LG1626DXC [AGERE]
LG1626DXC Modulator Driver; LG1626DXC调制器驱动器
| 型号： | LG1626DXC |
| 厂家： | 
AGERE SYSTEMS |
| 描述： | LG1626DXC Modulator Driver |
| 文件： | 总10页 (文件大小：259K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Data Sheet
February 1999
LG1626DXC Modulator Driver
Features
Functional Description
■ High data-rate optical modulator driver
■ Adjustable output voltage up to 3 Vp-p (RL = 50 Ω)
■ Adjustable modulator dc offset
■ Operation up to 3 Gbits/s
The LG1626DXC is a gallium-arsenide (GaAs) inter-
grated circuit used to provide voltages to drive optical
modulators in high-speed non-return-to-zero (NRZ)
transmission systems. The device is made in a high-
performance 0.9 µm gate GaAs hetero-junction FET
technology that utilizes high-density MIM capacitors,
airbridge interconnect, and NiCr film precision resis-
tors. The device contains four cascaded stages,
operates with a single –5.2 V power supply, and
accepts ECL 100K level inputs. The output is an
open drain designed to drive 50 Ω loads. Voltages
control the output modulation amplitude and modula-
tor dc offset. A –2.5 V band-gap reference is required
for stable operation over temperature and varying
power supply voltage. The LG1626DXC is available
in a 24-lead hermetic, gull-wing package.
■ Single ended or differential inputs
■ Single –5.2 V power supply
■ 90 ps rise and fall times
■ Enable control
Applications
■ SONET/SDM transmission systems
■ SONET/SDM test equipment
■ Optical transmitters
GND
BG2P5
MK
VTH
MK
VDC-ADJ
VIN
VIN
VOUT
VOUT-DC
VTH
VMOD
MOD_E
VSS3
VSS2
VSS1
5-6549(F)
Figure 1. Functional Diagram
Data Sheet
February 1999
LG1626DXC Modulator Driver
Pin Information
GND
MK MK VMOD VDC-ADJ
VTH
50 Ω
VIN
+
–
VOUT
+
VIN
–
50 Ω
50 Ω
VTH
VSS1
MOD_E
VSS3
VSS2
5-6550(F)
Figure 2. LG1626DXC Die Block Diagram
2
Lucent Technologies Inc.
Data Sheet
February 1999
LG1626DXC Modulator Driver
Pin Information (continued)
GND
VDC-ADJ
1
2
3
4
5
6
18
17
16
15
14
13
VIN
VOUT-DC
GND
GND
VOUT
LG1626DXC
MODULATOR
DRIVER
GND
GND
GND
VIN
VTH
5-6551(F)
Note: Figure is not to scale.
Figure 3. LG1626DXC Package Pinout
Table 1. LG1626DXC Pin Description
Symbol
Pin
Description
GND
1, 3, 4, 9, 10, 13, 14, 15,
Package Bottom
Ground. For optimum performance, the package bottom must be
soldered to the ground plane.
VIN
2
5
Data input.
---------
Complementary data input.
VIN
-----------
VTH
BG2P5
6
Complementary threshold control (eye crossing) input.
–2.5 V band-gap reference (National Semiconductor * LM4040).
Modulation enable (connect to VSS1 to enable, float to disable).
Complementary mark density output.
Mark density output.
7
MOD_E
8
11
12
16
17
18
19
20
21
22, 23
24
MK
MK
VOUT
Output, ac couple to 50 Ω modulator.
Output, modulator dc offset.
VOUT-DC
VDC-ADJ
VSS2
Modulator dc offset control input.
VSS2 supply –5.2 V for output prebias.
VSS3 supply –5.2 V for output modulation.
Output modulation control input.
VSS3
VMOD
VSS1
VSS1 supply –5.2 V.
VTH
Threshold control (eye crossing) input.
* National Semiconductor is a registered trademark of National Semiconductor Corporation.
Lucent Technologies Inc.
3
Data Sheet
February 1999
LG1626DXC Modulator Driver
Absolute Maximum Ratings (at TA = 25 °C unless otherwise specified)
Table 2. Absolute Maximum Ratings
Parameter
Supply Voltage
Symbol
Min
Max
Unit
VSS
VI
—
GND
—
5.75
VSS
1
V
V
Input Voltage
Power Dissipation
PD
W
°C
°C
Storage Temperature Range
Operating Temperature Range
Tstg
TC
–40
0
125
100
Handling Precautions
Although protection circuitry has been designed into this device, proper precautions should be taken to avoid expo-
sure to electrostatic discharge (ESD) during handling and mounting. Lucent employs a human-body model (HBM)
and a charged-device model (CDM) for ESD-susceptibility testing and protection design evaluation. ESD voltage
threshold are dependent on the circuit parameters used to define the model. No industry-wide standard has been
adopted for the CDM. However, a standard HBM (resistance = 1500 Ω, capacitance = 100 pF) is widely used and
therefore, can be used for comparision. The HBM ESD threshold presented here was obtained by using these cir-
cuit parameters.
Table 3. ESD Threshold Voltage
Human-Body Model ESD Threshold
Device
Voltage
LG1626DXC
>200 V
Mounting and Connections
Cetain precautions must be taken when using solder. For installation using a constant temperature solder, temper-
atures of under 300 °C may be employed for periods of time up to 5 seconds, maximum. For installation with a sol-
dering iron (battery operated or nonswitching only), the soldering tip temperature should not be greater than
300 °C and the soldering time for each lead must not exceed 5 seconds. This device is supplied with solder on the
back of the package. For optimum performance, it is recommended to solder the back of the package to the
ground.
4
Lucent Technologies Inc.
Data Sheet
February 1999
LG1626DXC Modulator Driver
Electrical Characteristics
TA = 25 °C, VSS1 = VSS2 = VSS3 = –5.2 V, VTH = – 1.3 V, VMOD = – 3.8 V, RL = 50 Ω.
Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are
the result of engineering evaluations. Typical values are for information purposes only and are not part of the test-
ing requirements. Stresses in excess of the absolute maximum ratings can cause permanent damage to the
device.
Table 4. LG1626DXC Minimum and Maximum Values
Parameter
Symbol
Min
Typ
Max
Unit
Data Input Voltage (peak to peak) Single Ended
Voltage Control for Output Modulation Current
Maximum Modulated Output Voltage1
Minimum Modulated Output Voltage2
Output Rise and Fall Times (20%—80%)
Power Supply Voltage
Power Supply Current3
Mark Density4
Complementary Mark Density4
VIN
VMOD
300
–5.5
2.70
0
600
—
1000
–4
mV
V
VOUT
—
3.00
0.2
—
V
VOUT
—
V
tR, tF
—
90
ps
V
VSS1, VSS2, VSS3
ISS1
–5.5
100
—
–5.2
140
–0.5
–0.5
—
–4.9
180
—
mA
V
MK
—
—
V
MK
VDC-ADJ
Voltage Control for Modulator dc Offset
Maximum Output, Modulator dc Offset5
Minimum Output, Modulator dc Offset6
–5.5
1.2
0
–3
V
VOUT-DC
VOUT-DC
—
1.5
0.1
V
—
V
1. Maximum output modulation at maximum VMOD (RL = 50 Ω).
2. Minimum output modulation when MOD_E is floating and VMOD = VSS3.
3. Excludes IPRE and average IMOD:
Power suppy current ISS2 (relating to prebias) is dependent on VPRE.
Power suppy current ISS3 (relating to modulation) is dependent on VMOD.
4. Both MK and MK are open drains, the typical value is obtained by driving a 1kΩ load.
5. Maximum modulator dc offset voltage (RL = 50 Ω) at maximum VDC-ADJ.
6. Minimum modulator dc offset voltage (RL = 50 Ω) at VDC-ADJ = VSS2.
Note: All parameters measured at 25 °C ambient.
Lucent Technologies Inc.
5
Data Sheet
February 1999
LG1626DXC Modulator Driver
Electrical Characteristics (continued)
VSS = –5.2 V
10
Ω
0.1
2.5 k
µF
Ω*
VTH
10
Ω
0.1 µF
24 23 22 21 20 19
0.047 µF
DATA IN
1
18
VIN
V
OUT-DC
2
3
4
5
6
17
16
15
14
13
LG1626DXC
MODULATOR
DRIVER
VOUT
Zo = 50
Ω
+
50
Ω
Zo = 50
Ω
50
Ω
0.047 µF
50
Ω
SCOPE
0.1
10
µF
7
8
9 10 11 12
2.5 kΩ
Ω
DATA
BG2P5
GENERATOR
LM4040
MOD_5
VOLTAGE
DIVIDER
VSS
VSS
VSS = –5.2 V
MK MK
CURRENT
SENSE
2 kΩ
TO USER-SUPPLIED
VOLTAGE MONITOR
(DVM).
BYPASS
FOR VSS1
1
Ω
V
SS
0.1 µF
0.1 µF
3 kΩ
TO NODE
SS2 AND VSS3
0.1 µF
V
VSS1
ONE EACH.
REQUIRED TO SET
MOD AND VDC-ADJ
V
TO ACHIEVE DESIRED
MODULATION, ONE EACH.
5-6553(F).b
*A 2.5 kΩ resistor will set the eye crossing at 50%. A 5 kΩ potentiometer will allow the eye crossing to be varied.
Notes:
All bypass caps should be mounted close to the package.
ISS3 can be measured and used to control VMOD.
ISS2 can be measured and used to control VOUT-DC.
For optimal performance, the proximity of the two components should be minimized and the package bottom must be soldered to the circuit
board (GND).
For proper impedance matching, high-speed transmission lines should be 50 Ω controlled impedance lines.
Figure 4. LG1626DXC Typical Electrical Evaluation (ac Coupled to Scope)
6
Lucent Technologies Inc.
Data Sheet
February 1999
LG1626DXC Modulator Driver
Electrical Characteristics (continued)
VSS = –5.2 V
10
Ω
8
7
0.1
F
µ
dc
SUPPLY
2.5 k *
Ω
VTH
10
Ω
9
6
5
4
3
2
1
0.1
F
µ
10
11
12
13
14
100
H
µ
E2500
24 23 22 21 20 19
EM-ILM
DATA
IN
0.047
F
µ
1
18
17
16
15
14
13
10
H
µ
VIN
+2 V
MAX
VOUT-DC
VOUT
2
3
4
5
6
INPUT
0.047
F
µ
LG1626DXC
MODULATOR
DRIVER
50
Ω
Zo = 50
Ω
+
Zo = 50
Zo = 50
Ω
Ω
0.047
F
µ
50
Ω
DMM
0.1
F
µ
7
8
9
10 11 12
10
H
µ
2.5 k
10
Ω
Ω
DATA
GENERATOR
BG2P5
50
Ω
LM4040
MOD_E
VSS = –5.2 V
MK MK
5-6554(F).b
*A 2.5 kΩ resistor will set the eye crossing at 50%. A 5 kΩ potentiometer will allow the eye crossing to be varied.
Notes:
All bypass caps should be mounted close to the package.
ISS3 can be measured and used to control VMOD.
ISS2 can be measured and used to control VOUT-DC.
For optimal performance, the proximity of the two components should be minimized and the package bottom must be soldered to the circuit
board (GND).
For proper impedance matching, high-speed transmission lines should be 50 Ω controlled impedance lines.
Figure 5. Typical Optical Evaluation of the LG1626DXC and EM2500 EM-ILM
Lucent Technologies Inc.
7
Data Sheet
February 1999
LG1626DXC Modulator Driver
Electrical Characteristics (continued)
80 ps/div
5-7341(F)
Figure 6. Typical Electrical Eye Diagram (ac Coupled to Scope)
60 ps/div
5-7342(F)
Figure 7. Typical Optical Eye Diagram
Table 5. Pin Description of Lucent’s E2500 EM-ILM Modulator
Pin
Description
1, 2 Thermistor
3
4
5
6
7
Laser Anode
Monitor Anode
Monitor Cathode
Thermoelectric Cooler (+)
Thermoelectric Cooler (–)
8, 9 Case Ground
10, 14 No Connect
11, 13 Laser/Modulator Ground
12
Modulator Anode (–) 50 Ω RF Input
8
Lucent Technologies Inc.
Data Sheet
February 1999
LG1626DXC Modulator Driver
Outline Diagram
0.465
0.280
1
0.012
1
LUCENT
LG1626DXC
XXXXXXX
0.030
0.082
0.005
0.092
0.045
0 — 0.004
0.035
12-3224(F).a
Assembly Notes:
Standoff specifications applies to package prior to solder dipping of leads and package base.
During board assembly use back lighting to silhouette the package. This will eliminate reflection problems with the
solder on the bottom of the package.
Lead space tolerance should be set to ± 0.012 in.
Board solder pattern for the package base should not exceed 50% of the package base area.
Insertion pressure should not exceed 125 grams.
LG1626DXC Ordering Information
Device
Type
Comcode Number
LG1626DXC
24-Pin Package
108192865
Lucent Technologies Inc.
9
For additional information, contact your Microelectronics Group Account Manager or the following:
INTERNET:
E-MAIL:
http://www.lucent.com/micro
docmaster@micro.lucent.com
N. AMERICA: Microelectronics Group, Lucent Technologies Inc., 555 Union Boulevard, Room 30L-15P-BA, Allentown, PA 18103
1-800-372-2447, FAX 610-712-4106 (In CANADA: 1-800-553-2448, FAX 610-712-4106)
ASIA PACIFIC: Microelectronics Group, Lucent Technologies Singapore Pte. Ltd., 77 Science Park Drive, #03-18 Cintech III, Singapore 118256
Tel. (65) 778 8833, FAX (65) 777 7495
CHINA:
Microelectronics Group, Lucent Technologies (China) Co., Ltd., A-F2, 23/F, Zao Fong Universe Building, 1800 Zhong Shan Xi Road, Shanghai
200233 P. R. China Tel. (86) 21 6440 0468, ext. 316, FAX (86) 21 6440 0652
JAPAN:
Microelectronics Group, Lucent Technologies Japan Ltd., 7-18, Higashi-Gotanda 2-chome, Shinagawa-ku, Tokyo 141, Japan
Tel. (81) 3 5421 1600, FAX (81) 3 5421 1700
EUROPE:
Data Requests: MICROELECTRONICS GROUP DATALINE: Tel. (44) 1189 324 299, FAX (44) 1189 328 148
Technical Inquiries:GERMANY: (49) 89 95086 0 (Munich), UNITED KINGDOM: (44) 1344 865 900 (Ascot),
FRANCE: (33) 1 40 83 68 00 (Paris), SWEDEN: (46) 8 594 607 00 (Stockholm), FINLAND: (358) 9 4354 2800 (Helsinki),
ITALY: (39) 02 6608131 (Milan), SPAIN: (34) 1 807 1441 (Madrid)
Lucent Technologies Inc. reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or application. No
rights under any patent accompany the sale of any such product(s) or information.
Copyright © 1999 Lucent Technologies Inc.
All Rights Reserved
February 1999
DS99-145HSPL
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