ADP3342 [ADI]

Ultralow, IQ, anyCAP Low Dropout Regulator; 超低智商,公司的anyCAP低压降稳压器
ADP3342
型号: ADP3342
厂家: ADI    ADI
描述:

Ultralow, IQ, anyCAP Low Dropout Regulator
超低智商,公司的anyCAP低压降稳压器

稳压器
文件: 总8页 (文件大小:164K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
®
Ultralow, IQ, anyCAP  
Low Dropout Regulator  
a
ADP3342  
FEATURES  
FUNCTIONAL BLOCK DIAGRAM  
Accuracy Over Line and Load: ؎4.0% @ 25؇C,  
؎5% Over Temperature  
Ultralow Dropout Voltage: 300 mV (Typ) @ 300 mA  
Requires Only CO = 1.0 F for Stability  
anyCAP = Stable with any Type of Capacitor  
(including MLCC)  
Current and Thermal Limiting  
Low Shutdown Current: < 2 A  
1.7 V Յ VIN Յ 6 V  
Q1  
IN  
OUT  
VCC  
THERMAL  
CC  
PROTECTION  
g
DRIVER  
m
PWRGD  
SD  
BANDGAP +  
REF –  
2.8 V Յ VCC Յ 6 V  
ADP3342  
VOUT = 1.2 V ؎5%  
–40؇C to +100؇C Ambient Temperature Range  
Ultrasmall Thermally Enhanced 8-Lead MSOP Package  
GND  
APPLICATIONS  
Notebook PCs  
Desktop PCs  
3.3V  
GENERAL DESCRIPTION  
The ADP3342 is a unique member of the ADP330x family of  
precision low dropout anyCAP voltage regulators. The ADP3342  
operates with an input voltage range of 1.7 V to 6 V and delivers  
a continuous load current up to 300 mA. In order to support the  
ability to regulate from such a low input voltage, the power rail  
to the IC, VCC, has been split off from the main power rail, VIN,  
from which the output is powered.  
VCC  
ADP3342  
V
1.8V  
V
OUT  
1.2V  
IN  
IN  
OUT  
+
+
1F  
1F  
IN  
OUT  
SD PWRGD  
ON  
GND  
OFF  
The ADP3342 stands out from the conventional LDOs with the  
lowest thermal resistance of any MSOP-8 package and an enhanced  
process that enables it to offer performance advantages beyond  
its competition. Its patented design requires only a 1.0 µF output  
capacitor for stability. This device is insensitive to output capacitor  
Equivalent Series Resistance (ESR), and is stable with any good  
quality capacitor, including ceramic (MLCC) types for space-  
restricted applications. The dropout voltage of the ADP3342 is  
only 190 mV (typical) at 300 mA. This device also includes a  
safety current limit, thermal overload protection and a shutdown  
control pin.  
Figure 1. Typical Application Circuit  
anyCAP is a registered trademark of Analog Devices, Inc.  
REV. 0  
Information furnished by Analog Devices is believed to be accurate and  
reliable. However, no responsibility is assumed by Analog Devices for its  
use, norforanyinfringementsofpatentsorotherrightsofthirdpartiesthat  
may result from its use. No license is granted by implication or otherwise  
under any patent or patent rights of Analog Devices.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781/329-4700  
Fax: 781/326-8703  
www.analog.com  
© Analog Devices, Inc., 2002  
(VCC = 3.0 V, VIN = 1.8 V, CIN = COUT = 1 F, TA = 0؇C to 100؇C and TA = –40؇C to  
+100؇C, unless otherwise noted.)  
ADP3342–SPECIFICATIONS  
Parameter  
Symbol  
Conditions  
Min  
Typ  
Max  
Unit  
OUTPUT  
Voltage Accuracy  
VOUT  
VCC = 2.8 V to 6 V, VIN = 1.7 V to 6 V  
IL = 0.1 mA to 300 mA  
TA = 25°C  
VCC = 2.8 V to 6 V, VIN = 1.7 V to 6 V  
IL = 0.1 mA to 300 mA,  
TA = 40°C to +100°C  
VCC = 2.8 V to 6 V, VIN = 1.7 V to 6 V  
TA = 25°C  
IL = 0.1 mA to 300 mA  
TA = 25°C  
VOUT = 98% of VOUTNOM  
IL = 300 mA  
IL = 200 mA  
IL = 100 mA  
4.0  
+4.0  
%
5.0  
+5.0  
%
Line Regulation  
Load Regulation  
Dropout Voltage  
0.04  
0.12  
mV/V  
mV/mA  
VDROP  
190  
125  
70  
450  
mV  
mV  
mV  
Current Limiting  
Output Noise  
ILIM  
VNOISE  
VCC = 3 V, VIN = 1.8 V  
f = 10 Hz100 kHz, CL = 1 µF  
IL = 300 mA  
450  
60  
mA  
µV rms  
OPERATING CURRENTS  
Ground Current in Regulation  
IGND  
IL = 300 mA, TA = 40°C to +100°C  
IL = 300 mA, TA = 0°C to 100°C  
IL = 300 mA, TA = 25°C  
IL = 200 mA  
IL = 0.1 mA  
IL = 300 mA  
3.0  
3.0  
3.0  
2.0  
100  
100  
0.01  
8.5  
6.0  
4.0  
mA  
mA  
mA  
mA  
µA  
175  
170  
2
VCC Current in Regulation  
Ground Current in Shutdown  
IVCC  
IGNDSD  
µA  
SD = 0 V, VCC = 6 V, VIN = 1.8 V  
µA  
SHUTDOWN  
Threshold Voltage  
VTHSD  
ON  
VCC 0.9  
V
OFF  
0 SD 6 V  
TA = 25°C VCC = 6 V, VIN = 6 V  
TA = 100°C VCC = 6 V, VIN = 6 V  
0.6  
7
1
V
SD Input Current  
Output Current In Shutdown  
ISD  
IOSD  
1.4  
0.01  
0.01  
µA  
µA  
µA  
2
PWRGD  
Power Good Output Voltage  
IPWRGDL  
VPWRGDL  
VPWRGD = 1.2 V, VCC = 3.0 V  
IPWRGD = 300 µA  
0.85  
1.5  
mA  
V
V
2
0.4  
300  
300  
1
2
VPWRGDH IPWRGD = 300 µA  
VCC 0.4  
5
Power Good On Time Delay  
TD13  
TD24  
TD35  
IL = 3 mA to 300 mA,  
COUT = 1 µF to 10 µF  
IL = 3 mA to 300 mA,  
µs  
50  
µs  
µs  
C
OUT = 1 µF to 10 µF  
Power Good Off Time Delay  
IL = 3 mA to 300 mA,  
0.05  
COUT = 1 µF to 10 µF  
THERMAL PROTECTION  
Shutdown Temperature  
THPROT  
IL = 100 mA  
165  
°C  
NOTES  
1Ambient temperature of 100°C corresponds to a junction temperature of 125°C under typical full load test conditions.  
2VPWRGDL, VPWRGDH,: Powergood output voltages. Guaranteed by design and characterization.  
3TD1: Delay time from VOUT crossing 1 V to PWRGD high. Guaranteed by design.  
4TD2: Delay time from SD high to PWRGD high. Guaranteed by design.  
5TD3: Delay time between SD low to PWRGD low. Guaranteed by design.  
Specifications subject to change without notice.  
–2–  
REV. 0  
ADP3342  
ABSOLUTE MAXIMUM RATINGS*  
PIN CONFIGURATION  
Input Supply Voltage . . . . . . . . . . . . . . . . . . . 0.3 V to +13 V  
Shutdown Input Voltage . . . . . . . . . . . . . . . . 0.3 V to +13 V  
Power Dissipation . . . . . . . . . . . . . . . . . . . Internally Limited  
Operating Ambient Temperature Range . . . 40°C to +100°C  
Operating Junction Temperature Range . . . 40°C to +125°C  
OUT  
OUT  
1
2
3
4
8
7
6
5
IN  
IN  
ADP3342  
TOP VIEW  
VCC  
GND  
(Not to Scale)  
SD  
PWRGD  
JA (2-layer) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157°C/W  
JA (4-layer) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121°C/W  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56°C/W  
JC  
Storage Temperature Range . . . . . . . . . . . . 65°C to +150°C  
Lead Temperature Range (Soldering 10 sec) . . . . . . . . 300°C  
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 215°C  
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C  
*This is a stress rating only; operation beyond these limits can cause the device  
to be permanently damaged.  
ORDERING GUIDE  
Model  
Output Voltage*  
Package Option  
Marking Code Temperature Range  
ADP3342JRM-REEL7 1.2 V  
ADP3342ARM-REEL7 1.2 V  
RM-8 (MSOP-8)  
RM-8 (MSOP-8)  
LJA  
LJB  
0°C to 100°C  
40°C to +100°C  
*Contact the factory for other output voltage options.  
PIN FUNCTION DESCRIPTIONS  
Pin No.  
Mnemonic  
Function  
1, 2  
OUT  
Output of the Regulator. Bypass to ground with a 1.0 µF or larger capacitor. All pins must be  
connected together for proper operation.  
3
4
5
6
VCC  
Supply Voltage  
GND  
PWRGD  
SD  
Ground Pin  
Power Good. Used to indicate output is in regulation.  
Active Low Shutdown Pin. Connect to ground to disable the regulator output. When shut down  
is not used, this pin should be connected to the input pin.  
7, 8  
IN  
Regulator Input. All pins must be connected together for proper operation.  
CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily  
accumulate on the human body and test equipment and can discharge without detection. Although  
the ADP3342 features proprietary ESD protection circuitry, permanent damage may occur on  
devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are  
recommended to avoid performance degradation or loss of functionality.  
WARNING!  
ESD SENSITIVE DEVICE  
REV. 0  
–3–  
ADP3342Typical Performance Characteristics  
1.25  
1.24  
1.23  
1.22  
1.21  
1.20  
1.19  
1.18  
1.17  
1.23  
1.22  
1.21  
1.20  
1.19  
1.18  
1.17  
120  
110  
100  
90  
V
= 1.8V  
= 3.0V  
IN  
V
= 1.2V  
= 3V  
V
= 1.2V  
= 3V  
OUT  
OUT  
V
CC  
V
V
CC  
CC  
I
= 0A  
L
I
= 0mA  
L
I
= 100mA  
L
80  
I
I
= 200mA  
= 300mA  
L
70  
L
60  
50  
1.7  
2.7  
3.7  
4.7  
5.7  
0
50  
100  
150  
200  
250  
300  
1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 4.4 4.8 5.2 5.6 6.0  
INPUTVOLTAGE V  
OUTPUT LOAD mA  
INPUT VOLTAGE V  
TPC 1. Line Regulation Output Voltage  
vs. Supply Voltage  
TPC 2. Output Voltage vs. Load Current  
TPC 3. Ground Current vs. Supply  
Voltage  
5.50  
3.5  
1.0  
0
V
= 3.0V  
= 1.8V  
V
= 1.8V  
= 3.0V  
CC  
IN  
0.9  
5.00  
4.50  
4.00  
3.50  
3.00  
2.50  
2.00  
1.50  
1.00  
0.50  
0
V
V
IN  
3.0  
2.5  
CC  
0.8  
0.7  
200mA  
0.6  
0.5  
0.4  
0.3  
0.2  
I
I
= 300mA  
= 200mA  
L
2.0  
1.5  
1.0  
L
300mA  
0.1  
0
0.1  
0.2  
0.3  
0.4  
I
= 100mA  
= 0mA  
L
0.5  
0
I
L
0
50  
100  
150  
200  
250  
300  
40 20  
0
20  
40  
60  
80  
100  
50 25  
0
25  
50  
75 100 125 150  
OUTPUT LOAD mA  
JUNCTIONTEMPERATURE ؇C  
JUNCTION TEMPERATURE ؇C  
TPC 4. Ground Current vs. Load Current  
TPC 5. Output Voltage Variation  
vs. Junction Temperature  
TPC 6. Ground Current vs. Junction  
Temperature  
0.25  
0.20  
0.15  
0.10  
7.0  
V
= 3.0V  
= 1.8V  
CC  
6.5  
6.0  
5.5  
6
V
IN  
V
= 1.2V  
OUT  
SD = V  
5
4
3
2
1
IN  
= 4  
R
L
5.0  
4.5  
4.0  
3.5  
MAX  
TYP  
MIN  
3.0  
2.5  
2.0  
0
1  
2  
0.05  
0
1.5  
1.0  
0
200  
400  
600  
800  
1000  
TIME s  
0
50  
100  
150  
200  
250  
300  
40 25 10  
5
20 35 50 65 80 950  
OUTPUT LOAD mA  
TEMPERATURE ؇C  
TPC 7. Dropout Voltage vs. Output  
Current  
TPC 8. Ground Current @ 300 mA  
Load vs. Ambient Temperature  
TPC 9. Power-Up/Power-Down  
–4–  
REV. 0  
ADP3342  
0
V
C
R
= 3V  
= 10F  
= 4⍀  
V
C
R
= 3V  
= 1F  
= 4⍀  
CC  
CC  
1.3  
1.2  
1.1  
L
L
L
L
1.32  
1.22  
1.12  
3.00  
1.80  
1.32  
1.22  
1.12  
3.00  
1.80  
V
= 3V  
= 1.8V  
= 1F  
CC  
V
IN  
C
L
400  
200  
5
0
400  
800  
1200  
1600  
2000  
0
40  
80  
120  
160  
200  
0
40  
80  
120  
160  
200  
TIME s  
TIME s  
TIME s  
TPC 10. Line Transient Response  
TPC 11. Line Transient Response  
TPC 12. Load Transient Response  
0
V
= 1.8V  
V
R
= 3V  
= 4⍀  
= 1.8V  
IN  
CC  
1.3  
1.2  
1.2  
0
2.0  
1.0  
0
L
V
IN  
V
= 3V  
= 1.8V  
= 10F  
CC  
1.1  
V
IN  
C
L
3.0  
0
400  
200  
5
1.0  
0.5  
0
1.8  
0
0
400  
800  
1200  
1600  
2000  
0
200  
400  
600  
800  
1000  
200  
200  
600  
1000  
1400  
1800  
TIME s  
TIME s  
TIME s  
TPC 13. Load Transient Response  
TPC 14. Short Circuit Current  
TPC 15. Power-On/Power-Off  
Response from Shutdown  
2.0  
1.0  
2.0  
V
= 1.8V  
IN  
2.0  
1.0  
0
1.0  
0
SD = 3.0V  
R
V
= 3V  
= 1.8V  
= 4⍀  
= 4⍀  
CC  
L
0
V
IN  
V
= 3V  
= 1.8V  
R
CC  
L
V
IN  
R
= 4⍀  
L
3.0  
0
3.0  
0
1.8  
0
1.8  
0
3.0  
0
0
100  
200  
300  
400  
500  
200  
600  
1000  
1400  
1800  
2
6
10  
14  
18  
TIME s  
TIME s  
TIME s  
TPC 16. Turn On Delay  
TPC 17. Turn Off Delay  
TPC 18. Power-On/Power-Off  
Response from VCC  
–5–  
REV. 0  
ADP3342  
20  
30  
40  
50  
60  
70  
80  
90  
70  
60  
V
= 1.2V  
OUT  
C
= 10F  
= 300mA  
L
I
L
C
= 1F  
= 300mA  
L
1.2  
0
I
L
50  
40  
30  
20  
V
= 1.8V  
IN  
SD = 3.0V  
= 4⍀  
C
= 1F  
= 50A  
L
R
L
I
L
300mA  
0mA  
3.0  
0
1.8  
0
C
= 10F  
= 50A  
L
I
L
10  
0
0
200  
400  
600  
800  
1000  
TIME s  
0
10  
20  
C
30  
F  
40  
50  
10  
100  
1k  
10k  
100k  
1M  
10M  
FREQUENCY Hz  
L
TPC 19. Power On/Power Off  
Response from VIN  
TPC 20. Power Supply Ripple  
Rejection  
TPC 21. RMS Noise vs. CL  
(10 Hz–100 Hz)  
1.25  
100  
10  
650  
V
= 1.2V  
= 1mA  
OUT  
I
L
1.23  
0mA  
50mA  
600  
550  
500  
C
= 10F  
L
1.21  
1
C
= 1F  
L
100mA  
200mA  
300mA  
1.19  
1.17  
1.15  
0.1  
0.01  
0.001  
35  
55  
75  
95 115 135 155 175  
10  
100  
1k  
10k  
100k  
1M  
1.5  
1.6  
1.7  
V
1.8  
V  
1.9  
2.0  
AMBIENT TEMPERATURE ؇C  
FREQUENCY Hz  
IN  
TPC 22. Output Noise Density  
TPC 23. Thermal Protection  
TPC 24. Current Limit vs. VIN  
3.6  
3.0  
V
= 1.8V  
IN  
SD = 3V  
400  
200  
0
5
15  
25  
35  
45  
TIME ms  
TPC 25. Current Limiting from VCC  
–6–  
REV. 0  
ADP3342  
THEORY OF OPERATION  
APPLICATION INFORMATION  
PC Application—VCCVID  
The new anyCAP LDO ADP3342 uses a single control loop for  
regulation and reference functions. The output voltage is sensed  
by a resistive voltage divider consisting of R1 and R2. Feedback  
is taken from this network by way of a series diode (D1) and a  
second resistor divider (R3 and R4) to the input of an amplifier.  
The ADP3342 has been optimized for PC applications that  
require a 1.2 V output for powering the voltage identification  
rail, VCCVID. The rail from which the output draws current,  
the IN pin, is separated from the rail that powers the IC, the  
VCC pin. This allows a higher efficiency design when, as  
recommended for the IMVP-3 application, the VCC pin is  
connected to a 3.3 V supply to power the IC adequately, and  
the IN pin is connected to a 1.8 V supply. The efficiency is  
nearly 60% in this case.  
VCC  
INPUT  
Q1  
OUTPUT  
COMPENSATION  
CAPACITOR  
ATTENUATION  
/V  
R1  
(a)  
(V  
)
BANDGAP OUT  
C
LOAD  
D1  
R3  
PTAT  
V
NONINVERTING  
WIDEBAND  
DRIVER  
Capacitor Selection  
OS  
g
m
PTAT  
As with any voltage regulator, output transient response is a  
function of the output capacitance. The ADP3342 is stable with  
a wide range of capacitor values, types and ESR (anyCAP).  
A capacitor as low as 1 µF is all that is needed for stability; larger  
capacitors can be used if high output current surges are anticipated.  
The ADP3342 is stable with extremely low ESR capacitors (ESR 0),  
such as multilayer ceramic capacitors (MLCC) or OSCON.  
Note that the effective capacitance of some capacitor types may  
fall below the minimum at cold temperature. Ensure that the  
capacitor provides more than 1 µF at minimum temperature.  
R
LOAD  
CURRENT  
R4  
R2  
ADP3342  
GND  
Figure 2. Control Loop Functional Block Diagram  
A very high gain error amplifier is used to control this loop. The  
amplifier is constructed in such a way that at equilibrium it  
produces a large, temperature proportional input offset voltage”  
that is repeatable and very well controlled. The temperature  
proportional offset voltage is combined with the complementary  
diode voltage to form a virtual bandgapvoltage, implicit in  
the network, although it never appears explicitly in the circuit.  
Ultimately, this patented design makes it possible to control the  
loop with only one amplifier. This technique also improves the  
noise characteristics of the amplifier by providing more flexibility  
on the trade-off of noise sources that leads to a low noise design.  
Input Bypass Capacitor  
An input bypass capacitor is not strictly required but is advisable  
in any application involving long input wires or high source  
impedance. Connecting a 1 µF capacitor from IN to ground reduces  
the circuit's sensitivity to PC board layout. If a larger value output  
capacitor is used, then a larger value input capacitor is also  
recommended.  
Power Good Monitoring Function  
The PWRGD pin does not monitor the output voltage directly,  
but rather detects whether the internal PNP pass transistor is being  
modulated by the regulation loop. This means of detecting PWRGD,  
rather than using a voltage threshold detection, provides an inherent  
and desirable delay in asserting the PWRGD signal. During  
startup or overload, the regulation loop is not in control, so the  
PWRGD pin is low.  
The R1, R2 divider is chosen in the same ratio as the bandgap  
voltage to the output voltage. Although the R1, R2 resistor  
divider is loaded by the diode D1 and a second divider consisting  
of R3 and R4, the values can be chosen to produce a temperature  
stable output. This unique arrangement specifically corrects for  
the loading of the divider so that the error resulting from base  
current loading in conventional circuits is avoided.  
Shutdown Mode  
The patented amplifier controls a new and unique noninverting  
driver that drives the pass transistor, Q1. The use of this special  
noninverting driver enables the frequency compensation to include  
the load capacitor in a pole splitting arrangement to achieve reduced  
sensitivity to the value, type and ESR of the load capacitance.  
Applying a TTL high signal to the shutdown (SD) pin or tying  
it to the input pin, will turn the output ON. Pulling SD down to  
0.4 V or below, or tying it to ground will turn the output OFF.  
In shutdown mode, quiescent current is reduced.  
Paddle-Under-Lead Package  
Most LDOs place very strict requirements on the range of ESR  
values for the output capacitor because they are difficult to stabilize  
due to the uncertainty of load capacitance and resistance. More-  
over, the ESR value, required to keep conventional LDOs stable,  
changes depending on load and temperature. These ESR limitations  
make designing with LDOs more difficult because of their unclear  
specifications and extreme variations over temperature.  
The ADP3342 uses a patented paddle-under-lead package design  
to ensure the best thermal performance in an MSOP-8 footprint.  
This new package uses an electrically isolated die attach that  
allows all pins to contribute to heat conduction. This technique  
reduces the thermal resistance to 110°C/W on a 4-layer board as  
compared to >160°C/W for a standard MSOP-8 leadframe.  
Thermal Overload Protection  
With the ADP3342 anyCAP LDO, this is no longer true. It can  
be used with virtually any good quality capacitor, with no con-  
straint on the minimum ESR. This innovative design allows the  
circuit to be stable with just a small 1 µF capacitor on the output.  
Additional advantages of the pole splitting scheme include superior  
line noise rejection and very high regulator gain which leads to  
excellent line and load regulation.  
The ADP3342 is protected against damage due to excessive power  
dissipation by its thermal overload protection circuit which limits  
the die temperature to a maximum of 165°C. Under extreme  
conditions (i.e., high ambient temperature and power dissipation)  
where die temperature starts to rise above 165°C, the output current  
is reduced until the die temperature has dropped to a safe level.  
The output current is restored when the die temperature is reduced.  
Additional features of the circuit include current limit and thermal  
shutdown and noise reduction.  
REV. 0  
–7–  
ADP3342  
Current and thermal limit protections are intended to protect the  
device against accidental overload conditions. For normal operation,  
device power dissipation should be limited by operating conditions  
so that junction temperatures will not exceed 150°C.  
Assuming ILOAD = 300 mA, IGND = 4 mA, VIN = 1.8 V and  
VOUT = 1.2 V, device power dissipation is:  
PD = (1.8 1.2) 300 mA +(1.8) 4 mA = 187 mW  
The proprietary package used in the ADP3342 has a thermal  
resistance of 110°C/W, significantly lower than a standard  
MSOP-8 package. Assuming a 4-layer board, the junction tem-  
perature rise above ambient temperature will be approximately  
equal to:  
Calculating Junction Temperature  
Device power dissipation is calculated as follows:  
PD = (VIN VOUT )ILOAD +(VIN )IGND  
Where ILOAD and IGND are load current and ground current, VIN  
and VOUT are input and output voltages respectively.  
TJA = 0.187W ×110°C W = 20.6°C  
OUTLINE DIMENSIONS  
Dimensions shown in inches and (mm).  
8-Lead Micro SOIC (MSOP)  
(RM-8)  
0.122 (3.10)  
0.114 (2.90)  
8
5
4
0.122 (3.10)  
0.114 (2.90)  
0.199 (5.05)  
0.187 (4.75)  
1
PIN 1  
0.0256 (0.65) BSC  
0.120 (3.05)  
0.112 (2.84)  
0.120 (3.05)  
0.112 (2.84)  
0.043 (1.09)  
0.037 (0.94)  
0.006 (0.15)  
0.002 (0.05)  
33؇  
0.018 (0.46)  
0.008 (0.20)  
27؇  
0.028 (0.71)  
0.016 (0.41)  
0.011 (0.28)  
0.003 (0.08)  
SEATING  
PLANE  
CONTROLLING DIMENSIONS ARE IN MILLIMETERS. INCH DIMENSIONS  
ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE  
ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.  
–8–  
REV. 0  

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