HMC798ALC4TR-R5 [ADI]
24 GHz to 34 GHz, GaAs, MMIC, Subharmonic SMT Mixer;
| 型号： | HMC798ALC4TR-R5 |
| 厂家： | 
ADI |
| 描述： | 24 GHz to 34 GHz, GaAs, MMIC, Subharmonic SMT Mixer 局域网 射频 微波 |
| 文件： | 总26页 (文件大小：481K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
24 GHz to 34 GHz, GaAs, MMIC,
Subharmonic SMT Mixer
Data Sheet
HMC798ALC4
FEATURES
FUNCTIONAL BLOCK DIAGRAM
Single positive supply: 5 V at 97 mA
Conversion loss: 10 dB typical at 24 GHz to 30 GHz,
10.5 dB typical at 30 GHz to 34 GHz (upconverter)
Input IP3: 17.5 dBm typical at 24 GHz to 30 GHz,
20 dBm typical at 30 GHz to 34 GHz (upconverter)
2 × LO to RF isolation: 36 dB typical at 30 GHz to 34 GHz
Wide IF bandwidth: dc to 4 GHz
1
2
3
4
5
6
18
17
16
GND
NIC
NIC
GND
IF
GND
NIC
HMC798ALC4
GND
15 LO
14 GND
GND
13
GND
LO drive level: 4 dBm input
Subharmonically pumped 2 × LO
RoHS compliant, 24-terminal, 3.90 mm × 3.90 mm, ceramic
LCC package
PACKAGE
BASE
GND
Figure 1.
APPLICATIONS
Microwave and very small aperture terminal (VSAT) radios
Test equipment
Point to point radios
Satellite communications (SATCOM)
Military electronic warfare (EW), electronic countermeasure
(ECM), and command, control, communications and
intelligence (C3I)
GENERAL DESCRIPTION
The HMC798ALC4 is a 24 GHz to 34 GHz subharmonically
pumped (×2) MMIC mixer with an integrated LO amplifier housed
in a leadless, RoHS compliant LCC package. The HMC798ALC4
can be used as an upconverter or downconverter between 24 GHz
and 34 GHz.
to 34 GHz frequency range, eliminating the need for additional
filtering. The LO amplifier is single bias at a 5 V dc with a
typical 4 dBm LO drive level requirement The HMC798ALC4
eliminates the need for wire bonding, allowing use of surface-
mount technology (SMT) manufacturing techniques.
The 2 × LO to radio frequency (RF) isolation is typically 30 dB
in a 24 GHz to 30 GHz frequency range and 36 dB in a 30 GHz
Rev. 0
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Tel: 781.329.4700
Technical Support
©2018 Analog Devices, Inc. All rights reserved.
www.analog.com
HMC798ALC4
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Downconverter Performance ................................................... 10
Isolation and Return Loss ......................................................... 18
IF Bandwidth—Downconverter, Upper Sideband................. 20
IF Bandwidth—Downconverter, Lower Sideband................. 21
Spurious and Harmonics Performance ................................... 22
Theory of Operation ...................................................................... 23
Applications Information.............................................................. 24
Typical Application Circuit....................................................... 24
Evaluation PCB Information .................................................... 24
Soldering Information and Recommended Land Pattern.... 24
Outline Dimensions....................................................................... 26
Ordering Guide .......................................................................... 26
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
Thermal Resistance ...................................................................... 4
ESD Caution.................................................................................. 4
Pin Configuration and Function Descriptions............................. 5
Interface Schematics..................................................................... 5
Typical Performance Characteristics ............................................. 6
Upconverter Performance........................................................... 6
REVISION HISTORY
6/2018—Revision 0: Initial Version
Rev. 0 | Page 2 of 26
Data Sheet
HMC798ALC4
SPECIFICATIONS
VCC = 5 V, TA = 25°C, upconverter (IFIN) = 1 GHz at −10 dBm, LO = 4 dBm, upper side band. All measurements performed as an
upconverter, unless otherwise noted, on the evaluation printed circuit board (PCB).
Table 1.
Parameter
Symbol
Test Conditions/Comments
Min
Typ
Max
Unit
FREQUENCY RANGE
RF
LO Input
24
12
DC
34
18
4
GHz
GHz
GHz
mA
V
IF
SUPPLY CURRENT
SUPPLY VOLTAGE
LO DRIVE LEVELS
24 GHz to 30 GHz PERFORMANCE
Upconverter
ICC
97
5
125
5.25
6
VCC
4.75
0
4
dBm
IFIN
Conversion Loss
10
17.5
6
12.5
dB
dBm
dBm
Input Third-Order Intercept
Input 1 dB Compression Point
Downconverter
IP3
P1dB
IF
12.5
Conversion Loss
11
23
50
14
dB
Input Third-Order Intercept
Input Second-Order Intercept
Input 1 dB Compression Point
Isolation
IP3
IP2
P1dB
dBm
dBm
dBm
RF to IF
2 × LO to RF
2 × LO to IF
30
31
26.5
dB
dB
dB
22
15
30 GHz to 34 GHz PERFORMANCE
Upconverter
IFIN
Conversion Loss
10.5
20
9
13.5
dB
dBm
dBm
Input Third-Order Intercept
Input 1 dB Compression Point
Downconverter
IP3
P1dB
IF
Conversion Loss
10.5
25
43
dB
Input Third-Order Intercept
Input Second-Order Intercept
Input 1 dB Compression Point
Isolation
IP3
IP2
P1dB
dBm
dBm
dBm
15
RF to IF
2 × LO to RF
2 × LO to IF
32
36
27
dB
dB
dB
25
Rev. 0 | Page 3 of 26
HMC798ALC4
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
THERMAL RESISTANCE
RF Input Power
LO Input Power
IF Input Power
IF Source or Sink Current
VCC Supply Voltage
Peak Reflow Temperature
Maximum Junction Temperature (TJ)
Lifetime at Maximum (TJ)
Moisture Sensitivity Level (MSL)1
Continuous Power Dissipation, PDISS (TA =
85°C, Derate 8.33 mW/°C Above 85°C)
13 dBm
10 dBm
13 dBm
3 mA
5.5 V
260°C
175°C
1 × 106 hrs
MSL3
750 mW
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
θJA is the natural convection junction to ambient thermal
resistance measured in a one cubic foot sealed enclosure. θJC is
the junction to case thermal resistance.
Table 3. Thermal Resistance
Package Type
E-24-11
θJA
θJC
Unit
120
119
°C/W
1 See JEDEC Standard JESD51-2 for additional information on optimizing the
thermal impedance (PCB with 3 × 3 vias).
Operating Temperature Range
Storage Temperature Range
Lead Temperature Range
−40°C to +85°C
−65°C to +150°C
−65°C to +150°C
ESD CAUTION
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM)
Field Induced Charged Device Model
(FICDM)
250 V
250 V
1 Based on IPC/JEDEC J-STD-20 MSL classifications.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rev. 0 | Page 4 of 26
Data Sheet
HMC798ALC4
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
GND
NIC
NIC
GND
IF
1
2
3
4
5
6
18 GND
17 NIC
HMC798ALC4
16
15
GND
LO
TOP VIEW
(Not to Scale)
14 GND
13 GND
GND
NOTES
1. NOT INTERNALLY CONNECTED. THESE PINS
CAN BE CONNECTED TO RF AND DC GROUND.
PERFORMANCE IS NOT AFFECTED.
2. EXPOSED PAD. THE EXPOSED PAD MUST BE
CONNECTED TO RF AND DC GROUND.
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions
Pin No.
Mnemonic Description
1, 4, 6, 7, 9, 12, GND
13, 14, 16,
Ground. These pins and package bottom must be connected to RF and dc ground.
18, 19, 24
2, 3, 10, 17, 20, NIC
21, 22, 23
Not Internally Connected. These pins can be connected to RF and dc ground. Performance is not affected.
5
IF
Intermediate Frequency Port. This pin is dc-coupled. For applications not requiring operation to dc, dc block
this port externally using a series capacitor of a value chosen to pass the necessary IF frequency range. For
operation to dc, this pin must not source or sink more than 3 mA of current or die malfunction and possible
die failure may result.
8
RF
VCC
LO
EPAD
Radio Frequency Port. This pin is dc-coupled and matched to 50 Ω.
Power Supply for the LO Amplifier.
Local Oscillator Port. This pin is ac-coupled and matched to 50 Ω.
Exposed Pad. The exposed pad must be connected to RF and dc ground.
11
15
25
INTERFACE SCHEMATICS
GND
IF
Figure 3. GND Interface Schematic
Figure 5. IF Interface Schematic
LO
RF
Figure 4. LO Interface Schematic
Figure 6. RF Interface Schematic
Rev. 0 | Page 5 of 26
HMC798ALC4
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
UPCONVERTER PERFORMANCE
IFIN = 1 GHz, Upper Sideband
0
0
–5
T
T
T
= +85°C
= +25°C
= –40°C
LO = 6dBm
LO = 4dBm
LO = 2dBm
A
A
A
–5
–10
–15
–20
–10
–15
–20
23 24 25 26 27 28 29 30 31 32 33 34 35
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 7. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 4 dBm
Figure 10. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
25
20
15
30
25
20
15
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
10
5
LO = 6dBm
10
LO = 4dBm
LO = 2dBm
5
0
0
23 24 25 26 27 28 29 30 31 32 33 34 35
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 8. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 4 dBm
Figure 11. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
20
20
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
LO = 6dBm
LO = 4dBm
LO = 2dBm
15
10
5
15
10
5
0
0
23 24 25 26 27 28 29 30 31 32 33 34 35
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 9. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 4 dBm
Figure 12. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. 0 | Page 6 of 26
Data Sheet
HMC798ALC4
IFIN = 1 GHz, Lower Sideband
0
0
–5
T
T
T
= +85°C
= +25°C
= –40°C
LO = 6dBm
LO = 4dBm
LO = 2dBm
A
A
A
–5
–10
–15
–20
–10
–15
–20
23 24 25 26 27 28 29 30 31 32 33 34 35
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 13. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 4 dBm
Figure 16. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
30
T
T
T
= +85°C
= +25°C
= –40°C
LO = 6dBm
LO = 4dBm
LO = 2dBm
A
A
A
25
20
15
10
5
25
20
15
10
5
0
0
23 24 25 26 27 28 29 30 31 32 33 34 35
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 14. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 4 dBm
Figure 17. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
20
20
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
LO = 6dBm
LO = 4dBm
LO = 2dBm
15
10
5
15
10
5
0
0
23 24 25 26 27 28 29 30 31 32 33 34 35
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 15. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 4 dBm
Figure 18. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. 0 | Page 7 of 26
HMC798ALC4
Data Sheet
IFIN = 3.75 GHz, Upper Sideband
0
0
–5
T
T
T
= +85°C
= +25°C
= –40°C
LO = 6dBm
LO = 4dBm
LO = 2dBm
A
A
A
–5
–10
–15
–20
–10
–15
–20
23 24 25 26 27 28 29 30 31 32 33 34 35
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 19. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 4 dBm
Figure 22. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
30
T
T
T
= +85°C
= +25°C
= –40°C
LO = 6dBm
LO = 4dBm
LO = 2dBm
A
A
A
25
20
15
10
5
25
20
15
10
5
0
0
23 24 25 26 27 28 29 30 31 32 33 34 35
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 20. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 4 dBm
Figure 23. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
20
20
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
LO = 6dBm
LO = 4dBm
LO = 2dBm
15
10
5
15
10
5
0
0
23 24 25 26 27 28 29 30 31 32 33 34 35
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 21. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 4 dBm
Figure 24. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. 0 | Page 8 of 26
Data Sheet
HMC798ALC4
IFIN = 3.75 GHz, Lower Sideband
0
0
–5
T
T
T
= +85°C
= +25°C
= –40°C
LO = 6dBm
LO = 4dBm
LO = 2dBm
A
A
A
–5
–10
–15
–20
–10
–15
–20
23 24 25 26 27 28 29 30 31 32 33 34 35
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 25. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 4 dBm
Figure 28. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
30
T
T
T
= +85°C
= +25°C
= –40°C
LO = 6dBm
LO = 4dBm
LO = 2dBm
A
A
A
25
20
15
10
5
25
20
15
10
5
0
0
23 24 25 26 27 28 29 30 31 32 33 34 35
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 26. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 4 dBm
Figure 29. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
20
20
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
LO = 6dBm
LO = 4dBm
LO = 2dBm
15
10
5
15
10
5
0
0
23 24 25 26 27 28 29 30 31 32 33 34 35
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 27. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 4 dBm
Figure 30. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. 0 | Page 9 of 26
HMC798ALC4
Data Sheet
DOWNCONVERTER PERFORMANCE
IF = 1 GHz, Upper Sideband (Low-Side LO)
0
0
–5
T
T
T
= +85°C
= +25°C
= –40°C
LO = 6dBm
LO = 4dBm
LO = 2dBm
A
A
A
–5
–10
–15
–20
–10
–15
–20
23 24 25 26 27 28 29 30 31 32 33 34 35
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 31. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 4 dBm
Figure 33. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
25
20
15
30
25
20
15
LO = 6dBm
T
T
T
= +85°C
= +25°C
= –40°C
10
10
5
A
A
A
LO = 4dBm
LO = 2dBm
5
0
0
23 24 25 26 27 28 29 30 31 32 33 34 35
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 34. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Figure 32. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 4 dBm
Rev. 0 | Page 10 of 26
Data Sheet
HMC798ALC4
Downconverter IP2 and P1dB, Upper Sideband (Low-Side LO)
80
80
70
60
50
40
30
20
10
0
70
60
50
40
30
20
T
T
T
= +85°C
= +25°C
= –40°C
LO = 6dBm
LO = 4dBm
LO = 2dBm
A
A
A
10
0
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
Figure 35. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 4 dBm
Figure 37. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
20
15
10
20
15
10
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
LO = 6dBm
LO = 4dBm
5
5
LO = 2dBm
0
0
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
Figure 36. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 4 dBm
Figure 38. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. 0 | Page 11 of 26
HMC798ALC4
Data Sheet
IF = 1 GHz, Lower Sideband (High-Side LO)
0
0
–5
T
T
T
= +85°C
= +25°C
= –40°C
LO = 6dBm
LO = 4dBm
LO = 2dBm
A
A
A
–5
–10
–15
–20
–10
–15
–20
23 24 25 26 27 28 29 30 31 32 33 34 35
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 39. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 4 dBm
Figure 41. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
25
20
15
30
25
20
15
LO = 6dBm
LO = 4dBm
LO = 2dBm
T
T
T
= +85°C
= +25°C
= –40°C
10
5
A
A
A
10
5
0
0
23 24 25 26 27 28 29 30 31 32 33 34 35
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 40. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 4 dBm
Figure 42. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. 0 | Page 12 of 26
Data Sheet
HMC798ALC4
Downconverter IP2 and P1dB, Lower Sideband (High-Side LO)
80
80
70
60
50
40
30
20
10
0
T
T
T
= +85°C
= +25°C
= –40°C
LO = 6dBm
LO = 4dBm
LO = 2dBm
A
A
A
70
60
50
40
30
20
10
0
23 24 25 26 27 28 29 30 31 32 33 34 35
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 43. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 4 dBm
Figure 45. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
20
15
10
20
15
10
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
LO = 6dBm
LO = 4dBm
5
5
LO = 2dBm
0
0
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
Figure 44. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 4 dBm
Figure 46. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. 0 | Page 13 of 26
HMC798ALC4
Data Sheet
IF = 3.75 GHz, Upper Sideband (Low-Side LO)
0
0
–5
T
T
T
= +85°C
= +25°C
= –40°C
LO = 6dBm
LO = 4dBm
LO = 2dBm
A
A
A
–5
–10
–15
–20
–10
–15
–20
23 24 25 26 27 28 29 30 31 32 33 34 35
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 47. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 4 dBm
Figure 49. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
25
20
15
30
25
20
15
LO = 6dBm
T
T
T
= +85°C
= +25°C
= –40°C
10
5
10
A
A
A
LO = 4dBm
LO = 2dBm
5
0
0
23 24 25 26 27 28 29 30 31 32 33 34 35
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 48. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 4 dBm
Figure 50. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. 0 | Page 14 of 26
Data Sheet
HMC798ALC4
Downconverter IP2 and P1dB, Upper Sideband (Low-Side LO)
80
80
70
60
50
40
30
20
10
0
LO = 6dBm
LO = 4dBm
LO = 2dBm
70
60
50
40
30
20
T
T
T
= +85°C
= +25°C
= –40°C
10
A
A
A
0
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
Figure 51. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 4 dBm
Figure 53. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
20
15
10
20
15
10
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
LO = 6dBm
LO = 4dBm
5
0
5
LO = 2dBm
0
23 24 25 26 27 28 29 30 31 32 33 34 35
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 52. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 4 dBm
Figure 54. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. 0 | Page 15 of 26
HMC798ALC4
Data Sheet
IF = 3.75 GHz, Lower Sideband (High-Side LO)
0
0
–5
T
T
T
= +85°C
= +25°C
= –40°C
LO = 6dBm
LO = 4dBm
LO = 2dBm
A
A
A
–5
–10
–15
–20
–10
–15
–20
23 24 25 26 27 28 29 30 31 32 33 34 35
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 55. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 4 dBm
Figure 57. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
25
20
15
30
25
20
15
LO = 6dBm
T
T
T
= +85°C
= +25°C
= –40°C
10
5
A
A
A
10
LO = 4dBm
LO = 2dBm
5
0
0
23 24 25 26 27 28 29 30 31 32 33 34 35
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 56. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 4 dBm
Figure 58. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. 0 | Page 16 of 26
Data Sheet
HMC798ALC4
Downconverter IP2 and P1dB, Lower Sideband (High-Side LO)
80
80
70
60
50
40
30
20
10
0
LO = 6dBm
LO = 4dBm
LO = 2dBm
70
60
50
40
30
20
T
T
T
= +85°C
= +25°C
= –40°C
10
A
A
A
0
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
Figure 59. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 4 dBm
Figure 61. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
20
15
10
20
15
10
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
LO = 6dBm
LO = 4dBm
5
0
5
LO = 2dBm
0
23 24 25 26 27 28 29 30 31 32 33 34 35
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 60. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 4 dBm
Figure 62. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. 0 | Page 17 of 26
HMC798ALC4
Data Sheet
ISOLATION AND RETURN LOSS
Upconverter performance at IFIN = 1 GHz, upper sideband.
50
50
40
30
20
10
0
40
30
20
LO = 6dBm
LO = 4dBm
LO = 2dBm
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
10
0
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
Figure 63. 2 × LO to RF Isolation vs. RF Frequency at Various Temperatures,
LO = 4 dBm
Figure 66. 2 × LO to RF Isolation vs. RF Frequency at Various LO Power Levels,
TA = 25°C
50
40
30
20
50
40
30
20
LO = 6dBm
LO = 4dBm
LO = 2dBm
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
10
0
10
0
23 24 25 26 27 28 29 30 31 32 33 34 35
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 64. 2 × LO to IF Isolation vs. RF Frequency at Various Temperatures,
LO = 4 dBm
Figure 67. 2 × LO to IF Isolation vs. RF Frequency at Various LO Power Levels,
TA = 25°C
50
40
30
20
50
40
30
20
LO = 6dBm
LO = 4dBm
LO = 2dBm
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
10
0
10
0
23 24 25 26 27 28 29 30 31 32 33 34 35
23 24 25 26 27 28 29 30 31 32 33 34 35
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 65. RF to IF Isolation vs. RF Frequency at Various Temperatures,
LO = 4 dBm
Figure 68. RF to IF Isolation vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. 0 | Page 18 of 26
Data Sheet
HMC798ALC4
0
0
–10
–20
–30
–10
–20
–30
T
T
T
= +85°C
= +25°C
= –40°C
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
A
A
A
10
11
12
13
14
15
16
17
18
19
20
0
1
2
3
4
5
6
7
8
9
10
LO FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 69. LO Return Loss vs. LO Frequency at Various Temperatures,
LO = 4 dBm
Figure 71. IF Return Loss vs. IF Frequency at Various Temperatures,
LO = 14 GHz at 4 dBm
0
–10
–20
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
–30
20 11 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36
RF FREQUENCY (GHz)
Figure 70. RF Return Loss vs. RF Frequency at Various Temperatures,
LO = 14 GHz at 4 dBm
Rev. 0 | Page 19 of 26
HMC798ALC4
Data Sheet
IF BANDWIDTH—DOWNCONVERTER, UPPER SIDEBAND
LO frequency = 8 GHz.
0
0
–5
T
T
T
= +85°C
= +25°C
= –40°C
LO = 6dBm
LO = 4dBm
LO = 2dBm
A
A
A
–5
–10
–15
–20
–10
–15
–20
0.1
1.1
2.1
3.1
4.1
5.1
6.1
0.1
1.1
2.1
3.1
4.1
5.1
6.1
IF FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 72. Conversion Gain vs. IF Frequency at Various Temperatures,
LO = 4 dBm
Figure 74. Conversion Gain vs. IF Frequency at Various LO Power Levels,
TA = 25°C
30
30
T
T
T
= +85°C
= +25°C
= –40°C
LO = 6dBm
LO = 4dBm
LO = 2dBm
A
A
A
25
20
15
10
5
25
20
15
10
5
0
0.1
0
0.1
1.1
2.1
3.1
4.1
5.1
6.1
1.1
2.1
3.1
4.1
5.1
6.1
IF FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 73. Input IP3 vs. IF Frequency at Various Temperatures,
LO = 4 dBm
Figure 75. Input IP3 vs. IF Frequency at Various LO Power Levels,
TA = 25°C
Rev. 0 | Page 20 of 26
Data Sheet
HMC798ALC4
IF BANDWIDTH—DOWNCONVERTER, LOWER SIDEBAND
LO frequency = 13 GHz.
0
0
–5
T
T
T
= +85°C
= +25°C
= –40°C
LO = 6dBm
LO = 4dBm
LO = 2dBm
A
A
A
–5
–10
–15
–20
–10
–15
–20
0.1
1.1
2.1
3.1
4.1
5.1
6.1
0.1
1.1
2.1
3.1
4.1
5.1
6.1
IF FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 76. Conversion Gain vs. IF Frequency at Various Temperatures,
LO = 4 dBm
Figure 78. Conversion Gain vs. IF Frequency at Various LO Power Levels,
TA = 25°C
30
25
20
15
30
LO = 6dBm
LO = 4dBm
LO = 2dBm
25
20
15
10
5
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
10
5
0
0.1
0
0.1
1.1
2.1
3.1
4.1
5.1
6.1
1.1
2.1
3.1
4.1
5.1
6.1
IF FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 77. Input IP3 vs. IF Frequency at Various Temperatures,
LO = 4 dBm
Figure 79. Input IP3 vs. IF Frequency at Various LO Power Levels,
TA = 25°C
Rev. 0 | Page 21 of 26
HMC798ALC4
Data Sheet
SPURIOUS AND HARMONICS PERFORMANCE
M × N Spurious Outputs
Upconversion, Upper Sideband
Spur values are (M × IFIN) + (N × LO). IFIN = 0.1 GHz, LO =
10 GHz, RF power = −10 dBm, and LO power = 13 dBm. Mixer
spurious products are measured in dBc from the RF output power
level. N/A means not applicable.
Downconversion, Upper Sideband
Spur values are (M × RF) − (N × LO). RF = 10.1 GHz, LO =
10 GHz, RF power = −10 dBm, and LO power = 13 dBm. Mixer
spurious products are measured in dBc from the IF output power
level. N/A means not applicable.
N × LO
0
1
2
3
4
75
80
83
85
49
0
77
79
77
78
39
12
36
73
77
78
77
74
73
63
44
3
70
70
71
74
53
0
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
−5
−4
−3
−2
−1
0
N × LO
0
1
2
3
4
0
25
3
N/A
25
N/A
47
0
1
2
3
4
18
28
0
N/A
N/A
N/A
N/A
N/A
N/A
63
N/A
N/A
75
71
M × RF
14
0
M × IFIN
N/A
N/A
72
50
83
81
77
78
53
73
71
70
69
+1
+2
+3
+4
+5
N/A
44
68
73
72
Downconversion, Lower Sideband
Spur values are (M × RF) − (N × LO). RF = 14 GHz, LO =
14.1 GHz, RF power = −10 dBm, and LO power = 13 dBm.
Mixer spurious products are measured in dBc from the IF output
power level. N/A means not applicable.
Upconversion, Lower Sideband
Spur values are (M × IFIN) + (N × LO). IFIN = 0.1 GHz, LO =
14.1 GHz, RF power = −10 dBm, and LO power = 13 dBm.
Mixer spurious products are measured in dBc from the RF output
power level. N/A means not applicable.
N × LO
0
1
2
3
4
0
18
0
N/A
30
N/A
48
0
1
2
3
4
22
33
0
N × LO
N/A
N/A
N/A
N/A
N/A
N/A
58
N/A
N/A
75
62
M × RF
0
1
2
3
4
N/A
N/A
70
76
76
80
82
53
0
76
77
77
75
45
24
41
73
74
73
73
68
72
69
40
0
N/A N/A
N/A N/A
N/A N/A
N/A N/A
N/A N/A
N/A N/A
N/A N/A
N/A N/A
N/A N/A
N/A N/A
N/A N/A
−5
−4
−3
−2
−1
0
N/A
8
M × IFIN
53
82
79
79
75
0
+1
+2
+3
+4
+5
44
63
65
68
Rev. 0 | Page 22 of 26
Data Sheet
HMC798ALC4
THEORY OF OPERATION
The HMC798ALC4 is a subharmonically pumped (×2) MMIC
mixer with an integrated LO amplifier that can be used as an
upconverter or a downconverter from 24 GHz to 34 GHz. The
LO amplifier is single bias at a 5 V dc with a typical 4 dBm LO
drive level.
When used as a downconverter, the HMC798ALC4 downconverts
radio frequencies between 24 GHz and 34 GHz to intermediate
frequencies between dc and 4 GHz.
When used as an upconverter, the mixer up converts IF
between dc and 4 GHz to RF between 24 GHz and 34 GHz.
Rev. 0 | Page 23 of 26
HMC798ALC4
Data Sheet
APPLICATIONS INFORMATION
directly to the ground plane (see Figure 81). Use a sufficient
TYPICAL APPLICATION CIRCUIT
number of via holes to connect the top and bottom ground
planes. The evaluation circuit board shown in Figure 81 is
available from Analog Devices, Inc., upon request.
Figure 80 shows the typical application circuit for the
HMC798ALC4. The integrated LO amplifier is single bias at 5 V
with a typical 4 dBm input. Place capacitors as close as possible
to the pin to decouple the power supply. The LO and RF pins
are internally ac-coupled. The IF pin is internally dc-coupled.
When IF operation to dc is not required, use of an external
series capacitor is recommended, of a value chosen to pass the
necessary IF frequency range. When IF operation to dc is
required, do not exceed the IF source or sink current rating
specified in the Absolute Maximum Ratings section.
TERMINAL_SWAGE
Table 5. List of Materials for Evaluation PCB
EV1HMC798ALC4
Item
Description
J1
Johnson Surface-Mount Type A (SMA) connector
SRI 2.92 mm connector
HMC798ALC4
126598-1 evaluation board
C0G, 0402, 100 pF capacitor
X7R, 0603, 10000 pF capacitor
SMD, 3216, 4.7 µF capacitor
J2, J3
U1
PCB1
C1
C2
C3
GND
NIC
NIC
GND
IF
GND
NIC
1
2
3
4
5
6
18
17
16
15
14
13
1 126598-1 is the raw bare PCB identifier. Reference EV1HMC798ALC4 when
ordering the complete evaluation PCB.
HMC798ALC4
GND
LO
LO
K_SRI-NS
IF
SOLDERING INFORMATION AND RECOMMENDED
LAND PATTERN
GND
GND
GND
SMA_JC_062PCB
Figure 81 shows the recommended land pattern for the
HMC798ALC4. The HMC798ALC4 is contained in a 3.90 mm
× 3.90 mm, 24-terminal, ceramic LCC package with an exposed
ground pad (EPAD). This exposed pad is internally connected
to the ground of the chip. To minimize thermal impedance and
ensure electrical performance, solder the exposed pad to the
low impedance ground plane on the PCB. It is recommended
that the ground planes on all layers under the exposed pad be
stitched together with vias to further reduce thermal
RF
VCC
+
C1
100pF
C2
10nF
C3
4.7µF
TERMINAL_SWAGE
K_SRI-NS
Figure 80. Typical Application Circuit
EVALUATION PCB INFORMATION
impedance. The land pattern on the HMC798ALC4 evaluation
board provides a simulated thermal resistance (θJC) of 119° C / W.
Use RF circuit design techniques for the circuit board used in
the application. Ensure that signal lines have 50 Ω impedance,
and connect the package ground leads and the exposed pad
Rev. 0 | Page 24 of 26
Data Sheet
HMC798ALC4
.178" SQUARE
.004" MASK/METAL OVERLAP
.010" MIN MASK WIDTH
SOLDERMASK
GROUND PAD
PAD SIZE
.026" × .010"
PIN 1
.0197"
[0.50]
.116"
MASK
OPENING
.034"
TYPICAL
VIA
SPACING
ᶲ .010"
TYPICAL VIA
.010" REF
.030"
MASK OPENING
.098" SQUARE MASK OPENING
.020 × 45" CHAMFER FOR PIN 1
.106" SQUARE
GROUND PAD
Figure 81. Evaluation Board Land Pattern for the HMC798ALC4 Package
GND
126598-1
IF
LO
24 23 22 21 20 19
1
18
17
16
15
14
13
2
3
4
5
6
798A
XXXX
J3
J1
7
8 9 10 11 12
C1 C2
VCC
RF
C3
J2
Figure 82. Evaluation PCB Top Layer
Rev. 0 | Page 25 of 26
HMC798ALC4
Data Sheet
OUTLINE DIMENSIONS
4.05
3.90 SQ
3.75
0.36
0.30
0.24
PIN 1
0.08
BSC
INDICATOR
PIN 1
24
19
18
1
0.50
BSC
2.60
2.50 SQ
2.40
EXPOSED
PAD
13
6
12
7
BOTTOM VIEW
2.50 REF
0.32
BSC
TOP VIEW
SIDE VIEW
1.00
0.90
0.80
3.10 BSC
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SEATING
PLANE
SECTION OF THIS DATA SHEET.
Figure 83. 24-Terminal Ceramic Leadless Chip Carrier [LCC]
(E-24-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
HMC798ALC4
HMC798ALC4TR
HMC798ALC4TR-R5
EV1HMC798ALC4
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
MSL Rating2
MSL3
MSL3
MSL3
Package Description
Package Option
E-24-1
E-24-1
24-Terminal Ceramic Leadless Chip Carrier [LCC]
24-Terminal Ceramic Leadless Chip Carrier [LCC]
24-Terminal Ceramic Leadless Chip Carrier [LCC]
Evaluation PCB Assembly
E-24-1
1 All models are RoHS compliant parts.
2 The peak reflow temperature is 260°C. See the Absolute Maximum Ratings section, Table 2.
©2018 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D16785-0-6/18(0)
Rev. 0 | Page 26 of 26
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