ADT7302ARM-REEL7 [ADI]

【2∑C Accurate, MicroPower Digital Temperature Sensor in 6-Lead SOT-23; 【 2ΣC准确,微功耗数字温度传感器,采用6引脚SOT -23
ADT7302ARM-REEL7
型号: ADT7302ARM-REEL7
厂家: ADI    ADI
描述:

【2∑C Accurate, MicroPower Digital Temperature Sensor in 6-Lead SOT-23
【 2ΣC准确,微功耗数字温度传感器,采用6引脚SOT -23

传感器 温度传感器
文件: 总14页 (文件大小:220K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
± ±2°C AAcurae,CMiAuoPoweuCDigiarlC  
TempeuracueCSensouCinC6-LerdCSOT-±3C  
PueliminruyCTeAhniArlCDrarC  
 DT730±  
FEATURES  
FUNCTIONAL BLOCK DIAGRAM  
13-bit temperature-to-digital converter  
−40°C to +125°C operating temperature range  
2°C accuracy  
BAND GAP  
TEMPERATURE  
SENSOR  
13-BIT  
ANALOG/DIGITAL  
CONVERTER  
0.03125°C temperature resolution  
Shutdown current of 1 µA  
Power dissipation of 0.631 mW at VDD = 3.3 V  
SPI- and DSP-compatible serial interface  
Shutdown mode  
GND  
V
DD  
TEMPERATURE  
VALUE  
REGISTER  
ADT7302  
CS  
SERIAL  
BUS  
INTERFACE  
SCLK  
DIN  
Space-saving SOT-23 and MSOP packages  
DOUT  
APPLICATIONS  
Medical equipment  
Automotive:  
Figure 1. Functional Block Diagram  
Environmental controls  
Oil temperature  
Hydraulic systems  
Cell phones  
Hard disk drives  
Personal computers  
Electronic test equipment  
Office equipment  
Domestic appliances  
Process control  
GENERAL DESCRIPTION  
PRODUCT HIGHLIGHTS  
The ADT7302 is a complete temperature monitoring system  
available in SOT-23 and MSOP packages. It contains a band gap  
temperature sensor and a 13-bit ADC to monitor and digitize  
the temperature reading to a resolution of 0.03125°C.  
1. The ADT7302 has an on-chip temperature sensor that  
allows an accurate measurement of the ambient tempera-  
ture. The measurable temperature range is −40°C to  
+125°C.  
2. Supply voltage of 2.7 V to 5.5 V.  
The ADT7302 has a flexible serial interface that allows easy  
interfacing to most microcontrollers. The interface is compat-  
ible with SPI®, QSPI™, and MICROWIRE™ protocols as well as  
DSPs. The part features a standby mode that is controlled via  
the serial interface.  
3. Space-saving 6-lead SOT-23 and 8-lead MSOP packages.  
4. Temperature accuracy of 2°C.  
5. 13-bit temperature reading to 0.03125°C resolution.  
The ADT7302s wide supply voltage range, low supply current,  
and SPI compatible interface make it ideal for a variety of  
applications, including personal computers, office equipment,  
automotive, and domestic appliances.  
6. The ADT7302 features a shutdown mode that reduces the  
power consumption to 4.88 µW with VDD = 3.3 V @ 1 SPS.  
Rev. PrE  
Information furnished by Analog Devices is believed to be accurate and reliable.  
However, no responsibility is assumed by Analog Devices for its use, nor for any  
infringements of patents or other rights of third parties that may result from its use.  
Specifications subject to change without notice. No license is granted by implication  
or otherwise under any patent or patent rights of Analog Devices. Trademarks and  
registered trademarks are the property of their respective owners.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781.329.4700  
Fax: 781.326.8703  
www.analog.com  
© 2004 Analog Devices, Inc. All rights reserved.  
 DT730±C  
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T BLECOFC°ONTENTSC  
Specifications.....................................................................................3  
Temperature Value Register........................................................ 8  
Serial Interface .............................................................................. 9  
Microprocessor Interfacing.......................................................10  
Mounting The ADT7302........................................................... 12  
Supply Decoupling .....................................................................12  
Outline Dimensions ....................................................................... 13  
Ordering Guide............................................................................... 14  
Timing Characteristics.................................................................4  
Absolute Maximum Ratings............................................................5  
ESD Caution..................................................................................5  
Pin Configurations and Function Descriptions............................6  
Typical Performance Characteristics..............................................7  
Circuit Information ..........................................................................8  
Converter Details..........................................................................8  
REVISION HISTORY  
Revision PrE: Preliminary Version  
Rev. PrE | Page 2 of 14  
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SPE°IFI° TIONSC  
 DT730±  
TA = TMIN to TMAX, VDD = 2.7 V to 5.5 V, unless otherwise noted. All specifications apply for –40°C to +125°C, unless otherwise stated  
Table 1.  
Parameter  
TEMPERATURE SENSOR AND ADC  
Accuracy  
Min  
Typ  
Max  
Unit  
Test Conditions/Comments  
VDD = +3.3 V ( 10%) and 5 V ( 10%)  
TA = 0°C to 70°C.  
TBD  
2
°C  
TBD  
TBD  
2.5  
3
°C  
°C  
TA = −20°C to +85°C.  
TA = −40°C to +125°C.  
Temperature Resolution  
Auto Conversion Update Rate, tR  
Temperature Conversion Time  
Thermal Time Constant1  
SUPPLIES  
0.03125  
°C  
1
2
2
sec  
ms  
sec  
Temperature measurement every 1 second  
Supply Voltage  
2.7  
5.5  
V
For Specified performance.  
Supply Current  
Normal Mode  
1.6  
190  
1.6  
280  
0.2  
0.2  
2.2  
300  
2.2  
400  
1
mA  
µA  
mA  
µA  
µA  
µA  
VDD = 3.3 V. Powered up and converting  
VDD = 3.3 V. Powered up and not converting  
VDD = 5 V. Powered up and converting  
VDD = 5 V. Powered up and not converting  
VDD = 3.3 V.  
Shutdown Mode  
1
VDD = 5 V.  
Power Dissipation  
Normal Mode (Average)  
631  
1.41  
µW  
mW  
VDD = 3.3 V. Auto conversion update, tR.  
VDD = 5 V. Auto conversion update, tR.  
Shutdown Mode (Average)2  
1 SPS  
4.88  
7.4  
42.9  
65  
423  
641  
µW  
µW  
µW  
µW  
µW  
µW  
VDD = 3.3 V  
VDD = 5 V  
VDD = 3.3 V  
VDD = 5 V  
VDD = 3.3 V  
VDD = 5 V  
10 SPS  
100 SPS  
DIGITAL INPUT3  
Input High Voltage, VIH  
Input Low Voltage, VIL  
Input Current, IIN  
Input Capacitance, CIN  
DIGITAL OUTPUT3  
2.5  
V
V
µA  
pF  
0.8  
1
10  
VIN = 0 V to VDD  
All digital inputs  
Output High Voltage, VOH  
Output Low Voltage, VOL  
Output Capacitance, COUT  
VDD − 0.3 V  
ISOURCE = ISINK = 200 µA  
IOL = 200 µA  
0.4  
50  
V
pF  
1 Thermal Time Constant is the time it takes for a starting temperature difference to change to 36.8% of it’s starting value. For example if the ADT7302 experienced a  
thermal shock from 0°C to 100°C, it would take typically 2 secs for the ADT7302 to reach 63.2°C.  
2 The ADT7302 is taken out of shutdown mode and a temperature conversion is immediately performed after this write operation. Once the temperature conversion is  
complete, the ADT7302 is put back into shutdown mode.  
3 Guaranteed by design and characterization, not production tested.  
Rev. PrE | Page 3 of 14  
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TIMING CHARACTERISTICS  
Guaranteed by design and characterization, not production tested. All input signals are specified with tr = tf = 5 ns (10% to 90% of VDD  
)
and timed from a voltage level of 1.6 V. See Figure 3.  
TA = TMIN to TMAX, VDD = 2.7 V to 5.5 V, unless otherwise noted.  
Table 2.  
Parameter  
t1  
Limit  
5
Unit  
ns min  
Comments  
CS  
to SCLK Setup Time  
t2  
t3  
t4  
t5  
t6  
t7  
25  
25  
35  
20  
5
ns min  
ns min  
ns max  
ns min  
ns min  
ns min  
ns max  
SCLK High Pulse Width  
SCLK Low Pulse Width  
Data Access Time after SCLK Falling Edge  
Data Setup Time prior to SCLK Rising Edge  
Data Hold Time after SCLK Rising Edge  
1
5
CS  
CS  
to SCLK HoldTime  
1
t8  
40  
to DOUT High Impedance  
1 Measured with the load circuit of Figure 2.  
200µA  
I
OL  
TO  
OUTPUT  
PIN  
1.6V  
C
L
50pF  
200µA  
I
OH  
Figure 2. Load Circuit for Data Access Time and Bus Relinquish Time  
Rev. PrE | Page 4 of 14  
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 DT730±  
 BSOLUTECM XIMUMCR TINGSC  
Table 3. ADT7302 Stress Ratings  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability  
Parameter  
Rating  
VDD to GND  
−0.3 V to +7 V  
−0.3 V to VDD + 0.3 V  
−0.3 V to VDD + 0.3 V  
−40°C to +125°C  
−65°C to +150°C  
150°C  
Digital Input Voltage to GND  
Digital Output Voltage to GND  
Operating Temperature Range  
Storage Temperature Range  
Junction Temperature  
6-Lead SOT-23 (RJ-6)  
Power Dissipation1  
2
1.2  
1.0  
0.8  
WMAX = (TJMAX - TA )/θJA  
Thermal Impedance  
θJA, Junction-to-Ambient (Still Air)  
8-Lead MSOP (RM-8)  
Power Dissipation1  
190.4°C/W  
2
WMAX = (TJMAX - TA )/θJA  
Thermal Impedance3  
θJA, Junction-to-Ambient (Still Air)  
θJC, Junction-to-Case  
IR Reflow Soldering  
Peak Temperature  
Time at Peak Temperature  
Ramp-up Rate  
SOT-23  
0.6  
205.9°C/W  
43.74°C/W  
MSOP  
0.4  
0.2  
0
+220°C (−0/+5°C)  
10 s to 20 s  
2°C/s to 3°C/s  
−6°C/sec  
Ramp-down Rate  
TEMPERATURE (°C)  
1Values relate to the package being used on a standard 2-layer PCB. Reference  
Figure 3 for a plot of maximum power dissipation versus ambient  
temperature (TA).  
Figure 3. Plot of Maximum Power Dissipation vs. Temperature  
2TA = ambient temperature  
3Junction-to-case resistance is applicable to components featuring a  
preferential flow direction, e.g., components mounted on a heat sink.  
Junction-to-ambient resistance is more useful for air-cooled, PCB mounted  
components.  
ESD CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the  
human body and test equipment and can discharge without detection. Although this product features  
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy  
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance  
degradation or loss of functionality.  
Rev. PrE | Page 5 of 14  
 DT730±C  
PueliminruyCTeAhniArlCDrar  
PINC°ONFIGUR TIONSC NDCFUN°TIONCDES°RIPTIONSC  
1
2
3
6
5
4
1
2
3
4
8
7
6
5
GND  
DOUT  
NC  
NC  
ADT7302  
TOP VIEW  
(Not to Scale)  
ADT7302  
DOUT  
GND  
DIN  
CS  
TOP VIEW  
(Not to Scale)  
SCLK  
V
CS  
DIN  
DD  
SCLK  
V
DD  
Figure 4. SOT-23  
Figure 5. MSOP  
Table 4. Pin Function Description  
SOT-23  
Mnemonic Pin No.  
Description  
Analog and Digital Ground.  
GND  
DIN  
1
2
Serial Data Input. Serial data to be loaded to the part’s control register is provided on this input. Data is clocked  
into the control register on the rising edge of SCLK.  
VDD  
SCLK  
3
4
Positive Supply Voltage, 2.7 V to 5.5 V.  
Serial Clock Input. This is the clock input for the serial port. The serial clock is used to clock data out of the  
ADT7302’s temperature value register and to clock data into the ADT7302’s control register.  
5
6
Chip Select Input. Logic input. The device is selected when this input is low. The SCLK input is disabled when  
this pin is high.  
Serial Data Output. Logic output. Data is clocked out of the temperature value register at this pin. Data is  
clocked out on the falling edge of SCLK.  
CS  
DOUT  
Rev. PrE | Page 6 of 14  
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 DT730±  
TYPI° LCPERFORM N°EC°H R °TERISTI°SC  
–000  
500E-9  
450E-9  
400E-9  
350E-9  
300E-9  
250E-9  
200E-9  
150E-9  
100E-9  
50E-9  
–000  
–000  
TBD  
–000  
–000  
–000  
000E+0  
–000  
–000  
–000  
–000  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
6.0  
ALL CAPS (Initial caps)  
SupplyVoltage (V)  
Figure 6. Temperature Accuracy @ 3.3 V and 5 V  
Figure 9. Shutdown Current vs. Supply Voltage @ 30°C  
215.0E-6  
20  
15  
10  
5
250 mv p-p ripple @ Vdd = 5 V  
210.0E-6  
205.0E-6  
200.0E-6  
195.0E-6  
190.0E-6  
185.0E-6  
180.0E-6  
175.0E-6  
170.0E-6  
5.5 V  
0
3.3 V  
10E+3  
100E+3  
1E+6  
10E+6  
100E+6  
-5  
-10  
Frequency (Hz)  
-45  
5
55  
105  
155  
Figure 10. Temperature Accuracy vs. Supply Ripple Frequency  
Temperature (°C)  
140  
120  
100  
80  
Figure 7. Average Operating Supply Current vs. Temperature  
205E-6  
200E-6  
195E-6  
190E-6  
185E-6  
180E-6  
175E-6  
60  
40  
20  
0
0
5
10  
15  
20  
25  
30  
35  
40  
45  
50  
Time (sec)  
Figure 11. Response to Thermal Shock  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
6.0  
Supply Voltage (V)  
Figure 8. Average Operating Supply Current vs. Supply Voltage @ 30°C  
Rev. PrE | Page 7 of 14  
 DT730±C  
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TEMPERATURE VALUE REGISTER  
°IR°UITCINFORM TIONC  
The temperature value register is a 14-bit read-only register that  
stores the temperature reading from the ADC in 13-bit twos  
complement format plus a sign bit. The MSB (DB13) is the sign  
bit. The ADC can theoretically measure a 255°C temperature  
span. The internal temperature sensor is guaranteed to a low  
value limit of –40°C and a high limit of +125°C. The  
temperature data format is shown in Table 5, which shows the  
temperature measurement range of the device (–40°C to  
+125°C). A typical performance curve is shown in Figure 6.  
The ADT7302 is a 13-bit digital temperature sensor with a 14th  
bit that acts as a sign bit. The part houses an on-chip tempera-  
ture sensor, a 13-bit A/D converter, a reference circuit, and  
serial interface logic functions in SOT-23 and MSOP packages.  
The A/D converter section consists of a conventional  
successive-approximation converter based around a capacitor  
DAC. The parts are capable of running on a 2.7 V to 5.5 V  
power supply.  
The on-chip temperature sensor allows an accurate measure-  
ment of the ambient device temperature to be made. The  
specified measurement range of the ADT7302 is −40°C to  
+125°C. The structural integrity of the device starts to  
deteriorate when operated at voltage and temperature  
maximum specifications.  
Table 5. Temperature Data Format  
Temperature  
−40°C  
−30°C  
−25°C  
−10°C  
−0.03125°C  
0°C  
+0.03125°C  
+10°C  
+25°C  
Digital Output DB13…DB0  
11, 1011 0000 0000  
11, 1100 0100 0000  
11, 1100 1110 0000  
11, 1110 1100 0000  
11, 1111 1111 1111  
00, 0000 0000 0000  
00, 0000 0000 0001  
00, 0001 0100 0000  
00, 0011 0010 0000  
00, 0110 0100 0000  
00, 1001 0110 0000  
00, 1100 1000 0000  
00, 1111 1010 0000  
CONVERTER DETAILS  
The conversion clock for the part is internally generated; no  
external clock is required except when reading from and  
writing to the serial port. In normal mode, an internal clock  
oscillator runs an automatic conversion sequence. During this  
automatic conversion sequence, a conversion is initiated every 1  
second. At this time, the part powers up its analog circuitry and  
performs a temperature conversion. This temperature  
conversion typically takes 800 µs, after which time the analog  
circuitry of the part automatically shuts down. The analog  
circuitry powers up again when the 1 second timer times out  
and the next conversion begins. The result of the most recent  
temperature conversion is always available in the serial output  
register because the serial interface circuitry never shuts down.  
+50°C  
+75°C  
+100°C  
+125°C  
Temperature Conversion Formula  
1. Positive Temperature = ADC Code(d)/32  
2. Negative Temperature = (ADC Code*(d) 16384)/32  
*Using all 14 bits of the data byte, includes the sign bit.  
The ADT7302 can be placed in a shutdown mode via the con-  
trol register, in which case the on-chip oscillator is shut down  
and no further conversions are initiated until the ADT7302 is  
taken out of shutdown mode. The ADT7302 can be taken out of  
shutdown mode by writing all zeros into the control register.  
The conversion result from the last conversion prior to shut-  
down can still be read from the ADT7302 even when it is in  
shutdown mode.  
Negative Temperature = (ADC Code(d)* 8192)/32  
*DB13 (sign bit) is removed from the ADC code  
01, 0010, 1100, 0000  
75°C  
00, 1001, 0110, 0000  
In normal conversion mode, the internal clock oscillator is reset  
after every read or write operation. This causes the device to  
start a temperature conversion, the result of which is typically  
available 800 µs later. Similarly, when the part is taken out of  
shutdown mode, the internal clock oscillator is started and a  
conversion is initiated. The conversion result is available 800 µs  
later, typically. Reading from the device before a conversion is  
complete causes the ADT7302 to stop converting; the part starts  
again when serial communication is finished. This read  
operation provides the previous result.  
00, 0000, 0000, 0001  
–0.03125°C  
11, 1111, 1111, 1111  
11, 1100, 0100, 0000  
TEMPERATURE (°C)  
125°C  
–40°C  
–30°C  
11, 1011, 0000, 0000  
Figure 12. Temperature to Digital Transfer Function  
Rev. PrE | Page 8 of 14  
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 DT730±  
CS  
t1  
t7  
t2  
15  
SCLK  
DOUT  
1
2
3
4
16  
t3  
t8  
t4  
DB0  
DB1  
LEADING ZEROS  
DB13  
DB12  
t
6
t
5
POWER-  
DOWN  
DIN  
Figure 13. Serial Interface Timing Diagram  
SERIAL INTERFACE  
Read Operation  
Figure 13 shows the timing diagram for a serial read from the  
CS  
data plus a sign bit are transferred during a read operation.  
Read operations occur during streams of 16 clock pulses. The  
first two bits out are leading zeros and the next 14 bits contain  
CS  
The serial interface on the ADT7302 consists of four wires:  
SCLK, DIN, and DOUT. The interface can be operated in 2-  
CS  
,
ADT7302. The  
line enables the SCLK input. Thirteen bits of  
wire mode with  
inter-face has read-only capability, with data being read from  
CS  
and DIN tied to ground, in which case the  
the data register via the DOUT line. It is advisable to utilize  
,
which improves synchronization between the ADT7302 and the  
master device. The DIN line is used to write the part into  
standby mode, if required. The  
device when more than one device is connected to the serial  
clock and data lines.  
CS  
the temperature data. If  
remains low and 16 more SCLK  
cycles are applied, the ADT7302 loops around and outputs the  
two leading zeros plus the 14 bits of data that are in the temper-  
CS  
line is used to select the  
CS  
ature value register. When  
returns high, the DOUT line goes  
into three-state. Data is clocked out onto the DOUT line on the  
falling edge of SCLK.  
The part operates in a slave mode and requires an externally  
applied serial clock to the SCLK input to access data from the  
data register. The serial interface on the ADT7302 allows the  
part to be interfaced to systems that provide a serial clock  
synchronized to the serial data, such as the 80C51, 87C51,  
68HC11, 68HC05 and PIC16Cxx microcontrollers as well as  
DSP processors.  
Write Operation  
Figure 13 also shows the timing diagram for a serial write to the  
ADT7302. The write operation takes place at the same time as  
the read operation. Only the third bit in the data stream  
provides a user-controlled function. This third bit is the power-  
down bit, which, when set to a 1, puts the ADT7302 into  
shutdown mode. Besides the power-down bit, all bits in the  
input data stream should be zero to ensure correct operation of  
the ADT7302. Data is loaded into the control register on the  
16th rising SCLK edge; the data takes effect at this time, i.e., if  
A read operation from the ADT7302 accesses data from the  
temperature value register while a write operation to the part  
writes data to the control register.  
the part is programmed to go into shutdown, it does so at this  
th  
CS  
point. If  
is brought high before this 16 SCLK edge, the  
control register is not loaded and the power-down status of the  
part does not change. Data is clocked into the ADT7302 on the  
rising edge of SCLK.  
Rev. PrE | Page 9 of 14  
 DT730±C  
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MICROPROCESSOR INTERFACING  
The ADT7302s serial interface allows for easy interface to most  
microcomputers and microprocessors. Figure 14 through  
Figure 17 show some typical interface circuits. The serial  
In the example shown, the ADT7302 is connected to the serial  
port of the 8051. Because the serial interface of the 8051  
contains only one data line, the DIN line of the ADT7302 is tied  
low in the interface example given in Figure 15.  
CS  
interface on the ADT7302 consists of four wires: , DIN,  
DOUT and SCLK. All interface circuits shown utilize all four  
interface lines. However, it is possible to operate the interface  
with three wires. If the application does not require the power-  
down facility offered by the ADT7302, the DIN line can be tied  
permanently low. Thus, the interface can be operated from just  
For applications that require the ADT7302s power-down  
feature, the serial interface should be implemented using data  
port lines on the 8051. This allows a full-duplex serial interface  
to be implemented. The method involves “bit-banging” a port  
line to generate a serial clock while using two other port lines to  
CS  
three wires: SCLK, , and DOUT.  
CS  
shift data in and out with the fourth port line connecting to  
.
Port lines 1.0 through 1.3 (with P1.1 configured as an input)  
The serial data transfer to and from the ADT7302 requires a 16-  
bit read operation. Many 8-bit microcontrollers have 8-bit serial  
ports, and this 16-bit data transfer is handled as two 8-bit trans-  
fers. Other microcontrollers and DSP processors transfer 16 bits  
of data in a serial data operation.  
CS  
can be used to connect to SCLK, DOUT, DIN, and  
respectively, to implement this scheme.  
,
8051*  
ADT7302*  
ADT7302 to MC68HC11 Interface  
P3.1  
P3.0  
P1.2  
P1.3  
SCLK  
DOUT  
DIN  
Figure 14 shows an interface between the ADT7302 and the  
MC68HC11 microcontroller. The MC68HC11 is configured in  
master mode with its CPOL and CPHA bits set to a Logic 1.  
When the MC68HC11 is configured like this, its SCLK line  
idles high between data transfers. Data is transferred to and  
from the ADT7302 in two 8-bit serial data operations. The  
diagram shows the full (4-wire) interface. PC1 of the  
CS  
*ADDITIONAL PINS OMITTED FOR CLARITY  
Figure 15. ADT7302 to 8051 Interface  
MC68HC11 is configured as an output and is used to drive the  
CS  
input.  
ADT7302 to PIC16C6x/7x and PIC16F873 Interface  
Figure 16 shows an interface circuit between the ADT7302 and  
the PIC16C6x/7x microcontroller. The PIC16C6x/7x  
MC68HC11*  
SCLK  
ADT7302*  
SCLK  
synchronous serial port (SSP) is configured as an SPI master  
with the clock polarity bit set to a Logic 1. In this mode, the  
serial clock line of the PIC16C6x/7x idles high between data  
transfers. Data is transferred to and from the ADT7302 in two  
8-bit serial data operations. In the example shown, port line  
DOUT  
DIN  
MISO  
MOSI  
PC1  
CS  
CS  
RA1 is being used to generate the  
for the ADT7302.  
*ADDITIONAL PINS OMITTED FOR CLARITY  
Figure 14. ADT7302 to MC68HC11 Interface  
PIC16C6x/7x*  
SCK  
ADT7302*  
SCLK  
ADT7302 to 8051 Interface  
SDO  
SDI  
DOUT  
DIN  
An interface circuit between the ADT7302 and the microcon-  
troller is shown in Figure 15. The 8051 is configured in its Mode  
0 serial interface mode. The serial clock line of the 8051 (on  
P3.1) idles high between data transfers. Data is transferred to  
and from the ADT7302 in two 8-bit serial data operations. The  
ADT7302 outputs the MSB of its data stream as the first valid  
bit while the 8051 expects the LSB first. Thus, the data read into  
the serial buffer needs to be rearranged before the correct data-  
word from the ADT7302 is available in the accumulator.  
RA1  
CS  
*ADDITIONAL PINS OMITTED FOR CLARITY  
Figure 16. ADT7302 to PIC16C6x/7x Interface  
The following software program shows how to program an  
PIC16F873 to communicate with the ADT7302. The  
PIC16F873 is configured as an SPI master with the PortA.1 pin  
CS  
used as . Any Microchip microcontroller can use this  
program by simply exchanging the include file for the device  
that’s being used.  
Rev. PrE | Page 10 of 14  
PueliminruyCTeAhniArlCDrarC  
 DT730±  
#include <16F873.h>  
#device adc=8  
#use delay(clock=4000000)  
#fuses NOWDT,XT, PUT, NOPROTECT, BROWNOUT, LVP  
#BIT CKP = 0x14.4  
#define CS PIN_A1  
void main(){  
int MSByte,LSByte;  
long int ADC_Temp_Code;  
float TempVal,ADC_Temp_Code_dec;  
setup_spi(spi_master);  
CKP = 1;  
//Pic is set up as Master device.  
//Idle state of clock is high.  
do{  
delay_ms(10);  
//Allow time for conversions.  
Output_low(CS);  
//Pull CS low.  
delay_us(10);  
MSByte = SPI_Read(0);  
LSByte = SPI_Read(0);  
//CS to SCLK setup time.  
//The first byte is clocked in.  
//The second byte is clocked in.  
delay_us(10);  
Output_High(CS);  
//SCLK to CS setup time.  
//Bring CS high.  
MSByte = 0x03;  
LSByte = 0x20;  
ADC_Temp_Code = make16(MSByte,LSByte);  
ADC_Temp_Code_dec = (float)ADC_Temp_Code;  
//16bit ADC code is stored ADC_Temp_Code.  
//Covert to float for division.  
if ((0x2000 & ADC_Temp_Code) == 0x2000)  
//Check sign bit for negative value.  
{
TempVal = (ADC_Temp_Code_dec - 16384)/32;  
//Conversion formula if negative temperature.  
}
else  
{
TempVal = (ADC_Temp_Code_dec/32);  
}
}while(True);  
//Conversion formula if positive temperature.  
//Temperature value stored in TempVal.  
}
Rev. PrE | Page 11 of 14  
 DT730±C  
PueliminruyCTeAhniArlCDrar  
ADT7302 to ADSP-21xx Interface  
MOUNTING THE ADT7302  
Figure 17 shows an interface between the ADT7302 and the  
ADSP-21xx DSP processor. To ensure correct operation of the  
interface, the SPORT control register should be set up as  
follows:  
The ADT7302 can be used for surface- or air-temperature  
sensing applications. If the device is cemented to a surface with  
thermally conductive adhesive, the die temperature will be  
within about 0.1°C of the surface temperature, thanks to the  
ADT7302s low power consumption. Care should be taken to  
insulate the back and leads of the device from the air if the  
ambient air temperature is different from the surface tempera-  
ture being measured.  
TFSW = RFSW = 1, alternate framing  
INVRFS = INVTFS = 1, active low framing signal  
DTYPE = 00, right justify data  
SLEN = 1111, 16-bit data-words  
ISCLK = 1, internal serial clock  
The ground pin provides the best thermal path to the die, so the  
temperature of the die will be close to that of the printed circuit  
ground track. Care should be taken to ensure that this is in  
good thermal contact with the surface being measured.  
TFSR = RFS = 1, frame every word  
IRFS = 0, RFS configured as input  
ITFS = 1, TFS configured as output  
The interface requires an inverter between the SCLK line of the  
ADSP-21xx and the SCLK input of the ADT7302. The ADSP-  
21xx has the TFS and RFS of the SPORT tied together, with TFS  
set as an output and RFS set as an input. The DSP operates in  
alternate framing mode, and the SPORT control register is set  
up as described previously.  
As with any IC, the ADT7302 and its associated wiring and  
circuits must be kept free from moisture to prevent leakage and  
corrosion, particularly in cold conditions where condensation is  
more likely to occur. Water-resistant varnishes and conformal  
coatings can be used for protection. The small size of the  
ADT7302 allows it to be mounted inside sealed metal probes,  
which provide a safe environment for the device.  
SUPPLY DECOUPLING  
ADSP-21xx*  
SCK  
ADT7302*  
SCLK  
The ADT7302 should be decoupled with a 0.1 µF ceramic  
capacitor between VDD and GND. This is particularly important  
if the ADT7302 is mounted remote from the power supply.  
DR  
DOUT  
DIN  
DT  
CS  
RFS  
TFS  
*ADDITIONAL PINS OMITTED FOR CLARITY  
Figure 17. ADT7302 to ADSP-21 Interface  
Rev. PrE | Page 12 of 14  
PueliminruyCTeAhniArlCDrarC  
OUTLINECDIMENSIONSC  
 DT730±  
2.90 BSC  
6
5
2
4
3
2.80 BSC  
1.60 BSC  
1
PIN 1  
0.95 BSC  
1.90  
BSC  
1.30  
1.15  
0.90  
1.45 MAX  
0.22  
0.08  
10°  
4°  
0°  
0.60  
0.45  
0.30  
0.50  
0.30  
0.15 MAX  
SEATING  
PLANE  
COMPLIANT TO JEDEC STANDARDS MO-178AB  
Figure 18. 6-Lead Small Outline Transistor Package [SOT-23]  
(RJ-6)  
Dimensions shown in millimeters  
3.00  
BSC  
8
5
4
4.90  
BSC  
3.00  
BSC  
PIN 1  
0.65 BSC  
1.10 MAX  
0.15  
0.00  
0.80  
0.60  
0.40  
8°  
0°  
0.38  
0.22  
0.23  
0.08  
COPLANARITY  
0.10  
SEATING  
PLANE  
COMPLIANT TO JEDEC STANDARDS MO-187AA  
Figure 19. 8-Lead Mini Small Outline Package [MSOP]  
(RM-8)  
Dimensions shown in millimeters  
Rev. PrE | Page 13 of 14  
 DT730±C  
PueliminruyCTeAhniArlCDrar  
ORDERINGCGUIDEC  
Temperature  
Accuracy1  
Package  
Description  
Samples Branding  
Information  
T01  
T01  
T01  
Package  
Option  
RJ-6  
RJ-6  
RJ-6  
RM-8  
RM-8  
RM-8  
RJ-6  
RJ-6  
RJ-6  
Model  
Temperature Range  
−40°C to +125°C  
−40°C to +125°C  
−40°C to +125°C  
−40°C to +125°C  
−40°C to +125°C  
−40°C to +125°C  
−40°C to +125°C  
−40°C to +125°C  
−40°C to +125°C  
−40°C to +125°C  
−40°C to +125°C  
−40°C to +125°C  
ADT7302ART-500RL7  
ADT7302ART-REEL7  
ADT7302ART-REEL  
ADT7302ARM  
ADT7302ARM-REEL7  
ADT7302ARM-REEL  
ADT7302ARTZ-500RL72  
ADT7302ARTZ-REEL72  
ADT7302ARTZ-REEL2  
ADT7302ARMZ2  
2°C  
2°C  
2°C  
2°C  
2°C  
2°C  
2°C  
2°C  
2°C  
2°C  
2°C  
2°C  
6-Lead SOT-23  
6-Lead SOT-23  
6-Lead SOT-23  
8-Lead MSOP  
8-Lead MSOP  
8-Lead MSOP  
6-Lead SOT-23  
6-Lead SOT-23  
6-Lead SOT-23  
8-Lead MSOP  
8-Lead MSOP  
8-Lead MSOP  
RM-8  
RM-8  
RM-8  
ADT7302ARMZ-REEL72  
ADT7302ARMZ-REEL2  
1 Temperature accuracy is over 0°C to 70°C temperature range.  
2 Z = Pb-free.  
©
2004 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
PR04662-0-8/04(PrE)  
Rev. PrE | Page 14 of 14  

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