CEXPRESS-BW-X5-E8000 [ADLINK]

COM Express Compact Size Type 6 Module;


型号：	CEXPRESS-BW-X5-E8000
厂家：	ADLINK
描述：	COM Express Compact Size Type 6 Module
文件：	总4页 (文件大小：312K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

cExpress-BW

COM Express Compact Size Type 6 Module with

Intel^®Pentium^®, Celeron^®N3000 Series and Atom™ X5-E8000 SoC

New

Features

Dual, quad-core Intel^®Pentium^®, Celeron^®N3000 Series and

●

Atom™ X5-E8000 SoC

●

Up to 8 GB Dual Channel DDR3L at 1600MHz

●

Three DDI channels, one eDP, (shared with DDI3) 3 independent

displays (build option) LVDS in place of eDP

●

Three PCIe x1 (five PCIe x1 with bridge)

●

GbE, two SATA 6 Gb/s (build option onboard SSD),

four USB 3.0/2.0, four USB 2.0

Smart Embedded Management Agent (SEMA^®) functions

●

Speciﬁcations

● Core System

● Ethernet

CPU

MAC/PHY: Intel^®Ethernet Controller i211AT

Interface: 10/100/1000 GbE connection

Dual or quad-core Intel^®Pentium^®, Celeron^®N3000 Series and Atom™ SoC,

14nm process (formerly “Braswell”)

Intel^®Pentium^®N3710, 1.6/2.56 (Burst) GHz, 400/700 (Turbo), 6W (4C)

Intel^®Celeron^®N3160, 1.6/2.24 (Burst) GHz, 320/640 (Turbo), 6W (4C)

Intel^®Celeron^®N3060, 1.6/2.48 (Burst) GHz, 320/600 (Turbo), 6W (2C)

Intel^®Celeron^®N3010, 1.04/2.24 (Burst) GHz, 320/600 (Turbo), 4W (2C)

Intel^®Atom™ X5-E8000, 1.04/2.0 (Burst) GHz, 320

(no Turbo), 5W (4C)

● Video

Supports

3 independent and simultaneous display combinations of DisplayPort/HDMI/

eDP monitors (optional LVDS in place of eDP)

GPU Feature Support

Encode/transcode of HD video content

Memory

Supports 3D rendering, media compositing and video encoding

Dual channel non-ECC 1600/1333 MHz DDR3L memory

up to 8GB in dual SODIMM socket

Full hardware acceleration for decode of HEVC, H.264, SVC, VP8, VP9,

MPEG4, AVS, H.263

Full hardware acceleration for encode of H.264, SVC, VP8, VP9, AVS, H.263

Embedded BIOS

Supports content protection using PAVP2.0, HDCP 1.4/2.1 and Media Vault

DRM

AMI EFI with CMOS backup in 8MB SPI BIOS

Cache

DirectX 11.1 support

2MB for Pentium^®, Celeron^®and Atom™

OpenGL 4.2, ES 3.0 and OpenCL 1.2 support

Note: Availability of features dependent on operating system.

Expansion Busses

3x PCIe x1: Lanes 0/1/2 (build option 5x PCIe x1 with bridge)

LVDS/eDP

eDP support (shared with DDI3)

LPC bus, SMBus (system) , I2C (user)

Single/dual channel 18/24-bit LVDS (build option in place of eDP)

SEMA Board Controller

Supports voltage/current monitoring, power sequence debug support, AT/

ATX mode control, logistics and forensic information, ﬂat panel control,

general purpose I2C, failsafe BIOS (dual BIOS ), watchdog timer and fan

control

Digital Display Interface

DDI1 supporting DisplayPort/HDMI

DDI2 supporting DisplayPort/HDMI

DDI3 supporting DisplayPort/HDMI (shared with LVDS/eDP)

Note: Only two simultaneous HDMI outputs supported.

Debug Headers

40-pin multipurpose ﬂat cable connector for DB-40 debug module providing

BIOS POST code LEDs, BMC access, SPI BIOS ﬂashing, power testpoints,

debug LEDs

60-pin XDP header for ICE debug of CPU

● Audio

Chipset

Intel^®HD Audio integrated in SoC

Audio Codec

On Express-BASE6 carrier (ALC886 standard support)

Note: “Build option” indicates an alternative BOM conﬁguration to support additional or alternative functions that are not available on the standard product.

Be aware that part numbers for SKUs with “build options” will need to be created and may cause production lead times.

Speciﬁcations

● I/O Interfaces

● Mechanical and Environmental

USB: 4x USB 1.1/2.0/3.0 (USB 0,1,2,3) and 4x USB 1.1/2.0

(USB 4,5,6,7, port 4-7 from USB hub)

Form Factor: PICMG COM.0 Rev 2.1 Type 6

Dimension: Compact size: 95 mm x 95 mm

SATA: 2x SATA 6Gb/s (SATA0, SATA1)

Operating Temperature

Standard: 0°C to 60°C

Optional onboard SSD (8/16/32GB) in place of SATA1 port

Serial: 2 UART ports COM 1/2 (COM 1 supports console redirection)

GPIO/SD: 4 GPO and 4 GPI

Humidity

SD muxed with GPIO, switched by BIOS setting

5-90% RH operating, non-condensing

5-95% RH storage (and operating with conformal coating)

Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27

● Super I/O

Supported on carrier if needed (standard support for

W83627DHG-P)

MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A,

Table 214-I, Condition D

HALT

● TPM

Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

Chipset: Atmel AT97SC3204

Type: TPM 1.2

● Operating Systems

Standard Support

● Power

Standard Input: ATX: 12V±5%/5Vsb ±5%, or AT: 12V±5%

Windows 10/8.1 64-bit, Windows7 32/64-bit, Linux 32/64-bit

Wide Input: ATX: 5-20 V/5Vsb ±5%, or AT: 5-20V

Extended Support (BSP)

Management: ACPI 5.0 compliant, Smart Battery support

WES7 32/64-bit, Linux 32/64-bit, VxWorks 32-bit

Power States: C1-C6, S0, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL

S3/S4/S5)

ECO mode: Supports deep S5 mode for power saving

Note: “Build option” indicates an alternative BOM conﬁguration to support additional or alternative functions that are not available on the standard product.

Be aware that part numbers for SKUs with “build options” will need to be created and may cause production lead times.

Functional Diagram

Single/dual channel

18/24-bit LVDS

LVDS

eDP-to-LVDS

(opꢀonal)

SODIMM

1-4 GB DDR3L

non-ECC

eDP 4 lanes

SODIMM

1-4 GB DDR3L

non-ECC

4x USB 2.0/1.0

(ports 0-3)

Intel® Penꢀum®

Celeron®

DDI1 (4 lanes)

DP/HDMI

USB

Hub

1x USB 2.0/1.1

4x USB 2.0/1.1

(ports 4-7)

DDI2 (4 lanes)

DP/HDMI

Atom™

2x PCIe x1 Gen2

(port 0,1)

1x PCIe x1 Gen2

(port 2)

Switch

DDI3 (4 lanes)

DP/HDMI

(formerly “Braswell”)

(switch through BIOS)

PCIe

Switch

(optional)

3x PCIe x1 Gen2

(port 2,3,4)

4x USB 3.0 upgrade

(port 0-3)

PCIe x1 Gen2

GbE

XDP

60-pin

1x SATA 6Gb/s (port 0)

1x SATA 6Gb/s (port 1)

HD Audio

UART0, UART1

TPM

Atmel AT97SC3204

(optional)

LPC bus

SPI 0

BIOS

GPIO

GPIO/SD

SMBus

MUX

PCA9535

SPI 1

BIOS

GP I²C

DDC I²C

SEMA

BMC

SPI_CS#

LM73

SPI

Ordering Information

Accessories

●

cExpress-BW-N3710

Heat Spreaders

COM Express Compact size Type 6 module with Intel^®Pentium^®

N3710 at 1.6/2.56 (Burst) GHz

●

HTS-cBW-B

Heatspreader for cExpress-BW with threaded standoffs for

bottom mounting

●

cExpress-BW-N3160

COM Express Compact size Type 6 module with Intel^®Celeron^®

N3160 at 1.6/2.24 (Burst) GHz

●

HTS-cBW-BT

Heatspreader for cExpress-BW with through hole standoffs for

top mounting

●

cExpress-BW-N3060

COM Express Compact size Type 6 module with Intel^®Celeron^®

N3060 at 1.6/2.48 (Burst) GHz

Passive Heatsinks

●

cExpress-BW-N3010

COM Express Compact size Type 6 module with Intel^®Celeron^®

N3010 at 1.04/2.24 (Burst) GHz

THS-cBW-B

●

Low profile heatsink for cExpress-BW with threaded standoffs

for bottom mounting

●

cExpress-BW-x5-E8000

COM Express Compact size Type 6 module with Intel^®Atom™

x5-E8000 at 1.04/2.0 (Burst) GHz

●

THS-cBW-BT

Low profile heatsink for cExpress-BW with through hole

standoffs for top mounting

●

THSH-cBW-B

High profile heatsink for cExpress-BW with threaded standoffs

for bottom mounting

Active Heatsink

●

THSF-cBW-B

High profile heatsink with Fan for cExpress-BW with threaded

standoffs for bottom mounting

Starter Kit

●

COM Express Type 6 Starter Kit Plus

COM Express formfactor starter kit with Express-BASE6 board,

power supply, and accessory kit

www.adlinktech.com

All products and company name listed are trademarks or trade names of their respective companies.

All specifications are subject to change without further notice.

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