CEXPRESS-BL [ADLINK]

COM Express Compact Size Type 6 Module;


型号：	CEXPRESS-BL
厂家：	ADLINK
描述：	COM Express Compact Size Type 6 Module
文件：	总4页 (文件大小：291K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

cExpress-BL

COM Express^®Compact Size Type 6 Module with

5th Generation Intel^®Core™ i7/i5/i3 and Celeron^®SoC

Features

5th Generation Intel^®Core™ i7/i5/i3 and Celeron^®SoC

●

Up to 32GB DDR3L at 1600MHz

●

Two DDI channels, one LVDS supporting 3 independent displays

●

Dual channel 18/24-bit LVDS (or build option eDP)

●

GbE, four PCIe x1 or 1 PCIe x4

●

Four SATA 6 Gb/s, two USB 3.0, six USB 2.0

Supports Smart Embedded Management Agent (SEMA^®) functions

●

Extreme Rugged operating temperature: -40°C to +85°C

(build option)

Speciﬁcations

● Audio

● Core System

Chipset

CPU

Intel^®HD Audio integrated in U-Series SoC

5th Generation Intel^®Core™ and Celeron^®Processor (Mobile) - 14nm

(formerly "Broadwell U-Series")

Core™ i7-5650U 2.2 GHz (3.2 GHz Turbo), 4MB, 15W (2C/GT3)

Core™ i5-5350U 1.8 GHz (2.9 GHz Turbo), 3MB, 15W (2C/GT3)

Core™ i3-5010U 2.1 GHz (no Turbo), 3MB, 15W (2C/GT2)

Celeron^®TBC

Audio Codec

located on carrier Express-BASE6 (ALC886 standard supported)

● Video

GPU Feature Support

Supports: Intel^®VT, Intel^®TXT, Intel^®SSE4.2, Intel^®HT Technology, Intel^®64

Architecture, Execute Disable Bit, Intel^®Turbo Boost Technology 2.0, Intel^®

AVX2, Intel^®AES-NI, Intel^®PCLMULQDQ Instruction, Intel^®Device Protection

Technology with Intel^®Secure Key, Intel^®TSX-NI.

Generation 8 Intel graphics core architecture, supporting 3 independent and

simultaneous displays

Note: Availability of features may vary between processor SKUs.

Combinations of DisplayPort/HDMI/LVDS or eDP outputs

Encode/transcode HD content

Memory

Playback of high deﬁnition content including Blu-ray Disc

Superior image quality with sharper, more colorful images

Dual channel non-ECC 1600/1333 MHz DDR3L memory up to 32GB in dual

SODIMM socket

Playback of Blu-ray disc S3D content using HDMI

(1.4a spec compliant with 3D)

Embedded BIOS

AMI EFI with CMOS backup in 8MB SPI BIOS with Intel AMT 10 support

DirectX Video Acceleration (DXVA) support for accelerating video processing

Full AVC/VC1/MPEG2 HW Decode

Advanced Scheduler 2.0, 1.0, XPDM support

Expansion Busses

4 PCI Express x1: lanes 0/1/2/3

LPC bus, SMBus (system) , I²C (user)

Windows 8, Windows 7, OSX, Linux OS support

DirectX 11.1, DirectX 11.1+, DirectX 10.1, DirectX 10, DirectX 9 support

OpenGL 4.2/4.0 support

SEMA Board Controller

LVDS/eDP

Single/dual channel 18/24-bit LVDS (default)

Supports : Voltage/Current monitoring, Power sequence debug support, AT/

ATX mode control, Logistics and Forensic information, Flat Panel Control,

General Purpose I²C, Failsafe BIOS (dual BIOS ), Watchdog Timer and Fan

Control

eDP support (optional)

Digital Display Interface

DDI1 supporting DisplayPort / HDMI

Debug Headers

40-pin multipurpose ﬂat cable connector for use in combination with

DB-40 debug module, providing BIOS POST code LED, BMC access, SPI BIOS

ﬂashing, power test points, debug LEDs

DDI2 supporting DisplayPort / HDMI

60-pin XDP header for ICE debug of CPU/Chipset

Note: “Build option” indicates an alternative BOM conﬁguration to support additional or alternative functions that are not available on the standard product.

Be aware that part numbers for SKUs with “build options” will need to be created and may cause production lead times.

Speciﬁcations

● Mechanical and Environmental

Form Factor: PICMG COM.0 Rev 2.1 Type 6

Dimension: Compact size: 95 mm x 95 mm

● Ethernet

Intel^®MAC/PHY: i218LM (Enterprise SKU) with AMT 10 support

Interface: 10/100/1000 GbE connection

● I/O Interfaces

Operating Temperature

Standard: 0°C to 60°C

USB: 2x USB 1.1/2.0/3.0 (USB 0,1) and 6x USB 1.1/2.0 (USB 2,3,4,5,6,7)

SATA: Four ports SATA 6Gb/s (SATA0, SATA1, SATA2, SATA3)

Serial: 2 UART ports COM1/2 with console redirection

GPIO: 4 GPO and 4 GPI

Extreme Rugged: -40°C + 85°C (build option)

Humidity

5-90% RH operating, non-condensing

● Super I/O

5-95% RH storage (operating with conformal coating)

Supported on carrier if needed (standard support for W83627DHG-P)

Shock and Vibration

IEC 60068-2-64 and IEC-60068-2-27

● TPM

Chipset: Atmel AT97SC3204

MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A,

Table 214-I, Condition D

Type: TPM 1.2

HALT

● Power

Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

Standard Input: ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5%

Wide Input: ATX = 5~20 V / 5Vsb ±5% or AT = 5 ~20V

Management: ACPI 4.0 compliant, Smart Battery support

● Intelligent Middleware

SEMA^®

Power States: C1-C6, S0, S4, S3, S5, S5 ECO mode

(Wake on USB S3/S4, WOL S3/S4/S5)

Local management, control of embedded computer systems

Extended EAPI for monitoring, controlling and analytics applications

Multiple OS support and across platforms (x86, ARM)

ECO mode: Supports deep S5 mode for power saving

● Operating Systems

Standard Support

Windows 7/8.1U 32/64-bit, Linux 32/64-bit

Extended Support (BSP)

WES7, WE8S, Linux, VxWorks (all support 32/64-bit)

Note: “Build option” indicates an alternative BOM conﬁguration to support additional or alternative functions that are not available on the standard product.

Be aware that part numbers for SKUs with “build options” will need to be created and may cause production lead times.

Functional Diagram

SODIMM1

1333/1600MHz

1~8 GB DDR3L,

non-ECC

SODIMM2

1333/1600MHz

1~8 GB DDR3L,

non-ECC

XDP

5^thGeneraꢀon

60 pin

Intel® Core™

Dual Core

eDP to LVDS

RTD2136R

Single/Dual

18/24 bit LVDS

eDP

2 lanes

DDI 0

DP/HDMI/DVI

Intel® Celeron™

4-lane eDP

DDI 1

DP/HDMI/DVI

4 PCIe x1 Gen2

(port 0~3)

(formerly “Broadwell-U”)

2x USB 3.0 upgrade

(port 0~1)

GbE

i218LM

PCIe x1 Gen2

(port 4)

4x SATA 6Gb/s

(port 0~3)

8x USB 1.1/2.0

(port 0~7)

HD Audio

UART 0

UART 1

TPM

Atmel

AT97SC3204

Serial

NCT5104D

SPI

LPC bus

SPI 0

BIOS

4x GP0

4x GPI

GPIO

PCA9535

SMBus

SPI 1

BIOS

SMBus

GP I²C

DDC I²C

SEMA

BMC

SPI_CS#

LM73

SPI

Ordering Information

Accessories

●

cExpress-BL-i7-5650U

Heat Spreaders

Compact COM Express^®Type 6 module with Intel^®Core™

i7-5650U at 2.2/3.2 GHz with GT3 level graphics

●

HTS-cBL-B

Heatspreader for cExpress-BL with threaded standoffs for

bottom mounting

●

cExpress-BL-i5-5350U

Compact COM Express^®Type 6 module with Intel^®Core™

i5-5350U at 1.8/2.9 GHz with GT3 level graphics

●

HTS-cBL-BT

Heatspreader for cExpress-BL with through hole standoffs for

top mounting

●

cExpress-BL-i3-5010U

Compact COM Express^®Type 6 module with Intel^®Core™

i3-5010U at 2.1 GHz with GT2 level graphics

Passive Heatsinks

cExpress-BL-Celeron^®

●

Compact COM Express Type 6 module with Intel^®Celeron^®

THS-cBL-B

●

Low profile heatsink for cExpress-BL with threaded standoffs

for bottom mounting

Starter Kit

●

THS-cBL-BT

●

COM Express Type 6 Starter Kit Plus

Low profile heatsink for cExpress-BL with through hole

standoffs for top mounting

COM Express formfactor starter kit with Express-BASE6 board,

power supply, and accessory kit

Active Heatsink

●

THSF-cBL-B

High profile heatsink with Fan for cExpress-BL with threaded

standoffs for bottom mounting

●

THSH-cBL-B

High profile heatsink for cExpress-BL with through hole

standoffs for bottom mounting

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All products and company name listed are trademarks or trade names of their respective companies.

All specifications are subject to change without further notice.

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