NANOX-AL-N3350-2G [ADLINK]
COM Express Mini Size Type 10 Module;
| 型号： | NANOX-AL-N3350-2G |
| 厂家： | 
ADLINK |
| 描述： | COM Express Mini Size Type 10 Module |
| 文件： | 总4页 (文件大小：444K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
nanoX-AL
COM Express Mini Size Type 10 Module with Intel Atom® E3900 series SoC
and Pentium®/Celeron® SoC
Features
Intel Atom® E3900 series (formerly Apollo Lake) and
●
Pentium®/Celeron® SoC, supporting full virtualization (VT-d/VT-x)
●
Up to 8GB Dual Channel soldered non-ECC DDR3L at 1867/1600MHz
Newest Intel® Gen9 Low Power graphics, up to 4k resolution and
●
H.265 codec
●
Multiple PCIe x1 Gen2 (configurable to x2, x4), GbE
●
Two SATA 6 Gb/s, two USB 3.0 and six USB 2.0, eMMC 5.0
(build option)
●
Supports Smart Embedded Management Agent (SEMA) functions
●
Extreme Rugged operating temperature: -40°C to +85°C
(build option for E3900 series SKUs)
Specifications
● Core System
● Video
CPU
GPU Feature Support
Intel Atom® E3900 series (formerly Apollo Lake) and Pentium®/Celeron® SoC
Intel Atom® E3950 1.6/2.0GHz (Turbo), 12W (4C/1866)
Intel Atom® E3940 1.6/1.8GHz (Turbo), 9W (4C/1866)
Intel Atom® E3930 1.3/1.8GHz (Turbo), 6W (2C/1866)
Intel® Pentium® N4200 1.1/2.5GHz (Turbo), 6W (4C/1866) (by project basis)
Intel® Celeron® N3350 1.1/2.3GHz (Turbo), 6W (2C/1866) (by project basis)
Intel® Generation 9 LP Graphics Core Architecture, supporting 2 independent
and simultaneous display combinations of DisplayPort, HDMI, LVDS or eDP
outputs
Hardware encode/transcode (including HEVC)
DirectX 12, DirectX 11.3, DirectX 10, DirectX 9.3 support
OpenGL 4.3 and ES 3.0 support
OpenCL 2.0 support
Supports: Intel® TXT, Intel® SSE4.2, Intel® 64 Architecture, IA 32-bit, Intel®
AES-NI, dual or quad Out-of-Order Execution (OOE) processor cores,
PCLMULQDQ Instruction DRNG
Digital Display Interface
DDI0 supportts DisplayPort/HDMI/DVI
Note: Availability of features may vary between processor SKUs.
LVDS
Memory
Single channel 18/24-bit LVDS from eDP-to-LVDS IC
Up to 8 GB Dual channel DDR3L at 1867/1600 MHz non-ECC
2GB is single channel
eDP
4/8GB is dual channel
4 lane support (build option, in place of LVDS)
Embedded BIOS
AMI EFI with CMOS backup in 16MB SPI BIOS (dual BIOS by build option)
● Audio
Chipset
Intel® HD Audio integrated in SoC
Cache
2MB for all SKUs
Audio Codec
On carrier miniBASE-10R
Expansion Busses
Multiple PCI Express x1 Gen2: Lanes 0/1/2/3 (configurable to 3x1, 1x4,
1x2+2x1)
LPC bus, SMBus (system) , I2C (user)
● Ethernet
Intel® Ethernet Controller I210 (Extreme Rugged operating temperature range)
Intel® Ethernet Controller I211 (standard operating temperature range)
Supports IEEE 1588 and GbE0_SDP (I210 only)
SEMA® Board Controller
Supports : Voltage/current monitoring, power sequence debug support,
AT/ATX mode control, logistics and forensic information, flat panel control,
general purpose I2C, failsafe BIOS (dual BIOS), watchdog timer and fan control
Debug Headers
40-pin multipurpose flat cable connector for use with DB-40 debug module
providing BIOS POST code LED, BMC access, SPI BIOS flashing, power
testpoints, debug LEDs
MIPI60 header for ICE debug of CPU/chipset on break out board (build option)
Note: “build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product.
Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.
Specifications
● I/O Interfaces
● Mechanical and Environmental
USB: 2x USB 1.1/2.0/3.0 (USB 0,1) and 6x USB 1.1/2.0 (USB 2,3,4,5,6,7)
USB OTG support on USB 2.0 port 7 with Yocto Linux
SATA: Two ports SATA 6Gb/s (SATA0,1)
Form Factor: PICMG COM.0 Rev 2.1, Type 10
Dimension: Compact size: 84 mm x 55 mm
Operating Temperature
Standard: 0°C to 60°C
Serial: 2 UART ports
eMMC: eMMC 5.0 (8/16/32GB, build option)
GPIO/SD: 4 GPO and 4 GPI
Extreme Rugged: -45°C to +85°C (build option with E39XX SoC SKUs)
SD signal is a build option supported by project basis
Note: eMMC/SD boot device support depends on OS
Humidity
5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
● Super I/O
Supported on carrier if needed (standard support for W83627DHG-P)
Shock and Vibration
IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table
214-I, Condition D
● TPM (build option)
Chipset: Infineon
Type: TPM 2.0
HALT
Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
● Power
● Operating Systems
Standard Input: ATX: 12V±5%, 5Vsb ±5%; AT: 12V±5%
Wide Input: ATX: 4.75-20 V, 5Vsb ±5%; AT: 4.75-20V (Standard Temp. only)
Management: ACPI 5.0 compliant, Smart Battery support
Standard Support
Windows 10 64-bit, Yocto project based Linux 64-bit, VxWorks 64-bit
Power States: C1-C6, S0, S3, S4, S5 and S5 ECO mode (Wake on USB S3/S4, WOL
S3/S4/S5)
Extended Support (BSP)
VxWorks 64-bit
ECO mode: Supports deep S5 mode for power saving
Note: “build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product.
Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.
Functional Diagram
eDP x4 lanes
(build opꢀon)
LVDS
eDP to LVDS
eDP
Soldered
2/4/8 GB DDR3L
non-ECC
Single channel
18/24-bit
DDI0
4 lanes
8x USB 2.0/1.1 (port 0-7)
(port 7 supports host and client mode)
Intel Atom®
2x USB 3.0 (port 0-1)
Processor E3900
4x PCIe x1 Gen2 (port 0-3)
Supports x1, x2, x4 (3 devices only)
On break-out board
by build option
GbE0_SDP (for I210)
PCIe x1 Gen2
MIPI60
60-pin
GbE
I210/I211
2x SATA 6Gb/s
(port 0/1)
eMMC 5.0
8/16/32GB
(build option)
HD Audio
2 UART (Tx/Rx)
HSUART
Super I/O
TPM 2.0
LPC to UART
(build option)
LPC Bus
SMBus
GPIO
SPI0
PCA9535
BIOS
SD
I2C
SPI1
BIOS
4x GP0, 4x GPI (SDIO)
GP I2C
SEMA
BMC
DDC I2C
LM73
SPI_CS#
SPI
Ordering Information
Accessories
●
nanoX-AL-E3950-2G
Heat Spreaders
Mini COM Express Type10 with Intel Atom® E3950 (4C), 2G
memory
●
HTS-nXAL-B-I
Heatspreader for nanoX-AL Intel Atom® with threaded
standoffs for bottom mounting
●
nanoX-AL-E3940-2G
Mini COM Express Type10 with Intel Atom® E3940 (4C), 2G
memory
●
HTS-nXAL-BT-I
Heatspreader for nanoX-AL Intel Atom® with through hole
standoffs for top mounting
●
nanoX-AL-E3930-2G
Mini COM Express Type10 with Intel Atom® E3930 (2C), 2G
memory
●
HTS-nXAL-B
nanoX-AL-N4200-2G
Heatspreader for nanoX-AL Intel® Pentium®/Celeron® with
threaded standoffs for bottom mounting
●
Mini COM Express Type10 with Intel Pentium® N4200 (4C)
●
●
nanoX-AL-N3350-2G
HTS-nXAL-BT
Mini COM Express Type10 with Intel Celeron® N3350 (2C)
Heatspreader for nanoX-AL Intel® Pentium®/Celeron® with
through hole standoffs for top mounting
Notes:
1. Notes: the combination not listed above might be supported by project basis
2. N4200/N3350 is supported by project basis
Passive Heatsinks
●
THS-nXAL-B-I
Low profile heatsink for nanoX-AL Intel Atom® with threaded
standoffs for bottom mounting
Starter Kit
●
THS-nXAL-BT-I
Low profile heatsink for nanoX-AL Intel Atom® with through
hole standoffs for top mounting
●
COM Express Type 10 Starter Kit Plus
Starter Kit Plus Starter kit for COM Express Type 10
●
THS-nXAL-B
Low profile heatsink for nanoX-AL Intel® Pentium®/Celeron®
with threaded standoffs for bottom mounting
●
THS-nXAL-BT
Low profile heatsink for nanoX-AL Intel® Pentium®/Celeron®
with through hole standoffs for top mounting
●
THSH-nXAL-B-I
High profile heatsink for nanoX-AL Intel Atom® with threaded
standoffs for bottom mounting
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All products and company names listed are trademarks or trade names of their respective companies.
Updated Dec. 13, 2019. ©2019 ADLINK Technology, Inc. All Rights Reserved.
All specifications are subject to change without further notice.
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