 (system clock for SPORTS, None  
SPI, ACM)  
,
,
PLL  
Core  
Power  
On  
On  
DCLK (LPDDR/DDR2 clock)  
OCLK (output clock)  
USBCLK  
By 2  
Mode/State PLL  
Full On  
Active  
Bypassed fCCLK  
Programmable  
Enabled No  
Enabled Enabled  
Enabled Enabled  
None  
Enabled/ Yes  
Disabled  
CLKBUF  
None, direct from SYS_CLKIN  
None, direct from USB_CLKIN  
USBCLKBUF  
Deep Sleep Disabled  
Hibernate Disabled  
Disabled Disabled On  
Disabled Disabled Off  
Power Management  
As shown in Table 4, the processor supports five different power  
domains, which maximizes flexibility while maintaining com-  
pliance with industry standards and conventions. There are no  
sequencing requirements for the various power domains, but all  
domains must be powered according to the appropriate Specifi-  
cations table for processor operating conditions; even if the  
feature/peripheral is not used.  
Deep Sleep Operating Mode—Maximum Dynamic Power  
Savings  
The deep sleep mode maximizes dynamic power savings by dis-  
abling the clocks to the processor core and to all synchronous  
peripherals. Asynchronous peripherals may still be running but  
cannot access internal resources or external memory.  
Hibernate State—Maximum Static Power Savings  
Table 4. Power Domains  
The hibernate state maximizes static power savings by disabling  
the voltage and clocks to the processor cores and to all of the  
peripherals. This setting signals the external voltage regulator  
supplying the VDD_INT pins to shut off using the  
SYS_EXTWAKE signal, which provides the lowest static power  
dissipation. Any critical information stored internally (for  
example, memory contents, register contents, and other infor-  
mation) must be written to a non-volatile storage device prior to  
removing power if the processor state is to be preserved.  
Power Domain  
All internal logic  
DDR2/LPDDR  
USB  
VDD Range  
VDD_INT  
VDD_DMC  
VDD_USB  
Thermal diode  
VDD_TD  
All other I/O (includes SYS, JTAG, and Ports pins) VDD_EXT  
The dynamic power management feature of the processor  
allows the processor’s core clock frequency (fCCLK) to be dynam-  
ically controlled.  
The power dissipated by a processor is largely a function of its  
clock frequency and the square of the operating voltage. For  
example, reducing the clock frequency by 25% results in a 25%  
reduction in dynamic power dissipation.  
Since the VDD_EXT pins can still be supplied in this mode, all of  
the external pins three-state, unless otherwise specified. This  
allows other devices that may be connected to the processor to  
still have power applied without drawing unwanted current.  
Reset Control Unit  
Reset is the initial state of the whole processor or one of the  
cores and is the result of a hardware or software triggered event.  
In this state, all control registers are set to their default values  
Rev. PrD  
| Page 16 of 44 | March 2012  
Preliminary Technical Data ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609  
and functional units are idle. Exiting a full system reset starts  
with Core-0 only being ready to boot. Exiting a Core-n only  
reset starts with this Core-n being ready to boot.  
System Watchpoint Unit  
The System Watchpoint Unit (SWU) is a single module which  
connects to a single system bus and provides for transaction  
monitoring. One SWU is attached to the bus going to each sys-  
tem slave. The SWU provides ports for all system bus address  
channel signals. Each SWU contains four match groups of regis-  
ters with associated hardware. These four SWU match groups  
operate independently, but share common event (interrupt,  
trigger and others) outputs.  
The Reset Control Unit (RCU) controls how all the functional  
units enter and exit reset. Differences in functional require-  
ments and clocking constraints define how reset signals are  
generated. Programs must guarantee that none of the reset  
functions puts the system into an undefined state or causes  
resources to stall. This is particularly important when only one  
of the cores is reset (programs must ensure that there is no  
pending system activity involving the core that is being reset).  
System Debug Unit  
The System Debug Unit (SDU) provides IEEE-1149.1 support  
through its JTAG interface. In addition to traditional JTAG fea-  
tures, present in legacy Blackfin products, the SDU adds more  
features for debugging the chip without halting the core  
processors.  
From a system perspective reset is defined by both the reset tar-  
get and the reset source as described below.  
Target defined:  
• Hardware Reset – All functional units are set to their  
default states without exception. History is lost.  
• System Reset – All functional units except the RCU are set  
to their default states.  
EZ-KIT LITE® EVALUATION BOARD  
For evaluation of ADSP-BF606/ADSP-BF607/ADSP-  
BF608/ADSP-BF609 processors, use the EZ-KIT Lite® boards  
available from Analog Devices. Order using part numbers  
ADZS-BF609-EZLITE. The boards come with on-chip emula-  
tion capabilities and are equipped to enable software  
development. Multiple daughter cards are available.  
• Core-n only Reset – Affects Core-n only. The system soft-  
ware should guarantee that the core in reset state is not  
accessed by any bus master.  
Source defined:  
• Hardware Reset – The SYS_HWRST input signal is  
asserted active (pulled down).  
• System Reset – May be triggered by software (writing to the  
RCU_CTL register) or by another functional unit such as  
the dynamic power management (DPM) unit (Hibernate)  
or any of the system event controller (SEC), trigger routing  
unit (TRU), or emulator inputs.  
DESIGNING AN EMULATOR-COMPATIBLE  
PROCESSOR BOARD (TARGET)  
The Analog Devices family of emulators are tools that every sys-  
tem developer needs in order to test and debug hardware and  
software systems. Analog Devices has supplied an IEEE 1149.1  
JTAG Test Access Port (TAP) on each processor. The emulator  
uses the TAP to access the internal features of the processor,  
allowing the developer to load code, set breakpoints, observe  
variables, observe memory, and examine registers. The proces-  
sor must be halted to send data and commands, but once an  
operation has been completed by the emulator, the processor  
system is set running at full speed with no impact on  
system timing.  
• Core-n-only reset – Triggered by software.  
• Trigger request (peripheral).  
Voltage Regulation  
The processor requires an external voltage regulator to power  
the VDD_INT pins. To reduce standby power consumption, the  
external voltage regulator can be signaled through  
SYS_EXTWAKE to remove power from the processor core.  
This signal is high-true for power-up and may be connected  
directly to the low-true shut-down input of many common  
regulators.  
While in the hibernate state, all external supply pins (VDD_EXT  
DD_USB, VDD_DMC) can still be powered, eliminating the need for  
external buffers. The external voltage regulator can be activated  
from this power down state by asserting the SYS_HWRST pin,  
which then initiates a boot sequence. SYS_EXTWAKE indicates  
a wakeup to the external voltage regulator.  
To use these emulators, the target board must include a header  
that connects the processor’s JTAG port to the emulator.  
For details on target board design issues including mechanical  
layout, single processor connections, multiprocessor scan  
chains, signal buffering, signal termination, and emulator pod  
logic, see (EE-68) Analog Devices JTAG Emulation Technical  
Reference on the Analog Devices website (www.analog.com)—  
use site search on “EE-68.” This document is updated regularly  
to keep pace with improvements to emulator support.  
,
V
SYSTEM DEBUG  
The processor includes various features that allow for easy sys-  
tem debug. These are described in the following sections.  
Rev. PrD  
| Page 17 of 44 | March 2012  
ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609 Preliminary Technical Data  
RELATED DOCUMENTS  
The following publications that describe the ADSP-  
BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609 processors  
(and related processors) can be ordered from any Analog  
Devices sales office or accessed electronically on our website:  
Getting Started With Blackfin Processors  
ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609  
Blackfin Processor Hardware Reference  
Blackfin Processor Programming Reference  
RELATED SIGNAL CHAINS  
A signal chain is a series of signal-conditioning electronic com-  
ponents that receive input (data acquired from sampling either  
real-time phenomena or from stored data) in tandem, with the  
output of one portion of the chain supplying input to the next.  
Signal chains are often used in signal processing applications to  
gather and process data or to apply system controls based on  
analysis of real-time phenomena. For more information about  
this term and related topics, see the “signal chain” entry in the  
Glossary of EE Terms on the Analog Devices website.  
Analog Devices eases signal processing system development by  
providing signal processing components that are designed to  
work together well. A tool for viewing relationships between  
specific applications and related components is available on the  
www.analog.com website.  
The Application Signal Chains page in the Circuits from the  
TM  
Lab site (http:\\www.analog.com\circuits) provides:  
• Graphical circuit block diagram presentation of signal  
chains for a variety of circuit types and applications  
• Drill down links for components in each chain to selection  
guides and application information  
• Reference designs applying best practice design techniques  
Rev. PrD  
| Page 18 of 44 | March 2012  
Preliminary Technical Data ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609  
SIGNAL DESCRIPTIONS  
The processors’ signal definitions are shown in Table 6.  
Table 6. Processor Signal Descriptions  
Signal Name  
Ports Pins  
Function  
Driver Type  
Power Domain  
PA00 – PA15  
PB00 – PB15  
PC00 – PC15  
PD00 – PD15  
PE00 – PE15  
Port A 00 – Port A 15  
Port B 00 – Port B 15  
Port C 00 – Port C 15  
Port D 00 – Port D 15  
Port E 00 – Port E 15  
Port F 00 – Port F 15  
Port G 00 – Port G 15  
A
A
A
A
A
A
A
VDD_EXT  
VDD_EXT  
VDD_EXT  
VDD_EXT  
VDD_EXT  
VDD_EXT  
VDD_EXT  
PF00 – PF15  
PG00 – PG15  
Dynamic Memory Controller  
DMC0_A00 – DMC0_A13  
DMC0_BA0  
DMC0_BA1  
DMC0_BA2  
DMC0_CAS  
DMC0_CK  
DMC0_CK  
DMC0_CKE  
DMC0_CS0  
DMC0_DQ00 – DMC0_DQ15  
DMC0_LDM  
DMC0_LDQS  
DMC0_LDQS  
DMC0_ODT  
DMC0_RAS  
DMC0_UDM  
DMC0_UDQS  
DMC0_UDQS  
DMC0_WE  
DMC0 Address 0 – DMC0 Address 13  
DMC0 Bank Address Input 0  
DMC0 Bank Address Input 1  
DMC0 Bank Address Input 2  
DMC0 Column Address Strobe  
DMC0 Clock  
DMC0 Clock (complement)  
DMC0 Clock enable  
DMC0 Chip Select 0  
DMC0 Data 0 – DMC0 Data 15  
DMC0 Data Mask for Lower Byte  
DMC0 Data Strobe for Lower Byte  
DMC0 Data Strobe for Lower Byte (complement)  
DMC0 On-die termination  
DMC0 Row Address Strobe  
DMC0 Data Mask for Upper Byte  
DMC0 Data Strobe for Upper Byte  
DMC0 Data Strobe for Upper Byte (complement)  
DMC0 Write Enable  
B
B
B
B
B
C
C
B
B
B
B
C
C
B
B
B
C
C
B
VDD_DMC  
VDD_DMC  
VDD_DMC  
VDD_DMC  
VDD_DMC  
VDD_DMC  
VDD_DMC  
VDD_DMC  
VDD_DMC  
VDD_DMC  
VDD_DMC  
VDD_DMC  
VDD_DMC  
VDD_DMC  
VDD_DMC  
VDD_DMC  
VDD_DMC  
VDD_DMC  
VDD_DMC  
JTAG Test Access Port  
JTG_EMU  
JTG_TCK  
JTG_TDI  
JTG_TDO  
JTG Emulation Output  
JTG Clock  
JTG Serial Data In  
JTG Serial Data Out  
JTG Mode Select  
JTG Reset  
A
A
VDD_EXT  
VDD_EXT  
VDD_EXT  
VDD_EXT  
VDD_EXT  
VDD_EXT  
JTG_TMS  
JTG_TRST  
Static Memory Controller  
SMC0_A01  
SMC0_A02  
SMC0_AMS0  
SMC0_AOE/SMC0_NORDV  
SMC0_ARDY/SMC0_NORWT  
SMC0_ARE  
SMC0_AWE  
SMC0_BR  
SMC0_D00 – SMC0_D15  
SMC0 Address 1  
SMC0 Address 2  
SMC0 Memory Select 0  
SMC0 Output Enable/SMC0 NOR Data Valid  
SMC0 Asynchronous Ready/SMC0 NOR Wait  
SMC0 Read Enable  
SMC0 Write Enable  
SMC0 Bus Request  
SMC0 Data 0 – SMC0 Data 15  
A
A
A
A
VDD_EXT  
VDD_EXT  
VDD_EXT  
VDD_EXT  
VDD_EXT  
VDD_EXT  
VDD_EXT  
VDD_EXT  
VDD_EXT  
A
A
A
Rev. PrD  
| Page 19 of 44 | March 2012  
ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609 Preliminary Technical Data  
Table 6. Processor Signal Descriptions (Continued)  
Signal Name  
System Booting, Clocking and Control  
SYS_BMODE0  
SYS_BMODE1  
SYS_BMODE2  
SYS_CLKIN  
SYS_CLKOUT  
SYS_EXTWAKE  
SYS_FAULT  
Function  
Driver Type  
Power Domain  
SYS Boot Mode Control 0  
SYS Boot Mode Control 1  
SYS Boot Mode Control 2  
SYS Clock/Crystal Input  
SYS Processor Clock Output  
SYS External Wake Control  
SYS Fault Output  
SYS Complementary Fault Output  
SYS Non-maskable Interrupt/SYS Reset Output  
SYS Power Good Indicator  
SYS Processor Reset Control  
SYS Thermal Diode Anode  
SYS Thermal Diode Cathode  
SYS Crystal Output  
VDD_EXT  
VDD_EXT  
VDD_EXT  
VDD_EXT  
VDD_EXT  
VDD_EXT  
VDD_EXT  
VDD_EXT  
VDD_EXT  
VDD_EXT  
VDD_EXT  
VDD_THD  
VDD_THD  
VDD_EXT  
A
A
A
A
A
SYS_FAULT  
SYS_NMI/SYS_RESOUT  
SYS_PWRGD  
SYS_HWRST  
SYS_TDA  
SYS_TDK  
SYS_XTAL  
2-Wire Interface  
TWI0_SCL  
TWI0_SDA  
TWI1_SCL  
TWI1_SDA  
TWI0 Serial Clock  
TWI0 Serial Data  
TWI1 Serial Clock  
TWI1 Serial Data  
D
D
D
D
VDD_EXT  
VDD_EXT  
VDD_EXT  
VDD_EXT  
Universal Serial Bus  
USB0_CLKIN  
USB0_DM  
USB0_DP  
USB0_ID  
USB0 Clock/Crystal Input  
USB0 Data –  
USB0 Data +  
USB0 OTG ID  
USB0 VBUS Control  
USB0 Bus Voltage  
VDD_USB  
VDD_USB  
VDD_USB  
VDD_USB  
VDD_USB  
VDD_USB  
USB0_VBC  
USB0_VBUS  
PIN MULTIPLEXING  
In Table 7, the default state is shown in plain text, while the  
alternate functions are shown in italics.  
Table 7. Processor Multiplexing Scheme  
Signal Name  
Function  
Port A  
PA_00/SMC0_A03/EPPI2_D00/LP0_D0  
PA_01/SMC0_A04/EPPI2_D01/LP0_D1  
PA_02/SMC0_A05/EPPI2_D02/LP0_D2  
PA_03/SMC0_A06/EPPI2_D03/LP0_D3  
PA_04/SMC0_A07/EPPI2_D04/LP0_D4  
PA_05/SMC0_A08/EPPI2_D05/LP0_D5  
PA_06/SMC0_A09/EPPI2_D06/LP0_D6  
PA_07/SMC0_A10/EPPI2_D07/LP0_D7  
PA_08/SMC0_A11/EPPI2_D08/LP1_D0  
PA_09/SMC0_A12/EPPI2_D09/LP1_D1  
PA_10/SMC0_A14/EPPI2_D10/LP1_D2  
PA_11/SMC0_A15/EPPI2_D11/LP1_D3  
PA_12/SMC0_A17/EPPI2_D12/LP1_D4  
PA_13/SMC0_A18/EPPI2_D13/LP1_D5  
PA Position 0/SMC0 Address 3/EPPI2 Data 0/LP0 Data 0  
PA Position 1/SMC0 Address 4/EPPI2 Data 1/LP0 Data 1  
PA Position 2/SMC0 Address 5/EPPI2 Data 2/LP0 Data 2  
PA Position 3/SMC0 Address 6/EPPI2 Data 3/LP0 Data 3  
PA Position 4/SMC0 Address 7/EPPI2 Data 4/LP0 Data 4  
PA Position 5/SMC0 Address 8/EPPI2 Data 5/LP0 Data 5  
PA Position 6/SMC0 Address 9/EPPI2 Data 6/LP0 Data 6  
PA Position 7/SMC0 Address 10/EPPI2 Data 7/LP0 Data 7  
PA Position 8/SMC0 Address 11/EPPI2 Data 8/LP1 Data 0  
PA Position 9/SMC0 Address 12/EPPI2 Data 9/LP1 Data 1  
PA Position 10/SMC0 Address 14/EPPI2 Data 10/LP1 Data 2  
PA Position 11/SMC0 Address 15/EPPI2 Data 11/LP1 Data 3  
PA Position 12/SMC0 Address 17/EPPI2 Data 12/LP1 Data 4  
PA Position 13/SMC0 Address 18/EPPI2 Data 13/LP1 Data 5  
Rev. PrD  
| Page 20 of 44 | March 2012  
Preliminary Technical Data ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609  
Table 7. Processor Multiplexing Scheme (Continued)  
Signal Name  
Function  
PA_14/SMC0_A19/EPPI2_D14/LP1_D6  
PA_15/SMC0_A20/EPPI2_D15/LP1_D7  
Port B  
PA Position 14/SMC0 Address 19/EPPI2 Data 14/LP1 Data 6  
PA Position 15/SMC0 Address 20/EPPI2 Data 15/LP1 Data 7  
PB_00/SMC0_NORCLK/EPPI2_CLK/LP0_CLK  
PB_01/SMC0_AMS1/EPPI2_FS1/LP0_ACK  
PB_02/SMC0_A13/EPPI2_FS2/LP1_ACK  
PB_03/SMC0_A16/EPPI2_FS3/LP1_CLK  
PB_04/SMC0_AMS2/SMC0_ABE0/SPT0_AFS  
PB_05/SMC0_AMS3/SMC0_ABE1/SPT0_ACLK  
PB_06/SMC0_A21/SPT0_ATDV/TM0_ACLK4  
PB Position 0/SMC0 NOR Clock/EPPI2 Clock/LP0 Clock  
PB Position 1/SMC0 Memory Select 1/EPPI2 Frame Sync 1 (HSYNC)/LP0 Acknowledge  
PB Position 2/SMC0 Address 13/EPPI2 Frame Sync 2 (VSYNC)/LP1 Acknowledge  
PB Position 3/SMC0 Address 16/EPPI2 Frame Sync 3 (FIELD)/LP1 Clock  
PB Position 4/SMC0 Memory Select 2/SMC0 Byte Enable 0/SPORT0 Channel A Frame Sync  
PB Position 5/SMC0 Memory Select 3/SMC0 Byte Enable 1/SPORT0 Channel A Clock  
PB Position 6/SMC0 Address 21/SPORT0 Channel A Transmit Data Valid/  
TIMER0 Alternate Clock 4  
PB_07/SMC0_A22/EPPI2_D16/SPT0_BFS  
PB_08/SMC0_A23/EPPI2_D17/SPT0_BCLK  
PB_09/SMC0_BGH/SPT0_AD0/TM0_ACLK2  
PB_10/SMC0_A24/SPT0_BD1/TM0_ACLK0  
PB_11/SMC0_A25/SPT0_BD0/TM0_ACLK3  
PB Position 7/SMC0 Address 22/EPPI2 Data 16/SPORT0 Channel B Frame Sync  
PB Position 8/SMC0 Address 23/EPPI2 Data 17/SPORT0 Channel B Clock  
PB Position 9/SMC0 Bus Grant Hang/SPORT0 Channel A Data 0/TIMER0 Alternate Clock 2  
PB Position 10/SMC0 Address 24/SPORT0 Channel B Data 1/TIMER0 Alternate Clock 0  
PB Position 11/SMC0 Address 25/SPORT0 Channel B Data 0/TIMER0 Alternate Clock 3  
PB_12/SMC0_BG/SPT0_BTDV/SPT0_AD1/  
PB Position 12/SMC0 Bus Grant/SPORT0 Channel B Transmit Data Valid/ SPORT0 Channel A  
TM0_ACLK1  
Data 1/TIMER0 Alternate Clock 1  
PB_13/ETH0_TXEN/EPPI1_FS1/TM0_ACI6  
PB Position 13/ETH0 Transmit Enable/EPPI1 Frame Sync 1 (HSYNC)/  
TIMER0 Alternate Capture Input 6  
PB_14/ETH0_REFCLK/EPPI1_CLK  
PB_15/ETH0_PTPPPS/EPPI1_FS3  
Port C  
PB Position 14/ETH0 Reference Clock/EPPI1 Clock  
PB Position 15/ETH0 PTP Pulse-Per-Second Output/EPPI1 Frame Sync 3 (FIELD)  
PC_00/ETH0_RXD0/EPPI1_D00  
PC_01/ETH0_RXD1/EPPI1_D01  
PC_02/ETH0_TXD0/EPPI1_D02  
PC_03/ETH0_TXD1/EPPI1_D03  
PC_04/ETH0_RXERR/EPPI1_D04  
PC_05/ETH0_CRS/EPPI1_D05  
PC_06/ETH0_MDC/EPPI1_D06  
PC_07/ETH0_MDIO/EPPI1_D07  
PC_08/EPPI1_D08  
PC Position 0/ETH0 Receive Data 0/EPPI1 Data 0  
PC Position 1/ETH0 Receive Data 1/EPPI1 Data 1  
PC Position 2/ETH0 Transmit Data 0/EPPI1 Data 2  
PC Position 3/ETH0 Transmit Data 1/EPPI1 Data 3  
PC Position 4/ETH0 Receive Error/EPPI1 Data 4  
PC Position 5/ETH0 Carrier Sense/RMII Receive Data Valid/EPPI1 Data 5  
PC Position 6/ETH0 Management Channel Clock/EPPI1 Data 6  
PC Position 7/ETH0 Management Channel Serial Data/EPPI1 Data 7  
PC Position 8/EPPI1 Data 8  
PC_09/ETH1_PTPPPS/EPPI1_D09  
PC_10/EPPI1_D10  
PC Position 9/ETH1 PTP Pulse-Per-Second Output/EPPI1 Data 9  
PC Position 10/EPPI1 Data 10  
PC_11/EPPI1_D11/ETH_PTPAUXIN  
PC_12/SPI0_SEL7/EPPI1_D12  
PC_13/SPI0_SEL6/EPPI1_D13/ETH_PTPCLKIN  
PC_14/SPI1_SEL7/EPPI1_D14  
PC_15/SPI0_SEL4/EPPI1_D15  
Port D  
PC Position 11/EPPI1 Data 11/ETH PTP Auxiliary Trigger Input  
PC Position 12/SPI0 Slave Select Output 7/EPPI1 Data 12  
PC Position 13/SPI0 Slave Select Output 6/EPPI1 Data 13/ETH PTP Clock Input  
PC Position 14/SPI1 Slave Select Output 7/EPPI1 Data 14  
PC Position 15/SPI0 Slave Select Output 4/EPPI1 Data 15  
PD_00/SPI0_D2/EPPI1_D16/SPI0_SEL3  
PD_01/SPI0_D3/EPPI1_D17/SPI0_SEL2  
PD_02/SPI0_MISO  
PD Position 0/SPI0 Data 2/EPPI1 Data 16/SPI0 Slave Select Output 3  
PD Position 1/SPI0 Data 3/EPPI1 Data 17/SPI0 Slave Select Output 2  
PD Position 2/SPI0 Master In, Slave Out  
PD_03/SPI0_MOSI  
PD Position 3/SPI0 Master Out, Slave In  
PD_04/SPI0_CLK  
PD Position 4/SPI0 Clock  
PD_05/SPI1_CLK/TM0_ACLK7  
PD_06/ETH0_PHYINT/EPPI1_FS2/TM0_ACI5  
PD Position 5/SPI1 Clock/TIMER0 Alternate Clock 7  
PD Position 6/ETH0 RMII Management Data Interrupt/EPPI1 Frame Sync 2 (VSYNC)/  
TIMER0 Alternate Capture Input 5  
PD_07/UART0_TX/TM0_ACI3  
PD Position 7/UART0 Transmit/TIMER0 Alternate Capture Input 3  
Rev. PrD  
| Page 21 of 44 | March 2012  
ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609 Preliminary Technical Data  
Table 7. Processor Multiplexing Scheme (Continued)  
Signal Name  
Function  
PD_08/UART0_RX/TM0_ACI0  
PD_09/SPI0_SEL5/UART0_RTS/SPI1_SEL4  
PD_10/SPI0_RDY/UART0_CTS/SPI1_SEL3  
PD_11/SPI0_SEL1/SPI0_SS  
PD Position 8/UART0 Receive/TIMER0 Alternate Capture Input 0  
PD Position 9/SPI0 Slave Select Output 5/UART0 Request to Send/SPI1 Slave Select Output 4  
PD Position 10/SPI0 Ready/UART0 Clear to Send/SPI1 Slave Select Output 3  
PD Position 11/SPI0 Slave Select Output 1/SPI0 Slave Select Input  
PD_12/SPI1_SEL1/EPPI0_D20/SPT1_AD1/  
PD Position 12/SPI1 Slave Select Output 1/EPPI0 Data 20/SPORT1 Channel A Data 1/  
SPI1_SS  
SPI1 Slave Select Input  
PD_13/SPI1_MOSI/TM0_ACLK5  
PD_14/SPI1_MISO/TM0_ACLK6  
PD_15/SPI1_SEL2/EPPI0_D21/SPT1_AD0  
Port E  
PD Position 13/SPI1 Master Out, Slave In/TIMER0 Alternate Clock 5  
PD Position 14/SPI1 Master In, Slave Out/TIMER0 Alternate Clock 6  
PD Position 15/SPI1 Slave Select Output 2/EPPI0 Data 21/SPORT1 Channel A Data 0  
PE_00/SPI1_D3/EPPI0_D18/SPT1_BD1  
PE_01/SPI1_D2/EPPI0_D19/SPT1_BD0  
PE_02/SPI1_RDY/EPPI0_D22/SPT1_ACLK  
PE_03/EPPI0_D16/ACM0_FS/SPT1_BFS  
PE_04/EPPI0_D17/ACM0_CLK/SPT1_BCLK  
PE_05/EPPI0_D23/SPT1_AFS  
PE Position 0/SPI1 Data 3/EPPI0 Data 18/SPORT1 Channel B Data 1  
PE Position 1/SPI1 Data 2/EPPI0 Data 19/SPORT1 Channel B Data 0  
PE Position 2/SPI1 Ready/EPPI0 Data 22/SPORT1 Channel A Clock  
PE Position 3/EPPI0 Data 16/ACM0 Frame Sync/SPORT1 Channel B Frame Sync  
PE Position 4/EPPI0 Data 17/ACM0 Clock/SPORT1 Channel B Clock  
PE Position 5/EPPI0 Data 23/SPORT1 Channel A Frame Sync  
PE_06/SPT1_ATDV/EPPI0_FS3/LP3_CLK  
PE_07/SPT1_BTDV/EPPI0_FS2/LP3_ACK  
PE Position 6/SPORT1 Channel A Transmit Data Valid/EPPI0 Frame Sync 3 (FIELD)/LP3 Clock  
PE Position 7/SPORT1 Channel B Transmit Data Valid/  
EPPI0 Frame Sync 2 (VSYNC)/LP3 Acknowledge  
PE_08/PWM0_SYNC/EPPI0_FS1/LP2_ACK/  
PE Position 8/PWM0 Sync/EPPI0 Frame Sync 1 (HSYNC)/LP2 Acknowledge/  
ACM0_T0  
ACM0 External Trigger 0  
PE_09/EPPI0_CLK/LP2_CLK/PWM0_TRIP0  
PE_10/ETH1_MDC/PWM1_DL/RSI0_D6  
PE_11/ETH1_MDIO/PWM1_DH/RSI0_D7  
PE_12/ETH1_PHYINT/PWM1_CL/RSI0_D5  
PE_13/ETH1_CRS/PWM1_CH/RSI0_D4  
PE Position 9/EPPI0 Clock/LP2 Clock/PWM0 Shutdown Input 0  
PE Position 10/ETH1 Management Channel Clock/PWM1 Channel D Low Side/RSI0 Data 6  
PE Position 11/ETH1 Management Channel Serial Data/PWM1 Channel D High Side/RSI0 Data 7  
PE Position 12/ETH1 RMII Management Data Interrupt/PWM1 Channel C Low Side/RSI0 Data 5  
PE Position 13/ETH1 Carrier Sense/RMII Receive Data Valid/PWM1 Channel C High Side/  
RSI0 Data 4  
PE_14/ETH1_RXERR/SPT2_ATDV/TM0_TMR0  
PE_15/ETH1_RXD1/PWM1_BL/RSI0_D3  
Port F  
PE Position 14/ETH1 Receive Error/SPORT2 Channel A Transmit Data Valid/ TIMER0 Timer 0  
PE Position 15/ETH1 Receive Data 1/PWM1 Channel B Low Side/RSI0 Data 3  
PF_00/PWM0_AL/EPPI0_D00/LP2_D0  
PF_01/PWM0_AH/EPPI0_D01/LP2_D1  
PF_02/PWM0_BL/EPPI0_D02/LP2_D2  
PF_03/PWM0_BH/EPPI0_D03/LP2_D3  
PF_04/PWM0_CL/EPPI0_D04/LP2_D4  
PF_05/PWM0_CH/EPPI0_D05/LP2_D5  
PF_06/PWM0_DL/EPPI0_D06/LP2_D6  
PF_07/PWM0_DH/EPPI0_D07/LP2_D7  
PF_08/SPI1_SEL5/EPPI0_D08/LP3_D0  
PF_09/SPI1_SEL6/EPPI0_D09/LP3_D1  
PF_10/ACM0_A4/EPPI0_D10/LP3_D2  
PF_11/EPPI0_D11/LP3_D3/PWM0_TRIP1  
PF_12/ACM0_A2/EPPI0_D12/LP3_D4  
PF_13/ACM0_A3/EPPI0_D13/LP3_D5  
PF_14/ACM0_A0/EPPI0_D14/LP3_D6  
PF_15/ACM0_A1/EPPI0_D15/LP3_D7  
Port G  
PF Position 0/PWM0 Channel A Low Side/EPPI0 Data 0/LP2 Data 0  
PF Position 1/PWM0 Channel A High Side/EPPI0 Data 1/LP2 Data 1  
PF Position 2/PWM0 Channel B Low Side/EPPI0 Data 2/LP2 Data 2  
PF Position 3/PWM0 Channel B High Side/EPPI0 Data 3/LP2 Data 3  
PF Position 4/PWM0 Channel C Low Side/EPPI0 Data 4/LP2 Data 4  
PF Position 5/PWM0 Channel C High Side/EPPI0 Data 5/LP2 Data 5  
PF Position 6/PWM0 Channel D Low Side/EPPI0 Data 6/LP2 Data 6  
PF Position 7/PWM0 Channel D High Side/EPPI0 Data 7/LP2 Data 7  
PF Position 8/SPI1 Slave Select Output 5/EPPI0 Data 8/LP3 Data 0  
PF Position 9/SPI1 Slave Select Output 6/EPPI0 Data 9/LP3 Data 1  
PF Position 10/ACM0 Address 4/EPPI0 Data 10/LP3 Data 2  
PF Position 11/EPPI0 Data 11/LP3 Data 3/PWM0 Shutdown Input 1  
PF Position 12/ACM0 Address 2/EPPI0 Data 12/ LP3 Data 4  
PF Position 13/ACM0 Address 3/EPPI0 Data 13/ LP3 Data 5  
PF Position 14/ACM0 Address 0/EPPI0 Data 14/ LP3 Data 6  
PF Position 15/ACM0 Address 1/EPPI0 Data 15/ LP3 Data 7  
PG_00/ETH1_RXD0/PWM1_BH/RSI0_D2  
PG_01/SPT2_AFS/TM0_TMR2/CAN0_TX  
PG Position 0/ETH1 Receive Data 0/PWM1 Channel B High Side/RSI0 Data 2  
PG Position 1/SPORT2 Channel A Frame Sync/TIMER0 Timer 2/CAN0 Transmit  
Rev. PrD  
| Page 22 of 44 | March 2012  
Preliminary Technical Data ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609  
Table 7. Processor Multiplexing Scheme (Continued)  
Signal Name  
Function  
PG_02/ETH1_TXD1/PWM1_AL/RSI0_D1  
PG_03/ETH1_TXD0/PWM1_AH/RSI0_D0  
PG Position 2/ETH1 Transmit Data 1/PWM1 Channel A Low Side/RSI0 Data 1  
PG Position 3/ETH1 Transmit Data 0/PWM1 Channel A High Side/RSI0 Data 0  
PG_04/SPT2_ACLK/TM0_TMR1/CAN0_RX/  
PG Position 4/SPORT2 Channel A Clock/TIMER0 Timer 1/CAN0 Receive/  
TM0_ACI2  
TIMER0 Alternate Capture Input 2  
PG_05/ETH1_TXEN/RSI0_CMD/PWM1_SYNC/  
PG Position 5/ETH1 Transmit Enable/RSI0 Command/PWM1 Sync/  
ACM0_T1  
ACM0 External Trigger 1  
PG_06/ETH1_REFCLK/RSI0_CLK/SPT2_BTDV/  
PG Position 6/ETH1 Reference Clock/RSI0 Clock/SPORT2 Channel B Transmit Data Valid/  
PWM1_TRIP0  
PWM1 Shutdown Input 0  
PG_07/SPT2_BFS/TM0_TMR5/CNT0_ZM  
PG_08/SPT2_AD1/TM0_TMR3/PWM1_TRIP1  
PG_09/SPT2_AD0/TM0_TMR4  
PG Position 7/SPORT2 Channel B Frame Sync/ TIMER0 Timer 5/CNT0 Count Zero Marker  
PG Position 8/SPORT2 Channel A Data 1/TIMER0 Timer 3/PWM1 Shutdown Input  
PG Position 9/SPORT2 Channel A Data 0/TIMER0 Timer 4  
PG_10/UART1_RTS/SPT2_BCLK  
PG Position 10/UART1 Request to Send/SPORT2 Channel B Clock  
PG_11/SPT2_BD1/TM0_TMR6/CNT0_UD  
PG_12/SPT2_BD0/TM0_TMR7/CNT0_DG  
PG_13/UART1_CTS/TM0_CLK  
PG Position 11/SPORT2 Channel B Data 1/TIMER0 Timer 6/CNT0 Count Up and Direction  
PG Position 12/SPORT2 Channel B Data 0/TIMER0 Timer 7/CNT0 Count Down and Gate  
PG Position 13/UART1 Clear to Send/TIMER0 Clock  
PG_14/UART1_RX/SYS_IDLE1/TM0_ACI1  
PG Position 14/UART1 Receive/SYS Core 1 Idle Indicator/TIMER0 Alternate Capture Input 1  
PG_15/UART1_TX/SYS_IDLE0/SYS_SLEEP/  
PG Position 15/UART1 Transmit/SYS Core 0 Idle Indicator/SYS Processor Sleep Indicator/  
TM0_ACI4  
TIMER0 Alternate Capture Input 4  
Rev. PrD  
| Page 23 of 44 | March 2012  
ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609 Preliminary Technical Data  
PIN TERMINATION AND DRIVE CHARACTERISTICS-REQUIREMENTS  
Table 8 identifies how each signal on the chip is internally ter-  
minated and driven. In addition, external termination  
requirements are provided. In this table the following columns  
are used.  
• Internal Termination – Specifies the termination present  
when the processor is not in the reset or hibernate state.  
• Reset Drive – Specifies the active drive on the signal when  
the processor is in the reset state.  
• Hibernate Termination – Specifies the termination present  
when the processor is in the hibernate state.  
• Hibernate Drive – Specifies the active drive on the signal  
when the processor is in the hibernate state.  
• Notes – Specifies any special requirements or characteris-  
tics for the signal. If no special requirements are listed the  
signal may be left unconnected if it is not used.  
• Reset Termination – Specifies the termination present  
when the processor is in the reset state.  
Table 8. ADSP-BF60x Pad Table  
Signal Name  
Internal  
Termination Termination  
Reset  
Reset Drive Hibernate Hibernate Notes  
Termination Drive  
DMC0_A00  
DMC0_A01  
DMC0_A02  
DMC0_A03  
DMC0_A04  
DMC0_A05  
DMC0_A06  
DMC0_A07  
DMC0_A08  
DMC0_A09  
DMC0_A10  
DMC0_A11  
DMC0_A12  
DMC0_A13  
DMC0_BA0  
DMC0_BA1  
DMC0_BA2  
DMC0_CAS  
DMC0_CK  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
Low  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
Low  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
For LPDDR leave unconnected.  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
DMC0_CK  
Low  
Low  
DMC0_CKE  
DMC0_CS0  
DMC0_DQ00  
DMC0_DQ01  
DMC0_DQ02  
DMC0_DQ03  
DMC0_DQ04  
DMC0_DQ05  
DMC0_DQ06  
DMC0_DQ07  
DMC0_DQ08  
DMC0_DQ09  
DMC0_DQ10  
DMC0_DQ11  
Low  
Low  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
Rev. PrD  
|
Page 24 of 44  
|
March 2012  
Preliminary Technical Data ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609  
Table 8. ADSP-BF60x Pad Table (Continued)  
Signal Name  
Internal  
Termination Termination  
Reset  
Reset Drive Hibernate Hibernate Notes  
Termination Drive  
DMC0_DQ12  
DMC0_DQ13  
DMC0_DQ14  
DMC0_DQ15  
DMC0_LDM  
DMC0_LDQS  
DMC0_LDQS  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
No notes  
No notes  
No notes  
No notes  
No notes  
For LPDDR a 100k pull-down is required.  
For single ended DDR2 connect to  
VREF_DMC. For LPDDR leave unconnected.  
DMC0_ODT  
DMC0_RAS  
DMC0_UDM  
DMC0_UDQS  
DMC0_UDQS  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
For LPDDR leave unconnected.  
No notes  
No notes  
For LPDDR a 100k pull-down is required.  
For single ended DDR2 connect to  
VREF_DMC. For LPDDR leave unconnected.  
DMC0_WE  
GND  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
No notes  
None  
No notes  
JTG_EMU  
JTG_TCK  
JTG_TDI  
JTG_TDO  
None  
No notes  
Pull-down  
Pull-up  
None  
Functional during reset.  
Functional during reset.  
Functional during reset, three-state when  
JTG_TRST is asserted.  
JTG_TMS  
JTG_TRST  
PA00  
PA01  
PA02  
PA03  
PA04  
PA05  
PA06  
PA07  
PA08  
PA09  
PA10  
PA11  
PA12  
PA13  
PA14  
PA15  
PB00  
PB01  
PB02  
PB03  
PB04  
PB05  
PB06  
Pull-up  
None  
None  
None  
None  
None  
None  
None  
None  
Functional during reset.  
Functional during reset.  
No notes  
Pull-down  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
Rev. PrD  
| Page 25 of 44 | March 2012  
ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609 Preliminary Technical Data  
Table 8. ADSP-BF60x Pad Table (Continued)  
Signal Name  
Internal  
Termination Termination  
Reset  
Reset Drive Hibernate Hibernate Notes  
Termination Drive  
PB07  
PB08  
PB09  
PB10  
PB11  
PB12  
PB13  
PB14  
PB15  
PC00  
PC01  
PC02  
PC03  
PC04  
PC05  
PC06  
PC07  
PC08  
PC09  
PC10  
PC11  
PC12  
PC13  
PC14  
PC15  
PD00  
PD01  
PD02  
PD03  
PD04  
PD05  
PD06  
PD07  
PD08  
PD09  
PD10  
PD11  
PD12  
PD13  
PD14  
PD15  
PE00  
PE01  
PE02  
PE03  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
Rev. PrD  
| Page 26 of 44 | March 2012  
Preliminary Technical Data ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609  
Table 8. ADSP-BF60x Pad Table (Continued)  
Signal Name  
Internal  
Termination Termination  
Reset  
Reset Drive Hibernate Hibernate Notes  
Termination Drive  
PE04  
PE05  
PE06  
PE07  
PE08  
PE09  
PE10  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
Has an optional internal pull-up for use with  
RSI. See the RSI chapter in the HRM for more  
details.  
PE11  
PE12  
PE13  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Has an optional internal pull-up for use with  
RSI. See the RSI chapter in the HRM for more  
details.  
Has an optional internal pull-up for use with  
RSI. See the RSI chapter in the HRM for more  
details.  
Has an optional internal pull-up for use with  
RSI. See the RSI chapter in the HRM for more  
details.  
PE14  
PE15  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
No notes  
Has an optional internal pull-up for use with  
RSI. See the RSI chapter in the HRM for more  
details.  
PF00  
PF01  
PF02  
PF03  
PF04  
PF05  
PF06  
PF07  
PF08  
PF09  
PF10  
PF11  
PF12  
PF13  
PF14  
PF15  
PG00  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
Has an optional internal pull-up for use with  
RSI. See the RSI chapter in the HRM for more  
details.  
PG01  
PG02  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
No notes  
Has an optional internal pull-up for use with  
RSI. See the RSI chapter in the HRM for more  
details.  
PG03  
Weak Keeper Weak Keeper None  
Weak Keeper None  
Has an optional internal pull-up for use with  
RSI. See the RSI chapter in the HRM for more  
details.  
Rev. PrD  
| Page 27 of 44 | March 2012  
ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609 Preliminary Technical Data  
Table 8. ADSP-BF60x Pad Table (Continued)  
Signal Name  
Internal  
Termination Termination  
Reset  
Reset Drive Hibernate Hibernate Notes  
Termination Drive  
PG04  
PG05  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
No notes  
Has an optional internal pull-up for use with  
RSI. See the RSI chapter in the HRM for more  
details.  
PG06  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
No notes  
PG07  
No notes  
PG08  
No notes  
PG09  
No notes  
PG10  
No notes  
PG11  
No notes  
PG12  
No notes  
PG13  
No notes  
PG14  
No notes  
PG15  
No notes  
SMC0_A01  
SMC0_A02  
SMC0_AMS0  
No notes  
No notes  
Pull-up  
Pull-up  
None  
Pull-up  
None  
No notes  
SMC0_AOE_NORDV Weak Keeper Weak Keeper None  
Weak Keeper None  
No notes  
SMC0_ARDY_NORWT None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
Requires an external pull-up.  
No notes  
SMC0_ARE  
SMC0_AWE  
SMC0_BR  
Pull-up  
Pull-up  
None  
Pull-up  
Pull-up  
None  
Pull-up  
Pull-up  
None  
No notes  
Requires an external pull-up.  
No notes  
SMC0_D00  
SMC0_D01  
SMC0_D02  
SMC0_D03  
SMC0_D04  
SMC0_D05  
SMC0_D06  
SMC0_D07  
SMC0_D08  
SMC0_D09  
SMC0_D10  
SMC0_D11  
SMC0_D12  
SMC0_D13  
SMC0_D14  
SMC0_D15  
SYS_BMODE0  
SYS_BMODE1  
SYS_BMODE2  
SYS_CLKIN  
SYS_CLKOUT  
SYS_EXTWAKE  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
Weak Keeper None  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
No notes  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
Low  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
Low  
No notes  
No notes  
No notes  
Active during reset.  
No notes  
High  
Drives low during hibernate and high all  
other times.  
Rev. PrD  
|
Page 28 of 44  
|
March 2012  
Preliminary Technical Data ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609  
Table 8. ADSP-BF60x Pad Table (Continued)  
Signal Name  
Internal  
Termination Termination  
Reset  
Reset Drive Hibernate Hibernate Notes  
Termination Drive  
SYS_FAULT  
None  
None  
None  
None  
None  
Open source, requires an external pull-  
down.  
SYS_FAULT  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
Low  
None  
None  
None  
None  
None  
None  
None  
None  
Open drain, requires an external pull-up.  
Active during reset.  
SYS_HWRST  
SYS_NMI_RESOUT  
SYS_PWRGD  
Requires an external pull-up.  
None  
If hibernate isn't used or the internal Power  
Good Counter is used connect to VDD_EXT.  
SYS_TDA  
SYS_TDK  
SYS_XTAL  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
Active during reset and hibernate. If the  
thermal diode is not used connect to  
ground.  
Active during reset and hibernate. If the  
thermal diode is not used connect to  
ground.  
Leave unconnected if an oscillator is used to  
provide SYS_CLKIN. Active during reset.  
State during hibernate is controlled by  
DPM_HIB_DIS.  
TWI0_SCL  
TWI0_SDA  
TWI1_SCL  
TWI1_SDA  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
Open drain, requires external pull up.  
Consult version 2.1 of the I2C specification  
for the proper resistor value. If TWI is not  
used connect to ground.  
Open drain, requires external pull up.  
Consult version 2.1 of the I2C specification  
for the proper resistor value. If TWI is not  
used connect to ground.  
Open drain, requires external pull up.  
Consult version 2.1 of the I2C specification  
for the proper resistor value. If TWI is not  
used connect to ground.  
Open drain, requires external pull up.  
Consult version 2.1 of the I2C specification  
for the proper resistor value. If TWI is not  
used connect to ground.  
USB0_CLKIN  
USB0_DM  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
If USB is not used connect to ground. Active  
during reset.  
Pull low if not using USB. For complete  
documentation of hibernate behavior when  
USB is used see the USB chapter in the HRM.  
USB0_DP  
USB0_ID  
None  
None  
None  
None  
None  
None  
None  
None  
None  
Pull low if not using USB. For complete  
documentation of hibernate behavior when  
USB is used see the USB chapter in the HRM.  
Pull-up  
If USB is not used connect to ground. When  
USB is being used the internal pull-up that is  
present during hibernate is programmable.  
See the USB chapter in the HRM. Active  
during reset.  
USB0_VBC  
USB0_VBUS  
VDD_DMC  
VDD_EXT  
VDD_INT  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
If USB is not used pull low.  
If USB is not used connect to ground.  
If the DMC is not used connect to VDD_INT.  
Must be powered.  
Must be powered.  
Rev. PrD  
|
Page 29 of 44  
|
March 2012  
ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609 Preliminary Technical Data  
Table 8. ADSP-BF60x Pad Table (Continued)  
Signal Name  
Internal  
Termination Termination  
Reset  
Reset Drive Hibernate Hibernate Notes  
Termination Drive  
VDD_TD  
None  
None  
None  
None  
None  
If the thermal diode is not used connect to  
ground.  
VDD_USB  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
If USB is not used connect to VDD_EXT.  
VREF_DMC  
If the DMC is not used connect to VDD_INT.  
Rev. PrD  
|
Page 30 of 44  
|
March 2012  
Preliminary Technical Data ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609  
SPECIFICATIONS  
For information about product specifications please contact  
your ADI representative.  
OPERATING CONDITIONS  
Parameter  
Conditions  
TBD MHz  
Min  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
–40  
–40  
Nominal  
TBD  
1.8, 3.3  
1.8  
Max  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
105  
Unit  
V
1
VDD_INT  
Internal Supply Voltage  
External Supply Voltage  
DDR2/LPDDR Supply Voltage  
USB Supply Voltage  
2
VDD_EXT  
V
VDD_DMC  
V
3
VDD_USB  
3.3  
V
VDD_TD  
Thermal Diode Supply Voltage  
High Level Input Voltage  
High Level Input Voltage  
High Level Input Voltage  
Low Level Input Voltage  
Low Level Input Voltage  
Low Level Input Voltage  
Junction Temperature  
3.3  
V
4
VIH  
VDD_EXT = Maximum  
VDD_EXT = Maximum  
VDD_EXT = Maximum  
VDD_EXT = Maximum  
VDD_EXT = Maximum  
VDD_EXT = Maximum  
TAMBIENT = TBD°C to +TBD°C  
TAMBIENT = TBD°C to +TBD°C  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
V
4
VIH  
V
5
VIHTWI  
V
4
VIL  
V
4
VIL  
V
5
VILTWI  
V
TJ  
°C  
TJ  
Junction Temperature  
125  
°C  
1 The expected nominal value is 1.25 V 5%, and initial customer designs should design with a programmable regulator that can be adjusted from 1.1 V to 1.35 V in 50 mV steps.  
2 Must remain powered (even if the associated function is not used).  
3 If not used, connect to 1.8 V or 3.3 V.  
4 Parameter value applies to all input and bidirectional pins, except TWI_SDA and TWI_SCL.  
5 Parameter applies to TWI_SDA and TWI_SCL.  
Rev. PrD  
| Page 31 of 44 | March 2012  
ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609 Preliminary Technical Data  
Clock Related Operating Conditions  
Table 9 describes the core clock timing requirements. The data  
presented in the tables applies to all speed grades (found in  
Automotive Products on Page 43) except where expressly noted.  
Figure 8 provides a graphical representation of the various  
clocks and their available divider values.  
Table 9. Clock Operating Conditions  
Parameter  
fCCLK  
Maximum  
Unit  
MHz  
MHz  
MHz  
MHz  
MHz  
MHz  
Core Clock Frequency (CCLK ≥ SYSCLK, CSEL ≤ SYSSEL)  
SYSCLK Frequency (SYSSEL ≤ DSEL)  
SCLK0 Frequency  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
fSYSCLK  
1, 2  
fSCLK0  
1, 2  
fSCLK1  
SCLK1 Frequency  
fDCLK  
DDR2/LPDDR Clock Frequency  
Output Clock Frequency  
fOCLK  
1 tSCLK0/1 is equal to 1/fSCLK0/1  
.
2 Rounded number. Actual test specification is a period of [TBD] ns.  
Table 10. Phase-Locked Loop Operating Conditions  
Parameter  
Minimum  
Maximum  
Unit  
fPLLCLK  
PLL Clock Frequency  
TBD  
Speed Grade MHz  
CSEL  
(1 32)  
CCLK  
-
SCLK0  
(PVP, ALL OTHER  
PERIPHERALS)  
S0SEL  
(1 4)  
-
SYSCLK  
SYSSEL  
(1 32)  
-
PLLCLK  
PLL  
CLKIN  
SCLK1  
(SPORTS, SPI, ACM)  
S1SEL  
(1 4)  
-
DSEL  
(1 32)  
DCLK  
OCLK  
-
OSEL  
(1 128)  
-
Figure 8. Clock Relationships and Divider Values  
Rev. PrD  
| Page 32 of 44 | March 2012  
Preliminary Technical Data ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609  
ELECTRICAL CHARACTERISTICS  
Parameter  
Test Conditions  
Min  
TBD  
TBD  
Typical  
Max  
Unit  
VOH  
VOH  
VOL  
High Level Output Voltage  
High Level Output Voltage  
Low Level Output Voltage  
VDD_EXT = 1.7 V, IOH = –0.5 mA  
VDD_EXT = 3.13 V, IOH = –0.5 mA  
V
V
V
VDD_EXT = 1.7 V/3.13 V,  
IOL = 2.0 mA  
TBD  
1
VOLTWI  
Low Level Output Voltage  
High Level Input Current  
Low Level Input Current  
High Level Input Current JTAG  
Three-State Leakage Current  
Three-State Leakage Current  
Three-State Leakage Current  
Input Capacitance  
VDD_EXT = 1.7 V/3.13 V, IOL = 2.0 mA  
VDD_EXT =3.47 V, VIN = 3.47 V  
VDD_EXT =3.47 V, VIN = 0 V  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
V
2
IIH  
μA  
μA  
μA  
μA  
μA  
μA  
pF  
2
IIL  
3
IIHP  
VDD_EXT = 3.47 V, VIN = 3.47 V  
VDD_EXT = 3.47 V, VIN = 3.47 V  
VDD_EXT =3.13 V, VIN = 5.5 V  
VDD_EXT = 3.47 V, VIN = 0 V  
4
IOZH  
1
IOZHTWI  
4
IOZL  
5, 6  
CIN  
fIN = 1 MHz, TAMBIENT = 25°C,  
VIN = 2.5 V  
TBD  
7
IDD_DEEPSLEEP  
VDD_INT Current in Deep Sleep Mode TBD  
TBD  
TBD  
TBD  
TBD  
mA  
mA  
mA  
μA  
IDD_IDLE  
IDD_TYP  
VDD_INT Current in Idle  
VDD_INT Current  
TBD  
TBD  
TBD  
7, 8  
IDD_HIBERNATE  
IDD_DEEPSLEEP  
IDD_INT  
Hibernate State Current  
VDD_INT Current in Deep Sleep Mode TBD  
TBD  
TBD  
mA  
mA  
VDD_INT Current TBD  
1 Applies to bidirectional pins TWI_SCL and TWI_SDA.  
2 Applies to input pins.  
3 Applies to JTAG input pins (JTG_TCK, JTG_TDI, JTG_TMS, JTG_TRST).  
4 Applies to three-statable pins.  
5 Guaranteed, but not tested.  
6 Applies to all signal pins.  
7 See the ADSP-BF60x Blackfin Processor Hardware Reference Manual for definition of deep sleep and hibernate operating modes.  
8 Applies to TBD supply pins only. Clock inputs are tied high or low.  
Rev. PrD  
| Page 33 of 44 | March 2012  
ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609 Preliminary Technical Data  
Table 11. Maximum Duty Cycle for Input Transient Voltage1  
Total Power Dissipation  
Total power dissipation has two components:  
1. Static, including leakage current  
2. Dynamic, due to transistor switching characteristics  
VIN Min (V)  
TBD  
VIN Max (V)  
TBD  
Maximum Duty Cycle  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
Many operating conditions can also affect power dissipation,  
including temperature, voltage, operating frequency, and pro-  
cessor activity. Electrical Characteristics on Page 33 shows the  
current dissipation for internal circuitry (VDD_INT).  
TBD  
TBD  
TBD  
TBD  
1 Applies to all signal pins with the exception of SYS_CLKIN, SYS_XTAL,  
SYS_EXTWAKE.  
I
DD_DEEPSLEEP specifies static power dissipation as a function of  
voltage (VDD_INT) and temperature, and IDD_INT specifies the total  
power specification for the listed test conditions, including the  
dynamic component as a function of voltage (VDD_INT) and  
frequency.  
ESD SENSITIVITY  
There are two parts to the dynamic component. The first part is  
due to transistor switching in the core clock (CCLK) domain.  
This part is subject to an Activity Scaling Factor (ASF) which  
represents application code running on the processor core and  
L1 memories.  
The ASF is combined with the CCLK frequency and VDD_INT  
dependent data to calculate this part. The second part is due to  
transistor switching in the system clock (SCLK) domain, which  
is included in the IDD_INT specification equation.  
ESD (electrostatic discharge) sensitive device.  
Charged devices and circuit boards can discharge  
without detection. Although this product features  
patented or proprietary protection circuitry, damage  
may occur on devices subjected to high energy ESD.  
Therefore, proper ESD precautions should be taken to  
avoid performance degradation or loss of functionality.  
PROCESSOR — PACKAGE INFORMATION  
The information presented in Figure 9 and Table 12 provides  
details about package branding. For a complete listing of prod-  
uct availability, see Automotive Products on Page 43.  
PROCESSOR — ABSOLUTE MAXIMUM RATINGS  
Stresses greater than those listed in the table may cause perma-  
nent damage to the device. These are stress ratings only.  
Functional operation of the device at these or any other condi-  
tions greater than those indicated in the operational sections of  
this specification is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device  
reliability.  
Figure 9. Product Information on Package  
Table 12. Package Brand Information  
Parameter  
Internal Supply Voltage (VDD_INT  
Rating  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
)
Brand Key  
ADSP-BF60x  
Field Description  
Product Name1  
External (I/O) Supply Voltage (VDD_EXT  
Input Voltage1, 2  
Input Voltage1, 2, 3  
)
t
Temperature Range  
Package Type  
pp  
Output Voltage Swing  
Z
RoHS Compliant Designation  
See Ordering Guide  
Assembly Lot Code  
Silicon Revision  
Load Capacitance  
ccc  
Storage Temperature Range  
Junction Temperature Under Bias  
vvvvvv.x  
n.n  
1 Applies to 100% transient duty cycle. For other duty cycles see Table 11.  
2 Applies only when VDD_EXT is within specifications. When VDD_EXT is outside  
specifications, the range is VDD_EXT 0.2 Volts.  
yyww  
Date Code  
1 See product names in the Automotive Products on Page 43.  
3 Applies to pins TWI_SCL and TWI_SDA.  
Rev. PrD  
| Page 34 of 44 | March 2012  
Preliminary Technical Data ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609  
Values of θJC are provided for package comparison and printed  
circuit board design considerations when an external heat sink  
is required.  
In Table 13, airflow measurements comply with JEDEC stan-  
dards JESD51-2 and JESD51-6. The junction-to-case  
measurement complies with MIL-STD-883 (Method 1012.1).  
All measurements use a 2S2P JEDEC test board.  
ENVIRONMENTAL CONDITIONS  
To determine the junction temperature on the application  
printed circuit board use:  
TJ = TCASE + JT × PD)  
where:  
Thermal Diode  
TJ = Junction temperature (°C)  
The processor incorporates thermal diode/s to monitor the die  
temperature. The thermal diode is a grounded collector, PNP  
Bipolar Junction Transistor (BJT). The SYS_TDA pin is con-  
nected to the emitter and the SYS_TDK pin is connected to the  
base of the transistor. These pins can be used by an external  
temperature sensor (such as ADM 1021A or LM86 or others) to  
read the die temperature of the chip.  
T
CASE = Case temperature (°C) measured by customer at top  
center of package.  
ΨJT = From Table 13  
PD = Power dissipation (see Total Power Dissipation on Page 34  
for the method to calculate PD)  
Table 13. Thermal Characteristics  
The technique used by the external temperature sensor is to  
measure the change in VBE when the thermal diode is operated  
at two different currents. This is shown in the following  
equation:  
Parameter Condition  
Typical Unit  
θJA  
0 linear m/s air flow  
16.7  
14.6  
13.9  
4.41  
0.11  
0.24  
0.25  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
θJMA  
θJMA  
θJC  
1 linear m/s air flow  
2 linear m/s air flow  
kT  
ΔVBE= n × ----- × In(N)  
q
ΨJT  
ΨJT  
ΨJT  
0 linear m/s air flow  
1 linear m/s air flow  
2 linear m/s air flow  
where:  
n = multiplication factor close to 1, depending on process  
variations  
k = Boltzmann’s constant  
T = temperature (°C)  
q = charge of the electron  
N = ratio of the two currents  
The two currents are usually in the range of 10 micro Amperes  
to 300 micro Amperes for the common temperature sensor  
chips available.  
Values of θJA are provided for package comparison and printed  
circuit board design considerations. θJA can be used for a first  
order approximation of TJ by the equation:  
TJ = TA + JA × PD)  
where:  
TA = Ambient temperature (°C)  
Table 14 contains the thermal diode specifications using the  
transistor model. Note that Measured Ideality Factor already  
takes into effect variations in beta (Β).  
Table 14. Thermal Diode Parameters – Transistor Model  
Symbol  
IFW  
Parameter  
Min  
TBD  
TBD  
TBD  
TBD  
Typ  
Max  
TBD  
TBD  
TBD  
TBD  
Unit  
μA  
μA  
1
Forward Bias Current  
Emitter Current  
Transistor Ideality  
Series Resistance  
IE  
2, 3  
nQ  
TBD  
TBD  
3, 4  
RT  
Ω
1 Analog Devices does not recommend operation of the thermal diode under reverse bias.  
2 Not 100% tested. Specified by design characterization.  
3 The ideality factor, nQ, represents the deviation from ideal diode behavior as exemplified by the diode equation: IC = IS × (e qVBE/nqkT –1), where IS = saturation current,  
q = electronic charge, VBE = voltage across the diode, k = Boltzmann Constant, and T = absolute temperature (Kelvin).  
4 The series resistance (RT) can be used for more accurate readings as needed.  
Rev. PrD  
| Page 35 of 44 | March 2012  
ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609 Preliminary Technical Data  
349-BALL CSP_BGA BALL ASSIGNMENTS  
Table 15 lists the CSP_BGA package by ball number for the  
ADSP-BF609. Table 16 lists the CSP_BGA package by signal.  
Table 15. 349-Ball CSP_BGA Ball Assignment (Numerical by Ball Number)  
Ball No.  
A01  
Signal Name  
GND  
Ball No.  
AA19  
AA20  
AA21  
AA22  
AB01  
AB02  
AB03  
AB04  
AB05  
AB06  
AB07  
AB08  
AB09  
AB10  
AB11  
AB12  
AB13  
AB14  
AB15  
AB16  
AB17  
AB18  
AB19  
AB20  
AB21  
AB22  
B01  
Signal Name  
PG_07  
PG_13  
GND  
Ball No.  
B15  
B16  
B17  
B18  
B19  
B20  
B21  
B22  
C01  
C02  
C03  
C04  
C05  
C06  
C07  
C08  
C09  
C10  
C11  
C12  
C13  
C14  
C15  
C16  
C17  
C18  
C19  
C20  
C21  
C22  
D01  
D02  
D03  
D11  
D12  
D20  
D21  
D22  
E01  
E02  
Signal Name  
SMC0_D01  
SMC0_D15  
SMC0_D09  
SMC0_D02  
SMC0_D13  
SMC0_D05  
GND  
Ball No.  
E03  
E05  
E20  
E21  
E22  
F01  
F02  
F03  
F06  
F07  
F08  
F09  
F10  
F11  
F12  
F13  
F14  
F15  
F16  
F17  
F20  
F21  
F22  
G01  
G02  
G03  
G06  
G07  
G08  
G09  
G10  
G11  
G12  
G13  
G14  
G15  
G16  
G17  
G20  
G21  
Signal Name  
JTG_TMS  
VDD_USB  
A02  
USB0_DM  
USB0_DP  
PB_10  
A03  
DMC0_CAS  
DMC0_DQ10  
DMC0_DQ13  
SYS_FAULT  
SYS_FAULT  
SYS_NMI_RESOUT  
VDD_EXT  
A04  
GND  
A05  
PB_07  
GND  
A06  
PA_14  
PD_05  
PD_14  
PE_01  
PE_04  
PF_15  
PF_13  
PF_11  
PF_09  
PF_07  
PF_05  
PF_03  
PF_01  
PE_13  
PG_03  
PG_06  
PG_02  
PG_12  
PG_14  
PG_15  
PG_10  
GND  
A07  
PA_12  
A08  
PA_10  
SMC0_AOE_NORDV  
USB0_CLKIN  
USB0_VBC  
GND  
A09  
PA_08  
A10  
PA_06  
VDD_INT  
A11  
PA_04  
VDD_INT  
A12  
PA_02  
PB_12  
VDD_INT  
A13  
PA_00  
PB_09  
VDD_INT  
A14  
SMC0_A01  
SMC0_D00  
SMC0_AMS0  
SMC0_D03  
SMC0_D04  
SMC0_D07  
SMC0_D10  
SMC0_AWE  
GND  
PB_06  
VDD_EXT  
A15  
PB_05  
VDD_EXT  
A16  
PB_04  
VDD_INT  
A17  
PB_03  
VDD_INT  
A18  
PB_02  
VDD_INT  
A19  
PB_01  
VDD_INT  
A20  
PB_00  
VDD_DMC  
A21  
SMC0_BR  
SMC0_D06  
SMC0_D12  
SMC0_ARE  
SMC0_D08  
SMC0_D11  
SMC0_D14  
GND  
DMC0_CS0  
DMC0_DQ15  
DMC0_DQ08  
GND  
A22  
AA01  
AA02  
AA03  
AA04  
AA05  
AA06  
AA07  
AA08  
AA09  
AA10  
AA11  
AA12  
AA13  
AA14  
AA15  
AA16  
AA17  
AA18  
PD_11  
GND  
PD_13  
SYS_HWRST  
SYS_BMODE2  
VDD_EXT  
PE_00  
PE_03  
USB0_VBUS  
GND  
PF_14  
B02  
VDD_EXT  
PF_12  
B03  
USB0_ID  
PB_11  
PB_08  
PA_15  
PA_13  
PA_11  
PA_09  
PA_07  
PA_05  
PA_03  
PA_01  
SMC0_A02  
TWI1_SCL  
TWI0_SCL  
JTG_TDI  
VDD_INT  
PF_10  
B04  
VDD_INT  
PF_08  
B05  
VDD_EXT  
PF_06  
B06  
JTG_TDO  
JTG_TCK  
VDD_EXT  
VDD_EXT  
PF_04  
B07  
VDD_EXT  
PF_02  
B08  
VDD_EXT  
PF_00  
B09  
GND  
VDD_INT  
PG_00  
B10  
SMC0_ARDY_NORWT  
TWI1_SDA  
TWI0_SDA  
JTG_TRST  
JTG_EMU  
VDD_INT  
PE_15  
B11  
VDD_DMC  
PE_14  
B12  
VDD_DMC  
PG_05  
B13  
DMC0_UDM  
DMC0_UDQS  
PG_08  
B14  
Rev. PrD  
|
Page 36 of 44  
|
March 2012  
Preliminary Technical Data ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609  
Table 15. 349-Ball CSP_BGA Ball Assignment (Numerical by Ball Number)  
Ball No.  
G22  
H01  
H02  
H03  
H06  
H07  
H16  
H17  
H20  
H21  
H22  
J01  
Signal Name  
DMC0_UDQS  
SYS_CLKIN  
SYS_XTAL  
SYS_BMODE1  
VDD_EXT  
Ball No.  
L06  
Signal Name  
VDD_EXT  
GND  
Ball No.  
N20  
N21  
N22  
P01  
P02  
P03  
P06  
P09  
P10  
P11  
P12  
P13  
P14  
P17  
P20  
P21  
P22  
R01  
R02  
R03  
R06  
R07  
R16  
R17  
R20  
R21  
R22  
T01  
T02  
T03  
T06  
T07  
T08  
T09  
T10  
T11  
T12  
T13  
T14  
T15  
T16  
T17  
T20  
T21  
T22  
Signal Name  
DMC0_WE  
DMC0_DQ04  
DMC0_DQ03  
PC_08  
Ball No.  
U01  
U02  
U03  
U06  
U07  
U08  
U09  
U10  
U11  
U12  
U13  
U14  
U15  
U16  
U17  
U20  
U21  
U22  
V01  
V02  
V03  
V20  
V21  
V22  
W01  
W02  
W03  
W11  
W12  
W20  
W21  
W22  
Y01  
Y02  
Y03  
Y04  
Y05  
Y06  
Y07  
Y08  
Y09  
Y10  
Y11  
Y12  
Y13  
Signal Name  
PC_14  
L08  
PC_13  
L09  
GND  
PD_09  
L10  
GND  
VDD_EXT  
L11  
GND  
PC_07  
VDD_INT  
VDD_EXT  
L12  
GND  
PD_06  
VDD_INT  
VDD_DMC  
L13  
GND  
VDD_EXT  
VDD_INT  
VDD_DMC  
L14  
GND  
GND  
VDD_INT  
DMC0_RAS  
DMC0_DQ09  
DMC0_DQ14  
GND  
L15  
GND  
GND  
VDD_EXT  
L17  
VDD_DMC  
VREF_DMC  
DMC0_CK  
DMC0_DQ06  
DMC0_DQ07  
PC_04  
PC_03  
PB_15  
GND  
GND  
VDD_EXT  
L19  
GND  
VDD_INT  
L20  
GND  
VDD_INT  
J02  
SYS_PWRGD  
SYS_BMODE0  
VDD_EXT  
L21  
GND  
VDD_INT  
J03  
L22  
VDD_DMC  
DMC0_CKE  
DMC0_DQ02  
DMC0_DQ05  
PC_10  
VDD_INT  
J06  
M01  
M02  
M03  
M04  
M06  
M08  
M09  
M10  
M11  
M12  
M13  
M14  
VDD_DMC  
DMC0_A09  
DMC0_A05  
DMC0_A01  
PD_00  
J09  
GND  
J10  
GND  
J11  
GND  
J12  
GND  
VDD_EXT  
GND  
PC_09  
J13  
GND  
PD_07  
PC_15  
J14  
GND  
GND  
VDD_EXT  
PD_10  
J17  
VDD_DMC  
GND  
VDD_EXT  
DMC0_BA1  
DMC0_A13  
DMC0_A11  
PD_04  
J20  
DMC0_ODT  
DMC0_DQ12  
DMC0_DQ11  
PC_00  
GND  
VDD_DMC  
VDD_DMC  
DMC0_BA2  
DMC0_BA0  
DMC0_A10  
PC_12  
J21  
GND  
J22  
GND  
K01  
K02  
K03  
K06  
K08  
K09  
K10  
K11  
K12  
K13  
K14  
K15  
K17  
K20  
K21  
K22  
L01  
L02  
L03  
L04  
GND  
PD_01  
SYS_EXTWAKE M15  
GND  
PD_12  
PB_13  
VDD_EXT  
GND  
M17  
M19  
M20  
M21  
M22  
N01  
N02  
N03  
N06  
N08  
N09  
N10  
N11  
N12  
N13  
N14  
N15  
N17  
VDD_DMC  
GND  
GND  
PC_11  
VDD_TD  
DMC0_CK  
DMC0_DQ00  
DMC0_DQ01  
PC_06  
PC_05  
SYS_CLKOUT  
VDD_EXT  
GND  
PD_08  
DMC0_A04  
DMC0_A06  
DMC0_A08  
PD_03  
GND  
VDD_EXT  
GND  
VDD_EXT  
GND  
VDD_INT  
GND  
VDD_INT  
PD_02  
GND  
VDD_EXT  
GND  
GND  
VDD_EXT  
PD_15  
GND  
VDD_EXT  
PE_02  
VDD_DMC  
DMC0_LDM  
DMC0_LDQS  
DMC0_LDQS  
PC_02  
PC_01  
PB_14  
VDD_EXT  
GND  
VDD_EXT  
PE_05  
GND  
VDD_INT  
PE_06  
GND  
VDD_INT  
PE_07  
GND  
VDD_DMC  
VDD_DMC  
DMC0_A03  
DMC0_A07  
DMC0_A12  
PE_08  
GND  
PE_09  
GND  
SYS_TDK  
SYS_TDA  
PE_12  
GND  
VDD_DMC  
Rev. PrD  
|
Page 37 of 44  
|
March 2012  
ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609 Preliminary Technical Data  
Table 15. 349-Ball CSP_BGA Ball Assignment (Numerical by Ball Number)  
Ball No.  
Y14  
Signal Name  
PE_10  
Ball No.  
Y19  
Signal Name  
PG_11  
Ball No.  
Signal Name  
Ball No.  
Signal Name  
Y15  
PE_11  
Y20  
GND  
Y16  
PG_09  
Y21  
DMC0_A00  
DMC0_A02  
Y17  
PG_01  
Y22  
Y18  
PG_04  
Rev. PrD  
|
Page 38 of 44  
|
March 2012  
Preliminary Technical Data ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609  
Table 16. 349-Ball CSP_BGA Ball Assignment (Alphabetical by Signal Name)  
Signal Name  
DMC0_A00  
DMC0_A01  
DMC0_A02  
DMC0_A03  
DMC0_A04  
DMC0_A05  
DMC0_A06  
DMC0_A07  
DMC0_A08  
DMC0_A09  
DMC0_A10  
DMC0_A11  
DMC0_A12  
DMC0_A13  
DMC0_BA0  
DMC0_BA1  
DMC0_BA2  
DMC0_CAS  
DMC0_CK  
Ball No.  
Y21  
U22  
Y22  
T20  
W20  
U21  
W21  
T21  
W22  
U20  
R22  
V22  
T22  
V21  
R21  
V20  
R20  
E20  
M20  
P20  
L20  
F20  
M21  
M22  
P21  
N22  
N21  
P22  
L21  
L22  
F22  
H21  
E21  
J22  
Signal Name  
DMC0_UDQS  
DMC0_WE  
GND  
Ball No.  
G22  
N20  
A01  
A22  
AA02  
AA21  
AA22  
AB01  
AB22  
B21  
C20  
D12  
G01  
J01  
Signal Name  
GND  
Ball No.  
M19  
N08  
N09  
N10  
N11  
N12  
N13  
N14  
N15  
P09  
P10  
P11  
P12  
P13  
P14  
W11  
Y03  
Y20  
C03  
B02  
E02  
D03  
D01  
D02  
E03  
E01  
A13  
B13  
A12  
B12  
A11  
B11  
A10  
B10  
A09  
B09  
A08  
B08  
A07  
B07  
A06  
B06  
C12  
C11  
C10  
Signal Name  
PB_03  
PB_04  
PB_05  
PB_06  
PB_07  
PB_08  
PB_09  
PB_10  
PB_11  
PB_12  
PB_13  
PB_14  
PB_15  
PC_00  
PC_01  
PC_02  
PC_03  
PC_04  
PC_05  
PC_06  
PC_07  
PC_08  
PC_09  
PC_10  
PC_11  
PC_12  
PC_13  
PC_14  
PC_15  
PD_00  
PD_01  
PD_02  
PD_03  
PD_04  
PD_05  
PD_06  
PD_07  
PD_08  
PD_09  
PD_10  
PD_11  
PD_12  
PD_13  
PD_14  
PD_15  
Ball No.  
C09  
C08  
C07  
C06  
A05  
B05  
C05  
A04  
B04  
C04  
K03  
L03  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
M03  
K01  
L02  
GND  
GND  
GND  
J09  
GND  
GND  
J10  
GND  
L01  
GND  
J11  
GND  
M02  
M01  
N02  
N01  
P02  
P01  
GND  
J12  
GND  
GND  
J13  
GND  
DMC0_CKE  
DMC0_CK  
GND  
J14  
GND  
GND  
K08  
K09  
K10  
K11  
K12  
K13  
K14  
K15  
L08  
JTG_EMU  
JTG_TCK  
JTG_TDI  
JTG_TDO  
JTG_TMS  
JTG_TRST  
PA_00  
PA_01  
PA_02  
PA_03  
PA_04  
PA_05  
PA_06  
PA_07  
PA_08  
PA_09  
PA_10  
PA_11  
PA_12  
PA_13  
PA_14  
PA_15  
PB_00  
PB_01  
PB_02  
DMC0_CS0  
DMC0_DQ00  
DMC0_DQ01  
DMC0_DQ02  
DMC0_DQ03  
DMC0_DQ04  
DMC0_DQ05  
DMC0_DQ06  
DMC0_DQ07  
DMC0_DQ08  
DMC0_DQ09  
DMC0_DQ10  
DMC0_DQ11  
DMC0_DQ12  
DMC0_DQ13  
DMC0_DQ14  
DMC0_DQ15  
DMC0_LDM  
DMC0_LDQS  
DMC0_LDQS  
DMC0_ODT  
DMC0_RAS  
DMC0_UDM  
DMC0_UDQS  
GND  
GND  
R02  
R01  
T02  
GND  
GND  
GND  
T01  
GND  
U02  
U01  
V02  
V01  
W02  
Y02  
Y01  
W01  
AB02  
P03  
R03  
T03  
GND  
GND  
GND  
L09  
GND  
L10  
GND  
L11  
GND  
L12  
GND  
L13  
J21  
GND  
L14  
E22  
H22  
F21  
K20  
K22  
K21  
J20  
GND  
L15  
GND  
M04  
M08  
M09  
M10  
M11  
M12  
M13  
M14  
M15  
GND  
GND  
U03  
V03  
AA01  
W03  
AA03  
AB03  
Y04  
GND  
GND  
GND  
H20  
G20  
G21  
GND  
GND  
GND  
Rev. PrD  
| Page 39 of 44 | March 2012  
ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609 Preliminary Technical Data  
Table 16. 349-Ball CSP_BGA Ball Assignment (Alphabetical by Signal Name)  
Signal Name  
PE_00  
PE_01  
PE_02  
PE_03  
PE_04  
PE_05  
PE_06  
PE_07  
PE_08  
PE_09  
PE_10  
PE_11  
PE_12  
PE_13  
PE_14  
PE_15  
PF_00  
PF_01  
PF_02  
PF_03  
PF_04  
PF_05  
PF_06  
PF_07  
PF_08  
PF_09  
PF_10  
PF_11  
PF_12  
PF_13  
PF_14  
PF_15  
PG_00  
PG_01  
PG_02  
PG_03  
PG_04  
PG_05  
PG_06  
PG_07  
PG_08  
PG_09  
PG_10  
PG_11  
PG_12  
Ball No.  
AA04  
AB04  
Y05  
Signal Name  
PG_13  
Ball No.  
AA20  
AB19  
AB20  
A14  
Signal Name  
USB0_CLKIN  
USB0_DM  
USB0_DP  
USB0_ID  
USB0_VBC  
USB0_VBUS  
VDD_DMC  
VDD_DMC  
VDD_DMC  
VDD_DMC  
VDD_DMC  
VDD_DMC  
VDD_DMC  
VDD_DMC  
VDD_DMC  
VDD_DMC  
VDD_DMC  
VDD_DMC  
VDD_DMC  
VDD_DMC  
VDD_DMC  
VDD_DMC  
VDD_EXT  
Ball No.  
C01  
A02  
A03  
B03  
C02  
B01  
F17  
G16  
G17  
H16  
H17  
J17  
Signal Name  
VDD_EXT  
VDD_EXT  
VDD_EXT  
VDD_EXT  
VDD_EXT  
VDD_EXT  
VDD_EXT  
VDD_INT  
VDD_INT  
VDD_INT  
VDD_INT  
VDD_INT  
VDD_INT  
VDD_INT  
VDD_INT  
VDD_INT  
VDD_INT  
VDD_INT  
VDD_INT  
VDD_INT  
VDD_INT  
VDD_INT  
VDD_INT  
VDD_INT  
VDD_INT  
VDD_INT  
VDD_INT  
VDD_INT  
VDD_INT  
VDD_INT  
VDD_INT  
VDD_TD  
Ball No.  
T10  
T11  
T12  
T13  
U06  
U11  
U12  
F07  
F08  
F09  
F10  
F13  
F14  
F15  
F16  
G08  
G09  
G14  
G15  
T08  
T09  
T14  
T15  
U07  
U08  
U09  
U10  
U13  
U14  
U15  
U16  
W12  
E05  
L19  
PG_14  
PG_15  
AA05  
AB05  
Y06  
SMC0_A01  
SMC0_A02  
SMC0_AMS0  
SMC0_AOE_NORDV  
B14  
A16  
Y07  
B22  
Y08  
SMC0_ARDY_NORWT D20  
Y09  
SMC0_ARE  
SMC0_AWE  
SMC0_BR  
C16  
A21  
C13  
A15  
B15  
B18  
A17  
A18  
B20  
C14  
A19  
C17  
B17  
A20  
C18  
C15  
B19  
C19  
B16  
J03  
Y10  
Y14  
Y15  
SMC0_D00  
SMC0_D01  
SMC0_D02  
SMC0_D03  
SMC0_D04  
SMC0_D05  
SMC0_D06  
SMC0_D07  
SMC0_D08  
SMC0_D09  
SMC0_D10  
SMC0_D11  
SMC0_D12  
SMC0_D13  
SMC0_D14  
SMC0_D15  
SYS_BMODE0  
SYS_BMODE1  
SYS_BMODE2  
SYS_CLKIN  
SYS_CLKOUT  
SYS_EXTWAKE  
SYS_FAULT  
SYS_FAULT  
SYS_NMI_RESOUT  
SYS_PWRGD  
SYS_HWRST  
SYS_TDA  
Y13  
K17  
L17  
M17  
N17  
P17  
R16  
R17  
T16  
T17  
U17  
D11  
F06  
F11  
F12  
G06  
G07  
G10  
G11  
G12  
G13  
H06  
H07  
J06  
AB14  
AA16  
AA15  
AA13  
AB13  
AA12  
AB12  
AA11  
AB11  
AA10  
AB10  
AA09  
AB09  
AA08  
AB08  
AA07  
AB07  
AA06  
AB06  
AA14  
Y17  
VDD_EXT  
VDD_EXT  
VDD_EXT  
VDD_EXT  
VDD_EXT  
H03  
G03  
H01  
N03  
K02  
F02  
F01  
F03  
J02  
VDD_EXT  
VDD_EXT  
VDD_EXT  
VDD_EXT  
VDD_EXT  
VDD_USB  
VREF_DMC  
VDD_EXT  
AB17  
AB15  
Y18  
VDD_EXT  
VDD_EXT  
K06  
L04  
L06  
M06  
N06  
P06  
R06  
R07  
T06  
T07  
VDD_EXT  
AA17  
AB16  
AA19  
AA18  
Y16  
G02  
Y12  
Y11  
H02  
C22  
D22  
C21  
D21  
VDD_EXT  
VDD_EXT  
SYS_TDK  
VDD_EXT  
SYS_XTAL  
VDD_EXT  
TWI0_SCL  
VDD_EXT  
AB21  
Y19  
TWI0_SDA  
TWI1_SCL  
VDD_EXT  
VDD_EXT  
AB18  
TWI1_SDA  
VDD_EXT  
Rev. PrD  
|
Page 40 of 44 | March 2012  
Preliminary Technical Data ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609  
TOP VIEW  
2
4
6
8
10 12 14 16 18 20 22  
9 11 13 15 17 19 21  
A1 BALL  
PAD CORNER  
1
3
5
7
A
C
E
G
J
B
D
F
U
D
D
D
D
D
D
D
D
D
D
D
D
D
D
H
K
M
P
T
L
GND  
N
R
U
W
I/O SIGNALS  
VDD_EXT  
D
D
VDD_INT  
V
Y
T
D
VDD_DMC  
T
AA  
AB  
VDD_TD  
U
VDD_USB  
BOTTOM VIEW  
A1 BALL  
PAD CORNER  
22 20 18 16 14 12 10  
21 19 17 15 13 11  
8
6
4
2
9
7
5
3
1
A
C
B
D
F
U
E
D
D
D
D
D
D
D
D
D
D
D
D
D
D
G
J
H
K
M
P
T
L
N
D
D
R
U
V
Y
T
W
AA  
AB  
Figure 10. 349-Ball CSP_BGA Ball Configuration  
Rev. PrD  
| Page 41 of 44 | March 2012  
ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609 Preliminary Technical Data  
OUTLINE DIMENSIONS  
Dimensions for the 19 mm × 19 mm CSP_BGA package in  
Figure 11 are shown in millimeters.  
19.10  
19.00 SQ  
18.90  
A1 BALL  
CORNER  
22 20 18 16 14 12 10  
21 19 17 15 13 11  
8
6
4
2
A1 BALL  
CORNER  
9
7
5
3
1
A
C
E
G
J
B
D
F
16.80  
H
K
M
P
T
BSC SQ  
L
N
R
U
W
0.80  
BSC  
V
Y
AB  
AA  
TOP VIEW  
DETAIL A  
BOTTOM VIEW  
DETAIL A  
1.10 REF  
1.50  
1.36  
1.21  
1.11  
1.01  
0.91  
0.35 NOM  
0.30 MIN  
0.50  
0.45  
0.40  
COPLANARITY  
0.20  
SEATING  
PLANE  
BALL DIAMETER  
COMPLIANT TO JEDEC STANDARDS MO-275-PPAB-2.  
Figure 11. 349-Ball Chip Scale Package Ball Grid Array [CSP_BGA]  
(BC-349-1)  
Dimensions shown in millimeters  
SURFACE-MOUNT DESIGN  
Table 17 is provided as an aid to PCB design. For industry-stan-  
dard design recommendations, refer to IPC-7351, Generic  
Requirements for Surface-Mount Design and Land Pattern  
Standard.  
Table 17. BGA Data for Use with Surface-Mount Design  
Package  
Ball Attach Type  
Package  
Solder Mask Opening  
Package  
Ball Pad Size  
Package  
BC-349-1  
Solder Mask Defined  
0.4 mm Diameter  
0.5 mm Diameter  
Rev. PrD  
| Page 42 of 44 | March 2012  
Preliminary Technical Data ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609  
AUTOMOTIVE PRODUCTS  
The TBD model is available with controlled manufacturing to  
support the quality and reliability requirements of automotive  
applications. Note that these automotive models may have spec-  
ifications that differ from the commercial models and designers  
should review the product specifications section of this data  
sheet carefully. Only the automotive grade products shown in  
below are available for use in automotive applications. Contact  
your local ADI account representative for specific product  
ordering information and to obtain the specific Automotive  
Reliability reports for these models.  
Temperature  
Package  
Option  
Processor Instruction  
Rate (Max)  
Model  
Range1  
Package Description  
TBD  
TBD  
349-Ball Chip Scale Package Ball BC-349-1  
Grid Array  
500 MHz  
1 Referenced temperature is ambient temperature. The ambient temperature is not a specification. Please see Operating Conditions on Page 31 for the junction temperature  
(TJ) specification which is the only temperature specification.  
PRE RELEASE PRODUCTS  
Temperature  
Range1  
Package  
Option  
Processor Instruction  
Rate (Max)  
Model  
Package Description  
ADSP-BF609-ENG  
TBD  
349-Ball Chip Scale Package Ball BC-349-1  
Grid Array  
500 MHz  
1 Referenced temperature is ambient temperature. The ambient temperature is not a specification. Please see Operating Conditions on Page 31 for the junction temperature  
(TJ) specification which is the only temperature specification.  
Rev. PrD  
| Page 43 of 44 | March 2012  
ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609 Preliminary Technical Data  
©2012 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
PR10659-0-3/12(PrD)  
Rev. PrD  
| Page 44 of 44 | March 2012  

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