CEXPRESS-BT-E3805 [ADLINK]
COM Express Compact Size Type 6 Module;型号: | CEXPRESS-BT-E3805 |
厂家: | ADLINK |
描述: | COM Express Compact Size Type 6 Module |
文件: | 总4页 (文件大小:292K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
cExpress-BT
COM Express® Compact Size Type 6 Module with
Intel Atom® E3800 series or Celeron® Processor SoC
Features
Single, dual, quad-core Intel Atom® or Celeron® Processor SoC
●
●
Up to 8GB Dual Channel DDR3L at 1333MHz
●
VGA and two DDI channels (build option LVDS)
●
Three PCIe x1, GbE
●
Two SATA 3Gb/s, one USB 3.0, seven USB 2.0
Supports Smart Embedded Management Agent (SEMA®) functions
●
●
Extreme Rugged operating temperature: -40°C to +85°C
(build option)
Specifications
● Core System
● Video
GPU Feature Support
CPU
Single, dual, quad-core Intel Atom® or Celeron® Processor
7th generation Intel® graphics core architecture with four execution units
supporting two independent displays
Atom® E3845 1.91 GHz 542/792 (Turbo) 10W (4C/1333)
Atom® E3827 1.75 GHz 542/792 (Turbo) 8W (2C/1333)
Atom® E3826 1.46 GHz 533/667 (Turbo) 7W (2C/1066)
Atom® E3825 1.33 GHz 533 (No Turbo) 6W (2C/1066)
Atom® E3815 1.46 GHz 400 (No Turbo) 5W (1C/1066)
Atom® E3805 1.33 GHz (No GFX) 3W (2C/1066)
3D graphics hardware acceleration
Supports DirectX 11, OCL 1.1, OGL ES Halt/2.0/1.1, OGL 3.2
Video decode hardware acceleration including support for H.264, MPEG2,
MVC, VC-1, WMV9 and VP8 formats
Celeron® N2930 1.83/2.16 (Burst) GHz, 313/854 (Turbo) 7.5W (4C/1333)
Celeron® J1900 2.0/2.42 (Burst) GHz, 688/854 (Turbo) 10W (4C/1333)
Video encode hardware acceleration including support for H.264, MPEG2 and
MVC formats
Supports: Single, dual or quad Out-of-Order Execution (OOE) processor
cores, Intel® VT-x, Intel® SSE4.1 and SSE4.2, Intel® 64 architecture, IA 32-bit ,
PCLMULQDQ Instruction DRNG, Intel® Thermal Monitor (TM1 & TM2)
Note: Availability of features may vary between processor SKUs.
Digital Display Interface
DDI1 supporting DisplayPort/HDMI/DVI (build option dual channel 18/24-bit
LVDS support)
DDI2 supporting DisplayPort/HDMI/DVI
Memory
Dual channel non-ECC 1333/1066 MHz DDR3L memory up to 8GB in dual
stacked SODIMM sockets
VGA
Analog VGA supporting resolutions of up to 2560 x 1600 x 24bpp @60
Embedded BIOS
AMI EFI with CMOS backup in 8MB SPI BIOS
● Audio
Chipset
Intel® HD Audio integrated in SoC
Cache
Primary 32 KB, 8-way L1 instruction cache and 24 KB, 6-way L1 write-back
data cache
Audio Codec
Located on carrier Express-BASE6
2MB for E3845, N2930 and J1900
1MB for E3827, E3826, E3825 and E3805
512K for E3815
● Ethernet
Intel® MAC/PHY: Intel® i210LM (MAC/PHY) Ethernet controller
Interface: 10/100/1000 GbE connection
Expansion Busses
3 PCI Express x1 Gen2 (AB): Ianes 0/1/2; build option PCIe x4 (lose GbE)
LPC bus, SMBus (system), I2C (user)
SEMA Board Controller
Supports: Voltage/Current monitoring, Power sequence debug support, AT/
ATX mode control, Logistics and Forensic information, Flat Panel Control,
General Purpose I2C, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan
Control
Debug Headers
40-pin multipurpose flat cable connector
Use in combination with DB-40 debug module
providing BIOS POST code LED, BMC access, SPI BIOS flashing, Power test
points, Debug LEDs
26-pin XDP header for ICE debug of CPU/chipset
Note: “build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product.
Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.
Specifications
● I/O Interfaces
● Mechanical and Environmental
USB: 1x USB 3.0 (USB 0)
Specification: PICMG COM.0: Rev 2.1 Type 6
6x USB 1.1/2.0 (USB 1/2/3/4/5/6, ports 3-6 from USB hub)
SATA: Two SATA 3 Gb/s ports
Form Factor: Compact size: 95 mm x 95 mm
Operating Temperature
Standard: 0°C to +60°C
Serial: 2 UART ports COM 0/1 (COM 0 support console redirection)
eMMC: Build option soldered on module bootable eMMC flash storage
8 to 32 GB
Extreme Rugged™: -40°C to +85°C (build option, Atom™ E38xx series only)
SDIO: On module mini SD card socket, eMMC feature may vary between OS
GPIO: 4 GPO and 4 GPI
Humidity
5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
● Super I/O
On carrier if needed (standard support for W83627DHG-P)
Shock and Vibration
IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A,
Table 214-I, Condition D
● TPM
Chipset: Atmel AT97SC3204 (build option)
Type: TPM 1.2
HALT
Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
● Power
● Operating Systems
Standard Support
Standard Input: ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5%
Wide Input: ATX = 5~20 V / 5Vsb ±5% or AT = 5 ~20V
Management: ACPI 4.0 compliant, Smart Battery support
Power States: C0, C1, C1E, C4, C6
Windows 7/8 32/64-bit, Linux 32/64-bit
Extended Support (BSP)
WES7/8, Linux, VxWorks 32/64-bit WEC7 32-bit
S0, S3, S4, S5 (Wake on USB S3 for port 0~7/S4 for port 0~3, WOL S3/S4/S5
ECO mode: Wake on USB S3/S4, WOL S3/S4/S5
Note: “Build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product.
Be aware that part numbers for SKUs with “build options” will need to be created and may cause production lead times.
Functional Diagram
SODIMM
1-4 GB DDR3L
non ECC
Analog VGA
SODIMM
1-4 GB DDR3L
non ECC
Intel® Atom
LVDS
eDP to LVDS
Realtek
E3845
E3827
eDP
2 lanes
E3826
E3825
E3815
Single/dual channel
18/24-bit LVDS (opꢀonal)
DDI1 (4 lanes)
DP/eDP/TMDS
E3805 (No GFX)
DDI2 (4 lanes)
DP/eDP/TMDS
Intel® Celeron®
3x USB 2.0/1.0
(ports 0-2)
N2930
J1900
1x USB 2.0/1.1
USB
Hub
4x USB 2.0/1.1
(ports 3-6)
1x USB 3.0 upgrade
(port 0)
(formerly “Bay Trail” )
3x PCIe x1 Gen2 (opt. 4x)
(port 0,1,2)
XDP
26
PCIe x1
altern.
route
GbE
i210
PCIe x1 Gen2
(port 3)
eMMC
8-32GB
2x SATA 3Gb/s (port 0/1)
HD Audio
UART0, UART1
Mini SD
Socket
TPM
Atmel
AT97SC3204
LPC bus
GPIO
SPI 0
BIOS
4x GP0
4x GPI
PCA9535
SMBus
GP I2C
DDC I2C
SPI 1
BIOS
SEMA
BMC
SPI_CS#
LM73
SPI
Ordering Information
Accessories
●
cExpress-BT-E3845
Heat Spreaders
Compact COM Express® Type 6 Module with Intel Atom® E3845
at 1.91 GHz
●
HTS-cBT-B
Heatspreader for cExpress-BT with threaded standoffs for
bottom mounting
●
cExpress-BT-E3827
Compact COM Express® Type 6 Module with Intel Atom® E3827
at 1.75 GHz
●
HTS-cBT-BT
Heatspreader for cExpress-BT with through hole standoffs for
top mounting
●
cExpress-BT-E3826
Compact COM Express® Type 6 Module with Intel Atom® E3826
at 1.46 GHz
Passive Heatsinks
●
cExpress-BT-E3825
Compact COM Express® Type 6 Module with Intel Atom® E3825
at 1.33 GHz
THS-cBT-B
●
Low profile heatsink for cExpress-BT with threaded standoffs
for bottom mounting
●
cExpress-BT-E3815
Compact COM Express® Type 6 Module with Intel Atom® E3815
at 1.46 GHz
●
THSH-cBT-B
High profile heatsink for cExpress-BT with threaded standoffs
for bottom mounting
●
cExpress-BT-E3805
Compact COM Express Type6 Module with Intel Atom® E3805
at 1.33 GHz
Active Heatsink
●
cExpress-BT-J1900
●
THSF-cBT-B
Compact COM Express® Type 6 Module with Intel® Celeron®
J1900 at 2.00 GHz
High profile heatsink with Fan for cExpress-BT with threaded
standoffs for bottom mounting (-40°C to + 85°C build option)
●
cExpress-BT-N2930
Compact COM Express® Type 6 Module with Intel® Celeron®
N2930 at 1.83 GHz
Starter Kit
●
COM Express Type 6 Starter Kit Plus
COM Express formfactor starter kit with Express-BASE6 board,
power supply, and accessory kit
www.adlinktech.com
All products and company name listed are trademarks or trade names of their respective companies.
Updated Jan. 08, 2018. ©2018 ADLINK Technology, Inc. All Rights Reserved.
All specifications are subject to change without further notice.
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