ADCMP580BCP-RL7 [ADI]

Ultrafast SiGe Voltage Comparators; 超快的SiGe电压比较器
ADCMP580BCP-RL7
型号: ADCMP580BCP-RL7
厂家: ADI    ADI
描述:

Ultrafast SiGe Voltage Comparators
超快的SiGe电压比较器

比较器
文件: 总16页 (文件大小:416K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Ultrafast SiGe  
Voltage Comparators  
ADCMP580/ADCMP581/ADCMP582  
FEATURES  
FUNCTIONAL BLOCK DIAGRAM  
180 ps propagation delay  
25 ps overdrive and slew rate dispersion  
8 GHz equivalent input rise time bandwidth  
100 ps minimum pulse width  
37 ps typical output rise/fall  
10 ps deterministic jitter (DJ)  
200 fs random jitter (RJ)  
V
TERMINATION  
TP  
V
NONINVERTING  
INPUT  
P
Q OUTPUT  
Q OUTPUT  
ADCMP580/  
ADCMP581/  
ADCMP582  
CML/ECL/  
PECL  
V
INVERTING  
INPUT  
N
2 V to +3 V input range with +5 V/5 V supplies  
On-chip terminations at both input pins  
Resistor-programmable hysteresis  
Differential latch control  
V
TERMINATION  
HYS  
TN  
LE INPUT  
LE INPUT  
Power supply rejection > 70 dB  
Figure 1.  
APPLICATIONS  
Automatic test equipment (ATE)  
High speed instrumentation  
Pulse spectroscopy  
Medical imaging and diagnostics  
High speed line receivers  
Threshold detection  
Peak and zero-crossing detectors  
High speed trigger circuitry  
Clock and data signal restoration  
GENERAL DESCRIPTION  
The CML output stage is designed to directly drive 400 mꢀ  
into 50 Ω transmission lines terminated to ground. The NECL  
output stages are designed to directly drive 400 mꢀ into 50 Ω  
terminated to 2 . The PECL output stages are designed to  
directly drive 400 mꢀ into 50 Ω terminated to ꢀCCO 2 .  
High speed latch and programmable hysteresis are also  
provided. The differential latch input controls are also 50 Ω  
terminated to an independent ꢀTT pin to interface to either  
CML or ECL or to PECL logic.  
The ADCMP580/ADCMP581/ADCMP582 are ultrafast voltage  
comparators fabricated on Analog Devices’ proprietary XFCB3  
Silicon Germanium (SiGe) bipolar process. The ADCMP580  
features CML output drivers; the ADCMP581 features reduced  
swing ECL (negative ECL) output drivers; and the ADCMP582  
features reduced swing PECL (positive ECL) output drivers.  
All three comparators offer 180 ps propagation delay and  
100 ps minimum pulse width for 10 Gbps operation with  
200 fs random jitter (RJ). Overdrive and slew rate dispersion  
are typically less than 15 ps.  
The ADCMP580/ADCMP581/ADCMP582 are available in  
a 16-lead LFCSP package.  
The 5 ꢀ power supplies enable a wide 2 ꢀ to +3 ꢀ input  
range with logic levels referenced to the CML/NECL/PECL  
outputs. The inputs have 50 Ω on-chip termination resistors  
with the optional capability to be left open (on an individual  
pin basis) for applications requiring high impedance input.  
Rev. 0  
Information furnished by Analog Devices is believed to be accurate and reliable. However, no  
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other  
rights of third parties that may result from its use. Specifications subject to change without notice. No  
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.  
Trademarks and registeredtrademarks arethe property of their respective owners.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781.329.4700  
Fax: 781.461.3113  
www.analog.com  
© 2005 Analog Devices, Inc. All rights reserved.  
ADCMP580/ADCMP581/ADCMP582  
TABLE OF CONTENTS  
Specifications..................................................................................... 3  
Power/Ground Layout and Bypassing..................................... 11  
ADCMP58x Family of Output Stages ..................................... 11  
Using/Disabling the Latch Feature........................................... 11  
Optimizing High Speed Performance ..................................... 12  
Comparator Propagation Delay Dispersion ........................... 12  
Comparator Hysteresis .............................................................. 13  
Minimum Input Slew Rate Requirement................................ 13  
Outline Dimensions....................................................................... 14  
Ordering Guide .......................................................................... 14  
Timing Information ......................................................................... 5  
Absolute Maximum Ratings............................................................ 6  
Thermal Considerations.............................................................. 6  
ESD Caution.................................................................................. 6  
Pin Configurations and Function Descriptions ........................... 7  
Typical Performance Characteristics ............................................. 8  
Typical Application Circuits.......................................................... 10  
Application Information................................................................ 11  
REVISION HISTORY  
7/05—Revision 0: Initial Version  
Rev. 0 | Page 2 of 16  
ADCMP580/ADCMP581/ADCMP582  
SPECIFICATIONS  
CCI = +5.0 ꢀ; ꢀEE = −5.0 ꢀ; ꢀCCO = +3.3 ꢀ; TA = 25°C, unless otherwise noted.  
Table 1.  
Parameter  
Symbol  
Condition  
Min  
Typ  
Max  
Unit  
DC INPUT CHARACTERISTICS  
Input Voltage Range  
Input Differential Range  
Input Offset Voltage  
Offset Voltage Tempco  
Input Bias Current  
Input Bias Current Tempco  
Input Offset Current  
VP, VN  
−2.0  
−2.0  
−10.0  
+3.0  
+2.0  
+10.0  
V
V
VOS  
ΔVOS/dT  
IP, IN  
±±  
10  
15  
50  
2
±7 to 53  
50  
500  
±8  
mV  
μV/°C  
μA  
nA/°C  
μA  
Ω
kΩ  
kΩ  
dB  
Open termination  
30.0  
±5.0  
ΔIB/dT  
Input Resistance  
Input Resistance, Differential Mode  
Input Resistance, Common Mode  
Active Gain  
Open termination  
Open termination  
AV  
CMRR  
Common-Mode Rejection  
Hysteresis  
VCM = −2.0 V to +3.0 V  
RHYS = ∞  
60  
1
dB  
mV  
LATCH ENABLE CHARACTERISTICS  
Latch Enable Input Impedance  
Latch to Output Delay  
Latch Minimum Pulse Width  
ADCMP580 (CML)  
ZIN  
tPLOH, tPLOL  
tPL  
Each pin, VTT at ac ground  
VOD = 200 mV  
VOD = 200 mV  
±7 to 53  
175  
100  
Ω
ps  
ps  
Latch Enable Input Range  
Latch Enable Input Differential  
Latch Setup Time  
−0.8  
0.2  
0
0.5  
V
V
ps  
ps  
0.±  
95  
−90  
tS  
tH  
VOD = 200 mV  
VOD = 200 mV  
Latch Hold Time  
ADCMP581 (NECL)  
Latch Enable Input Range  
Latch Enable Input Differential  
Latch Setup Time  
−1.8  
0.2  
+0.8  
0.5  
V
V
ps  
ps  
0.±  
70  
−65  
tS  
tH  
VOD = 200 mV  
VOD = 200 mV  
Latch Hold Time  
ADCMP582 (PECL)  
Latch Enable Input Range  
Latch Enable Input Differential  
Latch Setup Time  
VCCO − 1.8  
0.2  
VCCO − 0.8  
0.5  
V
V
ps  
ps  
0.±  
30  
−25  
tS  
tH  
VOD = 200 mV  
VOD = 200 mV  
Latch Hold Time  
DC OUTPUT CHARACTERISTICS  
ADCMP580 (CML)  
Output Impedance  
ZOUT  
VOH  
50  
0
−0.±0  
395  
Ω
V
V
mV  
Output Voltage High Level  
Output Voltage Low Level  
Output Voltage Differential  
ADCMP581 (NECL)  
50 Ω to GND  
50 Ω to GND  
50 Ω to GND  
−0.10  
−0.50  
3±0  
0.03  
−0.35  
±50  
VOL  
Output Voltage High Level  
Output Voltage High Level  
Output Voltage High Level  
Output Voltage Low Level  
Output Voltage Low Level  
Output Voltage Low Level  
Output Voltage Differential  
VOH  
VOH  
VOH  
VOL  
VOL  
VOL  
50 Ω to −2 V, TA = 125°C  
50 Ω to −2 V, TA = 25°C  
50 Ω to −2 V, TA = −55°C  
50 Ω to −2 V, TA = 125°C  
50 Ω to −2 V, TA = 25°C  
50 Ω to −2 V, TA = −55°C  
50 Ω to −2.0 V  
−0.99  
−1.06  
−1.11  
−1.±3  
−1.50  
−1.55  
3±0  
−0.87  
−0.9±  
−0.99  
−1.26  
−1.33  
−1.38  
395  
−0.75  
−0.82  
−0.87  
−1.13  
−1.20  
−1.25  
±50  
V
V
V
V
V
V
mV  
Rev. 0 | Page 3 of 16  
 
ADCMP580/ADCMP581/ADCMP582  
Parameter  
Symbol  
Condition  
Min  
Typ  
Max  
Unit  
ADCMP582 (PECL)  
Vcco = 3.3 V  
Output Voltage High Level  
Output Voltage High Level  
Output Voltage High Level  
Output Voltage Low Level  
Output Voltage Low Level  
Output Voltage Low Level  
Output Voltage Differential  
AC PERFORMANCE  
VOH  
VOH  
VOH  
VOL  
VOL  
VOL  
50 Ω to VCCO − 2 V, TA = 125°C  
50 Ω to VCCO − 2 V, TA = 25°C  
50 Ω to VCCO − 2 V, TA = −55°C  
50 Ω to VCCO − 2 V, TA = 125°C  
50 Ω to VCCO − 2 V, TA = 25°C  
50 Ω to VCCO − 2 V, TA = −55°C  
50 Ω to VCCO − 2.0 V  
VCCO − 0.99 VCCO − 0.87 VCCO − 0.75  
VCCO − 1.06 VCCO − 0.9± VCCO − 0.82  
VCCO − 1.11 VCCO − 0.99 VCCO − 0.87  
VCCO − 1.±3 VCCO − 1.26 VCCO − 1.13  
VCCO − 1.50 VCCO − 1.33 VCCO − 1.20  
VCCO − 1.55 VCCO − 1.35 VCCO − 1.25  
V
V
V
V
V
V
mV  
3±0  
395  
±50  
Propagation Delay  
Propagation Delay Tempco  
Prop Delay Skew—Rising Transition  
to Falling Transition  
tPD  
ΔtPD/dT  
VOD = 500 mV  
180  
0.25  
10  
ps  
ps/°C  
ps  
VOD = 500 mV, 5 V/ns  
Overdrive Dispersion  
50 mV < VOD < 1.0 V  
10 mV < VOD < 200m V  
2 V/ns to 10 V/ns  
100 ps to 5 ns  
1.0 V/ns, 15 MHz, VCM = 0.0 V  
VOD = 0.2 V, −2 V < VCM < 3 V  
10  
15  
15  
15  
10  
5
ps  
ps  
ps  
ps  
ps  
ps/V  
GHz  
Slew Rate Dispersion  
Pulse Width Dispersion  
Duty Cycle Dispersion 5% to 95%  
Common-Mode Dispersion  
Equivalent Input Bandwidth1  
BWEQ  
0.0 V to ±00 mV input  
tR = tF = 25 ps, 20/80  
8
Toggle Rate  
Deterministic Jitter  
>50% output swing  
12.5  
15  
Gbps  
ps  
DJ  
DJ  
VOD = 500 mV, 5 V/ns  
PRBS31 − 1 NRZ, 5 Gbps  
Deterministic Jitter  
VOD = 200 mV, 5 V/ns  
25  
ps  
PRBS31 − 1 NRZ, 10 Gbps  
RJ  
RMS Random Jitter  
Minimum Pulse Width  
Minimum Pulse Width  
Rise/Fall Time  
VOD = 200 mV, 5 V/ns, 1.25 GHz  
ΔtPD < 5 ps  
ΔtPD < 10 ps  
0.2  
100  
80  
ps  
ps  
ps  
ps  
PWMIN  
PWMIN  
tR, tF  
20/80  
37  
POWER SUPPLY  
Positive Supply Voltage  
Negative Supply Voltage  
ADCMP580 (CML)  
VCCI  
VEE  
+±.5  
−5.5  
+5.0  
−5.0  
+5.5  
−±.5  
V
V
Positive Supply Current  
Negative Supply Current  
Power Dissipation  
IVCCI  
IVEE  
PD  
VCCI = +5.0 V, 50 Ω to GND  
VEE = −5.0 V, 50 Ω to GND  
50 Ω to GND  
6
−±0  
230  
8
−3±  
260  
mA  
mA  
mW  
−50  
ADCMP581 (NECL)  
Positive Supply Current  
Negative Supply Current  
Power Dissipation  
IVCCI  
IVEE  
PD  
VCCI = +5.0 V, 50 Ω to −2 V  
VEE = −5.0 V, 50 Ω to −2 V  
50 Ω to −2 V  
6
−25  
155  
8
−19  
200  
mA  
mA  
mW  
−35  
+2.5  
−35  
ADCMP582 (PECL)  
+3.3  
6
±±  
−25  
310  
−75  
−60  
−75  
Logic Supply Voltage  
Input Supply Current  
Output Supply Current  
Negative Supply Current  
Power Dissipation  
Power Supply Rejection (VCCI  
Power Supply Rejection (VEE)  
Power Supply Rejection (VCCO  
VCCO  
IVCCI  
IVCCO  
IVEE  
+5.0  
8
55  
−19  
350  
V
VCCI = +5.0 V, 50 Ω to VCCO − 2 V  
VCCO = +5.0 V, 50 Ω to VCCO − 2 V  
VEE = −5.0 V, 50 Ω to VCCO − 2 V  
50 Ω to VCCO − 2 V  
VCCI = 5.0 V + 5%  
VEE = −5.0 V + 5%  
mA  
mA  
mA  
mW  
dB  
PD  
)
PSRVCCI  
PSRVEE  
PSRVCCO  
dB  
dB  
)
VCCO = 3.3 V + 5% (ADCMP582)  
1 Equivalent input bandwidth assumes a simple first-order input response and is calculated with the following formula: BWEQ = 0.22/(trCOMP2 trIN2), where trIN is the 20/80  
transition time of a quasi-Gaussian input edge applied to the comparator input and trCOMP is the effective transition time digitized by the comparator.  
Rev. 0 | Page ± of 16  
ADCMP580/ADCMP581/ADCMP582  
TIMING INFORMATION  
Figure 2 shows the ADCMP580/ADCMP581/ADCMP582 compare and latch timing relationships. Table 2 provides the definitions of the  
terms shown in the figure.  
LATCH ENABLE  
50%  
LATCH ENABLE  
tS  
tPL  
tH  
V
N
DIFFERENTIAL  
INPUT VOLTAGE  
V
± V  
OS  
N
V
OD  
tPDL  
tPLOH  
Q OUTPUT  
50%  
50%  
tF  
tPDH  
Q OUTPUT  
tPLOL  
tR  
Figure 2. Comparator Timing Diagram  
Table 2. Timing Descriptions  
Symbol  
Timing  
Description  
tPDH  
Input to Output High Delay  
Propagation delay measured from the time the input signal crosses the reference  
(± the input offset voltage) to the 50% point of an output low-to-high transition.  
tPDL  
tPLOH  
tPLOL  
tH  
Input to Output Low Delay  
Propagation delay measured from the time the input signal crosses the reference  
(± the input offset voltage) to the 50% point of an output high-to-low transition.  
Propagation delay measured from the 50% point of the latch enable signal  
low-to-high transition to the 50% point of an output low-to-high transition.  
Propagation delay measured from the 50% point of the latch enable signal  
low-to-high transition to the 50% point of an output high-to-low transition.  
Minimum time after the negative transition of the latch enable signal that the  
input signal must remain unchanged to be acquired and held at the outputs.  
Latch Enable to Output High Delay  
Latch Enable to Output Low Delay  
Minimum Hold Time  
tPL  
tS  
Minimum Latch Enable Pulse Width  
Minimum Setup Time  
Minimum time that the latch enable signal must be high to acquire an input  
signal change.  
Minimum time before the negative transition of the latch enable signal that an  
input signal change must be present to be acquired and held at the outputs.  
tR  
Output Rise Time  
Amount of time required to transition from a low to a high output as measured  
at the 20% and 80% points.  
tF  
Output Fall Time  
Amount of time required to transition from a high to a low output as measured  
at the 20% and 80% points.  
VN  
VOD  
Normal Input Voltage  
Voltage Overdrive  
Difference between the input voltages VP and VN for output true.  
Difference between the input voltages VP and VN for output false.  
Rev. 0 | Page 5 of 16  
 
 
 
ADCMP580/ADCMP581/ADCMP582  
ABSOLUTE MAXIMUM RATINGS  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only and functional operation of the device at these or  
any other conditions above those indicated in the operational  
sections of this specification is not implied. Exposure to  
absolute maximum rating conditions for extended periods may  
affect device reliability.  
Table 3.  
Parameter  
Rating  
SUPPLY VOLTAGES  
Positive Supply Voltage  
(VCCI to GND)  
Negative Supply Voltage  
(VEE to GND)  
−0.5 V to +6.0 V  
–6.0 V to +0.5 V  
Logic Supply Voltage  
(VCCO to GND)  
−0.5 V to +6.0 V  
INPUT VOLTAGES  
Input Voltage  
THERMAL CONSIDERATIONS  
−3.0 V to +±.0 V  
−2 V to +2 V  
−2.5 V to +5.5 V  
The ADCMP580/ADCMP581/ADCMP582 LFCSP 16-lead  
package option has a θJA (junction-to-ambient thermal  
resistance) of 70°C/W in still air.  
Differential Input Voltage  
Input Voltage, Latch Enable  
HYSTERESIS CONTROL PIN  
Applied Voltage (HYS to VEE)  
Maximum Input/Output Current  
OUTPUT CURRENT  
−5.5 V to +0.5 V  
1 mA  
ADCMP580 (CML)  
ADCMP581 (NECL)  
ADCMP582 (PECL)  
−25 mA  
−±0 mA  
−±0 mA  
TEMPERATURE  
Operating Temperature, Ambient  
Operating Temperature, Junction  
Storage Temperature Range  
−±0°C to +125°C  
125°C  
−65°C to +150°C  
ESD CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as ±000 V readily accumulate on  
the human body and test equipment and can discharge without detection. Although this product features  
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy  
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance  
degradation or loss of functionality.  
Rev. 0 | Page 6 of 16  
 
ADCMP580/ADCMP581/ADCMP582  
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS  
PIN 1  
PIN 1  
PIN 1  
INDICATOR  
INDICATOR  
INDICATOR  
12 GND  
11 Q  
12 GND  
11 Q  
12 V  
CCO  
V
1
2
3
4
V
1
2
3
4
V
TP  
1
2
3
4
TP  
TP  
11 Q  
10 Q  
V
V
V
P
P
P
ADCMP580  
TOP VIEW  
(Not to Scale)  
ADCMP581  
TOP VIEW  
(Not to Scale)  
ADCMP582  
TOP VIEW  
(Not to Scale)  
V
10 Q  
V
10 Q  
V
N
N
N
V
9
GND  
V
9
GND  
V
9 V  
CCO  
TN  
TN  
TN  
Figure 3. ADCMP580 Pin Configuration  
Figure 4. ADCMP581 Pin Configuration  
Figure 5. ADCMP582 Pin Configuration  
Table 4. Pin Function Descriptions  
Pin No.  
Mnemonic  
Description  
1
2
VTP  
VP  
Termination Resistor Return Pin for VP Input.  
Noninverting Analog Input.  
3
VN  
Inverting Analog Input.  
±
5, 16  
6
VTN  
VCCI  
LE  
Termination Resistor Return Pin for VN Input.  
Positive Supply Voltage.  
Latch Enable Input Pin, Inverting Side. In compare mode (LE = low), the output tracks changes at the input  
of the comparator. In latch mode (LE = high), the output reflects the input state just prior to the comparator  
being placed into latch mode. LE must be driven in complement with LE.  
7
8
LE  
Latch Enable Input Pin, Noninverting Side. In compare mode (LE = high), the output tracks changes  
at the input of the comparator. In latch mode (LE = low), the output reflects the input state just prior  
to the comparator being placed into latch mode. LE must be driven in complement with LE.  
VTT  
Termination Return Pin for the LE/LE Input Pins.  
For the ADCMP580 (CML output stage), this pin should be connected to the GND ground.  
For the ADCMP581 (ECL output stage), this pin should be connected to the –2 V termination potential.  
For the ADCMP582 (PECL output stage), this pin should be connected to the VCCO – 2 V termination potential.  
Digital Ground Pin/Positive Logic Power Supply Terminal.  
9, 12  
GND/VCCO  
For the ADCMP580/ADCMP581, this pin should be connected to the GND pin.  
For the ADCMP582, this pin should be connected to the positive logic power VCCO supply.  
Inverting Output. Q is logic low if the analog voltage at the noninverting input, VP, is greater than the analog  
voltage at the inverting input, VN, provided that the comparator is in compare mode. See the LE/LE descriptions  
(Pin 6 to Pin 7) for more information.  
Noninverting Output. Q is logic high if the analog voltage at the noninverting input, VP, is greater than  
the analog voltage at the inverting input, VN, provided that the comparator is in compare mode. See the  
LE/LE descriptions (Pin 6 to Pin 7) for more information.  
10  
11  
Q
Q
13  
1±  
VEE  
HYS  
Negative Power Supply.  
Hysteresis Control. Leave this pin disconnected for zero hysteresis. Connect this pin to the VEE supply  
with a suitably sized resistor to add the desired amount of hysteresis. Refer to Figure 9 for proper sizing  
of the HYS hysteresis control resistor.  
15  
GND  
Analog Ground.  
Heat Sink N/C  
Paddle  
The metallic back surface of the package is not electrically connected to any part of the circuit. It can be left  
floating for optimal electrical isolation between the package handle and the substrate of the die. It can also  
be soldered to the application board if improved thermal and/or mechanical stability is desired.  
Rev. 0 | Page 7 of 16  
 
ADCMP580/ADCMP581/ADCMP582  
TYPICAL PERFORMANCE CHARACTERISTICS  
CCI = +5.0 , EE = 5.0 , CCO = +3.3 , TA = 25°C, unless otherwise noted.  
12  
80  
70  
60  
50  
40  
30  
20  
10  
0
10  
VIN COMMON-MODE BIAS SWEEP  
8
6
4
2
0
–4  
–2  
0
2
4
0
10  
100  
1k  
10k  
COMMON MODE (V)  
RESISTOR (Ω)  
Figure 6. Bias Current vs. Common-Mode Voltage  
Figure 9. Hysteresis vs. RHYS Control Resistor  
2.5  
2.4  
2.3  
2.2  
2.1  
2.0  
1.9  
–0.8  
VOH VS TEMP OUTPUT (NECL)  
–0.9  
–1.0  
–1.1  
–1.2  
–1.3  
–1.4  
–1.5  
VOH VS TEMP OUTPUT (PECL)  
VOL VS TEMP OUTPUT (NECL)  
VOL VS TEMP OUTPUT (PECL)  
–55  
–5  
45  
95  
145  
–55  
–5  
45  
95  
145  
TEMP (°C)  
TEMP (°C)  
Figure 10. ADCMP582 Output Voltage vs. Temperature  
Figure 7. ADCMP581 Output Voltage vs. Temperature  
8
80  
70  
60  
50  
40  
30  
20  
10  
0
125°C COMMON-MODE OFFSET SWEEP  
7
6
5
4
3
2
1
0
25°C COMMON-MODE OFFSET SWEEP  
–55°C COMMON-MODE OFFSET SWEEP  
–2  
0
2
4
0
100  
200  
300  
400  
500  
600  
COMMON-MODE (V)  
–IHYST (μA)  
Figure 11. A Typical VOS vs. Common- Mode Voltage  
Figure 8. Hysteresis vs. −IHYST  
Rev. 0 | Page 8 of 16  
 
 
ADCMP580/ADCMP581/ADCMP582  
5
4
45  
43  
41  
39  
37  
35  
33  
31  
29  
27  
25  
3
2
1
0
–1  
–2  
–3  
–4  
–5  
LOT2 CHAR1 RISE  
LOT2 CHAR1 FALL  
LOT3 CHAR1 RISE  
LOT3 CHAR1 FALL  
QBARRISE  
QRISE  
QBARFALL  
QFALL  
–2  
–1  
0
1
2
3
–55  
–35  
–15  
5
25  
45  
65  
C)  
85  
105  
125  
V
(V)  
TEMPERATURE (°  
CM  
Figure 12. ADCMP580 Prop Delay vs. Common-Mode Voltage  
Figure 15. ADCMP581 TR/TF vs. Temperature  
M1  
M1  
M1  
M1  
5
Figure 13. ADCMP580 Eye Diagram at 7.5 Gbps  
Figure 16. ADCMP582 Eye Diagram at 2.5 Gbps  
18  
16  
14  
12  
10  
8
6
OD DISPERSION FALL  
4
2
OD DISPERSION RISE  
0
0
50  
100  
150  
200  
250  
OVERDRIVE (mV)  
Figure 14. Dispersion vs. Overdrive  
Rev. 0 | Page 9 of 16  
ADCMP580/ADCMP581/ADCMP582  
TYPICAL APPLICATION CIRCUITS  
GND  
V
TP  
50Ω  
50Ω  
V
V
P
CML  
ADCMP580  
V
V
P
Q
Q
N
V
IN  
N ADCMP580  
V
TN  
50Ω  
50Ω  
1.5kΩ  
V
EE  
LATCH  
INPUTS  
Figure 17. Zero-Crossing Detector with CML Outputs  
Figure 21. Disabling the Latch Feature on the ADCMP580  
V
TP  
V
V
P
Q
Q
V
P
V
P
RSECL  
ADCMP581  
N ADCMP581  
V
V
N
N
V
TN  
50Ω  
50Ω  
50Ω  
50Ω  
450Ω  
V
V
TT  
TT  
V
LATCH  
INPUTS  
EE  
Figure 18. LVDS to a 50 Ω Back-Terminated (RS) ECL Receiver  
Figure 22. Disabling the Latch Feature on the ADCMP581  
V
V
P
ADCMP580  
RSPECL  
ADCMP582  
HYS  
N
50Ω  
50Ω  
50Ω  
50Ω  
0Ω TO 5kΩ  
1kΩ  
V
V
TT  
EE  
Figure 19. Adding Hysteresis Using the HYS Control  
Figure 23. Disabling the Latch Feature on the ADCMP582  
GND  
50Ω  
50Ω  
+
Q
Q
V
IN  
ADCMP580  
V
TH  
LATCH  
INPUTS  
Figure 20. Comparator with −2 to +3 V Input Range  
Rev. 0 | Page 10 of 16  
 
ADCMP580/ADCMP581/ADCMP582  
APPLICATION INFORMATION  
POWER/GROUND LAYOUT AND BYPASSING  
GND  
The ADCMP58x family of comparators is designed for very  
high speed applications. Consequently, high speed design  
techniques must be used to achieve the specified performance.  
It is critically important to use low impedance supply planes,  
particularly for the negative supply (ꢀEE), the output supply  
plane (ꢀCCO), and the ground plane (GND). Individual supply  
planes are recommended as part of a multilayer board. Provid-  
ing the lowest inductance return path for the switching currents  
ensures the best possible performance in the target application.  
50Ω  
50Ω  
Q
Q
16mA  
It is also important to adequately bypass the input and output  
supplies. A 1 μF electrolytic bypass capacitor should be placed  
within several inches of each power supply pin to ground. In  
addition, multiple high quality 0.1 μF bypass capacitors should  
be placed as close as possible to each of the ꢀEE, ꢀCCI, and ꢀCCO  
supply pins and should be connected to the GND plane with  
redundant vias. High frequency bypass capacitors should be  
carefully selected for minimum inductance and ESR. Parasitic  
layout inductance should be strictly avoided to maximize the  
effectiveness of the bypass at high frequencies.  
V
EE  
Figure 24. Simplified Schematic Diagram  
of the ADCMP580 CML Output Stage  
GND / Vcco  
ADCMP58x FAMILY OF OUTPUT STAGES  
Q
Q
Specified propagation delay dispersion performance is achieved  
by using proper transmission line terminations. The outputs of  
the ADCMP580 family comparators are designed to directly  
drive 400 mꢀ into 50 Ω cable or microstrip/stripline transmis-  
sion lines terminated with 50 Ω referenced to the proper return.  
The CML output stage is shown in the simplified schematic  
diagram in Figure 24. Each output is back-terminated with  
50 Ω for best transmission line matching. The outputs of the  
ADCMP581/ADCMP582 are illustrated in Figure 25; they  
should be terminated to −2 ꢀ for ECL outputs of ADCMP581  
and ꢀCCO − 2 ꢀ for PECL outputs of ADCMP582. As an alter-  
native, Thevenin equivalent termination networks may also be  
used. If these high speed signals must be routed more than a  
centimeter, then either microstrip or stripline techniques are  
required to ensure proper transition times and to prevent  
excessive output ringing and pulse width-dependent  
V
EE  
Figure 25. Simplified Schematic Diagram of the  
ADCMP581/ADCMP582 ECL/PECL Output Stage  
USING/DISABLING THE LATCH FEATURE  
The latch inputs (LE/ ) are active low for latch mode and are  
LE  
internally terminated with 50 Ω resistors to the ꢀTT pin. When  
using the ADCMP580, ꢀTT should be connected to ground.  
When using the ADCMP581, ꢀTT should be connected to  
−2 . When using the ADCMP582, ꢀTT should be connected  
externally to ꢀCCO − 2 , preferably with its own low inductance  
plane.  
propagation delay dispersion.  
When using the ADCMP580/ADCMP582, the latch function  
can be disabled by connecting the  
pin to ꢀEE with an  
LE  
external pull-down resistor and leaving the LE pin discon-  
nected. To prevent excessive power dissipation, the resistor  
should be 1.5 kΩ for the ADCMP580 and 1 kΩ for the  
ADCMP582. When using the ADCMP581 comparators, the  
latch can be disabled by connecting the LE pin to GND with  
an external 450 Ω resistor and leaving the  
pin disconnected.  
LE  
The idea is to create an approximate 0.5 ꢀ offset using the  
internal resistor as half of the voltage divider. The ꢀTT pin  
should be connected as recommended.  
Rev. 0 | Page 11 of 16  
 
 
 
ADCMP580/ADCMP581/ADCMP582  
OPTIMIZING HIGH SPEED PERFORMANCE  
COMPARATOR PROPAGATION  
DELAY DISPERSION  
As with any high speed comparator, proper design and layout  
techniques are essential to obtaining the specified performance.  
Stray capacitance, inductance, inductive power, and ground  
impedances or other layout issues can severely limit performance  
and can cause oscillation. Discontinuities along input and output  
transmission lines can also severely limit the specified pulse  
width dispersion performance.  
The ADCMP58x family of comparators has been specifically  
designed to reduce propagation delay dispersion over a wide  
input overdrive range of 5 mꢀ to 500 m. Propagation delay  
dispersion is a change in propagation delays, which results  
from a change in the degree of overdrive or slew rate (how far  
or fast the input signal exceeds the switching threshold). The  
overall result is a higher degree of timing accuracy.  
For applications in a 50 Ω environment, input and output  
matching have a significant impact on data-dependent (or  
deterministic) jitter (DJ) and pulse width dispersion  
performance. The ADCMP58x family of comparators provides  
internal 50 Ω termination resistors for both ꢀP and ꢀN inputs.  
The return side for each termination is pinned out separately  
with the ꢀTP and ꢀTN pins, respectively. If a 50 Ω termination  
is desired at one or both of the ꢀP/ꢀN inputs, the ꢀTP and ꢀTN  
pins can be connected (or disconnected) to (from) the desired  
termination potential as appropriate. The termination potential  
should be carefully bypassed using ceramic capacitors as dis-  
cussed previously to prevent undesired aberrations on the input  
signal due to parasitic inductance in the termination return  
path. If a 50 Ω termination is not desired, either one or both  
of the ꢀTP/ꢀTN termination pins can be left disconnected. In this  
case, the open pins should be left floating with no external pull  
downs or bypassing capacitors.  
Propagation delay dispersion is a specification that becomes  
important in critical timing applications, such as data commu-  
nication, automatic test and measurement, instrumentation,  
and event-driven applications, such as pulse spectroscopy,  
nuclear instrumentation, and medical imaging. Dispersion  
is defined as the variation in the overall propagation delay as  
the input overdrive conditions are changed (see Figure 26 and  
Figure 27). For the ADCMP58x family of comparators, disper-  
sion is typically <25 ps, as the overdrive varies from 5 mꢀ to  
500 m, and the input slew rate varies from 1 ꢀ/ns to 10 ꢀ/ns.  
This specification applies for both positive and negative signals,  
because the ADCMP58x family of comparators has almost  
equal delays for positive- and negative-going inputs.  
500mV OVERDRIVE  
INPUT VOLTAGE  
For applications that require high speed operation but do not  
have on-chip 50 Ω termination resistors, some reflections  
should be expected, because the comparator inputs can no  
longer provide matched impedance to the input trace leading  
up to the device. It then becomes important to back-match the  
drive source impedance to the input transmission path leading  
to the input to minimize multiple reflections. For applications  
in which the comparator is less than 1 cm from the driving  
signal source, the source impedance should be minimized. High  
source impedance in combination with parasitic input capaci-  
tance of the comparator could cause undesirable degradation  
in bandwidth at the input, thus degrading the overall response.  
It is therefore recommended that the drive source impedance  
should be no more than 50 Ω for best high speed performance.  
5mV OVERDRIVE  
± V  
V
N
OS  
DISPERSION  
Q/Q OUTPUT  
Figure 26. Propagation Delay—Overdrive Dispersion  
INPUT VOLTAGE  
1V/ns  
V
± V  
OS  
N
10V/ns  
DISPERSION  
Q/Q OUTPUT  
Figure 27. Propagation Delay—Slew Rate Dispersion  
Rev. 0 | Page 12 of 16  
 
 
 
ADCMP580/ADCMP581/ADCMP582  
The hysteresis pin may also be driven by a current source.  
It is biased approximately 400 mꢀ above ꢀEE and has an  
internal series resistance of approximately 600 Ω.  
COMPARATOR HYSTERESIS  
Adding hysteresis to a comparator is often desirable in a noisy  
environment or when the differential inputs are very small or  
slow moving. The transfer function for a comparator with  
hysteresis is shown in Figure 28. If the input voltage approaches  
the threshold from the negative direction, the comparator  
switches from a low to a high when the input crosses +ꢀH/2.  
The new switching threshold becomes −ꢀH/2. The comparator  
remains in the high state until the threshold −ꢀH/2 is crossed  
from the positive direction. In this manner, noise centered on  
0 ꢀ input does not cause the comparator to switch states unless  
it exceeds the region bounded by H/2.  
80  
70  
60  
50  
40  
30  
20  
10  
0
The customary technique for introducing hysteresis into a  
comparator uses positive feedback from the output back to  
the input. A limitation of this approach is that the amount  
of hysteresis varies with the output logic levels, resulting in  
hysteresis that is not symmetric about the threshold. The  
external feedback network can also introduce significant  
parasitics that reduce high speed performance and can even  
reduce overall stability in some cases.  
0
10  
100  
1k  
10k  
RESISTOR (Ω)  
Figure 29. Comparator Hysteresis vs. RHYS Control Resistor  
MINIMUM INPUT SLEW RATE REQUIREMENT  
–V  
2
+V  
2
H
H
As with many high speed comparators, a minimum slew rate  
requirement must be met to ensure that the device does not  
oscillate as the input signal crosses the threshold. This oscil-  
lation is due in part to the high input bandwidth of the comparator  
and the feedback parasitics inherent in the package. A  
minimum slew rate of 50 ꢀ/μs should ensure clean output  
transitions from the ADCMP58x family of comparators.  
0V  
INPUT  
1
The slew rate may be too slow for other reasons. The extremely  
high bandwidth of these devices means that broadband noise  
can be a significant factor when input slew rates are low. There  
is 120 ꢁꢀ of thermal noise generated over the comparators  
bandwidth by the two 50 ꢂ terminations at room temperature.  
With a slew rate of only 50 ꢀ/ꢁs, the inputs will be inside this  
noise band for over 2 ps, rendering the comparators jitter  
performance of 200 fs irrelevant. Raising the slew rate of the  
input signal and/or reducing the bandwidth over which that  
resistance is seen at the input can greatly reduce jitter. We do  
not characterize the devices this way, but simply bypassing a  
reference input close to the package can reduce jitter 30% in  
low slew rate applications.  
0
OUTPUT  
Figure 28. Comparator Hysteresis Transfer Function  
The ADCMP58x family of comparators offers a programmable  
hysteresis feature that can significantly improve the accuracy  
and stability of the desired hysteresis. By connecting an external  
pull-down resistor from the HYS pin to ꢀEE, a variable amount  
of hysteresis can be applied. Leaving the HYS pin disconnected  
disables the feature, and hysteresis is then less than 1 m, as  
specified. The maximum range of hysteresis that can be applied  
by using this method is approximately 25 m.  
Figure 29 illustrates the amount of applied hysteresis as a  
function of external resistor value. The advantage of applying  
hysteresis in this manner is improved accuracy, stability, and  
reduced component count. An external bypass capacitor is not  
required on the HYS pin and it would likely degrade the jitter  
performance of the device.  
Rev. 0 | Page 13 of 16  
 
 
 
ADCMP580/ADCMP581/ADCMP582  
OUTLINE DIMENSIONS  
0.50  
0.40  
0.30  
3.00  
BSC SQ  
0.60 MAX  
PIN 1  
INDICATOR  
*
1.65  
13  
12  
16  
0.45  
1
1.50 SQ  
1.35  
PIN 1  
TOP  
2.75  
BSC SQ  
EXPOSED  
PAD  
INDICATOR  
VIEW  
(BOTTOM VIEW)  
4
9
8
5
0.50  
BSC  
0.25 MIN  
1.50 REF  
0.80 MAX  
12° MAX  
0.65 TYP  
0.90  
0.85  
0.80  
0.05 MAX  
0.02 NOM  
SEATING  
0.30  
PLANE  
0.20 REF  
0.23  
0.18  
*
COMPLIANT TO JEDEC STANDARDS MO-220-VEED-2  
EXCEPT FOR EXPOSED PAD DIMENSION.  
Figure 30. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]  
(CP-16-3)  
Dimensions shown in millimeters  
ORDERING GUIDE  
Model  
Temperature Range  
Package Description  
16-LEAD LFCSP-VQ  
16-LEAD LFCSP-VQ  
16-LEAD LFCSP-VQ  
16-LEAD LFCSP-VQ  
16-LEAD LFCSP-VQ  
16-LEAD LFCSP-VQ  
16-LEAD LFCSP-VQ  
16-LEAD LFCSP-VQ  
16-LEAD LFCSP-VQ  
Evaluation Board  
Package Option  
CP-16-3  
CP-16-3  
Branding  
GO7  
GO7  
ADCMP580BCP-WP  
ADCMP580BCP–R2  
ADCMP580BCP–RL7  
ADCMP581BCP-WP  
ADCMP581BCP–R2  
ADCMP581BCP–RL7  
ADCMP582BCP-WP  
ADCMP582BCP-R2  
ADCMP582BCP-RL7  
EVAL-ADCMP580BCP  
EVAL-ADCMP581BCP  
EVAL-ADCMP582BCP  
−±0°C to +125°C  
−±0°C to +125°C  
−±0°C to +125°C  
−±0°C to +125°C  
−±0°C to +125°C  
−±0°C to +125°C  
−±0°C to +125°C  
−±0°C to +125°C  
−±0°C to +125°C  
CP-16-3  
GO7  
CP-16-3  
CP-16-3  
CP-16-3  
GO9  
GO9  
GO9  
CP-16-3  
CP-16-3  
CP-16-3  
GOB  
GOB  
GOB  
Evaluation Board  
Evaluation Board  
Rev. 0 | Page 1± of 16  
 
ADCMP580/ADCMP581/ADCMP582  
NOTES  
Rev. 0 | Page 15 of 16  
ADCMP580/ADCMP581/ADCMP582  
NOTES  
Preliminary Technical Data  
© 2005 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
D04672-0-7/05(0)  
Rev. 0 | Page 16 of 16  
 

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