EVAL-ADMP510Z-FLEX [ADI]
RF Hardened, Ultralow Noise Microphone with Bottom Port and Analog Output; RF硬化，超低噪声麦克风与底部端口和模拟输出
| 型号： | EVAL-ADMP510Z-FLEX |
| 厂家： | 
ADI |
| 描述： | RF Hardened, Ultralow Noise Microphone with Bottom Port and Analog Output |
| 文件： | 总12页 (文件大小：247K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
RF Hardened, Ultralow Noise Microphone
with Bottom Port and Analog Output
Data Sheet
ADMP510
FEATURES
FUNCTIONAL BLOCK DIAGRAM
Tiny, 3.35 mm × 2.5 mm × 0.98 mm surface-mount package
Noninverted signal output
Omnidirectional response
High SNR of 65 dBA
OUTPUT
AMPLIFIER
OUTPUT
Sensitivity of −38 dBV
Sensitivity tolerance of 2 dB
POWER
Extended frequency response from 60 Hz to 20 kHz
Enhanced radio frequency (RF) performance
Acoustic overload point of 124 dB SPL
Low current consumption of 180 µA
Single-ended analog output
ADMP510
V
GND
DD
Figure 1.
High PSR of −78 dBV
Compatible with Sn/Pb and Pb-free solder processes
RoHS/WEEE compliant
APPLICATIONS
Smartphones and feature phones
Tablet computers
Teleconferencing systems
Digital still and video cameras
Bluetooth headsets
Figure 2. Isometric Views of the Microphone Package
Notebook PCs
Security and surveillance
GENERAL DESCRIPTION
The ADMP5101 is an RF hardened, analog output, bottom-ported,
omnidirectional MEMS microphone with high performance,
ultralow noise, and low power. The ADMP510 consists of a MEMS
microphone element, an impedance converter, and an output
amplifier. The ADMP510 sensitivity specification makes it an
excellent choice for both near-field and far-field applications.
The ADMP510 is pin compatible with the ADMP504 microphone.
The ADMP510 has a very high signal-to-noise ratio (SNR)
and extended wideband frequency response, resulting in natural
sound with high intelligibility. Low current consumption enables
long battery life for portable applications.
The ADMP510 is available in an ultraminiature 3.35 mm ×
2.5 mm × 0.98 mm surface-mount package. It is reflow solder
compatible with no sensitivity degradation.
1 Protected by U.S. Patents 7,449,356; 7,825,484; 7,885,423; and 7,961,897. Other patents are pending.
Rev. 0
Document Feedback
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rightsof third parties that may result fromits use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks andregisteredtrademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Technical Support
©2013 Analog Devices, Inc. All rights reserved.
www.analog.com
ADMP510
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications Information .................................................................7
Interfacing with Analog Devices Codecs...................................7
Supporting Documents ................................................................7
PCB Design and Land Pattern Layout............................................8
Handling Instructions.......................................................................9
Pick-and-Place Equipment ..........................................................9
Reflow Solder.................................................................................9
Board Wash ....................................................................................9
Outline Dimensions....................................................................... 10
Ordering Guide .......................................................................... 10
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
ESD Caution.................................................................................. 4
Soldering Profile........................................................................... 4
Pin Configuration and Function Descriptions............................. 5
Typical Performance Characteristics ............................................. 6
REVISION HISTORY
7/13—Revision 0: Initial Version
Rev. 0 | Page 2 of 12
Data Sheet
ADMP510
SPECIFICATIONS
TA = 25°C, VDD = 1.8 V, unless otherwise noted. All minimum and maximum specifications are guaranteed. Typical specifications are not
guaranteed.
Table 1.
Parameter
Symbol
Test Conditions/Comments
Min
Typ
Max
Unit
PERFORMANCE
Directionality
Omni
Output Polarity
Sensitivity
Signal-to-Noise Ratio
Equivalent Input Noise
Dynamic Range
Noninverted
−38
65
29
91
1 kHz, 94 dB sound pressure level (SPL)
20 Hz to 20 kHz, A-weighted
20 Hz to 20 kHz, A-weighted
Derived from EIN and maximum acoustic
input
Low frequency −3 dB point
High frequency −3 dB point
105 dB SPL
−40
−36
dBV
dBA
dBA SPL
dB
SNR
EIN
Frequency Response1
60
>20
0.2
Hz
kHz
%
Total Harmonic Distortion
Power Supply Rejection
THD
PSR
1
217 Hz, 100 mV p-p square wave super-
imposed on VDD = 1.8 V (A-weighted)
−78
dBV
Power Supply Rejection Ratio
PSRR
1 kHz, 100 mV p-p sine wave superimposed
on VDD = 1.8 V
10% THD
−55
124
dB
Acoustic Overload Point
POWER SUPPLY
dB SPL
Supply Voltage
Supply Current
VDD
IS
1.5
3.63
220
250
V
µA
µA
VDD = 1.8 V
VDD = 3.3 V
180
210
OUTPUT CHARACTERISTICS
Output Impedance
Output DC Offset
ZOUT
350
0.7
Ω
V
Maximum Output Voltage
Noise Floor
124 dB SPL input
20 Hz to 20 kHz, A-weighted, rms
0.398
−103
V rms
dBV
1 See Figure 5 and Figure 6.
Rev. 0 | Page 3 of 12
ADMP510
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 2.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Parameter
Rating
Supply Voltage
Sound Pressure Level (SPL)
Mechanical Shock
Vibration
−0.3 V to +3.63 V
160 dB
10,000 g
Per MIL-STD-883 Method 2007,
Test Condition B
Temperature Range
−40°C to +85°C
ESD CAUTION
SOLDERING PROFILE
CRITICAL ZONE
tP
T
TO T
L
P
T
P
RAMP-UP
T
L
tL
T
SMAX
T
SMIN
tS
RAMP-DOWN
PREHEAT
t25°C TO PEAK
TIME
Figure 3. Recommended Soldering Profile Limits
Table 3. Recommended Soldering Profile Limits
Profile Feature
Sn63/Pb37
Pb-Free
Average Ramp Rate (TL to TP)
Preheat
1.25°C/sec maximum
1.25°C/sec maximum
Minimum Temperature (TSMIN
)
100°C
150°C
Maximum Temperature (TSMAX
)
150°C
200°C
Time, TSMIN to TSMAX (tS)
Ramp-Up Rate (TSMAX to TL)
60 sec to 75 sec
1.25°C/sec
60 sec to 75 sec
1.25°C/sec
Time Maintained Above Liquidous (tL)
Liquidous Temperature (TL)
45 sec to 75 sec
183°C
~50 sec
217°C
Peak Temperature (TP)
Time Within 5°C of Actual Peak Temperature (tP)
Ramp-Down Rate
215°C +3°C/−3°C
20 sec to 30 sec
3°C/sec maximum
5 minutes maximum
260°C +0°C/−5°C
20 sec to 30 sec
3°C/sec maximum
5 minutes maximum
Time 25°C (t25°C) to Peak Temperature
Rev. 0 | Page 4 of 12
Data Sheet
ADMP510
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
GND
3
2
OUTPUT
1
V
DD
ADMP510
TOP VIEW
(TERMINAL SIDE DOWN)
Not to Scale
Figure 4. Pin Configuration
Table 4. Pin Function Descriptions
Pin No.
Mnemonic
Description
1
2
3
VDD
OUTPUT
GND
Power Supply
Analog Output Signal
Ground
Rev. 0 | Page 5 of 12
ADMP510
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
20
15
10
5
10
1
0
–5
–10
–15
0.1
90
100
110
120
130
10
100
1k
10k
INPUT (dB SPL)
FREQUENCY (Hz)
Figure 5. Frequency Response Mask
Figure 8. THD + N vs. Input SPL
15
0
–5
10
5
–10
–15
–20
–25
–30
–35
–40
–45
–50
0
–5
–10
–15
10
100
1k
10k
90
100
110
120
130
140
FREQUENCY (Hz)
INPUT AMPLITUDE (dB SPL)
Figure 6. Typical Frequency Response (Measured)
Figure 9. Linearity
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
–50
–51
–52
–53
–54
–55
–56
–57
–58
–59
–60
120dB SPL
124dB SPL
128dB SPL
132dB SPL
100
1k
10k
0
0.5
TIME (ms)
1.0
FREQUENCY (Hz)
Figure 7. Typical Power Supply Rejection Ratio vs. Frequency
Figure 10. Clipping Characteristics
Rev. 0 | Page 6 of 12
Data Sheet
ADMP510
APPLICATIONS INFORMATION
INTERFACING WITH ANALOG DEVICES CODECS
SUPPORTING DOCUMENTS
The output of the ADMP510 can be connected to a dedicated
codec microphone input (see Figure 11) or to a high input
impedance gain stage (see Figure 12). A 0.1 µF ceramic capacitor
placed close to the ADMP510 supply pin is used for testing and
is recommended to adequately decouple the microphone from
noise on the power supply. A dc blocking capacitor is required
at the output of the microphone. This capacitor creates a high-
pass filter with a corner frequency at
For additional information, see the following documents.
Evaluation Board User Guide
UG-325, Analog Output MEMS Microphone Flex Evaluation
Board
Circuit Note
CN-0207, High Performance Analog MEMS Microphone’s Simple
Interface to SigmaDSP Audio Codec
fC = 1/(2π × C × R)
Application Notes
where R is the input impedance of the codec.
AN-1003, Recommendations for Mounting and Connecting
the Analog Devices, Inc., Bottom-Ported MEMS Microphones
A minimum value of 2.2 μF is recommended in Figure 11
because the input impedance of the ADAU1761/ADAU1361
can be as low as 2 kΩ at its highest PGA gain setting, which
results in a high-pass filter corner frequency at about 37 Hz.
AN-1068, Reflow Soldering of the MEMS Microphone
AN-1112, Microphone Specifications Explained
AN-1124, Recommendations for Sealing Analog Devices, Inc.,
Bottom-Port MEMS Microphones from Dust and Liquid Ingress
MICBIAS
0.1µF
AN-1140, Microphone Array Beamforming
ADAU1761
OR
V
DD
AN-1165, Op Amps for MEMS Microphone Preamp Circuits
ADAU1361
2.2µF
MINIMUM
ADMP510
AN-1181, Using a MEMS Microphone in a 2-Wire Microphone
Circuit
LINN
LINP
CM
OUTPUT
GND
Figure 11. ADMP510 Connected to the ADAU1761 or ADAU1361 Codec
Figure 12 shows the ADMP510 connected to an ADA4075-2
op amp configured as a noninverting preamplifier.
GAIN = (R1 + R2)/R1
R1
R2
V
REF
0.1µF
V
DD
V
ADA4075-2
OUT
1µF
MINIMUM
ADMP510
OUTPUT
GND
10kΩ
V
REF
Figure 12. ADMP510 Connected to the ADA4075-2 Op Amp
Rev. 0 | Page 7 of 12
ADMP510
Data Sheet
PCB DESIGN AND LAND PATTERN LAYOUT
Lay out the PCB land pattern for the ADMP510 at a 1:1 ratio to
the solder pads on the microphone package (see Figure 13). Take
care to avoid applying solder paste to the sound hole in the PCB.
Figure 14 shows a suggested solder paste stencil pattern layout.
The diameter of the sound hole in the PCB should be larger than
the diameter of the sound port of the microphone. A minimum
diameter of 0.5 mm is recommended.
1.52
0.68
1.22
0.61
Ø1.55
1.90
Ø0.95
0.61
0.90
Figure 13. Suggested PCB Land Pattern Layout
1.55/1.05 DIA.
2×
0.8 × 0.6
0.225 CUT WIDTH (2×)
1.22
0.2 × 45°
TYP
1.52mm
Figure 14. Suggested Solder Paste Stencil Pattern Layout
Rev. 0 | Page 8 of 12
Data Sheet
ADMP510
HANDLING INSTRUCTIONS
PICK-AND-PLACE EQUIPMENT
REFLOW SOLDER
The MEMS microphone can be handled using standard pick-
and-place and chip shooting equipment. Take care to avoid
damage to the MEMS microphone structure as follows:
For best results, the soldering profile should be in accordance
with the recommendations of the manufacturer of the solder
paste used to attach the MEMS microphone to the PCB. It is
recommended that the solder reflow profile not exceed the limit
conditions specified in Figure 3 and Table 3.
•
Use a standard pickup tool to handle the microphone.
Because the microphone hole is located on the bottom
surface of the package (see Figure 2), the pickup tool can
make contact with any part of the top lid surface.
Do not pick up the microphone with a vacuum tool that
makes contact with the bottom side of the microphone.
Do not use excessive force to place the microphone on
the PCB.
BOARD WASH
When washing the PCB, ensure that water does not make contact
with the microphone port. Do not use blow-off procedures or
ultrasonic cleaning.
•
•
Rev. 0 | Page 9 of 12
ADMP510
Data Sheet
OUTLINE DIMENSIONS
3.425
3.350
3.275
1.52
BSC
0.75 REF
1.08
3.06 REF
1.07
REF
REFERENCE
CORNER
0.30 BSC
0.25 NOM
0.20 MIN
DIA.
THRU HOLE
(SOUND PORT)
0.90 × 0.68
(PINS 1, 3)
1.55 DIA.
2
0.95 DIA.
2.575
2.500
2.425
0.54
REF
3
1.22 BSC
2.21
REF
1.25
1
BOTTOM VIEW
TOP VIEW
0.64 REF
PIN 1
0.20 TYP
× 45°
1.08
0.98
0.88
SIDE VIEW
Figure 15. 3-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV]
3.35 mm × 2.5 mm Body
(CE-3-5)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
−40°C to +85°C
−40°C to +85°C
Package Description
Package Option2
CE-3-5
Ordering Quantity
10,000
1,000
ADMP510ACEZ-RL
ADMP510ACEZ-RL7
EVAL-ADMP510Z-FLEX
3-Terminal LGA_CAV, 13”Tape and Reel
3-Terminal LGA_CAV, 7”Tape and Reel
Flexible Evaluation Board
CE-3-5
1 Z = RoHS Compliant Part.
2 This package option is halide free.
Rev. 0 | Page 10 of 12
Data Sheet
NOTES
ADMP510
Rev. 0 | Page 11 of 12
ADMP510
NOTES
Data Sheet
©2013 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D11532-0-7/13(0)
Rev. 0 | Page 12 of 12
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