FIDO1100BGA208IR1 [ADI]
Micro Peripheral IC;
| 型号： | FIDO1100BGA208IR1 |
| 厂家： | 
ADI |
| 描述： | Micro Peripheral IC 时钟 外围集成电路 |
| 文件： | 总83页 (文件大小：1470K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
®
Flexible Input Deterministic Output (fido )
Data Sheet
32-Bit Real-Time Communications Controller
April 25, 2012
®
fido1100 Data Sheet
32-Bit Real-Time Communications Controller
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Data Sheet
32-Bit Real-Time Communications Controller
April 25, 2012
Copyright 2012 by Innovasic, Inc.
Published by Innovasic, Inc.
5635 Jefferson St. NE, Suite A, Albuquerque, New Mexico 87109 USA
fido®, fido1100®, and SPIDER are trademarks of Innovasic, Inc.
I2C™ Bus is a trademark of Philips Electronics N.V.
Motorola is a registered trademark of Motorola, Inc.
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April 25, 2012
TABLE OF CONTENTS
List of Figures..................................................................................................................................5
List of Tables ...................................................................................................................................6
1.
2.
Overview.................................................................................................................................7
Features...................................................................................................................................9
2.1 Core CPU ....................................................................................................................10
2.2 JTAG...........................................................................................................................10
2.3 Internal Memory and Memory Management ..............................................................11
2.4 External Bus Interface.................................................................................................12
2.5 PMU/UIC/CPU DMA.................................................................................................12
2.6 Internal Peripherals .....................................................................................................13
2.6.1 Timer Counter Units (TCU) ...........................................................................13
2.6.2 Analog-to-Digital Converter (ADC)...............................................................14
2.6.3 Timers .............................................................................................................14
2.7 Power Control .............................................................................................................14
Libraries and Support Tools .................................................................................................15
Packaging, Pin Descriptions, and Physical Dimensions.......................................................16
4.1 PQFP Package.............................................................................................................17
4.1.1 PQFP Pinout ...................................................................................................17
4.1.2 PQFP Physical Dimensions............................................................................24
4.2 BGA 10- by 10-mm Package ......................................................................................25
4.2.1 BGA 10- by 10-mm Pinout.............................................................................25
4.2.2 BGA 10- by 10-mm Physical Package Dimensions.......................................33
4.3 BGA 15- by 15-mm Package ......................................................................................34
4.3.1 BGA 15- by 15-mm Pinout.............................................................................34
4.3.2 BGA 15- by 15-mm Physical Package Dimensions.......................................42
4.3.3 BGA 15- by 15-mm Signal Routing...............................................................43
4.4 Power and Ground Signals..........................................................................................45
Electrical Characteristics ......................................................................................................47
Thermal Characteristics........................................................................................................49
Reset .....................................................................................................................................52
7.1 Overview .....................................................................................................................52
7.2 Signal Considerations and Reset Timing ....................................................................52
7.3 Clock Signals...............................................................................................................54
7.4 Typical Clock Source Implementations ......................................................................54
7.4.1 Normal or Driven Clock Source.....................................................................54
7.4.2 Using an External Crystal...............................................................................54
7.5 Off-Chip Component Value........................................................................................56
Signals...................................................................................................................................57
8.1 External Bus Operation ...............................................................................................57
8.1.1 Overview.........................................................................................................57
3.
4.
5.
6.
7.
8.
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8.2 General Setup and Hold Timing..................................................................................57
8.3 External Bus Timing ...................................................................................................58
Setup and Hold Timing.........................................................................................................59
9.1.1 External Bus Timing for a 32-Bit Transfer (without RDY_N) ......................61
9.1.2 External Bus Timing for a 32-Bit Transfer (with RDY_N) ...........................62
9.1.3 External Bus Timing for 8-Bit/16-Bit Transfer (without RDY_N)................64
9.1.4 External Bus Timing for 8-Bit/16-Bit Transfer (with RDY_N).....................65
9.2 SDRAM Timing..........................................................................................................66
9.2.1 SDRAM CAS Timing.....................................................................................66
9.2.2 SDRAM Row Activation Timing...................................................................67
9.2.3 SDRAM Read Operation Timing...................................................................69
9.2.4 SDRAM Read Burst Timing ..........................................................................69
9.2.5 SDRAM Write Operation, Write Burst, Write-to-Write, and Write-to-
9.
Precharge Timing............................................................................................70
10. JTAG.....................................................................................................................................74
10.1 JTAG Scan Chain Debug Functionality......................................................................75
11. Ordering Information............................................................................................................77
12. Errata.....................................................................................................................................78
12.1 Summary .....................................................................................................................78
12.2 Detail ...........................................................................................................................78
13. Revision History...................................................................................................................82
14. For Additional Information...................................................................................................83
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April 25, 2012
LIST OF FIGURES
Figure 1. Block Diagram for the fido1100......................................................................................8
Figure 2. PQFP Package Diagram ................................................................................................17
Figure 3. PQFP Physical Package Dimensions.............................................................................24
Figure 4. BGA 10- by 10-mm Package Diagram .........................................................................26
Figure 5. BGA 10- by 10-mm Physical Package Dimensions......................................................33
Figure 6. BGA 15- by 15-mm Package Diagram .........................................................................35
Figure 7. BGA 15- by 15-mm Physical Package Dimensions......................................................42
Figure 8. BGA 15- by 15-mm Signal Routing..............................................................................44
Figure 9. Thermal Performance of PQFP/BGA Under Forced Convection .................................50
Figure 10. Reset Timing ...............................................................................................................53
Figure 11. Extended Reset Timing ...............................................................................................53
Figure 12. Driven Clock Source ...................................................................................................55
Figure 13. Crystal Oscillator Third Overtone Off-Chip Components.........................................55
Figure 14. Crystal Oscillator Fundamental Overtone Off-Chip Components..............................55
Figure 15. Propagation Delay .......................................................................................................59
Figure 16. Setup Time...................................................................................................................59
Figure 17. Hold Time....................................................................................................................60
Figure 18. Recovery Time ............................................................................................................60
Figure 19. Removal Time .............................................................................................................60
Figure 20. Minimum Pulse Width ................................................................................................61
Figure 21. External Bus Timing for a Single, 32-Bit Cycle (without RDY_N) ...........................62
Figure 22. External Bus Timing for a 32-Bit Transfer (with RDY_N) ........................................63
Figure 23. External Bus Timing for 8-Bit/16-Bit Transfer (without RDY_N).............................64
Figure 24. External Bus Timing for 8-Bit/16-Bit Transfer (with RDY_N)..................................65
Figure 25. SDRAM CAS Timing .................................................................................................67
Figure 25. Specific Row Activation Timing.................................................................................68
Figure 27. Meeting tRCD (min) When 2 < tRCD (min)/tCK ≤ 3 ................................................68
Figure 28. SDRAM Read Operation Timing................................................................................69
Figure 29. SDRAM Read Burst Timing .......................................................................................70
Figure 30. SDRAM Write Operation Timing...............................................................................71
Figure 31. SDRAM Write Burst Timing ......................................................................................72
Figure 32. SDRAM Write-to-Write Timing.................................................................................72
Figure 33. SDRAM Write-to-Precharge Timing ..........................................................................73
Figure 34. JTAG State Machine ...................................................................................................74
Figure 35. JTAG Port Register Interface ......................................................................................75
Figure 36. Timing of JTAG Signals .............................................................................................75
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Data Sheet
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April 25, 2012
LIST OF TABLES
Table 1. Key Features .....................................................................................................................7
Table 2. Test Pin Descriptions......................................................................................................11
Table 3. PQFP Pin Listing ............................................................................................................18
Table 4. BGA 10- by 10-mm Package Pin Listing.......................................................................27
Table 5. BGA 15- by 15-mm Package Pin Listing.......................................................................36
Table 6. Analog Power and Ground Signals.................................................................................45
Table 7. Crystal Oscillator Power and Ground Signals................................................................45
Table 8. 2.5 VDC Digital Core Power Signals .............................................................................45
Table 9. 3.3 VDC Digital IO Power Signals.................................................................................46
Table 10. Digital Ground Signals .................................................................................................46
Table 11. Absolute Maximum Ratings .........................................................................................47
Table 12. ESD and Latch-Up Characteristics ...............................................................................47
Table 13. Recommended Operating Conditions ...........................................................................47
Table 14. DC Characteristics ........................................................................................................48
Table 15. Input Impedance............................................................................................................48
Table 16. Physical Properties and Simulation Conditions............................................................49
Table 17. Maximum Power Dissipation of PQFP/BGA Under Forced Convection.....................50
Table 18. AC Characteristics of Crystal Oscillator.......................................................................50
Table 19. Analog-to-Digital Converter Characteristics ................................................................51
Table 20. Power Consumption......................................................................................................51
Table 21. Hardware Signals Involved When Asserting Reset ......................................................52
Table 22. Suggested Off-Chip Component Values .......................................................................56
Table 23. Debug Scan Chain Commands Supported by the JTAG TAP......................................76
Table 24. Part Numbers by Package Types ..................................................................................77
Table 25. Summary of Errata........................................................................................................78
Table 26. Revision History ...........................................................................................................82
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Data Sheet
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April 25, 2012
1.
Overview
Innovasic Semiconductor’s fido1100 is the first product in the fido family of real-time
communication controllers. The fido communication controller architecture is uniquely
optimized for solving memory bottlenecks, and is designed from the ground up for deterministic
processing. Critical timing parameters, such as context switching and interrupt latency, are
precisely predictable for real-time tasks. The fido1100 also incorporates the Universal I/O
Controller (UIC) that is configurable to support various communication protocols across
multiple platforms. This flexibility relieves the designer of the task of searching product
matrices to find the set of peripherals that most closely match the system interface needs. The
Software Profiling and Integrated Debug EnviRonment (SPIDER) has extensive real-time code
debug capabilities without the burden of code instrumentation (see Table 1).
Figure 1 illustrates the top-level blocks of the fido1100 architecture.
Table 1. Key Features
Feature
Benefit
Programmable UIC
Provides the ability to customize peripherals to match user application.
Single chip can solve multiple end-product demands.
Reduces costs through optimized inventory management.
Five Hardware
Contexts
Runs tight-control loops in separate contexts while RTOS manages high-level
tasks in another context.
Provides context isolation with robust time-and-space partitioning.
Low-Jitter
Execution
Performs tasks at much lower clock rates (66MHz versus >200MHz), reducing
power budget and simplifying board design.
SPIDER
Reduces system integration and debug time through in-system, “what-if” testing
without code changes.
Reduces firmware development time thus cutting costs.
Up to 1Mbyte of trace buffer.
Long-Life-Cycle
Support
Fulfills Innovasic’s corporate policy of supporting products for the customer’s
entire life-cycle, eliminating product obsolescence concerns.
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Data Sheet
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April 25, 2012
T0IN
T1IN
RREM and
MPU
T0IC[3:0]
Timer
T1IC[3:0]
T0OC[3:0]
T1OC[3:0]
Counter Unit
DMA[1:0]_ACK
DMA[1:0]_REQ
INT[7:0]
SPIDER™
Debug
CPU
DMA
Context
Manager
A[30:0]
D[15:0]
Core
CPU
CS[7:0]_N
RW_N
External Bus
Interface
SRAM
Priority
Control
RDY_N
Timers
HLDREQ_N
HLDGNT_N
BE[1:0]_N
OE_N
Execution Unit
TDI
JTAG
TDO
TCK
TMS
Debug
MEMCLK
BA[1:0]
CAS_N
RAS_N
CKE
Peripheral Management Unit
SDRAM
Controller
and
Frame Buffers
10-Bit
8-Channel
ADC
AN[7:0]
VRH
VRL
UIC_0
UIC_1
UIC_2
UIC_3
UIC0[17:0]
UIC1[17:0]
UIC2[17:0]
UIC3[17:0]
Figure 1. Block Diagram for the fido1100
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April 25, 2012
2.
Features
The fido1100 communication controller’s features include:
32-bit Core CPU
CISC architecture optimized for real time
CPU32+ (Motorola® 68000) instruction-set compatible
Five hardware contexts, each with its own register set and interrupt vector table
An 8- or 16-bit external bus interface with programmable chip selects
24 Kbytes of high-speed internal user SRAM
32 Kbytes of high-speed internal user-mappable Relocatable Rapid Execution Memory
(RREM)
A Memory Protection Unit (MPU)
An SDRAM controller
Flat, contiguous memory space
Non-aligned memory access support
Dedicated Peripheral Management Unit (PMU)
Four Universal I/O Controllers (UICs) capable of supporting the following protocols:
– GPIO
– 10/100 Ethernet with flexible MAC Address Filtering schemes
– EIA-232
– CAN
– SPI
– I2C Bus
– SMBus
– HDLC
Two channels of full-featured direct memory access (DMA) with deterministic arbitration
Two Timer/Counter Units (TCU)
A Watchdog timer, system timer, and context timers
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JTAG emulation and debug interface
Available in a 208-pin PQFP, BGA 10- by 10-mm package, and BGA 15- by 15-mm
package
3.3V operation with 5V-tolerant I/O
Industrial temperature grade
Software development supported by libraries and tools including UIC firmware for
various interface protocols and formats, as well as a customized GNU tool set.
2.1
Core CPU
The fido1100 core is based on the CPU32 architecture, and is compatible with the CPU32
instruction set. The fido1100 incorporates five independent hardware contexts. While all
contexts share the same Execution Unit, each of the five hardware contexts in the fido1100 has
its own register set, execution priority and exception vector table. From an application’s view,
this unique feature of the fido1100 allows it to operate as five independent machines in one:
32-bit address and data paths on-chip
66-MHz operation
Instruction execution from external memory or fast internal memory.
Each hardware context has its own copy of:
– Eight 32-bit User Data Registers (D0-D7)
– Seven 32-bit Address Registers (A0-A6)
– Two 32-bit Stack Pointers (A7 and A7')
– One 32-bit Program Counter
– One 16-bit Status Register (SR)
– One 32-bit Vector Base Register (VBR)
2.2
JTAG
The fido1100 is fully compliant with the IEEE 1149.1 Test Access Port and Boundary-Scan
architecture (see Table 2). The fido1100 architecture is equipped with the TAP (Test Access
Port) interface, TAP controller, instruction register, instruction decoder, boundary-scan register,
and by-pass register.
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Table 2. Test Pin Descriptions
Pin
TDO
Direction
In
Description
Test Data Output—The tri-state test data output changing on the falling edge of the
TCK input. This is actively driven only in the shift-DR and shift-IR controller states.
TDI
TMS
In
In
Test Data Input—The test data input sampled on the rising edge of the TCK input.
Test Mode Select Input—The test mode select input used to sequence the TAP
controller state machine. If TMS is a 1 for 5 clock cycles, it sends the TAP controller
into reset. If TMS is 0, the TAP controller goes to IDLE.
TCK
In
Test Clock Input—All JTAG commands and serial data are synchronized by this
signal.
The JTAG Interface is used for controlling the SPIDER Debug Features of the fido1100.
Breakpoints—Eight hardware context-aware breakpoints that can be chained to set up
if/then triggering conditions.
– Hardware breakpoints are enabled in software or over JTAG
Watchpoints—Eight hardware watchpoints.
Trace—Follow program execution with trace buffers.
– Single address, single buffer, and circular buffer trace modes
– Trace buffer can be written anywhere in the address space or to a peripheral
Debug Control—Hardware single-step and context status control.
– Access to all memory and registers that are accessible to software
– Byte, word, and long-word access in full-address mode or offset mode
– Invalid address access (keystroke errors) over JTAG will not kill the session
– Direct programming of FLASH on the evaluation board without target software
support
– Built-in hardware support to halt contexts and execute single instructions without
software
– JTAG access to registers, stack space, etc., even if the processor is halted
Statistical Profiling—SPIDER provides statistical software profiling to identify critical
pieces of code.
2.3
Internal Memory and Memory Management
User SRAM—Internal 24-Kbyte memory that can be used by applications for general
purpose data needs or as trace buffers.
Relocatable Rapid Execution Memory (RREM)—Internal 32-Kbyte memory that can be
used as an instruction source for code that requires maximum execution speed.
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Memory Protection Unit (MPU)—Access-control method for 16 user-configurable blocks
of internal or external memory on a context basis. A block of memory may be
inaccessible, read only or read/write accessible to a selectable set of contexts. The MPU
provides the space partitioning needed in deterministic, real-time systems.
2.4
External Bus Interface
The interface to all external memory. It handles memory interface timing and arbitration of
external bus requests. The external bus interfaces provide all address, data, and control line to
implement either an 8- or 16-bit microcontroller system bus.
Address/data bus
– 31-bit address bus to access up to 2 Gbytes of memory space
– 8- or 16-bit data bus
– Zero-overhead Endian conversion
Chip Selects—Eight programmable chip selects with programmable size, data width, and
timing.
SDRAM Controller—Supports 8- or 16-bit data interfaces to SDRAM and provides the
necessary control signals to interface to external SDRAM. The interface to the external
SDRAM uses the 16-bit-wide data bus and 13 bits of the address bus of the External Bus
Interface. The dedicated clock signal for this interface (MEMCLK) operates at the same
frequency as the internal master clock.
– Operates at a maximum clock rate of 66 MHz
– Executes read, write, pre-charge, auto refresh, power down, and initialize SDRAM
modes
– Fixed, 4-word bursts to/from SDRAM interface
– Periodically issues auto refresh command to prevent SDRAM data loss
External Bus Arbitration—The fido1100 provides signals to allow it to operate in a multi-
bus master environment.
2.5
PMU/UIC/CPU DMA
The PMU, UIC, and CPU DMA work together as a fast data transport scheme that requires
minimal Core CPU overhead or intervention.
Peripheral Management Unit (PMU)—A set of user-configurable buffers for data
transmission and reception via the UICs.
Universal Input/Output Controller (UIC)—Programmable protocol engine.
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The UIC is a very flexible hardware solution designed to support numerous interface
requirements. When working in concert with the on-board Peripheral Management Unit (PMU)
and on-board data buffers, the operation of the interfaces requires little core processor
intervention. This allows the processor to use its bus bandwidth for more important functions
than managing data traffic. The UIC design can support complex protocols such as Ethernet or
GPIO functions.
Four software-configurable UICs
Each supports 10/100 Ethernet, CAN, UART, SPI, I2C, HDLC, or GPIO functionality
Software libraries are provided for various interface protocols and formats
User-programmable integrated 256-location MAC address filter
Dedicated PMU offloads main CPU bus traffic
Large 1K 32 transmit buffer and 2K 32 receive buffers
At a minimum, each UIC can support 1 Ethernet port (MII), 2 UARTs, or 18 GPIO
CPU DMA—Two independent channels of DMA for data transfer
Internal Peripherals
2.6
The fido1100 incorporates the following set of internal peripherals:
2.6.1 Timer Counter Units (TCU)
Two Timer Counter Units (TCU)—The fido1100 is equipped with two Timer Counter
Units.
– Four channels per timer; any channel can be either input capture or output compare.
– Input captures can be either rising or falling edge.
– External signal clocking can be rising edge, falling edge, or both edges of input
signal.
– Output compare can be assert high, assert low, or toggle mode.
– Underflow, overflow, input-capture, or output-compare conditions can trigger an
interrupt.
– Timers can be programmed for auto-stop or auto-reload.
– Timer can generate an internal interrupt to wake up the processor from sleep mode.
– Timer periods in excess of 50 seconds are achievable.
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2.6.2 Analog-to-Digital Converter (ADC)
– 8-channel, 10-bit ADC
– Maximum throughput rate of 200 Kbps
– High- and low-reference voltage pins ensure accuracy and temperature compensation
– Very low 5-mW power consumption and includes a built-in power-down mode
– Single- or multiple-channel conversion scan modes
– Interrupt generated at the end of conversion is assigned a priority and a context
– Interrupts from the analog-to-digital converter can be disabled
2.6.3 Timers
System Timer.
– Provides five periodic System Timer interrupts.
o 16-bit counter with 16-bit prescale allows a range of System Timer interrupts
from 80 nS to 50 seconds with a 66-MHz system clock.
o These interrupts can be assigned to the fast-context switching hardware providing
a zero overhead system executive or the System Timer interrupts can simply
produce a traditional vectored interrupt request to provide a system with basic
timing needs.
Watchdog Timer
– 16-bit counter with an 11-bit prescaler
Context Timers
– Each hardware context has a set of timing registers that can track, specify, and limit
execution time.
2.7
Power Control
All internal peripherals can be put into a low-power consumption mode.
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3.
Libraries and Support Tools
Full library support
UIC libraries
Embedded communication stacks
TCP/IP
GPIO sample programs
Customized GNU tool set
Eclipse IDE
Sourcery G++ from Code Sourcery
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4.
Packaging, Pin Descriptions, and Physical Dimensions
Information on the packages and pin descriptions for the fido1100 communication controller
PQFP, BGA 10- by 10-mm package, and BGA 15- by 15-mm package is provided individually.
Refer to sections, figures, and tables for information on the device of interest.
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4.1
PQFP Package
4.1.1 PQFP Pinout
The pinout for the fido1100 communication controller PQFP package is as shown in Figure 2.
The corresponding pinout is provided in Table 3.
Figure 2. PQFP Package Diagram
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Table 3. PQFP Pin Listing
Pin
1
2
3
4
5
6
7
8
Signal Name
AN_7
AN_6
AN_5
AN_4
AN_3
AN_2
AN_1
AN_0
VRL
Type
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Power
Ground
Input
Input
Input
Power
Input
Description
Analog-to-digital converter input channel 7
Analog-to-digital converter input channel 6
Analog-to-digital converter input channel 5
Analog-to-digital converter input channel 4
Analog-to-digital converter input channel 3
Analog-to-digital converter input channel 2
Analog-to-digital converter input channel 1
Analog-to-digital converter input channel 0
Analog-to-digital converter low-input reference
Analog-to-digital converter high-input reference
Analog supply voltage (+3.3VDC)
Analog ground
9
10
11
12
13
14
15
16
17
18
VRH
VDDA
GNDA
INT0
INT1
INT2
Interrupt_0
Interrupt_1
Interrupt_2
Digital core supply voltage (+2.5VDC)
Interrupt_3
VDDC
INT3
INT4_DMA0_ Bidirectional Muxed pin, Interrupt_4 or DMA channel 0 acknowledge
ACK
19
20
21
INT5_DMA1_ Bidirectional Muxed pin, Interrupt_5 or DMA channel 1 acknowledge
ACK
INT6_DMA0_
REQ
INT7_DMA1_
REQ
Input
Muxed pin, Interrupt_6 or DMA channel 0 request
Muxed pin, Interrupt_7 or DMA channel 1 request
Digital I/O supply voltage (+3.3VDC)
Input
22
23
24
25
26
27
28
29
30
31
32
33
34
35
VDDIO
D0
D1
D2
D3
D4
D5
D6
D7
Power
Bidirectional External Bus Interface data Bit [0]
Bidirectional External Bus Interface data Bit [1]
Bidirectional External Bus Interface data Bit [2]
Bidirectional External Bus Interface data Bit [3]
Bidirectional External Bus Interface data Bit [4]
Bidirectional External Bus Interface data Bit [5]
Bidirectional External Bus Interface data Bit [6]
Bidirectional External Bus Interface data Bit [7]
GND
D8
D9
D10
D11
Ground
Digital ground
Bidirectional External Bus Interface data Bit [8]
Bidirectional External Bus Interface data Bit [9]
Bidirectional External Bus Interface data Bit [10]
Bidirectional External Bus Interface data Bit [11]
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Table 3. PQFP Pin Listing (Continued)
Pin
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
Signal Name
D12
Type
Bidirectional External Bus Interface data Bit [12]
Power Digital I/O supply voltage (+3.3VDC)
Bidirectional External Bus Interface data Bit [13]
Bidirectional External Bus Interface data Bit [14]
Bidirectional External Bus Interface data Bit [15]
Description
VDDIO
D13
D14
D15
RDY_N
GND
Input
Ground
Output
Ground
Output
Output
Output
Power
Output
Output
Output
Output
Ground
Output
Output
Input
External Bus Interface External Ready Indication
Digital ground
Memory clock used by external memory
Digital ground
Byte enable 0, active low
Byte enable 1, active low
Output enable, active low
Digital core supply voltage (+2.5VDC)
Read or write control (active low write)
Bank Enable 0
Bank Enable 1
Column activate signal, active low
Digital Ground
MEMCLK
GND
BE0_N
BE1_N
OE_N
VDDC
RW_N
BA_0
BA_1
CAS_N
GND
RAS_N
CKE
Row activate signal, active low
Clock enable to be used in conjunction with MEMCLK
External Bus hold request, active low
External Bus grant request, active low
Reset input
HOLDREQ_N
HOLDGNT_N
RESET_N
RESET_OUT_N
GND
Output
Input
Output
Ground
Output
Output
Output
Output
Power
Output
Output
Output
Output
Ground
Output
Output
Output
Output
Reset output
Digital ground
A0
A1
A2
A3
VDDIO
A4
A5
A6
A7
GND
A8
A9
A10
External Bus Interface address Bit [0]
External Bus Interface address Bit [1]
External Bus Interface address Bit [2]
External Bus Interface address Bit [3]
Digital I/O supply voltage (+3.3VDC)
External Bus Interface address Bit [4]
External Bus Interface address Bit [5]
External Bus Interface address Bit [6]
External Bus Interface address Bit [7]
Digital ground
External Bus Interface address Bit [8]
External Bus Interface address Bit [9]
External Bus Interface address Bit [10]
External Bus Interface address Bit [11]
A11
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Table 3. PQFP Pin Listing (Continued)
Pin
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
Signal Name
VDDC
A12
Type
Power
Output
Output
Output
Output
Power
Output
Output
Output
Output
Power
Output
Output
Output
Output
Ground
Output
Description
Digital core supply voltage (+2.5VDC)
External Bus Interface address Bit [12]
External Bus Interface address Bit [13]
External Bus Interface address Bit [14]
External Bus Interface address Bit [15]
Digital core supply voltage (+2.5VDC)
External Bus Interface address Bit [16]
External Bus Interface address Bit [17]
External Bus Interface address Bit [18]
External Bus Interface address Bit [19]
Digital I/O supply voltage (+3.3VDC)
External Bus Interface address Bit [20]
External Bus Interface address Bit [21]
External Bus Interface address Bit [22]
External Bus Interface address Bit [23]
Digital ground
A13
A14
A15
VDDC
A16
A17
A18
A19
VDDIO
A20
A21
A22
A23
GND
A24
External Bus Interface address Bit [24]
Muxed pin, External Bus Interface address Bit [25] or POR
counter bypass
A25_RESET_
DELAY
Internal
Pull-up
93
94
95
96
97
A26_SIZE
A27_CS7_N
A28_CS6_N
A29_CS5_N
A30_CS4_N
Internal
Pull-up
Muxed pin, External Bus Interface address Bit [26] or data bus
size select (0 = 8-Bit, 1= 16=Bit)
Muxed pin, External Bus Interface address Bit [27] or Chip select
7 (chip select active low)
Muxed pin, External Bus Interface address Bit [28] or Chip select
6 (chip select active low)
Muxed pin, External Bus Interface address Bit [29] or Chip select
5 (chip select active low)
Output
Output
Output
Output
Muxed pin, External Bus Interface address Bit [30] or Chip select
4 (chip select active low)
98
99
CS0_N
CS1_N
CS2_N
CS3_N
TDI
TDO
TCK
TMS
Output
Output
Output
Output
Input
Output
Input
Input
Chip select 0 (chip select active low)
Chip select 1 (chip select active low)
Chip select 2 (chip select active low)
Chip select 3 (chip select active low)
JTAG data input
JTAG data output
JTAG clock input
JTAG control signal
Digital core supply voltage (+2.5VDC)
100
101
102
103
104
105
106
107
108
VDDC
UIC0_0
UIC0_1
Power
Bidirectional Universal I/O Controller 0, pin 0
Bidirectional Universal I/O Controller 0, pin 1
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Table 3. PQFP Pin Listing (Continued)
Pin
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
Signal Name
UIC0_2
UIC0_3
GND
UIC0_4
UIC0_5
UIC0_6
UIC0_7
UIC0_8
VDDCLK
XTAL0
Type
Description
Bidirectional Universal I/O Controller 0, pin 2
Bidirectional Universal I/O Controller 0, pin 3
Ground
Digital ground
Bidirectional Universal I/O Controller 0, pin 4
Bidirectional Universal I/O Controller 0, pin 5
Bidirectional Universal I/O Controller 0, pin 6
Bidirectional Universal I/O Controller 0, pin 7
Bidirectional Universal I/O Controller 0, pin 8
Power supply Power Supply for the Crystal Oscillator (+2.5VDC)
Clock
Clock
Ground
Crystal input pin 0 (Osc. In)
Crystal input/output pin 1 (Osc. Out)
Digital ground
XTAL1
GNDCLK
UIC0_9
UIC0_10
UIC0_11
UIC0_12
UIC0_13
UIC0_14
UIC0_15
UIC0_16
UIC0_17
GND
UIC1_0
UIC1_1
UIC1_2
UIC1_3
VDDIO
UIC1_4
UIC1_5
UIC1_6
UIC1_7
UIC1_8
UIC1_9
VDDC
UIC1_10
UIC1_11
UIC1_12
UIC1_13
UIC1_14
Bidirectional Universal I/O Controller 0, pin 9
Bidirectional Universal I/O Controller 0, pin 10
Bidirectional Universal I/O Controller 0, pin 11
Bidirectional Universal I/O Controller 0, pin 12
Bidirectional Universal I/O Controller 0, pin 13
Bidirectional Universal I/O Controller 0, pin 14
Bidirectional Universal I/O Controller 0, pin 15
Bidirectional Universal I/O Controller 0, pin 16
Bidirectional Universal I/O Controller 0, pin 17
Ground
Digital ground
Bidirectional Universal I/O Controller 1, pin 0
Bidirectional Universal I/O Controller 1, pin 1
Bidirectional Universal I/O Controller 1, pin 2
Bidirectional Universal I/O Controller 1, pin 3
Power
Digital I/O supply voltage (+3.3VDC)
Bidirectional Universal I/O Controller 1, pin 4
Bidirectional Universal I/O Controller 1, pin 5
Bidirectional Universal I/O Controller 1, pin 6
Bidirectional Universal I/O Controller 1, pin 7
Bidirectional Universal I/O Controller 1, pin 8
Bidirectional Universal I/O Controller 1, pin 9
Power
Digital core supply voltage (+2.5VDC)
Bidirectional Universal I/O Controller 1, pin 10
Bidirectional Universal I/O Controller 1, pin 11
Bidirectional Universal I/O Controller 1, pin 12
Bidirectional Universal I/O Controller 1, pin 13
Bidirectional Universal I/O Controller 1, pin 14
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Table 3. PQFP Pin Listing (Continued)
Pin
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162
163
164
165
166
167
168
169
170
171
172
173
174
175
176
177
178
179
180
181
182
183
184
185
186
Signal Name
GND
Type
Ground
Description
Digital ground
UIC1_15
UIC1_16
UIC1_17
VDDIO
UIC2_0
UIC2_1
UIC2_2
UIC2_3
VDDC
UIC2_4
UIC2_5
UIC2_6
UIC2_7
GND
UIC2_8
UIC2_9
UIC2_10
UIC2_11
VDDIO
UIC2_12
UIC2_13
UIC2_14
UIC2_15
GND
UIC2_16
UIC2_17
UIC3_0
UIC3_1
VDDC
Bidirectional Universal I/O Controller 1, pin 15
Bidirectional Universal I/O Controller 1, pin 16
Bidirectional Universal I/O Controller 1, pin 17
Power
Digital I/O supply voltage (+3.3VDC)
Bidirectional Universal I/O Controller 2, pin 0
Bidirectional Universal I/O Controller 2, pin 1
Bidirectional Universal I/O Controller 2, pin 2
Bidirectional Universal I/O Controller 2, pin 3
Power
Digital core supply voltage (+2.5VDC)
Bidirectional Universal I/O Controller 2, pin 4
Bidirectional Universal I/O Controller 2, pin 5
Bidirectional Universal I/O Controller 2, pin 6
Bidirectional Universal I/O Controller 2, pin 7
Ground
Digital ground
Bidirectional Universal I/O Controller 2, pin 8
Bidirectional Universal I/O Controller 2, pin 9
Bidirectional Universal I/O Controller 2, pin 10
Bidirectional Universal I/O Controller 2, pin 11
Power
Digital I/O supply voltage (+3.3VDC)
Bidirectional Universal I/O Controller 2, pin 12
Bidirectional Universal I/O Controller 2, pin 13
Bidirectional Universal I/O Controller 2, pin 14
Bidirectional Universal I/O Controller 2, pin 15
Ground
Digital ground
Bidirectional Universal I/O Controller 2, pin 16
Bidirectional Universal I/O Controller 2, pin 17
Bidirectional Universal I/O Controller 3 pin 0
Bidirectional Universal I/O Controller 3 pin 1
Power
Digital core supply voltage (+2.5VDC)
UIC3_2
UIC3_3
UIC3_4
UIC3_5
GND
UIC3_6
UIC3_7
UIC3_8
UIC3_9
Bidirectional Universal I/O Controller 3 pin 2
Bidirectional Universal I/O Controller 3 pin 3
Bidirectional Universal I/O Controller 3 pin 4
Bidirectional Universal I/O Controller 3 pin 5
Ground
Digital ground
Bidirectional Universal I/O Controller 3 pin 6
Bidirectional Universal I/O Controller 3 pin 7
Bidirectional Universal I/O Controller 3 pin 8
Bidirectional Universal I/O Controller 3 pin 9
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Table 3. PQFP Pin Listing (Continued)
Pin
187
188
189
190
191
192
193
194
195
196
Signal Name
VDDIO
Type
Power
Description
Digital I/O supply voltage (+3.3VDC)
UIC3_10
UIC3_11
UIC3_12
UIC3_13
GND
UIC3_14
UIC3_15
UIC3_16
UIC3_17
Bidirectional Universal I/O Controller 3 pin 10
Bidirectional Universal I/O Controller 3 pin 11
Bidirectional Universal I/O Controller 3 pin 12
Bidirectional Universal I/O Controller 3 pin 13
Ground
Digital Ground
Bidirectional Universal I/O Controller 3 pin 14
Bidirectional Universal I/O Controller 3 pin 15
Bidirectional Universal I/O Controller 3 pin 16
Bidirectional Universal I/O Controller 3 pin 17
197 T0IC0_T0OC0 Bidirectional Muxed pin, Timer Counter Unit 0 input capture 0 or output
compare 0
198 T0IC1_T0OC1 Bidirectional Muxed pin, Timer Counter Unit 0 input capture 1 or output
compare 1
199 T0IC2_T0OC2 Bidirectional Muxed pin, Timer Counter Unit 0 input capture 2 or output
compare 2
200 T0IC3_T0OC3 Bidirectional Muxed pin, Timer Counter Unit 0 input capture 3 or output
compare 3
201
GND
Ground
Digital ground
202 T1IC0_T1OC0 Bidirectional Muxed pin, Timer Counter Unit 1 input capture 0 or output
compare 0
203 T1IC1_T1OC1 Bidirectional Muxed pin, Timer Counter Unit 1 input capture 1 or output
compare 1
204 T1IC2_T1OC2 Bidirectional Muxed pin, Timer Counter Unit 1 input capture 2 or output
compare 2
205 T1IC3_T1OC3 Bidirectional Muxed pin, Timer Counter Unit 1 input capture 3 or output
compare 3
206
207
208
VDDC
T0IN
T1IN
Power
Input
Input
Digital core supply voltage (+2.5VDC)
Timer Counter Unit 0 external clock source
Timer Counter Unit 1 external clock source
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4.1.2 PQFP Physical Dimensions
The physical dimensions for the 208-pin PQFP package are as shown in Figure 3.
Legend:
Dimension in mm
Dimension in Inches
Symbol
Min Nom
Max
4.07
–
Min Nom
Max
0.160
–
A
A1
A2
b
–
0.25
–
–
–
–
–
0.010
3.15 3.23
3.30 0.124 0.127 0.130
0.28 0.007
0.23 0.005
0.18
0.13
–
–
–
–
0.011
0.009
c
D
E
27.90 28.00 28.10 1.098 1.102 1.106
27.90 28.00 28.10 1.098 1.102 1.106
e
0.50 BSC
0.020 BSC
HD
HE
L
L1
y
30.35 30.60 30.85 1.195 1.205 1.215
30.35 30.60 30.85 1.195 1.205 1.215
0.35 0.50
1.30 REF
0.65 0.014 0.020 0.026
0.051 REF
–
0°
–
–
0.19
7°
–
0°
–
–
0.004
7°
Θ
Notes:
1. Dimension D & E do not include interlead flash.
2. Dimension B does not include damper protrusion/intrusion.
3. Controlling dimension: mm
4. General appearance spec. should be based on visual inspection spec.
Figure 3. PQFP Physical Package Dimensions
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4.2
BGA 10- by 10-mm Package
4.2.1 BGA 10- by 10-mm Pinout
The pinout for the fido1100 communication controller BGA 10- by 10-mm package is as
shown in Figure 4. The corresponding pinout is provided in Table 4.
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1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
T1IC2_ T0IC3_ T0IC0_
T1OC2 T0OC3 T0OC0
A
B
C
D
E
F
T1IN
T0IN
UIC3_16 GND UIC3_11 UIC3_8 UIC3_5 UIC3_2
UIC2_17 UIC2_14 UIC2_11 UIC2_8 UIC2_4
A
T1IC1_ T0IC2_
T1OC1 T0OC2
AN_7
AN_5
AN_3
AN_0
INT0
AN_6
AN_4
AN_1
VRH
T1IC3_T1OC3
AN_2
UIC3_17 UIC3_15 UIC3_13 UIC3_10 UIC3_6 UIC3_4 UIC3_1
UIC3_14 UIC3_12 UIC3_9 UIC3_7 UIC3_3 UIC3_0 UIC2_15
UIC2_16 UIC2_13 UIC2_9
UIC2_12 UIC2_10 UIC2_7
UIC2_6 UIC2_5 UIC2_3 B
UIC2_0 UIC2_1 UIC2_2 C
UIC1_13 UIC1_16 UIC1_17 D
UIC1_10 UIC1_15 UIC1_14 E
UIC1_7 UIC1_12 UIC1_11 F
UIC1_4 UIC1_9 UIC1_8 G
UIC1_1 UIC1_6 UIC1_5 H
UIC0_16 UIC1_3 UIC1_2 J
UIC0_15 UIC1_0 UIC0_17 K
UIC0_12 UIC0_13 UIC0_14 L
VDDIO UIC0_10 UIC0_11 M
UIC0_8 UIC0_9 XTAL1 N
T1IC0_ T0IC1_
T1OC0 T0OC1
VRL
INT1
INT4_DMA0_
ACK
INT2
INT6_DMA0_ INT7_DMA1_
G
H
J
INT3
VDDA VDDC VDDIO VDDC VDDC VDDIO
REQ
REQ
INT5_DMA1_
ACK
D1
D2
GNDA
VDDC
VDDIO
VDDC
VDDIO
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
VDDC
VDDC
VDDIO
D0
D3
D4
D5
D8
K
L
D7
D6
D10
D11
GND
GND GNDCLK VDDCLK
M
N
P
R
T
D9
D13
D14
GND VDDC VDDC
VDDC
D12
RDY_N
BE0_N
RW_N
CAS_N
RAS_N
GND
D15
BE1_N
BA_0
UIC0_5 UIC0_7 XTAL0 P
MEMCLK
OE_N
BA_1
UIC0_2 UIC0_4 UIC0_6 R
A30_CS4_N TDI UIC0_1 UIC0_3 T
RESET_
A2
A29_
CS5_N
HOLDREQ_N
HOLDGNT_N
A5
A6
A8
A9
A11
A12
A14
A15
A17
A18
A20
A21
A23
A24
A26_SIZE
OUT_N
U
V
A0
A3
A27_CS7_N CS1_N
CS2_N
TDO
TMS UIC0_0 U
A25_RESET_ A28_
GND
2
CKE
3
RESET_N A1
A4
6
A7
7
A10
8
A13
9
A16
10
A19
11
A22
12
CS0_N
15
CS3_N
16
TCK
17
V
DELAY
13
CS6_N
14
1
4
5
18
= Signals.
= Indicates power.
= Indicates ground.
Figure 4. BGA 10- by 10-mm Package Diagram
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Table 4. BGA 10- by 10-mm Package Pin Listing
Pin
B1
B2
C1
C2
D1
C3
D2
E1
D3
E2
G7
H7
F1
E3
F2
G8
G1
F3
Signal Name
AN_7
AN_6
AN_5
AN_4
AN_3
AN_2
AN_1
AN_0
VRL
Type
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Power
Ground
Input
Input
Input
Power
Input
Description
Analog-to-digital converter input channel 7
Analog-to-digital converter input channel 6
Analog-to-digital converter input channel 5
Analog-to-digital converter input channel 4
Analog-to-digital converter input channel 3
Analog-to-digital converter input channel 2
Analog-to-digital converter input channel 1
Analog-to-digital converter input channel 0
Analog-to-digital converter low-input reference
Analog-to-digital converter high-input reference
Analog supply voltage (+3.3VDC)
Analog ground
VRH
VDDA
GNDA
INT0
INT1
INT2
Interrupt_0
Interrupt_1
Interrupt_2
Digital core supply voltage (+2.5VDC)
Interrupt_3
VDDC
INT3
INT4_DMA0_ Bidirectional Muxed pin, Interrupt_4 or DMA channel 0 acknowledge
ACK
H1
G2
G3
INT5_DMA1_ Bidirectional Muxed pin, Interrupt_5 or DMA channel 1 acknowledge
ACK
INT6_DMA0_
REQ
INT7_DMA1_
REQ
Input
Muxed pin, Interrupt_6 or DMA channel 0 request
Muxed pin, Interrupt_7 or DMA channel 1 request
Digital I/O supply voltage (+3.3VDC)
Input
G9
J1
H2
H3
K1
J2
VDDIO
D0
D1
D2
D3
D4
D5
D6
D7
Power
Bidirectional External Bus Interface data Bit [0]
Bidirectional External Bus Interface data Bit [1]
Bidirectional External Bus Interface data Bit [2]
Bidirectional External Bus Interface data Bit [3]
Bidirectional External Bus Interface data Bit [4]
Bidirectional External Bus Interface data Bit [5]
Bidirectional External Bus Interface data Bit [6]
Bidirectional External Bus Interface data Bit [7]
J3
L1
K2
H8
K3
M1
L2
L3
GND
D8
D9
D10
D11
Ground
Digital ground
Bidirectional External Bus Interface data Bit [8]
Bidirectional External Bus Interface data Bit [9]
Bidirectional External Bus Interface data Bit [10]
Bidirectional External Bus Interface data Bit [11]
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Table 4. BGA 10- by 10-mm Pin Listing (Continued)
Pin
N1
G12
M2
M3
P1
N2
N3
R1
H9
P2
P3
T1
G10
R2
R3
U1
T2
V2
U2
V3
T3
U3
V4
T4
H10
U4
V5
T5
U5
K7
V6
T6
U6
V7
H11
T7
Signal Name
D12
Type
Bidirectional External Bus Interface data Bit [12]
Power Digital I/O supply voltage (+3.3VDC)
Bidirectional External Bus Interface data Bit [13]
Bidirectional External Bus Interface data Bit [14]
Bidirectional External Bus Interface data Bit [15]
Description
VDDIO
D13
D14
D15
RDY_N
GND
Input
Ground
Output
Ground
Output
Output
Output
Power
Output
Output
Output
Output
Ground
Output
Output
Input
External Bus Interface External Ready Indication
Digital ground
Memory clock used by external memory
Digital ground
Byte enable 0, active low
Byte enable 1, active low
Output enable, active low
Digital core supply voltage (+2.5VDC)
Read or write control (active low write)
Bank Enable 0
Bank Enable 1
Column activate signal, active low
Digital Ground
MEMCLK
GND
BE0_N
BE1_N
OE_N
VDDC
RW_N
BA_0
BA_1
CAS_N
GND
RAS_N
CKE
Row activate signal, active low
Clock enable to be used in conjunction with MEMCLK
External Bus hold request, active low
External Bus grant request, active low
Reset input
HOLDREQ_N
HOLDGNT_N
RESET_N
RESET_OUT_N
GND
Output
Input
Output
Ground
Output
Output
Output
Output
Power
Output
Output
Output
Output
Ground
Output
Output
Output
Reset output
Digital ground
A0
A1
A2
A3
VDDIO
A4
A5
A6
A7
GND
A8
A9
A10
External Bus Interface address Bit [0]
External Bus Interface address Bit [1]
External Bus Interface address Bit [2]
External Bus Interface address Bit [3]
Digital I/O supply voltage (+3.3VDC)
External Bus Interface address Bit [4]
External Bus Interface address Bit [5]
External Bus Interface address Bit [6]
External Bus Interface address Bit [7]
Digital ground
External Bus Interface address Bit [8]
External Bus Interface address Bit [9]
External Bus Interface address Bit [10]
U7
V8
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Table 4. BGA 10- by 10-mm Pin Listing (Continued)
Pin
T8
G11
U8
V9
T9
Signal Name
A11
Type
Output
Power
Output
Output
Output
Output
Power
Output
Output
Output
Output
Power
Output
Output
Output
Output
Ground
Output
Description
External Bus Interface address Bit [11]
Digital core supply voltage (+2.5VDC)
External Bus Interface address Bit [12]
External Bus Interface address Bit [13]
External Bus Interface address Bit [14]
External Bus Interface address Bit [15]
Digital core supply voltage (+2.5VDC)
External Bus Interface address Bit [16]
External Bus Interface address Bit [17]
External Bus Interface address Bit [18]
External Bus Interface address Bit [19]
Digital I/O supply voltage (+3.3VDC)
External Bus Interface address Bit [20]
External Bus Interface address Bit [21]
External Bus Interface address Bit [22]
External Bus Interface address Bit [23]
Digital ground
VDDC
A12
A13
A14
A15
VDDC
A16
A17
A18
A19
VDDIO
A20
A21
A22
A23
U9
H12
V10
T10
U10
V11
K12
T11
U11
V12
T12
J8
GND
A24
U12
External Bus Interface address Bit [24]
V13 A_25_RESET_
DELAY
Internal
Pull-up
Muxed pin, External Bus Interface address Bit [25] or POR
counter bypass
T13
U13
V14
T14
T15
A_26_SIZE
A27_CS7_N
A28_CS6_N
A29_CS5_N
A30_CS4_N
Internal
Pull-up
Muxed pin, External Bus Interface address Bit [26] or data bus
size select (0 = 8-Bit, 1= 16=Bit)
Muxed pin, External Bus Interface address Bit [27] or Chip
select 7 (chip select active low)
Muxed pin, External Bus Interface address Bit [28] or Chip
select 6 (chip select active low)
Muxed pin, External Bus Interface address Bit [29] or Chip
select 5 (chip select active low)
Output
Output
Output
Output
Muxed pin, External Bus Interface address Bit [30] or Chip
select 4 (chip select active low)
V15
U14
U15
V16
T16
U16
V17
U17
J12
CS0_N
CS1_N
CS2_N
CS3_N
TDI
TDO
TCK
TMS
VDDC
Output
Output
Output
Output
Input
Output
Input
Input
Chip select 0 (chip select active low)
Chip select 1 (chip select active low)
Chip select 2 (chip select active low)
Chip select 3 (chip select active low)
JTAG data input
JTAG data output
JTAG clock input
JTAG control signal
Digital core supply voltage (+2.5VDC)
Power
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Table 4. BGA 10- by 10-mm Pin Listing (Continued)
Pin
U18
T17
R16
T18
K8
Signal Name
UIC0_0
UIC0_1
UIC0_2
UIC0_3
GND
Type
Description
Bidirectional Universal I/O Controller 0, pin 0
Bidirectional Universal I/O Controller 0, pin 1
Bidirectional Universal I/O Controller 0, pin 2
Bidirectional Universal I/O Controller 0, pin 3
Ground
Digital ground
R17
P16
R18
P17
N16
L12
P18
N18
L11
N17
M17
M18
L16
L17
L18
K16
J16
K18
K11
K17
H16
J18
J17
M7
UIC0_4
UIC0_5
UIC0_6
UIC0_7
UIC0_8
VDDCLK
XTAL0
Bidirectional Universal I/O Controller 0, pin 4
Bidirectional Universal I/O Controller 0, pin 5
Bidirectional Universal I/O Controller 0, pin 6
Bidirectional Universal I/O Controller 0, pin 7
Bidirectional Universal I/O Controller 0, pin 8
Power supply Power Supply for the Crystal Oscillator (+2.5VDC)
Clock
Clock
Ground
Crystal input pin 0 (Osc. In)
Crystal input/output pin 1 (Osc. Out)
Digital ground
XTAL1
GNDCLK
UIC0_9
UIC0_10
UIC0_11
UIC0_12
UIC0_13
UIC0_14
UIC0_15
UIC0_16
UIC0_17
GND
UIC1_0
UIC1_1
UIC1_2
UIC1_3
VDDIO
Bidirectional Universal I/O Controller 0, pin 9
Bidirectional Universal I/O Controller 0, pin 10
Bidirectional Universal I/O Controller 0, pin 11
Bidirectional Universal I/O Controller 0, pin 12
Bidirectional Universal I/O Controller 0, pin 13
Bidirectional Universal I/O Controller 0, pin 14
Bidirectional Universal I/O Controller 0, pin 15
Bidirectional Universal I/O Controller 0, pin 16
Bidirectional Universal I/O Controller 0, pin 17
Ground
Digital ground
Bidirectional Universal I/O Controller 1, pin 0
Bidirectional Universal I/O Controller 1, pin 1
Bidirectional Universal I/O Controller 1, pin 2
Bidirectional Universal I/O Controller 1, pin 3
Power
Digital I/O supply voltage (+3.3VDC)
G16
H18
H17
F16
G18
G17
M12
E16
F18
UIC1_4
UIC1_5
UIC1_6
UIC1_7
UIC1_8
UIC1_9
VDDC
Bidirectional Universal I/O Controller 1, pin 4
Bidirectional Universal I/O Controller 1, pin 5
Bidirectional Universal I/O Controller 1, pin 6
Bidirectional Universal I/O Controller 1, pin 7
Bidirectional Universal I/O Controller 1, pin 8
Bidirectional Universal I/O Controller 1, pin 9
Power
Digital core supply voltage (+2.5VDC)
UIC1_10
UIC1_11
Bidirectional Universal I/O Controller 1, pin 10
Bidirectional Universal I/O Controller 1, pin 11
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Table 4. BGA 10- by 10-mm Pin Listing (Continued)
Pin
F17
D16
E18
L8
Signal Name
UIC1_12
UIC1_13
UIC1_14
GND
Type
Description
Bidirectional Universal I/O Controller 1, pin 12
Bidirectional Universal I/O Controller 1, pin 13
Bidirectional Universal I/O Controller 1, pin 14
Ground
Digital ground
E17
D17
D18
M16
C16
C17
C18
B18
M11
A17
B17
B16
C15
L9
UIC1_15
UIC1_16
UIC1_17
VDDIO
UIC2_0
UIC2_1
UIC2_2
UIC2_3
VDDC
UIC2_4
UIC2_5
UIC2_6
UIC2_7
GND
Bidirectional Universal I/O Controller 1, pin 15
Bidirectional Universal I/O Controller 1, pin 16
Bidirectional Universal I/O Controller 1, pin 17
Power
Digital I/O supply voltage (+3.3VDC)
Bidirectional Universal I/O Controller 2, pin 0
Bidirectional Universal I/O Controller 2, pin 1
Bidirectional Universal I/O Controller 2, pin 2
Bidirectional Universal I/O Controller 2, pin 3
Power
Digital core supply voltage (+2.5VDC)
Bidirectional Universal I/O Controller 2, pin 4
Bidirectional Universal I/O Controller 2, pin 5
Bidirectional Universal I/O Controller 2, pin 6
Bidirectional Universal I/O Controller 2, pin 7
Ground
Digital ground
A16
B15
C14
A15
C13
B14
A14
C12
L10
B13
A13
C11
B12
M10
A12
C10
B11
A11
J11
UIC2_8
UIC2_9
UIC2_10
UIC2_11
UIC2_12
UIC2_13
UIC2_14
UIC2_15
GND
UIC2_16
UIC2_17
UIC3_0
UIC3_1
VDDC
Bidirectional Universal I/O Controller 2, pin 8
Bidirectional Universal I/O Controller 2, pin 9
Bidirectional Universal I/O Controller 2, pin 10
Bidirectional Universal I/O Controller 2, pin 11
Bidirectional Universal I/O Controller 2, pin 12
Bidirectional Universal I/O Controller 2, pin 13
Bidirectional Universal I/O Controller 2, pin 14
Bidirectional Universal I/O Controller 2, pin 15
Ground
Digital ground
Bidirectional Universal I/O Controller 2, pin 16
Bidirectional Universal I/O Controller 2, pin 17
Bidirectional Universal I/O Controller 3 pin 0
Bidirectional Universal I/O Controller 3 pin 1
Power
Digital core supply voltage (+2.5VDC)
UIC3_2
UIC3_3
UIC3_4
UIC3_5
GND
Bidirectional Universal I/O Controller 3 pin 2
Bidirectional Universal I/O Controller 3 pin 3
Bidirectional Universal I/O Controller 3 pin 4
Bidirectional Universal I/O Controller 3 pin 5
Ground
Digital ground
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Table 4. BGA 10- by 10-mm Pin Listing (Continued)
Pin
B10
C9
A10
C8
B9
A9
C7
B8
A8
C6
B7
A7
B6
A6
Signal Name
UIC3_6
Type
Description
Bidirectional Universal I/O Controller 3 pin 6
Bidirectional Universal I/O Controller 3 pin 7
Bidirectional Universal I/O Controller 3 pin 8
Bidirectional Universal I/O Controller 3 pin 9
Bidirectional Universal I/O Controller 3 pin 10
Bidirectional Universal I/O Controller 3 pin 11
Bidirectional Universal I/O Controller 3 pin 12
Bidirectional Universal I/O Controller 3 pin 13
UIC3_7
UIC3_8
UIC3_9
UIC3_10
UIC3_11
UIC3_12
UIC3_13
GND
UIC3_14
UIC3_15
UIC3_16
UIC3_17
Ground
Digital Ground
Bidirectional Universal I/O Controller 3 pin 14
Bidirectional Universal I/O Controller 3 pin 15
Bidirectional Universal I/O Controller 3 pin 16
Bidirectional Universal I/O Controller 3 pin 17
T0IC0_T0OC0 Bidirectional Muxed pin, Timer Counter Unit 0 input capture 0 or output
compare 0
C5
B5
A5
T0IC1_T0OC1 Bidirectional Muxed pin, Timer Counter Unit 0 input capture 1 or output
compare 1
T0IC2_T0OC2 Bidirectional Muxed pin, Timer Counter Unit 0 input capture 2 or output
compare 2
T0IC3_T0OC3 Bidirectional Muxed pin, Timer Counter Unit 0 input capture 3 or output
compare 3
M8
C4
GND
Ground
Digital ground
T1IC0_T1OC0 Bidirectional Muxed pin, Timer Counter Unit 1 input capture 0 or output
compare 0
B4
A4
B3
T1IC1_T1OC1 Bidirectional Muxed pin, Timer Counter Unit 1 input capture 1 or output
compare 1
T1IC2_T1OC2 Bidirectional Muxed pin, Timer Counter Unit 1 input capture 2 or output
compare 2
T1IC3_T1OC3 Bidirectional Muxed pin, Timer Counter Unit 1 input capture 3 or output
compare 3
L7
A3
A2
M9
J7
VDDC
T0IN
T1IN
GND
VDDC
Power
Input
Input
Ground
Power
Digital core supply voltage (+2.5VDC)
Timer Counter Unit 0 external clock source
Timer Counter Unit 1 external clock source
Digital Ground
Digital core supply voltage (+2.5VDC)
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4.2.2 BGA 10- by 10-mm Physical Package Dimensions
The physical dimensions for the BGA 10- by 10-mm package are as shown in Figure 5.
Notes:
1. Controlling dimension:
Millimeter.
. Primary datum C and seating
plane are defined by the spherical
crowns of the solder balls.
. Dimension b is measured at the
maximum solder ball diameter,
parallel to primary datum C.
4. There shall be a minimum
clearance of 0.25mm between the
edge of the solder ball and the
body edge.
5. Special Characteristics C Class:
bbb ddd.
. The pattern of pin 1 fiducial is
for reference only.
Legend:
Dimension in mm
NOM
–
Dimension in Inches
Symbol
A
A1
A2
c
D
E
D1
E1
e
MIN
–
MAX
1.20
0.26
0.94
0.4
MIN
–
NOM
–
MAX
0.047
0.16
0.84
0.32
9.90
9.90
–
–
–
0.25
–
–
0.21
0.89
0.36
0.006
0.033
0.013
0.008
0.035
0.014
0.394
0.394
0.335
0.335
0.020
0.012
0.004
0.004
0.003
0.006
0.002
18/18
0.010
0.037
0.016
0.398
0.398
–
–
–
10.00
10.00
8.50
10.10 0.390
10.10 0.390
–
–
–
0.35
–
–
–
–
–
–
–
–
–
8.50
0.50
0.30
0.10
0.10
0.08
0.15
0.05
b
0.010
0.014
aaa
bbb
ddd
eee
fff
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
MD/ME
18/18
Figure 5. BGA 10- by 10-mm Physical Package Dimensions
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4.3
BGA 15- by 15-mm Package
4.3.1 BGA 15- by 15-mm Pinout
The pinout for the fido1100 communication controller BGA 15- by 15-mm package is as
shown in Figure 6. The corresponding pinout is provided in Table 5.
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1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
A
T1IC1_
T1OC1
T0IC2_
T0OC2
T0IC0_
T0OC0
A
B
C
D
E
F
UIC3_15 UIC3_13 UIC3_12 UIC3_9 UIC3_7 UIC3_4 UIC3_1 UIC3_0 UIC2_15
UIC2_13
UIC2_10 UIC2_7 UIC2_6 UIC1_17
T1IC2_
T1OC2
T1IC0_ T0IC1_
T1OC0 T0OC1
AN_2
AN_0
VDDA
GNDA
INT2
UIC3_16
GND
UIC3_11 UIC3_8 UIC3_5 UIC3_2 UIC2_17 UIC2_14
UIC2_11
UIC2_9
GND
UIC2_8
UIC2_4
GND
UIC2_5 UIC2_0 UIC1_14 B
UIC2_1 UIC1_16 UIC1_12 C
UIC2_2 UIC1_13 UIC1_9 D
UIC1_15 UIC1_10 UIC1_6 E
UIC1_11 UIC1_8 UIC1_5 F
T1IC3_
T0IN
T0IC3_
T0OC3
AN_5
AN_1
VRH
INT0
UIC3_17 UIC3_14 UIC3_10 UIC3_6 UIC3_3 UIC2_16 UIC2_12
T1OC3
AN_6
AN_3
VRL
GND
GND
AN_7
GND
T1IN
VDDC
VDDC VDDC VDDIO VDDIO
VDDIO
GND
UIC2_3
INT4_
DMA0_
ACK
INT7_
DMA1_
REQ
G
H
INT3
INT1
AN_4
VDDIO
VDDIO
UIC1_7 UIC1_4 UIC1_2 G
UIC1_3 UIC1_1 UIC1_0 H
INT6_
DMA0_
REQ
INT5_
DMA1_ VDDC
ACK
J
K
L
D0
D3
D1
D4
D2
D6
VDDIO
VDDIO
OE_N
VDDIO
VDDC
VDDC
UIC0_17 UIC0_16 UIC0_15 J
UIC0_14 UIC0_13 UIC0_12 K
UIC0_10 UIC0_9 UIC0_11 L
D5
D7
D11
M
N
P
R
T
D8
D10
D15 CAS_N
BE1_N GND
GNDCLK VDDCLK UIC0_8 XTAL1
M
N
D9
D13
GND
GND
UIC0_5 UIC0_7 XTAL0
D12
D14
GND
RDY_N
BE0_N
RW_N
BA_1
GND
GND
GND RESET_N VDDIO VDDC VDDC
A21
A26_SIZE
GND
UIC0_0 UIC0_4 UIC0_6 P
CS2_N UIC0_2 UIC0_3 R
BA_0 RAS_N HOLDGNT_N
RESET_
A3
A5
A6
A8
A10
A11
A15
A14
A18
A17
A22 A27_CS7_N A29_CS5_N
CS3_N
CS0_N
CKE
A2
A20
A24
A28_CS6_N
CS1_N
TCK
UIC0_1 T
OUT_N
A25_RESET_
DELAY
U MEMCLK HOLDREQ_N A0
A1
4
A4
5
A7
6
A9
7
A12
8
A13
9
A16
10
A19
11
A23
12
A30_CS4_N
14
TDI
15
TDO
16
TMS
17
U
1
2
3
13
= Signals.
= Indicates power.
= Indicates ground.
Figure 6. BGA 15- by 15-mm Package Diagram
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Table 5. BGA 15- by 15-mm Package Pin Listing
Pin
F4
D3
C2
G4
E3
B1
D2
C1
F3
E2
D1
E1
F2
G3
F1
D7
G2
G1
Signal Name
AN_7
AN_6
AN_5
AN_4
AN_3
AN_2
AN_1
AN_0
VRL
Type
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Power
Ground
Input
Input
Input
Power
Input
Description
Analog-to-digital converter input channel 7
Analog-to-digital converter input channel 6
Analog-to-digital converter input channel 5
Analog-to-digital converter input channel 4
Analog-to-digital converter input channel 3
Analog-to-digital converter input channel 2
Analog-to-digital converter input channel 1
Analog-to-digital converter input channel 0
Analog-to-digital converter low-input reference
Analog-to-digital converter high-input reference
Analog supply voltage (+3.3VDC)
Analog ground
VRH
VDDA
GNDA
INT0
INT1
INT2
Interrupt_0
Interrupt_1
Interrupt_2
Digital core supply voltage (+2.5VDC)
Interrupt_3
VDDC
INT3
INT4_DMA0_ Bidirectional Muxed pin, Interrupt_4 or DMA channel 0 acknowledge
ACK
H3
H2
H1
INT5_DMA1_ Bidirectional Muxed pin, Interrupt_5 or DMA channel 1 acknowledge
ACK
INT6_DMA0_
REQ
INT7_DMA1_
REQ
Input
Muxed pin, Interrupt_6 or DMA channel 0 request
Muxed pin, Interrupt_7 or DMA channel 1 request
Digital I/O supply voltage (+3.3VDC)
Input
D10
J1
J2
VDDIO
D0
Power
Bidirectional External Bus Interface data Bit [0]
Bidirectional External Bus Interface data Bit [1]
Bidirectional External Bus Interface data Bit [2]
Bidirectional External Bus Interface data Bit [3]
Bidirectional External Bus Interface data Bit [4]
Bidirectional External Bus Interface data Bit [5]
Bidirectional External Bus Interface data Bit [6]
Bidirectional External Bus Interface data Bit [7]
D1
D2
D3
D4
D5
D6
D7
J3
K1
K2
L1
K3
L2
D4
M1
N1
M2
L3
GND
D8
D9
D10
D11
Ground
Digital ground
Bidirectional External Bus Interface data Bit [8]
Bidirectional External Bus Interface data Bit [9]
Bidirectional External Bus Interface data Bit [10]
Bidirectional External Bus Interface data Bit [11]
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Table 5. BGA 15- by 15-mm Package Pin Listing (Continued)
Pin
P1
D11
N2
R1
M3
P2
T1
U1
D5
R2
N3
L4
Signal Name
D12
Type
Bidirectional External Bus Interface data Bit [12]
Power Digital I/O supply voltage (+3.3VDC)
Bidirectional External Bus Interface data Bit [13]
Bidirectional External Bus Interface data Bit [14]
Bidirectional External Bus Interface data Bit [15]
Description
VDDIO
D13
D14
D15
RDY_N
GND
Input
Ground
Output
Ground
Output
Output
Output
Power
Output
Output
Output
Output
Ground
Output
Output
Input
External Bus Interface External Ready Indication
Digital ground
Memory clock used by external memory
Digital ground
Byte enable 0, active low
Byte enable 1, active low
Output enable, active low
Digital core supply voltage (+2.5VDC)
Read or write control (active low write)
Bank Enable 0
Bank Enable 1
Column activate signal, active low
Digital Ground
MEMCLK
GND
BE0_N
BE1_N
OE_N
VDDC
RW_N
BA_0
BA_1
CAS_N
GND
D8
T2
R3
P3
M4
P6
R4
T3
U2
R5
P7
T4
D13
U3
U4
T5
R6
D12
U5
T6
RAS_N
CKE
Row activate signal, active low
Clock enable to be used in conjunction with MEMCLK
External Bus hold request, active low
External Bus grant request, active low
Reset input
HOLDREQ_N
HOLDGNT_N
RESET_N
RESET_OUT_N
GND
Output
Input
Output
Ground
Output
Output
Output
Output
Power
Output
Output
Output
Output
Ground
Output
Output
Output
Reset output
Digital ground
A0
A1
A2
A3
VDDIO
A4
A5
A6
A7
GND
A8
A9
A10
External Bus Interface address Bit [0]
External Bus Interface address Bit [1]
External Bus Interface address Bit [2]
External Bus Interface address Bit [3]
Digital I/O supply voltage (+3.3VDC)
External Bus Interface address Bit [4]
External Bus Interface address Bit [5]
External Bus Interface address Bit [6]
External Bus Interface address Bit [7]
Digital ground
R7
U6
D14
T7
U7
R8
External Bus Interface address Bit [8]
External Bus Interface address Bit [9]
External Bus Interface address Bit [10]
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Table 5. BGA 15- by 15-mm Package Pin Listing (Continued)
Pin
T8
D9
U8
U9
T9
R9
H4
U10
T10
R10
U11
G14
T11
P11
R11
U12
E4
Signal Name
A11
Type
Output
Power
Output
Output
Output
Output
Power
Output
Output
Output
Output
Power
Output
Output
Output
Output
Ground
Output
Description
External Bus Interface address Bit [11]
Digital core supply voltage (+2.5VDC)
External Bus Interface address Bit [12]
External Bus Interface address Bit [13]
External Bus Interface address Bit [14]
External Bus Interface address Bit [15]
Digital core supply voltage (+2.5VDC)
External Bus Interface address Bit [16]
External Bus Interface address Bit [17]
External Bus Interface address Bit [18]
External Bus Interface address Bit [19]
Digital I/O supply voltage (+3.3VDC)
External Bus Interface address Bit [20]
External Bus Interface address Bit [21]
External Bus Interface address Bit [22]
External Bus Interface address Bit [23]
Digital ground
VDDC
A12
A13
A14
A15
VDDC
A16
A17
A18
A19
VDDIO
A20
A21
A22
A23
GND
A24
T12
External Bus Interface address Bit [24]
U13 A_25_RESET_
DELAY
Internal
Pull-up
Muxed pin, External Bus Interface address Bit [25] or POR
counter bypass
P12
R12
T13
R13
U14
A_26_SIZE
A27_CS7_N
A28_CS6_N
A29_CS5_N
A30_CS4_N
Internal
Pull-up
Muxed pin, External Bus Interface address Bit [26] or data bus
size select (0 = 8-Bit, 1= 16=Bit)
Muxed pin, External Bus Interface address Bit [27] or Chip
select 7 (chip select active low)
Muxed pin, External Bus Interface address Bit [28] or Chip
select 6 (chip select active low)
Muxed pin, External Bus Interface address Bit [29] or Chip
select 5 (chip select active low)
Output
Output
Output
Output
Muxed pin, External Bus Interface address Bit [30] or Chip
select 4 (chip select active low)
T14
T15
R15
R14
U15
U16
T16
U17
K14
CS0_N
CS1_N
CS2_N
CS3_N
TDI
TDO
TCK
TMS
VDDC
Output
Output
Output
Output
Input
Output
Input
Input
Chip select 0 (chip select active low)
Chip select 1 (chip select active low)
Chip select 2 (chip select active low)
Chip select 3 (chip select active low)
JTAG data input
JTAG data output
JTAG clock input
JTAG control signal
Digital core supply voltage (+2.5VDC)
Power
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Table 5. BGA 15- by 15-mm Package Pin Listing (Continued)
Pin
P15
T17
R16
R17
E14
P16
N15
P17
N16
M16
M15
N17
M17
M14
L16
L15
L17
K17
K16
K15
J17
J16
J15
N4
Signal Name
UIC0_0
UIC0_1
UIC0_2
UIC0_3
GND
UIC0_4
UIC0_5
UIC0_6
UIC0_7
UIC0_8
VDDCLK
XTAL0
Type
Description
Bidirectional Universal I/O Controller 0, pin 0
Bidirectional Universal I/O Controller 0, pin 1
Bidirectional Universal I/O Controller 0, pin 2
Bidirectional Universal I/O Controller 0, pin 3
Ground
Digital ground
Bidirectional Universal I/O Controller 0, pin 4
Bidirectional Universal I/O Controller 0, pin 5
Bidirectional Universal I/O Controller 0, pin 6
Bidirectional Universal I/O Controller 0, pin 7
Bidirectional Universal I/O Controller 0, pin 8
Power supply Power Supply for the Crystal Oscillator (+2.5VDC)
Clock
Clock
Ground
Crystal input pin 0 (Osc. In)
Crystal input/output pin 1 (Osc. Out)
Digital ground
XTAL1
GNDCLK
UIC0_9
UIC0_10
UIC0_11
UIC0_12
UIC0_13
UIC0_14
UIC0_15
UIC0_16
UIC0_17
GND
Bidirectional Universal I/O Controller 0, pin 9
Bidirectional Universal I/O Controller 0, pin 10
Bidirectional Universal I/O Controller 0, pin 11
Bidirectional Universal I/O Controller 0, pin 12
Bidirectional Universal I/O Controller 0, pin 13
Bidirectional Universal I/O Controller 0, pin 14
Bidirectional Universal I/O Controller 0, pin 15
Bidirectional Universal I/O Controller 0, pin 16
Bidirectional Universal I/O Controller 0, pin 17
Ground
Digital ground
H17
H16
G17
H15
J4
UIC1_0
UIC1_1
UIC1_2
UIC1_3
VDDIO
Bidirectional Universal I/O Controller 1, pin 0
Bidirectional Universal I/O Controller 1, pin 1
Bidirectional Universal I/O Controller 1, pin 2
Bidirectional Universal I/O Controller 1, pin 3
Power
Digital I/O supply voltage (+3.3VDC)
G16
F17
E17
G15
F16
D17
L14
E16
F15
UIC1_4
UIC1_5
UIC1_6
UIC1_7
UIC1_8
UIC1_9
VDDC
Bidirectional Universal I/O Controller 1, pin 4
Bidirectional Universal I/O Controller 1, pin 5
Bidirectional Universal I/O Controller 1, pin 6
Bidirectional Universal I/O Controller 1, pin 7
Bidirectional Universal I/O Controller 1, pin 8
Bidirectional Universal I/O Controller 1, pin 9
Power
Digital core supply voltage (+2.5VDC)
UIC1_10
UIC1_11
Bidirectional Universal I/O Controller 1, pin 10
Bidirectional Universal I/O Controller 1, pin 11
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Table 5. BGA 15- by 15-mm Package Pin Listing (Continued)
Pin
C17
D16
B17
N14
E15
C16
A17
J14
B16
C15
D15
F14
P9
Signal Name
UIC1_12
UIC1_13
UIC1_14
GND
UIC1_15
UIC1_16
UIC1_17
VDDIO
Type
Description
Bidirectional Universal I/O Controller 1, pin 12
Bidirectional Universal I/O Controller 1, pin 13
Bidirectional Universal I/O Controller 1, pin 14
Ground
Digital ground
Bidirectional Universal I/O Controller 1, pin 15
Bidirectional Universal I/O Controller 1, pin 16
Bidirectional Universal I/O Controller 1, pin 17
Power
Digital I/O supply voltage (+3.3VDC)
UIC2_0
UIC2_1
UIC2_2
UIC2_3
VDDC
Bidirectional Universal I/O Controller 2, pin 0
Bidirectional Universal I/O Controller 2, pin 1
Bidirectional Universal I/O Controller 2, pin 2
Bidirectional Universal I/O Controller 2, pin 3
Power
Digital core supply voltage (+2.5VDC)
C14
B15
A16
A15
P4
UIC2_4
UIC2_5
UIC2_6
UIC2_7
GND
Bidirectional Universal I/O Controller 2, pin 4
Bidirectional Universal I/O Controller 2, pin 5
Bidirectional Universal I/O Controller 2, pin 6
Bidirectional Universal I/O Controller 2, pin 7
Ground
Digital ground
B14
C13
A14
B13
K4
UIC2_8
UIC2_9
UIC2_10
UIC2_11
VDDIO
Bidirectional Universal I/O Controller 2, pin 8
Bidirectional Universal I/O Controller 2, pin 9
Bidirectional Universal I/O Controller 2, pin 10
Bidirectional Universal I/O Controller 2, pin 11
Power
Digital I/O supply voltage (+3.3VDC)
C12
A13
B12
A12
P5
UIC2_12
UIC2_13
UIC2_14
UIC2_15
GND
Bidirectional Universal I/O Controller 2, pin 12
Bidirectional Universal I/O Controller 2, pin 13
Bidirectional Universal I/O Controller 2, pin 14
Bidirectional Universal I/O Controller 2, pin 15
Ground
Digital ground
C11
B11
A11
A10
P10
B10
C10
A9
UIC2_16
UIC2_17
UIC3_0
UIC3_1
VDDC
UIC3_2
UIC3_3
UIC3_4
UIC3_5
Bidirectional Universal I/O Controller 2, pin 16
Bidirectional Universal I/O Controller 2, pin 17
Bidirectional Universal I/O Controller 3 pin 0
Bidirectional Universal I/O Controller 3 pin 1
Power
Digital core supply voltage (+2.5VDC)
Bidirectional Universal I/O Controller 3 pin 2
Bidirectional Universal I/O Controller 3 pin 3
Bidirectional Universal I/O Controller 3 pin 4
Bidirectional Universal I/O Controller 3 pin 5
B9
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Table 5. BGA 15- by 15-mm Package Pin Listing (Continued)
Pin
C9
A8
B8
A7
P8
C8
B7
A6
A5
B6
C7
A4
B5
C6
A3
Signal Name
UIC3_6
Type
Description
Bidirectional Universal I/O Controller 3 pin 6
Bidirectional Universal I/O Controller 3 pin 7
Bidirectional Universal I/O Controller 3 pin 8
Bidirectional Universal I/O Controller 3 pin 9
UIC3_7
UIC3_8
UIC3_9
VDDIO
UIC3_10
UIC3_11
UIC3_12
UIC3_13
GND
UIC3_14
UIC3_15
UIC3_16
UIC3_17
Power
Digital I/O supply voltage (+3.3VDC)
Bidirectional Universal I/O Controller 3 pin 10
Bidirectional Universal I/O Controller 3 pin 11
Bidirectional Universal I/O Controller 3 pin 12
Bidirectional Universal I/O Controller 3 pin 13
Ground
Digital Ground
Bidirectional Universal I/O Controller 3 pin 14
Bidirectional Universal I/O Controller 3 pin 15
Bidirectional Universal I/O Controller 3 pin 16
Bidirectional Universal I/O Controller 3 pin 17
T0IC0_T0OC0 Bidirectional Muxed pin, Timer Counter Unit 0 input capture 0 or output
compare 0
B4
A2
C5
T0IC1_T0OC1 Bidirectional Muxed pin, Timer Counter Unit 0 input capture 1 or output
compare 1
T0IC2_T0OC2 Bidirectional Muxed pin, Timer Counter Unit 0 input capture 2 or output
compare 2
T0IC3_T0OC3 Bidirectional Muxed pin, Timer Counter Unit 0 input capture 3 or output
compare 3
P13
B3
GND
Ground
Digital ground
T1IC0_T1OC0 Bidirectional Muxed pin, Timer Counter Unit 1 input capture 0 or output
compare 0
A1
B2
C4
T1IC1_T1OC1 Bidirectional Muxed pin, Timer Counter Unit 1 input capture 1 or output
compare 1
T1IC2_T1OC2 Bidirectional Muxed pin, Timer Counter Unit 1 input capture 2 or output
compare 2
T1IC3_T1OC3 Bidirectional Muxed pin, Timer Counter Unit 1 input capture 3 or output
compare 3
C3
D6
P14
H14
T0IN
T1IN
GND
Input
Input
Ground
Power
Timer Counter Unit 0 external clock source
Timer Counter Unit 1 external clock source
Digital Ground
VDDIO
Digital I/O supply voltage (+3.3VDC)
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4.3.2 BGA 15- by 15-mm Physical Package Dimensions
The physical dimensions for the BGA 15- by 15-mm package are as shown in Figure 7.
Notes:
1. Controlling dimension:
Millimeter.
. Primary datum C and seating
plane are defined by the spherical
crowns of the solder balls.
. Dimension b is measured at the
maximum solder-ball diameter,
parallel to primary datum C.
4. There will be a minimum
clearance of 0.25 mm between the
edge of the solder ball and the
body edge.
5. Special Characteristics C Class:
bbb ddd.
. The pattern of Pin 1 fiducial is
for reference only.
Legend:
Dimension in mm
Dimension in Inches
Symbol
A
A1
A2
c
D
E
D1
E1
e
MIN
NOM
–
MAX
MIN
–
0.006 0.008
0.033 0.035
0.013 0.014
NOM
–
MAX
0.047
0.010
0.037
0.016
0.594
0.594
–
–
0.16
0.84
0.32
14.90
14.90
–
–
–
0.25
1.20
0.26
0.94
0.40
0.21
0.89
0.36
15.00
15.00
12.80
12.80
0.80
0.30
0.10
0.10
0.12
0.15
0.08
17/17
15.10 0.587 0.591
15.10 0.587 0.591
–
–
–
0.35
–
–
–
0.504
0.504
0.031
–
–
b
0.010 0.012
0.004
0.014
aaa
bbb
ddd
eee
fff
0.004
0.005
0.006
0.003
MD/ME
17/17
Figure 7. BGA 15- by 15-mm Physical Package Dimensions
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4.3.3 BGA 15- by 15-mm Signal Routing
The 15- by15-mm BGA can be easily routed using economical and readily available PCB
fabrication design rules. In order to route all signals from the fido1100 BGA, 2 layers in addition
to power and ground are required, using 0.1mm trace/space technology. Since 0.1mm =
3.937mil, most PCB fabricators will consider this 4mil trace/space.
The PCB land pattern for the BGA should use 0.3mm round pads. Since the BGA pitch is
0.8mm, this leaves 0.5mm of space between pads. Using 0.1mm trace/space, 2 signals may be
routed between each pair of pads (2 traces + 3spaces = 0.5mm). Figure 8 shows how this is
accomplished.
Referring to Figure 8, signal layer 1 is shown in black, signal layer 2 is shown in red, and the
vias are shown in blue. Signal layer 1 is the top side with the BGA pads, while signal layer 2
may be any other layer, but is typically the bottom side. All vias with no trace routed out from
the BGA are power or ground.
Note that the innermost row of pads is all power and ground, except for 9 pads which are signals.
Three of these signals are easily routed on signal layer 1, but 6 of them require the use of vias
and signal layer 2. If all of the signals are not required for a given design, it may be possible to
route all of the used signals on signal layer 1.
It may be beneficial to place more vias and to route more signals on layers other than signal layer
1. This could produce a better PCB layout, but care should be exercised to not include an
excessive number of vias. The use of too many vias can lead to inadequate copper on the
power/ground plane layers surrounding the center area of the BGA, resulting in relative isolation
of the BGA power/ground via connections.
Note the open space between pads M17 and N17 (A1 is upper left corner). These signals are
XTAL1 and XTAL0. It is best not to route other signals between these pads, especially if a
crystal is used for the clock source.
The power connections to the inner ring of pads have 4 vias for +3.3V and 4 vias for +2.5V. The
use of a single bypass capacitor for each via, and alternating 0.1uF and 0.01uF values on each
supply, provide reasonable bypass capacitance for the fido1100. Using 8 capacitors in this
manner allows the use of capacitors in the 0603 package for economical PCB assembly.
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Figure 8. BGA 15- by 15-mm Signal Routing
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4.4
Power and Ground Signals
Tables 6, 7, 8, 9, and 10 provide analog power and ground signals, crystal oscillator power and
ground signals, 2.5 VDC digital core power signals, 3.3 VDC digital IO power signals, and
digital ground signals, respectively.
The recommended bypass capacitors for the fido1100 are:
Use a mix of 0.1 µf and 0.01 µf capacitors.
Bypass capacitors should be located as close as possible to power pins they are
connected to.
Table 6. Analog Power and Ground Signals
BGA
BGA
PQFP 10 x 10 15 x 15 Signal Name
Type
Power
Ground
Description
Analog supply voltage (+3.3VDC)
Analog ground
11
12
G7
H7
D1
E1
VDDA
GNDA
Table 7. Crystal Oscillator Power and Ground Signals
BGA
BGA
Signal
Name
PQFP 10 x 10 15 x 15
Type
Description
117
120
L12
L11
M15
M14
VDDCLK Power supply Power Supply for the Crystal Oscillator (+2.5VDC)
GNDCLK Ground Digital ground
Table 8. 2.5 VDC Digital Core Power Signals
BGA
BGA
PQFP 10 x 10 15 x 15 Signal Name
Type
Description
16
48
75
G8
G10
G11
H12
J12
M12
M11
M10
L7
D7
D8
D9
H4
K14
L14
P9
P10
–
VDDC
VDDC
VDDC
VDDC
VDDC
VDDC
VDDC
VDDC
VDDC
VDDC
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Digital core supply voltage (+2.5VDC)
Digital core supply voltage (+2.5VDC)
Digital core supply voltage (+2.5VDC)
Digital core supply voltage (+2.5VDC)
Digital core supply voltage (+2.5VDC)
Digital core supply voltage (+2.5VDC)
Digital core supply voltage (+2.5VDC)
Digital core supply voltage (+2.5VDC)
Digital core supply voltage (+2.5VDC)
Digital core supply voltage (+2.5VDC)
80
106
142
157
177
206
–
J7
–
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Table 9. 3.3 VDC Digital IO Power Signals
BGA
BGA
15 x 15
PQFP 10 x 10
Signal Name
VDDIO
VDDIO
VDDIO
VDDIO
VDDIO
VDDIO
VDDIO
VDDIO
VDDIO
Type
Description
22
37
65
G9
G12
K7
K12
M7
M16
–
D10
D11
D12
G14
J4
J14
K4
P8
Power
Power
Power
Power
Power
Power
Power
Power
Power
Digital I/O supply voltage (+3.3VDC)
Digital I/O supply voltage (+3.3VDC)
Digital I/O supply voltage (+3.3VDC)
Digital I/O supply voltage (+3.3VDC)
Digital I/O supply voltage (+3.3VDC)
Digital I/O supply voltage (+3.3VDC)
Digital I/O supply voltage (+3.3VDC)
Digital I/O supply voltage (+3.3VDC)
Digital I/O supply voltage (+3.3VDC)
85
135
152
167
187
–
–
–
H14
Table 10. Digital Ground Signals
BGA
BGA
PQFP 10 x 10 15 x 15 Signal Name
Type
Description
Digital ground
Digital ground
Digital ground
Digital Ground
Digital ground
Digital ground
Digital ground
Digital ground
Digital ground
Digital ground
Digital ground
Digital ground
Digital ground
Digital Ground
Digital ground
Digital Ground
31
42
H8
N3
D4
T1
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
44
H9
D5
53
V2
P6
60
70
90
H10
H11
J8
D13
D14
E4
111
130
148
162
172
182
192
201
–
K8
K11
L8
E14
N4
N14
P4
P5
B6
P13
P14
–
L9
L10
J11
A8
M8
M9
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5.
Electrical Characteristics
Tables 11, 12, 13, 14, and 15 show the absolute maximum ratings, ESD and latch-up
characteristics, recommended operating conditions, DC characteristics, and input impedance,
respectively.
Table 11. Absolute Maximum Ratings
Symbol
VDDC
VDDIO
VAIN
Parameter Name
Digital core supply voltage
Digital I/O supply voltage
Analog input voltage with respect to ground
Ambient temperature
Conditions Min Typ Max Units
–
–
–
–
–
-0.3
-0.3
-0.3
-40
–
–
–
–
–
3.05
5.5
3.9
+85
+150
V
V
V
TA
TS
oC
oC
Storage temperature
-55
Note: Operation of the fido1100 outside of maximum operating ratings may result in failure of the device.
Table 12. ESD and Latch-Up Characteristics
Symbol
VHBM
VMM
ILATP
ILATN
Parameter Name
Human body model
Machine model
Positive latch-up current
Negative latch-up current
Conditions Min Typ Max Units
–
–
–
–
2000
200
–
–
–
–
–
–
–
50
-50
V
V
µA
µA
–
Table 13. Recommended Operating Conditions
Symbol
VDDC
VDDIO
fXTAL
TA
VDDA
VRH
VRL
Parameter Name
Digital core supply voltage
Digital I/O supply voltage
Crystal frequency
Conditions Min Typ Max Units
–
–
–
–
–
–
–
2.25 2.5 2.75
V
V
MHz
oC
V
3.0
–
-40
3.0
–
3.3
–
–
3.3
3.0
0
3.6
66
+85
3.6
–
Ambient temperature
Analog supply voltage
ADC reference voltage—high
ADC reference voltage—low
V
V
–
–
CL
Digital output load capacitance See note
–
3.1
–
pF
Note: This parameter is guaranteed by design and not tested in production.
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Table 14. DC Characteristics
TA = –40oC and +85oC;
VDDC = 2.5V ± 10%;
VDDIO = 3.3V ± 10%;
FCLK = 66MHz
Max Units
Symbol
VIH
Parameter Name Conditions
Input high voltage
Min
2.0
–
Typ
–
–
–
–
–
–
–
0.8
10
–
V
V
µA
pF
V
VIL
Input low voltage
ILKG
CIN
Input leakage current
Input capacitance
-10
–
2.4
–
1
3.6
–
VOH
VOL
IOZ
Output high voltage
Output low voltage
Tri-state leakage
|IOH| = 8 mA
|IOL| = 8 mA
–
–
0.4
10
–
V
µA
pF
–
–
-10
–
1
3.6
COUT
Package output capacitance
Table 15. Input Impedance
Input leakage current:
Tristate leakage current:
± 10 µA with no pull-up/pull-down
± 10 µA
Pin capacitance (input or output): ~3.5 pF not including package contribution
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6.
Thermal Characteristics
Thermal resistance represents the capability of an IC package to carry out the heat inside an IC
chip. It is a complex function of package structure, material property, input power, and
environment variables such as airflow speed and PCB layers that can be analyzed by finite
element modeling (FEM) techniques. In the simulations used to generate information for this
data sheet, a commercial Finite Element Analysis (FEA) program, ANSYS, was used to create
the 3D thermal model stacked by brick elements. Considering the package structure symmetry,
only the quarter package structure was modeled to save CPU calculating time. All the materials
were assumed isotropic with constant physical property and all material interfaces are also
assumed perfect joined. The heat flux was applied on the top surface of the die to simulate
heating power and constant convection coefficients were applied on the exterior surface of this
model. The physical properties and simulation conditions are summarized in Table 16.
Table 16. Physical Properties and Simulation Conditions
Input Power
1.0W
Test Board (PCB) Four Layer (2S2P)
Control Condition Air flow = 0,1,2, and 3 M/S
The thermal characteristic listed in this data sheet address both the 28- by 28-mm PQFP and the
BGA 10- by 10-mm package mounted on four layers of PCB using the Finite Element Modeling
(FEM) method. The junction-to-ambient thermal resistance is used to evaluate thermal
performance for this package and then to predict the power dissipation capability by given
ambient and maximum junction temperatures.
The results shown in Figure 8 are generated using the input power (P) and ambient temperature
(TA), to calculate the thermal resistance of θJA according to θJA = (TJ – TA)/P, assuming ambient
temperature of 65°C, maximum junction temperature of 125°C, and input power of 1 watt. The
maximum power dissipation of the PQFP and BGA packages is:
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47
45
43
41
39
37
35
33
31
PQFP Package
BGA 10 x 10
BGA 15 x 15
0
1
2
3
AirFlow (m/s)
PQFP Package
35.8
47.6
47
33.3
42.2
42.2
32.1
39.8
39.7
31.3
38.2
38.2
BGA 10 x 10
BGA 15 x 15
Figure 9. Thermal Performance of PQFP/BGA Under Forced Convection
Tables 17, 18, 19, and 20 present the maximum power dissipation of PQFP/BGA under forced
convection, the AC characteristics of crystal oscillator, the analog-to-digital converter
characteristics, and power consumption, respectively.
Table 17. Maximum Power Dissipation of PQFP/BGA Under Forced Convection
Air Flow in Meters/Second
Maximum Power PQFP
Dissipation (Watts)
0
1
2
3
1.68 1.8 1.87 1.92
BGA10 x 10 1.26 1.42 1.51 1.57
BGA 15 x 15 0.85 0.95 1.01 1.05
Table 18. AC Characteristics of Crystal Oscillator
Symbol
fOSC
Parameter
Crystal oscillator range TA = 25ºC
Startup time TA = 25ºC
Conditions Typ Max Units
–
66
MHz
tST
20
–
µs
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Table 19. Analog-to-Digital Converter Characteristics
Symbol
VINA
CINA
Res
INL
Parameter Name
Input voltage range
Input capacitance
Resolution
Integral non-linearity
Differential non-linearity
Conditions
Min
0.1VDDA
Typ
-
Max
0.9VDDA
Units
V
pF
Bits
Lsb
Lsb
dB
MHz
mW
Ksps
–
–
–
–
–
–
–
–
–
0.5
–
–
20
10
± 2
± 1
54
–
–
–
–
–
–
2.6
–
200
DNL
guaranteed no missing codes
SINAD Signal to noise plus distortion
FSMPL Sample clock frequency
PD
SMP
Fin = 10 KHz
–
TA = 25ºC
–
Power dissipation
Sample rate
5
–
Notes:
1. The ADC in the fido1100 uses its own VDD (VDDA) and GND (GNDA) connections along with
VREF High (VRH) and VREF Low (VRL) signals.
2. VRH must be less than or equal to VDDA.
3. VRL must be greater than or equal to GNDA.
4. To ensure maximum conversion accuracy, VDDA, GNDA, VRH, and VRL should be as clean and
free of noise as possible.
Table 20. Power Consumption
Core Voltage 2.5 VDC
I/O Voltage 3.3 VDC
Total
Conditions
Current
Power
Current
Power
Power
Halted after a Reset
109.240 mA
273.100 mW 2.500 mA
535.000 mW 7.700 mA
8.25 mW
281.35 mW
560.41 mW
623.60 mW
320.90 mW
302.91 mW
8.68 mW
Light Processing Load
Heavy Processing Load
Sleep Mode
214.000 mA
227.000 mA
25.41 mW
567.500 mW 17.000 mA 56.1 mW
Stop Mode
Low Power Stop Mode (LPSTOP)
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7.
Reset
7.1
Overview
This section describes the reset signal considerations and the reset timing. The Power On Reset
Register has a control bit to determine whether Major Reset or Minor Reset processing is
performed after reset is asserted. The section below presents the hardware signal characteristics.
See The fido1100 User Guide for more details on the Power On Reset Control Register.
7.2
Signal Considerations and Reset Timing
The fido1100 requires the RESET_N signal to be asserted LOW for a minimum of 100 µS after
VDDIO and VDDC are at their nominal values and stable. The RESET_N signal must have a
rise time of less than 100 nS. Table 21 presents the hardware signals involved or affected and
should be considered when asserting reset.
Table 21. Hardware Signals Involved When Asserting Reset
Signal Name
RESET_N
Type
Input
Description
Reset input
RESET_OUT_N
A_25_RESET_DELAY
Output
Muxed, Internal
Pull-up
Reset output
Muxed pin, External Bus Interface address Bit [25] or
POR counter bypass
A_26_SIZE
A27_CS7_N
A28_CS6_N
A29_CS5_N
A30_CS4_N
CS0_N
Muxed, Internal
Pull-up
Muxed pin, External Bus Interface address Bit [26] or data
bus size select (0 = 8-bit, 1 = 16-bit)
Muxed pin, External Bus Interface address Bit [27] or
Chip select 7 (chip select active low)
Muxed pin, External Bus Interface address Bit [28] or
Chip select 6 (chip select active low)
Muxed pin, External Bus Interface address Bit [29] or
Chip select 5 (chip select active low)
Muxed
Muxed
Muxed
Muxed
Output
Muxed pin, External Bus Interface address Bit [30] or
Chip select 4 (chip select active low)
Chip select 0 (chip select active low)
When RESET_N is asserted, the following sequence occurs:
The A25_Reset_Delay signal is sampled to determine the length of the reset clock delay
– Low—reset clock delay → 100 µsecs
– High—reset clock delay → 20 msecs
Note: After this delay, the part performs major or minor reset processing and is
released to run.
The A_26_SIZE pin is sampled for the external bus interface size
– Low—8-bit width
– High—16-bit width
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The RESET_OUT_N signal is driven low for the determined clock delay
Figures 9 and 10 present the reset timing and extended reset timing diagrams, respectively. The
A_26_SIZE signal is not shown, but it is sampled.
CLK
Clock Running
| <--- Clock Stable
RESET_N
RESET_OUT_N
(ADDR 25)
RESET_DELAY
ADDR 24:0
0x000000
0x000000
DATA 15:0
CS0
100uS
Power On Reset
100uS
Hardware Reset
TimeGen
Figure 10. Reset Timing
CLK
Clock Running
| <--- Clock Stable
RESET_N
RESET_OUT_N
RESET_DELAY
(ADDR 25)
ADDR 24:0
0x000000
0x000000
DATA 15:0
CS0
20mS
Power On Reset
20mS
Hardware Reset
TimeGen
Figure 11. Extended Reset Timing
Note: If A25_RESET_DELAY is high at the rising edge of RESET_N,
internal reset and RESET_OUT_N are extended from 100 µs to 20 mS.
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The following multiplexed signals are tri-stated during reset and should be pulled high if being
used as chip selects or pulled low if being used as address lines (the fido1100 boots at address
0x00000000). If not being used, they can be pulled either high or low.
A27_CS7_N
A28_CS6_N
A29_CS5_N
A30_CS4_N
At Reset, the CS0_N signal defaults to low for external memory access, supporting the boot
sequence from address 0x00000000.
7.3
7.4
Clock Signals
Typical Clock Source Implementations
The fido1100 can operate in one of two modes: (1) Normal or driven clock source input or
(2) using an external crystal to set the operating frequency of the internal oscillator.
Note: VDDCLK and GNDCLK must be connected even when not using an
external crystal.
7.4.1 Normal or Driven Clock Source
System configuration—Drive external clock source into XTAL0 (see Figure 11). XTAL1 is left
unconnected. XTAL0 is effectively a Schmitt trigger input. Target frequency should have a
duty cycle of approximately 40% to 60%.
7.4.2 Using an External Crystal
System Configuration (third overtone)—Crystal across XTAL0/XTAL1 (see Figure 12),
36 pF load caps to ground, 0.1-µF cap, and 0.33-µH inductor in series from XTAL1 to
ground.
System Configuration (fundamental tone)—Crystal across XTAL0/XTAL1 (see
Figure 13) and 20-pF load caps to ground.
Note: Load capacitor and inductor values may be different based on crystal
used. Please consult with your crystal supplier for more information.
Third overtone configuration is recommended for 24- to 66-MHz operation and fundamental
tone configuration is recommended for 1- to 24-MHz operation.
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GNDCLK
GNDCLK
XTAL1
L1
C3
C2
XTAL1
XTAL0
Not Connected
Crystal
fido1100
fido1100
C1
External Clock
Source
XTAL0
2.5V
2.5V
VDDCLK
VDDCLK
Figure 12. Driven Clock Source
Figure 13. Crystal Oscillator Third
Overtone Off-Chip Components
GNDCLK
C2
XTAL1
Crystal
fido1100
C1
XTAL0
2.5V
VDDCLK
Figure 14. Crystal Oscillator
Fundamental Overtone Off-Chip
Components
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7.5
Off-Chip Component Value
Table 22 shows the suggested off-chip component values:
Table 22. Suggested Off-Chip Component Values
Operating frequency C1 C2
C3
36pF 36pF 0.1µF 330nH
20pF 20pF NA NA
L1
66MHz
20 MHZ
Notes:
1. Different C1, C2 values lead to different oscillation characteristics and should be selected based on
system (board) level considerations.
2. Using C1 = C2 is recommended.
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8.
Signals
8.1
External Bus Operation
8.1.1 Overview
The fido1100 interfaces to external memory and peripherals through a set of programmable chip-
select and bus-timing registers. It also has a built-in SDRAM controller to interface to SDRAM.
This chapter provides timing diagrams for hardware considerations.
For definitions of registers that control external bus timing and the SDRAM timing, please see
The fido1100 User Guide.
The external address bus of the fido1100 is 31-bit, and the external data bus is configurable to
support either an 8- or 16-bit bus. In this section, timing diagrams are provided for the
following:
General Setup and Hold Timing
External Bus Timing
– 32-bit transfer without external ready (RDY_N)
– 32-bit transfer with external ready (RDY_N)
– 8-bit/16-bit single cycle without external ready (RDY_N)
– 8-bit/16-bit cycle with external ready (RDY_N)
SDRAM Timing
– SDRAM CAS Timing
– SDRAM Row Activation Timing
– SDRAM Read Operation Timing
– SDRAM Read Burst Timing
– SDRAM Write Operation, Write Burst, Write-to-Write Operation, and Write-to-
Precharge Timing
8.2
General Setup and Hold Timing
All timing delays are characterized at the 50% to 50% point. This includes propagation delay
times through combinatorial functions as well as setup, hold time, and release-time definitions
for sequential elements (see Chapter 9, Setup and Hold Timing, for diagrams).
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8.3
Signals listed on the External Bus Timing diagrams are described below.
TwWAIT
External Bus Timing
– If RDY_ENABLE=0, specifies the width of the chip select active period for the non-
burst-mode write cycle. The allowed range is 0–31, resulting in a wait time of 1–32
clocks.
– If RDY_ENABLE=1, specifies the wait time before the RDY_N line is first sampled
for the write cycle. This provides a max wait time of 484 nS at 66 MHz. Anything
greater than this will require the external RDY_N line and external logic.
TrWAIT
– If RDY_ENABLE=0, specifies the width of the chip select active period for the non-
burst-mode read cycle. The allowed range is 0–31, resulting in a wait time of 1–32
clocks.
– If RDY_ENABLE=1, specifies the wait time before the RDY_N line is first sampled
for the read cycle. This provides a max wait time of 484 nS at 66 MHz. Anything
greater than this will require the external RDY_N line and external logic.
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9.
Setup and Hold Timing
All timing delays are characterized at the 50% to 50% point. This includes propagation delay
times through combinatorial functions as well as setup, hold-time, and release-time definitions
for sequential elements.
Propagation Delay—Time between an input signal transition and the resultant output
signal transition (see Figure 14).
Tplh = 14ns.
Tphl = 14ns.
Figure 15. Propagation Delay
Setup Time—The minimum time that input data must remain unchanged prior to an
active clock transition (see Figure 15).
Setup = 2ns.
Figure 16. Setup Time
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Hold Time—The minimum time that input data must remain unchanged subsequent to an
active clock transition (see Figure 16).
Hold = 2ns.
Figure 17. Hold Time
Recovery Time—The minimum time that the Set or Reset input must remain unactivated
prior to an active clock transition (see Figure 17).
Recovery = 3ns.
Figure 18. Recovery Time
Removal Time—The minimum time that the Set or Reset input must remain activated
subsequent to an active clock transition (see Figure 18).
Removal = 3ns.
Figure 19. Removal Time
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Minimum Pulse Width—The minimum length of time between the leading and trailing
edges of a pulse (see Figure 19).
Timings are based on a 66-MHz clock yielding 15-ns cycles.
MPW_H = 7ns.
MPW_L = 7ns.
Figure 20. Minimum Pulse Width
THLD—Specifies the time between when the CSn_N and BEn_N signals go inactive (hi)
and the address is removed, 0–7 clocks.
TCS—Specifies the time between when the address bus is driven and the CSn_N and
BEn_N signals go active (low), 0–3 clocks.
TOE—Specifies the time between when the CSn_N and BEn_N signals go active (low)
and the OE signal goes active (low), 0–3 clocks.
TWEF—Specifies the time between when the CSn_N and BEn_N signals go active (low)
and the WE_N signal goes active (low), 0–3 clocks.
TWER—Specifies the time between when the WE_N signal goes inactive (hi) and the
CSn_N and BEn_N signals go inactive (hi), 0–3 clocks.
9.1.1 External Bus Timing for a 32-Bit Transfer (without RDY_N)
This timing is programmable via the External Bus Chip Select Timing Register (see Figure 20).
All timing is relative to the rising edge of the clock.
The chip-select and byte-enable signals (CSn_N and BEn_N) go active (low) 0–3 clocks
(TCS) after the address bus is driven.
The chip-select, output-enable, and byte-enable signals (CSn_N, BEn_N, and OE_N) go
inactive (hi) 0–7 clocks (THLD) before the address is removed (on the last cycle).
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Figure 21. External Bus Timing for a Single, 32-Bit Cycle (without RDY_N)
The write-cycle timing is controlled by TwWAIT setting (shown as TxWAIT in the
diagram), 1–16 clocks.
The read-cycle timing is controlled by TrWAIT setting (shown as TxWAIT in the
diagram), 1–16 clocks.
The output-enable signal (OE_N) goes active (low) 0–3 clocks (TOE) after the chip
select.
The output-enable signal (OE_N) goes inactive (hi) coincident with the chip select.
The write-enable signal (WE_N) goes active (low) 0–3 clocks (TWEF) after the chip
select (first cycle only). For subsequent cycles, the WE_N line will go active (low) 0–3
clocks (TWEF) after the address bus changes.
The write-enable signal (WE_N) goes inactive (hi) 0–3 clocks (TWER) before the end of
the wait time and hence before the address bus changes (subsequent cycles). This is
when the data is considered “written.”
9.1.2 External Bus Timing for a 32-Bit Transfer (with RDY_N)
This timing is programmable via the External Bus Chip Select Timing Register (see Figure 21).
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Figure 22. External Bus Timing for a 32-Bit Transfer (with RDY_N)
The TxWAIT setting determines when first to start sampling the low active RDY_N line
(labeled with an arrow marked “1” in the diagram).
In the case of a write transfer after the low active RDY_N line is first sampled low
(labeled with an arrow marked “2” in the diagram), the write cycle will complete on the
next rising edge of the clock as shown (labeled with an arrow marked “3” in the
diagram).
In the case of a read transfer once the low active RDY_N line is first sampled low
(labeled with an arrow marked “2” in the diagram), the read data will be sampled on the
second rising edge of the clock.
The write-cycle timing is controlled by TwWAIT setting (shown as TxWAIT in the
diagram), 1–16 clocks.
The read-cycle timing is controlled by TrWAIT setting (shown as TxWAIT in the
diagram), 1–16 clocks.
If the RDY_N line never goes low, the cycle will end (as a bus error) after a timeout of
TxWAIT + 256 clocks.
If the RDY_N line is unused (tied low via an internal pull down) or goes low
immediately, the cycle will be controlled by TxWAIT as described above.
In the case of a write transfer, the write-enable signal (WE_N) goes active (low) 0–3
clocks after the CS_N goes low.
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The write-enable signal (WE_N) goes inactive (hi) 0–3 clocks (TWER) before the end of
the chip-select time.
9.1.3 External Bus Timing for 8-Bit/16-Bit Transfer (without RDY_N)
This timing is programmable via the External Bus Chip Select Control Register (see Figure 22).
Figure 23. External Bus Timing for 8-Bit/16-Bit Transfer (without RDY_N)
All timing is relative to the rising edge of the clock.
The chip-select and byte-enable signals (CSn_N and BEn_N) go active (low) 0–3 clocks
(TCS) after the address bus is driven.
The chip-select and byte-enable signals (CSn_N and BEn_N) go inactive (hi) 0–7 clocks
(THLD) before the address is changed.
The write-cycle timing is controlled by TwWAIT setting (shown as TxWAIT in the
diagram), 1–16 clocks.
The read-cycle timing is controlled by TrWAIT setting (shown as TxWAIT in the
diagram), 1–16 clocks.
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The output-enable signal (OE_N) goes active (low) 0–3 clocks (TOE) after the chip
select.
The output-enable signal (OE_N) goes inactive (hi) coincident with the chip select. This
is also when the read data is sampled.
The write-enable signal (WE_N) goes active (low) 0–3 clocks (TWEF) after the chip
select.
The write-enable signal (WE_N) goes inactive (hi) 0–3 clocks (TWER) before the end of
the cycle (CSn_N is removed).
9.1.4 External Bus Timing for 8-Bit/16-Bit Transfer (with RDY_N)
This timing is programmable via the External Bus Chip Select Control Register (see Figure 23).
Figure 24. External Bus Timing for 8-Bit/16-Bit Transfer (with RDY_N)
The write-cycle timing is controlled by TwWAIT setting (shown as TxWAIT in the
diagram), 1–16 clocks.
The read-cycle timing is controlled by TrWAIT setting (shown as TxWAIT in the
diagram), 1–16 clocks.
The TxWAIT setting determines when first to start sampling the low active RDY_N line
(labeled with an arrow marked “1” in the diagram).
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In the case of a write transfer, once the low active RDY_N line is first sampled low
(labeled with an arrow marked “2” in the diagram), the write cycle will complete on the
next rising edge of the clock as shown (labeled with an arrow marked “3” in the
diagram).
In the case of a read transfer, once the low active RDY_N line is first sampled low
(labeled with an arrow marked “2” in the diagram), the read data will be sampled on the
second rising edge of the clock.
If the RDY_N line never goes low, the cycle will end (as a bus error) after a timeout of
TxWAIT + 256 clocks.
If the RDY_N line is unused (tied low via an internal pull down) or goes low
immediately, the cycle will be controlled by TxWAIT as shown above.
In the case of a write transfer, the write enable signal (WE_N) goes active (low) 0–3
clocks after the CS_N goes low.
The write enable signal (WE_N) goes inactive (hi) 0–3 clocks (TWER) before the end of
the chip-select time.
Note: This timing picture also reflects the default bus timing for all memory
addresses not decoded by the internal chip-select unit. In this case, the
timing is controlled by the External Bus Default Timing Register.
9.2
SDRAM Timing
9.2.1 SDRAM CAS Timing
The CAS latency is the delay, in clock cycles, between the registration of a READ command and
the availability of the first piece of output data. The latency can be set to two or three clocks. If
a READ command is registered at clock edge n, and the latency is m clocks, the data will be
available by clock edge n + m. The DQs will start driving because of the clock edge one cycle
earlier (n + m – 1) and, provided the relevant access times are met, the data will be valid by
clock edge n + m. For example, assuming the clock cycle time is such that all relevant access
times are met, if a READ command is registered at T0 and the latency is programmed to two
clocks, the DQs will start driving after T1 and the data will be valid by T2, as shown in
Figure 24.
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Figure 25. SDRAM CAS Timing
9.2.2 SDRAM Row Activation Timing
Before any READ or WRITE commands can be issued to a bank within the SDRAM, a row in
that bank must be “opened.” This is accomplished via the ACTIVE command, which selects
both the bank and the row to be activated (see Figure 25). After opening a row (issuing an
ACTIVE command), a READ or WRITE command may be issued to that row, subject to the
tRCD specification. The tRCD (MIN) should be divided by the clock period and rounded up to
the next whole number to determine the earliest clock edge after the ACTIVE command on
which a READ or WRITE command can be entered. For example, a tRCD specification of 20ns
with a 125-MHz clock (8-ns period) results in 2.5 clocks, rounded to 3. This is reflected in
Figure 26, which covers any case where 2 < tRCD (MIN)/tCK ≤ 3. (The same procedure is used
to convert other specification limits from time units to clock cycles.)
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Figure 26. Specific Row Activation Timing
Figure 27. Meeting tRCD (min) When 2 < tRCD (min)/tCK ≤ 3
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9.2.3 SDRAM Read Operation Timing
READ bursts are initiated with a READ command.
The starting column and bank addresses are provided with the READ command, and auto
precharge is either enabled or disabled for that burst access. If auto precharge is enabled, the
row being accessed is precharged at the completion of the burst. For the generic READ
commands used in the following illustrations, auto precharge is disabled (see Figure 27).
Figure 28. SDRAM Read Operation Timing
During READ bursts, the valid data-out element from the starting column address will be
available following the CAS latency after the READ command. Each subsequent data-out
element will be valid by the next positive clock edge.
Upon completion of a burst, assuming no other commands have been initiated, the DQs will go
high, and full-page burst will continue until terminated. (At end of the page, it will wrap to
column 0 and continue.)
9.2.4 SDRAM Read Burst Timing
Data from any READ burst may be truncated with subsequent READ command, and data from a
fixed-length READ burst may be immediately followed by data from a READ command. In
either case, a continuous flow of data can be maintained. The first data element from the new
burst follows either the last element of a completed burst or the last desired data element of a
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longer burst that is being truncated. The new READ command should be issued x cycles before
the clock edge at which the last desired data element is valid, where x equals the CAS latency
minus one (see Figure 28). For CAS latencies of two and three, data element n + 3 is either the
last of a burst of four or the last desired of a longer burst. The 64 Mbyte SDRAM uses a
pipelined architecture and therefore does not require the 2n rule associated with a prefetch
architecture. A READ command can be initiated on any clock cycle following a previous READ
command. Full-speed random read accesses can be performed to the same bank, as shown in
Figure 16 or each subsequent READ may be performed to a different bank.
Figure 29. SDRAM Read Burst Timing
9.2.5 SDRAM Write Operation, Write Burst, Write-to-Write, and Write-to-Precharge
Timing
WRITE bursts are initiated with a WRITE command.
The starting column and bank addresses are provided with the WRITE command, and auto
precharge is either enabled or disabled for that access. If auto precharge is enabled, the row
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being accessed is precharged at the completion of the burst. For the generic WRITE commands
used in the following illustrations, auto precharge is disabled.
During WRITE bursts, the first valid data-in element will be registered coincident with the
WRITE command. Subsequent data elements will be registered on each successive positive
clock edge. Upon completion of a fixed-length burst, assuming no other commands have been
initiated, the DQs will remain High-Z, and any additional input data will be ignored. A full-page
burst will continue until terminated. (At the end of the page, it will wrap to column 0 and
continue.)
Data for any WRITE burst may be truncated with a subsequent WRITE command, and data for a
fixed length WRITE burst may be immediately followed by data for a WRITE command. The
new WRITE command can be issued on any clock following the previous WRITE command,
and the data provided coincident with the new command applies to the new command (see
Figures 29, 30, 31, and 32).
Figure 30. SDRAM Write Operation Timing
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Figure 31. SDRAM Write Burst Timing
Figure 32. SDRAM Write-to-Write Timing
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Figure 33. SDRAM Write-to-Precharge Timing
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10. JTAG
The TAP controller is a synchronous Finite State Machine and responds to changes in the TMS
and TCK signals. States transition occurs on the rising edge of TCK. Values shown to the side
of each state represent the state of TMS at the time of the rising edge of TCK (see Figure 33).
There are two paths through the state machine. The instruction path captures and loads the
JTAG instructions into the instruction register. The data path captures and loads data into the
other three registers. The TAP controller executes the last instruction decode until a new
instruction is entered at the Update-IR state or until a reset is sent to the controller.
1
Test-Logic-Reset
1
0
Run-Test/Idle
1
1
Select-DR-Scan
0
Select-IR-Scan
0
0
Capture-DR
0
Capture-IR
0
1
1
Shift-DR
1
Shift-IR
1
0
0
0
Exit1-DR
0
Exit1-IR
0
0
0
Pause-DR
1
Pause-IR
1
0
1
1
Exit2-DR
1
Exit2-IR
1
Update-DR
Update-IR
1
0
1
0
Figure 34. JTAG State Machine
The JTAG port has four Read/Write registers. An ID register, By-Pass Register, Boundary Scan,
and Instruction Register (see Figure 34).
The TDO pin remains in the high impedance state except during a shift-DR or shift-IR controller
state. In the shift-DR and shift-IR controller states, TDO is updated on the falling edge of TCK.
TMS and TDI are sampled on the rising edge of TCK.
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Input Mux
Output Mux
ID Register
By-Pass Register
Boundary Scan
TDI
Instruction Register
Instruction Decode
Tap Controller
TMS
TCK
TDO
Figure 35. JTAG Port Register Interface
The timing of the JTAG signals is shown in Figure 35. The TDO pin remains in the high
impedance state except during a shift-DR or shift-IR controller state. In the shift-DR and
shift-IR controller states, TDO is updated on the falling edge of TCK. TMS and TDI are
sampled on the rising edge of TCK.
Figure 36. Timing of JTAG Signals
10.1 JTAG Scan Chain Debug Functionality
The JTAG port contains an 8-bit-wide instruction register. Instructions are transferred to this
register during the shift-IR state of the TAP state machine and are decoded by entering the
Update-IR state of the TAP. The JTAG controller executes the last decoded instruction until
another new one is entered and decoded. The instructions and data are entered serially through
the TDI pin, LSB first.
The JTAG Test Access Port (TAP) instruction shift register will support the debug scan chain
commands shown in Table 23.
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Table 23. Debug Scan Chain Commands Supported by the JTAG TAP
Scan
Chain
Length
Scan Chain
Reference
Number
JTAG
Instruction
Public or
Private
Scan Chain Function
00010000
READWRITEADDRCMD (Read/Write
37 bits
1
Private
Memory/Registers Address and Command)
00010001
00010010
00010011
READDATA (Read Memory/Registers Data)
WRITEDATA (Write Memory/Registers Data)
READPC_ANDCONTEXT (Read Program
Counter and Active context)
32 bits
32 bits
37 bits
2
7
4
Private
Private
Private
00010100
READWRITEDRBUGREG (Read/Write Debug
Control Register)
IDCODE (Read Device ID Register)
EXTEST (IO Boundary Scan)
15 bits
32 bits
5
Private
11111110
11111000
3
6
Public
Public
n bits
(I/O Pins)
11111010
SAMPLE/PRELOAD (Sample Boundary Scan
chain on “Capture-DR” state, Load Boundary
Scan chain on ‘Update-DR’ state)
N bits
(I/O Pins)
6
Public
11111111
00000111
00001111
BYPASS (Use TDI/TDO Bypass Register)
RUNBIST (Run Built in Self Test)
ENABLEATPG (Enable ATPG Mode for
Manufacturing Test)
1 bit
16 bits
N/A
9
8
N/A
Public
Public
Private
Notes:
1. The boundary-scan scan chain is selected via the EXETEST, SAMPLE, and PRELOAD
instructions.
2. The SAMPLE and PRELOAD instructions have the SAME binary code. (They are identified as
separate instructions in the JTAG Spec, but are allowed to have the same binary code for
backwards compatibility with previous version of spec.)
3. Any undefined bit pattern that is shifted into the Instruction Register will perform the same
function as the BYPASS instruction.
4. On Power-on Reset, or when the JTAG state machine enters the “Test Logic Reset” the
instruction register will reset its value to operate as the IDCODE Instruction (per JTAG Spec).
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11. Ordering Information
The packages (part numbers) currently available are listed in Table 24.
Table 24. Part Numbers by Package Types
Innovasic Part Number
Package Type
208-Lead QFP
Temperature Grade
fido1100PQF208IR1
Industrial
Lead-free (RoHS-compliant)
28- by 28-mm Package
fido1100BGA208IR1
208-Ball BGA, .5mm pitch
10- by 10-mm Package
Industrial
Industrial
Lead-free (RoHS-compliant)
fido1100BGB208IR1
208-Ball BGA, .8mm pitch
15- by 15-mm Package
Lead-free (RoHS-compliant)
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12. Errata
This chapter addresses issues discovered by our internal testing organization that may affect the
implementation of the fido1100. This information should be used in conjunction with The
fido1100 User Guide and The fido1100 Instruction Set Reference Guide to circumvent problems
during the design process and is not intended as a standalone design guide. Although
fido1100-specific terms are clearly described, in the interest of conciseness, many terms already
familiar to designers and developers are left undefined.
12.1 Summary
Table 25 presents a summary of errata.
Table 25. Summary of Errata
Errata
No.
Problem
Ver. 1
1
ADC Start Register Bit 0 (START) does not self clear when non-scanning
mode conversion for single channel or multi-channel is selected.
Exists
2
3
Fatal fault recovery sequence can be disturbed by interrupts.
Exists
Exists
The vectors are reversed when a trapx instruction is executed coincident
with an interrupt to a higher priority context.
4
5
When using the RDY_N signal to insert wait states (chip select timing
register RDY_ENABLE bit = 1), the Address bus timing is incorrect.
Exists
Exists
When using a JMP or JSR instruction in PC indirect with base displacement
addressing mode in assembly code projects, the CPU does not execute the
instruction correctly.
12.2 Detail
Errata No. 1
Problem: ADC Start Register Bit 0 (START) does not self clear when non-scanning mode
conversion for single channel or multi-channel is selected.
Description:
Scanning mode is controlled by ADC Control Register Bit 6 (SCAN).
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ADC Control Register Bit 4 (CD-Conversion Done) will correctly indicate that
conversion(s) are done.
An ADC interrupt will be issued if ADC interrupts are enabled. ADC interrupts are
enabled by setting ADC Control Register Bit 3 (IRQ_En) to 1.
ADC Data Available Register will correctly indicate which channels have updated results
in their Data Registers.
Workaround: When using non-scanning mode conversions, enable the ADC between each
commanded conversion (single channel or multi-channel):
Clear ADC Control Register Bit 7 (EN) to 0.
Set ADC Control Register Bit 7 (EN) to 1.
Set ADC Start Register Bit 0 (START) to 1 to start the conversion process.
ADC Conversion complete will be indicated by:
– An ADC interrupt, if ADC Control Register Bit 3 (IRQ_En) is set to 1.
– ADC Control Register Bit 4 (CD-Conversion Done) will set to indicate that
conversion(s) are done.
Errata No. 2
Problem: Fatal fault recovery sequence can be disturbed by interrupts.
Description:
Context Fatal Faults can occur if a context's stack pointer becomes corrupted. It is a feature of
the hardware to detect this "Fatal Fault" and allow a graceful recovery by directing an exception
to the Master Context. This operation can be disturbed if, by chance, an interrupt is triggered
during a bus cycle leading to a Fatal Fault. This problem occurs no matter which context the
interrupt is directed to. It need not be the faulting context. Furthermore, since neither interrupt
timing nor fatal faults are predictable, there is no way to guarantee this cannot happen. The effect
of this error depends on the interrupt mode of the context to which the interrupt is directed. If the
interrupted context is running in Fast Single Threaded mode, when an interrupt targeted to it
occurs during a faulting bus cycle (caused by another context) the CPU will lock up after the
faulting bus cycle completes. If the interrupted context is in Standard or Fast Vectored mode the
CPU will not lock up but the normal fault handling process will be disrupted. The effect is:
Both the interrupted and the faulting context will be set to Halted.
The fatal fault exception will be directed to the interrupted context rather than the Master.
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The expected interrupt will be directed (queued behind the fatal fault exception) to the
interrupted context.
The Master context will be moved to the ready state, with no modification of its program
counter, thus it will start running from where it left off previously.
All other contexts are unaffected.
Errata No. 3
Problem: The vectors are reversed when a trapx instruction is executed coincident with an
interrupt to a higher priority context.
Description: Given a low priority context currently executing and the master context and a
higher priority context sleeping, if an interrupt comes in for the higher priority context
simultaneously with the execution of a trapx instruction in the low priority context, it can happen
that the interrupt handler is executed by the master context (even though intended for the higher
priority context), while the trapx handler is executed by the higher priority context.
Workaround:
The workaround involves several issues:
1. Any interrupt handlers intended for other than the lowest priority context should
be executable by the master context.
2. The master context must have a valid vector to the appropriate interrupt handlers.
Either the master context and the other contexts share a vector table or the vectors
are duplicated on the master context's table. If the master context is executed in a
different mode than the other contexts (e.g. master in standard mode, other
context in fast-vectored mode), then a second interrupt handler must be coded that
is compatible with the master context's operating mode.
3. Trapx handlers should verify that they are being executed in the master context.
This assumes that they are performing some action that can only be executed in
the master context, and if so, then they should execute and set a flag to alert the
caller that they executed. If not, then they should return without setting the flag.
Also, trapx handlers must be present (in the appropriate execution mode) on all
vector tables.
4. The routine executing a trapx instruction should check the handshake flag from
the trapx handler after execution of the instruction. If it is not set appropriately,
the trapx should be executed again.
The approach given in 3 and 4 above, while more complex than simply having the trapx
handler issue a trapx instruction if not executed in the master context, avoids the issue of
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trapx handlers that rely on the Faulted Context register to determine what specific action to
take.
Errata No. 4
Problem: When using the RDY_N signal to insert wait states (chip select timing register
RDY_ENABLE bit = 1), the Address bus timing is incorrect.
Description: When used in this way, the Address bus will change states coincident with, or in
some cases, before the end of the bus cycle. This can cause data corruption in memory.
Workaround: There is no work around for this problem. It is recommended to avoid use of the
RDY_N signal and the RDY_ENABLE bit of the chip select timing registers.
Errata No. 5
Problem: When using a JMP or JSR instruction in PC indirect with base displacement
addressing mode in assembly code projects, the CPU does not execute the instruction correctly.
Description: Instead of jumping indirectly to the location pointed to by the effective address,
execution jumps to the effective address directly.
Workaround: There is no workaround for this problem. For assembly code projects, avoiding
use of the PC indirect addressing with base displacement mode is recommended.
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13. Revision History
Table 26 presents the sequence of revisions to document IA211080807.
Table 26. Revision History
Date
Revision Description
Page(s)
August 8,
2007
First edition released.
00
01
NA
Reformatted to meet publication standards. Technical data
updated. Errata added.
September
11, 2008
NA
17, 19, 26,
28, 35, 37,
50, 51
Changed “RESET” to “RESET_N” and “RESET_OUT” to
“RESET_OUT_N” in text, figures, and tables.
In Table 5, changed pin numbers in data row 14 from “F3” to
“G3”and in data row 19 from “G3” to “H3.”
36
In Table 5, changed pin numbers in data row 11 from “M14”
to “M15” and in data row 14 from “M15” to “M14.”
Deleted last row of Table 5 (duplicate).
In Table 7, changed numbers in data row 1 from “M14” to
“M15” and in data row 2 from “M15” to “M14.”
39
40
43
October 9,
2008
02
In Table 10, changed numbers in data rows 13, 14, 15, and
16 to “B6,” “P13,” “P14,” and “–,” from “P5,” “B6,” “P13,” and 44
“P14,” respectively, for column labeled “BGA 15 x 15.”
Added 2 new sentences at beginning of Section 7.2, “Signal
Considerations and Reset Timing.”
50
Changed “CLKVDD” to “VDDCLK” and “CLKGND” to
“GNDCLK” in note and Figures 11, 12, and 13.
52, 53
76 through
87
Updated errata chapter to reflect errata for Version 01.
To conform to publication standards, removed illustration
from cover. Changed Table 24, “Part Numbers by Package
Types,” to reflect Version 01 part numbers.
October 10,
2008
03
04
1, 75
Revised ordering information – package information; Added
Errata 2.
March 12,
2009
75 - 78
Revised description of when bus cycle terminates in a Read 61, 64, 76,
July 28, 2009 05
cycle; Added two errata.
78, 79
November
06
Updated LPSTOP power consumption.
49
20, 2009
April 15,
07
Added BGA signal routing guidance.
Added Errata 5
43, 44
81
2010
April 25,
08
2012
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14. For Additional Information
Innovasic’s fido1100 is the first product in the fido family of real-time communication
controllers. The fido communication controller architecture is uniquely optimized for solving
memory bottlenecks, and is designed from the ground up for deterministic processing. Critical
timing parameters, such as context switching and interrupt latency, are precisely predictable for
real-time tasks. The fido1100 also incorporates the Universal I/O Controller (UIC) that is
configurable to support various communication protocols across multiple platforms. This
flexibility relieves the designer of the task of searching product matrices to find the set of
peripherals that most closely match the system interface needs. The Software Profiling and
Integrated Debug EnviRonment (SPIDER) has extensive real-time code debug capabilities
without the burden of code instrumentation.
The fido1100 User Guide and The fido1100 Instruction Set Reference Guide as well as other
helpful tools and files are available. For example, the GDB debugger supports both profiling and
tracing of executing code.
The Innovasic Support Team is continually planning and creating tools for your use. Visit
http://www.innovasic.com for up-to-date documentation and software. Our goal is to provide
timely, complete, accurate, useful, and easy-to-understand information. Please feel free to
contact our experts at Innovasic at any time with suggestions, comments, or questions.
Innovasic Support Team
5635 Jefferson St. NE, Suite A
Albuquerque, NM 87109 USA
(505) 883-5263
Fax: (505) 883-5477
Toll Free: (888) 824-4184
E-mail: support@innovasic.com
Website: http://www.Innovasic.com
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