NANOX-BT-E3827-2 [ADLINK]

Extreme Rugged COM Express Mini Size Type 10 Module;


型号：	NANOX-BT-E3827-2
厂家：	ADLINK
描述：	Extreme Rugged COM Express Mini Size Type 10 Module
文件：	总4页 (文件大小：430K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

nanoX-BT

Extreme Rugged COM Express^®Mini Size Type 10 Module with

Intel Atom^®E3800 series or Celeron^®Processor SoC

Features

Single, dual, quad-core Intel Atom^®or Celeron^®Processor SoC

●

Up to 4GB soldered Dual Channel DDR3L at 1333MHz

●

One DDI channel, one LVDS (build option, eDP)

●

Three PCIe x1

●

GbE, two SATA 3Gb/s, four USB and one USB client

Supports Smart Embedded Management Agent (SEMA^®) functions

●

Extreme Rugged operating temperature: -40°C to +85°C

(build option)

Speciﬁcations

● Core System

CPU

Debug Headers

Single, dual, quad-core Intel Atom^®or quad-core Celeron^®

40-pin multipurpose ﬂat cable connector

Use in combination with DB-40 debug module

providing BIOS POST code LED, BMC access, SPI BIOS ﬂashing, power test points,

debug LEDs

Atom^®E3845 1.91 GHz 542/792 Gfx (Turbo) 10W (4C/1333)

Atom^®E3827 1.75 GHz 542/792 Gfx (Turbo) 8W (2C/1333)

Atom^®E3826 1.46 GHz 533/667 Gfx (Turbo) 7W (2C/1066)

Atom^®E3825 1.33 GHz 533 Gfx (No Turbo) 6W (2C/1066)

Atom^®E3815 1.46 GHz 400 Gfx (No Turbo) 5W (1C/1066) Atom^®E3805 1.33 GHz

(No GFX) 3W (2C/1066)

60-pin XDP header for ICE debug of CPU/chipset on break out board

GPU Feature Support

7th generation Intel® graphics core architecture with four execution units

supporting two independent displays

Celeron^®N2930 1.83/2.16 (Burst) GHz, 313/854 (Turbo) 7.5W (4C/1333)Celeron^®

J1900 2.0/2.42 (Burst) GHz, 688/854 (Turbo) 10W (4C/1333)

Supports: Single, dual or quad Out-of-Order Execution (OOE) processor

cores, Intel^®VT-x, Intel^®SSE4.1 and SSE4.2, Intel^®64 architecture, IA 32-bit ,

PCLMULQDQ Instruction DRNG, Intel^®Thermal Monitor (TM1 & TM2)

Note: Availability of features may vary between processor SKUs.

3D graphics hardware acceleration

Supports for DirectX11, OCL 1.1, OGL ES Halt/2.0/1.1, OGL 3.2

Video decode hardware acceleration including support for H.264, MPEG2, MVC,

VC-1, WMV9 and VP8 formats

Memory

Video encode hardware acceleration including support for H.264, MPEG2 and

MVC formats

Single channel non-ECC 1333/1066 MHz soldered DDR3L memory up to 4GB

(2GB or 4GB)

Digital Display Interface

One DDI channel supporting DisplayPort/HDMI/DVI

Embedded BIOS

AMI EFI with CMOS backup in 8MB SPI BIOS

LVDS/eDP

Single channel 18/24-bit LVDS

(BOM option support for 24-bit EDID panel)

Cache

Primary 32 KB, 8-way L1 instruction cache and 24 KB, 6-way L1 write-back data

cache

eDP support (build option)

2MB for E3845, N2930 and J1900

1MB for E3827, E3826, E3825 and E3805

512K for E3815

● Audio

Chipset

Intel^®HD Audio integrated in SOC

Expansion Busses

3 PCI Express x1 Gen2 (AB): Ianes 0/1/2;

optional PCIe x4 (lose GbE)

Audio Codec

Located on carrier miniBASE-10R

LPC bus, SMBus (system), I2C (user)

SEMA Board Controller

● Ethernet

Supports: Voltage/Current monitoring, Power sequence debug support, AT/ATX

mode control, Logistics and Forensic information, Flat Panel Control, General

Purpose I2C, Watchdog Timer

Intel^®MAC/PHY: Intel^®i210LM (MAC/PHY) Ethernet controller

Interface: 10/100/1000 GbE connection

Note: “Build option” indicates an alternative BOM conﬁguration to support additional or alternative functions that are not available on the standard product.

Be aware that part numbers for SKUs with “build options” will need to be created and may cause production lead times.

Speciﬁcations

● Mechanical and Environmental

Form Factor: PICMG COM.0: Rev 2.1 Type 10

● I/O Interfaces

USB: 1x USB 3.0 (USB 0) 3x USB 2.0 (USB 1,2,3) and 1x USB 2.0 client (USB 7)

Dimension: Mini size: 84 mm x 55 mm

SATA: Two SATA 3 Gb/s ports

Serial: 2 UART ports COM 0/1 (COM 0 support console redirection)

eMMC: Optional soldered on module bootable eMMC ﬂash storage

8G to 32 GB

Operating Temperature

Standard: 0°C to +60°C

Extreme Rugged: -40 to +85°C (build option, Atom™ E38xx series only)

SD: Optional, SD support multiplexed over GPIO pins

eMMC and SD functions may vary between OS

GPIO: 4 GPO and 4 GPI

Humidity

5-90% RH operating, non-condensing

5-95% RH storage (and operating with conformal coating)

● Super I/O

On carrier if needed (standard support for W83627DHG-P)

Shock and Vibration

IEC 60068-2-64 and IEC-60068-2-27

MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table

214-I, Condition D

● Power

Standard Input: ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5%

Wide Input: ATX = 5-14V / 5Vsb (standard temp. only)

AT = 5-14V (standard temp. only)

HALT

Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

Management: ACPI 4.0 compliant, Smart Battery support

Power States: C0, C1, C1E, C4, C6

S0, S3, S4, S5 (Wake on USB S3/S4, WOL S3/S4/S5

ECO mode: Supports deep S5 (ECO mode) for power saving

● Operating Systems

Standard Support

Windows 7/8 32/64-bit, Windows 10 64-bit, Linux 32/64-bit

Extended Support (BSP)

WES7/8, Linux, VxWorks 32/64-bit, WEC7 32-bit

Note: “Build option” indicates an alternative BOM conﬁguration to support additional or alternative functions that are not available on the standard product.

Be aware that part numbers for SKUs with “build options” will need to be created and may cause production lead times.

Functional Diagram

eDP (optional)

LVDS

eDP to LVDS

RTL2132

DDI1

eDP 1 lane

Soldered

1-2 GB DDR3L

non ECC (only)

Intel Atom

E3845

E3827

E3826

E3825

E3815

DDI2

4 lanes

1x USB 1.1/2.0/3.0 (port 0)

3x USB 1.1/2.0 (port 1~3)

1x USB 1.1/2.0 client (port 7)

Intel Celeron

N2930

J1900

3 PCIe x1 Gen2

(port 0~2)

PCIe x1

alternative

route

(formerly

“Baytrail”)

GbE

i210

PCIe x1 Gen2

(port 3)

On break-out board

XDP

60-pin

2x SATA 3Gb/s

(port 0/1)

eMMC

8GB/16GB/

32GB

HD Audio

2 UART (Tx/Rx)

LPC Bus

SDIO/MMC port 0 (optional)

4x GP0, 4x GPI

GPIO

PCA9535

SMBus

GP I²C

DDC I²C

SPI0

BIOS

SEMA

BMC

LM73

to CPU

SPI_CS#

SPI

Ordering Information

Accessories

●

nanoX-BT-E3845-2G

Heat Spreaders

COM Express^®Mini Size Type 10 with Intel Atom^®E3845

●

HTS-nXBT-B

at 1.91 GHz and 2GB non ECC DDR3L

Heatspreader for nanoX-BT with threaded standoffs for bottom

mounting

●

nanoX-BT-E3827-2G

COM Express^®Mini Size Type 10 with Intel Atom^®E3827

●

at 1.75 GHz and 2GB non ECC DDR3L

HTS-nXBT-BT

Heatspreader for nanoX-BT with through hole standoffs for top

mounting

●

nanoX-BT-E3826-2G

COM Express^®Mini Size Type 10 with Intel Atom^®E3826

at 1.46 GHz and 2GB non ECC DDR3L

Passive Heatsinks

●

nanoX-BT-E3825-2G

COM Express^®Mini Size Type 10 with Intel Atom^®E3825

THS-nXBT-B

●

at 1.33 GHz and 2GB non ECC DDR3L

Low profile heatsink for nanoX-BT with threaded standoffs for

bottom mounting

●

nanoX-BT-E3815-2G

COM Express^®Mini Size Type 10 with Intel Atom^®E3815

●

THS-nXBT-BT

at 1.46 GHz and 2GB non ECC DDR3L

Low profile heatsink for nanoX-BT with through hole standoffs

for top mounting

●

nanoX-BT-E3805-2G

COM Express Mini Size Type 10 with Intel Atom^®E3805

●

THSM-nXBT-B

at 1.33 GHz and 2GB non ECC DDR3L

High profile heatsink for nanoX-BT with threaded standoffs for

bottom mounting

●

nanoX-BT-N2930-2G

COM Express Mini Size Type 10 with Intel^®Celeron^®N2930

at 1.83 GHz and 2GB non ECC DDR3L

●

nanoX-BT-J1900-2G

Starter Kit

COM Express^®Mini Size Type 10 with Intel^®Celeron^®J1900

at 2.00 GHz and 2GB non ECC DDR3L

●

COM Express Type 10 Starter Kit Plus

COM Express formfactor starter kit with miniBase-10R carrier

board, power supply, and accessory kit

www.adlinktech.com

All products and company names listed are trademarks or trade names of their respective companies.

All specifications are subject to change without further notice.

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