TMP37FT9Z [ADI]
Low Voltage Temperature Sensors; 低电压温度传感器
| 型号： | TMP37FT9Z |
| 厂家： | 
ADI |
| 描述： | Low Voltage Temperature Sensors |
| 文件： | 总20页 (文件大小：341K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Low Voltage Temperature Sensors
TMP35/TMP36/TMP37
FEATURES
FUNCTIONAL BLOCK DIAGRAM
+V (2.7V TO 5.5V)
S
Low voltage operation (2.7 V to 5.5 V)
Calibrated directly in °C
10 mV/°C scale factor (20 mV/°C on TMP37)
2°C accuracy over temperature (typ)
0.5°C linearity (typ)
TMP35/
TMP36/
TMP37
SHUTDOWN
V
OUT
Stable with large capacitive loads
Specified −40°C to +125°C, operation to +150°C
Less than 50 μA quiescent current
Shutdown current 0.5 μA max
Low self-heating
Figure 1.
PIN CONFIGURATIONS
Qualified for automotive applications
V
GND
1
2
3
5
4
OUT
APPLICATIONS
TOP VIEW
(Not to Scale)
+V
S
Environmental control systems
Thermal protection
NC
SHUTDOWN
Industrial process control
Fire alarms
Power system monitors
CPU thermal management
NC = NO CONNECT
Figure 2. RJ-5 (SOT-23)
V
1
2
3
4
8
7
6
5
+V
S
OUT
NC
GENERAL DESCRIPTION
NC
TOP VIEW
The TMP35/TMP36/TMP37 are low voltage, precision centi-
grade temperature sensors. They provide a voltage output that
is linearly proportional to the Celsius (centigrade) temperature.
The TMP35/ TMP36/TMP37 do not require any external
calibration to provide typical accuracies of ±±1C at +251C
and ±21C over the −401C to +±251C temperature range.
(Not to Scale)
NC
NC
SHUTDOWN
GND
NC = NO CONNECT
Figure 3. R-8 (SOIC_N)
2
1
3
The low output impedance of the TMP35/TMP36/TMP37 and
its linear output and precise calibration simplify interfacing to
temperature control circuitry and ADCs. All three devices are
intended for single-supply operation from 2.7 V to 5.5 V maxi-
mum. The supply current runs well below 50 μA, providing
very low self-heating—less than 0.±1C in still air. In addition, a
shutdown function is provided to cut the supply current to less
than 0.5 μA.
BOTTOM VIEW
(Not to Scale)
PIN 1, +V ; PIN 2, V
; PIN 3, GND
OUT
S
Figure 4. T-3 (TO-92)
The TMP35 is functionally compatible with the LM35/LM45
and provides a 250 mV output at 251C. The TMP35 reads
temperatures from ±01C to ±251C. The TMP36 is specified from
−401C to +±251C, provides a 750 mV output at 251C, and
operates to ±251C from a single 2.7 V supply. The TMP36 is
functionally compatible with the LM50. Both the TMP35 and
TMP36 have an output scale factor of ±0 mV/1C.
The TMP37 is intended for applications over the range of 51C
to ±001C and provides an output scale factor of 20 mV/1C. The
TMP37 provides a 500 mV output at 251C. Operation extends
to ±501C with reduced accuracy for all devices when operating
from a 5 V supply.
The TMP35/TMP36/TMP37 are available in low cost 3-lead
TO-92, 8-lead SOIC_N, and 5-lead SOT-23 surface-mount
packages.
Rev. F
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113 ©1996–2010 Analog Devices, Inc. All rights reserved.
TMP35/TMP36/TMP37
TABLE OF CONTENTS
Features .............................................................................................. ±
Basic Temperature Sensor Connections.................................. ±0
Fahrenheit Thermometers ........................................................ ±0
Average and Differential Temperature Measurement ........... ±2
Microprocessor Interrupt Generator....................................... ±3
Applications....................................................................................... ±
General Description......................................................................... ±
Functional Block Diagram .............................................................. ±
Pin Configurations ........................................................................... ±
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
Thermal Resistance ...................................................................... 4
ESD Caution.................................................................................. 4
Typical Performance Characteristics ............................................. 5
Functional Description.................................................................... 8
Applications Information ................................................................ 9
Shutdown Operation.................................................................... 9
Mounting Considerations ........................................................... 9
Thermal Environment Effects .................................................... 9
Thermocouple Signal Conditioning with Cold-Junction
Compensation............................................................................. ±4
Using TMP3x Sensors in Remote Locations .......................... ±5
Temperature to 4–20 mA Loop Transmitter .......................... ±5
Temperature-to-Frequency Converter .................................... ±6
Driving Long Cables or Heavy Capacitive Loads .................. ±7
Commentary on Long-Term Stability..................................... ±7
Outline Dimensions....................................................................... ±8
Ordering Guide .......................................................................... ±9
Automotive Products................................................................. 20
REVISION HISTORY
11/10—Rev. E to Rev. F
10/02—Rev. B to Rev. C
Changes to Features.......................................................................... ±
Updated Outline Dimensions....................................................... ±8
Changes to Ordering Guide .......................................................... ±9
Added Automotive Products Section .......................................... 20
Changes to Specifications.................................................................3
Deleted Text from Commentary on Long-Term Stability
Section.............................................................................................. ±3
Updated Outline Dimensions....................................................... ±4
8/08—Rev. D to Rev. E
9/01—Rev. A to Rev. B
Updated Outline Dimensions....................................................... ±8
Changes to Ordering Guide .......................................................... ±9
Edits to Specifications.......................................................................2
Addition of New Figure ±.................................................................2
Deletion of Wafer Test Limits Section ............................................3
3/05—Rev. C to Rev. D
6/97—Rev. 0 to Rev. A
Updated Format..................................................................Universal
Changes to Specifications................................................................ 3
Additions to Absolute Maximum Ratings..................................... 4
Updated Outline Dimensions....................................................... ±8
Changes to Ordering Guide .......................................................... ±9
3/96—Revision 0: Initial Version
Rev. F | Page 2 of 20
TMP35/TMP36/TMP37
SPECIFICATIONS
VS = 2.7 V to 5.5 V, −401C ≤ TA ≤ +±251C, unless otherwise noted.
Table 1.
Parameter1
Symbol
Test Conditions/Comments
Min
Typ
Max
Unit
ACCURACY
TMP35/TMP36/TMP37 (F Grade)
TMP35/TMP36/TMP37 (G Grade)
TMP35/TMP36/TMP37 (F Grade)
TMP35/TMP36/TMP37 (G Grade)
Scale Factor, TMP35
TA = 25°C
TA = 25°C
±±
±±
±2
±2
±0
±0
20
20
±2
±3
±3
±ꢀ
°C
°C
°C
°C
mV/°C
mV/°C
mV/°C
mV/°C
Over rated temperature
Over rated temperature
±0°C ≤ TA ≤ ±25°C
−ꢀ0°C ≤ TA ≤ +±25°C
5°C ≤ TA ≤ 85°C
5°C ≤ TA ≤ ±00°C
3.0 V ≤ VS ≤ 5.5 V
0 μA ≤ IL ≤ 50 μA
−ꢀ0°C ≤ TA ≤ +±05°C
−±05°C ≤ TA ≤ +±25°C
TA = 25°C
Scale Factor, TMP36
Scale Factor, TMP37
Load Regulation
6
20
60
±00
m°C/μA
m°C/μA
m°C/V
m°C/V
°C
25
30
50
0.5
0.ꢀ
Power Supply Rejection Ratio
PSRR
3.0 V ≤ VS ≤ 5.5 V
Linearity
Long-Term Stability
SHUTDOWN
TA = ±50°C for ± kHz
°C
Logic High Input Voltage
Logic Low Input Voltage
OUTPUT
VIH
VIL
VS = 2.7 V
VS = 5.5 V
±.8
V
mV
ꢀ00
TMP35 Output Voltage
TMP36 Output Voltage
TMP37 Output Voltage
Output Voltage Range
Output Load Current
Short-Circuit Current
Capacitive Load Driving
Device Turn-On Time
POWER SUPPLY
TA = 25°C
TA = 25°C
TA = 25°C
250
750
500
mV
mV
mV
mV
μA
μA
pF
±00
0
2000
50
250
IL
ISC
CL
Note 2
No oscillations2
Output within ±±°C, ±00 kΩ||±00 pF load2
±000
2.7
±0000
0.5
±
ms
Supply Range
Supply Current
Supply Current (Shutdown)
VS
ISY (ON)
ISY (OFF)
5.5
50
0.5
V
μA
μA
Unloaded
Unloaded
0.0±
± Does not consider errors caused by self-heating.
2 Guaranteed but not tested.
Rev. F | Page 3 of 20
TMP35/TMP36/TMP37
ABSOLUTE MAXIMUM RATINGS
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 2.
Parameter1, 2
Rating
Supply Voltage
Shutdown Pin
7 V
GND ≤ SHUTDOWN ≤ +VS
GND ≤ VOUT ≤ +VS
−55°C to +±50°C
±75°C
Output Pin
Operating Temperature Range
Die Junction Temperature
Storage Temperature Range
IR Reflow Soldering
Peak Temperature
Time at Peak Temperature Range
Ramp-Up Rate
THERMAL RESISTANCE
−65°C to +±60°C
θJA is specified for the worst-case conditions, that is, a device in
socket.
220°C (0°C/5°C)
±0 sec to 20 sec
3°C/sec
−6°C/sec
6 min
Table 3. Thermal Resistance
Package Type
θJA
θJC
Unit
°C/W
°C/W
°C/W
Ramp-Down Rate
TO-92 (T-3)
SOIC_N (R-8)
SOT-23 (RJ-5)
±62
±58
300
±20
ꢀ3
±80
Time 25°C to Peak Temperature
IR Reflow Soldering—Pb-Free Package
Peak Temperature
Time at Peak Temperature Range
Ramp-Up Rate
260°C (0°C)
20 sec to ꢀ0 sec
3°C/sec
−6°C/sec
8 min
ESD CAUTION
Ramp-Down Rate
Time 25°C to Peak Temperature
± Digital inputs are protected; however, permanent damage can occur on
unprotected units from high energy electrostatic fields. Keep units in
conductive foam or packaging at all times until ready to use. Use proper
antistatic handling procedures.
2 Remove power before inserting or removing units from their sockets.
Rev. F | Page ꢀ of 20
TMP35/TMP36/TMP37
TYPICAL PERFORMANCE CHARACTERISTICS
0.4
0.3
0.2
50
+V = 3V TO 5.5V, NO LOAD
S
40
30
20
10
0
0.1
0
–50
0
50
100
150
–50
–25
0
25
50
75
100
125
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 5. Load Regulation vs. Temperature (m°C/μA)
Figure 8. Power Supply Rejection vs. Temperature
2.0
1.8
1.6
100.000
31.600
a. TMP35
b. TMP36
c. TMP37
c
+V = 3V
S
10.000
3.160
1.000
0.320
0.100
0.032
0.010
1.4
1.2
b
1.0
0.8
0.6
a
0.4
0.2
0
–50
–25
0
25
50
75
100
125
20
100
1k
10k
100k
TEMPERATURE (°C)
FREQUENCY (Hz)
Figure 6. Output Voltage vs. Temperature
Figure 9. Power Supply Rejection vs. Frequency
5
4
3
5
4
MINIMUM SUPPLY VOLTAGE REQUIRED TO MEET
DATA SHEET SPECIFICATION
a
a. MAXIMUM LIMIT (G GRADE)
b. TYPICAL ACCURACY ERROR
c. MINIMUM LIMIT (G GRADE)
NO LOAD
2
1
3
2
b
0
–1
–2
a
b
–3
–4
1
0
a. TMP35/TMP36
b. TMP37
c
–5
0
20
40
60
80
100
120
140
–50
–25
0
25
50
75
100
125
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 10. Minimum Supply Voltage vs. Temperature
Figure 7. Accuracy Error vs. Temperature
Rev. F | Page 5 of 20
TMP35/TMP36/TMP37
60
400
300
200
100
0
a. +V = 5V
S
b. +V = 3V
S
50
40
30
NO LOAD
= +V AND SHUTDOWN PINS
S
HIGH TO LOW (3V TO 0V)
a
= +V AND SHUTDOWN PINS
S
LOW TO HIGH (0V TO 3V)
V
SETTLES WITHIN ±1°C
OUT
b
20
10
–50
–25
0
25
50
75
100
125
–50
–25
0
25
50
75
125
100
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 11. Supply Current vs. Temperature
Figure 14. VOUT Response Time for +VS Power-Up/Power-Down vs.
Temperature
400
50
40
= SHUTDOWN PIN
HIGH TO LOW (3V TO 0V)
T
= 25°C, NO LOAD
A
300
200
30
20
100
= SHUTDOWN PIN
10
0
LOW TO HIGH (0V TO 3V)
V
SETTLES WITHIN ±1°C
OUT
0
–50
–25
0
25
50
75
125
100
0
1
2
3
4
5
6
7
8
TEMPERATURE (°C)
SUPPLY VOLTAGE (V)
SHUTDOWN
Pin vs. Temperature
Figure 12. Supply Current vs. Supply Voltage
Figure 15. VOUT Response Time for
1.0
0.8
50
40
a. +V = 5V
S
T
= 25°C
b. +V = 3V
S
A
0.6
0.4
0.2
0
+V = 3V
S
SHUTDOWN =
SIGNAL
NO LOAD
30
20
10
0
1.0
0.8
0.6
0.4
0.2
0
a
T
= 25°C
A
+V AND SHUTDOWN =
S
SIGNAL
b
–50
0
50
100 150 200 250 300 350 400 450
TIME (µs)
–50
–25
0
25
50
75
125
100
TEMPERATURE (°C)
Figure 13. Supply Current vs. Temperature (Shutdown = 0 V)
SHUTDOWN
Figure 16. VOUT Response Time to
Pin and +VS Pin vs. Time
Rev. F | Page 6 of 20
TMP35/TMP36/TMP37
110
100
90
80
70
60
50
40
30
20
10
0
a
10mV
1ms
100
90
+V = 3V, 5V
S
c
b
a. TMP35 SOIC SOLDERED TO 0.5" × 0.3" Cu PCB
b. TMP36 SOIC SOLDERED TO 0.6" × 0.4" Cu PCB
c. TMP35 TO-92 IN SOCKET SOLDERED TO
1" × 0.4" Cu PCB
10
0%
100
TIME/DIVISION
0
200
300
400
500
600
TIME (s)
Figure 17. Thermal Response Time in Still Air
Figure 20. Temperature Sensor Wideband Output Noise Voltage;
Gain = 100, BW = 157 kHz
140
120
100
80
2400
2200
a. TMP35 SOIC SOLDERED TO 0.5" × 0.3" Cu PCB
b. TMP36 SOIC SOLDERED TO 0.6" × 0.4" Cu PCB
c. TMP35 TO-92 IN SOCKET SOLDERED TO
1" × 0.4" Cu PCB
2000
b
1800
1600
1400
1200
+V = 3V, 5V
S
60
1000
800
b
40
600
c
a
400
200
0
a. TMP35/TMP36
b. TMP37
20
a
0
0
100
200
300
400
500
600
700
10
100
FREQUENCY (Hz)
1k
10k
AIR VELOCITY (FPM)
Figure 21. Voltage Noise Spectral Density vs. Frequency
Figure 18. Thermal Response Time Constant in Forced Air
110
a
100
90
80
70
60
50
40
30
20
10
0
+V = 3V, 5V
S
c
b
a. TMP35 SOIC SOLDERED TO 0.5" × 0.3" Cu PCB
b. TMP36 SOIC SOLDERED TO 0.6" × 0.4" Cu PCB
c. TMP35 TO-92 IN SOCKET SOLDERED TO
1" × 0.4" Cu PCB
10
0
20
30
40
50
60
TIME (s)
Figure 19. Thermal Response Time in Stirred Oil Bath
Rev. F | Page 7 of 20
TMP35/TMP36/TMP37
FUNCTIONAL DESCRIPTION
+V
S
An equivalent circuit for the TMP3x family of micropower,
centigrade temperature sensors is shown in Figure 22. The core
of the temperature sensor is a band gap core that comprises
transistors Q± and Q2, biased by Q3 to approximately 8 μA. The
band gap core operates both Q± and Q2 at the same collector
current level; however, because the emitter area of Q± is ±0
times that of Q2, the VBE of Q± and the VBE of Q2 are not equal
by the following relationship:
SHUTDOWN
25µA
3X
2X
Q2
1X
Q4
R1
⎛
⎜
⎞
⎟
AE,Q1
AE,Q2
Q1
10X
ΔVBE = VT × ln
⎜
⎝
⎟
⎠
R3
R2
V
Resistors R± and R2 are used to scale this result to produce
the output voltage transfer characteristic of each temperature
sensor and, simultaneously, R2 and R3 are used to scale the VBE of
Q± as an offset term in VOUT. Table 4 summarizes the differences
in the output characteristics of the three temperature sensors.
OUT
7.5µA
Q3
2X
6X
GND
Figure 22. Temperature Sensor Simplified Equivalent Circuit
The output voltage of the temperature sensor is available at the
emitter of Q4, which buffers the band gap core and provides
load current drive. The current gain of Q4, working with the
available base current drive from the previous stage, sets the
short-circuit current limit of these devices to 250 μA.
Table 4. TMP3x Output Characteristics
Offset
Output Voltage
Output Voltage
@ 25°C (mV)
Sensor
TMP35
TMP36
TMP37
Voltage (V) Scaling (mV/°C)
0
0.5
0
±0
±0
20
250
750
500
Rev. F | Page 8 of 20
TMP35/TMP36/TMP37
APPLICATIONS INFORMATION
SHUTDOWN OPERATION
THERMAL ENVIRONMENT EFFECTS
All TMP3x devices include a shutdown capability, which
reduces the power supply drain to less than 0.5 μA maximum.
This feature, available only in the SOIC_N and the SOT-23
packages, is TTL/CMOS level-compatible, provided that the
temperature sensor supply voltage is equal in magnitude to the
The thermal environment in which the TMP3x sensors are used
determines two important characteristics: self-heating effects
and thermal response time. Figure 23 illustrates a thermal model
of the TMP3x temperature sensors, which is useful in under-
standing these characteristics.
SHUTDOWN
logic supply voltage. Internal to the TMP3x at the
pin, a pull-up current source to +VS is connected. This allows
SHUTDOWN
T
θ
θ
CA
T
J
JC
C
the
pin to be driven from an open-collector/drain
SHUTDOWN
C
C
T
C
CH
P
A
D
driver. A logic low, or zero-volt condition, on the
pin is required to turn off the output stage. During shutdown,
the output of the temperature sensors becomes high impedance
where the potential of the output pin is then determined by
external circuitry. If the shutdown feature is not used, it is
Figure 23. Thermal Circuit Model
In the T-3 package, the thermal resistance junction-to-case, θJC,
is ±201C/W. The thermal resistance case-to-ambient, CA, is the
difference between θJA and θJC, and is determined by the char-
acteristics of the thermal connection. The power dissipation of
the temperature sensor, PD, is the product of the total voltage
across the device and its total supply current, including any
current delivered to the load. The rise in die temperature above
the ambient temperature of the medium is given by
SHUTDOWN
recommended that the
pin be connected to +VS
(Pin 8 on the SOIC_N; Pin 2 on the SOT-23).
The shutdown response time of these temperature sensors is
shown in Figure ±4, Figure ±5, and Figure ±6.
MOUNTING CONSIDERATIONS
If the TMP3x temperature sensors are thermally attached and
protected, they can be used in any temperature measurement
application where the maximum temperature range of the
medium is between −401C and +±251C. Properly cemented or
glued to the surface of the medium, these sensors are within
0.0±1C of the surface temperature. Caution should be exercised,
especially with T-3 packages, because the leads and any wiring
to the device can act as heat pipes, introducing errors if the
surrounding air-surface interface is not isothermal. Avoiding this
condition is easily achieved by dabbing the leads of the temper-
ature sensor and the hookup wires with a bead of thermally
conductive epoxy. This ensures that the TMP3x die temperature
is not affected by the surrounding air temperature. Because
plastic IC packaging technology is used, excessive mechanical
stress should be avoided when fastening the device with a clamp
or a screw-on heat tab. Thermally conductive epoxy or glue,
which must be electrically nonconductive, is recommended
under typical mounting conditions.
TJ = PD × (θJC + θCA) + TA
Thus, the die temperature rise of a TMP35 SOT-23 package
mounted into a socket in still air at 251C and driven from a 5 V
supply is less than 0.041C.
The transient response of the TMP3x sensors to a step change
in the temperature is determined by the thermal resistances and
the thermal capacities of the die, CCH, and the case, CC. The
thermal capacity of CC varies with the measurement medium
because it includes anything in direct contact with the package.
In all practical cases, the thermal capacity of CC is the limiting
factor in the thermal response time of the sensor and can be
represented by a single-pole RC time constant response. Figure
±7 and Figure ±9 show the thermal response time of the TMP3x
sensors under various conditions. The thermal time constant
of a temperature sensor is defined as the time required for the
sensor to reach 63.2% of the final value for a step change in the
temperature. For example, the thermal time constant of a
TMP35 SOIC package sensor mounted onto a 0.5" × 0.3" PCB is
less than 50 sec in air, whereas in a stirred oil bath, the time
constant is less than 3 sec.
These temperature sensors, as well as any associated circuitry,
should be kept insulated and dry to avoid leakage and corrosion.
In wet or corrosive environments, any electrically isolated metal
or ceramic well can be used to shield the temperature sensors.
Condensation at very cold temperatures can cause errors and
should be avoided by sealing the device, using electrically non-
conductive epoxy paints or dip or any one of the many printed
circuit board coatings and varnishes.
Rev. F | Page 9 of 20
TMP35/TMP36/TMP37
BASIC TEMPERATURE SENSOR CONNECTIONS
FAHRENHEIT THERMOMETERS
Figure 24 illustrates the basic circuit configuration for the
TMP3x family of temperature sensors. The table in Figure 24
shows the pin assignments of the temperature sensors for the
three package types. For the SOT-23, Pin 3 is labeled NC, as are
Pin 2, Pin 3, Pin 6, and Pin 7 on the SOIC_N package. It is
recommended that no electrical connections be made to these
pins. If the shutdown feature is not needed on the SOT-23 or
Although the TMP3x temperature sensors are centigrade
temperature sensors, a few components can be used to convert
the output voltage and transfer characteristics to directly read
Fahrenheit temperatures. Figure 25 shows an example of a
simple Fahrenheit thermometer using either the TMP35 or the
TMP37. Using the TMP35, this circuit can be used to sense
temperatures from 4±1F to 2571F with an output transfer
characteristic of ± mV/1F; using the TMP37, this circuit can be
used to sense temperatures from 4±1F to 2±21F with an output
transfer characteristic of 2 mV/1F. This particular approach
does not lend itself to the TMP36 because of its inherent 0.5 V
output offset. The circuit is constructed with an AD589, a ±.23 V
voltage reference, and four resistors whose values for each sensor
are shown in the table in Figure 25. The scaling of the output
resistance levels ensures minimum output loading on the temp-
erature sensors. A generalized expression for the transfer
equation of the circuit is given by
SHUTDOWN
on the SOIC_N package, the
connected to +VS.
pin should be
2.7V < +V < 5.5V
S
0.1µF
+V
S
V
SHUTDOWN
TMP3x
OUT
GND
⎛
⎜
⎜
⎝
⎞
⎟
⎟
⎠
⎛
⎜
⎜
⎝
⎞
⎟
⎟
⎠
R1
R1+ R2
R3
R3 + R4
PIN ASSIGNMENTS
VOUT
=
(
TMP35
)
+
AD589
( )
+V
V
OUT
GND
SHUTDOWN
PACKAGE
S
SOIC_N
SOT-23
TO-92
8
2
1
4
5
3
1
1
2
5
4
where:
TMP35 is the output voltage of the TMP35 or the TMP37 at the
measurement temperature, TM.
NA
Figure 24. Basic Temperature Sensor Circuit Configuration
AD589 is the output voltage of the reference, that is, ±.23 V.
Note the 0.± μF bypass capacitor on the input. This capacitor
should be a ceramic type, have very short leads (surface-mount
is preferable), and be located as close as possible in physical
proximity to the temperature sensor supply pin. Because these
temperature sensors operate on very little supply current and
may be exposed to very hostile electrical environments, it is
important to minimize the effects of radio frequency interference
(RFI) on these devices. The effect of RFI on these temperature
sensors specifically and on analog ICs in general is manifested as
abnormal dc shifts in the output voltage due to the rectification
of the high frequency ambient noise by the IC. When the
devices are operated in the presence of high frequency radiated
or conducted noise, a large value tantalum capacitor (±2.2 μF)
placed across the 0.± μF ceramic capacitor may offer additional
noise immunity.
The output voltage of this circuit is not referenced to the
circuit’s common ground. If this output voltage were applied
directly to the input of an ADC, the ADC common ground
should be adjusted accordingly.
+V
S
0.1µF
+V
S
V
OUT
TMP35/
TMP37
R1
R2
GND
+
V
OUT
AD589
1.23V
R3
R4
–
TCV
SENSOR
R1 (kΩ) R2 (kΩ) R3 (kΩ) R4 (kΩ)
OUT
TMP35
TMP37
1mV/°F
2mV/°F
45.3
45.3
10
10
10
10
374
182
Figure 25. TMP35/TMP37 Fahrenheit Thermometers
Rev. F | Page ±0 of 20
TMP35/TMP36/TMP37
The same circuit principles can be applied to the TMP36, but
because of the inherent offset of the TMP36, the circuit uses only
two resistors, as shown in Figure 26. In this circuit, the output
voltage transfer characteristic is ± mV/1F but is referenced to
the common ground of the circuit; however, there is a 58 mV
(581F) offset in the output voltage. For example, the output
voltage of the circuit reads ±8 mV if the TMP36 is placed in a
−401F ambient environment and 3±5 mV at +2571F.
At the expense of additional circuitry, the offset produced by
the circuit in Figure 26 can be avoided by using the circuit in
Figure 27. In this circuit, the output of the TMP36 is conditioned
by a single-supply, micropower op amp, the OP±93. Although
the entire circuit operates from a single 3 V supply, the output
voltage of the circuit reads the temperature directly, with a
transfer characteristic of ± mV/1F, without offset. This is accom-
plished through an ADM660, which is a supply voltage inverter.
The 3 V supply is inverted and applied to the V− terminal of the
OP±93. Thus, for a temperature range between −401F and +2571F,
the output of the circuit reads −40 mV to +257 mV. A general
expression for the transfer equation of the circuit is given by
+V
S
+V
S
V
OUT
0.1µF
TMP36
⎛
⎜
⎜
⎝
⎞ ⎛
⎟ ⎜
⎟ ⎜
⎠ ⎝
⎞
⎟
⎟
⎠
V
2
R6
R5 + R6
R4
R3
R4
R3
R1
45.3kΩ
⎛
⎞
⎜
⎟
⎠
⎝
⎞
⎟
⎠
⎛
⎜
⎝
S
VOUT
=
± +
(TMP36) −
GND
V
R2
10kΩ
@ 1mV/°F – 58°F
OUT
V
V
@ –40°F = 18mV
@ +257°F = 315mV
OUT
OUT
Figure 26. TMP36 Fahrenheit Thermometer Version 1
+3V
R1
50kΩ
R3
R5
R4
+
C1
10µF
0.1µF
R2
50kΩ
7
2
–
+V
S
V
@ 1mV/°F
OUT
OP193
–40°F ≤ T ≤ +257°F
6
V
A
+
3
OUT
TMP36
+
10µF/0.1µF
4
R6
GND
8
1
2
5
6
NC
+
–3V
ELEMENT
VALUE
10µF
+
ADM660
R3
R4
R5
R6
258.6kΩ
10kΩ
10µF
4
3
NC
47.7kΩ
10kΩ
7
Figure 27. TMP36 Fahrenheit Thermometer Version 2
Rev. F | Page ±± of 20
TMP35/TMP36/TMP37
2.7V < +V < 5.5V
S
AVERAGE AND DIFFERENTIAL TEMPERATURE
MEASUREMENT
0.1µF
V
TEMP(AVG)
7
In many commercial and industrial environments, temperature
sensors often measure the average temperature in a building, or
the difference in temperature between two locations on a factory
floor or in an industrial process. The circuits in Figure 28 and
Figure 29 demonstrate an inexpensive approach to average and
differential temperature measurement.
@ 10mV/°C FOR TMP35/TMP36
@ 20mV/°C FOR TMP37
2
–
+
6
OP193
4
3
R5
100kΩ
R1
300kΩ
TMP3x
TMP3x
TMP3x
In Figure 28, an OP±93 sums the outputs of three temperature
sensors to produce an output voltage scaled by ±0 mV/1C that
represents the average temperature at three locations. The circuit
can be extended to include as many temperature sensors as
required as long as the transfer equation of the circuit is
maintained. In this application, it is recommended that one
temperature sensor type be used throughout the circuit;
otherwise, the output voltage of the circuit cannot produce an
accurate reading of the various ambient conditions.
R6
7.5kΩ
R2
300kΩ
FOR R1 = R2 = R3 = R;
V
= 1 (TMP3x + TMP3x + TMP3x )
TEMP(AVG)
1
2
3
3
R3
300kΩ
R1
3
R5 =
R4
7.5kΩ
R4 = R6
The circuit in Figure 29 illustrates how a pair of TMP3x sensors
used with an OP±93 configured as a difference amplifier can
read the difference in temperature between two locations. In
these applications, it is always possible that one temperature
sensor is reading a temperature below that of the other sensor.
To accommodate this condition, the output of the OP±93 is
offset to a voltage at one-half the supply via R5 and R6. Thus,
the output voltage of the circuit is measured relative to this
point, as shown in Figure 29. Using the TMP36, the output
voltage of the circuit is scaled by ±0 mV/1C. To minimize the
error in the difference between the two measured temperatures,
a common, readily available thin-film resistor network is used
for R± to R4.
Figure 28. Configuring Multiple Sensors for
Average Temperature Measurements
2.7V < +V < 5.5V
S
1
1
R1
R2
TMP36
0.1µF
@ T1
R8
25kΩ
0.1µF
7
2
3
–
+
V
OUT
6
OP193
4
1
R3
TMP36
0.1µF
@ T2
R7
100kΩ
R9
25kΩ
CENTERED AT
1
1µF
R4
R6
100kΩ
R5
100kΩ
V
= T2 – T1 @ 10mV/°C
0°C ≤ T ≤ 125°C
OUT
A
V
S
CENTERED AT
2
NOTE:
1
R1–R4, CADDOCK T914–100k–100, OR EQUIVALENT.
Figure 29. Configuring Multiple Sensors for
Differential Temperature Measurements
Rev. F | Page ±2 of 20
TMP35/TMP36/TMP37
Because temperature is a slowly moving quantity, the possibility
for comparator chatter exists. To avoid this condition, hysteresis
is used around the comparator. In this application, a hysteresis
of 51C about the trip point was arbitrarily chosen; the ultimate
value for hysteresis should be determined by the end application.
The output logic voltage swing of the comparator with R± and
R2 determines the amount of comparator hysteresis. Using a
3.3 V supply, the output logic voltage swing of the CMP402 is
2.6 V; therefore, for a hysteresis of 51C (50 mV @ ±0 mV/1C),
R± is set to 20 kΩ, and R2 is set to ± MΩ. An expression for the
hysteresis of this circuit is given by
MICROPROCESSOR INTERRUPT GENERATOR
These inexpensive temperature sensors can be used with a
voltage reference and an analog comparator to configure an
interrupt generator for microprocessor applications. With the
popularity of fast microprocessors, the need to indicate a
microprocessor overtemperature condition has grown
tremendously. The circuit in Figure 30 demonstrates one way to
generate an interrupt using a TMP35, a CMP402 analog
comparator, and a REF±9±, a 2 V precision voltage reference.
The circuit is designed to produce a logic high interrupt signal
if the microprocessor temperature exceeds 801C. This 801C trip
point was arbitrarily chosen (final value set by the microprocessor
thermal reference design) and is set using an R3 to R4 voltage
divider of the REF±9± output voltage. Because the output of the
TMP35 is scaled by ±0 mV/1C, the voltage at the inverting
terminal of the CMP402 is set to 0.8 V.
R1
R2
⎛
⎜
⎝
⎞
⎟
⎠
VHYS
=
V
)
LOGIC SWING, CMP402
Because this circuit is probably used in close proximity to high
speed digital circuits, R± is split into equal values and a ±000 pF
capacitor is used to form a low-pass filter on the output of the
TMP35. Furthermore, to prevent high frequency noise from
contaminating the comparator trip point, a 0.± μF capacitor is
used across R4.
3.3V
R2
1MΩ
+V
S
0.1µF
3
R1A
10kΩ
R1B
10kΩ
V
OUT
6
5
4
–
0.1µF
TMP35
2
INTERRUPT
>80°C
CMP402
C
R5
100kΩ
L
14
1000pF
+
GND
0.1µF
13
2
<80°C
R3
16kΩ
V
REF
6
REF191
4
3
+
R4
10kΩ
0.1µF
1µF
1
4
C1 =
CMP402
Figure 30. Microprocessor Overtemperature Interrupt Generator
Rev. F | Page ±3 of 20
TMP35/TMP36/TMP37
and the wires of the thermocouple from introducing an error in
the measured temperature. This compensation works extremely
well for circuit ambient temperatures in the range of 201C to 501C.
Over a 2501C measurement temperature range, the thermocouple
produces an output voltage change of ±0.±5± mV. Because the
required output full-scale voltage of the circuit is 2.5 V, the gain
of the circuit is set to 246.3. Choosing R4 equal to 4.99 kΩ sets
R5 equal to ±.22 MΩ. Because the closest ±% value for R5 is
±.2± MΩ, a 50 kΩ potentiometer is used with R5 for fine trim of
the full-scale output voltage. Although the OP±93 is a superior
single-supply, micropower operational amplifier, its output stage
is not rail-to-rail; therefore, the 01C output voltage level is 0.± V.
If this circuit is digitized by a single-supply ADC, the ADC
common should be adjusted to 0.± V accordingly.
THERMOCOUPLE SIGNAL CONDITIONING WITH
COLD-JUNCTION COMPENSATION
The circuit in Figure 3± conditions the output of a Type K
thermocouple, while providing cold-junction compensation for
temperatures between 01C and 2501C. The circuit operates from
a single 3.3 V to 5.5 V supply and is designed to produce an
output voltage transfer characteristic of ±0 mV/1C.
A Type K thermocouple exhibits a Seebeck coefficient of
approximately 4± μV/1C; therefore, at the cold junction, the
TMP35, with a temperature coefficient of ±0 mV/1C, is used
with R± and R2 to introduce an opposing cold-junction temp-
erature coefficient of −4± μV/1C. This prevents the isothermal,
cold-junction connection between the PCB tracks of the circuit
3.3V < +V < 5.5V
S
+V
S
P1
50kΩ
R3
V
OUT
0.1µF
1
R4
4.99kΩ
R5
1.21MΩ
10MΩ
TMP35
5%
0.1µF
GND
1
R1
7
24.9kΩ
2
3
–
6
V
OUT
0V TO 2.5V
OP193
CU
CU
CHROMEL
+
R6
100kΩ
5%
+
4
TYPE K
THERMO-
COUPLE
COLD
JUNCTION
NOTE:
ALUMEL
–
1
ALL RESISTORS 1% UNLESS OTHERWISE NOTED.
1
R2
102Ω
ISOTHERMAL
BLOCK
0°C ≤ T ≤ 250°C
A
Figure 31. Single-Supply, Type K Thermocouple Signal Conditioning Circuit with Cold-Junction Compensation
Rev. F | Page ±ꢀ of 20
TMP35/TMP36/TMP37
USING TMP3x SENSORS IN REMOTE LOCATIONS
TEMPERATURE TO 4–20 mA LOOP TRANSMITTER
In many industrial environments, sensors are required to
operate in the presence of high ambient noise. These noise
sources take many forms, for example, SCR transients, relays,
radio transmitters, arc welders, and ac motors. They can also
be used at considerable distances from the signal conditioning
circuitry. These high noise environments are typically in the
form of electric fields, so the voltage output of the temperature
sensor can be susceptible to contamination from these noise
sources.
In many process control applications, 2-wire transmitters are
used to convey analog signals through noisy ambient environ-
ments. These current transmitters use a zero-scale signal current
of 4 mA, which can be used to power the signal conditioning
circuitry of the transmitter. The full-scale output signal in these
transmitters is 20 mA.
Figure 33 illustrates a circuit that transmits temperature inform-
ation in this fashion. Using a TMP3x as the temperature sensor,
the output current is linearly proportional to the temperature of
the medium. The entire circuit operates from the 3 V output of
the REF±93. The REF±93 requires no external trimming because
of its tight initial output voltage tolerance and the low supply
current of the TMP3x, the OP±93, and the REF±93. The entire
circuit consumes less than 3 mA from a total budget of 4 mA.
The OP±93 regulates the output current to satisfy the current
summation at the noninverting node of the OP±93. A generalized
expression for the KCL equation at Pin 3 of the OP±93 is given by
Figure 32 illustrates a way to convert the output voltage of a
TMP3x sensor into a current to be transmitted down a long
twisted pair shielded cable to a ground referenced receiver. The
temperature sensors are not capable of high output current
operation; thus, a standard PNP transistor is used to boost the
output current drive of the circuit. As shown in the table in
Figure 32, the values of R2 and R3 were chosen to produce an
arbitrary full-scale output current of 2 mA. Lower values for the
full-scale current are not recommended. The minimum-scale
output current produced by the circuit could be contaminated
by ambient magnetic fields operating in the near vicinity of the
circuit/cable pair. Because the circuit uses an external transistor,
the minimum recommended operating voltage for this circuit is
5 V. To minimize the effects of EMI (or RFI), both the circuit
and the temperature sensor supply pins are bypassed with good
quality ceramic capacitors.
TMP3x × R3 VREF × R3
1
R7
⎛
⎞
⎛
⎜
⎝
⎞
⎟
⎠
IOUT
=
×⎜
⎜
+
⎟
⎟
R1
R2
⎝
⎠
For each temperature sensor, Table 5 provides the values for the
components P±, P2, and R± to R4.
Table 5. Circuit Element Values for Loop Transmitter
Sensor R1
P1
R2
P2
R3
R4
TMP35
TMP36
TMP37
97.6 kΩ 5 kΩ ±.58 MΩ ±00 kΩ ±ꢀ0 kΩ 56.2 kΩ
97.6 kΩ 5 kΩ 93± kΩ
97.6 kΩ 5 kΩ ±0.5 kΩ
50 kΩ
500 Ω
97.6 kΩ ꢀ7 kΩ
8ꢀ.5 kΩ 8.ꢀ5 kΩ
R1
4.7kΩ
5V
The 4 mA offset trim is provided by P2, and P± provides the
full-scale gain trim of the circuit at 20 mA. These two trims do
not interact because the noninverting input of the OP±93 is
held at a virtual ground. The zero-scale and full-scale output
currents of the circuit are adjusted according to the operating
temperature range of each temperature sensor. The Schottky
diode, D±, is required in this circuit to prevent loop supply
power-on transients from pulling the noninverting input of the
OP±93 more than 300 mV below its inverting input. Without
this diode, such transients can cause phase reversal of the
operational amplifier and possible latch-up of the transmitter.
The loop supply voltage compliance of the circuit is limited by
the maximum applied input voltage to the REF±93; it is from
9 V to ±8 V.
2N2907
V
OUT
+V
0.1µF
S
R3
0.01µF
TMP3x
V
OUT
GND
R2
TWISTED PAIR
BELDEN TYPE 9502
OR EQUIVALENT
SENSOR R2
R3
TMP35
TMP36
TMP37
634 634
887 887
1k
1k
Figure 32. Remote, 2-Wire Boosted Output Current Temperature Sensor
Rev. F | Page ±5 of 20
TMP35/TMP36/TMP37
3V
2
6
REF193
4
+
1
1
R2
1µF
V
LOOP
9V TO 18V
P2
4mA
ADJUST
+V
S
0.1µF
6
1
R1
7
R6
100kΩ
2
3
TMP3x
–
1
P1
Q1
2N1711
V
OUT
OP193
20mA
+
ADJUST
V
OUT
GND
4
D1
R5
100kΩ
R
250Ω
L
1
1
R3
R4
R7
100Ω
NOTE:
D1: HP5082-2810
1
SEE TEXT FOR VALUES.
I
L
Figure 33. Temperature to 4–20 mA Loop Transmitter
TEMPERATURE-TO-FREQUENCY CONVERTER
Another common method of transmitting analog information
from a remote location is to convert a voltage to an equivalent
value in the frequency domain. This is readily done with any of
the low cost, monolithic voltage-to-frequency converters (VFCs)
available. These VFCs feature a robust, open-collector output
transistor for easy interfacing to digital circuitry. The digital
signal produced by the VFC is less susceptible to contamination
from external noise sources and line voltage drops because the
only important information is the frequency of the digital sig-
nal. When the conversions between temperature and frequency
are done accurately, the temperature data from the sensors can
be reliably transmitted.
5V
1
C
T
0.1µF
R
PU
5kΩ
+V
S
6
7
8
V
OUT
4
3
TMP3x
10µF/0.1µF
1
f
AD654
OUT
GND
5
2
R1
1
R
T
NB: ATT (MIN), fOUT = 0Hz
A
5V
P1
NOTE:
1
fOUT
OFFSET
R
AND C – SEE TABLE
T
P2
100kΩ
T
R
OFF1
470Ω
R
OFF2
10Ω
The circuit in Figure 34 illustrates a method by which the
outputs of these temperature sensors can be converted to a
frequency using the AD654. The output signal of the AD654 is
a square wave that is proportional to the dc input voltage across
Pin 4 and Pin 3. The transfer equation of the circuit is given by
SENSOR
R
(R1 + P1)
C
T
T
TMP35
TMP36
TMP37
11.8kΩ + 500Ω 1.7nF
16.2kΩ + 500Ω 1.8nF
18.2kΩ + 1kΩ
2.1nF
⎛
⎜
⎜
⎝
⎞
⎟
⎟
⎠
VTPM −VOFFSET
±0×(RT ×CT )
Figure 34. Temperature-to-Frequency Converter
fOUT
=
Rev. F | Page ±6 of 20
TMP35/TMP36/TMP37
An offset trim network (fOUT OFFSET ) is included with this
circuit to set fOUT to 0 Hz when the minimum output voltage of
the temperature sensor is reached. Potentiometer P± is required
to calibrate the absolute accuracy of the AD654. The table in
Figure 34 illustrates the circuit element values for each of the
three sensors. The nominal offset voltage required for 0 Hz
output from the TMP35 is 50 mV; for the TMP36 and TMP37,
the offset voltage required is ±00 mV. For the circuit values
shown, the output frequency transfer characteristic of the
circuit was set at 50 Hz/1C in all cases. At the receiving end, a
frequency-to-voltage converter (FVC) can be used to convert
the frequency back to a dc voltage for further processing. One
such FVC is the AD650.
COMMENTARY ON LONG-TERM STABILITY
The concept of long-term stability has been used for many years
to describe the amount of parameter shift that occurs during
the lifetime of an IC. This is a concept that has been typically
applied to both voltage references and monolithic temperature
sensors. Unfortunately, integrated circuits cannot be evaluated
at room temperature (251C) for ±0 years or more to determine
this shift. As a result, manufacturers very typically perform
accelerated lifetime testing of integrated circuits by operating
ICs at elevated temperatures (between ±251C and ±501C) over a
shorter period of time (typically, between 500 and ±000 hours).
As a result of this operation, the lifetime of an integrated circuit
is significantly accelerated due to the increase in rates of reaction
within the semiconductor material.
For complete information about the AD650 and the AD654,
consult the individual data sheets for those devices.
DRIVING LONG CABLES OR HEAVY CAPACITIVE
LOADS
Although the TMP3x family of temperature sensors can drive
capacitive loads up to ±0,000 pF without oscillation, output
voltage transient response times can be improved by using a
small resistor in series with the output of the temperature
sensor, as shown in Figure 35. As an added benefit, this resistor
forms a low-pass filter with the cable capacitance, which helps
to reduce bandwidth noise. Because the temperature sensor is
likely to be used in environments where the ambient noise level
can be very high, this resistor helps to prevent rectification by
the devices of the high frequency noise. The combination of this
resistor and the supply bypass capacitor offers the best protection.
+V
S
V
750Ω
OUT
0.1µF
TMP3x
LONG CABLE OR
HEAVY CAPACITIVE
LOADS
GND
Figure 35. Driving Long Cables or Heavy Capacitive Loads
Rev. F | Page ±7 of 20
TMP35/TMP36/TMP37
OUTLINE DIMENSIONS
5.00 (0.1968)
4.80 (0.1890)
3.00
2.90
2.80
8
1
5
4
6.20 (0.2441)
5.80 (0.2284)
4.00 (0.1574)
3.80 (0.1497)
5
1
4
3
3.00
2.80
2.60
1.70
1.60
1.50
2
0.50 (0.0196)
0.25 (0.0099)
1.27 (0.0500)
BSC
45°
1.75 (0.0688)
1.35 (0.0532)
0.25 (0.0098)
0.10 (0.0040)
8°
0°
0.95 BSC
1.90
BSC
0.51 (0.0201)
0.31 (0.0122)
COPLANARITY
0.10
1.27 (0.0500)
0.40 (0.0157)
0.25 (0.0098)
0.17 (0.0067)
1.30
1.15
0.90
SEATING
PLANE
0.20 MAX
0.08 MIN
1.45 MAX
0.95 MIN
COMPLIANT TO JEDEC STANDARDS MS-012-AA
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
0.55
0.45
0.35
0.15 MAX
0.05 MIN
10°
5°
0°
SEATING
PLANE
0.60
BSC
0.50 MAX
0.35 MIN
COMPLIANT TO JEDEC STANDARDS MO-178-AA
Figure 36. 8-Lead Standard Small Outline Package [SOIC_N]
Figure 37. 5-Lead Small Outline Transistor Package [SOT-23]
Narrow Body
(R-8)
(RJ-5)
Dimensions shown in millimeters
Dimensions shown in millimeters and (inches)
0.165 (4.19)
0.145 (3.68)
0.210 (5.33)
0.125 (3.18)
0.190 (4.83)
0.0220 (0.56)
0.170 (4.32)
0.0185 (0.47)
0.1150 (2.92)
0.0975 (2.48)
0.0800 (2.03)
0.055 (1.40)
0.050 (1.27)
0.045 (1.15)
0.0150 (0.38)
3
2
1
0.205 (5.21)
0.190 (4.83)
0.175 (4.45)
0.105 (2.68)
0.100 (2.54)
0.095 (2.42)
0.020 (0.51)
FRONT VIEW
0.017 (0.43)
0.014 (0.36)
0.500 (12.70) MIN
SEATING
PLANE
BOTTOM VIEW
COMPLIANT TO JEDEC STANDARDS TO-226-AA
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 38. 3-Pin Plastic Header-Style Package [TO-92]
(T-3)
Dimensions shown in inches and (millimeters)
Rev. F | Page ±8 of 20
TMP35/TMP36/TMP37
ORDERING GUIDE
Accuracy at
25°C (°C max) Temperature Range Package Description
Linear Operating
Package
Model1, 2
Option
R-8
RJ-5
RJ-5
R-8
T-3
Branding
TMP35FSZ-REEL
TMP35GRT-REEL7
TMP35GRTZ-REEL7
TMP35GS
TMP35GT9
TMP35GT9Z
2.0
3.0
3.0
3.0
3.0
3.0
3.0
2.0
2.0
2.0
2.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
2.0
2.0
2.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
10°C to 125°C
10°C to 125°C
10°C to 125°C
10°C to 125°C
10°C to 125°C
10°C to 125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
5°C to 100°C
8-Lead Standard Small Outline Package (SOIC_N)
5-Lead Small Outline Transistor Package (SOT-23)
5-Lead Small Outline Transistor Package (SOT-23)
8-Lead Standard Small Outline Package (SOIC_N)
3-Pin Plastic Header-Style Package (TO-92)
T5G
#T11
3-Pin Plastic Header-Style Package (TO-92)
T-3
ADW75001Z-0REEL7
TMP36FS
TMP36FS-REEL
TMP36FSZ
TMP36FSZ-REEL
TMP36GRT-REEL7
TMP36GRTZ-REEL7
TMP36GS
TMP36GS-REEL
TMP36GS-REEL7
TMP36GSZ
5-Lead Small Outline Transistor Package (SOT-23)
8-Lead Standard Small Outline Package (SOIC_N)
8-Lead Standard Small Outline Package (SOIC_N)
8-Lead Standard Small Outline Package (SOIC_N)
8-Lead Standard Small Outline Package (SOIC_N)
5-Lead Small Outline Transistor Package (SOT-23)
5-Lead Small Outline Transistor Package (SOT-23)
8-Lead Standard Small Outline Package (SOIC_N)
8-Lead Standard Small Outline Package (SOIC_N)
8-Lead Standard Small Outline Package (SOIC_N)
8-Lead Standard Small Outline Package (SOIC_N)
8-Lead Standard Small Outline Package (SOIC_N)
8-Lead Standard Small Outline Package (SOIC_N)
3-Pin Plastic Header-Style Package (TO-92)
RJ-5
R-8
R-8
R-8
R-8
RJ-5
RJ-5
R-8
R-8
R-8
R-8
R-8
R-8
T-3
#T6G
T6G
#T6G
TMP36GSZ-REEL
TMP36GSZ-REEL7
TMP36GT9
TMP36GT9Z
3-Pin Plastic Header-Style Package (TO-92)
T-3
TMP37FT9
TMP37FT9-REEL
TMP37FT9Z
TMP37GRT-REEL7
TMP37GRTZ-REEL7
TMP37GSZ
TMP37GSZ-REEL
TMP37GT9
3-Pin Plastic Header-Style Package (TO-92)
3-Pin Plastic Header-Style Package (TO-92)
3-Pin Plastic Header-Style Package (TO-92)
5-Lead Small Outline Transistor Package (SOT-23)
5-Lead Small Outline Transistor Package (SOT-23)
8-Lead Standard Small Outline Package (SOIC_N)
8-Lead Standard Small Outline Package (SOIC_N)
3-Pin Plastic Header-Style Package (TO-92)
T-3
T-3
T-3
RJ-5
RJ-5
R-8
R-8
T-3
5°C to 100°C
5°C to 100°C
5°C to 100°C
5°C to 100°C
5°C to 100°C
5°C to 100°C
5°C to 100°C
5°C to 100°C
T7G
#T12
TMP37GT9-REEL
TMP37GT9Z
3-Pin Plastic Header-Style Package (TO-92)
3-Pin Plastic Header-Style Package (TO-92)
T-3
T-3
5°C to 100°C
1 Z = RoHS Compliant Part.
2 W = Qualified for Automotive Applications.
Rev. F | Page 19 of 20
TMP35/TMP36/TMP37
AUTOMOTIVE PRODUCTS
The ADW7500±Z-0REEL7 model is available with controlled manufacturing to support the quality and reliability requirements of
automotive applications. Note that this automotive model may have specifications that differ from the commercial models; therefore,
designers should review the Specifications section of this data sheet carefully. Only automotive grade products shown are available for use
in automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to
obtain the specific Automotive Reliability reports for these models.
©1996–2010 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D00337-0-11/10(F)
Rev. F | Page 20 of 20
相关型号：
TMP37GRT
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TMP37GRT-REEL7
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TMP37GRTZ-REEL7
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TMP37GRTZ-REEL7
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TMP37GS
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ADI
TMP37GSZ
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TMP37GSZ
ANALOG TEMP SENSOR-VOLTAGE, 4Cel, RECTANGULAR, SURFACE MOUNT, ROHS COMPLIANT, MS-012AA, SOIC-8Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TMP37GSZ-REEL
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TMP37GSZ-REEL
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TMP37GT9
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TMP37GT9
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