EV-ADF4360-1EB1Z [ADI]
Integrated Synthesizer and VCO; 集成的合成器和VCO
| 型号： | EV-ADF4360-1EB1Z |
| 厂家： | 
ADI |
| 描述： | Integrated Synthesizer and VCO |
| 文件： | 总24页 (文件大小：335K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Integrated Synthesizer and VCO
ADF4360-1
Data Sheet
FEATURES
GENERAL DESCRIPTION
Output frequency range: 2050 MHz to 2450 MHz
Divide-by-2 output
3.0 V to 3.6 V power supply
1.8 V logic compatibility
Integer-N synthesizer
Programmable dual-modulus prescaler 8/9, 16/17, 32/33
Programmable output power level
3-wire serial interface
Analog and digital lock detect
Hardware and software power-down mode
The ADF4360-1 is a fully integrated integer-N synthesizer and
voltage-controlled oscillator (VCO). The ADF4360-1 is
designed for a center frequency of 2250 MHz. In addition, there
is a divide-by-2 option available, whereby the user gets an RF
output of between 1025 MHz and 1225 MHz.
Control of all the on-chip registers is through a simple 3-wire
interface. The device operates with a power supply ranging
from 3.0 V to 3.6 V and can be powered down when not in use.
APPLICATIONS
Wireless handsets (DECT, GSM, PCS, DCS, WCDMA)
Test equipment
Wireless LANs
CATV equipment
FUNCTIONAL BLOCK DIAGRAM
AV
DV
CE
R
SET
DD
DD
ADF4360-1
MUXOUT
MULTIPLEXER
14-BIT R
COUNTER
REF
IN
LOCK
DETECT
MUTE
CLK
DATA
LE
24-BIT
FUNCTION
LATCH
24-BIT
DATA REGISTER
CHARGE
PUMP
CP
PHASE
COMPARATOR
V
V
VCO
TUNE
C
C
N
C
INTEGER
REGISTER
RF
RF
A
B
OUT
VCO
CORE
OUTPUT
STAGE
13-BIT B
COUNTER
OUT
LOAD
LOAD
5-BIT A
COUNTER
PRESCALER
P/P+1
N = (BP + A)
2
DIVSEL = 1
DIVSEL = 2
CPGND
AGND
DGND
Figure 1.
Rev. C
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ADF4360-1
Data Sheet
TABLE OF CONTENTS
Specifications..................................................................................... 3
VCO ............................................................................................. 10
Output Stage................................................................................ 11
Latch Structure ........................................................................... 12
Power-Up..................................................................................... 16
Control Latch.............................................................................. 18
N Counter Latch......................................................................... 19
R Counter Latch ......................................................................... 19
Applications..................................................................................... 20
Direct Conversion Modulator .................................................. 20
Fixed Frequency LO................................................................... 21
Interfacing ................................................................................... 21
PCB Design Guidelines for Chip-Scale Package.......................... 22
Output Matching........................................................................ 22
Outline Dimensions....................................................................... 23
Ordering Guide .......................................................................... 23
Timing Characteristics..................................................................... 5
Absolute Maximum Ratings............................................................ 6
Transistor Count........................................................................... 6
ESD Caution.................................................................................. 6
Pin Configuration and Function Descriptions............................. 7
Typical Performance Characteristics ............................................. 8
Circuit Description........................................................................... 9
Reference Input Section............................................................... 9
Prescaler (P/P + 1)........................................................................ 9
A and B Counters ......................................................................... 9
R Counter ...................................................................................... 9
PFD and Charge Pump................................................................ 9
MUXOUT and Lock Detect...................................................... 10
Input Shift Register..................................................................... 10
REVISION HISTORY
Added Table 10 ............................................................................... 16
Added Figure 16 ............................................................................. 16
Changes to Ordering Guide.......................................................... 23
Updated Outline Dimensions....................................................... 23
/12—Rev. B to Rev. C
Changes to Table 1............................................................................ 4
Changes to Table 3............................................................................ 6
Changes to Figure 3 and Table 4..................................................... 7
Change to Output Matching section............................................ 22
Updated Outline Dimensions....................................................... 23
Changes to Ordering Guide .......................................................... 23
6/04—Data Sheet Changed from Rev. 0 to Rev. A
Changes to Specifications.................................................................3
Changes to Table 6.......................................................................... 12
Changes to Table 7.......................................................................... 13
Changes to Table 9.......................................................................... 15
12/04—Rev. A to Rev. B
Updated Format..................................................................Universal
Changes to Specifications ................................................................ 3
Changes to the Timing Characteristics ......................................... 5
Changes to the Power-Up Section................................................ 16
8/03—Revision 0: Initial Version
Rev. C | Page 2 of 24
Data Sheet
ADF4360-1
SPECIFICATIONS1
AVDD = DVDD = VVCO = 3.3 V 10%; AGND = DGND = 0 V; TA = TMIN to TMAX, unless otherwise noted.
Table 1.
Parameter
B Version
Unit
Conditions/Comments
REFIN CHARACTERISTICS
REFIN Input Frequency
10/250
MHz min/max
For f < 10 MHz, use a dc-coupled CMOS compatible
square wave, slew rate > 21 V/µs.
REFIN Input Sensitivity
0.7/AVDD
0 to AVDD
5.0
p-p min/max
V max
pF max
AC-coupled.
CMOS compatible.
REFIN Input Capacitance
REFIN Input Current
PHASE DETECTOR
Phase Detector Frequency2
CHARGE PUMP
100
µA max
8
MHz max
ICP Sink/Source3
With RSET = 4.7 kΩ.
High Value
Low Value
RSET Range
2.5
mA typ
mA typ
kΩ
nA typ
% typ
% typ
% typ
0.312
2.7/10
0.2
2
1.5
ICP 3-State Leakage Current
Sink and Source Current Matching
ICP vs. VCP
ICP vs. Temperature
LOGIC INPUTS
1.25 V ≤ VCP ≤ 2.5 V.
1.25 V ≤ VCP ≤ 2.5 V.
VCP = 2.0 V.
2
VINH, Input High Voltage
VINL, Input Low Voltage
IINH/IINL, Input Current
CIN, Input Capacitance
LOGIC OUTPUTS
VOH, Output High Voltage
IOH, Output High Current
VOL, Output Low Voltage
POWER SUPPLIES
AVDD
1.5
0.6
1
V min
V max
µA max
pF max
3.0
DVDD – 0.4 V min
500
0.4
CMOS output chosen.
IOL = 500 µA.
µA max
V max
3.0/3.6
AVDD
AVDD
10
V min/V max
DVDD
VVCO
AIDD
4
mA typ
mA typ
mA typ
mA typ
µA typ
4
DIDD
2.5
4, 5
IVCO
24.0
3.5 – 11.0
7
ICORE = 15 mA.
RF output stage is programmable.
4
IRFOUT
Low Power Sleep Mode4
RF OUTPUT CHARACTERISTICS5
VCO Output Frequency
VCO Sensitivity
2050/2450 MHz min/max
57
400
6
15
−20
−35
−13/−6
3
ICORE = 15 mA.
MHz/V typ
µs typ
MHz/V typ
kHz typ
dBc typ
dBc typ
dBm typ
dB typ
V min/max
Lock Time6
To within 10 Hz of final frequency.
Into 2.00 VSWR load.
Frequency Pushing (Open Loop)
Frequency Pulling (Open Loop)
Harmonic Content (Second)
Harmonic Content (Third)
Output Power5, 7
Programmable in 3 dB steps. See Table 7.
For tuned loads, see the Output Matching section.
Output Power Variation
VCO Tuning Range
1.25/2.5
Rev. C | Page 3 of 24
ADF4360-1
Data Sheet
Parameter
B Version
Unit
Conditions/Comments
NOISE CHARACTERISTICS1, 5
VCO Phase-Noise Performance8
−110
−130
−141
−148
−172
−163
−147
−81
dBc/Hz typ
dBc/Hz typ
dBc/Hz typ
dBc/Hz typ
dBc/Hz typ
dBc/Hz typ
dBc/Hz typ
dBc/Hz typ
Degrees typ
dBc typ
@ 100 kHz offset from carrier.
@ 1 MHz offset from carrier.
@ 3 MHz offset from carrier.
@ 10 MHz offset from carrier.
@ 25 kHz PFD frequency.
@ 200 kHz PFD frequency.
@ 8 MHz PFD frequency.
@ 1 kHz offset from carrier.
100 Hz to 100 kHz.
Synthesizer Phase-Noise Floor9
In-Band Phase Noise10, 11
RMS Integrated Phase Error12
0.72
Spurious Signals due to PFD Frequency11, 13 −70
Level of Unlocked Signal with MTLD Enabled
−38
dBm typ
1 Operating temperature range is –40°C to +85°C.
2 Guaranteed by design. Sample tested to ensure compliance.
3 ICP is internally modified to maintain constant-loop gain over the frequency range.
4 TA = 25°C; AVDD = DVDD = VVCO = 3.3 V; P = 32.
5 These characteristics are guaranteed for VCO Core Power = 15 mA.
6 Jumping from 2.05 GHz to 2.45 GHz. PFD frequency = 200 kHz; loop bandwidth = 10 kHz.
7 Using 50 Ω resistors to VVCO into a 50 Ω load. For tuned loads, see the Output Matching section.
8 The noise of the VCO is measured in open-loop conditions.
9 The synthesizer phase-noise floor is estimated by measuring the in-band phase noise at the output of the VCO and subtracting 20 log N (where N is the N divider value).
10 The phase noise is measured with the EV-ADF4360-1EB1Z Evaluation Board and the HP8562E Spectrum Analyzer. The spectrum analyzer provides the REFIN for the
synthesizer; offset frequency = 1 kHz.
11
f
f
= 10 MHz; fPFD = 200 kHz; N = 12500; Loop B/W = 10 kHz.
= 10 MHz; fPFD = 1 MHz; N = 2400; Loop B/W = 25 kHz.
REFIN
12
REFIN
13 The spurious signals are measured with the EV-ADF4360-1EB1Z Evaluation Board and the HP8562E Spectrum Analyzer. The spectrum analyzer provides the REFIN for
the synthesizer; fREFOUT = 10 MHz @ 0 dBm.
Rev. C | Page 4 of 24
Data Sheet
ADF4360-1
TIMING CHARACTERISTICS1
AVDD = DVDD = VVCO = 3.3 V 10%; AGND = DGND = 0 V; 1.8 V and 3 V logic levels used; TA = TMIN to TMAX, unless otherwise noted.
Table 2.
Parameter
Limit at TMIN to TMAX (B Version)
Unit
Test Conditions/Comments
LE Setup Time
t1
t2
t3
t4
t5
t6
t7
20
10
10
25
25
10
20
ns min
ns min
ns min
ns min
ns min
ns min
ns min
DATA to CLOCK Setup Time
DATA to CLOCK Hold Time
CLOCK High Duration
CLOCK Low Duration
CLOCK to LE Setup Time
LE Pulse Width
1 See the Power-Up section for the recommended power-up procedure for this device.
t4
t5
CLOCK
t2
t3
DB1
(CONTROL BIT C2)
DB0 (LSB)
(CONTROL BIT C1)
DB23 (MSB)
DB22
DB2
DATA
LE
t7
t1
t6
LE
Figure 2. Timing Diagram
Rev. C | Page 5 of 24
ADF4360-1
Data Sheet
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational sec-
tions of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Parameter
AVDD to GND1
Rating
−0.3 V to +3.9 V
−0.3 V to +0.3 V
−0.3 V to +3.9 V
−0.3 V to +0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
AVDD to DVDD
VVCO to GND
VVCO to AVDD
Digital I/O Voltage to GND
Analog I/O Voltage to GND
REFIN to GND
This device is a high performance RF integrated circuit with an
ESD rating of <1 kV and it is ESD sensitive. Proper precautions
should be taken for handling and assembly.
Operating Temperature Range
Maximum Junction Temperature
CSP θJA Thermal Impedance
(Paddle Soldered)
(Paddle Not Soldered)
Lead Temperature, Soldering Reflow
150°C
50°C/W
88°C/W
260°C
TRANSISTOR COUNT
12543 (CMOS) and 700 (Bipolar)
1 GND = AGND = DGND = 0 V.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate
on the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy elec-
trostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation
or loss of functionality.
Rev. C | Page 6 of 24
Data Sheet
ADF4360-1
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
PIN 1
IDENTIFIER
CPGND
AV
1
2
3
4
5
6
18 DATA
17 CLK
DD
AGND
ADF4360-1
TOP VIEW
(Not to Scale)
16 REF
IN
RF
RF
A
B
15 DGND
OUT
14
13
C
R
OUT
N
V
VCO
SET
NOTES
1. THE EXPOSED PAD MUST BE CONNECTED TO AGND.
Figure 3. Pin Configuration
Table 4. Pin Function Descriptions
Pin No.
Mnemonic Description
1
2
CPGND
AVDD
Charge Pump Ground. This is the ground return path for the charge pump.
Analog Power Supply. This ranges from 3.0 V to 3.6 V. Decoupling capacitors to the analog ground plane
should be placed as close as possible to this pin. AVDD must have the same value as DVDD
.
3, 8 to 11, 22
4
AGND
Analog Ground. This is the ground return path of the prescaler and VCO.
VCO Output. The output level is programmable from −6 dBm to −13 dBm. See the Output Matching section
for a description of the various output stages.
VCO Complementary Output. The output level is programmable from −6 dBm to −13 dBm. See the Output
Matching section for a description of the various output stages.
Power Supply for the VCO. This ranges from 3.0 V to 3.6 V. Decoupling capacitors to the analog ground plane
should be placed as close as possible to this pin. VVCO must have the same value as AVDD
Control Input to the VCO. This voltage determines the output frequency and is derived from filtering the CP
output voltage.
RFOUT
RFOUT
VVCO
A
5
6
7
B
.
VTUNE
12
13
CC
RSET
Internal Compensation Node. This pin must be decoupled to ground with a 10 nF capacitor.
Connecting a resistor between this pin and CPGND sets the maximum charge pump output current for the
synthesizer. The nominal voltage potential at the RSET pin is 0.6 V. The relationship between ICP and RSET is
11.75
RSET
ICPmax
=
where RSET = 4.7 kΩ, ICPMAX = 2.5 mA.
14
15
16
CN
DGND
REFIN
Internal Compensation Node. This pin must be decoupled to VVCO with a 10 µF capacitor.
Digital Ground.
Reference Input. This is a CMOS input with a nominal threshold of VDD/2 and a dc equivalent input resistance of
100 kΩ. See Figure 10. This input can be driven from a TTL or CMOS crystal oscillator or it can be ac-coupled.
17
18
19
20
21
23
24
CLK
Serial Clock Input. This serial clock is used to clock in the serial data to the registers. The data is latched into
the 24-bit shift register on the CLK rising edge. This input is a high impedance CMOS input.
Serial Data Input. The serial data is loaded MSB first with the two LSBs being the control bits. This input is a
high impedance CMOS input.
Load Enable, CMOS Input. When LE goes high, the data stored in the shift registers is loaded into one of the
four latches, and the relevant latch is selected using the control bits.
This multiplexer output allows either the lock detect, the scaled RF, or the scaled reference frequency to be
accessed externally.
DATA
LE
MUXOUT
DVDD
CE
Digital Power Supply. This ranges from 3.0 V to 3.6 V. Decoupling capacitors to the digital ground plane
should be placed as close as possible to this pin. DVDD must have the same value as AVDD
.
Chip Enable. A logic low on this pin powers down the device and puts the charge pump into three-state
mode. Taking the pin high powers up the device depending on the status of the power-down bits.
Charge Pump Output. When enabled, this provides ICP to the external loop filter, which in turn drives the
internal VCO.
CP
EP
Exposed Pad. The exposed pad must be connected to AGND.
Rev. C | Page 7 of 24
ADF4360-1
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
0
–10
–20
–30
–40
–50
–60
0
–10
–20
–30
V
= 3V, V = 3V
VCO
DD
= 2.5mA
I
CP
PFD FREQUENCY = 200kHz
LOOP BANDWIDTH = 10kHz
RES. BANDWIDTH = 10Hz
VIDEO BANDWIDTH = 10Hz
SWEEP = 1.9 SECONDS
–40 AVERAGES = 10
–50
–70
–80
1
–90
2
–100
–110
–120
–130
–140
–150
–160
–170
–60
–70
–80
–90
–83.0dBc/Hz
3
4
1k
10k
100k
1M
10M
–2kHz
–1kHz
2250MHz
1kHz
2kHz
FREQUENCY OFFSET (Hz)
Figure 7. Close-In Phase Noise at 2250 MHz (200 kHz Channel Spacing)
Figure 4. Open Loop VCO Phase Noise
–70
–75
0
V
I
= 3V, V = 3V
VCO
DD
= 2.5mA
CP
–10
–20
–30
–80
PFD FREQUENCY = 200kHz
LOOP BANDWIDTH = 10kHz
RES. BANDWIDTH = 1kHz
VIDEO BANDWIDTH = 1kHz
SWEEP = 1.3 SECONDS
–85
–90
–95
–100
–105
–110
–115
–120
–125
–130
–135
–140
–145
–150
–155
–40 AVERAGES = 1
–50
–70.7dBc
–60
–70
–80
–90
100
1000
10k
100k
1M
10M
–200kHz
–100kHz
2250MHz
100kHz
200kHz
FREQUENCY OFFSET (Hz)
Figure 8. Reference Spurs at 2250 MHz
(200 kHz Channel Spacing, 10 kHz Loop Bandwidth)
Figure 5. VCO Phase Noise, 2250 MHz, 200 kHz PFD, 10 kHz Loop Bandwidth
0
–10
–20
–30
–70
–75
V
= 3V, V = 3V
VCO
DD
= 2.5mA
I
CP
–80
PFD FREQUENCY = 1MHz
LOOP BANDWIDTH = 25kHz
RES. BANDWIDTH = 10kHz
VIDEO BANDWIDTH = 10kHz
SWEEP = 1.9 SECONDS
–85
–90
–95
–100
–105
–110
–115
–120
–125
–130
–135
–140
–145
–150
–155
–40 AVERAGES = 10
–50
–60
–70
–80
–90
–84.8dBc/Hz
–1MHz
–0.5MHz
2250MHz
0.5MHz
1MHz
100
1000
10k
100k
1M
10M
FREQUENCY OFFSET (Hz)
Figure 6. VCO Phase Noise, 1125 MHz,
Divide-by-2 Enabled, 200 kHz PFD, 10 kHz Loop Bandwidth
Figure 9. Reference Spurs at 2250 MHz
(1 MHz Channel Spacing, 25 kHz Loop Bandwidth)
Rev. C | Page 8 of 24
Data Sheet
ADF4360-1
CIRCUIT DESCRIPTION
REFERENCE INPUT SECTION
The reference input stage is shown in Figure 10. SW1 and SW2
are normally closed switches. SW3 is normally open. When
power-down is initiated, SW3 is closed, and SW1 and SW2 are
opened. This ensures that there is no loading of the REFIN pin
on power-down.
N = BP + A
13-BIT B
COUNTER
TO PFD
LOAD
PRESCALER
P/P+1
FROM VCO
LOAD
5-BIT A
MODULUS
CONTROL
POWER-DOWN
CONTROL
COUNTER
N DIVIDER
100kΩ
SW2
NC
TO R COUNTER
REF
IN
Figure 11. A and B Counters
NC
SW1
BUFFER
R COUNTER
SW3
NO
The 14-bit R counter allows the input reference frequency to
be divided down to produce the reference clock to the phase
frequency detector (PFD). Division ratios from 1 to 16,383 are
allowed.
Figure 10. Reference Input Stage
PRESCALER (P/P + 1)
The dual-modulus prescaler (P/P + 1), along with the A and B
counters, enables the large division ratio, N, to be realized (N =
BP + A). The dual-modulus prescaler, operating at CML levels,
takes the clock from the VCO and divides it down to a manage-
able frequency for the CMOS A and B counters. The prescaler is
programmable. It can be set in software to 8/9, 16/17, or 32/33
and is based on a synchronous 4/5 core. There is a minimum
divide ratio possible for fully contiguous output frequencies;
this minimum is determined by P, the prescaler value, and is
given by (P2−P).
PFD AND CHARGE PUMP
The PFD takes inputs from the R counter and N counter
(N = BP + A) and produces an output proportional to the phase
and frequency difference between them. Figure 12 is a simpli-
fied schematic. The PFD includes a programmable delay ele-
ment that controls the width of the antibacklash pulse. This
pulse ensures that there is no dead zone in the PFD transfer
function and minimizes phase noise and reference spurs. Two
bits in the R counter latch, ABP2 and ABP1, control the width
of the pulse (see Table 9).
A AND B COUNTERS
V
P
The A and B CMOS counters combine with the dual-modulus
prescaler to allow a wide range division ratio in the PLL feed-
back counter. The counters are specified to work when the
prescaler output is 300 MHz or less. Thus, with a VCO
frequency of 2.5 GHz, a prescaler value of 16/17 is valid, but a
value of 8/9 is not valid.
CHARGE
PUMP
UP
HI
D1
Q1
U1
R DIVIDER
CLR1
Pulse Swallow Function
PROGRAMMABLE
DELAY
CP
U3
The A and B counters, in conjunction with the dual-modulus
prescaler, make it possible to generate output frequencies that
are spaced only by the reference frequency divided by R. The
VCO frequency equation is
ABP1
ABP2
CLR2
U2
DOWN
HI
D2
Q2
fVCO =[ P × B + A]× f
/R
(
)
REFIN
N DIVIDER
where:
VCO is the output frequency of the VCO.
CPGND
f
P is the preset modulus of the dual-modulus prescaler (8/9,
16/17, and so on).
B is the preset divide ratio of the binary 13-bit counter (3 to 8191).
R DIVIDER
N DIVIDER
CP OUTPUT
A is the preset divide ratio of the binary 5-bit swallow counter (0 to 31).
fREFIN is the external reference frequency oscillator.
Figure 12. PFD Simplified Schematic and Timing (In Lock)
Rev. C | Page 9 of 24
ADF4360-1
Data Sheet
Table 5. C2 and C1 Truth Table
MUXOUT AND LOCK DETECT
Control Bits
The output multiplexer on the ADF4360 family allows the user
to access various internal points on the chip. The state of
MUXOUT is controlled by M3, M2, and M1 in the function
latch. The full truth table is shown in Table 7. Figure 13 shows
the MUXOUT section in block diagram form.
C2
0
0
C1
0
1
Data Latch
Control Latch
R Counter
1
1
0
1
N Counter (A and B)
Test Mode Latch
Lock Detect
MUXOUT can be programmed for two types of lock detect:
digital and analog. Digital lock detect is active high. When LDP
in the R counter latch is set to 0, digital lock detect is set high
when the phase error on three consecutive phase detector cycles
is less than 15 ns.
VCO
The VCO core in the ADF4360 family uses eight overlapping
bands, as shown in Figure 14, to allow a wide frequency range
to be covered without a large VCO sensitivity (KV) and resultant
poor phase noise and spurious performance.
With LDP set to 1, five consecutive cycles of less than 15 ns
phase error are required to set the lock detect. It stays set high
until a phase error greater than 25 ns is detected on any subse-
quent PD cycle.
The correct band is chosen automatically by the band select
logic at power-up or whenever the N counter latch is updated. It
is important that the correct write sequence be followed at pow-
er-up. This sequence is
The N-channel open-drain analog lock detect should be operat-
ed with an external pull-up resistor of 10 kΩ nominal. When
lock has been detected, the output will be high with narrow
low-going pulses.
1. R counter latch
2. Control latch
3. N counter latch
DV
DD
During band select, which takes five PFD cycles, the VCO VTUNE
is disconnected from the output of the loop filter and connected
to an internal reference voltage.
ANALOG LOCK DETECT
DIGITAL LOCK DETECT
R COUNTER OUTPUT
N COUNTER OUTPUT
SDOUT
3.0
2.8
2.6
MUXOUT
MUX
CONTROL
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
DGND
Figure 13. MUXOUT Circuit
INPUT SHIFT REGISTER
The ADF4360 family’s digital section includes a 24-bit input
shift register, a 14-bit R counter, and an 18-bit N counter, com-
prising of a 5-bit A counter and a 13-bit B counter. Data is
clocked into the 24-bit shift register on each rising edge of CLK.
The data is clocked in MSB first. Data is transferred from the
shift register to one of four latches on the rising edge of LE. The
destination latch is determined by the state of the two control
bits (C2, C1) in the shift register. The two LSBs are DB1 and
DB0, as shown in Figure 2.
FREQUENCY (MHz)
Figure 14. Frequency vs. VTUNE, ADF4360-1
The R counter output is used as the clock for the band select
logic and should not exceed 1 MHz. A programmable divider is
provided at the R counter input to allow division by 1, 2, 4, or 8
and is controlled by Bits BSC1 and BSC2 in the R counter latch.
Where the required PFD frequency exceeds 1 MHz, the divide
ratio should be set to allow enough time for correct band
selection.
The truth table for these bits is shown in Table 5. Table 6 shows
a summary of how the latches are programmed. Note that the
test mode latch is used for factory testing and should not be
programmed by the user.
Rev. C | Page 10 of 24
Data Sheet
ADF4360-1
After band select, normal PLL action resumes. The nominal value
of KV is 57 MHz/V or 28 MHZ/V if divide-by-2 operation has been
selected (by programming DIV2 [DB22], high in the N counter
latch). The ADF4360 family contains linearization circuitry to min-
imize any variation of the product of ICP and KV.
If the outputs are used individually, the optimum output stage
consists of a shunt inductor to VDD.
Another feature of the ADF4360 family is that the supply current
to the RF output stage is shut down until the part achieves lock as
measured by the digital lock detect circuitry. This is enabled by the
mute-till-lock detect (MTLD) bit in the control latch.
The operating current in the VCO core is programmable in four
steps: 5 mA, 10 mA, 15 mA, and 20 mA. This is controlled by
Bits PC1 and PC2 in the control latch.
RF
A
RF
B
OUT
OUT
OUTPUT STAGE
The RFOUTA and RFOUTB pins of the ADF4360 family are con-
nected to the collectors of an NPN differential pair driven by
buffered outputs of the VCO, as shown in Figure 15. To allow
the user to optimize the power dissipation versus the output
power requirements, the tail current of the differential pair is
programmable via Bits PL1 and PL2 in the control latch. Four
current levels may be set: 3.5 mA, 5 mA, 7.5 mA, and 11 mA.
These levels give output power levels of −13 dBm, −10.5 dBm,
−8 dBm, and −6 dBm, respectively, using a 50 Ω resistor to VDD
and ac coupling into a 50 Ω load. Alternatively, both outputs
can be combined in a 1 + 1:1 transformer or a 180° microstrip
coupler (see the Output Matching section).
BUFFER/
DIVIDE BY 2
VCO
Figure 15. Output Stage ADF4360-1
Rev. C | Page 11 of 24
ADF4360-1
Data Sheet
LATCH STRUCTURE
Table 6 shows the three on-chip latches for the ADF4360 family. The two LSBs determine which latch is programmed.
Table 6. Latch Structure
CONTROL LATCH
OUTPUT
POWER
LEVEL
CORE
POWER
LEVEL
PRESCALER
VALUE
CURRENT
SETTING 2
CURRENT
SETTING 1
MUXOUT
CONTROL
CONTROL
BITS
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
P2
P1
PD2 PD1 CPI6 CPI5 CPI4 CPI3 CPI2 CPI1 PL2 PL1 MTLD CPG CP
PDP
M3
M2
M1
CR
PC2 PC1 C2 (0) C1 (0)
N COUNTER LATCH
CONTROL
BITS
13-BIT B COUNTER
5-BIT A COUNTER
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
DIVSEL DIV2 CPG B13 B12 B11 B10
B9
B8
B7
B6
B5
B4
B3
B2
B1
RSV A5
A4
A3
A2
A1 C2 (1) C1 (0)
R COUNTER LATCH
ANTI-
BACKLASH
PULSE
BAND
SELECT
CLOCK
CONTROL
BITS
14-BIT REFERENCE COUNTER
WIDTH
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
RSV RSV BSC2 BSC1 TMB LDP ABP2 ABP1 R14 R13 R12 R11 R10 R9 R8 R7 R6 R5 R4 R3 R2 R1 C2 (0) C1 (1)
Rev. C | Page 12 of 24
Data Sheet
ADF4360-1
Table 7. Control Latch
OUTPUT
POWER
LEVEL
CORE
POWER
LEVEL
PRESCALER
VALUE
CURRENT
SETTING 2
CURRENT
SETTING 1
MUXOUT
CONTROL
CONTROL
BITS
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
P2
P1
PD2 PD1 CPI6 CPI5 CPI4 CPI3 CPI2 CPI1 PL2 PL1 MTLD CPG CP
PDP
M3
M2
M1
CR
PC2 PC1 C2 (0) C1 (0)
PC2
CORE POWER LEVEL
5mA
10mA
15mA
20mA
PC1
0
1
0
1
0
0
1
1
I
(mA)
PHASE DETECTOR
PDP POLARITY
CPI6
CPI3
CPI5
CPI2
CPI4
CPI1
CP
4.7kΩ
COUNTER
0
1
NEGATIVE
POSITIVE
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0.31
0.62
0.93
1.25
1.56
1.87
2.18
2.50
CR
OPERATION
0
1
NORMAL
R, A, B COUNTERS
HELD IN RESET
CHARGE PUMP
OUTPUT
NORMAL
CP
0
1
THREE-STATE
CP GAIN
CPG
0
1
CURRENT SETTING 1
CURRENT SETTING 2
MUTE-TILL-LOCK DETECT
DISABLED
ENABLED
MTLD
0
1
M3
0
0
M2
0
0
M1
0
1
OUTPUT
THREE-STATE OUTPUT
DIGITAL LOCK DETECT
(ACTIVE HIGH)
PL2
PL1
OUTPUT POWER LEVEL
CURRENT
POWER INTO 50Ω (USING 50Ω TO V
)
VCO
0
0
1
1
0
1
0
1
3.5mA
5.0mA
7.5mA
11.0mA
–13dBm
–10.5dBm
–8dBm
0
0
1
1
0
1
N DIVIDER OUTPUT
DV
DD
–6dBm
R DIVIDER OUTPUT
N-CHANNEL OPEN-DRAIN
LOCK DETECT
1
1
0
0
0
1
SERIAL DATA OUTPUT
DGND
1
1
1
1
0
1
CE PIN
PD2
X
X
0
1
PD1
X
0
1
1
MODE
0
1
1
1
ASYNCHRONOUS POWER-DOWN
NORMAL OPERATION
ASYNCHRONOUS POWER-DOWN
SYNCHRONOUS POWER-DOWN
P2
0
P1
0
PRESCALER VALUE
8/9
0
1
1
1
0
1
16/17
32/33
32/33
Rev. C | Page 13 of 24
ADF4360-1
Data Sheet
Table 8. N Counter Latch
CONTROL
BITS
13-BIT B COUNTER
5-BIT A COUNTER
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
DIVSEL DIV2 CPG B13 B12 B11 B10
B9
B8
B7
B6
B5
B4
B3
B2
B1
RSV A5
A4
A3
A2
A1 C2 (1) C1 (0)
THIS BIT IS NOT USED
BY THE DEVICE AND
IS A DON'T CARE BIT.
A COUNTER
A5
A4
..........
A2
A1
DIVIDE RATIO
0
0
0
0
.
.
.
1
1
1
1
0
0
0
0
.
.
.
1
1
1
1
..........
..........
..........
..........
..........
..........
..........
..........
..........
..........
..........
0
0
1
1
.
.
.
0
0
1
1
0
1
0
1
.
.
.
0
1
0
1
0
1
2
3
.
.
.
28
29
30
31
B13
B12
B11
B3
B2
0
0
1
1
.
.
.
0
0
1
1
B1
0
1
0
1
.
.
.
0
1
0
1
B COUNTER DIVIDE RATIO
NOT ALLOWED
NOT ALLOWED
NOT ALLOWED
3
.
.
.
8188
8189
8190
8191
0
0
0
0
.
.
.
1
1
1
1
0
0
0
0
.
.
.
1
1
1
1
0
0
0
0
.
.
.
1
1
1
1
..........
..........
..........
..........
..........
..........
..........
..........
..........
..........
..........
0
0
0
1
.
.
.
1
1
1
1
F4 (FUNCTION LATCH)
FASTLOCK ENABLE
CP GAIN OPERATION
0
0
0
1
CHARGE PUMP CURRENT SETTING 1
IS PERMANENTLY USED
CHARGE PUMP CURRENT SETTING 2
IS PERMANENTLY USED
N = BP + A; P IS PRESCALER VALUE SET IN THE CONTROL LATCH.
B MUST BE GREATER THAN OR EQUAL TO A. FOR CONTINUOUSLY
2
ADJACENT VALUES OF (N × F
), AT THE OUTPUT, N
IS (P –P).
REF
MIN
DIVIDE-BY-2
DIV2
0
1
FUNDAMENTAL OUTPUT
DIVIDE-BY-2
DIVIDE-BY-2 SELECT (PRESCALER INPUT)
DIVSEL
0
1
FUNDAMENTAL OUTPUT SELECTED
DIVIDE-BY-2 SELECTED
Rev. C | Page 14 of 24
Data Sheet
ADF4360-1
Table 9. R Counter Latch
ANTI-
BACKLASH
PULSE
BAND
SELECT
CLOCK
CONTROL
BITS
14-BIT REFERENCE COUNTER
WIDTH
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
RSV RSV BSC2 BSC1 TMB LDP ABP2 ABP1 R14 R13 R12 R11 R10
R9
R8
R7
R6
R5
R4
R3
R2
R1 C2 (0) C1 (1)
R14
0
0
R13
R12
R3
0
0
0
0
.
.
.
1
1
1
1
R2
0
0
1
1
.
.
.
0
0
1
1
R1
DIVIDE RATIO
Not Allowed
1
2
3
.
.
.
16380
16381
16382
16383
0
0
0
0
.
.
.
1
1
1
1
0
0
0
0
.
.
.
1
1
1
1
..........
..........
..........
..........
..........
..........
..........
..........
..........
..........
..........
0
1
0
1
.
.
.
0
1
0
1
0
TEST MODE
BIT SHOULD
BE SET TO 0
0
.
.
FOR NORMAL
OPERATION.
THESE BITS ARE NOT
USED BY THE DEVICE
AND ARE DON'T CARE
BITS.
.
1
1
1
1
ABP2
ABP1
ANTIBACKLASH PULSE WIDTH
0
0
1
1
0
1
0
1
3.0ns
1.3ns
6.0ns
3.0ns
LDP
0
LOCK DETECT PRECISION
THREE CONSECUTIVE CYCLES OF PHASE DELAY LESS THAN
15ns MUST OCCUR BEFORE LOCK DETECT IS SET.
1
FIVE CONSECUTIVE CYCLES OF PHASE DELAY LESS THAN
15ns MUST OCCUR BEFORE LOCK DETECT IS SET.
BSC2
BSC1
BAND SELECT CLOCK DIVIDER
0
0
1
1
0
1
0
1
1
2
4
8
Rev. C | Page 15 of 24
ADF4360-1
Data Sheet
POWER-UP
During initial power-up, a write to the control latch powers up
the part and the bias currents of the VCO begin to settle. If the-
se currents have not settled to within 10% of their steady-state
value, and if the N counter latch is then programmed, the VCO
may not oscillate at the desired frequency, which does not allow
the band select logic to choose the correct frequency band and
the ADF4360-1 may not achieve lock. If the recommended in-
terval is inserted, and the N counter latch is programmed, the
band select logic can choose the correct frequency band, and
the part locks to the correct frequency.
Power-Up Sequence
The correct programming sequence for the ADF4360-1 after
power-up is:
1. R counter latch
2. Control latch
3. N counter latch
Initial Power-Up
The duration of this interval is affected by the value of the
capacitor on the CN pin (Pin 14). This capacitor is used to
reduce the close-in noise of the ADF4360-1 VCO. The recom-
mended value of this capacitor is 10 µF. Using this value
requires an interval of ≥ 5 ms between the latching in of the
control latch bits and latching in of the N counter latch bits.
If a shorter delay is required, this capacitor can be reduced. A
slight phase noise penalty is incurred by this change, which is
explained in the Table 10.
Initial power-up refers to programming the part after the
application of voltage to the AVDD, DVDD, VVCO, and CE pins. On
initial power-up, an interval is required between programming
the control latch and programming the N counter latch. This
interval is necessary to allow the transient behavior of the
ADF4360-1 during initial power-up to have settled.
Table 10. CN Capacitance vs. Interval and Phase Noise
CN Value
Recommended Interval between Control Latch and N Counter Latch
Open-Loop Phase Noise @ 10 kHz Offset
10 µF
440 nF
≥ 5 ms
≥ 600 µs
−85 dBc
−84 dBc
POWER-UP
CLOCK
R COUNTER
LATCH DATA
CONTROL
LATCH DATA
N COUNTER
LATCH DATA
DATA
LE
REQUIRED INTERVAL
CONTROL LATCH WRITE TO
N COUNTER LATCH WRITE
Figure 16. ADF4360-1 Power-Up Timing
Rev. C | Page 16 of 24
Data Sheet
ADF4360-1
Hardware Power-Up/Power-Down
Software Power-Up/Power-Down
If the ADF4360-1 is powered down via the hardware (using the
CE pin) and powered up again without any change to the N
counter register during power-down, it locks at the correct fre-
quency because the part is already in the correct frequency
band. The lock time depends on the value of capacitance on the
CN pin, which is <5 ms for 10 µF capacitance. The smaller ca-
pacitance of 440 nF on this pin enables lock times of <600 µs.
If the ADF4360-1 is powered down via the software (using the
control latch) and powered up again without any change to the
N counter latch during power-down, it locks at the correct fre-
quency because it is already in the correct frequency band. The
lock time depends on the value of capacitance on the CN pin,
which is <5 ms for 10 µF capacitance. The smaller capacitance
of 440 nF on this pin enables lock times of <600 µs.
The N counter value cannot be changed while the part is in
power-down because it may not lock to the correct frequency
on power-up. If it is updated, the correct programming se-
quence for the part after power-up is to the R counter latch,
followed by the control latch, and finally the N counter latch,
with the required interval between the control latch and N
counter latch, as described in the Initial Power-Up section.
The N counter value cannot be changed while the part is in
power-down because it may not lock to the correct frequency
on power-up. If it is updated, the correct programming se-
quence for the part after power-up is to the R counter latch,
followed by the control latch, and finally the N counter latch,
with the required interval between the control latch and N
counter latch, as described in the Initial Power-Up section.
Rev. C | Page 17 of 24
ADF4360-1
Data Sheet
Charge Pump Currents
CONTROL LATCH
CPI3, CPI2, and CPI1 in the ADF4360 family determine
Current Setting 1.
With (C2, C1) = (0, 0), the control latch is programmed. Table 7
shows the input data format for programming the control latch.
CPI6, CPI5, and CPI4 determine Current Setting 2. See the
truth table in Table 7.
Prescaler Value
In the ADF4360 family, P2 and P1 in the control latch set the
prescaler values.
Output Power Level
Bits PL1 and PL2 set the output power level of the VCO. See the
truth table in Table 7.
Power-Down
DB21 (PD2) and DB20 (PD1) provide programmable pow-
erdown modes.
Mute-Till-Lock Detect
DB11 of the control latch in the ADF4360 family is the mute-till-
lock detect bit. This function, when enabled, ensures that the RF
outputs are not switched on until the PLL is locked.
In the programmed asynchronous power-down, the device
powers down immediately after latching a 1 into Bit PD1, with
the condition that PD2 has been loaded with a 0. In the pro-
grammed synchronous power-down, the device power-down is
gated by the charge pump to prevent unwanted frequency
jumps. Once the power-down is enabled by writing a 1 into
Bit PD1 (on the condition that a 1 has also been loaded to PD2),
the device will go into power-down on the second rising edge of
the R counter output, after LE goes high. When the CE pin is
low, the device is immediately disabled regardless of the state of
PD1 or PD2.
CP Gain
DB10 of the control latch in the ADF4360 family is the charge
pump gain bit. When it is programmed to a 1, Current Setting 2
is used. When it is programmed to a 0, Current Setting 1 is
used.
Charge Pump Three-State
This bit puts the charge pump into three-state mode when
programmed to a 1. It should be set to 0 for normal operation.
When a power-down is activated (either in synchronous or
asynchronous mode), the following events occur:
Phase Detector Polarity
The PDP bit in the ADF4360 family sets the phase detector
polarity. The positive setting enabled by programming a 1 is
used when using the on-chip VCO with a passive loop filter or
with an active noninverting filter. It can also be set to 0. This is
required if an active inverting loop filter is used.
• All active dc current paths are removed.
• The R, N, and timeout counters are forced to their load
state conditions.
MUXOUT Control
• The charge pump is forced into three-state mode.
• The digital lock detect circuitry is reset.
The on-chip multiplexer is controlled by M3, M2, and M1.
See the truth table in Table 7.
• The RF outputs are debiased to a high impedance state.
• The reference input buffer circuitry is disabled.
Counter Reset
DB4 is the counter reset bit for the ADF4360 family. When this
is 1, the R counter and the A, B counters are reset. For normal
operation, this bit should be 0.
• The input register remains active and capable of loading and
latching data.
Core Power Level
PC1 and PC2 set the power level in the VCO core. The recom-
mended setting is 15 mA. See the truth table in Table 7.
Rev. C | Page 18 of 24
Data Sheet
ADF4360-1
R COUNTER LATCH
N COUNTER LATCH
With (C2, C1) = (0, 1), the R counter latch is programmed.
Table 9 shows the input data format for programming the
R counter latch.
With (C2, C1) = (1, 0), the N counter latch is programmed.
Table 8 shows the input data format for programming the
N counter latch.
R Counter
A Counter Latch
R1 to R14 set the counter divide ratio. The divide range is 1
(00......001) to 16383 (111......111).
A5 to A1 program the 5-bit A counter. The divide range is 0
(00000) to 31 (11111).
Antibacklash Pulse Width
Reserved Bits
DB16 and DB17 set the antibacklash pulse width.
Lock Detect Precision
DB7 is a spare bit that is reserved. It should be programmed to 0.
B Counter Latch
DB18 is the lock detect precision bit and sets the number of
reference cycles with less than 15 ns phase error for entering the
locked state. With LDP at 1, five cycles are taken, and with LDP
at 0, three cycles are taken.
B13 to B1 program the B counter. The divide range is 3
(00.....0011) to 8191 (11....111).
Overall Divide Range
The overall divide range is defined by ((P × B) + A), where P is
the prescaler value.
Test Mode Bit
DB19 is the test mode bit (TMB) and should be set to 0. With
TMB = 0, the contents of the test mode latch are ignored and
normal operation occurs as determined by the contents of the
control latch, R counter latch, and N counter latch. Note that
test modes are for factory testing only and should not be pro-
grammed by the user.
CP Gain
DB21 of the N counter latch in the ADF4360 family is the
charge pump gain bit. When this is programmed to 1, Current
Setting 2 is used. When programmed to 0, Current Setting 1 is
used. This bit can also be programmed through DB10 of the con-
trol latch. The bit will always reflect the latest value written to it,
whether this is through the control latch or the N counter latch.
Band Select Clock
These bits set a divider for the band select logic clock input. The
output of the R counter is by default the value used to clock the
band select logic, but if this value is too high (>1 MHz), a
divider can be switched on to divide the R counter output to a
smaller value (see Table 9).
Divide-by-2
DB22 is the divide-by-2 bit. When set to 1, the output divide-by-2
function is chosen. When it is set to 0, normal operation occurs.
Divide-by-2 Select
Reserved Bits
DB23 is the divide-by-2 select bit. When programmed to 1, the
divide-by-2 output is selected as the prescaler input. When set
to 0, the fundamental is used as the prescaler input. For exam-
ple, using the output divide-by-2 feature and a PFD frequency
of 200 kHz, the user will need a value of N = 12,000 to generate
1.2 GHz. With the divide-by-2 select bit high, the user may keep
N = 6,000.
DB23 to DB22 are spare bits that are reserved. They should be
programmed to 0.
Rev. C | Page 19 of 24
ADF4360-1
Data Sheet
APPLICATIONS
DIRECT CONVERSION MODULATOR
Direct conversion architectures are increasingly being used to
implement base station transmitters. Figure 17 shows how ADI
parts can be used to implement such a system.
The LO ports of the AD8349 can be driven differentially from
the complementary RFOUTA and RFOUTꢀ outputs of the
ADF436±-1. This gives a better performance than a single-
ended LO driver and eliminates the often necessary use of a
balun to convert from a single-ended LO input to the more
desirable differential LO inputs for the AD8349. The typical
rms phase noise (1±± Hz to 1±± kHz) of the LO in this
configuration is 1.±9°.
The circuit block diagram shows the AD9761 TxDAC® being
used with the AD8349. The use of dual integrated DACs, such
as the AD9761 with its specified ±±.±0 dꢀ and ±±.±±4 dꢀ gain
and offset matching characteristics, ensures minimum error
contribution (over temperature) from this portion of the
signal chain.
The AD8349 accepts LO drive levels from −1± dꢀm to ± dꢀm.
The optimum LO power can be software programmed on the
ADF436±-1, which allows levels from −13 dꢀm to −6 dꢀm from
each output.
The local oscillator is implemented using the ADF436±-1. The
low-pass filter was designed using ADIsimPLL for a channel
spacing of 1 MHz and an open-loop bandwidth of 05 kHz. The
frequency range of the ADF436±-1 (0.±5 GHz to 0.45 GHz)
makes it ideally suited for implementation of a ꢀluetooth®
transceiver.
The RF output is designed to drive a 5± Ω load but must be
ac-coupled, as shown in Figure 17. If the I and Q inputs are
driven in quadrature by 0 V p-p signals, the resulting output
power from the modulator will be approximately 0 dꢀm.
REFIO
IOUTA
LOW-PASS
FILTER
IOUTB
MODULATED
DIGITAL
DATA
AD9761
TxDAC
QOUTA
QOUTB
LOW-PASS
FILTER
FSADJ
2k
LOCK
V
V
DETECT
VCO
DD
2
VPS1
VPS2
IBBP
IBBN
6
21
DV
23
20
100pF
10F
V
CE MUXOUT
7
TUNE
CP
V
AV
DD
VCO
DD
3.9k
14
16
C
N
24
TO RF PA
1nF 1nF
51
FREF
IN
REF
IN
10nF
680pF
330pF
AD8349
2k
17 CLK
QBBP
QBBN
ADF4360-1
18
19
12
DATA
LE
V
VCO
C
C
47nH
47nH
1.5pF
1.5pF
3.9nH
3.9nH
13
R
LOIP
LOIN
SET
1nF
RF
A
B
4
5
OUT
PHASE
SPLITTER
4.7k
CPGND
1
AGND
DGND
RF
OUT
3
8
9
10 11 22 15
Figure 17. Direct Conversion Modulator
Rev. C | Page 20 of 24
Data Sheet
ADF4360-1
ADuC812 Interface
FIXED FREQUENCY LO
Figure 19 shows the interface between the ADF4360 family and
the ADuC812 MicroConverter®. Because the ADuC812 is based
on an 8051 core, this interface can be used with any 8051 based
microcontroller. The MicroConverter is set up for SPI master
mode with CPHA = 0. To initiate the operation, the I/O port
driving LE is brought low. Each latch of the ADF4360 family
needs a 24-bit word, which is accomplished by writing three 8-
bit bytes from the MicroConverter to the device. When the
third byte is written, the LE input should be brought high to
complete the transfer.
Figure 18 shows the ADF4360-1 used as a fixed frequency LO at
2.2 GHz. The low-pass filter was designed using ADIsimPLL for
a channel spacing of 8 MHz and an open-loop bandwidth of
40 kHz. The maximum PFD frequency of the ADF4360-1 is
8 MHz. Because using a larger PFD frequency allows users to
use a smaller N, the in-band phase noise is reduced to as low as
possible, –99 dBc/Hz. The 40 kHz bandwidth is chosen to be
just greater than the point at which the open-loop phase noise
of the VCO is –99 dBc/Hz, thus giving the best possible inte-
grated noise. The typical rms phase noise (100 Hz to 100 kHz)
of the LO in this configuration is 0.3°. The reference frequency
is from a 16 MHz TCXO from Fox, thus an R value of 2 is pro-
grammed. Taking into account the high PFD frequency and its
effect on the band select logic, the band select clock divider is
enabled. In this case, a value of 8 is chosen. A very simple pull-
up resistor and dc blocking capacitor complete the RF output
stage.
SCLOCK
MOSI
SCLK
SDATA
ADuC812
I/O Ports
LE
ADF4360-x
CE
MUXOUT
(Lock Detect)
LOCK
V
V
DETECT
VCO
VDD
Figure 19. ADuC812 to ADF4360-x Interface
6
21
DV
2
23
20
I/O port lines on the ADuC812 are also used to control pow-
erdown (CE input) and detect lock (MUXOUT configured as
lock detect and polled by the port input). When operating in
the described mode, the maximum SCLOCK rate of the
ADuC812 is 4 MHz. This means that the maximum rate at
which the output frequency can be changed is 166 kHz.
10µF
V
CE MUXOUT
7
TUNE
CP
V
AV
DD
VCO
DD
14
16
C
N
24
1nF 1nF
FOX
801BE-160
16MHz
REF
IN
15.0nF
3.3nF
51Ω
17 CLK
620Ω
ADF4360-1
18
19
12
DATA
LE
V
VCO
C
C
51Ω
51Ω
100pF
100pF
13
R
SET
1nF
ADSP-21xx Interface
RF
A
B
4
5
OUT
4.7kΩ
CPGND
1
AGND
DGND
RF
OUT
Figure 20 shows the interface between the ADF4360 family and
the ADSP-21xx digital signal processor. The ADF4360 family
needs a 24-bit serial word for each latch write. The easiest way
to accomplish this using the ADSP-21xx family is to use the
autobuffered transmit mode of operation with alternate fram-
ing. This provides a means for transmitting an entire block of
serial data before an interrupt is generated.
3
8
9
10 11 22 15
Figure 18. Fixed Frequency LO
INTERFACING
The ADF4360 family has a simple SPI®-compatible serial inter-
face for writing to the device. CLK, DATA, and LE control the
data transfer. When LE goes high, the 24 bits that are clocked
into the appropriate register on each rising edge of CLK get
transferred to the appropriate latch. See Figure 2 for the timing
diagram and Table 5 for the latch truth table.
SCLOCK
SCLK
MOSI
TFS
SDATA
LE
ADF4360-x
ADSP-21xx
I/O Ports
CE
MUXOUT
(Lock Detect)
The maximum allowable serial clock rate is 20 MHz. This
means the maximum update rate possible is 833 kHz or one
update every 1.2 µs. This is certainly more than adequate for
systems that will have typical lock times in hundreds of micro-
seconds.
Figure 20. ADSP-21xx to ADF4360-x Interface
Set up the word length for 8 bits and use three memory loca-
tions for each 24-bit word. To program each 24-bit latch, store
the 8-bit bytes, enable the autobuffered mode, and write to the
transmit register of the DSP. This last operation initiates the
autobuffer transfer.
Rev. C | Page 21 of 24
ADF4360-1
Data Sheet
PCB DESIGN GUIDELINES FOR CHIP-SCALE PACKAGE
Experiments have shown that Figure 22 provides an excellent
match to 50 Ω over the operating range of the ADF4360-1. This
gives approximately −4 dBm output power across the frequency
range of the ADF4360-1. Both single-ended architectures can
be examined using the EV-ADF4360-1EB1 evaluation board.
The leads on the chip-scale package (CP-24) are rectangular.
The printed circuit board pad for these should be 0.1 mm long-
er than the package lead length and 0.05 mm wider than the
package lead width. The lead should be centered on the pad to
ensure that the solder joint size is maximized.
V
VCO
The bottom of the chip-scale package has a central thermal pad.
The thermal pad on the printed circuit board should be at least
as large as this exposed pad. On the printed circuit board, there
should be a clearance of at least 0.25 mm between the thermal
pad and the inner edges of the pad pattern to ensure that short-
ing is avoided.
47nH
1.5pF
3.9nH
RF
OUT
50Ω
Figure 22. Optimum ADF4360-1 Output Stage
If the user does not need the differential outputs available on
the ADF4360-1, the user may either terminate the unused out-
put or combine both outputs using a balun. The circuit in Fig-
ure 23 shows how best to combine the outputs.
Thermal vias may be used on the printed circuit board thermal
pad to improve thermal performance of the package. If vias are
used, they should be incorporated in the thermal pad at a
1.2 mm pitch grid. The via diameter should be between 0.3 mm
and 0.33 mm, and the via barrel should be plated with 1 ounce
of copper to plug the via.
V
VCO
3.6nH
1.5pF
3.6nH
47nH
10pF
1nH
The user should connect the printed circuit thermal pad to
AGND. This is internally connected to AGND.
RF
RF
A
B
OUT
50Ω
1nH
OUTPUT MATCHING
OUT
1.5pF
There are a number of ways to match the output of the
ADF4360-1 for optimum operation; the most basic is to use a
50 Ω resistor to VVCO. A dc bypass capacitor of 100 pF is con-
nected in series, as shown Figure 21. Because the resistor is not
frequency dependent, this provides a good broadband match.
The output power in this circuit typically gives −6 dBm output
power into a 50 Ω load.
Figure 23. Balun for Combining ADF4360-1 RF Outputs
The circuit in Figure 23 is a lumped-lattice-type LC balun. It is
designed for a center frequency of 2.2 GHz and outputs 1.0 dBm
at this frequency. The series 1 nH inductor is used to tune out
any parasitic capacitance due to the board layout from each
input, and the remainder of the circuit is used to shift the
output of one RF input by +90° and the second by −90°, thus
combining the two. The action of the 3.6 nH inductor and the
1.5 pF capacitor accomplish this. The 47 nH is used to provide
an RF choke in order to feed the supply voltage, and the 10 pF
capacitor provides the necessary dc block. To ensure good RF
performance, the circuits in Figure 22 and Figure 23 were im-
plemented with Coilcraft 0402/0603 inductors and AVX 0402
thin-film capacitors.
V
VCO
51Ω
100pF
RF
OUT
50Ω
Figure 21. Simple ADF4360-1 Output Stage
A better solution is to use a shunt inductor (acting as an RF
choke) to VVCO. This gives a better match and hence more
output power. Additionally, a series inductor is added after the
dc bypass capacitor to provide a resonant LC circuit. This tunes
the oscillator output and provides approximately 10 dB addi-
tional rejection of the second harmonic. The shunt inductor
needs to be a relatively high value (>40 nH).
Alternatively, instead of the LC balun shown in Figure 23, both
outputs may be combined using a 180° rat-race coupler.
Rev. C | Page 22 of 24
Data Sheet
ADF4360-1
OUTLINE DIMENSIONS
4.10
4.00 SQ
3.90
0.60 MAX
2.50 REF
0.60 MAX
PIN 1
INDICATOR
19
18
24
1
0.50
BSC
PIN 1
INDICATOR
2.45
2.30 SQ
2.15
3.75 BSC
SQ
EXPOSED
PAD
6
13
12
7
0.50
0.40
0.30
0.25 MIN
BOTTOM VIEW
TOP VIEW
0.80 MAX
0.65 TYP
12° MAX
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
1.00
0.85
0.80
0.05 MAX
0.02 NOM
SECTION OF THIS DATA SHEET.
COPLANARITY
0.08
0.30
0.23
0.18
SEATING
PLANE
0.20 REF
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-2
Figure 24. 24-Lead Lead Frame Chip-Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad (CP-24-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Frequency Range
Package Description
24-Lead LFCSP_VQ
24-Lead LFCSP_VQ
24-Lead LFCSP_VQ
Package Option
ADF4360-1BCPZ
ADF4360-1BCPZRL
ADF4360-1BCPZRL7
EV-ADF4360-1EB1Z
2050 MHz to 2450 MHz
2050 MHz to 2450 MHz
2050 MHz to 2450 MHz
CP-24-2
CP-24-2
CP-24-2
Evaluation Board
1 Z = RoHS Compliant Part.
Rev. C | Page 23 of 24
ADF4360-1
NOTES
Data Sheet
Purchase of licensed I2C components of Analog Devices or one of its sublicensed Associated Companies conveys a license for the purchaser under the Philips I2C Patent
Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips.
©2003–2012 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D04414-0-11/12(C)
Rev. C | Page 24 of 24
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