SW201-803Q [ADI]

SGL POLE SGL THROW SWITCH;
SW201-803Q
型号: SW201-803Q
厂家: ADI    ADI
描述:

SGL POLE SGL THROW SWITCH

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中文:  中文翻译
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Tuesday, Feb 26, 2008 3:28 PM /  
Quad SPST JFET  
Analog Switch  
SW201  
1.0  
SCOPE  
This specification documents the detail requirements for space qualified product manufactured on  
Analog Devices, Inc.'s QML certified line per MIL-PRF-38535 Level V except as modified herein.  
The manufacturing flow described in the STANDARD SPACE LEVEL PRODUCTS PROGRAM  
brochure is to be considered a part of this specification. http://www.analog.com/aerospace  
This data sheet specifically details the space grade version of this product. A more detailed  
operational description and a complete data sheet for commercial product grades can be found at  
www.analog.com/SW201  
2.0  
Part Number. The complete part number(s) of this specification follow:  
Part Number  
SW201-803Q  
SW201-813Q  
Description  
Quad SPST JFET Analog Switch  
Radiation Tested, Quad SPST JFET Analog Switch  
2.1  
Letter Descriptive designator Case Outline (Lead Finish per MIL-PRF-38535)  
GDIP1-T16 16-Lead ceramic dual-in-line package (CERDIP)  
Case Outline.  
Q
2.1 Figure 1 - Terminal connections.  
2.1.1 SW201 Logic Table:  
Control Logic  
Logic Input  
Switch State  
ON  
0
ASD0011315  
Rev. E  
Information furnished by Analog Devices is believed to be accurate and  
reliable. However, no responsibility is assumed by Analog Devices for its use,  
nor for any infringements of patents or other rights of third parties that may  
result from its use. Specifications subject to change without notice. No license  
is granted by implication or otherwise under any patent or patent rights of  
Analog Devices. Trademarks and registered trademarks are the property of  
their respective companies.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106,  
U.S.A.  
Tel: 781.329.4700  
www.analog.com  
Fax: 781.326.8703 © 2008 Analog Devices, Inc. All rights reserved.  
SW201  
3.0  
Absolute Maximum Ratings. (TA = 25°C, unless otherwise noted)  
Operating Temperature Range ................................................................... -55°C to +125°C  
Storage Temperature Range....................................................................... -65°C to +150°C  
Power Dissipation.....................................................................................................900mW  
Lead Temperature (Soldering, 60 sec.) .....................................................................+300°C  
Maximum Junction Temperature (TJ).......................................................................+150°C  
V+ Supply to V- Supply..................................................................................................36V  
V+ Supply to Ground......................................................................................................36V  
Logic Input Voltage Range ........................................................... (-4V or V-) to V+ Supply  
Analog Input Voltage  
Continuous................................................................V- Supply to V+ Supply +20V  
1% Duty Cycle and Driving all 4 inputs  
with 500μS pulse ............................................V- Supply –15V to V+ Supply +20V  
Maximum Current Through Any Pin...........................................................................30mA  
3.1  
4.0  
Thermal Characteristics:  
Thermal Resistance, Q (cerdip) Package  
Junction-to-Case (ΘJC) = 29°C/W Max  
Junction-to-Ambient (ΘJA) = 91°C/W Max  
Electrical Table:  
TABLE I  
Parameter  
See notes at end of table  
Symbol  
Conditions  
VS = ±15V Unless otherwise  
specified  
Sub-  
group  
Limit Limit Units  
Min  
Max  
Positive Supply Current  
Negative Supply Current  
Ground Current  
I+  
I-  
All channels OFF or ON  
All Channels OFF or ON  
All Channels OFF or ON  
1
2,3  
1
9
13.5  
6.0  
8.5  
4
mA  
2,3  
1
IG  
2,3  
1
6
Logic “0” Input Current  
Logic “1” Input Current (Note 1)  
“ON” Resistance  
IIL  
5
μA  
2,3  
1
10  
5
IIH  
2,3  
1
10  
80  
110  
15  
15  
20  
RON  
VA = -10V to 10V; IS = 1mA  
Ω
2,3  
1
%
ΔRON vs. VA  
ΔRON  
VA 10V, IS = 1mA  
VA = 0V, ID = 100μA  
RON Match Between Switches  
(Note 3)  
RON  
(Match)  
1
2,3  
1
Analog Current Range (Note 2)  
IA  
VS = ±10V  
IS = 1mA  
10  
7
mA  
V
2,3  
1,2,3  
Analog Voltage Range (Note 2)  
VA  
±10  
ASD0011315 Rev. E | Page 2 of 5  
SW201  
4.0  
Electrical Table: (Cont’d)  
Parameter  
Symbol  
Conditions  
VS = ±15V Unless otherwise  
specified  
Sub-  
group  
Limit Limit Units  
See notes at end of table  
Min  
Max  
Source Current “OFF” Condition  
Drain Current “OFF” Condition  
IS(OFF)  
VS = +10V, VD = -10V  
VS = -10V, VD = +10V  
VS = +10V, VD = -10V  
VS = -10V, VD = +10V  
VS = VD = ±10V  
1
2
60  
2
nA  
2
1
2
60  
2
ID(OFF)  
1
2
60  
2
1
2
60  
2
Leakage Current “ON”  
Condition  
ID(ON)  
+
1
2
IS(ON)  
100  
0.8  
Logic “0” Input Voltage  
Logic “1” Input Voltage  
Turn-On-Time  
VIL  
VIH  
1,2,3  
1,2,3  
9
V
V
2
tON  
500  
400  
nS  
VS = -5V, RL = 1KΩ, CL = 13pF  
Turn-Off-Time  
tOFF  
9
Break-Before-Make Time  
tON-tOFF  
9
50  
Table I notes:  
1 Current Tested at VIN = 2V (worst case condition)  
2 VA, VIH, VIL is verified by leakage and RON tests.  
3 RON Match specified as a percentage of Raverage where Raverage = RON1 + RON2 + RON3 + RON4  
4
ASD0011315 Rev. E | Page 3 of 5  
SW201  
4.1  
Electrical Test Requirements:  
Table II  
Test Requirements  
Subgroups (in accordance  
with MIL-PRF-38535,  
Table III)  
Interim Electrical Parameters  
Final Electrical Parameters  
Group A Test Requirements  
1
1, 2, 3 1/ 2/  
1, 2, 3, 9  
Group C end-point electrical parameters 1 2/  
Group D end-point electrical parameters  
Group E end-point electrical parameters  
1
1
1/ PDA applies to Subgroup 1. Exclude delta's from PDA.  
2/ See Table III for delta parameters. See Table I for test conditions.  
4.2  
Table III. Burn-in test delta limits.  
Table III  
TEST  
TITLE  
ENDPOINT  
LIMIT  
DELTA  
LIMIT  
UNITS  
ohm  
RON  
80  
±15  
5.0  
Life Test/Burn-In Circuit:  
5.1  
5.2  
5.3  
HTRB is not applicable for this drawing.  
Burn-in is per MIL-STD-883 Method 1015 test condition C.  
Steady state life test is per MIL-STD-883 Method 1005.  
ASD0011315 Rev. E | Page 4 of 5  
SW201  
Rev  
A
B
Description of Change  
Date  
July 12, 2000  
20-Dec-01  
Initiate  
Update web site address. Under max ratings change TJ to TJ. For RON  
conditions, change ID = 1mA to IS = 1mA. RON (Match), change  
subgroups from 1,2 to 2,3. Break before make specification must a  
minimum. Add subgroup 9 to Group A requirements on Table II.  
Change BI circuit from condition A to Condition C.  
C
Delete subgroups 4, 5, 6 from Table II, they are not used in Table I.  
Change paragraph 5.2 from cond. B to Cond. C (BI circuit not changed).  
Update web address. Delete burn-in circuit  
Feb. 21, 2002  
D
E
June 20, 2003  
Feb. 22,2008  
Update header/footer & add to 1.0 Scope description.  
© 2008 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective  
companies.  
Printed in the U.S.A.  
02/08  
ASD0011315 Rev. E | Page 5 of 5  

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