HMC881ALP5ETR [ADI]
2.4 GHz to 4 GHz, Tunable Low-Pass Filter;
| 型号： | HMC881ALP5ETR |
| 厂家： | 
ADI |
| 描述： | 2.4 GHz to 4 GHz, Tunable Low-Pass Filter LTE |
| 文件： | 总11页 (文件大小：621K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
2.4 GHz to 4 GHz,
Tunable Low-Pass Filter
Data Sheet
HMC881A
FEATURES
FUNCTIONAL BLOCK DIAGRAM
Amplitude settling time: 200 ns (typical)
Wideband rejection: ≥35 dB
HMC881A
Single-chip replacement for mechanically tuned designs
RoHS compliant, 32-lead, 5 mm × 5 mm LFCSP package
GND
RFIN
GND
RFOUT
APPLICATIONS
Testing and measurement equipment
Military radar and electronic warfare/electronic
countermeasures (ECMs)
Satellite communication and space
Industrial and medical equipment
V
FCTL
Figure 1.
GENERAL DESCRIPTION
The HMC881A is a monolithic microwave integrated circuit
(MMIC) low-pass filter that features a user-selectable cutoff
frequency. The cutoff frequency can be varied from 2.4 GHz to
4 GHz by applying a single analog tuning voltage between 0 V
and 14 V. This low-pass filter provides a low 3 dB insertion loss,
16.5 dB return loss, and 1.35 × f3dB stopband attenuation of
>20 dB. This tunable filter can be used as a much smaller
alternative to physically large switched filter banks and cavity
tuned filters. The HMC881A has excellent microphonics due to
the monolithic design, and provides a dynamically adjustable
solution in advanced communications applications. The low-
pass tunable filter is packaged in a RoHS compliant 5 mm ×
5 mm LFCSP package.
Rev. 0
Document Feedback
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responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rightsof third parties that may result fromits use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks andregisteredtrademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Technical Support
©2019 Analog Devices, Inc. All rights reserved.
www.analog.com
HMC881A
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Typical Performance Characteristics ..............................................6
Theory of Operation .........................................................................9
Applications Information .............................................................. 10
Typical Application Circuit....................................................... 10
Evaluation PCB........................................................................... 10
Outline Dimensions....................................................................... 11
Ordering Guide .......................................................................... 11
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
ESD Caution.................................................................................. 4
Pin Configuration and Function Descriptions............................. 5
REVISION HISTORY
4/2019—Revision 0: Initial Version
Rev. 0 | Page 2 of 11
Data Sheet
HMC881A
SPECIFICATIONS
TA = 25°C, with tuning voltage (VFCTL) varying from 0 V to 14 V, unless otherwise noted.
Table 1.
Parameter
Min Typ
Max Unit
Test Conditions/Comments
FREQUENCY RANGE
Passband
Cutoff Frequency (f3dB
REJECTION
0
2.4
4
4
GHz
GHz
)
Stopband Frequency
Re-Entry Frequency
LOSS
1.35 × f3dB
≥30
GHz
GHz
≥20 dB attenuation
≥35 dB wideband rejection
Insertion Loss
Return Loss
3
16.5
dB
dB
DYNAMIC PERFORMANCE
Maximum Input Power for Linear
Operation
10
dBm
Input Third-Order Intercept
Group Delay
Amplitude Settling
41
0.5
200
dBm
ns
ns
Input power (PIN) = 20 dBm, two-tone
Time to settle to minimum insertion loss, within ≤0.5 dB of
static insertion loss
Drift Rate
0.6
MHz/°C
dBc/Hz
RESIDUAL PHASE NOISE
1 MHz Offset
−170
TUNING
Voltage (VFCTL
Current (IFCTL
)
0
14
1
V
µA
)
Rated current for pin
Rev. 0 | Page 3 of 11
HMC881A
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 2.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Parameter
Rating
Tuning
Voltage (VFCTL
Current (IFCTL
RF Input Power
Temperature
)
−0.5 V to +15 V
1 mA
27 dBm
)
ESD CAUTION
Operating Temperature Range
Storage Temperature Range
Junction Temperature for 1Million Mean
Time to Failure (MTTF)
−40°C to +85°C
−65°C to +150°C
175°C
Nominal Junction Temperature
(Exposed Pad Temperature (TEPAD) = 85°C,
PIN = 10 dBm)
90°C
Electrostatic Discharge (ESD) Rating
Human Body Model (HBM)
Field Induced Charge Device Model
(FICDM)
1500 V
1250 V
Moisture Sensitivity Level (MSL) Rating
MSL3
Rev. 0 | Page 4 of 11
Data Sheet
HMC881A
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
NIC
NIC
NIC
1
2
3
4
5
6
7
8
24 NIC
23
22 NIC
21 NIC
NIC
HMC881
A
NIC
TOP VIEW
20
19
GND
RFIN
NIC
GND
RFOUT
(Not to Scale)
18 NIC
17 NIC
NIC
NOTES
1. NIC = NOT INTERNALLY CONNECTED. ALL DATA SHOWN
HEREIN WAS MEASURED WITH THESE PINS CONNECTED
TO RF AND DC GROUND EXTERNALLY.
2. EXPOSED PAD. THE PACKAGE BOTTOM HAS AN EXPOSED
PAD THAT MUST BE CONNECTED TO RF AND DC GROUND.
Figure 2. Pin Configuration
Table 3. Pin Function Descriptions
Pin No.
Mnemonic Description
1 to 4, 7 to 13, 15 to
18, 21 to 32
NIC
Not Internally Connected. These pins are not connected internally. All data shown herein was measured
with these pins connected to RF and dc ground externally.
5, 20
6
GND
RFIN
Ground. Connect these pins to RF and dc ground.
Radio Frequency Input. This pin is dc-coupled and matched to 50 Ω. Do not apply an external voltage
to this pin.
14
19
VFCTL
RFOUT
Tuning Voltage. This pin controls the cutoff frequency of the device.
Radio Frequency Output. This pin is dc-coupled and matched at 50 Ω. Do not apply an external
voltage to this pin.
EPAD
Exposed Pad. The package bottom has an exposed metal pad that must be connected to RF and dc
ground.
GND
15nH 500Ω
V
FCTL
34.5pF
6.1pF
Figure 3. GND Interface Schematic
Figure 5. VFCTL Interface Schematic
RFIN
RFOUT
1.0kΩ
1.0kΩ
Figure 4. RFIN Interface Schematic
Figure 6. RFOUT Interface Schematic
Rev. 0 | Page 5 of 11
HMC881A
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
0
0
–10
–20
–30
–40
14V
7V
0V
–10
–20
–30
–40
–50
–60
–70
–80
S22, 14V
S22, 7V
S22, 0V
S11, 14V
S11, 7V
S11, 0V
0
5
10
15
20
25
30
0
5
10
15
20
25
30
BROADBAND RF FREQUENCY (GHz)
BROADBAND RF FREQUENCY (GHz)
Figure 7. Insertion Loss vs. Broadband RF Frequency at Various VFCTL Voltages
Figure 10. Return Loss vs. Broadband RF Frequency at Various VFCTL Voltages
0
0
14V
7V
0V
–2
–4
–10
–20
–6
–30
–8
S22, 14V
S22, 7V
S22, 0V
–40
–10
–12
S11, 14V
S11, 7V
S11, 0V
–50
0
1
2
3
4
5
0
1
2
3
4
5
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 8. Insertion Loss vs. RF Frequency at Various VFCTL Voltages
Figure 11. Return Loss vs. RF Frequency at Various VFCTL Voltages
0
–10
–20
–30
–40
0
+85°C
+25°C
–40°C
–2
–4
–6
–8
S22, –40°C
S22, +25°C
S22, +85°C
S11, –40°C
S11, +25°C
S11, +85°C
–50
–60
–10
–12
0
1
2
3
4
5
0
1
2
3
4
5
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 12. Return Loss vs. RF Frequency at Various Temperatures, VFCTL = 7 V
Figure 9. Insertion Loss vs. RF Frequency at Various Temperatures, VFCTL = 7 V
Rev. 0 | Page 6 of 11
Data Sheet
HMC881A
5
2
–2
+85°C
+25°C
–40°C
+85°C
+25°C
–40°C
4
3
2
1
–6
–10
–14
–18
–22
–26
–30
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14
V
(V)
V
(V)
FCTL
FCTL
Figure 13. Cutoff Frequency (f3dB) vs. VFCTL at Various Temperatures
Figure 16. Maximum Return Loss vs. VFCTL at Various Temperatures, 2 dB
Bandwidth
1.5
250
+85°C
+25°C
–40°C
+85°C
+25°C
–40°C
1.4
1.3
1.2
1.1
1.0
200
150
100
50
0
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14
V
(V)
V
(V)
FCTL
FCTL
Figure 14. Rejection Ratio vs. VFCTL at Various Temperatures; Rejection Ratio Is the
Ratio of the Frequency of Which the Relative Insertion Loss Is 20 dB to f3dB
Figure 17. Tuning Sensitivity vs. VFCTL at Various Temperatures
0
–100
+85°C
14V
7V
0V
+25°C
–110
–120
–130
–140
–150
–160
–170
–180
–40°C
–1
–2
–3
–4
–5
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14
10
100
1k
10k
100k
1M
10M
100M
V
(V)
OFFSET FREQUENCY (GHz)
FCTL
Figure 18. Residual Phase Noise vs. Offset Frequency at
Various VFCTL Voltages
Figure 15. Insertion Loss vs. VFCTL at Various Temperatures
Rev. 0 | Page 7 of 11
HMC881A
Data Sheet
1.0
25
20
15
10
5
V
V
V
V
V
= 0V
FCTL
FCTL
FCTL
FCTL
FCTL
0V
= 3V
7V
= 7V
= 10V
= 14V
14V
0.8
0.6
0.4
0.2
0
–5
–10
–15
0
0.5
1.5
2.5
3.5
4.5
5.5
6.5
0
2
4
6
8
10 12 14 16 18 20 22 24 26
INPUT POWER (dBm)
RF FREQUENCY(GHz)
Figure 19. Group Delay vs. RF Frequency at Various VFCTL Voltages
Figure 21. Phase Shift vs. Input Power at Various VFCTL Voltages
50
45
40
35
30
25
20
15
+85°C
10
+25°C
–40°C
5
0
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14
V
(V)
FCTL
Figure 20. Input IP3 vs. VFCTL at Various Temperatures, PIN = 20 dBm
Rev. 0 | Page 8 of 11
Data Sheet
HMC881A
THEORY OF OPERATION
The HMC881A is a MMIC low-pass filter that features a user-
selectable pass band frequency. Varying the applied analog
tuning voltage between 0 V and 14 V at VFCTL varies the f3dB
frequency between 2.4 GHz and 4 GHz.
Rev. 0 | Page 9 of 11
HMC881A
Data Sheet
APPLICATIONS INFORMATION
PRIMARY SILKSCREEN
PRIMARY SOLDER MASK
PRIMARY SIDE (LAYER 1)
TYPICAL APPLICATION CIRCUIT
Figure 22 shows the typical application circuit for the
HMC881A. The RFIN and RFOUT pins are DC-coupled and
require external, 100 pF series capacitors (C1 and C2).
0.5oz Cu
ARLON OR ROGERS CORE 10MILS ±1MIL (CRITICAL)
NOMINAL
FINISHED
0.5oz Cu
PREPREG AS REQUIRED
L2_GND PLANE (LAYER 2)
BOARD
THICKNESS 0.062"
±10%
0.5oz Cu
370HR
L3_GND PLANE (LAYER 3)
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
0.5oz Cu
SECONDARY SIDE (LAYER 4)
HMC881A
Figure 23. Cross Sectional View of the EV1HMC881ALP5 PCB layers
C2
100pF
C1
100pF
IN
J1
OUT
J2
The circuit board in this application uses RF circuit design
techniques. Signal lines must have 50 Ω impedance and the
package ground leads and exposed pad must be connected
directly to the ground plane (see Figure 23). Use a sufficient
number of via holes to connect the top and bottom ground
planes. The evaluation circuit board shown in Figure 24 is
available from Analog Devices, Inc., upon request.
PACKAGE
BASE
V
FCTL
J3
GND
Figure 22. Typical Application Circuit
EVALUATION PCB
Table 4. Bill of Materials for the EV1HMC881ALP5
All RF traces are routed on Layer 1 (primary side) and the
remaining three layers are ground planes that provide a solid
ground for RF transmission lines, as shown in Figure 23. The
top dielectric material is Rogers 4350, which offers low loss
performance. The prepreg material in Layer 2 attaches the Isola
370HR core layer with copper traces layers above and below the
core layer. Both prepreg material and the Isola 370HR core layer
are used to achieve the required board finish thickness.
Item
Description
J1 to J2 PCB mount SRI Subminiature Version A (SMA)
Connector
J3 to J4 PCB mount Johnson SMA connector
C1, C2
U1
PCB1
Capacitor, 100 pF, 0402
HMC881A
08-0495982 evaluation PCB
1 Circuit board material is Arlon 25FR or Rogers 25FR
2 08-049598 is the raw, bare PCB identifier. Reference the EV1HMC881ALP5
when ordering the complete evaluation PCB.
1.000
2 × 0.095
2 × R.032
2.000
1.570
Figure 24. Evaluation PCB Top Layer Outline Dimensions
Rev. 0 | Page 10 of 11
Data Sheet
HMC881A
OUTLINE DIMENSIONS
DETAIL A
(JEDEC 95)
5.10
5.00 SQ
4.90
0.30
0.25
0.18
PIN 1
INDICATOR
AREA
PIN 1
25
32
IONS
INDICATOR AR EA OP T
(SEE DETAIL A)
24
1
0.50
BSC
3.75
EXPOSED
PAD
3.60 SQ
3.55
17
8
16
9
0.50
0.40
0.30
0.20 MIN
TOP VIEW
TOP VIEW
0.80
0.75
0.70
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
0.05 MAX
0.02 NOM
COPLANARITY
0.08
SECTION OF THIS DATA SHEET.
SEATING
PLANE
0.20 REF
COMPLIANT TO JEDEC STANDARDS MO-220-WHHD-5
Figure 25. 32-Lead Lead Frame Chip Scale Package [LFCSP]
5 mm × 5 mm Body and 0.75 mm Package Height
(CP-32-12)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
−40°C to +85°C
−40°C to +85°C
Package Description
Package Option
HMC881ALP5E
HMC881ALP5ETR
EV1HMC881ALP5
32-Lead Lead Frame Chip Scale Package [LFCSP]
32-Lead Lead Frame Chip Scale Package [LFCSP]
Evaluation PCB
CP-32-12
CP-32-12
1 All models are RoHS compliant parts.
©2019 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D17299-0-4/19(0)
Rev. 0 | Page 11 of 11
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