HMC311ST89 [ADI]

HMC311ST89;
HMC311ST89
型号: HMC311ST89
厂家: ADI    ADI
描述:

HMC311ST89

射频 微波
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HMC311ST89 / 311ST89E  
v04.0517  
InGaP HBT GAIN BLOCK  
MMIC AMPLIFIER, DC - 6 GHz  
Features  
Typical Applications  
The HMC311ST89(E) is ideal for:  
P1dB Output Power: +15.5 dBm  
Output IP3: +31.5 dBm  
Gain: 16 dB  
• Cellular / PCS / 3G  
• Fixed Wireless & WLAN  
• CATV & Cable Modem  
• Microwave Radio  
50 Ohm I/O’s  
Industry Standard SOT89 Package  
Included in the HMC-DK001 Designer’s Kit  
General Description  
Functional Diagram  
The HMC311ST89(E) is a GaAs InGaP Heterojunc-  
tion Bipolar Transistor (HBT) Gain Block MMIC SMT  
DC to 6 GHz amplifier. Packaged in an industry  
standard SOT89E, the amplifier can be used as either  
a cascadable 50 Ohm gain stage or to drive the LO of  
HMC mixers with up to +16.5 dBm output power. The  
HMC311ST89(E) offers 16 dB of gain and an output  
IP3 of +31.5 dBm while requiring only 54 mA from a  
+5V supply. The Darlington feedback pair used results  
in reduced sensitivity to normal process variations  
and yields excellent gain stability over temperature  
while requiring a minimal number of external bias  
components.  
Electrical Specifications, Vs= 5V, Rbias= 22 Ohm, TA = +25° C  
Parameter  
Min.  
Typ.  
Max.  
Units  
DC - 1.0 GHz  
1.0 - 4.0 GHz  
4.0 - 6.0 GHz  
14.0  
13.0  
12.5  
16.0  
15.0  
14.5  
dB  
dB  
dB  
Gain  
DC - 2.0 GHz  
2.0 - 4.0 GHz  
4.0 - 6.0 GHz  
0.004  
0.007  
0.012  
0.007  
0.012  
0.016  
dB/ °C  
dB/ °C  
dB/ °C  
Gain Variation Over Temperature  
DC - 2.0 GHz  
2.0 - 5.0 GHz  
5.0 - 6.0 GHz  
8
7
8
dB  
dB  
dB  
Return Loss Input / Output  
Reverse Isolation  
DC - 6 GHz  
20  
dB  
DC - 2.0 GHz  
2.0 - 4.0 GHz  
4.0 - 6.0 GHz  
13.5  
12.0  
10.0  
15.5  
15.0  
13.0  
dBm  
dBm  
dBm  
Output Power for 1 dB Compression (P1dB)  
DC - 1.0 GHz  
1.0 - 2.0 GHz  
2.0 - 4.0 GHz  
4.0 - 6.0 GHz  
31.5  
30  
27  
dBm  
dBm  
dBm  
dBm  
Output Third Order Intercept (IP3)  
Noise Figure  
24  
DC - 4 GHz  
4.0 - 6.0 GHz  
4.5  
5
dB  
Supply Current (Icq)  
55  
74  
mA  
Note: Data taken with broadband bias tee on device output.  
Information furnished by Analog Devices is believed to be accurate and reliable. However, no  
For price, delivery, and to place orders: Analog Devices, Inc.,  
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106  
rights of third parties that may result from its use. Specifications subject to change without notice. No  
Phone: 781-329-4700 • Order online at www.analog.com  
Application Support: Phone: 1-800-ANALOG-D  
license is granted by implication or otherwise under any patentorpatent rights ofAnalogDevices.
1
Trademarks and registered trademarks are the property of their respective owners.  
HMC311ST89 / 311ST89E  
v04.0517  
InGaP HBT GAIN BLOCK  
MMIC AMPLIFIER, DC - 6 GHz  
Broadband Gain & Return Loss  
Gain vs. Temperature  
20  
20  
15  
10  
5
18  
16  
14  
12  
10  
8
0
-5  
-10  
-15  
-20  
6
4
0
1
2
3
4
5
6
7
8
0
1
2
3
4
5
6
7
8
9
FREQUENCY (GHz)  
FREQUENCY (GHz)  
+25 C  
+85 C  
-40 C  
S21  
S11  
S22  
Input Return Loss vs. Temperature  
Output Return Loss vs. Temperature  
0
0
-5  
-10  
-15  
-20  
-5  
-10  
-15  
-20  
0
1
2
3
4
5
6
7
8
0
1
2
3
4
5
6
7
8
FREQUENCY (GHz)  
FREQUENCY (GHz)  
+25 C  
+85 C  
-40 C  
+25 C  
+85 C  
-40 C  
Reverse Isolation vs. Temperature  
Noise Figure vs. Temperature  
10  
0
-5  
-10  
-15  
-20  
-25  
8
6
4
2
0
0
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
FREQUENCY (GHz)  
FREQUENCY (GHz)  
+25 C  
+85 C  
-40 C  
+25 C  
+85 C  
-40 C  
For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106  
Phone: 781-329-4700 • Order online at www.analog.com  
2
Application Support: Phone: 1-800-ANALOG-D  
HMC311ST89 / 311ST89E  
v04.0517  
InGaP HBT GAIN BLOCK  
MMIC AMPLIFIER, DC - 6 GHz  
P1dB vs. Temperature  
18  
Psat vs. Temperature  
18  
16  
14  
12  
10  
8
16  
14  
12  
10  
8
6
6
4
4
0
1
2
3
4
5
6
7
8
0
1
2
3
4
5
6
7
8
FREQUENCY (GHz)  
FREQUENCY (GHz)  
+25 C  
+85 C  
-40 C  
+25 C  
+85 C  
-40 C  
Power Compression @ 1 GHz  
Power Compression @ 6 GHz  
18  
16  
14  
12  
10  
8
18  
16  
14  
12  
10  
8
6
6
4
4
2
2
0
0
-2  
-4  
-2  
-4  
-20 -18 -16 -14 -12 -10 -8 -6 -4 -2  
INPUT POWER (dBm)  
0
2
4
6
-20 -18 -16 -14 -12 -10 -8 -6 -4 -2  
INPUT POWER (dBm)  
0
2
4
6
Pout  
Gain  
PAE  
Pout  
Gain  
PAE  
Gain, Power, OIP3 & Supply Current vs.  
Supply Voltage @ 1 GHz  
Output IP3 vs. Temperature  
34  
80  
70  
60  
50  
40  
30  
20  
10  
40  
35  
30  
25  
20  
15  
10  
5
30  
26  
22  
18  
14  
10  
0
1
2
3
4
5
6
7
8
4.5  
4.75  
5
Vs (Vdc)  
5.25  
5.5  
FREQUENCY (GHz)  
Gain  
P1dB  
Psat  
IP3  
+25 C  
+85 C  
-40 C  
Icq  
For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106  
Phone: 781-329-4700 • Order online at www.analog.com  
3
Application Support: Phone: 1-800-ANALOG-D  
HMC311ST89 / 311ST89E  
v04.0517  
InGaP HBT GAIN BLOCK  
MMIC AMPLIFIER, DC - 6 GHz  
Absolute Maximum Ratings  
Collector Bias Voltage (Vcc)  
RF Input Power (RFIN)(Vcc = +3.9V)  
Junction Temperature  
+7V  
ELECTROSTATIC SENSITIVE DEVICE  
OBSERVE HANDLING PRECAUTIONS  
+10 dBm  
150 °C  
Continuous Pdiss (T = 85 °C)  
(derate 5.21 mW/°C above 85 °C)  
0.34 W  
Thermal Resistance  
(junction to lead)  
191 °C/W  
Storage Temperature  
Operating Temperature  
-65 to +150 °C  
-40 to +85 °C  
Class1A,  
Passed 250V  
ESD Sensitivity (HBM)  
Outline Drawing  
NOTES:  
1. PACKAGE BODY MATERIAL:  
MOLDING COMPOUND MP-180S OR EQUIVALENT.  
2. LEAD MATERIAL: Cu w/ Ag SPOT PLATING.  
3. LEAD PLATING: 100% MATTE TIN.  
4. DIMENSIONS ARE IN INCHES [MILLIMETERS]  
5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.  
6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.  
7. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.  
Package Information  
Part Number  
Package Body Material  
Lead Finish  
MSL Rating  
MSL1 [1]  
Package Marking [3]  
311  
XXXX  
HMC311ST89  
Low Stress Injection Molded Plastic  
Sn/Pb Solder  
H311  
XXXX  
MSL1 [2]  
HMC311ST89E  
RoHS-compliant Low Stress Injection Molded Plastic  
100% matte Sn  
[1] Max peak reflow temperature of 235 °C  
[2] Max peak reflow temperature of 260 °C  
[3] 4-Digit lot number XXXX  
For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106  
Phone: 781-329-4700 • Order online at www.analog.com  
4
Application Support: Phone: 1-800-ANALOG-D  
HMC311ST89 / 311ST89E  
v04.0517  
InGaP HBT GAIN BLOCK  
MMIC AMPLIFIER, DC - 6 GHz  
Pin Descriptions  
Pin Number  
Function  
Description  
Interface Schematic  
This pin is DC coupled.  
An off chip DC blocking capacitor is required.  
1
RFIN  
RF output and DC Bias for the output stage.  
3
RFOUT  
GND  
These pins and package bottom must be connected to RF/  
DC ground.  
2, 4  
Application Circuit  
Note:  
1. Select Rbias to achieve Icq using equation below,  
>
Rbias 22 Ohm.  
2. External blocking capacitors are required on  
RFIN and RFOUT.  
Icq = Vs - 3.8  
Rbias  
Recommended Component Values  
Frequency (MHz)  
Component  
50  
900  
1900  
18 nH  
100 pF  
2200  
2400  
15 nH  
100 pF  
3500  
8.2 nH  
100 pF  
5200  
3.3 nH  
100 pF  
5800  
3.3 nH  
100 pF  
L1  
270 nH  
0.01 µF  
56 nH  
100 pF  
18 nH  
C1, C2  
100 pF  
For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106  
Phone: 781-329-4700 • Order online at www.analog.com  
5
Application Support: Phone: 1-800-ANALOG-D  
HMC311ST89 / 311ST89E  
v04.0517  
InGaP HBT GAIN BLOCK  
MMIC AMPLIFIER, DC - 6 GHz  
Evaluation PCB  
List of Materials for Evaluation PCB 108313 [1]  
The circuit board used in the final application  
should use RF circuit design techniques. Signal  
lines should have 50 Ohm impedance while the  
package ground leads and package bottom should  
be connected directly to the ground plane similar to  
that shown. A sufficient number of via holes should  
be used to connect the top and bottom ground  
planes. The evaluation board should be mounted to  
an appropriate heat sink.The evaluation circuit board  
shown is available fromAnalog Devices upon request.  
Item  
J1 - J2  
J3 - J4  
C1, C2  
C3  
Description  
PCB Mount SMA Connector  
DC Pin  
Capacitor, 0402 Pkg.  
100 pF Capacitor, 0402 Pkg.  
1000 pF Capacitor, 0603 Pkg.  
2.2 µF Capacitor, Tantalum  
Resistor, 0805 Pkg.  
Inductor, 0603 Pkg.  
HMC311ST89(E)  
C4  
C5  
R1  
L1  
U1  
[2]  
PCB  
107368 Evaluation PCB  
[1] Reference this number when ordering complete evaluation PCB  
[2] Circuit Board Material: Rogers 4350  
For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106  
Phone: 781-329-4700 • Order online at www.analog.com  
6
Application Support: Phone: 1-800-ANALOG-D  

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