TMP37GS [ADI]

Low Voltage Temperature Sensors; 低电压温度传感器
TMP37GS
型号: TMP37GS
厂家: ADI    ADI
描述:

Low Voltage Temperature Sensors
低电压温度传感器

传感器 换能器 温度传感器 输出元件
文件: 总16页 (文件大小:362K)
中文:  中文翻译
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a
Low Voltage Temperature Sensors  
TMP35/TMP36/TMP37  
FEATURES  
FUNCTIONAL BLOCK DIAGRAM  
Low Voltage Operation (2.7 V to 5.5 V)  
Calibrated Directly in ؇C  
+V (2.7V to 5.5V)  
s
10 mV/؇C Scale Factor (20 mV/؇C on TMP37)  
؎2؇C Accuracy over Temperature (Typ)  
؎0.5؇C Linearity (Typ)  
Stable with Large Capacitive Loads  
Specified –40؇C to +125؇C, Operation to +150؇C  
Less than 50 A Quiescent Current  
Shutdown Current 0.5 A Max  
Low Self-Heating  
TMP35/  
TMP36/  
TMP37  
SHUTDOWN  
V
OUT  
PACKAGE TYPES AVAILABLE  
RT-5 (SOT-23)  
APPLICATIONS  
Environmental Control Systems  
Thermal Protection  
Industrial Process Control  
Fire Alarms  
Power System Monitors  
CPU Thermal Management  
V
GND  
1
2
3
5
OUT  
TOP VIEW  
(Not to Scale)  
+V  
S
NC  
4
SHUTDOWN  
NC = NO CONNECT  
PRODUCT DESCRIPTION  
RN-8 (SOIC)  
The TMP35, TMP36, and TMP37 are low voltage, precision  
centigrade temperature sensors. They provide a voltage output  
that is linearly proportional to the Celsius (Centigrade) tem-  
perature. The TMP35/TMP36/TMP37 do not require any  
external calibration to provide typical accuracies of 1°C at  
+25°C and 2°C over the –40°C to +125°C temperature range.  
1
2
3
4
8
7
6
5
V
+V  
S
OUT  
NC  
NC  
TOP VIEW  
(Not to Scale)  
NC  
NC  
SHUTDOWN  
GND  
NC = NO CONNECT  
The low output impedance of the TMP35/TMP36/TMP37 and  
its linear output and precise calibration simplify interfacing to  
temperature control circuitry and A/D converters. All three  
devices are intended for single-supply operation from 2.7 V to  
5.5 V maximum. Supply current runs well below 50 µA, providing  
very low self-heating—less than 0.1°C in still air. In addition, a  
shutdown function is provided to cut supply current to less  
than 0.5 µA.  
TO-92  
2
1
3
BOTTOM VIEW  
(Not to Scale)  
PIN 1, +V ; PIN 2, V  
; PIN 3, GND  
s
OUT  
The TMP35 is functionally compatible with the LM35/LM45 and  
provides a 250 mV output at 25°C. The TMP35 reads temperatures  
from 10°C to 125°C. The TMP36 is specified from –40°C to  
+125°C, provides a 750 mV output at 25°C, and operates to  
+125°C from a single 2.7 V supply. The TMP36 is functionally  
compatible with the LM50. Both the TMP35 and TMP36 have  
an output scale factor of 10 mV/°C. The TMP37 is intended for  
applications over the range 5°C to 100°C and provides an output  
scale factor of 20 mV/°C. The TMP37 provides a 500 mV output  
at 25°C. Operation extends to 150°C with reduced accuracy for all  
devices when operating from a 5 V supply.  
The TMP35/TMP36/TMP37 are all available in low cost 3-lead  
TO-92, SOIC-8, and 5-lead SOT-23 surface-mount packages.  
REV. C  
Information furnished by Analog Devices is believed to be accurate and  
reliable. However, no responsibility is assumed by Analog Devices for its  
use, norforanyinfringementsofpatentsorotherrightsofthirdpartiesthat  
may result from its use. No license is granted by implication or otherwise  
under any patent or patent rights of Analog Devices.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781/329-4700  
Fax: 781/326-8703  
www.analog.com  
© Analog Devices, Inc., 2002  
(VS = 2.7 V to 5.5 V, –40C TA +125C, unless  
TMP35/TMP36/TMP37–SPECIFICATIONS1  
otherwise noted.)  
Parameter  
Symbol  
Conditions  
Min  
Typ  
Max  
Unit  
ACCURACY  
TMP35/TMP36/TMP37F  
TMP35/TMP36/TMP37G  
TMP35/TMP36/TMP37F  
TMP35/TMP36/TMP37G  
Scale Factor, TMP35  
Scale Factor, TMP36  
Scale Factor, TMP37  
TA = 25°C  
1
1
2
2
3
3
4
°C  
TA = 25°C  
°C  
Over Rated Temperature  
Over Rated Temperature  
10°C TA 125°C  
–40°C TA +125°C  
5°C TA 85°C  
°C  
°C  
mV/°C  
mV/°C  
mV/°C  
mV/°C  
2
10  
10  
20  
20  
9.8/10.2  
9.8/10.2  
19.6/20.4  
19.6/20.4  
5°C TA 100°C  
3.0 V +VS 5.5 V  
0 µA IL 50 µA  
–40°C TA +105°C  
–105°C TA +125°C  
TA = 25°C  
Load Regulation  
6
20  
60  
100  
m°C/µA  
m°C/µA  
m°C/V  
m°C/V  
°C  
25  
30  
50  
0.5  
0.4  
Power Supply Rejection Ratio  
PSRR  
3.0 V +VS 5.5 V  
Linearity  
Long-Term Stability  
TA = 150°C for 1 kHrs  
°C  
SHUTDOWN  
Logic High Input Voltage  
Logic Low Input Voltage  
VIH  
VIL  
VS = 2.7 V  
VS = 5.5 V  
1.8  
V
mV  
400  
OUTPUT  
TMP35 Output Voltage  
TMP36 Output Voltage  
TMP37 Output Voltage  
Output Voltage Range  
Output Load Current  
Short-Circuit Current  
Capacitive Load Driving  
Device Turn-On Time  
TA = 25°C  
TA = 25°C  
TA = 25°C  
250  
750  
500  
mV  
mV  
mV  
mV  
µA  
100  
0
2000  
50  
250  
IL  
ISC  
CL  
Note 2  
µA  
No Oscillations2  
Output within 1°C  
100 k100 pF Load2  
1000  
10000  
0.5  
pF  
ms  
1
POWER SUPPLY  
Supply Range  
Supply Current  
+VS  
ISY (ON)  
ISY (OFF)  
2.7  
5.5  
50  
0.5  
V
µA  
µA  
Unloaded  
Unloaded  
Supply Current (Shutdown)  
0.01  
NOTES  
1Does not consider errors caused by self-heating.  
2Guaranteed but not tested.  
Specifications subject to change without notice.  
50  
40  
30  
20  
10  
0
–50  
0
50  
100  
150  
TEMPERATURE – C  
Figure 1. Load Reg vs. Temperature (m°C/µA)  
–2–  
REV. C  
TMP35/TMP36/TMP37  
FUNCTIONAL DESCRIPTION  
ABSOLUTE MAXIMUM RATINGS1, 2, 3  
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V  
An equivalent circuit for the TMP3x family of micropower,  
centigrade temperature sensors is shown in Figure 2. At the  
heart of the temperature sensor is a band gap core, which is  
comprised of transistors Q1 and Q2, biased by Q3 to approxi-  
mately 8 µA. The band gap core operates both Q1 and Q2 at the  
same collector current level; however, since the emitter area of  
Q1 is 10 times that of Q2, Q1’s VBE and Q2’s VBE are not equal  
by the following relationship:  
Shutdown Pin . . . . . . . . . . . . . . GND  
SHUTDOWN +VS  
Output Pin . . . . . . . . . . . . . . . . . . . . . . GND Յ VOUT Յ +VS  
Operating Temperature Range . . . . . . . . . . –55°C to +150°C  
Dice Junction Temperature . . . . . . . . . . . . . . . . . . . . . . 175°C  
Storage Temperature Range . . . . . . . . . . . . –65°C to +160°C  
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . . 300°C  
NOTES  
1Stresses above those listed under Absolute Maximum Ratings may cause perma-  
nent damage to the device. This is a stress rating only; functional operation at or  
above this specification is not implied. Exposure to maximum rating conditions for  
extended periods may affect device reliability.  
AE,Q1  
A
VBE =VT × ln  
E,Q2  
2Digital inputs are protected; however, permanent damage may occur on unpro-  
tected units from high energy electrostatic fields. Keep units in conductive foam  
or packaging at all times until ready to use. Use proper antistatic handling  
procedures.  
+V  
S
3Remove power before inserting or removing units from their sockets.  
SHDN  
25A  
Package Type  
JA  
JC  
Unit  
3X  
2X  
TO-92 (T9 Suffix)  
SOIC-8 (S Suffix)  
SOT-23 (RT Suffix)  
162  
158  
300  
120  
43  
180  
°C/W  
°C/W  
°C/W  
θ
JA is specified for device in socket (worst-case conditions).  
Q2  
1X  
Q4  
R1  
ORDERING GUIDE  
Accuracy Linear  
Q1  
10X  
R3  
R2  
at 25C  
Operating  
Package  
+V  
OUT  
Model  
(C max) Temperature Range Options1  
7.5A  
Q3  
TMP35FT9  
TMP35GT9  
TMP35FS  
2.0  
3.0  
2.0  
3.0  
3.0  
10°C to 125°C  
10°C to 125°C  
10°C to 125°C  
10°C to 125°C  
10°C to 125°C  
TO-92  
TO-92  
RN-8  
RN-8  
RT-5  
2X  
6X  
GND  
TMP35GS  
TMP35GRT2  
Figure 2. Temperature Sensor Simplified  
Equivalent Circuit  
TMP36FT9  
TMP36GT9  
TMP36FS  
2.0  
3.0  
2.0  
3.0  
3.0  
–40°C to +125°C  
–40°C to +125°C  
–40°C to +125°C  
–40°C to +125°C  
–40°C to +125°C  
TO-92  
TO-92  
RN-8  
RN-8  
RT-5  
Resistors R1 and R2 are used to scale this result to produce the  
output voltage transfer characteristic of each temperature sensor  
and, simultaneously, R2 and R3 are used to scale Q1’s VBE as  
an offset term in VOUT. Table I summarizes the differences  
between the three temperature sensors’ output characteristics.  
TMP36GS  
TMP36GRT2  
TMP37FT9  
TMP37GT9  
TMP37FS  
2.0  
3.0  
2.0  
3.0  
3.0  
5°C to 100°C  
5°C to 100°C  
5°C to 100°C  
5°C to 100°C  
5°C to 100°C  
TO-92  
TO-92  
RN-8  
RN-8  
RT-5  
Table I. TMP3x Output Characteristics  
TMP37GS  
Offset  
Output Voltage  
Output Voltage  
Voltage (V) Scaling (mV/C) @ 25C (mV)  
TMP37GRT2  
Sensor  
NOTES  
TMP35  
TMP36  
TMP37  
0
0.5  
0
10  
10  
20  
250  
750  
500  
1SOIC = Small Outline Integrated Circuit; RT = Plastic Surface Mount;  
TO = Plastic.  
2Consult factory for availability.  
The output voltage of the temperature sensor is available at the  
emitter of Q4, which buffers the band gap core and provides  
load current drive. Q4’s current gain, working with the available  
base current drive from the previous stage, sets the short-circuit  
current limit of these devices to 250 µA.  
CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily  
accumulate on the human body and test equipment and can discharge without detection. Although  
the TMP35/TMP36/TMP37 features proprietary ESD protection circuitry, permanent damage  
may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD  
precautions are recommended to avoid performance degradation or loss of functionality.  
WARNING!  
ESD SENSITIVE DEVICE  
REV. C  
–3–  
TMP35/TMP36/TMP37 – Typical Performance Characteristics  
2.0  
1.8  
1.6  
100  
a. TMP35  
b. TMP36  
c. TMP37  
31.6  
c
V
= 3V  
S
10  
3.16  
1
1.4  
1.2  
b
1.0  
0.8  
0.6  
0.4  
0.2  
0
a
0.32  
0.1  
0.032  
0.01  
20  
100  
1k  
10k  
100k  
50  
25  
0
25  
50  
75  
100  
125  
TEMPERATURE – C  
FREQUENCY – Hz  
TPC 1. Output Voltage vs. Temperature  
TPC 4. Power Supply Rejection vs. Frequency  
5
5
4
3
MINIMUM SUPPLY VOLTAGE REQUIRED TO MEET  
DATA SHEET SPECIFICATION  
4
3
2
1
a. MAXIMUM LIMIT (G GRADE)  
b. TYPICAL ACCURACY ERROR  
c. MINIMUM LIMIT (G GRADE)  
a
NO LOAD  
2
1
b
0
1  
2  
b
a
3  
4  
a. TMP35/TMP36  
b. TMP37  
c
5  
0
0
20  
40  
60  
80  
100  
120  
140  
50  
25  
0
25  
50  
75  
100  
125  
TEMPERATURE – C  
TEMPERATURE – C  
TPC 2. Accuracy Error vs. Temperature  
TPC 5. Minimum Supply Voltage vs. Temperature  
60  
0.4  
0.3  
0.2  
0.1  
0
a. V+ = 5V  
V+ = 3V to 5.5V, NO LOAD  
b. V+ = 3V  
50  
NO LOAD  
40  
a
30  
b
20  
10  
50  
25  
0
25  
50  
75  
100  
125  
50  
25  
0
25  
50  
75  
100  
125  
TEMPERATURE – C  
TEMPERATURE – C  
TPC 3. Power Supply Rejection vs. Temperature  
TPC 6. Supply Current vs. Temperature  
–4–  
REV. C  
TMP35/TMP36/TMP37  
400  
300  
200  
100  
0
50  
40  
= SHUTDOWN PIN  
HIGH TO LOW (3V TO 0V)  
T
= 25°C, NO LOAD  
A
30  
20  
10  
0
= SHUTDOWN PIN  
LOW TO HIGH (0V TO 3V)  
V
SETTLES WITHIN 1°C  
OUT  
0
1
2
3
4
5
6
7
8
50  
25  
0
25  
50  
75  
125  
100  
SUPPLY VOLTAGE – V  
TEMPERATURE – C  
TPC 7. Supply Current vs. Supply Voltage  
TPC 10. VOUT Response Time for Shutdown Pin vs.  
Temperature  
50  
1.0  
0.8  
a. V+ = 5V  
b. V+ = 3V  
T
= 25 C  
A
0.6  
0.4  
0.2  
0
40  
30  
20  
10  
0
V+ = 3V  
NO LOAD  
SHUTDOWN =  
SIGNAL  
1.0  
0.8  
0.6  
0.4  
0.2  
0
a
T = 25 C  
A
V+ AND SHUTDOWN =  
SIGNAL  
b
50  
25  
0
25  
50  
75  
125  
50  
0
50  
100 150 200 250 300 350 400 450  
TIME – µs  
100  
TEMPERATURE – C  
TPC 8. Supply Current vs. Temperature (Shutdown = 0 V)  
TPC 11. VOUT Response Time to Shutdown and V+  
Pins vs. Time  
400  
110  
a
100  
90  
V
= 3V, 5V  
c
IN  
300  
b
80  
70  
60  
50  
40  
30  
20  
10  
0
= V+ AND SHUTDOWN PINS  
HIGH TO LOW (3V TO 0V)  
200  
= V+ AND SHUTDOWN PINS  
LOW TO HIGH (0V TO 3V)  
V
SETTLES WITHIN 1°C  
OUT  
a. TMP35 SOIC SOLDERED TO 0.5" x 0.3" Cu PCB  
b. TMP36 SOIC SOLDERED TO 0.6" x 0.4" Cu PCB  
c. TMP35 TO-92 IN SOCKET SOLDERED TO  
1" x 0.4" Cu PCB  
100  
0
50  
25  
0
25  
50  
75  
125  
100  
100  
0
200  
300  
TIME – sec  
400  
500  
600  
TEMPERATURE – C  
TPC 9. VOUT Response Time for V+ Power-Up/Power-  
Down vs. Temperature  
TPC 12. Thermal Response Time in Still Air  
REV. C  
–5–  
TMP35/TMP36/TMP37  
140  
a. TMP35 SOIC SOLDERED TO 0.5" x 0.3" Cu PCB  
10mV  
1ms  
b. TMP36 SOIC SOLDERED TO 0.6" x 0.4" Cu PC  
c. TMP35 TO-92 IN SOCKET SOLDERED TO  
1" x 0.4" Cu PCB  
120  
100  
80  
60  
40  
20  
0
100  
90  
V
= 3V, 5V  
IN  
b
10  
0%  
c
a
TIME/DIVISION  
0
100  
200  
300  
400  
500  
600  
700  
AIR VELOCITY – FPM  
TPC 15. Temperature Sensor Wideband Output  
Noise Voltage. Gain = 100, BW = 157 kHz  
TPC 13. Thermal Response Time Constant in Forced Air  
2400  
2200  
110  
a
100  
2000  
b
90  
V
= 3V, 5V  
IN  
1800  
1600  
1400  
1200  
c
80  
70  
60  
50  
40  
30  
20  
10  
0
b
1000  
800  
a. TMP35 SOIC SOLDERED TO 0.5" x 0.3" Cu PCB  
b. TMP36 SOIC SOLDERED TO 0.6" x 0.4" Cu PCB  
c. TMP35 TO-92 IN SOCKET SOLDERED TO  
1" x 0.4" Cu PCB  
600  
a
400  
200  
0
a. TMP35/36  
b. TMP37  
10  
100  
1k  
10k  
10  
0
20  
30  
40  
50  
60  
FREQUENCY – Hz  
TIME – sec  
TPC 16. Voltage Noise Spectral Density vs. Frequency  
TPC 14. Thermal Response Time in Stirred Oil Bath  
–6–  
REV. C  
TMP35/TMP36/TMP37  
APPLICATIONS SECTION  
Shutdown Operation  
In the TO-92 package, the thermal resistance junction-to-case,  
θJC, is 120°C/W. The thermal resistance case-to-ambient, θCA, is  
the difference between θJA and θJC, and is determined by the  
characteristics of the thermal connection. The temperature  
sensor’s power dissipation, represented by PD, is the product of  
the total voltage across the device and its total supply current  
(including any current delivered to the load). The rise in die  
temperature above the medium’s ambient temperature is given by:  
All TMP3x devices include a shutdown capability that reduces the  
power supply drain to less than 0.5 µA maximum. This feature,  
available only in the SOIC-8 and the SOT-23 packages, is TTL/  
CMOS level compatible, provided that the temperature sensor  
supply voltage is equal in magnitude to the logic supply voltage.  
Internal to the TMP3x at the SHUTDOWN pin, a pull-up current  
source to VIN is connected. This permits the SHUTDOWN pin to  
be driven from an open-collector/drain driver. A logic LOW, or  
zero-volt condition on the SHUTDOWN pin, is required to turn  
the output stage OFF. During shutdown, the output of the  
temperature sensors becomes a high impedance state where the  
potential of the output pin would then be determined by external  
circuitry. If the shutdown feature is not used, it is recommended  
that the SHUTDOWN pin be connected to VIN (Pin 8 on the  
SOIC-8, Pin 2 on the SOT-23).  
T = P × θ + θCA +T  
(
)
J
D
JC  
A
Thus, the die temperature rise of a TMP35 “RT” package  
mounted into a socket in still air at 25°C and driven from a 5 V  
supply is less than 0.04°C.  
The transient response of the TMP3x sensors to a step change  
in the temperature is determined by the thermal resistances and  
the thermal capacities of the die, CCH, and the case, CC. The  
thermal capacity of the case, CC, varies with the measurement  
medium since it includes anything in direct contact with the  
package. In all practical cases, the thermal capacity of the case is  
the limiting factor in the thermal response time of the sensor  
and can be represented by a single-pole RC time constant  
response. TPCs 12 and 14 illustrate the thermal response time  
of the TMP3x sensors under various conditions. The thermal  
time constant of a temperature sensor is defined as the time  
required for the sensor to reach 63.2% of the final value for a  
step change in the temperature. For example, the thermal time  
constant of a TMP35 “S” package sensor mounted onto a 0.5"  
by 0.3" PCB is less than 50 sec in air, whereas in a stirred oil  
bath, the time constant is less than 3 seconds.  
The shutdown response time of these temperature sensors is  
illustrated in TPCs 9, 10, and 11.  
Mounting Considerations  
If the TMP3x temperature sensors are thermally attached and  
protected, they can be used in any temperature measurement  
application where the maximum temperature range of the  
medium is between –40°C to +125°C. Properly cemented or  
glued to the surface of the medium, these sensors will be within  
0.01°C of the surface temperature. Caution should be exercised,  
especially with TO-92 packages, because the leads and any  
wiring to the device can act as heat pipes, introducing errors if  
the surrounding air-surface interface is not isothermal. Avoiding  
this condition is easily achieved by dabbing the leads of the  
temperature sensor and the hookup wires with a bead of  
thermally conductive epoxy. This will ensure that the TMP3x  
die temperature is not affected by the surrounding air temperature.  
Basic Temperature Sensor Connections  
Figure 4 illustrates the basic circuit configuration for the  
TMP3x family of temperature sensors. The table shown in the  
figure illustrates the pin assignments of the temperature sensors  
for the three package types. For the SOT-23, Pin 3 is labeled as  
“NC” as are Pins 2, 3, 6, and 7 on the SOIC-8 package. It is  
recommended that no electrical connections be made to  
these pins. If the shutdown feature is not needed on the  
SOT-23 or the SOIC-8 package, the SHUTDOWN pin  
should be connected to VS.  
Because plastic IC packaging technology is used, excessive  
mechanical stress should be avoided when fastening the device  
with a clamp or a screw-on heat tab. Thermally conductive epoxy  
or glue, which must be electrically nonconductive, is recommended  
under typical mounting conditions.  
These temperature sensors, as well as any associated circuitry,  
should be kept insulated and dry to avoid leakage and corrosion.  
In wet or corrosive environments, any electrically isolated metal  
or ceramic well can be used to shield the temperature sensors.  
Condensation at very cold temperatures can cause errors and  
should be avoided by sealing the device, using electrically non-  
conductive epoxy paints or dip or any one of many printed circuit  
board coatings and varnishes.  
2.7V < V < 5.5V  
s
0.1F  
V
s
V
TMP3x  
SHDN  
OUT  
GND  
Thermal Environment Effects  
The thermal environment in which the TMP3x sensors are used  
determines two important characteristics: self-heating effects  
and thermal response time. Illustrated in Figure 3 is a thermal  
model of the TMP3x temperature sensors that is useful in  
understanding these characteristics.  
PIN ASSIGNMENTS  
V
V
OUT  
GND  
PACKAGE  
SHDN  
S
SOIC-8  
SOT-23-5  
TO-92  
8
2
1
4
5
3
1
1
2
5
4
NA  
T
T
JC  
CA  
J
C
Figure 4. Basic Temperature Sensor Circuit Configuration  
C
C
T
A
P
C
CH  
D
Figure 3. Thermal Circuit Model  
REV. C  
–7–  
TMP35/TMP36/TMP37  
The same circuit principles can be applied to the TMP36, but  
because of the TMP36’s inherent offset, the circuit uses two less  
resistors as shown in Figure 5b. In this circuit, the output  
voltage transfer characteristic is 1 mV/°F but is referenced to  
the circuit’s common; however, there is a 58 mV (58°F) offset  
in the output voltage. For example, the output voltage of the  
circuit would read 18 mV were the TMP36 placed in –40°F  
ambient environment and 315 mV at 257°F.  
Note the 0.1 µF bypass capacitor on the input. This capacitor  
should be a ceramic type, have very short leads (surface mount  
would be preferable), and be located as close a physical proxim-  
ity to the temperature sensor supply pin as practical. Since these  
temperature sensors operate on very little supply current and  
could be exposed to very hostile electrical environments, it is  
important to minimize the effects of RFI (radio frequency  
interference) on these devices. The effect of RFI on these  
temperature sensors in specific and analog ICs in general is  
manifested as abnormal dc shifts in the output voltage due to  
the rectification of the high frequency ambient noise by the IC.  
In those cases where the devices are operated in the presence of  
high frequency radiated or conducted noise, a large value tanta-  
lum capacitor (Ͼ2.2 µF) placed across the 0.1 µF ceramic may  
offer additional noise immunity.  
V
S
V
S
V
OUT  
0.1F  
TMP36  
Fahrenheit Thermometers  
R1  
45.3kꢄ  
Although the TMP3x temperature sensors are centigrade tem-  
perature sensors, a few components can be used to convert the  
output voltage and transfer characteristics to directly read Fahr-  
enheit temperatures. Shown in Figure 5a is an example of a  
simple Fahrenheit thermometer using either the TMP35 or the  
TMP37. This circuit can be used to sense temperatures from  
41°F to 257°F, with an output transfer characteristic of 1 mV/°F  
using the TMP35 and from 41°F to 212°F using the TMP37  
with an output characteristic of 2 mV/°F. This particular  
approach does not lend itself well to the TMP36 because of its  
inherent 0.5 V output offset. The circuit is constructed with an  
AD589, a 1.23 V voltage reference, and four resistors whose values  
for each sensor are shown in the figure table. The scaling of the  
output resistance levels was to ensure minimum output loading  
on the temperature sensors. A generalized expression for the  
circuit’s transfer equation is given by:  
GND  
R2  
V
@ 1mV/F – 58F  
OUT  
10kꢄ  
V
@ –40F = 18mV  
OUT  
V
@ +257F = 315mV  
OUT  
Figure 5b. TMP36 Fahrenheit Thermometer Version 1  
At the expense of additional circuitry, the offset produced by the  
circuit in Figure 5b can be avoided by using the circuit in Figure 5c. In  
this circuit, the output of the TMP36 is conditioned by a single-  
supply, micropower op amp, the OP193. Although the entire  
circuit operates from a single 3 V supply, the output voltage of the  
circuit reads the temperature directly, with a transfer character-  
istic of 1 mV/°F, without offset. This is accomplished through  
the use of an ADM660, a supply voltage inverter. The 3 V  
supply is inverted and applied to the P193’s V– terminal. Thus,  
for a temperature range between –40°F and +257°F, the  
output of the circuit reads –40 mV to +257 mV. A general  
expression for the circuit’s transfer equation is given by:  
R1  
R1+ R2  
R3  
R3+ R4  
VOUT  
=
TMP35 +  
AD589  
(
)
(
)
where: TMP35 = Output voltage of the TMP35, or the TMP37,  
at the measurement temperature, TM, and  
AD589 = Output voltage of the reference = 1.23 V.  
Note that the output voltage of this circuit is not referenced to  
the circuit’s common. If this output voltage were to be applied  
directly to the input of an ADC, the ADC’s common should be  
adjusted accordingly.  
  
  
R6  
R4  
R4 VS  
VOUT  
=
1+  
TMP36 −  
(
)
  
  
R5+ R6  
R3  
R3  
2
  
  
Average and Differential Temperature Measurement  
V
S
In many commercial and industrial environments, temperature  
sensors are often used to measure the average temperature in a  
building, or the difference in temperature between two locations  
on a factory floor or in an industrial process. The circuits in  
Figures 6a and 6b demonstrate an inexpensive approach  
to average and differential temperature measurement.  
In Figure 6a, an OP193 is used to sum the outputs of three  
temperature sensors to produce an output voltage scaled by  
10 mV/°C that represents the average temperature at three loca-  
tions. The circuit can be extended to as many temperature  
sensors as required as long as the circuit’s transfer equation  
is maintained. In this application, it is recommended that one  
temperature sensor type be used throughout the circuit; other-  
wise, the output voltage of the circuit will not produce an  
accurate reading of the various ambient conditions.  
0.1F  
V
S
R1  
V
TMP35/37 OUT  
R2  
GND  
V
OUT  
AD589  
1.23V  
R3  
R4  
PIN ASSIGNMENTS  
TCV  
R1 (k) R2 (k) R3 (k) R4 (k)  
SENSOR  
OUT  
TMP35  
TMP37  
1mV/F  
2mV/F  
45.3  
45.3  
10  
10  
10  
10  
374  
182  
Figure 5a. TMP35/TMP37 Fahrenheit Thermometers  
–8–  
REV. C  
TMP35/TMP36/TMP37  
+3V  
R1  
50k  
R3  
R5  
R4  
C1  
10F  
0.1F  
R2  
50kꢄ  
8
2
3
V
S
V
@ 1mV/F  
OUT  
–40F Յ T Յ +257F  
OP193  
4
6
V
OUT  
A
10F/0.1F  
TMP36  
R6  
GND  
8
1
2
5
6
–3V  
NC  
ELEMENT  
TMP36  
10F  
R2  
R4  
R5  
R6  
258.6kꢄ  
10kꢄ  
47.7kꢄ  
10kꢄ  
ADM660  
10F  
4
3
NC  
7
Figure 5c. TMP36 Fahrenheit Thermometer Version 2  
as shown in the figure. Using the TMP36, the output voltage of  
the circuit is scaled by 10 mV/°C. To minimize error in the differ-  
ence between the two measured temperatures, a common, readily  
available thin-film resistor network is used for R1–R4.  
The circuit in Figure 6b illustrates how a pair of TMP3x sensors  
can be used with an OP193 configured as a difference amplifier  
to read the difference in temperature between two locations. In  
these applications, it is always possible that one temperature  
sensor would be reading a temperature below that of the other  
sensor. To accommodate this condition, the output of the OP193  
is offset to a voltage at one-half the supply via R5 and R6. Thus,  
the output voltage of the circuit is measured relative to this point,  
2.7V < V < 5.5V  
S
2.7V < +V < 5.5V  
S
0.1F  
R1*  
R2*  
TMP36  
@ T1  
0.1F  
V
TEMP(AVG)  
7
@ 10mV/C FOR TMP35/36  
@ 20mV/C FOR TMP35/36  
R8  
25kꢄ  
2
3
1
OP193  
4
0.1F  
R5  
100kꢄ  
7
R1  
300kꢄ  
2
3
V
OUT  
TMP3x  
TMP3x  
TMP3x  
6
OP193  
4
R3*  
TMP36  
@ T2  
0.1F  
R6  
7.5kꢄ  
R2  
300kꢄ  
R7  
100kꢄ  
R9  
25kꢄ  
CENTERED AT  
FOR R1 = R2 = R3 = R;  
= 1 (TMP3x + TMP3x + TMP3x )  
R4*  
1F  
V
TEMP(AVG)  
1
2
3
3
R3  
R1  
3
300kꢄ  
R5 =  
R6  
100kꢄ  
R5  
100kꢄ  
V
= T2 – T1 @ 10mV/C  
0
Յ T Յ 125 C  
A
OUT  
R4  
7.5kꢄ  
R4 = R6  
V
S
CENTERED AT  
2
*R1–R4, CADDOCK T914–100k–100, OR EQUIVALENT  
Figure 6b. Configuring Multiple Sensors for Differential  
Temperature Measurements  
Figure 6a. Configuring Multiple Sensors for Average  
Temperature Measurements  
REV. C  
–9–  
TMP35/TMP36/TMP37  
Microprocessor Interrupt Generator  
Thermocouple Signal Conditioning with Cold-Junction  
Compensation  
These inexpensive temperature sensors can be used with a  
voltage reference and an analog comparator to configure an  
interrupt generator useful in microprocessor applications. With  
the popularity of fast 486 and Pentium® laptop computers, the  
need to indicate a microprocessor overtemperature condition  
has grown tremendously. The circuit illustrated in Figure 7  
demonstrates one way to generate an interrupt using a TMP35,  
a CMP402 analog comparator, and a REF191, a 2 V precision  
voltage reference.  
The circuit in Figure 8 conditions the output of a Type K  
thermocouple, while providing cold-junction compensation for  
temperatures between 0°C and 250°C. The circuit operates  
from single 3.3 V to 5.5 V supplies and has been designed to  
produce an output voltage transfer characteristic of 10 mV/°C.  
A Type K thermocouple exhibits a Seebeck coefficient of  
approximately 41 µV/°C; therefore, at the cold junction, the  
TMP35, with a temperature coefficient of 10 mV/°C, is  
used with R1 and R2 to introduce an opposing cold-junction  
temperature coefficient of –41 µV/°C. This prevents the  
isothermal, cold-junction connection between the circuit’s PCB  
tracks and the thermocouple’s wires from introducing an error  
in the measured temperature. This compensation works extremely  
well for circuit ambient temperatures in the range of 20°C to  
50°C. Over a 250°C measurement temperature range, the  
thermocouple produces an output voltage change of 10.151 mV.  
Since the required circuit’s output full-scale voltage is 2.5 V, the  
gain of the circuit is set to 246.3. Choosing R4 equal to 4.99 kΩ  
sets R5 equal to 1.22 M. Since the closest 1% value for R5 is  
1.21 M, a 50 kpotentiometer is used with R5 for fine trim of  
the full-scale output voltage. Although the OP193 is a superior  
single-supply, micropower operational amplifier, its output stage  
is not rail-to-rail; as such, the 0°C output voltage level is 0.1 V.  
If this circuit were to be digitized by a single-supply ADC, the  
ADC’s common should be adjusted to 0.1 V accordingly.  
The circuit has been designed to produce a logic HIGH interrupt  
signal if the microprocessor temperature exceeds 80°C. This  
80°C trip point was arbitrarily chosen (final value set by the  
microprocessor thermal reference design) and is set using an  
R3–R4 voltage divider of the REF191’s output voltage. Since  
the output of the TMP35 is scaled by 10 mV/°C, the voltage at  
the CMP402’s inverting terminal is set to 0.8 V.  
Since temperature is a slowly moving quantity, the possibility  
for comparator chatter exists. To avoid this condition, hysteresis  
is used around the comparator. In this application, a hysteresis  
of 5°C about the trip point was arbitrarily chosen; the ultimate  
value for hysteresis should be determined by the end application.  
The output logic voltage swing of the comparator with R1 and  
R2 determine the amount of comparator hysteresis. Using a 3.3 V  
supply, the output logic voltage swing of the CMP402 is 2.6 V;  
thus, for a hysteresis of 5°C (50 mV @ 10 mV/°C), R1 is set to  
20 kand R2 is set to 1 M. An expression for this circuit’s  
hysteresis is given by:  
Using TMP3x Sensors in Remote Locations  
In many industrial environments, sensors are required to oper-  
ate in the presence of high ambient noise. These noise sources  
take on many forms; for example, SCR transients, relays, radio  
transmitters, arc welders, ac motors, and so on. They may also  
be used at considerable distances from the signal conditioning  
circuitry. These high noise environments are very typically in the  
form of electric fields, so the voltage output of the tempera-  
ture sensor can be susceptible to contamination from these  
noise sources.  
R1  
VHYS  
=
V
LOGIC SWING,CMP402  
(
)
R2  
Because of the likelihood that this circuit would be used in  
close proximity to high speed digital circuits, R1 is split into  
equal values and a 1000 pF is used to form a low-pass filter  
on the output of the TMP35. Furthermore, to prevent high  
frequency noise from contaminating the comparator trip point,  
a 0.1 µF capacitor is used across R4.  
3.3V  
R2  
1M  
V
S
0.1F  
3
R1A  
10kꢄ  
R1B  
10kꢄ  
V
OUT  
6
5
4
0.1F  
TMP35  
2
INTERRUPT  
C1  
C
R5  
100kꢄ  
L
14  
1000pF  
GND  
0.1F  
>80C  
13  
2
<80C  
R3  
16kꢄ  
V
6
REF  
REF191  
4
3
R4  
10kꢄ  
0.1F  
1F  
1
4
C1 =  
CMP402  
Figure 7. Pentium Overtemperature Interrupt Generator  
Pentium is a registered trademark of Intel Corporation.  
–10–  
REV. C  
TMP35/TMP36/TMP37  
3.3V < V < 5.5V  
S
V
P1  
50k  
S
R3  
10Mꢄ  
5%  
V
0.1F  
R5*  
1.21Mꢄ  
R4  
4.99kꢄ  
OUT  
TMP35  
0.1F  
GND  
R1*  
24.9kꢄ  
7
2
3
6
V
OUT  
OP193  
0V – 2.5V  
R6  
CU  
CU  
CHROMEL  
100kꢄ  
5%  
4
TYPE K  
THERMO-  
COUPLE  
COLD  
JUNCTION  
NOTE: ALL RESISTORS 1%  
UNLESS OTHERWISE NOTED  
ALUMEL  
R2*  
102ꢄ  
ISOTHERMAL  
BLOCK  
0C Յ T Յ 250C  
Figure 8. A Single-Supply, Type K Thermocouple Signal Conditioning Circuit with Cold-Junction Compensation  
Illustrated in Figure 9 is a way to convert the output voltage of a  
TMP3x sensor into a current to be transmitted down a long  
twisted-pair shielded cable to a ground referenced receiver. The  
temperature sensors do not possess the capability of high output  
current operation; thus, a garden variety PNP transistor is used  
to boost the output current drive of the circuit. As shown in the  
table, the values of R2 and R3 were chosen to produce an arbi-  
trary full-scale output current of 2 mA. Lower values for the  
full-scale current are not recommended. The minimum-scale  
output current produced by the circuit could be contaminated  
by nearby ambient magnetic fields operating in the vicinity of  
the circuit/cable pair. Because of the use of an external transis-  
tor, the minimum recommended operating voltage for this  
circuit is 5 V. Note, to minimize the effects of EMI (or RFI),  
both the circuit’s and the temperature sensor’s supply pins are  
bypassed with good quality, ceramic capacitors.  
A Temperature to 4–20 mA Loop Transmitter  
In many process control applications, 2-wire transmitters are  
used to convey analog signals through noisy ambient environ-  
ments. These current transmitters use a “zero-scale” signal  
current of 4 mA that can be used to power the transmitter’s  
signal conditioning circuitry. The “full-scale” output signal in  
these transmitters is 20 mA.  
A circuit that transmits temperature information in this fashion  
is illustrated in Figure 10. Using a TMP3x as the temperature  
sensor, the output current is linearly proportional to the tem-  
perature of the medium. The entire circuit operates from the  
3 V output of the REF193. The REF193 requires no external  
trimming for two reasons: (1) the REF193’s tight initial output  
voltage tolerance and (2) the low supply current of TMP3x, the  
OP193 and the REF193. The entire circuit consumes less than  
3 mA from a total budget of 4 mA. The OP193 regulates the  
output current to satisfy the current summation at the noninverting  
node of the OP193. A generalized expression for the KCL  
equation at the OP193’s Pin 3 is given by:  
R1  
5V  
4.7kꢄ  
TMP3x × R3 VREF × R3  
1
R 7  
2N2907  
IOUT  
=
×
+
V
OUT  
R1  
R2  
V
0.1F  
S
For each of the three temperature sensors, the table below illus-  
trates the values for each of the components, P1, P2, and R1–R4:  
R3  
0.01F  
V
TMP3x  
OUT  
Table II. Circuit Element Values for Loop Transmitter  
GND  
R2  
TWISTED PAIR  
BELDEN TYPE 9502  
OR EQUIVALENT  
Sensor R1() P1() R2()  
P2() R3() R4()  
1.58 M 100 k 140 k 56.2 k  
97.6 k 47 k  
84.5 k 8.45 k  
TMP35 97.6 k  
TMP36 97.6 k  
TMP37 97.6 k  
5 k  
5 k  
5 k  
SENSOR R2  
R3  
931 k  
10.5 k  
50 k  
500  
TMP35  
TMP36  
TMP37  
634 634  
887 887  
1k  
1k  
Figure 9. A Remote, 2-Wire Boosted Output Current Tem-  
perature Sensor  
REV. C  
–11–  
TMP35/TMP36/TMP37  
5V  
The 4 mA offset trim is provided by P2, and P1 provides the  
circuit’s full-scale gain trim at 20 mA. These two trims do not  
interact because the noninverting input of the OP193 is held at  
a virtual ground. The zero-scale and full-scale output currents of  
the circuit are adjusted according to the operating temperature  
range of each temperature sensor. The Schottky diode, D1, is  
required in this circuit to prevent loop supply power-on tran-  
sients from pulling the noninverting input of the OP193 more  
than 300 mV below its inverting input. Without this diode, such  
transients could cause phase reversal of the operational amplifier  
and possible latchup of the transmitter. The loop supply voltage  
compliance of the circuit is limited by the maximum applied  
input voltage to the REF193 and is from 9 V to 18 V.  
C
*
0.1F  
T
R
5kꢄ  
PU  
V
S
6
7
8
V
OUT  
4
3
TMP3x  
10F/0.1F  
1
fOUT  
AD654  
GND  
5
2
R1  
R
*
T
NB: ATT (min), fOUT = 0Hz  
A
5V  
P1  
*
R
AND C – SEE TABLE  
T T  
fOUT  
OFFSET  
P2  
100kꢄ  
R
OFF1  
470ꢄ  
R
A Temperature to Frequency Converter  
OFF2  
10ꢄ  
Another common method of transmitting analog information  
from a remote location is to convert a voltage to an equivalent in  
the frequency domain. This is readily done with any of the  
low cost, monolithic voltage-to-frequency converters (VFCs)  
available. These VFCs feature a robust, open-collector output  
transistor for easy interfacing to digital circuitry. The digital  
signal produced by the VFC is less susceptible to contamination  
from external noise sources and line voltage drops because the  
only important information is the frequency of the digital signal.  
As long as the conversions between temperature and frequency  
are done accurately, the temperature data from the sensors can  
be reliably transmitted.  
SENSOR  
R (R1 + P1)  
T
C
T
TMP35 11.8k+ 5001.7nF  
TMP36 16.2k+ 5001.8nF  
TMP37  
18.2k+ 1k2.1nF  
Figure 11. A Temperature-to-Frequency Converter  
An offset trim network (fOUT OFFSET ) is included with this  
circuit to set fOUT at 0 Hz when the temperature sensor’s mini-  
mum output voltage is reached. Potentiometer P1 is required to  
calibrate the absolute accuracy of the AD654. The table in  
Figure 11 illustrates the circuit element values for each of the  
three sensors. The nominal offset voltage required for 0 Hz  
output from the TMP35 is 50 mV; for the TMP36 and  
TMP37, the offset voltage required is 100 mV. In all cases  
for the circuit values shown, the output frequency transfer  
characteristic of the circuit was set at 50 Hz/°C. At the receiving  
end, a frequency-to-voltage converter (FVC) can be used to  
The circuit in Figure 11 illustrates a method by which the  
outputs of these temperature sensors can be converted to a  
frequency using the AD654. The output signal of the AD654 is  
a square wave that is proportional to the dc input voltage across  
Pins 4 and 3. The transfer equation of the circuit is given by:  
VTMP VOFFSET  
10 × R × C  
convert the frequency back to a dc voltage for further process  
ing. One such FVC is the AD650.  
-
fOUT  
=
(
)
T
T
For complete information on the AD650 and AD654, please  
consult the individual data sheets for those devices.  
3V  
2
6
REF193  
4
R2*  
1F  
V
LOOP  
9V TO 18V  
P2*  
4mA  
ADJUST  
V
0.1F  
S
R1*  
7
4
R6  
100kꢄ  
3
2
TMP3x  
Q1  
2N1711  
V
P1*  
OUT  
20mA  
ADJUST  
V
OUT  
GND  
D1  
R5  
100kꢄ  
R
L
250ꢄ  
R3*  
R4*  
*SEE TEXT  
FOR VALUES  
R7  
100ꢄ  
D1: HP5082–2810  
A1: OP193  
I
L
Figure 10. A Temperature to 4-to-20 mA Loop Transmitter  
–12–  
REV. C  
TMP35/TMP36/TMP37  
Driving Long Cables or Heavy Capacitive Loads  
Commentary on Long-Term Stability  
Although the TMP3x family of temperature sensors is capable  
of driving capacitive loads up to 10,000 pF without oscillation,  
output voltage transient response times can be improved with  
the use of a small resistor in series with the output of the temperature  
sensor, as shown in Figure 12. As an added benefit, this resistor  
forms a low-pass filter with the cable’s capacitance, which helps  
to reduce bandwidth noise. Since the temperature sensor is  
likely to be used in environments where the ambient noise level  
can be very high, this resistor helps to prevent rectification by the  
devices of the high frequency noise. The combination of this  
resistor and the supply bypass capacitor offers the best protection.  
The concept of long-term stability has been used for many years  
to describe by what amount an IC’s parameter would shift dur-  
ing its lifetime. This is a concept that has been typically applied  
to both voltage references and monolithic temperature sensors.  
Unfortunately, integrated circuits cannot be evaluated at room  
temperature (25°C) for 10 years or so to determine this shift. As  
a result, manufacturers very typically perform accelerated life-  
time testing of integrated circuits by operating ICs at elevated  
temperatures (between 125°C and 150°C) over a shorter period  
of time (typically, between 500 and 1000 hours).  
As a result of this operation, the lifetime of an integrated circuit  
is significantly accelerated due to the increase in rates of reac-  
tion within the semiconductor material.  
+V  
S
750ꢄ  
V
0.1F  
OUT  
TMP3x  
LONG CABLE OR  
HEAVY CAPACITIVE  
LOADS  
GND  
Figure 12. Driving Long Cables or Heavy Capacitive Loads  
REV. C  
–13–  
TMP35/TMP36/TMP37  
OUTLINE DIMENSIONS  
3-Pin Plastic Header-Style Package [TO-92]  
8-Lead Standard Small Outline Package [SOIC]  
(TO-92)  
Narrow Body  
(RN-8)  
Dimensions shown in inches and (millimeters)  
Dimensions shown in millimeters and (inches)  
0.205 (5.21)  
0.135  
5.00 (0.1968)  
4.80 (0.1890)  
0.175 (4.45)  
(3.43)  
MIN  
8
1
5
4
0.210 (5.33)  
0.170 (4.32)  
6.20 (0.2440)  
5.80 (0.2284)  
4.00 (0.1574)  
3.80 (0.1497)  
0.050  
(1.27)  
MAX  
SEATING  
PLANE  
0.50 (0.0196)  
0.25 (0.0099)  
1.27 (0.0500)  
BSC  
؋
 45؇  
1.75 (0.0688)  
1.35 (0.0532)  
0.25 (0.0098)  
0.10 (0.0040)  
0.019 (0.482)  
0.016 (0.407)  
0.500  
(12.70)  
MIN  
SQ  
8؇  
0.51 (0.0201)  
0.33 (0.0130)  
0؇ 1.27 (0.0500)  
COPLANARITY  
0.10  
0.25 (0.0098)  
0.19 (0.0075)  
SEATING  
PLANE  
0.41 (0.0160)  
COMPLIANT TO JEDEC STANDARDS MS-012AA  
0.055 (1.40)  
0.045 (1.15)  
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS  
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR  
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN  
0.105 (2.66)  
0.095 (2.42)  
0.115 (2.92)  
0.080 (2.03)  
0.165 (4.19)  
0.125 (3.18)  
1
2
3
0.115 (2.92)  
0.080 (2.03)  
5-Lead Plastic Surface-Mount Package [SOT-23]  
(RT-5)  
BOTTOM VIEW  
Dimensions shown in millimeters  
COMPLIANT TO JEDEC STANDARDS TO-226AA  
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETERS DIMENSIONS  
(IN PARENTHESES) ARE ROUNDED-OFF EQUIVALENTS FOR  
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN  
2.90 BSC  
5
1
4
3
2.80 BSC  
1.60 BSC  
2
PIN 1  
0.95 BSC  
1.90  
BSC  
1.30  
1.15  
0.90  
1.45 MAX  
10؇  
0؇  
0.15 MAX  
0.50  
0.30  
0.60  
0.45  
0.30  
SEATING  
PLANE  
0.22  
0.08  
COMPLIANT TO JEDEC STANDARDS MO-178AA  
Revision History  
Location  
Page  
10/02—Data Sheet changed from REV. B to REV. C.  
Deleted text from Commentary on Long-Term Stability section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Update OUTLINE DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
–14–  
REV. C  
–15–  
–16–  

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