CEXPRESS-BT-E3815 [ADLINK]

COM Express Compact Size Type 6 Module;


型号：	CEXPRESS-BT-E3815
厂家：	ADLINK
描述：	COM Express Compact Size Type 6 Module
文件：	总4页 (文件大小：292K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

cExpress-BT

COM Express^®Compact Size Type 6 Module with

Intel Atom^®E3800 series or Celeron^®Processor SoC

Features

Single, dual, quad-core Intel Atom^®or Celeron^®Processor SoC

●

Up to 8GB Dual Channel DDR3L at 1333MHz

●

VGA and two DDI channels (build option LVDS)

●

Three PCIe x1, GbE

●

Two SATA 3Gb/s, one USB 3.0, seven USB 2.0

Supports Smart Embedded Management Agent (SEMA^®) functions

●

Extreme Rugged operating temperature: -40°C to +85°C

(build option)

Speciﬁcations

● Core System

● Video

GPU Feature Support

CPU

Single, dual, quad-core Intel Atom^®or Celeron^®Processor

7th generation Intel^®graphics core architecture with four execution units

supporting two independent displays

Atom^®E3845 1.91 GHz 542/792 (Turbo) 10W (4C/1333)

Atom^®E3827 1.75 GHz 542/792 (Turbo) 8W (2C/1333)

Atom^®E3826 1.46 GHz 533/667 (Turbo) 7W (2C/1066)

Atom^®E3825 1.33 GHz 533 (No Turbo) 6W (2C/1066)

Atom^®E3815 1.46 GHz 400 (No Turbo) 5W (1C/1066)

Atom^®E3805 1.33 GHz (No GFX) 3W (2C/1066)

3D graphics hardware acceleration

Supports DirectX 11, OCL 1.1, OGL ES Halt/2.0/1.1, OGL 3.2

Video decode hardware acceleration including support for H.264, MPEG2,

MVC, VC-1, WMV9 and VP8 formats

Celeron^®N2930 1.83/2.16 (Burst) GHz, 313/854 (Turbo) 7.5W (4C/1333)

Celeron^®J1900 2.0/2.42 (Burst) GHz, 688/854 (Turbo) 10W (4C/1333)

Video encode hardware acceleration including support for H.264, MPEG2 and

MVC formats

Supports: Single, dual or quad Out-of-Order Execution (OOE) processor

cores, Intel^®VT-x, Intel^®SSE4.1 and SSE4.2, Intel^®64 architecture, IA 32-bit ,

PCLMULQDQ Instruction DRNG, Intel^®Thermal Monitor (TM1 & TM2)

Note: Availability of features may vary between processor SKUs.

Digital Display Interface

DDI1 supporting DisplayPort/HDMI/DVI (build option dual channel 18/24-bit

LVDS support)

DDI2 supporting DisplayPort/HDMI/DVI

Memory

Dual channel non-ECC 1333/1066 MHz DDR3L memory up to 8GB in dual

stacked SODIMM sockets

VGA

Analog VGA supporting resolutions of up to 2560 x 1600 x 24bpp @60

Embedded BIOS

AMI EFI with CMOS backup in 8MB SPI BIOS

● Audio

Chipset

Intel^®HD Audio integrated in SoC

Cache

Primary 32 KB, 8-way L1 instruction cache and 24 KB, 6-way L1 write-back

data cache

Audio Codec

Located on carrier Express-BASE6

2MB for E3845, N2930 and J1900

1MB for E3827, E3826, E3825 and E3805

512K for E3815

● Ethernet

Intel^®MAC/PHY: Intel^®i210LM (MAC/PHY) Ethernet controller

Interface: 10/100/1000 GbE connection

Expansion Busses

3 PCI Express x1 Gen2 (AB): Ianes 0/1/2; build option PCIe x4 (lose GbE)

LPC bus, SMBus (system), I2C (user)

SEMA Board Controller

Supports: Voltage/Current monitoring, Power sequence debug support, AT/

ATX mode control, Logistics and Forensic information, Flat Panel Control,

General Purpose I²C, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan

Control

Debug Headers

40-pin multipurpose ﬂat cable connector

Use in combination with DB-40 debug module

providing BIOS POST code LED, BMC access, SPI BIOS ﬂashing, Power test

points, Debug LEDs

26-pin XDP header for ICE debug of CPU/chipset

Note: “build option” indicates an alternative BOM conﬁguration to support additional or alternative functions that are not available on the standard product.

Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.

Speciﬁcations

● I/O Interfaces

● Mechanical and Environmental

USB: 1x USB 3.0 (USB 0)

Speciﬁcation: PICMG COM.0: Rev 2.1 Type 6

6x USB 1.1/2.0 (USB 1/2/3/4/5/6, ports 3-6 from USB hub)

SATA: Two SATA 3 Gb/s ports

Form Factor: Compact size: 95 mm x 95 mm

Operating Temperature

Standard: 0°C to +60°C

Serial: 2 UART ports COM 0/1 (COM 0 support console redirection)

eMMC: Build option soldered on module bootable eMMC ﬂash storage

8 to 32 GB

Extreme Rugged™: -40°C to +85°C (build option, Atom™ E38xx series only)

SDIO: On module mini SD card socket, eMMC feature may vary between OS

GPIO: 4 GPO and 4 GPI

Humidity

5-90% RH operating, non-condensing

5-95% RH storage (and operating with conformal coating)

● Super I/O

On carrier if needed (standard support for W83627DHG-P)

Shock and Vibration

IEC 60068-2-64 and IEC-60068-2-27

MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A,

Table 214-I, Condition D

● TPM

Chipset: Atmel AT97SC3204 (build option)

Type: TPM 1.2

HALT

Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

● Power

● Operating Systems

Standard Support

Standard Input: ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5%

Wide Input: ATX = 5~20 V / 5Vsb ±5% or AT = 5 ~20V

Management: ACPI 4.0 compliant, Smart Battery support

Power States: C0, C1, C1E, C4, C6

Windows 7/8 32/64-bit, Linux 32/64-bit

Extended Support (BSP)

WES7/8, Linux, VxWorks 32/64-bit WEC7 32-bit

S0, S3, S4, S5 (Wake on USB S3 for port 0~7/S4 for port 0~3, WOL S3/S4/S5

ECO mode: Wake on USB S3/S4, WOL S3/S4/S5

Note: “Build option” indicates an alternative BOM conﬁguration to support additional or alternative functions that are not available on the standard product.

Be aware that part numbers for SKUs with “build options” will need to be created and may cause production lead times.

Functional Diagram

SODIMM

1-4 GB DDR3L

non ECC

Analog VGA

SODIMM

1-4 GB DDR3L

non ECC

Intel® Atom

LVDS

eDP to LVDS

Realtek

E3845

E3827

eDP

2 lanes

E3826

E3825

E3815

Single/dual channel

18/24-bit LVDS (opꢀonal)

DDI1 (4 lanes)

DP/eDP/TMDS

E3805 (No GFX)

DDI2 (4 lanes)

DP/eDP/TMDS

Intel® Celeron®

3x USB 2.0/1.0

(ports 0-2)

N2930

J1900

1x USB 2.0/1.1

USB

Hub

4x USB 2.0/1.1

(ports 3-6)

1x USB 3.0 upgrade

(port 0)

(formerly “Bay Trail” )

3x PCIe x1 Gen2 (opt. 4x)

(port 0,1,2)

XDP

PCIe x1

altern.

route

GbE

i210

PCIe x1 Gen2

(port 3)

eMMC

8-32GB

2x SATA 3Gb/s (port 0/1)

HD Audio

UART0, UART1

Mini SD

Socket

TPM

Atmel

AT97SC3204

LPC bus

GPIO

SPI 0

BIOS

4x GP0

4x GPI

PCA9535

SMBus

GP I²C

DDC I²C

SPI 1

BIOS

SEMA

BMC

SPI_CS#

LM73

SPI

Ordering Information

Accessories

●

cExpress-BT-E3845

Heat Spreaders

Compact COM Express^®Type 6 Module with Intel Atom^®E3845

at 1.91 GHz

●

HTS-cBT-B

Heatspreader for cExpress-BT with threaded standoffs for

bottom mounting

●

cExpress-BT-E3827

Compact COM Express^®Type 6 Module with Intel Atom^®E3827

at 1.75 GHz

●

HTS-cBT-BT

Heatspreader for cExpress-BT with through hole standoffs for

top mounting

●

cExpress-BT-E3826

Compact COM Express^®Type 6 Module with Intel Atom^®E3826

at 1.46 GHz

Passive Heatsinks

●

cExpress-BT-E3825

Compact COM Express^®Type 6 Module with Intel Atom^®E3825

at 1.33 GHz

THS-cBT-B

●

Low profile heatsink for cExpress-BT with threaded standoffs

for bottom mounting

●

cExpress-BT-E3815

Compact COM Express^®Type 6 Module with Intel Atom^®E3815

at 1.46 GHz

●

THSH-cBT-B

High profile heatsink for cExpress-BT with threaded standoffs

for bottom mounting

●

cExpress-BT-E3805

Compact COM Express Type6 Module with Intel Atom^®E3805

at 1.33 GHz

Active Heatsink

●

cExpress-BT-J1900

●

THSF-cBT-B

Compact COM Express^®Type 6 Module with Intel^®Celeron^®

J1900 at 2.00 GHz

High profile heatsink with Fan for cExpress-BT with threaded

standoffs for bottom mounting (-40°C to + 85°C build option)

●

cExpress-BT-N2930

Compact COM Express^®Type 6 Module with Intel^®Celeron^®

N2930 at 1.83 GHz

Starter Kit

●

COM Express Type 6 Starter Kit Plus

COM Express formfactor starter kit with Express-BASE6 board,

power supply, and accessory kit

www.adlinktech.com

All products and company name listed are trademarks or trade names of their respective companies.

All specifications are subject to change without further notice.

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