APT5026HVR [ADPOW]

Power MOS V is a new generation of high voltage N-Channel enhancement mode power MOSFETs.; 功率MOS V是新一代高压N沟道增强型功率MOSFET 。
APT5026HVR
型号: APT5026HVR
厂家: ADVANCED POWER TECHNOLOGY    ADVANCED POWER TECHNOLOGY
描述:

Power MOS V is a new generation of high voltage N-Channel enhancement mode power MOSFETs.
功率MOS V是新一代高压N沟道增强型功率MOSFET 。

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APT5026HVR  
500V 18.5A 0.260  
POWER MOS V®  
TO-258  
Power MOS V® is a new generation of high voltage N-Channel enhancement  
mode power MOSFETs. This new technology minimizes the JFET effect,  
increases packing density and reduces the on-resistance. Power MOS V®  
also achieves faster switching speeds through optimized gate layout.  
D
S
• Faster Switching  
• Lower Leakage  
• 100% Avalanche Tested  
• Popular TO-258 Package  
G
MAXIMUM RATINGS  
Symbol Parameter  
All Ratings: T = 25°C unless otherwise specified.  
C
APT5026HVR  
500  
UNIT  
VDSS  
ID  
Drain-Source Voltage  
Volts  
Continuous Drain Current @ TC = 25°C  
18.5  
Amps  
Volts  
1
IDM  
Pulsed Drain Current  
74  
VGS  
VGSM  
Gate-Source Voltage Continuous  
Gate-Source Voltage Transient  
±30  
±40  
Total Power Dissipation @ TC = 25°C  
Linear Derating Factor  
Watts  
200  
PD  
1.6  
W/°C  
TJ,TSTG  
TL  
Operating and Storage Junction Temperature Range  
-55 to 150  
300  
°C  
Amps  
mJ  
Lead Temperature: 0.063" from Case for 10 Sec.  
1
IAR  
Avalanche Current  
(Repetitive and Non-Repetitive)  
18.5  
1
EAR  
EAS  
30  
Repetitive Avalanche Energy  
Single Pulse Avalanche Energy  
4
1210  
STATIC ELECTRICAL CHARACTERISTICS  
Symbol Characteristic / Test Conditions  
MIN  
500  
18.5  
TYP  
MAX  
UNIT  
BVDSS  
ID(on)  
Drain-Source Breakdown Voltage (VGS = 0V, ID = 250µA)  
Volts  
2
On State Drain Current  
(VDS > ID(on) x RDS(on) Max, VGS = 10V)  
Amps  
2
RDS(on)  
Drain-Source On-State Resistance  
(VGS = 10V, 0.5 ID[Cont.])  
Ohms  
0.260  
25  
Zero Gate Voltage Drain Current (VDS = VDSS, VGS = 0V)  
IDSS  
µA  
Zero Gate Voltage Drain Current (VDS = 0.8 VDSS, VGS = 0V, TC = 125°C)  
Gate-Source Leakage Current (VGS = ±30V, VDS = 0V)  
Gate Threshold Voltage (VDS = VGS, ID = 1.0mA)  
250  
±100  
4
IGSS  
nA  
VGS(th)  
Volts  
2
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.  
APT Website - http://www.advancedpower.com  
USA  
405 S.W. Columbia Street  
EUROPE  
Bend, Oregon 97702-1035  
F-33700 Merignac - France  
Phone: (541) 382-8028  
Phone: (33) 5 57 92 15 15  
FAX: (541) 388-0364  
FAX: (33) 5 56 47 97 61  
Avenue J.F. Kennedy Bât B4 Parc Cadéra Nord  
DYNAMIC CHARACTERISTICS  
Symbol Characteristic  
APT5026HVR  
Test Conditions  
MIN  
TYP  
MAX  
UNIT  
Ciss  
Coss  
Crss  
Qg  
Input Capacitance  
3600  
470  
180  
140  
22  
4320  
660  
270  
210  
35  
VGS = 0V  
VDS = 25V  
f = 1 MHz  
Output Capacitance  
pF  
Reverse Transfer Capacitance  
3
VGS = 10V  
Total Gate Charge  
Qgs  
Qgd  
VDD = 0.5 VDSS  
Gate-Source Charge  
Gate-Drain ("Miller") Charge  
Turn-on Delay Time  
Rise Time  
nC  
ns  
ID = ID[Cont.] @ 25°C  
65  
95  
td(on)  
tr  
td(off)  
tf  
VGS = 15V  
VDD = 0.5 VDSS  
ID = ID[Cont.] @ 25°C  
RG = 1.6Ω  
11  
22  
10  
20  
Turn-off Delay Time  
Fall Time  
50  
75  
7
14  
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS  
Symbol Characteristic / Test Conditions  
MIN  
TYP  
MAX  
18.5  
74  
UNIT  
IS  
Continuous Source Current (Body Diode)  
Amps  
1
ISM  
VSD  
t rr  
Pulsed Source Current  
Diode Forward Voltage  
(Body Diode)  
2
(VGS = 0V, IS = -ID[Cont.]  
)
1.3  
Volts  
ns  
Reverse Recovery Time (IS = -ID[Cont.], dlS/dt = 100A/µs)  
Reverse Recovery Charge (IS = -ID[Cont.], dlS/dt = 100A/µs)  
415  
6.6  
Q rr  
µC  
THERMAL CHARACTERISTICS  
Symbol Characteristic  
MIN  
TYP  
MAX  
0.62  
40  
UNIT  
RθJC  
RθJA  
Junction to Case  
°C/W  
Junction to Ambient  
1
2
3
4
Repetitive Rating: Pulse width limited by maximum junction  
temperature.  
See MIL-STD-750 Method 3471  
Starting T = +25°C, L = 7.07mH, R = 25, Peak I = 18.5A  
j
G
L
Pulse Test: Pulse width < 380 µS, Duty Cycle < 2%  
APT Reserves the right to change, without notice, the specifications and information contained herein.  
0.7  
0.5  
D=0.5  
0.2  
0.1  
0.1  
0.05  
0.05  
0.02  
Note:  
0.01  
0.01  
t
1
SINGLE PULSE  
0.005  
t
2
t
1
Duty Factor D =  
Peak T = P x Z  
/
t
2
+ T  
J
DM  
θJC  
C
0.001  
10-5  
10-4  
10-3  
10-2  
10-1  
1.0  
10  
RECTANGULAR PULSE DURATION (SECONDS)  
FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION  
APT5026HVR  
50  
40  
30  
20  
10  
0
50  
40  
30  
20  
10  
0
V
=7V, 10V & 15V  
GS  
6V  
V
=15V  
GS  
6V  
V
=7V & 10V  
GS  
5.5V  
4.5V  
5.5V  
5V  
4V  
5V  
4V  
4.5V  
8
0
V
50  
100  
150  
200  
250  
0
V
2
4
6
10  
, DRAIN-TO-SOURCE VOLTAGE (VOLTS)  
, DRAIN-TO-SOURCE VOLTAGE (VOLTS)  
DS  
DS  
FIGURE 2, TYPICAL OUTPUT CHARACTERISTICS  
FIGURE 3, TYPICAL OUTPUT CHARACTERISTICS  
1.8  
50  
T
= -55°C  
J
NORMALIZED TO  
V
= 10V  
@
0.5 I [Cont.]  
D
GS  
V
> I (ON) x  
R (ON)MAX.  
DS  
T
= +125°C  
DS  
D
J
250µSEC. PULSE TEST  
40  
30  
20  
10  
0
1.6  
1.4  
1.2  
1.0  
0.8  
@ <0.5 % DUTY CYCLE  
V
=10V  
GS  
V
=20V  
GS  
T
= +125°C  
= +25°C  
J
T
= -55°C  
T
J
J
0
V
2
4
6
8
0
20  
40  
60  
80  
, GATE-TO-SOURCE VOLTAGE (VOLTS)  
I , DRAIN CURRENT (AMPERES)  
GS  
D
FIGURE 4, TYPICAL TRANSFER CHARACTERISTICS  
FIGURE 5, R (ON) vs DRAIN CURRENT  
DS  
20  
1.20  
1.15  
1.10  
1.05  
1.00  
0.95  
0.90  
16  
12  
8
4
0
25  
50  
75  
100  
125  
150  
-50 -25  
0
25 50 75 100 125 150  
T , CASE TEMPERATURE (°C)  
T , JUNCTION TEMPERATURE (°C)  
C
J
FIGURE 6, MAXIMUM DRAIN CURRENT vs CASE TEMPERATURE  
FIGURE 7, BREAKDOWN VOLTAGE vs TEMPERATURE  
2.5  
1.2  
I
= 0.5 I [Cont.]  
D
D
V
= 10V  
GS  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
2.0  
1.5  
1.0  
0.5  
0.0  
-50 -25  
0
25 50  
75 100 125 150  
-50 -25  
0
25 50 75 100 125 150  
T , JUNCTION TEMPERATURE (°C)  
T , CASE TEMPERATURE (°C)  
J
C
FIGURE 8, ON-RESISTANCE vs. TEMPERATURE  
FIGURE 9, THRESHOLD VOLTAGE vs TEMPERATURE  
APT5026HVR  
80  
50  
10,000  
5,000  
10µS  
OPERATION HERE  
LIMITED BY R (ON)  
DS  
100µS  
C
iss  
10  
5
1mS  
C
oss  
1,000  
500  
10mS  
1
C
rss  
100mS  
DC  
T
T
=+25°C  
=+150°C  
.5  
C
J
SINGLE PULSE  
.1  
100  
1
V
5
10  
50 100  
500  
.01  
V
.1  
1
10  
50  
, DRAIN-TO-SOURCE VOLTAGE (VOLTS)  
, DRAIN-TO-SOURCE VOLTAGE (VOLTS)  
DS  
DS  
FIGURE 10, MAXIMUM SAFE OPERATING AREA  
FIGURE 11, TYPICAL CAPACITANCE vs DRAIN-TO-SOURCE VOLTAGE  
100  
20  
16  
12  
8
I
= I [Cont.]  
D
D
T
=+150°C  
T
=+25°C  
J
J
V
=100V  
50  
DS  
=250V  
V
DS  
V
=400V  
DS  
10  
5
4
0
1
0
50  
g
100  
150  
200  
250  
300  
0
V
0.4  
0.8  
1.2  
1.6  
2.0  
Q , TOTAL GATE CHARGE (nC)  
, SOURCE-TO-DRAIN VOLTAGE (VOLTS)  
SD  
FIGURE 12, GATE CHARGES vs GATE-TO-SOURCE VOLTAGE  
FIGURE 13, TYPICAL SOURCE-DRAIN DIODE FORWARD VOLTAGE  
TO-258 Package Outline  
17.65 (.695)  
17.39 (.685)  
1.14 (.045)  
0.88 (.035)  
8.89 (.350)  
8.63 (.340)  
4.19 (.165)  
3.94 (.155)  
21.21 (.835)  
20.70 (.815)  
17.96 (.707)  
17.70 (.697)  
13.84 (.545)  
13.58 (.535)  
Drain  
Source  
Gate  
19.05 (0.750)  
12.70 (0.500)  
1.65 (.065) Dia. Typ.  
1.39 (.055) 3 Leads  
3.56 (.140) BSC  
6.86 (.270)  
6.09 (.240)  
5.08 (.200) BSC  
Dimensions in Millimeters and (Inches)  
APT's devices are covered by one or more of the following U.S.patents: 4,895,810  
5,256,583  
5,045,903  
4,748,103  
5,089,434  
5,283,202  
5,182,234  
5,231,474  
5,019,522  
5,434,095  
5,262,336  
5,528,058  

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