APTM100H45SCT [ADPOW]

Full bridge Series & SiC parallel diodes MOSFET Power Module; 全桥系列和碳化硅二极管并联MOSFET功率模块
APTM100H45SCT
型号: APTM100H45SCT
厂家: ADVANCED POWER TECHNOLOGY    ADVANCED POWER TECHNOLOGY
描述:

Full bridge Series & SiC parallel diodes MOSFET Power Module
全桥系列和碳化硅二极管并联MOSFET功率模块

晶体 二极管 晶体管 功率场效应晶体管 开关 脉冲 局域网
文件: 总7页 (文件大小:325K)
中文:  中文翻译
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APTM100H45SCT  
Full bridge  
VDSS = 1000V  
RDSon = 450mmax @ Tj = 25°C  
Series & SiC parallel diodes  
MOSFET Power Module  
ID = 18A @ Tc = 25°C  
Application  
Motor control  
Switched Mode Power Supplies  
Uninterruptible Power Supplies  
VBUS  
CR1A  
CR3A  
CR1B CR3B  
OUT1 OUT2  
Features  
Q1  
Q3  
Q4  
Power MOS 7® MOSFETs  
G3  
S3  
G1  
S1  
-
-
-
-
Low RDSon  
Low input and Miller capacitance  
Low gate charge  
CR2A  
CR4A  
Avalanche energy rated  
CR2B CR4B  
Q2  
Parallel SiC Schottky Diode  
G4  
S4  
G2  
S2  
-
Zero reverse recovery  
-
-
-
Zero forward recovery  
Temperature Independent switching behavior  
Positive temperature coefficient on VF  
0/VBUS  
NTC1  
NTC2  
Kelvin source for easy drive  
Very low stray inductance  
-
-
Symmetrical design  
Lead frames for power connections  
Internal thermistor for temperature monitoring  
High level of integration  
G3  
S3  
G4  
S4  
OUT2  
OUT1  
Benefits  
Outstanding performance at high frequency operation  
Direct mounting to heatsink (isolated package)  
Low junction to case thermal resistance  
Solderable terminals both for power and signal for  
easy PCB mounting  
VBUS  
0/VBUS  
S1  
G1  
S2  
G2  
NTC2  
NTC1  
Low profile  
Absolute maximum ratings  
Symbol  
Parameter  
Max ratings  
Unit  
VDSS  
Drain - Source Breakdown Voltage  
1000  
V
Tc = 25°C  
Tc = 80°C  
18  
ID  
Continuous Drain Current  
A
14  
IDM  
VGS  
RDSon  
Pulsed Drain current  
Gate - Source Voltage  
Drain - Source ON Resistance  
72  
±30  
450  
V
m  
W
PD  
IAR  
EAR  
EAS  
Maximum Power Dissipation  
Tc = 25°C  
357  
18  
50  
2500  
Avalanche current (repetitive and non repetitive)  
A
Repetitive Avalanche Energy  
mJ  
Single Pulse Avalanche Energy  
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed.  
APT website – http://www.advancedpower.com  
1 – 7  
APTM100H45SCT  
All ratings @ Tj = 25°C unless otherwise specified  
Electrical Characteristics  
Symbol Characteristic  
Test Conditions  
VGS = 0V, ID = 250µA  
VGS = 0V,VDS= 1000V  
VGS = 0V,VDS= 800V  
VGS = 10V, ID = 9A  
VGS = VDS, ID = 2.5mA  
VGS = ±30 V, VDS = 0V  
Min Typ Max Unit  
BVDSS Drain - Source Breakdown Voltage  
1000  
V
Tj = 25°C  
Tj = 125°C  
100  
500  
450  
5
IDSS  
Zero Gate Voltage Drain Current  
µA  
RDS(on) Drain – Source on Resistance  
VGS(th) Gate Threshold Voltage  
mΩ  
V
nA  
3
IGS S  
Gate – Source Leakage Current  
±100  
Dynamic Characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
Ciss  
Coss  
Crss  
Input Capacitance  
4350  
VGS = 0V  
VDS = 25V  
f = 1MHz  
pF  
Output Capacitance  
715  
120  
Reverse Transfer Capacitance  
Qg  
Qgs  
Qgd  
Total gate Charge  
154  
26  
97  
VGS = 10V  
VBus = 500V  
ID = 18A  
nC  
Gate – Source Charge  
Gate – Drain Charge  
Td(on) Turn-on Delay Time  
Tr Rise Time  
Td(off) Turn-off Delay Time  
10  
12  
121  
35  
Inductive switching @ 125°C  
VGS = 15V  
VBus = 667V  
ns  
ID = 18A  
RG = 5Ω  
Tf  
Fall Time  
Inductive switching @ 25°C  
VGS = 15V, VBus = 667V  
ID = 18A, RG = 5  
Eon  
Turn-on Switching Energy  
383  
380  
627  
451  
µJ  
µJ  
Eoff  
Eon  
Eoff  
Turn-off Switching Energy X  
Turn-on Switching Energy  
Turn-off Switching Energy X  
Inductive switching @ 125°C  
VGS = 15V, VBus = 667V  
ID = 18A, RG = 5Ω  
X In accordance with JEDEC standard JESD24-1.  
Parallel SiC diode ratings and characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
VRRM  
Maximum Peak Repetitive Reverse Voltage  
1200  
V
Tj = 25°C  
Tj = 150°C  
100  
400  
IRRM  
Maximum Reverse Leakage Current  
VR=1200V  
µA  
200 2000  
IF(AV)  
VF  
Maximum Average Forward Current  
Diode Forward Voltage  
50% duty cycle Tc = 125°C  
10  
1.6  
2.6  
A
V
Tj = 25°C  
1.8  
3.0  
IF = 10A  
Tj = 175°C  
IF = 10A, VR = 600V  
di/dt =800A/µs  
QC  
Q
Total Capacitive Charge  
Total Capacitance  
28  
nC  
pF  
f = 1MHz, VR = 200V  
f = 1MHz, VR = 400V  
90  
66  
APT website – http://www.advancedpower.com  
2 – 7  
APTM100H45SCT  
Series diode ratings and characteristics  
Symbol Characteristic  
Test Conditions  
50% duty cycle  
IF = 30A  
Min Typ Max Unit  
IF(AV)  
Maximum Average Forward Current  
Tc = 85°C  
30  
1.1  
1.4  
0.9  
A
1.15  
VF  
Diode Forward Voltage  
IF = 60A  
IF = 30A  
V
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
IF = 30A  
24  
48  
trr  
Reverse Recovery Time  
Reverse Recovery Charge  
ns  
VR = 133V  
di/dt = 200A/µs  
IF = 30A  
33  
Qrr  
nC  
VR = 133V  
di/dt = 200A/µs  
150  
Thermal and package characteristics  
Symbol Characteristic  
Min Typ Max Unit  
Transistor  
0.35  
RthJC  
Junction to Case  
°C/W  
V
Series diode  
1.2  
1.5  
Parallel diode  
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz  
Operating junction temperature range  
Storage Temperature Range  
VISOL  
TJ  
2500  
-40  
150  
125  
100  
4.7  
°C  
TSTG  
-40  
-40  
TC  
Operating Case Temperature  
Torque Mounting torque  
To Heatsink  
M5  
N.m  
g
Wt  
Package Weight  
160  
Temperature sensor NTC  
Symbol Characteristic  
Min Typ Max Unit  
R25  
Resistance @ 25°C  
68  
kΩ  
B25/85 T25 = 298.16 K  
4080  
K
R25  
RT  
=
T: Thermistor temperature  
RT: Thermistor value at T  
1
1
T
25 /85   
exp B  
T25  
Package outline  
APT website – http://www.advancedpower.com  
3 – 7  
APTM100H45SCT  
Typical MOSFET Performance Curve  
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration  
0.4  
0.35  
0.3  
0.9  
0.7  
0.25  
0.2  
0.5  
0.3  
0.15  
0.1  
0.1  
0.05  
0.05  
0
0.00001  
Single Pulse  
0.01  
0.0001  
0.001  
0.1  
1
10  
rectangular Pulse Duration (Seconds)  
Low Voltage Output Characteristics  
Transfert Characteristics  
60  
50  
40  
30  
20  
10  
0
80  
70  
60  
50  
40  
30  
20  
10  
0
VDS > ID(on)xRDS(on)MAX  
250µs pulse test @ < 0.5 duty cycle  
7V  
6.5V  
VGS=15&8V  
6V  
TJ=25°C  
5.5V  
5V  
TJ=125°C  
TJ=-55°C  
0
5
10  
15  
20  
25  
30  
0
1
2
3
4
5
6
7
8
9 10  
V
DS, Drain to Source Voltage (V)  
VGS, Gate to Source Voltage (V)  
DC Drain Current vs Case Temperature  
RDS(on) vs Drain Current  
1.4  
1.3  
1.2  
1.1  
1
20  
18  
16  
14  
12  
10  
8
Normalized to  
GS=10V @ 9A  
V
VGS=10V  
VGS=20V  
6
4
2
0
0.9  
0.8  
0
10  
20  
30  
40  
50  
25  
50  
75  
100  
125  
150  
ID, Drain Current (A)  
TC, Case Temperature (°C)  
APT website – http://www.advancedpower.com  
4 – 7  
APTM100H45SCT  
Breakdown Voltage vs Temperature  
ON resistance vs Temperature  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
1.15  
1.10  
1.05  
1.00  
0.95  
0.90  
0.85  
VGS=10V  
ID=9A  
-50 -25  
0
25 50 75 100 125 150  
-50 -25  
0
25 50 75 100 125 150  
TJ, Junction Temperature (°C)  
TJ, Junction Temperature (°C)  
Threshold Voltage vs Temperature  
Maximum Safe Operating Area  
100  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
100µs  
limited by  
RDSon  
1ms  
10  
1
Single pulse  
TJ=150°C  
10ms  
-50 -25  
0
25 50 75 100 125 150  
1
10  
100  
1000  
VDS, Drain to Source Voltage (V)  
TC, Case Temperature (°C)  
Capacitance vs Drain to Source Voltage  
100000  
Gate Charge vs Gate to Source Voltage  
14  
12  
10  
8
ID=18A  
TJ=25°C  
VDS=200V  
VDS=500V  
10000  
1000  
100  
Ciss  
VDS=800V  
Coss  
Crss  
6
4
2
0
10  
0
40  
80  
120  
160  
200  
0
10  
20  
30  
40  
50  
VDS, Drain to Source Voltage (V)  
Gate Charge (nC)  
APT website – http://www.advancedpower.com  
5 – 7  
APTM100H45SCT  
Delay Times vs Current  
Rise and Fall times vs Current  
60  
50  
40  
30  
20  
10  
0
160  
140  
120  
100  
80  
VDS=667V  
RG=5  
TJ=125°C  
td(off)  
L=100µH  
tf  
VDS=667V  
RG=5Ω  
TJ=125°C  
L=100µH  
60  
tr  
40  
td(on)  
20  
0
5
10 15 20 25 30 35 40  
5
10 15  
20 25  
30  
35  
40  
ID, Drain Current (A)  
ID, Drain Current (A)  
Switching Energy vs Gate Resistance  
Switching Energy vs Current  
2.5  
2
1.5  
1
VDS=667V  
ID=18A  
VDS=667V  
Eoff  
RG=5Ω  
TJ=125°C  
L=100µH  
Eon  
Eoff  
TJ=125°C  
L=100µH  
1.5  
1
0.5  
0
Eon  
0.5  
0
5
10 15 20 25 30 35 40  
0
5
10  
15  
20  
25  
30  
ID, Drain Current (A)  
Gate Resistance (Ohms)  
Operating Frequency vs Drain Current  
Source to Drain Diode Forward Voltage  
1000  
100  
10  
300  
250  
200  
150  
100  
50  
VDS=667V  
D=50%  
RG=5Ω  
TJ=125°C  
TJ=150°C  
TJ=25°C  
1
0
0.2 0.4 0.6 0.8  
1
1.2 1.4 1.6 1.8  
6
8
10  
12  
14  
16  
18  
ID, Drain Current (A)  
VSD, Source to Drain Voltage (V)  
APT website – http://www.advancedpower.com  
6 – 7  
APTM100H45SCT  
Typical SiC Diode Performance Curve  
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration  
1.6  
1.4  
1.2  
1
0.9  
0.7  
0.5  
0.3  
0.8  
0.6  
0.4  
0.2  
0
0.1  
0.05  
Single Pulse  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
Rectangular Pulse Duration (Seconds)  
Reverse Characteristics  
Forward Characteristics  
20  
15  
10  
5
400  
300  
TJ=25°C  
TJ=75°C  
200  
TJ=75°C  
TJ=125°C  
TJ=125°C  
TJ=175°C  
TJ=175°C  
100  
0
TJ=25°C  
0
0
0.5  
1
1.5  
2
2.5  
3
3.5  
400 600 800 1000 1200 1400 1600  
VR Reverse Voltage (V)  
VF Forward Voltage (V)  
Capacitance vs.Reverse Voltage  
800  
700  
600  
500  
400  
300  
200  
100  
0
1
10  
100  
1000  
VR Reverse Voltage  
APT reserves the right to change, without notice, the specifications and information contained herein  
APT's products arecovered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522  
5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. U.S and Foreign patents pending. All Rights Reserved.  
APT website – http://www.advancedpower.com  
7 – 7  

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