EV-ADF41020EB1Z [ADI]
The ADF41020 frequency synthesizer can be used to implement local oscillators as high as 18 GHz in the up conversion and down conversion sections of wireless receivers and transmitters.; 该ADF41020频率合成器可以用于实现本地振荡器高达18千兆赫的向上转换和向下的无线接收机和发射机的变频部分。
| 型号： | EV-ADF41020EB1Z |
| 厂家： | 
ADI |
| 描述： | The ADF41020 frequency synthesizer can be used to implement local oscillators as high as 18 GHz in the up conversion and down conversion sections of wireless receivers and transmitters. |
| 文件： | 总16页 (文件大小：352K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
18 GHz Microwave PLL Synthesizer
Data Sheet
ADF41020
FEATURES
GENERAL DESCRIPTION
18 GHz maximum RF input frequency
Integrated SiGe prescaler
Software compatible with the ADF4106/ADF4107/ADF4108
family of PLLs
2.85 V to 3.15 V PLL power supply
Programmable dual-modulus prescaler
8/9, 16/17, 32/33, 64/65
Programmable charge pump currents
3-wire serial interface
The ADF41020 frequency synthesizer can be used to implement
local oscillators as high as 18 GHz in the up conversion and
down conversion sections of wireless receivers and transmitters.
It consists of a low noise, digital phase frequency detector
(PFD), a precision charge pump, a programmable reference
divider, and high frequency programmable feedback dividers
(A, B, and P). A complete phase-locked loop (PLL) can be
implemented if the synthesizer is used with an external loop
filter and voltage controlled oscillator (VCO). The synthesizer
can be used to drive external microwave VCOs via an active
loop filter. Its very high bandwidth means a frequency doubler
stage can be eliminated, simplifying system architecture and
reducing cost. The ADF41020 is software-compatible with the
existing ADF4106/ADF4107/ADF4108 family of devices from
Analog Devices, Inc. Their pinouts match very closely with
the exception of the ADF41020’s single-ended RF input pin,
meaning only a minor layout change is required when updating
current designs.
Analog and digital lock detect
Hardware and software power-down mode
APPLICATIONS
Microwave point-to-point/multipoint radios
Wireless infrastructure
VSAT radios
Test equipment
Instrumentation
FUNCTIONAL BLOCK DIAGRAM
AV
DV
V
R
SET
DD
DD
P
GND
REFERENCE
PHASE
FREQUENCY
DETECTOR
REF
R COUNTER
CHARGE
PUMP
IN
CP
R COUNTER
LATCH
LOCK
DETECT
CURRENT
SETTING 1
CURRENT
SETTING 2
CLK
DATA
LE
24-BIT INPUT
REGISTER
FUNCTION
LATCH
CPI6 CPI5 CPI4
HIGH-Z
CPI3 CPI2 CPI1
A, B COUNTER
LATCH
AV
DD
MUXOUT
MUX
N = 4(BP + A)
SD
OUT
3pF
A AND B
COUNTERS
DIVIDE
BY 4
RF
IN
P/P+ 1
M3 M2 M1
50Ω
ADF41020
GND
CE
GND
Figure 1.
Rev. 0
Document Feedback
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responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rightsof third parties that may result fromits use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks andregisteredtrademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Technical Support
©2012 Analog Devices, Inc. All rights reserved.
www.analog.com
ADF41020
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
RF Input Stage................................................................................8
Prescaler..........................................................................................8
A Counter and B Counter............................................................8
R Counter .......................................................................................9
PFD and Charge Pump.................................................................9
MUXOUT and Lock Detect.........................................................9
Input Shift Register .......................................................................9
The Function Latch.................................................................... 13
Applications Information.............................................................. 15
Interfacing ................................................................................... 15
PCB Design Guidelines ............................................................. 15
Outline Dimensions....................................................................... 16
Ordering Guide .......................................................................... 16
Applications....................................................................................... 1
General Description......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Timing Characteristics ................................................................ 4
Absolute Maximum Ratings............................................................ 5
ESD Caution.................................................................................. 5
Pin Configuration and Function Descriptions............................. 6
Typical Performance Characteristics ............................................. 7
Theory of Operation ........................................................................ 8
Reference Input Section............................................................... 8
REVISION HISTORY
10/12—Revision 0: Initial Version
Rev. 0 | Page 2 of 16
Data Sheet
ADF41020
SPECIFICATIONS
DVDD = AVDD = VP = 3.0 V 5%, GND = 0 V, RSET = 5.1 kΩ, dBm referred to 50 Ω, TA = TMAX to TMIN, unless otherwise noted.
Table 1.
Parameter
Min
Typ
Max
Unit
Test Conditions/Comments
RF CHARACTERISTICS
RF Input Frequency (RFIN)
RF Input Sensitivity
Maximum Allowable Prescaler
Output Frequency1
See Figure 1 for input circuit
4.0
−10
18.0
+10
350
GHz
dBm
MHz
REFIN CHARACTERISTICS
REFIN Input Frequency
REFIN Input Sensitivity
REFIN Input Capacitance
REFIN Input Current
PHASE DETECTOR
Phase Detector Frequency2
CHARGE PUMP
ICP Sink/Source
High Value
Low Value
Absolute Accuracy
RSET
ICP Three-State Leakage
Sink and Source Current Matching
ICP vs. VCP
ICP vs. Temperature
LOGIC INPUTS
VIH, Input High Voltage
VIL, Input Low Voltage
IINH, IINL, Input Current
CIN, Input Capacitance
LOGIC OUTPUTS
10
0.8
400
DVDD
10
MHz
V p-p
pF
For f < 10 MHz, ensure slew rate > 50 V/μs
Biased at DVDD/2 when input is ac-coupled
100
µA
100
MHz
Programmable, see Figure 17
With RSET = 5.1 kΩ
5.0
625
3
5.1
1
2
1
2
mA
µA
%
kΩ
nA
%
With RSET = 5.1 kΩ
See Figure 17
TA = 25°C
0.5 V ≤ VCP ≤ VP − 0.5 V
0.5 V ≤ VCP ≤ VP − 0.5 V
VCP = VP/2
5.1
1.4
5.1
2
%
%
V
V
µA
pF
The SPI interface is 1.8 V and 3 V logic compatible
0.6
1
10
VOH, Output High Voltage
1.4
V
Open-drain output chosen, 1 kΩ pull-up resistor
to 1.8 V
VOH, Output High Voltage
IOH, Output High Current
VOL, Output Low Voltage
IOL, Output Low Current
POWER SUPPLIES
AVDD
DVDD − 0.4
V
µA
V
CMOS output chosen
500
0.4
500
µA
2.85
2.85
2.85
3.15
3.15
3.15
30
V
V
V
mA
mA
µA
DVDD
VP
3
IDD
27
4.5
1
TA = 25°C
TA = 25°C
TA = 25°C
3
IP
5
Power-Down Mode
Rev. 0 | Page 3 of 16
ADF41020
Data Sheet
Parameter
Min
Typ
Max
Unit
Test Conditions/Comments
NOISE CHARACTERISTICS
Normalized Phase Noise Floor4
Normalized 1/f Noise5
Phase Noise Performance6
5.7 GHz
−221
−118
dBc/Hz PLL loop bandwidth = 500 kHz
dBc/Hz Normalized to 10 kHz offset at 1 GHz
At VCO output
dBc/Hz At 1 kHz offset and 2.5 MHz PFD frequency with
20 kHz loop bandwidth
dBc/Hz At 3 kHz offset and 2.5 MHz PFD frequency with
20 kHz loop bandwidth
−89
−82
−96
12.5 GHz7
17.64 GHz
dBc/Hz At 100 kHz offset and 90 MHz PFD frequency with
700 kHz loop bandwidth
Spurious Signals
5.7 GHz
−80/−86
−98/<−110
−109/−113
dBc
dBc
dBc
At 2.5 MHz/5 MHz and 2.5 MHz PFD frequency
At 2.5 MHz/5 MHz and 2.5 MHz PFD frequency
At 90 MHz/180 MHz and 90 MHz PFD frequency
12.5 GHz7
17.64 GHz
1 This is the maximum operating frequency of the CMOS counters. The prescaler value should be chosen to ensure that the RF input is divided down to a frequency that
is less than this value.
2 Guaranteed by design. Sample tested to ensure compliance.
3 TA = 25°C; AVDD = DVDD = VP = 3.0 V; P = 16; fREF = 100 MHz; fPFD = 100 MHz; RFIN = 12.8 GHz.
IN
4 The synthesizer phase noise floor is estimated by measuring the in-band phase noise at the output of the VCO and subtracting 20 log N (where N is the N divider
value) and 10 log fPFD. PNSYNTH = PNTOT − 10 log fPFD − 20 log N.
5 The PLL phase noise is composed of 1/f (flicker) noise plus the normalized PLL noise floor. The formula for calculating the 1/f noise contribution at an RF frequency, fRF,
and at a frequency offset, f, is given by PN = PN1_f + 10 log(10 kHz/f) + 20 log(fRF/1 GHz). Both the normalized phase noise floor and flicker noise are modeled in
ADIsimPLL.
6 The phase noise is measured with a Rohde & Schwarz FSUP spectrum analyzer. The reference is provided by a Rohde & Schwarz SMA100A.
7 The phase noise and spurious noise is measured with the EV-ADF41020EB1Z evaluation board and the Rohde & Schwarz FSUP spectrum analyzer.
TIMING CHARACTERISTICS
AVDD = DVDD = VP = 3.0 V, GN D = 0 V, RSET = 5.1 kΩ, dBm referred to 50 Ω, TA = TMAX to TMIN, unless otherwise noted.
Table 2.
Parameter
Limit
10
10
25
25
Unit
Test Conditions/Comments
DATA to CLK setup time
DATA to CLK hold time
CLK high duration
CLK low duration
CLK to LE setup time
LE pulse width
t1
t2
t3
t4
t5
t6
ns min
ns min
ns min
ns min
ns min
ns min
10
20
t3
t4
CLK
t1
t2
DB0 (LSB)
(CONTROL BIT C1)
DB1 (CONTROL
BIT C2)
DB2
DB23 (MSB)
DB22
DATA
t6
LE
LE
t5
Figure 2. Timing Diagram
Rev. 0 | Page 4 of 16
Data Sheet
ADF41020
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 3.
Parameter
Rating
AVDD to GND
AVDD to DVDD
VP to GND
VP to AVDD
Digital I/O Voltage, REFIN to GND
Analog I/O Voltage to GND
REFIN, RFIN to GND
−0.3 V to +3.9 V
−0.3 V to +0.3 V
−0.3 V to +3.9 V
−0.3 V to +0.3 V
−0.3 V to DVDD + 0.3 V
−0.3 V to VP + 0.3 V
−0.3 V to AVDD + 0.3 V
This device is a high performance RF integrated circuit with an
ESD rating of <2 kV, and it is ESD sensitive. Proper precautions
should be taken for handling and assembly.
Operating Temperature Range
Industrial
Storage Temperature Range
Maximum Junction Temperature
−40°C to +85°C
−65°C to +125°C
150°C
ESD CAUTION
LFCSP θJA Thermal Impedance1
(Paddle Soldered)
62.82°C/W
Reflow Soldering
Peak Temperature
Time at Peak Temperature
Transistor Count
CMOS
260°C
40 sec
6610
358
Bipolar
1 Two signal planes (that is, on the top and bottom surfaces of the board), two
buried planes, and four vias.
Rev. 0 | Page 5 of 16
ADF41020
Data Sheet
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
GND
GND
1
2
15 MUXOUT
14 LE
ADF41020
GND 3
RF
13 DATA
12 CLK
11 CE
TOP
4
VIEW
IN
GND 5
NOTES
1. THE EXPOSED PAD MUST BE
CONNECTED TO GND.
Figure 3. Pin Configuration
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
1, 2, 3, 5, 9, 10 GND Ground Pins.
Input to the RF Prescaler. This input is ac-coupled internally.
4
RFIN
6, 7
AVDD
Analog Power Supply. This may range from 2.85 V to 3.15 V. Decoupling capacitors to the ground plane
should be placed as close as possible to this pin. Pin 6 is the supply for the fixed divide-by-4 prescaler.
8
REFIN
Reference Input. This is a CMOS input with a nominal threshold of DVDD/2 and a dc equivalent input
resistance of 100 kΩ (see Figure 9). This input can be driven from a TTL or CMOS crystal oscillator or it
can be ac-coupled.
11
CE
Chip Enable. A logic low on this pin powers down the device and puts the charge pump output into three-
state mode. Taking the pin high powers up the device, depending on the status of the power-down bit, PD1.
12
CLK
Serial Clock Input. This serial clock is used to clock in the serial data to the registers. The data is latched into
the 24-bit shift register on the CLK rising edge. This is a high impedance CMOS input.
13
DATA
LE
Serial Data Input. The serial data is loaded MSB first with the two LSBs being the control bits. This is a high
impedance CMOS input.
Load Enable, CMOS Input. When LE goes high, the data stored in the shift registers is loaded into one of the
four latches with the latch being selected using the control bits.
14
15
MUXOUT
DVDD
This multiplexer output allows either the lock detect, the scaled RF, or the scaled reference frequency to be
accessed externally.
Digital Power Supply. This may range from 2.85 V to 3.15 V. Decoupling capacitors to the ground plane
should be placed as close as possible to this pin. DVDD must be the same value as AVDD.
16, 17
18
19
VP
RSET
Charge Pump Power Supply.
Connecting a resistor between this pin and GND sets the maximum charge pump output current.
The nominal voltage potential at the RSET pin is 0.66 V. The relationship between ICP and RSET is
25.5
RSET
ICP MAX
=
So, with RSET = 5.1 kΩ, ICP MAX = 5.0 mA.
20
CP
EP
Charge Pump Output. When enabled, this provides ICP to the external loop filter, which in turn drives the
external VCO.
Exposed Pad. The exposed pad must be connected to GND.
Rev. 0 | Page 6 of 16
Data Sheet
ADF41020
TYPICAL PERFORMANCE CHARACTERISTICS
20
10
5
8/9 PRESCALER
10
0
–10
–20
–30
–40
0
–5
–10
–15
–20
–25
16/17 PRESCALER
–50
–60
–70
0
100 200 300 400 500 600 700 800 900 1000
0
5
10
15
20
25
FREQUENCY (MHz)
FREQUENCY (GHz)
Figure 4. RF Input Sensitivity
Figure 7. REFIN Sensitivity
FREQ UNIT:
GHz KEYWORD: R
s
PARAM TYPE:
DATA FORMAT: MA
6
5
FREQ MAGS11
ANGS11
FREQ MAGS11
ANGS11
4.0
4.2
4.4
4.6
4.8
5.0
5.2
5.4
5.6
5.8
6.0
6.2
6.4
6.6
6.8
7.0
7.2
7.4
7.6
7.8
8.0
8.2
8.4
8.6
8.8
9.0
9.2
9.4
9.6
9.8
10.0
0.20099200
0.19669930
0.19140480
0.18317790
0.17232760
0.16071930
0.14943970
0.13791310
0.12839340
0.12090700
0.11516160
0.11252430
0.11213720
0.11236920
0.11323590
0.11401910
0.11361600
0.11225360
0.10909150
0.10484100
0.09871251
0.09258573
0.08667851
0.08075383
0.07542522
0.07048169
0.06751262
0.06561201
0.06308079
0.05995205
0.05666475
–133.9429000
–134.7069000
–135.0024000
–135.1249000
–135.0415000
–135.1840000
–136.0447000
–137.7694000
–140.5623000
–144.7454000
–149.8260000
–155.1801000
–160.0477000
–164.5794000
–168.1217000
–170.9163000
–173.2882000
–175.2539000
–176.9327000
–179.0774000
178.5525000
175.9697000
172.5878000
168.3692000
163.5676000
159.0954000
154.6976000
149.2087000
142.2284000
137.8226000
134.1730000
10.2
10.4
10.6
10.8
11.0
11.4
11.8
12.2
12.6
13.0
13.4
13.8
14.2
14.6
15.0
15.2
15.4
15.6
15.8
16.0
16.2
16.4
16.6
16.8
17.0
17.2
17.4
17.6
17.8
18.0
0.05542031
0.05306026
0.05123230
0.04471957
0.03846882
0.03402513
0.04456061
0.05158395
0.06039219
0.05580344
0.08402054
0.10374910
0.11639920
0.13647950
0.16700580
0.18309070
0.19458010
0.20377790
0.21170140
0.21883690
0.22280700
0.22498210
0.22589250
0.22572100
0.22596830
0.23197900
0.24339450
0.26023130
0.28636130
0.31905490
130.0581000
126.9556000
115.8988000
102.0333000
86.3895600
51.1515300
21.0829700
16.8124600
16.5178200
31.4631600
36.3540700
18.8428500
0.2817307
–15.4473000
–22.3273100
–24.3333900
–25.3870800
–25.0101800
–24.2554800
–23.4312200
–23.5596400
–24.411100
–26.5202700
–30.3773300
–36.2808700
–42.8398200
–50.7222200
–57.5844600
–63.0764200
–67.5389600
5.0mA
4.375mA
3.75mA
3.125mA
2.5mA
1.875mA
1.25mA
0.625mA
4
3
2
1
0
0.625mA
1.25mA
1.875mA
2.5mA
3.125mA
3.75mA
4.375mA
5.0mA
–1
–2
–3
–4
–5
–6
0
0.5
1.0
1.5
(V)
2.0
2.5
3.0
V
CP
Figure 5. Charge Pump Output Characteristics
Figure 8. S-Parameters
0
–20
–40
–60
–80
–100
–120
–140
–160
–180
100
1k
10k
100k
1M
10M
FREQUENCY OFFSET (Hz)
Figure 6. Closed-Loop Phase Noise, RF = 12.5 GHz, PFD = 2.5 MHz,
Loop Bandwidth = 20 kHz
Rev. 0 | Page 7 of 16
ADF41020
Data Sheet
THEORY OF OPERATION
REFERENCE INPUT SECTION
PRESCALER
The reference input stage is shown in Figure 9. SW1 and SW2
are normally closed switches. SW3 is a normally open switch.
When power-down is initiated, SW3 is closed and SW1 and
SW2 are opened. This ensures that there is no loading of the
REFIN pin on power-down.
The ADF41020 uses a two prescaler approach to achieve
operation up to 18 GHz. The first prescaler is a fixed
divide-by-4 block. The second prescaler, which takes its
input from the divide-by-4 output, is implemented as a dual-
modulus prescaler (P/P + 1), which allows finer frequency
resolution vs. a fixed prescaler. Along with the A counter and
B counter, this enables the large division ratio, N, to be realized
(N = 4(BP + A)). The dual-modulus prescaler, operating at
CML levels, takes the clock from the fixed prescaler stage and
divides it down to a manageable frequency for the CMOS A
counter and B counter. The second prescaler is programmable.
It can be set in software to 8/9, 16/17, 32/33, or 64/65. It is
based on a synchronous 4/5 core. There is a minimum divide
ratio possible for contiguous output frequencies. This minimum
is given by 4(P2 − P).
POWER-DOWN
CONTROL
100kΩ
SW2
NC
TO R COUNTER
REF
IN
NC
BUFFER
SW1
SW3
NO
Figure 9. Reference Input Stage
A COUNTER AND B COUNTER
RF INPUT STAGE
The A counter and B counter combine with the two prescalers
to allow a wide ranging division ratio in the PLL feedback
counter. The counters are specified to work when the prescaler
output is 350 MHz or less.
The RF input stage is shown in Figure 10. It is followed by a
buffer, which generates the differential CML levels needed for
the prescaler.
AV
DD
Pulse Swallow Function
Because of the fixed divide-by-4 block, the generated output
frequencies are spaced by four times the reference frequency
divided by R. The equation for VCO frequency is
TO DIVIDE BY 4
PRESCALER
3pF
RF
BUFFER
IN
4 fREF
IN
fVCO
(P B) A
R
50Ω
where:
VCO is the output frequency of the external voltage controlled
f
oscillator (VCO).
GND
P is the preset modulus of the dual-modulus prescaler
Figure 10. RF Input Stage
(such as, 8/9, 16/17).
B is the preset divide ratio of the binary 13-bit counter
(2 to 8191).
A is the preset divide ratio of the binary 6-bit swallow
counter (0 to 63).
fREFIN is the external reference frequency oscillator.
N = 4(BP + A)
DIVIDE BY 4
TO PFD
13-BIT B
COUNTER
LOAD
LOAD
PRESCALER
P/P + 1
FROM RF INPUT
BUFFER
6-BIT A
COUNTER
MODULUS
CONTROL
N DIVIDER
Figure 11. Prescalers, A and B Counters that Make Up the N-Divide Value
Rev. 0 | Page 8 of 16
Data Sheet
ADF41020
DV
DD
R COUNTER
The 14-bit R counter allows the input reference frequency to
be divided down to produce the reference clock to the phase
frequency detector (PFD). Division ratios from 1 to 16,383
are allowed.
DIGITAL LOCK DETECT
R COUNTER OUTPUT
N COUNTER OUTPUT
SDOUT
MUX
CONTROL
MUXOUT
PFD AND CHARGE PUMP
The PFD takes inputs from the R counter and N counter and
produces an output proportional to the phase and frequency
difference between them. Figure 13 is a simplified schematic.
The PFD includes a fixed delay element that controls the
width of the antibacklash pulse. This pulse ensures that there
is no dead zone in the PFD transfer function and minimizes
phase noise and reference spurs. The charge pump converts the
PFD output to current pulses, which are integrated by the PLL
loop filter.
GND
Figure 12. MUXOUT Circuit
INPUT SHIFT REGISTER
The ADF41020 digital section includes a 24-bit input shift
register, a 14-bit R counter, and a 19-bit N counter, comprising
a 6-bit A counter and a 13-bit B counter. Data is clocked into
the 24-bit shift register on each rising edge of CLK. The data is
clocked in MSB first. Data is transferred from the shift register
to one of three latches on the rising edge of LE. The destination
latch is determined by the state of the two control bits (C2, C1)
in the shift register. C2 and C1 are the two LSBs, DB1 and DB0,
as shown in the timing diagram of Figure 2. The truth table for
these bits is shown in Table 5. Table 5 shows a summary of
how the latches are programmed. The SPI is both 1.8 V and
3 V compatible.
MUXOUT AND LOCK DETECT
The output multiplexer on the ADF41020 allows the user
to access various internal points on the chip. The state of
MUXOUT is controlled by M3, M2, and M1 in the function
latch. Figure 17 shows the full truth table. Figure 12 shows
the MUXOUT section in block diagram form.
Lock Detect
MUXOUT can be programmed for two types of lock detect:
digital lock detect and analog lock detect.
Digital lock detect is active high. Digital lock detect is set high
when the phase error on five consecutive phase detector cycles
is less than 15 ns. It stays set high until a phase error of greater
than 25 ns is detected on any subsequent PD cycle.
Table 5. C1, C2 Truth Table
Control Bits
C2
0
C1
0
Data Latch
R counter
0
1
1
0
N counter (A and B)
Function latch (including prescaler)
V
P
CHARGE
PUMP
UP
Q1
U1
D1
HIGH
R DIVIDER
CLR1
FIXED
DELAY
U3
CP
CLR2
D2 Q2
DOWN
HIGH
U2
N DIVIDER
GND
Figure 13. PFD Simplified Schematic
Rev. 0 | Page 9 of 16
ADF41020
Data Sheet
REFERENCE COUNTER LATCH
CONTROL
BITS
14-BIT REFERENCE COUNTER
RESERVED
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2
R6
DB1
DB0
1
0
0
1
0
0
0
1
R14
R13
R12
R11
R10
R9
R8
R7
R5
R4
R3
R2
R1
C2 (0) C1 (0)
N COUNTER LATCH
CONTROL
BITS
RESERVED
13-BIT B COUNTER
6-BIT A COUNTER
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8
DB7 DB6 DB5 DB4 DB3 DB2 DB1
DB0
0
0
G1
B13 B12
B11
B10
B9
B8
B7
B6
B5
B4
B3
B2
B1
A6
A5
A4
A3
A2
A1 C2 (0)
C1 (1)
FUNCTION LATCH
CURRENT
SETTING
2
CURRENT
SETTING
1
CONTROL
BITS
TIMER COUNTER
CONTROL
PRESCALER
VALUE
MUXOUT
CONTROL
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1
DB0
P2
P1
PD2 CPI6 CPI5 CPI4 CPI3 CPI2 CPI1 TC4 TC3 TC2
TC1
F5
F4
F3
F2
M3
M2
M1
PD1
F1
C2 (1) C1 (0)
Figure 14. Latch Summary
CONTROL
BITS
14-BIT REFERENCE COUNTER
RESERVED
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7
DB6 DB5 DB4
DB3 DB2
DB1
DB0
1
0
0
1
0
0
0
1
R14
R13
R12 R11
R10
R9
R8
R7
R6
R5
R4
R3
R2 R1 C2 (0) C1 (0)
R14
R13
R12
..........
R3
R2
R1
DIVIDE RATIO
0
0
0
0
0
0
0
0
0
..........
..........
..........
0
0
0
0
1
1
1
0
1
1
2
3
0
.
0
.
0
.
..........
..........
1
.
0
.
0
.
4
.
.
.
.
.
.
.
..........
..........
.
.
.
.
.
.
.
.
1
1
1
1
1
1
1
1
1
1
1
1
..........
..........
..........
..........
1
1
1
1
0
0
1
1
0
1
0
1
16380
16381
16382
16383
Figure 15. Reference Counter Latch Map
Rev. 0 | Page 10 of 16
Data Sheet
ADF41020
CONTROL
BITS
RESERVED
6-BIT A COUNTER
13-BIT B COUNTER
DB21
G1
DB19
B12
DB16 DB15 DB14
DB10
B3
DB9
B2
DB6
A5
DB5
A4
DB4
A3
DB3
A2
DB0
C2 (0) C1 (1)
DB23 DB22
DB20
B13
DB18 DB17
B11 B10
DB13 DB12 DB11
B6 B5 B4
DB8
B1
DB7
A6
DB2
A1
DB1
0
0
B9
B8
B7
A COUNTER
DIVIDE RATIO
A6
A5
..........
A2
A1
0
0
0
0
.
0
0
0
0
.
..........
..........
..........
..........
..........
..........
0
0
1
1
.
0
1
0
1
.
0
1
2
3
.
.
.
.
.
.
.
1
.
1
..........
..........
.
0
.
0
.
60
1
1
1
1
1
1
..........
..........
..........
0
1
1
1
0
1
61
62
63
B13
B12
B11
B3
B2
B1
B COUNTER DIVIDE RATIO
0
0
0
0
.
.
0
0
0
0
.
.
0
0
0
0
.
.
..........
..........
..........
..........
..........
..........
0
0
0
0
.
.
0
0
1
1
.
.
0
1
0
1
.
.
NOT ALLOWED
NOT ALLOWED
2
3
.
.
.
.
.
.
..........
..........
..........
..........
..........
.
.
.
8188
8189
8190
8191
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
1
1
0
1
0
1
F4 (FUNCTION LATCH)
FASTLOCK ENABLE
CP GAIN OPERATION
0
0
1
1
0
1
0
1
CHARGE PUMP CURRENT
SETTING 1 IS PERMANENTLY USED.
CHARGE PUMP CURRENT
SETTING 2 IS PERMANENTLY USED.
CHARGE PUMP CURRENT
SETTING 1 IS USED.
CHARGE PUMP CURRENT IS
SWITCHED TO SETTING 2. THE
TIME SPENT IN SETTING 2 IS
DEPENDENT ON WHICH FAST LOCK
MODE IS USED. SEE FUNCTION
LATCH DESCRIPTION.
N = 4(BP + A), P IS A PRESCALER VALUE SET IN THE FUNCTION
LATCH. B MUST BE GREATER THAN OR EQUAL TO A. FOR
CONTINUOUSLY ADJACENT VALUES OF (N × FREF), AT THE
2
OUTPUT, N MIN IS 4(P – P).
BOTH OF THESE BITS
MUST BE SET TO 0 FOR
NORMAL OPERATION.
Figure 16. N (A, B) Counter Latch Map
Rev. 0 | Page 11 of 16
ADF41020
Data Sheet
CURRENT
SETTING
2
CURRENT
SETTING
1
PRESCALER
VALUE
CONTROL
BITS
TIMER COUNTER
CONTROL
MUXOUT
CONTROL
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5
DB4 DB3 DB2 DB1
DB0
P2
P1
PD2
CPI5 CPI4 CPI3 CPI2 CPI1 TC4 TC3 TC2
TC1
F4
F3
F2
M3
M2
M1
F1
C2 (1) C1 (0)
CPI6
F5
PD1
PHASE DETECTOR
POLARITY
COUNTER
OPERATION
F2
F1
0
1
NEGATIVE
POSITIVE
0
1
NORMAL
R, A, B COUNTERS
HELD IN RESET
CHARGE PUMP
OUTPUT
F3
0
1
NORMAL
THREE-STATE
F4
F5
FAST LOCK MODE
0
1
1
X
0
1
FAST LOCK DISABLED
FAST LOCK MODE 1
FAST LOCK MODE 2
M3
M2
M1
OUTPUT
TIMEOUT
TC4
TC3
TC2
TC1
(PFD CYCLES)
0
0
0
0
0
1
THREE-STATE OUTPUT
DIGITAL LOCK DETECT
(ACTIVE HIGH)
0
0
0
0
0
0
0
0
0
0
0
1
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
3
7
11
15
19
23
27
0
0
1
1
1
1
1
1
0
0
1
1
0
1
0
1
0
1
N DIVIDER OUTPUT
DV
DD
R DIVIDER OUTPUT
RESERVED
SERIAL DATA OUTPUT
DGND
0
1
1
0
1
0
1
0
31
35
1
0
0
1
39
1
1
0
0
1
1
0
1
43
47
1
1
1
1
0
0
0
1
51
55
1
1
1
1
1
1
0
1
59
63
CPI6
CPI5
CPI4
I
(mA)
CP
CPI3
CPI2
CPI1
0.625
1.25
1.875
0
0
0
0
0
1
0
1
0
2.5
3.125
0
1
1
0
1
0
3.75
1
0
1
4.375
5.0
1
1
1
1
0
1
CE PIN
PD2
PD1
MODE
0
0
0
ASYNCHRONOUS POWER-DOWN
NORMAL OPERATION
SOFTWARE POWER-DOWN
0
1
1
X
0
1
PRESCALER VALUE
P2
P1
0
0
1
1
0
1
0
1
8/9
16/17
32/33
64/65
Figure 17. Function Latch Map
Rev. 0 | Page 12 of 16
Data Sheet
ADF41020
Fast Lock Mode 2
THE FUNCTION LATCH
With C2 and C1 set to 1 and 0, respectively, the on-chip
function latch is programmed. Figure 17 shows the input
data format for programming the function latch.
The charge pump current is switched to the contents of Current
Setting 2. The device enters fast lock when 1 is written to the
CP gain bit in the N (A, B) counter latch. The device exits fast
lock under the control of the timer counter. After the timeout
period, which is determined by the value in TC4 to TC1, the CP
gain bit in the N (A, B) counter latch is automatically reset to 0,
and the device reverts to normal mode instead of fast lock. See
Figure 17 for the timeout periods.
Counter Reset
DB2 (F1) is the counter reset bit. When this is 1, the R counter
and the N (A, B) counter is reset. For normal operation, this bit
should be 0. When powering up, disable the F1 bit (set to 0).
The N counter then resumes counting in close alignment with
the R counter. (The maximum error is one prescaler cycle).
Timer Counter Control
The user has the option of programming two charge pump
currents. The intent is that Current Setting 1 is used when the
RF output is stable and the system is in a static state. Current
Setting 2 is used when the system is dynamic and in a state of
change (that is, when a new output frequency is programmed).
The normal sequence of events follows.
Power-Down
Bit DB3 (PD1) provides a software power-down mode to reduce
the overall current drawn by the device. It is enabled by the CE
pin. When the CE pin is low, the device is immediately disabled
regardless of the state of PD1.
In the programmed software power-down, the device powers
down immediately after latching 1 into the PD1 bit. PD2 is a
reserved bit and should be cleared to 0.
The user initially decides what the preferred charge pump
currents are going to be. For example, the choice may be
0.85 mA as Current Setting 1 and 1.7 mA as Current Setting 2.
When a power-down is activated, the following events occur:
Simultaneously, the decision must be made as to how long the
secondary current stays active before reverting to the primary
current. This is controlled by the timer counter control bits,
DB14 to DB11 (TC4 to TC1), in the function latch. The truth
table is given in Figure 17.
•
All active dc current paths in the main synthesizer section
are removed. However, the RF divide-by-4 prescaler
remains active.
The R, N, and timeout counters are forced to their load
state conditions.
•
To program a new output frequency, simply program the N (A, B)
counter latch with new values for A and B. Simultaneously, the
CP gain bit can be set to 1, which sets the charge pump with the
value in CPI6 to CPI4 for a period of time determined by TC4
to TC1. When this time is up, the charge pump current reverts
to the value set by CPI3 to CPI1. At the same time, the CP gain
bit in the N (A, B) counter latch is reset to 0 and is ready for the
next time the user wishes to change the frequency.
•
•
•
•
•
The charge pump is forced into three-state mode.
The digital clock detect circuitry is reset.
The RFIN input is debiased.
The reference input buffer circuitry is disabled.
The input register remains active and capable of loading
and latching data.
MUXOUT Control
Note that there is an enable feature on the timer counter. It is
enabled when Fast Lock Mode 2 is chosen by setting the fast
lock mode bit (DB10) in the function latch to 1.
The on-chip multiplexer is controlled by M3, M2, and M1 on
the ADF41020. Figure 17 shows the truth table.
Fast Lock Enable Bit
Charge Pump Currents
Bit DB9 (F4) of the function latch is the fast lock enable bit.
When this bit is 1, fast lock is enabled.
CPI3, CPI2, and CPI1 program Current Setting 1 for the charge
pump. CPI6, CPI5, and CPI4 program Current Setting 2 for the
charge pump. The truth table is given in Figure 17.
Fast Lock Mode Bit
Bit DB10 (F5)of the function latch is the fast lock mode bit.
When fast lock is enabled, this bit determines which fast lock
mode is used. If the fast lock mode bit is 0, then Fast Lock
Mode 1 is selected; and if the fast lock mode bit is 1, then Fast
Lock Mode 2 is selected.
Prescaler Value
P2 and P1 in the function latch set the programmable P
prescaler value. The P value should be chosen so that the
prescaler output frequency is always less than or equal to
350 MHz.
Fast Lock Mode 1
PD Polarity
The charge pump current is switched to the contents of Current
Setting 2. The device enters fast lock when 1 is written to the CP
gain bit in the N (A, B) counter latch. The device exits fast lock
when 0 is written to the CP gain bit in the N (A, B) counter latch.
Bit DB7 (F2) sets the phase detector polarity bit. See Figure 17.
Rev. 0 | Page 13 of 16
ADF41020
Data Sheet
CP Three-State
6. Bring CE high to take the device out of power-down. The
R and N (A, B) counters now resume counting in close
alignment.
Bit DB8 (F3) controls the CP output pin. With the bit set high,
the CP output is put into three-state. With the bit set low, the
CP output is enabled.
Note that after CE goes high, a 1 µs duration may be required
for the prescaler band gap voltage and oscillator input buffer
bias to reach steady state.
CE can be used to power the device up and down to check
for channel activity. The input register does not need to be
reprogrammed each time the device is disabled and enabled
as long as it is programmed at least once after VDD is initially
applied.
Device Programming After Initial Power-Up
After initial power up of the device, there are three methods for
programming the device: function latch, CE pin, and counter
reset.
Function Latch Method
1. Apply VDD
.
2. Program the function latch load (10 in two LSBs of the
control word), making sure that the F1 bit is programmed
to a 0.
3. Do an R load (00 in two LSBs).
4. Do an N (A, B) load (01 in two LSBs).
Counter Reset Method
1. Apply VDD
.
2. Do a function latch load (10 in two LSBs). As part of this,
load 1 to the F1 bit. This enables the counter reset.
3. Do an R counter load (00 in two LSBs).
4. Do an N (A, B) counter load (01 in two LSBs).
5. Do a function latch load (10 in two LSBs). As part of this,
load 0 to the F1 bit. This disables the counter reset.
CE Pin Method
1. Apply VDD
.
2. Bring CE low to put the device into power-down. This is an
asychronous power-down in that it happens immediately.
3. Program the function latch (10).
This sequence provides direct control over the internal
counter reset.
4. Program the R counter latch (00).
5. Program the N (A, B) counter latch (01).
Rev. 0 | Page 14 of 16
Data Sheet
ADF41020
APPLICATIONS INFORMATION
Blackfin BF527 Interface
INTERFACING
Figure 19 shows the interface between the ADF41020 and
the Blackfin® ADSP-BF527 digital signal processor (DSP). The
ADF41020 needs a 24-bit serial word for each latch write. The
easiest way to accomplish this using the Blackfin family is to
use the autobuffered transmit mode of operation with alternate
framing. This provides a means for transmitting an entire block
of serial data before an interrupt is generated. Set up the word
length for 8 bits and use three memory locations for each 24-bit
word. To program each 24-bit latch, store the three 8-bit bytes,
enable the autobuffered mode, and write to the transmit register
of the DSP. This last operation initiates the autobuffer transfer.
As in the microcontroller case, ensure the clock speeds are
within the maximum limits outlined in Table 1.
The ADF41020 has a simple 1.8 V and 3 V SPI-compatible
serial interface for writing to the device. CLK, DATA, and
LE control the data transfer. When LE goes high, the 24 bits
clocked into the input register on each rising edge of CLK
are transferred to the appropriate latch. See Figure 2 for the
timing diagram and Table 5 for the latch truth table.
The maximum allowable serial clock rate is 20 MHz.
ADuC7020 Interface
Figure 18 shows the interface between the ADF41020 and the
ADuC7019 to ADuC7023 family of analog microcontrollers.
The ADuC70xx family is based on an AMR7 core, although the
same interface can be used with any 8051-based micro-
controller. The microcontroller is set up for SPI master mode
with CPHA = 0. To initiate the operation, the I/O port driving
LE is brought low. Each latch of the ADF41020 needs a 24-bit
word. This is accomplished by writing three 8-bit bytes from the
microcontroller to the device. When the third byte is written,
bring the LE input high to complete the transfer.
SCK
CLK
MOSI
DATA
GPIO
LE
CE
ADSP-BF527
ADF41020
I/O FLAGS
MUXOUT
On first applying power to the ADF41020, it needs three writes
(one each to the function latch, R counter latch, and N counter
latch) for the output to become active.
(LOCK DETECT)
Figure 19. ADSP-BF527-to-ADF41020 Interface
I/O port lines on the microcontroller are also used to control
power-down (CE input) and to detect lock (MUXOUT
configured as lock detect and polled by the port input).
PCB DESIGN GUIDELINES
The lands on the LFCSP (CP-20) are rectangular. The printed
circuit board (PCB) pad for these should be 0.1 mm longer than
the package land length and 0.05 mm wider than the package
land width. Center the land on the pad to ensure that the solder
joint size is maximized. The bottom of the LFCSP has a central
thermal pad.
When operating in the mode described, the maximum SPI
transfer rate of the ADuC7023 is 20 Mbps. This means that
the maximum rate at which the output frequency can be
changed is 833 kHz. If using a faster SPI clock, ensure
adherence to the SPI timing requirements listed in Table 1.
The thermal pad on the PCB should be at least as large as the
exposed pad. To avoid shorting, on the PCB, provide a
clearance of at least 0.25 mm between the thermal pad and the
inner edges of the pad pattern.
SCLOCK
MOSI
CLK
DATA
LE
CE
ADuC70xx
ADF41020
Thermal vias may be used on the PCB thermal pad to improve
thermal performance of the package. If vias are used, they should
be incorporated in the thermal pad at 1.2 mm pitch grid. The
via diameter should be between 0.3 mm and 0.33 mm, and plate
the via barrel with 1 oz copper to plug the via.
I/O PORTS
MUXOUT
(LOCK DETECT)
Figure 18. ADuC70xx-to-ADF41020 Interface
Connect the PCB thermal pad to GND.
Rev. 0 | Page 15 of 16
ADF41020
Data Sheet
OUTLINE DIMENSIONS
4.10
4.00 SQ
3.90
0.30
0.25
0.18
PIN 1
INDICATOR
PIN 1
INDICATOR
16
15
20
0.50
BSC
1
EXPOSED
PAD
2.30
2.10 SQ
2.00
11
5
6
10
0.65
0.60
0.55
0.20 MIN
TOP VIEW
BOTTOM VIEW
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
0.80
0.75
0.70
0.05 MAX
0.02 NOM
COPLANARITY
0.08
SECTION OF THIS DATA SHEET.
SEATING
PLANE
0.20 REF
COMPLIANT TO JEDEC STANDARDS MO-220-WGGD-1.
Figure 20. 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-20-6)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
ADF41020BCPZ
ADF41020BCPZ-RL7
EV-ADF41020EB1Z
Temperature Range
–40°C to +85°C
–40°C to +85°C
Package Description
Package Option
CP-20-6
CP-20-6
20-Lead Lead Frame Chip Scale Package (LFCSP_WQ)
20-Lead Lead Frame Chip Scale Package (LFCSP_WQ)
Evaluation Board
1 Z = RoHS Compliant Part.
©2012 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D10304-0-10/12(0)
Rev. 0 | Page 16 of 16
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