EVAL-ADM2687EEBZ [ADI]
5 kV rms Signal and Power Isolated; 5 kV的均方根信号和电源隔离型号: | EVAL-ADM2687EEBZ |
厂家: | ADI |
描述: | 5 kV rms Signal and Power Isolated |
文件: | 总24页 (文件大小:464K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
5 kV rms Signal and Power Isolated
RS-485 Transceiver with ± ±5 kV ꢀSꢁ
AꢁM2682ꢀ/AꢁM2687ꢀ
FEATURES
FUNCTIONAL BLOCK DIAGRAM
V
V
ISOOUT
CC
5 kV rms isolated RS-485/RS-422 transceiver, configurable as
half or full duplex
isoPower DC-TO-DC CONVERTER
isoPower integrated isolated dc-to-dc converter
15 kV ESD protection on RS-485 input/output pins
Complies with ANSI/TIA/EIA-485-A-98 and ISO 8482:1987(E)
Data rate: 16 Mbps (ADM2682E), 500 kbps (ADM2687E)
5 V or 3.3 V operation
OSCILLATOR
RECTIFIER
V
ISOIN
REGULATOR
Connect up to 256 nodes on one bus
Open- and short-circuit, fail-safe receiver inputs
High common-mode transient immunity: >25 kV/μs
Thermal shutdown protection
TRANSCEIVER
D
DIGITAL ISOLATION iCoupler
Y
Z
ENCODE
DECODE
DECODE
ENCODE
TxD
DE
Safety and regulatory approvals
UL recognition (pending)
5000 V rms for 1 minute per UL 1577
ENCODE
DECODE
CSA Component Acceptance Notice #5A (pending)
IEC 60601-1: 400 V rms (basic), 250 V rms (reinforced)
IEC 60950-1: 600 V rms (basic), 380 V rms (reinforced)
VDE Certificates of Conformity (pending)
DIN EN 60747-5-2 (VDE 0884 Part 2): 2003-01
A
B
RxD
R
RE
ADM2682E/ADM2687E
V
IORM = 846 V peak
Operating temperature range: −40°C to +85°C
16-lead wide-body SOIC with >8 mm creepage and clearance
GND
GND
2
1
ISOLATION
BARRIER
Figure 1.
APPLICATIONS
Isolated RS-485/RS-422 interfaces
Industrial field networks
Multipoint data transmission systems
GENERAL DESCRIPTION
The ADM2682E/ADM2687E are fully integrated 5 kV rms
signal and power isolated data transceivers with ±±5 kV EꢀD
protection and are suitable for high speed communication on
multipoint transmission lines. The ADM2682E/ADM2687E
include an integrated 5 kV rms isolated dc-to-dc power supply
that eliminates the need for an external dc-to-dc isolation block.
The ADM2682E/ADM2687E drivers have an active high enable.
An active low receiver enable is also provided, which causes the
receiver output to enter a high impedance state when disabled.
The devices have current limiting and thermal shutdown
features to protect against output short circuits and situations
where bus contention may cause excessive power dissipation.
The parts are fully specified over the industrial temperature
range and are available in a highly integrated, ±6-lead, wide-
body ꢀOIC package with >8 mm creepage and clearance.
They are designed for balanced transmission lines and comply
with ANꢀI/TIA/EIA-485-A-98 and IꢀO 8482:±987(E).
The devices integrate Analog Devices, Inc., iCoupler® technology to
combine a 3-channel isolator, a three-state differential line driver, a
differential input receiver, and Analog Devices isoPower® dc-to-dc
converter into a single package. The devices are powered by a
single 5 V or 3.3 V supply, realizing a fully integrated signal and
power isolated Rꢀ-485 solution.
The ADM2682E/ADM2687E contain isoPower technology that
uses high frequency switching elements to transfer power through
the transformer. ꢀpecial care must be taken during printed circuit
board (PCB) layout to meet emissions standards. Refer to
AN-097± Application Note, Recommendations for Control of
Radiated Emissions with isoPower Devices, for details on board
layout considerations.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Fax: 781.461.3113
www.analog.com
©2011 Analog Devices, Inc. All rights reserved.
AꢁM2682ꢀ/AꢁM2687ꢀ
TABLꢀ OF CONTꢀNTS
Features .............................................................................................. ±
ꢀwitching Characteristics .............................................................. ±5
Circuit Description......................................................................... ±6
ꢀignal Isolation ........................................................................... ±6
Power Isolation ........................................................................... ±6
Truth Tables................................................................................. ±6
Thermal ꢀhutdown .................................................................... ±6
Open- and ꢀhort-Circuit, Fail-ꢀafe Receiver Inputs.............. ±6
DC Correctness and Magnetic Field Immunity........................... ±6
Applications Information.............................................................. ±8
PCB Layout ................................................................................. ±8
EMI Considerations................................................................... ±8
Insulation Lifetime..................................................................... ±9
Isolated ꢀupply Considerations ................................................ ±9
Typical Applications................................................................... 20
Outline Dimensions....................................................................... 22
Ordering Guide .......................................................................... 22
Applications....................................................................................... ±
Functional Block Diagram .............................................................. ±
General Description......................................................................... ±
Revision History ............................................................................... 2
ꢀpecifications..................................................................................... 3
ADM2682E Timing ꢀpecifications ............................................ 4
ADM2687E Timing ꢀpecifications ............................................ 4
Package Characteristics ............................................................... 4
Regulatory Information............................................................... 5
Insulation and ꢀafety-Related ꢀpecifications............................ 5
VDE 0884 Insulation Characteristics (Pending)...................... 6
Absolute Maximum Ratings............................................................ 7
EꢀD Caution.................................................................................. 7
Pin Configuration and Function Descriptions............................. 8
Typical Performance Characteristics ............................................. 9
Test Circuits..................................................................................... ±4
REVISION HISTORY
7/11—Revision 0: Initial Version
Rev. 0 | Page 2 of 24
AꢁM2682ꢀ/AꢁM2687ꢀ
SPꢀCIFICATIONS
All voltages are relative to their respective ground; 3.0 ≤ VCC ≤ 5.5 V. All minimum/maximum specifications apply over the entire
recommended operation range, unless otherwise noted. All typical specifications are at TA = 25°C, VCC = 5 V unless otherwise noted.
Table 1.
Parameter
Symbol Min
Typ
Max
Unit
Test Conditions/Comments
ADM2687E SUPPLY CURRENT
Data Rate ≤ 500 kbps
ICC
90
72
125
98
mA
mA
mA
mA
mA
VCC = 3.3 V, 100 Ω load between Y and Z
VCC = 5 V, 100 Ω load between Y and Z
VCC = 3.3 V, 54 Ω load between Y and Z
VCC = 5 V, 54 Ω load between Y and Z
120 Ω load between Y and Z
140
ADM2682E SUPPLY CURRENT
Data Rate = 16 Mbps
ICC
175
260
130
200
mA
mA
mA
mA
V
120 Ω load between Y and Z
54 Ω load between Y and Z
120 Ω load between Y and Z
54 Ω load between Y and Z
Data Rate = 16 Mbps, 4.5 ≤ VCC ≤ 5.5 V
ISOLATED SUPPLY VOLTAGE
DRIVER
VISOOUT
3.3
Differential Outputs
Differential Output Voltage, Loaded
|VOD2
|
|
2.0
1.5
1.5
3.6
3.6
3.6
0.2
3.0
0.2
200
30
V
V
V
V
V
V
mA
μA
RL = 100 Ω (RS-422), see Figure 29
RL = 54 Ω (RS-485), see Figure 29
−7 V ≤ VTEST1 ≤ 12 V, see Figure 30
RL = 54 Ω or 100 Ω, see Figure 29
RL = 54 Ω or 100 Ω, see Figure 29
RL = 54 Ω or 100 Ω, see Figure 29
|VOD3
Δ|VOD| for Complementary Output States Δ|VOD|
Common-Mode Output Voltage
Δ|VOC| for Complementary Output States
Short-Circuit Output Current
VOC
Δ|VOC|
IOS
Output Leakage Current (Y, Z)
IO
DE = 0 V, RE = 0 V, VCC = 0 V or 3.6 V,
VIN = 12 V
−30
μA
DE = 0 V, RE = 0 V, VCC = 0 V or 3.6 V,
VIN = −7 V
Logic Inputs DE, RE, TxD
Input Threshold Low
Input Threshold High
Input Current
VIL
VIH
II
0.27 VCC
−10
V
DE, RE, TxD
DE, RE, TxD
DE, RE, TxD
0.7 VCC
10
V
0.01
μA
RECEIVER
Differential Inputs
Differential Input Threshold Voltage
Input Voltage Hysteresis
Input Current (A, B)
VTH
VHYS
II
−200
−125
15
−30
125
mV
mV
μA
μA
kΩ
−7 V < VCM < +12 V
VOC = 0 V
DE = 0 V, VCC = 0 V or 3.6 V, VIN = 12 V
DE = 0 V, VCC = 0 V or 3.6 V, VIN = −7 V
−7 V < VCM < +12 V
−100
96
Line Input Resistance
Logic Outputs
RIN
Output Voltage Low
Output Voltage High
VOL
VOH
0.2
0.4
V
V
IO = 1.5 mA, VA − VB = −0.2 V
IO = −1.5 mA, VA − VB = 0.2 V
VCC − 0.3 VCC − 0.2
Short-Circuit Current
100
mA
COMMON-MODE TRANSIENT IMMUNITY1
25
kV/μs VCM = 1 kV, transient magnitude = 800 V
1 CM is the maximum common-mode voltage slew rate that can be sustained while maintaining specification-compliant operation. VCM is the common-mode potential
difference between the logic and bus sides. The transient magnitude is the range over which the common-mode is slewed. The common-mode voltage slew rates
apply to both rising and falling common-mode voltage edges.
Rev. 0 | Page 3 of 24
AꢁM2682ꢀ/AꢁM2687ꢀ
ADM2682E TIMING SPECIFICATIONS
TA = −40°C to +85°C.
Table 2.
Parameter
Symbol
Min Typ Max Unit
Test Conditions/Comments
DRIVER
Maximum Data Rate
Propagation Delay, Low to High tDPLH
Propagation Delay, High to Low tDPHL
Output Skew
Rise Time/Fall Time
Enable Time
16
Mbps
ns
ns
ns
ns
63
64
1
100
100
8
15
120
150
RL = 54 Ω, CL1 = C L2 = 100 pF, see Figure 31 and Figure 35
RL = 54 Ω, CL1 = C L2 = 100 pF, see Figure 31 and Figure 35
RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 31 and Figure 35
RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 31 and Figure 35
RL = 110 Ω, CL = 50 pF, see Figure 32 and Figure 37
RL = 110 Ω, CL = 50 pF, see Figure 32 and Figure 37
tSKEW
tDR, tDF
tZL, tZH
tLZ, tHZ
ns
ns
Disable Time
RECEIVER
Propagation Delay, Low to High tRPLH
Propagation Delay, High to Low tRPHL
94
95
1
110
110
12
15
15
ns
ns
ns
ns
ns
CL = 15 pF, see Figure 33 and Figure 36
CL = 15 pF, see Figure 33 and Figure 36
CL = 15 pF, see Figure 33 and Figure 36
RL = 1 kΩ, CL = 15 pF, see Figure 34 and Figure 38
RL = 1 kΩ, CL = 15 pF, see Figure 34 and Figure 38
Output Skew1
Enable Time
Disable Time
tSKEW
tZL, tZH
tLZ, tHZ
1 Guaranteed by design.
ADM2687E TIMING SPECIFICATIONS
TA = −40°C to +85°C.
Table 3.
Parameter
Symbol
Min Typ Max
Unit
Test Conditions/Comments
DRIVER
Maximum Data Rate
Propagation Delay, Low to High tDPLH
Propagation Delay, High to Low tDPHL
Output Skew
Rise Time/Fall Time
Enable Time
500
250
250
kbps
ns
ns
503
510
7
700
700
100
RL = 54 Ω, CL1 = C L2 = 100 pF, see Figure 31 and Figure 35
RL = 54 Ω, CL1 = C L2 = 100 pF, see Figure 31 and Figure 35
RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 31 and Figure 35
RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 31 and Figure 35
RL = 110 Ω, CL = 50 pF, see Figure 32 and Figure 37
RL = 110 Ω, CL = 50 pF, see Figure 32 and Figure 37
tSKEW
ns
tDR, tDF
tZL, tZH
tLZ, tHZ
200
1100 ns
2.5
200
μs
ns
Disable Time
RECEIVER
Propagation Delay, Low to High tRPLH
Propagation Delay, High to Low tRPHL
91
95
4
200
200
30
15
15
ns
ns
ns
ns
ns
CL = 15 pF, see Figure 33 and Figure 36
CL = 15 pF, see Figure 33 and Figure 36
CL = 15 pF, see Figure 33 and Figure 36
RL = 1 kΩ, CL = 15 pF, see Figure 34 and Figure 38
RL = 1 kΩ, CL = 15 pF, see Figure 34 and Figure 38
Output Skew
Enable Time
Disable Time
tSKEW
tZL, tZH
tLZ, tHZ
PACKAGE CHARACTERISTICS
Table 4.
Parameter
Symbol
RI-O
CI-O
Min
Typ
1012
3
Max
Unit
Ω
pF
Test Conditions/Comments
Resistance (Input-to-Output)1
Capacitance (Input-to-Output)1
Input Capacitance2
f = 1 MHz
CI
4
pF
1 Device considered a 2-terminal device: short together Pin 1 to Pin 8 and short together Pin 9 to Pin 16.
2 Input capacitance is from any input data pin to ground.
Rev. 0 | Page 4 of 24
AꢁM2682ꢀ/AꢁM2687ꢀ
REGULATORY INFORMATION
Table 5. ADM2682E/ADM2687E Approvals (Pending)
Organization
Approval Type
To be recognized under the UL 1577 Component Recognition Program of Underwriters Laboratories, Inc.
Single protection, 5000 V rms isolation voltage.
UL (Pending)
In accordance with UL 1577, each ADM2682E/ADM2687E is proof tested by applying an insulation test voltage
≥ 6000 V rms for 1 second.
To be approved under CSA Component Acceptance Notice #5A.
CSA (Pending)
VDE (Pending)
Reinforced insulation per IEC 60601-1, 250 V rms (353 V peak) maximum working voltage.
Basic insulation per IEC 60601-1, 400 V rms (566 V peak) maximum working voltage.
Reinforced insulation per CSA 60950-1-07 and IEC 60950-1, 380 V rms (537 V peak) maximum working voltage.
Basic insulation per CSA 60950-1-07 and IEC 60950-1, 600 V rms (848 V peak) maximum working voltage.
To be certified according to DIN EN 60747-5-2 (VDE 0884 Part 2):2003-01.
In accordance with DIN EN 60747-5-2, each ADM2682E/ADM2687E is proof tested by applying an insulation test voltage
≥1590 V peak for 1 second.
INSULATION AND SAFETY-RELATED SPECIFICATIONS
Table 6.
Parameter
Symbol Value
Unit
Test Conditions/Comments
Rated Dielectric Insulation Voltage
Minimum External Air Gap (Clearance)
5000
>8.0
V rms 1-minute duration
L(I01)
L(I02)
mm
mm
Measured from input terminals to output terminals,
shortest distance through air
Measured from input terminals to output terminals,
shortest distance along body
Minimum External Tracking (Creepage)
>8.0
Minimum Internal Gap (Internal Clearance)
Tracking Resistance (Comparative Tracking Index)
Isolation Group
0.017 min mm
Insulation distance through insulation
DIN IEC 112/VDE 0303-1
Material Group (DIN VDE 0110:1989-01, Table 1)
CTI
>175
IIIa
V
Rev. 0 | Page 5 of 24
AꢁM2682ꢀ/AꢁM2687ꢀ
VDE 0884 INSULATION CHARACTERISTICS (PENDING)
This isolator is suitable for basic electrical isolation only within the safety limit data. Maintenance of the safety data must be ensured by
means of protective circuits.
Table 7.
Description
Test Conditions/Comments
Symbol Characteristic Unit
CLASSIFICATIONS
Installation Classification per DIN VDE 0110 for
Rated Mains Voltage
≤300 V rms
≤450 V rms
≤600 V rms
I to IV
I to III
I to II
40/85/21
2
Climatic Classification
Pollution Degree
VOLTAGE
Table 1 of DIN VDE 0110
Maximum Working Insulation Voltage
Input-to-Output Test Voltage
Method b1
VIORM
VPR
846
V peak
V peak
VIORM × 1.875 = VPR, 100% production tested,
tm = 1 sec, partial discharge < 5 pC
1590
Method a
After Environmental Tests, Subgroup 1
After Input and/or Safety Test,
Subgroup 2/Subgroup 3
VIORM × 1.6 = VPR, tm = 60 sec, partial discharge < 5 pC
VIORM × 1.2 = VPR, tm = 60 sec, partial discharge < 5 pC
1375
1018
V peak
V peak
Highest Allowable Overvoltage
SAFETY-LIMITING VALUES
Case Temperature
Input Current
Output Current
Transient overvoltage, tTR = 10 sec
VTR
6000
V peak
Maximum value allowed in the event of a failure
TS
150
265
335
>109
°C
IS, INPUT
IS, OUTPUT
RS
mA
mA
Ω
Insulation Resistance at TS
VIO = 500 V
Rev. 0 | Page 6 of 24
AꢁM2682ꢀ/AꢁM2687ꢀ
ABSOLUTꢀ MAXIMUM RATINGS
TA = 25°C, unless otherwise noted. All voltages are relative to
their respective ground.
Table 9. Maximum Continuous Working Voltage1
Parameter
Max Unit
Reference Standard
AC Voltage
Bipolar Waveform
Table 8.
Parameter
424
V peak All certifications,
50-year minimum
lifetime
Rating
VCC
−0.5 V to +7 V
−0.5 V to VDD + 0.5 V
−0.5 V to VDD + 0.5 V
−9 V to +14 V
−40°C to +85°C
−55°C to +150°C
15 kV
Digital Input Voltage (DE, RE, TxD)
Digital Output Voltage (RxD)
Driver Output/Receiver Input Voltage
Operating Temperature Range
Storage Temperature Range
Unipolar Waveform
Basic Insulation
600
V peak
Reinforced Insulation 537
V peak Maximum approved
working voltage per
IEC 60950-1
DC Voltage
Basic Insulation
Reinforced Insulation
ESD (Human Body Model) on
A, B, Y, and Z pins
600
537
V peak
2 kV
ESD (Human Body Model) on Other Pins
Thermal Resistance θJA
Lead Temperature
Soldering (10 sec)
Vapor Phase (60 sec)
Infrared (15 sec)
V peak Maximum approved
working voltage per
IEC 60950-1
52°C/W
1 Refers to continuous voltage magnitude imposed across the isolation
barrier. See the Insulation Lifetime section for more details.
260°C
215°C
220°C
ESD CAUTION
ꢀtresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rev. 0 | Page 7 of 24
AꢁM2682ꢀ/AꢁM2687ꢀ
PIN CONFIGURATION ANꢁ FUNCTION ꢁꢀSCRIPTIONS
GND
1
2
3
4
5
6
7
8
16 GND
1
2
V
15
14
13
12
11
10
9
V
ISOIN
CC
RxD
RE
A
B
Z
ADM2682E/
ADM2687E
DE
TOP VIEW
(Not to Scale)
TxD
Y
V
V
ISOOUT
CC
GND
GND
2
1
NOTES
1. PIN 10 AND PIN 15 MUST BE
CONNECTED EXTERNALLY.
Figure 2. Pin Configuration
Table 10. Pin Function Descriptions
Pin No.
Mnemonic
Description
1
2
GND1
VCC
Ground, Logic Side.
Logic Side Power Supply. It is recommended that a 0.1 μF and a 0.01 μF decoupling capacitor be fitted between
Pin 2 and Pin 1.
3
4
RxD
RE
Receiver Output Data. This output is high when (A − B) ≥ −30 mV and low when (A − B) ≤ –200 mV. The output is
tristated when the receiver is disabled, that is, when RE is driven high.
Receiver Enable Input. This is an active-low input. Driving this input low enables the receiver, while driving it high
disables the receiver.
5
6
7
DE
TxD
VCC
Driver Enable Input. Driving this input high enables the driver, while driving it low disables the driver.
Driver Input. Data to be transmitted by the driver is applied to this input.
Logic Side Power Supply. It is recommended that a 0.1 μF and a 10 μF decoupling capacitor be fitted between
Pin 7 and Pin 8.
8
9
10
GND1
GND2
VISOOUT
Ground, Logic Side.
Ground, Bus Side.
Isolated Power Supply Output. This pin must be connected externally to VISOIN. It is recommended that a reservoir
capacitor of 10 μF and a decoupling capacitor of 0.1 μF be fitted between Pin 10 and Pin 9.
11
12
13
14
15
Y
Z
B
A
Driver Noninverting Output
Driver Inverting Output
Receiver Inverting Input.
Receiver Noninverting Input.
Isolated Power Supply Input. This pin must be connected externally to VISOOUT. It is recommended that a 0.1 μF
and a 0.01 μF decoupling capacitor be fitted between Pin 15 and Pin 16.
VISOIN
16
GND2
Ground, Bus Side.
Rev. 0 | Page 8 of 24
AꢁM2682ꢀ/AꢁM2687ꢀ
TYPICAL PꢀRFORMANCꢀ CHARACTꢀRISTICS
200
140
120
100
80
180
160
R
= 54Ω
L
R
= 54Ω
L
140
120
100
80
R
= 120Ω
L
R
= 120Ω
L
60
60
40
NO LOAD
NO LOAD
40
20
20
0
0
–40
–15
10
35
60
85
85
16
1
4
7
10
13
16
85
85
TEMPERATURE (°C)
DATA RATE (Mbps)
Figure 3. ADM2682E Supply Current (ICC) vs. Temperature
(Data Rate = 16 Mbps, DE = 3.3 V, VCC = 3.3 V)
Figure 6. ADM2682E Supply Current (ICC) vs. Data Rate
(TA = 25°C, DE = 5 V, VCC = 5 V)
160
120
100
80
60
40
20
0
140
120
100
80
R
= 54Ω
R
= 54Ω
L
L
R
= 120Ω
L
R
= 120Ω
L
60
NO LOAD
40
NO LOAD
20
0
–40
–15
10
35
60
–40
–15
10
35
60
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 4. ADM2682E Supply Current (ICC) vs. Temperature
(Data Rate = 16 Mbps, DE = 5 V, VCC = 5 V)
Figure 7. ADM2687E Supply Current (ICC) vs. Temperature
(Data Rate = 500 kbps, DE = 5 V, VCC = 5 V)
180
160
160
140
120
100
80
140
120
100
80
R
= 54Ω
L
R
= 54Ω
L
R
= 120Ω
L
R
= 120Ω
L
60
60
40
40
NO LOAD
NO LOAD
20
20
0
0
1
4
7
10
13
–40
–15
10
35
60
DATA RATE (Mbps)
TEMPERATURE (°C)
Figure 5. ADM2682E Supply Current (ICC) vs. Data Rate
(TA = 25°C, DE = 3.3 V, VCC = 3.3 V)
Figure 8. ADM2687E Supply Current (ICC) vs. Temperature
(Data Rate = 500 kbps, DE = 3.3 V, VCC = 3.3 V)
Rev. 0 | Page 9 of 24
AꢁM2682ꢀ/AꢁM2687ꢀ
140
600
580
560
540
520
500
480
460
440
420
400
R
= 54Ω
L
120
100
80
60
40
20
0
tDPLH
R
= 120Ω
L
tDPHL
NO LOAD
50
125
200
275
350
425
500
500
85
–40
–15
10
35
60
85
TEMPERATURE (°C)
DATA RATE (kbps)
Figure 9. ADM2687E Supply Current (ICC) vs. Data Rate
(TA = 25°C, DE = 3.3 V, VCC = 3.3 V)
Figure 12. ADM2687E Differential Driver Propagation Delay vs. Temperature
120
100
80
60
40
20
0
R
= 54Ω
L
TxD
R
= 120Ω
L
1
Z
Y
NO LOAD
3
CH1 2.0V CH2 2.0V
CH3 2.0V
M10.00ns
A
CH1
1.28V
50
125
200
275
350
425
DATA RATE (kbps)
Figure 10. ADM2687E Supply Current (ICC) vs. Data Rate
(TA = 25°C, DE = 5 V, VCC = 5 V)
Figure 13. ADM2682E Driver Propagation Delay
72
70
68
66
64
62
60
58
56
54
52
50
tDPHL
tDPLH
TxD
1
Z
Y
3
CH1 2.0V CH2 2.0V
CH3 2.0V
M200ns
A
CH1
2.56V
–40
–15
10
35
60
TEMPERATURE (°C)
Figure 11. ADM2682E Differential Driver Propagation Delay vs. Temperature
Figure 14. ADM2687E Driver Propagation Delay
Rev. 0 | Page 10 of 24
AꢁM2682ꢀ/AꢁM2687ꢀ
0
–10
–20
–30
–40
–50
–60
–70
0.32
0.30
0.28
0.26
0.24
0.22
0.20
–40
–15
10
35
60
85
0
1
2
3
4
5
TEMPERATURE (°C)
OUTPUT HIGH VOLTAGE (V)
Figure 18. Receiver Output Low Voltage vs. Temperature
Figure 15. Receiver Output Current vs. Receiver Output High Voltage
60
50
40
30
20
10
0
B
A
1
RxD
3
CH1 2.0V CH2 2.0V
CH3 2.0V
M10.00ns
A
CH1
2.56V
0
1
2
3
4
5
OUTPUT LOW VOLTAGE (V)
Figure 16. Receiver Output Current vs. Receiver Output Low Voltage
Figure 19. ADM2682E Receiver Propagation Delay
4.75
4.74
A
B
4.73
4.72
4.71
4.70
4.69
4.68
4.67
1
RxD
3
4.66
4.65
CH1 2.0V CH2 2.0V
CH3 2.0V
M10.00ns
A
CH1
2.56V
–40
–15
10
35
60
85
TEMPERATURE (°C)
Figure 17. Receiver Output High Voltage vs. Temperature
Figure 20. ADM2687E Receiver Propagation Delay
Rev. 0 | Page 11 of 24
AꢁM2682ꢀ/AꢁM2687ꢀ
3.44
3.43
3.42
3.41
3.40
3.39
3.38
3.37
3.36
3.35
3.34
98
97
96
tRPHL
NO LOAD
95
94
93
92
tRPLH
R
= 120Ω
L
R
= 54Ω
L
–40
–15
10
35
60
85
–40
–15
10
35
60
85
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 21. ADM2682E Receiver Propagation Delay vs. Temperature
Figure 24. ADM2682E Isolated Supply Voltage vs. Temperature
(VCC = 5 V, Data Rate = 16 Mbps)
3.37
100
99
98
97
96
3.36
3.35
NO LOAD
3.34
tRPHL
R
= 120Ω
95
L
3.33
3.32
3.31
3.30
94
93
R
= 54Ω
L
92
tRPLH
91
90
–40
–40
–15
10
35
60
85
–15
10
35
60
85
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 25. ADM2687E Isolated Supply Voltage vs. Temperature
(VCC = 3.3 V, Data Rate = 500 kbps)
Figure 22. ADM2687E Receiver Propagation Delay vs. Temperature
3.39
3.38
3.37
3.36
3.39
3.38
NO LOAD
3.37
R
= 120Ω
L
NO LOAD
3.35
3.36
3.35
3.34
3.33
R
= 120Ω
R
= 54Ω
L
L
3.34
3.33
3.32
3.31
R
= 54Ω
L
–40
–15
10
35
60
85
–40
–15
10
35
60
85
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 26. ADM2687E Isolated Supply Voltage vs. Temperature
(VCC = 5 V, Data Rate = 500 kbps
Figure 23. ADM2682E Isolated Supply Voltage vs. Temperature
(VCC = 3.3 V, Data Rate = 16 Mbps)
Rev. 0 | Page 12 of 24
AꢁM2682ꢀ/AꢁM2687ꢀ
60
50
40
30
20
10
0
40
35
30
25
20
15
10
5
R
= 54Ω
L
R
= 54Ω
L
R
= 120Ω
L
R
= 120Ω
L
NO LOAD
NO LOAD
0
–40
–15
10
35
60
85
–40
–15
10
35
60
85
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 27. ADM2682E Isolated Supply Current vs. Temperature
(VCC = 3.3 V, Data Rate = 16 Mbps)
Figure 28. ADM2687E Isolated Supply Current vs. Temperature
(VCC = 3.3 V, Data Rate = 500 kbps)
Rev. 0 | Page 13 of 24
AꢁM2682ꢀ/AꢁM2687ꢀ
TꢀST CIRCUITS
Y
R
L
2
TxD
V
OD2
V
V
CC
OUT
R
L
Y
Z
R
110ꢀ
L
Z
2
V
OC
TxD
DE
S1
S2
C
L
50pF
Figure 29. Driver Voltage Measurement
Figure 32. Driver Enable/Disable
Y
375ꢀ
A
V
60ꢀ
TxD
OD3
RxD
375ꢀ
V
Z
OUT
V
TEST
RE
B
C
L
Figure 30. Driver Voltage Measurement over Common Mode
Figure 33. Receiver Propagation Delay
V
+1.5V
–1.5V
CC
Y
C
C
L
S1
TxD
R
R
L
RxD
L
S2
L
RE
Z
C
V
OUT
L
RE IN
Figure 31. Driver Propagation Delay
Figure 34. Receiver Enable/Disable
Rev. 0 | Page 14 of 24
AꢁM2682ꢀ/AꢁM2687ꢀ
SWITCHING CHARACTꢀRISTICS
V
CC
V
/2
V
/2
CC
CC
0V
Z
tDPLH
tDPHL
V
CC
1/2V
0.5V
tZL
0.5V
CC
O
CC
DE
V
O
0V
tLZ
2.3V
2.3V
Y
+V
Y, Z
Y, Z
O
V
V
+ 0.5V
– 0.5V
OL
90% POINT
90% POINT
V
= V – V
(Y)
DIFF
(Z)
V
OL
V
DIFF
tZH
tHZ
10% POINT
10% POINT
V
OH
–V
O
tDF
tDR
OH
t
= │t
DPHL
– t
│
DPLH
SKEW
Figure 37. Driver Enable/Disable Timing
Figure 35. Driver Propagation Delay, Rise/Fall Timing
V
V
IH
0.5V
tZL
0.5V
tLZ
CC
CC
RE
IL
A – B
0V
0V
1.5V
1.5V
RxD
V
+ 0.5V
– 0.5V
OL
OUTPUT LOW
OUTPUT HIGH
tRPLH
tRPHL
V
OL
V
V
tZH
tHZ
OH
V
OH
RxD
1.5V
V
1.5V
OH
tSKEW = |tRPLH – tRPHL
|
RxD
0V
OL
Figure 38. Receiver Enable/Disable Timing
Figure 36. Receiver Propagation Delay
Rev. 0 | Page 15 of 24
AꢁM2682ꢀ/AꢁM2687ꢀ
CIRCUIT ꢁꢀSCRIPTION
Table 13. Receiving (see Table 11 for Abbreviations)
Inputs Output
SIGNAL ISOLATION
The ADM2682E/ADM2687E signal isolation of 5 kV rms is
implemented on the logic side of the interface. The part achieves
signal isolation by having a digital isolation section and a trans-
ceiver section (see Figure ±). Data applied to the TxD and DE
pins and referenced to logic ground (GND±) are coupled across
an isolation barrier to appear at the transceiver section referenced
to isolated ground (GND2). ꢀimilarly, the single-ended receiver
output signal, referenced to isolated ground in the transceiver
section, is coupled across the isolation barrier to appear at the
RxD pin referenced to logic ground.
RE
A − B
RxD
≥ −0.03 V
≤ −0.2 V
−0.2 V < A − B < −0.03 V
Inputs open
X
L or NC
L or NC
L or NC
L or NC
H
H
L
I
H
Z
THERMAL SHUTDOWN
The ADM2682E/ADM2687E contain thermal shutdown circuitry
that protects the parts from excessive power dissipation during
fault conditions. ꢀhorting the driver outputs to a low impedance
source can result in high driver currents. The thermal sensing
circuitry detects the increase in die temperature under this
condition and disables the driver outputs. This circuitry is
designed to disable the driver outputs when a die temperature
of ±50°C is reached. As the device cools, the drivers are reenabled
at a temperature of ±40°C.
POWER ISOLATION
The ADM2682E/ADM2687E power isolation of 5 kV rms is
implemented using an isoPower integrated isolated dc-to-dc
converter. The dc-to-dc converter section of the ADM2682E/
ADM2687E works on principles that are common to most
modern power supplies. It is a secondary side controller
architecture with isolated pulse-width modulation (PWM)
feedback. VCC power is supplied to an oscillating circuit that
switches current into a chip-scale air core transformer. Power
transferred to the secondary side is rectified and regulated to
3.3 V. The secondary (VIꢀO) side controller regulates the output
by creating a PWM control signal that is sent to the primary
(VCC) side by a dedicated iCoupler (5 kV rms signal isolated)
data channel. The PWM modulates the oscillator circuit to
control the power being sent to the secondary side. Feedback
allows for significantly higher power and efficiency.
OPEN- AND SHORT-CIRCUIT, FAIL-SAFE RECEIVER
INPUTS
The receiver inputs have open- and short-circuit, fail-safe features
that ensure that the receiver output is high when the inputs are
open or shorted. During line-idle conditions, when no driver on
the bus is enabled, the voltage across a terminating resistance at
the receiver input decays to 0 V. With traditional transceivers,
receiver input thresholds specified between −200 mV and
+200 mV mean that external bias resistors are required on the
A and B pins to ensure that the receiver outputs are in a known
state. The short-circuit, fail-safe receiver input feature eliminates
the need for bias resistors by specifying the receiver input
threshold between −30 mV and −200 mV. The guaranteed negative
threshold means that when the voltage between A and B decays
to 0 V, the receiver output is guaranteed to be high.
TRUTH TABLES
The truth tables in this section use the abbreviations found in
Table ±±.
Table 11. Truth Table Abbreviations
Letter
Description
H
L
High level
Low level
DC CORRECTNESS AND MAGNETIC FIELD IMMUNITY
X
I
Z
Don’t care
The digital signals transmit across the isolation barrier using
iCoupler technology. This technique uses chip-scale transformer
windings to couple the digital signals magnetically from one
side of the barrier to the other. Digital inputs are encoded into
waveforms that are capable of exciting the primary transformer
winding. At the secondary winding, the induced waveforms are
decoded into the binary value that was originally transmitted.
Indeterminate
High impedance (off)
Disconnected
NC
Table 12. Transmitting (see Table 11 for Abbreviations)
Inputs
Outputs
Positive and negative logic transitions at the isolator input cause
narrow (~± ns) pulses to be sent to the decoder via the transformer.
The decoder is bistable and is, therefore, either set or reset by
the pulses, indicating input logic transitions. In the absence of
logic transitions at the input for more than ± μs, periodic sets of
refresh pulses indicative of the correct input state are sent to
ensure dc correctness at the output. If the decoder receives no
internal pulses of more than approximately 5 μs, the input side
DE
H
H
L
TxD
Y
H
L
Z
Z
Z
L
H
Z
Z
H
L
X
X
X
Rev. 0 | Page 16 of 24
AꢁM2682ꢀ/AꢁM2687ꢀ
is assumed to be unpowered or nonfunctional, in which case,
the isolator output is forced to a default state by the watchdog
timer circuit.
For example, at a magnetic field frequency of ± MHz, the
maximum allowable magnetic field of 0.2 kgauss induces a
voltage of 0.25 V at the receiving coil. This is about 50% of the
sensing threshold and does not cause a faulty output transition.
ꢀimilarly, if such an event occurs during a transmitted pulse
(and is of the worst-case polarity), it reduces the received pulse
from >±.0 V to 0.75 V, which is still well above the 0.5 V sensing
threshold of the decoder.
This situation should occur in the ADM2682E/ADM2687E devices
only during power-up and power-down operations. The limitation
on the ADM2682E/ADM2687E magnetic field immunity is set
by the condition in which induced voltage in the transformer
receiving coil is sufficiently large to either falsely set or reset the
decoder. The following analysis defines the conditions under
which this can occur.
The preceding magnetic flux density values correspond to
specific current magnitudes at given distances from the
ADM2682E/ADM2687E transformers. Figure 40 expresses
these allowable current magnitudes as a function of frequency
for selected distances. As shown in Figure 40, the ADM2682E/
ADM2687E are extremely immune and can be affected only by
extremely large currents operated at high frequency very close
to the component. For the ± MHz example, a 0.5 kA current must
be placed 5 mm away from the ADM2682E/ADM2687E to affect
The 3.3 V operating condition of the ADM2682E/ADM2687E
is examined because it represents the most susceptible mode of
operation. The pulses at the transformer output have an amplitude
of >±.0 V. The decoder has a sensing threshold of about 0.5 V,
thus establishing a 0.5 V margin in which induced voltages can
be tolerated. The voltage induced across the receiving coil is
given by
component operation.
2
V = (−dβ/dt)Σπrn ; n = ±, 2, … , N
1k
where:
DISTANCE = 1m
β is magnetic flux density (gauss).
N is the number of turns in the receiving coil.
rn is the radius of the nth turn in the receiving coil (cm).
100
10
Given the geometry of the receiving coil in the ADM2682E/
ADM2687E and an imposed requirement that the induced
voltage be, at most, 50% of the 0.5 V margin at the decoder, a
maximum allowable magnetic field is calculated as shown in
Figure 39.
DISTANCE = 100mm
1
DISTANCE = 5mm
0.1
100
0.01
1k
10k
100k
1M
10M
100M
10
1
MAGNETIC FIELD FREQUENCY (Hz)
Figure 40. Maximum Allowable Current for Various Current-to-
ADM2682E/ADM2687E Spacings
Note that in combinations of strong magnetic field and high
frequency, any loops formed by PCB traces can induce error
voltages sufficiently large to trigger the thresholds of succeeding
circuitry. Take care in the layout of such traces to avoid this
possibility.
0.1
0.01
0.001
1k
10k
100k
1M
10M
100M
MAGNETIC FIELD FREQUENCY (Hz)
Figure 39. Maximum Allowable External Magnetic Flux Density
Rev. 0 | Page 17 of 24
AꢁM2682ꢀ/AꢁM2687ꢀ
APPLICATIONS INFORMATION
In applications involving high common-mode transients, ensure
that board coupling across the isolation barrier is minimized.
Furthermore, design the board layout such that any coupling
that does occur equally affects all pins on a given component
side. Failure to ensure this can cause voltage differentials between
pins exceeding the absolute maximum ratings for the device,
thereby leading to latch-up and/or permanent damage.
PCB LAYOUT
The ADM2682E/ADM2687E isolated Rꢀ-422/Rꢀ-485 transceiver
contains an isoPower integrated dc-to-dc converter, requiring
no external interface circuitry for the logic interfaces. Power
supply bypassing is required at the input and output supply pins
(see Figure 4±). The power supply section of the ADM2682E/
ADM2687E uses an ±80 MHz oscillator frequency to pass power
efficiently through its chip-scale transformers. In addition, the
normal operation of the data section of the iCoupler introduces
switching transients on the power supply pins.
The ADM2682E/ADM2687E dissipate approximately 675 mW
of power when fully loaded. Because it is not possible to apply
a heat sink to an isolation device, the devices primarily depend
on heat dissipation into the PCB through the GND pins. If the
devices are used at high ambient temperatures, provide a thermal
path from the GND pins to the PCB ground plane. The board
layout in Figure 4± shows enlarged pads for Pin ±, Pin 8, Pin 9,
and Pin ±6. Implement multiple vias from the pad to the ground
plane to reduce the temperature inside the chip significantly. The
dimensions of the expanded pads are at the discretion of the
designer and dependent on the available board space.
Bypass capacitors are required for several operating frequencies.
Noise suppression requires a low inductance, high frequency
capacitor, whereas ripple suppression and proper regulation
require a large value capacitor. These capacitors are connected
between Pin ± (GND±) and Pin 2 (VCC) and Pin 7 (VCC) and
Pin 8 (GND±) for VCC. The VIꢀOIN and VIꢀOOUT capacitors are
connected between Pin 9 (GND2) and Pin ±0 (VIꢀOOUT) and
Pin ±5 (VIꢀOIN) and Pin ±6 (GND2). To suppress noise and reduce
ripple, a parallel combination of at least two capacitors is required
with the smaller of the two capacitors located closest to the device.
The recommended capacitor values are 0.± μF and ±0 μF for
EMI CONSIDERATIONS
The dc-to-dc converter section of the ADM2682E/ADM2687E
components must, of necessity, operate at very high frequency
to allow efficient power transfer through the small transformers.
This creates high frequency currents that can propagate in circuit
board ground and power planes, causing edge and dipole radiation.
Grounded enclosures are recommended for applications that
use these devices. If grounded enclosures are not possible, good
RF design practices should be followed in the layout of the PCB.
ꢀee the AN-097± Application Note, Recommendations for
Control of Radiated Emissions with isoPower Devices, for more
information.
VIꢀOOUT at Pin 9 and Pin ±0 and VCC at Pin 7 and Pin 8. Capacitor
values of 0.0± μF and 0.± μF are recommended for VIꢀOIN at Pin ±5
and Pin ±6 and VCC at Pin ± and Pin 2. The recommended best
practice is to use a very low inductance ceramic capacitor, or its
equivalent, for the smaller value capacitors. The total lead length
between both ends of the capacitor and the input power supply
pin should not exceed ±0 mm.
10nF
10nF
100nF
100nF
GND
V
GND
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
1
2
V
CC
ISOIN
RxD
A
B
Z
ADM2682E/
ADM2687E
RE
DE
TxD
Y
V
V
CC
ISOOUT
GND
1
GND
2
10µF
100nF
10µF
100nF
Figure 41. Recommended PCB Layout
Rev. 0 | Page 18 of 24
AꢁM2682ꢀ/AꢁM2687ꢀ
INSULATION LIFETIME
All insulation structures eventually break down when subjected to
voltage stress over a sufficiently long period. The rate of insulation
degradation is dependent on the characteristics of the voltage
waveform applied across the insulation. Analog Devices conducts
an extensive set of evaluations to determine the lifetime of the
insulation structure within the ADM2682E/ADM2687E.
waveform that does not conform to Figure 43 or Figure 44 should
be treated as a bipolar ac waveform, and its peak voltage should
be limited to the 50-year lifetime voltage value listed in Table 9.
RATED PEAK VOLTAGE
0V
Figure 42. Bipolar AC Waveform
Accelerated life testing is performed using voltage levels higher
than the rated continuous working voltage. Acceleration factors for
several operating conditions are determined, allowing calculation
of the time to failure at the working voltage of interest. The values
shown in Table 9 summarize the peak voltages for 50 years of
service life in several operating conditions. In many cases, the
working voltage approved by agency testing is higher than the
50-year service life voltage. Operation at working voltages higher
than the service life voltage listed leads to premature insulation
failure.
RATED PEAK VOLTAGE
0V
Figure 43. DC Waveform
RATED PEAK VOLTAGE
0V
NOTES
1. THE VOLTAGE IS SHOWN AS SINUSODIAL FOR ILLUSTRATION
PURPOSES ONLY. IT IS MEANT TO REPRESENT ANY VOLTAGE
WAVEFORM VARYING BETWEEN 0 AND SOME LIMITING VALUE.
THE LIMITING VALUE CAN BE POSITIVE OR NEGATIVE, BUT THE
VOLTAGE CANNOT CROSS 0V.
The insulation lifetime of the ADM2682E/ADM2687E depends
on the voltage waveform type imposed across the isolation barrier.
The iCoupler insulation structure degrades at different rates,
depending on whether the waveform is bipolar ac, unipolar ac,
or dc. Figure 42, Figure 43, and Figure 44 illustrate these different
isolation voltage waveforms.
Figure 44. Unipolar AC Waveform
ISOLATED SUPPLY CONSIDERATIONS
The typical output voltage of the integrated isoPower dc-to-dc
isolated supply is 3.3 V. The isolated supply in the ADM2682E/
ADM2687E is typically capable of supplying a current of 55 mA
when the junction temperature of the device is kept below ±30°C.
This includes the current required by the internal Rꢀ-485 circuitry,
and typically, no additional current is available on VIꢀOOUT for
external applications.
Bipolar ac voltage is the most stringent environment. A 50-year
operating lifetime under the bipolar ac condition determines
the Analog Devices recommended maximum working voltage.
In the case of unipolar ac or dc voltage, the stress on the insulation
is significantly lower. This allows operation at higher working
voltages while still achieving a 50-year service life. The working
voltages listed in Table 9 can be applied while maintaining the
50-year minimum lifetime, provided the voltage conforms to either
the unipolar ac or dc voltage cases. Any cross-insulation voltage
Rev. 0 | Page 19 of 24
AꢁM2682ꢀ/AꢁM2687ꢀ
TYPICAL APPLICATIONS
An example application of the ADM2682E/ADM2687E for a full-
duplex Rꢀ-485 node is shown in the circuit diagram of Figure 45.
Refer to the PCB Layout section for the recommended placement
of the capacitors shown in this circuit diagram. Placement of
the RT termination resistors depends on the location of the node
and the network configuration. Refer to AN-960 Application Note,
RS-485/RS-422 Circuit Implementation Guide, for guidance on
termination.
Figure 46 and Figure 47 show typical applications of the
ADM2682E/ADM2687E in half duplex and full duplex Rꢀ-485
network configurations. Up to 256 transceivers can be connected to
the Rꢀ-485 bus. To minimize reflections, terminate the line at
the receiving end in its characteristic impedance and keep stub
lengths off the main line as short as possible. For half-duplex
operation, this means that both ends of the line must be terminated
because either end can be the receiving end.
3.3V/5V POWER
SUPPLY
100nF
10µF
100nF
10nF
100nF 10µF
V
V
CC
ISOOUT
V
CC
isoPower DC-TO-DC CONVERTER
OSCILLATOR
RECTIFIER
V
ISOIN
100nF 10nF
REGULATOR
DIGITAL ISOLATION
ENCODE
i
Coupler
TRANSCEIVER
D
Y
TxD
DE
DECODE
DECODE
ENCODE
Z
MICROCONTROLLER
AND UART
ENCODE
DECODE
A
B
RxD
R
R
T
RE
ADM2682E/ADM2687E
GND
GND
2
1
ISOLATION
BARRIER
GND
1
Figure 45. Example Circuit Diagram Using the ADM2682E/ADM2687E
Rev. 0 | Page 20 of 24
AꢁM2682ꢀ/AꢁM2687ꢀ
MAXIMUM NUMBER OF TRANSCEIVERS ON BUS = 256
ADM2582E/
ADM2587E
ADM2682E/
ADM2687E
A
B
A
RxD
RxD
R
R
B
RE
RE
DE
R
R
T
T
DE
Z
Y
Z
TxD
TxD
D
D
Y
A
B
Z
Y
A
B
Z
Y
R
R
D
D
ADM2682E/
ADM2687E
ADM2682E/
ADM2687E
RxD RE DE TxD
RxD RE DE TxD
NOTES
1. R IS EQUAL TO THE CHARACTERISTIC IMPEDANCE OF THE CABLE.
T
2. ISOLATION NOT SHOWN.
Figure 46. ADM2682E/ADM2687E Typical Half Duplex RS-485 Network
MAXIMUM NUMBER OF NODES = 256
MASTER
R
SLAVE
A
B
Z
Y
Z
RxD
RE
D
TxD
DE
R
T
B
A
DE
RE
R
T
TxD
D
R
RxD
Y
ADM2682E/
ADM2687E
ADM2682E/
ADM2687E
A
B
Z
Y
A
B
Z
Y
SLAVE
SLAVE
R
R
D
D
ADM2682E/
ADM2687E
ADM2682E/
ADM2687E
RxD RE DE TxD
RxD RE DE TxD
NOTES
1. R IS EQUAL TO THE CHARACTERISTIC IMPEDANCE OF THE CABLE.
T
2. ISOLATION NOT SHOWN.
Figure 47. ADM2682E/ADM2687E Typical Full Duplex RS-485 Network
Rev. 0 | Page 21 of 24
AꢁM2682ꢀ/AꢁM2687ꢀ
OUTLINꢀ ꢁIMꢀNSIONS
13.00 (0.5118)
12.60 (0.4961)
16
1
9
8
7.60 (0.2992)
7.40 (0.2913)
10.65 (0.4193)
10.00 (0.3937)
0.75 (0.0295)
0.25 (0.0098)
45°
2.65 (0.1043)
2.35 (0.0925)
0.30 (0.0118)
0.10 (0.0039)
8°
0°
COPLANARITY
0.10
SEATING
PLANE
1.27
(0.0500)
BSC
0.33 (0.0130)
0.20 (0.0079)
1.27 (0.0500)
0.40 (0.0157)
0.51 (0.0201)
0.31 (0.0122)
COMPLIANT TO JEDEC STANDARDS MS-013-AC
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 48. 16-Lead Standard Small Outline Package with Increased Creepage [SOIC_IC]
Wide Body,
(RI-16-1)
Dimensions shown in millimeters and (inches)
ORDERING GUIDE
Model1
ADM2682EBRIZ
ADM2682EBRIZ-RL7
ADM2687EBRIZ
ADM2687EBRIZ-RL7
EVAL-ADM2682EEBZ
EVAL-ADM2687EEBZ
Data Rate (Mbps)
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
16-Lead SOIC_IC
16-Lead SOIC_IC
Package Option
RI-16-1
RI-16-1
16
16
0.5
0.5
16-Lead SOIC_IC
16-Lead SOIC_IC
RI-16-1
RI-16-1
ADM2682E Evaluation Board
ADM2687E Evaluation Board
1 Z = RoHS Compliant Part.
Rev. 0 | Page 22 of 24
AꢁM2682ꢀ/AꢁM2687ꢀ
NOTꢀS
Rev. 0 | Page 23 of 24
AꢁM2682ꢀ/AꢁM2687ꢀ
NOTꢀS
©2011 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D09927-0-7/11(0)
Rev. 0 | Page 24 of 24
相关型号:
EVAL-ADM3052EBZ
Isolated CAN Transceiver with Integrated High Voltage, Bus-Side, Linear Regulator
ADI
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