ADT7517ARQZ [ADI]

SPI-/I2C-Compatible, Temperature Sensor,4-Channel ADC and Quad Voltage Output; SPI / I2C兼容,温度传感器, 4通道ADC和四路电压输出
ADT7517ARQZ
型号: ADT7517ARQZ
厂家: ADI    ADI
描述:

SPI-/I2C-Compatible, Temperature Sensor,4-Channel ADC and Quad Voltage Output
SPI / I2C兼容,温度传感器, 4通道ADC和四路电压输出

传感器 换能器 温度传感器 输出元件
文件: 总44页 (文件大小:1144K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SPI-/I2C-Compatible, Temperature Sensor,  
4-Channel ADC and Quad Voltage Output  
ADT7516/ADT7517/ADT7519  
FEATURES  
PIN CONFIGURATION  
ADT7516: four 12-bit DACs  
ADT7517: four 10-bit DACs  
ADT7519: four 8-bit DACs  
Buffered voltage output  
Guaranteed monotonic by design over all codes  
10-bit temperature-to-digital converter  
10-bit 4-channel ADC  
V
-B  
-A  
1
2
3
4
5
6
7
8
16  
15  
V
V
-C  
-D  
OUT  
OUT  
V
OUT  
OUT  
ADT7516/  
ADT7517/  
ADT7519  
V
-IN  
14 AIN4  
REF  
CS  
13 SCL/SCLK  
12 SDA/DIN  
11 DOUT/ADD  
10 INT/INT  
TOP VIEW  
(Not to Scale)  
GND  
V
DD  
D+/AIN1  
D–/AIN2  
9
LDAC/AIN3  
DC input bandwidth  
Input range: 0 V to 2.28 V  
Figure 1.  
Temperature range: −40°C to +120°C  
Temperature sensor accuracy: 0.5°C typ  
Supply range: 2.7 V to 5.5 V  
DAC output range: 0 V to 2 VREF  
Power-down current: <10 μA  
Internal 2.28 VREF option  
Double-buffered input logic  
Buffered reference input  
GENERAL DESCRIPTION  
The ADT7516/ADT7517/ADT75191 combine a 10-bit tempera-  
ture-to-digital converter, a 10-bit 4-channel ADC, and a quad  
12-/10-/8-bit DAC, respectively, in a 16-lead QSOP package.  
The parts also include a band gap temperature sensor and a  
10-bit ADC to monitor and digitize the temperature reading to  
a resolution of 0.25°C.  
Power-on reset to 0 V DAC output  
Simultaneous update of outputs (LDAC function)  
On-chip, rail-to-rail output buffer amplifier  
SPI®, I2C®, QSPI™, MICROWIRE™, and DSP compatible  
4-wire serial interface  
The ADT7516/ADT7517/ADT7519 operate from a single 2.7 V  
to 5.5 V supply. The input voltage range on the ADC channels is  
0 V to 2.28 V, and the input bandwidth is dc. The reference for  
the ADC channels is derived internally. The output voltage of  
the DAC ranges from 0 V to VDD, with an output voltage settling  
time of 7 μs typical.  
SMBus packet error checking (PEC) compatible  
16-lead QSOP package  
The ADT7516/ADT7517/ADT7519 provide two serial interface  
options: a 4-wire serial interface that is compatible with SPI,  
QSPI, MICROWIRE, and DSP interface standards, and a 2-wire  
SMBus/I2C interface. They feature a standby mode that is  
controlled through the serial interface.  
APPLICATIONS  
Portable battery-powered instruments  
Personal computers  
Smart battery chargers  
Telecommunications systems  
Electronic text equipment  
Domestic appliances  
The reference for the four DACs is derived either internally or  
from a reference pin. The outputs of all DACs can be updated  
simultaneously using the software LDAC function or the  
Process control  
LDAC  
external  
pin. The ADT7516/ADT7517/ADT7519  
incorporate a power-on reset circuit, ensuring that the DAC  
output powers up to 0 V and remains there until a valid write  
takes place.  
The wide supply voltage range, low supply current, and SPI-/  
I2C-compatible interface of the ADT7516/ADT7517/ADT7519  
make them ideal for a variety of applications, including  
personal computers, office equipment, and domestic appliances.  
1 Protected by U.S. Patent Numbers: 6,169,442; 5,867,012; and 5,764,174. Other patents pending.  
Rev. B  
Information furnished by Analog Devices is believed to be accurate and reliable. However, no  
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other  
rights of third parties that may result from its use. Specifications subject to change without notice. No  
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.  
Trademarks and registeredtrademarks arethe property of their respective owners.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781.329.4700  
Fax: 781.461.3113  
www.analog.com  
©2006 Analog Devices, Inc. All rights reserved.  
 
ADT7516/ADT7517/ADT7519  
TABLE OF CONTENTS  
Features .............................................................................................. 1  
Terminology.................................................................................... 17  
Theory of Operation ...................................................................... 19  
Power-Up Calibration................................................................ 19  
Conversion Speed....................................................................... 19  
Function Description—Voltage Output.................................. 20  
Functional Description—Analog Inputs................................. 23  
ADC Transfer Function............................................................. 23  
Functional Description—Measurement.................................. 25  
ADT7516/ADT7517/ADT7519 Registers............................... 28  
Serial Interface............................................................................ 37  
SMBus Alert Response .............................................................. 42  
Outline Dimensions....................................................................... 43  
Ordering Guide .......................................................................... 43  
Applications....................................................................................... 1  
Pin Configuration............................................................................. 1  
General Description......................................................................... 1  
Revision History ............................................................................... 2  
Specifications..................................................................................... 3  
DAC AC Characteristics.............................................................. 6  
Timing Diagrams.......................................................................... 7  
Functional Block Diagram .............................................................. 8  
Absolute Maximum Ratings............................................................ 9  
ESD Caution.................................................................................. 9  
Pin Configuration and Functional Descriptions........................ 10  
Typical Performance Characteristics ........................................... 11  
REVISION HISTORY  
8/04—Rev. 0 to Rev. A  
10/06—Rev. A to Rev. B  
Updated Format...................................................................... Universal  
Deleted ADT7518  
Added ADT7519..................................................................... Universal  
Change to Internal VREF Value .............................................................5  
Change to Equation.............................................................................26  
Updated Format..................................................................Universal  
Changes to Features..........................................................................1  
Changes to General Description.....................................................1  
Changes to Specifications.................................................................3  
Changes to Absolute Maximum Ratings........................................9  
Changes to Table 10........................................................................28  
Changes to ADT7516/ADT7517/ADT7519 Registers Section......28  
Changes to Serial Interface Section...............................................37  
Changes to Ordering Guide...........................................................44  
7/03—Initial Version: Rev. 0  
Rev. B | Page 2 of 44  
 
ADT7516/ADT7517/ADT7519  
SPECIFICATIONS  
Temperature range is as follows: A version: −40°C to +120°C, VDD = 2.7 V to 5.5 V, GND = 0 V, REFIN = 2.25 V, unless otherwise noted.  
Table 1.  
Parameter1  
DAC DC PERFORMANCE2, 3  
Min  
Typ  
Max  
Unit  
Conditions/Comments  
ADT7519  
Resolution  
8
Bits  
LSB  
LSB  
Relative Accuracy  
Differential Nonlinearity  
ADT7517  
0.15  
0.02  
1
0.25  
Guaranteed monotonic over all codes  
Guaranteed monotonic over all codes  
Guaranteed monotonic over all codes  
Resolution  
10  
0.5  
0.05  
Bits  
LSB  
LSB  
Relative Accuracy  
Differential Nonlinearity  
ADT7516  
4
0.5  
Resolution  
12  
2
0.02  
0.4  
0.3  
Bits  
LSB  
LSB  
% of FSR  
% of FSR  
mV  
Relative Accuracy  
Differential Nonlinearity  
Offset Error  
Gain Error  
Lower Deadband  
16  
0.9  
2
2
65  
20  
Lower deadband exists only if offset error is  
negative, see Figure 40  
Upper Deadband  
60  
100  
mV  
Upper deadband exists if VREF = VDD and off-set  
plus gain error is positive, see Figure 41  
Offset Error Drift4  
Gain Error Drift4  
–12  
–5  
ppm of FSR/°C  
ppm of FSR/°C  
DC Power Supply Rejection Ratio4  
DC Crosstalk4  
–60  
200  
dB  
μV  
∆VDD = 10%  
See Figure 5  
ADC DC ACCURACY  
Resolution  
Total Unadjusted Error (TUE)  
Total Unadjusted Error (TUE)  
Offset Error  
Maximum VDD = 5 V  
10  
3
2
0.5  
2
Bits  
2
% of FSR  
% of FSR  
% of FSR  
% of FSR  
Hz  
VDD = 2.7 V to 5.5 V  
VDD = 3.3 V 10%  
Gain Error  
ADC BANDWIDTH  
ANALOG INPUTS  
DC  
Input Voltage Range  
0
0
2.28  
VDD  
1
V
V
μA  
pF  
MΩ  
AIN1 to AIN4, C4 = 0 in Control Configuration 3  
AIN1 to AIN4, C4 = 0 in Control Configuration 3  
DC Leakage Current  
Input Capacitance  
Input Resistance  
5
10  
20  
THERMAL CHARACTERISTICS  
Internal Temperature Sensor  
Accuracy @ VDD = 3.3 V 10%  
Internal reference used, averaging on  
TA = 85°C  
TA = 0°C to +85°C  
TA = –40°C to +120°C  
TA = 0°C to +85°C  
TA = –40°C to +120°C  
Equivalent to 0.25°C  
Drift over 10 years if part is operated at 55°C  
1.5  
3
5
3
5
°C  
°C  
°C  
°C  
°C  
Bits  
°C  
0.5  
2
2
Accuracy @ VDD = 5 V 5%  
3
Resolution  
Long-Term Drift  
10  
0.25  
Rev. B | Page 3 of 44  
 
 
ADT7516/ADT7517/ADT7519  
Parameter1  
Min  
Typ  
Max  
Unit  
Conditions/Comments  
External transistor = 2N3906  
TA = 85°C  
TA = 0°C to +85°C  
TA = −40°C to +120°C  
TA = 0°C to +85°C  
TA = −40°C to +120°C  
Equivalent to 0.25°C  
High level  
External Temperature Sensor  
Accuracy @ VDD = 3.3 V 10%  
1.5  
3
5
3
5
°C  
°C  
°C  
°C  
Accuracy @ VDD = 5 V 5%  
2
3
°C  
Resolution  
Output Source Current  
10  
Bits  
μA  
μA  
180  
11  
Low level  
Thermal Voltage Output  
8-Bit DAC Output  
Resolution  
1
°C  
Scale Factor  
8.97  
17.58  
mV/°C  
mV/°C  
0 V to VREF output, TA = −40°C to +120°C  
0 V to 2 VREF output, TA = −40°C to +120°C  
10-Bit DAC Output  
Resolution  
0.25  
°C  
Scale Factor  
2.2  
4.39  
mV/°C  
mV/°C  
0 V to VREF output, TA = −40°C to +120°C  
0 V to 2 VREF output, TA = −40°C to +120°C  
Single channel mode  
CONVERSION TIMES  
Slow ADC  
VDD/AIN  
11.4  
712  
ms  
μs  
Averaging (16 samples) on  
Averaging off  
Internal Temperature  
External Temperature  
11.4  
712  
24.22  
1.51  
ms  
μs  
ms  
ms  
Averaging (16 samples) on  
Averaging off  
Averaging (16 samples) on  
Averaging off  
Fast ADC  
VDD/AIN  
712  
μs  
μs  
ms  
μs  
ms  
μs  
Averaging (16 samples) on  
Averaging off  
Averaging (16 samples) on  
Averaging off  
Averaging (16 samples) on  
Averaging off  
44.5  
2.14  
134  
14.25  
890  
Internal Temperature  
External Temperature  
ROUND ROBIN UPDATE RATE5  
Time to complete one measurement cycle  
through all channels  
Slow ADC @ 25°C  
Averaging On  
Averaging Off  
Averaging On  
Averaging Off  
79.8  
4.99  
94.76  
9.26  
ms  
ms  
ms  
ms  
AIN1 and AIN2 are selected on Pin 7 and Pin 8  
AIN1 and AIN2 are selected on Pin 7 and Pin 8  
D+ and D– are selected on Pin 7 and Pin 8  
D+ and D– are selected on Pin 7 and Pin 8  
Fast ADC @ 25°C  
Averaging On  
Averaging Off  
Averaging On  
Averaging Off  
6.41  
ms  
μs  
ms  
ms  
AIN1 and AIN2 are selected on Pin 7 and Pin 8  
AIN1 and AIN2 are selected on Pin 7 and Pin 8  
D+ and D– are selected on Pin 7 and Pin 8  
D+ and D– are selected on Pin 7 and Pin 8  
400.84  
21.77  
3.07  
DAC EXTERNAL REFERENCE INPUT4  
VREF Input Range  
1
VDD  
V
Buffered reference  
VREF Input Impedance  
Reference Feedthrough  
Channel-to-Channel Isolation  
>10  
–90  
–75  
MΩ  
dB  
dB  
Buffered reference and power-down mode  
Frequency = 10 kHz  
Frequency = 10 kHz  
Rev. B | Page 4 of 44  
ADT7516/ADT7517/ADT7519  
Parameter1  
Min  
Typ  
Max  
Unit  
Conditions/Comments  
ON-CHIP REFERENCE  
Reference Voltage4  
Temperature Coefficient4  
OUTPUT CHARACTERISTICS4  
Output Voltage6  
2.2662 2.28  
80  
2.2938  
V
ppm/°C  
0.001  
VDD − 0.1  
V
This is a measure of the minimum and maximum  
drive capability of the output amplifier  
DC Output Impedance  
Short Circuit Current  
0.5  
25  
16  
2.5  
5
Ω
mA  
mA  
μs  
VDD = 5 V  
VDD = 3 V  
Power-Up Time  
Coming out of power-down mode, VDD = 5 V  
Coming out of power-down mode, VDD = 3.3 V  
μs  
DIGITAL INPUTS4  
Input Current  
1
0.8  
μA  
V
V
pF  
ns  
VIN = 0 V to VDD  
VIL, Input Low Voltage  
VIH, Input High Voltage  
Pin Capacitance  
1.89  
3
10  
50  
All digital inputs  
Input filtering suppresses noise spikes of less  
than 50 ns  
SCL, SDA Glitch Rejection  
LDAC Pulse Width  
20  
ns  
Edge triggered input  
DIGITAL OUTPUT  
Digital High Voltage, VOH  
Output Low Voltage, VOL  
Output High Current, IOH  
Output Capacitance, COUT  
INT/INT Output Saturation Voltage  
2.4  
V
V
mA  
pF  
V
ISOURCE = ISINK = 200 μA  
IOL = 3 mA  
VOH = 5 V  
0.4  
1
50  
0.8  
I
OUT = 4 mA  
I2C TIMING CHARACTERISTICS7, 8  
Serial Clock Period, t1  
Data In Setup Time to SCL High, t2  
Data Out Stable after SCL Low, t3  
SDA Low Setup Time to SCL  
Low (Start Condition), t4  
2.5  
50  
0
μs  
ns  
ns  
ns  
Fast mode I2C, see Figure 2  
See Figure 2  
See Figure 2  
50  
SDA High Hold Time after SCL  
High (Stop Condition), t5  
50  
ns  
See Figure 2  
SDA and SCL Fall Time, t6  
SDA and SCL Rise Time, t7  
SPI TIMING CHARACTERISTICS4, 10  
CS to SCLK Setup Time, t1  
SCLK High Pulse Width, t2  
SCLK Low Pulse Width, t3  
Data Access Time after SCLK  
300  
ns  
ns  
See Figure 2  
See Figure 2  
3009  
0
ns  
ns  
ns  
ns  
See Figure 3  
See Figure 3  
See Figure 3  
50  
50  
35  
11  
Falling Edge, t4  
Data Setup Time Prior to SCLK  
Rising Edge, t5  
Data Hold Time after SCLK  
Rising Edge, t6  
20  
0
ns  
ns  
See Figure 3  
See Figure 3  
CS to SCLK Hold Time, t7  
0
μs  
ns  
See Figure 3  
See Figure 3  
CS to DOUT High Impedance, t8  
40  
POWER REQUIREMENTS  
VDD  
VDD Settling Time  
IDD (Normal Mode)12  
2.7  
5.5  
50  
3
V
ms  
mA  
mA  
VDD settles to within 10% of its final voltage level  
VDD = 3.3 V, VIH = VDD, and VIL = GND  
VDD = 5 V, VIH = VDD, and VIL = GND  
2.2  
3
Rev. B | Page 5 of 44  
ADT7516/ADT7517/ADT7519  
Parameter1  
Min  
Typ  
Max  
10  
10  
10  
33  
Unit  
μA  
μA  
mW  
μW  
Conditions/Comments  
IDD (Power-Down Mode)  
VDD = 3.3 V, VIH = VDD, and VIL = GND  
VDD = 5 V, VIH = VDD, and VIL = GND  
VDD = 3.3 V, normal mode  
Power Dissipation  
VDD = 3.3 V, shutdown mode  
1 See the Terminology section.  
2 DC specifications are tested with the outputs unloaded.  
3 Linearity is tested using a reduced code range: ADT7516 (Code 115 to 4095); ADT7517 (Code 28 to 1023); ADT7519 (Code 8 to 255).  
4 Guaranteed by design and characterization, not production tested.  
5 Round robin is the continuous sequential measurement of the following channels: VDD, internal temperature, external temperature (AIN1, AIN2), AIN3, and AIN4.  
6 For the amplifier output to reach its minimum voltage, the offset error must be negative. For the amplifier output to reach its maximum voltage (VREF = VDD), the offset  
plus gain error must be positive.  
7 The SDA and SCL timing is measured with the input filters turned on to meet the fast mode I2C specification. Switching off the input filters improves the transfer rate  
but has a negative effect on the EMC behavior of the part.  
8 Guaranteed by design, not production tested. All I2C timing specifications are for fast mode operation but the interface is still capable of handling the slower standard  
rate specifications.  
9
The interface is also capable of handling the I2C standard mode rise time specification of 1000 ns.  
10 All input signals are specified with tr = tf = 5 ns (10% to 90% of VDD), and timed from a voltage level of 1.6 V.  
11 Measured with the load circuit shown in Figure 4.  
12 The IDD specification is valid for all DAC codes and full-scale analog input voltages. Interface inactive. All DACs and ADCs active. Load currents excluded.  
DAC AC CHARACTERISTICS  
VDD = 2.7 V to 5.5 V, RL = 4.7 kΩ to GND, CL = 200 pF to GND, 4.7 kΩ to VDD, all specifications TMIN to TMAX, unless otherwise noted.  
Table 2.  
Parameter1, 2  
Min  
Typ3  
Max  
Unit  
Conditions/Comments  
Output Voltage Settling Time  
ADT7519  
ADT7517  
VREF = VDD = 5 V  
6
7
8
8
9
10  
μs  
μs  
μs  
1/4 scale to 3/4 scale change (0x40 to 0xC0)  
1/4 scale to 3/4 scale change (0x100 to 0x300)  
1/4 scale to 3/4 scale change (0x400 to 0xC00)  
ADT7516  
Slew Rate  
0.7  
12  
0.5  
1
0.5  
3
V/μs  
nV-s  
nV-s  
nV-s  
nV-s  
nV-s  
kHz  
dB  
Major-Code Change Glitch Energy  
Digital Feedthrough  
Digital Crosstalk  
Analog Crosstalk  
DAC-to-DAC Crosstalk  
Multiplying Bandwidth  
Total Harmonic Distortion  
1 LSB change around major carry  
200  
–70  
VREF = 2 V 0.1 V p-p  
VREF = 2.5 V 0.1 V p-p; frequency = 10 kHz  
1 See the Terminology section.  
2 Guaranteed by design and characterization, not production tested.  
3 At 25°C.  
Rev. B | Page 6 of 44  
 
ADT7516/ADT7517/ADT7519  
TIMING DIAGRAMS  
t1  
SCL  
t5  
t2  
t4  
SDA  
DATA IN  
t3  
SDA  
DATA OUT  
t6  
Figure 2. I2C Bus Timing Diagram  
CS  
t1  
t2  
t7  
SCLK  
DIN  
t6  
t3  
t5  
t8  
D7  
X
D6  
X
D5  
X
D4  
D3  
X
D2  
D1  
D0  
X
X
X
X
X
X
X
X
X
t4  
DOUT  
X
X
X
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
Figure 3. SPI Bus Timing Diagram  
200µA  
I
OL  
TO OUTPUT  
PIN  
1.6V  
C
L
50pF  
200µA  
I
OH  
Figure 4. Load Circuit for Access Time and Bus Relinquish Time  
V
DD  
4.7k  
TO DAC  
OUTPUT  
4.7kΩ  
200pF  
Figure 5. Load Circuit for DAC Outputs  
Rev. B | Page 7 of 44  
 
 
 
 
 
ADT7516/ADT7517/ADT7519  
FUNCTIONAL BLOCK DIAGRAM  
INTERNAL  
TEMPERATURE  
VALUE REGISTER  
ADT7516/ADT7517/ADT7519  
ON-CHIP  
TEMPERATURE  
ADDRESS POINTER  
REGISTER  
SENSOR  
EXTERNAL  
T
LIMIT  
HIGH  
REGISTERS  
TEMPERATURE  
VALUE REGISTER  
T
LIMIT  
LOW  
REGISTERS  
DAC A  
STRING  
DAC A  
7
8
D+/AIN1  
D–/AIN2  
LDAC/AIN3  
AIN4  
2
1
V
V
V
V
-A  
-B  
-C  
-D  
OUT  
OUT  
OUT  
OUT  
REGISTERS  
V
LIMIT  
CC  
REGISTERS  
LIMIT  
COMPARATOR  
A-TO-D  
ANALOG  
MUX  
CONVERTER  
AIN LIMIT  
HIGH  
REGISTERS  
DAC B  
REGISTERS  
STRING  
DAC B  
9
14  
AIN  
REGISTERS  
LIMIT  
LOW  
V
DD  
DAC C  
REGISTERS  
STRING  
DAC C  
16  
15  
VALUE REGISTER  
CONTROL CONFIG. 1  
REGISTER  
AIN1  
VALUE REGISTER  
CONTROL CONFIG. 2  
REGISTER  
V
DD  
SENSOR  
DAC D  
REGISTERS  
STRING  
DAC D  
AIN2  
VALUE REGISTER  
CONTROL CONFIG. 3  
REGISTER  
AIN3  
GAIN  
SELECT  
LOGIC  
POWER-  
DOWN  
LOGIC  
DAC CONFIGURATION  
REGISTERS  
VALUE REGISTER  
AIN4  
VALUE REGISTER  
LDAC CONFIGURATION  
REGISTERS  
10  
INT/INT  
INTERRUPT MASK  
REGISTERS  
STATUS  
REGISTERS  
INTERNAL  
REFERENCE  
SPI/SMBus INTERFACE  
6
5
4
13  
12  
11  
9
3
V
GND  
CS  
SCL  
SDA  
ADD  
LDAC/AIN3  
V
-IN  
REF  
DD  
Figure 6. Functional Block Diagram for the ADT7516/ADT7517/ADT7519  
Rev. B | Page 8 of 44  
 
ADT7516/ADT7517/ADT7519  
ABSOLUTE MAXIMUM RATINGS  
Table 3.  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Parameter  
Rating  
VDD to GND  
–0.3 V to +7 V  
Analog Input Voltage to GND  
Digital Input Voltage to GND  
Digital Output Voltage to GND  
Reference Input Voltage to GND  
Operating Temperature Range  
Storage Temperature Range  
Junction Temperature  
Power Dissipation1  
–0.3 V to VDD + 0.3 V  
–0.3 V to VDD + 0.3 V  
–0.3 V to VDD + 0.3 V  
–0.3 V to VDD + 0.3 V  
–40°C to +120°C  
–65°C to +150°C  
150°C  
Table 4. I2C Address Selection  
ADD Pin  
I2C Address  
1001 000  
1001 010  
1001 011  
Low  
Float  
High  
(TJ max – TA)/θJA  
Thermal Impedance2  
θJA Junction-to-Ambient  
θJC Junction-to-Case  
105.44°C/W  
38.8°C/W  
IR Reflow Soldering  
Peak Temperature  
ESD CAUTION  
220°C (0°C/5°C)  
Time at Peak Temperature  
Ramp-Up Rate  
Ramp-Down Rate  
Time 25°C to Peak Temperature  
IR Reflow Soldering (Pb-Free Package)  
Peak Temperature  
10 sec to 20 sec  
3°C/sec maximum  
–6°C/sec maximum  
6 min maximum  
260°C (+0°C)  
Time at Peak Temperature  
Ramp-Up Rate  
Ramp-Down Rate  
20 sec to 40 sec  
3°C/sec maximum  
–6°C/sec maximum  
8 min maximum  
Time 25°C to Peak Temperature  
1 Values relate to the package being used on a 4-layer board.  
2 Junction-to-case resistance is applicable to components featuring a  
preferential flow direction, for example, components mounted on a heat  
sink. Junction-to-ambient resistance is more useful for air cooled PCB-  
mounted components.  
Rev. B | Page 9 of 44  
 
ADT7516/ADT7517/ADT7519  
PIN CONFIGURATION AND FUNCTIONAL DESCRIPTIONS  
V
-B  
1
2
3
4
5
6
7
8
16  
V
-C  
OUT  
OUT  
V
-A  
15  
V
-D  
OUT  
OUT  
ADT7516/  
ADT7517/  
ADT7519  
V
-IN  
CS  
14 AIN4  
REF  
13 SCL/SCLK  
12 SDA/DIN  
11 DOUT/ADD  
10 INT/INT  
TOP VIEW  
(Not to Scale)  
GND  
V
DD  
D+/AIN1  
D–/AIN2  
9
LDAC/AIN3  
Figure 7. Pin Configuration (QSOP Package)  
Table 5. Pin Function Descriptions  
Pin No. Mnemonic Description  
1
2
3
4
VOUT-B  
VOUT-A  
VREF-IN  
CS  
Buffered Analog Output Voltage from DAC B. The output amplifier has rail-to-rail operation.  
Buffered Analog Output Voltage from DAC A. The output amplifier has rail-to-rail operation.  
Reference Input Pin for All Four DACs. This input is buffered and has an input range from 1 V to VDD.  
SPI Active Low Control Input. This is the frame synchronization signal for the input data. When CS goes low, it enables  
the input register, and data is transferred in on the rising edges and out on the falling edges of the subsequent serial  
clocks. It is recommended that this pin be tied high to VDD when operating the serial interface in I2C mode.  
5
6
7
GND  
VDD  
D+/AIN1  
Ground Reference Point. Ground reference point for all circuitry on the part. Analog and digital ground.  
Positive Supply Voltage, 2.7 V to 5.5 V. The supply should be decoupled to ground.  
D+: Positive Connection to External Temperature Sensor.  
AIN1: Analog Input. Single-ended analog input channel. Input range is 0 V to 2.28 V or 0 V to VDD.  
D–: Negative Connection to External Temperature Sensor.  
AIN2: Analog Input. Single-ended analog input channel. Input range is 0 V to 2.28 V or 0 V to VDD.  
8
9
D–/AIN2  
LDAC/AIN3 LDAC: Active Low Control Input. Transfers the contents of the input registers to their respective DAC registers. A  
falling edge on this pin forces any or all DAC registers to be updated if the input registers have new data. A minimum  
pulse width of 20 ns must be applied to the LDAC pin to ensure proper loading of a DAC register. This allows  
simultaneous update of all DAC outputs. Bit C3 of the Control Configuration 3 register enables the LDAC pin. Default is  
with the LDAC pin controlling the loading of the DAC registers.  
AIN3: Analog Input. Single-ended analog input channel. Input range is 0 V to 2.28 V or 0 V to VDD.  
10  
11  
INT/INT  
Over Limit Interrupt. The output polarity of this pin can be set to give an active low or active high interrupt when  
temperature, VDD, or AIN limits are exceeded. The default is active low. Open-drain output, needs a pull-up resistor.  
DOUT/ADD DOUT: SPI Serial Data Output. Logic output. Data is clocked out of any register at this pin. Data is clocked out on the  
falling edge of SCLK. Open-drain output, needs a pull-up resistor.  
ADD: I2C Serial Bus Address Selection Pin. Logic input. A low on this pin gives the Address 1001 000; leaving it floating  
gives the Address 1001 010; and setting it high gives the address 1001 011. The I2C address set up by the ADD pin is  
not latched by the device until after this address has been sent twice. On the eighth SCL cycle of the second valid  
communication, the serial bus address is latched in. Any subsequent change on this pin has no effect on the I2C serial  
bus address.  
12  
13  
SDA/DIN  
SCL/SCLK  
SDA: I2C Serial Data Input/Output. I2C serial data to be loaded into the registers of the part and read from these  
registers is provided on this pin. Open-drain configuration, needs a pull-up resistor.  
DIN: SPI Serial Data Input. Serial data to be loaded into the part’s registers is provided on this pin. Data is clocked into  
a register on the rising edge of SCLK. Open-drain configuration, needs a pull-up resistor.  
Serial Clock Input. This is the clock input for the serial port. The serial clock is used to clock data out of any register of  
the ADT7516/ADT7517/ADT7519, and also to clock data into any register that can be written to. Open-drain  
configuration, needs a pull-up resistor.  
14  
15  
16  
AIN4  
VOUT-D  
VOUT-C  
Analog Input. Single-ended analog input channel. Input range is 0 V to 2.28 V or 0 V to VDD.  
Buffered Analog Output Voltage from DAC D. The output amplifier has rail-to-rail operation.  
Buffered Analog Output Voltage from DAC C. The output amplifier has rail-to-rail operation.  
Rev. B | Page 10 of 44  
 
ADT7516/ADT7517/ADT7519  
TYPICAL PERFORMANCE CHARACTERISTICS  
0.10  
0.08  
0.06  
0.04  
0.02  
0
0.20  
0.15  
0.10  
0.05  
0
–0.02  
–0.04  
–0.06  
–0.08  
–0.10  
–0.05  
–0.10  
–0.15  
–0.20  
0
50  
100  
150  
200  
250  
0
50  
100  
150  
200  
250  
DAC CODE  
DAC CODE  
Figure 8. ADT7519 Typical DAC INL Plot  
Figure 11. ADT7519 Typical DAC DNL Plot  
0.6  
0.4  
0.3  
0.2  
0.2  
0.1  
0
0
–0.1  
–0.2  
–0.3  
–0.2  
–0.4  
–0.6  
0
200  
400  
600  
800  
1000  
0
200  
400  
600  
800  
1000  
DAC CODE  
DAC CODE  
Figure 9. ADT7517 Typical DAC INL Plot  
Figure 12. ADT7517 Typical DAC DNL Plot  
1.0  
0.8  
2.5  
2.0  
1.5  
0.6  
0.4  
1.0  
0.2  
0.5  
0
0
–0.2  
–0.4  
–0.6  
–0.8  
–1.0  
–0.5  
–1.0  
–1.5  
–2.0  
–2.5  
0
500  
1000  
1500  
2000  
2500  
3000  
3500 4000  
0
500  
1000  
1500  
2000  
2500  
3000  
3500 4000  
DAC CODE  
DAC CODE  
Figure 10. ADT7516 Typical DAC INL Plot  
Figure 13. ADT7516 Typical DAC DNL Plot  
Rev. B | Page 11 of 44  
 
 
 
 
 
ADT7516/ADT7517/ADT7519  
0.30  
10  
5
0.25  
OFFSET ERROR  
INL WCP  
0.20  
0.15  
0.10  
0
V
= 2.25V  
REF  
–5  
0.05  
0
DNL WCP  
–10  
DNL WCN  
INL WCN  
GAIN ERROR  
–15  
–20  
–0.05  
–0.10  
1.0 1.5  
2.0  
2.5  
3.0  
(V)  
3.5  
4.0  
4.5  
5.0  
2.7  
3.3  
3.6  
4.0  
(V)  
4.5  
5.0  
5.5  
V
V
DD  
REF  
Figure 14. ADT7519 DAC INL and DNL Error vs. VREF  
Figure 17. DAC Offset Error and Gain Error vs. VDD  
0.14  
0.12  
0.10  
0.08  
0.06  
0.04  
0.02  
0
2.505  
2.500  
2.495  
2.490  
2.485  
2.480  
2.475  
2.470  
2.465  
INL WCP  
INL WCN  
SOURCE CURRENT  
SINK CURRENT  
DNL WCP  
DNL WCN  
V
V
= 5V  
= 5V  
DD  
–0.02  
–0.04  
–0.06  
REF  
DAC OUTPUT  
LOADED TO MIDSCALE  
–40  
–10  
20  
50  
80  
110  
0
1
2
3
4
5
6
TEMPERATURE (°C)  
CURRENT (mA)  
Figure 15. ADT7519 DAC INL Error and DNL Error vs. Temperature  
Figure 18. DAC VOUT Source and Sink Current Capability  
1.98  
0
DAC OUTPUT UNLOADED  
–0.2  
1.96  
1.94  
1.92  
1.90  
1.88  
1.86  
OFFSET ERROR  
–0.4  
–0.6  
–0.8  
–1.0  
–1.2  
DAC OUTPUT LOADED  
–1.4  
GAIN ERROR  
–1.6  
–1.8  
0
500 1000  
1500  
2000  
2500  
3000  
3500  
4000  
–40  
–20  
0
20  
40  
60  
80  
100  
120  
DAC CODE  
TEMPERATURE (°C)  
Figure 19. Supply Current vs. DAC Code  
Figure 16. DAC Offset Error and Gain Error vs. Temperature  
Rev. B | Page 12 of 44  
 
ADT7516/ADT7517/ADT7519  
2.00  
1.95  
1.90  
1.85  
1.80  
1.75  
1.8  
1.6  
ADC OFF  
DAC OUTPUTS AT 0V  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 5.1 5.3 5.5  
0
2
4
6
8
10  
V
(V)  
CC  
TIME (µs)  
Figure 20. Supply Current vs. Supply Voltage @ 25°C  
Figure 23. Exiting Power-Down to Midscale  
0.4700  
0.4695  
0.4690  
0.4685  
0.4680  
0.4675  
0.4670  
0.4665  
0.4660  
0.4655  
0.4650  
7
6
5
4
3
2
1
0
0
2
4
6
8
10  
2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 5.1 5.3 5.5  
V
(V)  
TIME (µs)  
CC  
Figure 24. ADT7516 DAC Major Code Transition Glitch Energy;  
011…11 to 100...00  
Figure 21. Power-Down Current vs. Supply Voltage @ 25°C  
0.4730  
0.4725  
0.4720  
0.4715  
0.4710  
0.4705  
0.4700  
0.4695  
0.4690  
0.4685  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
0
2
4
6
8
10  
0
2
4
6
8
10  
TIME (µs)  
TIME (µs)  
Figure 25. ADT7516 DAC Major Code Transition Glitch Energy;  
100…00 to 011…11  
Figure 22. DAC Half-Scale Settling (1/4 to 3/4 Scale Code Change)  
Rev. B | Page 13 of 44  
ADT7516/ADT7517/ADT7519  
0
0
–10  
–20  
–30  
–40  
–50  
–60  
V
= 5V  
DD  
= 25°C  
±100mV RIPPLE ON V  
CC  
T
A
V
V
= 2.25V  
= 3.3V  
REF  
–2  
DD  
TEMPERATURE = 25°C  
–4  
–6  
–8  
–10  
–12  
1
10  
100  
1
2
3
4
5
FREQUENCY (kHz)  
V
(V)  
REF  
Figure 26. DAC Full-Scale Error vs. VREF  
Figure 29. PSRR vs. Supply Ripple Frequency  
2.329  
2.328  
2.327  
2.326  
2.325  
2.324  
2.323  
2.322  
1.5  
1.0  
0.5  
0
V
V
= 5V  
DD  
EXTERNAL TEMPERATURE @ 5V  
INTERNAL TEMPERATURE @ 3.3V  
= 5V  
REF  
DAC OUTPUT LOADED  
TO MIDSCALE  
–0.5  
–1.0  
EXTERNAL TEMPERATURE @ 3.3V  
INTERNAL TEMPERATURE @ 5V  
–30  
0
40  
85  
120  
0
1
2
3
4
5
TEMPERATURE (°C)  
TIME (µs)  
Figure 27. DAC-to-DAC Crosstalk  
Figure 30. Internal Temperature Error @ 3.3 V and 5 V  
3
2
1.0  
0.8  
V
= 3.3V  
DD  
0.6  
OFFSET ERROR  
1
0.4  
0.2  
0
0
–1  
–2  
–3  
–4  
–0.2  
–0.4  
–0.6  
–0.8  
–1.0  
GAIN ERROR  
–40  
–20  
0
20  
40  
60  
80  
100  
120  
0
200  
400  
600  
800  
1000  
TEMPERATURE (°C)  
ADC CODE  
Figure 31. ADC Offset Error and Gain Error vs. Temperature  
Figure 28. ADC INL with VREF = VDD (3.3 V)  
Rev. B | Page 14 of 44  
ADT7516/ADT7517/ADT7519  
3
2
1
0
10  
8
V
= 3.3V  
DD  
COMMON-MODE  
VOLTAGE = 100mV  
OFFSET ERROR  
6
4
2
0
–1  
–2  
–3  
–2  
–4  
–6  
GAIN ERROR  
2.7  
3.1  
3.5  
3.9  
4.3  
(V)  
4.7  
5.1  
5.5  
1
100  
200  
300  
400  
500  
600  
V
NOISE FREQUENCY (Hz)  
DD  
Figure 32. ADC Offset Error and Gain Error vs. VDD  
Figure 35. External Temperature Error vs. Common-Mode Noise Frequency  
15  
70  
V
= 3.3V  
DD  
V
= 3.3V  
TEMPERATURE = 25°C  
DD  
DIFFERENTIAL-MODE  
VOLTAGE = 100mV  
10  
5
60  
50  
40  
30  
20  
10  
0
D+ TO GND  
0
–5  
D+ TO V  
CC  
–10  
–15  
–20  
–25  
–10  
0
10  
20  
30  
40  
50  
60  
70  
80  
90 100  
1
100  
200  
300  
400  
500  
600  
PCB LEAKAGE RESISTANCE (M)  
NOISE FREQUENCY (MHz)  
Figure 33. External Temperature Error vs. PCB Leakage Resistance  
Figure 36. External Temperature Error vs. Differential-  
Mode Noise Frequency  
0.6  
0.4  
0
V
= 3.3V  
DD  
V
= 3.3V  
DD  
–10  
–20  
–30  
–40  
–50  
–60  
0.2  
0
–0.2  
–0.4  
–0.6  
±250mV  
1
100  
200  
300  
400  
500  
600  
0
5
10  
15  
20  
25  
30  
35  
40  
45  
50  
NOISE FREQUENCY (Hz)  
CAPACITANCE (nF)  
Figure 37. Internal Temperature Error vs. Power Supply Noise Frequency  
Figure 34. External Temperature Error vs. Capacitance Between D+ and D–  
Rev. B | Page 15 of 44  
ADT7516/ADT7517/ADT7519  
0
140  
EXTERNAL TEMPERATURE  
120  
–5  
100  
INTERNAL TEMPERATURE  
–10  
–15  
–20  
–25  
80  
60  
40  
TEMPERATURE OF  
ENVIRONMENT  
20  
0
CHANGED HERE  
0
10  
100  
1k  
10k  
100k  
1M  
10M  
1
10  
20  
30  
40  
50  
60  
TIME (s)  
FREQUENCY (Hz)  
Figure 38. Temperature Sensor Response to Thermal Shock  
Figure 39. DAC Multiplying Bandwidth (Small Signal Frequency Response)  
Rev. B | Page 16 of 44  
ADT7516/ADT7517/ADT7519  
TERMINOLOGY  
Unfortunately, integrated circuits cannot be evaluated at room  
temperature (25°C) for 10 years or so to determine this shift.  
Manufacturers perform accelerated lifetime testing of integrated  
circuits by operating ICs at elevated temperatures (between  
125°C and 150°C) over a shorter period (typically between  
500 hours and 1000 hours). As a result, the lifetime of an  
integrated circuit is significantly accelerated due to the increase  
in rates of reaction within the semiconductor material.  
Relative Accuracy  
Relative accuracy or integral nonlinearity (INL) is a measure of  
the maximum deviation, in LSBs, from a straight line passing  
through the endpoints of the transfer function. Typical INL vs.  
code plots are shown in Figure 8, Figure 9, and Figure 10.  
Differential Nonlinearity (DNL)  
Differential nonlinearity is the difference between the measured  
change and the ideal 1 LSB change between any two adjacent  
codes. A specified differential nonlinearity of 0.9 LSB maximum  
ensures monotonicity. Typical DAC DNL vs. code plots can be  
seen in Figure 11, Figure 12, and Figure 13.  
DC Power Supply Rejection Ratio (PSRR)  
PSRR indicates how the output of the DAC is affected by  
changes in the supply voltage. PSRR is the ratio of the change in  
VOUT to a change in VDD for full-scale output of the DAC. It is  
measured in dB. VREF is held at 2 V and VDD is varied 10ꢀ.  
Total Unadjusted Error (TUE)  
Total unadjusted error is a comprehensive specification that  
includes the sum of the relative accuracy error, gain error, and  
offset error under a specified set of conditions.  
DC Crosstalk  
DC crosstalk is the dc change in the output level of one DAC in  
response to a change in the output of another DAC. It is  
measured with a full-scale output change on one DAC while  
monitoring another DAC. It is expressed in ꢁV.  
Offset Error  
Offset error is a measure of the offset error of the DAC and the  
output amplifier (see Figure 40 and Figure 41). It can be  
negative or positive, and it is expressed in mV.  
Reference Feedthrough  
Reference feedthrough is the ratio of the amplitude of the signal  
at the DAC output to the reference input when the DAC output  
is not being updated (that is, LDAC is high). It is expressed in dB.  
Offset Error Match  
Offset error match is the difference in offset error between any  
two channels.  
Channel-to-Channel Isolation  
Gain Error  
Channel-to-channel isolation is the ratio of the amplitude of the  
signal at the output of one DAC to a sine wave on the reference  
input of another DAC. It is measured in dB.  
Gain error is a measure of the span error of the DAC. It is the  
deviation in slope of the actual DAC transfer characteristic from  
the ideal expressed as a percentage of the full-scale range.  
Major Code Transition Glitch Energy  
Gain Error Match  
Gain error match is the difference in gain error between any  
two channels.  
Major code transition glitch energy is the energy of the impulse  
injected into the analog output when the code in the DAC  
register changes state. It is normally specified as the area of the  
glitch in nV-s and is measured when the digital code is changed  
by 1 LSB at the major carry transition (011 . . . 11 to 100 . . . 00  
or 100 . . . 00 to 011 . . . 11).  
Offset Error Drift  
Offset error drift is a measure of the change in offset error  
with changes in temperature. It is expressed in ppm of  
full-scale range/°C.  
Digital Feedthrough  
Gain Error Drift  
Digital feedthrough is a measure of the impulse injected into  
the analog output of a DAC from the digital input pins of the  
device. However, it is measured when the DAC is not being  
written to. It is specified in nV-s and is measured with a full-  
scale change on the digital input pins, that is, from all 0s to all  
1s or vice versa.  
Gain error drift is a measure of the change in gain error  
with changes in temperature. It is expressed in ppm of  
full-scale range/°C.  
Long-Term Temperature Drift  
Long-term temperature drift is a measure of the change in  
temperature error with the passage of time. It is expressed in °C.  
The concept of long-term stability has been used for many years  
to describe the amount an IC parameter shifts during its  
lifetime. This is a concept that has typically been applied to both  
voltage references and monolithic temperature sensors.  
Digital Crosstalk  
Digital crosstalk is the glitch impulse transferred to the output  
of one DAC at midscale in response to a full-scale code change  
(all 0s to all 1s and vice versa) in the input register of another  
DAC. It is measured in standalone mode and is expressed in nV-s.  
Rev. B | Page 17 of 44  
 
ADT7516/ADT7517/ADT7519  
Analog Crosstalk  
GAIN ERROR  
+
OFFSET ERROR  
Analog crosstalk is the glitch impulse transferred to the output  
of one DAC due to a change in the output of another DAC. It is  
measured by loading one of the input registers with a full-scale  
code change (all 0s to all 1s and vice versa) while keeping  
OUTPUT  
VOLTAGE  
LDAC  
LDAC  
high. Then pulse  
low and monitor the output of  
the DAC whose digital code was not changed. The area of the  
glitch is expressed in nV-s.  
NEGATIVE  
DAC-to-DAC Crosstalk  
DAC CODE  
OFFSET  
ERROR  
DAC-to-DAC crosstalk is the glitch impulse transferred to the  
output of one DAC due to a digital code change and subsequent  
output change of another DAC. This includes both digital and  
analog crosstalk. It is measured by loading one of the DACs  
with a full-scale code change (all 0s to all 1s and vice versa) with  
ACTUAL  
IDEAL  
LOWER  
DEADBAND  
CODES  
LDAC  
low and monitoring the output of another DAC. The  
energy of the glitch is expressed in nV-s.  
AMPLIFIER  
FOOTROOM  
Multiplying Bandwidth  
The multiplying bandwidth is a measure of the finite bandwidth  
of the amplifiers within the DAC. A sine wave on the reference  
(with full-scale code loaded to the DAC) appears on the output.  
The multiplying bandwidth is the frequency at which the output  
amplitude falls to 3 dB below the input.  
NEGATIVE  
OFFSET  
ERROR  
Figure 40. DAC Transfer Function with Negative Offset  
Total Harmonic Distortion (THD)  
GAIN ERROR  
THD is the difference between an ideal sine wave and its  
attenuated version using the DAC. The sine wave is used as  
the reference for the DAC, and the THD is a measure of the  
harmonics present on the DAC output, expressed in dB.  
+
OFFSET ERROR  
UPPER  
DEADBAND  
CODES  
OUTPUT  
VOLTAGE  
Round Robin  
The term round robin is used to describe the ADT7516/ADT7517/  
ADT7519 cycling through the available measurement channels  
in sequence, taking a measurement on each channel.  
ACTUAL  
IDEAL  
POSITIVE  
OFFSET  
ERROR  
DAC Output Settling Time  
DAC CODE  
FULL-SCALE  
DAC output settling time is the time required, following a  
prescribed data change, for the output of a DAC to reach and  
remain within 0.5 LSB of the final value. A typical prescribed  
change is from 1/4 scale to 3/4 scale.  
Figure 41. DAC Transfer Function with Positive Offset (VREF = VDD  
)
Rev. B | Page 18 of 44  
 
 
 
ADT7516/ADT7517/ADT7519  
THEORY OF OPERATION  
DAC A and DAC B outputs can be configured to give a voltage  
output proportional to the temperature of the internal and  
external temperature sensors, respectively.  
Directly after the power-up calibration routine, the ADT7516/  
ADT7517/ADT7519 go into idle mode. In this mode, the  
devices are not performing any measurements and are fully  
powered up. All four DAC outputs are at 0 V.  
The dual serial interface defaults to the I2C protocol on power-  
up. To select and lock in the SPI protocol, follow the selection  
process as described in the Serial Interface Selection section.  
The I2C protocol cannot be locked in, though the SPI protocol  
is automatically locked in on selection. The interface can be  
To begin monitoring, write to the Control Configuration 1  
register (Address 0x18) and set Bit C0 = 1. The ADT7516/  
ADT7517/ADT7519 go into the power-up default measurement  
mode (round robin). The devices proceed to take measurements  
on the VDD channel, internal temperature sensor channel,  
external temperature sensor channel (AIN1 and AIN2), AIN3,  
and finally AIN4. After they finish taking measurements on the  
AIN4 channel, the devices immediately loop back to start  
taking measurements on the VDD channel and repeat the same  
cycle as before. This loop continues until the monitoring is  
stopped by resetting Bit C0 of the Control Configuration 1  
register to 0.  
switched back to be I2C on selection when the device is powered  
2
CS  
off and on. When using I C, the  
VDD or GND.  
pin should be tied to either  
There are a number of different operating modes on the  
ADT7516/ADT7517/ADT7519 devices and all of them can be  
controlled by the configuration registers. These features consist  
INT  
of enabling and disabling interrupts, polarity of the INT/  
pin, enabling and disabling the averaging on the measurement  
channels SMBus timeout, and software reset.  
It is also possible to continue monitoring as well as switching to  
single-channel mode by writing to the Control Configuration 2  
register (Address 0x19) and setting Bit C4 = 1. Further explana-  
tion of the single-channel and round robin measurement modes  
is given in later sections. All measurement channels have  
averaging enabled on them at power-up. Averaging forces the  
devices to take an average of 16 readings before giving a final  
measured result. To disable averaging and consequently  
decrease the conversion time by a factor of 16, set Bit C5 = 1 in  
the Control Configuration 2 register.  
POWER-UP CALIBRATION  
It is recommended that no communication to the part be  
initiated until approximately 5 ms after VDD has settled to  
within 10ꢀ of its final value. It is generally accepted that most  
systems take a maximum of 50 ms to power up. Power-up time  
is directly related to the amount of decoupling on the voltage  
supply line.  
During the 5 ms after VDD has settled, the part is performing a  
calibration routine. Any communication to the device during  
calibration interrupts this routine, and can cause erroneous  
temperature measurements. If it is not possible to have VDD at its  
nominal value by the time 50 ms has elapsed or if communication  
to the device has started prior to VDD settling, it is recommended  
that a measurement be taken on the VDD channel before a  
temperature measurement is taken. The VDD measurement is  
used to calibrate out any temperature measurement error due to  
different supply voltage values.  
There are four single-ended analog input channels on the  
ADT7516/ADT7517/ADT7519, AIN1 to AIN4. AIN1 and  
AIN2 are multiplexed with the external temperature sensor  
terminals (D+ and D−). Bit C1 and Bit C2 of the Control  
Configuration 1 register (Address 0x18) are used to select  
between AIN1/AIN2 and the external temperature sensor.  
The input range on the analog input channels is dependent on  
whether the ADC reference used is the internal VREF or VDD. To  
meet linearity specifications, it is recommended that the maximum  
CONVERSION SPEED  
VDD value is 5 V. Bit C4 of the Control Configuration 3 register  
be used to select between the internal reference and VDD as the  
ADC reference of the analog inputs.  
The internal oscillator circuit used by the ADC has the capability  
to output two different clock frequencies. This means that the  
ADC is capable of running at two different speeds when doing a  
conversion on a measurement channel. Thus, the time taken to  
perform a conversion on a channel can be reduced by setting  
Bit C0 of the Control Configuration 3 register (Address 0x1A).  
This increases the ADC clock speed from 1.4 kHz to 22 kHz. At  
the higher clock speed, the analog filters on the D+ and D–  
input pins (external temperature sensors) are switched off. This  
is why the power-up default setting is to have the ADC working  
at the slow speed. The typical times for fast and slow ADC  
speeds are given in the Specifications section.  
Controlling the DAC outputs can be done by writing to the MSB  
and LSB registers of the DAC (Address 0x10 to Address 0x17).  
The power-up default setting is to have a low going pulse on the  
LDAC  
pin (Pin 9) controlling the updating of the DAC outputs  
from the DAC registers. Alternatively, one can configure the  
updating of the DAC outputs to be controlled by means other  
LDAC  
than the  
pin by setting Bit C3 = 1 of the Control  
Configuration 3 register (Address 0x1A). The DAC configura-  
tion register (Address 0x1B) and the LDAC configuration  
register (Address 0x1C) can now be used to control the DAC  
updating. These two registers also control the output range of  
the DACs and select between the internal or external reference.  
Rev. B | Page 19 of 44  
 
ADT7516/ADT7517/ADT7519  
The ADT7516/ADT7517/ADT7519 power up with averaging  
on. This means every channel is measured 16 times and inter-  
nally averaged to reduce noise. The conversion time can also be  
sped up by turning off the averaging. This is done by setting  
Bit C5 of the Control Configuration 2 register (Address 0x19) to 1.  
0 to 255 for ADT7519 (8 bits)  
0 to 1023 for ADT7517 (10 bits)  
0 to 4095 for ADT7516 (12 bits)  
N = DAC resolution.  
Resistor String  
FUNCTION DESCRIPTION—VOLTAGE OUTPUT  
The resistor string section is shown in Figure 43. It is simply a  
string of resistors, each of approximately 603 Ω. The digital  
code loaded to the DAC register determines at which node on  
the string the voltage is tapped off to be fed into the output  
amplifier. The voltage is tapped off by closing one of the  
switches connecting the string to the amplifier. Because it is a  
string of resistors, it is guaranteed monotonic.  
Digital-to-Analog Converters  
The ADT7516/ADT7517/ADT7519 have four resistor string  
DACs fabricated on a CMOS process with resolutions of 12, 10,  
and 8 bits, respectively. They contain four output buffer amplifiers  
and are written to via I2C serial interface or SPI serial interface.  
See the Serial Interface section for more information.  
V
-IN  
REF  
The ADT7516/ADT7517/ADT7519 operate from a single  
supply of 2.7 V to 5.5 V, and the output buffer amplifiers  
provide rail-to-rail output swing with a slew rate of 0.7 V/μs. All  
four DACs share a common reference input, VREF-IN. The  
reference input is buffered to draw virtually no current from the  
reference source because it offers the source a high impedance  
input. The devices have a power-down mode to completely turn  
off all DACs with a high impedance output.  
REFERENCE  
BUFFER  
INT V  
DAC  
REF  
GAIN MODE  
(GAIN = 1 OR 2)  
V
-A  
OUT  
INPUT  
REGISTER  
RESISTOR  
STRING  
REGISTER  
OUTPUT BUFFER  
AMPLIFIER  
Each DAC output is not updated until it receives the LDAC  
command. Therefore, though the DAC registers would have  
been written to with a new value, this value is not represented  
by a voltage output until the DACs receive the LDAC command.  
Reading back from any DAC register prior to issuing an LDAC  
command results in the digital value that corresponds to the  
DAC output voltage. Thus, the digital value written to the DAC  
register cannot be read back until after the LDAC command has  
been initiated. This LDAC command can be given by either  
Figure 42. Single DAC Channel Architecture  
R
R
TO OUTPUT  
AMPLIFIER  
R
LDAC  
pulling the  
pin low (falling edge loads DACs), setting up  
Bit D4 and Bit D5 of the DAC configuration register  
(Address 0x1B), or using the LDAC register (Address 0x1C).  
R
R
LDAC  
When using the  
the low going pulse width should be 20 ns minimum. The  
LDAC  
pin to control the DAC register loading,  
pin has to go high and low again before the DAC  
registers can be reloaded.  
Figure 43. Resistor String  
Digital-to-Analog Section  
V
-IN  
REF  
The architecture of one DAC channel consists of a resistor string  
DAC followed by an output buffer amplifier. The voltage at the  
2.28V  
INTERNAL V  
VREF-IN pin or the on-chip reference of 2.28 V provides the  
REF  
reference voltage for the corresponding DAC. Figure 42 shows a  
block diagram of the DAC architecture. Because the input  
coding to the DAC is straight binary, the ideal output voltage is  
given by  
STRING  
DAC A  
STRING  
DAC B  
VREF × D  
VOUT  
=
2N  
STRING  
DAC C  
where:  
STRING  
DAC D  
D = decimal equivalent of the binary code that is loaded to the  
DAC register  
Figure 44. DAC Reference Buffer Circuit  
Rev. B | Page 20 of 44  
 
 
 
 
ADT7516/ADT7517/ADT7519  
DAC Reference Inputs  
corresponding to 1 LSB change. The default output resolution  
for the ADT7516 and ADT7517 is 8 bits. To increase this to  
10 bits, set C1 = 1 in the Control Configuration 3 register. The  
default output range is 0 V to VREF and this can be increased to  
0 V to 2 VREF. Increasing the output voltage span to 2 VREF can  
be done by setting D0 = 1 for DAC A (internal temperature  
sensor) and D1 = 1 for DAC B (external temperature sensor) in  
the DAC configuration register (Address 0x1B).  
There is an input reference pin for the DACs. This reference  
input is buffered (see Figure 44).  
The advantage of the buffered input is the high impedance it  
presents to the voltage source driving it. The user can have an  
external reference voltage as low as 1 V and as high as VDD. The  
restriction of 1 V is due to the footroom of the reference buffer.  
LDAC  
The  
configuration register controls the option to select  
The output voltage is capable of tracking a maximum tempera-  
ture range of −128°C to +127°C, but the default setting is  
−40°C to +127°C. If the output voltage range is 0 V to VREF-IN  
(VREF-IN = 2.25 V), then this corresponds to 0 V representing  
−40°C, and 1.48 V representing +127°C. This, of course, gives  
between internal and external voltage references. The default  
selection is external reference.  
Output Amplifier  
The output buffer amplifier can generate output voltages to  
within 1 mV of either rail. Its actual range depends on the value  
of VREF, gain, and offset error.  
an upper deadband between 1.48 V and VREF  
.
The internal and external analog temperature offset registers  
can be used to vary this upper deadband and, consequently, the  
temperature that 0 V corresponds to. Table 6 and Table 7 give  
examples of how this is done using a DAC output voltage span  
of VREF and 2 VREF, respectively. Simply write in the temperature  
value, in twos complement format, at which 0 V is to start. For  
example, if using the DAC A output and 0 V to start at −40°C,  
program 0xD8 into the internal analog temperature offset  
register (Address 0x21). This is an 8-bit register and has a  
temperature offset resolution of only 1°C for all device models.  
Use Equation 1 to Equation 4 to determine the value to  
program into the offset registers.  
If a gain of 1 is selected (Bit 0 to Bit 3 of the DAC configuration  
register = 0), the output range is 0.001 V to VREF  
.
If a gain of 2 is selected (Bit 0 to Bit 3 of the DAC configuration  
register = 1), the output range is 0.001 V to 2 VREF. Because  
of clamping, however, the maximum output is limited to  
VDD − 0.001 V.  
The output amplifier can drive a load of 4.7 kΩ to GND or VDD  
in parallel with 200 pF to GND or VDD (see Figure 5). The  
source and sink capabilities of the output amplifier can be seen  
in the plot of Figure 18.  
,
The slew rate is 0.7 V/ꢁs with a half-scale settling time to  
0.5 LSB (at 8 bits) of 6 ꢁs.  
Table 6. Thermal Voltage Output (0 V to VREF  
)
O/P Voltage (V) Default °C  
Max °C  
−128  
−71  
Sample °C  
0
+56  
+113  
+127  
UDB1  
UDB1  
UDB1  
UDB1  
Thermal Voltage Output  
0
−40  
0.5  
1
+17  
+73  
The ADT7516/ADT7517/ADT7519 can output voltages that are  
proportional to temperature. DAC A output can be configured  
to represent the temperature of the internal sensor and the DAC B  
output can be configured to represent the external temperature  
sensor. Bit C5 and Bit C6 of the Control Configuration 3 register  
select the temperature proportional output voltage. Each time a  
temperature measurement is taken, the DAC output is updated.  
The output resolution for the ADT7519 is 8 bits with 1°C change  
corresponding to 1 LSB change. The output resolution for the  
ADT7516 and ADT7517 is capable of 10 bits with 0.25°C change  
−15  
1.12  
1.47  
1.5  
2
+87  
−1  
+39  
+42  
+99  
+127  
UDB1  
UDB1  
UDB1  
2.25  
+127  
1 Upper deadband has been reached. DAC output is not capable of increasing.  
See Figure 41.  
V
DD  
I
N × I  
I
BIAS  
OPTIONAL CAPACITOR, UP TO  
3nF MAX. CAN BE ADDED TO  
IMPROVE HIGH FREQUENCY  
NOISE REJECTION IN NOISY  
ENVIRONMENTS  
V
OUT+  
D+  
REMOTE  
C1  
TO ADC  
SENSING  
TRANSISTOR  
(2N3906)  
D–  
BIAS  
DIODE  
V
OUT–  
LOW-PASS  
FILTER  
fC = 65kHz  
Figure 45. Signal Conditioning for External Diode Temperature Sensor  
Rev. B | Page 21 of 44  
 
ADT7516/ADT7517/ADT7519  
V
DD  
I
N × I  
I
BIAS  
V
OUT+  
TO ADC  
INTERNAL  
BIAS  
DIODE  
V
OUT–  
SENSE  
TRANSISTOR  
Figure 46. Top Level Structure of Internal Temperature Sensor  
For example,  
Table 7. Thermal Voltage Output (0 V to 2 VREF  
)
Offset Register Code (d) = 10d = 0x0A  
O/P Voltage (V)  
Default °C  
Max °C  
–128  
–114  
–100  
–85  
–71  
–65  
–45  
–43  
Sample °C  
0
+14  
+28  
+43  
+57  
+63  
+83  
+85  
+113  
+127  
UDB1  
UDB1  
UDB1  
UDB1  
UDB1  
UDB1  
UDB1  
UDB1  
UDB1  
0
–40  
–26  
+12  
+3  
+17  
+23  
+43  
+45  
The following equation is used to work out the various  
temperatures for the corresponding 8-bit DAC output:  
0.25  
0.5  
0.75  
1
1.12  
1.47  
1.5  
2
2.25  
2.5  
2.75  
3
3.25  
3.5  
3.75  
4
8-Bit Temp = (DAC O/P)/1 LSB + (0 V Temp)  
(3)  
For example, if the output is 1.5 V, VREF-IN= 2.25 V, 8-bit DAC  
has an LSB size = 2.25 V/256 = 8.79 × 10–3, and 0 V temp is at  
−128°C, then the resultant temperature is  
1.5/(8.79 × 10−3) + (−128) = +43°C  
+73  
+88  
–15  
0
The following equation is used to work out the various  
temperatures for the corresponding 10-bit DAC output:  
+102  
+116  
UDB1  
UDB1  
UDB1  
UDB1  
UDB1  
UDB1  
UDB1  
+14  
+28  
+42  
+56  
+70  
+85  
+99  
+113  
+127  
10-Bit Temp = [(DAC O/P)/1 LSB] × 0.25 + (0 V Temp) (4)  
For example, if the output is 0.4991 V, VREF-IN = 2.25 V, 10-bit  
DAC has an LSB size = 2.25 V/1024 = 2.197 × 10–3, and 0 V  
temperature is at −40°C, then the resulting temperature is  
[0.4991/(2.197 × 10–3)] × 0.25 + (–40) = +16.75°C  
Figure 47 shows a graph of the DAC output vs. temperature for  
a VREF-IN = 2.25 V.  
4.25  
4.5  
2.25  
2.10  
1.95  
1 Upper deadband has been reached. DAC output is not capable of increasing.  
See Figure 41.  
0V = –128°C  
1.80  
1.65  
1.50  
1.35  
1.20  
1.05  
0.90  
0.75  
0.60  
0.45  
0.30  
0.15  
0
For negative temperatures,  
Offset Register Code (d) = (0 V Temp) + 128  
(1)  
0V = –40°C  
where D7 of Offset Register Code is set to 1 for negative  
temperatures.  
For example,  
0V = 0°C  
Offset Register Code (d) = −40 + 128 = 88d = 0x58  
Since a negative temperature has been inserted into the  
equation, DB7 (MSB) of the offset register code is set to 1.  
Therefore, 0x58 becomes 0xD8.  
–128110 –90 –70 –50 –30 –10 10 30 50 70 90 110 127  
TEMPERATURE (°C)  
0x58 + DB7(1) = 0xD8  
For positive temperatures,  
Figure 47. DAC Output vs. Temperature VREF-IN = 2.25 V  
Offset Register Code (d) = 0 V Temp  
(2)  
Rev. B | Page 22 of 44  
 
ADT7516/ADT7517/ADT7519  
the comparator to become unbalanced. The control logic and  
the DAC are used to add and subtract fixed amounts of charge  
from the sampling capacitor to bring the comparator back into  
a balanced condition. When the comparator is rebalanced, the  
conversion is complete. The control logic generates the ADC  
output code. Figure 51 shows the ADC transfer function for the  
analog inputs.  
FUNCTIONAL DESCRIPTION—ANALOG INPUTS  
Single-Ended Inputs  
The ADT7516/ADT7517/ADT7519 offer four single-ended  
analog input channels. The analog input range is from 0 V to  
2.28 V, or 0 V to VDD. To maintain the linearity specification, it  
is recommended that the maximum VDD value be set at 5 V.  
Selection between the two input ranges is done by Bit C4 of the  
Control Configuration 3 register (Address 0x1A). Setting this  
bit to 0 sets up the analog input ADC reference to be sourced  
from the internal voltage reference of 2.28 V. Setting the bit to 1  
ADC TRANSFER FUNCTION  
The output coding of the ADT7516/ADT7517/ADT7519 analog  
inputs is straight binary. The designed code transitions occur  
midway between successive integer LSB values (that is, 1/2 LSB,  
3/2 LSB). The LSB is VDD/1024 or internal VREF/1024, internal  
sets up the ADC reference to be sourced from VDD  
.
The ADC resolution is 10 bits and is mostly suitable for dc  
input signals. Bits[C1:C2] of the Control Configuration 1  
register (Address 0x18) are used to set up Pin 7 and Pin 8 as  
AIN1 and AIN2. Figure 48 shows the overall view of the  
4-channel analog input path.  
VREF = 2.28 V. The ideal transfer characteristic is shown in  
Figure 51.  
111...111  
111...110  
M
U
L
T
I
AIN1  
AIN2  
AIN3  
AIN4  
111...000  
011...111  
TO ADC  
VALUE  
REGISTER  
10-BIT  
ADC  
P
L
E
X
E
R
1LSB = INT V  
REF  
/1024  
1LSB = V /1024  
DD  
000...010  
000...001  
000...000  
Figure 48. Quad Analog Input Path  
0V 1/2LSB  
+V  
– 1LSB  
REF  
ANALOG INPUT  
Converter Operation  
Figure 51. Single-Ended Transfer Function  
The analog input channels use a successive approximation ADC  
based on a capacitor DAC. Figure 49 and Figure 50 show simpli-  
fied schematics of the ADC. Figure 49 shows the ADC during  
acquisition phase. SW2 is closed and SW1 is in Position A.  
The comparator is held in a balanced condition and the  
sampling capacitor acquires the signal on AIN.  
To work out the voltage on any analog input channel, the  
following method can be used:  
1 LSB = reference (V)/1024  
Convert value read back from AIN value register into decimal.  
AIN voltage = AIN value (d) × LSB size  
where d = decimal.  
INT V  
V
REF  
DD  
REF  
CAP DAC  
SAMPLING  
CAPACITOR  
A
For example, if internal reference is used, VREF = 2.28 V.  
AIN value = 512d  
AIN  
SW1  
B
ACQUISITION  
PHASE  
1 LSB size = 2.28 V/1024 = 2.226 × 10−3  
SW2  
AIN voltage = 512 × 2.226 × 10−3 = 1.14 V  
CONTROL  
LOGIC  
REF/2  
Analog Input ESD Protection  
COMPARATOR  
Figure 52 shows the input structure on any of the analog input  
pins that provide ESD protection. The diode provides the main  
ESD protection for the analog inputs. Care must be taken that  
the analog input signal never drops below the GND rail by  
more than 200 mV. If this happens, the diode becomes forward-  
biased and starts conducting current into the substrate. The  
4 pF capacitor is the typical pin capacitance and the resistor is a  
lumped component made up of the on resistance of the  
multiplexer switch.  
Figure 49. ADC Acquisition Phase  
INT V  
V
DD  
REF  
REF  
CAP DAC  
SAMPLING  
CAPACITOR  
A
AIN  
SW1  
B
CONVERSION  
PHASE  
SW2  
CONTROL  
LOGIC  
REF/2  
COMPARATOR  
Figure 50. ADC Conversion Phase  
When the ADC eventually goes into conversion phase (see  
Figure 50), SW2 opens and SW1 moves to Position B, causing  
Rev. B | Page 23 of 44  
 
 
 
 
 
 
ADT7516/ADT7517/ADT7519  
100  
voltage limits are not masked out, then any out-of-limit compari-  
sons generate flags that are stored in the Interrupt Status 1  
register (Address = 0x00) and one or more out-of-limit results  
AIN  
4pF  
INT  
cause the INT/  
output to pull either high or low depending  
Figure 52. Equivalent Analog Input ESD Circuit  
on the output polarity setting. It is good design practice to mask  
out interrupts for channels that are of no concern to the  
application. Figure 53 shows the interrupt structure for the  
ADT7516/ ADT7517/ADT7519. It gives a block diagram  
representation of how the various measurement channels affect  
AIN Interrupts  
The measured results from the AIN inputs are compared with  
the AIN VHIGH (greater than comparison) and VLOW (less than or  
equal to comparison) limits. An interrupt occurs if the AIN  
inputs exceed or equal the limit registers. These voltage limits  
are stored in on-chip registers. Note that the limit registers are  
8 bits long and the AIN conversion result is 10 bits long. If the  
INT  
the INT/  
pin.  
S/W RESET  
INTERNAL  
TEMP  
INTERRUPT  
STATUS  
REGISTER  
(TEMP AND  
AIN1 TO AIN4)  
EXTERNAL  
TEMP  
V
DD  
WATCHDOG  
LIMIT  
COMPARISONS  
INTERRUPT  
INT/INT  
(LATCHED OUTPUT)  
MASK  
REGISTERS  
DIODE  
FAULT  
INTERRUPT  
STATUS  
REGISTER 2  
(V  
)
DD  
AIN1 TO AIN4  
INT/INT  
ENABLE BIT  
READ RESET  
CONTROL  
CONFIGURATION  
REGISTER 1  
Figure 53. ADT7516/ADT7517/ADT7519 Interrupt Structure  
Rev. B | Page 24 of 44  
 
ADT7516/ADT7517/ADT7519  
Temperature measurement is also initiated after every read or  
write to the part when the part is in either single-channel  
measurement mode or round robin measurement mode.  
FUNCTIONAL DESCRIPTION—MEASUREMENT  
Temperature Sensor  
The ADT7516/ADT7517/ADT7519 contain an ADC with  
special input signal conditioning to enable operation with  
external and on-chip diode temperature sensors. When the  
ADT7516/ADT7517/ADT7519 operate in single-channel mode,  
the ADC continually processes the measurement taken on one  
channel only. This channel is preselected by Bits[C0:C2] in the  
Control Configuration 2 register (Address 0x19). When in  
round robin mode, the analog input multiplexer sequentially  
selects the VDD input channel, the on-chip temperature sensor  
to measure its internal temperature, either the external tempera-  
ture sensor or AIN1 and AIN2, AIN3, and then AIN4. These  
signals are digitized by the ADC and the results are stored in  
the various value registers.  
Once serial communication has started, any conversion in  
progress stops and the ADC resets. Conversion restarts  
immediately after the serial communication has finished. The  
temperature measurement proceeds normally as described above.  
VDD Monitoring  
The ADT7516/ADT7517/ADT7519 also have the ability to  
monitor their own power supply. The part measures the voltage  
on its VDD pin to a resolution of 10 bits. The resulting value is  
stored in two 8-bit registers; the two LSBs are stored in register  
Address 0x03 and the eight MSBs are stored in register  
Address 0x06. This allows the option of doing just a 1-byte read  
if 10-bit resolution is not important. The measured result is  
compared with the VHIGH and VLOW limits. If the VDD interrupt is  
not masked, any out-of-limit comparison generates a flag in the  
Interrupt Status 2 register and one or more out-of-limit results  
The measured results from the temperature sensors are com-  
pared with the internal and external THIGH and TLOW limits.  
These temperature limits are stored in on-chip registers. If the  
temperature limits are not masked, any out-of-limit comparisons  
generate flags that are stored in the Interrupt Status 1 register.  
INT  
cause the INT/  
output to pull either high or low, depending  
on the output polarity setting.  
INT  
One or more out-of-limit results cause the INT/  
output to  
Measuring the voltage on the VDD pin is regarded as monitoring  
a channel along with the internal, external, and AIN channels.  
The user can select the VDD channel for single-channel  
measurement by setting Bit C4 = 1 and setting Bits[C0:C2] to all  
0s in the Control Configuration 2 register.  
pull either high or low depending on the output polarity setting.  
Theoretically, the temperature measuring circuit can measure  
temperatures from −128°C to +127°C with a resolution of  
0.25°C. However, temperatures outside TA are outside the  
guaranteed operating temperature range of the device.  
Temperature measurement from −128°C to +127°C is possible  
using an external sensor.  
When measuring the VDD value, the reference for the ADC is  
sourced from the internal reference. Table 8 shows the data  
format. As the maximum measurable VDD voltage is 7 V,  
internal scaling is performed on the VDD voltage to match the  
2.28 V internal reference value. Following is an example of how  
the transfer function works:  
Temperature measurement is initiated by three methods. The  
first method is applicable when the part is in single-channel  
measurement mode. The temperature is measured 16 times and  
internally averaged to reduce noise. In single-channel mode, the  
part is continuously monitoring the selected channel, that is, as  
soon as one measurement is taken another one is started on the  
same channel. The total time to measure a temperature channel  
with the ADC operating at slow speed is typically 11.4 ms  
(712 ꢁs × 16) for the internal temperature sensor and 24.22 ms  
(1.51 ms × 16) for the external temperature sensor. The new  
temperature value is stored in two 8-bit registers and is ready  
for reading by the I2C or SPI interface. The user has the option  
of disabling the averaging by setting Bit 5 in the Control  
Configuration 2 register (Address 0x19). The ADT7516/  
ADT7517/ADT7519 default on power-up is with averaging  
enabled.  
V
DD = 5 V  
ADC Reference = 2.28 V  
1 LSB = ADC Reference/210  
= 2.28/1024  
= 2.226 mV  
Scale Factor = Full-Scale VCC/ADC Reference  
= 7/2.28  
= 3.07  
Conversion Result = VDD/(Scale Factor × LSB size)  
= 5/(3.07 × 2.226 mV)  
= 0x2DC  
The second method is applicable when the part is in round  
robin measurement mode. The part measures both the internal  
and external temperature sensors as it cycles through all  
possible measurement channels. The two temperature channels  
are measured each time the part runs a round robin sequence.  
In round robin mode, the part is continuously measuring all  
channels.  
Rev. B | Page 25 of 44  
 
ADT7516/ADT7517/ADT7519  
writing to Bits[C0:C2] in the Control Configuration 2 register.  
For example, to select the VDD channel for monitoring, write to  
the Control Configuration 2 register and set C4 to 1 (if not done  
so already), then write all 0s to Bits[C0:C2]. All subsequent  
conversions are done on the VDD channel only. To change the  
channel selection to the internal temperature channel, write to  
the Control Configuration 2 register and set C0 = 1. When  
measuring in single channel mode, conversions on the channel  
selected occur directly after each other. Any communication to  
the ADT7516/ADT7517/ADT7519 stops the conversions, but  
they are restarted once the read or write operation is completed.  
Table 8. VDD Data Format (VREF = 2.28 V)  
Digital Output  
VDD Value (V)  
Binary  
Hex  
18B  
1B7  
200  
249  
292  
2DC  
325  
36E  
3B7  
3FF  
2.7  
3
3.5  
4
4.5  
5
5.5  
6
01 1000 1011  
01 1011 0111  
10 0000 0000  
10 0100 1001  
10 1001 0010  
10 1101 1100  
11 0010 0101  
11 0110 1110  
11 1011 0111  
11 1111 1111  
Temperature Measurement Method  
6.5  
7
Internal Temperature Measurement  
The ADT7516/ADT7517/ADT7519 contain an on-chip band  
gap temperature sensor whose output is digitized by the on-chip  
ADC. The temperature data is stored in the internal temperature  
value register. Because both positive and negative temperatures  
can be measured, the temperature data is stored in twos comple-  
ment format, as shown in Table 9. The thermal characteristics  
of the measurement sensor can change and, therefore, an offset  
is added to the measured value to enable the transfer function  
to match the thermal characteristics. This offset is added before  
the temperature data is stored. The offset value used is stored in  
the internal temperature offset register.  
On-Chip Reference  
The ADT7516/ADT7517/ADT7519 have an on-chip 1.2 V band  
gap reference that is gained up by a switched capacitor amplifier  
to give an output of 2.28 V. The amplifier is powered up for the  
duration of the device monitoring phase and is powered down  
once monitoring is disabled. This saves on current consumption.  
The internal reference is used as the reference for the ADC. The  
ADC is used for measuring VDD, internal temperature sensor,  
external temperature sensor, and AIN inputs. The internal  
reference is always used when measuring VDD, and the internal  
and external temperature sensors. The external reference is the  
default power-up reference for the DACs.  
External Temperature Measurement  
The ADT7516/ADT7517/ADT7519 can measure the temperature  
of one external diode sensor or diode-connected transistor.  
Round Robin Measurement  
On power-up, the ADT7516/ADT7517/ADT7519 go into round  
robin mode, but monitoring is disabled. Setting Bit C0 of the  
Control Configuration 1 register to 1 enables conversions. It  
sequences through all the available channels, taking a  
measurement from each in the following order: VDD, internal  
temperature sensor, external temperature sensor (AIN1 and  
AIN2), AIN3, and AIN4. Pin 7 and Pin 8 can be configured to  
be either external temperature sensor pins or standalone analog  
input pins. Once conversion is completed on the AIN4 channel,  
the device loops around for another measurement cycle. This  
method of taking a measurement on all the channels in one  
cycle is called round robin. Setting Bit C4 of Control  
The forward voltage of a diode or diode connected transistor,  
operated at a constant current, exhibits a negative temperature  
coefficient of about −2 mV/°C. Unfortunately, because the  
absolute value of VBE varies from device to device, and  
individual calibration is required to null this out, the technique  
is unsuitable for mass production.  
The technique used in the ADT7516/ADT7517/ADT7519 is to  
measure the change in VBE when the device is operated at two  
different currents. This is given by  
ΔVBE = kT/q × ln(N)  
where:  
Configuration 2 (Address 0x19) disables the round robin mode  
and in turn sets up the single-channel mode. In single-channel  
mode, only one channel (for example, the internal temperature  
sensor) is measured in each conversion cycle.  
k is Boltzmann’s constant.  
q is the charge on the carrier.  
T is the absolute temperature in kelvins.  
N is the ratio of the two currents.  
The time taken to monitor all channels is normally not of  
interest, because the most recently measured value can be read  
at any time. For applications where the round robin time is  
important, typical times at 25°C are given in the Specifications  
section.  
Figure 45 shows the input signal conditioning used to measure  
the output of an external temperature sensor. This figure shows  
the external sensor as a substrate transistor, provided for  
temperature monitoring on some microprocessors, but it can  
equally well be a discrete transistor.  
Single Channel Measurement  
If a discrete transistor is used, the collector is not grounded, and  
should be linked to the base. If a PNP transistor is used, the  
base is connected to the D− input and the emitter to the D+  
Setting C4 of the Control Configuration 2 register enables the  
single channel mode and allows the ADT7516/ADT7517/  
ADT7519 to focus on one channel only. A channel is selected by  
Rev. B | Page 26 of 44  
ADT7516/ADT7517/ADT7519  
input. If an NPN transistor is used, the emitter is connected to  
the D− input and the base to the D+ input.  
Try to minimize the number of copper/solder joints  
because they can cause thermocouple effects. Where  
copper/solder joints are used, make sure that they are in  
both the D+ and D− path and are at the same temperature.  
A 2N3906 is recommended as the external transistor.  
To prevent ground noise from interfering with the  
Thermocouple effects should not be a major problem  
because 1°C corresponds to about 240 ꢁV, and  
thermocouple voltages are about 3 ꢁV/°C of temperature  
difference. Unless there are two thermocouples with a big  
temperature differential between them, thermocouple  
voltages should be much less than 200 mV.  
measurement, the more negative terminal of the sensor is not  
referenced to ground, but is biased above ground by an internal  
diode at the D− input. As the sensor is operating in a noisy  
environment, C1 is provided as a noise filter. See the Layout  
Considerations section for more information on C1.  
To measure ꢂVBE, the sensor is switched between operating  
currents of I and N × I. The resulting waveform is passed  
through a low-pass filter to remove noise, then to a chopper  
stabilized amplifier that performs the functions of amplification  
and rectification of the waveform to produce a dc voltage  
proportional to ꢂVBE. This voltage is measured by the ADC to  
give a temperature output in 10-bit twos complement format.  
To further reduce the effects of noise, digital filtering is  
performed by averaging the results of 16 measurement cycles.  
Place 0.1 ꢁF bypass and 2200 pF input filter capacitors  
close to the ADT7516/ADT7517/ADT7519.  
If the distance to the remote sensor is more than 8 inches,  
the use of twisted-pair cable is recommended. This works  
up to about 6 feet to 12 feet.  
For long distances (up to 100 feet), use shielded twisted-  
pair cable, such as Belden® #8451 microphone cable. Connect  
the twisted pair to D+ and D− and the shield to GND, close  
to the ADT7516/ADT7517/ADT7519. Leave the remote  
end of the shield unconnected to avoid ground loops.  
Layout Considerations  
Digital boards can be electrically noisy environments and care  
must be taken to protect the analog inputs from noise, particu-  
larly when measuring the very small voltages from a remote  
diode sensor. The following precautions should be taken:  
Because the measurement technique uses switched current  
sources, excessive cable and/or filter capacitance can affect the  
measurement. When using long cables, the filter capacitor can  
be reduced or removed.  
Place the ADT7516/ADT7517/ADT7519 as close as  
possible to the remote sensing diode. Provided that the  
worst noise sources such as clock generators, data/address  
buses, and CRTs are avoided, this distance can be 4 inches  
to 8 inches.  
Cable resistance can also introduce errors. Series resistance of  
1 Ω introduces about 0.5°C error.  
Temperature Value Format  
One LSB of the ADC corresponds to 0.25°C. The ADC can  
theoretically measure a temperature span of 255°C. The internal  
temperature sensor is guaranteed to a low value limit of −40°C.  
It is possible to measure the full temperature span using the  
external temperature sensor. The temperature data format is  
shown in Table 9.  
Route the D+ and D− tracks close together, in parallel,  
with grounded guard tracks on each side. Provide a ground  
plane under the tracks, if possible.  
Use wide tracks to minimize inductance and reduce noise  
pickup. A 10 mil track minimum width and spacing is  
recommended.  
The result of the internal or external temperature measurements  
is stored in the temperature value registers, and is compared  
with limits programmed into the internal or external high and  
low registers.  
GND  
10MIL  
10MIL  
D+  
D–  
10MIL  
10MIL  
10MIL  
10MIL  
GND  
10MIL  
Figure 54. Arrangement of Signal Tracks  
Rev. B | Page 27 of 44  
 
 
ADT7516/ADT7517/ADT7519  
conversion results of measurements taken on the temperature,  
DD, and AIN channels. For example, the eight MSBs of the VDD  
Table 9. Temperature Data Format  
(Internal and External Temperature)  
V
measurement are stored in Register Address 0x06 and the two  
LSBs are stored in Register Address 0x03. These types of  
registers are linked so that when the LSB register is read first,  
the MSB registers associated with that LSB register are locked to  
prevent any updates. To unlock these MSB registers, the user only  
has to read any one of them; this has the effect of unlocking all  
previously locked MSB registers. Therefore, for the preceding  
example, if Register 0x03 is read first, MSB Register 0x06 and  
Register 0x07 would be locked to prevent any updates to them.  
If Register 0x06 is read, this register and Register 0x07 would be  
subsequently unlocked.  
Temperature  
Digital Output  
11 0110 0000  
11 1001 1100  
11 1101 1000  
11 1111 1111  
00 0000 0000  
00 0000 0001  
00 0010 1000  
00 0110 0100  
00 1100 1000  
01 0010 1100  
01 1001 0000  
01 1010 0100  
01 1111 0100  
–40°C  
–25°C  
–10°C  
–0.25°C  
0°C  
+0.25°C  
+10°C  
+25°C  
+50°C  
+75°C  
FIRST READ  
COMMAND  
LSB  
REGISTER  
OUTPUT  
DATA  
+100°C  
+105°C  
+125°C  
LOCK ASSOCIATED  
MSB REGISTERS  
Temperature conversion formula:  
Figure 55. Phase 1 of 10-Bit Read  
Positive Temperature = ADC Code/4  
Negative Temperature = (ADC Code – 512)/4  
where DB9 is removed from the ADC Code in the Negative  
Temperature equation.  
SECOND READ  
COMMAND  
MSB  
REGISTER  
OUTPUT  
DATA  
Interrupts  
UNLOCK ASSOCIATED  
MSB REGISTERS  
The measured results from the internal temperature sensor,  
external temperature sensor, VDD pin, and AIN inputs are  
compared with the THIGH/VHIGH (greater than comparison) and  
TLOW/VLOW (less than or equal to comparison) limits. An  
interrupt occurs if the measurement exceeds or equals the limit  
registers. These limits are stored in on-chip registers. Note that  
the limit registers are 8 bits long and the conversion results are  
10 bits long. If the limits are not masked, any out-of-limit  
comparisons generate flags that are stored in the Interrupt  
Status 1 register (Address 0x00) and Interrupt Status 2 register  
(Address 0x01). One or more out-of-limit results cause the  
Figure 56. Phase 2 of 10-Bit Read  
If an MSB register is read first, its corresponding LSB register is  
not locked, leaving the user with the option of just reading back  
8 bits (MSB) of a 10-bit conversion result. Reading an MSB  
register first does not lock other MSB registers, and likewise,  
reading an LSB register first does not lock other LSB registers.  
Table 10. ADT7516/ADT7517/ADT7519 Registers  
R/W  
Power-On  
Default  
Address Name  
INT  
INT/  
output to pull either high or low depending on the  
0x00  
0x01  
0x02  
0x03  
0x04  
0x05  
0x06  
0x07  
0x08  
0x09  
0x0A  
0x0B  
0x0C to  
0x0F  
0x10  
0x11  
0x12  
0x13  
Interrupt Status 1  
Interrupt Status 2  
Reserved  
Internal Temp and VDD LSBs  
External Temp and AIN1 to AIN4 LSBs  
Reserved  
0x00  
0x00  
output polarity setting. It is good design practice to mask out  
interrupts for channels that are of no concern to the application.  
0x00  
0x00  
0x00  
No default value  
0x00  
0x00  
0x00  
0x00  
0x00  
Figure 53 shows the interrupt structure for the ADT7516/  
ADT7517/ADT7519. It gives a block diagram representation of  
how the various measurement channels affect the INT/  
INT  
pin.  
VDD MSBs  
ADT7516/ADT7517/ADT7519 REGISTERS  
Internal Temp MSBs  
External Temp MSBs/AIN1 MSBs  
AIN2 MSBs  
AIN3 MSBs  
AIN4 MSBs  
The ADT7516/ADT7517/ADT7519 contain registers that are  
used to store the results of external and internal temperature  
measurements, VDD value measurements, analog input measure-  
ments, high and low temperature limits, supply voltage and  
analog input limits, set output DAC voltage levels, configure  
multipurpose pins, and generally to control the device. A  
description of these registers follows.  
Reserved  
0x00  
DAC A LSBs (ADT7516/ADT7517 Only)  
DAC A MSBs  
DAC B LSBs (ADT7516/ADT7517 Only)  
DAC B MSBs  
0x00  
0x00  
0x00  
0x00  
The register map is divided into registers of 8 bits. Each register  
has its own individual address, but some consist of data that is  
linked with other registers. These registers hold the 10-bit  
Rev. B | Page 28 of 44  
 
 
 
ADT7516/ADT7517/ADT7519  
Table 11.  
Bit Function  
R/W  
Power-On  
Default  
Address Name  
0x14  
0x15  
0x16  
0x17  
0x18  
0x19  
0x1A  
0x1B  
0x1C  
0x1D  
0x1E  
0x1F  
0x20  
0x21  
0x22  
0x23  
0x24  
0x25  
0x26  
0x27  
0x28  
DAC C LSBs (ADT7516/ADT7517 only)  
DAC C MSBs  
DAC D LSBs (ADT7516/ADT7517 only)  
DAC D MSBs  
Control Configuration 1  
Control Configuration 2  
Control Configuration 3  
DAC Configuration  
LDAC Configuration  
Interrupt Mask 1  
0x00  
0x00  
0x00  
0x00  
0x00  
0x00  
0x00  
0x00  
0x00  
0x00  
0x00  
0x00  
0x00  
0xD8  
0xD8  
0xC7  
0x62  
0x64  
0xC9  
0xFF  
0x00  
D0 1 when the internal temperature value exceeds THIGH limit.  
Any internal temperature reading greater than the set limit  
causes an out-of-limit event.  
D1 1 when internal temperature value exceeds TLOW limit. Any  
internal temperature reading less than or equal to the set  
limit causes an out-of-limit event.  
D2 This status bit is linked to the configuration of Pin 7 and  
Pin 8. If configured for external temperature sensor, this bit  
is 1 when the external temperature value exceeds THIGH  
limit. The default value for this limit register is –1°C, so any  
external temperature reading greater than the set limit  
causes an out-of-limit event. If configured for AIN1 and  
AIN2, this bit is 1 when AIN1 input voltage exceeds VHIGH or  
Interrupt Mask 2  
Internal Temp Offset  
External Temp Offset  
Internal Analog Temp Offset  
External Analog Temp Offset  
VDD VHIGH Limit  
VDD VLOW Limit  
Internal THIGH Limit  
Internal TLOW Limit  
VLOW limits.  
D3 1 when external temperature value exceeds TLOW limit. The  
default value for this limit register is 0°C, so any external  
temperature reading less than or equal to the set limit  
causes an out-of-limit event.  
D4 1 indicates a fault (open or short) for the external  
temperature sensor.  
D5 1 when AIN2 voltage is greater than its corresponding VHIGH  
limit. 1 when AIN2 voltage is less than or equal to its  
corresponding VLOW limit.  
D6 1 when AIN3 voltage is greater than its corresponding VHIGH  
limit. 1 when AIN3 voltage is less than or equal to its  
corresponding VLOW limit.  
External THIGH/AIN1 VHIGH Limits  
External TLOW/AIN1 VLOW Limits  
Reserved  
0x29 to  
0x2A  
0x2B  
0x2C  
0x2D  
0x2E  
0x2F  
0x30  
0x31 to  
0x4C  
0x4D  
0x4E  
0x4F  
AIN2 VHIGH Limit  
AIN2 VLOW Limit  
AIN3 VHIGH Limit  
AIN3 VLOW Limit  
AIN4 VHIGH Limit  
AIN4 VLOW Limit  
Reserved  
0xFF  
0x 00  
0xFF  
0x00  
0xFF  
0x00  
D7 1 when AIN4 voltage is greater than its corresponding VHIGH  
limit. 1 when AIN4 voltage is less than or equal to its  
corresponding VLOW limit.  
Interrupt Status 2 Register (Read-Only) [Address = 0x01]  
This 8-bit read-only register reflects the status of the VDD  
INT  
interrupt that can cause the INT/  
pin to go active. This  
register is reset by a read operation, provided that any out-of-  
limit event has been corrected. It is also reset by a software reset.  
Device ID  
Manufacturer’s ID  
Silicon Revision  
0x03/0x0B/0x07  
0x41  
Check register  
for current  
D7  
D6  
D5  
D4  
01  
D3  
D2  
D1  
D0  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
1 Default settings at power-up.  
silicon revision  
0x50 to  
0x7E  
0x7F  
0x80 to  
0xFF  
Reserved  
0x00  
Table 12.  
Bit Function  
SPI Lock Status  
Reserved  
0x00  
0x00  
D4 1 when VDD value is greater than its corresponding VHIGH  
limit. 1 when VDD is less than or equal to its corresponding  
V
LOW limit.  
Interrupt Status 1 Register (Read-Only) [Address 0x00]  
Internal Temperature Value/VDD Value Register LSBs  
(Read-Only) [Address = 0x03]  
This 8-bit read-only register reflects the status of some of the  
INT  
interrupts that can cause the INT/  
pin to go active. This  
This 8-bit read-only register stores the two LSBs of the 10-bit  
temperature reading from the internal temperature sensor and  
the two LSBs of the 10-bit supply voltage reading.  
register is reset by a read operation, provided that any out-of-  
limit event has been corrected. It is also reset by a software reset.  
D7  
D6  
D5  
D4  
01  
D3  
01  
D2  
01  
D1  
01  
D0  
01  
D7  
D6  
D5  
D4  
D3  
V1  
01  
D2  
LSB  
01  
D1  
T1  
01  
D0  
LSB  
01  
01  
01  
01  
N/A  
N/A  
N/A  
N/A  
N/A  
1 Default settings at power-up.  
N/A  
N/A  
N/A  
1 Default settings at power-up.  
Rev. B | Page 29 of 44  
ADT7516/ADT7517/ADT7519  
Table 13.  
temperature value is stored in twos complement format. The  
eight MSBs of the 10-bit value are stored in this register.  
Bit  
D0  
D1  
D2  
D3  
Function  
LSB of internal temperature value.  
Bit 1 of internal temperature value.  
LSB of VDD value.  
D7  
T/A9  
01  
D6  
T/A8  
01  
D5  
T/A7  
01  
D4  
T/A6  
01  
D3  
T/A5  
01  
D2  
T/A4  
01  
D1  
T/A3  
01  
D0  
T/A2  
01  
Bit 1 of VDD value.  
1 Default settings at power-up.  
External Temperature Value and Analog Input 1 to  
Analog Input 4 Register LSBs (Read-Only) [Address = 0x04]  
AIN2 Register MSBs (Read) [Address = 0x09]  
This 8-bit read register contains the eight MSBs of the AIN2  
analog input voltage word. The value in this register is combined  
with Bits[D2:D3] of the external temperature value and Analog  
Input 1 to Analog Input 4 register LSBs, Address 0x04, to give the  
full 10-bit conversion result of the analog value on the AIN2 pin.  
This is an 8-bit, read-only register. Bits[D2:D7] store the two  
LSBs of the analog inputs AIN2 to AIN4. Bits[D0:D1] store the  
two LSBs of either the external temperature value or AIN1 input  
value. The type of input for D0 and D1 is selected by Bits[C1:C2]  
of the Control Configuration Register 1.  
D7  
MSB  
01  
D6  
A8  
01  
D5  
A7  
01  
D4  
A6  
01  
D3  
A5  
01  
D2  
A4  
01  
D1  
A3  
01  
D0  
A2  
01  
D7  
A4  
01  
D6  
D5  
A3  
01  
D4  
A3LSB  
01  
D3  
A2  
01  
D2  
A2LSB  
01  
D1  
T/A  
01  
D0  
A4LSB  
01  
T/ALSB  
01  
1 Default settings at power-up.  
1 Default settings at power-up.  
AIN3 Register MSBs (Read) [Address = 0x0A]  
Table 14.  
This 8-bit read register contains the eight MSBs of the AIN3  
analog input voltage word. The value in this register is combined  
with Bits[D4:D5] of the external temperature value and Analog  
Input 1 to Analog Input 4 register LSBs, Address 0x04, to give the  
full 10-bit conversion result of the analog value on the AIN3 pin.  
Bit  
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
Function  
LSB of external temperature value or AIN1 value.  
Bit 1 of external temperature value or AIN1 value.  
LSB of AIN2 value.  
Bit 1 of AIN2 value.  
LSB of AIN3 value.  
Bit 1 of AIN3 value.  
LSB of AIN4 value.  
Bit 1 of AIN4 value.  
D7  
MSB  
01  
D6  
A8  
01  
D5  
A7  
01  
D4  
A6  
01  
D3  
A5  
01  
D2  
A4  
01  
D1  
A3  
01  
D0  
A2  
01  
1 Default settings at power-up.  
AIN4 Register MSBs (Read) [Address = 0x0B]  
VDD Value Register MSBs (Read-Only) [Address = 0x06]  
This 8-bit read register contains the eight MSBs of the AIN4  
analog input voltage word. The value in this register is combined  
with Bits[D6:D7] of the external temperature value and Analog  
Input 1 to Analog Input 4 register LSBs, Address 0x04, to give the  
full 10-bit conversion result of the analog value on the AIN4 pin.  
This 8-bit read-only register stores the supply voltage value. The  
eight MSBs of the 10-bit value are stored in this register.  
D7  
V9  
x1  
D6  
V8  
x1  
D5  
V7  
x1  
D4  
V6  
x1  
D3  
V5  
x1  
D2  
V4  
x1  
D1  
V3  
x1  
D0  
V2  
x1  
D7  
MSB  
01  
D6  
A8  
01  
D5  
A7  
01  
D4  
A6  
01  
D3  
A5  
01  
D2  
A4  
01  
D1  
A3  
01  
D0  
A2  
01  
1 Loaded with VDD value after power-up.  
Internal Temperature Value Register MSBs (Read-Only)  
[Address = 0x07]  
1 Default settings at power-up.  
This 8-bit read-only register stores the internal temperature value  
from the internal temperature sensor in twos complement format.  
The eight MSBs of the 10-bit value are stored in this register.  
DAC A Register LSBs (Read/Write) [Address = 0x10]  
This 8-bit read/write register contains the 4/2 LSBs of the  
ADT7516/ADT7517 DAC A word, respectively. The value in  
this register is combined with the value in the DAC A register  
MSBs and converted to an analog voltage on the VOUT-A pin.  
On power-up, the voltage output on the VOUT-A pin is 0 V.  
D7  
T9  
01  
D6  
T8  
01  
D5  
T7  
01  
D4  
T6  
01  
D3  
T5  
01  
D2  
T4  
01  
D1  
T3  
01  
D0  
T2  
01  
1 Default settings at power-up.  
ADT7516  
External Temperature Value or Analog Input AIN1  
Register MSBs (Read-Only) [Address = 0x08]  
D7  
B3  
01  
D6  
B2  
01  
D5  
B1  
01  
D4  
LSB  
01  
D3  
D2  
D1  
D0  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
This 8-bit read-only register stores, if selected, the external  
temperature value or the analog input AIN1 value. Selection is  
done in the Control Configuration 1 register. The external  
1 Default settings at power-up.  
Rev. B | Page 30 of 44  
ADT7516/ADT7517/ADT7519  
ADT7517  
ADT7516  
D7  
B1  
01  
D6  
LSB  
01  
D5  
D4  
D3  
D2  
D1  
D0  
D7  
B3  
01  
D6  
B2  
01  
D5  
B1  
01  
D4  
LSB  
01  
D3  
D2  
D1  
D0  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
1 Default settings at power-up.  
1 Default settings at power-up.  
DAC A Register MSBs (Read/Write) [Address = 0x11]  
ADT7517  
This 8-bit read/write register contains the eight MSBs of the  
DAC A word. The value in this register is combined with the  
value in the DAC A register LSBs and converted to an analog  
voltage on the VOUT-A pin. On power-up, the voltage output on  
the VOUT-A pin is 0 V.  
D7  
B1  
01  
D6  
LSB  
01  
D5  
D4  
D3  
D2  
D1  
D0  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
1 Default settings at power-up.  
DAC C Register MSBs (Read/Write) [Address = 0x15]  
D7  
MSB  
01  
D6  
B8  
01  
D5  
B7  
01  
D4  
B6  
01  
D3  
B5  
01  
D2  
B4  
01  
D1  
B3  
01  
D0  
B2  
01  
This 8-bit read/write register contains the eight MSBs of the  
DAC C word. The value in this register is combined with the  
value in the DAC C register LSBs and converted to an analog  
voltage on the VOUT-C pin. On power-up, the voltage output on  
the VOUT-C pin is 0 V.  
1 Default settings at power-up.  
DAC B Register LSBs (Read/Write) [Address = 0x12]  
This 8-bit read/write register contains the 4/2 LSBs of the  
D7  
MSB B8  
01 01  
D6  
D5  
B7  
01  
D4  
B6  
01  
D3  
B5  
01  
D2  
B4  
01  
D1  
B3  
01  
D0  
B2  
01  
ADT7516/ADT7517 DAC B word, respectively. The value in  
this register is combined with the value in the DAC B register  
MSBs and converted to an analog voltage on the VOUT-B pin. On  
power-up, the voltage output on the VOUT-B pin is 0 V.  
1 Default settings at power-up.  
DAC D Register LSBs (Read/Write) [Address = 0x16]  
ADT7516  
This 8-bit read/write register contains the 4/2 LSBs of the  
D7  
B3  
01  
D6  
B2  
01  
D5  
B1  
01  
D4  
LSB  
01  
D3  
D2  
D1  
D0  
ADT7516/ADT7517 DAC D word, respectively. The value in  
this register is combined with the value in the DAC D register  
MSBs and converted to an analog voltage on the VOUT-D pin.  
On power-up, the voltage output on the VOUT-D pin is 0 V.  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
1 Default settings at power-up.  
ADT7517  
ADT7516  
D7  
B1  
01  
D6  
LSB  
01  
D5  
D4  
D3  
D2  
D1  
D0  
D7  
B3  
01  
D6  
B2  
01  
D5  
B1  
01  
D4  
LSB  
01  
D3  
D2  
D1  
D0  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
1 Default settings at power-up.  
1 Default settings at power-up.  
DAC B Register MSBs (Read/Write) [Address = 0x13]  
ADT7517  
This 8-bit read/write register contains the eight MSBs of the  
DAC B word. The value in this register is combine with the  
value in the DAC B register LSBs and converts to an analog  
voltage on the VOUT-B pin. On power-up, the voltage output on  
the VOUT-B pin is 0 V.  
D7  
B1  
01  
D6  
LSB  
01  
D5  
D4  
D3  
D2  
D1  
D0  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
1 Default settings at power-up.  
DAC D Register MSBs (Read/Write) [Address = 0x17]  
D7  
MSB  
01  
D6  
B8  
01  
D5  
B7  
01  
D4  
B6  
01  
D3  
B5  
01  
D2  
B4  
01  
D1  
B3  
01  
D0  
B2  
01  
This 8-bit read/write register contains the eight MSBs of the  
DAC D word. The value in this register combines with the value  
in the DAC D register LSBs and converts to an analog voltage  
on the VOUT-D pin. On power-up, the voltage output on the  
1 Default settings at power-up.  
VOUT-D pin is 0 V.  
DAC C Register LSBs (Read/Write) [Address = 0x14]  
This 8-bit read/write register contains the 4/2 LSBs of the  
D7  
MSB  
01  
D6  
B8  
01  
D5  
B7  
01  
D4  
B6  
01  
D3  
B5  
01  
D2  
B4  
01  
D1  
B3  
01  
D0  
B2  
01  
ADT7516/ADT7517 DAC C word, respectively. The value in  
this register is combined with the value in the DAC C register  
MSBs and converted to an analog voltage on the VOUT-C pin.  
On power-up, the voltage output on the VOUT-C pin is 0 V.  
1 Default settings at power-up.  
Rev. B | Page 31 of 44  
ADT7516/ADT7517/ADT7519  
Control Configuration 1 Register (Read/Write)  
[Address = 0x18]  
Table 17.  
Bit  
Function  
[C0:C2] In single-channel mode, these bits select between VDD,  
the internal temperature sensor, external temperature  
sensor/AIN1, AIN2, AIN3, and AIN4 for conversion. The  
default is VDD.  
This configuration register is an 8-bit read/write register that is  
used to set up some of the operating modes of the ADT7516/  
ADT7517/ADT7519.  
000 = VDD.  
Table 15. Control Configuration 1  
001 = internal temperature sensor.  
010 = external temperature sensor/AIN1.  
(Bits[C1:C2] of the Control Configuration 1 register  
affect this selection).  
D7  
PD  
01  
D6  
C6  
01  
D5  
C5  
01  
D4  
C4  
01  
D3  
C3  
01  
D2  
C2  
01  
D1  
C1  
01  
D0  
C0  
01  
1 Default settings at power-up.  
011 = AIN2.  
100 = AIN3.  
101 = AIN4.  
110 to 111 = reserved.  
Table 16.  
Bit  
Function  
C0  
This bit enables/disables conversions in round robin  
and single-channel mode.  
ADT7516/ADT7517/ADT7519 powers up in round  
robin mode but monitoring is not initiated until this bit  
is set. The default = 0.  
0 = stop monitoring.  
1 = start monitoring.  
C3  
C4  
Reserved.  
Selects between single-channel and round robin  
conversion cycle. The default is round robin.  
0 = round robin.  
1 = single channel.  
C5  
Default condition is to average every measurement on  
all channels 16 times. This bit disables this averaging.  
Channels affected are temperature, analog inputs, and  
VDD.  
0 = enable averaging.  
1 = disable averaging.  
SMBus timeout on the serial clock puts a 25 ms limit  
on the pulse width of the clock, ensuring that a fault  
on the master SCL does not lock up the SDA line.  
0 = disable SMBus timeout.  
[C1:C2] Selects between the two different analog inputs on  
Pin 7 and Pin 8. ADT7516/ADT7517/ADT7519 powers  
up with AIN1 and AIN2 selected.  
00 = AIN1 and AIN2 selected.  
01 = undefined.  
10 = external TDM selected.  
11 = undefined.  
Selects between digital (LDAC) and analog inputs  
(AIN3) on Pin 9. When AIN3 is selected, Bit C3 of the  
Control Configuration 3 register is masked and has no  
effect until LDAC is selected as the input on Pin 9.  
0 = LDAC selected.  
C6  
C7  
C3  
1 = enable SMBus timeout.  
Software Reset. Setting this bit to 1 causes a software  
reset. All registers and DAC outputs reset to their  
default settings.  
1 = AIN3 selected.  
C4  
C5  
Reserved. Write 0 only.  
0 = enable INT/INT output.  
1 = disable INT/INT output.  
Control Configuration 3 Register (Read/Write)  
[Address = 0x1A]  
This configuration register is an 8-bit read/write register that is  
used to set up some of the operating modes of the ADT7516/  
ADT7517/ADT7519.  
C6  
PD  
Configures INT/INT output polarity.  
0 = active low.  
1 = active high.  
Power-Down Bit. Setting this bit to 1 puts the  
ADT7516/ADT7517/ADT7519 into standby mode. In  
this mode, both ADC and DACs are fully powered  
down, but the serial interface is still operational. To  
power up the part again, just write 0 to this bit.  
D7  
C7  
01  
D6  
C6  
01  
D5  
C5  
01  
D4  
C4  
01  
D3  
C3  
01  
D2  
C2  
01  
D1  
C1  
01  
D0  
C0  
01  
1 Default settings at power-up.  
Control Configuration 2 Register (Read/Write)  
[Address = 0x19]  
This configuration register is an 8-bit read/write register that is  
used to set up some of the operating modes of the ADT7516/  
ADT7517/ADT7519.  
D7  
C7  
01  
D6  
C6  
01  
D5  
C5  
01  
D4  
C4  
01  
D3  
C3  
01  
D2  
C2  
01  
D1  
C1  
01  
D0  
C0  
01  
1 Default settings at power-up.  
Rev. B | Page 32 of 44  
ADT7516/ADT7517/ADT7519  
Table 18.  
Bit  
Function  
Bit Function  
[D4:D5] 00 = MSB write to any DAC register generates LDAC  
command that updates that DAC only.  
C0 Selects between fast and slow ADC conversion speeds.  
0 = ADC clock at 1.4 kHz.  
01 = MSB write to DAC B or DAC D register generates  
LDAC command that updates DAC A and DAC B or  
DAC C and DAC D, respectively.  
10 = MSB write to DAC D register generates LDAC  
command that updates all four DACs.  
1 = ADC clock at 22.5 kHz. D+ and D– analog filters are  
disabled.  
C1 On the ADT7516 and ADT7517, this bit selects between  
8-bit and 10-bit DAC output resolution on the thermal  
voltage output feature. The default is 8 bits. This bit has no  
effect on the ADT7519 output because this part has only  
an 8-bit DAC. For the ADT7519, write 0 to this bit.  
0 = 8-bit resolution.  
11 = LDAC command generated from LDAC register.  
[D6:D7] Reserved. Write 0s only.  
LDAC Configuration Register (Write-Only)[Address = 0x1C]  
1 = 10-bit resolution.  
This configuration register is an 8-bit write register that is used  
C2 Reserved. Write 0 only.  
C3 0 = LDAC pin controls updating of DAC outputs.  
1 = DAC configuration register and LDAC configuration  
register control updating of DAC outputs.  
C4 Selects the ADC reference to be either internal VREF or VDD  
to control the updating of the quad DAC outputs if the  
LDAC  
pin is disabled and Bits[D4:D5] of the DAC configuration  
register are both set to 1. Also selects either the internal or the  
external VREF for all four DACs. Bits[D0:D3] in this register are  
self-clearing, that is, reading back from this register always gives  
0s for these bits.  
for analog inputs.  
0 = internal VREF.  
1 = VDD.  
D7  
D7  
01  
D6  
D6  
01  
D5  
D5  
01  
D4  
D4  
01  
D3  
D3  
01  
D2  
D2  
01  
D1  
D1  
01  
D0  
D0  
01  
C5 Setting this bit selects DAC A voltage output to be  
proportional to the internal temperature measurement.  
C6 Setting this bit selects DAC B voltage output to be  
proportional to the external temperature measurement.  
1 Default settings at power-up.  
Table 20.  
C7 Reserved. Write 0 only.  
Bit  
Function  
DAC Configuration Register (Read/Write) [Address = 0x1B]  
D0  
Writing a 1 to this bit generates the LDAC command  
to update DAC A output only.  
Writing a 1 to this bit generates the LDAC command  
to update DAC B output only.  
Writing a 1 to this bit generates the LDAC command  
to update DAC C output only.  
Writing a 1 to this bit generates the LDAC command  
to update DAC D output only.  
Selects either internal VREF or external VREF for DAC A  
and DAC B.  
0 = external VREF  
1 = internal VREF  
This configuration register is an 8-bit read/write register that is  
used to control the output ranges of all four DACs and also to  
D1  
D2  
D3  
D4  
LDAC  
control the loading of the DAC registers if the  
pin is  
disabled (Bit C3 = 1, Control Configuration 3 register).  
D7  
D7  
01  
D6  
D6  
01  
D5  
D5  
01  
D4  
D4  
01  
D3  
D3  
01  
D2  
D2  
01  
D1  
D1  
01  
D0  
D0  
01  
1 Default settings at power-up.  
.
.
Table 19.  
Bit  
Function  
Selects the output range of DAC A.  
0 = 0 V to VREF  
1 = 0 V to 2 VREF  
Selects the output range of DAC B.  
0 = 0 V to VREF  
1 = 0 V to 2 VREF  
Selects the output range of DAC C.  
0 = 0 V to VREF  
1 = 0 V to 2 VREF  
Selects the output range of DAC D.  
0 = 0 V to VREF  
1 = 0 V to 2 VREF  
D5  
Selects either internal VREF or external VREF for DAC C  
and DAC D.  
D0  
0 = external VREF  
1 = internal VREF  
.
.
.
.
[D6:D7] Reserved. Write 0s only.  
D1  
D2  
D3  
.
Interrupt Mask 1 Register (Read/Write) [Address = 0x1D]  
.
This mask register is an 8-bit read/write register that can be  
used to mask any interrupts that can cause the INT/  
go active.  
INT  
.
pin to  
.
D7  
D7  
01  
D6  
D6  
01  
D5  
D5  
01  
D4  
D4  
01  
D3  
D3  
01  
D2  
D2  
01  
D1  
D0  
D0  
01  
.
D1  
01  
.
1 Default settings at power-up.  
Rev. B | Page 33 of 44  
ADT7516/ADT7517/ADT7519  
External Temperature Offset Register (Read/Write)  
[Address = 0x20]  
Table 21.  
Bit Function  
This register contains the offset value for the external temperature  
channel. A twos complement number can be written to this  
register and is then added to the measured result before it is  
stored or compared to limits. In this way, a one-point calibration  
can be done, whereby the whole transfer function of the channel  
can be moved up or down. From a software point of view, this  
can be a very simple method to vary the characteristics of the  
measurement channel if the thermal characteristics change.  
Because it is an 8-bit register, the temperature resolution is 1°C.  
D0 0 = enable internal THIGH interrupt.  
1 = disable internal THIGH interrupt.  
D1 0 = enable internal TLOW interrupt.  
1 = disable internal TLOW interrupt.  
D2 0 = enable external THIGH interrupt or AIN1 interrupt.  
1 = disable external THIGH interrupt or AIN1 interrupt.  
D3 0 = enable external TLOW interrupt.  
1 = disable external TLOW interrupt.  
D4 0 = enable external temperature fault interrupt.  
1 = disable external temperature fault interrupt.  
D5 0 = enable AIN2 interrupt.  
D7  
D7  
01  
D6  
D6  
01  
D5  
D5  
01  
D4  
D4  
01  
D3  
D3  
01  
D2  
D2  
01  
D1  
D1  
01  
D0  
D0  
01  
1 = disable AIN2 interrupt.  
D6 0 = enable AIN3 interrupt.  
1 Default settings at power-up.  
1 = disable AIN3 interrupt.  
D7 0 = enable AIN4 interrupt.  
Internal Analog Temperature Offset Register  
(Read/Write) [Address = 0x21]  
1 = disable AIN4 interrupt.  
Interrupt Mask 2 Register (Read/Write) [Address = 0x1E]  
This register contains the offset value for the internal thermal  
voltage output. A twos complement number can be written to  
this register and then added to the measured result before it is  
converted by DAC A. Varying the value in this register has the  
effect of varying the temperature span. For example, the output  
voltage can represent a temperature span of −128°C to +127°C  
or even 0°C to +127°C. In essence, this register changes the  
position of 0 V on the temperature scale. Temperatures other  
than −128°C to +127°C produce an upper deadband on the  
DAC A output. Because it is an 8-bit register, the temperature  
resolution is 1°C. The default value is −40°C.  
This mask register is an 8-bit read/write register that can be  
used to mask any interrupts that can cause the INT/  
pin to  
INT  
go active.  
D7  
D7  
01  
D6  
D6  
01  
D5  
D5  
01  
D4  
D4  
01  
D3  
D3  
01  
D2  
D2  
01  
D1  
D0  
D0  
01  
D1  
01  
1 Default settings at power-up.  
Table 22.  
Bit  
Function  
[D0:D3]  
D4  
Reserved. Write 0s only.  
0 = enable VDD interrupts.  
1 = disable VDD interrupts.  
D7  
D7  
11  
D6  
D6  
11  
D5  
D5  
01  
D4  
D4  
11  
D3  
D3  
11  
D2  
D2  
01  
D1  
D1  
01  
D0  
D0  
01  
[D5:D7]  
Reserved. Write 0s only.  
1 Default settings at power-up.  
Internal Temperature Offset Register (Read/Write)  
[Address = 0x1F]  
External Analog Temperature Offset Register  
(Read/Write) [Address = 0x22]  
This register contains the offset value for the internal temperature  
channel. A twos complement number can be written to this  
register and then added to the measured result before it is stored  
or compared to limits. In this way, a one-point calibration can  
be done, whereby the whole transfer function of the channel  
can be moved up or down. From a software point of view, this  
can be a very simple method to vary the characteristics of the  
measurement channel if the thermal characteristics change.  
Because it is an 8-bit register, the temperature resolution is 1°C.  
This register contains the offset value for the external thermal  
voltage output. A twos complement number can be written to  
this register and then added to the measured result before it is  
converted by DAC B. Varying the value in this register has the  
effect of varying the temperature span. For example, the output  
voltage can represent a temperature span of −128°C to +127°C  
or even 0°C to +127°C. In essence, this register changes the  
position of 0 V on the temperature scale. Temperatures other  
than −128°C to +127°C produce an upper deadband on the  
DAC B output. Because it is an 8-bit register, the temperature  
resolution is 1°C. The default value is −40°C.  
D7  
D7  
01  
D6  
D6  
01  
D5  
D5  
01  
D4  
D4  
01  
D3  
D3  
01  
D2  
D2  
01  
D1  
D1  
01  
D0  
D0  
01  
D7  
D7  
11  
D6  
D6  
11  
D5  
D5  
01  
D4  
D4  
11  
D3  
D3  
11  
D2  
D2  
01  
D1  
D1  
01  
D0  
D0  
01  
1 Default settings at power-up.  
1 Default settings at power-up.  
Rev. B | Page 34 of 44  
ADT7516/ADT7517/ADT7519  
VDD VHIGH Limit Register (Read/Write) [Address = 0x23]  
External THIGH/AIN1 VHIGH Limit Register (Read/Write)  
[Address = 0x27]  
This limit register is an 8-bit read/write register that stores the  
If Pin 7 and Pin 8 are configured for the external temperature  
sensor, this limit register is an 8-bit read/write register that  
stores the twos complement of the external temperature upper  
V
INT/  
DD upper limit, and causes an interrupt and activates the  
INT  
output (if enabled). For this to happen, the measured  
VDD value has to be greater than the value in this register. The  
INT  
limit, and causes an interrupt and activates the INT/  
output  
default value is 5.46 V.  
(if enabled). For this to happen, the measured external  
temperature value has to be greater than the value in this  
register. Because it is an 8-bit register, the temperature  
resolution is 1°C. The default value is −1°C.  
D7  
D7  
11  
D6  
D6  
11  
D5  
D5  
01  
D4  
D4  
01  
D3  
D3  
01  
D2  
D2  
11  
D1  
D1  
11  
D0  
D0  
11  
1 Default settings at power-up.  
Positive Temperature = Limit Register Code (d)  
VDD VLOW Limit Register (Read/Write) [Address = 0x24]  
Negative Temperature = Limit Register Code (d) − 256  
This limit register is an 8-bit read/write register that stores the  
If Pin 7 and Pin 8 are configured for AIN1 and AIN2 inputs,  
this limit register is an 8-bit read/write register that stores the  
AIN1 input upper limit, and causes an interrupt and activates  
VDD lower limit, and causes an interrupt and activates the  
INT  
INT/  
output (if enabled). For this to happen, the measured  
VDD value has to be less than or equal to the value in this  
register. The default value is 2.7 V.  
INT  
the INT/  
output (if enabled). For this to happen, the  
measured AIN1 value has to be greater than the value in this  
register. Because it is an 8-bit register, the resolution is four  
times less than the resolution of the 10-bit ADC. Because the  
power-up default settings for Pin 7 and Pin 8 are AIN1 and  
AIN2 inputs, the default value for this limit register is full-scale  
voltage.  
D7  
D7  
01  
D6  
D6  
11  
D5  
D5  
11  
D4  
D4  
01  
D3  
D3  
01  
D2  
D2  
01  
D1  
D1  
11  
D0  
D0  
01  
1 Default settings at power-up.  
Internal THIGH Limit Register (Read/Write) [Address = 0x25]  
D7  
D7  
11  
D6  
D6  
11  
D5  
D5  
11  
D4  
D4  
11  
D3  
D3  
11  
D2  
D2  
11  
D1  
D1  
11  
D0  
D0  
11  
This limit register is an 8-bit read/write register that stores the twos  
complement of the internal temperature upper limit, and causes  
INT  
an interrupt and activates the INT/  
output (if enabled). For this  
1 Default settings at power-up.  
to happen, the measured internal temperature value has to be  
greater than the value in this register. Because it is an 8-bit register,  
the temperature resolution is 1°C. The default value is +100°C.  
External TLOW/AIN1 VLOW Limit Register (Read/Write)  
[Address = 0x28]  
Positive Temperature = Limit Register Code (d)  
If Pin 7 and Pin 8 are configured for the external temperature  
sensor, this limit register is an 8-bit read/write register that  
stores the twos complement of the external temperature lower  
Negative Temperature = Limit Register Code (d) − 256  
D7  
D7  
01  
D6  
D6  
11  
D5  
D5  
11  
D4  
D4  
01  
D3  
D3  
01  
D2  
D2  
11  
D1  
D1  
01  
D0  
D0  
01  
INT  
limit, and causes an interrupt and activates the INT/  
output  
(if enabled). For this to happen, the measured external  
temperature value has to be more negative than or equal to the  
value in this register. Because it is an 8-bit register, the  
temperature resolution is 1°C. The default value is 0°C.  
1 Default settings at power-up.  
Internal TLOW Limit Register (Read/Write) [Address = 0x26]  
Positive Temperature = Limit Register Code (d)  
This limit register is an 8-bit read/write register that stores the  
twos complement of the internal temperature lower limit, and  
Negative Temperature = Limit Register Code (d) − 256  
INT  
causes an interrupt and activates the INT/  
output (if enabled).  
If Pin 7 and Pin 8 are configured for AIN1 and AIN2 inputs,  
this limit register is an 8-bit read/write register that stores the  
AIN1 input lower limit, and causes an interrupt and activates  
For this to happen, the measured internal temperature value has  
to be more negative than or equal to the value in this register.  
Because it is an 8-bit register, the temperature resolution is 1°C.  
The default value is −55°C.  
INT  
the INT/  
output (if enabled). For this to happen, the  
measured AIN1 value has to be less than or equal to the value in  
this register. Because it is an 8-bit register, the resolution is four  
times less than the resolution of the 10-bit ADC. Because the  
power-up default settings for Pin 7 and Pin 8 are AIN1 and  
AIN2 inputs, the default value for this limit register is 0 V.  
Positive Temperature = Limit Register Code (d)  
Negative Temperature = Limit Register Code (d) − 256  
D7  
D7  
11  
D6  
D6  
11  
D5  
D5  
01  
D4  
D4  
01  
D3  
D3  
11  
D2  
D2  
01  
D1  
D1  
01  
D0  
D0  
11  
1 Default settings at power-up.  
Rev. B | Page 35 of 44  
ADT7516/ADT7517/ADT7519  
D7  
D7  
01  
D6  
D6  
01  
D5  
D5  
01  
D4  
D4  
01  
D3  
D3  
01  
D2  
D2  
01  
D1  
D1  
01  
D0  
D0  
01  
D7  
D7  
01  
D6  
D6  
01  
D5  
D5  
01  
D4  
D4  
01  
D3  
D3  
01  
D2  
D2  
01  
D1  
D1  
01  
D0  
D0  
01  
1 Default settings at power-up.  
1 Default settings at power-up.  
AIN2 VHIGH Limit Register (Read/Write) [Address = 0x2B]  
AIN4 VHIGH Limit Register (Read/Write) [Address = 0x2F]  
This limit register is an 8-bit read/write register that stores the  
AIN2 input upper limit, and causes an interrupt and activates  
This limit register is an 8-bit read/write register that stores the  
AIN4 input upper limit, and causes an interrupt and activates  
the INT/  
output (if enabled). For this to happen, the  
the INT/  
output (if enabled). For this to happen, the  
INT  
INT  
measured AIN2 value has to be greater than the value in this  
register. Because it is an 8-bit register, the resolution is four  
times less than the resolution of the 10-bit ADC. The default  
value is full-scale voltage.  
measured AIN4 value has to be greater than the value in this  
register. Because it is an 8-bit register, the resolution is four  
times less than the resolution of the 10-bit ADC. The default  
value is full-scale voltage.  
D7  
D7  
11  
D6  
D6  
11  
D5  
D5  
11  
D4  
D4  
11  
D3  
D3  
11  
D2  
D2  
11  
D1  
D1  
11  
D0  
D0  
11  
D7  
D7  
11  
D6  
D6  
11  
D5  
D5  
11  
D4  
D4  
11  
D3  
D3  
11  
D2  
D2  
11  
D1  
D1  
11  
D0  
D0  
11  
1 Default settings at power-up.  
1 Default settings at power-up.  
AIN2 VLOW Limit Register (Read/Write) [Address = 0x2C]  
AIN4 VLOW Limit Register (Read/Write) [Address = 0x30]  
This limit register is an 8-bit read/write register that stores the  
AIN2 input lower limit, and causes an interrupt and activates  
This limit register is an 8-bit read/write register that stores the  
AIN4 input lower limit, and causes an interrupt and activates  
the INT/  
output (if enabled). For this to happen, the meas-  
the INT/ output (if enabled). For this to happen, the measured  
INT  
INT  
ured AIN2 value has to be less than or equal to the value in this  
register. Because it is an 8-bit register, the resolution is four times  
less than the resolution of the 10-bit ADC. The default value is 0 V.  
AIN4 value has to be less than or equal to the value in this register.  
Because it is an 8-bit register, the resolution is four times less  
than the resolution of the 10-bit ADC. The default value is 0 V.  
D7  
D7  
01  
D6  
D6  
01  
D5  
D5  
01  
D4  
D4  
01  
D3  
D3  
01  
D2  
D2  
01  
D1  
D1  
01  
D0  
D0  
01  
D7  
D7  
01  
D6  
D6  
01  
D5  
D5  
01  
D4  
D4  
01  
D3  
D3  
01  
D2  
D2  
01  
D1  
D1  
01  
D0  
D0  
01  
1 Default settings at power-up.1 Default settings at power-up.  
1 Default settings at power-up.  
AIN3 VHIGH Limit Register (Read/Write) [Address = 0x2D]  
Device ID Register (Read-Only) [Address = 0x4D]  
This limit register is an 8-bit read/write register that stores the  
AIN3 input upper limit, and causes an interrupt and activates  
This 8-bit read-only register indicates the part model of the  
device: ADT7516 = 0x03, ADT7517 = 0x07, and ADT7519 = 0x0B.  
the INT/  
output (if enabled). For this to happen, the  
INT  
Manufacturer’s ID Register (Read-Only) [Address = 0x4E]  
measured AIN3 value has to be greater than the value in this  
register. Because it is an 8-bit register, the resolution is four  
times less than the resolution of the 10-bit ADC. The default  
value is full-scale voltage.  
This register contains the manufacturers identification number.  
ID number of Analog Devices, Inc. is 0x41.  
Silicon Revision Register (Read-Only) [Address = 0x4F]  
This register is divided into the four LSBs representing the  
stepping and the four MSBs representing the version. The  
stepping contains the manufacturers code for minor revisions  
or steppings to the silicon. The version is the ADT7516/  
ADT7517/ADT7519 version number.  
D7  
D7  
11  
D6  
D6  
11  
D5  
D5  
11  
D4  
D4  
11  
D3  
D3  
11  
D2  
D2  
11  
D1  
D1  
11  
D0  
D0  
11  
1 Default settings at power-up.  
AIN3 VLOW Limit Register (Read/Write) [Address = 0x2E]  
SPI Lock Status Register (Read-Only) [Address = 0x7F]  
This limit register is an 8-bit read/write register that stores the  
AIN3 input lower limit, and causes an interrupt and activates  
the INT/  
ured AIN3 value has to be less than or equal to the value in this  
register. Because it is an 8-bit register, the resolution is four times  
less than the resolution of the 10-bit ADC. The default value is 0 V.  
Bit D0 (LSB) of this read-only register indicates whether or not  
the SPI interface is locked. Writing to this register causes the  
device to malfunction. The default value is 0x00.  
output (if enabled). For this to happen, the meas-  
INT  
0 = I2C interface.  
1 = SPI interface selected and locked.  
Rev. B | Page 36 of 44  
ADT7516/ADT7517/ADT7519  
CS  
As per most SPI standards, the  
line must be low during  
SERIAL INTERFACE  
There are two serial interfaces that can be used on this part, I2C  
and SPI. The device powers up with the serial interface in I2C  
mode, but it is not locked into this mode. To stay in I2C mode, it  
every SPI communication to the ADT7516/ADT7517/ADT7519  
and high all other times. Typical examples of how to connect the  
dual interface as I2C or SPI are shown in Figure 57 and Figure 58.  
The following sections describe in detail how to use the I2C and  
SPI protocols associated with the ADT7516/ADT7517/ADT7519.  
CS  
is recommended that the user tie the  
line to either VCC or  
GND. It is not possible to lock the I2C mode, but it is possible to  
select and lock the SPI mode.  
V
V
DD  
To select and lock the interface into the SPI mode, a number of  
DD  
ADT7516/  
ADT7517/  
ADT7519  
CS  
pulses must be sent down the  
line (Pin 4). The following  
10k  
10kΩ  
section describes how this is done.  
CS  
Once the SPI communication protocol has been locked in, it  
cannot be unlocked while the device is still powered up. Bit D0  
of the SPI lock status register (Address 0x7F) is set to 1 when a  
successful SPI interface lock has been accomplished. To reset  
the serial interface, the user must power down the part and  
power it up again. A software reset does not reset the serial  
interface.  
SDA  
SCL  
2
I C ADDRESS = 1001 000  
ADD  
Figure 57. Typical I2C Interface Connection  
ADT7516/  
ADT7517/  
ADT7519  
LOCK AND  
Serial Interface Selection  
SELECT SPI  
2
CS  
The  
line controls the selection between I C and SPI.  
CS  
Figure 59 shows the selection process necessary to lock the SPI  
interface mode.  
V
DD  
SPI FRAMING  
EDGE  
To communicate to the ADT7516/ADT7517/ADT7519 using  
820820820Ω  
CS  
the SPI protocol, send three pulses down the  
line as shown  
DIN  
SCLK  
DOUT  
in Figure 59. On the third rising edge (marked as C in Figure 59),  
the part selects and locks the SPI interface. The user is now  
limited to communicating to the device using the SPI protocol.  
Figure 58. Typical SPI Interface Connection.  
A
B
C
CS  
(START HIGH)  
SPI LOCKED ON  
THIRD RISING EDGE  
SPI FRAMING  
EDGE  
A
B
C
CS  
(START LOW)  
SPI LOCKED ON  
THIRD RISING EDGE  
SPI FRAMING  
EDGE  
Figure 59. Serial Interface—Selecting and Locking SPI Protocol  
Rev. B | Page 37 of 44  
 
 
 
 
 
ADT7516/ADT7517/ADT7519  
I2C Serial Interface  
2. Data is sent over the serial bus in sequences of nine clock  
pulses: eight bits of data followed by an acknowledge bit  
from the receiver of data. Transitions on the data line must  
occur during the low period of the clock signal and remain  
stable during the high period, because a low to high  
transition when the clock is high can be interpreted as a  
stop signal.  
Like all I2C-compatible devices, the ADT7516/ADT7517/  
ADT7519 have a 7-bit serial address. The four MSBs of this  
address for the ADT7516/ADT7517/ADT7519 are set to 1001.  
The three LSBs are set by Pin 11, ADD. The ADD pin can be  
configured three ways to give three different address options:  
low, floating, and high. Setting the ADD pin low gives a serial bus  
address of 1001 000, leaving it floating gives the Address 1001 010,  
and setting it high gives the Address 1001 011. The recommended  
pull-up resistor value is 10 kΩ.  
3. When all data bytes have been read or written, stop  
conditions are established. In write mode, the master pulls  
the data line high during the 10th clock pulse to assert a  
stop condition. In read mode, the master device pulls the  
data line high during the low period before the ninth clock  
pulse. This is known as no acknowledge. The master then  
takes the data line low during the low period before the 10th  
clock pulse, and then high during the 10th clock pulse to  
assert a stop condition.  
There is an enable/disable bit for the SMBus timeout. When this  
is enabled, the SMBus times out after 25 ms of no activity. To  
enable it, set Bit 6 of the Control Configuration 2 register. The  
power-on default is with the SMBus timeout disabled.  
The ADT7516/ADT7517/ADT7519 support SMBus packet  
error checking (PEC), but its use is optional. It is triggered by  
supplying the extra clocks for the PEC byte. The PEC is  
calculated using CRC-8. The frame clock sequence (FCS)  
conforms to CRC-8 by the polynomial  
Any number of bytes of data can be transferred over the serial  
bus in one operation, but it is not possible to mix read and write  
in one operation because the type of operation is determined at  
the beginning and cannot subsequently be changed without  
starting a new operation.  
C(x) = x8 + x2 + x1 + 1  
Consult the SMBus specification for more information.  
The serial bus protocol operates as follows:  
The I2C address set up by the ADD pin is not latched by the  
device until after this address has been sent twice. On the eighth  
SCL cycle of the second valid communication, the serial bus  
address is latched in. This is the SCL cycle directly after the  
device has seen its own I2C serial bus address. Any subsequent  
changes on this pin have no effect on the I2C serial bus address.  
1. The master initiates a data transfer by establishing a start  
condition, defined as a high to low transition on the serial  
data line (SDA) while the serial clock line (SCL) remains  
high. This indicates that an address/data stream follows.  
All slave peripherals connected to the serial bus respond to  
the start condition and shift in the next eight bits,  
Writing to the ADT7516/ADT7517/ADT7519  
Depending on the register being written to, there are two different  
writes for the ADT7516/ADT7517/ADT7519. It is not possible  
to do a block write to this part, that is, no I2C auto-increment.  
W
consisting of a 7-bit address (MSB first) plus a R/ bit; this  
determines the direction of the data transfer, that is,  
whether data is written to or read from the slave device.  
Writing to the Address Pointer Register for a  
Subsequent Read  
The peripheral whose address corresponds to the  
transmitted address responds by pulling the data line low  
during the low period before the ninth clock pulse, known  
as the acknowledge bit. All other devices on the bus now  
remain idle while the selected device waits for data to be  
To read data from a particular register, the address pointer  
register must contain the address of that register. If it does not,  
the correct address must be written to the address pointer  
register by performing a single-byte write operation, as shown  
in Figure 60. The write operation consists of the serial bus  
address followed by the address pointer byte. No data is written  
to any of the data registers. A read operation is then performed  
to read the register.  
W
read from or written to it. If the R/ bit is 0, the master  
W
writes to the slave device. If the R/ bit is 1, the master  
reads from the slave device.  
1
9
1
9
SCL  
1
0
0
1
A2  
A1  
A0  
R/W  
ACK. BY  
P7  
P6  
P5  
P4  
P3  
P2  
P1  
P0  
SDA  
START BY  
ACK. BY  
ADT7516/ADT7517/ADT7519 MASTER  
STOP BY  
MASTER  
ADT7516/ADT7517/ADT7519  
FRAME 1  
SERIAL BUS ADDRESS BYTE  
FRAME 2  
ADDRESS POINTER REGISTER BYTE  
Figure 60. I2C—Writing to the Address Pointer Register to Select a Register for a Subsequent Read Operation  
Rev. B | Page 38 of 44  
 
ADT7516/ADT7517/ADT7519  
1
1
9
1
9
SCL  
SDA  
0
0
1
A2  
A1  
A0  
P7  
P6  
P5  
P4  
P3  
P2  
P1  
P0  
R/W  
ACK. BY  
START BY  
MASTER  
ACK. BY  
ADT7516/ADT7517/ADT7519  
ADT7516/ADT7517/ADT7519  
FRAME 1  
SERIAL BUS ADDRESS BYTE  
FRAME 2  
ADDRESS POINTER REGISTER BYTE  
1
9
SCL (CONTINUED)  
SDA (CONTINUED)  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
STOP BY  
MASTER  
ACK. BY  
ADT7516/ADT7517/ADT7519  
FRAME 3  
DATA BYTE  
Figure 61. I2C—Writing to the Address Pointer Register Followed by a Single Byte of Data to the Selected Register  
1
1
9
1
9
SCL  
SDA  
0
0
1
A2  
A1  
A0 R/W  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
ACK. BY  
ADT7616/ADT7517/ADT7519  
START BY  
MASTER  
NO ACK. BY STOP BY  
MASTER  
MASTER  
FRAME 1  
SERIAL BUS ADDRESS BYTE  
FRAME 2  
SINGLE DATA BYTE FROM ADT7516/ADT7517/ADT7519  
Figure 62. I2C—Reading a Single Byte of Data from a Selected Register  
Writing Data to a Register  
CS  
is also used to  
to the serial clock and data lines. The  
distinguish between any two separate serial communications  
(see Figure 67 for a graphical explanation). The SCLK is used to  
clock data in and out of the part. The DIN line is used to write  
to the registers, and the DOUT line is used to read data back  
from the registers. The recommended pull-up resistor value is  
between 500 Ω and 820 Ω. Strong pull-ups are needed when  
serial clock speeds that are close to the maximum limit are used  
or when the SPI interface lines are experiencing large capacitive  
loading. Larger resistor values can be used for pull-up resistors  
when the serial clock speed is reduced.  
All registers are 8-bit registers, therefore only one byte of data  
can be written to each register. Writing a single byte of data to  
one of these read/write registers consists of the serial bus  
address, the data register address written to the address pointer  
register, followed by the data byte written to the selected data  
register. This is illustrated in Figure 61. To write to a different  
register, another start or repeated start is required. If more than  
one byte of data is sent in one communication operation, the  
addressed register is repeatedly loaded until the last data byte  
has been sent.  
The part operates in slave mode and requires an externally  
applied serial clock to the SCLK input. The serial interface is  
designed to allow the part to be interfaced to systems that  
provide a serial clock that is synchronized to the serial data.  
Reading Data from the ADT7516/ADT7517/ADT7519  
Reading data from the ADT7516/ADT7517/ADT7519 is done  
in a one-byte operation. Reading back the contents of a register  
is shown in Figure 62. The register address had previously been  
set up by a single-byte write operation to the address pointer  
register. To read from another register, write to the address  
pointer register again to set up the relevant register address.  
Thus, block reads are not possible, that is, no I2C auto-increment.  
There are two types of serial operations, read and write.  
Command words are used to distinguish read operations from  
write operations. These command words are given in Table 23.  
Address auto-increment is possible in SPI mode.  
SPI Serial Interface  
Table 23. SPI Command Words  
The SPI serial interface of the ADT7516/ADT7517/ADT7519  
Write  
Read  
CS  
CS  
consists of four wires:  
, SCLK, DIN, and DOUT. The  
is  
0x90 (1001 0000)  
0x91 (1001 0001)  
used to select the device when more than one device is connected  
Rev. B | Page 39 of 44  
 
 
 
ADT7516/ADT7517/ADT7519  
CS  
8
1
8
1
SCLK  
DIN  
D6  
D2  
D1  
D7  
D5  
D4  
D3  
D2  
D1  
D0  
D7  
D6  
D5  
D4  
D3  
D0  
START  
WRITE COMMAND  
REGISTER ADDRESS  
CS (CONTINUED)  
1
8
SCLK (CONTINUED)  
D7  
D6  
D4  
D3  
D1  
D5  
D2  
D0  
DIN (CONTINUED)  
STOP  
DATA BYTE  
Figure 63. SPI—Writing to the Address Pointer Register Followed by a Single Byte of Data to the Selected Register  
Write Operation  
Read Operation  
Figure 63 shows the timing diagram for a write operation to the  
ADT7516/ADT7517/ADT7519. Data is clocked into the  
Figure 64 to Figure 66 show the timing diagrams necessary to  
accomplish correct read operations. To read back from a  
register, first write to the address pointer register with the  
address of the register to be read from. This operation is shown  
in Figure 64. Figure 65 shows the procedure for reading back a  
single byte of data. The read command is first sent to the part  
during the first eight clock cycles. As the read command is  
being sent, irrelevant data is output onto the DOUT line.  
During the following eight clock cycles, the data contained in  
the register selected by the address pointer register is output  
onto the DOUT line. Data is output onto the DOUT line on the  
falling edge of SCLK. Figure 66 shows the procedure when  
reading data from two sequential registers. Multiple data reads  
are possible in the SPI interface mode as the address pointer  
register is auto-incremental. The address pointer register auto-  
increments from 0x00 to 0x3F and loops back to start again at  
0x00 when it reaches 0x3F.  
CS  
registers on the rising edge of SCLK. When the  
the DIN and DOUT lines are in three-state mode. Only when  
CS  
line is high,  
the  
goes from a high to a low does the part accept any data  
on the DIN line. In SPI mode, the address pointer register is  
capable of auto-incrementing to the next register in the register  
map without having to load the address pointer register each  
time. In Figure 63, the register address portion gives the first  
register that is written to. Subsequent data bytes are written into  
sequential writable registers. Thus, after each data byte has been  
written into a register, the address pointer register auto-  
increments its value to the next available register. The address  
pointer register auto-increments from 0x00 to 0x3F and loops  
back to start again at 0x00 when it reaches 0x3F.  
Rev. B | Page 40 of 44  
 
ADT7516/ADT7517/ADT7519  
CS  
1
8
1
8
SCLK  
DIN  
D2  
D1  
D6  
D7  
D7  
D5  
D4  
D3  
D2  
D1  
D0  
D6  
D5  
D4  
D3  
D0  
STOP  
START  
WRITE COMMAND  
REGISTER ADDRESS  
Figure 64. SPI—Writing to the Address Pointer Register to Select a Register for a Subsequent Read Operation  
CS  
1
8
1
8
SCLK  
X
X
D6  
X
X
DIN  
D7  
D5  
X
D4  
X
D3  
X
D1  
X
D0  
X
X
X
X
D2  
X
X
X
D0  
X
D7  
D6  
D5  
D4  
D3  
D2  
D1  
DOUT  
STOP  
START  
DATA BYTE 1  
READ COMMAND  
Figure 65. SPI—Reading a Single Byte of Data From a Selected Register  
CS  
1
8
1
8
SCLK  
DIN  
X
X
D6  
X
D5  
X
D1  
X
X
X
D7  
X
D4  
X
D3  
X
D2  
X
D0  
X
X
X
X
DOUT  
X
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
START  
READ COMMAND  
DATA BYTE 1  
CS (CONTINUED)  
1
8
SCLK (CONTINUED)  
DIN (CONTINUED)  
X
X
X
X
X
X
X
X
DOUT (CONTINUED)  
D6  
D5  
D4  
D3  
D1  
D0  
D7  
D2  
STOP  
DATA BYTE 2  
Figure 66. SPI—Reading Two Bytes of Data from Two Sequential Registers  
CS  
SPI  
READ OPERATION  
WRITE OPERATION  
CS  
Figure 67. SPI—Correct Use of during SPI Communication  
Rev. B | Page 41 of 44  
 
 
 
ADT7516/ADT7517/ADT7519  
SMBALERT  
INT  
SMBus/SPI INT/  
allows them to do so.  
is used in conjunction with  
the SMBus general call address.  
INT  
The ADT7516/ADT7517/ADT7519 INT/  
outputs are an  
INT  
interrupt line for devices that want to trade their ability to  
One or more INT/  
outputs can be connected to a common  
master for an extra pin. The ADT7516/ADT7517/ADT7519 are  
SMBALERT  
SMBALERT  
line connected to the master. When the  
line is pulled low by one of the devices, the  
INT  
slave devices and use the SMBus/SPI INT/  
to signal the host  
INT  
device that it wants to talk to. The SMBus/SPI INT/  
on the  
following procedure occurs as shown in Figure 68:  
SMBALERT  
ADT7516/ADT7517/ADT7519 is used as an over/under limit  
indicator.  
1.  
is pulled low.  
2. Master initiates a read operation and sends the alert  
response address (ARA = 0001 100). This general call  
address must not be used as a specific device address.  
INT  
The INT/  
outputs of several devices to be wire-ANDed together when the  
INT  
pin has an open-drain configuration that allows the  
INT/  
register to set the active polarity of the INT/  
INT  
pin is active low. Use C6 of the Control Configuration 1  
INT  
3. A device whose INT/  
output is low responds to the  
INT  
output. The  
alert response address and the master reads its device  
address. As the device address is seven bits long, an LSB of  
1 is added. The address of the device is now known and it  
can be interrogated in the usual way.  
power-up default is active low. The INT/  
output can be  
disabled or enabled by setting C5 of the Control Configuration 1  
register to 1 or 0, respectively.  
INT  
The INT/  
output becomes active when either the internal  
INT  
4. If INT/  
output of more than one device is low, the one  
temperature value, the external temperature value, VDD value, or  
any of the AIN input values exceed the values in their  
corresponding THIGH/VHIGH or TLOW/VLOW registers. The  
with the lowest device address has priority in accordance  
with normal SMBus specifications.  
5. When the ADT7516/ADT7517/ADT7519 have responded  
INT  
INT/  
output goes inactive again when a conversion result  
INT  
to the alert response address, they reset their INT/  
has the measured value back within the trip limits and when the  
status register associated with the out-of-limit event is read. The  
two interrupt status registers show the event that caused the  
output, provided that the condition that caused the out-of-  
limit event no longer exists and that the status register  
associated with the out-of-limit event is read. If the  
INT  
INT/  
The INT/  
can be connected to a voltage different from VDD, provided the  
INT  
pin to go active.  
SMBALERT  
line remains low, the master sends the ARA  
again. It continues to do this until all devices whose  
INT  
output requires an external pull-up resistor. This  
SMBALERT  
outputs were low have responded.  
maximum voltage rating of the INT/  
output pin is not  
exceeded. The value of the pull-up resistor depends on the  
application but should be large enough to avoid excessive sink  
MASTER  
RECEIVES  
SMBALERT  
INT  
currents at the INT/  
output because they can heat the chip  
ALERT RESPONSE  
NO  
ACK  
START  
RD ACK DEVICE ADDRESS  
STOP  
and affect the temperature reading.  
ADDRESS  
SMBUS ALERT RESPONSE  
MASTER SENDS  
ARA AND READ  
COMMAND  
DEVICE SENDS  
ITS ADDRESS  
INT  
The INT/  
when the SMBus/I2C interface is selected. It is an open-drain  
INT  
pin behaves the same way as an SMBus alert pin  
INT  
SMBALERT  
ARA  
Figure 68. INT/  
Responds to  
output and requires a pull-up to VDD. Several INT/  
can be wire-ANDed together, so that the common line goes low  
INT  
outputs  
MASTER  
ACK  
MASTER  
NACK  
DEVICE ACK  
MASTER  
if one or more of the INT/  
outputs goes low. The polarity of  
pin must be set active low for a number of outputs  
to be wire-ANDed together.  
INT  
RECEIVES  
SMBALERT  
INT  
the INT/  
ALERT RESPONSE  
ADDRESS  
DEVICE  
ADDRESS  
NO  
ACK  
START  
RD ACK  
ACK  
PEC  
STOP  
MASTER SENDS  
ARA AND READ  
COMMAND  
SMBALERT  
function.  
The INT/  
Slave devices on the SMBus cannot normally signal to the  
SMBALERT  
output can operate as an  
DEVICE SENDS DEVICE SENDS  
ITS ADDRESS ITS PEC DATA  
INT  
SMBALERT  
ARA  
Figure 69. INT/  
Responds to  
master that they want to talk, but the  
function  
with Packet Error Checking (PEC)  
Rev. B | Page 42 of 44  
 
 
ADT7516/ADT7517/ADT7519  
OUTLINE DIMENSIONS  
0.197  
0.193  
0.189  
16  
1
9
8
0.158  
0.154  
0.150  
0.244  
0.236  
0.228  
PIN 1  
0.069  
0.053  
0.065  
0.049  
8°  
0°  
0.010  
0.004  
0.025  
BSC  
0.012  
0.008  
0.050  
0.016  
SEATING  
PLANE  
0.010  
0.006  
COPLANARITY  
0.004  
COMPLIANT TO JEDEC STANDARDS MO-137-AB  
Figure 70. 16-Lead Shrink Small Outline Package [QSOP]  
(RQ-16)  
Dimensions shown in inches  
ORDERING GUIDE  
DAC  
Package  
Ordering  
Model  
Temperature Range  
Resolution  
Description  
Package Option  
RQ-16  
RQ-16  
RQ-16  
RQ-16  
RQ-16  
RQ-16  
RQ-16  
RQ-16  
RQ-16  
RQ-16  
RQ-16  
RQ-16  
RQ-16  
RQ-16  
RQ-16  
RQ-16  
RQ-16  
RQ-16  
Quantity  
ADT7519ARQ  
–40°C to +120°C  
–40°C to +120°C  
–40°C to +120°C  
–40°C to +120°C  
–40°C to +120°C  
–40°C to +120°C  
–40°C to +120°C  
–40°C to +120°C  
–40°C to +120°C  
–40°C to +120°C  
–40°C to +120°C  
–40°C to +120°C  
–40°C to +120°C  
–40°C to +120°C  
–40°C to +120°C  
–40°C to +120°C  
–40°C to +120°C  
–40°C to +120°C  
8 Bits  
8 Bits  
8 Bits  
8 Bits  
8 Bits  
8 Bits  
16-Lead QSOP  
16-Lead QSOP  
16-Lead QSOP  
16-Lead QSOP  
16-Lead QSOP  
16-Lead QSOP  
16-Lead QSOP  
16-Lead QSOP  
16-Lead QSOP  
16-Lead QSOP  
16-Lead QSOP  
16-Lead QSOP  
16-Lead QSOP  
16-Lead QSOP  
16-Lead QSOP  
16-Lead QSOP  
16-Lead QSOP  
16-Lead QSOP  
Evaluation Board  
98  
ADT7519ARQ-REEL  
ADT7519ARQ-REEL7  
ADT7519ARQZ1  
ADT7519ARQZ-REEL1  
ADT7519ARQZ-REEL71  
ADT7517ARQ  
ADT7517ARQ-REEL  
ADT7517ARQ-REEL7  
ADT7517ARQZ1  
ADT7517ARQZ-REEL1  
ADT7517ARQZ-REEL71  
ADT7516ARQ  
ADT7516ARQ-REEL  
ADT7516ARQ-REEL7  
ADT7516ARQZ1  
ADT7516ARQZ-REEL1  
ADT7516ARQZ-REEL71  
EVAL-ADT7516EB  
2,500  
1,000  
98  
2,500  
1,000  
98  
2,500  
1,000  
98  
2,500  
1,000  
98  
2,500  
1,000  
98  
2,500  
1,000  
10 Bits  
10 Bits  
10 Bits  
10 Bits  
10 Bits  
10 Bits  
12 Bits  
12 Bits  
12 Bits  
12 Bits  
12 Bits  
12 Bits  
1 Z = Pb-free part.  
Rev. B | Page 43 of 44  
 
 
ADT7516/ADT7517/ADT7519  
NOTES  
Purchase of licensed I2C components of Analog Devices or one of its sublicensed Associated Companies conveys a license for the purchaser under the Philips I2C Patent.  
Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips.  
©2006 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
C02883-0-10/06(B)  
Rev. B | Page 44 of 44  
 

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