GR712RC-MS-CG240 [AEROFLEX]
Dual-Core LEON3-FT SPARC V8 Processor; 双核LEON3 -FT SPARC V8处理器型号: | GR712RC-MS-CG240 |
厂家: | AEROFLEX CIRCUIT TECHNOLOGY |
描述: | Dual-Core LEON3-FT SPARC V8 Processor |
文件: | 总48页 (文件大小:838K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Dual-Core LEON3-FT SPARC V8 Processor
GR712RC
Data Sheet
GAISLER
Features
Description
•
Dual-core SPARC V8 integer unit, each with
7-stage pipeline, 8 register windows, 4x4 KiB multi-
way instruction cache, 4x4 KiB multi-way data cache,
branch prediction, hardware multiplier and divider,
power-down mode, hardware watchpoints, single-
vector trapping, SPARC reference memory
management unit, etc.
The GR712RC is an implementation of the
dual-core LEON3FT SPARC V8 processor using
TM
RadSafe technology. The fault tolerant design
of the processor in combination with the
radiation tolerant technology
provides total immunity
to radiation effects.
•
•
Two high-performance double precision IEEE-754
floating point units
EDAC protected (8-bit BCH and 16-bit Reed-
Solomon) interface to multiple 8/32-bits
PROM/SRAM/SDRAM memory banks
Advanced on-chip debug support unit
192 KiB EDAC protected on-chip memory
Multiple SpaceWire links with RMAP target
Redundant 1553 BC/RT/MT interfaces
Redundant CAN 2.0 interfaces
Specification
•
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•
•
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CQFP240 package
Total Ionizing Dose (TID) up to 300 krad(Si)
Proven Single-Event Latch-Up (SEL) immunity
Proven Single-Event Upset (SEU) tolerance
1.8V & 3.3V supply
15 mW/MHz processor core power consumption
100 MHz system frequency
200 Mbps SpaceWire links
10 Mbps CCSDS Telecommand link
50 Mbps CCSDS Telemetry link
10/100 Ethernet MAC with RMII interface
2
SPI, I C, ASCS16 (STR), SLINK interfaces
CCSDS/ECSS Telemetry and Telecommand
UARTs, Timers & Watchdog, GPIO ports,
Interrupt controllers, Status registers, JTAG, etc.
Configurable I/O switch matrix
•
Applications
GR712RC is an advanced system-on-chip, targeting high reliability rad-hard space,
aeronautics and military applications.
It incorporates a dual-core LEON3-FT SPARC V8 processor and is implemented
TM
using Ramon Chips’ RadSafe library on Tower Semiconductors’ standard
180 nm CMOS technology.
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Table of contents
1
Introduction..............................................................................................................................3
1.1
1.2
1.3
1.4
1.5
Overview .................................................................................................................................................3
Key features.............................................................................................................................................3
Signal overview .......................................................................................................................................5
Signal description....................................................................................................................................6
I/O switch matrix overview .....................................................................................................................7
2
3
Electrical characteristics ........................................................................................................18
2.1
2.2
2.3
2.4
Absolute maximum ratings ...................................................................................................................18
Recommended operating conditions .....................................................................................................18
DC electrical performance characteristics.............................................................................................19
AC electrical performance characteristics.............................................................................................21
Mechanical description ..........................................................................................................37
3.1
3.2
3.3
Package..................................................................................................................................................37
Pin assignment.......................................................................................................................................37
Mechanical package drawings...............................................................................................................43
4
5
6
7
Reference documents.............................................................................................................45
Screening, qualification, and quality control .........................................................................46
Ordering information .............................................................................................................46
Change record ........................................................................................................................47
Copyright Aeroflex Gaisler AB
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1
Introduction
Overview
1.1
GR712RC is a dual-core LEON3-FT SPARC V8 processor, with advanced interface protocols, dedi-
cated for high reliability Rad-Hard aerospace applications.
The GR712RC is fabricated at Tower Semiconductors Ltd., using standard 180 nm CMOS technol-
TM
ogy. It employs radiation-hard-by-design methods from Aeroflex Gaisler and the RadSafe technol-
ogy from Ramon Chips Ltd., enabling superior radiation hardness together with excellent low-power
performance.
The LEON3-FT processors provide hardware support for cache coherency, processor enumeration
and interrupt steering. Each processor core includes a SPARC Reference Memory Management Unit
(SRMMU) and an IEEE-754 compliant double-precision FPU for floating-point operations. It can be
utilized in symmetric or asymmetric multiprocessing mode.
The GR712RC architecture is centered around the AMBA Advanced High-speed Bus (AHB), to
which the two LEON3-FT processors and other high-bandwidth units are connected. Low-bandwidth
units are connected to the AMBA Advanced Peripheral Bus (APB) which is accessed through an
AHB to APB bridge.
GR712RC is provided in a 240-pin, 0.5 mm pitch high-reliability ceramic quad flat package (CQFP).
This document is complemented by the GR712RC Dual-Core LEON3-FT SPARC V8 Processor -
User's Manual from Aeroflex Gaisler [UM], which provides information related to software integra-
tion and development.
1.2
Key features
•
•
•
Technology: 180 nm standard CMOS, Tower Semiconductors Ltd.
Library: 180 nm RadSafe™, Ramon Chips Ltd.
Package:
• 240 pin CQFP, 0.5 mm pitch, 32 mm * 32 mm, hermetically sealed,
delivered with flat pins and insulating lead-frame for customer trim and fold
• Core voltage 1.8V +/- 0.15V, I/O voltage 3.3V +/- 0.3V
• -55ºC to +125ºC temperature range
Radiation tolerance:
•
•
• TID: 300 krad (Si)
2
• SEL: > 118 MeV-cm /mg
• SEU: proven tolerance with hardened flip-flops and error correction on all on-chip memories
• Error detection and correction on external memories
Maximum system clock frequency of 100 MHz (depending on external memory choice)
• Optional 2x internal system frequency multiplication by an all-digital DLL
• Optional 2x or 4x internal SpaceWire frequency multiplication by an all-digital DLL
• Clock-gating for each major core
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•
Two LEON3-FT SPARC V8 compliant 32-bit processors, each with:
• SPARC reference memory management unit (SRMMU) with 32 TLB entries
• High-performance double-precision IEEE-754 floating point co-processor (GRFPU)
• 16 KiB multi-way instruction cache and 16 KiB multi-way data cache
Internal on-chip high speed AMBA (AHB) bus
•
•
•
•
•
•
•
Instruction trace and AMBA (AHB) trace buffers for debugging
Timer unit with four 32-bit timers including watchdog
Secondary timer unit with four 32-bit timers
Primary and secondary interrupt controller for 31 interrupts
On-chip 192 KiB memory block with EDAC
External memory support:
• Bus width: 8 bits, or 32 bit data plus 8/16 bits for EDAC checkbits, 24 bit address
• 8 bit BCH EDAC for SRAM and PROM, 16 bit Reed-Solomon EDAC for SDRAM
• Memory types: SRAM, SDRAM, PROM / EEPROM / NOR-FLASH and I/O address space
• Programmable wait-states:
• SRAM read/write cycle 2 - 5 clock cycles
• PROM / EEPROM / NOR-FLASH read cycle 2 - 32 clock periods
• One idle clock period between accesses to SRAM and PROM
Debug Support Unit (DSU) accessed via JTAG and SpaceWire RMAP targets
Two SpaceWire ports with RMAP targets, maximum 200 Mbps full-duplex data rate
Configurable I/O selection matrix, connecting a subset of available I/O units to 67 shared pins:
• Four SpaceWire ports, maximum 200 Mbps full-duplex data rate
• Redundant MIL-STD-1553B BRM (BC/RT/BM) interface
• Two CAN 2.0B bus controllers
•
•
•
• Six UART ports, with 8-byte FIFO
• Ethernet MAC with RMII 10/100 Mbps port
• SPI master serial port
• I2C master serial port
• ASCS16 (STR) serial port
• SLINK 6 MHz serial port
• CCSDS / ECSS Telecommand decoder (five input channels), maximum 10 Mbps input rate
• CCSDS / ECSS Telemetry encoder, maximum 50 Mbps output rate
• 26 input and 38 input/output general purpose ports
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1.3
Signal overview
INCLK
RESETN
DLLBPN
ERRORN
WDOGN
Clock & Reset
Error & Watchdog
TESTEN
SCANEN
Test
TCK
TMS
TDI
TDO
JTAG
DATA[31:0]
CB[7:0]
BRDYN
ADDRESS[23:0]
RAMSN[1:0]
RAMOEN
RAMWEN
ROMSN[1:0]
IOSN
Memory interface
BEXCN
OEN
READ
WRITEN
SDCLK
SPWCLK
SPW_RXD[1:0]
SPW_RXS[1:0]
SpaceWire Links
SPW_TXD[1:0]
SPW_TXS[1:0]
SWMX[66:0]
I/O Matrix
Figure 1. Signal overview
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1.4
Signal description
The external signals are described in table 1.
Table 1. External signals
Name
Usage
Direction
In
Polarity
-
INCLK
Main system clock
DLL bypass
DLLBPN
RESETN
SCANEN
TESTEN
ERRORN
WDOGN
TCK
In
Low
Low
High
High
Low
Low
-
System reset
In
Scan enable (tie to ground)
Test enable (tie to ground)
Processor error mode
Watchdog output
In
In
Out-Tri
Out-Tri
In
JTAG Test Clock
TMS
JTAG Test Mode
In
High
-
TDI
JTAG Test Data Input
JTAG Test Data Output
Memory address
In
TDO
Out
Out
In/Out
In/Out
Out
Out
Out
Out
Out
Out
-
ADDRESS[23:0]
DATA[31:0]
CB[7:0]
RAMSN[1:0]
RAMOEN
RAMWEN
OEN
-
Memory data bus
-
Memory checkbits
SRAM chip selects
SRAM output enable
SRAM write enable strobe
PROM, I/O output enable
PROM, I/O write strobe
-
Low
Low
Low
Low
Low
High
WRITEN
READ
SRAM, PROM I/O read indicator 1)
I/O area chip select
IOSN
Out
Out
In
Low
Low
Low
Low
-
ROMSN[1:0]
BRDYN
PROM chip selects
Bus ready
BEXCN
Bus exception
In
SDCLK
SDRAM clock
Out
In
SPWCLK
SpaceWire receiver and transmitter clock
SpaceWire Data input
SpaceWire Strobe input
SpaceWire Data output
SpaceWire Strobe output
I/O switch matrix
-
SPW_RXD[1:0]
SPW_RXS[1:0]
SPW_TXD[1:0]
SPW_TXS[1:0]
SWMX[66:0]
Note 1:
In
High
High
High
High
-
In
Out
Out
In/Out
The READ signal may also change value during SDRAM accesses.
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GR712RC-DS
1.5
I/O switch matrix overview
The I/O switch matrix provides access to several I/O units. When an interface is not activated, its pins
automatically become general purpose I/O. After reset, all I/O switch matrix pins are defined as I/O
until programmed otherwise. Note that some pins are input only, some are output only, and the rest are
both input and output, as described in table 3. The enabling of the I/O units is described in [UM].
Figure 2 shows how the various I/O units are connected to the I/O switch matrix.
Table 2 shows examples of possible configurations using the I/O switch matrix. Note that two
SpaceWire interfaces are always available outside the I/O switch matrix.
Table 3 shows a listing of all pins in the I/O switch matrix, indicating the priority amongst them.
Table 4 shows a listing of pin utilization per I/O unit.
Table 5 shows a listing of pins in the I/O switch matrix grouped per function (GPIO is not listed).
Table 6 shows a complete listing of conflicts between I/O units (GPIO is not listed).
TMS, TCK
TDI, TDO
INCLK, SPWCLK
DLLBPN, RESETN
TESTEN
SCANEN
ERRORN
WDOGN
TIMERS
JTAG
DSU
LEON3FT LEON3FT 192K RAM CANMUX CLKGATE GPREG IRQ
STAT
AMBA
TM
1553
SLINK
I2C
UART
UART
GPIO
SPW
SPW
SPW
GPIO
SPW
U
UART
SPW
U
UART
MCTRL SDRAM
TC
CAN
ETH
SPI
ASCS
SWMX[66:0]
SPW_TXD/S[1:0]
SPW_RXD/S[1:0]
ADDRESS[23:0]
DATA[31:0], CB[7:0]
CTRL, SDCLK
Figure 2. Architectural block diagram showing connections to the I/O switch matrix
Table 2. Example of possible configurations using the I/O switch matrix. Note that other configurations are also possible.
Interface type
Example configuration
CF0
CF1
CF2
CF3
CF4
CF5
SDRAM with or without Reed-Solomon
1
4
4
1
6
2
1
6
2
1
6
4
1
1
6
3
1
UART
6
6
SpaceWire
Ethernet
MIL-STD-1553B BC/RT/BM
1
1
1
I2C
1
1
1
1
1
1
1
SPI
SLINK
1
1
ASCS16
CCSDS/ECSS TC & TM
1
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Table 3. I/O switch matrix pin description, defining the order of priority for outputs and input/outputs, with the highest
priority for each pin listed first.
Pin no.
Pin name
SWMX[0]
SWMX[1]
SWMX[2]
SWMX[3]
Pin function
UART_TX[0]
UART_RX[0]
UART_TX[1]
UART_RX[1]
GPIO[0]
Polarity
Reset value
Dir.
Out
In
Description
4
3
2
1
-
-
-
-
-
-
-
-
High
UART Transmit 0
UART Receive 0
High
Out
In
UART Transmit 1
UART Receive 1
In
GPIO 1 Register, bit 0 (input only)
UART Transmit 2
GPIO 1 Register, bit 1
240
SWMX[4]
UART_TX[2]
GPIO[1]
High-Z
High-Z
Out
In/Out
In
MCFG3[8]
At reset, bit 8 in MCFG3 register in the mem-
ory controller is set from this input.
239
238
SWMX[5]
SWMX[6]
UART_RX[2]
GPIO[2]
-
-
-
-
-
In
UART Receive 2
In
GPIO 1 Register, bit 2 (input only)
UART Transmit 3
UART_TX[3]
GPIO[3]
High-Z
High-Z
Out
In/Out
In
GPIO 1 Register, bit 3
MCFG1[9]
At reset, bit 9 in MCFG1 register in the mem-
ory controller is set from this input
233
232
SWMX[7]
SWMX[8]
UART_RX[3]
GPIO[4]
-
In
UART Receive 3
-
In
GPIO 1 Register, bit 4 (input only)
UART Transmit 4
UART_TX[4]
TMDO
-
High-Z
High-Z
High-Z
Out
Out
In/Out
In
-
Telemetry Data Out
GPIO[5]
-
GPIO 1 Register, bit 5
231
230
229
228
227
226
SWMX[9]
SWMX[10]
SWMX[11]
SWMX[12]
SWMX[13]
SWMX[14]
UART_RX[4]
TMCLKI
-
UART Receive 4
Rising
In
Telemetry Clock Input
GPIO 1 Register, bit 6 (input only)
UART Transmit 5
GPIO[6]
-
In
UART_TX[5]
TMCLKO
GPIO[7]
-
High-Z
High-Z
High-Z
Out
Out
In/Out
In
-
Telemetry Clock Output
GPIO 1 Register, bit 7
-
UART_RX[5]
TCACT[0]
GPIO[8]
-
UART Receive 5
High
In
Telecommand Active 0
GPIO 1 Register, bit 8 (input only)
SpaceWire Transmit Strobe 4
SDRAM Select 0
-
In
SPW_TXS[4]
SDCSN[0]
GPIO[9]
High
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
Out
Out
In/Out
Out
Out
In/Out
In
Low
-
GPIO 1 Register, bit 9
SPW_TXD[4]
SDCSN[1]
GPIO[10]
High
SpaceWire Transmit Data 4
SDRAM Select 1
Low
-
GPIO 1 Register, bit 10
SpaceWire Receive Strobe 4
Telecommand Clock 0
ASCS DAS A - Slave data in
GPIO 1 Register, bit 11 (input only)
SpaceWire Receive Data 4
Telecommand Data 0
SPW_RXS[4]
TCCLK[0]
A16DASA
GPIO[11]
High
Rising
In
-
In
-
In
225
220
SWMX[15]
SWMX[16]
SPW_RXD[4]
TCD[0]
High
In
-
In
A16DASB
GPIO[12]
-
In
ASCS DAS B - Slave data in
GPIO 1 Register, bit 12 (input only)
SpaceWire Transmit Strobe 2
CAN Transmit A
-
In
SPW_TXS[2]
CANTXA
GPIO[13]
High
High-Z
High-Z
High-Z
Out
Out
In/Out
-
-
GPIO 1 Register, bit 13
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Table 3. I/O switch matrix pin description, defining the order of priority for outputs and input/outputs, with the highest
priority for each pin listed first.
Pin no.
Pin name
Pin function
SPW_TXD[2]
CANTXB
Polarity
Reset value
High-Z
Dir.
Out
Out
In/Out
In
Description
219
SWMX[17]
High
SpaceWire Transmit Data 2
CAN Transmit B
-
High-Z
GPIO[14]
-
High-Z
GPIO 1 Register, bit 14
218
217
203
202
SWMX[18]
SWMX[19]
SWMX[20]
SWMX[21]
SPW_RXS[2]
CANRXA
High
SpaceWire Receive Strobe 2
CAN Receive A
-
In
GPIO[15]
-
In
GPIO 1 Register, bit 15 (input only)
SpaceWire Receive Data 2
CAN Receive B
SPW_RXD[2]
CANRXB
High
-
In
In
GPIO[16]
-
In
GPIO 1 Register, bit 16 (input only)
SpaceWire Transmit Strobe 3
SLINK SYNC
SPW_TXS[3]
SLSYNC
High
High
-
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
Out
Out
In/Out
Out
Out
In/Out
In
GPIO[17]
GPIO 1 Register, bit 17
SPW_TXD[3]
A16ETR
High
High
-
SpaceWire Transmit Data 3
ASCS ETR - Synchronization signal
GPIO 1 Register, bit 18
GPIO[18]
201
200
197
SWMX[22]
SWMX[23]
SWMX[24]
SPW_RXS[3]]
GPIO[19]
High
-
SpaceWire Receive Strobe 3
GPIO 1 Register, bit 19 (input only)
SpaceWire Receive Data 3
GPIO 1 Register, bit 20 (input only)
SpaceWire Transmit Data 5
In
SPW_RXD[3]
GPIO[20]
High
-
In
In
SPW_TXD[5]
SDDQM[0]
High
High
High-Z
High-Z
Out
Out
SDRAM Data Mask 0, corresponds to
DATA[7:0]
GPIO[21]
-
High-Z
High-Z
High-Z
In/Out
Out
GPIO 1 Register, bit 21
196
SWMX[25]
SPW_TXS[5]
SDDQM[1]
High
High
SpaceWire Transmit Strobe 5
Out
SDRAM Data Mask 1, corresponds to
DATA[15:8]
GPIO[22]
SPW_RXS[5]
TCRFAVL[0]
GPIO[23]
SPW_RXD[5]
TCCLK[1]
GPIO[24]
1553RXENA
-
-
High-Z
In/Out
In
GPIO 1 Register, bit 22
193
192
191
SWMX[26]
SWMX[27]
SWMX[28]
High
High
-
SpaceWire Receive Strobe 5
Telecommand RF Available 0
GPIO 1 Register, bit 23 (input only)
SpaceWire Receive Data 5
Telecommand Clock 1
In
In
High
Rising
-
In
In
In
GPIO 1 Register, bit 24 (input only)
MIL-STD-1553B Receive Enable A
Proprietary, enabled by CAN
Ethernet Transmit Data 0
High
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
Out
Out
Out
In/Out
Out
Out
Out
In/Out
In
RMTXD[0]
GPIO[25]
1553TXA
-
-
-
GPIO 1 Register, bit 25
190
189
SWMX[29]
SWMX[30]
High
MIL-STD-1553B Transmit Positive A
Proprietary, enabled by CAN
Ethernet Transmit Data 1
RMTXD[1]
GPIO[26]
1553RXA
TCD[1]
-
-
GPIO 1 Register, bit 26
High
MIL-STD-1553B Receive Positive A
Telecommand Data 1
-
-
-
In
RMRXD[0]
GPIO[27]
In
Ethernet Receive Data 0
In
GPIO 1 Register, bit 27 (input only)
Copyright Aeroflex Gaisler AB
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Table 3. I/O switch matrix pin description, defining the order of priority for outputs and input/outputs, with the highest
priority for each pin listed first.
Pin no.
Pin name
Pin function
1553RXNA
TCACT[1]
RMRXD[1]
GPIO[28]
1553TXNA
-
Polarity
Reset value
Dir.
In
Description
188
SWMX[31]
Low
High
-
MIL-STD-1553B Receive Negative A
Telecommand Active 1
In
In
Ethernet Receive Data 1
-
In
GPIO 1 Register, bit 28 (input only)
MIL-STD-1553B Transmit Negative A
Proprietary, enabled by CAN
Ethernet Transmit Enable
185
SWMX[32]
Low
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
Out
Out
Out
In/Out
Out
Out
In/Out
In
RMTXEN
GPIO[29]
1553TXINHA
-
High
-
GPIO 1 Register, bit 29
184
183
SWMX[33]
SWMX[34]
High
MIL-STD-1553B Transmit Inhibit A
Proprietary, enabled by CAN
GPIO 1 Register, bit 30
GPIO[30]
1553RXB
TCRFAVL[1]
RMCRSDV
GPIO[31]
1553RXNB
TCCLK[2]
RMINTN
GPIO[32]
1553RXENB
A16MCS
RMMDIO
GPIO[33]
1553TXB
A16HS
-
High
High
High
-
MIL-STD-1553B Receive Positive B
Telecommand RF Available 1
Ethernet Carrier Sense / Data Valid
GPIO 1 Register, bit 31 (input only)
MIL-STD-1553B Receive Negative B
Telecommand Clock 2
In
In
In
182
179
178
SWMX[35]
SWMX[36]
SWMX[37]
Low
Rising
Low
-
In
In
In
Ethernet Management Interrupt
GPIO 2 Register, bit 0 (input only)
MIL-STD-1553B Receive Enable B
ASCS MCS - TM start/stop signal
Ethernet Media Interface Data
GPIO 2 Register, bit 1
In
High
High
-
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
Out
Out
In/Out
In/Out
Out
Out
Out
In/Out
In
-
High
High
-
MIL-STD-1553B Transmit Positive B
ASCS HS - TM/TC serial clock
Ethernet Media Interface Clock
GPIO 2 Register, bit 2
RMMDC
GPIO[34]
-
SpaceWire clock
divisor registers
-
At reset, bits 8 and 0 in the clock divisor reg-
ister of the SpaceWire interfaces are set from
this input
177
SWMX[38]
1553CK
-
In
MIL-STD-1553B Clock
TCD[2]
-
In
Telecommand Data 2
RMRFCLK
GPIO[35]
TCACT[2]
GPIO[36]
1553TXNB
A16DCS
GPIO[37]
-
In
Ethernet Reference Clock
GPIO 2 Register, bit 3 (input only)
Telecommand Active 2
-
In
176
175
SWMX[39]
SWMX[40]
High
In
-
In
GPIO 2 Register, bit 4 (input only)
MIL-STD-1553B Transmit Negative B
ASCS DCS - Slave data out
GPIO 2 Register, bit 5
Low
High-Z
High-Z
High-Z
Out
Out
In/Out
In
-
-
-
SpaceWire clock
divisor registers
At reset, bits 9 and 1 in the clock divisor reg-
ister of the SpaceWire interfaces are set from
this input
174
SWMX[41]
1553TXINHB
A16MAS
High
High
-
High-Z
High-Z
High-Z
Out
MIL-STD-1553B Transmit Inhibit B
ASCS MAS - TM start/stop signal
GPIO 2 Register, bit 6
Out
GPIO[38]
In/Out
Copyright Aeroflex Gaisler AB
February 2013, Issue 2.0
AEROFLEX GAISLER
11
GR712RC-DS
Table 3. I/O switch matrix pin description, defining the order of priority for outputs and input/outputs, with the highest
priority for each pin listed first.
Pin no.
Pin name
Pin function
TCRFAVL[2]
GPIO[39]
-
Polarity
Reset value
Dir.
In
Description
173
SWMX[42]
High
-
Telecommand RF Available 2
GPIO 2 Register, bit 7 (input only)
Proprietary, enabled by CAN
GPIO 2 Register, bit 8
In
172
SWMX[43]
High-Z
High-Z
Out
In/Out
In
GPIO[40]
-
-
SpaceWire clock
divisor registers
At reset, bits 10 and 2 in the clock divisor reg-
ister of the SpaceWire interfaces are set from
this input
169
166
SWMX[44]
SWMX[45]
SPICLK
SLO
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
Out
SPI Clock
-
Out
SLINK Data Out
GPIO 2 Register, bit 9
SPI Master Out Slave In
SLINK Clock
GPIO[41]
SPIMOSI
SLCLK
GPIO[42]
-
In/Out
Out
-
High
Out
-
-
In/Out
In
GPIO 2 Register, bit 10
SpaceWire clock
divisor registers
At reset, bits 11 and 3 in the clock divisor reg-
ister of the SpaceWire interfaces are set from
this input
165
164
163
162
161
160
SWMX[46]
SWMX[47]
SWMX[48]
SWMX[49]
SWMX[50]
SWMX[51]
TCCLK[3]
GPIO[43]
TCD[3]
Rising
In
Telecommand Clock 3
-
In
GPIO 2 Register, bit 11 (input only)
Telecommand Data 3
-
In
GPIO[44]
SDCASN
GPIO[45]
SDRASN
GPIO[46]
TCACT[3]
GPIO[47]
SPIMISO
TCRFAVL[3]
SLI
-
In
GPIO 2 Register, bit 12 (input only)
SDRAM Column Address Strobe
GPIO 2 Register, bit 13
Low
High-Z
High-Z
High-Z
High-Z
Out
In/Out
Out
In/Out
In
-
Low
SDRAM Row Address Strobe
GPIO 2 Register, bit 14
-
High
-
Telecommand Active 3
In
GPIO 2 Register, bit 15 (input only)
SPI Master In Slave Out
In
High
In
Telecommand RF Available 3
SLINK Data In
-
In
GPIO[48]
SDWEN
-
In
GPIO 2 Register, bit 16 (input only)
SDRAM Write Enable
157
155
SWMX[52]
SWMX[53]
Low
-
High-Z
High-Z
High-Z
Out
In/Out
Out
GPIO[49]
SDDQM[2]
GPIO 2 Register, bit 17
High
SDRAM Data Mask 2, corresponds to
DATA[23:16]
GPIO[50]
-
High-Z
High-Z
In/Out
Out
GPIO 2 Register, bit 18
154
SWMX[54]
SDDQM[3]
High
SDRAM Data Mask 3, corresponds to
DATA[31:24]
GPIO[51]
TCACT[4]
GPIO[52]
TCRFAVL[4]
GPIO[53]
I2CSDA
-
High-Z
In/Out
In
GPIO 2 Register, bit 19
Telecommand Active 4
GPIO 2 Register, bit 20 (input only)
Telecommand RF Available 4
GPIO 2 Register, bit 21 (input only)
I2C Serial Data
153
144
143
SWMX[55]
SWMX[56]
SWMX[57]
High
-
In
High
-
In
In
High-Z
High-Z
In/Out
In/Out
In
GPIO[54]
TCCLK[4]
I2CSCL
-
GPIO 2 Register, bit 22
Telecommand Clock 4
I2C Serial Clock
Rising
142
SWMX[58]
High-Z
High-Z
In/Out
In/Out
In
GPIO[55]
TCD[4]
-
-
GPIO 2 Register, bit 23
Telecommand Data 4
Copyright Aeroflex Gaisler AB
February 2013, Issue 2.0
AEROFLEX GAISLER
12
GR712RC-DS
Table 3. I/O switch matrix pin description, defining the order of priority for outputs and input/outputs, with the highest
priority for each pin listed first.
Pin no.
Pin name
Pin function
CB[8]
Polarity
Reset value
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
Dir.
Description
140
SWMX[59]
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
In/Out
In/Out
In/Out
In/Out
In/Out
In/Out
In/Out
In/Out
In/Out
In/Out
In/Out
In/Out
In/Out
In/Out
In/Out
In/Out
Reed-Solomon Check Bit 8
GPIO 2 Register, bit 24
Reed-Solomon Check Bit 9
GPIO 2 Register, bit 25
Reed-Solomon Check Bit 10
GPIO 2 Register, bit 26
Reed-Solomon Check Bit 11
GPIO 2 Register, bit 27
Reed-Solomon Check Bit 12
GPIO 2 Register, bit 28
Reed-Solomon Check Bit 13
GPIO 2 Register, bit 29
Reed-Solomon Check Bit 14
GPIO 2 Register, bit 30
Reed-Solomon Check Bit 15
GPIO 2 Register, bit 31
GPIO[56]
CB[9]
137
136
135
132
129
128
127
SWMX[60]
SWMX[61]
SWMX[62]
SWMX[63]
SWMX[64]
SWMX[65]
SWMX[66]
GPIO[57]
CB[10]
GPIO[58]
CB[11]
GPIO[59]
CB[12]
GPIO[60]
CB[13]
GPIO[61]
CB[14]
GPIO[62]
CB[15]
GPIO[63]
Copyright Aeroflex Gaisler AB
February 2013, Issue 2.0
AEROFLEX GAISLER
13
GR712RC-DS
Table 4. I/O switch matrix pin utilization per interface type
Interface type
Pin function
Direction
Total
In
Out
In/Out
SDRAM
SDDQM[3:0], SDCASN, SDRASN, SDWEN, SDCSN[1:0]
CB[15:8]
9
9
SDRAM Reed-Solomon
GPIO
8
8
GPIO[...]
26
6
38
64
12
16
10
UART
UART_TX[5:0], UART_RX[5:0]
6
8
4
SpaceWire
Ethernet
SPW_RXD[5:2], SPW_RXS[5:2], SPW_TXD[5:2], SPW_TXS[5:2]
RMTXD[1:0], RMTXEN, RMMDIO, RMMDC
RMRFCLK, RMRXD[0:1], RMCRSDV, RMINTN
CANTXA, CANRXA, CANTXB, CANRXB
8
5
1
CAN
4
5
4
8
8
MIL-STD-1553B BC/RT/BM 1553RXA, 1553RXNA, 1553RXENA, 1553TXA, 1553TXNA, 1553TXINHA
13
1553RXB, 1553RXNB, 1553RXENB, 1553TXB, 1553TXNB, 1553TXINHB
1553CK
I2C
I2CSDA, I2CSCL
2
2
SPI
SPICLK, SPIMOSI, SPIMISO
1
2
3
5
3
SLINK
SLI, SLO, SLSYNC, SLCLK
1
4
ASCS16
A16DASA, A16DASB, A16MCS, A16HS, A16DCS, A16MAS, A16ETR
TCACT[4:0], TCD[4:0], TCCLK[4:0], TCRFAV[4:0]
TMDO, TMCLKO, TMCLKI
2
7
CCSDS/ECSS TC
CCSDS/ECSS TM
20
1
20
3
2
Copyright Aeroflex Gaisler AB
February 2013, Issue 2.0
AEROFLEX GAISLER
14
GR712RC-DS
Table 5. I/O switch matrix pins listed per function, including supporting signals outside the I/O switch matrix.
Pin no.
157
Pin name
Pin function
SDWEN
Polarity
Low
Reset value
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
Dir.
Out
Out
Out
Out
Out
Out
Description
SWMX[52]
SWMX[48]
SWMX[49]
SWMX[12]
SWMX[13]
SWMX[24]
SDRAM Write Enable
SDRAM Column Address Strobe
SDRAM Row Address Strobe
SDRAM Select 0
163
SDCASN
SDRASN
SDCSN[0]
SDCSN[1]
SDDQM[0]
Low
162
Low
228
Low
227
Low
SDRAM Select 1
197
High
SDRAM Data Mask 0, corresponds to
DATA[7:0]
196
155
154
SWMX[25]
SWMX[53]
SWMX[54]
SDDQM[1]
SDDQM[2]
SDDQM[3]
High
High
High
High-Z
High-Z
High-Z
Out
Out
Out
SDRAM Data Mask 1, corresponds to
DATA[15:8]
SDRAM Data Mask 2, corresponds to
DATA[23:16]
SDRAM Data Mask 3, corresponds to
DATA[31:24]
140
137
136
135
132
129
128
127
SWMX[59]
SWMX[60]
SWMX[61]
SWMX[62]
SWMX[63]
SWMX[64]
SWMX[65]
SWMX[66]
ADDRESS[16:2]
DATA[31:0]
CB[7:0]
CB[8]
-
-
-
-
-
-
-
-
-
-
-
-
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
Low
In/Out
In/Out
In/Out
In/Out
In/Out
In/Out
In/Out
In/Out
Out
Check Bit 8, Reed-Solomon
Check Bit 9, Reed-Solomon
Check Bit 10, Reed-Solomon
Check Bit 11, Reed-Solomon
Check Bit 12, Reed-Solomon
Check Bit 13, Reed-Solomon
Check Bit 14, Reed-Solomon
Check Bit 15, Reed-Solomon
Memory address
CB[9]
CB[10]
CB[11]
CB[12]
CB[13]
CB[14]
CB[15]
ADDRESS[16:2]
DATA[31:0]
CB[7:0]
MCFG3[8]
High-Z
High-Z
In/Out
In/Out
In
Memory data bus
Memory checkbits
240
238
SWMX[4]
At reset, bit 8 in MCFG3 register in the
memory controller is set from this input.
SWMX[6]
MCFG1[9]
-
In
At reset, bit 9 in MCFG1 register in the
memory controller is set from this input
4
SWMX[0]
UART_TX[0]
UART_RX[0]
UART_TX[1]
UART_RX[1]
UART_TX[2]
UART_RX[2]
UART_TX[3]
UART_RX[3]
UART_TX[4]
UART_RX[4]
UART_TX[5]
UART_RX[5]
SPW_RXD[0]
SPW_RXS[0]
SPW_TXD[0]
SPW_TXS[0]
SPW_RXD[1]
SPW_RXS[1]
SPW_TXD[1]
SPW_TXS[1]
SPW_RXD[2]
-
High
Out
In
UART Transmit 0
3
SWMX[1]
-
UART Receive 0
2
SWMX[2]
-
High
Out
In
UART Transmit 1
1
SWMX[3]
-
UART Receive 1
240
239
238
233
232
231
230
229
213
214
215
216
204
205
206
209
217
SWMX[4]
-
High-Z
High-Z
High-Z
High-Z
Out
In
UART Transmit 2
SWMX[5]
-
UART Receive 2
SWMX[6]
-
Out
In
UART Transmit 3
SWMX[7]
-
UART Receive 3
SWMX[8]
-
Out
In
UART Transmit 4
SWMX[9]
-
UART Receive 4
SWMX[10]
SWMX[11]
SPW_RXD[0]
SPW_RXS[0]
SPW_TXD[0]
SPW_TXS[0]
SPW_RXD[1]
SPW_RXS[1]
SPW_TXD[1]
SPW_TXS[1]
SWMX[19]
-
Out
In
UART Transmit 5
-
UART Receive 5
High
High
High
High
High
High
High
High
High
In
SpaceWire Receive Data 0
SpaceWire Receive Strobe 0
SpaceWire Transmit Data 0
SpaceWire Transmit Strobe 0
SpaceWire Receive Data 1
SpaceWire Receive Strobe 1
SpaceWire Transmit Data 1
SpaceWire Transmit Strobe 1
SpaceWire Receive Data 2
In
Low
Low
Out
Out
In
In
Low
Low
Out
Out
In
Copyright Aeroflex Gaisler AB
February 2013, Issue 2.0
AEROFLEX GAISLER
15
GR712RC-DS
Table 5. I/O switch matrix pins listed per function, including supporting signals outside the I/O switch matrix.
Pin no.
218
219
220
200
201
202
203
225
226
227
228
192
193
197
196
178
175
172
166
185
191
190
189
188
183
182
179
178
177
220
218
219
217
191
190
185
184
172
177
184
190
185
191
189
188
174
178
Pin name
Pin function
SPW_RXS[2]
SPW_TXD[2]
SPW_TXS[2]
SPW_RXD[3]
SPW_RXS[3]
SPW_TXD[3]
SPW_TXS[3]
SPW_RXD[4]
SPW_RXS[4]
SPW_TXD[4]
SPW_TXS[4]
SPW_RXD[5]
SPW_RXS[5]
SPW_TXD[5]
SPW_TXS[5]
Polarity
Reset value
Dir.
In
Description
SWMX[18]
SWMX[17]
SWMX[16]
SWMX[23]
SWMX[22]
SWMX[21]
SWMX[20]
SWMX[15]
SWMX[14]
SWMX[13]
SWMX[12]
SWMX[27]
SWMX[26]
SWMX[24]
SWMX[25]
SWMX[37]
SWMX[40]
SWMX[43]
SWMX[45]
SWMX[32]
SWMX[28]
SWMX[29]
SWMX[30]
SWMX[31]
SWMX[34]
SWMX[35]
SWMX[36]
SWMX[37]
SWMX[38]
SWMX[16]
SWMX[18]
SWMX[17]
SWMX[19]
SWMX[28]
SWMX[29]
SWMX[32]
SWMX[33]
SWMX[43]
SWMX[38]
SWMX[33]
SWMX[29]
SWMX[32]
SWMX[28]
SWMX[30]
SWMX[31]
SWMX[41]
SWMX[37]
High
SpaceWire Receive Strobe 2
SpaceWire Transmit Data 2
SpaceWire Transmit Strobe 2
SpaceWire Receive Data 3
High
High-Z
High-Z
Out
Out
In
High
High
High
In
SpaceWire Receive Strobe 3
SpaceWire Transmit Data 3
SpaceWire Transmit Strobe 3
SpaceWire Receive Data 4
High
High-Z
High-Z
Out
Out
In
High
High
High
In
SpaceWire Receive Strobe 4
SpaceWire Transmit Data 4
SpaceWire Transmit Strobe 4
SpaceWire Receive Data 5
High
High-Z
High-Z
Out
Out
In
High
High
High
In
SpaceWire Receive Strobe 5
SpaceWire Transmit Data 5
SpaceWire Transmit Strobe 5
At reset, bits 8 & 0 are set from this input
At reset, bits 9 & 1 are set from this input
At reset, bits 10 & 2 are set from this input
At reset, bits 11 & 3 are set from this input
Ethernet Transmit Enable
High
High-Z
High-Z
Out
Out
In
High
SpaceWire clock
divisor registers
values at reset, all
other bits are zero.
-
-
In
-
In
-
In
RMTXEN
RMTXD[0]
RMTXD[1]
RMRXD[0]
RMRXD[1]
RMCRSDV
RMINTN
RMMDIO
RMMDC
RMRFCLK
CANTXA
CANRXA
CANTXB
CANRXB
-
High
High-Z
High-Z
High-Z
Out
Out
Out
In
-
Ethernet Transmit Data 0
-
Ethernet Transmit Data 1
-
Ethernet Receive Data 0
-
In
Ethernet Receive Data 1
High
In
Ethernet Carrier Sense / Data Valid
Ethernet Management Interrupt
Ethernet Media Interface Data
Ethernet Media Interface Clock
Ethernet Reference Clock
Low
In
-
-
-
-
-
-
-
High-Z
High-Z
In/Out
Out
In
High-Z
High-Z
Out
In
CAN Transmit A
CAN Receive A
Out
In
CAN Transmit B
CAN Receive B
High-Z
High-Z
High-Z
High-Z
High-Z
Out
Out
Out
Out
Out
In
Proprietary, enabled by CAN
Proprietary, enabled by CAN
Proprietary, enabled by CAN
Proprietary, enabled by CAN
Proprietary, enabled by CAN
MIL-STD-1553B Clock
-
-
-
-
1553CK
-
1553TXINHA
1553TXA
1553TXNA
1553RXENA
1553RXA
1553RXNA
1553TXINHB
1553TXB
High
High
Low
High
High
Low
High
High
High-Z
High-Z
High-Z
High-Z
Out
Out
Out
Out
In
MIL-STD-1553B Transmit Inhibit A
MIL-STD-1553B Transmit Positive A
MIL-STD-1553B Transmit Negative A
MIL-STD-1553B Receive Enable A
MIL-STD-1553B Receive Positive A
MIL-STD-1553B Receive Negative A
MIL-STD-1553B Transmit Inhibit B
MIL-STD-1553B Transmit Positive B
In
High-Z
High-Z
Out
Out
Copyright Aeroflex Gaisler AB
February 2013, Issue 2.0
AEROFLEX GAISLER
16
GR712RC-DS
Table 5. I/O switch matrix pins listed per function, including supporting signals outside the I/O switch matrix.
Pin no.
175
179
183
182
143
142
169
166
160
203
166
160
169
226
225
202
175
174
179
178
229
226
225
193
188
192
189
183
176
182
177
173
161
165
164
160
153
143
142
144
231
230
232
Pin name
Pin function
1553TXNB
1553RXENB
1553RXB
1553RXNB
I2CSDA
Polarity
Low
Reset value
High-Z
Dir.
Out
Out
In
Description
SWMX[40]
SWMX[36]
SWMX[34]
SWMX[35]
SWMX[57]
SWMX[58]
SWMX[44]
SWMX[45]
SWMX[51]
SWMX[20]
SWMX[45]
SWMX[51]
SWMX[44]
SWMX[14]
SWMX[15]
SWMX[21]
SWMX[40]
SWMX[41]
SWMX[36]
SWMX[37]
SWMX[11]
SWMX[14]
SWMX[15]
SWMX[26]
SWMX[31]
SWMX[27]
SWMX[30]
SWMX[34]
SWMX[39]
SWMX[35]
SWMX[38]
SWMX[42]
SWMX[50]
SWMX[46]
SWMX[47]
SWMX[51]
SWMX[55]
SWMX[57]
SWMX[58]
SWMX[56]
SWMX[9]
MIL-STD-1553B Transmit Negative B
MIL-STD-1553B Receive Enable B
MIL-STD-1553B Receive Positive B
MIL-STD-1553B Receive Negative B
I2C Serial Data
High
High-Z
High
Low
In
High-Z
High-Z
High-Z
High-Z
In/Out
In/Out
Out
Out
In
I2CSCL
I2C Serial Clock
SPICLK
SPI Clock
SPIMOSI
SPIMISO
SLSYNC
SLCLK
-
SPI Master Out Slave In
SPI Master In Slave Out
SLINK SYNC
High
High
-
High-Z
High-Z
Out
Out
In
SLINK Clock
SLI
SLINK Data In
SLO
-
High-Z
Out
In
SLINK Data Out
A16DASA
A16DASB
A16ETR
-
ASCS DAS A - Slave data in
ASCS DAS B - Slave data in
ASCS ETR - Synchronization signal
ASCS DCS - Slave data out
ASCS MAS - TM start/stop signal
ASCS MCS - TC start/stop signal
ASCS HS - TM/TC serial clock
Telecommand Active 0
Telecommand Clock 0
Telecommand Data 0
-
In
High
-
High-Z
High-Z
High-Z
High-Z
High-Z
Out
Out
Out
Out
Out
In
A16DCS
A16MAS
A16MCS
A16HS
High
High
High
High
Rising
-
TCACT[0]
TCCLK[0]
TCD[0]
In
In
TCRFAVL[0]
TCACT[1]
TCCLK[1]
TCD[1]
High
High
Rising
-
In
Telecommand RF Available 0
Telecommand Active 1
Telecommand Clock 1
Telecommand Data 1
In
In
In
TCRFAVL[1]
TCACT[2]
TCCLK[2]
TCD[2]
High
High
Rising
-
In
Telecommand RF Available 1
Telecommand Active 2
Telecommand Clock 2
Telecommand Data 2
In
In
In
TCRFAVL[2]
TCACT[3]
TCCLK[3]
TCD[3]
High
High
Rising
-
In
Telecommand RF Available 2
Telecommand Active 3
Telecommand Clock 3
Telecommand Data 3
In
In
In
TCRFAVL[3]
TCACT[4]
TCCLK[4]
TCD[4]
High
High
Rising
-
In
Telecommand RF Available 3
Telecommand Active 4
Telecommand Clock 4
Telecommand Data 4
In
In
In
TCRFAVL[4]
TMCLKI
TMCLKO
TMDO
High
Rising
-
In
Telecommand RF Available 4
Telemetry Clock Input
Telemetry Clock Output
Telemetry Data Out
In
SWMX[10]
SWMX[8]
High-Z
High-Z
Out
Out
-
Copyright Aeroflex Gaisler AB
February 2013, Issue 2.0
AEROFLEX GAISLER
17
GR712RC-DS
Table 6. Conflicting interfaces in the I/O switch matrix are marked with an X, with duplicates shown in bold typeface.
SDRAM (with RS)
UART 0
-
X
X
-
UART 1
-
UART 2
-
UART 3
-
UART 4
-
X
X
UART 5
-
X
SpaceWire 0
SpaceWire 1
SpaceWire 2
SpaceWire 3
SpaceWire 4
SpaceWire 5
Ethernet
-
-
-
X
X
X
-
X
X
X
-
X
X
-
X
-
X
X
X
X
CAN
X
X
X
X
-
MIL-STD-1553B
I2C
-
X
X
X
-
X
SPI
-
X
X
X
SLINK
X
X
-
ASCS
X
X
X
-
X
CCSDS TC 0
CCSDS TC 1
CCSDS TC 2
CCSDS TC 3
CCSDS TC 4
CCSDS TM
X
X
X
X
X
-
X
X
X
X
-
-
X
X
-
X
-
X
-
Copyright Aeroflex Gaisler AB
February 2013, Issue 2.0
AEROFLEX GAISLER
18
GR712RC-DS
2
Electrical characteristics
2.1
Absolute maximum ratings
These values specify the stress that might apply to the device without causing it permanent damage.
Table 7. Absolute maximum ratings 1)
Symbol
Parameter
Rating
Units
Min.
Max.
VDDIO
VDD
VIN
DC Supply Voltage for I/O
DC Supply Voltage for Core
Input Voltage
-0.3
4.2
V
V
-0.3
-0.3
-65
-55
2.4
VDDIO + 0.3
+150
+125
+250
+150
4
V
Tstor
Tcase
Tsolder
Tj
Storage Temperature
˚C
Operating Case Temperature
Lead Temperature (Soldering 10 sec.)
Junction Temperature
˚C
˚C
˚C
ΘJC (ceramic) Thermal Resistance, Junction to Case
˚C/W
W
PD
Power Dissipation
6.25
Note 1:
Extended operation at the maximum levels may degrade the performance and affect the reliability of the
device.
2.2
Recommended operating conditions
Table 8. Recommended operating conditions
Symbol
Parameter
Rating
Units
Min.
Typ.
Max.
VDDIO
VDD
DC Supply Voltage for I/O
DC Supply Voltage for Core
Input Voltage
3.0
3.3
3.6
V
V
1.65
0
1.8
1.95
VDDIO
+125
VIN
V
Tcase
Operating Case Temperature
-55
0.4
˚C
Slew rate of all inputs 1)
SLIN
Note 1:
V/ns
Applies only to the range 0.8 V and 2.0 V.
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2.3
DC electrical performance characteristics
Table 9. DC characteristics (VDD = 1.8 V +/- 0.15 V, VDDIO = 3.3 V +/- 0.3 V, Tcase = -55˚C to +125˚C)
Symbol Parameter
Condition
Rating
Typ.
Units
Min.
Max.
Output High Voltage 1)
IOH = -4 mA 2)
IOH = -6 mA 3)
VOH
2.4
V
V
VOL
Output Low Voltage
0.5
IOL = 4 mA 2)
IOL = 6 mA 3)
VIH
Input High Voltage
Input Low Voltage
Input Leakage Current
2.0
V
V
VIL
0.8
10
10
IILEAK
-10
-10
uA
uA
IOLEAK Output Leakage Current
outputs at
tri-state
120 5)
IOS
Short-circuit Output Current
VO = VDDIO
,
mA
VDDIO = 3.6 V
-120 5)
VO = 0 V,
VDDIO = 3.6 V
IDDS
IDD
Core Static Current
Core Supply Current
FCLK = 0 MHz
1
mA
A
10
2.0 5)
2
FCLK = 100 MHz
0.9
0.2
I/O Static Current 4)
IDDIOS
FCLK = 0 MHz
VDDIO = 3.6 V
mA
I/O Supply Current 6)
I/O Pad Capacitance 5)
IDDIO
CI/O
mA
pF
15
Note 1: Except open-drain outputs ERRORN, WDOGN, I2CSCL and I2CSDA.
Note 2: All outputs defined with a maximum load of 50 pF.
Note 3: All outputs defined with a maximum load of 100 pF.
Note 4: All inputs at 0 V or VDDIO. No resistive load.
Note 5: Supplied as a design limit. Parameter not measured during production test.
Note 6: The dynamic power consumption of the I/O supply can be calculated as a function of the average frequency and
2
the capacitive load of each output i: sum of [FI/O * CLOAD (i) * (VDDIO)
]
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Table 10. Detailed core power consumption (VDD = 1.8 V +/- 0.15 V, VDDIO = 3.3 V +/- 0.3 V, Tcase = -55˚C to +125˚C)
Test condition
Rating
Units
1)
Typ.
Max.
Static, no clocks or toggling signals
30
4
50
6
mW
Standby, all cores clock gated
mW/MHz
mW/MHz
mW/MHz
mW/MHz
mW/MHz
mW/MHz
mW/MHz
1 processor core active at 50%, remaining IP cores clock gated
1 processor core active at 100%, remaining IP cores clock gated
2 processor cores active at 100%, remaining IP cores clock gated
1 SpaceWire link active @ 100 Mbit/s
7
10
15
24
1.5
1.5
1
10
15
1
2 CAN interfaces active 100% @ 1 Mbit/s
1
Telemetry encoder active @ 10 Mbit/s
0.5
Note 1: Supplied as a design limit. Parameter not measured during production test.
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2.4
AC electrical performance characteristics
All measured AC parameters have been tested with a 50 pF - 70 pF capacitive load on the outputs.
Transition time measurements have been tested at a voltage level of 1.4 V. Equivalent load chart is
provided in the product specification [PS.]
2.4.1 Clock
The timing waveforms and timing parameters are shown in figure 3 and are defined in table 11.
TINCLK
INCLK
Figure 3. Timing waveforms
Table 11. Timing parameters (VDD = 1.8 V +/- 0.15 V, VDDIO = 3.3 V +/- 0.3 V, Tcase = -55˚C to +125˚C)
Name
Parameter
Reference
INCLK
Min
10
Max
-
Unit
ns
TINCLK
input clock period without DLL
input clock frequency without DLL 2)
input clock high phase without DLL 5)
input clock low phase without DLL 5)
input clock period with DLL 1)
input clock frequency with DLL 1) 2)
input frequency duty cycle with DLL
input clock high phase with DLL 5)
input clock low phase with DLL 5)
FINCLK
INCLK
INCLK
INCLK
INCLK
INCLK
INCLK
INCLK
INCLK
-
-
100
MHz
ns
TINCLK_HIGH
TINCLK_LOW
TINCLK
4.5
4.5
20
ns
22 3)
50
ns
46 3)
35
FINCLK
MHz
%
DCINCLK
TINCLK_HIGH
TINCLK_LOW
TCLK
65
7
ns
7
ns
4) 5) 6)
10
-
-
ns
internal system clock period
internal system clock frequency 2) 4) 5) 6)
FCLK
-
100
MHz
Note 1:
Note 2:
For the system clock, the DLL provides a times 2 multiplication of the input frequency.
TINCLK = 1/FINCLK, TCLK = 1/FCLK
Note 3:
Note 4:
Parameter not measured during production test.
Applies to the system clock only (i.e. processor and AMBA clock) only. SpaceWire clocks are dis-
cussed in section 2.4.9.
Note 5:
The maximum internal system clock frequency is specified by the parameters TCLK and FCLK.
The parameters TINCLK and FINCLK specify the what the clock input pin and the DLL can support,
and not what the internal logic can support.
Note 6:
The internal system clock frequency is limited by the timing of the memory interface towards external
synchronous memory components.
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2.4.2 Reset and initialization
The timing waveforms and timing parameters are shown in figure 4 and are defined in table 12.
INCLK
RESETN
tRSTGEN0
Figure 4. Timing waveforms
Table 12. Timing parameters (VDD = 1.8 V +/- 0.15 V, VDDIO = 3.3 V +/- 0.3 V, Tcase = -55˚C to +125˚C)
Name
Parameter
Reference edge Min
10
Max
-
Unit
tRSTGEN0
asserted period
-
TINCLK periods
Note 1:
Note 2:
The RESETN input is re-synchronized internally.
VDD must reach at least minimum operating voltage for tRESTGEN0 before RESETN is de-asserted.
If DLL is used, the internal reset is released 2048 TINCLK periods after RESETN is de-asserted
After power-up all flip-flops, on-chip memory and DLL are in an unknown state before reset.
Note 3:
Note 4:
2.4.3 LEON3 - High-performance SPARC V8 32-bit Processor
The timing waveforms and timing parameters are shown in figure 5 and are defined in table 13.
INCLK
tLEON0
tLEON1
ERRORN
Figure 5. Timing waveforms
Table 13. Timing parameters (VDD = 1.8 V +/- 0.15 V, VDDIO = 3.3 V +/- 0.3 V, Tcase = -55˚C to +125˚C)
Name
Parameter
Reference edge
Min
2 1)
Max
23 2)
50 1)
Unit
ns
tLEON0
clock to output delay
rising INCLK edge
tLEON1
clock to output tri-state
rising INCLK edge
ns
Note 1:
Note 2:
Note 3:
Parameter not measured during production test.
Parameter measured during production test without DLL enabled.
For correct operation, the signal should be pulled-up externally with 1- 10 kOhm. GR712RC does
not include any internal pull-up resistors.
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2.4.4 Fault tolerant memory controller
The timing waveforms and timing parameters are shown in figure 6 and are defined in table 14.
SDCLK
tFTMCTRL0
ADDRESS[23:0]
tFTMCTRL1
tFTMCTRL2
tFTMCTRL2
tFTMCTRL1
tFTMCTRL2
tFTMTRL2
RAMSN[1:0]
ROMSN[1:0]
RAMWEN, WRITEN
READ
tFTMCTRL3, FTMCTRL4
t
DATA[31:0], CB[7:0]
(output)
tFTMCTRL5
SDCLK
ADDRESS[23:0]
RAMSN[1:0]
ROMSN[1:0]
tFTMCTRL6
tFTMCTRL6
RAMOEN, OEN
READ
tFTMCTRL7
tFTMCTRL8
DATA[31:0], CB[7:0]
(input)
tFTMCTRL10
tFTMCTRL9
BRDYN, BEXCN
Figure 6. Timing waveforms - SRAM (0 wait state) access, PROM (0 wait state) access
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The timing waveforms and timing parameters are shown in figure 7 and are defined in table 14.
SDCLK
tFTMCTRL0
ADDRESS[23:0]
tFTMCTRL1
tFTMCTRL2
tFTMCTRL1
tFTMCTRL2
tFTMCTRL2
IOSN
RAMWEN, WRITEN
READ
tFTMCTRL2
tFTMCTRL3, FTMCTRL4
t
DATA[31:0]
(output)
tFTMCTRL5
SDCLK
ADDRESS[23:0]
IOSN
tFTMCTRL6
tFTMCTRL6
OEN
READ
tFTMCTRL8
tFTMCTRL7
DATA[31:0]
(input)
tFTMCTRL10
tFTMCTRL9
BRDYN, BEXCN
Figure 7. Timing waveforms - I/O accesses
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Table 14. Timing parameters (VDD = 1.8 V +/- 0.15 V, VDDIO = 3.3 V +/- 0.3 V, Tcase = -55˚C to +125˚C)
Name
Parameter
Reference edge 2)
Min
0 1)
0 1)
Max
Unit
address clock to output delay 3)
tFTMCTRL0
rising SDCLK edge
7.5
ns
tFTMCTRL1
clock to RAMSN[1:0] and
ROMSN[1:0]output delay 3)
rising SDCLK edge
7.5
ns
clock to IOSN output delay 3)
clock to output delay
0 1)
0 1)
0 1)
0 1)
0 1)
tFTMCTRL1
tFTMCTRL2
tFTMCTRL3
tFTMCTRL4
tFTMCTRL5
tFTMCTRL6
tFTMCTRL7
tFTMCTRL8
tFTMCTRL9
tFTMCTRL10
rising SDCLK edge
rising SDCLK edge
rising SDCLK edge
rising SDCLK edge
rising SDCLK edge
rising SDCLK edge
rising SDCLK edge
rising SDCLK edge
rising SDCLK edge
rising SDCLK edge
8.5
8.5
6.5
6.5
ns
ns
ns
ns
clock to data output delay
clock to data non-tri-state delay
clock to data tri-state delay 4)
clock to output delay
6.5 1)
8.5
ns
ns
0 1)
6.9
data input to clock setup
data input from clock hold
input to clock setup
-
-
-
-
ns
ns
ns
ns
-0.5 1)
6.9
-0.5 1)
input from clock hold
Note 1:
Note 2:
Note 3:
Parameter not measured during production test.
The specified timing is valid for the default programmable internal clock delay of value 0.
The ADDRESS[23:0] and RAMSN[1:0] signals change in the same clock cycle, which might not be
compatible with all SRAM types. Check your SRAM documentation for compatibility.
Note 4:
GR712RC does not provide internal pull-up resistors on the DATA[31:0] and CB[15:0] buses. In the
case of prolonged periods of idle bus activity in a board design, i.e. high impedance state, it is
advised to add external pull-up resistors.
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The timing waveforms and timing parameters are shown in figure 8 and are defined in table 15.
SDCLK
tFTMCTRL11
SDCASN, SDRASN
SDWEN, SDCSN[1:0]
SDDQM[3:0]
write
nop
read
nop
nop
term
nop
nop
nop
tFTMCTRL11
ADDRESS[16:2]
tFTMCTRL12
tFTMCTRL14
tFTMCTRL13
DATA[31:0], CB[15:0]
tFTMCTRL15
Figure 8. Timing waveforms - SDRAM accesses
Table 15. Timing parameters (VDD = 1.8 V +/- 0.15 V, VDDIO = 3.3 V +/- 0.3 V, Tcase = -55˚C to +125˚C)
Name
Parameter
Reference edge 2)
Min
1 1)
Max
Unit
tFTMCTRL11
clock to output delay
rising SDCLK edge
6
ns
1 1)
tFTMCTRL12
tFTMCTRL13
tFTMCTRL14
tFTMCTRL15
clock to data output delay
data clock to data tri-state delay
data input to clock setup
rising SDCLK edge
rising SDCLK edge
rising SDCLK edge
rising SDCLK edge
6.5
ns
ns
ns
ns
1 1)
6.9
6.5 1)
-
-0.5 1)
data input from clock hold
-
Note 1:
Note 2:
Note 3:
Parameter not measured during production test.
The specified timing is valid for the default programmable internal clock delay of value 0.
The maximum operating frequency of the GR712RC may be limited due to the timing performance
of external SDRAM devices.
The timing waveforms and timing parameters are shown in figure 9 and are defined in table 16.
TSDCLK0, TSDCLK51
INCLK
SDCLK
Figure 9. Timing waveforms
Table 16. Timing parameters (VDD = 1.65 V, VDDIO = 3.0 V, Tcase = +125˚C) 1)
Name
Parameter
Reference
Min
7
Max
10
Unit
ns
TSDCLK0
clock to output delay, delay value 0
rising INCLK edge
TSDCLK51
Note 1:
clock to output delay, delay value 51
rising INCLK edge
25
ns
16
Production test performed at fixed voltage and temperature.
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2.4.5 JTAG Debug Interface
The timing waveforms and timing parameters are shown in figure 10 and are defined in table 17.
tAHBJTAG0
tAHBJTAG1
TCK
tAHBJTAG2
TDI, TMS
TDO
tAHBJTAG4
tAHBJTAG3
Figure 10. Timing waveforms
Table 17. Timing parameters (VDD = 1.8 V +/- 0.15 V, VDDIO = 3.3 V +/- 0.3 V, Tcase = -55˚C to +125˚C)
Name
Parameter
Reference edge
Min
Max
Unit
tAHBJTAG0
clock period
-
100
-
ns
tAHBJTAG1
tAHBJTAG2
tAHBJTAG3
tAHBJTAG4
clock low/high period
-
40
-
ns
ns
ns
ns
10 1)
10 1)
0 1)
data input to clock setup
data input from clock hold
clock to data output delay
rising TCK edge
rising TCK edge
falling TCK edge
-
-
21
Note 1:
Note 2:
Parameter not measured during production test.
For correct operation, all JTAG signals should be pulled-up externally with 1 - 10 kOhm. This is in
line with the TAP specification where TMS and TDI implementation should be such that if an exter-
nal signal fails (e.g. open circuit) then the behavior of TMS and TDI should be equivalent to a logi-
cal 1 input. GR712RC does not include any internal pull-up resistors.
2.4.6 General Purpose Timer Unit
The timing waveforms and timing parameters are shown in figure 11 and are defined in table 18.
INCLK
tGPTIMER0
tGPTIMER1
WDOGN
Figure 11. Timing waveforms
Table 18. Timing parameters (VDD = 1.8 V +/- 0.15 V, VDDIO = 3.3 V +/- 0.3 V, Tcase = -55˚C to +125˚C)
Name
Parameter
Reference edge
Min
Max
23 2)
50 1)
Unit
2 1)
tGPTIMER0
clock to output delay
rising INCLK edge
ns
tGPTIMER1
clock to output tri-state
rising INCLK edge
ns
Note 1:
Note 2:
Note 3:
Parameter not measured during production test.
Parameter measured during production test without DLL enabled.
For correct operation, the signal should be pulled-up externally with 1 - 10 kOhm. GR712RC does
not include any internal pull-up resistors.
Note 4:
WDOGN output is undefined during internal reset when DLL is used to generate the internal system
clock frequency. See section 2.4.2 for detailed timing information on the reset behavior.
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2.4.7 General Purpose Input Output Port
The timing waveforms and timing parameters are shown in figure 12 and are defined in table 19.
INCLK
GPIO[...]
tGRGPIO0
tGRGPIO0
(output)
tGRGPIO1
tGRGPIO2
GPIO[...]
(output)
GPIO[...]
tGRGPIO3
tGRGPIO4
(input)
Figure 12. Timing waveforms
Table 19. Timing parameters (VDD = 1.8 V +/- 0.15 V, VDDIO = 3.3 V +/- 0.3 V, Tcase = -55˚C to +125˚C)
Name
Parameter
Reference edge
Min
2 1)
Max
21 2)
21 1)
Unit
tGRGPIO0
clock to output delay
rising INCLK edge
ns
2 1)
tGRGPIO1
tGRGPIO2
tGRGPIO3
tGRGPIO4
clock to non-tri-state delay
clock to tri-state delay
input to clock hold
rising INCLK edge
rising INCLK edge
rising INCLK edge
rising INCLK edge
ns
ns
50 1)
-
ns 3)
ns 3)
-
-
input to clock setup
-
Note 1:
Note 2:
Note 3:
Parameter not measured during production test.
Parameter measured during production test without DLL enabled.
The GPIO[...] inputs are re-synchronized to the internal system clock with a TCLK period.
2.4.8 UART Serial Interface
The timing waveforms and timing parameters are shown in figure 13 and are defined in table 20.
INCLK
UART_TX[5:0]
UART_RX[5:0]
tAPBUART0
tAPBUART0
tAPBUART1
tAPBUART2
Figure 13. Timing waveforms
Table 20. Timing parameters (VDD = 1.8 V +/- 0.15 V, VDDIO = 3.3 V +/- 0.3 V, Tcase = -55˚C to +125˚C)
Name
Parameter
Reference edge
Min
Max
Unit
2 1)
-
21 2)
-
tAPBUART0
clock to output delay
rising INCLK edge
ns
ns 3)
ns 3)
tAPBUART1
tAPBUART2
input to clock hold
input to clock setup
rising INCLK edge
rising INCLK edge
-
-
Note 1:
Note 2:
Note 3:
Parameter not measured during production test.
Parameter measured during production test without DLL enabled.
The UART_RX[5:0] inputs are re-synchronized to the internal system clock with a TCLK period.
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2.4.9 SpaceWire Interface
The timing waveforms and timing parameters are shown in figure 14 and are defined in table 21.
TSPWCLK
SPWCLK
tSPW2
tSPW2
SPW_TXD[5:0]
SPW_TXS[5:0]
tSPW2
tSPW3
SPW_TXD[5:0]
SPW_TXS[5:0]
tSPW4, SPW6
t
tSPW4, SPW6
t
SPW_RXD[5:0]
SPW_RXS[5:0]
tSPW4, SPW6
t
tSPW5
SPW_RXD[5:0]
SPW_RXS[5:0]
Figure 14. Timing waveforms
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Table 21. Timing parameters transmitter (VDD = 1.8 V +/- 0.15 V, VDDIO = 3.3 V +/- 0.3 V, Tcase = -55˚C to +125˚C)
Name
Parameter
Reference edge
Min
Max
Unit
input clock period without DLL 5)
input clock frequency without DLL 2)
input frequency duty cycle without DLL 5)
input clock period with DLL x2 1) 6)
10 4)
-
TSPWCLK
SPWCLK
-
ns
100 4)
55
FSPWCLK
DCSPWCLK
TSPWCLK
FSPWCLK
TSPWCLK
FSPWCLK
DCSPWCLK
TSPW
SPWCLK
MHz
%
SPWCLK
45
20
22 4)
50
SPWCLK
ns
1) 2)
45 4)
20
SPWCLK
MHz
ns
input clock frequency with DLL x2
input clock period with DLL x4 1) 6)
22 4)
50
SPWCLK
input clock frequency with DLL x4 1) 2)
input frequency duty cycle with DLL
45 4)
SPWCLK
MHz
%
35 4)
5
65 4)
SPWCLK
internal transmitter clock period 6)
500 4)
200
-
-
-
-
-
-
-
ns
internal transmitter clock frequency 2) 6)
output data bit period
2 4)
FSPW
MHz
ns
5 4)
-
500 4)
500 4)
500 4)
tSPW2
tSPW3
data & strobe output skew & jitter
input data bit period
ps
5 4)
-
tSPW4
ns
800 4)
-
tSPW5
data & strobe input skew, jitter & hold
ps
data & strobe edge separation 5)
2500 4)
tSPW6
ps
Note 1:
For the internal SpaceWire clock, the DLL provides a times 2 or 4 multiplication of the input fre-
quency.
Note 2:
TSPWCLK = 1/FSPWCLK, TSPW = 1/FSPW
Note 3:
Note 4:
Note 5:
N/A
Parameter not measured during production test.
Minimum internal edge separation equals half the internal transmitter clock period. Minimum tSPW6 is
specified at minimum TSPW with 50% duty cycle. External edge separation should not be less than the
sum of tSPW5 + tSPW6
.
Note 6:
Note 7:
The maximum SpaceWire clock frequency is specified by the parameters TSPW and FSPW
.
The parameters TSPWCLK and FSPWCLK specify the what the clock input pin and the DLL can support,
and not what the internal logic can support.
The parameters tSPWn are only valid between signals belonging to one SpaceWire link.
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2.4.10 Ethernet Media Access Controller (MAC)
The timing waveforms and timing parameters are shown in figure 15 and are defined in table 22.
RMRFCLK
RMTXD[1:0], RMTXEN
tGRETH0
tGRETH0
RMRXD[1:0]
tGRETH1
tGRETH2
Figure 15. Timing waveforms
Table 22. Timing parameters (VDD = 1.8 V +/- 0.15 V, VDDIO = 3.3 V +/- 0.3 V, Tcase = -55˚C to +125˚C)
Name
Parameter
Reference edge
Min
Max
-
Unit
ns
20 4)
tGRETHREF Ethernet reference clock period
any RMRFCLK edge
2 1)
2
tGRETH0
tGRETH1
tGRETH2
transmitter clock to output delay rising RMRFCLK edge
15
-
ns
ns
ns
input to receiver clock hold
input to receiver clock setup
rising RMRFCLK edge
rising RMRFCLK edge
4
-
Note 1:
Note 2:
Note 3:
Parameter not measured during production test.
The RMINTN, RMMDIO and RMCRSDV inputs are re-synchronized internally.
The RMMDIO and RMMDC outputs are low speed signals without any timing relationship with the
RMRFCLK clock.
Note 4:
According to Ethernet standard the reference clock RMRFCLK frequency must be 50 MHz +/- 50 ppm.
2.4.11 CAN Interface
The timing waveforms and timing parameters are shown in figure 16 and are defined in table 23.
INCLK
tCAN_OC0
CANTX[A:B]
tCAN_OC2
CANRX[A:B]
tCAN_OC1
Figure 16. Timing waveforms
Table 23. Timing parameters (VDD = 1.8 V +/- 0.15 V, VDDIO = 3.3 V +/- 0.3 V, Tcase = -55˚C to +125˚C)
Name
Parameter
Reference edge
Min
Max
Unit
ns
clock to data output delay
data input to clock setup
rising INCLK edge
rising INCLK edge
2 1)
-
21 1)
-
tCAN_OC0
tCAN_OC1
ns 3)
ns 3)
tCAN_OC2
data input from clock hold
rising INCLK edge
-
-
Note 1:
Note 2:
Note 3:
Parameter not measured during production test.
Parameter measured during production test without DLL enabled.
The CANRX[A:B] input is re-synchronized to the internal system clock with a TCLK period.
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2.4.12 Obsolete
Proprietary function not supported.
2.4.13 MIL-STD-1553B BC/RT/BM
The timing waveforms and timing parameters are shown in figure 17 and are defined in table 24.
1553CK
t1553BRM0
1553TXA/TXAN
1553TXB/TXBN
1553TXINHA, 1553TXINHB
1553RXENA, 1553RXENB
t1553BRM2
1553RXA/RXAN
1553RXB/RXBN
t1553BRM1
Figure 17. Timing waveforms
Table 24. Timing parameters (VDD = 1.8 V +/- 0.15 V, VDDIO = 3.3 V +/- 0.3 V, Tcase = -55˚C to +125˚C)
Name
Parameter
Reference edge
Min
Max
Unit
ns
clock to data output delay
data input to clock setup
rising 1553CK edge 2 1)
21 1)
-
t1553BRM0
t1553BRM1
t1553BRM2
t1553BRM3
ns 2)
ns 2)
MHz 3)
rising 1553CK edge
rising 1553CK edge
1553CK
-
-
data input from clock hold
clock frequency
-
16, 20, 24
Note 1:
Note 2:
Note 3:
Parameter not measured during production test.
The 1553RXA, 1553RXAN, 1553RXB and 1553RXBN inputs are re-synchronized internally.
The core frequency must be lower than the internal system frequency: t1553BRM3 < FCLK
Copyright Aeroflex Gaisler AB
February 2013, Issue 2.0
AEROFLEX GAISLER
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GR712RC-DS
2.4.14 I2C-master
The timing waveforms and timing parameters are shown in figure 18 and are defined in table 25.
I2CSCL
(input/output)
tI2C1
tI2C0
tI2C3
I2CSDA
(output)
I2CSDA
(input)
tI2C2
Figure 18. Timing waveforms
Table 25. Timing parameters (VDD = 1.8 V +/- 0.15 V, VDDIO = 3.3 V +/- 0.3 V, Tcase = -55˚C to +125˚C)
Name
Parameter
Reference edge
Min
Max
Unit
scaler 1)
-
tI2C0
data output valid before clock
rising I2CSCL edge
-
TCLK periods
scaler 1)
2 2)
tI2C1
data output valid after clock
data input setup to clock
data input hold from clock
falling I2CSCL edge
rising I2CSCL edge
falling I2CSCL edge
TCLK periods
TCLK periods
TCLK periods
tI2C2
-
-
0 2)
tI2C3
Note 1:
The core’s I2C bus functional timing depends on the core’s scaler value and the internal system clock
TCLK period. When the scaler is set for the core to operate in Fast- or Standard-Mode, the timing charac-
teristics in the I2C-bus specification apply. The maximum TCLK period for proper operation is 50 ns.
The I2CSCL and I2CSDA inputs are re-synchronized to the internal system clock with a TCLK period.
I2CSCL and I2CSDA are open-drain outputs, driving a logical 0 level or tri-state.
Note 2:
Note 3:
Note 4:
For correct operation, the signals should be pulled-up externally with 10 kOhm. GR712RC does not
include any internal pull-up resistors.
Copyright Aeroflex Gaisler AB
February 2013, Issue 2.0
AEROFLEX GAISLER
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GR712RC-DS
2.4.15 SPI controller
The timing waveforms and timing parameters are shown in figure 19 and are defined in table 26.
SPICLK
SPIMOSI
SPIMISO
tSPICTRL0
tSPICTRL0
tSPICTRL1
tSPICTRL2
Figure 19. Timing waveforms
Table 26. Timing parameters (VDD = 1.8 V +/- 0.15 V, VDDIO = 3.3 V +/- 0.3 V, Tcase = -55˚C to +125˚C)
Name
Parameter
Reference edge
Min
-15 2)
0 2)
Max
Unit
ns 1)
ns 3)
ns 3)
15 2)
-
tSPICTRL0
clock to output delay
driving SPICLK edge
tSPICTRL1
tSPICTRL2
Note 1:
input to clock hold
input to clock setup
sampling SPICLK edge
sampling SPICLK edge
20 2)
-
The driving and sampling edges of the interface are programmable, and always opposite to each
other.
Note 2:
Note 3:
Parameter not measured during production test.
The SPIMISO input is re-synchronized to the internal system clock with a TCLK period.
2.4.16 SLINK Serial Bus Based Real-Time Network Master
The timing waveforms and timing parameters are shown in figure 20 and are defined in table 27.
SLCLK
SLO, SLSYNC
tSLINK0
tSLINK0
(output)
SLI
tSLINK1
tSLINK2
(input)
Figure 20. Timing waveforms
Table 27. Timing parameters (VDD = 1.8 V +/- 0.15 V, VDDIO = 3.3 V +/- 0.3 V, Tcase = -55˚C to +125˚C)
Name
Parameter
Reference edge
Min
Max
Unit
TCLK periods 1)
TCLK periods
TCLK periods
tSLINK0
clock to output delay
rising SLCLK edge
1
-
tSLINK1
tSLINK2
Note 1:
input to clock hold
input to clock setup
rising SLCLK edge
rising SLCLK edge
0
2
-
-
Output timing depends on the ODEL setting in the core’s control register. Outputs will transition
(ODEL+1)*(system clock period) ns after SLCLK rising edge.
Copyright Aeroflex Gaisler AB
February 2013, Issue 2.0
AEROFLEX GAISLER
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GR712RC-DS
2.4.17 ASCS controller
The timing waveforms and timing parameters are shown in figure 21 and are defined in table 28.
tASCS1
tASCS3
A16MCS, A16MAS
A16DCS
tASCS4
tASCS5
tASCS2
tASCS6
tASCS0
A16HS
tASCS7
A16DASA, A16DASB
Figure 21. Timing waveforms
Table 28. Timing parameters (VDD = 1.8 V +/- 0.15 V, VDDIO = 3.3 V +/- 0.3 V, Tcase = -55˚C to +125˚C)
Name
Parameter
Reference edge
Min
Max
Unit
TCLK periods 1)
tASCS0
clock period
rising A16HS edge
2
-
TCLK periods 1)
TCLK periods 1)
TCLK periods 1)
TCLK periods 1)
tASCS1
tASCS2
tASCS3
tASCS4
tASCS5
qualifier de-asserted width
qualifier asserted to clock
clock to qualifier de-asserted
output data to clock setup
output data after clock hold
-
20
8
-
-
-
-
-
rising A16HS edge
falling A16HS edge
rising A16HS edge
rising A16HS edge
2
1
TCLK periods 1)
TCLK periods
TCLK periods
1
tASCS6
tASCS7
Note 1:
input data to clock setup
input data after clock hold
rising A16HS edge
rising A16HS edge
2
2
-
-
The timing of the interface is programmable and is dependable on the tASCS0 clock period.
Copyright Aeroflex Gaisler AB
February 2013, Issue 2.0
AEROFLEX GAISLER
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GR712RC-DS
2.4.18 CCSDS / ECSS Telecommand Decoder
The timing waveforms and timing parameters are shown in figure 22 and are defined in table 29.
TCCLK[4:0]
tGRTC0
TCACT[4:0]
TCD[4:0]
tGRTC1
tGRTC2
TCRFAVL[4:0]
tGRTC3
tGRTC4
Figure 22. Timing waveforms
Table 29. Timing parameters (VDD = 1.8 V +/- 0.15 V, VDDIO = 3.3 V +/- 0.3 V, Tcase = -55˚C to +125˚C)
Name
Parameter
Reference edge
Min
Max
Unit
tGRTC0
bit period
rising TCCLK edge
7
-
TCLK periods
tGRTC1
tGRTC2
tGRTC3
tGRTC4
Note 1:
data/active input to clock hold
data/active input to clock setup
RF available input to clock hold
RF available input to clock setup
rising TCCLK edge
rising TCCLK edge
rising INCLK edge
rising INCLK edge
3
3
-
-
-
-
-
TCLK periods
TCLK periods
ns 1)
ns 1)
-
The TCRFAVL[4:0] inputs are re-synchronized to the internal system clock with a TCLK period.
2.4.19 CCSDS / ECSS Telemetry Encoder
The timing waveforms and timing parameters are shown in figure 23 and are defined in table 30.
TMCLKO
TMDO
tGRTM0
tGRTM0
TCACT[4:0], TCRFAVL[4:0]
tGRTM1
tGRTM2
Figure 23. Timing waveforms
Table 30. Timing parameters (VDD = 1.8 V +/- 0.15 V, VDDIO = 3.3 V +/- 0.3 V, Tcase = -55˚C to +125˚C)
Name
Parameter
Reference edge
Min
Max
Unit
ns 1)
ns 2)
-15 3)
-
15 3)
-
tGRTM0
clock to output delay
any TMCLKO edge
tGRTM1
tGRTM2
tGRTM3
tGRTM4
Note 1:
input to clock hold
input to clock setup
input to output delay
TMCLKI clock period
rising INCLK edge
rising INCLK edge
TMCLKI to TMCLKO
-
ns 2)
ns
-
-
0 3)
23 3)
20 3)
ns
The TMDO signal is output simultaneously with the programmable TMCLKO clock edge. The oppo-
site clock edge should be used for sampling TMDO.
Note 2:
Note 3:
The TCACT[4:0] and TCRFAVL[4:0] inputs are re-synchronized to the TCLK period.
Parameter not measured during production test.
Copyright Aeroflex Gaisler AB
February 2013, Issue 2.0
AEROFLEX GAISLER
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GR712RC-DS
3
Mechanical description
3.1
Package
Ceramic hermetically sealed CQFP-240L package with 0.5 mm lead pitch, with gold plated leads.
See drawing in section 3.3.
All devices are marked on top lid with GR712RC. For space class marking see the product specifica-
tion [PS].
Lead trimming and forming are performed by customer prior to assembly on printed circuit board.
3.2
Pin assignment
The pin assignment in table 31 shows the implementation characteristics of each signal, indicating
how each pin has been configured in terms of maximum load, polarity and reset value.
Table 31. Pin assignment
Pin no.
Pin name
SWMX[3]
SWMX[2]
SWMX[1]
SWMX[0]
CB[6]
Dir.
In
Max load [pF]
Polarity Reset value
Note
1
2
3
4
5
6
7
-
I/O Switch Matrix 3
I/O Switch Matrix 2
I/O Switch Matrix 1
I/O Switch Matrix 0
Check Bit 6
Out
In
50
-
-
-
-
High
Out
In/Out
50
50
High
High-Z
VDDIO
I/O Supply Voltage
I/O Supply Ground
GNDIO 2)
CB[5]
8
In/Out
In/Out
In/Out
In/Out
In/Out
50
50
50
50
50
-
-
-
-
-
High-Z
High-Z
High-Z
High-Z
High-Z
Check Bit 5
9
CB[4]
Check Bit 4
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
CB[3]
Check Bit 3
CB[2]
Check Bit 2
CB[1]
Check Bit 1
VDD
Core Supply Voltage
Core Supply Ground
Check Bit 0
GND
CB[0]
In/Out
In/Out
In/Out
50
50
50
-
-
-
High-Z
High-Z
High-Z
DATA[31]
DATA[30]
VDDIO
GNDIO
DATA[29]
DATA[28]
DATA[27]
DATA[26]
DATA[25]
DATA[24]
DATA[23]
DATA[22]
VDDIO
GNDIO
VDD
Data Bit 31
Data Bit 30
I/O Supply Voltage
I/O Supply Ground
Data Bit 29
In/Out
In/Out
In/Out
In/Out
In/Out
In/Out
In/Out
In/Out
50
50
50
50
50
50
50
50
-
-
-
-
-
-
-
-
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
Data Bit 28
Data Bit 27
Data Bit 26
Data Bit 25
Data Bit 24
Data Bit 23
Data Bit 22
I/O Supply Voltage
I/O Supply Ground
Core Supply Voltage
Core Supply Ground
GND
Copyright Aeroflex Gaisler AB
February 2013, Issue 2.0
AEROFLEX GAISLER
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GR712RC-DS
Table 31. Pin assignment
Pin no.
32
Pin name
DATA[21]
Dir.
Max load [pF]
Polarity Reset value
Note
In/Out
In/Out
In/Out
In/Out
In/Out
In/Out
50
50
50
50
50
50
-
-
-
-
-
-
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
Data Bit 21
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
DATA[20]
DATA[19]
DATA[18]
DATA[17]
DATA[16]
VDDIO
Data Bit 20
Data Bit 19
Data Bit 18
Data Bit 17
Data Bit 16
I/O Supply Voltage
I/O Supply Ground
Data Bit 15
GNDIO
DATA[15]
DATA[14]
DATA[13]
DATA[12]
DATA[11]
DATA[10]
DATA[9]
VDD
In/Out
In/Out
In/Out
In/Out
In/Out
In/Out
In/Out
50
50
50
50
50
50
50
-
-
-
-
-
-
-
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
Data Bit 14
Data Bit 13
Data Bit 12
Data Bit 11
Data Bit 10
Data Bit 9
Core Supply Voltage
Core Supply Ground
Data Bit 8
GND
DATA[8]
VDDIO
In/Out
50
-
High-Z
I/O Supply Voltage
I/O Supply Ground
Data Bit 7
GNDIO
DATA[7]
DATA[6]
DATA[5]
DATA[4]
DATA[3]
DATA[2]
DATA[1]
DATA[0]
VDDIO
In/Out
In/Out
In/Out
In/Out
In/Out
In/Out
In/Out
In/Out
50
50
50
50
50
50
50
50
-
-
-
-
-
-
-
-
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
Data Bit 6
Data Bit 5
Data Bit 4
Data Bit 3
Data Bit 2
Data Bit 1
Data Bit 0
I/O Supply Voltage
I/O Supply Ground
Address Bit 0
Address Bit 1
Address Bit 2
Address Bit 3
Core Supply Voltage
Core Supply Ground
Address Bit 4
I/O Supply Voltage
I/O Supply Ground
Address Bit 5
Address Bit 6
Address Bit 7
Address Bit 8
I/O Supply Voltage
I/O Supply Ground
Address Bit 9
Core Supply Voltage
GNDIO
ADDRESS[0]
ADDRESS[1]
ADDRESS[2]
ADDRESS[3]
VDD
Out
Out
Out
Out
50
-
-
-
-
Low
Low
Low
Low
50
100
100
GND
ADDRESS[4]
VDDIO
Out
100
-
Low
GNDIO
ADDRESS[5]
ADDRESS[6]
ADDRESS[7]
ADDRESS[8]
VDDIO
Out
Out
Out
Out
100
100
100
100
-
-
-
-
Low
Low
Low
Low
GNDIO
ADDRESS[9]
VDD
Out
100
-
Low
Copyright Aeroflex Gaisler AB
February 2013, Issue 2.0
AEROFLEX GAISLER
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GR712RC-DS
Table 31. Pin assignment
Pin no.
79
Pin name
GND
Dir.
Max load [pF]
Polarity Reset value
Note
Core Supply Ground
Address Bit 10
80
ADDRESS[10]
ADDRESS[11]
ADDRESS[12]
VDDIO
Out
Out
Out
100
100
100
-
-
-
Low
Low
Low
81
Address Bit 11
82
Address Bit 12
83
I/O Supply Voltage
I/O Supply Ground
Address Bit 23
84
GNDIO
85
ADDRESS[23]
ADDRESS[13]
ADDRESS[22]
ADDRESS[21]
ADDRESS[14]
VDD
Out
Out
Out
Out
Out
50
-
-
-
-
-
Low
Low
Low
Low
Low
86
100
50
Address Bit 13
87
Address Bit 22
88
50
Address Bit 21
89
100
Address Bit 14
90
Core Supply Voltage
Core Supply Ground
Address Bit 20
91
GND
92
ADDRESS[20]
VDDIO
Out
50
-
Low
93
I/O Supply Voltage
I/O Supply Ground
Address Bit 19
94
GNDIO
95
ADDRESS[19]
ADDRESS[15]
ADDRESS[18]
ADDRESS[16]
ADDRESS[17]
SCANEN
ROMSN[0]
VDD
Out
Out
Out
Out
Out
In
50
-
Low
Low
Low
Low
Low
96
100
50
-
Address Bit 15
97
-
Address Bit 18
98
100
50
-
Address Bit 16
99
-
Address Bit 17
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
High
Low
Scan enable (tie to ground)
PROM Select 0
Out
50
High
Core Supply Voltage
Core Supply Ground
I/O Supply Voltage
I/O Supply Ground
PROM Select 1
GND
VDDIO
GNDIO
ROMSN[1]
WRITEN
Out
Out
Out
Out
Out
Out
Out
In
50
50
50
50
50
50
50
Low
Low
Low
Low
Low
Low
Low
Low
High
High
High
High
High
High
High
Write Strobe for PROM, I/O
I/O Select
IOSN
RAMSN[0]
RAMSN[1]
RAMOEN
RAMWEN
BRDYN
SRAM Select 0
SRAM Select 1
SRAM Output Enable
SRAM Write Enable
Bus Ready
VDD
Core Supply Voltage
Core Supply Ground
I/O Supply Voltage
I/O Supply Ground
Bus Exception
GND
VDDIO
GNDIO
BEXCN
In
Low
Low
WDOGN
Out
50
50
High-Z
High
Watchdog Indicator (output is driven active low, else it
is in tri-state and therefore requires external pull-up)
120
121
122
123
124
READ
TDI
Out
In
High
SRAM, PROM, I/O read indicator
Jtag Test Data In
-
TCK
TMS
TDO
In
-
Jtag Test Clock
In
High
-
Jtag Test Mode Select
Jtag Test Data Out
Out
50
Low
Copyright Aeroflex Gaisler AB
February 2013, Issue 2.0
AEROFLEX GAISLER
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GR712RC-DS
Table 31. Pin assignment
Pin no.
125
Pin name
TESTEN
Dir.
Max load [pF]
Polarity Reset value
Note
In
High
Test Enable (tie to ground)
Output Enable for PROM, I/O
I/O Switch Matrix 66
I/O Switch Matrix 65
I/O Switch Matrix 64
I/O Supply Voltage
I/O Supply Ground
I/O Switch Matrix 63
Core Supply Voltage
Core Supply Ground
I/O Switch Matrix 62
I/O Switch Matrix 61
I/O Switch Matrix 60
I/O Supply Voltage
I/O Supply Ground
I/O Switch Matrix 59
Check Bit 7
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
OEN
Out
Low
High
SWMX[66]
SWMX[65]
SWMX[64]
VDDIO
In/Out
In/Out
In/Out
50
50
50
-
-
-
High-Z
High-Z
High-Z
GNDIO
SWMX[63]
VDD
In/Out
50
-
High-Z
GND
SWMX[62]
SWMX[61]
SWMX[60]
VDDIO
In/Out
In/Out
In/Out
50
50
50
-
-
-
High-Z
High-Z
High-Z
GNDIO
SWMX[59]
CB[7]
In/Out
In/Out
In/Out
In/Out
In
50
50
50
50
-
High-Z
High-Z
High-Z
High-Z
-
SWMX[58]
SWMX[57]
SWMX[56]
RESETN
ERRORN
-
I/O Switch Matrix 58
I/O Switch Matrix 57
I/O Switch Matrix 56
System Reset
-
-
In
Low
Low
Out
50
High-Z
Processor Error Mode (output is driven active low, else
it is in tri-state and therefore requires external pull-up)
147
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162
163
164
165
166
DLLBPN
INCLK
In
In
Low
-
DLL Bypass
Input Clock
VDDIO
I/O Supply Voltage
Core Supply Voltage
Core Supply Ground
I/O Supply Ground
I/O Switch Matrix 55
I/O Switch Matrix 54
I/O Switch Matrix 53
SDRAM Clock
VDD
GND
GNDIO
SWMX[55]
SWMX[54]
SWMX[53]
SDCLK
In
-
-
-
-
-
In/Out
In/Out
Out
100
100
100
100
High-Z
High-Z
-
SWMX[52]
VDDIO
In/Out
High-Z
I/O Switch Matrix 52
I/O Supply Voltage
I/O Supply Ground
I/O Switch Matrix 51
I/O Switch Matrix 50
I/O Switch Matrix 49
I/O Switch Matrix 48
I/O Switch Matrix 47
I/O Switch Matrix 46
GNDIO
SWMX[51]
SWMX[50]
SWMX[49]
SWMX[48]
SWMX[47]
SWMX[46]
SWMX[45]
In
-
-
-
-
-
-
-
In
In/Out
In/Out
In
100
100
High-Z
High-Z
In
I/O Switch Matrix 45 1)
Core Supply Voltage
Core Supply Ground
I/O Switch Matrix 44
I/O Supply Voltage
In/Out
50
50
High-Z
High-Z
167
168
169
170
VDD
GND
SWMX[44]
VDDIO
In/Out
-
Copyright Aeroflex Gaisler AB
February 2013, Issue 2.0
AEROFLEX GAISLER
41
GR712RC-DS
Table 31. Pin assignment
Pin no.
171
Pin name
GNDIO
Dir.
Max load [pF]
Polarity Reset value
Note
I/O Supply Ground
I/O Switch Matrix 43 1)
I/O Switch Matrix 42
I/O Switch Matrix 41
172
SWMX[43]
In/Out
50
-
High-Z
173
174
175
SWMX[42]
SWMX[41]
SWMX[40]
In
-
-
-
In/Out
In/Out
50
50
High-Z
High-Z
I/O Switch Matrix 40 1)
I/O Switch Matrix 39
I/O Switch Matrix 38
176
177
178
SWMX[39]
SWMX[38]
SWMX[37]
In
-
-
-
In
I/O Switch Matrix 37 1)
I/O Switch Matrix 36
I/O Supply Voltage
In/Out
50
50
High-Z
High-Z
179
180
181
182
183
184
185
186
187
188
189
190
191
192
193
194
195
196
197
198
199
200
201
202
203
204
205
206
207
208
209
210
211
212
213
214
215
216
217
SWMX[36]
VDDIO
In/Out
-
GNDIO
I/O Supply Ground
SWMX[35]
SWMX[34]
SWMX[33]
SWMX[32]
VDD
In
-
-
-
-
I/O Switch Matrix 35
I/O Switch Matrix 34
I/O Switch Matrix 33
I/O Switch Matrix 32
Core Supply Voltage
Core Supply Ground
I/O Switch Matrix 31
I/O Switch Matrix 30
I/O Switch Matrix 29
I/O Switch Matrix 28
I/O Switch Matrix 27
I/O Switch Matrix 26
I/O Supply Voltage
In
In/Out
In/Out
50
50
High-Z
High-Z
GND
SWMX[31]
SWMX[30]
SWMX[29]
SWMX[28]
SWMX[27]
SWMX[26]
VDDIO
In
-
-
-
-
-
-
In
In/Out
In/Out
In
50
50
High-Z
High-Z
In
GNDIO
I/O Supply Ground
SWMX[25]
SWMX[24]
VDD
In/Out
In/Out
100
100
-
-
High-Z
High-Z
I/O Switch Matrix 25
I/O Switch Matrix 24
Core Supply Voltage
Core Supply Ground
I/O Switch Matrix 23
I/O Switch Matrix 22
I/O Switch Matrix 21
I/O Switch Matrix 20
SpaceWire Receive Data 1
SpaceWire Receive Strobe 1
SpaceWire Transmit Data 1
I/O Supply Voltage
GND
SWMX[23]
SWMX[22]
SWMX[21]
SWMX[20]
SPW_RXD[1]
SPW_RXS[1]
SPW_TXD[1]
VDDIO
In
-
-
-
-
-
-
-
In
In/Out
In/Out
100
100
High-Z
High-Z
Out
Out
100
100
Low
Low
GNDIO
I/O Supply Ground
SPW_TXS[1]
VDD
-
SpaceWire Transmit Strobe 1
Core Supply Voltage
Core Supply Ground
GND
SPWCLK
SPW_RXD[0]
SPW_RXS[0]
SPW_TXD[0]
SPW_TXS[0]
SWMX[19]
In
-
-
-
-
-
-
SpaceWire Receiver and Transmitter Clock
SpaceWire Receive Data 0
In
In
SpaceWire Receive Strobe 0
SpaceWire Transmit Data 0
SpaceWire Transmit Strobe 0
I/O Switch Matrix 19
Out
Out
In
100
100
50
Low
Low
Copyright Aeroflex Gaisler AB
February 2013, Issue 2.0
AEROFLEX GAISLER
42
GR712RC-DS
Table 31. Pin assignment
Pin no.
218
Pin name
SWMX[18]
Dir.
Max load [pF]
Polarity Reset value
Note
In
-
I/O Switch Matrix 18
I/O Switch Matrix 17
I/O Switch Matrix 16
I/O Supply Voltage
Core Supply Voltage
Core Supply Ground
I/O Supply Ground
I/O Switch Matrix 15
I/O Switch Matrix 14
I/O Switch Matrix 13
I/O Switch Matrix 12
I/O Switch Matrix 11
I/O Switch Matrix 10
I/O Switch Matrix 09
I/O Switch Matrix 08
I/O Switch Matrix 07
Core Supply Voltage
Core Supply Ground
I/O Supply Voltage
I/O Supply Ground
219
220
221
222
223
224
225
226
227
228
229
230
231
232
233
234
235
236
237
238
SWMX[17]
SWMX[16]
VDDIO
In/Out
In/Out
100
100
-
-
High-Z
High-Z
VDD
GND
GNDIO
SWMX[15]
SWMX[14]
SWMX[13]
SWMX[12]
SWMX[11]
SWMX[10]
SWMX[9]
SWMX[8]
SWMX[7]
VDD
In
-
-
-
-
-
-
-
-
-
In
In/Out
In/Out
In
100
100
High-Z
High-Z
In/Out
In
50
50
High-Z
High-Z
In/Out
In
GND
VDDIO
GNDIO
I/O Switch Matrix 06 1)
I/O Switch Matrix 05
SWMX[6]
In/Out
50
50
-
High-Z
High-Z
239
240
SWMX[5]
SWMX[4]
In
-
-
I/O Switch Matrix 04 1)
In/Out
Note 1:
Note 2:
See tables 3 and 5 for detailed description of behavior at reset.
GNDIO is connected internally to GND.
Copyright Aeroflex Gaisler AB
February 2013, Issue 2.0
AEROFLEX GAISLER
43
GR712RC-DS
3.3
Mechanical package drawings
GND
GND
V
V
DD
DD
GND
GND
V
V
DDIO
DDIO
Figure 24. Top view
Table 32. Dimensions
Millimeters
Min.
---
Max.
3.50
A
Total height
A1
Body height
---
2.75
A2
0.10
0.15
0.10
74.80
55.44
31.75
0.40
b
Lead width
Lead height
0.25
c
0.20
D/E
D1/E1
D2/E2
D3/E3
D4/E4
e
75.40
56.56
32.25
29.50 BSC
21.00 TYP
0.50 BSC
16.50 TYP
Lead pitch
L1
Note 1: The seal ring is electrically connected to GND.
Note 2: Package weight is 16 1 grams, including the lead-frame.
Copyright Aeroflex Gaisler AB
February 2013, Issue 2.0
AEROFLEX GAISLER
44
GR712RC-DS
Figure 25. Capacitor pads on top of package (mm)
Copyright Aeroflex Gaisler AB
February 2013, Issue 2.0
AEROFLEX GAISLER
45
GR712RC-DS
4
Reference documents
[UM]
GR712RC Dual-Core LEON3-FT SPARC V8 Processor - User's Manual, Aeroflex
Gaisler, www.aeroflex.com/gaisler
[PS]
Product Specification GR712RC, GR712RC-PS, Aeroflex Gaisler
[SPARC]
The SPARC Architecture Manual, Version 8, Revision SAV080SI9308, SPARC
International Inc.
[SPW]
ECSS - Space Engineering, SpaceWire - Links, Nodes, Routers and Networks,
ECSS-E-ST-50-12C, 31 July 2008
[RMAPID] ECSS - Space Engineering, SpaceWire Protocol Identification, ECSS-E-ST-50-51C,
February 2010
[RMAP]
ECSS - Space Engineering, Remote Memory Access Protocol, ECSS-E-ST-50-52C,
February 2010
[1553BRM] Core1553BRM Product Handbook, 50200040-0/11-04, November 2004, Actel Corpo-
ration
Core1553BRM MIL-STD-1553 BC, RT, and MT, 51700052-4/12.05, v 5.0,
December 2005, Actel Corporation
Core1553BRM User's Guide, 50200023-0/06.04, June 2004, Actel Corporation
Core1553BRM v2.16 Release Notes, 51300019-8/6.06, June 2006, Actel Corporation
[MIL883]
Test Method Standard, Microcircuits, revision H, 26 February 2010, MIL-STD-883H
[MIL38535] Integrated Circuits (Microcircuits) Manufacturing, General Specification For, revision
J, 28 December 2010, MIL-PRF-38535J
Copyright Aeroflex Gaisler AB
February 2013, Issue 2.0
AEROFLEX GAISLER
46
GR712RC-DS
5
Screening, qualification, and quality control
GR712RC is provided as a high reliability product for space, for which space level screening and
qualifications tests are performed in accordance to the product specification [PS].
A Certificate of Compliance is delivered with space grade parts.
A procurement specification is provided for space grade parts.
GR712RC is also provided in prototype grade in military or commercial temperature range.
6
Ordering information
Ordering information is provided in table 33 and a legend is provided in table 34.
Table 33. Ordering information, available models
Product
Description
GR712RC-MS-CG240
GR712RC-MP-CG240
GR712RC-CP-CG240
Flight model
Electrical qualification model
Engineering model (prototype)
Table 34. Ordering legend
Designator
Option
Description
Product
GR712RC
Dual-core LEON3-FT SPARC V8 Processor
-55˚C to +125˚C (Military range)
-40˚C to +85˚C (Industrial range)
0˚C to +70˚C (Commercial range)
Space grade
Temperature Range
M
I
C
Screening Level
S
P
Prototype grade
Package Type
Lead Finish
Lead Count
C
Ceramic Quad Flat Pack (CQFP)
Gold
G
240
Number of leads
Copyright Aeroflex Gaisler AB
February 2013, Issue 2.0
AEROFLEX GAISLER
47
GR712RC-DS
7
Change record
Change record information is provided in table 35.
Table 35. Change record
Issue
2.0
Date
Sections
Note
2013 February 1.2
Key features updated
1.4
2.1
2.2
2.3
2.4
Signal descriptions clarified
Absolute maximum ratings updated
Recommended operating conditions updated
DC parameters updated
AC parameter test conditions clarified
2.4.1, 2.4.3, 2.4.4, 2.4.5, 2.4.6, Updated timing
2.4.7, 2.4.8, 2.4.9, 2.4.10,
2.4.11, 2.4.13, 2.4.15, 2.4.19
1.5, 2.4.12
Obsolete proprietary function removed
Package marking clarified
3.1
3.2
3.3
4
GNDIO connection to GND clarified
Weight information added
Reference to product specification added
1.5
2012 May
1.5
The following conflicts added to table:
CCSDS TC 0 vs. Proprietary
CCSDS TC 0 vs. ASCS
CCSDS TC 1 vs. Proprietary
CCSDS TC 1 vs. Ethernet
CCSDS TC 2 vs. Ethernet
Proprietary vs. SpaceWire 2
1.4
1.3
2012 January 2.4.5
TCK edges in JTAG waveform & timing parameters corrected
2011 March
1.2, 2
4, 5
Timing parameters redefined
Qualification level specified
Table 6
Conflict between SLINK and CCSDS TC 3 clarified
1.2
1.1
2011 August
2.3
Added detailed core power consumption
2011 February Tables 3 and 5
Tables 3, 4 and 19, figure 19
Table 31
SDDQM signals marked as active high
GPIO1/GPIO2 names changed to GPIO
Reference added regarding behavior at reset
1.0
2011 February All
New document layout
All pin descriptions, reset values etc. updated
Copyright Aeroflex Gaisler AB
February 2013, Issue 2.0
AEROFLEX GAISLER
48
GR712RC-DS
Information furnished by Aeroflex Gaisler AB is believed to be accurate and reliable.
However, no responsibility is assumed by Aeroflex Gaisler AB for its use, nor for any infringements of patents
or other rights of third parties which may result from its use.
No license is granted by implication or otherwise under any patent or patent rights of Aeroflex Gaisler AB.
Aeroflex Gaisler AB
Kungsgatan 12
411 19 Göteborg
Sweden
tel +46 31 7758650
fax +46 31 421407
sales@gaisler.com
www.aeroflex.com/gaisler
GAISLER
Copyright © 2013 Aeroflex Gaisler AB.
All information is provided as is. There is no warranty that it is correct or suitable for any purpose, neither
implicit nor explicit.
Copyright Aeroflex Gaisler AB
February 2013, Issue 2.0
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