HMC327MS8G [ADI]
MMIC Power Amplifier SMT, 3 - 4 GHz;型号: | HMC327MS8G |
厂家: | ADI |
描述: | MMIC Power Amplifier SMT, 3 - 4 GHz 射频 微波 |
文件: | 总7页 (文件大小:360K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
HMC327MS8G / 327MS8GE
v06.1209
GaAs InGaP HBT MMIC
1/2 WATT POWER AMPLIFIER, 3 - 4 GHz
Typical Applications
Features
The HMC327MS8G(E) is ideal for:
• Wireless Local Loop
High Gain: 21 dB
Saturated Power: +30 dBm @ 45% PAE
Output P1dB: +27 dBm
• WiMAX & Fixed Wireless
• Access Points
Single Supply: +5V
• Subscriber Equipment
Power Down Capability
11
Low External Part Count
Compact MSOP Package: 14.8 mm2
Functional Diagram
General Description
The HMC327MS8G(E) is a high efficiency GaAs
InGaP Heterojunction Bipolar Transistor (HBT) MMIC
power amplifier which operates between 3 and 4 GHz.
The amplifier is packaged in a low cost, surface mo-
unt 8 leaded package with an exposed base for
improved RF and thermal performance. With a mini-
mum of external components, the amplifier provides
21 dB of gain, +30 dBm of saturated power at 45%
PAE from a single +5V supply. Power down capability
is available to conserve current consumption when the
amplifier is not in use.
Electrical Specifications, TA = +25 °C, Vs = 5V, Vctl = 5V
Parameter
Min.
17
Typ.
Max.
Units
GHz
dB
Frequency Range
3 - 4
Gain
21
24
Gain Variation Over Temperature
Input Return Loss
0.025
0.035
dB / °C
dB
15
Output Return Loss
8
dB
Output Power for 1dB Compression (P1dB)
Saturated Output Power (Psat)
Output Third Order Intercept (IP3)
Noise Figure
24
36
27
dBm
dBm
dBm
dB
30
40
5
Supply Current (Icq)
Vctl* = 0V/5V
Vctl* = 5V
0.002 / 250
mA
Control Current (Ipd)
7
mA
Switching Speed
tON, tOFF
40
ns
*See Application Circuit for proper biasing configuration.
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
For price, delivery, and to place orders: Analog Devices, Inc.,
responsibility is assumed byAnalogDevices foritsuse, nor for anyinfringementsofpatentsor other
rights of third parties thatmay resultfromitsuse.Specificationssubject to changewithout notice. NoPOhnoenTee:c7h8n1o-3lo2g9y-4W7a0y0, •P.OOr.dBeorxon9l1in0e6,aNtworwwwoo.adn,aMloAg.0c2o0m62-9106
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
11 - 2
Application Support: Phone: 1-800-ANALOG-D
Trademarks and registered trademarks are the property of their respective owners.
HMC327* PRODUCT PAGE QUICK LINKS
Last Content Update: 11/29/2017
COMPARABLE PARTS
View a parametric search of comparable parts.
DESIGN RESOURCES
• HMC327 Material Declaration
• PCN-PDN Information
EVALUATION KITS
• HMC327MS8G Evaluation Board
• Quality And Reliability
• Symbols and Footprints
DOCUMENTATION
Application Notes
DISCUSSIONS
View all HMC327 EngineerZone Discussions.
• Broadband Biasing of Amplifiers General Application Note
• MMIC Amplifier Biasing Procedure Application Note
SAMPLE AND BUY
• Thermal Management for Surface Mount Components
Visit the product page to see pricing options.
General Application Note
Data Sheet
TECHNICAL SUPPORT
• HMC327 Data Sheet
Submit a technical question or find your regional support
number.
TOOLS AND SIMULATIONS
DOCUMENT FEEDBACK
• HMC327 S-Parameter
Submit feedback for this data sheet.
REFERENCE MATERIALS
Product Selection Guide
• RF, Microwave, and Millimeter Wave IC Selection Guide
2017
Quality Documentation
• HMC Legacy PCN: MS##, MS##E and MS##G,MS##GE
packages - Relocation of pre-existing production
equipment to new building
• Package/Assembly Qualification Test Report: MS8G (QTR:
2014-00393)
• PCN: MS, QS, SOT, SOIC Packages - Sn/Pb Plating Vendor
Change
• Semiconductor Qualification Test Report: GaAs HBT-B
(QTR: 2013-00229)
This page is dynamically generated by Analog Devices, Inc., and inserted into this data sheet. A dynamic change to the content on this page will not
trigger a change to either the revision number or the content of the product data sheet. This dynamic page may be frequently modified.
HMC327MS8G / 327MS8GE
v05.0509
GaAs InGaP HBT MMIC
1/2 WATT POWER AMPLIFIER, 3 - 4 GHz
Broadband Gain & Return Loss
Gain vs. Temperature
25
15
5
24
20
16
S21
S11
S22
+25 C
+85 C
-40 C
12
8
-5
11
-15
-25
4
0
2
2.5
3
3.5
4
4.5
5
2.5
3
3.5
FREQUENCY (GHz)
4
4.5
4.5
4.5
FREQUENCY (GHz)
Input Return Loss vs. Temperature
Output Return Loss vs. Temperature
0
0
+25 C
+25 C
+85 C
-40 C
-5
-10
-15
-20
-25
-30
+85 C
-40 C
-3
-6
-9
-12
-15
2.5
3
3.5
FREQUENCY (GHz)
4
2.5
3
3.5
4
4.5
FREQUENCY (GHz)
P1dB vs. Temperature
Psat vs. Temperature
34
34
30
26
22
18
14
30
26
22
18
14
+25 C
+85 C
-40 C
+25 C
+85 C
-40 C
2.5
3
3.5
FREQUENCY (GHz)
4
4.5
2.5
3
3.5
FREQUENCY (GHz)
4
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
For price, delivery, and to place orders: Analog Devices, Inc.,
responsibility is assumed byAnalogDevices foritsuse, nor for anyinfringementsofpatentsor other
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
rights of third parties that may result from its use. Specifications subject to change without notice. No
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
11 - 3
HMC327MS8G / 327MS8GE
v05.0509
GaAs InGaP HBT MMIC
1/2 WATT POWER AMPLIFIER, 3 - 4 GHz
Power Compression @ 3.5 GHz
Output IP3 vs. Temperature
48
40
32
24
16
8
44
Pout
Gain
PAE
39
34
+25 C
+85 C
-40 C
29
24
19
14
11
0
-5
-1
3
7
11
15
2.5
3
3.5
FREQUENCY (GHz)
4
4.5
INPUT POWER (dBm)
Noise Figure vs. Temperature
Gain & Power vs. Supply Voltage
10
32
28
+25 C
+85 C
-40 C
8
6
4
2
0
30
28
26
24
22
26
24
22
20
P1dB
Psat
Gain
18
4.75
3
3.5
4
4.5
5
5.25
FREQUENCY (GHz)
Vcc SUPPLY VOLTAGE (V)
Reverse Isolation vs. Temperature
Power Down Isolation
0
0
-10
-10
-20
-30
-40
+25 C
+85 C
-40 C
-20
-30
-40
-50
-60
2.5
3
3.5
FREQUENCY (GHz)
4
4.5
2.5
3
3.5
4
4.5
FREQUENCY (GHz)
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
For price, delivery, and to place orders: Analog Devices, Inc.,
responsibility is assumed byAnalogDevices foritsuse, nor for anyinfringementsofpatentsor other
rights of third parties thatmay resultfromitsuse.Specificationssubject to changewithout notice. NoPOhnoenTee:c7h8n1o-3lo2g9y-4W7a0y0, •P.OOr.dBeorxon9l1in0e6,aNtworwwwoo.adn,aMloAg.0c2o0m62-9106
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
11 - 4
Application Support: Phone: 1-800-ANALOG-D
Trademarks and registered trademarks are the property of their respective owners.
HMC327MS8G / 327MS8GE
v05.0509
GaAs InGaP HBT MMIC
1/2 WATT POWER AMPLIFIER, 3 - 4 GHz
Gain, Power & Quiescent Supply
Absolute Maximum Ratings
Current vs. Vpd @ 3.5 GHz
250
200
150
100
50
30
Collector Bias Voltage (Vcc)
+5.5V
Control Voltage (Vpd)
+5.5V
25
RF Input Power (RFIN)(Vs = Vctl = +5V)
Junction Temperature
+16 dBm
150 °C
20
Icq
Continuous Pdiss (T = 85 °C)
(derate 29 mW/°C above 85 °C)
1.88 W
15
10
5
Thermal Resistance
(junction to ground paddle)
34 °C/W
11
P1dB
Psat
Gain
Storage Temperature
Operating Temperature
-65 to +150 °C
-40 to +85 °C
0
2.5
3
3.5
4
4.5
5
Vctl (V)
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Outline Drawing
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
5. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO
PCB RF GROUND.
Package Information
Part Number
Package Body Material
Lead Finish
MSL Rating
MSL1 [1]
Package Marking [3]
H327
XXXX
HMC327MS8G
HMC327MS8GE
Low Stress Injection Molded Plastic
Sn/Pb Solder
H327
XXXX
MSL1 [2]
RoHS-compliant Low Stress Injection Molded Plastic
100% matte Sn
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
For price, delivery, and to place orders: Analog Devices, Inc.,
responsibility is assumed byAnalogDevices foritsuse, nor for anyinfringementsofpatentsor other
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
rights of third parties that may result from its use. Specifications subject to change without notice. No
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
11 - 5
HMC327MS8G / 327MS8GE
v05.0509
GaAs InGaP HBT MMIC
1/2 WATT POWER AMPLIFIER, 3 - 4 GHz
Pin Descriptions
Pin Number
Function
Description
Interface Schematic
Power Control Pin. For proper control bias, this pin should be con-
nected to 5V through a series resistor of 130 Ohms. A higher voltage is
not recommended. For lower idle current, this voltage can be reduced.
1
Vpd
11
Ground: Backside of package has exposed metal ground paddle that
must be connected to ground thru a short path. Vias under the device
are required.
2, 4, 7
3
GND
RFIN
This pin is AC coupled
and matched to 50 Ohms.
RF output and bias for the output stage. The power supply for the
output device needs to be supplied to these pins.
5, 6
RFOUT
Power supply voltage for the first amplifier stage. An external bypass
capacitor of 330 pF is required. This capacitor should be placed as
close to the device as possible.
8
Vcc
Application Circuit
TL1
TL2
TL3
50 Ohm
0.1”
Impedance
Length
50 Ohm
0.038”
50 Ohm
0.231”
Note: C3 should be located <0.020” from Pin 8 (Vcc)
Note: C2 Should be located < 0.020” from L1
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
For price, delivery, and to place orders: Analog Devices, Inc.,
responsibility is assumed byAnalogDevices foritsuse, nor for anyinfringementsofpatentsor other
rights of third parties thatmay resultfromitsuse.Specificationssubject to changewithout notice. NoPOhnoenTee:c7h8n1o-3lo2g9y-4W7a0y0, •P.OOr.dBeorxon9l1in0e6,aNtworwwwoo.adn,aMloAg.0c2o0m62-9106
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
11 - 6
Application Support: Phone: 1-800-ANALOG-D
Trademarks and registered trademarks are the property of their respective owners.
HMC327MS8G / 327MS8GE
v05.0509
GaAs InGaP HBT MMIC
1/2 WATT POWER AMPLIFIER, 3 - 4 GHz
Evaluation PCB
11
List of Materials for Evaluation PCB 104991 [1]
The circuit board used in the application should
use RF circuit design techniques. Signal lines sho-
uld have 50 Ohm impedance while the package
ground leads and exposed paddle should be con-
nected directly to the ground plane similar to that
shown. A sufficient number of via holes should be
used to connect the top and bottom ground planes.
The evaluation board should be mounted to an
appropriate heat sink. The evaluation circuit board
shown is available from Hittite upon request.
Item
J1 - J2
J3
Description
PCB Mount SMA RF Connector
2 mm DC Header
C1 - C3
C4
330 pF Capacitor, 0603 Pkg.
1.2 pF Capacitor, 0603 Pkg.
2 pF Capacitor, 0402 Pkg.
2.2 μF Capacitor, Tantalum
3 nH Inductor, 0805 Pkg.
130 Ohm Resistor, 0603 Pkg.
HMC327MS8G(E) Amplifier
104829 Eval Board
C5
C6
L1
R1
U1
[2]
PCB
[1] Reference this number when ordering complete evaluation PCB
[2] Circuit Board Material: Rogers 4350
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
For price, delivery, and to place orders: Analog Devices, Inc.,
responsibility is assumed byAnalogDevices foritsuse, nor for anyinfringementsofpatentsor other
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
rights of third parties that may result from its use. Specifications subject to change without notice. No
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
11 - 7
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