ADT6502ARJP065 [ADI]
Low Cost, 2.7 V to 5.5 V, Micropower Temperature Switches in SOT-23; 低成本， 2.7 V至5.5 V ，微功耗温度开关，采用SOT -23
| 型号： | ADT6502ARJP065 |
| 厂家： | 
ADI |
| 描述： | Low Cost, 2.7 V to 5.5 V, Micropower Temperature Switches in SOT-23 |
| 文件： | 总16页 (文件大小：259K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Low Cost, 2.7 V to 5.5 V, Micropower
Temperature Switches in SOT-23
ADT6501/ADT6502/ADT6503/ADT6504
Preliminary Technical Data
FEATURES
0.ꢀ5C (typ) accuracy over temperature range
FUNCTIONAL BLOCK DIAGRAM
Factory set trip points from −4ꢀ5C to +1ꢀ5C in 105C
increments
V
CC
4
DECIMATOR
Factory set trip points from +3ꢀ5C to +11ꢀ5C in 105C
increments
No external components required
Max temperature of +12ꢀ5C
LPF
TEMPERATURE
SENSOR
1-BIT
12-BIT
DIGITAL
+
COMPARATOR
Open-drain output (ADT6ꢀ01/ADT6ꢀ03)
Push-pull output (ADT6ꢀ02/ADT6ꢀ04)
Pin selectable hysteresis of 25C and 105C
Supply current of 30 μA (typ)
–
5
TOVER
REFERENCE
Σ-Δ
1-BIT
DAC
CLK AND
TIMING
GENERATION
FACTORY PRESET
TRIP POINT
Space saving ꢀ-lead SOT23 package
2°C/10°C
REGISTER
APPLICATIONS
2
3
1
Medical equipment
Automotive
Cell phone
GND GND
HYST
Figure 1.
Hard disk drives
Personal computers
Electronic test equipment
Domestic appliances
Process control
GENERAL DESCRIPTION
becomes active when the temperature goes higher than the
The ADT6501/ADT6502/ADT6503/ADT6504 are trip point
temperature switches available in a 5-lead SOT23 package. It
contains an internal band gap temperature sensor for local
temperature sensing. When the temperature crosses the trip
point setting, the logic output is activated. The ADT6501/
ADT6503 logic output is active low and open-drain. The
ADT6502/ADT6504 logic output is active high and push-pull.
The temperature is digitized to a resolution of +0.0625°C
(12 bit). The factory settings are 10°C apart starting from −45°C
to +15°C for the cold threshold models and from +35°C to
+115°C for the hot threshold models.
selected trip point temperature. The ADT6503 and ADT6504
are used for monitoring temperatures from −45°C to +15°C
only. Hence, the logic output pin becomes active when the
temperature goes lower than the selected trip point
temperature.
PRODUCT HIGHLIGHTS
1.
0.5°C typical from −55°C to +125°C.
2. Factory threshold settings from −45°C to +115°C in 10°C
increments
These devices require no external components and typically
consume 30μA supply current. Hysteresis is pin selectable at
2°C and 10°C. The temperature switch is specified to operate
over the supply range of 2.7 V to 5.5 V.
3. Supply voltage is 2.7 V to 5.5 V.
4. Supply current of 30 μA.
5. Space-saving 5-lead SOT23 package.
6. Pin selectable temperature hysteresis of 2°C or 10°C.
7. Temperature resolution of 0.0625°C.
ADT6501 and ADT6502 are used for monitoring temperatures
from +35°C to +115°C only. Hence, the logic output pin
Rev. PrA
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
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One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Fax: 781.461.3113
www.analog.com
© 2006 Analog Devices, Inc. All rights reserved.
ADT6501/ADT6502/ADT6503/ADT6504
Preliminary Technical Data
TABLE OF CONTENTS
Features .............................................................................................. 1
Converter Details ..........................................................................8
Factory Programmed Threshold Range.....................................8
Hysteresis Input.............................................................................8
Functional Description.................................................................9
Application Information................................................................ 10
Thermal Response Time ........................................................... 10
Self-Heating Effects.................................................................... 10
Supply Decoupling ..................................................................... 10
Temperature Monitoring........................................................... 11
Outline Dimensions....................................................................... 12
Ordering Guide .......................................................................... 12
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Product Highlights ........................................................................... 1
Specifications..................................................................................... 3
Absolute Maximum Ratings ....................................................... 4
ESD Caution.................................................................................. 4
Pin Configuration and Function Descriptions............................. 5
Typical Performance Characteristics ............................................. 6
Theory of Operation ........................................................................ 8
Circuit Information...................................................................... 8
Rev. PrA | Page 2 of 16
Preliminary Technical Data
SPECIFICATIONS
ADT6501/ADT6502/ADT6503/ADT6504
TA = TMIN to TMAX, VDD = 2.7 V to 5.5 V. All specifications for −45°C to +115°C, unless otherwise noted. Open-drain RPULL-UP = 100 kΩ.
Table 1.
Parameter
Min
Typ
Max
Unit Test Conditions/Comments
TEMPERATURE SENSOR AND ADC
Threshold Accuracy at VCC = 2.7 V to 5.5 V
±±.5
±±.5
±±.5
±±.5
12
±6
±4
±4
±6
°C
°C
°C
°C
Bits
ms
ms
°C
TA = −45°C to −25°C
TA = −15°C to +15°C
TA = +35°C to +65°C
TA = +75°C to +115°C
ADC Resolution
Temperature Conversion Time
Update Rate
Long Term Drift
Temperature Hysteresis
Temperature Threshold Hysteresis
3±
Time necessary to complete a conversion
Conversion started every 6±± ms
Drift over 1± years, if part is operated at +55°C
Temperature cycle = 25°C to 125°C to 25°C
6±±
±.±8
+±.±3
°C
2
1±
°C
°C
DIGITAL INPUT (HYST)
Input Low Voltage, VIL
±.2 × VCC
V
V
Input High Voltage, VIH
DIGITAL OUTPUT (OPEN-DRAIN)
Output High Current, IOH
Output Low Voltage, VOL
Output Low Voltage, VOL
±.8 × VCC
1±
nA
V
V
Leakage current, Vcc = 2.7 V and VOH = 5.5 V
IOL = 1.2 mA, Vcc = 2.7 V
IOL = 3.2 mA, Vcc = 4.5 V
±.3
±.4
1±
1
Output Capacitance, COUT
pF
DIGITAL OUTPUT (Push-Pull)
Output Low Voltage, VOL
Output Low Voltage, VOL
Output High Voltage, VOH
Output High Voltage, VOH
±.3
±.4
V
V
V
IOL = 1.2 mA, Vcc = 2.7 V
IOL = 3.2 mA, Vcc = 4.5 V
ISOURCE = 5±± μA, VCC = 2.7 V
ISOURCE = 8±± μA, VCC = 4.5 V
±.8 × VCC
VCC – 1.5
V
11
Output Capacitance, COUT
1±
pF
POWER REQUIREMENTS
Supply Voltage
Supply Current
2.7
5.5
85
V
μA
3±
1 Guaranteed by design and characterization.
Rev. PrA | Page 3 of 16
ADT6501/ADT6502/ADT6503/ADT6504
Preliminary Technical Data
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rating
VCC to GND
–±.3 V to +7 V
–±.3 V to VCC + ±.3 V
–±.3 V to +7 V
–±.3 V to VDD + ±.3 V
2± mA
HYST Input Voltage to GND
Open Drain Output Voltage to GND
Push-Pull Output Voltage to GND
Input Current on All Pins
Output Current on All Pins
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature, TJMAX
5-Lead SOT-23 (RJ-5)
Power Dissipation2
Thermal Impedance4
θJA, Junction-to-Ambient (still air)
IR Reflow Soldering (Pb-Free Package)
Peak Temperature
Time at Peak Temperature
Ramp-Up Rate
2± mA
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
–55°C to +125°C
–65°C to +16±°C
15±.7°C
3
WMAX = (TJMAX − TA )/θJA
24±°C/W
26±°C (+±°C)
2± sec to 4± sec
3°C/sec maximum
–6°C/sec maximum
8 minutes maximum
0.1
SOT-23 PD @ 125°C = 0.107W
0
Ramp-Down Rate
Time 25°C to Peak Temperature
–55 –40 –20
0
20
40
60
80
100 120
–50 –30 –10
10
30
50
70
90 110 125
TEMPERATURE (°C)
1 Values relate to package being used on a standard 2-layer PCB. This gives a
worst case θJA. Refer to Figure 2 for a plot of maximum power dissipation vs.
ambient temperature (TA).
Figure 2. SOT-23 Maximum Power Dissipation vs. Temperature
2 TA = ambient temperature.
3 Junction-to-case resistance is applicable to components featuring a
preferential flow direction, for example, components mounted on a heat
sink. Junction-to-ambient resistance is more useful for air-cooled, PCB-
mounted components
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4±±± V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. PrA | Page 4 of 16
Preliminary Technical Data
ADT6501/ADT6502/ADT6503/ADT6504
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
ADT6501/
ADT6502
ADT6503/
ADT6504
GND
GND
1
2
3
5
TOVER/
TOVER
GND
GND
1
2
3
5
4
TUNDER/
TUNDER
TOP VIEW
(Not to Scale)
TOP VIEW
(Not to Scale)
HYST
4
V
HYST
V
CC
CC
Figure 3. ADT6501/ADT6502 Pin Configuration
Figure 4. ADT6503/ADT6504 Pin Configuration
Table 3. Pin Function Descriptions
ADT6ꢀ01/ADT6ꢀ02 ADT6ꢀ03/ADT6ꢀ04 Mnemonic Description
Pin No.
Pin No.
1
2
3
1
2
3
GND
GND
HYST
Ground.
Ground.
Hysteresis Input. Connects HYST to GND for +2°C hysteresis or connects to VCC
for +1±°C hysteresis.
4
5
4
–
VCC
TOVER
Supply Input (+2.7 V to +5.5 V).
Open-Drain, Active-Low Output. TOVER goes low when the temperature of the
part exceeds the factory programmed threshold; must use a pull-up resistor.
/
5
–
–
5
TOVER
Push-Pull, Active-High Output. TOVER goes high when the temperature of the
part exceeds the factory programmed threshold.
Open-Drain, Active-Low Output. TUNDER goes low when the temperature of
the part exceeds the factory programmed threshold; must use a pull-up
resistor.
TUNDER
/
–
5
TUNDER
Push-Pull, Active-High Output. TUNDER goes high when the temperature of
the part exceeds the factory programmed threshold.
Rev. PrA | Page 5 of 16
ADT6501/ADT6502/ADT6503/ADT6504
Preliminary Technical Data
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Rev. PrA | Page 6 of 16
Preliminary Technical Data
ADT6501/ADT6502/ADT6503/ADT6504
Figure 13.
Figure 11.
Figure 12.
Rev. PrA | Page 7 of 16
Preliminary Technical Data
ADT6501/ADT6502/ADT6503/ADT6504
THEORY OF OPERATION
The modulated output of the comparator is encoded using a
circuit technique that results in SMBus/I2C temperature data.
CIRCUIT INFORMATION
The ADT6501/ADT6502/ADT6503/ADT6504 are 12-bit digital
temperature sensors with the 12th bit acting as the sign bit. An on-
board temperature sensor generates a voltage precisely
proportional to absolute temperature that is compared to an
internal voltage reference and input to a precision digital
modulator. The 12-bit output from the modulator is input into a
digital comparator where it is compared with a factory set trip
level. The output trip pin is activated if the temperature measured
is greater than the factory set trip level. Overall accuracy for the
ADT650x family is 6°C from −45°C to +115°C.
FACTORY PROGRAMMED THRESHOLD RANGE
The ADT6501/ADT6502/ADT6503/ADT6504 are available
with factory set threshold levels ranging from −45°C to +115°C
in 10°C. The ADT6501/ADT6503 outputs are intended to
interface to reset inputs of microprocessors. The
ADT6502/ADT6504 are intended for driving circuits of
applications, such as fan control circuits. Table 4 lists the
available temperature threshold ranges.
Table 4. Factory Set Temperature Threshold Ranges
The on-board temperature sensor has excellent accuracy and
linearity over the entire rated temperature range without needing
correction or calibration by the user. The ADT6501/ADT6503
have active-low, open-drain output structures that can only sink
current. The ADT6502/ADT6504 have active-high, push-pull
output structures that can sink and source current. On power-up,
the output cannot become active until the first conversion is
completed. This typically takes 30 ms.
Device
Threshold (TTH) Range
+35°C < TTH < +115°C
+35°C < TTH < +115°C
−45°C < TTH < +15°C
−45°C < TTH < +15°C
ADT65±1
ADT65±2
ADT65±3
ADT65±4
HYSTERESIS INPUT
The HYST pin is used to select a temperature hysteresis of 2°C
or 10°C. If the HYST pin is connected to VCC then a hysteresis
of 10°C is selected or if the HYST pin is connected to GND then
a hysteresis of 2°C is selected. The HYST pin should not be left
floating. Hysteresis prevents oscillation on the output pin when
the temperature is approaching the trip point, after it activates.
For example, if the temperature trip is 45°C and the hysteresis
selected is 10°C, the temperature would have to go as low as
35°C before the output deactivates.
The sensor output is digitized by a first-order, ∑-Δ modulator,
also known as the charge balance type analog-to-digital
converter (ADC). This type of converter utilizes time-domain
oversampling and a high accuracy comparator to deliver 12 bits
of effective accuracy in an extremely compact circuit.
CONVERTER DETAILS
The ∑-Δ modulator consists of an input sampler, a summing
network, an integrator, a comparator, and a 1-bit digital-to-
analog converter (DAC). Similar to the voltage-to-frequency
converter, this architecture creates a negative feedback loop and
minimizes the integrator output by changing the duty cycle of
the comparator output in response to input voltage changes.
The comparator samples the output of the integrator at a much
higher rate than the input sampling frequency; this is called
oversampling. Oversampling spreads the quantization noise
over a much wider band than that of the input signal, improving
overall noise performance and increasing accuracy.
Σ-Δ MODULATOR
INTEGRATOR
COMPARATOR
+
VOLTAGE REF
AND VPTAT
–
1-BIT
DAC
1-BIT
LPF DIGITAL
FILTER
TEMPERATURE
VALUE
REGISTER
CLOCK
GENERATOR
12-BIT
Figure 14. First-Order ∑-Δ Modulator
Rev. PrA | Page 8 of 16
Preliminary Technical Data
ADT6501/ADT6502/ADT6503/ADT6504
V
FUNCTIONAL DESCRIPTION
TOVER
The conversion clock for the part is generated internally. No
external clock is required. The internal clock oscillator runs an
automatic conversion sequence. During this automatic
conversion sequence, a conversion is initiated every 600 ms. At
this time, the part powers up its analog circuitry and performs a
temperature conversion.
COLD
HOT
TEMP
TTH
10°C
HYST
2°C
HYST
This temperature conversion typically takes 30 ms, after which
time the analog circuitry of the part automatically shuts down.
The analog circuitry powers up again 570 ms later, when the
600 ms timer times out and the next conversion begins. The
result of the most recent temperature conversion is compared
with the factory set trip point value. If the temperature
measured is greater than the trip point value, the output is
activated. The output is deactivated once the temperature
crosses back over the trip point threshold plus whatever
temperature hysteresis is selected. Figure 15 to Figure 18 show
the transfer function for the output trip pin of each generic
model.
Figure 16. ADT6502 TOVER Transfer Function
V
TUNDER
HOT
COLD
TEMP
TTH
V
10°C
HYST
2°C
HYST
TOVER
TUNDER
Figure 17. ADT6503
Transfer Function
COLD
HOT
10°C
HYST
V
TEMP
TTH
TUNDER
2°C
HYST
HOT
COLD
TOVER
Figure 15. ADT6501
Transfer Function
TEMP
TTH
10°C
HYST
2°C
HYST
Figure 18. ADT6504 TUNDER Transfer Function
Rev. PrA | Page 9 of 16
ADT6501/ADT6502/ADT6503/ADT6504
Preliminary Technical Data
APPLICATION INFORMATION
THERMAL RESPONSE TIME
SUPPLY DECOUPLING
The time required for a temperature sensor to settle to a
specified accuracy is a function of the thermal mass of the
sensor and the thermal conductivity between the sensor and the
object being sensed. Thermal mass is often considered
equivalent to capacitance. Thermal conductivity is commonly
specified using the symbol Q, and can be thought of as thermal
resistance. It is commonly specified in units of degrees per watt
of power transferred across the thermal joint. Thus, the time
required for the ADT6501/ADT6502/ADT6503/ADT6504 to
settle to the desired accuracy is dependent on the characteristics
of the SOT-23 package, the thermal contact established in that
particular application, and the equivalent power of the heat
source. In most applications, the settling time is probably best
determined empirically.
The ADT6501/ADT6502/ADT6503/ADT6504 should be
decoupled with a 0.1 μF ceramic capacitor between VDD and
GND. This is particularly important when the ADT650x are
mounted remotely from the power supply. Precision analog
products, such as the ADT650x, require a well-filtered power
source. Because the ADT650x operate from a single supply, it
might seem convenient to tap into the digital logic power
supply.
Unfortunately, the logic supply is often a switch-mode design,
which generates noise in the 20 kHz to 1 MHz range. In
addition, fast logic gates can generate glitches hundreds of mV
in amplitude due to wiring resistance and inductance.
If possible, the ADT650x should be powered directly from the
system power supply. This arrangement, shown in Figure 19,
isolates the analog section from the logic switching transients.
Even if a separate power supply trace is not available, generous
supply bypassing reduces supply line induced errors. Local
supply bypassing consisting of a 0.1 μF ceramic capacitor is
advisable for the temperature accuracy specifications to be
achieved. This decoupling capacitor must be placed as close as
possible to the ADT650x VCC pin.
SELF-HEATING EFFECTS
The temperature measurement accuracy of the
ADT6501/ADT6502/ADT6503/ADT6504 can be degraded in
some applications due to self-heating. Errors can be introduced
from the quiescent dissipation and power dissipated when
converting. The magnitude of these temperature errors is
dependent on the thermal conductivity of the ADT650x
package, the mounting technique, and the effects of airflow. At
25°C, static dissipation in the ADT650x is typically TBD μW
operating at 3.3 V. In the 5-lead SOT-23 package mounted in
free air, this accounts for a temperature increase due to self-
heating of
TTL/CMOS
LOGIC
CIRCUITS
0.1µF
ADT650x
ꢀT = PDISS × θJA = TBD μW × 240°C/W = TBD°C
POWER
SUPPLY
It is recommended that current dissipated through the device be
kept to a minimum, because it has a proportional effect on the
temperature error.
Figure 19. Use Separate Traces to Reduce Power Supply Noise
Rev. PrA | Page 1± of 16
Preliminary Technical Data
ADT6501/ADT6502/ADT6503/ADT6504
As much as 60% of the heat transferred from the heat source to
the thermal sensor on the ADT650x die is discharged via the
copper tracks, package pins, and bond pads. Of the pins on the
ADT650x, the GND pins transfer most of the heat. Therefore,
to monitor the temperature of a heat source it is recommended
that the thermal resistance between the ADT650x GND pins
and the GND of the heat source is reduced as much as possible.
TEMPERATURE MONITORING
The ADT6501/ADT6502/ADT6503/ADT6504 are ideal for
monitoring the thermal environment within electronic
equipment. For example, the surface-mount package accurately
reflects the exact thermal conditions that affect nearby
integrated circuits.
The ADT650x measure and convert the temperature at the
surface of its own semiconductor chip. When the ADT650x are
used to measure the temperature of a nearby heat source, the
thermal impedance between the heat source and the ADT650x
must be as low as possible.
For example, use the unique properties of the ADT650x to
monitor a high power dissipation microprocessor. The
ADT650x device, in its SOT-23 package, is mounted directly
beneath the microprocessor’s pin grid array (PGA) package.
The ADT650x requires no external characterization.
Rev. PrA | Page 11 of 16
ADT6501/ADT6502/ADT6503/ADT6504
Preliminary Technical Data
OUTLINE DIMENSIONS
2.90 BSC
5
4
3
2.80 BSC
1.60 BSC
1
2
PIN 1
0.95 BSC
1.90
BSC
1.30
1.15
0.90
1.45 MAX
0.22
0.08
10°
5°
0°
0.15 MAX
0.50
0.30
0.60
0.45
0.30
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MO-178-AA
Figure 20. 5-Lead Small Outline Transistor Package [SOT-23]
(RJ-5)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Threshold Temperature
+35°C
+45°C
+55°C
+65°C
+75°C
+85°C
+95°C
+1±5°C
+115°C
+35°C
+45°C
+55°C
+65°C
+75°C
+85°C
+95°C
+1±5°C
+115°C
−45°C
−35°C
−25°C
−15°C
−5°C
Temperature Accuracy
±4°C
±4°C
±4°C
±4°C
±6°C
±6°C
±6°C
±6°C
±6°C
±4°C
±4°C
±4°C
±4°C
±6°C
±6°C
±6°C
±6°C
±6°C
±6°C
±6°C
±6°C
±4°C
±4°C
±4°C
±4°C
±6°C
±6°C
±6°C
±4°C
±4°C
±4°C
±4°C
Package Description
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
Package Option
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
ADT65±1ARJP±35
ADT65±1ARJP±45
ADT65±1ARJP±55
ADT65±1ARJP±65
ADT65±1ARJP±75
ADT65±1ARJP±85
ADT65±1ARJP±95
ADT65±1ARJP1±5
ADT65±1ARJP115
ADT65±2ARJP±35
ADT65±2ARJP±45
ADT65±2ARJP±55
ADT65±2ARJP±65
ADT65±2ARJP±75
ADT65±2ARJP±85
ADT65±2ARJP±95
ADT65±2ARJP1±5
ADT65±2ARJP115
ADT65±3ARJN±45
ADT65±3ARJN±35
ADT65±3ARJN±25
ADT65±3ARJN±15
ADT65±3ARJN±±5
ADT65±3ARJP±±5
ADT65±3ARJP±15
ADT65±4ARJN±45
ADT65±4ARJN±35
ADT65±4ARJN±25
ADT65±4ARJN±15
ADT65±4ARJN±±5
ADT65±4ARJP±±5
ADT65±4ARJP±15
+5°C
+15°C
−45°C
−35°C
−25°C
−15°C
−5°C
+5°C
+15°C
Rev. PrA | Page 12 of 16
Preliminary Technical Data
NOTES
ADT6501/ADT6502/ADT6503/ADT6504
Rev. PrA | Page 13 of 16
ADT6501/ADT6502/ADT6503/ADT6504
NOTES
Preliminary Technical Data
Rev. PrA | Page 14 of 16
Preliminary Technical Data
NOTES
ADT6501/ADT6502/ADT6503/ADT6504
Rev. PrA | Page 15 of 16
ADT6501/ADT6502/ADT6503/ADT6504
NOTES
Preliminary Technical Data
Purchase of licensed I2C components of Analog Devices or one of its sublicensed Associated Companies conveys a license for the purchaser under the Philips I2C Patent
Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips.
©2006 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
PR06096-0-10/06(PrA)
Rev. PrA | Page 16 of 16
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