DLAP-3000-CFP5 [ADLINK]

Embedded System supporting MXM Graphics Module;
DLAP-3000-CFP5
型号: DLAP-3000-CFP5
厂家: ADLINK    ADLINK
描述:

Embedded System supporting MXM Graphics Module

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中文:  中文翻译
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(Preliminary)  
DLAP-3000-CFL Series  
Embedded System supporting MXM Graphics Module with  
8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket  
Features  
ADLINK MXM Graphics module support (Type A/B, up to 120W)  
8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor  
Dual SODIMMs for up to 64GB DDR4 non-ECC memory  
(dependent on CPU)  
DisplayPort (2 from CPU, 4 from MXM)  
1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module,  
1x M.2 B key supporting 2242 or 2280 for SATA storage module  
Reliable Molex type 12V DC-in connector  
Software Support  
Ordering Information  
Windows 10 IoT Enterprise CBB 64-bit  
Model  
DLAP-3000-CFP1  
DLAP-3000-CFP2  
DLAP-3000-CFP12 EGX-MXM-P1000/2000  
(not incl.)  
DLAP-3000-CFP3  
DLAP-3000-CFP5  
MXM Support  
EGX-MXM-P1000  
EGX-MXM-P2000  
Chipset DC-in  
Ubuntu 16.04 LTS  
H310  
H310  
H310  
12V  
12V  
12V  
Optional Accessories  
2.5" SATA SSD/HDD, M.2 Storage  
EGX-MXM-P3000  
EGX-MXM-P5000  
H310  
H310  
H310  
12V  
12V  
12V  
Wireless Module  
Wi-Fi/Bluetooth/4G LTE wireless kit (w/ antenna)  
DLAP-3000-CFP35 EGX-MXM-P3000/5000  
(not incl.)  
240W AC/DC Adapter  
Specifications  
DLAP-3000-CFP1  
DLAP-3000-CFP2  
EGX-MXM-P2000  
DLAP-3000-CFP3  
DLAP-3000-CFP5  
EGX-MXM-P5000  
Model  
DLAP-3000-CFP12*  
DLAP-3000-CFP35*  
MXM Support  
EGX-MXM-P1000  
EGX-MXM-P3000  
Intel® Core™ i7-9700TE, 1.8GHz 12M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (8C/8T)  
Intel® Core™ i7-8700T, 2.4GHz 12M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/12T)  
Intel® Core™ i5-8500T, 2.1GHz, 9M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/6T)  
Intel® Core™ i3-8100T, 3.1GHz, 6M Cache, 35W TDP, LGA1151, DDR4 2400MHz support (4C/4T)  
Intel® Celeron® G4900T, 2.9GHz, 2M Cache, 35W TDP, LGA1151, DDR4 2400MHz support (2C/2T)  
Processor  
Chipset  
Intel® H310 Chipset  
Memory  
I/O Interfaces  
Display  
Non-ECC DDR4 2666/2400MHz, 2x SO-DIMM, up to 64GB (dependent on CPU) system memory  
6x DisplayPort (2 from CPU, 4 from MXM)  
1x GbE (Intel® i219-LM), 3x GbE (Intel® i210-AT)  
1x RS-232/422/485, 1x RS-232  
Ethernet  
Serial Ports  
USB  
4x USB 3.1 Gen1 ports, 4x USB 2.0 ports  
1x M.2 E key supporting 1630 or 2230 for Wi-Fi/BT module,  
1x M.2 B key supporting 2242 or 2280 for SATA storage module  
M.2  
Default: w/o DIO  
Digital IO  
Option: 1x DI/DO with 4 in, 4 out, one ground pin , and one power pin  
(no power/5V/12V, 0.5A by BIOS selection)  
Default: w/o Audio  
Option 1: Mic-in, Line-out, Line-in  
Option 2: Mic-in, L/R speaker-out (6W + 6W)  
Option 3: Line-in, L/R speaker-out (6W + 6W)  
Audio  
TPM 2.0  
eSIM  
Optional  
Optional  
Storage  
2x 2.5" SATA 6Gb/s external drive bays  
1x SATA 6Gb/s signal via M.2 B key connector  
SATA  
Mechanical  
Dimensions  
Mounting  
235 x 182 x 75mm (W x D x H)  
Optional wall-mount bracket  
Power Supply  
DC Input  
DC 12V input (Molex DC-in jack)  
AC Input  
Optional: 240W (12V/20A) AC/DC adapter  
Environmental  
Operating Temperature  
Storage Temperature  
Humidity  
0°C to 50°C (W/MXM, W/SSD)  
-20°C to 60°C  
10% to 90%, non-condensing  
EN55032/EN55024  
EMC  
Safety  
UL/cUL, CB, CCC  
*Note: These models do not include an MXM graphics module.  
www.adlinktech.com  
All products and company names listed are trademarks or trade names of their respective companies.  
Updated Jul. 31, 2019. ©2019 ADLINK Technology, Inc. All Rights Reserved.  
All specifications are subject to change without further notice.  

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