HMC911LC4BTR [ADI]
Broadband Analog Time Delay to 24 GHz;
| 型号： | HMC911LC4BTR |
| 厂家： | 
ADI |
| 描述： | Broadband Analog Time Delay to 24 GHz |
| 文件： | 总14页 (文件大小：1520K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Broadband Analog Time Delay to 24 GHz
Data Sheet
HMC911
FEATURES
FUNCTIONAL BLOCK DIAGRAM
Very wide bandwidth to 24 GHz
Time delay range: 70 ps typical
Single-ended or differential operation
Adjustable differential output amplitude with 780 mV p-p typical
at 10 GHz
Delay control modulation bandwidth: 1.6 GHz typical
Single supply: 3.3 V
NC
GND
INP
1
2
3
4
5
6
18 NC
17 GND
16 QP
15 QN
14 GND
V
CC
V
CC
HMC911
AMP
BUF
24-terminal ceramic, leadless chip carrier (LCC)
INN
TEMPERATURE
COMPENSATION
AND BIAS
APPLICATIONS
GND
EN
V
CC
BUF
V
CC
Synchronization of clock and data
Transponder design
13
V
EE
Serial data transmissions up to 32 Gbps
Broadband test and measurement
RF ATE applications
PACKAGE
BASE
GND
Figure 1.
GENERAL DESCRIPTION
The HMC911 is a broadband time delay with 62 ps to 75 ps
continuously adjustable delay range to 24 GHz. The delay control
is linearly monotonic with respect to the differential delay control
voltage (VDCP and VDCN), and the control input has a modulation
bandwidth of 1.6 Hz. The HMC911 provides a differential
output voltage with constant amplitude for single-ended or
differential input voltages above the input sensitivity level, and
the output voltage swing can be adjusted using the VAC control pin.
The HMC911 features internal temperature compensation and
bias circuitry to minimize delay variations with temperature. All
RF inputs and outputs of the HMC911 are internally terminated
with 50 Ω to VCC and can be ac-coupled or dc-coupled. Output
pins connect directly to a 50 Ω to VCC terminated system.
However, use dc blocking capacitors if the terminated system
input is 50 Ω to a dc voltage other than VCC
.
The HMC911 is available in a RoHS-compliant, 24-terminal,
ceramic, leadless chip carrier.
Rev. B
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HMC911* PRODUCT PAGE QUICK LINKS
Last Content Update: 02/23/2017
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DOCUMENTATION
Data Sheet
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Sheet
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REFERENCE MATERIALS
Quality Documentation
TECHNICAL SUPPORT
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number.
• Package/Assembly Qualification Test Report: LC4, LC4B
(QTR: 2014-00380 REV: 01)
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HMC911
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Pin Configuration and Function Descriptions..............................5
Interface Schematics .....................................................................6
Typical Performance Characteristics ..............................................7
Applications Information .............................................................. 11
Evaluation Printed Circuit Board (PCB)................................. 11
Typical Application Circuit........................................................... 12
Outline Dimensions....................................................................... 13
Ordering Guide .......................................................................... 13
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
ESD Caution.................................................................................. 4
REVISION HISTORY
10/2016—Rev. v02.0614 to Rev. B
Changes to Figure 13 Caption .........................................................7
Changes to Figure 17 Caption and Figure 20 Caption .................8
Changes to Figure 31 Caption ...................................................... 10
Changes to Table 4.......................................................................... 11
Changes to Typical Application Circuit Section ........................ 12
Updated Outline Dimensions....................................................... 13
Changes to Ordering Guide.......................................................... 13
Updated Format..................................................................Universal
Changes to Product Title, Features Section, and General
Description Section.......................................................................... 1
Changes to Table 1............................................................................ 3
Changes to Table 2............................................................................ 4
Changes to Table 3............................................................................ 5
Changes to Figure 4 and Figure 6................................................... 6
Rev. B | Page 2 of 13
Data Sheet
HMC911
SPECIFICATIONS
TA = 25°C, VCC = 3.3 V, VAC = 2.6 V, VEE = GND = 0 V, unless otherwise noted.
Table 1.
Parameter
Min
Typ
Max
Unit
Test Conditions/Comments
5% tolerance
POWER SUPPLY
Voltage
Current
3.13
460
3.3
3.47
530
V
mA
TIME DELAY RANGE
10 GHz
18 GHz
VDCP = 3.9 V, VDCN = 3.3 V
62
64
66
70
70
70
71
73
75
ps
ps
ps
22 GHz
TIME DELAY SENSITIVITY
Voltage
116
ps/V
Temperature
PHASE SHIFT RANGE
10 GHz
18 GHz
22 GHz
0.04
ps/°C
VDCP = VDCN = 3.3 V at 18 GHz
VDCP = 3.9 V, VDCN = 3.3 V
210
400
515
32
250
475
595
Degrees
Degrees
Degrees
Gbps
MAXIMUM DATA RATE
MAXIMUM CLOCK FREQUENCY
DELAY CONTROL
Modulation Bandwidth
Voltage (VDCP and VDCN
INPUT VOLTAGE
Low (VIL)
24
GHz
1.6
GHz
V
)
VCC − 0.6
VCC + 0.6
VCC − 500 VCC − 200 VCC − 25
mV
High (VIH)
VCC + 25
VCC + 200 VCC + 500 mV
INPUT AMPLITUDE, PEAK TO PEAK
Single Ended
Differential
50
100
1000
2000
mV p-p
mV p-p
OUTPUT AMPLITUDE
10 GHz
VAC = 2.6 V
370
740
350
700
340
680
1.7
390
780
375
750
350
700
2.6
640
1280
640
1280
640
1280
2.7
mV p-p
mV p-p
mV p-p
mV p-p
mV p-p
mV p-p
V
Single-ended
Differential
Single-ended
Differential
Single-ended
Differential
18 GHz
22 GHz
CONTROL VOLTAGE (VAC)
HARMONIC SUPPRESSION (fIN − 2fIN)1, 2
VDCP = VDCN = 3.3 V
10 GHz
20 GHz
21
19
32
30
dBc
dBc
RETURN LOSS
Input
Output
Frequency < 24 GHz
32 Gbps, 10101 … data
9
10
0.3
dB
dB
RMS JITTER
TIME3
ps, p-p
Rise (tR)
Fall (tF)
15
14
ps
ps
ps
PROPAGATION DELAY
480
VDCP = 2.7 V, VDCN = 3.3 V (relative to zero time delay)
1 Harmonic suppression measurements were taken for single-ended inputs and outputs.
2 fIN is the fundamental frequency.
3 VINPUT = differential 400 mV p-p, and fDATA = 22.5 Gbps, and pseudorandom bit sequences (PRBS) 233 − 1
Rev. B | Page 3 of 13
HMC911
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 2.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Parameter
Rating
Power Supply Voltage (VCC)
Input Voltage (VIN)
−0.5 V to +3.75 V
VCC – 1.2 V to
V
CC + 0.6 V
Output Voltage (VOUT
)
VCC – 1.2 V to
VCC + 0.6 V
Delay Control Voltage (VDCP, VDCN
Power-Down (Enable) Pin (EN)
Amplitude Control (VAC)
Continuous Power Dissipation, PDISS (TA =
85°C, Derate 54.96 mW/°C above 85°C)
)
0 V to VCC + 0.6 V
0 V to VCC + 0.6 V
0 V to VCC + 0.6 V
2.2 W
ESD CAUTION
Thermal Resistance (Junction to Ground
Paddle)
Channel Temperature (TC)
Maximum Peak Reflow Temperature (MSL3)1 260°C
18.2°C/W
125°C
Storage Temperature Range
Operating Temperature Range
Electrostatic Discharge (ESD)
Human Body Model (HBM)
1 See the Ordering Guide section.
−65°C to +125°C
−40°C to +85°C
Class 1B
Rev. B | Page 4 of 13
Data Sheet
HMC911
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
NC
GND
INP
1
2
3
4
5
6
18 NC
17 GND
16 QP
15 QN
14 GND
HMC911
TOP VIEW
(Not to Scale)
INN
GND
EN
13
V
EE
PACKAGE
BASE
GND
NOTES
1. NC = NO CONNECT.
2. EXPOSED PAD. CONNECT THE EXPOSED
PAD TO RF/DC GROUND
Figure 2. Pin Configuration
Table 3. Pin Function Descriptions
Pin No.
Mnemonic Description
1, 18
NC
No Connect. These pins are not connected internally; however, all data shown herein was measured with these
pins connected to RF/dc ground externally.
2, 5, 14, 17
GND
INP
INN
EN
Ground Pin. Connect these signal grounds to 0 V. See Figure 3 for the interface schematic.
Positive Differential RF Input Pin. See Figure 4 for the interface schematic.
Negative Differential RF Input Pin. See Figure 4 for the interface schematic.
Enable Pin for the Time Delay. For normal operation, leave this pin open or apply 3.3 V. To disable the HMC911,
apply 0 V. When disabled, the total current consumption drops to 15 mA. See Figure 5 for the interface schematic.
3
4
6
7, 8, 11, 13
9
10
12
15
16
19 to 24
VEE
Supply Grounds. Connect these pins to 0 V. See Figure 6 for the interface schematic.
Positive Differential Time Delay Control Pin. See Figure 7 for the interface schematic.
Negative Differential Time Delay Control Pin. See Figure 7 for the interface schematic.
Output Amplitude Control Pin. See Figure 8 for the interface schematic.
Negative Differential RF Output Pin. See Figure 9 for the interface schematic.
Positive Differential RF Output Pin. See Figure 9 for the interface schematic.
Positive Supply Pins. See Figure 10 for the interface schematic.
VDCP
VDCN
VAC
QN
QP
VCC
EPAD
Exposed Pad. Connect the exposed pad to RF/dc ground.
Rev. B | Page 5 of 13
HMC911
Data Sheet
INTERFACE SCHEMATICS
V
CC
50Ω
V
V
,
DCP
DCN
GND
V
EE
Figure 7. VDCP and VDCN Interface Schematic
Figure 3. GND Interface Schematic
V
V
CC
CC
50Ω
INP,
INN
V
AC
V
V
EE
EE
Figure 4. INP and INN Interface Schematic
Figure 8. VAC Interface Schematic
V
V
CC
CC
50Ω
20kΩ
QP,
QN
250Ω
EN
V
EE
V
EE
EN
Figure 5. Interface Schematic
Figure 9. QN and QP Interface Schematic
V
CC
V
EE
GND
GND
Figure 10. VCC Interface Schematic
Figure 6. VEE Interface Schematic
Rev. B | Page 6 of 13
Data Sheet
HMC911
TYPICAL PERFORMANCE CHARACTERISTICS
80
80
70
60
50
40
30
20
10
0
V
V
V
= 2.6V
= 3.3V
V
V
V
= 2.6V
= 3.3V
= 3.3V
AC
AC
DCN
DCN
70
60
50
40
30
20
10
0
= 3.3V
CC
CC
10GHz
16GHz
20GHz
22GHz
24GHz
3.13V
3.30V
3.47V
–0.6
–0.4
–0.2
0
0.2
0.4
0.6
–0.6
–0.4
–0.2
0
0.2
0.4
0.6
DIFFERENTIAL DELAY CONTROL VOLTAGE (V)
DIFFERENTIAL DELAY CONTROL VOLTAGE (V)
Figure 14. Normalized Time Delay vs. Differential Delay Control Voltage at
22 GHz for Various Voltages, Differential Delay Control Voltage Represents
VDCP − VDCN Voltage on the X-Axis
Figure 11. Normalized Time Delay vs. Differential Delay Control Voltage,
Differential Delay Control Voltage Represents VDCP − VDCN Voltage on the X-Axis
80
80
V
V
V
= 2.6V
AC
V
V
V
= 2.6V
AC
= 3.3V
DCN
= 3.3V
DCN
70
60
50
40
30
20
10
0
70
60
50
40
30
20
10
0
= 3.3V
CC
= 3.3V
CC
+85°C
+25°C
–40°C
2
4
6
8
10
12
14
16
18
20
22
24
–0.6
–0.4
–0.2
0
0.2
0.4
0.6
FREQUENCY (GHz)
DIFFERENTIAL DELAY CONTROL VOLTAGE (V)
Figure 15. Time Delay vs. Frequency at VDCP = 2.7 V to 3.9 V with 0.1 V Step
Figure 12. Normalized Time Delay vs. Differential Delay Control Voltage at
22 GHz for Various Temperatures, Differential Delay Control Voltage
Represents VDCP − VDCN Voltage on the X-Axis
45
8
V
V
V
= 2.6V
= 3.3V
= 3.3V
V
V
V
= 2.6V
= 3.3V
= 3.3V
AC
AC
V
V
V
V
V
V
V
– V
– V
– V
– V
– V
– V
– V
= –0.6V (REFERENCE)
= –0.4V
DCP
DCP
DCP
DCP
DCP
DCP
DCP
DCN
DCN
DCN
DCN
DCN
DCN
DCN
DCN
DCN
40
35
30
25
20
15
10
5
6
4
= –0.2V
CC
CC
= 0V
= +0.2V
= +0.4V
= +0.6V
2
0
–2
–4
–6
–8
V
V
V
V
V
V
V
– V
– V
– V
– V
– V
– V
– V
= –0.6V
= –0.4V
= –0.2V
= 0V
= +0.2V
= +0.4V
= +0.6V
DCP
DCP
DCP
DCP
DCP
DCP
DCP
DCN
DCN
DCN
DCN
DCN
DCN
DCN
0
5
6
7
8
9
10 11 12 13 14 15 16 17 18 19 20
FREQUENCY (GHz)
2
4
6
8
10
12
14
16
18
20
22
FREQUENCY (GHz)
Figure 13. fIN Power – 2fIN Power vs. Frequency
Figure 16. Time Delay Error vs. Frequency at Mean Frequency (fMEAN) = 18 GHz
Rev. B | Page 7 of 13
HMC911
Data Sheet
80
V
80
75
70
65
60
55
50
= 2.6V
= 3.3V
V
V
V
V
= 2.6V
= 3.3V
= 3.3V
AC
AC
V
V
V
DCN
DCN
= 3.3V
= 3.9V
CC
CC
75
70
65
60
55
50
= 3.9V
DCP
DCP
+85°C
+25°C
–40°C
3.13V
3.30V
3.47V
2
4
6
8
10
12
14
16
18
20
22
24
2
4
6
8
10
12
14
16
18
20
22
24
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 17. Programmable Maximum Time Delay vs. Frequency for Various
Temperatures
Figure 20. Programmable Maximum Time Delay vs. Frequency for Various
Voltages
400
375
350
325
300
275
250
600
550
500
450
400
350
300
V
V
f
= 2.6V
= V
= 18GHz
V
V
f
= 2.6V
= V
= 18GHz
+85°C
+25°C
–40°C
+85°C
+25°C
–40°C
AC
AC
225
250
= 3.3V
DCN
= 3.3V
DCN
DCP
DCP
IN
IN
200
200
3.13
3.30
SUPPLY VOLTAGE (V)
3.47
3.13
3.30
SUPPLY VOLTAGE (V)
3.47
Figure 18. Single-Ended Output Voltage Swing vs. Supply Voltage for Various
Temperatures
Figure 21. DC Current vs. Supply Voltage for Various Temperatures
450
600
550
500
450
400
350
300
V
V
f
= V
= 3.3V
= 10GHz
= 3.3V
DCP
DCN
CC
400
350
300
250
200
150
100
50
IN
+85°C
+25°C
–40°C
V
V
f
= V
= 3.3V
= 10GHz
= 3.3V
2.0
+85°C
+25°C
–40°C
DCP
DCN
250
CC
IN
0
1.7
200
1.7
1.8
1.9
2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
1.8
1.9
2.1
2.2
2.3
2.4
2.5
2.6
2.7
AMPLITUDE CONTROL VOLTAGE (V)
AMPLITUDE CONTROL VOLTAGE (V)
Figure 19. Single-Ended Output Voltage Swing vs. Amplitude Control Voltage
(VAC) for Various Temperatures
Figure 22. DC Current vs. Amplitude Control Voltage (VAC) for Various
Temperatures
Rev. B | Page 8 of 13
Data Sheet
HMC911
500
450
400
350
300
250
200
500
450
400
350
300
250
200
V
V
V
= 2.6V
V
V
V
= 2.6V
AC
AC
= V
= 3.3V
= V
= 3.3V
DCP
DCN
DCP
DCN
= 3.3V
= 3.3V
CC
CC
+85°C
+25°C
–40°C
5GHz
14GHz
22GHz
2
4
6
8
10
12
14
16
18
20
22
24
–0.6
–0.4
–0.2
0
0.2
0.4
0.6
FREQUENCY (GHz)
DIFFERENTIAL DELAY CONTROL VOLTAGE (V)
Figure 23. Single-Ended Output Voltage Swing vs. Frequency for Various
Temperatures
Figure 26. Single-Ended Output Voltage Swing vs. Differential Delay Control
Voltage, Differential Control Voltage Represents VDCP − VDCN Voltage on the
X-Axis
0.40
0.40
V
V
V
= 2.6V
= 3.3V
= 3.3V
V
V
V
= 2.6V
= 3.3V
= 3.3V
AC
AC
DCN
DCN
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
CC
CC
+85°C
+25°C
–40°C
3.13V
3.30V
3.47V
–0.6
–0.4
–0.2
0
0.2
0.4
0.6
–0.6
–0.4
–0.2
0
0.2
0.4
0.6
DIFFERENTIAL DELAY CONTROL VOLTAGE (V)
DIFFERENTIAL DELAY CONTROL VOLTAGE (V)
Figure 24. RMS Jitter vs. Differential Delay Control Voltage at 18 GHz for
Various Temperatures, Differential Control Voltage Represents VDCP − VDCN
Voltage on the X-Axis
Figure 27. RMS Jitter vs. Differential Delay Control Voltage at 18 GHz for
Various Voltages, Differential Control Voltage Represents VDCP − VDCN Voltage
on the X-Axis
18
18
V
V
V
= 2.6V
= 3.3V
= 3.3V
V
V
V
= 2.6V
= 3.3V
= 3.3V
AC
AC
DCN
DCN
CC
CC
16
14
12
10
8
16
14
12
10
8
+85°C
+25°C
–40°C
+85°C
+25°C
–40°C
–0.6
–0.4
–0.2
0
0.2
0.4
0.6
–0.6
–0.4
–0.2
0
0.2
0.4
0.6
DIFFERENTIAL DELAY CONTROL VOLTAGE (V)
DIFFERENTIAL DELAY CONTROL VOLTAGE (V)
Figure 25. Rise Time vs. Differential Delay Control Voltage, Differential Control
Voltage Represents VDCP − VDCN Voltage on the X-Axis, Input Data Rate =
22.5 Gbps, PRBS 233 − 1
Figure 28. Fall Time vs. Differential Delay Control Voltage, Differential Control
Voltage Represents VDCP − VDCN Voltage on the X-Axis, Input Data Rate =
22.5 Gbps, PRBS 233 − 1
Rev. B | Page 9 of 13
HMC911
Data Sheet
0
0
–5
V
V
V
= 2.6V
= 3.3V
= 3.3V
V
V
V
= 2.6V
= 3.3V
= 3.3V
AC
INN
INP
AC
QN
QP
DCN
DCN
–5
–10
–15
–20
–25
–30
–35
–40
–45
CC
CC
–10
–15
–20
–25
–30
–35
–40
–45
–50
0
2
4
6
8
10 12 14 16 18 20 22 24
FREQUENCY (GHz)
0
2
4
6
8
10 12 14 16 18 20 22 24
FREQUENCY (GHz)
Figure 32. Output Return Loss vs. Frequency,
Figure 29. Input Return Loss vs. Frequency,
V
V
= 3.3V
= 2.6V
V
V
= 3.3V
= 2.6V
CC
AC
CC
AC
V
V
= 1200mV p-p AT 1800MHz,
= 50Ω TERMINATED,
DCP
V
IS VARIED FROM 2.7V TO 3.3V
DCP
DCN
(50% OF THE WHOLE DELAY RANGE)
INPUT DATA = SINGLE-ENDED 400mV p-p 16GHz CLOCK SIGNAL
INPUT DATA = DIFFERENTIAL 400mV p-p, 10Gbps NRZ,
23
PRBS 2 – 1 PATTERN
96.4mV/DIV
20ps/DIV
TIME DELAY = 45.2ps
99.1mV/DIV
20ps/DIV
TIME DELAY = 37ps
Figure 33. Output Eye Diagram Continuous Snapshot for 10 Gbps Input
Figure 30. Output Eye Diagram Continuous Snapshot for 16 GHz Input
80
+85°C
+25°C
–40°C
70
60
50
40
30
20
10
V
V
= 2.6V
= 3.3V
AC
CC
0
100M
1G
10G
MODULATION FREQUENCY (Hz)
Figure 31. Maximum Time Delay vs. Modulation Frequency,
Input Data Rate = 22.5 Gbps, PRBS 233 – 1, 6 dBm Input Power Applied to
VDCP and VDCN Terminated to 50 Ω
Rev. B | Page 10 of 13
Data Sheet
HMC911
APPLICATIONS INFORMATION
of via holes to connect the top and bottom ground planes.
EVALUATION PRINTED CIRCUIT BOARD (PCB)
Mount the evaluation board to an appropriate heat sink. The
evaluation PCB shown is available from Analog Devices, Inc.,
upon request.
Generate the evaluation PCB used in this application with
proper RF circuit design techniques. Signal lines at the RF port
must have 50 Ω impedance, and the package ground leads and
exposed paddle must be connected directly to the ground plane
similar to what is shown in Figure 34. Use a sufficient number
Figure 34. 600-00070-00-1 (EVAL01-HMC911LC4B) Evaluation Board
Bill of Materials
Table 4.
Component
J1 to J4
J5, J6
Description
K connectors
SMA connectors
J7, J8
SMA connectors for through calibration
DC test points
TP1 to TP6
C1, C3 to C6
C2, C7 to C10
C9
C11 to C14
U1
1 nF capacitors, 0402 package
0.1 μF capacitors, 0402 package
100 nF capacitor, 0402 package
4.7 μF tantalum capacitors
HMC911 analog phase shifter
PCB
600-00070-00-1 (EVAL01-HMC911LC4B1) evaluation PCB, circuit board material: Rogers 4350 or Arlon 25 FR
1 Reference this number when ordering the completed evaluation PCB.
Rev. B | Page 11 of 13
HMC911
Data Sheet
TYPICAL APPLICATION CIRCUIT
Figure 35 shows the typical application circuit. Note that TP2 goes to ground and is not shown in Figure 35.
V
CC
TP6
C11
4.7µF
C2
0.1µF
C1
1nF
1
2
3
4
5
6
18
17
16
15
14
13
V
CC
V
CC
HMC911
INP
J1
QP
J3
AMP
BUF
INN
J2
QN
J4
TEMPERATURE
COMPENSATION
AND BIAS
V
CC
BUF
V
CC
EN
TP1
C9
100nF
C6
1nF
V
EE
TP3
C14
4.7µF
C10
0.1µF
C5
1nF
V
TP5
AC
C3
1nF
C8
0.1µF
C12
4.7µF
V
EE
TP4
C4
1nF
C7
0.1µF
C13
4.7µF
V
V
DCP
J5
DCN
J6
Figure 35. Typical Application Circuit
Rev. B | Page 12 of 13
Data Sheet
HMC911
OUTLINE DIMENSIONS
4.13
4.00 SQ
3.87
0.36
0.30
0.24
PIN 1
(0.32 × 0.32)
PIN 1
INDICATOR
19
24
18
1
0.50
BSC
EXPOSED
PAD
2.50 SQ
13
6
7
12
BOTTOM VIEW
2.50 REF
TOP VIEW
SIDE VIEW
3.10 BSC
1.02 MAX
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SEATING
PLANE
SECTION OF THIS DATA SHEET.
Figure 36. 24-Terminal Ceramic Leadless Chip [LCC]
(E-24-1)
Dimensions shown in millimeters
ORDERING GUIDE
Temperature
Range
Package
Model1
Package Body Material Lead Finish
MSL Rating2 Package Description Option
HMC911LC4B
−40°C to +85°C Alumina, White
−40°C to +85°C Alumina, White
−40°C to +85°C Alumina, White
Gold over Nickel MSL3
Gold over Nickel MSL3
Gold over Nickel MSL3
24-Terminal LCC
24-Terminal LCC
24-Terminal LCC
Evaluation Board
E-24-1
E-24-1
E-24-1
HMC911LC4BTR
HMC911LC4BTR-R5
EVAL01-HMC911LC4B
1 The HMC911LC4B, HMC911LC4BTR, and HMC911LC4BTR-R5 are RoHS Compliant Parts.
2 See the Absolute Maximum Ratings section for additional information.
©2014–2016 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D14816-0-10/16(B)
Rev. B | Page 13 of 13
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